Coil electronic component

Abstract

To provide a coil electronic component having a coupled inductor structure, capable of easily adjusting a coupling coefficient while securing a high inductance, preventing inclination of laminated coils, and maintaining the interval between the coils.SOLUTION: A coil electronic component of the present invention, comprises: a first coil; a second coil separated from the first coil; an intermediate layer that is arranged so as to be extended from a first region between a first core of the first coil and a second core of the second coil to a second region between the first coil and the second coil; and a magnetic material that surrounds the first coil, the second coil, and the intermediate layer. The permeability of the intermediate layer is smaller than that of the magnetic material.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a coil electronic component. [Background technology]

[0002] Recently, as the functions of mobile devices become more diverse and power consumption increases, coil electronic components with low loss and excellent efficiency are being adopted around power semiconductors (PMIC: power management integrated circuit) to increase battery life in mobile devices.

[0003] When a coil electronic component has a coupled inductor structure in which a primary coil and a secondary coil are stacked, a method is required that can easily adjust a coupling coefficient (K) while ensuring high inductance.

[0004] In addition, it is necessary to prevent the stacked primary coil and secondary coil from tilting relative to each other and to maintain a constant distance between the primary coil and the secondary coil. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-67769 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made in consideration of the above-mentioned conventional technology, and an object of the present invention is to provide a coil electronic component having a coupled inductor structure that ensures high inductance while allowing the coupling coefficient to be easily adjusted. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, one embodiment of the present invention provides a coil electronic component comprising a first coil, a second coil spaced apart from the first coil, an intermediate layer arranged to extend from a first region between a first core of the first coil and a second core of the second coil to a second region between the first coil and the second coil, and a magnetic body surrounding the first coil, the second coil, and the intermediate layer, wherein the permeability of the intermediate layer is smaller than that of the magnetic body.

[0008] The intermediate layer may contact the first coil and the second coil. The intermediate layer may be spaced from an outer edge of the second region. The thickness of the intermediate layer in the first region may be the same as the thickness of the intermediate layer in the second region. The intermediate layer may extend from the first region to a portion of the first core. The intermediate layer may extend from the first region to a portion of the second core. The intermediate layer may extend from the first region to a portion of the first core, and the intermediate layer may extend from the first region to a portion of the second core. The second region may include an inner region in which the intermediate layer is disposed, and an outer region in which the magnetic body is disposed in contact with the inner region. The coil electronic component may further include a support disposed in the second region and in contact with the first coil and the second coil. The support may be spaced from the intermediate layer. The support may be in contact with the intermediate layer. The support may be made of a magnetic material, an epoxy, or a non-magnetic material. The coil electronic component may further include a first external electrode arranged outside the magnetic body and connected to a first lead-out portion of the first coil, a second external electrode arranged outside the magnetic body and connected to a second lead-out portion of the first coil, a third external electrode arranged outside the magnetic body and connected to the first lead-out portion of the second coil, and a fourth external electrode arranged outside the magnetic body and connected to the second lead-out portion of the second coil. The first coil may include a wire-wound coil, and the second coil may include a wire-wound coil. The first coil may include a first support substrate having a first surface and a second surface facing each other, a first coil pattern arranged on the first surface of the first support substrate, a second coil pattern arranged on the second surface of the first support substrate, and a first via that penetrates the first support substrate to connect the first coil pattern and the second coil pattern, and the second coil may include a second support substrate having a first surface and a second surface facing each other, a first coil pattern arranged on the first surface of the second support substrate, a second coil pattern arranged on the second surface of the second support substrate, and a second via that penetrates the second support substrate to connect the first coil pattern and the second coil pattern. The intermediate layer may be positioned to extend into a portion of the second region. An insulating film may be provided on a surface of the first coil and a surface of the second coil. Effect of the Invention

[0009] According to the coil electronic component of the present invention, a high inductance can be ensured, the coupling coefficient can be easily adjusted, and tilting of the stacked coils can be prevented to maintain the spacing between the coils. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing a schematic diagram of a first example of a coil electronic component according to an embodiment. [Diagram 2] FIG. 2 is a plan view illustrating the coil electronic component of FIG. [Diagram 3] FIG. 2 is a bottom perspective view showing the coil electronic component of FIG. 1. [Figure 4] FIG. 2 is a schematic cross-sectional view taken along line IV-IV′ in FIG. [Diagram 5] FIG. 13 is a perspective view showing a schematic diagram of a second example of a coil electronic component according to an embodiment. [Figure 6]FIG. 13 is a perspective view showing a schematic diagram of a third example of a coil electronic component according to an embodiment. [Figure 7] FIG. 11 is a cross-sectional view illustrating a schematic diagram of a fourth example of a coil electronic component according to an embodiment. [Figure 8] FIG. 13 is a perspective view illustrating a fifth example of a coil electronic component according to an embodiment. [Figure 9] 9 is a cross-sectional view taken along line IX-IX' in FIG. 8. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific examples of the embodiments of the present invention will be described in detail with reference to the drawings.

[0012] In the drawings, parts unnecessary for the explanation of the present invention are omitted in order to clearly explain the present invention, and the same or similar components are given the same reference numerals throughout the specification. In addition, in the drawings, some components are exaggerated, omitted, or illustrated in a schematic manner, and the size of each component does not entirely reflect the actual size.

[0013] The drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and the drawings are not intended to limit the technical ideas disclosed in this specification, and it should be understood that the drawings include all modifications, equivalents, or alternatives included in the idea and technical scope of the present invention.

[0014] Terms including ordinal numbers such as first, second, etc. are used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.

[0015] Furthermore, when a part such as a layer, film, region, or plate is said to be "on" or "above" another part, this includes not only the case where it is "directly on" another part, but also the case where there is another part in between. Conversely, when a part is said to be "directly on" another part, it means that there is no other part in between. Furthermore, when a part is said to be "on" or "above" a reference part, it means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "above" the opposite direction of gravity.

[0016] Throughout the specification, the terms "comprise" or "have" and the like are intended to specify the presence of any feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood as not precluding the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Thus, when a part is said to "comprise" a certain element, this means that it can further include other elements, but not to the exclusion of other elements, unless specifically stated to the contrary.

[0017] Additionally, throughout the specification, the term "in a plane" means the part being viewed from above, and the term "in cross section" means the part being viewed from the side, cut vertically through the cross section.

[0018] In addition, throughout the specification, the term "connected" does not only mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, or that two or more components are not only physically connected, but also electrically connected, or that components are referred to by different names depending on their position or function but are integrated.

[0019] FIG. 1 is a perspective view that shows a schematic of a first example of a coil electronic component according to one embodiment, FIG. 2 is a plan view that shows a schematic of the coil electronic component of FIG. 1, FIG. 3 is a bottom perspective view that shows a schematic of the coil electronic component of FIG. 1, and FIG. 4 is a schematic cross-sectional view taken along line IV-IV' of FIG. 1.

[0020] 1, 2, 3, and 4, the coil electronic component 1000 according to this embodiment includes a magnetic body 100, a first coil 200, a second coil 300, an intermediate layer 400, a first external electrode 500, a second external electrode 600, a third external electrode 700, and a fourth external electrode 800.

[0021] The magnetic body 100 is formed in a roughly rectangular hexahedron shape, but the present embodiment is not limited thereto. Due to shrinkage of the magnetic powder during sintering, the magnetic body 100 is not a perfect rectangular hexahedron shape, but has a substantially rectangular hexahedron shape. For example, the magnetic body 100 has a roughly rectangular hexahedron shape, but the corners and vertices are rounded.

[0022] In this embodiment, for ease of explanation, the two surfaces facing each other in the length direction (L axis direction) are defined as the first surface S1 and the second surface S2, the two surfaces facing each other in the width direction (W axis direction) are defined as the third surface S3 and the fourth surface S4, and the two surfaces facing each other in the thickness direction (T axis direction) are defined as the fifth surface S5 and the sixth surface S6.

[0023] The length of the coil electronic component 1000 refers to the maximum value among the lengths of a plurality of line segments parallel to the length direction (L axis direction) by connecting two outermost boundary lines facing each other in the length direction (L axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph, based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section in the length direction (L axis direction)-thickness direction (T axis direction) at the center of the width direction (W axis) of the coil electronic component 1000. Alternatively, the length of the coil electronic component 1000 refers to the minimum value among the lengths of a plurality of line segments parallel to the length direction (L axis direction) by connecting two outermost boundary lines facing each other in the length direction (L axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph. Alternatively, the length of the coil electronic component 1000 means the arithmetic average value of the lengths of at least two of a plurality of line segments parallel to the length direction (L-axis direction) connecting the two outermost boundary lines facing each other in the length direction (L-axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph.

[0024] The thickness of the coil electronic component 1000 refers to the maximum value among the lengths of a plurality of line segments parallel to the thickness direction (T axis direction) by connecting two outermost boundary lines facing each other in the thickness direction (T axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph, based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section in the length direction (L axis direction)-thickness direction (T axis direction) at the center of the width direction (W axis direction) of the coil electronic component 1000. Alternatively, the thickness of the coil electronic component 1000 refers to the minimum value among the lengths of a plurality of line segments parallel to the thickness direction (T axis direction) by connecting two outermost boundary lines facing each other in the thickness direction (T axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph. Alternatively, the thickness of the coil electronic component 1000 means the arithmetic average value of the lengths of at least two of a plurality of line segments that are parallel to the thickness direction (T-axis direction) and connect the two outermost boundary lines that face each other in the thickness direction (T-axis direction) of the coil electronic component 1000 shown in the cross-sectional photograph described above.

[0025] The width of the coil electronic component 1000 refers to the maximum value among the lengths of a plurality of line segments parallel to the width direction (W axis direction) by connecting two outermost boundary lines facing each other in the width direction (W axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph, based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section in the length direction (L axis direction)-width direction (W axis direction) at the center in the thickness direction (T axis direction) of the coil electronic component 1000. Alternatively, the width of the coil electronic component 1000 refers to the minimum value among the lengths of a plurality of line segments parallel to the width direction (W axis direction) by connecting two outermost boundary lines facing each other in the width direction (W axis direction) of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph. Alternatively, the width of the coil electronic component 1000 means the arithmetic average value of the lengths of at least two of the multiple line segments that are parallel to the width direction (W-axis direction) and connect the two outermost boundary lines that face each other in the width direction (W-axis direction) of the coil electronic component 1000 shown in the cross-sectional photograph described above.

[0026] Meanwhile, each of the length, width, and thickness of the coil electronic component 1000 can be measured by a micrometer measurement method. In the micrometer measurement method, a zero point is set with a micrometer that has been subjected to Gage R&R (Repeatability and Reproducibility), the coil electronic component 1000 according to the present embodiment is inserted between the tips of the micrometer, and the measurement lever of the micrometer is rotated to perform measurement. Meanwhile, when the length of the coil electronic component 1000 is measured by the micrometer measurement method, the length of the coil electronic component 1000 can mean a value measured once or an arithmetic average of values ​​measured multiple times. This is similarly applied to the measurement of the width and thickness of the coil electronic component 1000.

[0027] The magnetic body 100 forms the exterior of the coil electronic component 1000, and is a space in which a magnetic path is formed, which is a path through which the magnetic flux induced in the first coil 200 and the magnetic flux induced in the second coil 300 pass, when a current is applied to the first coil 200 through the first external electrode 500 and the second external electrode 600, and a current is applied to the second coil 300 through the third external electrode 700 and the fourth external electrode 800.

[0028] The magnetic body 100 encapsulates the first coil 200, the second coil 300, and the intermediate layer 400, and includes a magnetic material. The magnetic body 100 includes magnetic particles, and an insulating material is interposed between the magnetic particles.

[0029] The magnetic material includes a first metal magnetic powder, a second metal magnetic powder having a larger particle size than the first metal magnetic powder, and a third metal magnetic powder having a larger particle size than the second metal magnetic powder. The average particle size (D 50 ) is 0.1 μm or more and 0.2 μm or less, and the average particle size (D 50 ) is 1 μm or more and 2 μm or less, and the average particle size (D 50 ) is 25 μm or more and 30 μm or less.

[0030] The magnetic particles are ferrite particles or metallic magnetic particles that exhibit magnetic properties.

[0031] The ferrite particles are at least one of spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn-based ferrites, hexagonal-type ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co-based ferrites, garnet-type ferrites such as Y-based ferrites, and Li-based ferrites.

[0032] The metal magnetic particles are composed of two or more types of powders with different compositions, and include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles are at least one of pure iron, Fe-Si alloys, Fe-Si-Al alloys, Fe-Ni alloys, Fe-Ni-Mo alloys, Fe-Ni-Mo-Cu alloys, Fe-Co alloys, Fe-Ni-Co alloys, Fe-Cr alloys, Fe-Cr-Si alloys, Fe-Si-Cu-Nb alloys, Fe-Ni-Cr alloys, and Fe-Cr-Al alloys. Here, the different compositions of the metal magnetic particles may mean different contents.

[0033] The metal magnetic particles are amorphous or crystalline. For example, the metal magnetic particles are Fe-Si-B-Cr amorphous alloys, but the present embodiment is not limited thereto. The metal magnetic particles have an average particle size of about 0.1 μm to 30 μm, but the present embodiment is not limited thereto. In this specification, the average particle size is defined as D 90 Or D 50 Particle size distribution is an index showing the ratio of particles of different sizes (particle diameters) contained in the particle group being measured, and is well known to ordinary engineers. 50 (Particle size corresponding to 50% cumulative volume of particle size distribution) indicates the average particle size.

[0034] The metal magnetic particles are two or more different types of metal magnetic particles. Different types of metal magnetic particles mean that the metal magnetic particles are distinguished from one another in at least one of the average particle size, composition, component ratio, crystallinity, and shape.

[0035] The insulating material may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0036] There is no particular limitation on the method for forming the magnetic body 100. For example, a sheet made of a magnetic material is disposed on the upper and lower parts of the first coil 200 and the second coil 300, and then the sheet is compressed and hardened to form the magnetic body 100.

[0037] The first coil 200 and the second coil 300 are disposed inside the magnetic body 100 and exhibit the characteristics of a coil electronic component. For example, when the coil electronic component 1000 of the present embodiment is used as a power inductor, when a current is applied to the first coil 200 and the second coil 300, the coil electronic component 1000 stores energy in the form of a magnetic field and maintains an output voltage, thereby stabilizing the power supply of an electronic device.

[0038] The first coil 200 and the second coil 300 are magnetically coupled to each other to form a coupled inductor structure.

[0039] The first coil 200 and the second coil 300 are formed by winding a metal (e.g., copper (Cu) or silver (Ag)) wire whose surface is coated with an insulating material into a spiral shape. That is, the first coil 200 and the second coil 300 are wound coils. The first coil 200 and the second coil 300 are not limited to a single wire, and may be a twisted wire or made of two or more wires.

[0040] The first coil 200 and the second coil 300 are, but are not limited to, circular coils. For example, the first coil 200 and the second coil 300 may be any of various known coils such as rectangular coils.

[0041] The cross sections of the individual wires of the first coil 200 and the second coil 300 may have various known shapes such as a rectangle, a circle, an ellipse, or the like.

[0042] The first coil 200 and the second coil 300 each have a plurality of turns and are edgewise coils.

[0043] For example, the first coil 200 has an outermost turn coil C1 and an innermost turn coil C2 sequentially arranged from the fifth surface S5 side to the sixth surface S6 side of the coil electronic component 1000. Meanwhile, although not shown, at least one intermediate turn coil may be disposed between the outermost turn coil C1 and the innermost turn coil C2.

[0044] Similarly, the second coil 300 has an outermost turn coil C1' and an innermost turn coil C2' sequentially arranged from the sixth surface S6 side to the fifth surface S5 side of the coil electronic component 1000. Meanwhile, although not shown, at least one intermediate turn coil may be disposed between the outermost turn coil C1' and the innermost turn coil C2'.

[0045] An insulating film IF is provided along each surface of the plurality of turns of the first coil 200 and the second coil 300. The insulating film IF is for protecting and insulating the plurality of turns of the first coil 200 and the second coil 300, and includes a known insulating material such as Parylene. The insulating material included in the insulating film IF can be any material and is not particularly limited. For example, the insulating film IF is a polyurethane resin, a polyester resin, an epoxy resin, or a polyamideimide resin. The insulating film IF is formed by a method such as vapor phase deposition, but is not limited thereto.

[0046] Meanwhile, the shapes of the first coil 200 and the second coil 300 are not limited to those described above and may be various known shapes. For example, the first coil 200 has an outermost turn coil, one or more intermediate turn coils, and an innermost turn coil, in that order from the outer surface of the magnetic body 100 to the inside. Similarly, the second coil 300 has an outermost turn coil, one or more intermediate turn coils, and an innermost turn coil, in that order from the outer surface of the magnetic body 100 to the inside.

[0047] The first coil 200 includes a winding portion 210 and a lead-out portion 220 .

[0048] The winding portion 210 is a portion in which the metal wire makes at least one turn.

[0049] The lead-out portion 220 extends from both ends of the winding portion 210 and is exposed to the sixth surface S6 of the magnetic body 100. The lead-out portion 220 includes a first lead-out portion 223 and a second lead-out portion 225. The first lead-out portion 223 extends from one end of the winding portion 210 and is exposed to the sixth surface S6 of the magnetic body 100, and the second lead-out portion 225 extends from the other end of the winding portion 210 and is exposed to the sixth surface S6 of the magnetic body 100. The portions of the first lead-out portion 223 and the second lead-out portion 225 exposed to the sixth surface S6 of the magnetic body 100 are spaced apart from each other in the length direction (L-axis direction), but are not limited thereto.

[0050] The second coil 300 includes a winding portion 310 and a lead-out portion 320 .

[0051] The winding portion 310 is a portion in which the metal wire makes at least one turn.

[0052] The lead-out portion 320 extends from both ends of the winding portion 310 and is exposed to the sixth surface S6 of the magnetic body 100. The lead-out portion 320 includes a first lead-out portion 323 and a second lead-out portion 325. The first lead-out portion 323 extends from one end of the winding portion 310 and is exposed to the sixth surface S6 of the magnetic body 100, and the second lead-out portion 325 extends from the other end of the winding portion 310 and is exposed to the sixth surface S6 of the magnetic body 100. The portions of the first lead-out portion 323 and the second lead-out portion 325 exposed to the sixth surface S6 of the magnetic body 100 are spaced apart from each other in the length direction (L-axis direction), but are not limited thereto.

[0053] In the above, it has been described that both the lead-out portion 220 of the first coil 200 and the lead-out portion 320 of the second coil 300 are exposed to the sixth surface S6 of the magnetic body 100, but the present embodiment is not limited to this. For example, the lead-out portion 220 of the first coil 200 is exposed to the third surface S3 of the magnetic body 100, and the lead-out portion 320 of the second coil 300 is exposed to the fourth surface S4.

[0054] The intermediate layer 400 is disposed between the first coil 200 and the second coil 300. For example, the intermediate layer 400 contacts the first coil 200 and the second coil 300.

[0055] The intermediate layer 400 has a rectangular shape when viewed in the thickness direction (T-axis direction), but is not limited to this. The intermediate layer 400 has a shape similar to, for example, the winding portion 210 of the first coil 200 and the winding portion 310 of the second coil 300.

[0056] The intermediate layer 400 is positioned to extend from a first region R1 between the first core 230 of the first coil 200 and the second core 330 of the second coil 300 to a portion of the second region R2 between the first coil 200 and the second coil 300.

[0057] The first core 230 is a region where a first hollow space of the first coil 200 is at least partially filled with the magnetic body 100, and the second core 330 is a region where a second hollow space of the second coil 300 is at least partially filled with the magnetic body 100. That is, the magnetic body 100 filling the first hollow space of the first coil 200 forms a first core around which the first coil 200 is wound, and the magnetic body 100 filling the second hollow space of the second coil 300 forms a second core around which the second coil 300 is wound.

[0058] The thickness of the intermediate layer 400 in the first region R1 is the same as the thickness of the intermediate layer 400 in the second region R2.

[0059] The thickness of the intermediate layer 400 is measured based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section in the length direction (L axis direction)-thickness direction (T axis direction) at the center in the width direction (W axis direction) of the coil electronic component 1000. The thickness of the intermediate layer 400 is the arithmetic average value of the thicknesses of the intermediate layer 400 at five points equally spaced apart from the intermediate layer 400 of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph.

[0060] The thickness of the intermediate layer 400 in the first region R1 may be different from the thickness of the intermediate layer 400 in the second region R2. For example, the intermediate layer 400 extends from the first region R1 to a portion of the first core 230, or extends from the first region R1 to a portion of the second core 330. On the other hand, the intermediate layer 400 extends from the first region R1 to a portion of the first core 230 and a portion of the second core 330.

[0061] When the intermediate layer 400 extends from the first region R1 to a portion of the first core 230, a portion of the first core 230 is filled with the intermediate layer 400, and the remaining portion of the first core 230 is filled with the magnetic body 100. When the intermediate layer 400 extends from the first region R1 to a portion of the second core 330, a portion of the second core 330 is filled with the intermediate layer 400, and the remaining portion of the second core 330 is filled with the magnetic body 100. In this case, the magnetic body 100 filling the first hollow of the first coil 200 and the intermediate layer 400 form the first core 230 around which the first coil 200 is wound, and the magnetic body 100 filling the second hollow of the second coil 300 and the intermediate layer 400 form the second core 330 around which the second coil 300 is wound.

[0062] The intermediate layer 400 is disposed so as to extend from the first region R1 to a portion of the second region R2, so that the intermediate layer 400 is not disposed in the entire second region R2.

[0063] For example, the second region R2 has an outer edge close to the outer surface of the coil electronic component 1000 and an inner edge close to the inside of the coil electronic component 1000. In other words, the second region R2 has an inner edge close to the first core 230 and the second core 330 side and an outer edge far from the first core 230 and the second core 330 side. The intermediate layer 400 extends from the inner edge towards the outer edge of the second region R2 but is spaced apart from the outer edge.

[0064] The intermediate layer 400 fills a portion of the second region R2 while contacting the innermost turn coil C2 of the first coil 200 and the innermost turn coil C2' of the second coil 300 in the second region R2. The remaining portion of the second region R2 not filled by the intermediate layer 400 is filled with the magnetic material 100. That is, the magnetic material 100 is disposed from the outer edge of the second region R2 to the intermediate layer 400.

[0065] Meanwhile, the intermediate layer 400 includes a magnetic material and affects the magnetic coupling characteristics between the first coil 200 and the second coil 300. The intermediate layer 400 includes magnetic particles, and an insulating material is interposed between the magnetic particles.

[0066] The magnetic material includes a first metal magnetic powder, a second metal magnetic powder having a larger particle size than the first metal magnetic powder, and a third metal magnetic powder having a larger particle size than the second metal magnetic powder. The average particle size (D 50 ) is 0.1 μm or more and 0.2 μm or less, and the average particle size (D 50 ) is 1 μm or more and 2 μm or less, and the average particle size (D 50 ) is 25 μm or more and 30 μm or less.

[0067] The magnetic particles are ferrite particles or metallic magnetic particles that exhibit magnetic properties.

[0068] The ferrite particles are at least one of spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn-based ferrites, hexagonal-type ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co-based ferrites, garnet-type ferrites such as Y-based ferrites, and Li-based ferrites.

[0069] The metal magnetic particles are composed of two or more types of powders with different compositions, and include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles are at least one of pure iron, Fe-Si alloys, Fe-Si-Al alloys, Fe-Ni alloys, Fe-Ni-Mo alloys, Fe-Ni-Mo-Cu alloys, Fe-Co alloys, Fe-Ni-Co alloys, Fe-Cr alloys, Fe-Cr-Si alloys, Fe-Si-Cu-Nb alloys, Fe-Ni-Cr alloys, and Fe-Cr-Al alloys. Here, the different compositions of the metal magnetic particles may mean different contents.

[0070] The metal magnetic particles are amorphous or crystalline. For example, the metal magnetic particles are Fe-Si-B-Cr amorphous alloys, but the present embodiment is not limited thereto. The metal magnetic particles have an average particle size of about 0.1 μm to 30 μm, but the present embodiment is not limited thereto. In this specification, the average particle size is defined as D 90 Or D 50 Particle size distribution is an index showing the ratio of particles of different sizes (particle diameters) contained in the particle group being measured, and is well known to ordinary engineers. 50 (Particle size corresponding to 50% cumulative volume of particle size distribution) indicates the average particle size.

[0071] The metal magnetic particles are two or more different types of metal magnetic particles. Different types of metal magnetic particles mean that the metal magnetic particles are distinguished from one another in at least one of the average particle size, composition, component ratio, crystallinity, and shape.

[0072] The insulating material may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0073] The intermediate layer 400 includes the above-mentioned materials, but the permeability of the intermediate layer 400 is smaller than that of the magnetic body 100. Furthermore, the permeability of the magnetic body 100 and the intermediate layer 400 is appropriately set to adjust the coefficient of coupling (K) between the first coil 200 and the second coil 300.

[0074] For example, in a method for adjusting the magnetic permeability of the magnetic body 100 and the intermediate layer 400, the volume fraction of the first magnetic particles contained in the magnetic body 100 and the volume fraction of the second magnetic particles contained in the intermediate layer 400 are made different from each other. Here, the volume fraction of the magnetic particles means the ratio of the volume of the first magnetic particles to the volume of the magnetic body 100 or the ratio of the volume of the second magnetic particles to the volume of the intermediate layer 400. In order to adjust the relative magnetic permeability of the magnetic body 100 and the intermediate layer 400 by the volume fraction of the first magnetic particles and the second magnetic particles, the first magnetic particles and the second magnetic particles are realized with the same material, for example, a metal alloy of the same composition. Meanwhile, in a method for adjusting the magnetic permeability of the magnetic body 100 and the intermediate layer 400, the area fraction of the first magnetic particles contained in the magnetic body 100 and the area fraction of the second magnetic particles contained in the intermediate layer 400 are made different from each other when checked by cross-sectional area. Here, the area fraction of the magnetic grains means the ratio of the cross-sectional area of ​​the first magnetic grains to the cross-sectional area of ​​the magnetic body 100 or the ratio of the cross-sectional area of ​​the second magnetic grains to the cross-sectional area of ​​the intermediate layer 400 .

[0075] When the permeability of the intermediate layer 400 is smaller than that of the magnetic body 100, the volume fraction of the second magnetic particles contained in the intermediate layer 400 is smaller than the volume fraction of the first magnetic particles contained in the magnetic body 100. When the permeability of the intermediate layer 400 is smaller than that of the magnetic body 100, the coupling coefficient between the first coil 200 and the second coil 300 increases relatively. Here, the relatively increase in the coupling coefficient means that the coupling coefficient is larger than when the permeability of the intermediate layer 400 and the permeability of the magnetic body 100 are the same. When the permeability of the intermediate layer 400 is relatively small, the amount of magnetic flux flowing through the intermediate layer 400 is relatively small, and the mutual inductance due to the magnetic flux shared by the first coil 200 and the second coil 300 is large. Here, the magnetic flux flowing through the intermediate layer 400 can be understood as flowing in the length direction (L-axis direction) of the intermediate layer 400 in FIG. 4.

[0076] As a result, the mutual inductance between the first coil 200 and the second coil 300 becomes large, and the leakage inductance formed only in the first coil 200 or the second coil 300 becomes small, so that the coupling coefficient between the first coil 200 and the second coil 300 becomes large.

[0077] The first external electrode 500 and the second external electrode 600 are provided outside the magnetic body 100 and are electrically connected to the first coil 200 .

[0078] The first external electrode 500 is disposed on the sixth surface S6 of the magnetic body 100, and the first lead-out portion 223 of the first coil 200 is exposed to the sixth surface S6 of the magnetic body 100 and connected to the first external electrode 500.

[0079] The second external electrode 600 is disposed on the sixth surface S6 of the magnetic body 100, and the second lead-out portion 225 of the first coil 200 is exposed to the sixth surface S6 of the magnetic body 100 and connected to the second external electrode 600.

[0080] The first external electrode 500 and the second external electrode 600 are formed of a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or an alloy thereof.

[0081] The first external electrode 500 and the second external electrode 600 include a plurality of metal layers formed by plating a conductive metal.

[0082] Referring to the right circle of FIG. 1, a first external electrode 500 includes a first metal layer 501 , a second metal layer 502 and a third metal layer 503 .

[0083] The first metal layer 501 is a plating layer in contact with the first lead portion 223 of the first coil 200 and the outer surface of the magnetic body 100, and contains copper (Cu). The second metal layer 502 is a plating layer covering the first metal layer 501, and contains nickel (Ni). The third metal layer 503 is a plating layer covering the second metal layer 502, and contains tin (Sn). However, this embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one plating layer is added on the first metal layer 501 is also possible.

[0084] Referring to the left circle of FIG. 1, the second external electrode 600 includes a first metal layer 601 , a second metal layer 602 and a third metal layer 603 .

[0085] The first metal layer 601 is a plating layer in contact with the second lead portion 225 of the first coil 200 and the outer surface of the magnetic body 100, and contains copper (Cu). The second metal layer 602 is a plating layer covering the first metal layer 601, and contains nickel (Ni). The third metal layer 603 is a plating layer covering the second metal layer 602, and contains tin (Sn). However, this embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one plating layer is added on the first metal layer 601 is also possible.

[0086] In this manner, the first external electrode 500 and the second external electrode 600 include a plurality of plating layers including nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or an alloy thereof. For example, the first external electrode 500 and the second external electrode 600 are formed in a combination of nickel (Ni), copper (Cu), nickel / copper (Ni / Cu), palladium / nickel (Pd / Ni), palladium / nickel / copper (Pd / Ni / Cu), or copper / nickel / copper (Cu / Ni / Cu).

[0087] In some cases, the outermost layer may be made of tin (Sn), which has a relatively low melting point, and therefore can improve the ease of mounting the first and second external electrodes 500 and 600 on a board.

[0088] In general, the tin plating layer is bonded to the electrode pad on the substrate through a solder containing a tin (Sn)-copper (Cu)-silver (Ag) alloy paste, that is, the tin plating layer is melted and bonded to the solder during a heat treatment (reflow) process.

[0089] The third external electrode 700 and the fourth external electrode 800 are provided outside the magnetic body 100 and are electrically connected to the second coil 300 .

[0090] The third external electrode 700 is disposed on the sixth surface S6 of the magnetic body 100, and the first lead-out portion 323 of the second coil 300 is exposed to the sixth surface S6 of the magnetic body 100 and connected to the third external electrode 700.

[0091] The fourth external electrode 800 is disposed on the sixth surface S6 of the magnetic body 100, and the second lead-out portion 325 of the second coil 300 is exposed to the sixth surface S6 of the magnetic body 100 and connected to the fourth external electrode 800.

[0092] The structures and components of the third external electrode 700 and the fourth external electrode 800 are the same as those of the first external electrode 500 and the second external electrode 600 described above, and therefore, a duplicated description thereof will be omitted.

[0093] Meanwhile, in the magnetic body 100 of the coil electronic component 1000 according to the present embodiment, an insulating layer 900 is provided in a region other than the region where the first external electrode 500, the second external electrode 600, the third external electrode 700, and the fourth external electrode 800 are arranged. Alternatively, an insulating layer may be present in a region between the exposed portion of the first lead portion 223 of the first coil 200, the exposed portion of the second lead portion 225 of the first coil 200, the exposed portion of the first lead portion 323 of the second coil 300, and the exposed portion of the second lead portion 325 of the second coil 300 on the sixth surface S6 of the magnetic body 100. In this case, the first external electrode 500, the second external electrode 600, the third external electrode 700, and the fourth external electrode 800 cover a portion of the insulating layer.

[0094] In this manner, the insulating layer 900 is disposed on at least a portion of the first surface S1, the second surface S2, the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the magnetic body 100 to prevent electrical shorts between other electronic components and the external electrodes (500, 600, 700, 800).

[0095] The insulating layer 900 is used as a resist when forming the external electrodes 500, 600, 700, and 800 by electrolytic plating, but is not limited thereto.

[0096] FIG. 5 is a perspective view that illustrates a second example of a coil electronic component according to an embodiment.

[0097] 5, a first external electrode 2500 of a coil electronic component 2000 according to the present embodiment is connected to a first lead-out portion 223 of a first coil 200 at a sixth surface S6 of a magnetic body 100 and extends to a second surface S2 of the magnetic body 100. In addition, a second external electrode 2600 is connected to a second lead-out portion 225 of a first coil 200 at a sixth surface S6 of the magnetic body 100 and extends to a first surface S1 of the magnetic body 100.

[0098] The third external electrode 2700 is connected to the first lead-out portion 323 of the second coil 300 on the sixth surface S6 of the magnetic body 100 and extends to the first surface S1 of the magnetic body 100. In addition, the fourth external electrode 2800 is connected to the second lead-out portion 325 of the second coil 300 on the sixth surface S6 of the magnetic body 100 and extends to the second surface S2 of the magnetic body 100.

[0099] The remaining components other than those described above are the same as those of the coil electronic component shown in FIG. 1, so a duplicated description thereof will be omitted.

[0100] FIG. 6 is a perspective view that illustrates a schematic diagram of a third example of a coil electronic component according to an embodiment.

[0101] 6, a first external electrode 3500 of a coil electronic component 3000 according to the present embodiment is connected to a first lead-out portion 223 of a first coil 200 at a sixth surface S6 of a magnetic body 100, and extends to a second surface S2 and a fifth surface S5 of the magnetic body 100. In addition, a second external electrode 3600 is connected to a second lead-out portion 225 of a first coil 200 at a sixth surface S6 of the magnetic body 100, and extends to a first surface S1 and a fifth surface S5 of the magnetic body 100.

[0102] The third external electrode 3700 is connected to the first lead-out portion 323 of the second coil 300 on the sixth surface S6 of the magnetic body 100, and extends to the first surface S1 and the fifth surface S5 of the magnetic body 100. In addition, the fourth external electrode 3800 is connected to the second lead-out portion 325 of the second coil 300 on the sixth surface S6 of the magnetic body 100, and extends to the second surface S2 and the fifth surface S5 of the magnetic body 100.

[0103] The remaining components other than those described above are the same as those of the coil electronic component shown in FIG. 1, so a duplicated description thereof will be omitted.

[0104] FIG. 7 is a cross-sectional view that illustrates a schematic diagram of a fourth example of a coil electronic component according to an embodiment.

[0105] 7, a coil electronic component 4000 according to the present embodiment includes a magnetic body 100, a first coil 200, a second coil 300, an intermediate layer 400, and a support 4100.

[0106] The intermediate layer 400 is disposed between the first coil 200 and the second coil 300. For example, the intermediate layer 400 contacts the first coil 200 and the second coil 300.

[0107] The intermediate layer 400 is positioned to extend from a first region R1 between the first core 230 of the first coil 200 and the second core 330 of the second coil 300 to a portion of the second region R2 between the first coil 200 and the second coil 300.

[0108] The second region R2 includes an inner region R21 and an outer region R22.

[0109] The inner region R21 is a region in which the intermediate layer 400 is disposed, and is a region close to the first core 230 and the second core 330 side.

[0110] The outer region R22 is a region in which the magnetic body 100 is disposed in contact with the inner region R21, and is a region far from the first core 230 and the second core 330 side.

[0111] The support 4100 is disposed within the second region R2 and contacts the first coil 200 and the second coil 300. Since the support 4100 contacts the first coil 200 and the second coil 300, the support 4100 can prevent the first coil 200 and the second coil 300 from being tilted relative to each other. That is, the support 4100 maintains a constant distance between the first coil 200 and the second coil 300.

[0112] On the other hand, the support 4100 may be spaced apart from the intermediate layer 400 or may be in contact with the intermediate layer 400 .

[0113] The support 4100 is made of, for example, a magnetic material, an epoxy, or a non-magnetic material. When the support 4100 is made of a magnetic material, the magnetic permeability of the support 4100 may be greater than the magnetic permeability of the intermediate layer 400, and may be the same as or smaller than the magnetic permeability of the magnetic body 100.

[0114] The remaining components other than those described above are the same as those of the coil electronic component shown in FIG. 1, so a duplicated description thereof will be omitted.

[0115] FIG. 8 is a perspective view that illustrates a fifth example of a coil electronic component according to an embodiment, and FIG. 9 is a cross-sectional view taken along line IX-IX' in FIG.

[0116] 8 and 9, the coil electronic component 5000 according to this embodiment includes a magnetic body 100, a first coil 5200, a second coil 5300, an intermediate layer 5400, a first external electrode 500, a second external electrode 600, a third external electrode 700, a fourth external electrode 800, and a support 5500.

[0117] The first coil 5200 includes a first support substrate 5210 , a first coil pattern 5220 , a second coil pattern 5230 , and a first via 5240 .

[0118] The first support substrate 5210 includes a first surface 5213 and a second surface 5215 opposing each other, and is made of an insulating material.

[0119] The first coil pattern 5220 is disposed on a first surface 5213 of the first support substrate 5210, and the second coil pattern 5230 is disposed on a second surface 5215 of the first support substrate 5210. The first coil pattern 5220 and the second coil pattern 5230 are formed using a plating process used in the art, such as pattern plating, anisotropic plating, isotropic plating, etc., and are formed in a multi-layer structure using a plurality of these processes.

[0120] The first via 5240 penetrates the first support substrate 5210 to connect the first coil pattern 5220 and the second coil pattern 5230 to each other.

[0121] The second coil 5300 includes a second support substrate 5310 , a first coil pattern 5320 , a second coil pattern 5330 , and a second via 5340 .

[0122] The second support substrate 5310 includes a first surface 5313 and a second surface 5315 opposing each other, and is made of an insulating material.

[0123] The first coil pattern 5320 is disposed on a first surface 5313 of the second support substrate 5310, and the second coil pattern 5330 is disposed on a second surface 5315 of the second support substrate 5310. The first coil pattern 5320 and the second coil pattern 5330 are formed using a plating process used in the art, such as pattern plating, anisotropic plating, isotropic plating, etc., and are formed in a multi-layer structure using a plurality of these processes.

[0124] The second via 5340 passes through the second support substrate 5310 and connects the first coil pattern 5320 and the second coil pattern 5330 to each other.

[0125] The intermediate layer 5400 is disposed between the first coil 5200 and the second coil 5300 .

[0126] The intermediate layer 5400 is disposed to extend from a first region R1 between the first core 5227 of the first coil 5200 and the second core 5327 of the second coil 5300 to a portion of the second region R2 between the first coil 5200 and the second coil 5300.

[0127] The second region R2 includes an inner region R21 and an outer region R22.

[0128] The inner region R21 is a region in which the intermediate layer 5400 is disposed, and is a region close to the first core 5227 and the second core 5327 side.

[0129] The outer region R22 is a region in which the magnetic body 100 is disposed in contact with the inner region R21, and is a region far from the first core 5227 and the second core 5327 side.

[0130] The support 5500 is disposed in the second region R2 and contacts the first coil 5200 and the second coil 5300. Since the support 5500 contacts the first coil 5200 and also the second coil 5300, the support 5500 can prevent the first coil 5200 and the second coil 5300 from being tilted relative to each other. That is, the support 5500 maintains a constant distance between the first coil 5200 and the second coil 5300.

[0131] Meanwhile, the intermediate layer 5400 includes a magnetic material and affects the magnetic coupling characteristics between the first coil 5200 and the second coil 5300. The intermediate layer 400 includes magnetic particles, and an insulating material is interposed between the magnetic particles.

[0132] The permeability of the intermediate layer 5400 is smaller than that of the magnetic body 100. Furthermore, the permeability of the magnetic body 100 and the intermediate layer 5400 is appropriately set to adjust the coefficient of coupling (K) between the first coil 5200 and the second coil 5300.

[0133] The first external electrode 500 and the second external electrode 600 are provided outside the magnetic body 100 and are electrically connected to the first coil 5200 .

[0134] The first lead-out portion 5223 of the first coil 5200 is exposed to the fourth surface S4 of the magnetic body 100 and is connected to the first external electrode 500. The first external electrode 500 extends from the fourth surface S4 to the fifth surface S5 and sixth surface S6 of the magnetic body. In addition, the second lead-out portion 5225 of the first coil 5200 is exposed to the third surface S3 of the magnetic body 100 and is connected to the second external electrode 600. The second external electrode 600 extends from the third surface S3 to the fifth surface S5 and sixth surface S6 of the magnetic body.

[0135] The third external electrode 700 and the fourth external electrode 800 are provided outside the magnetic body 100 and are electrically connected to the second coil 5300 .

[0136] The first lead-out portion 5323 of the second coil 5300 is exposed to the fourth surface S4 of the magnetic body 100 and is connected to the third external electrode 700. The third external electrode 700 extends from the fourth surface S4 to the fifth surface S5 and sixth surface S6 of the magnetic body. In addition, the second lead-out portion 5325 of the second coil 5300 is exposed to the third surface S3 of the magnetic body 100 and is connected to the fourth external electrode 800. The fourth external electrode 800 extends from the third surface S3 to the fifth surface S5 and sixth surface S6 of the magnetic body.

[0137] The remaining components other than those described above are the same as those of the coil electronic component shown in FIG. 1, so a duplicated description thereof will be omitted.

[0138] Although the embodiments of the present invention have been described in detail above with reference to the drawings, the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the technical spirit of the present invention. [Explanation of symbols]

[0139] 1000, 2000, 3000, 4000, 5000 Coil Electronic Components 100 Magnetic material 200, 5200 First coil 210, 310 Winding section 220, 320 Drawer section 223, 323, 5223 1st drawer 225, 325, 5325 2nd drawer 230, 5227 1st Core 300, 5300 Second coil 330, 5327 2nd Core 400, 5400 Middle class 500, 2500, 3500 1st external electrode 501, 601 1st metal layer 502, 602 2nd metal layer 503, 603 3rd metal layer 600, 2600, 3600 2nd external electrode 700, 2700, 3700 3rd external electrode 800, 2800, 3800 4th external electrode 900 Insulation layer 4100, 5500 support 5210, 5310 1st and 2nd support board 5213, 5313 1st page 5215, 5315 2nd page 5220, 5320 1st coil pattern 5230, 5330 Second coil pattern 5240, 5340 1st and 2nd vias C1, C1' Outermost turn coil C2, C2' Innermost turn coil IF insulating film R1, R2 1st, 2nd area R21 Inner area R22 outer area S1~S6 1st~6th page

Claims

1. A first coil; a second coil spaced apart from the first coil; an intermediate layer disposed to extend from a first region between a first core of the first coil and a second core of the second coil to a second region between the first coil and the second coil; a magnetic body surrounding the first coil, the second coil, and the intermediate layer, A coil electronic component, characterized in that the permeability of the intermediate layer is smaller than the permeability of the magnetic body.

2. The coil electronic component according to claim 1 , wherein the intermediate layer is in contact with the first coil and the second coil.

3. The coil electronic component according to claim 2 , wherein the intermediate layer is spaced apart from an outer edge of the second region.

4. 2. The coil electronic component according to claim 1, wherein the thickness of the intermediate layer in the first region is the same as the thickness of the intermediate layer in the second region.

5. The coil electronic component according to claim 1 , wherein the intermediate layer extends from the first region to a portion of the first core.

6. The coil electronic component according to claim 1 , wherein the intermediate layer extends from the first region to a portion of the second core.

7. the intermediate layer extends from the first region to a portion of the first core, The coil electronic component according to claim 1 , wherein the intermediate layer extends from the first region to a portion of the second core.

8. 2. The coil electronic component according to claim 1, wherein the second region includes an inner region in which the intermediate layer is disposed, and an outer region in which the magnetic body is disposed and in contact with the inner region.

9. The coil electronic component according to claim 1 , further comprising a support disposed in the second region and in contact with the first coil and the second coil.

10. The coil electronic component according to claim 9 , wherein the support is spaced apart from the intermediate layer.

11. The coil electronic component according to claim 9 , wherein the support body is in contact with the intermediate layer.

12. The coil electronics component of claim 9, wherein the support is made of a magnetic material, an epoxy, or a non-magnetic material.

13. a first external electrode disposed outside the magnetic body and connected to a first lead portion of the first coil; a second external electrode disposed outside the magnetic body and connected to a second lead portion of the first coil; a third external electrode disposed outside the magnetic body and connected to the first lead portion of the second coil; The coil electronic component according to claim 1 , further comprising: a fourth external electrode disposed outside the magnetic body and connected to the second lead-out portion of the second coil.

14. the first coil includes a wire-wound coil; The coil electronic component according to claim 1 , wherein the second coil comprises a wire-wound coil.

15. The first coil is a first support substrate having a first surface and a second surface opposed to each other; a first coil pattern disposed on a first surface of the first support substrate; a second coil pattern disposed on a second surface of the first support substrate; a first via penetrating the first supporting substrate and connecting the first coil pattern and the second coil pattern, The second coil is a second support substrate having a first surface and a second surface opposed to each other; a first coil pattern disposed on a first surface of the second support substrate; a second coil pattern disposed on a second surface of the second support substrate; The coil electronic component according to claim 1 , further comprising: a second via penetrating the second support substrate and connecting the first coil pattern and the second coil pattern.

16. The coil electronic component according to claim 1 , wherein the intermediate layer is disposed so as to extend to a portion of the second region.

17. The coil electronic component according to claim 1 , wherein an insulating film is provided on a surface of the first coil and a surface of the second coil.

Images