Processing method of work-piece

Abstract

To provide a processing method capable of preventing a support member for supporting a work-piece from being damaged even if a high-pressure water adopted to a burr removing is injected.SOLUTION: A processing method of a work-piece, contains: a preparation step of preparing a work-piece (10) in which a support member (11) is fixed to one surface (101), and a division groove (13) is formed along a division schedule line; a contraction step of narrowing a width of the division groove by applying an external force to a region corresponded to at least the division groove of the support member, and contracting them; and a burr removing step of removing a burr by injecting a high-pressure water (W) along the division groove from the other surface (102) of the work-piece after the contraction step.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a method for machining a workpiece. [Background technology]

[0002] In a processing method for manufacturing multiple chips by dividing a workpiece, when the workpiece is divided into multiple chips using a cutting blade or the like, burrs are generated on the edge of the dividing groove (kerf). For example, if the workpiece is a semiconductor workpiece such as a package board, the burrs can cause poor connection when the chips obtained by dividing the workpiece are mounted on a board or the like. For this reason, it is desirable to remove the burrs, and a method for removing burrs generated on the workpiece by jetting high-pressure water is known (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-206048 A Summary of the Invention [Problem to be solved by the invention]

[0004] When removing burrs by jetting high-pressure water, it is necessary to remove the burrs without damaging surrounding structures other than the burrs. For example, if the pressure of the jetted high-pressure water is increased, it becomes easier to remove the burrs, but there is a risk that the high-pressure water may hit the sheet (tape) supporting the workpiece or the holding surface of the holding table on which the workpiece is placed, causing holes in the sheet or holding surface, making it impossible to hold the workpiece properly. In addition, if the pressure of the jetted high-pressure water is reduced, the problem of not being able to sufficiently remove the burrs arises.

[0005] The present invention has been made in consideration of the above points, and aims to provide a processing method that does not damage the support member that supports the workpiece, even when high-pressure water at a pressure suitable for removing burrs is sprayed. [Means for solving the problem]

[0006] A method for processing a workpiece according to one aspect of the present invention includes a preparation step of preparing a workpiece having a support member fixed to one surface and a division groove formed along a planned division line, a contraction step of applying an external force to at least an area of ​​the support member corresponding to the division groove to cause it to shrink and narrow the width of the division groove, and a burr removal step of spraying high-pressure water from the other surface along the division groove after the contraction step to remove burrs.

[0007] In the shrinking step, for example, the support member is heated to shrink it. Effect of the Invention

[0008] According to the method for processing a workpiece of the present invention, the support member that supports the workpiece is contracted to narrow the width of the dividing groove, and then high-pressure water is sprayed along the dividing groove to remove burrs, so that damage to the support member can be prevented even when high-pressure water of a pressure suitable for burr removal is sprayed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a semiconductor wafer as a workpiece. [Diagram 2] FIG. 2 is a diagram showing a package substrate which is a workpiece. [Diagram 3] FIG. 13 is a diagram showing a division process in the preparation step. [Figure 4] FIG. 1 shows a first embodiment of a shrinking step. [Diagram 5] FIG. 1 shows a first embodiment of a shrinking step. [Figure 6] FIG. 13 illustrates a second embodiment of the shrinking step. [Figure 7] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a method for processing a workpiece according to this embodiment will be described with reference to the accompanying drawings. Figures 1 and 2 show an example of a workpiece. Figures 3 to 7 show each step in the method for processing a workpiece. The X-axis and Y-axis directions shown in each drawing are horizontal directions, and the Z-axis direction is the up-down direction. The X-axis and Y-axis directions are perpendicular to each other.

[0011] The wafer 1 shown in Fig. 1 is a disk-shaped semiconductor wafer made of, for example, silicon. On the front side of the wafer 1, chips 2, which are electronic devices, are formed in a plurality of regions partitioned by a plurality of lattice-like division lines. The wafer is supported on an annular frame 4 via tape 3, which is a support member, attached to the back side.

[0012] 2, chips 6, which are electronic devices, are formed in a plurality of regions defined by a plurality of grid-like division lines. The package substrate 5 is supported by an annular frame 8 via tape 7, which is a support member, attached to the back side.

[0013] In the method for processing a workpiece of this embodiment described below, a plate-shaped object to be processed, including a wafer 1 and a package substrate 5, is called a workpiece 10, a member corresponding to the tape 3 and the tape 7 is called a support member 11, and a member corresponding to the frame 4 and the frame 8 is called a frame 12.

[0014] [Preparation step (division process)] 3, in the preparation step, a support member 11 is fixed to one surface 101 of the workpiece 10, and a dividing groove 13 is formed along a planned dividing line of the workpiece 10. The surface of the workpiece 10 to which the support member 11 is fixed is referred to as the one surface 101, and the opposite surface is referred to as the other surface 102.

[0015] As an example, the support member 11 is an adhesive tape (dicing tape) having a flexible and non-adhesive base layer and a flexible and adhesive adhesive layer laminated on the base layer. The support member 11 made of such an adhesive tape is fixed to one surface 101 of the workpiece 10 by the adhesion of the adhesive layer.

[0016] As another example, the support member 11 may be a sheet made of a thermoplastic resin that does not have an adhesive layer. The support member 11 made of such a non-adhesive sheet is attached to one surface 101 of the workpiece 10 by thermocompression bonding. As the non-adhesive sheet, a polyolefin sheet, a polyethylene sheet, a polypropylene sheet, or a polystyrene sheet is preferable.

[0017] As yet another example, the support member 11 may be a resin sheet having a finely uneven surface that adheres closely to one surface 101 of the workpiece 10 when pressed against the surface.

[0018] The support member 11 is made of a material that has elasticity and shrinks when a predetermined external force is applied. More specifically, the support member 11 in this embodiment is made of a heat-shrinkable tape or sheet that shrinks when heated to a predetermined temperature or higher. Heating the support member 11 to a predetermined temperature or higher applies a predetermined external force to the support member 11 in the shrinking step described below.

[0019] The frame 12 is made of a highly rigid material such as metal. The area of ​​the support member 11 is larger than the area of ​​the workpiece 10. The workpiece 10 is fixed to the central region of the support member 11, and the frame 12 is fixed to the peripheral region of the support member 11.

[0020] 3 shows a dividing step in which dividing grooves 13 are formed in the workpiece 10 using a cutting device in the preparation step. With the frame 12 fixed to the peripheral region of the support member 11, the workpiece 10 is transported to the cutting device. The cutting device includes a holding table 20 that holds the workpiece 10, and a cutting section 21 that performs cutting on the workpiece 10 held on the holding table 20.

[0021] The workpiece 10 is placed on the holding table 20 with the other surface 102 facing upward and the support member 11 facing downward. In other words, the support member 11 is placed on the upper surface of the holding table 20, and the workpiece 10 is held on the holding table 20 via the support member 11.

[0022] The workpiece 10 is fixedly held by the holding table 20. As a method for holding the workpiece 10, for example, the holding table 20 is provided with a suction structure (not shown) that applies a suction force to the upper surface. When a suction force is applied to the upper surface of the holding table 20, the support member 11 is sucked and held on the upper surface of the holding table 20, and the workpiece 10 fixed to the support member 11 is fixed to the holding table 20.

[0023] As another method for holding the workpiece 10, the holding table 20 is provided with a clamping portion (not shown) that clamps the frame 12. When the frame 12 is clamped by the clamping portion, the workpiece 10 supported by the frame 12 via the support member 11 is fixed to the holding table 20.

[0024] The holding table 20 may hold the workpiece 10 using a suction structure and a clamping portion in combination.

[0025] The cutting unit 21 has a spindle 22 extending in the Y-axis direction and a cutting blade 24 attached to the tip of the spindle 22 via a mount 23. The cutting blade 24 is an annular cutting edge. The spindle 22 is rotated by a motor (not shown), and the cutting blade 24 rotates integrally with the spindle 22.

[0026] The holding table 20 and the cutting unit 21 are relatively movable in the X-axis direction and the Y-axis direction. For example, the holding table 20 is configured to move in the X-axis direction, and the cutting unit 21 is configured to move in the Y-axis direction. The cutting unit 21 is also movable in the Z-axis direction. When the cutting unit 21 moves downward in the Z-axis direction while the workpiece 10 is held on the holding table 20, the lower edge of the cutting blade 24 approaches the workpiece 10. By driving the spindle 22 to rotate the cutting blade 24 and moving the cutting unit 21 downward, the cutting blade 24 can be cut into the other surface 102 of the workpiece 10 to form a dividing groove 13 in the workpiece 10, as shown in FIG. 3.

[0027] When forming the division groove 13 in the workpiece 10 using a cutting device, the cutting blade 24 is positioned above the start point of the planned division line extending in the X-axis direction. Then, the cutting unit 21 is moved downward while rotating the cutting blade 24, and the cutting blade 24 is caused to cut into the start point of the planned division line to a predetermined depth. Next, the holding table 20 and the cutting unit 21 are moved relatively in the X-axis direction, and the cutting blade 24 is caused to reach the end point of the planned division line. In this way, the division groove 13 is formed along one planned division line extending in the X-axis direction.

[0028] Once the division groove 13 has been formed along one planned division line, the holding table 20 and the cutting unit 21 are moved relatively in the Y-axis direction, and the cutting blade 24 is positioned above the start point of the next planned division line extending in the X-axis direction. Then, the rotating cutting blade 24 is caused to cut into the start point of the planned division line, and the holding table 20 and the cutting unit 21 are moved relatively in the X-axis direction until the cutting blade 24 reaches the end point of the planned division line. In this way, the division groove 13 is formed along the next planned division line extending in the X-axis direction.

[0029] When the formation of the division grooves 13 along all the division lines extending in the X-axis direction is completed, the holding table 20 is rotated by 90°. Then, a plurality of undivided division lines extend in the X-axis direction (lined up at intervals in the Y-axis direction), and cutting is performed with the cutting blade 24 along each division line extending in the X-axis direction in the same procedure as above to form the division grooves 13.

[0030] The dividing step is performed so that the dividing groove 13 becomes a full-cut groove penetrating the workpiece 10 in the Z-axis direction. Therefore, the support member 11 is exposed at the bottom of the dividing groove 13.

[0031] Workpiece 10 is provided with chips 14 (corresponding to chip 2 in FIG. 1 and chip 6 in FIG. 2) in each of a plurality of regions partitioned in a lattice shape by dividing grooves 13. When dividing grooves 13 are formed in workpiece 10 in the preparation step, burrs 15, which are processing marks, are generated along the edges of dividing grooves 13. In particular, burrs 15 are likely to be formed in a shape that protrudes toward the other surface 102 side where cutting blade 24 is cut. Burrs 15 can cause poor connection of chip 14 after completion and may degrade the quality of the device, so burrs 15 must be removed in order to obtain good chips 14.

[0032] When a water jet processing device (FIG. 7) is used as a method for removing the burrs 15, as described later, high-pressure water is sprayed toward the workpiece 10. However, as shown in FIG. 3, the dividing groove 13 at the stage of dividing using the cutting blade 24 of the cutting section 21 or the like has a predetermined width between two adjacent chips 14. The dividing groove 13 is a full-cut groove that penetrates the workpiece 10 in the Z-axis direction (thickness direction). Therefore, when high-pressure water that has been increased to a pressure suitable for removing the burrs 15 is sprayed toward the dividing groove 13 in a wide state immediately after the dividing process, the high-pressure water passes through the dividing groove 13 and hits the support member 11 (the exposed area of ​​the support member 11 that corresponds to the dividing groove 13). The support member 11, which is formed of a material that is elastic and relatively low in rigidity compared to the workpiece 10, is easily damaged, such as by being perforated, when hit by the sprayed high-pressure water. If the support member 11 is damaged, it will no longer be able to hold the workpiece 10 normally, which will cause problems in the processing and transportation of the workpiece 10 thereafter.

[0033] [Shrinkage Step] In order to solve such problems, a shrinking step is performed following the preparation step. In the shrinking step, an external force is applied to at least the region of the support member 11 corresponding to the dividing groove 13 to cause it to shrink and narrow the width of the dividing groove 13. The concept of narrowing the width of the dividing groove 13 includes a case where the edges of adjacent chips 14 come into contact with each other and the width of the dividing groove 13 becomes substantially zero, and a case where the edges of adjacent chips 14 do not come into contact with each other and some width remains in the dividing groove 13. In other words, the shrinking step may be one that makes the width of the dividing groove 13 smaller by a predetermined amount or more than the width of the dividing groove 13 immediately after the dividing step.

[0034] In particular, in the contraction step, it is preferable to contract the width of the dividing groove 13 to be equal to the nozzle diameter of the high-pressure water jet nozzle 41 (FIG. 7) used in the burr removal step described later, and more preferably, to contract the width to a width smaller than the nozzle diameter of the high-pressure water jet nozzle 41. Since the high-pressure water W jetted from the high-pressure water jet nozzle 41 has a wider jet range than the nozzle diameter of the high-pressure water jet nozzle 41 when it reaches the workpiece 10, contracting the width of the dividing groove 13 to be equal to the nozzle of the high-pressure water jet nozzle 41 provides the effect of protecting the support member 11 from the pressure of the high-pressure water W. Furthermore, contracting the width of the dividing groove 13 to a width smaller than the nozzle diameter of the high-pressure water jet nozzle 41 can reliably prevent the high-pressure water W jetted from the high-pressure water jet nozzle 41 from directly hitting the support member 11.

[0035] 4 and 5 show a first embodiment of the shrinking step, and FIG. 6 shows a second embodiment of the shrinking step. As described above, the support member 11 is made of a heat-shrinkable tape or sheet that shrinks when heated to a predetermined temperature or higher. Both the first and second embodiments of the shrinking step are common in that heating is performed to apply a predetermined external force to the support member 11, and the support member 11 shrinks in response to the heating. In the shrinking step, the support member 11 is supported on holding tables 30 and 35, which will be described later, so that it can move in the horizontal direction. In other words, in the shrinking step, the support member 11 is not fixed to the holding tables 30 and 35.

[0036] 4 and 5, in a first embodiment of the shrinking step, a holding table 30 incorporating a heater 31 as a heat source is provided, and the workpiece 10 and the support member 11 are placed on the holding table 30. In detail, the other surface 102 of the workpiece 10 is placed upward, the support member 11 is placed downward, and the lower surface of the support member 11 is placed on the upper surface of the holding table 30.

[0037] In addition, when the overall shrinkage amount of the support member 11 is large, such as when the number of dividing grooves 13 is large, if the frame 12 is left attached to the support member 11 in the shrinking step, the tension between the frame 12 and a part of the support member 11 may reach a limit, and sufficient shrinkage of the support member 11 may be hindered. Therefore, in the first embodiment of the shrinking step, as shown in Figs. 4 and 5, the workpiece 10 and the support member 11 are placed on the holding table 30 with the frame 12 removed from the support member 11. However, depending on conditions such as the number of dividing grooves 13 and the amount of shrinkage, it is possible to deal with this by increasing the tension of the support member 11 even if the support member 11 is attached to the frame 12, and the frame 12 does not hinder the shrinkage of the support member 11. In such a case, the shrinking step may be performed with the frame 12 attached to the support member 11.

[0038] Once the workpiece 10 and the support member 11 have been placed on the holding table 30 as shown in Fig. 4, the heater 31 is turned on to generate heat. Heat is then transferred from the heater 31 to the support member 11 via the holding table 30, and the support member 11 that has received the heat contracts in the horizontal direction as shown in Fig. 5. When the support member 11 contracts, the intervals between the multiple chips 14 supported on the support member 11 become smaller, and the width of the dividing grooves 13 becomes narrower.

[0039] The heater 31 has an area roughly corresponding to the workpiece 10, and when the heater 31 is turned on, the areas corresponding to the multiple dividing grooves 13 are heated collectively, and a wide area of ​​the support member 11 can be contracted in a short time. In addition, the heater 31 is disposed so as to heat from the support member 11 side (the side opposite to the other surface 102 of the workpiece 10), so that heat can be efficiently transferred to the support member 11.

[0040] As shown in Fig. 6, in the second embodiment of the shrinking step, a protective sheet 36 is laid on the upper surface of a holding table 35, and the other surface 102 of the workpiece 10 is placed downward and the support member 11 is placed upward, and the frame 12 is placed on the upper surface of the protective sheet 36. The protective sheet 36 is made of a resin material such as polyethylene terephthalate (PET) or polyolefin, and protects the chip 14 from direct contact with the holding table 35. In the configuration example of Fig. 6, the thickness of the frame 12 is greater than the thickness of the workpiece 10, and the workpiece 10 is supported above the protective sheet 36 with the other surface 102 spaced apart from the protective sheet 36.

[0041] The heating member 37 is disposed above the holding table 35. The holding table 35 and the heating member 37 are relatively movable in the X-axis direction and the Y-axis direction. For example, the holding table 35 is configured to move in the X-axis direction, and the heating member 37 is configured to move in the Y-axis direction. The heating member 37 sprays hot air or irradiates infrared rays downward. In other words, it is possible to heat the area directly below the heating member 37 in a spot manner.

[0042] When the imaging unit 38 arranged above the holding table 35 captures an image of the workpiece 10 through the support member 11 to detect the position of the division groove 13, and the heating member 37 is positioned above the detected division groove 13 and heated by injecting hot air or irradiating infrared rays from the heating member 37, the region of the support member 11 located above the division groove 13 is heated and contracts. Since the position of the division groove 13 moves due to the contraction of the support member 11, the detection of the division groove 13 by the imaging unit 38, the positioning of the heating member 37 at a position corresponding to the division groove 13, and the heating of the support member 11 by the heating member 37 are repeatedly performed, and the holding table 35 and the heating member 37 are moved relatively in the X-axis direction, whereby the support member 11 contracts in the region along the division groove 13 extending in the X-axis direction.

[0043] After heating from the heating member 37 has been performed along one dividing groove 13, an image of the workpiece 10 is captured by the imaging unit 38 to detect the position of the next dividing groove 13 that has not yet been shrunk, and the holding table 35 and the heating member 37 are moved relatively in the Y-axis direction to position the heating member 37 above the detected dividing groove 13. Then, while heating is being performed by the heating member 37, the holding table 35 and the heating member 37 are moved relatively in the X-axis direction, whereby the support member 11 is shrunk in a region along the next dividing groove 13.

[0044] Alternatively, a long-type heating unit extending in the X-axis direction to a length equal to or greater than the diameter of the workpiece 10 may be provided as a heating unit instead of the heating member 37. When this heating unit is used, the heating unit can heat the entire range along the division grooves 13 extending in the X-axis direction, eliminating the need for the operation of moving the holding table 35 and the heating member 37 relatively in the X-axis direction as described above. Therefore, the regions of the support member 11 corresponding to each division groove 13 can be efficiently heated.

[0045] After shrinking the support member 11 by heating with the heating member 37 along all of the division grooves 13 extending in the X-axis direction, the holding table 35 is rotated 90°. Then, the support member 11 is in a state where a plurality of unshrunk division grooves 13 extend in the X-axis direction (lined up at intervals in the Y-axis direction), and heating is performed with the heating member 37 along each division groove 13 extending in the X-axis direction in the same procedure as above, causing the support member 11 to shrink.

[0046] As shown in Fig. 6, when the support member 11 shrinks in the area heated by the heating member 37, the width of the dividing groove 13 narrows. Fig. 6 shows the stage where the support member 11 has shrunk to the area corresponding to the two dividing grooves 13 on the left side of the drawing, and the support member 11 has not yet shrunk in the dividing grooves 13 to the right of that.

[0047] In this way, heating by the heating member 37 is limited to a specific region along the dividing grooves 13, so that the support member 11 can be reliably shrunk in the region along each dividing groove 13, and the shrinkage of the support member 11 can be suppressed in the intermediate region (the region corresponding to the tip 14) between each dividing groove 13. In addition, since the heating member 37 heats from the support member 11 side (the side opposite to the other surface 102 of the workpiece 10), the support member 11 can be efficiently heated.

[0048] [Deburring step] Following the shrinkage step, a burr removal step is performed as shown in Fig. 7. The burr removal step is performed using a water jet processing device equipped with a holding table 40 and a high-pressure water jet nozzle 41.

[0049] In the burr removal step, the workpiece 10 and the support member 11 are placed on the holding table 40. More specifically, the other surface 102 of the workpiece 10 is placed facing upward, the support member 11 is placed facing downward, and the lower surface of the support member 11 is placed on the upper surface of the holding table 40. The holding table 40 is equipped with a suction structure that holds the support member 11 by suction and a clamping portion that clamps the frame 12, and the workpiece 10 is fixedly held relative to the holding table 40.

[0050] A high-pressure water jet nozzle 41 is provided above the holding table 40. The high-pressure water jet nozzle 41 constitutes a water jet type processing unit, and the water supplied from a high-pressure water supply source 42 is pressurized, and the high-pressure water W, which has been increased to a pressure suitable for removing burrs, is jetted downward from the high-pressure water jet nozzle 41. In other words, the high-pressure water W is jetted from the other surface 102 of the workpiece 10 along the dividing groove 13.

[0051] The pressure of the high-pressure water W suitable for burr removal is a pressure that can remove minute burrs 15 formed on the workpiece 10 with the force of the high-pressure water W, and does not damage the tip 14. Such an appropriate pressure of the high-pressure water W is calculated in advance and stored in a control unit (storage unit) of the processing device that performs the burr removal step. In addition, an appropriate injection time of the high-pressure water W per unit area of ​​the workpiece 10 is also calculated in advance and stored in the control unit (storage unit) of the processing device so that the burrs 15 can be removed and the tip 14 is not damaged.

[0052] The holding table 40 and the high-pressure water jet nozzle 41 are relatively movable in the X-axis direction and the Y-axis direction. For example, the holding table 40 is configured to move in the X-axis direction, and the high-pressure water jet nozzle 41 is configured to move in the Y-axis direction.

[0053] The burr removal step is performed in a state where the image capturing unit 43 arranged above the holding table 40 captures an image of the workpiece 10 to detect the position of the division groove 13, and the high-pressure water jet nozzle 41 is positioned above the detected division groove 13. When the high-pressure water jet nozzle 41 is positioned above the division groove 13 detected by the image capturing unit 43 and high-pressure water W is jetted from the high-pressure water jet nozzle 41, the burrs 15 can be removed from the region of the other surface 102 of the workpiece 10 that is hit by the high-pressure water W. By relatively moving the holding table 40 and the high-pressure water jet nozzle 41 in the X-axis direction while jetting the high-pressure water W from the high-pressure water jet nozzle 41, the burrs 15 are removed from the region along the division groove 13 extending in the X-axis direction.

[0054] After the burrs 15 have been removed along one dividing groove 13, the image of the workpiece 10 is captured by the imaging unit 43 to detect the position of the next dividing groove 13, and the holding table 40 and the high-pressure water jet nozzle 41 are moved relatively in the Y-axis direction to position the high-pressure water jet nozzle 41 above the detected dividing groove 13. Then, while jetting high-pressure water W from the high-pressure water jet nozzle 41, the holding table 40 and the high-pressure water jet nozzle 41 are moved relatively in the X-axis direction to remove the burrs 15 in the area along the next dividing groove 13.

[0055] After the high-pressure water W is sprayed from the high-pressure water spray nozzle 41 along all of the dividing grooves 13 extending in the X-axis direction to remove the burrs 15, the holding table 40 is rotated by 90°. Then, multiple dividing grooves 13 from which the burrs 15 have not been removed extend in the X-axis direction (lined up at intervals in the Y-axis direction), and the burrs 15 are removed by spraying high-pressure water W from the high-pressure water spray nozzle 41 along each dividing groove 13 extending in the X-axis direction in the same procedure as above.

[0056] In the previous shrinking step, at least the region of the support member 11 corresponding to the dividing groove 13 is shrunk to narrow the width of the dividing groove 13, so that most of the high-pressure water W sprayed on the workpiece 10 to remove the burrs 15 hits the other surface 102 of the workpiece 10 and scatters around, suppressing the intrusion of the high-pressure water W into the dividing groove 13. Even if water infiltrates into the dividing groove 13, the width of the dividing groove 13 is narrowed, so that the water infiltrates with a weaker force than the high-pressure water W. Therefore, it is possible to prevent the high-pressure water W from passing through the dividing groove 13 with a strong force and reaching the support member 11 and directly hitting it, and it is possible to prevent the support member 11 from being perforated by the spray of the high-pressure water W. In addition, the high-pressure water W with a strong force does not reach the holding surface of the holding table 40 located below the support member 11, so it is possible to prevent the holding surface of the holding table 40 from being perforated by the spray of the high-pressure water W. In other words, there is no need to reduce the pressure of the high-pressure water W to prevent damage to the support member 11 or the holding table 40, and the high-pressure water W can be sprayed with sufficient pressure to remove the burrs 15.

[0057] In addition, when the high-pressure water W is sprayed with the width of the dividing groove 13 narrowed, the spray area of ​​the high-pressure water W (spray width of the high-pressure water W in the Y-axis direction) becomes easier to cover both edges of the dividing groove 13 in the width direction, and the burrs 15 on both edges of the dividing groove 13 can be removed together, so that the burrs 15 can be efficiently removed by spraying the high-pressure water W once against one dividing groove 13.

[0058] For example, if the shrinkage step is not performed (i.e., if the width of the dividing groove 13 is not narrowed), the injection area of ​​the high-pressure water W cannot cover both edges of the dividing groove 13, and the high-pressure water W will be injected back and forth against each edge of one dividing groove 13, which will take extra time to remove the burrs 15 from both edges of the dividing groove 13.

[0059] As described above, by carrying out the burr removal step after the shrinkage step, the burrs 15 can be efficiently removed by jetting the high-pressure water W without damaging the support member 11. After the burr removal step is completed, the workpiece 10 is removed from the holding table 40, completing the series of steps.

[0060] The workpiece 10 after the burr removal is transported to a die bonder device (not shown), and the divided chips 14 are picked up. In general, when picking up the chips 14, it is required that the chips 14 are spaced apart at a predetermined interval. Therefore, after the burr removal step, a re-expansion step may be performed in which the contraction of the support member 11 is released and the width of the division groove 13 is widened again. As an example, the width of the division groove 13 is re-expanded by stretching the support member 11 in the radial expansion direction using an expansion mechanism capable of applying tension to the support member 11 in the radial expansion direction. Alternatively, the width of the division groove 13 may be widened by attaching the chips 14 from the support member 11 to another support member at a predetermined interval.

[0061] In the above embodiment, a heat-shrinkable support member 11 is used, and the support member 11 is heated and shrunk in the shrinking step, but the manner in which the support member shrinks in the shrinking step is not limited to this.

[0062] For example, as a modified example, it is possible to use a support member of a type that shrinks when irradiated with electromagnetic waves (such as ultraviolet rays) or a support member of a type that shrinks when cooled, etc. In these types of support members, the irradiation of electromagnetic waves or cooling serves as the application of an external force that causes the support member to shrink.

[0063] As another modification, a holding table for holding the workpiece (such as holding table 40 used in the burr removal step shown in FIG. 7) may be provided with a suction structure capable of sucking and drawing in the support member in the area corresponding to the division groove. The suction structure can partially draw the support member toward the holding table to cause it to shrink, thereby narrowing the width of the division groove. Also, the width of the division groove can be restored by releasing the suction of the support member by the suction structure of the holding table. That is, in this modification, the application of a suction force to the support member serves as the application of an external force for shrinking the support member.

[0064] In the above embodiment, the dividing groove 13 is formed in the workpiece 10 using the cutting blade 24, but the method of forming the dividing groove in the workpiece is not limited to this. For example, the dividing groove may be formed in the workpiece by laser processing or water jet processing. In other words, any processing method that may cause burrs along the edge of the dividing groove when it is formed can be widely applied.

[0065] In the above embodiment, the dividing groove 13 is formed and the burrs 15 are removed from a workpiece unit having a frame 12 attached to the peripheral portion of a support member 11 that supports the workpiece 10. However, processing may also be performed on a workpiece unit that does not have a frame 12 and is composed only of the workpiece 10 and the support member 11.

[0066] The embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological progress or a derived technology, the present invention may be implemented using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0067] As described above, the method for processing a workpiece of the present invention can remove burrs without damaging the support member when high-pressure water is sprayed along the dividing groove, and is highly useful in technical fields where a workpiece is divided to produce multiple chips, etc. [Explanation of symbols]

[0068] 10: Workpiece 101: One side of the workpiece 102: Other side of the workpiece 11: Support member 12: Frame 13:Dividing groove 14: Tip 15: Bali 20: Holding table 21:Cutting section 22: Spindle 23: Mount 24: Cutting blade 30: Holding table 31: Heater 35: Holding table 36: Protective sheet 37: Heating member 38: Imaging unit 40: Holding table 41: High pressure water jet nozzle 42: High pressure water supply source 43: Imaging unit W: High pressure water

Claims

1. A preparation step of preparing a workpiece having a support member fixed to one surface thereof and a division groove formed along a planned division line; a contraction step of applying an external force to at least a region of the support member corresponding to the dividing groove to cause the support member to contract and narrow the width of the dividing groove; a burr removing step of removing burrs by spraying high-pressure water along the dividing groove from the other surface after the shrinking step; A method for processing a workpiece comprising:

2. 2. The method for processing a workpiece according to claim 1, wherein the contracting step comprises heating the support member.

Images