Component supply device and component supply method

Abstract

To provide a component supply device and the like capable of preventing productivity decline.SOLUTION: A component supply device 100 includes: a tray supply unit 110 that supplies a tray 300, on which a component and a sheet of separation paper 310 covering component are placed; a paper pickup unit 130 that picks up the separation paper 310 from the tray 300 supplied by the tray supply unit 110; and a tray conveyor unit 180 that receives the tray 300 with the separation paper 310 placed thereon from the tray supply unit 110 and conveys the tray 300 to a position where the paper pickup unit 130 picks up the separation paper 310 from the tray 300, and that conveys the tray 300 from which the separation paper 310 has been picked up, to a position where a component pickup part 190 that supplies the component to a component mounting unit 200 picks up the component placed on the tray 300.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a component supplying device and a component supplying method for supplying components to a component mounting device that mounts components on a board. [Background technology]

[0002] Conventionally, there is a component supplying device for supplying components to a component mounting device that mounts components on a board (see, for example, Patent Document 1). Patent Document 1 discloses a component supplying device that supplies a plurality of components stored in a tray to a component mounting section. The component supplying device disclosed in Patent Document 1 includes a tray storage section that stores trays, and a tray transport section that transports the tray stored in the tray storage section to a component supplying position where components are supplied to the component mounting section. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-119390 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the tray storage unit disclosed in Patent Document 1, multiple trays are stacked and arranged. Here, on the trays arranged in the tray storage unit, separation paper is placed so as to cover the components placed on the trays and prevent contact between the components and other trays.

[0005] Conventionally, the separation paper placed on the tray is removed by an operator. However, such a method requires an operator to remove the separation paper, which increases labor costs, and may lead to operational mistakes such as turning over the tray, making the components unusable. In other words, such a method may increase the cost of supplying components to the component mounting device, which may reduce the productivity of the component mounting system that includes the component supply device and the component mounting device and produces boards on which components are mounted.

[0006] The present invention provides a component supplying device and the like that can suppress a decrease in productivity. [Means for solving the problem]

[0007] A component supplying device according to one embodiment of the present invention includes a tray supplying unit that supplies a tray on which components and separation paper covering the components are placed, a paper pickup unit that picks up the separation paper on the tray supplied from the tray supplying unit, and a tray transporting unit that receives the tray on which the separation paper is placed from the tray supplying unit, transports the tray to a position where the paper pickup unit picks up the separation paper on the tray, and transports the tray on which the separation paper has been picked up to a position where a component pickup unit that supplies the components to a component mounting device picks up the components placed on the tray.

[0008] A component supply method according to one embodiment of the present invention is a component supply method executed by a component supplying device including a tray supplying unit, a paper pickup unit, and a tray transporting unit, in which the tray supplying unit supplies a tray on which components and separation paper covering the components are placed to the tray transporting unit, the tray transporting unit transports the tray to a position where the paper pickup unit picks up the separation paper on the tray, the paper pickup unit picks up the separation paper on the tray, and the tray transporting unit transports the tray on which the separation paper has been picked up to a position where a component pickup unit that supplies the components to a component mounting device picks up the components placed on the tray. Effect of the Invention

[0009] According to the present invention, it is possible to provide a component supplying device and the like that can suppress a decrease in productivity. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a top view showing a component mounting system according to an embodiment. [Diagram 2] FIG. 2 is a perspective view showing a component supplying device according to an embodiment. [Diagram 3] FIG. 3 is a block diagram illustrating a functional configuration of the component supplying device according to the embodiment. [Figure 4] FIG. 4 is a side view showing a specific configuration of the paper pickup unit according to the embodiment. [Diagram 5] FIG. 5 is a top view for explaining the positional relationship of each device included in the component supplying device according to the embodiment. [Figure 6] FIG. 6 is a diagram illustrating a first example of a processing procedure of the component supplying device according to the embodiment. [Figure 7] FIG. 7 is a diagram illustrating a second example of a processing procedure of the component supplying device according to the embodiment. [Figure 8] FIG. 8 is a flowchart showing a processing procedure of the component supplying device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims will be described as optional components.

[0012] In addition, each drawing is a schematic diagram and is not necessarily a precise illustration. In addition, in each drawing, the same components are denoted by the same reference numerals.

[0013] In addition, in this specification, ordinal numbers such as "first" and "second" do not refer to the number or order of components, unless otherwise specified, but are used for the purpose of avoiding confusion and distinguishing between components of the same type.

[0014] In this specification, the vertical direction is referred to as the Z-axis direction or up-down direction, one direction on a plane perpendicular to the vertical direction is referred to as the Y-axis direction or depth direction, and a direction perpendicular to the Y-axis direction on the perpendicular plane is referred to as the X-axis direction, left-right direction, or lateral direction. In this specification, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this specification, the positive side of the Y-axis direction is the back side or back, and the negative side of the Y-axis direction is the front side or front. In this specification, the positive side of the X-axis direction is the right side or right, and the negative side of the X-axis direction is the left side or left.

[0015] (Embodiment) [composition] First, the configuration of the component supply device according to the embodiment will be described.

[0016] Fig. 1 is a top view showing a component mounting system 10 according to an embodiment. Fig. 2 is a perspective view showing a component supplying device 100 according to an embodiment. Fig. 3 is a block diagram showing a functional configuration of the component supplying device 100 according to an embodiment. Note that in Figs. 1 and 2, illustration of a computer for controlling each device provided in the component mounting system 10, such as a control device 170, is omitted.

[0017] The component mounting system 10 is a system that mounts components on a board 400 to produce a mounted board on which components are mounted.

[0018] An example of the substrate 400 is a film-like flexible substrate made of resin, etc. The substrate 400 may be a rigid substrate such as a glass substrate.

[0019] Examples of components that can be attached to the substrate 400 via ACF pieces include electronic components such as ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

[0020] The component mounting system 10 includes a component mounting apparatus 200 and a component supplying apparatus 100. In addition, for example, the component mounting system 10 includes an ACF (Anisotropic Conductive Film) bonding apparatus (not shown) located upstream of the component mounting apparatus 200, and a main pressure bonding apparatus (not shown) located downstream of the component mounting apparatus 200.

[0021] The ACF attachment device is a device that receives the substrate 400 carried in from the loader and attaches ACF, which is an adhesive material, to the electrode portion of the substrate 400. The ACF attachment device is realized by, for example, a transport mechanism that transports the substrate 400 and an attachment mechanism that attaches ACF to the substrate 400.

[0022] The component mounting apparatus 200 is a mounting apparatus that mounts components on the board 400. Specifically, the component mounting apparatus 200 provisionally pressure-bonds the components to the board 400. More specifically, the component mounting apparatus 200 provisionally pressure-bonds the components supplied from the component supplying apparatus 100 to the portions of the board 400 carried in from the ACF attachment apparatus to which the ACF is attached.

[0023] The component mounting apparatus 200 includes a component placement stage 220 , a component mounting section 230 , a substrate stage 240 , and a substrate transport section 250 .

[0024] The component placement stage 220 is a stage on which the components picked up by the component pickup unit 190 and supplied from the component supply device 100 are placed. Specifically, the components placed on the tray 300 and picked up by the component pickup unit 190 are placed on the component placement stage 220.

[0025] The component mounting section 230 is a device that picks up a component placed on the component placement stage 220 and mounts (more specifically, temporarily presses) the picked-up component onto the substrate 400 placed on the substrate stage 240.

[0026] The component mounting section 230 is realized by, for example, a pick-up head for picking up a component and mounting it on the substrate 400, a camera for determining the placement position of the component on the substrate 400, and a backup stage for supporting the end of the substrate 400 from below. The method of holding the component by the pick-up head is not particularly limited, but in the case of this embodiment, a method of holding the component by vacuum suction is adopted as the method of the pick-up head picking up the component. Also, for example, the pick-up head is arranged on a head transfer mechanism constituted by a combination of a linear guide and a linear motor, and is movable.

[0027] The substrate stage 240 is a stage on which the substrate 400 carried in by the substrate transport unit 250 is placed.

[0028] The substrate transport unit 250 is a device that transports the substrate 400 from the ACF attachment device to the substrate stage 240 and transports the substrate 400 on which components are mounted to the main pressure bonding device. The substrate transport unit 250 is realized, for example, by a suction nozzle that suctions and holds the substrate 400, and a suction nozzle transfer mechanism that moves the suction nozzle. Note that the method of holding the substrate 400 by the suction nozzle is not particularly limited, but in this embodiment, a method of holding the substrate by vacuum suction is adopted as a method of holding the substrate 400 by the suction nozzle. Also, for example, the suction nozzle transfer mechanism is configured by a combination of a linear guide and a linear motor.

[0029] The final bonding apparatus is an apparatus that performs a final bonding operation of final bonding (i.e., thermocompression bonding) to the board of components that have been provisionally bonded to the board by the component mounting apparatus 200. In this way, the electrode parts formed on the board and the components are electrically connected via the ACF. In other words, the components are mounted on the board by this final bonding, thereby producing a mounted board.

[0030] Each device included in the component mounting system 10, such as the component mounting device 200, the ACF attachment device, and the full-pressure bonding device, is controlled by a computer. The computer is realized by, for example, a communication interface for communicating with these devices, a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, and a processor for executing the program. The communication interface may be a connector to which a communication line is connected for performing wired communication, or a wireless communication circuit for performing wireless communication. The computer may be realized by one computer together with the control device 170 included in the component supply device 100, or may be realized by a computer separate from the control device 170.

[0031] The component supplying device 100 is a device for supplying components to the component mounting device 200. Specifically, the component supplying device 100 supplies components to the component mounting device 200 by placing the components on a component placement stage 220 by a component pickup unit 190. One or more components are placed on a tray 300, and the one or more components are picked up in sequence by the component pickup unit 190. Note that the type and number of components placed on the tray 300 are not particularly limited.

[0032] The component supplying device 100 includes a tray supplying unit 110, a sensor unit 120, a paper pickup unit 130, a tray transport unit 180, a component pickup unit 190, a collection unit 160, and a control device 170.

[0033] The tray supply unit 110 is a device that supplies trays 300 on which components and separation paper 310 covering the components are placed. In the present embodiment, the tray supply unit 110 supplies the trays 300 to the tray transport unit 180. Specifically, the tray supply unit 110 supplies the trays 300 by placing the trays 300 on a tray stage 150 included in the tray transport unit 180.

[0034] Moreover, the tray 300 from which the parts have been picked up and which has become empty is returned to the tray supply unit 110.

[0035] The tray supply unit 110 is realized by a storage (tray stocker) that stores the trays 300. In the storage, for example, a plurality of trays 300, each having a separation sheet 310 placed thereon, are arranged in a stacked state. The lower part of the storage is a door that can be opened and closed. The trays 300 are delivered by opening and closing the door.

[0036] The mechanism for transferring the tray 300 between the tray supply unit 110 and the tray stage 150 may be provided by the tray supply unit 110 or by the tray transport unit 180 .

[0037] The sensor unit 120 is a sensor for detecting the presence or absence of separation paper 310 on the tray 300. In the present embodiment, the sensor unit 120 is a camera that captures an image of the tray 300 from above. The type of sensor employed as the sensor unit 120 is not particularly limited as long as it can detect the presence or absence of separation paper 310 on the tray 300, and may be realized by a sensor that emits light and detects reflected light of the light from an object.

[0038] In the following description, it is assumed that the sensor unit 120 is a camera.

[0039] The paper pickup unit 130 is a device that picks up the separation paper 310 on the tray 300 supplied from the tray supply unit 110 .

[0040] FIG. 4 is a side view showing a specific configuration of the paper pickup unit 130 according to the embodiment.

[0041] The paper pickup unit 130 includes, for example, one or more suction nozzles 131, a support 132, and a lifting mechanism 133.

[0042] The suction nozzle 131 is a nozzle that suctions and holds the separation paper 310. The paper pickup unit 130, for example, picks up the separation paper 310 on the tray 300 by suctioning from the suction nozzle 131 while the suction nozzle 131 is separated from the separation paper 310. In this embodiment, a method of holding the substrate by vacuum suction is adopted as a method for the suction nozzle 131 to hold the separation paper 310. Note that the method of holding the separation paper 310 by the suction nozzle 131 is not particularly limited. Suction by the suction nozzle 131 may be started with the suction nozzle 131 in contact with the separation paper 310.

[0043] Furthermore, in this embodiment, the paper pickup unit 130 is provided with suction nozzles 131 so as to be able to suck each of the four corners of the rectangular separation paper 310. The number of suction nozzles 131 provided in the paper pickup unit 130 may be one, or may be two or more, and is not particularly limited.

[0044] The support 132 is a support that supports one or more suction nozzles. The support 132 supports the one or more suction nozzles 131 so that the heights of the lower surfaces of the one or more suction nozzles 131 (i.e., the positions at which the separation paper 310 is sucked) are the same.

[0045] The lifting mechanism 133 is a device that lifts and lowers one or more suction nozzles 131 by lifting and lowering the support 132. For example, the lifting mechanism 133 is realized by an air cylinder for moving the nozzles up and down, and an air supply source and a valve for driving the air cylinder.

[0046] The configuration for moving the suction nozzle 131 is not particularly limited, and may be realized by a motor or the like.

[0047] The tray transport section 180 is a device that transports the tray 300. The tray transport section 180 includes a transport section 140 and a tray stage 150.

[0048] The transport unit 140 is a transport mechanism for transporting the tray 300 placed on the tray stage 150 by moving the tray stage 150. In the present embodiment, the transport unit 140 moves the tray stage 150 in the X-axis direction and the Y-axis direction. The transport unit 140 is realized by, for example, a linear guide and a linear motor.

[0049] The tray stage 150 is a stage on which the tray 300 is placed. In the present embodiment, two trays 300 can be arranged on the tray stage 150 so as to be aligned in the X-axis direction. The number of trays arranged on the tray stage 150 may be one or more, and is not particularly limited.

[0050] For example, the tray transport section 180 receives the tray 300 on which the separation paper 310 is placed from the tray supply section 110, and transports the tray 300 to a position where the paper pickup section 130 picks up the separation paper 310 on the tray 300. In this embodiment, the tray transport section 180 moves the tray stage 150 below the tray supply section 110, and receives the tray 300 on which the separation paper 310 is placed from the tray supply section 110. Also, for example, the transport section 140 transports the tray 300 on which the separation paper 310 is picked up to a position where the component pickup section 190, which supplies components to the component mounting device 200, picks up the components placed on the tray 300. In this way, the component supplying device 100 supplies components to the component mounting device 200. Furthermore, when the components have been picked up and the tray 300 is empty, the tray transport section 180 moves the tray stage 150 to below the tray supply section 110 and returns the tray 300 to the tray supply section 110.

[0051] FIG. 5 is a top view for explaining the positional relationship of each device included in the component supplying device 100 according to the embodiment. FIG. 5 shows the positional relationship between the tray supplying unit 110, the sensor unit 120, and the paper pickup unit 130, and the tray stage 150 and the recovery unit 160. The conveying unit 140 moves the tray stage 150 and the recovery unit 160 to any of the positions shown in (a) to (h) of FIG. 5 according to the operation performed by the component supplying device 100. Note that the tray stage 150 and the recovery unit 160 move below the tray supplying unit 110, the sensor unit 120, and the paper pickup unit 130, but in FIG. 5, they are shown shifted in the Y-axis direction for the sake of explanation. In FIG. 5, the two trays placed on the tray stage 150 are distinguished and labeled as tray 301 and tray 302. In FIG. 5, the separation paper 310 on the trays 301 and 302 is omitted from illustration.

[0052] For example, the tray supply unit 110, the sensor unit 120, and the paper pickup unit 130 cannot move in the X-axis direction or the Y-axis direction. Therefore, the transport unit 140 moves the tray stage 150 so that the tray supply unit 110 can transfer the trays 301, 302 between the tray stage 150 and the tray stage 150, the sensor unit 120 can capture images of the trays 301, 302 placed on the tray stage 150, and the paper pickup unit 130 can pick up the separation paper 310 on the trays 301, 302 placed on the tray stage 150.

[0053] The position of the tray stage 150 shown in FIG. 5(a) is the position when the tray supply unit 110 transfers the trays 301 and 302 between the tray stage 150 and the tray supply unit 110.

[0054] The position of the tray stage 150 shown in FIG. 5(b) is the position when the components placed on the tray 302 are picked up by the component pickup unit 190.

[0055] The position of the tray stage 150 shown in FIG. 5(c) is the position when the components placed on the tray 301 are picked up by the component pickup unit 190.

[0056] The position of the tray stage 150 shown in FIG. 5( d ) is the position when the tray 302 is imaged by the sensor unit 120 to detect the presence or absence of the separation paper 310 on the tray 302 .

[0057] The position of the tray stage 150 shown in FIG. 5(e) is the position when the tray 301 is imaged by the sensor unit 120 to detect the presence or absence of the separation paper 310 on the tray 301.

[0058] The position of the tray stage 150 shown in FIG. 5( f ) is the position when the separation paper 310 on the tray 302 is picked up by the paper pickup unit 130 .

[0059] The position of the tray stage 150 shown in FIG. 5(g) is the position when the separation paper 310 on the tray 301 is picked up by the paper pickup unit 130.

[0060] The position of the collection section 160 shown in FIG. 5(h) is the position at which the paper pickup section 130 holds the separation paper 310 and discards the separation paper 310 into the collection section 160.

[0061] Here, for example, when separation paper 310 is placed on tray 300, tray transport section 180 transports tray 300 at a first speed, and when separation paper 310 is not placed on tray 300, tray transport section 180 transports tray 300 at a second speed faster than the first speed. Specifically, when separation paper 310 is placed on tray 300, tray transport section 180 moves tray stage 150 at a first speed, and when separation paper 310 is not placed on tray 300, tray transport section 180 moves tray stage 150 at a second speed faster than the first speed. Note that the first speed and the second speed are not particularly limited as long as the second speed is faster than the first speed.

[0062] The collection section 160 is a mechanism that collects the separation paper 310 picked up by the paper pickup section 130. In this embodiment, the collection section 160 is a box body that is open at the top. The separation paper 310 picked up by the paper pickup section 130 is discarded in the collection section 160 so as to be stored in the collection section 160. The collection section 160 is also disposed in the transport section 140, and is movable by the transport section 140. In this embodiment, the collection section 160 is disposed alongside the tray stage 150 in the X-axis direction (specifically, it is disposed on the X-axis positive side of the tray stage), and is moved in the X-axis direction together with the tray stage 150.

[0063] The recovery unit 160 may be realized by a slope for receiving the separated paper 310 picked up by the paper pickup unit 130 from the paper pickup unit 130, and a box connected to the slope for receiving the separated paper 310 that has flowed down the slope. In this case, for example, the slope is moved by the transport unit 140, and the box is fixedly disposed at a specific location.

[0064] The component pickup unit 190 is a mechanism that picks up components placed on a tray 300 supplied from the component supply device 100 and places the components on the component placement stage 220. The component pickup unit 190 is realized, for example, by a pickup head that picks up the components and a movement mechanism that moves the pickup head. The movement mechanism is realized, for example, by a linear guide and a linear motor.

[0065] The method by which component pickup unit 190 holds components is not particularly limited, but in the case of this embodiment, a method in which component pickup unit 190 holds components by vacuum suction is adopted as the method by which component pickup unit 190 picks up components.

[0066] The control device 170 is a computer that controls each device included in the component supply device 100. Specifically, the control device 170 controls the tray supply unit 110, the sensor unit 120, the paper pickup unit 130, the tray transport unit 180, and the component pickup unit 190 to cause these devices to perform various operations. The control device 170 is realized by, for example, a communication interface for communicating with these devices, a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, and a processor for executing the program. The communication interface may be a connector to which a communication line is connected to perform wired communication, or a wireless communication circuit for performing wireless communication.

[0067] The control device 170 includes a detection unit 171, a control unit 172, and a storage unit 173.

[0068] The detection unit 171 is a processing unit that detects the presence or absence of the separation paper 310 on the tray 300 based on the detection result of the sensor unit 120. For example, the detection unit 171 determines whether or not the separation paper 310 is present on the tray 300 based on an image captured by the sensor unit 120.

[0069] The control unit 172 is a processing unit that controls the operation and operation timing of each device included in the component supplying device 100, such as the tray supplying unit 110, the sensor unit 120, the paper pickup unit 130, the tray transport unit 180, and the component pickup unit 190.

[0070] Processing units such as the detection unit 171 and the control unit 172 are realized by, for example, a processor, a memory, and a control program stored in the memory or the like and executed by the processor.

[0071] The storage unit 173 is a storage device that stores various data indicating the size and shape of the tray 300 and the separation paper 310, the operation of each device, the timing of the operation, etc., the control program executed by the processing unit, and information for the detection unit 171 to detect the separation paper 310. The storage unit 173 is realized by, for example, a flash memory, a HDD (Hard Disk Drive), etc.

[0072] [Processing Procedure] Next, a processing procedure of the component supplying device 100 according to the embodiment will be described in detail.

[0073] Fig. 6 is a diagram showing a first example of a processing procedure of the component supplying device 100 according to the embodiment. Fig. 7 is a diagram showing a second example of a processing procedure of the component supplying device 100 according to the embodiment.

[0074] In addition, in Fig. 6 and Fig. 7, the position of the tray stage 150 is indicated by a circle. The tray supply position shown in Fig. 6 and Fig. 7 is the position of the tray stage 150 shown in Fig. 5(a). The second component pickup position shown in Fig. 6 and Fig. 7 is the position of the tray stage 150 shown in Fig. 5(b). The first component pickup position shown in Fig. 6 and Fig. 7 is the position of the tray stage 150 shown in Fig. 5(c). The paper recovery position shown in Fig. 6 and Fig. 7 is the position of the recovery section 160 shown in Fig. 5(h). The second camera position shown in Fig. 6 and Fig. 7 is the position of the tray stage 150 shown in Fig. 5(d). The first camera position shown in Fig. 6 and Fig. 7 is the position of the tray stage 150 shown in Fig. 5(e). The second paper pickup position shown in Fig. 6 and Fig. 7 is the position of the tray stage 150 shown in Fig. 5(f). 6 and 7 is the position of the tray stage 150 shown in FIG. 5(g).

[0075] 6 and 7, the first tray is tray 301, and the second tray is tray 302, for example.

[0076] An empty tray is a tray 301 or 302 on which all components have been picked up and no components are placed.

[0077] 6 and 7, the state in which separation paper 310 is placed on trays 301 and 302 is indicated as "present" in the "paper presence / absence" item, and the state in which separation paper 310 is not placed on trays 301 and 302 is indicated as "absent" in the "paper presence / absence" item. In addition, in FIGS. 6 and 7, separation paper 310 is simply referred to as paper.

[0078] <Example 1> First, a first example of a processing procedure of the component supplying device 100 will be described.

[0079] 6, first, the transport section 140 moves the tray stage 150 to the tray supply position. Here, the tray stage 150 receives the first tray and the second tray from the tray supply section 110 (S101).

[0080] Next, the transport unit 140 moves the tray stage 150 to the second camera position (S102).

[0081] Next, the sensor unit 120 captures an image of the second tray, and the detection unit 171 determines (confirms) the presence or absence of the separation paper 310 on the second tray based on the image capture result of the sensor unit 120 (S103). If the separation paper 310 is not detected here, the process proceeds to step S108.

[0082] If the separate sheet 310 is detected, the transport section 140 moves the tray stage 150 to the second sheet pickup position (S104).

[0083] Next, the paper pickup unit 130 picks up the separation paper 310 on the second tray (S105).

[0084] Next, the transport unit 140 moves the tray stage 150 to the paper recovery position, thereby moving the recovery unit 160 to below the paper pickup unit 130 (S106).

[0085] Next, the paper pickup unit 130 discards the separation paper 310 picked up by the collection unit 160 (S107).

[0086] Next, the transport unit 140 moves the tray stage 150 to the first camera position (S108).

[0087] Next, the sensor unit 120 captures an image of the first tray, and the detection unit 171 determines (confirms) the presence or absence of the separation paper 310 on the first tray based on the image capture result of the sensor unit 120 (S109). If the separation paper 310 is not detected here, the process proceeds to step S114.

[0088] If the separation sheet 310 is detected, the transport section 140 moves the tray stage 150 to the first sheet pickup position (S110).

[0089] Next, the paper pickup unit 130 picks up the separation paper 310 on the first tray (S111).

[0090] Next, the transport section 140 moves the recovery section 160 to the paper recovery position (below the paper pickup section 130 in this embodiment) (S112).

[0091] Next, the paper pickup unit 130 discards the separation paper 310 picked up by the collection unit 160 (S113).

[0092] Next, the transport section 140 moves the tray stage 150 to the second component pick-up position (S114).

[0093] Next, the component pickup unit 190 picks up the components placed on the second tray (S115). The picked up components are placed on the component placement stage 220. The components placed on the component placement stage 220 are picked up by the component mounting device 200 and placed on the board 400. By repeating this process, one or more components placed on the second tray are sequentially placed on the board 400.

[0094] Here, when the second tray becomes an empty tray, the transport section 140 moves the tray stage 150 to the first component pick-up position (S116).

[0095] Next, the component pickup unit 190 picks up the components placed on the first tray (S117). The picked up components are placed on the component placement stage 220. The components placed on the component placement stage 220 are picked up by the component mounting device 200 and placed on the board 400. By repeating this process, one or more components placed on the first tray are sequentially placed on the board 400.

[0096] Here, when the first tray becomes an empty tray, the transport section 140 moves the tray stage 150 to the tray supply position (S118).

[0097] Next, the tray stage 150 returns the empty first and second trays to the tray supply section 110 (S119).

[0098] For example, steps S101 to S119 are repeatedly performed, whereby components are repeatedly supplied to component mounting apparatus 200.

[0099] Here, in steps S102 to S110, separation paper 310 is placed on at least one of the first tray and the second tray placed on the tray stage 150. Therefore, in steps S102 to S110, the transport section 140 moves the tray stage 150 at a first speed, that is, relatively slowly.

[0100] On the other hand, in steps S112 to S118, no separation paper 310 is placed on either the first tray or the second tray placed on the tray stage 150. Therefore, in steps S112 to S118, the transport section 140 moves the tray stage 150 at the second speed, that is, relatively quickly.

[0101] The order of steps S102 to S107 and steps S108 to S113 may be reversed from that described above.

[0102] Furthermore, the order in which steps S114 and S115, and steps S116 and S117 are executed may be reversed from that described above.

[0103] <Second Example> Next, a second example of the processing procedure of the component supplying device 100 will be described. In the first example, when both the first tray and the second tray become empty, the transport unit 140 returns both the first tray and the second tray together and receives new first tray and second tray. Here, when the component mounting device 200 finishes placing components on a certain board 400, the board 400 is carried out downstream and a new board 400 on which no components are mounted is carried in. When the board 400 is being transported, components cannot be placed on the board 400. Therefore, in the second example, the tray transport unit 180 returns the empty tray and receives a new tray while the board 400 is being transported.

[0104] In the second example, first, steps S110 to S117 shown in Fig. 6 are executed in the same manner as in the first example. That is, the second tray is an empty tray, and the parts placed on the first tray are picked up sequentially by the part pickup unit 190.

[0105] Here, for example, it is assumed that the placement of components on the board 400 is completed, and the board 400 is removed from the component mounting apparatus 200, and a new board 400 is carried in. In this case, whether the first tray is an empty tray or not, the second tray recovery operation is performed. Specifically, as shown in FIG. 7, the transport unit 140 moves the tray stage 150 to the tray supply position (S201). Next, the tray stage 150 returns the second tray, which has become an empty tray, to the tray supply unit 110 (S202).

[0106] Here, for example, when the loading of a new board 400 into the component mounting apparatus 200 is completed, the transport section 140 moves the tray stage 150 to the first component pick-up position even if a new second tray has not been received (S203).

[0107] Next, the component pickup unit 190 picks up the components placed on the first tray (S204).

[0108] Here, for example, it is assumed that the placement of components on the board 400 is completed, and the board 400 is removed and a new board 400 is loaded again in the component mounting apparatus 200. In this case, the transport unit 140 moves the tray stage 150 to the tray supply position (S205). In addition, the tray stage 150 receives a new second tray from the tray supply unit 110 (S206).

[0109] Here, for example, when the loading of a new board 400 is completed again in the component mounting device 200, the transport section 140 moves the tray stage 150 to the first component pickup position (S207) even if the pickup of the separation paper 310 on the new second tray has not been completed.

[0110] Next, the component pickup unit 190 picks up the components placed on the first tray (S208).

[0111] Here, for example, it is assumed that the placement of components on the board 400 is completed, and the board 400 is carried out again in the component mounting device 200 to carry out the removal of the board 400 and carry in a new board 400. In this case, the transport unit 140 performs an operation of collecting the separation paper 310 on the second tray (paper collection operation) (S209). Specifically, steps S209a to S209f are performed similarly to steps S102 to S107. First, the transport unit 140 moves the tray stage 150 to the second camera position (S209a), and then the sensor unit 120 captures an image of the second tray, and the detection unit 171 determines (confirms) the presence or absence of the separation paper 310 on the second tray based on the image capture result of the sensor unit 120 (S209b). If the separation paper 310 is not detected here, the process proceeds to step S210. If the separation paper 310 is detected, the transport unit 140 moves the tray stage 150 to the second paper pickup position (S209c), and the paper pickup unit 130 picks up the separation paper 310 on the second tray (S209d). Next, the transport unit 140 moves the collection unit 160 to the paper collection position (S209e), and the paper pickup unit 130 discards the separation paper 310 picked up by the collection unit 160 (S209f).

[0112] By the above-described processing, in the second example, at the timing when the substrate 400 is transported by the component mounting device 200, the second tray is supplied from the tray supply section 110 to the tray transport section 180, and the process of discarding the separation paper 310 on the supplied tray 300 is appropriately performed, thereby preparing the component pickup section 190 to pick up the components placed on the second tray.

[0113] Next, the transport section 140 moves the tray stage 150 to the first component pick-up position (S210).

[0114] Next, the component pickup unit 190 picks up the components placed on the first tray (S211). The picked up components are placed on the component placement stage 220. The components placed on the component placement stage 220 are picked up by the component mounting apparatus 200 and placed on the board 400.

[0115] Here, when the first tray becomes an empty tray, the transport section 140 moves the tray stage 150 to the second component pick-up position (S212).

[0116] Next, the component pickup unit 190 picks up the components placed on the second tray (S213). The picked up components are placed on the component placement stage 220. The components placed on the component placement stage 220 are picked up by the component mounting apparatus 200 and placed on the board 400.

[0117] Here, for example, it is assumed that the placement of components on the board 400 is completed, and the board 400 is removed and a new board 400 is loaded again in the component mounting apparatus 200. In this case, the transport unit 140 moves the tray stage 150 to the tray supply position (S214). Next, the tray stage 150 returns the first tray, which has become an empty tray, to the tray supply unit 110 (S215).

[0118] Here, for example, when the loading of a new board 400 into the component mounting apparatus 200 is completed, the transport section 140 moves the tray stage 150 to the second component pick-up position even if a new first tray has not been received (S216).

[0119] Next, the component pickup unit 190 picks up the components placed on the second tray (S217).

[0120] Here, for example, it is assumed that the placement of components on the board 400 is completed, and the board 400 is removed and a new board 400 is loaded again in the component mounting apparatus 200. In this case, the transport unit 140 moves the tray stage 150 to the tray supply position (S218). In addition, the tray stage 150 receives a new first tray from the tray supply unit 110 (S219).

[0121] Here, for example, when the loading of a new board 400 is completed again in the component mounting device 200, the transport section 140 moves the tray stage 150 to the second component pickup position (S220) even if the pickup of the separation paper 310 on the new first tray has not been completed.

[0122] Next, the component pickup unit 190 picks up the components placed on the second tray (S221).

[0123] Here, for example, it is assumed that the placement of components on the board 400 is completed, and the board 400 is carried out again in the component mounting device 200 to carry out the removal of the board 400 and to carry in a new board 400. In this case, the transport unit 140 performs an operation of collecting the separation paper 310 on the first tray (paper collection operation) (S222). Specifically, steps S222a to S222f are performed similarly to steps S108 to S113. First, the transport unit 140 moves the tray stage 150 to the first camera position (S222a), and then the sensor unit 120 captures an image of the first tray, and the detection unit 171 determines (confirms) the presence or absence of the separation paper 310 on the first tray based on the image capture result of the sensor unit 120 (S222b). If the separation paper 310 is not detected here, the process proceeds to step S114. If the separation paper 310 is detected, the transport unit 140 moves the tray stage 150 to the first paper pickup position (S222c), and the paper pickup unit 130 picks up the separation paper 310 on the first tray (S222d). Next, the transport unit 140 moves the collection unit 160 to the paper collection position (S222e), and the paper pickup unit 130 discards the separation paper 310 picked up by the collection unit 160 (S222f).

[0124] Thereafter, for example, steps S114 to S222 are repeatedly performed, whereby components are repeatedly supplied to the component mounting apparatus 200.

[0125] Here, in steps S206 to S209c and steps S219 to S222c, separation paper 310 is placed on at least one of the first tray and the second tray placed on the tray stage 150. Therefore, in these steps, the transport unit 140 moves the tray stage 150 at a first speed, that is, relatively slowly.

[0126] On the other hand, in steps S201 to S205, steps S209e to S218, and steps S222d to S222f, no separation paper 310 is placed on either the first tray or the second tray placed on the tray stage 150. Therefore, in these steps, the transport unit 140 moves the tray stage 150 at the second speed, that is, relatively quickly.

[0127] <Summary> FIG. 8 is a flowchart showing a processing procedure of the component supplying device 100 according to the embodiment.

[0128] First, the tray supply unit 110 supplies the tray 300 on which the components and the separation paper 310 covering the components are placed to the tray transport unit 180 (S10). Specifically, the tray supply unit 110 places the tray 300 on the tray stage 150, and the tray transport unit 180 receives the tray 300 from the tray supply unit 110.

[0129] Next, the tray transport section 180 transports the tray 300 to a position where the paper pickup section 130 picks up the separation paper 310 on the tray 300 (S20).

[0130] Next, the paper pickup unit 130 picks up the separation paper 310 on the tray 300 (S30).

[0131] Next, the tray transport section 180 transports the tray 300 on which the separation paper 310 has been picked up to a position (component pick-up position) where the component pick-up section 190 picks up the components placed on the tray 300 (S40).

[0132] The components placed on the tray 300 transported to the component pickup position are sequentially picked up by the component pickup unit 190. When the tray 300 is empty of components, it is transported, for example, by the tray transport unit 180 to the tray supply unit 110 and collected by the tray supply unit 110.

[0133] These operations are performed, for example, by the control unit 172 controlling each device.

[0134] (Effects, etc.) Below, examples of technologies that can be obtained from the disclosure of this specification will be given, and effects and the like that can be obtained from the exemplified technologies will be described.

[0135] Technology 1 is a component supplying device 100 including a tray supplying unit 110 that supplies trays 300 on which components and separation paper 310 covering the components are placed, a paper pickup unit 130 that picks up the separation paper 310 on the tray 300 supplied from the tray supplying unit 110, and a tray transporting unit 180 that receives the trays 300 on which the separation paper 310 is placed from the tray supplying unit 110, transports the trays 300 to a position where the paper pickup unit 130 picks up the separation paper 310 on the tray 300, and transports the trays 300 on which the separation paper 310 has been picked up to a position where a component pickup unit 190 that supplies components to a component mounting device 200 picks up the components placed on the tray 300.

[0136] Conventionally, the separation paper 310 placed on the tray 300 is removed by an operator. However, such a method may result in high labor costs or an operational error such as turning over the tray 300, which may make it impossible to use the components. Therefore, the component supplying device 100 removes the separation paper 310 on the tray 300 by picking up the separation paper 310 on the tray 300 with the paper pickup unit 130. In other words, the component supplying device 100 can automatically remove the separation paper 310 on the tray 300. As a result, the component supplying device 100 can reduce the labor costs of the operator who removes the separation paper 310 and reduce the loss of components due to the operator's operational error. Therefore, the cost of supplying components to the component mounting device 200 can be reduced, and the decrease in productivity in the component mounting system 10 can be suppressed.

[0137] Technology 2 is the component supply device 100 described in Technology 1, in which the paper pickup unit 130 is equipped with a suction nozzle 131 and picks up the separation paper 310 on the tray 300 by performing suction from the suction nozzle 131 while the suction nozzle 131 is spaced away from the separation paper 310.

[0138] According to this, the paper pickup unit 130 (more specifically, the suction nozzle 131 provided in the paper pickup unit 130) can pick up the separation paper 310 by suction without coming into contact with the components placed on the tray 300. This prevents damage such as scratches caused by the paper pickup unit 130 to the components placed on the tray 300 when the separation paper 310 is picked up.

[0139] Technology 3 is the component supplying device 100 described in Technology 1 or 2, in which the tray transport section 180 transports the tray 300 at a first speed when separation paper 310 is placed on the tray 300, and transports the tray 300 at a second speed faster than the first speed when separation paper 310 is not placed on the tray 300.

[0140] That is, when separation paper 310 is placed on tray 300, tray stage 150 on which tray 300 is placed moves slowly, and when separation paper 310 is not placed on tray 300, tray stage 150 on which tray 300 is placed moves quickly. This makes it possible to prevent separation paper 310 from scattering while transporting tray 300 when separation paper 310 is placed on tray 300. Also, when separation paper 310 is not placed on tray 300, tray 300 can be transported quickly, thereby shortening the time required to transport tray 300.

[0141] A fourth aspect of the present invention is the component supplying device 100 according to any one of the first to third aspects, further comprising a recovery unit 160 that recovers the separation paper 310 picked up by the paper pickup unit .

[0142] This allows the separation paper 310 to be collected efficiently and collectively.

[0143] Technology 5 is a component supplying method performed by a component supplying device 100 including a tray supplying unit 110, a paper pickup unit 130, and a tray transporting unit 180, in which the tray supplying unit 110 supplies a tray 300 on which components and separation paper 310 covering the components are placed to the transporting unit 140, the tray transporting unit 180 transports the tray 300 to a position where the paper pickup unit 130 picks up the separation paper 310 on the tray 300, the paper pickup unit 130 picks up the separation paper 310 on the tray 300, and the tray transporting unit 180 transports the tray 300 on which the separation paper 310 has been picked up to a position where the component pickup unit 190, which supplies components to a component mounting device 200, picks up the components placed on the tray 300.

[0144] According to this, the same effects as those of the component supplying device 100 are achieved.

[0145] In addition, these comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or may be realized by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. For example, the present invention may be realized as a control device including a control unit 172 that causes the tray supply unit 110 to supply the tray 300 on which the components and the separation paper 310 covering the components are placed to the tray transport unit 180, causes the tray transport unit 180 to transport the tray 300 to a position where the paper pickup unit 130 picks up the separation paper 310 on the tray 300, causes the paper pickup unit 130 to pick up the separation paper 310 on the tray 300, and causes the tray transport unit 180 to transport the tray 300 on which the separation paper 310 is picked up to a position where the component pickup unit 190 that supplies components to the component mounting device 200 picks up the components placed on the tray 300. The present invention may also be realized as a control method for executing the above-mentioned processing procedure executed by the control unit 172. The present invention may also be realized as a program for causing a computer to execute the control method. For example, the present invention may also be realized as a computer-readable non-transitory recording medium storing the program.

[0146] (Other embodiments) Although the component supply device according to the present embodiment has been described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments.

[0147] For example, all or some of the components of the processing unit of the component supply device may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD or semiconductor memory.

[0148] Furthermore, the components of the processing unit of the component supplying device may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0149] The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or an LSI, but depending on the degree of integration, it may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA), which is programmed after the LSI is manufactured, can be used for the same purpose.

[0150] The present invention can be realized not only as a component supplying device, but also as a program including, as steps, processes performed by each component of the component supplying device, and a computer-readable recording medium such as a DVD (Digital Versatile Disc) on which the program is recorded. In other words, the above-mentioned comprehensive or specific aspects may be realized as a system, a device, an integrated circuit, a computer program, or a computer-readable non-transitory recording medium, or as any combination of the system, the device, the integrated circuit, the computer program, and the recording medium.

[0151] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present invention. [Industrial Applicability]

[0152] The present invention can be used in a component supplying device for supplying components to a component mounting device that mounts components on a board. [Explanation of symbols]

[0153] 10 Component mounting system 100 Parts supply device 110 Tray supply section 120 Sensor section 130 Paper Pickup Unit 131 Suction nozzle 132 Support 133 Lifting mechanism 140 Conveyor 150 Tray Stage 160 Recovery Department 170 Control device 171 Detection unit 172 Control section 173 Memory section 180 Tray conveyor 190 Parts Pickup Section 200 Component mounting equipment 220 Parts placement stage 230 Parts mounting section 240 Substrate Stage 250 Board transport section 300, 301, 302 Tray 310 Separate Paper 400 Substrates

Claims

1. a tray supply unit that supplies a tray on which components and separation sheets covering the components are placed; a paper pickup unit that picks up the separation paper on the tray supplied from the tray supply unit; a tray transport unit that receives the tray on which the separation paper is placed from the tray supply unit, transports the tray to a position where the paper pickup unit picks up the separation paper on the tray, and transports the tray on which the separation paper has been picked up to a position where a component pickup unit that supplies the components to a component mounting device picks up the components placed on the tray. Parts supply device.

2. the paper pickup unit includes a suction nozzle, and picks up the separation paper on the tray by suctioning the separation paper from the suction nozzle while the suction nozzle is spaced apart from the separation paper. The component supply device according to claim 1 .

3. The tray conveying unit includes: When the separation paper is placed on the tray, the tray is transported at a first speed; When the separation paper is not placed on the tray, the tray is transported at a second speed that is faster than the first speed.

3. The component supply device according to claim 1 or 2.

4. a recovery unit that recovers the separation paper picked up by the paper pickup unit; 3. The component supply device according to claim 1 or 2.

5. A component supplying method executed by a component supplying device including a tray supplying unit, a paper pickup unit, and a tray transport unit, comprising: The tray supply unit supplies a tray on which components and separation paper covering the components are placed to the tray transport unit; the tray is transported by the tray transport unit to a position where the paper pickup unit picks up the separation paper on the tray; The separation paper is picked up on the tray by the paper pickup unit; the tray conveying unit conveys the tray on which the separation paper has been picked up to a position where a component pickup unit that supplies the components to a component mounting device picks up the components placed on the tray; Parts supply method.

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