Pressing plate

The pressing plate with varying height pressure portions addresses non-uniform pressure distribution issues, ensuring uniform loading and enhanced cooling efficiency for electronic components by minimizing deformation and maintaining consistent load distribution.

JP2025012301APending Publication Date: 2025-01-24AISIN CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2023115039
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-13
Publication Date
2025-01-24

AI Technical Summary

Technical Problem

Existing electronic component cooling structures suffer from non-uniform pressure distribution, leading to deformation and reduced cooling effectiveness due to uneven reaction forces on nail-shaped pressure portions, which compromises the uniform loading and cooling efficiency of electronic circuit parts.

Method used

A pressing plate with a plate body featuring multiple pressure portions of varying heights relative to a fixed point, designed to uniformly press electronic components against a cooling plate with internal coolant, ensuring consistent pressure distribution and minimizing deformation.

Benefits of technology

The solution ensures uniform pressure application, reducing deformation and enhancing cooling efficiency by maintaining consistent load distribution across electronic components, thereby improving thermal management.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025012301000001_ABST
    Figure 2025012301000001_ABST
Patent Text Reader

Abstract

To provide a pressing plate whose cooling effect is not easily reduced.SOLUTION: A pressing plate 1, which presses a plurality of electronic components 90 against a cooling plate 60 through which a cooling fluid flows, includes a plate body 80 having a plurality of pressing portions 82 which press the plurality of electronic components 90 from the side of the electronic components 90 opposite the cooling plate 60, and a fixing portion 81 which fixes the plate body 80 to the cooling plate 60, and before the pressing portions 82 press the electronic components 90, the height from a base end 87 to the tip 88 on the side of the electronic components 90 varies depending on the distance from the fixing portion 81 to the base end 87 in the pressing portions 82.SELECTED DRAWING: Figure 4
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to a pressing plate that presses a plurality of electronic components against a cooling plate through which a cooling fluid flows. [Background technology]

[0002] Some electronic components generate heat when electricity is applied. Electronic components may also receive heat from the surroundings. However, such electronic components need to be used at or below a preset maximum operating temperature in order to maintain their electrical characteristics. Therefore, technologies for cooling electronic components have been studied (for example, Patent Document 1).

[0003] Patent Document 1 describes an electronic circuit component mounting structure. In this electronic circuit component mounting structure, a flat leaf spring is fastened and fixed by screws to the upper end faces of walls erected upward from both ends of a board on which electronic circuit components are mounted, and to the upper end face of a column erected upward in the center of the board. The leaf spring is provided with a claw-shaped pressing portion that presses the upper end face of the electronic circuit component toward the board (heat sink). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-70999 A Summary of the Invention [Problem to be solved by the invention]

[0005] When a leaf spring is provided with multiple claw-shaped pressing parts, as shown in Fig. 6 and Fig. 8 of Patent Document 1, the distance from the fastening hole to each of the multiple claw-shaped pressing parts is not uniform, and there are claw-shaped pressing parts provided close to the fastening hole and claw-shaped pressing parts provided away from the fastening hole. When the upper end surface of an electronic circuit component is pressed toward a board with a leaf spring having such claw-shaped pressing parts, the reaction force against the pressing is suppressed in the claw-shaped pressing parts provided close to the fastening hole, but the reaction force against the pressing is difficult to suppress in the claw-shaped pressing parts provided away from the fastening hole. Therefore, there is a possibility that the part of the leaf spring that is away from the fastening hole (the center part of the leaf spring in a plan view) is deformed so as to be separated from the board by the reaction force. When such deformation occurs, there occurs a variation in the load applied to the electronic circuit components by the claw-shaped pressing portion provided in the center of the leaf spring and the load applied to the electronic circuit components by the claw-shaped pressing portion provided on the outer edge of the leaf spring (the claw-shaped pressing portion provided close to the fastening hole), making it impossible to press the electronic circuit components with a uniform load, thereby reducing the cooling effect of the electronic circuit components.For this reason, there is room for improvement in the electronic circuit component mounting structure described in Patent Document 1 in order to prevent a reduction in the cooling effect.

[0006] Therefore, a pressure plate whose cooling effect is not easily reduced is required. [Means for solving the problem]

[0007] A characteristic configuration of the pressing plate according to the present invention is a pressing plate that presses a plurality of electronic components against a cooling plate through which a cooling fluid flows, and includes a plate body having a plurality of pressing portions that press each of the plurality of electronic components from the side of the electronic components opposite the cooling plate, and a fixing portion that fixes the plate body to the cooling plate, and in a state before the pressing portions press the electronic components, the height from a base end to a tip on the side of the electronic components varies depending on the distance from the fixing portion to the base end.

[0008] With the above-mentioned characteristic configuration, since the height from the base end to the tip on the electronic component side varies depending on the distance from the fixing portion to the base end, even if the pressing plate is deformed so as to move away from the electronic component due to the reaction force against the pressing force when the pressing plate presses the electronic component, it is possible to suppress the variation in the pressing force. Therefore, the electronic component can be uniformly pressed against the cooling plate, making it possible to make it difficult to reduce the cooling effect of the pressing plate on the electronic component. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a vertical cross-sectional view of the vehicle drive device. [Diagram 2] FIG. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] 13 is a diagram showing a state of a pressing plate before being attached to a cooling plate. FIG. [Diagram 5] 13A and 13B are diagrams showing a state of a pressing plate when attached to a cooling plate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The pressing plate according to the present invention is configured to press a plurality of electronic components against a cooling plate through which a cooling fluid flows. The pressing plate 1 according to the present embodiment will be described below. However, the pressing plate 1 is not limited to the following embodiment, and various modifications are possible without departing from the gist of the present invention.

[0011] [Vehicle drive device] 1 is a vertical cross-sectional view of a vehicle drive device 100 provided with electronic components pressed by a pressing plate 1. The vehicle drive device 100 has a housing 100H, which has a first space 111, a second space 112, and a third space 113. A power conversion module PCM is accommodated in the first space 111, a motor M driven by an inverter 3 of the power conversion module PCM is accommodated in the second space 112, and a gear mechanism G that reduces the rotation of the motor M and outputs it is accommodated in the third space 113.

[0012] The power conversion module PCM includes a power supply module 2, an inverter 3, and a control unit 4. The power supply module 2 includes an AC / DC conversion unit 10 and a converter 20. The converter 20 includes a first conversion unit 31, a second conversion unit 41, a third conversion unit (not shown), and a transformer T. The control unit 4 is constructed of hardware or software, or both, with a CPU as a core member, in order to perform processing related to the control of the power conversion module PCM. The AC / DC conversion unit 10, the first conversion unit 31, the second conversion unit 41, the third conversion unit, and the inverter 3 each have a switching element.

[0013] The switching elements of the AC / DC conversion unit 10 and the first conversion unit 31 are mounted on a first substrate SS1. The switching elements of the second conversion unit 41 are mounted on a second substrate SS2. The switching elements of the third conversion unit are mounted on a fourth substrate SS4. The switching elements of the inverter 3 are modularized and provided between the third substrate SS3 and the cooling plate 60 via the pressing plate 1.

[0014] The control unit 4 is mounted on a control board 4S. The control unit 4 drives each of the switching elements based on a control signal. Therefore, the control board 4S is connected to each of the first board SS1, the second board SS2, and the third board SS3 via a control line that transmits the control signal.

[0015] The first substrate SS1, the second substrate SS2, the third substrate SS3, and the control substrate 4S are accommodated in the first space 111 in a mutually parallel orientation. Here, the direction perpendicular to the plate surface of the first substrate SS1 is referred to as the "vertical direction." In addition, in FIG. 1, the direction in which the control substrate 4S is viewed from the first substrate SS1, the second substrate SS2, and the third substrate SS3 along the vertical direction is referred to as the "upper direction," "upper side," etc., and the direction in which the first substrate SS1, the second substrate SS2, and the third substrate SS3 are viewed from the control substrate 4S is referred to as the "lower direction," "lower side," etc.

[0016] The opening Ha is closed by a lid 114, and the first space 111 is a closed space. The second space 112 is a closed space, with the motor M housed therein from the side and closed by a motor cover 115 fastened with bolts 115A. Motor shafts Ma extend from the motor M on both sides along the rotation axis, and one of the motor shafts Ma penetrates the motor cover 115 and is exposed to the outside of the housing 100H.

[0017] The other motor shaft Ma penetrates into the third space 113. The third space 113 is a closed space in which a gear mechanism G is housed from the side and closed by a gear cover 116 fastened with bolts 116A. The other motor shaft Ma extending from the second space 112 is connected to the gear mechanism G, and the rotation of the motor M is input via the motor shaft Ma. The gear mechanism G reduces the rotation of the motor M and outputs it from the gear shaft Ga. The gear shaft Ga penetrates the gear cover 116 and is exposed to the outside of the housing 100H.

[0018] The control board 4S is supported on the upper surface of a metallic support 61 having a C-shaped cross section. The support 61 is fixed to the cooling plate 60 by a bolt 61A. The first board SS1, the second board SS2, and the third board SS3 are disposed below the support 61. The control board 4S is disposed so as to overlap the second board SS2 and the third board SS3 when viewed along the vertical direction (vertical view). A harness 142 is used to connect the second board SS2 and the control board 4S, and to connect the third board SS3 and the control board 4S. This makes it easy to assemble the control board 4S to the second board SS2 and the third board SS3. In addition, a harness 143 is used to connect the first board SS1 and the control board 4S. Furthermore, the first board SS1 and the second board SS2 are connected by a harness (not shown). A capacitor 11 is mounted on the first board SS1. In addition, a capacitor 42 is attached to the upper side of the cooling plate 60.

[0019] Further, a through hole 60H is formed in the cooling plate 60, and via a conductor 77 inserted into this through hole 60H, the reactor coil L1 and the first substrate SS1 are connected, and the transformer T and the second substrate SS2 are connected.

[0020] The cooling plate 60 is provided in the housing 100H of the vehicle drive device 100, and a cooling fluid flows inside. The cooling fluid is cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO). The cooling fluid may be a gas such as air. In this embodiment, it is preferable to use cooling water such as long-life coolant (LLC) or liquid with high electrical insulation such as fluorine-based inert liquid, and a cooling liquid made of insulating oil may be used. The cooling plate 60 is formed in a plate shape, and the first substrate SS1, the second substrate SS2, and the third substrate SS3 are provided in parallel to and close to the cooling plate 60. In this embodiment, these substrates are provided above the cooling plate 60. This makes it possible to cool the switching elements mounted on each of the first substrate SS1, the second substrate SS2, and the third substrate SS3 by the cooling fluid.

[0021] In this embodiment, the first substrate SS1, the second substrate SS2, and the third substrate SS3 are provided on the opposite side of the cooling plate 60 from the transformer T. That is, the transformer T is provided below the cooling plate 60.

[0022] Moreover, in this embodiment, the cooling plate 60 has a conductive portion 62 made of metal. The conductive portion 62 is provided over the entire upper and lower surfaces of the cooling plate 60 in a plan view of the cooling plate 60. However, the conductive portion 62 may be provided on a part of the upper and lower surfaces of the cooling plate 60. Furthermore, the conductive portion 62 may be provided on at least one of the upper and lower surfaces of the cooling plate 60. By providing the conductive portion 62 on the cooling plate 60 in this manner, it is possible to increase the heat exchange efficiency of the cooling plate 60.

[0023] It is preferable to ground the conductive portion 62. This makes it possible to prevent the control signals for driving the switching elements, which are transmitted from the control substrate 4S to each of the first substrate SS1, the second substrate SS2, the third substrate SS3, and the fourth substrate SS4, from being disturbed by external noise.

[0024] [Pressure plate] Fig. 2 is a plan view of the pressing plate 1 of this embodiment. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. Fig. 4 is a view showing the pressing plate 1 before it is attached to the cooling plate 60, and Fig. 5 is a view showing the pressing plate 1 after it is attached to the cooling plate 60. Note that the conductive portion 62 is not shown in Figs. 4 and 5. In this embodiment, as shown in Figs. 2 and 3, the pressing plate 1 is formed by subjecting a metal flat plate to sheet metal processing, and includes a plate body 80 and ear portions 83.

[0025] The plate body 80 has a plurality of (four in this embodiment) pressing parts 82. The pressing parts 82 press each of the plurality of electronic components from the side opposite to the cooling plate 60 of the electronic components. Here, the inverter 3 drives a motor M as a three-phase motor. Therefore, the inverter 3 has three legs, and each of the three legs is provided with a high-side switching element and a low-side switching element connected in series. The high-side switching element and the low-side switching element provided in each of the three legs are modularized. Therefore, the inverter 3 has three modules 90. In this embodiment, the above electronic components correspond to the modules 90 of the inverter 3, and the plurality of electronic components correspond to the three modules 90 of the inverter 3. In the following, the three modules 90 will be described as modules 91, 92, and 93, respectively.

[0026] 1, the inverter 3 is provided on the upper side of the cooling plate 60. Therefore, the side of the electronic components opposite to the cooling plate 60 corresponds to the upper side of the inverter 3, i.e., the third substrate SS3 side. Therefore, as shown in FIGS. 2 and 4, the plate body 80 has four pressing portions 82, and the pressing portions 82 press each of the three modules 91, 92, and 93 from above the inverter 3.

[0027] The plate body 80 of this embodiment is configured in a rectangular shape when viewed from above, and the ears 83 are provided on the sides of a pair of opposing short sides of this rectangle (a first end side 51 and a second end side 52 described below) so as to extend outward from the plate body 80. The ears 83 are provided with fixing parts 81 consisting of through holes that penetrate the pressing plate 1 in the thickness direction. A bolt 81A is inserted into the fixing part 81, and the plate body 80 is fixed to the cooling plate 60 by fastening the bolt 81A.

[0028] The fixing portion 81 in this embodiment is provided on the first end side 51 side of the plate body 80 and on the second end side 52 side opposite the first end side 51. As described above, in this embodiment, the fixing portion 81 is provided on the ear portion 83 provided at the end portion of a pair of opposing short sides of the rectangular plate body 80. Therefore, in this embodiment, the first end side 51 corresponds to one of the pair of short sides of the rectangular plate body 80, and the second end side 52 corresponds to the other of the pair of short sides of the rectangular plate body 80.

[0029] In this embodiment, as described above, the plate body 80 is provided with four pressing portions 82. In this embodiment, the four pressing portions 82 correspond to the first pressing portion 82A, the second pressing portion 82B, and the central pressing portions 82C and 82D. As shown in Figs. 4 and 5, in this embodiment, three modules 91, 92, and 93 are arranged side by side along the longitudinal direction of the plate body 80. The modules 91, 92, and 93 are configured to have the same height. Therefore, the mounting heights of the modules 91, 92, and 93 are the same.

[0030] The first pressing portion 82A is provided on the side of the first end edge 51 and presses the module 91. The second pressing portion 82B is provided on the side of the second end edge 52 and presses the module 92. Furthermore, the central pressing portions 82C and 82D are provided in the central region between the first end edge 51 and the second end edge 52 and press the module 93. In this embodiment, as described above, the first pressing portion 82A and the second pressing portion 82B are provided on the side of the first end edge 51 and the side of the second end edge 52 of the plate main body 80, and two central pressing portions 82C and 82D are provided in the central region of the plate main body 80. Therefore, the number of central pressing portions 82C and 82D is greater than the number of the first pressing portions 82A and the second pressing portions 82B.

[0031] Therefore, the central pressing units 82C, 82D cooperate to press one module 93 in the central region of the plate body 80 in a plan view toward the cooling plate 60. The first pressing unit 82A presses one module 91 arranged on the first end side 51 side of the module 93 in the central region of the plate body 80 in a plan view, alone, toward the cooling plate 60. The second pressing unit 82B presses one module 92 arranged on the second end side 52 side of the module 93 in the central region of the plate body 80 in a plan view, alone, toward the cooling plate 60.

[0032] In the pressing portion 82 of this embodiment, the height from the base end 87 to the tip 88 on the module 91, 92, 93 side is configured to be lower as the distance from the fixing portion 81 to the base end 87 increases before the pressing portion 82 presses the modules 91, 92, 93. The state before the pressing portion 82 presses the modules 91, 92, 93 is a state in which the pressing portion 82 is not pressing the modules 91, 92, 93. The base end 87 on the module 91, 92, 93 side corresponds to the portion of the pressing portion 82 that is closest to the flat plate portion of the plate main body 80. The tip 88 corresponds to the most protruding portion of the pressing portion 82. The distance from the fixing portion 81 to the base end 87 corresponds to the distance between the fixing portion 81 and the base end 87 in a plan view of the plate main body 80. Therefore, when the pressing portion 82 is not pressing the modules 91, 92, 93, the height from the part of the pressing portion 82 that is farthest from the flat portion of the plate body 80 to the part of the pressing portion 82 that is closest to the flat portion of the plate body 80 is configured to be lower as the distance between the fixing portion 81 and the base end 87 in a planar view of the plate body 80 becomes longer.

[0033] 4, the heights of the central pressing portions 82C and 82D, which have a long distance from the fixed portion 81 to the base end 87, are configured to be lower than the first pressing portion 82A and the second pressing portion 82B, which have a short distance from the fixed portion 81 to the base end 87. Therefore, even if the first pressing portion 82A and the second pressing portion 82B are in contact with the module 91 and the module 92, respectively, before the pressing portion 82 presses the modules 91, 92, 93, the central pressing portions 82C and 82D are spaced apart from the module 93.

[0034] The pressing portion 82 in this embodiment is cut and raised in a one-piece shape from the base end 87 toward the modules 91, 92, and 93. That is, the pressing portion 82 extends at an incline so as to move away from the base end 87 toward the cooling plate 60. At this time, the pressing portion 82 is configured by cutting and raising so that the angle that the tip 88 of the pressing portion 82 makes with the surface of the plate main body 80 is an obtuse angle (approximately parallel). This makes it possible to prevent the pressing portion 82 from being deformed or damaged in the process of pressing the modules 91, 92, and 93.

[0035] In the first pressing portion 82A and the second pressing portion 82B, in a plan view of the plate body 80, a base end 87 is provided on the central region side, and a tip end 88 is provided on the first end side 51 side and the second end side 52 side, respectively. That is, as shown in Fig. 2, the base end 87 and the tip end 88 of the first pressing portion 82A are provided along the longitudinal direction of the plate body 80, and the base end 87 is provided closer to the central region than the tip end 88. In addition, the base end 87 and the tip end 88 of the second pressing portion 82B are provided along the longitudinal direction of the plate body 80, and the base end 87 is provided closer to the central region than the tip end 88.

[0036] In addition, in the present embodiment, the central pressing portions 82C and 82D have base ends 87 provided on the first end side 51 side and the second end side 52 side, respectively, in a plan view of the plate body 80, and have tips 88 provided on the central region side.

[0037] Moreover, the plate body 80 of this embodiment has an erected portion 89 that bends and rises toward the third end side 53 and the fourth end side 54 that intersect with the first end side 51 and the second end side 52. In this embodiment, the first end side 51 and the second end side 52 are ends that face each other along the longitudinal direction of the plate body 80. Therefore, the third end side 53 and the fourth end side 54 correspond to ends that face each other along the lateral direction of the plate body 80. The erected portion 89 is composed of a wall portion that erects the third end side 53 and the fourth end side 54 of the plate body 80 toward the side away from the cooling plate 60. This makes it possible to make the plate body 80 less likely to deform.

[0038] 5, when the central pressing units 82C and 82D cooperate to press the module 93 toward the cooling plate 60, the first pressing unit 82A presses the module 91 alone toward the cooling plate 60, and the second pressing unit 82B presses the module 92 alone toward the cooling plate 60, it is possible to suppress variations in the pressing force (load). Therefore, it is possible to appropriately press the modules 91, 92, and 93 toward the cooling plate 60.

[0039] Other embodiments Next, other embodiments of the pressing plate 1 will be described.

[0040] In the above embodiment, two central pressing portions 82C, 82D are provided, and the number of central pressing portions 82C, 82D is greater than the first pressing portions 82A and the second pressing portions 82B. However, it is also possible to configure the number of central pressing portions 82C (82D) to be less than the first pressing portions 82A and the second pressing portions 82B, or to configure the number of first pressing portions 82A and the second pressing portions 82B to be equal to the number of central pressing portions 82C (82D).

[0041] In the above embodiment, the height of the central pressing portions 82C, 82D is set lower than the respective heights of the first pressing portion 82A and the second pressing portion 82B. However, it is also possible to set the height of the central pressing portions 82C, 82D and the respective heights of the first pressing portion 82A and the second pressing portion 82B equal to each other, or to set the height of the central pressing portions 82C, 82D higher than the respective heights of the first pressing portion 82A and the second pressing portion 82B.

[0042] The pressing portion 82 in the above embodiment has been described as being cut and raised in a single piece from the base end 87 toward the module 90. However, the pressing portion 82 can also be configured as a convex body that extends from the base end 87 along the plate body 80 and protrudes at its end toward the cooling plate 60.

[0043] The first pressing portion 82A and the second pressing portion 82B in the above embodiment have been described as having the base end 87 provided on the central region side and the tip end 88 provided on the first end side 51 side and the second end side 52 side, respectively, in a plan view of the plate body 80. However, the first pressing portion 82A and the second pressing portion 82B may have the tip end 88 provided on the central region side and the base end 87 provided on the first end side 51 side and the second end side 52 side, respectively, in a plan view of the plate body 80.

[0044] The plate body 80 in the above embodiment has been described as having the erected portion 89 that bends and rises toward the third end side 53 and the fourth end side 54 that intersect with the first end side 51 and the second end side 52. However, the erected portion 89 can also be configured to bend and rise downward toward the cooling plate 60 on the sides of the third end side 53 and the fourth end side 54 that intersect with the first end side 51 and the second end side 52.

[0045] [Summary of the above embodiment] The above-described pressing plate 1 will now be outlined.

[0046] (1) The pressing plate 1, which presses a plurality of modules (electronic components) 90 against a cooling plate 60 through which a cooling fluid flows, comprises a plate body 80 having a plurality of pressing portions 82 which press each of the plurality of modules 90 from the side of the module 90 opposite the cooling plate 60, and a fixing portion 81 which fixes the plate body 80 to the cooling plate 60, and in a state before the pressing portion 82 presses the module 90, the height from a base end 87 to a tip 88 on the module 90 side of the pressing portion 82 varies depending on the distance from the fixing portion 81 to the base end 87.

[0047] According to this configuration, the height from the base end 87 to the tip 88 on the module 90 side varies depending on the distance from the fixing portion 81 to the base end 87, so that even if the pressing plate 1 is deformed so as to move away from the module 90 due to a reaction force against the pressing when the pressing plate 1 presses the module 90, it is possible to suppress variation in the pressing force. Therefore, the module 90 can be uniformly pressed against the cooling plate 60, so that it is possible to make it difficult for the cooling effect of the pressing plate 1 on the module 90 to be reduced.

[0048] (2) In the pressing plate 1 described in (1), the fixing portion 81 is provided on the side of a first end edge 51 of the plate body 80 and on the side of a second end edge 52 opposite to the first end edge 51, and the pressing portion 82 is provided on the side of the first end edge 51 and includes a first pressing portion 82A that presses one of the multiple modules 90, and a second pressing portion 82B that is provided on the side of the second end edge 52 and presses another one of the multiple modules 90; The central pressing portions 82C, 82D are provided in the central region between the first end edge 51 and the second end edge 52 and press yet another one of the multiple modules 90, and the central pressing portions 82C, 82D are provided in greater numbers than the first pressing portions 82A and the second pressing portions 82B, and it is preferable that the height of the central pressing portions 82C, 82D is set lower than the respective heights of the first pressing portions 82A and the second pressing portions 82B.

[0049] On the side of the first end side 51, since the distance from the fixed portion 81 is short, the reaction force against the pressing by the first pressing portion 82A is suppressed, and the plate body 80 is less likely to deform, and on the side of the second end side 52, since the distance from the fixed portion 81 is short, the reaction force against the pressing by the second pressing portion 82B is suppressed, and the plate body 80 is less likely to deform. On the other hand, in the central region between the first end side 51 and the second end side 52, since the distance from the fixed portion 81 is greater than the first pressing portion 82A and the second pressing portion 82B, the reaction force against the pressing by the central pressing portions 82C, 82D is less likely to be suppressed, and the plate body 80 is more likely to deform. According to this configuration, the modules 90 on the side of the first end 51 where the plate body 80 is less likely to deform are pressed by the first pressing portion 82A, the modules 90 on the side of the second end 52 where the plate body 80 is less likely to deform are pressed by the second pressing portion 82B, and further, the modules 90 in the central region between the first end 51 and the second end 52 where the plate body 80 is more likely to deform are pressed by the central pressing portions 82C, 82D, which are greater in number than the first pressing portion 82A and the second pressing portion 82B. In this way, the number of the central pressing portions 82C, 82D in the central region where the plate body 80 is more likely to deform is increased and the height of the central pressing portions 82C, 82D is lowered, relative to the first pressing portion 82A and the second pressing portion 82B in the region close to the fixed portion 81 where the plate body 80 is less likely to deform, thereby making it possible to adjust the pressing force of the pressing plate 1. Therefore, it is possible to obtain a desired cooling effect.

[0050] (3) In the pressing plate 1 described in (2), the pressing portion 82 is cut out in a piece shape from the base end 87 toward the module 90 side, and it is preferable that the first pressing portion 82A and the second pressing portion 82B are each, when viewed in a plane of the plate body 80, provided with the base end 87 on the central region side and the tip end 88 on the first end edge 51 side and the second end edge 52 side.

[0051] According to this configuration, even if the plate body 80 is deformed, it is possible to ensure the rigidity of the pressing portion 82 against the plate body 80. In addition, since the base end 87 of the pressing portion 82, which applies stress to the plate body 80, and the fixing portion 81 can be provided at a distance from each other, it is possible to prevent damage to the plate body 80.

[0052] (4) In the pressure plate 1 described in (2) or (3), it is preferable that the plate body 80 has an upright portion 89 that is bent and rises toward the third end edge 53 and the fourth end edge 54 that intersect with the first end edge 51 and the second end edge 52.

[0053] According to this configuration, the standing portion 89 is provided across the first end side 51 and the second end side 52 where the fixing portion 81 for fixing the pressing plate 1 to the cooling plate 60 is provided, so that the rigidity of the plate body 80 can be increased and deformation can be suppressed. Therefore, the multiple modules 90 can be pressed against the cooling plate 60 with a desired load, so that the cooling effect is unlikely to be reduced. [Industrial Applicability]

[0054] The technology according to the present disclosure can be used in a pressing plate that presses a plurality of electronic components against a cooling plate through which a cooling fluid flows. [Explanation of symbols]

[0055] 1: pressing plate, 51: first end, 52: second end, 53: third end, 54: fourth end, 60: cooling plate, 80: plate body, 81: fixing portion, 82: pressing portion, 82A: first pressing portion, 82B: second pressing portion, 82C: central pressing portion, 82D: central pressing portion, 87: base end, 88: tip, 89: standing portion, 90: module (electronic component)

Claims

1. A pressing plate that presses a plurality of electronic components against a cooling plate through which a cooling fluid flows, a plate body having a plurality of pressing portions that press the plurality of electronic components from the side opposite to the cooling plate; a fixing portion that fixes the plate body to the cooling plate, A pressing plate in which the height from a base end to a tip end on the side of the electronic component before the pressing portion presses the electronic component varies depending on the distance from the fixed portion to the base end.

2. The fixing portion is provided on a first end side of the plate body and a second end side opposite to the first end side, the pressing portion includes a first pressing portion provided on the first end side and pressing one of the plurality of electronic components, a second pressing portion provided on the second end side and pressing another of the plurality of electronic components, and a central pressing portion provided in a central region between the first end side and the second end side and pressing yet another of the plurality of electronic components, The central pressing portions are provided in greater number than the first pressing portions and the second pressing portions, 2. The pressure plate according to claim 1, wherein the height of the central pressure portion is set lower than the heights of the first pressure portion and the second pressure portion.

3. The pressing portion is cut out and raised in a strip shape from the base end toward the electronic component, The pressure plate according to claim 2, wherein the first pressing portion and the second pressing portion have, in a plan view of the plate body, a base end provided on the side of the central region and a tip end provided on the side of the first end edge and a side of the second end edge.

4. 4. The pressure plate according to claim 2, wherein the plate body has erected portions that are bent and stand up on the sides of third and fourth end sides that intersect with the first and second end sides.

Citation Information

Patent Citations

  • Electronic circuit component mounting structure

    JP2009070999A