Electronic component-mounted board

Abstract

To provide an electronic component-mounted board which can suppress outflow of a sealing resin while sufficiently protecting an electronic component with a sealing resin.SOLUTION: Electronic component-mounted boards (100, 200) include a printed board (10), an electronic component (20), and a sealing resin (30). The printed board has a main surface (10a). The electronic component is mounted on the main surface. The sealing resin is arranged on the main surface so as to cover the electronic component. In the main surface, a groove (10c) is formed. The groove extends so as to cross a region between one side (S) of the main surface and the electronic component, in plan view.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an electronic component mounting board. [Background technology]

[0002] For example, JP 2022-112463 A (Patent Document 1) describes a thermal printhead. The thermal printhead described in Patent Document 1 has a connection board. Various electronic components are mounted on the connection board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-112463 A [Summary] From the viewpoint of protecting the electronic components mounted on the connection board, it is preferable that the electronic components on the connection board are resin-sealed. If the amount of sealing resin is small, the surface of the electronic components is exposed from the sealing resin, resulting in insufficient protection for the electronic components. On the other hand, if the amount of sealing resin is large, the sealing resin may flow out from the place where it is supplied and reach the edge of the connection board, causing interference with other components (e.g., a cover, etc.).

[0004] The electronic component mounting board of the present disclosure includes a printed circuit board, an electronic component, and a sealing resin. The printed circuit board has a main surface. The electronic component is mounted on the main surface. The sealing resin is disposed on the main surface so as to cover the electronic component. A groove is formed in the main surface. The groove extends across a region between one side of the main surface and the electronic component in a plan view. [Brief description of the drawings]

[0005] [Figure 1] FIG. 2 is a plan view of the electronic component mounting board 100. [Diagram 2] FIG. 2 is a partial enlarged view of region II in FIG. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 13 is an enlarged plan view of an electronic component mounting board 100 according to a modified example. FIG. [Figure 6] 2 is an enlarged plan view of the electronic component mounting board 200. FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG.

[0006] [Detailed Description] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and redundant description will not be repeated.

[0007] (First embodiment) The component mounting board according to the first embodiment will be described below. The component mounting board according to the first embodiment is referred to as an electronic component mounting board 100.

[0008] <Configuration of Electronic Component Mounting Board 100> The configuration of the electronic component mounting board 100 will be described below.

[0009] FIG. 1 is a plan view of an electronic component mounting board 100. FIG. 2 is a partially enlarged view of region II in FIG. 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 2. As shown in FIGS. 1, 2, 3, and 4, the electronic component mounting board 100 has a printed circuit board 10, an electronic component 20, and a sealing resin 30. The electronic component mounting board 100 is used, for example, in a thermal printhead. However, the use of the electronic component mounting board 100 is not limited to this.

[0010] The printed circuit board 10 has a main surface 10a and a main surface 10b. The main surface 10a and the main surface 10b are end surfaces in the thickness direction of the printed circuit board 10. The main surface 10b is the opposite surface to the main surface 10a. The main surface 10a has, for example, a rectangular shape in a plan view. Although not shown, there is wiring on the main surface 10a, and the wiring is covered with a solder resist. Note that a part of the wiring is a pad exposed from the solder resist.

[0011] The electronic component 20 is mounted on the main surface 10a. More specifically, the electronic component 20 is soldered to, for example, a pad of a wiring on the main surface 10a of the printed circuit board 10. The electronic component 20 is, for example, an IC (Integrated Circuit) having a memory. Identification information of the thermal printhead is stored in the memory of the IC. However, the electronic component 20 is not limited to this.

[0012] A groove 10c is formed in the main surface 10a. In a plan view, the groove 10c extends across a region between one side (side S) of the main surface 10a and the electronic component 20. The width of the groove 10c in a direction parallel to the side S is, for example, larger than the width of the electronic component 20 in a direction parallel to the side S. In a plan view, the groove 10c extends, for example, parallel to the side S.

[0013] The sealing resin 30 is disposed on the main surface 10a so as to cover the electronic component 20. The sealing resin 30 is potted in an uncured state so as to cover the electronic component 20, and then cured by heating or the like. It is preferable that the sealing resin 30 covers the side of the electronic component 20 facing the groove 10c. The sealing resin 30 is preferably disposed in the groove 10c as well.

[0014] The adhesion strength between the sealing resin 30 and the electronic component 20 is preferably greater than the adhesion strength between the sealing resin 30 and the electronic component 20. The adhesion strength between the sealing resin 30 and the electronic component 20 and the adhesion strength between the sealing resin 30 and the electronic component 20 are measured by the following method.

[0015] First, a first sample and a second sample are prepared. The surface of the first sample is a simulation of the surface of the printed circuit board 10. That is, the surface of the first sample is made of solder resist. The surface of the second sample is a simulation of the surface of the electronic component 20. That is, the surface of the second sample is made of the molded resin of the electronic component 20. Secondly, the sealing resin 30 is disposed on the surface of the first sample and on the surface of the second sample. Thirdly, the adhesion strength of the sealing resin 30 from the surface of the first sample and the surface of the second sample is measured by a tensile strength measurement using a pull gauge. This measurement result is regarded as the adhesion strength between the sealing resin 30 and the electronic component 20 and the adhesion strength between the sealing resin 30 and the electronic component 20.

[0016] <Modification> Fig. 5 is an enlarged plan view of an electronic component mounting board 100 according to a modified example. As shown in Fig. 5, the groove 10c may be formed so as to surround the electronic component 20 in a plan view. In the above, the groove 10c is formed in the main surface 10a, but the groove may not be formed in the main surface 10a. In this case, the electronic component mounting board 100 is for a thermal printhead, and the electronic component 20 is an IC having a memory in which identification information of the thermal printhead is stored.

[0017] <Effects of the electronic component mounting board 100> The effects of the electronic component mounting board 100 will be described below.

[0018] If the electronic component 20 is an IC having a memory in which identification information of the thermal printhead is stored, the identification information can be used to ensure the traceability of the thermal printhead, and it is possible to prevent similar products from being installed in the printer.

[0019] When the electronic component 20 is exposed on the printed circuit board 10, a third party can easily ascertain the presence of the electronic component 20, and can therefore produce a similar product by separating the electronic component 20 from the printed circuit board 10 and analyzing it. In the electronic component mounting board 100, the electronic component 20 is covered with the sealing resin 30, making it difficult for a third party to ascertain the presence of the electronic component 20 and to separate the electronic component 20 from the printed circuit board 10, and therefore it is possible to inhibit a third party from producing a similar product.

[0020] When the amount of sealing resin 30 is small, the sealing resin 30 cannot completely cover the electronic component 20, and a part of the electronic component 20 may be exposed from the sealing resin 30. On the other hand, when the amount of sealing resin 30 is large, the sealing resin 30 may flow out and reach the vicinity of the side S, and may interfere with other components (e.g., a cover) when the other components are attached. In the electronic component mounting board 100, the groove 10c is formed so as to cross the region between the side S and the electronic component 20 in a plan view, so that the sealing resin 30 accumulates in the groove 10c, and the sealing resin 30 can be prevented from flowing out.

[0021] By forming the groove 10c and being able to supply a sufficient amount of sealing resin 30, it becomes possible to cover the electronic component 20, including the side of the electronic component 20 facing the groove 10c, with the sealing resin 30 without exposing it. In addition, by forming the groove 10c and being able to supply a sufficient amount of sealing resin 30, the sealing resin 30 also enters the groove 10c, increasing the adhesion area with the printed circuit board 10, and the sealing resin 30 becomes less likely to peel off from the printed circuit board 10. As a result, it becomes even more difficult to separate the electronic component 20 from the printed circuit board 10.

[0022] If the adhesive strength between the sealing resin 30 and the electronic component 20 is greater than the adhesive strength between the sealing resin 30 and the electronic component 20, even if the sealing resin 30 can be peeled off from the printed circuit board 10, it is difficult to peel the sealing resin 30 off from the electronic component 20. Therefore, in this case, it becomes even more difficult for a third party to analyze the electronic component 20 and manufacture a similar product. Furthermore, if the groove 10c surrounds the electronic component 20 in a plan view, it is possible to prevent the sealing resin 30 from spreading near the side S and also to prevent the sealing resin 30 from interfering with other locations on the printed circuit board 10.

[0023] Second embodiment An electronic component mounting board according to the second embodiment will be described. The electronic component mounting board according to the second embodiment is designated as electronic component mounting board 200. Here, differences from electronic component mounting board 100 will be mainly described, and overlapping descriptions will not be repeated.

[0024] <Configuration of Electronic Component Mounting Board 200> The configuration of the electronic component mounting board 200 will be described below.

[0025] Fig. 6 is an enlarged plan view of electronic component mounting board 200. Fig. 7 is a cross-sectional view taken along line VII-VII in Fig. 6. As shown in Fig. 6 and Fig. 7, electronic component mounting board 200 has printed circuit board 10, electronic component 20, and sealing resin 30. In this regard, the configuration of electronic component mounting board 200 is common to the configuration of electronic component mounting board 100.

[0026] In the electronic component mounting board 200, a through hole 10d is formed in the printed circuit board 10. The through hole 10d penetrates the printed circuit board 10 in the thickness direction. The through hole 10d is disposed around the electronic component 20 in a plan view. More specifically, the through hole 10d is located at a position overlapping with the sealing resin 30 in a plan view. In these respects, the configuration of the electronic component mounting board 200 is different from the configuration of the electronic component mounting board 100.

[0027] <Effects of the electronic component mounting board 200> The effects of the electronic component mounting board 200 will be described below.

[0028] When the sealing resin 30 is cured, air present inside the sealing resin 30 may foam on the surface of the sealing resin 30. When such foaming occurs, the appearance of the sealing resin 30 is impaired. In addition, the electronic component 20 may be exposed from such foaming marks. In the electronic component mounting substrate 200, the through hole 10d is formed at a position overlapping with the sealing resin 30 in a plan view. Therefore, the air inside the sealing resin 30 is discharged from the main surface 10b side through the through hole 10d, and is unlikely to foam on the surface of the sealing resin 30. Therefore, the electronic component mounting substrate 200 can suppress the deterioration of the appearance of the sealing resin 30 caused by foaming of the air present inside the sealing resin 30 and the exposure of the electronic component 20 from the foaming marks.

[0029] (Additional Note) The configurations included in the embodiments of the present disclosure are listed below.

[0030] <Appendix 1> An electronic component mounting board, A printed circuit board; Electronic components, and a sealing resin. The printed circuit board has a main surface, the electronic component is mounted on the main surface, the sealing resin is disposed on the main surface so as to cover the electronic component, A groove is formed in the main surface, the groove extends across a region between one side of the main surface and the electronic component in a plan view of the electronic component mounting board.

[0031] <Appendix 2> 2. The electronic component mounting board according to claim 1, wherein the sealing resin covers a side of the electronic component facing the groove.

[0032] <Appendix 3> 3. The electronic component mounting board according to claim 1, wherein the sealing resin is disposed in the groove.

[0033] <Appendix 4> 4. The electronic component mounting board according to claim 1, wherein the groove extends so as to surround the electronic component in a plan view.

[0034] <Appendix 5> The printed circuit board has a through hole formed therein, the through hole passing through the printed circuit board in a thickness direction, 5. The electronic component mounting board according to claim 1, wherein the through hole is located so as to overlap with the sealing resin in a plan view.

[0035] <Appendix 6> 6. The electronic component mounting board according to claim 1, wherein an adhesion strength between the sealing resin and the electronic component is greater than an adhesion strength between the sealing resin and the printed circuit board.

[0036] <Appendix 7> The electronic component mounting substrate is used in a thermal printhead, the electronic component is an IC having a memory, 7. The electronic component mounting board according to claim 1, wherein the memory stores identification information of the thermal printhead.

[0037] <Appendix 8> An electronic component mounting board, A printed circuit board; Electronic components, and a sealing resin. The printed circuit board has a main surface, the electronic component is mounted on the main surface, the sealing resin is disposed on the main surface so as to cover the electronic component, The electronic component mounting substrate is used in a thermal printhead, the electronic component is an IC having a memory, The memory stores identification information of the thermal printhead.

[0038] Although the embodiment of the present disclosure has been described above, the above-mentioned embodiment can be modified in various ways. The scope of the present invention is not limited to the above-mentioned embodiment. The scope of the present invention is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. [Explanation of symbols]

[0039] 10 printed circuit board, 10a, 10b main surfaces, 10c groove, 10d through hole, 20 electronic component, 30 sealing resin, 100, 200 electronic component mounting board, S side.

Claims

1. An electronic component mounting board, A printed circuit board; Electronic components, and a sealing resin. The printed circuit board has a main surface, the electronic component is mounted on the main surface, the sealing resin is disposed on the main surface so as to cover the electronic component, A groove is formed in the main surface, the groove extends across a region between one side of the main surface and the electronic component in a plan view of the electronic component mounting board.

2. The electronic component mounting board according to claim 1 , wherein the sealing resin covers a side surface of the electronic component facing the groove.

3. The electronic component mounting board according to claim 1 , wherein the sealing resin is disposed in the groove.

4. The electronic component mounting board according to claim 1 , wherein the groove extends so as to surround the electronic component in a plan view.

5. The printed circuit board has a through hole formed therein, the through hole passing through the printed circuit board in a thickness direction, The electronic component mounting board according to claim 1 , wherein the through hole is located so as to overlap the sealing resin in a plan view.

6. 2. The electronic component mounting board according to claim 1, wherein the adhesive strength between said sealing resin and said electronic components is greater than the adhesive strength between said sealing resin and said printed circuit board.

7. The electronic component mounting substrate is used in a thermal printhead, the electronic component is an IC having a memory, 7. The electronic component mounting board according to claim 1, wherein the memory stores identification information of the thermal printhead.

8. An electronic component mounting board, A printed circuit board; Electronic components, and a sealing resin. The printed circuit board has a main surface, the electronic component is mounted on the main surface, the sealing resin is disposed on the main surface so as to cover the electronic component, The electronic component mounting substrate is used in a thermal printhead, the electronic component is an IC having a memory, The memory stores identification information of the thermal printhead.

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