Cooling system for semiconductor manufacturing process, cooling method, and semiconductor manufacturing system

Abstract

To provide a cooling system capable of reducing power consumption of the entire cooling system by effectively utilizing waste heat which is generated in the cooling system.SOLUTION: A cooling system 5 comprises: a waste heat source (vacuum pump 6) which generates waste hot water; an absorption refrigerator 15 which generates a first coolant using the waste hot water as a heat source; a cooling unit 7 which cools a first circulation liquid passing a processing chamber 2 using the first coolant as a cooling source; a first waste hot water supply line 21 which supplies waste hot water from the waste heat source (vacuum pump 6) to the absorption refrigerator 15; a first waste hot water return line 22 which returns waste hot water passing the absorption refrigerator 15 to the waste heat source (vacuum pump 6); a first coolant supply line 41 which supplies the first coolant from the absorption refrigerator 15 to the cooling unit 7; and a first coolant return line 42 which returns the first coolant passing the cooling unit 7 to the absorption refrigerator 15.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a cooling system and a cooling method used for cooling semiconductor manufacturing equipment such as an etching device, and also to a semiconductor manufacturing system equipped with such a cooling system. [Background technology]

[0002] In the dry etching process, which is one of the semiconductor manufacturing processes, an etching apparatus installed in a clean room is used. In the sub-fab area located on the floor below the clean room, a vacuum pump for exhausting the process gas from the processing chamber of the etching apparatus, a detoxification device for detoxifying the process gas exhausted from the vacuum pump, a cooling unit for cooling the circulating liquid flowing in the processing chamber, and other equipment are installed. The circulating liquid cooled by the cooling unit flows through a flow path formed in the processing chamber of the etching apparatus to cool the processing chamber. In order to cool the circulating liquid in the cooling unit, it is necessary to supply the cooling unit with a stable temperature of cooling liquid. In conventional cooling systems, the cooling liquid is generated by a large turbo refrigerator installed in the machine room. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-179926 [Patent Document 2] Japanese Patent Application Publication No. 11-337211 [Patent Document 3] JP 2016-23826 A Summary of the Invention [Problem to be solved by the invention]

[0004] Because the dry etching process takes a long time, etching equipment is often equipped with multiple processing chambers to make the process more efficient. As the number of processing chambers increases, the number of cooling units and vacuum pumps required to accommodate the number of processing chambers also increases, and the amount of cooling liquid generated by the turbo refrigerator also increases, which has led to an increase in the power consumption of the entire cooling system.

[0005] Therefore, the present invention provides a cooling system and a cooling method that can effectively utilize the exhaust heat generated in the cooling system and reduce the power consumption of the entire cooling system. The present invention also provides a semiconductor manufacturing system equipped with such a cooling system. [Means for solving the problem]

[0006] In one aspect, a cooling system for cooling a processing chamber used in a semiconductor manufacturing apparatus is provided, the cooling system comprising: a waste heat source that generates waste hot water; an absorption chiller that uses the waste hot water as a heat source to generate a first coolant; a cooling unit that uses the first coolant as a cooling source to cool a first circulating liquid that has passed through the processing chamber; a first waste hot water supply line that supplies the waste hot water from the waste heat source to the absorption chiller; a first waste hot water return line that returns the waste hot water that has passed through the absorption chiller to the waste heat source; a first coolant supply line that supplies the first coolant from the absorption chiller to the cooling unit; and a first coolant return line that returns the first coolant that has passed through the cooling unit to the absorption chiller. According to the present invention, the absorption chiller can use waste hot water as a heat source to generate a first cooling liquid used as a cooling source in the cooling unit. By using the absorption chiller instead of or in addition to a chiller (e.g., a compression chiller) used as a conventional cooling source, the power consumption of the entire cooling system can be reduced.

[0007] In one embodiment, the cooling system further includes a first exhaust hot water flow control valve arranged in the first exhaust hot water supply line, a first exhaust hot water temperature measuring device that measures the temperature of the exhaust hot water flowing through the first exhaust hot water supply line, a first exhaust hot water return temperature measuring device that measures the temperature of the exhaust hot water flowing through the first exhaust hot water return line, and a control device that controls the operation of the first exhaust hot water flow control valve, and the control device is configured to adjust the temperature of the exhaust hot water flowing through the first exhaust hot water return line to a predetermined temperature. According to the present invention, the temperature of the waste hot water flowing through the first waste hot water return line is adjusted to a predetermined temperature by a control device that controls the operation of the first waste hot water flow control valve, so that the vacuum pump can generate waste hot water having a temperature that can be used as a heat source in an absorption chiller.

[0008] In one embodiment, the exhaust heat source is at least one of a vacuum pump that exhausts a processing gas from the processing chamber, a decontamination device that decontaminates the processing gas discharged from the vacuum pump, and a heating unit that heats a second circulating liquid that has passed through the processing chamber. According to the present invention, at least one of the vacuum pump, the abatement device, and the heating unit can provide waste hot water for use as a heat source in the absorption chiller. In one embodiment, the absorption chiller includes a regenerator that generates refrigerant vapor using heat from the waste hot water to concentrate the solution, a condenser that condenses the generated refrigerant vapor, an evaporator that evaporates the condensed refrigerant and cools the first cooling liquid, and an absorber that absorbs the evaporated refrigerant vapor with the solution, wherein the regenerator is connected to the first waste hot water supply line and the first waste hot water return line, and the evaporator is connected to the first cooling liquid supply line and the first cooling liquid return line. According to the present invention, the waste hot water can be used as a heat source for evaporating the refrigerant contained in the diluted solution in the regenerator of the absorption chiller. In one embodiment, the temperature of the waste hot water flowing through the first waste hot water return line is within a range of 70°C to 90°C. According to the present invention, by returning the waste hot water in the above temperature range to the waste heat source, the waste heat source can generate waste hot water at a temperature that can be used as a heat source in the absorption chiller.

[0009] In one embodiment, the cooling system further includes a waste heat utilization device that uses the waste hot water as a heat source, a second waste hot water supply line that supplies the waste hot water from the waste heat source to the waste heat utilization device, a second waste hot water return line that returns the waste hot water that has passed through the waste heat utilization device to the waste heat source, a second waste hot water flow control valve arranged on the second waste hot water supply line, a second waste hot water return temperature measuring device that measures the temperature of the waste hot water flowing through the second waste hot water return line, and a control device that controls the operation of the second waste hot water flow control valve, and the control device is configured to control the operation of the second waste hot water flow control valve based on the temperature of the waste hot water flowing through the second waste hot water return line. According to the present invention, the waste hot water generated by the waste heat source is utilized not only in the absorption chiller but also in the waste heat utilization device, so that the waste heat can be utilized without waste. In one embodiment, the exhaust heat utilization device is a heating unit that heats the second circulating fluid that has passed through the treatment chamber. According to the present invention, the waste hot water generated by the waste heat source is utilized not only for the absorption chiller but also for the heating unit, so that the waste heat can be utilized without waste. In one embodiment, the waste heat utilization device is a cooling tower for releasing heat from the waste hot water. According to the present invention, the temperature of the waste hot water flowing through the waste hot water return line can be sufficiently lowered by dissipating heat from the waste hot water generated by the waste heat source in the cooling tower.

[0010] In one embodiment, the cooling system further includes a waste heat utilization device that uses the waste hot water as a heat source, a second waste hot water supply line that supplies the waste hot water from the waste heat source to the waste heat utilization device, a second waste hot water return line that returns the waste hot water that has passed through the waste heat utilization device to the waste heat source, a second waste hot water flow control valve arranged on the second waste hot water supply line, a second waste hot water return temperature measuring device that measures the temperature of the waste hot water flowing through the second waste hot water return line, and a control device that controls the operation of the second waste hot water flow control valve, wherein the waste heat utilization device is at least one of a hot water demand device that uses the waste hot water, a heating unit that heats the second circulating liquid that has passed through the treatment chamber, and a cooling tower for releasing heat of the waste hot water, and the control device is configured to control the operation of the second waste hot water flow control valve based on the temperature of the waste hot water flowing through the second waste hot water return line. According to the present invention, the flow rate of the exhaust hot water supplied to the exhaust heat utilization device can be adjusted based on the temperature of the exhaust hot water returned from the exhaust heat utilization device. In one embodiment, the exhaust heat utilization device is a plurality of exhaust heat utilization devices, and the control device is configured to control the operation of the second exhaust hot water flow control valve based on a set value related to the temperature of the exhaust hot water flowing through the second exhaust hot water return line and the demand for the exhaust hot water between the plurality of exhaust heat utilization devices. According to the present invention, the flow rate of the exhaust hot water supplied to the exhaust heat utilization device can be adjusted based on the temperature of the exhaust hot water returned from the exhaust heat utilization device and the set value related to the demand for the exhaust hot water among the multiple exhaust heat utilization devices. By controlling the operation of the second exhaust hot water flow control valve based on the set value related to the demand for the exhaust hot water in the exhaust heat utilization device, the optimal supply destination of the exhaust hot water can be selected according to the demand of the user and the priority of use.

[0011] In one aspect, the cooling system further includes a second cooling source that generates a second cooling liquid, and the cooling unit is configured to cool the first circulating liquid using at least one of the first cooling liquid and the second cooling liquid as a cooling source. According to the present invention, by using the second cooling liquid generated by the second cooling source in addition to the first cooling liquid generated by the absorption chiller, the cooling unit can stably cool the first circulating liquid. In one embodiment, the cooling system further includes a second coolant supply line that supplies the second coolant from the second cooling source to the cooling unit, a second coolant return line that branches off from the first coolant return line and returns the second coolant that has passed through the cooling unit to the second cooling source, a first coolant temperature measuring device that measures the temperature of the first coolant flowing through the first coolant supply line, a coolant return flow control valve arranged at a branch point of the first coolant return line and the second coolant return line, and a control device that controls the operation of the coolant return flow control valve based on the temperature of the first coolant flowing through the first coolant supply line. According to the present invention, the flow rate of the second cooling liquid generated by the second cooling source can be adjusted based on the temperature of the first cooling liquid generated by the absorption chiller.

[0012] In one embodiment, the exhaust heat source includes a main exhaust heat source group including at least one of the vacuum pump and the abatement device, and a secondary exhaust heat source group including the heating unit, the first exhaust hot water supply line includes a main exhaust hot water supply line that supplies the exhaust hot water generated by the main exhaust heat source group to the absorption chiller, and a secondary exhaust hot water supply line that supplies the exhaust hot water generated by the secondary exhaust heat source group to the absorption chiller, and the cooling system further includes a secondary exhaust hot water temperature measuring device that measures the temperature of the exhaust hot water generated by the secondary exhaust heat source group, a secondary exhaust hot water flow control valve arranged on the secondary exhaust hot water supply line, and a control device that opens the secondary exhaust hot water flow control valve when the temperature of the exhaust hot water generated by the secondary exhaust heat source group is higher than a predetermined threshold value. According to the present invention, when the temperature of the waste hot water generated by the auxiliary exhaust heat source group is higher than a predetermined threshold value, waste hot water is also supplied from the auxiliary exhaust heat source group to the absorption chiller, thereby raising the temperature of the waste hot water used as a heat source in the absorption chiller, and efficiently generating the first coolant.

[0013] In one aspect, a semiconductor manufacturing system is provided, comprising: a semiconductor manufacturing apparatus having a processing chamber for performing a semiconductor manufacturing process; and a cooling system for cooling the processing chamber, the cooling system comprising: a waste heat source for generating waste hot water; an absorption chiller for generating a first cooling liquid using the waste hot water as a heat source; a cooling unit for cooling the first circulating liquid that has passed through the processing chamber using the first cooling liquid as a cooling source; and a heating unit for heating the second circulating liquid that has passed through the processing chamber. According to the present invention, a semiconductor manufacturing system is provided with a cooling system that uses an absorption chiller that uses waste hot water as a heat source to generate a first cooling liquid, instead of or in addition to a chiller (e.g., a compression chiller) that is conventionally used as a cooling source, thereby reducing the power consumption of the entire cooling system.

[0014] In one aspect, a cooling method for cooling a processing chamber used in semiconductor manufacturing equipment is provided, the cooling method including generating waste hot water by an exhaust heat source, using the waste hot water as a heat source by an absorption chiller to generate a first cooling liquid, returning the waste hot water that has passed through the absorption chiller to the exhaust heat source, and using the first cooling liquid as a cooling source by a cooling unit to cool a first circulating liquid that has passed through the processing chamber. According to the present invention, the absorption chiller can use waste hot water as a heat source to generate a first cooling liquid used as a cooling source in the cooling unit. By using the absorption chiller instead of or in addition to a chiller (e.g., a compression chiller) used as a conventional cooling source, the power consumption of the entire cooling system can be reduced. In one embodiment, the temperature of the waste hot water having passed through the absorption chiller is within a range of 70°C to 90°C. According to the present invention, by returning the waste hot water in the above temperature range to the waste heat source, the waste heat source can generate waste hot water at a temperature that can be used as a heat source in the absorption chiller. Effect of the Invention

[0015] According to the present invention, the absorption chiller can generate a cooling liquid by effectively utilizing the waste hot water generated in the cooling system as a heat source. By using the absorption chiller instead of or in addition to a chiller (e.g., a compression chiller) that is conventionally used as a cooling source, the power consumption of the entire cooling system can be reduced. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic diagram illustrating an embodiment of a semiconductor manufacturing system including a cooling system. [Diagram 2] FIG. 1 is a schematic diagram illustrating an embodiment of a cooling system. [Diagram 3] FIG. 1 is a schematic diagram showing an embodiment of an absorption refrigerator. [Figure 4] FIG. 13 is a schematic diagram illustrating another embodiment of the cooling system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing one embodiment of a semiconductor manufacturing system including a cooling system 5. The semiconductor manufacturing system includes a semiconductor manufacturing apparatus 1 having a plurality of processing chambers 2 for performing a semiconductor manufacturing process, and a cooling system 5 for cooling the plurality of processing chambers 2. The semiconductor manufacturing apparatus 1 is disposed in a clean room. The semiconductor manufacturing apparatus 1 of this embodiment is an etching apparatus for performing an etching process. The cooling system 5 is connected to the plurality of processing chambers 2, and a first circulating liquid and a second circulating liquid circulate between the plurality of processing chambers 2 and the cooling system 5.

[0018] The cooling system 5 includes a vacuum pump 6 for exhausting a processing gas (e.g., an etching gas) from the processing chamber 2, a cooling unit 7 for cooling the first circulating liquid that has passed through the processing chamber 2, a heating unit 8 for heating the second circulating liquid that has passed through the processing chamber 2, a detoxification device 10 for detoxifying the processing gas discharged from the vacuum pump 6, an absorption refrigerator 15 for generating a first cooling liquid, and a second cooling source 16 for generating a second cooling liquid. At least one of the first cooling liquid generated by the absorption refrigerator 15 and the second cooling liquid generated by the second cooling source 16 is supplied to the cooling unit 7 and used as a cooling source for cooling the first circulating liquid.

[0019] In the embodiment shown in FIG. 1, a plurality of vacuum pumps 6, a plurality of cooling units 7, and a plurality of heating units 8 connected to a plurality of processing chambers 2 are provided, whereas only one abatement device 10 is provided. In one embodiment, a plurality of abatement devices 10 may be provided. The number of processing chambers 2, the number of vacuum pumps 6, the number of cooling units 7, and the number of heating units 8 are not limited to the embodiment shown in FIG. 1. In the embodiment described below, for the sake of simplicity of description, the cooling system 5 includes one vacuum pump 6, one cooling unit 7, and one heating unit 8 connected to one processing chamber 2, but the configuration of the cooling system 5, particularly the number of vacuum pumps 6, the number of cooling units 7, and the number of heating units 8, are not limited to the embodiment described below. The cooling system 5 described below may be applied to a semiconductor manufacturing apparatus 1 having a single processing chamber 2.

[0020] Fig. 2 is a schematic diagram showing one embodiment of the cooling system 5. As shown in Fig. 2, the cooling system 5 includes a vacuum pump 6 for exhausting the processing gas from the processing chamber 2, a cooling unit 7 for cooling the first circulating liquid that has passed through the processing chamber 2, a heating unit 8 for heating the second circulating liquid that has passed through the processing chamber 2, a detoxification device 10 for detoxifying the processing gas discharged from the vacuum pump 6, an absorption refrigerator 15 for generating the first cooling liquid, and a second cooling source 16 for generating the second cooling liquid. The vacuum pump 6, the cooling unit 7, and the heating unit 8 are connected to the processing chamber 2.

[0021] An intake port (not shown) of the vacuum pump 6 is connected to the processing chamber 2, and an exhaust port (not shown) of the vacuum pump 6 is connected to an abatement device 10. An example of the vacuum pump 6 is a positive displacement dry vacuum pump. Examples of the abatement device 10 include a wet abatement device, a catalytic abatement device, a combustion abatement device, a heater abatement device, a plasma abatement device, and the like.

[0022] The absorption chiller 15 is configured to generate a first cooling liquid by using, as a heat source, waste hot water generated by the waste heat source of the cooling system 5. The waste heat source is at least one of the vacuum pump 6, the abatement device 10, and the heating unit 8. In this embodiment, the waste heat source of the cooling system 5 is the vacuum pump 6, and the vacuum pump 6 is configured to generate waste hot water.

[0023] As described later, the absorption chiller 15 can generate a first cooling liquid by using waste hot water as a heat source, and the generated first cooling liquid is used in the cooling unit 7. By using the absorption chiller 15 instead of or in addition to a chiller (e.g., a compression chiller) that is conventionally used as a cooling source, the power consumption of the entire cooling system 5 can be reduced.

[0024] The second cooling source 16 is configured to generate a second cooling liquid used as a cooling source in the cooling unit 7. Examples of the second cooling source 16 include refrigerators such as a turbo refrigerator, a screw refrigerator, and a positive displacement refrigerator. However, the second cooling source 16 is not limited to these and may be another cooling liquid supply source as long as it can generate the second cooling liquid. When the second cooling source 16 is a turbo refrigerator, the second cooling source 16 includes an evaporator (not shown) that evaporates a refrigerant liquid to generate refrigerant vapor, a compressor (not shown) that compresses the refrigerant vapor, and a condenser (not shown) that cools the compressed refrigerant vapor with cooling water to condense it. In such a turbo refrigerator, the refrigerant liquid is evaporated by the evaporator, and the second cooling liquid is generated by removing heat from the second cooling liquid.

[0025] At least one of the first cooling liquid produced by the absorption refrigerator 15 and the second cooling liquid produced by the second cooling source 16 is supplied to the cooling unit 7 and used as a cooling source for cooling the first circulating liquid. The first cooling liquid and the second cooling liquid are the same type of liquid, such as a fluorine-based inert liquid.

[0026] The cooling system 5 further includes a first waste hot water supply line 21 that supplies waste hot water from the waste heat source to the absorption chiller 15, and a first waste hot water return line 22 that returns the waste hot water that has passed through the absorption chiller 15 to the waste heat source. In this embodiment, the cooling system 5 further includes a first waste hot water supply line 21 that supplies waste hot water from the vacuum pump 6 as the waste heat source to the absorption chiller 15, and a first waste hot water return line 22 that returns the waste hot water that has passed through the absorption chiller 15 to the vacuum pump 6. The first waste hot water supply line 21 and the first waste hot water return line 22 extend from the vacuum pump 6 to the absorption chiller 15. The waste hot water generated by the vacuum pump 6 flows through the first waste hot water supply line 21 and is supplied to the absorption chiller 15. The waste hot water that has passed through the absorption chiller 15 flows through the first waste hot water return line 22 and is returned to the vacuum pump (waste heat source) 6.

[0027] The cooling system 5 further includes a first discharged hot water flow control valve 24 disposed in the first discharged hot water supply line 21, a first discharged hot water temperature measuring device 25 for measuring the temperature of the discharged hot water flowing through the first discharged hot water supply line 21, a first discharged hot water return temperature measuring device 26 for measuring the temperature of the discharged hot water flowing through the first discharged hot water return line 22, and a control device 100 for controlling the operation of the first discharged hot water flow control valve 24. The first discharged hot water flow control valve 24, the first discharged hot water temperature measuring device 25, and the first discharged hot water return temperature measuring device 26 are electrically connected to the control device 100. The temperature of the discharged hot water flowing through the first discharged hot water supply line 21 measured by the first discharged hot water temperature measuring device 25 and the temperature of the discharged hot water flowing through the first discharged hot water return line 22 measured by the first discharged hot water return temperature measuring device 26 are sent to the control device 100.

[0028] The control device 100 includes a storage device 100a in which a program is stored, and an arithmetic device 100b that executes arithmetic operations according to instructions included in the program. The control device 100 is composed of at least one computer. The storage device 100a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic device 100b include a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). However, the specific configuration of the control device 100 is not limited to these examples.

[0029] By receiving the relatively high-temperature waste hot water from the first waste hot water return line 22, the vacuum pump 6 can generate waste hot water at a temperature that can be used as a heat source in the absorption chiller 15. More specifically, the vacuum pump 6 heats the relatively high-temperature waste hot water returned from the first waste hot water return line 22 by internal heat exchange, and generates waste hot water at a temperature that can be used as a heat source in a regenerator 61 (described later) of the absorption chiller 15. The temperature of the waste hot water flowing through the first waste hot water supply line 21 is higher than the temperature of the waste hot water flowing through the first waste hot water return line 22.

[0030] In one embodiment, when the boiling point of the waste hot water is 100°C, the maximum temperature of the waste hot water at the inlet of the regenerator 61 of the absorption chiller 15 is set to 95°C for safety reasons. In one embodiment, the temperature difference between the waste hot water at the inlet and outlet of the regenerator 61 is a maximum of 10°C due to the design of the absorption chiller 15. Therefore, when the temperature of the waste hot water at the inlet of the regenerator 61 is 95°C, the minimum temperature of the waste hot water at the outlet of the regenerator 61 is 85°C. In another embodiment, the temperature difference between the waste hot water at the inlet and outlet of the regenerator 61 is 5°C, and the temperature of the waste hot water at the outlet of the regenerator 61 is 90°C. In one embodiment, the temperature of the waste hot water flowing through the first waste hot water return line 22 is within a range of 70°C to 90°C, and the temperature of the waste hot water flowing through the first waste hot water supply line 21 generated by the vacuum pump (waste heat source) 6 is within a range of 75°C to 95°C. This is because if the temperature of the waste hot water at the outlet of the regenerator 61 is lower than 70°C, the heat transfer efficiency of the waste hot water pipe 68 of the regenerator 61, which will be described later, will deteriorate, making it necessary to increase the surface area of ​​the waste hot water pipe 68, and as a result, the absorption chiller 15 will become larger.

[0031] The vacuum pump 6 has a heat-resistant structure that allows relatively high-temperature exhaust hot water to flow inside the vacuum pump 6. An example of the heat-resistant structure is that a seal member (e.g., an O-ring) used in a cooling water flow path (not shown) of the vacuum pump 6 is made of a heat-resistant material.

[0032] The control device 100 is configured to adjust the temperature of the waste hot water flowing through the first waste hot water return line 22 to a predetermined temperature by controlling the operation of the first waste hot water flow control valve 24. For example, the control device 100 may be configured to operate the first waste hot water flow control valve 24 to reduce the flow rate of the waste hot water flowing through the first waste hot water supply line 21 when the temperature of the waste hot water measured by the first waste hot water return temperature measuring device 26 is lower than a predetermined temperature. When the flow rate of the waste hot water flowing through the first waste hot water supply line 21 decreases, the flow rate of the waste hot water returned from the absorption chiller 15 to the vacuum pump 6 also decreases, and the temperature of the waste hot water generated by the vacuum pump 6 increases. Therefore, the temperature of the waste hot water passing through the absorption chiller 15 and flowing through the first waste hot water return line 22 also increases.

[0033] The control device 100 may be configured to operate the first discharged hot water flow control valve 24 to increase the flow rate of the discharged hot water flowing through the first discharged hot water supply line 21 when the temperature of the discharged hot water measured by the first discharged hot water return temperature measuring device 26 is higher than a predetermined temperature. When the flow rate of the discharged hot water flowing through the first discharged hot water supply line 21 increases, the flow rate of the discharged hot water returned from the absorption chiller 15 to the vacuum pump 6 also increases, and the temperature of the discharged hot water generated by the vacuum pump 6 decreases. Therefore, the temperature of the discharged hot water passing through the absorption chiller 15 and flowing through the first discharged hot water return line 22 also decreases. In this way, the control device 100 can adjust the temperature of the discharged hot water flowing through the first discharged hot water return line 22 by controlling the operation of the first discharged hot water flow control valve 24.

[0034] The control device 100 may be provided independently inside or outside the cooling system 5, or may be incorporated into a device (e.g., the absorption chiller 15) constituting the cooling system 5. For example, a part of the control device 100 may be incorporated into the vacuum pump 6, and the first discharge hot water flow rate control valve 24 may be provided in the vacuum pump 6, and the operation of the first discharge hot water flow rate control valve 24 may be controlled by the control device incorporated into the vacuum pump 6.

[0035] The cooling system 5 may include a waste heat utilization device that utilizes waste hot water generated by a waste heat source (in this embodiment, the vacuum pump 6) as a heat source. The waste heat utilization device is at least one of a hot water demand device 12 that uses the waste hot water, a heating unit 8 that heats the second circulating liquid that has passed through the treatment chamber 2, and a cooling tower 18 for discharging heat of the waste hot water. In the embodiment shown in FIG. 2, the waste heat utilization device is the hot water demand device 12, the heating unit 8, and the cooling tower 18. An example of the hot water demand device 12 can be a heating device for heating liquid such as pure water used in the treatment chamber 2.

[0036] The cooling system 5 further includes second exhaust hot water supply lines 28, 30, 32 that supply exhaust hot water from the exhaust heat source to the exhaust heat utilization device, and second exhaust hot water return lines 29, 31, 33 that return the exhaust hot water that has passed through the exhaust heat utilization device to the exhaust heat source. In this embodiment, the cooling system 5 includes a second exhaust hot water supply line 28 that supplies exhaust hot water from the vacuum pump 6 as the exhaust heat source to the hot water demand device 12 as the exhaust heat utilization device, a second exhaust hot water return line 29 that returns the exhaust hot water that has passed through the hot water demand device 12 to the vacuum pump 6, a second exhaust hot water supply line 30 that supplies exhaust hot water from the vacuum pump 6 to the heating unit 8 as the exhaust heat utilization device, a second exhaust hot water return line 31 that returns the exhaust hot water that has passed through the heating unit 8 to the vacuum pump 6, a second exhaust hot water supply line 32 that supplies exhaust hot water from the vacuum pump 6 to the cooling tower 18 as the exhaust heat utilization device, and a second exhaust hot water return line 33 that returns the exhaust hot water that has passed through the cooling tower 18 to the vacuum pump 6.

[0037] According to this embodiment, the waste hot water generated by the waste heat source (vacuum pump 6 in this embodiment) is used not only in the absorption chiller 15 but also in at least one of the hot water demand device 12 and the heating unit 8, so that the waste heat can be used without waste. In addition, by dissipating heat from the waste hot water generated by the waste heat source (vacuum pump 6 in this embodiment) in the cooling tower 18, the temperature of the waste hot water flowing through the second waste hot water return line 33 is lowered, so that the temperature of the waste hot water flowing through the first waste hot water return line 22 where the second waste hot water return line 33 joins can be sufficiently lowered.

[0038] The second waste hot water supply lines 28, 30, 32 branch off from the first waste hot water supply line 21 and extend to the hot water demand device 12, the heating unit 8, and the cooling tower 18, respectively. The waste hot water flowing through the first waste hot water supply line 21 branches off from the first waste hot water supply line 21, flows through the second waste hot water supply lines 28, 30, 32, and is supplied to the hot water demand device 12, the heating unit 8, and the cooling tower 18, respectively.

[0039] The second waste hot water return lines 29, 31, 33 extend from the hot water demand device 12, the heating unit 8, and the cooling tower 18, respectively, and merge with the first waste hot water return line 22. The waste hot water that has passed through the hot water demand device 12, the heating unit 8, and the cooling tower 18, respectively, flows from the second waste hot water return lines 29, 31, 33 into the first waste hot water return line 22.

[0040] The cooling system 5 includes second discharged hot water flow control valves 35, 36, 37 arranged in the second discharged hot water supply lines 28, 30, 32, respectively, second discharged hot water return temperature measuring devices 38, 39, 40 for measuring the temperature of the discharged hot water flowing through the second discharged hot water return lines 29, 31, 33, respectively, and a control device 100 for controlling the operation of the second discharged hot water flow control valves 35, 36, 37. The control device 100 is electrically connected to the second discharged hot water flow control valves 35, 36, 37 and the second discharged hot water return temperature measuring devices 38, 39, 40. The measured values ​​of the temperature of the discharged hot water flowing through the second discharged hot water return lines 29, 31, 33 measured by the second discharged hot water return temperature measuring devices 38, 39, 40, respectively, are sent to the control device 100.

[0041] The control device 100 is configured to control the operation of the second discharged hot water flow control valves 35, 36, 37 based on the temperature of the discharged hot water flowing through the second discharged hot water return lines 29, 31, 33. Controlling the operation of the second discharged hot water flow control valves 35, 36, 37 includes increasing or decreasing the opening degree of the second discharged hot water flow control valves 35, 36, 37 and maintaining the opening degree. Decreasing the opening degree of the second discharged hot water flow control valves 35, 36, 37 includes completely closing the second discharged hot water flow control valves 35, 36, 37 (setting the opening degree to 0%). Similarly, increasing the opening degree of the second discharged hot water flow control valves 35, 36, 37 includes fully opening the second discharged hot water flow control valves 35, 36, 37 (setting the opening degree to 100%).

[0042] In one embodiment, the control device 100 may control the operation of the second exhaust hot water flow control valves 35, 36, 37 so as to increase the flow rate of exhaust hot water supplied to the exhaust heat utilization device corresponding to the second exhaust hot water return line 29, 31, 33 when the temperature of the exhaust hot water flowing through the second exhaust hot water return line 29, 31, 33 is lower than a predetermined temperature. Alternatively, the control device 100 may control the operation of the second exhaust hot water flow control valves 35, 36, 37 so as to reduce the flow rate of exhaust hot water supplied to the exhaust heat utilization device corresponding to the second exhaust hot water return line 29, 31, 33 or to stop the supply of exhaust hot water to the exhaust heat utilization device corresponding to the second exhaust hot water return line 29, 31, 33 when the temperature of the exhaust hot water flowing through the second exhaust hot water return line 29, 31, 33 is higher than a predetermined temperature. For example, when the temperature of the waste hot water flowing through the second waste hot water return line 29 is lower than a predetermined temperature, the control device 100 may control the operation of the second waste hot water flow control valve 35 to increase the flow rate of the waste hot water supplied to the hot water demand device 12 corresponding to the second waste hot water return line 29.

[0043] In one embodiment, the control device 100 is configured to control the operation of the second exhaust hot water flow control valves 35, 36, 37 based on the temperature of the exhaust hot water flowing through the second exhaust hot water return lines 29, 31, 33 and a set value related to the demand for the exhaust hot water among the plurality of exhaust heat utilization devices (in this embodiment, the hot water demand device 12, the heating unit 8, and the cooling tower 18). In this case, the control device 100 includes an input device (not shown), and the set value related to the demand for the exhaust hot water among the plurality of exhaust heat utilization devices (in this embodiment, the hot water demand device 12, the heating unit 8, and the cooling tower 18) may be input to the control device 100 via the input device. Alternatively, the control device 100 may be configured to receive an input signal by wireless communication or wired communication, etc., and to input the set value related to the demand for the exhaust hot water among the plurality of exhaust heat utilization devices (in this embodiment, the hot water demand device 12, the heating unit 8, and the cooling tower 18).

[0044] In one embodiment, a value indicating that the demand for waste hot water between the multiple waste heat utilization devices is "valid" or "invalid" may be used as a setting value related to the demand for waste hot water between the multiple waste heat utilization devices input to the control device 100. For example, when waste hot water is supplied to the hot water demand device 12 and the cooling tower 18 and not supplied to the heating unit 8 based on the demand of the user, a value indicating that the demand for waste hot water at the hot water demand device 12 and the cooling tower 18 is "valid" and a value indicating that the demand for waste hot water at the heating unit 8 is "invalid" may be used as a setting value related to the demand for waste hot water input to the control device 100.

[0045] In this example, the control device 100 controls the operation of the second discharged hot water flow control valves 35, 37 based on the temperature of the discharged hot water flowing through the second discharged hot water return lines 29, 33 for the hot water demanding device 12 and the cooling tower 18, which are values ​​indicating that the set value related to the demand for discharged hot water is "valid." For example, when the temperature of the discharged hot water flowing through the second discharged hot water return line 29 is higher than a predetermined temperature, the control device 100 may control the operation of the second discharged hot water flow control valve 35 to maintain the flow rate of the discharged hot water supplied to the hot water demanding device 12 (the opening degree of the second discharged hot water flow control valve 35), and control the operation of the second discharged hot water flow control valve 37 to increase the flow rate of the discharged hot water supplied to the cooling tower 18 (increase the opening degree of the second discharged hot water flow control valve 37). As in the above example, the control device 100 may control the operation of the second exhaust hot water flow control valve (in this example, the second exhaust hot water flow control valves 35, 37) based on the temperature of the exhaust hot water flowing through a second exhaust hot water return line (in this example, the second exhaust hot water return line 29 corresponding to the hot water demand device 12) corresponding to at least one of the exhaust heat utilization devices (in this example, the hot water demand device 12 and the cooling tower 18) for which the setting value related to the demand for exhaust hot water is a value indicating "valid."

[0046] In one embodiment, the ratio of the demand for waste hot water between the multiple waste heat utilization devices may be used as a setting value related to the demand for waste hot water between the multiple waste heat utilization devices input to the control device 100. For example, when the ratio of the demand for waste hot water of the hot water demand device 12 and the cooling tower 18 is 50% and the ratio of the demand for waste hot water of the heating unit 8 is 0% based on the demand of the user, the control device 100 may control the operation of the second waste hot water flow control valves 35, 36, 37 so that the flow rate of the waste hot water supplied to the hot water demand device 12 is 50%, the flow rate of the waste hot water supplied to the cooling tower 18 is 50%, and the flow rate of the waste hot water supplied to the heating unit 8 is 0% relative to the flow rate of the waste hot water flowing through the first waste hot water supply line 21.

[0047] According to this embodiment, the flow rate of the exhaust hot water supplied to the exhaust heat utilization device (in this embodiment, the hot water demand device 12, the heating unit 8, and the cooling tower 18) can be adjusted based on the temperature of the exhaust hot water returned from the exhaust heat utilization device (in this embodiment, the hot water demand device 12, the heating unit 8, and the cooling tower 18) and the setting value (user demand and use priority) related to the demand for the exhaust hot water among the multiple exhaust heat utilization devices (in this embodiment, the hot water demand device 12, the heating unit 8, and the cooling tower 18) input to the control device 100. By controlling the operation of the second exhaust hot water flow control valve based on the setting value related to the demand for the exhaust hot water among the multiple exhaust heat utilization devices, the optimal supply destination of the exhaust hot water can be selected according to the user demand and use priority.

[0048] The cooling system 5 further includes a first coolant supply line 41 that supplies the first coolant from the absorption chiller 15 to the cooling unit 7, and a first coolant return line 42 that returns the first coolant that has passed through the cooling unit 7 to the absorption chiller 15. The first coolant supply line 41 and the first coolant return line 42 extend from the absorption chiller 15 to the cooling unit 7. The first coolant produced by the absorption chiller 15 flows through the first coolant supply line 41 and is supplied to the cooling unit 7. The first coolant that has passed through the cooling unit 7 flows through the first coolant return line 42 and is returned to the absorption chiller 15.

[0049] The cooling system 5 further includes a second coolant supply line 43 that supplies the second coolant from the second cooling source 16 to the cooling unit 7, and a second coolant return line 44 that branches off from the first coolant return line 42 and returns the second coolant that has passed through the cooling unit 7 to the second cooling source 16. The second coolant supply line 43 extends from the second cooling source 16 and merges with the first coolant supply line 41. The second coolant flowing through the second coolant supply line 43 flows into the first coolant supply line 41 and is supplied to the cooling unit 7.

[0050] The second coolant return line 44 branches off from the first coolant return line 42 and extends to the second cooling source 16. The second coolant that has passed through the cooling unit 7 branches off from the first coolant return line 42, flows through the second coolant return line 44, and is returned to the second cooling source 16. The cooling system 5 includes a coolant return flow rate control valve 46 that is disposed at the branch point of the first coolant return line 42 and the second coolant return line 44. A three-way valve can be used as the coolant return flow rate control valve 46.

[0051] When the coolant return flow control valve 46 operates to communicate the cooling unit 7 and the absorption chiller 15 through the first coolant return line 42 and to communicate the cooling unit 7 and the second cooling source 16 through the second coolant return line 44, the first coolant returned to the absorption chiller 15 is cooled in the absorption chiller 15 (the first coolant is generated), and the cooled (generated) first coolant flows through the first coolant supply line 41. The second coolant returned to the second cooling source 16 is cooled in the second cooling source 16 (the second coolant is generated), and the cooled (generated) second coolant flows through the second coolant supply line 43. The second coolant flows from the second coolant supply line 43 into the first coolant supply line 41 through which the first coolant flows, and a mixed coolant of the first coolant and the second coolant is supplied to the cooling unit 7. The mixed cooling liquid that has passed through the cooling unit 7 flows through the first cooling liquid return line 42 and is returned to the absorption refrigerator 15 as the first cooling liquid, and flows through the second cooling liquid return line 44 and is returned to the second cooling source 16 as the second cooling liquid.

[0052] When the coolant return flow rate control valve 46 operates to communicate the cooling unit 7 and the absorption chiller 15 through the first coolant return line 42 and not to communicate the cooling unit 7 and the second cooling source 16 through the second coolant return line 44, the second coolant is not returned to the second cooling source 16, and therefore the second coolant is not produced in the second cooling source 16. Therefore, only the first coolant produced in the absorption chiller 15 flows through the first coolant supply line 41, and only the first coolant is supplied to the cooling unit 7.

[0053] When the coolant return flow rate control valve 46 operates to communicate the cooling unit 7 and the second cooling source 16 through the second coolant return line 44 and not to communicate the cooling unit 7 and the absorption chiller 15 through the first coolant return line 42, the first coolant is not returned to the absorption chiller 15, and therefore the first coolant is not produced in the absorption chiller 15. Therefore, only the second coolant produced in the second cooling source 16 flows into the first coolant supply line 41 from the second coolant supply line 43, and only the second coolant is supplied to the cooling unit 7.

[0054] According to this embodiment, by using the second cooling liquid generated by the second cooling source 16 in addition to the first cooling liquid generated by the absorption chiller 15, the cooling unit 7 can stably cool the first circulating liquid.

[0055] The cooling system 5 further includes a first coolant temperature measuring device 47 that measures the temperature of the first coolant flowing through the first coolant supply line 41. The coolant return flow control valve 46 and the first coolant temperature measuring device 47 are electrically connected to the control device 100. The measured value of the temperature of the first coolant flowing through the first coolant supply line 41 measured by the first coolant temperature measuring device 47 is sent to the control device 100. The control device 100 is configured to control the operation of the coolant return flow control valve 46 based on the temperature of the first coolant flowing through the first coolant supply line 41. For example, when the temperature of the first coolant flowing through the first coolant supply line 41 is higher than a target temperature, the control device 100 may issue a command to the coolant return flow control valve 46 to communicate the cooling unit 7 with the second cooling source 16 through the second coolant return line 44, thereby increasing the flow rate of the second coolant generated by the second cooling source 16 supplied to the cooling unit 7.

[0056] The flow rate of the first coolant flowing through the first coolant supply line 41 and the first coolant return line 42, and the flow rate of the second coolant flowing through the second coolant supply line 43 and the second coolant return line 44 can be adjusted by the coolant return flow control valve 46. When the flow rate of the second coolant from the first coolant return line 42 to the second coolant return line 44 is increased by operating the coolant return flow control valve 46, the flow rate of the first coolant flowing through the first coolant supply line 41 and the first coolant return line 42 decreases, and the flow rate of the second coolant flowing through the second coolant supply line 43 and the second coolant return line 44 increases. When the coolant return flow control valve 46 is operated to reduce the flow rate of the second coolant from the first coolant return line 42 to the second coolant return line 44, the flow rate of the first coolant flowing through the first coolant supply line 41 and the first coolant return line 42 increases, and the flow rate of the second coolant flowing through the second coolant supply line 43 and the second coolant return line 44 decreases.

[0057] Operating the coolant return flow control valve 46 to reduce the flow rate of the second coolant from the first coolant return line 42 to the second coolant return line 44 includes reducing the flow rate of the second coolant from the first coolant return line 42 to the second coolant return line 44 to zero. In this case, the flow rate of the second coolant flowing through the second coolant supply line 43 and the second coolant return line 44 is zero.

[0058] According to this embodiment, the flow rate of the second cooling liquid generated by the second cooling source 16 can be adjusted based on the temperature of the first cooling liquid generated by the absorption refrigerator 15.

[0059] The cooling system 5 includes a cooling tower 18 that generates cooling water to be supplied to the absorption chiller 15 and the second cooling source 16, a cooling water supply line 50 that supplies cooling water from the cooling tower 18 to the absorption chiller 15, a cooling water return line 51 that returns the cooling water that has passed through the absorption chiller 15 to the cooling tower 18, a cooling water supply line 52 that supplies cooling water from the cooling tower 18 to the second cooling source 16, and a cooling water return line 53 that returns the cooling water that has passed through the second cooling source 16 to the cooling tower 18. In this embodiment, the cooling tower that generates cooling water to be supplied to the absorption chiller 15, the cooling tower that generates cooling water to be supplied to the second cooling source 16, and the cooling tower that releases heat of the waste hot water as the above-mentioned exhaust heat utilization device are shared, but in one embodiment, some or all of the cooling tower that generates cooling water to be supplied to the absorption chiller 15, the cooling tower that generates cooling water to be supplied to the second cooling source 16, and the cooling tower that releases heat of the waste hot water as the above-mentioned exhaust heat utilization device may be provided separately.

[0060] The cooling water supply line 50 and the cooling water return line 51 extend from the cooling tower 18 to the absorption chiller 15, and the cooling water supply line 52 and the cooling water return line 53 extend from the cooling tower 18 to the second cooling source 16. The cooling water generated by the cooling tower 18 flows through the cooling water supply line 50 and is supplied to the absorption chiller 15. The cooling water that has passed through the absorption chiller 15 flows through the cooling water return line 51 and is returned to the cooling tower 18.

[0061] The cooling water generated by the cooling tower 18 flows through the cooling water supply line 52 and is supplied to the second cooling source 16. The cooling water that has passed through the second cooling source 16 flows through the cooling water return line 53 and is returned to the cooling tower 18. More specifically, when the second cooling source 16 is a turbo chiller, for example, the cooling water supply line 52 and the cooling water return line 53 are connected to a condenser (not shown) of the turbo chiller, and the cooling water generated by the cooling tower 18 flows through the cooling water supply line 52 and is supplied to the condenser. The cooling water that has passed through the condenser of the second cooling source 16 flows through the cooling water return line 53 and is returned to the cooling tower 18.

[0062] The cooling unit 7 is a refrigerator (for example, a vapor compression refrigerator). Specifically, the cooling unit 7 includes an evaporator 55A that evaporates a refrigerant liquid to generate a refrigerant gas, a compressor 55B that compresses the refrigerant gas, a condenser 55C that condenses the compressed refrigerant gas to generate a refrigerant liquid, and an expansion valve 55D disposed between the evaporator 55A and the condenser 55C. The refrigerant circulates through the evaporator 55A, the compressor 55B, the condenser 55C, and the expansion valve 55D through a refrigerant pipe 55E. The treatment chamber 2 is connected to the evaporator 55A, and a first circulating liquid circulates between the treatment chamber 2 and the evaporator 55A.

[0063] The first coolant supply line 41 and the first coolant return line 42 are connected to the condenser 55C. The first coolant supplied from the absorption refrigerator 15 and the second coolant supplied from at least one of the second cooling source 16 are guided through the first coolant supply line 41 into the condenser 55C, and exchange heat with the refrigerant gas in the condenser 55C. As a result of the heat exchange between at least one of the first coolant and the second coolant and the refrigerant gas, at least one of the first coolant and the second coolant is heated, while the refrigerant gas is cooled to become a refrigerant liquid. The refrigerant liquid is guided through the expansion valve 55D to the evaporator 55A. The first circulating liquid is guided to the evaporator 55A, and exchanges heat with the refrigerant liquid in the evaporator 55A. As a result of the heat exchange between the first circulating liquid and the refrigerant liquid, the first circulating liquid is cooled, while the refrigerant liquid is heated to become a refrigerant gas. The refrigerant gas is sucked into the compressor 55B and compressed by the compressor 55B. The compressed refrigerant gas is guided to the condenser 55 C. In this manner, the first circulating liquid is cooled by at least one of the first cooling liquid and the second cooling liquid via the refrigerant.

[0064] The first circulating liquid cooled by the cooling unit 7 flows through a flow path (not shown) formed in the processing chamber 2, and cools the processing chamber 2. The first circulating liquid that has passed through the processing chamber 2 is heated by the heat of the processing chamber 2, and is returned to the cooling unit 7. The heated first circulating liquid is cooled by the cooling unit 7. In this way, the first circulating liquid circulates between the processing chamber 2 and the cooling unit 7, and cools the processing chamber 2.

[0065] The heating unit 8 of this embodiment includes a heating device 58 that heats the second circulating liquid. An electric heater or the like can be used as the heating device 58. The configuration of the heating device 58 is not particularly limited as long as it can heat the second circulating liquid. The second circulating liquid is guided to the heating device 58 and heated in the heating device 58. The second circulating liquid heated in the heating unit 8 flows through a flow path (not shown) formed in the processing chamber 2 to heat the processing chamber 2. The second circulating liquid that has passed through the processing chamber 2 is cooled by the processing chamber 2 and returned to the heating unit 8. The cooled second circulating liquid is heated by the heating unit 8. In this way, the second circulating liquid circulates between the processing chamber 2 and the heating unit 8 to heat the processing chamber 2.

[0066] Fig. 3 is a schematic diagram showing one embodiment of the absorption chiller 15. As shown in Fig. 3, the absorption chiller 15 includes a regenerator 61, a condenser 62, an evaporator 63, and an absorber 64. The absorption chiller 15 is configured to transfer heat by circulating a refrigerant with respect to a solution (absorption liquid) while undergoing a phase change, thereby generating a first cooling liquid as a cooling medium. In this embodiment, an aqueous LiBr solution is used as the solution, and water (H2O) is used as the refrigerant, but the present invention is not limited to these, and other combinations of refrigerants and solutions (absorption liquid) may be used.

[0067] A partition wall 66 is provided between the regenerator 61 and the condenser 62, and the condenser 62 and the regenerator 61 communicate with each other above the partition wall 66. In one embodiment, the regenerator 61 and the condenser 62 may both be formed in a single can body as a shell-and-tube type.

[0068] The regenerator 61 is configured to generate steam of the refrigerant contained in the diluted solution supplied from the absorber 64 by the heat of the waste hot water supplied through the first waste hot water supply line 21, thereby concentrating the solution. The regenerator 61 includes a waste hot water pipe 68 through which the waste hot water flows, and a diluted solution spray nozzle 69 that sprays the solution toward the waste hot water pipe 68. The regenerator 61 is connected to the first waste hot water supply line 21 and the first waste hot water return line 22. More specifically, one end of the waste hot water pipe 68 of the regenerator 61 is connected to the first waste hot water supply line 21, and the other end is connected to the first waste hot water return line 22. The waste hot water generated by the vacuum pump (waste heat source) 6 (see FIG. 2) flows through the waste hot water pipe 68 through the first waste hot water supply line 21 and is returned to the vacuum pump (waste heat source) 6 through the first waste hot water return line 22.

[0069] The drain hot water pipe 68 and the diluted solution spray nozzle 69 are disposed inside the regenerator 61, and the diluted solution spray nozzle 69 is disposed above the drain hot water pipe 68. The bottom of the regenerator 61 constitutes a regenerator storage section 70 that stores the concentrated solution. When the diluted solution is sprayed from the diluted solution spray nozzle 69, the refrigerant contained in the diluted solution evaporates due to the heat of the drain hot water flowing through the drain hot water pipe 68, and refrigerant vapor is generated. The refrigerant vapor generated in the regenerator 61 flows into the condenser 62 from above the partition wall 66. The solution with a high concentration due to the evaporation of the refrigerant is stored in the regenerator storage section 70. The regenerator storage section 70 is connected to a solution transfer pipe 71 that supplies the solution to the absorber 64. A solution pump 72 that pumps the solution to the absorber 64 is disposed in the solution transfer pipe 71.

[0070] The condenser 62 is configured to condense the refrigerant vapor that has flowed in from the regenerator 61. The condenser 62 is provided with a condenser cooling water pipe 74 through which cooling water flows. The condenser cooling water pipe 74 is disposed inside the condenser 62. One end of the condenser cooling water pipe 74 is connected to an absorber cooling water pipe 90 in the absorber 64 via a piping 78, and the other end is connected to a cooling water return line 51 (see FIG. 2). The cooling water that has flowed through the condenser cooling water pipe 74 is returned to the cooling tower 18 through the cooling water return line 51.

[0071] The refrigerant vapor flowing in from the regenerator 61 is condensed by being cooled by the cooling water flowing through the condenser cooling water pipe 74. The bottom of the condenser 62 constitutes a condenser reservoir 75 that stores the condensed refrigerant. The condenser reservoir 75 is connected to the evaporator 63 by a refrigerant supply pipe 76, and the refrigerant generated in the condenser 62 is supplied to the evaporator 63 through the refrigerant supply pipe 76.

[0072] A partition wall 80 is provided between the evaporator 63 and the absorber 64, and the evaporator 63 and the absorber 64 communicate with each other above the partition wall 80. In one embodiment, the evaporator 63 and the absorber 64 may both be formed in a single can body as a shell-and-tube type.

[0073] The evaporator 63 is configured to evaporate the refrigerant condensed in the condenser 62 to cool the first coolant. The evaporator 63 includes a first coolant pipe 82 through which the first coolant flows, and a refrigerant spray nozzle 83 that sprays the refrigerant toward the first coolant pipe 82. The evaporator 63 is connected to the first coolant supply line 41 and the first coolant return line 42. More specifically, one end of the first coolant pipe 82 of the evaporator 63 is connected to the first coolant supply line 41, and the other end is connected to the first coolant return line 42.

[0074] The first cooling liquid pipe 82 and the refrigerant spray nozzle 83 are disposed inside the evaporator 63, and the refrigerant spray nozzle 83 is disposed above the first cooling liquid pipe 82. The bottom of the evaporator 63 constitutes an evaporator reservoir 84 that stores the refrigerant supplied to the evaporator 63 through the refrigerant supply pipe 76. The evaporator reservoir 84 is connected to a refrigerant transfer pipe 85 that supplies the refrigerant to the refrigerant spray nozzle 83. A refrigerant pump 86 that pressure-feeds the refrigerant to the refrigerant spray nozzle 83 is disposed in the refrigerant transfer pipe 85.

[0075] As described later, the absorber 64 is configured to absorb the refrigerant vapor evaporated in the evaporator 63 with a solution. Since the absorber 64 and the evaporator 63 are in communication with each other, the pressure in the evaporator 63 is reduced by the refrigerant vapor being absorbed by the solution in the absorber 64. In a state in which the pressure in the evaporator 63 is reduced, the refrigerant sprayed from the refrigerant spray nozzle 83 evaporates. The refrigerant vapor evaporated in the evaporator 63 flows into the absorber 64 from above the partition wall 80. The refrigerant remaining in the evaporator 63 without evaporating is stored in the evaporator reservoir 84. The evaporator 63 is configured to cool the first cooling liquid flowing through the first cooling liquid pipe 82 by the heat of vaporization when the refrigerant evaporates. In this way, the absorption refrigerator 15 cools the first cooling liquid returned through the first cooling liquid return line 42 to generate the first cooling liquid.

[0076] The absorber 64 is equipped with an absorber cooling water pipe 90 through which cooling water flows, and a solution spray nozzle 91 that sprays a solution toward the absorber cooling water pipe 90. One end of the absorber cooling water pipe 90 is connected to the cooling water supply line 50 (see FIG. 2), and the other end is connected to the condenser cooling water pipe 74 of the condenser 62 via a pipe 78. The cooling water generated by the cooling tower 18 (see FIG. 2) flows through the absorber cooling water pipe 90 via the cooling water supply line 50, and then flows through the condenser cooling water pipe 74 via the pipe 78.

[0077] The absorber cooling water pipe 90 and the solution spray nozzle 91 are disposed inside the absorber 64, and the solution spray nozzle 91 is disposed above the absorber cooling water pipe 90. The solution spray nozzle 91 is configured to spray a relatively highly concentrated solution generated by the regenerator 61. The relatively highly concentrated solution sprayed from the solution spray nozzle 91 is diluted by absorbing the refrigerant vapor flowing in from the evaporator 63. The bottom of the absorber 64 constitutes an absorber storage section 92 that stores the diluted solution.

[0078] The cooling water flowing through the absorber cooling water pipe 90 has the function of removing heat generated when the solution absorbs the refrigerant vapor. The absorber storage section 92 is connected to a dilute solution transfer pipe 93 that supplies the diluted solution to the regenerator 61. The dilute solution transfer pipe 93 is connected to the dilute solution spray nozzle 69 of the regenerator 61. A dilute solution pump 94 is disposed in the dilute solution transfer pipe 93 to pump the diluted solution to the regenerator 61.

[0079] According to this embodiment, the waste hot water generated by the waste heat source (in this embodiment, the vacuum pump 6) can be used as a heat source for evaporating the refrigerant contained in the diluted solution in the regenerator 61 of the absorption chiller 15.

[0080] FIG. 4 is a schematic diagram showing another embodiment of the cooling system 5. The configuration and operation of this embodiment that are not particularly described are the same as those of the above-mentioned embodiment, so the overlapping description will be omitted. In one embodiment, the exhaust heat source of the cooling system 5 includes a main exhaust heat source group including at least one of the vacuum pump 6 and the abatement device 10, and a secondary exhaust heat source group including the heating unit 8. In this embodiment, the main exhaust heat source group includes the vacuum pump 6 and the abatement device 10, and the secondary exhaust heat source group includes the heating unit 8. The vacuum pump 6, the abatement device 10, and the heating unit 8 are configured to generate exhaust hot water.

[0081] In this embodiment, the first exhaust hot water supply line that supplies exhaust hot water from the exhaust heat source to the absorption chiller 15 includes main exhaust hot water supply lines 21A, 21B that supply the exhaust hot water generated by the main exhaust heat source group to the absorption chiller 15, and a sub-exhaust hot water supply line 21C that supplies the exhaust hot water generated by the sub-exhaust heat source group to the absorption chiller 15. Specifically, the first exhaust hot water supply line includes the main exhaust hot water supply line 21A and the main exhaust hot water supply line 21B that supply the exhaust hot water generated by the vacuum pump 6 and the abatement device 10, which are the main exhaust heat source group, to the absorption chiller 15, respectively, and the sub-exhaust hot water supply line 21C that supplies the exhaust hot water generated by the heating unit 8, which is the sub-exhaust heat source group, to the absorption chiller 15.

[0082] The main discharged hot water supply line 21B and the auxiliary discharged hot water supply line 21C extend from the detoxification device 10 and the heating unit 8, respectively, and merge into the main discharged hot water supply line 21A. The discharged hot water supplied from the detoxification device 10 and the heating unit 8 flows from the main discharged hot water supply line 21B and the auxiliary discharged hot water supply line 21C into the main discharged hot water supply line 21A.

[0083] The first exhaust hot water return line, which returns the exhaust hot water that has passed through the absorption chiller 15 to the exhaust heat source, includes a main exhaust hot water return line 22A, which returns the exhaust hot water that has passed through the absorption chiller 15 to the exhaust heat source of the main exhaust heat source group, and a sub-exhaust hot water return line 22B, which returns the exhaust hot water that has passed through the absorption chiller 15 to the exhaust heat source of the sub-exhaust heat source group. Specifically, the first exhaust hot water return line includes a main exhaust hot water return line 22A, which returns the exhaust hot water from the absorption chiller 15 to the vacuum pump 6, which is the main exhaust heat source group, and a sub-exhaust hot water return line 22B, which returns the exhaust hot water from the absorption chiller 15 to the heating unit 8, which is the sub-exhaust heat source group.

[0084] The auxiliary hot water discharge return line 22B branches off from the main hot water discharge return line 22A and extends to the heating unit 8. The hot water discharged through the absorption chiller 15 branches off from the main hot water discharge return line 22A, flows through the auxiliary hot water discharge return line 22B, and is returned to the heating unit 8.

[0085] The secondary hot water discharge supply line 21C and the secondary hot water discharge return line 22B are connected to the heating device 58 of the heating unit 8. The waste hot water returned from the secondary hot water discharge return line 22B is guided to the heating device 58 of the heating unit 8 and heated in the heating device 58. The waste hot water heated (generated) in the heating unit 8 flows through the secondary hot water discharge supply line 21C and is supplied to the absorption chiller 15.

[0086] The cooling system 5 further includes a sub-discharge hot water temperature measuring device 96 that measures the temperature of the discharged hot water generated by the sub-discharge heat source group (the heating unit 8 in this embodiment), and a sub-discharged hot water flow rate control valve 97 arranged in the sub-discharged hot water supply line 21C. In one embodiment, the sub-discharged hot water temperature measuring device 96 is arranged in a device included in the sub-discharge heat source group (in the heating unit 8 in this embodiment). The sub-discharged hot water temperature measuring device 96 and the sub-discharged hot water flow rate control valve 97 are electrically connected to the control device 100. The control device 100 is configured to open the sub-discharged hot water flow rate control valve 97 when the temperature of the discharged hot water generated by the sub-discharge heat source group (the heating unit 8 in this embodiment) is higher than a predetermined threshold value.

[0087] According to this embodiment, when the temperature of the waste hot water generated by the secondary exhaust heat source group (in this embodiment, the heating unit 8) is higher than a predetermined threshold value, waste hot water is also supplied from the secondary exhaust heat source group (in this embodiment, the heating unit 8) to the absorption chiller 15, thereby raising the temperature of the waste hot water used as a heat source in the absorption chiller 15 and efficiently generating the first coolant.

[0088] In one embodiment, the control device 100 may be configured to close the sub-discharge hot water flow control valve 97 when the temperature of the discharged hot water generated by the sub-discharge heat source group (the heating unit 8 in this embodiment) is lower than a predetermined threshold value. In another embodiment, the control device 100 may be configured to open the sub-discharged hot water flow control valve 97 when the temperature of the discharged hot water generated by the sub-discharge heat source group (the heating unit 8 in this embodiment) is higher than the temperature of the discharged hot water flowing through the first discharged hot water supply line 21 measured by the first discharged hot water temperature measuring device 25. Alternatively, the control device 100 may be configured to close the sub-discharged hot water flow control valve 97 when the temperature of the discharged hot water generated by the sub-discharge heat source group (the heating unit 8 in this embodiment) is lower than the temperature of the discharged hot water flowing through the first discharged hot water supply line 21 measured by the first discharged hot water temperature measuring device 25.

[0089] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0090] 1. Semiconductor manufacturing equipment 2 Processing chamber 5. Cooling System 6. Vacuum Pump 7 Cooling Unit 8 Heating Unit 10 Abatement equipment 12 Hot water demand equipment 15 Absorption Refrigeration Machine 16 Second cooling source 18 Cooling Tower 21 1st exhaust hot water supply line 21A, 21B Main hot water supply line 21C Secondary hot water supply line 22 No. 1 waste hot water return line 22A Main hot water return line 22B Secondary hot water return line 24 No. 1 waste hot water flow control valve 25 1st exhaust hot water temperature measuring device 26 1st exhaust hot water return temperature measuring device 28,30,32 2nd exhaust hot water supply line 29, 31, 33 Second waste hot water return line 35, 36, 37 Second waste hot water flow control valve 38,39,40 2nd exhaust hot water return temperature measuring device 41 First coolant supply line 42 First coolant return line 43 Second coolant supply line 44 Second coolant return line 46 Coolant return flow control valve 47 1st coolant temperature measuring device 50,52 Cooling water supply line 51,53 Cooling water return line 55A Evaporator 55B Compressor 55C Condenser 55D Expansion valve 55E Refrigerant piping 58 Heating device 61 Regenerator 62 Condenser 63 Evaporator 64 Absorber 66 Partition Wall 68 Exhaust hot water pipe 69 Dilute Solution Spray Nozzle 70 Regenerator storage section 71 Solution transfer tube 72 Solution Pump 74 Condenser cooling water pipe 75 Condenser reservoir 76 Refrigerant supply pipe 78 Piping 80 Partition Wall 82 First coolant pipe 83 Refrigerant Spray Nozzle 84 Evaporator reservoir 85 Refrigerant transfer pipe 86 Refrigerant Pump 90 Absorber cooling water pipe 91 Solution spray nozzle 92 Absorber storage section 93 Dilution solution transfer tube 94 Dilute Solution Pump 96 Sub-discharge hot water temperature measuring device 97 Auxiliary hot water discharge flow control valve 100 Control device 100a Storage device 100b arithmetic unit

Claims

1. A cooling system for cooling a processing chamber used in a semiconductor manufacturing device, comprising: A waste heat source for generating waste hot water; an absorption chiller that uses the waste hot water as a heat source to generate a first cooling liquid; a cooling unit that uses the first cooling liquid as a cooling source to cool the first circulating liquid that has passed through the processing chamber; a first waste hot water supply line for supplying the waste hot water from the waste heat source to the absorption chiller; a first waste hot water return line for returning the waste hot water that has passed through the absorption chiller to the waste heat source; a first coolant supply line that supplies the first coolant from the absorption refrigerator to the cooling unit; a first coolant return line for returning the first coolant that has passed through the cooling unit to the absorption chiller;

2. A first waste hot water flow rate control valve disposed in the first waste hot water supply line; a first waste hot water temperature measuring device that measures a temperature of the waste hot water flowing through the first waste hot water supply line; a first waste hot water return temperature measuring device that measures the temperature of the waste hot water flowing through the first waste hot water return line; A control device for controlling an operation of the first exhaust hot water flow rate control valve is further provided. The cooling system according to claim 1 , wherein the control device is configured to adjust a temperature of the waste hot water flowing through the first waste hot water return line to a predetermined temperature.

3. 2. The cooling system of claim 1, wherein the exhaust heat source is at least one of a vacuum pump that exhausts a processing gas from the processing chamber, a decontamination device that decontaminates the processing gas discharged from the vacuum pump, and a heating unit that heats a second circulating liquid that has passed through the processing chamber.

4. The absorption refrigerator comprises: a regenerator that generates refrigerant vapor by using heat of the waste hot water to concentrate the solution; a condenser for condensing the generated refrigerant vapor; an evaporator that evaporates the condensed refrigerant to cool the first cooling liquid; an absorber that absorbs the evaporated refrigerant vapor with the solution; The regenerator is connected to the first waste hot water supply line and the first waste hot water return line, The cooling system of claim 1 , wherein the evaporator is connected to the first coolant supply line and the first coolant return line.

5. The cooling system according to claim 1 , wherein the temperature of the waste hot water flowing through the first waste hot water return line is within a range of 70° C. to 90° C.

6. A waste heat utilization device that utilizes the waste hot water as a heat source; a second waste hot water supply line that supplies the waste hot water from the waste heat source to the waste heat utilization device; a second waste hot water return line that returns the waste hot water that has passed through the waste heat utilization device to the waste heat source; A second waste hot water flow rate control valve disposed in the second waste hot water supply line; A second waste hot water return temperature measuring device that measures the temperature of the waste hot water flowing through the second waste hot water return line; A control device for controlling the operation of the second exhaust hot water flow control valve is further provided. The cooling system according to claim 1 , wherein the control device is configured to control the operation of the second waste hot water flow control valve based on a temperature of the waste hot water flowing through the second waste hot water return line.

7. The cooling system according to claim 6 , wherein the exhaust heat recovery device is a heating unit that heats the second circulating fluid that has passed through the treatment chamber.

8. The cooling system according to claim 6 , wherein the exhaust heat utilization device is a cooling tower for dissipating heat of the exhaust hot water.

9. A waste heat utilization device that utilizes the waste hot water as a heat source; a second waste hot water supply line that supplies the waste hot water from the waste heat source to the waste heat utilization device; a second waste hot water return line that returns the waste hot water that has passed through the waste heat utilization device to the waste heat source; A second waste hot water flow rate control valve disposed in the second waste hot water supply line; A second waste hot water return temperature measuring device that measures the temperature of the waste hot water flowing through the second waste hot water return line; A control device for controlling the operation of the second exhaust hot water flow control valve is further provided. the waste heat utilization device is at least one of a hot water demand device that uses the waste hot water, a heating unit that heats the second circulating fluid that has passed through the treatment chamber, and a cooling tower that releases heat of the waste hot water; The cooling system according to claim 1 , wherein the control device is configured to control the operation of the second waste hot water flow control valve based on a temperature of the waste hot water flowing through the second waste hot water return line.

10. The exhaust heat utilization device is a plurality of exhaust heat utilization devices, The cooling system of claim 9, wherein the control device is configured to control the operation of the second exhaust hot water flow control valve based on a set value related to the temperature of the exhaust hot water flowing through the second exhaust hot water return line and the demand for the exhaust hot water between the multiple exhaust heat utilization devices.

11. a second cooling source generating a second cooling fluid; The cooling system of claim 1 , wherein the cooling unit is configured to cool the first circulating liquid using at least one of the first cooling liquid and the second cooling liquid as a cooling source.

12. a second cooling liquid supply line that supplies the second cooling liquid from the second cooling source to the cooling unit; a second coolant return line that branches off from the first coolant return line and returns the second coolant that has passed through the cooling unit to the second cooling source; a first coolant temperature measuring device for measuring a temperature of the first coolant flowing through the first coolant supply line; a coolant return flow control valve disposed at a branch point of the first coolant return line and the second coolant return line; The cooling system of claim 11 , further comprising a controller that controls operation of the coolant return flow control valve based on a temperature of the first coolant flowing through the first coolant supply line.

13. The exhaust heat source is a primary heat exhaust source group including at least one of the vacuum pump and the abatement device; a sub-exhaust heat source group including the heating unit; The first waste hot water supply line is a main waste hot water supply line that supplies the waste hot water generated by the main waste heat source group to the absorption chiller; a sub-waste hot water supply line that supplies the waste hot water generated by the sub-waste heat source group to the absorption chiller, The cooling system comprises: a sub-exhaust hot water temperature measuring device for measuring the temperature of the exhaust hot water generated by the sub-exhaust heat source group; A sub-discharge hot water flow rate control valve disposed in the sub-discharge hot water supply line; The cooling system of claim 3 , further comprising a controller that opens the auxiliary hot water discharge flow control valve when a temperature of the hot water discharged by the auxiliary heat source group is higher than a predetermined threshold value.

14. a semiconductor manufacturing apparatus having a processing chamber for performing a semiconductor manufacturing process; a cooling system for cooling the processing chamber; The cooling system comprises: A waste heat source for generating waste hot water; an absorption chiller that uses the waste hot water as a heat source to generate a first cooling liquid; a cooling unit that uses the first cooling liquid as a cooling source to cool the first circulating liquid that has passed through the processing chamber; A semiconductor manufacturing system comprising: a heating unit for heating the second circulating fluid that has passed through the processing chamber.

15. A method for cooling a process chamber used in a semiconductor manufacturing device, comprising the steps of: Generate hot waste water using a waste heat source, generating a first cooling liquid by using the waste hot water as a heat source in an absorption chiller; The waste hot water that has passed through the absorption chiller is returned to the waste heat source. A cooling method, comprising: a cooling unit for cooling a first circulating liquid that has passed through the processing chamber, the first cooling liquid being used as a cooling source.

16. The cooling method according to claim 15, wherein the temperature of the waste hot water having passed through the absorption chiller is within a range of 70°C to 90°C.

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