Circuit module

Abstract

To provide a circuit module capable of appropriately securing an insulation distance.SOLUTION: A circuit module 1 comprises: a cooling plate 60 in which a cooling fluid circulates; a depression plate 50 that depresses a first electronic component 90 to the cooling plate 60; and a circuit board 70 that is provided to the side opposite to the cooling plate 60 with reference to the depression plate 50, and to which a plurality of second electronic components 95 having different signal transmission paths are mounted. The depression plate 50 includes a plate main body 80 containing a plurality of depression parts 82 that depresses the first electronic component 90 from the side opposite to the cooling plate 60 in the first electronic component 90. An open region is provided to each depression part 82. In a plan view of the plate main body 80, each open region overlaps each of the second electronic components 95.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a circuit module having a pressing plate that presses an electronic component against a cooling plate. [Background technology]

[0002] Some electronic components generate heat when electricity is applied. Electronic components may also receive heat from the surroundings. However, such electronic components need to be used at or below a preset maximum operating temperature in order to maintain their electrical characteristics. Therefore, technologies for cooling electronic components have been studied (e.g., Patent Documents 1-3).

[0003] Patent Document 1 describes an electronic circuit component mounting structure. In this electronic circuit component mounting structure, a flat leaf spring is fastened and fixed by screws to the upper end faces of walls erected upward from both ends of a board on which electronic circuit components are mounted, and to the upper end face of a column erected upward in the center of the board. The leaf spring is provided with a claw-shaped pressing portion that presses the upper end face of the electronic circuit component toward the board (heat sink).

[0004] Patent Document 2 describes a fixing bracket. The fixing bracket is configured with a frame and a pressing part extending from the frame, and presses and fixes an electronic component against a heat sink. The pressing part has claws that are divided by notches formed from the tip on the electronic component side toward the frame side.

[0005] Patent Document 3 describes a fixing fixture. The fixing fixture has a base and side edges. A pressing portion is provided on the base. A notch is formed between two pressing portions that are spaced apart from each other. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2009-70999 A [Patent Document 2] Patent Publication No. 2021-28923 [Patent Document 3] JP 2015-118985 A Summary of the Invention [Problem to be solved by the invention]

[0007] For example, when mounted on a vehicle, a small size is desired from the viewpoint of mountability and weight reduction. Therefore, in vehicles, high-voltage system components are being integrated into one package. Examples of such components include power converters such as inverters, DC / DC converters, and chargers (OBC). In power converters, there is a tendency to increase the voltage value of the applied voltage in order to reduce power loss, and it is necessary to increase the insulation distance for electronic components (switching elements) used in the power converter. The techniques described in Patent Documents 1-3 do not disclose anything about the insulation distance between the fixing bracket, the electronic component pressed by the fixing bracket, and the component mounted on the board electrically connected to the electronic component, and there is room for improvement in constructing a circuit module that includes the fixing bracket, the electronic component, and the board.

[0008] Therefore, there is a demand for a circuit module that can ensure an insulation distance. [Means for solving the problem]

[0009] A characteristic configuration of the circuit module of the present invention includes a cooling plate through which a cooling fluid flows, a pressure plate that presses a first electronic component against the cooling plate, and a circuit board on the opposite side of the cooling plate with respect to the pressure plate, on which a plurality of second electronic components having different signal transmission paths are mounted, wherein the pressure plate has a plate body including a plurality of pressure portions that press the first electronic component from the side of the first electronic component opposite the cooling plate, each of the pressure portions having an opening area, and each of the opening areas overlaps with all of the second electronic components in a planar view of the plate body.

[0010] With this characteristic configuration, the first electronic component and the second electronic component are arranged with the opening area in the pressing plate sandwiched between them. Therefore, a gap can be provided between the first electronic component and the second electronic component, and this gap makes it possible to ensure an insulation distance. Furthermore, since the second electronic component entirely overlaps the opening area in a plan view of the plate body, the opening area can also ensure an insulation distance between the second electronic component and the plate body. Therefore, it is possible to ensure an insulation distance at low cost without using a dedicated member for ensuring the insulation distance. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a vertical cross-sectional view of the vehicle drive device. [Diagram 2] FIG. 2 is a side cross-sectional view of the circuit module. [Diagram 3] FIG. [Figure 4] 11A and 11B are diagrams illustrating a relationship between an opening area and a driver module. [Diagram 5] 13A and 13B are diagrams illustrating a relationship between an opening area and a driver module in another embodiment. [Figure 6] FIG. 11 is a side cross-sectional view of a circuit module according to another embodiment. [Figure 7] FIG. 11 is a side cross-sectional view of a circuit module according to another embodiment. [Figure 8] FIG. 11 is a side cross-sectional view of a circuit module according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The circuit module according to the present invention is configured to easily ensure the insulation distance of the components provided in the circuit module. The circuit module 1 of the present embodiment will be described below. However, the circuit module 1 is not limited to the following embodiment, and various modifications are possible without departing from the gist of the invention.

[0013] [Vehicle drive device] Fig. 1 is a vertical cross-sectional view of a vehicle drive device 100 in which a circuit module 1 is provided. In the drawings used in this embodiment, including Fig. 1, the direction along the axis of a motor shaft Ma described later is defined as the X direction, and the direction perpendicular to the X direction and in which a cooling plate 60 described later extends is defined as the Y direction. The direction perpendicular to both the X direction and the Y direction is defined as the Z direction.

[0014] The vehicle drive device 100 has a housing 100H, which has a first space 111, a second space 112, and a third space 113. The first space 111 houses a power conversion module PCM, the second space 112 houses a motor M driven by an inverter 3 of the power conversion module PCM, and the third space 113 houses a gear mechanism G that reduces the rotation of the motor M and outputs it.

[0015] The power conversion module PCM includes a power supply module 2, an inverter 3, and a control unit 4. The power supply module 2 includes an AC / DC conversion unit 10 and a converter 20. The converter 20 includes a first conversion unit 31, a second conversion unit 41, a third conversion unit (not shown), and a transformer T. The control unit 4 is constructed of hardware or software, or both, with a CPU as a core member, in order to perform processing related to the control of the power conversion module PCM. The AC / DC conversion unit 10, the first conversion unit 31, the second conversion unit 41, the third conversion unit, and the inverter 3 each have a switching element.

[0016] The switching elements of the AC / DC conversion unit 10 and the first conversion unit 31 are mounted on a first substrate SS1. The switching elements of the second conversion unit 41 are mounted on a second substrate SS2. The switching elements of the third conversion unit are mounted on a fourth substrate SS4. The switching elements of the inverter 3 are modularized and provided between the third substrate SS3 and the cooling plate 60 via the pressing plate 50.

[0017] The control unit 4 is mounted on a control board 4S. The control unit 4 drives each of the switching elements based on a control signal. Therefore, the control board 4S is connected to each of the first board SS1, the second board SS2, and the third board SS3 via a control line that transmits the control signal.

[0018] The first substrate SS1, the second substrate SS2, the third substrate SS3, and the control substrate 4S are accommodated in the first space 111 in a mutually parallel orientation. Here, the direction perpendicular to the plate surface of the first substrate SS1 is referred to as the "vertical direction." In addition, in FIG. 1, the direction in which the control substrate 4S is viewed from the first substrate SS1, the second substrate SS2, and the third substrate SS3 along the vertical direction is referred to as the "upper direction," "upper side," etc., and the direction in which the first substrate SS1, the second substrate SS2, and the third substrate SS3 are viewed from the control substrate 4S is referred to as the "lower direction," "lower side," etc.

[0019] The opening Ha is closed by a lid 114, and the first space 111 is a closed space. The second space 112 is a closed space, with the motor M housed therein from the side and closed by a motor cover 115 fastened with bolts 115A. Motor shafts Ma extend from the motor M on both sides along the rotation axis, and one of the motor shafts Ma penetrates the motor cover 115 and is exposed to the outside of the housing 100H.

[0020] The other motor shaft Ma penetrates into the third space 113. The third space 113 is a closed space in which a gear mechanism G is housed from the side and closed by a gear cover 116 fastened with bolts 116A. The other motor shaft Ma extending from the second space 112 is connected to the gear mechanism G, and the rotation of the motor M is input via the motor shaft Ma. The gear mechanism G reduces the rotation of the motor M and outputs it from the gear shaft Ga. The gear shaft Ga penetrates the gear cover 116 and is exposed to the outside of the housing 100H.

[0021] The control board 4S is supported on the upper surface of a metallic support 61 having a C-shaped cross section. The support 61 is fixed to the cooling plate 60 by a bolt 61A. The first board SS1, the second board SS2, and the third board SS3 are disposed below the support 61. The control board 4S is disposed so as to overlap the second board SS2 and the third board SS3 when viewed along the vertical direction (vertical view). A harness 142 is used to connect the second board SS2 and the control board 4S, and to connect the third board SS3 and the control board 4S. This makes it easy to assemble the control board 4S to the second board SS2 and the third board SS3. In addition, a harness 143 is used to connect the first board SS1 and the control board 4S. Furthermore, the first board SS1 and the second board SS2 are connected by a harness (not shown). A capacitor 11 is mounted on the first board SS1. In addition, a capacitor 42 is attached to the upper side of the cooling plate 60.

[0022] Further, a through hole 60H is formed in the cooling plate 60, and via a conductor 77 inserted into this through hole 60H, the reactor coil L1 and the first substrate SS1 are connected, and the transformer T and the second substrate SS2 are connected.

[0023] The cooling plate 60 is provided in the housing 100H of the vehicle drive device 100, and a cooling fluid flows inside. The cooling fluid is a cooling water such as long-life coolant (LLC), an insulating oil such as paraffin, or a refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO). In this embodiment, it is preferable to use a liquid with high electrical insulation such as a cooling water such as long-life coolant (LLC) or a fluorine-based inert liquid, and a cooling liquid made of insulating oil may be used. The cooling plate 60 is formed in a plate shape, and the first substrate SS1, the second substrate SS2, and the third substrate SS3 are provided in parallel to and adjacent to the cooling plate 60. In this embodiment, these substrates are provided above the cooling plate 60. This makes it possible to cool the switching elements mounted on each of the first substrate SS1, the second substrate SS2, and the third substrate SS3 by the cooling fluid.

[0024] In this embodiment, the first substrate SS1, the second substrate SS2, and the third substrate SS3 are provided on the opposite side of the cooling plate 60 from the transformer T. That is, the transformer T is provided below the cooling plate 60.

[0025] In this embodiment, the cooling plate 60 is made of metal, and a conductive portion 62 made of metal is exposed. The conductive portion 62 is provided over the entire upper and lower surfaces of the cooling plate 60 in a plan view of the cooling plate 60. However, the conductive portion 62 may be provided on a part of the upper and lower surfaces of the cooling plate 60. The conductive portion 62 may be provided on at least one of the upper and lower surfaces of the cooling plate 60. By providing the conductive portion 62 on the cooling plate 60 in this manner, it is possible to increase the heat exchange efficiency of the cooling plate 60.

[0026] It is preferable to ground the conductive portion 62. This makes it possible to prevent the control signals for driving the switching elements, which are transmitted from the control substrate 4S to each of the first substrate SS1, the second substrate SS2, the third substrate SS3, and the fourth substrate SS4, from being disturbed by external noise.

[0027] [Circuit module] Fig. 2 is a lateral view of the circuit module 1. The circuit module 1 includes the cooling plate 60, the pressure plate 50, and the circuit board 70. As described above, the cooling fluid flows through the cooling plate 60. Note that the conductive portion 62 is not shown in Fig. 2.

[0028] The pressing plate 50 presses a module 90 (an example of a "first electronic component") against the cooling plate 60. Fig. 3 shows a plan view of the pressing plate 50 of this embodiment. In this embodiment, as shown in Fig. 3, the pressing plate 50 is formed by subjecting a flat metal plate to sheet metal processing, and has a plate body 80 and ears 83.

[0029] The plate body 80 has a plurality of (four in this embodiment) pressing parts 82. The pressing parts 82 press the module 90 from the side opposite to the cooling plate 60 in the module 90. Here, the inverter 3 drives a motor M as a three-phase motor. Therefore, the inverter 3 has three legs, and each of the three legs is provided with a high-side switching element and a low-side switching element connected in series. The high-side switching element and the low-side switching element provided in each of the three legs are modularized. Therefore, the inverter 3 has three modules 90. In this embodiment, the pressing plate 50 presses the module 90 of such an inverter 3. Hereinafter, the three modules 90 will be described as a module 91, a module 92, and a module 93, respectively (see FIG. 2).

[0030] 1, the inverter 3 is provided above the cooling plate 60. Therefore, the side of the module 90 opposite to the cooling plate 60 corresponds to the upper side of the inverter 3, i.e., the third substrate SS3 side. Therefore, the plate body 80 has four pressing portions 82 as shown in FIG. 2, and the pressing portions 82 press each of the three modules 91, 92, 93 from above the inverter 3.

[0031] 3, the plate body 80 of this embodiment is configured in a rectangular shape in a plan view, and the ears 83 are provided on the sides of the first end side 51 and the second end side 52 facing each other in this rectangle, extending outward from the plate body 80. The ears 83 are provided with fixing parts 81 consisting of through holes that penetrate the pressing plate 50 in the thickness direction. As shown in FIG. 2, a bolt 81A is inserted into the fixing part 81, and the plate body 80 is fixed to the cooling plate 60 by fastening the bolt 81A.

[0032] As described above, the plate body 80 is provided with four pressing portions 82. In this embodiment, the four pressing portions 82 correspond to the first pressing portion 82A, the second pressing portion 82B, and the central pressing portions 82C and 82D. As shown in FIG. 2, in this embodiment, three modules 91, 92, and 93 are arranged side by side along the longitudinal direction of the plate body 80 (Y direction in FIG. 2). The modules 91, 92, and 93 are configured to have the same height. Therefore, the mounting heights of the modules 91, 92, and 93 are the same.

[0033] The first pressing portion 82A is provided on the side of the first end side 51 and presses the module 91. The second pressing portion 82B is provided on the side of the second end side 52 and presses the module 92. Furthermore, the central pressing portions 82C and 82D are provided in the central region between the first end side 51 and the second end side 52 and press the module 93.

[0034] That is, the central pressing units 82C and 82D cooperate to press one module 93 in the central region of the plate body 80 in a plan view toward the cooling plate 60. The first pressing unit 82A presses one module 91 arranged on the first end side 51 side of the module 93 in the central region of the plate body 80 in a plan view, alone, toward the cooling plate 60. The second pressing unit 82B presses one module 92 arranged on the second end side 52 side of the module 93 in the central region of the plate body 80 in a plan view, alone, toward the cooling plate 60.

[0035] The pressing portion 82 in this embodiment is cut and raised in a single piece from the base end region 87 toward the modules 91, 92, and 93. The base end region 87 is a region including the base end 87A of the pressing portion 82, and means a region where a driver module (an example of a "second electronic component") 95 described later does not physically interfere with the pressing portion 82 (i.e., a region where there is no contact). Therefore, in this embodiment, the base end region 87 does not have to be uniquely determined, and can be determined in relation to the driver module 95. However, when the base end region 87 is uniquely determined, it can be defined as a region from the plate main body 80 to a predetermined ratio (for example, 10%) of the height between the plate main body 80 and the tip 88 of the pressing portion 82 on the module side. Of course, this predetermined ratio is not limited to 10%, and can be, for example, 50%.

[0036] 2, the pressing portion 82 extends at an incline away from the base end region 87 as it moves from the base end 87A included in the base end region 87 toward the cooling plate 60. At this time, the pressing portion 82 is configured by cutting and raising so that the angle that the tip 88 of the pressing portion 82 makes with the surface of the plate main body 80 is an obtuse angle (approximately parallel). This makes it possible to prevent the pressing portion 82 from being deformed or damaged in the process of pressing the modules 91, 92, and 93.

[0037] In the first pressing portion 82A and the second pressing portion 82B, in a plan view of the plate body 80, a base end 87A is provided on the central region side, and a tip end 88 is provided on the first end side 51 side and the second end side 52 side, respectively. In addition, in the plan view of the plate body 80, the central pressing portions 82C and 82D, in a plan view of the plate body 80, a base end 87A is provided on the first end side 51 side and the second end side 52 side, and a tip end 88 is provided on the central region side, respectively.

[0038] As shown in FIG. 3, the plate body 80 of this embodiment has an erected portion 89 that bends and rises toward the third end side 53 and the fourth end side 54 that intersect with the first end side 51 and the second end side 52. In this embodiment, the first end side 51 and the second end side 52 are ends that face each other along the longitudinal direction of the plate body 80. Therefore, the third end side 53 and the fourth end side 54 are ends that face each other along the lateral direction of the plate body 80. The erected portion 89 is formed by a wall portion that erects the third end side 53 and the fourth end side 54 of the plate body 80 toward the side away from the cooling plate 60. This makes it possible to increase the rigidity of the plate body 80 and make it difficult to deform. Note that the erected portion 89 is omitted from FIG. 2.

[0039] The circuit board 70 is provided on the opposite side to the cooling plate 60 with respect to the pressure plate 50. That is, the circuit board 70 is provided in a state in which the circuit board 70, the pressure plate 50, and the cooling plate 60 are stacked from top to bottom in this order, as shown in Fig. 2. Here, as shown in Figs. 2 and 3, two ribs 65 are provided on the plate main body 80, respectively on the side of the first end edge 51 and the side of the second end edge 52 on the surface opposite to the module 90 side. The circuit board 70 is placed on the ribs 65 and fastened and fixed by bolts 65A.

[0040] The circuit board 70 is mounted with a driver module 95 including a driver that improves the drive capability of the control signal transmitted from the control unit 4 to the switching element of the inverter 3. The driver module 95 also includes a power supply unit having a transformer that supplies power to the driver. Here, in this embodiment, the inverter 3 has three legs, and each of the three legs is provided with a high-side switching element and a low-side switching element connected in series. That is, the inverter 3 is provided with six switching elements. Therefore, six driver modules 95 are provided in order to improve the drive capability of the control signal transmitted from the control unit 4 to the six switching elements. In the following, when distinguishing between the six driver modules 95, they will be described as driver module 95A, driver module 95B, driver module 95C, driver module 95D, driver module 95E, and driver module 95F (see FIG. 4). The driver module 95A, the driver module 95B, the driver module 95C, the driver module 95D, the driver module 95E, and the driver module 95F are provided between the control unit 4 and the switching elements of the inverter 3 in a state in which the signal transmission paths are different from each other. That is, the driver module 95A, the driver module 95B, the driver module 95C, the driver module 95D, the driver module 95E, and the driver module 95F are configured so that a control signal can be transmitted from the control unit 4 individually. In FIG. 1, the control board 4S is connected to the circuit board 70 via the harness 142, and the circuit board 70 is connected to the inverter 3 via a harness not shown. The circuit board 70 corresponds to the third board SS3 described above.

[0041] Each of the driver modules 95A, 95B, 95C, 95D, 95E, and 95F includes high-voltage components to which a voltage of a relatively high voltage value is applied, and low-voltage components to which a voltage of a relatively low voltage value is applied. Specifically, a voltage of several hundred volts is applied to the high-voltage components as applied to the motor M, and a voltage of several tens of volts or less is applied to the low-voltage components. The high-voltage components of the driver modules 95A, 95B, 95C, 95D, 95E, and 95F are mounted on the surface of the circuit board 70 facing the plate main body 80. The low-voltage components of the driver modules 95A, 95B, 95C, 95D, 95E, and 95F are mounted on the surface of the circuit board 70 facing the plate main body 80.

[0042] As described above, the driver module 95 is mounted on the circuit board 70. Electricity is applied to the driver module 95 via the circuit board 70. Meanwhile, the plate body 80 is made of metal as described above. Therefore, it is preferable that the plate body 80 is electrically connected to a grounded portion of the circuit board 70. This reduces the potential difference between the pressing portion 82 and the module 90, and prevents discharge or the like from occurring when the pressing portion 82 presses the module 90. Therefore, electrical damage to the module 90 can be suppressed.

[0043] Here, as described above, the pressing portion 82 is formed by cutting and raising into a piece. The pressing portion 82 has an opening area OA. In this embodiment, as shown in Fig. 3, the opening area OA is provided around the pressing portion 82 in a plan view of the plate body 80. Also, the pressing portion 82 is provided in the base end area 87, retracted from the surface of the plate body 80 facing the circuit board 70, and such an area retracted from the surface of the plate body 80 facing the circuit board 70 is also included in the opening area OA.

[0044] FIG. 4 is a diagram showing the relationship between the opening area OA and the driver module 95. As shown in FIG. 4, in a plan view of the plate body 80, each opening area OA is provided so as to overlap with each driver module 95. Specifically, in a view in the Z direction, the opening area OA on the first end side 51 side (hereinafter referred to as a "first opening area OA1") is provided so as to include the entire driver module 95A and the entire driver module 95B, and the opening area OA on the second end side 52 side (hereinafter referred to as a "second opening area OA2") is provided so as to include the entire driver module 95E and the entire driver module 95F. In addition, the opening areas OA in both central areas of the plate body 80 (hereinafter referred to as a "third opening area OA3") are provided so as to include the entire driver module 95C and the entire driver module 95D.

[0045] 4, in the first opening area OA1, driver modules 95A and 95B are arranged side by side along the X direction, and in the second opening area OA2, driver modules 95E and 95F are arranged side by side along the X direction when viewed in the Z direction. Also, in the third opening area OA3, driver modules 95C and 95D are arranged side by side along the X direction.

[0046] In this embodiment, the driver module 95 is inserted into the opening area OA so as to overlap the plate body 80 in a side view of the plate body 80. That is, as shown in FIG. 2, when the circuit module 1 is viewed from the side (in the X direction), the high-voltage components of the driver module 95A (not shown) and the driver module 95B are inserted into the first opening area OA1, and the high-voltage components of the driver module 95E (not shown) and the driver module 95F are inserted into the second opening area OA2. Furthermore, the high-voltage components of the driver module 95C (not shown) and the driver module 95D are inserted into the third opening area OA3. By providing the high-voltage components in the opening area OA in this way, the insulation distance can be reliably secured, and therefore the insulation effect can be improved.

[0047] As described above, the high-voltage components of each of driver modules 95A, 95B, 95C, 95D, 95E, and 95F are mounted on the surface of the circuit board 70 facing the plate body 80. For this reason, the high-voltage components of each of the driver modules 95 are provided facing each other in the opening area OA.

[0048] At this time, it is preferable that the high-voltage components of each of driver modules 95A, 95B, 95C, 95D, 95E, and 95F do not come into contact with pressing portion 82. This makes it possible to provide a gap between pressing portion 82 and each of the high-voltage components of driver modules 95A, 95B, 95C, 95D, 95E, and 95F, and this gap makes it possible to ensure an insulation distance.

[0049] As described above, when the driver module 95A, the driver module 95B, the driver module 95C, the driver module 95D, the driver module 95E, and the driver module 95F are inserted into the opening region OA, each of the driver modules 95A, 95B, 95C, the driver module 95D, the driver module 95E, and the driver module 95F may be inserted into the opening region OA in a region excluding the base end region 87. Specifically, in a plan view of the pressing plate 50 (when viewed in the Z direction), the driver module 95 may be inserted into the opening region OA so that it overlaps with the pressing portion 82 on the tip end 88 side and does not overlap with the base end region 87.

[0050] Other embodiments Next, other embodiments of the circuit module 1 will be described.

[0051] In the above embodiment, the first electronic component is the module 90 including the switching elements of the inverter 3, and the second electronic component is the driver module 95. However, the first electronic component may be an electronic component different from the module 90, and the second electronic component may also be an electronic component different from the driver module 95.

[0052] In the above embodiment, the driver module 95 is inserted into the opening area OA so as to overlap with the plate body 80 in a side view of the plate body 80. However, it is also possible to configure the driver module 95 not to be inserted into the opening area OA. In other words, it is also possible to configure the driver module 95 to be located above the pressing plate 50.

[0053] The pressing portion 82 in the above embodiment has been described as being cut and raised in a single piece toward the module 90. However, the pressing portion 82 can also be configured as a convex body that extends from the base end region 87 along the plate body 80 and protrudes at its end toward the cooling plate 60.

[0054] The plate body 80 in the above embodiment has been described as being made of metal and electrically connected to a grounded portion of the circuit board 70. However, the plate body 80 can also be made of an insulating material (e.g., resin), or the plate body 80 can be made of metal with the surface covered with an insulating material.

[0055] In the above embodiment, it has been described that the driver module 95A and the driver module 95B are arranged side by side along the X direction in the first opening area OA1, the driver module 95E and the driver module 95F are arranged side by side along the X direction in the second opening area OA2, and the driver module 95C and the driver module 95D are arranged side by side along the X direction in the third opening area OA3. For example, as shown in FIG. 5, it is also possible that the driver module 95A and the driver module 95B are arranged side by side along the Y direction in the first opening area OA1, and the driver module 95E and the driver module 95F are arranged side by side along the Y direction in the second opening area OA2, when viewed in the Z direction. It is also possible that the driver module 95C and the driver module 95D are arranged side by side along the Y direction in the third opening area OA3.

[0056] 2 and 3, in the above embodiment, the pressing portions 82 extending along the Y direction are arranged side by side along the Y direction, and the opening area OA is surrounded by the plate body 80. However, it is also possible to configure the pressing portions 82 arranged along the Y direction to extend along the X direction, as shown in Fig. 6. Also, as shown in Fig. 6, the opening area OA does not have to be surrounded by the plate body 80, and it is preferable that the opening area OA includes an area outside the tip 88 in the X direction (an area opposite the base end 87A).

[0057] 7, the plate body 80 can be configured to include a pressing portion 82 extending along the X direction and a pressing portion 82 extending along the Y direction. In this case, not only the opening area OA provided in the pressing portion 82 extending along the Y direction but also the opening area OA provided in the pressing portion 82 extending along the X direction can be configured to overlap with the entire driver module 95 in a plan view of the plate body 80.

[0058] 8, it is also possible to provide a hole 99 penetrating the pressing portion 82 in the Z direction, and use the radial inside of this hole 99 as the opening area OA. In this case, it is possible to provide at least a part of the driver module 95 by inserting it through this hole 99.

[0059] [Summary of the above embodiment] The above-described circuit module 1 will now be outlined.

[0060] (1) The circuit module 1 comprises a cooling plate 60 through which a cooling fluid flows, a pressure plate 50 which presses a module (first electronic component) 90 against the cooling plate 60, and a circuit board 70 which is provided on the opposite side of the cooling plate 60 with respect to the pressure plate 50 and on which a plurality of driver modules (second electronic components) 95 having different signal transmission paths are mounted, the pressure plate 50 having a plate body 80 which includes a plurality of pressure portions 82 which press the module 90 from the opposite side of the module 90 to the cooling plate 60, each of the pressure portions 82 having an opening area OA, and in a planar view of the plate body 80, each of the opening areas OA overlaps with all of the respective driver modules 95.

[0061] According to this configuration, the module 90 and the driver module 95 are arranged with the opening area OA in the pressing plate 50 sandwiched therebetween. Therefore, a gap can be provided between the module 90 and the driver module 95, and this gap makes it possible to ensure an insulation distance. In addition, in a plan view of the plate main body 80, the remainder of the driver module 95 overlaps the opening area OA, so that the opening area OA can also ensure an insulation distance between the driver module 95 and the plate main body 80. Therefore, it is possible to ensure an insulation distance at low cost without using a dedicated member for ensuring the insulation distance.

[0062] (2) In the circuit module 1 described in (1), it is preferable that the driver module 95 is inserted so as to overlap the plate body 80 when viewed from the side of the plate body 80.

[0063] According to this configuration, the height of the circuit module 1 can be reduced while ensuring an insulation distance between the module 90 and the driver module 95. Therefore, the circuit module 1 can be made smaller in size.

[0064] (3) In the circuit module 1 described in (1) or (2), it is preferable that the plate body 80 is made of metal and is electrically connected to a grounded portion of the circuit board 70.

[0065] According to this configuration, it is possible to reduce the potential difference between the pressing portion 82 and the module 90, and prevent the occurrence of discharge or the like when the pressing portion 82 presses the module 90. Therefore, electrical damage to the module 90 can be suppressed.

[0066] (4) In any of the circuit modules 1 (1) to (3), the driver module 95 preferably includes high-voltage components to which a voltage of a relatively high voltage value is applied, and the opening area OA is preferably arranged such that the high-voltage components of each driver module 95 are opposed to each other.

[0067] A high-voltage component to which a relatively high voltage is applied requires a longer insulation distance than a low-voltage component to which a relatively low voltage is applied. According to this configuration, the high-voltage component is provided facing the opening area OA, and the opening area OA can be used to ensure the insulation distance. Therefore, there is no need to provide a separate insulating member around the high-voltage component, which is highly effective in reducing size and cost. [Industrial Applicability]

[0068] The technology disclosed herein can be used in a circuit module that includes a pressure plate that presses electronic components against a cooling plate. [Explanation of symbols]

[0069] 1: circuit module, 50: pressure plate, 60: cooling plate, 70: circuit board, 80: plate body, 82: pressure section, 87: base end region, 90: module (first electronic component), 95: driver module (second electronic component), OA: opening region

Claims

1. a cooling plate through which a cooling fluid flows; a pressing plate that presses the first electronic component against the cooling plate; a circuit board on which a plurality of second electronic components having different signal transmission paths are mounted, the circuit board being provided on an opposite side of the pressing plate from the cooling plate, the pressing plate has a plate body including a plurality of pressing portions configured to press the first electronic component from a side of the first electronic component opposite to the cooling plate, An opening area is provided in each of the pressing portions, and each of the opening areas overlaps with the entirety of each of the second electronic components in a plan view of the plate body.

2. The circuit module according to claim 1 , wherein the second electronic component is inserted through the opening region so as to overlap the plate body in a side view of the plate body.

3. 3. The circuit module according to claim 1, wherein the plate body is made of metal and is electrically connected to a grounded portion of the circuit board.

4. The second electronic component includes a high voltage component to which a voltage of a relatively high voltage value is applied, 3. The circuit module according to claim 1, wherein the opening area faces the high voltage components of the second electronic components.

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