Cooling member and cooling module

Abstract

To increase, in a cooling member and a cooling module, the allowable internal pressure of a passage of a passage member to improve cooling performance.SOLUTION: A cooling member includes: a passage member which has a passage where a fluid flows between a pair of plate materials disposed at an interval and also has an opening in one plate material; and a heat sink which is mounted to the one plate material from the inside of the passage member in a partially overlapped manner, and which closes the opening and is exposed to the outside of the passage member while being in contact with the passage at the inside of the passage member.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a cooling member and a cooling module. [Background technology]

[0002] A cooling assembly is disclosed in US Pat. No. 5,399,633, which has a first cooling section and a second cooling section that form a cavity for a coolant. The first cooling section has an opening that receives an integrated cooling structure (base plate and pin fins). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-145522 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the above-mentioned conventional example, since the base plate is attached to the outside of the cooling assembly, the internal pressure of the cavity of the cooling assembly acts in a direction that causes the base plate to come out of the cooling assembly, and therefore it is considered difficult to flow the liquid coolant at high pressure into the cavity in order to increase the cooling efficiency.

[0005] The present disclosure provides a cooling member and a cooling module that improve cooling performance by increasing the allowable internal pressure of a flow path of a flow path member. [Means for solving the problem]

[0006] The cooling member of the first aspect has a flow path through which a fluid flows between a pair of plate members arranged at a distance from one another, the flow path member having an opening in one of the plate members, and a heat sink attached to one of the plate members so as to overlap partially from the inside of the flow path member, covering the opening, exposed to the outside of the flow path member, and in contact with the flow path on the inside of the flow path member.

[0007] In this cooling member, the heat sink covers the opening of the flow path member, is exposed to the outside of the flow path member, and is in contact with the flow path inside the flow path member. Furthermore, the heat sink is attached to one of the plates from the inside of the flow path member, overlapping a part of it. Therefore, compared to when the heat sink is attached from the outside of the flow path member, the internal pressure of the flow path of the flow path member can be increased. This improves the cooling performance.

[0008] In a second aspect, in the cooling member according to the first aspect, a film-type adhesive is used to bond one of the plates and the heat sink.

[0009] In this cooling member, the film-type adhesive ensures airtightness between one of the plates and the heat sink, which reduces the number of parts, assembly time, weight, and costs compared to using sealing members such as O-rings and fastening members such as bolts and nuts to ensure airtightness.

[0010] In a third aspect, in the cooling member according to the first aspect, a film-type adhesive is used to bond one of the plates to the other plate.

[0011] In this cooling member, the film-type adhesive ensures airtightness between one plate and the other plate, which reduces the number of parts and allows for weight and cost reduction compared to using sealing members such as O-rings and fastening members such as bolts and nuts to ensure airtightness.

[0012] A fourth aspect is the cooling member according to the first aspect, wherein a portion of the heat sink abuts against the other plate material facing the heat sink.

[0013] In this cooling member, a part of the heat sink is in contact with the other plate material facing the heat sink, so the strength of the cooling member in the thickness direction is increased. Also, the heat transfer area is enlarged, so the cooling efficiency is improved.

[0014] A cooling module according to a fifth aspect includes the cooling member according to any one of the first to fourth aspects, and an object to be cooled that is provided in contact with the heat sink of the cooling member.

[0015] In this cooling module, the object to be cooled can be efficiently cooled by the cooling member.

[0016] A sixth aspect is the cooling module according to the fifth aspect, wherein the object to be cooled is a semiconductor module.

[0017] In this cooling module, the semiconductor module as the object to be cooled can be efficiently cooled by the cooling member. Effect of the Invention

[0018] According to the present disclosure, in a cooling member and a cooling module, the allowable internal pressure of the flow passage of the flow passage member can be increased to improve the cooling performance. [Brief description of the drawings]

[0019] [Figure 1] FIG. 2 is a perspective view showing a connection module according to the embodiment. [Diagram 2] FIG. 2 is a perspective view showing a connection module according to the embodiment. [Diagram 3] FIG. 2 is an exploded perspective view showing a connection module according to the embodiment. [Figure 4] FIG. 2 is an exploded perspective view showing a connection module according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, the embodiment for carrying out the present disclosure will be described based on the drawings. Components indicated by the same reference numerals in each drawing are the same components. Note that duplicated explanations and reference numerals in the embodiments described below may be omitted. In addition, all drawings used in the following description are schematic, and the dimensional relationship of each element, the ratio of each element, etc. shown in the drawings do not necessarily match the actual ones. In addition, the dimensional relationship of each element, the ratio of each element, etc. between multiple drawings do not necessarily match.

[0021] In the drawings, the direction of arrow L indicates the longitudinal direction of cooling member 12 , the direction of arrow W indicates the width direction of cooling member 12 , and the direction of arrow T indicates the thickness direction of cooling member 12 .

[0022] 1 to 4, a cooling module 10 according to this embodiment has a cooling member 12 and a semiconductor module 14 as an example of an object to be cooled. The cooling module 10 from which the semiconductor module 14 has been removed corresponds to the cooling member 12.

[0023] (Cooling material) The cooling member 12 has a flow path member 16 and a heat sink 18. The flow path member 16 is, for example, a water jacket having a flow path 20 through which a fluid flows between a pair of plate members 21 and 22 arranged with a gap therebetween. Specifically, in the drawing, one plate member 21 is arranged overlapping the upper side of the other plate member 22. The outer shapes of the one plate member 21 and the other plate member 22 are, for example, rectangular. The outer peripheral portion of the one plate member 21 is a frame 21A. The area of ​​the one plate member 21 surrounded by the frame 21A is thinner than the frame 21A and is configured as a recessed portion 21B that is recessed upward.

[0024] A pair of inlets and outlets 21C, 21D are provided on both sides in the longitudinal direction of one of the plate materials 21. The inlets and outlets 21C, 21D are provided, for example, in the shape of a cylinder standing upward from the upper surface of the one of the plate materials 21, and open into the recess 28. In other words, the inlets and outlets 21C, 21D communicate with one end side and the other end side of the flow path 20, respectively. A fluid that serves as a refrigerant, for example, cooling water, is allowed to flow through the inlets and outlets 21C, 21D.

[0025] One plate material 21 of the flow path member 16 has an opening 21E. Specifically, the opening 21E is, for example, rectangular, and is formed in the center of the longitudinal direction and the center of the width direction of the one plate material 21. On the recess 21B side, that is, inside the cooling member 12, a thin-walled step portion 21F is formed on the periphery of the opening 21E. The step portion 21F is recessed upward from the recess 21B. As an example, the height of the step portion 21F is equal to the thickness of a plate portion 18A in the heat sink 18 described later. This is to suppress the flow path resistance by making the plate portion 18A and the recess 21B as flush as possible.

[0026] The outer peripheral portion of the other plate material 22 is a frame 22A. The area of ​​the other plate material 22 surrounded by the frame 22A is thinner than the frame 22A and is configured as a recessed portion 22B that is recessed downward. In the flow path member 16, the frame 21A and the recessed portion 21B of one plate material 21 face the frame 22A and the recessed portion 22B of the other plate material 22, respectively. In this way, by overlapping the one plate material 21 and the other plate material 22 with the recessed portions 21B and 22B facing each other, a gap is opened between the pair of plate materials 21 and 22, and the flow path 20 is formed.

[0027] The material of the one plate material 21 and the other plate material 22 is, for example, a synthetic resin. Note that a part of the one plate material 21 and a part of the other plate material 22 may be made of a metal.

[0028] The heat sink 18 is a heat conductive member made of, for example, metal, which is attached to one of the plates 21 so as to overlap a part of the plate 16 from the inside of the flow path member 16, closes the opening 21E, is exposed to the outside of the flow path member 16, and contacts the flow path 20 inside the flow path member 16. The heat sink 18 has, for example, a rectangular plate portion 18A of a size that fits into a step portion 21F on the periphery of the opening 21E in the one of the plates 21, and a plurality of, for example, pin-shaped fins 18B erected downward from the plate portion 18A. The shape of the fins 18B is not limited to a pin shape, and may be a polygonal column shape such as a rhombus. In the heat sink 18, the bottom surface of the plate portion 18A and the fins 18B contact the fluid in the flow path 20.

[0029] For example, a film-type adhesive 24 is used to bond one of the plates 21 and the heat sink 18. The film-type adhesive 24 is formed in, for example, a rectangular ring shape that matches the step 21F on the periphery of the opening 21E. The thickness of the film-type adhesive 24 is, for example, 0.05 mm.

[0030] A part of the heat sink 18 may be in contact with the other plate material 22 facing the heat sink 18. Specifically, at least a part of the multiple fins 18B may be in contact with the recessed portion 22B of the other plate material 22. Also, a boss (not shown) may be provided separately from the fins 18B, and the boss may be in contact with the recessed portion 22B of the other plate material 22. This boss may be provided on the bottom surface of the portion of the plate portion 18A that overlaps with the step portion 21F. The portion of the plate portion 18A that overlaps with the step portion 21F corresponds to the joint portion between the one plate material 21 and the heat sink 18. Therefore, by providing a boss that abuts on the recessed portion 22B of the other plate material 22 at this portion, it is possible to increase the joint strength.

[0031] A film-type adhesive 34 may be used to bond one plate material 21 and the other plate material 22. In the example shown in Fig. 3 and Fig. 4, the film-type adhesive 34 is formed in, for example, a rectangular ring shape that matches the frame 21A of one plate material 21 and the frame 22A of the other plate material 22. The thickness of the film-type adhesive 34 is, for example, 0.05 mm.

[0032] (Semiconductor Module) The semiconductor module 14 as the object to be cooled is provided in contact with the heat sink 18 of the cooling member 12. Specifically, the semiconductor module 14 is provided in contact with the upper surface of the plate portion 18A of the heat sink 18. A thermally conductive adhesive may be used as a joining means. The semiconductor module 14 is, for example, a power card including a power semiconductor used in electrical equipment such as a power switching or boosting power module for a power source. The semiconductor module 14 has, for example, a plurality of electrodes 14A and a plurality of terminals 14B.

[0033] (action) The present embodiment is configured as described above, and its operation will be described below. In FIG. 2, in the cooling member 12 according to the present embodiment, the heat sink 18 covers the opening 21E of the flow path member 16, is exposed to the outside of the flow path member 16, and is in contact with the flow path 20 inside the flow path member 16. Furthermore, the heat sink 18 is attached to one of the plates 21 from the inside of the flow path member 16, overlapping a part of it. The internal pressure of the flow path 20 acting on the heat sink 18 is transmitted from the plate portion 18A of the heat sink 18 to the step portion 21F of the one of the plates 21, so that the heat sink 18 is prevented from being separated from the one of the plates 21 due to the internal pressure. Therefore, the internal pressure of the flow path 20 of the flow path member 16 can be increased compared to the case where the heat sink 18 is attached from the outside of the flow path member 16.

[0034] When the film-type adhesive 24 is used to bond the one plate material 21 and the heat sink 18 together, the film-type adhesive 24 ensures airtightness between the one plate material 21 and the heat sink 18 . This allows for a reduction in the number of parts, a reduction in assembly labor, and a reduction in weight and costs compared to using sealing members such as O-rings to ensure airtightness, and fastening members such as bolts and nuts.

[0035] When the film-type adhesive 34 is used to join the one plate material 21 and the other plate material 22, the film-type adhesive 34 ensures airtightness between the one plate material 21 and the other plate material 22. This allows for a reduction in the number of parts, weight, and costs, compared to the case where a sealing member such as an O-ring and fastening members such as bolts and nuts are used to ensure airtightness.

[0036] When a part of the heat sink 18 is in contact with the other plate material 22 facing the heat sink 18, the strength of the cooling member 12 in the thickness direction is increased. In addition, the heat transfer area is enlarged, and the cooling efficiency is improved.

[0037] Moreover, in the cooling module 10 in which the cooling member 12 is combined with a semiconductor module 14 as an object to be cooled, the semiconductor module 14 can be efficiently cooled by the cooling member 12 .

[0038] As described above, according to this embodiment, in the cooling member 12 and the cooling module 10, the allowable internal pressure of the flow path 20 of the flow path member 16 can be increased, thereby improving the cooling performance.

[0039] [Other embodiments] An example of an embodiment of the present disclosure has been described above, but the embodiment of the present disclosure is not limited to the above, and it goes without saying that various modifications can be made without departing from the spirit and scope of the present disclosure.

[0040] Although the film-type adhesive 24 is used to bond the one plate material 21 and the heat sink 18, the bonding means is not limited to this, and various bonding means such as vibration welding, fastening with bolts and nuts, etc. The same applies to the bonding means between the one plate material 21 and the other plate material 22.

[0041] Although a portion of the heat sink 18 is in contact with the other plate material 22 facing the heat sink 18 in the above embodiment, the heat sink 18 may be configured not to be in contact with the other plate material 22 . [Explanation of symbols]

[0042] 10 Cooling Module 12 Cooling material 14 Semiconductor module (cooled body) 16 Flow path components 18 Heat sink 20 Flow Path 21 One of the boards 21E opening 22 The other board 24 Film type adhesive 34 Film type adhesive

Claims

1. a flow path member having a flow path through which a fluid flows between a pair of plate members arranged at a distance from one another, the flow path member having an opening in one of the plate members; a heat sink that is attached to one of the plates from the inside of the flow path member so as to overlap a part of the plate, covers the opening, and is exposed to the outside of the flow path member and is in contact with the flow path on the inside of the flow path member; A cooling member having

2. 2. The cooling member according to claim 1, wherein a film type adhesive is used to bond one of the plates and the heat sink.

3. 2. The cooling member according to claim 1, wherein a film type adhesive is used to bond one of said plates to the other of said plates.

4. The cooling member according to claim 1 , wherein a portion of the heat sink abuts against the other plate member facing the heat sink.

5. A cooling member according to any one of claims 1 to 4, a cooled body provided in contact with the heat sink of the cooling member; A cooling module having

6. The object to be cooled is a cooling module which is a semiconductor module.

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