Method for three-dimensionally decorating substrate in order to manufacture external component

Abstract

To provide an external component including a metal and / or aceramic decorative element fixed onto a ceramic substrate.SOLUTION: A method for three-dimensionally decorating a substrate 11 in order to manufacture an external component 10 includes the steps of: depositing at least one enamel carrier layer 12 on a decorative area of an external surface 110 of a ceramic substrate 11, the decorative area being intended to receive a decorative element 13; firing the substrate 11 including the carrier layer 12 in order to melt the carrier layer 12; depositing a ceramic and / or metal decorative element 13 in solid form on the carrier layer 12; and sealing the decorative element 13 onto the substrate 11 by firing in order to form the external component 10.SELECTED DRAWING: Figure 1c

Description

[Technical field]

[0001] The present invention relates to the decoration of watches, jewellery or fashion items, in particular the manufacture of external parts.

[0002] In particular, the present invention relates to a method for three-dimensional decoration of a substrate to manufacture an external part, which can be advantageously applied to any external part in the field of watchmaking, jewellery or fashion items such as leather goods, glasses, writing implements or portable electronic devices. [Background technology]

[0003] In the above mentioned fields, the external parts can be formed by assembling elements made of different materials. In particular, external parts comprising metallic and / or ceramic decorative elements fixed to a ceramic substrate are particularly attractive, although they are less common due to the complexity of their manufacture.

[0004] More specifically, the decorative elements have very small dimensions which make them difficult to grasp and position on a substrate.

[0005] Another drawback of this type of assembly is that when the decorative element is fixed to the substrate by driving, bonding or screwing, the bond between the decorative element and the substrate cannot be controlled over time. Summary of the Invention

[0006] To this end, the invention overcomes the aforementioned drawbacks by proposing a method for three-dimensional decoration of a substrate to manufacture an external component, said method comprising the steps of: - depositing at least one enamel carrier layer on a decorative area of ​​the outer surface of the ceramic substrate, this decorative area being intended to receive a decorative element; - firing the substrate including the carrier layer to melt the carrier layer; - depositing on the carrier layer a decorative element made of a ceramic and / or metallic material in solid form, this material being chosen such that its melting temperature is higher than the glass transition temperature of the material constituting the carrier layer; - sealing the decorative element to the substrate by firing to form an external component; Includes.

[0007] In particular implementations, the present invention may further include one or more of the following features, taken alone or in any technically possible combination.

[0008] In a particular implementation, firing of the substrate and carrier layer and sealing of the decorative element to the substrate are performed in the same step when the melting temperature of the material that constitutes the decorative element is above 1000 degrees Celsius.

[0009] In a particular implementation, a blind cavity is created in the substrate so as to form a decorative area and whose shape corresponds to the shape of the decorative element, which is deposited such that it extends beyond the cavity.

[0010] In certain implementations, the cavity has a depth of at least 0.01 mm, preferably 0.1 mm.

[0011] In certain implementations, the carrier layer is made from borosilicate enamel or feldspar.

[0012] In a particular implementation, the carrier layer is made from sodium borosilicate enamel.

[0013] In a particular implementation example, when the melting temperature of the material constituting the decorative element is less than 1000 degrees Celsius, after the step of firing the substrate including the carrier layer, the carrier layer is surface-treated to make its surface flat and its thickness uniform.

[0014] In certain implementations, the temperature to which the substrate, carrier layer and decorative element are exposed during the encapsulating step is between 500 and 1500 degrees Celsius. [Brief description of the drawings]

[0015] Other characteristics and advantages of the invention will become apparent from the following detailed description, given by way of example and not of limitation, which refers to the accompanying drawings, in which:

[0016] [Figure 1a] 1a to 1c show diagrammatically cross-sectional views of the steps involved in carrying out a method for decorating a substrate to manufacture an external component according to a first alternative embodiment of the invention. [Figure 1b] 1a to 1c show diagrammatically cross-sectional views of the steps involved in carrying out a method for decorating a substrate to manufacture an external component according to a first alternative embodiment of the invention. [Figure 1c] 1a to 1c show diagrammatically cross-sectional views of the steps involved in carrying out a method for decorating a substrate to manufacture an external component according to a first alternative embodiment of the invention. [Figure 1d] Figures 1d to 1f show diagrammatically cross-sectional views of the steps involved in carrying out a method for decorating a substrate to manufacture an external component according to a second alternative embodiment of the invention. [Figure 1e] Figures 1d to 1f show diagrammatically cross-sectional views of the steps involved in carrying out a method for decorating a substrate to manufacture an external component according to a second alternative embodiment of the invention. [Figure 1f] Figures 1d to 1f show diagrammatically cross-sectional views of the steps involved in carrying out a method for decorating a substrate to manufacture an external component according to a second alternative embodiment of the invention.

[0017] It should be noted that for purposes of clarity, the drawings have not necessarily been drawn to scale. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] The present invention relates to a method for three-dimensional decoration of a substrate 11 to manufacture an external component 10, which is shown in two alternative embodiments in Figures 1c and 1f. In detail, the steps of a first alternative implementation of the method are shown diagrammatically in Figures 1a to 1c and will be described first below, while the steps of a second alternative implementation of the method are shown diagrammatically in Figures 1d to 1f and will be described thereafter.

[0019] By way of example, in the field of watchmaking, the external part 10 may form a dial, a plate, a bridge, a gear train, an oscillating weight, a bezel, an intermediate section, a link of a bracelet or a clasp of a bracelet.

[0020] In a first alternative implementation, the method comprises the step of depositing at least one enamel carrier layer 12 on a decorative area of ​​an outer surface 110 of a substrate 11, as shown in Fig. 1a. The outer surface 110 is intended to be visible to a user once the manufacture of the external part 10 is completed. Furthermore, the decorative area constitutes a flat portion of the outer surface 110 and is intended to receive decorative elements, as will be described in more detail below.

[0021] In this alternative embodiment of the invention, the carrier layer 12 is made from a borosilicate enamel, such as sodium borosilicate, or feldspar. For linguistic reasons and readability, the singular is used herein when referring to the carrier layer 12, although the carrier layer 12 may be comprised of a stack of multiple layers.

[0022] Advantageously, the substrate 11 is made from a ceramic, for example a high density ceramic such as zirconia, alumina, yttrium aluminum garnet (also known by the acronym "YAG"), sapphire, or a mixture of these elements.

[0023] The substrate 11 and the carrier layer 12 are then baked in an oven at a temperature between 500 and 1500 degrees Celsius, preferably at 1000 degrees Celsius, causing the carrier layer 12 to melt and chemically bond to the substrate 11. Due to its composition, adhesion of the carrier layer 12 to the substrate 11 is guaranteed after this step.

[0024] The carrier layer 12 is preferably surface treated after the firing step to flatten its visible surface and make its thickness uniform, as shown diagrammatically in Fig. 1b. In particular, as shown exaggeratedly in Fig. 1a, the carrier layer 12 is prone to variations in thickness. In particular, since the surface of the base layer 12 may have successive depressions and bulges due to surface tension phenomena occurring during firing of the base layer 12, the thickness of the base layer 12 may be greater in the center of the outer surface 110 than at its periphery due to the wettability of the layer. Furthermore, if the outer surface 110 does not extend horizontally, i.e. forms a slope, the base layer 12 may tend to flow in the direction of the slope during firing, resulting in excess thickness under the effect of gravity and due to its high temperature viscosity.

[0025] The carrier layer 12 is preferably surface treated by mechanical abrasion, for example by grinding or sanding.

[0026] A decorative element 13 is then deposited on all or part of the carrier layer 12, as shown in figure 1c. Such decorative element 13 is deposited in solid form. The decorative element 13 is advantageously made from a ceramic and / or metallic material, said material being chosen to have a melting temperature higher than the glass transition temperature of the material constituting the carrier layer 12, for example a melting temperature higher than 600 degrees Celsius. In this document, the term "metallic material" refers to any metal alloy, any pure metal or any metal composite.

[0027] The decorative element 13 is then sealed to the substrate 11 to form the external part 10 by firing the assembly consisting of the substrate 11, the carrier layer 12 and the decorative element 13. The firing may take place at a temperature between 500 and 1500 degrees Celsius. This firing temperature corresponds to the glass transition temperature of the material of the carrier layer 12 and must be lower than the melting point of the material constituting the decorative element 13 so as not to cause its degradation.

[0028] Pressure may be applied to the decorative element 13 during firing to ensure adhesion with the carrier layer 12. Such pressure may be exerted by a weight placed on the decorative element 13.

[0029] Firing of the substrate 11 and the carrier layer 12 can advantageously be carried out during the step of sealing the decorative element 13 to the substrate 11, if the melting temperature of the material of which the decorative element 13 is made is higher than 1000 degrees Celsius. That is to say, a single firing step can melt the carrier layer 12 and seal the decorative element to the substrate 11. It is clear that in this case the method does not include a step of surface treatment of the carrier layer 12.

[0030] A second alternative embodiment of the invention corresponds to the first alternative embodiment, with the difference that, before the deposition of the carrier layer 12, a preliminary step is performed in which a blind cavity 14 forming the decorative area is made in the substrate 11. In detail, the cavity 14 is made through the outer surface 110, i.e. this cavity 14 is intended to receive the carrier layer 12 and the decorative element 13, respectively, when they are deposited. As shown in Fig. 1f, this cavity 14 is manufactured such that its shape corresponds to the shape of the decorative element 13. This cavity 14 can be manufactured by laser processing.

[0031] Furthermore, the decorative element 13 is deposited so as to extend beyond the cavity 14 .

[0032] The cavity 14 has a depth of at least 0.01 mm, preferably 0.1 mm, to facilitate positioning the decorative element 13 within the cavity 14 .

[0033] In this alternative embodiment of the present invention, the carrier layer 12 may be deposited into the cavity 14 in the form of a powder.

[0034] In general, it should be noted that the implementations and embodiments considered above are described as non-limiting examples, and therefore other alternatives are possible.

Claims

1. A method for three-dimensional decoration of a substrate (11) for producing an external part (10), comprising the steps of: - depositing at least one enamel carrier layer (12) on a decorative area of ​​the outer surface (110) of the ceramic substrate (11), said decorative area being intended to receive a decorative element (13); - firing the substrate (11) including the carrier layer (12) to melt the carrier layer (12); - depositing on said carrier layer (12) a decorative element (13) made of a ceramic and / or metallic material in solid form, the material of said decorative element (13) being chosen such that its melting temperature is higher than the glass transition temperature of the material constituting said carrier layer (12); - sealing said decorative element (13) to said substrate (11) by firing to form an external part (10); A method comprising:

2. 2. The method according to claim 1, wherein the firing of the substrate (11) and the carrier layer (12) and the sealing of the decorative element (13) to the substrate (11) are carried out during the same step, when the melting temperature of the material constituting the decorative element (13) is higher than 1000 degrees Celsius.

3. 3. The method according to claim 1 or 2, wherein a blind cavity (14) is made in the substrate (11) so as to form the decorative area and whose shape corresponds to the shape of the decorative element (13), the decorative element (13) being deposited so as to extend beyond the cavity (14).

4. 2. The method according to claim 1, wherein a blind cavity (14) is made in the substrate (11) so as to form the decorative area and whose shape corresponds to the shape of the decorative element (13), the decorative element (13) being deposited so as to extend beyond the cavity (14), the cavity (14) having a depth of at least 0.01 mm, preferably 0.1 mm.

5. The method of claim 1, wherein the carrier layer (12) is made of borosilicate enamel or feldspar.

6. The method of claim 5, wherein the carrier layer (12) is made from sodium borosilicate enamel.

7. 2. The method according to claim 1, wherein, if the melting temperature of the material constituting the decorative element (13) is less than 1000 degrees Celsius, after the step of firing the substrate (11) including the carrier layer (12), the carrier layer (12) is surface-treated to make its surface flat and its thickness uniform.

8. 2. The method according to claim 1, wherein the temperature to which the substrate (11), the carrier layer (12) and the decorative element (13) are exposed during the sealing step is between 500 degrees Celsius and 1500 degrees Celsius.

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