Substrate integrated waveguide with multiple substrates

Abstract

To provide a substrate integrated waveguide that can transmit signals in the same or different directions within different substrates.SOLUTION: A substrate integrated waveguide with multiple substrates includes: a first substrate 100 and a second substrate 110 stacked on the first substrate. Therein: metal layers 102A, 102B, 112A, 112B are formed on both end surfaces of the first substrate 100 and both end surfaces of the second substrate 110. A plurality of metal holes are formed between the two metal layers of the same substrate in order to restrict transmission paths of the electromagnetic waves transmitted within the substrates 100, 110; and a metal-less region 120 having no metal is formed between the first substrate 100 and the second substrate 110, thereby transmitting the electromagnetic waves between the first substrate 100 and the second substrate 110.SELECTED DRAWING: Figure 4A

Description

[Technical field]

[0001] The present invention relates to a substrate integrated waveguide, and more particularly to a substrate integrated waveguide comprising multiple substrates. [Background technology]

[0002] Commonly used micro-transmission structures for signal transmission include microstrip and stripline. Compared with common waveguide structures, the small size of micro-transmission structures makes them easier to integrate into circuits, which in turn allows the size of electronic components to be reduced. However, the small size of micro-transmission structures brings about problems such as low power handling capability and large energy loss.

[0003] To solve the above problems, there is a technological solution known as substrate integrated waveguide (SIW), which has been proven over time to be suitable for integration with various planar circuits to produce small electronic components while retaining the advantages of traditional waveguides such as low energy loss and high power handling capability.

[0004] Due to these advantages, substrate integrated waveguides are likely to be widely used in electronic components in the future, and therefore their improvement is of great importance. Summary of the Invention [Problem to be solved by the invention]

[0005] Thus, the present invention provides a substrate integrated waveguide that allows greater flexibility in circuit layout as described below. [Means for solving the problem]

[0006] In one aspect, the present invention provides a substrate integrated waveguide including a plurality of substrates including a first substrate and a second substrate. The first substrate has a first dielectric layer, a first metal layer and a second metal layer disposed on both end faces of the first dielectric layer, and a plurality of first metal holes disposed on the first dielectric layer, the first metal holes being arranged in a plurality of first hole rows along a first direction in which an electromagnetic wave is transmitted in the first dielectric layer, and two ends of each of the first metal holes being connected to the first metal layer and the second metal layer, respectively. The second substrate has a second dielectric layer, a third metal layer and a fourth metal layer disposed on both end faces of the second dielectric layer, and a plurality of second metal holes disposed on the second dielectric layer, the second metal holes being arranged in a plurality of second hole rows along a second direction in which an electromagnetic wave is transmitted in the second dielectric layer, and two ends of each of the second metal holes being connected to the third metal layer and the fourth metal layer, respectively. The first substrate is laminated on the second substrate, the second metal layer faces the third metal layer, there is no metal in a first metal-less region of the second metal layer and a second metal-less region of the third metal layer, electromagnetic waves are transmitted between the first substrate and the second substrate through the first metal-less region and the second metal-less region, a first structure configured to transmit and receive electromagnetic waves is disposed near a first side of the first metal-less region, a plurality of third metal holes are disposed near a second side of the first metal-less region and arranged in a third hole row along a third direction perpendicular to the first direction, and the first side and second side are on opposite sides of the first metal-less region.

[0007] In one embodiment, the number of the first rows of holes is the same as the number of the second rows of holes.

[0008] In one embodiment, the number of the first rows of holes is not the same as the number of the second rows of holes.

[0009] In one embodiment, a second structure configured to transmit electromagnetic waves is disposed on the second substrate adjacent one side of the second metal-less region.

[0010] In one embodiment, a third structure configured to transmit electromagnetic waves is disposed on the second substrate proximate two sides of the second metal-less region.

[0011] In one embodiment, the second metal layer and the third metal layer are integrated into one metal layer.

[0012] In one embodiment, the first metal-less region of the second metal layer is a region obtained by vertically projecting a predetermined region, and the second metal-less region of the third metal layer is a region obtained by vertically projecting the predetermined region. Effect of the Invention

[0013] By applying the above-mentioned technical solutions, the substrate integrated waveguide with multiple substrates provided in the present invention can transmit signals in the same direction or in different directions within different substrates, so that the circuit design of electronic components using the substrate integrated waveguide is more flexible than before. [Brief description of the drawings]

[0014] [Figure 1] 1 is a schematic diagram showing the appearance of a substrate integrated waveguide having multiple substrates according to an embodiment of the present invention;

[0015] [Figure 2A] FIG. 2 is a top view of the substrate 100 shown in FIG. 1 according to one embodiment of the present invention.

[0016] [Figure 2B] 2B is a cross-sectional view of the embodiment shown in FIG. 2A taken along section line BB'.

[0017] [Figure 2C] 2B is a cross-sectional view of the embodiment shown in FIG. 2A taken along section line CC'.

[0018] [Figure 3A] FIG. 2 is a top view of the substrate 110 shown in FIG. 1 according to one embodiment of the present invention.

[0019] [Figure 3B] FIG. 3B is a cross-sectional view of the embodiment shown in FIG. 3A taken along section line DD'.

[0020] [Figure 3C] 3B is a cross-sectional view of the embodiment shown in FIG. 3A taken along section line EE'.

[0021] [Figure 4A] 2 is a cross-sectional view taken along the section line AA' shown in FIG. 1 according to one embodiment of the present invention.

[0022] [Figure 4B] 2 is a cross-sectional view taken along the section line AA' shown in FIG. 1 according to one embodiment of the present invention.

[0023] [Figure 4C] 2 is a cross-sectional view taken along the section line AA' shown in FIG. 1 according to one embodiment of the present invention.

[0024] [Figure 5A] 1 is a schematic diagram showing the appearance of a substrate integrated waveguide having multiple substrates according to an embodiment of the present invention;

[0025] [Figure 5B] FIG. 5 is a top perspective view of a substrate 500 according to one embodiment of the present invention.

[0026] [Figure 5C] FIG. 5 is a top perspective view of a substrate 510 according to one embodiment of the present invention.

[0027] [Figure 6A] 1 is a schematic diagram showing the appearance of a substrate integrated waveguide having multiple substrates according to an embodiment of the present invention;

[0028] [Figure 6B] FIG. 6 is a top perspective view of a substrate 600 according to an embodiment of the present invention.

[0029] [Figure 6C]FIG. 6 is a top perspective view of a substrate 650 according to one embodiment of the present invention.

[0030] [Figure 7A] 1 is a schematic diagram showing the appearance of a substrate integrated waveguide having multiple substrates according to an embodiment of the present invention;

[0031] [Figure 7B] FIG. 7 is a top perspective view of a substrate 700 in accordance with one embodiment of the present invention.

[0032] [Figure 7C] FIG. 7 is a top perspective view of a substrate 750 in accordance with one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Please refer to Fig. 1, which is a schematic diagram showing the appearance of a substrate integrated waveguide with multiple substrates according to an embodiment of the present invention. In this embodiment, the substrate integrated waveguide 10 includes two substrates 100, 110, where the substrate 100 is stacked with the substrate 110, and there is at least one line extending along the Z-axis direction passing through the substrates 100, 110. It should be noted that in this embodiment, the substrate 100 is fully stacked with the substrate 110, but in other embodiments, the substrate 100 may not be fully stacked with the substrate 110, for example, the size of the substrate 100 may be different from the size of the substrate 110, or one of the substrates may extend along a certain direction such that the edge of one substrate exceeds the edge of the other substrate.

[0034] In order to make the substrate integrated waveguide, it is necessary for electromagnetic waves to be transmitted within the substrate integrated waveguide 10. Therefore, each of the substrates 100 and 110 should have a waveguide structure suitable for transmitting electromagnetic waves, and an electromagnetic wave transmission channel for transmitting electromagnetic waves needs to be constructed between the substrates 100 and 110 so that the electromagnetic waves can be transmitted through the substrates 100 and 110. In this embodiment, in order to make the substrate 100 a waveguide structure, metal layers are arranged on both the upper and lower surfaces of the substrate 100, and multiple metal holes are arranged between the two metal layers along the direction in which the electromagnetic waves are assumed to be transmitted through the substrate 100. Similarly, in order to make the substrate 110 a waveguide structure, metal layers are arranged on both the upper and lower surfaces of the substrate 110, and multiple metal holes are arranged between the two metal layers along the direction in which the electromagnetic waves are assumed to be transmitted through the substrate 110. Furthermore, a metal-less region 120, in which no metal is present, is disposed between the substrates 100, 110 so that transmission of electromagnetic waves from substrate 100 to substrate 110 or from substrate 110 to substrate 100, i.e., transmission of electromagnetic waves across the substrates 100, 110, can be achieved.

[0035] It should be noted that the metal-less region 120 is formed between the substrates 100, 110 and is therefore not visible from the outside of the substrate integrated waveguide 10. Therefore, the metal-less region 120 in Fig. 1 is drawn with a dotted line. In the following figures, structures that are present inside the component and are not visible from the outside are drawn with a dotted line, as was used to draw the metal-less region 120 in Fig. 1.

[0036] For convenience of description, in the following embodiments, the electromagnetic wave enters the substrate integrated waveguide 10 from the right side of the substrate 100 in the Y-axis direction, and exits the substrate integrated waveguide 10 from the right side of the substrate 110 in the Y-axis direction. Therefore, the structure configured to receive the electromagnetic wave may be formed to connect to the right side of the substrate 100 in the Y-axis direction, and the structure configured to transmit the electromagnetic wave may be formed to connect to the right side of the substrate 110 in the Y-axis direction. It should be noted that the position at which the electromagnetic wave enters or exits the substrate integrated waveguide 10 is not limited to that of the present invention. On the contrary, those skilled in the art can adjust the structure of the substrate integrated waveguide 10 according to the technical solutions provided in the present invention to achieve a predetermined transmission result of the electromagnetic wave when the position at which the electromagnetic wave enters or exits the substrate integrated waveguide 10 is changed.

[0037] Please also refer to Fig. 2A, which is a top view of the substrate 100 shown in Fig. 1 according to an embodiment of the present invention. As shown in Fig. 2A, a metal layer 102A is disposed on the upper surface of the substrate 100, a metal layer is disposed on the lower surface of the substrate 100, a metal-less region 106 in which no metal exists is formed inside the metal layer 102A, and a plurality of metal holes 104A, 104B are formed below the metal layer 102A in the Z-axis direction. The metal holes 104B are arranged in two hole rows 150, 152 along the Y-axis direction, and each of the hole rows 150, 152 includes at least two metal holes 104B, and the hole row 150 is separated from the hole row 152 by a certain distance so that electromagnetic waves can be transmitted along the Y-axis direction through the space formed between the hole rows 150, 152. Furthermore, since the metal holes 104A are arranged in a hole row 154 along the X-axis direction on the left side of the metal-less region 106 in the Y-axis direction, the hole row 154 can form a barrier when the electromagnetic wave is transmitted along the Y-axis direction, thereby reducing interference with the electromagnetic wave from outside the substrate integrated waveguide 10 and the probability of dissipation of the electromagnetic wave inside the substrate integrated waveguide 10.

[0038] Please refer to Figure 2B, which is a cross-sectional view of the embodiment shown in Figure 2A along the cross-sectional line BB'. As shown in Figure 2B, the substrate 100 is mainly composed of a dielectric layer 102C, a metal layer 102A is formed on the upper surface 100A of the substrate 100 (or the dielectric layer 102C), a metal layer 102B is formed on the lower surface 100B of the substrate 100 (or the dielectric layer 102C), and two ends of each metal hole 104A are connected to the metal layers 102A and 102B, respectively. Since the metal-less region 106 is surrounded by the metal layer 102A and does not contain metal, electromagnetic waves can be transmitted along the Z-axis direction in the metal-less region 106 without being blocked by the metal layer 102A.

[0039] Please refer to Figure 2C, which is a cross-sectional view of the embodiment shown in Figure 2A taken along the cross-sectional line CC'. As shown in Figure 2C, in addition to the two ends of each metal hole 104A, the two ends of each metal hole 104B are also connected to the metal layers 102A and 102B, respectively. Therefore, the transmission of electromagnetic waves along the X-axis direction is blocked by the metal hole 104B.

[0040] Please refer to FIG. 3A, which is a top view of the substrate 110 shown in FIG. 1 according to an embodiment of the present invention. As shown in FIG. 3A, a metal layer 112A is disposed on the upper surface of the substrate 110, a metal layer is disposed on the lower surface of the substrate 110, and a plurality of metal holes 114A, 114B are formed below the metal layer 112A in the Z-axis direction. The metal holes 114B are arranged in two hole rows 160, 162 along the Y-axis direction, and each of the hole rows 160, 162 includes at least two metal holes 114B, and the hole row 160 is separated from the hole row 162 by a certain distance so that electromagnetic waves can be transmitted along the Y-axis direction through the space formed between the hole rows 160, 162. A metal-less region 116, where no metal is present, is formed in the metal layer disposed on the lower surface of the substrate 110. Furthermore, the metal holes 114A are arranged in a hole row 164 along the X-axis direction on the left side of the metal-less region 116 in the Y-axis direction, and the hole row 164 forms a barrier when the electromagnetic wave is transmitted along the Y-axis direction, thereby reducing interference with the electromagnetic wave from outside the substrate integrated waveguide 10 and the probability of dissipation of the electromagnetic wave inside the substrate integrated waveguide 10.

[0041] Please refer to Figure 3B, which is a cross-sectional view of the embodiment shown in Figure 3A taken along the cross-sectional line DD'. As shown in Figure 3B, the substrate 110 is mainly composed of a dielectric layer 112C, a metal layer 112A is formed on the upper surface 110A of the substrate 110 (or the dielectric layer 112C), a metal layer 112B is formed on the lower surface 110B of the substrate 110 (or the dielectric layer 112C), and two ends of each metal hole 114A are connected to the metal layers 112A and 112B, respectively. Since the metal-less region 116 is surrounded by the metal layer 112B and does not contain metal, electromagnetic waves can be transmitted along the Z-axis direction in the metal-less region 116 without being blocked by the metal layer 112B.

[0042] Please refer to Figure 3C, which is a cross-sectional view taken along the cross-sectional line EE' of the embodiment shown in Figure 3A. As shown in Figure 3C, in addition to the two ends of each metal hole 114A, the two ends of each metal hole 114B are connected to the metal layers 112A and 112B, respectively. Therefore, the transmission of electromagnetic waves along the X-axis direction is blocked by the metal hole 114B.

[0043] It is well known to those skilled in the art that parameters such as the position, size, and number of metal holes should be designed according to the actual situation to achieve the shielding effect of electromagnetic wave transmission in a specific direction. In other words, the number of metal holes arranged in the hole row 150 or the hole row 152 can be the same as or different from the number of metal holes arranged in the hole row 160 or the hole row 162. The above parameters can be calculated by many calculation formulas known to those skilled in the art, and will not be described in detail here. For the same reason, those skilled in the art can understand that the parameters shown in the embodiments described herein are merely examples and do not limit the present invention. These parameters can be designed and changed according to actual requirements.

[0044] According to the embodiment described in Figures 2A-2C and 3A-3C, a cross-sectional view along the cross-sectional line AA' shown in Figure 1 is shown in Figure 4A. Please refer to Figure 4A. In this embodiment, the substrate 110 is stacked on the substrate 100, the metal layer 112B contacts the metal layer 102A, and the metal-less region 120 is formed by aligning the metal-less region 116 and the metal-less region 106. The electromagnetic wave can be transmitted upward from the dielectric layer 102C to the dielectric layer 112C through the metal-less region 120, or the electromagnetic wave can be transmitted downward from the dielectric layer 112C to the dielectric layer 102C through the metal-less region 120.

[0045] It should be noted that the substrate integrated waveguide with multiple substrates described in the above embodiment is formed by two substrates, each of which includes two metal layers, but the metal layers 112B, 102A shown in FIG. 4A can be integrated into one metal layer instead. See FIG. 4B, which is a cross-sectional view taken along the section line AA′ shown in FIG. 1 according to an embodiment of the present invention. In this embodiment, the above-mentioned metal layers 112B, 102A are integrated into a metal layer 400. In this embodiment, the metal-less region 120 is the same as the metal-less regions 106, 116, the substrate 100 described in the previous embodiment includes a dielectric layer 102C and a metal layer 102B, 400, and the substrate 110 described in the previous embodiment includes a dielectric layer 112C and a metal layer 112A, 400.

[0046] Moreover, in the previous embodiment, the metal-less regions 106, 116, 120 are considered as areas obtained by vertically projecting a predetermined area onto the XY plane of the metal layers 102B, 112A, 400, respectively. Instead of the metal-less regions extending perpendicularly to the XY plane, metal-less regions extending non-perpendicularly to the XY plane can be applied in other embodiments. Please refer to FIG. 4C, which is a cross-sectional view taken along the cross-sectional line AA′ shown in FIG. 1, according to another embodiment of the present invention. The main difference between the embodiments shown in FIG. 4B and FIG. 4C is that the metal-less regions 106, 116, 120 shown in FIG. 4C are composed of spaces extending non-perpendicularly to the XY plane.

[0047] Some embodiments are provided below for reference to those skilled in the art to show how the technical solutions can be applied.

[0048] Please refer to Fig. 5A, which is a schematic diagram showing the appearance of a substrate integrated waveguide with multiple substrates according to an embodiment of the present invention. In this embodiment, the substrate integrated waveguide includes substrates 500 and 510, and a metal-less region 502 is formed in the overlapping area of ​​the substrates 500 and 510. Furthermore, in the Y-axis direction, an electromagnetic wave transmission structure 55 capable of receiving or transmitting electromagnetic waves is connected to the left side of the substrate 500, the electromagnetic wave transmission structure 55 including a microstrip 550 and a tapered line 552, and two electromagnetic wave transmission structures 56A and 56B capable of receiving or transmitting electromagnetic waves are connected to the right side of the substrate 510, the electromagnetic wave transmission structure 56A including a microstrip 560A and a tapered line 562A, and the electromagnetic wave transmission structure 56B including a microstrip 560B and a tapered line 562B.

[0049] Please refer to FIG. 5B, which is a top perspective view of a substrate 500 according to an embodiment of the present invention. It should be noted that the substrate 500 also includes a dielectric layer and two metal layers arranged on both end surfaces of the dielectric layer in the Z-axis direction, similar to the substrates shown in the previous embodiment. As shown in FIG. 5B, in the Y-axis direction, the electromagnetic wave transmission structure 55 is connected to the dielectric layer of the substrate 500 on the left side of the metal-less region 502, and a plurality of metal holes 520A are arranged in a hole row 522A on the right side of the metal-less region 502, and the two ends of each metal hole 520A are respectively connected to the metal layers arranged on both end surfaces of the dielectric layer. Furthermore, on both sides of the metal-less region 502 in the X-axis direction, a plurality of metal holes 520B are arranged to form two hole rows 522B extending along the Y-axis direction, and the two ends of each metal hole 520B are respectively connected to the metal layers arranged on both end surfaces of the dielectric layer of the substrate 500. An electromagnetic wave transmitted from the outside of the substrate 500 to the substrate 500 through the electromagnetic wave transmission structure 55 is first transmitted from left to right along the Y-axis direction through the two hole rows 522B and the electromagnetic wave channel 580 formed between the two metal layers arranged on both end faces of the dielectric layer, and is further transmitted from the substrate 500 to the substrate 510 through the metal-less region 502. On the other hand, when an electromagnetic wave is transmitted from the substrate 510 to the substrate 500 through the metal-less region 502, the electromagnetic wave is first transmitted from right to left along the Y-axis direction through the electromagnetic wave channel 580, and then sent out from the substrate 500 through the electromagnetic wave transmission structure 55.

[0050] Please refer to FIG. 5C, which is a top perspective view of a substrate 510 according to an embodiment of the present invention. It should be noted that the substrate 510 also includes a dielectric layer and two metal layers arranged on both end surfaces of the dielectric layer in the Z-axis direction, similar to the substrates shown in the previous embodiments. As shown in FIG. 5C, in the Y-axis direction, both electromagnetic wave transmission structures 56A and 56B are connected to the dielectric layer of the substrate 510 on the right side of the metal-less region 502, and a plurality of metal holes 530A are arranged in a hole row 532A on the left side of the metal-less region 502, and two ends of each metal hole 530A are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 510. Furthermore, in the X-axis direction, a plurality of metal holes 530B are arranged in three hole rows 532B, 532C, and 532D extending along the Y-axis direction, and two ends of each metal hole 530B are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 510. The electromagnetic wave transmitted from the outside of the substrate 510 to the substrate 510 through the electromagnetic wave transmission structure 56A is first transmitted from right to left along the Y-axis direction through the two hole arrays 532D, 532C and the corresponding electromagnetic wave channel 540A formed between the two metal layers arranged on both end faces of the dielectric layer, and then transmitted from the substrate 510 to the substrate 500 through the metal-less region 502. Similarly, the electromagnetic wave transmitted from the outside of the substrate 510 to the substrate 510 through the electromagnetic wave transmission structure 56B is first transmitted from right to left along the Y-axis direction through the two hole arrays 532C, 532B and the corresponding electromagnetic wave channel 540B formed between the two metal layers arranged on both end faces of the dielectric layer, and then transmitted from the substrate 510 to the substrate 500 through the metal-less region 502. On the other hand, when an electromagnetic wave is transmitted from substrate 500 to substrate 510 through metal-less region 502, the electromagnetic wave is first transmitted along the Y-axis direction from left to right through electromagnetic wave channels 40A, 540B, and then sent out from substrate 510 through corresponding electromagnetic wave transmission structures 56A, 56B.

[0051] According to the present substrate integrated waveguide, by applying the technical solutions described in the above embodiments, the technical effect of transmitting signals from one signal source to multiple target objects or from multiple signal sources to one target object can be achieved. Furthermore, in accordance with the spirit of the technical solutions provided above, the technical effect of transmitting signals from multiple signal sources to multiple target objects can be achieved by adjusting the number of electromagnetic wave channels and electromagnetic wave transmission structures.

[0052] Please refer to FIG. 6A, which is a schematic diagram showing the appearance of a substrate integrated waveguide with multiple substrates according to an embodiment of the present invention. In this embodiment, the substrate integrated waveguide includes substrates 600 and 650, and a metal-less region 62 is formed in the overlapping area of ​​the substrates 600 and 650. In the Y-axis direction, an electromagnetic wave transmission structure 602 configured to receive or transmit electromagnetic waves is connected to the right side of the substrate 600, and an electromagnetic wave transmission structure 652 configured to receive or transmit electromagnetic waves is connected to the right side of the substrate 650. Furthermore, each of the substrates 600 and 650 also includes a dielectric layer and two metal layers arranged on both end faces of the dielectric layer in the Z-axis direction, similar to the substrates shown in the previous embodiment.

[0053] Please refer to Fig. 6B, which is a top perspective view of a substrate 600 according to an embodiment of the present invention. As shown in Fig. 6B, in the Y-axis direction, the electromagnetic wave transmission structure 602 is connected to the dielectric layer of the substrate 600 on the right side of the metal-less region 62, and a plurality of metal holes 610A are arranged in a hole row 620A on the left side of the metal-less region 62, and two ends of each metal hole 610A are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 600. Furthermore, on both sides of the metal-less region 62 in the X-axis direction, a plurality of metal holes 610B are arranged to form two hole rows 620B extending along the Y-axis direction, and two ends of each metal hole 610B are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 600. An electromagnetic wave transmitted from the outside of the substrate 600 to the substrate 600 through the electromagnetic wave transmission structure 602 is first transmitted in the Y-axis direction from right to left through the two hole arrays 620B and the electromagnetic wave channel formed between the two metal layers arranged on both end faces of the dielectric layer of the substrate 600, and is further transmitted from the substrate 600 to the substrate 650 through the metal-less region 62. On the other hand, when an electromagnetic wave is transmitted from the substrate 650 to the substrate 600 through the metal-less region 62, the electromagnetic wave is first transmitted in the Y-axis direction from left to right through the electromagnetic wave channel formed in the substrate 600, and then sent out from the substrate 600 through the electromagnetic wave transmission structure 602.

[0054] Please refer to Fig. 6C, which is a top perspective view of a substrate 650 according to an embodiment of the present invention. As shown in Fig. 6C, in the Y-axis direction, the electromagnetic wave transmission structure 652 is connected to the dielectric layer of the substrate 650 on the right side of the metal-less region 62, and a plurality of metal holes 660A are arranged in a hole row 670A on the left side of the metal-less region 62, and two ends of each metal hole 660A are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 650. Furthermore, in the X-axis direction, a plurality of metal holes 660B are arranged in two hole rows 670B extending along the Y-axis direction, and two ends of each metal hole 660B are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 650. An electromagnetic wave transmitted from the outside of the substrate 650 to the substrate 650 through the electromagnetic wave transmission structure 652 is first transmitted from right to left along the Y-axis direction through the two hole rows 670B and the electromagnetic wave channel formed between the two metal layers arranged on both end faces of the dielectric layer of the substrate 650, and is further transmitted from the substrate 650 to the substrate 600 through the metal-less region 62. On the other hand, when an electromagnetic wave is transmitted from the substrate 600 to the substrate 650 through the metal-less region 62, the electromagnetic wave is first transmitted from left to right along the Y-axis direction through the electromagnetic wave channel formed in the substrate 650, and then sent out from the substrate 650 through the electromagnetic wave transmission structure 652.

[0055] By using the above technical solutions, the transmission direction of the electromagnetic waves can be changed as needed, so that the circuit layout can be made more flexible.

[0056] Please refer to FIG. 7A, which is a schematic diagram showing the appearance of a substrate integrated waveguide with multiple substrates according to an embodiment of the present invention. In this embodiment, the substrate integrated waveguide includes substrates 700 and 750, and a metal-less region 72 is formed in the overlapping area of ​​the substrates 700 and 750. An electromagnetic wave transmission structure 702 configured to receive or transmit electromagnetic waves is connected to the left side of the substrate 700 in the Y-axis direction, a plurality of electromagnetic wave transmission structures 74A, 74B, 74C, and 74D configured to receive or transmit electromagnetic waves are connected to the upper surface of the substrate 750 in the Z-axis direction, and antenna patterns 76A, 76B, 76C, and 76D are disposed on the electromagnetic wave transmission structures 74A, 74B, 74C, and 74D to receive or transmit electromagnetic waves, respectively. Furthermore, each of the substrates 700 and 750 also includes a dielectric layer and two metal layers disposed on both end faces of the dielectric layer in the Z-axis direction, similar to the substrates shown in the previous embodiment.

[0057] Please refer to Fig. 7B, which is a top perspective view of a substrate 700 according to an embodiment of the present invention. As shown in Fig. 7B, in the Y-axis direction, the electromagnetic wave transmission structure 702 is connected to the dielectric layer of the substrate 700 on the left side of the metal-less region 72, and a plurality of metal holes 710A are arranged in a hole row 720A on the right side of the metal-less region 72, and two ends of each metal hole 710A are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 700. Furthermore, on both sides of the metal-less region 72 in the X-axis direction, a plurality of metal holes 710B are arranged to form two hole rows 720B extending along the Y-axis direction, and two ends of each metal hole 710B are respectively connected to metal layers arranged on both end surfaces of the dielectric layer of the substrate 700. An electromagnetic wave transmitted from the outside of the substrate 700 to the substrate 700 through the electromagnetic wave transmission structure 702 is first transmitted from left to right in the Y-axis direction through the two hole arrays 720B and the electromagnetic wave channel formed between the two metal layers arranged on both end faces of the dielectric layer of the substrate 700, and is further transmitted from the substrate 700 to the substrate 750 through the metal-less region 72. On the other hand, when an electromagnetic wave is transmitted from the substrate 750 to the substrate 700 through the metal-less region 72, the electromagnetic wave is first transmitted from right to left in the Y-axis direction through the electromagnetic wave channel formed in the substrate 700, and then sent out from the substrate 700 through the electromagnetic wave transmission structure 702.

[0058] Please refer to Fig. 7C, which is a top perspective view of a substrate 750 according to an embodiment of the present invention. As shown in Fig. 7C, in the XY plane, antenna patterns 76A, 76B, 76C, and 76D are formed in a metal layer disposed on the upper surface of the substrate 750 in the Z-axis direction, and are disposed around a projection area obtained by vertically projecting the metal-less area 72. The antenna patterns 76A to 76D are disposed around the projection area, and a plurality of metal holes 760A and 760B are arranged in two hole rows 770A extending along the X-axis direction and two hole rows 770B extending along the Y-axis direction on the outer periphery of the antenna patterns 76A to 76D, and the two ends of each of the metal holes 760A and 760B are connected to metal layers disposed on both end faces of the dielectric layer of the substrate 750, and the hole rows 770A and 770B together form a barrier that prevents the transmission of electromagnetic waves. In this embodiment, the electromagnetic waves transmitted from the substrate 700 to the substrate 750 through the metal-less region 72 can be freely transmitted in the space surrounded by the hole rows 770A and 770B and can finally be emitted by the antenna patterns 76A to 76D. On the other hand, the electromagnetic waves received by the antenna patterns 76A to 76D can be transmitted in the reverse direction from the substrate 750 to the substrate 700 through the metal-less region 72.

[0059] It should be noted that the above-mentioned embodiments can be adjusted according to actual needs or can be combined to achieve certain technical effects. It should be known to those skilled in the art that the above contents are merely examples to easily explain the technical solutions provided by the present invention, and are not intended to limit the present invention.

[0060] In summary, by applying the above technical solutions, the substrate integrated waveguide with multiple substrates provided in the present invention can transmit signals in the same or different directions in different substrates, so that the circuit design of electronic components using the substrate integrated waveguide is more flexible than before.

Claims

1. A substrate integrated waveguide comprising a plurality of substrates, a first substrate including a first dielectric layer, a first metal layer and a second metal layer disposed on both end surfaces of the first dielectric layer, and a plurality of first metal holes disposed in the first dielectric layer, the first metal holes being arranged in a plurality of first hole rows along a first direction in which an electromagnetic wave is transmitted in the first dielectric layer, and two ends of each of the first metal holes being connected to the first metal layer and the second metal layer, respectively; a second substrate including a second dielectric layer, a third metal layer and a fourth metal layer disposed on both end surfaces of the second dielectric layer, and a plurality of second metal holes disposed in the second dielectric layer, the second metal holes being arranged in a plurality of second hole rows along a second direction in which an electromagnetic wave is transmitted in the second dielectric layer, and two ends of each of the second metal holes being connected to the third metal layer and the fourth metal layer, respectively; the first substrate is laminated to the second substrate, the second metal layer faces the third metal layer, a first metal-less region of the second metal layer and a second metal-less region of the third metal layer are free of metal, electromagnetic waves are transmitted between the first substrate and the second substrate through the first metal-less region and the second metal-less region, a first structure configured to transmit and receive electromagnetic waves is disposed near a first side of the first metal-less region, and a plurality of third metal holes are disposed near a second side of the first metal-less region and arranged in a third hole row along a third direction perpendicular to the first direction, The substrate integrated waveguide, wherein the first side and the second side are on opposite sides of the first metal-less region.

2. 2. The substrate integrated waveguide of claim 1, wherein the number of the first rows of holes is the same as the number of the second rows of holes.

3. 2. The substrate integrated waveguide of claim 1, wherein the number of the first rows of holes is not the same as the number of the second rows of holes.

4. 10. The substrate integrated waveguide of claim 1, wherein a second structure configured to transmit electromagnetic waves is disposed in the second substrate adjacent one side of the second metal-less region.

5. 2. The substrate integrated waveguide of claim 1, wherein a third structure configured to transmit electromagnetic waves is disposed in the second substrate adjacent two sides of the second metal-less region.

6. 2. The substrate integrated waveguide of claim 1, wherein the second metal layer and the third metal layer are integrated into one metal layer.

7. 2. The substrate integrated waveguide of claim 1, wherein the first metal-less region of the second metal layer is a vertical projection of a predetermined region, and the second metal-less region of the third metal layer is a vertical projection of the predetermined region.

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