Board component, board assembly and method for assembling board assembly

Abstract

To provide a board component capable of reducing the possibility of damaging an electronic component and reducing the level of temperature rise of the electronic component, a board assembly, and a method for assembling the board assembly.SOLUTION: A board component to which a radiation fin 210 is attached includes a printed circuit board 110, at least one electronic component 120, and a protective frame 130. The printed circuit board 110 has a front surface 111 facing the radiation fin 210. The at least one electronic component 120 is arranged on the front surface 111. The protective frame 130 is arranged on the front surface 111, and has a wall part 131 standing in a surface outward direction of the front surface 111. The wall part 131 surrounds the entire periphery of the at least one electronic component 120 in a direction orthogonal to the surface outward direction, and includes notches 131b communicating an internal area where the electronic component 120 is located and an external area outside the internal area when the radiation fin 210 is attached.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a substrate component, a substrate assembly, and a method for assembling the substrate assembly. [Background technology]

[0002] 2. Description of the Related Art In order to cool electronic components such as IC packages mounted on a printed circuit board, the printed circuit board may be provided with heat dissipation fins that are in thermal contact with the electronic components. Electronic components are fixed to the printed circuit board by leads, and may also be fixed to heat dissipation fins.

[0003] In the process of manufacturing circuit board components, printed circuit boards that have electronic components mounted but no heat dissipation fins are sometimes handled. In this case, the electronic component is fixed to the printed circuit board only by the leads, so if the electronic component comes into contact with some object, the electronic component (especially the leads and the connections between the leads and the printed circuit board) may be damaged. The possibility of damage is particularly high for electronic components whose leads extend from only one surface.

[0004] Patent Document 1, although not primarily intended to alleviate the above concerns, describes a shielding member that prevents deformation or damage to electronic components due to external mechanical forces. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 8-18194 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the shielding member described in Patent Document 1 cannot completely surround the electronic components, and therefore there remains a possibility that the electronic components may be damaged if an external mechanical force is applied from a specific direction. However, if an electronic component is enclosed all around and then further covered from above with heat dissipation fins, the heat generated by the electronic component when electricity is applied is more likely to be trapped than in a state where the electronic component is not enclosed all around, and the temperature of the electronic component may be more likely to rise when the board component is actually in use.

[0007] The present disclosure has been made in consideration of the above circumstances, and aims to provide a board component, a board assembly, and an assembly method for a board assembly that can reduce the possibility of damage to electronic components and reduce the degree of temperature rise in the electronic components. [Means for solving the problem]

[0008] In order to solve the above problems, the board component, board assembly, and assembling method of the board assembly disclosed herein employ the following measures. A board component according to one embodiment of the present disclosure is a board component to which a heat dissipation component is attached, and comprises a printed circuit board, at least one electronic component, and a protective frame, wherein the printed circuit board has a first surface facing the heat dissipation component, the at least one electronic component is arranged on the first surface, and the protective frame is arranged on the first surface and has a wall portion standing in an out-of-plane direction of the first surface, the wall portion surrounding the entire periphery of the at least one electronic component in a direction perpendicular to the out-of-plane direction, and including a communication structure that connects an inner region in which the electronic component is located and an outer region outside the inner region when the heat dissipation component is attached.

[0009] A board assembly according to one embodiment of the present disclosure comprises a board component, the heat dissipation component, and a fastening component, the fastening component having a head and a shaft portion, the head sandwiching the fixing device, the printed circuit board, and the fixing portion of the protective frame between the head and the heat dissipation component, and the shaft portion is inserted into the fixing device, the printed circuit board, and the fixing portion of the protective frame and fastened to the heat dissipation component.

[0010] A method for assembling a board assembly according to one embodiment of the present disclosure includes a protective frame attaching step and a heat dissipation component attaching step, in which the protective frame is attached to a printed board on which at least one electronic component is arranged, and in the heat dissipation component attaching step, a heat dissipation component is attached to the printed board at a position such that the protective frame is positioned between the printed board and the heat dissipation component and so as to contact the at least one electronic component, the at least one electronic component is arranged on a first surface of the printed board, the protective frame is arranged on the first surface and has a wall portion standing in an out-of-plane direction of the first surface, the wall portion surrounds the entire periphery of the at least one electronic component in a direction perpendicular to the out-of-plane direction, and includes a communication structure that connects an inner region in which the electronic component is located and an outer region outside the inner region when the heat dissipation component is attached. Effect of the Invention

[0011] According to the present disclosure, the possibility of damage to electronic components can be reduced, and the degree of temperature rise in the electronic components can be reduced. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a substrate assembly according to an embodiment of the present disclosure. [Diagram 2] FIG. 1 is an exploded perspective view of a substrate assembly according to an embodiment of the present disclosure. [Diagram 3] FIG. 2 is an exploded perspective view of a substrate component according to an embodiment of the present disclosure. [Figure 4] 1 is a bottom view of a protective frame provided on a substrate component according to an embodiment of the present disclosure. FIG. [Diagram 5] 5 is a cross-sectional view taken along line VV shown in FIG. [Figure 6] FIG. 2 is a partially enlarged side view of a substrate assembly according to one embodiment of the present disclosure. [Figure 7] FIG. 2 is an exploded side view of a substrate assembly according to an embodiment of the present disclosure. [Figure 8]FIG. 2 is an exploded side view of a substrate assembly according to an embodiment of the present disclosure. [Figure 9] FIG. 2 is an exploded side view of a substrate assembly according to an embodiment of the present disclosure. [Figure 10] FIG. 2 is a side view of a substrate assembly according to an embodiment of the present disclosure. [Figure 11] FIG. 13 is a partially enlarged side view of a substrate assembly according to a modified example of an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, a board component, a board assembly, and an assembly method for a board assembly according to an embodiment of the present disclosure will be described with reference to the drawings.

[0014] <Board assembly> As shown in FIG. 1, the board assembly 10 includes a board component 100, a heat dissipation fin 210 (heat dissipation component), and a screw 220 (fastening component) for fastening the heat dissipation fin 210 to the board component 100.

[0015] As shown in FIG. 2, the board component 100 includes a printed board 110, at least one electronic component 120, a protective frame 130, and at least one bushing 140 (fixing device) for fixing the protective frame 130 to the printed board 110.

[0016] As shown in FIG. 3, the printed circuit board 110 has a front surface 111 (first surface), a back surface 112 (second surface), and a through hole 113. Front surface 111 is the surface on which electronic components 120 and protective frame 130 are arranged, and also faces heat dissipation fins 210.

[0017] The electronic component 120 is, for example, an IC package, and is mounted on the printed circuit board 110 . The electronic component 120 has a body 121 and a number of leads 122. The body 121 is a cubic-shaped part and includes, for example, a power semiconductor. Each lead 122 extends from a side surface of the body 121. The electronic component 120 is of a type in which the leads 122 extend from only one side surface of the body 121 . When there are a plurality of electronic components 120, it is preferable that the electronic components 120 are collectively arranged in a predetermined position and in a predetermined range on the front surface 111.

[0018] The board component 100 may include at least one electronic component 125. Electronic component 125 is mounted on printed circuit board 110 in the same manner as electronic component 120, but is of a type in which the leads extend from two or more side surfaces of the main body.

[0019] The protective frame 130 is a component for protecting the electronic component 120 mounted on the printed circuit board 110 from external mechanical forces. The protective frame 130 is made of, for example, an insulating material. As shown in FIGS. 3 to 5, the protective frame 130 has a wall portion 131 and at least one fixing portion 132.

[0020] The wall portion 131 is an annular wall that stands in a predetermined direction and has a predetermined thickness. The wall portion 131 defines a closed area (the inner area A1) on the inside. In other words, the inner area A1 is an area surrounded by the wall portion 131. As shown in FIG. 2, the above-mentioned "predetermined direction" approximately coincides with the out-of-plane direction of the front surface 111 when the protective frame 130 is fixed to the printed circuit board 110. The wall portion 131 is shaped so that all of the electronic components 120 are located in the inner area A1 when the protective frame 130 is fixed to the printed circuit board 110. In other words, the wall portion 131 is shaped so as to surround all of the electronic components 120 in a direction perpendicular to the out-of-plane direction of the front surface 111 when the protective frame 130 is fixed to the printed circuit board 110.

[0021] The wall portion 131 includes a peripheral edge 131a. The peripheral edge 131a is an edge of the wall portion 131 that faces the heat dissipation fins 210. In other words, the peripheral edge 131a is also an edge of the wall portion 131 that is located opposite the edge of the wall portion 131 that faces the printed circuit board 110. The peripheral edge 131a has notches 131b as a communication structure. The notches 131b are portions that are lower than the rest of the peripheral edge 131a. The notches 131b are provided at intervals along the peripheral edge 131a. The height position of the periphery 131a (portion other than the notch 131b) in a predetermined direction is set so as to be at the same position as the surface of the main body 121 of the electronic component 120 that contacts the heat dissipation fins 210 when the protective frame 130 is fixed to the printed circuit board 110. Therefore, when the board component 100 is viewed from a direction perpendicular to the predetermined direction, the main body 121 and the leads 122 of the electronic component 120 are covered by the wall portion 131. Covering the electronic component 120 in this manner reduces the possibility that the electronic component 120 mounted on the printed circuit board 110 will come into contact with an external object when the board component 100 is handled by itself. This reduces the possibility that the electronic component 120 will be damaged when the board component 100 is handled by itself.

[0022] As shown in FIGS. 5 and 6, when the heat dissipating fin 210 is fixed to the board component 100, the peripheral edge 131a comes into contact with the heat dissipating fin 210 except for the notch 131b, and the notch 131b does not come into contact with the heat dissipating fin 210. Therefore, when the heat dissipating fin 210 is fixed to the board component 100, a gap is defined between the notch 131b and the heat dissipating fin 210, and this gap provides communication between the inner area A1 and the outer area A2 located outside the inner area A1. By connecting the inner area A1 and the outer area A2, heat (heat generated by the electronic component 120 when current is applied) trapped in the inner area A1 can be discharged to the outer area A2, thereby reducing the degree of temperature rise of the electronic component 120.

[0023] The fixing portion 132 is a portion for fixing the protective frame 130 (wall portion 131) to the printed circuit board 110. The fixing portion 132 is provided on the outer surface of the wall portion 131. The fixing portion 132 may be integrated with the wall portion 131. 4, for example, the number of fixed portions 132 is two. However, the number of fixed portions 132 may be one, or three or more.

[0024] As shown in FIGS. 4 and 5, the fixing portion 132 includes a through hole 132a. The through hole 132a is a hole that penetrates the fixed portion 132 in the same direction as the wall portion 131 stands. The through hole 132a is a hole into which the bushing 140 and the screw 220 are inserted.

[0025] The protective frame 130 configured as above is fixed to the printed circuit board 110 by a bush 140 . As shown in FIG. 5, the bushing 140 has a head portion 141 and a shaft portion 142 . The bushing 140 is attached from the back surface 112 of the printed circuit board 110. Specifically, the bushing 140 is attached so that the shaft portion 142 is inserted into the through hole 113 of the printed circuit board 110 and so that the head portion 141 abuts against the back surface 112 of the printed circuit board 110. At this time, the tip portion of the shaft portion 142 protrudes from the front surface 111 of the printed circuit board 110. The protruding portion of the shaft portion 142 is fitted into a through hole 132a included in a fixing portion 132 of the protective frame 130 disposed on the front surface 111 of the printed circuit board 110. In this way, the protective frame 130 is fixed to the printed circuit board 110.

[0026] It should be noted that if multiple protective frames 130 are prepared, it is not necessary to position all of the electronic components 120 in one inner area A1 defined by the wall portions 131 of one protective frame 130.

[0027] The heat dissipation fins 210 are components for cooling the electronic components 120 and 125, which are heat generating bodies. As shown in FIGS. 1, 5 and 6, when heat dissipation fin 210 is fixed to substrate component 100, heat dissipation fin 210 is in thermal contact with main body 121 of electronic component 120 and the main body of electronic component 125. As shown in FIG.

[0028] As shown in FIG. 6, the heat dissipation fins 210 are fastened to the board component 100 by screws 220. The screw 220 has a head 221 and a shaft 222 . The screw 220 is attached from the back surface 112 of the printed circuit board 110. Specifically, the screw 220 is attached so that the shaft portion 222 is inserted into the through hole 132a of the bush 140 and the fixing portion 132 of the protective frame 130, and so that the head portion 221 (the head portion 221 of the screw 220) abuts against the head portion 141 of the bush 140. At this time, the tip portion of the shaft portion 222 protrudes from the fixing portion 132 of the protective frame 130. The protruding portion of shaft 222 is screwed to heat dissipation fin 210 arranged on front surface 111 of printed circuit board 110. This results in heat dissipation fin 210 being fastened to board component 100. At the same time, bush 140, printed circuit board 110, and protective frame 130 are fastened together by screw 220 and heat dissipation fin 210. Although not shown, the bushing 140 has a through hole through which the shaft portion 222 is inserted.

[0029] <How to assemble the board> First, as shown in FIGS. 7 and 8, the bush 140 is attached to the printed circuit board 110 on which the electronic components 120 and 125 are mounted. Specifically, the shaft portion 142 of the bushing 140 is inserted into the through hole 113 of the printed circuit board 110 , and the head portion 141 of the bushing 140 is brought into contact with the back surface 112 of the printed circuit board 110 . As a result, as shown in FIG. 8, shaft portion 142 of bushing 140 protrudes from front surface 111 of printed circuit board 110.

[0030] Next, as shown in FIGS. 8 and 9, the protective frame 130 is attached to the printed circuit board 110 (protective frame attachment step). Specifically, the portion of the shaft portion 142 of the bushing 140 protruding from the front surface 111 of the printed circuit board 110 is fitted into the through hole 132 a included in the fixing portion 132 of the protective frame 130 . In this way, the substrate component 100 is completed.

[0031] Next, as shown in FIGS. 9 and 10, the heat dissipation fins 210 are attached to the board component 100 (heat dissipation component attachment step). Specifically, the shaft portion 222 of the screw 220 is inserted into the through hole 132 a of the bush 140 and the fixing portion 132 of the protective frame 130 . Then, the shaft portion 222 of the screw 220 protruding from the fixing portion 132 is screwed into the heat dissipation fin 210 . This completes the substrate assembly 10.

[0032] According to this embodiment, the following effects are obtained. Protective frame 130 has wall portion 131, which surrounds electronic component 120 all around, reducing the possibility that electronic component 120 mounted on printed circuit board 110 will come into contact with an external object when board component 100 is handled by itself. This reduces the possibility that electronic component 120 will be damaged when board component 100 is handled by itself.

[0033] Furthermore, the wall portion 131 includes the notch 131b as a communication structure that communicates the inner area A1 where the electronic component 120 is located with the outer area A2 outside it when the heat dissipation fin 210 is attached to the board component 100, so that the heat (heat generated by the electronic component 120 when current is applied) trapped in the inner area A1 can be discharged to the outer area A2 even when the heat dissipation fin 210 is attached to the board component 100. This reduces the degree of temperature rise of the electronic component 120.

[0034] Furthermore, since the wall portion 131 has a height dimension sufficient to cover the main body 121 of the electronic component 120, the possibility of the entire electronic component 120 being damaged can be reduced. Furthermore, even if the electronic component 120 is a type in which the leads 122 extend from only one side surface, the protective frame 130 can reduce the possibility of the electronic component 120 being damaged.

[0035] The bush 140 is inserted into the printed circuit board 110 from the back surface 112 toward the front surface 111, and the protective frame 130 has a fixing portion 132 into which the bush 140 is inserted, so that the protective frame 130 can be fixed to the printed circuit board 110 by the bush 140 inserted into the printed circuit board 110 from the back surface 112.

[0036] In addition, the screw 220 has a head 221 and a shaft 222, and the head 221 sandwiches the bush 140, the printed circuit board 110 and the fixed portion 132 of the protective frame 130 between the head 221 and the heat dissipation fin 210, and the shaft 222 is inserted into the fixed portion 132 of the bush 140, the printed circuit board 110 and the protective frame 130 and is fastened to the heat dissipation fin 210, so that the screw 220 and the heat dissipation fin 210 can tighten the bush 140, the printed circuit board 110 and the protective frame 130 together.

[0037] <Variation 1> The communication structure does not have to be the notch 131b, and may be, for example, at least one through hole provided in the wall portion 131 where the notch 131b is not formed. In addition, the shape of the through hole is not particularly limited. In this case, the peripheral edge 131a is a flat edge.

[0038] <Variation 2> As shown in FIG. 6, in the protective frame 130 described in the embodiments so far, when the board component 100 is viewed from a direction perpendicular to the specified direction, the wall portion 131 (portions other than the notch 131b) covers the main body 121 and leads 122 of the electronic component 120. However, as shown in FIG. 11, the protective frame 130 may be configured so that the wall portion 131 covers at least the leads 122 of the electronic component 120 when the board component 100 is viewed from a direction perpendicular to the predetermined direction. In this case, gaps (communicating structure) are formed in all portions between the periphery 131a and the heat dissipation fins 210. This makes it possible to provide the communicating structure in the protective frame 130 without forming the notch 131b in the periphery 131a. At least the leads 122 of the electronic component 120 are covered with the protective frame 130, so the possibility of the leads 122 being damaged can be reduced.

[0039] The board component, the board assembly, and the method for assembling the board assembly according to the embodiment described above can be understood, for example, as follows. A substrate component (100) according to a first aspect of the present disclosure is a substrate component to which a heat dissipation component (210) is attached, and comprises a printed circuit board (110), at least one electronic component (120), and a protective frame (130), wherein the printed circuit board has a first surface (111) facing the heat dissipation component, the at least one electronic component is arranged on the first surface, the protective frame is arranged on the first surface and has a wall portion (131) standing in an out-of-plane direction of the first surface, the wall portion surrounds the entire periphery of the at least one electronic component in a direction perpendicular to the out-of-plane direction, and includes a communication structure that, when the heat dissipation component is attached, connects an inner region (A1) in which the electronic component is located to an outer region (A2) outside the inner region.

[0040] According to the circuit board component of this aspect, the protective frame has a wall portion that surrounds the entire periphery of the electronic component, so that when the circuit board component is handled alone, the electronic component mounted on the printed circuit board can be less likely to come into contact with an external object, thereby reducing the possibility of the electronic component being damaged when the circuit board component is handled alone. In addition, according to the circuit board component of this embodiment, the wall portion surrounding the electronic component includes a communication structure that connects the inner region where the electronic component is located when the heat dissipation component is attached to the circuit board component with the outer region outside the inner region, so that even when the heat dissipation component is attached to the circuit board component, heat (heat generated by the electronic component when current is applied) trapped in the inner region can be discharged to the outer region, thereby reducing the degree of temperature rise of the electronic component.

[0041] In the first aspect of the substrate component according to the second aspect of the present disclosure, at least one of the electronic components has a body (121) in contact with the heat dissipation component and a lead (122) extending from a side of the body, and the wall portion has a height dimension that covers at least the lead when viewed from a direction perpendicular to the out-of-plane direction, when the dimension in the out-of-plane direction is taken as the height dimension.

[0042] According to the board component of this aspect, the wall portion has a height dimension sufficient to cover the leads, so that at least the possibility of damage to the leads of the electronic component can be reduced.

[0043] A substrate component according to a third aspect of the present disclosure is the second aspect, wherein the wall portion has a height dimension that covers the main body of the electronic component when viewed from a direction perpendicular to the out-of-plane direction.

[0044] According to the board component of this aspect, the wall portion has a height dimension sufficient to cover the main body, thereby reducing the possibility of the entire electronic component being damaged.

[0045] A fourth aspect of the present disclosure relates to a substrate part in any one of the first to third aspects, wherein the wall portion includes a periphery (131a) facing the heat dissipation component, and the communication structure includes at least one notch (131b) provided in the periphery, and when the heat dissipation component is attached, the periphery other than the notch comes into contact with the heat dissipation component and the notch does not come into contact with the heat dissipation component.

[0046] In the circuit board part of this embodiment, the communication structure includes at least one notch provided on the periphery of the wall portion, and when the heat dissipation component is attached to the circuit board part, parts of the periphery other than the notch come into contact with the heat dissipation component and the notch does not come into contact with the heat dissipation component, so that the gap defined by the notch and the heat dissipation component can be used as the communication structure.

[0047] A fifth aspect of the present disclosure relates to a board component according to any one of the first to fourth aspects, and includes a fastener (140), the printed circuit board having a second surface (112) opposite the first surface, the fastener being inserted into the printed circuit board from the second surface toward the first surface, and the protective frame having a fixing portion (132) connected to the wall portion, the portion of the fastener inserted into the printed circuit board being inserted into the fixing portion.

[0048] According to the circuit board component of this embodiment, the fastener is inserted into the printed circuit board from the second surface toward the first surface, and the protective frame has a fixing portion into which the fastener is inserted, so that the protective frame can be fixed to the printed circuit board by the fastener inserted into the printed circuit board from the second surface.

[0049] A sixth aspect of the present disclosure relates to a board component according to the second aspect, wherein at least one of the electronic components has the leads extending from only one side surface of the body.

[0050] According to the board component of this embodiment, even if the electronic component is a type in which the leads extend from only one side surface, the protective frame can reduce the possibility of the electronic component being damaged.

[0051] A board assembly (10) according to a seventh aspect of the present disclosure comprises the board component according to the fifth aspect, the heat dissipation component, and a fastening component (220), the fastening component having a head (221) and a shaft portion (222), the head sandwiching the fixing device, the printed circuit board, and the fixing portion of the protective frame between the head and the heat dissipation component, and the shaft portion being inserted into the fixing portion of the fixing device, the printed circuit board, and the protective frame and fastened to the heat dissipation component.

[0052] An assembling method for a board assembly according to an eighth aspect of the present disclosure includes a protective frame attaching step and a heat dissipation component attaching step, in which the protective frame is attached to a printed board on which at least one electronic component is arranged, and in the heat dissipation component attaching step, a heat dissipation component is attached to the printed board at a position such that the protective frame is positioned between the printed board and the heat dissipation component and so as to contact the at least one electronic component, the at least one electronic component is arranged on a first surface of the printed board, the protective frame is arranged on the first surface and has a wall portion standing in an out-of-plane direction of the first surface, the wall portion surrounds the entire periphery of the at least one electronic component in a direction perpendicular to the out-of-plane direction, and includes a communication structure that connects an inner region in which the electronic component is located and an outer region outside the inner region when the heat dissipation component is attached. [Explanation of symbols]

[0053] 10 Board Assembly 100 PCB components 110 Printed Circuit Board 111 Front page (first page) 112 Back side (2nd side) 113 Through hole 120 Electronic Components 121 Main unit 122 Leads 125 Electronic Components (Electronic Components Not Subject to Protection) 130 Protective Frame 131 Wall 131a Periphery 131b Notch (communication structure) 132 Fixed part 132a Through hole 140 Bush (fixing device) 141 Head 142 Shaft 210 Heat dissipation fin (heat dissipation part) 220 Screws (fastening parts) 221 Head 222 Shaft A1 inner area A2 outer area

Claims

1. A substrate component to which a heat dissipation component is attached, A printed circuit board; At least one electronic component; A protective frame and Equipped with the printed circuit board has a first surface facing the heat dissipation component, At least one of the electronic components is disposed on the first surface; The protective frame is disposed on the first surface, A wall portion standing in an out-of-plane direction of the first surface, The wall portion is Surrounding at least one of the electronic components in a direction perpendicular to the out-of-plane direction; The heat dissipation component includes a communication structure that communicates an inner region in which the electronic component is located and an outer region outside the inner region when the heat dissipation component is attached. Circuit board parts.

2. At least one of the electronic components has a body in contact with the heat dissipation component and a lead extending from a side surface of the body, When the dimension in the out-of-plane direction is defined as a height dimension, the wall portion has the height dimension that covers at least the lead when viewed from a direction perpendicular to the out-of-plane direction. The substrate component according to claim 1 .

3. The wall portion has a height dimension that covers the main body of the electronic component when viewed in a direction perpendicular to the out-of-plane direction. The substrate component according to claim 2 .

4. The wall portion includes a periphery facing the heat dissipation component, the communication structure includes at least one notch provided on the periphery, When the heat dissipation component is attached, the peripheral edge is in contact with the heat dissipation component except for the notch, and the notch is not in contact with the heat dissipation component. The substrate component according to claim 1 .

5. Fixture Equipped with the printed circuit board has a second surface opposite the first surface; the fastener is inserted into the printed circuit board from the second surface toward the first surface, the protective frame has a fixing portion connected to the wall portion, The portion of the fixture that is inserted into the printed circuit board is inserted into the fixing portion. The substrate component according to claim 1 .

6. At least one of the electronic components has the leads extending from only one side of the body. The substrate component according to claim 2 .

7. The substrate component according to claim 5 ; The heat dissipation component; A fastening part; Equipped with The fastening component has a head and a shaft, the head sandwiches the fixing tool, the printed circuit board, and the fixing portion of the protective frame between the heat dissipation component and the head, The shaft portion is inserted into the fixing portion of the fixture, the printed circuit board, and the protective frame, and is fastened to the heat dissipation component. Circuit board assembly.

8. A protective frame mounting process; A heat dissipation component mounting process; Including, In the protective frame attachment step, a protective frame is attached to a printed circuit board on which at least one electronic component is arranged, In the heat dissipation component mounting step, a heat dissipation component is mounted on the printed circuit board at a position where the protective frame is located between the printed circuit board and the heat dissipation component and where the heat dissipation component is in contact with at least one of the electronic components; At least one of the electronic components is disposed on a first surface of the printed circuit board; The protective frame is disposed on the first surface, A wall portion standing in an out-of-plane direction of the first surface, The wall portion is Surrounding at least one of the electronic components in a direction perpendicular to the out-of-plane direction; The heat dissipation component includes a communication structure that communicates an inner region in which the electronic component is located and an outer region outside the inner region when the heat dissipation component is attached. A method for assembling a board assembly.

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