Power module and manufacturing method thereof

Abstract

To provide a power module and a manufacturing method thereof that greatly simplifies the replacement of one chip with another one.SOLUTION: A power module includes: a first housing element 10 having a first central through-cutout for receiving a first chip 70; the first chip 70 having a plurality of electrical contacts at least partially received in the first central through-cutout; connection elements 41, 42, 43 electrically connected to the electrical contacts of the first chip; and at least one insulating shim 90 at least partially arranged in the first cutout so as to at least partially cover the first chip. The at least one insulating shim has at least one opening providing access through the shim to the at least one electrical contact of the first chip, as well as, at least one track ensuring connection to one of the connection elements and / or capacitor 100.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a semiconductor power module and a method for manufacturing a semiconductor power module. [Background technology]

[0002] A power module generally comprises at least two electronic chips electrically connected to connection elements, such as metal tabs, and may also include one or more capacitors electrically connected to the chips or the connection elements.

[0003] Examples of power modules are disclosed in FR3115651, WO2018 / 024973, and U.S. Pat. No. 9,041,183.

[0004] In application WO2018 / 024973 the chip is accommodated in a suitably shaped cutout in the support.

[0005] Existing power modules are developed specifically for a particular chip, taking into account the size of the chip and the location of the electrical contacts, and therefore some include screen printed electrical tracks that depend on the placement of these contacts.

[0006] The disadvantage of these modules is that they cannot use chips other than those for which the modules were developed, without an extensive overhaul of the manufacturing process, in particular the screen printing steps and / or the shape of the support that receives the chips.

[0007] However, module manufacturers sometimes face supply difficulties that force them to change chip suppliers, and redesigning manufacturing methods when there is a change in chip model and use of new models that do not have the same dimensions and / or contact arrangements results in significant production delays and significant additional costs. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] FR3115651 [Patent Document 2] WO2018 / 024973 [Patent Document 3] U.S. Patent No. 9,041,183 Summary of the Invention [Problem to be solved by the invention]

[0009] Therefore, there is a need to overcome this shortcoming. [Means for solving the problem]

[0010] The present invention aims to meet this need and, according to one of its aspects, comprises: a first housing element having a first notch for receiving a first tip; a first tip having electrical contacts at least partially received within the first notch; a connection element electrically connected to the electrical contacts of the first chip; at least one insulating shim at least partially arranged in the first cutout so as to at least partially cover said chip, the at least one insulating shim having at least one opening providing access through the shim to at least one electrical contact of the first chip and / or at least one track ensuring a connection to one of the connecting elements and / or the potential capacitor; It does so by proposing a power module comprising:

[0011] The present invention allows the use of multiple chips having different dimensions and / or contact arrangements while limiting the changes applied to the module when switching from one chip model to another.

[0012] In particular, different shims can be used depending on the chip to make the chip compatible with most of the elements that make up the module, so that these elements can remain unchanged.

[0013] This greatly simplifies replacing one chip with another, as it no longer requires extensive rethinking of manufacturing methods as in the prior art.

[0014] Thus, in a preferred exemplary implementation of the present invention, the shim is the only element that needs to be modified to enable the use of a different chip on an existing module.

[0015] The module includes a second housing element having a second notch for receiving a second chip; a third housing element disposed between the first housing element and the second housing element and having at least a third recess, in particular for receiving a capacitor; a second tip having electrical contacts at least partially received within the second notch; a connection element electrically connected to the electrical contacts of the second chip; and at least one capacitor at least partially received within the third notch and electrically connected to at least one of the chips and / or to the connection element.

[0016] Shim The shim may be manufactured without conductive elements such as electrical tracks, or alternatively, with at least one such conductive element.

[0017] The shim may be made of any suitable material, in particular ceramic or other material, and its shape is obtained by sintering, 3D printing, machining, etc.

[0018] The shims are already present upon introduction into the corresponding cut-outs of the modules.

[0019] The shape of the shim depends on the chip model associated with the shim.

[0020] In an example, the shim has at least one lateral opening at an edge into which a corresponding connection element, for example a metal electrical connection tab of flattened cross section, electrically connected to a contact of the chip is engaged.

[0021] In the example, the shim has, at its two opposite longitudinal edges, two separate lateral openings into which two corresponding connection elements electrically connected to two separate contacts of the chip engage. These connection elements are, for example, metal tabs extending away from the power module. They are, for example, contacts corresponding to the power terminals of a transistor, such as the source or drain.

[0022] The connection elements may be soldered to corresponding contacts of the chip by any means, for example, with a solder paste disposed at the interface between the components to be soldered together.

[0023] At an edge substantially perpendicular to said longitudinal edge, the shim may have additional openings into which additional connection elements electrically connected to individual contacts of the chip may engage, these contacts corresponding to control terminals, for example gate contacts of a power transistor.

[0024] This additional connection element can be soldered directly to the corresponding contacts of the chip, or, as a variant, the shim has electrical tracks soldered to the corresponding contacts of the chip and the additional connection element is soldered to the tracks.

[0025] The first notch that receives the tip may have a rectangular or other shaped outline, although a rectangular shape is preferred.

[0026] The chip may not occupy the entire notch in question in top view.

[0027] If the chip occupies the entire cutout in top view, the cutout may allow the chip to be placed in the cutout within the assembly clearance. In this case, the shim may simply overlap the chip without being interposed between said chip and one or more edges of the cutout. The shim may then only have the function of thickness compensation, helping to position the connection elements and potentially also serving to establish electrical connections between the contacts of the chip and connection elements that are not directly overlapped therewith.

[0028] In contrast, if the chip does not occupy the entire notch in top view, a shim is advantageously inserted between the chip and at least one edge of the notch to help position the chip within the notch.

[0029] Thus, in an example embodiment, the shim is longer than the tip at its contact point and has at least one portion engaged in a notch between the tip and the housing element defining the notch for receiving the tip, for example, the shim is interposed on at least three sides, in particular four sides, between the tip and the housing element defining the notch for receiving the tip.

[0030] The shim may have a surface that is substantially flush with a surface of the housing element that defines a notch that receives a tip in contact with the shim.

[0031] Other features The third housing element may have a notch for receiving the connecting element arranged to allow the connecting element to overlap the electrical contacts of the second chip.

[0032] The housing elements may be pierced by holes allowing the passage of retaining members, in particular screws, for holding the housing elements in the assembled state.

[0033] The module may comprise at least one heat transfer element in contact with the outer surface of the chip, more preferably two heat transfer elements each in contact with the outer surface of a respective chip, the or these heat transfer elements each comprising a plate of metal, preferably copper.

[0034] Array of Modules A further subject of the invention is an array of power modules comprising at least a first and a second module according to the invention, where at least one of the chips of the first module differs from the corresponding chip of the other module, the two modules comprising different shims and at least identical first and second housing elements. "Different chips" should be understood to mean that the chip models differ by at least one of their dimensions, in particular the length and / or width, and / or the arrangement of the contacts.

[0035] The connecting elements may be identical and the third housing elements may also be identical.

[0036] Manufacturing method A further subject of the invention is a method for manufacturing a power module, in particular a module according to the invention as defined above, which comprises: a lower housing element having a first notch for receiving a first tip; a first tip having electrical contacts at least partially received within the first notch; The method comprises: The method includes covering the chip present in the first notch with an insulating shim, the shim defining at least one opening that is aligned with at least one electrical contact of the chip or having electrical tracks connected to the electrical contacts of the chip, in particular tracks leading to openings in the shim for receiving connecting elements.

[0037] In such a method, the shim can assist in positioning one or more connection elements relative to the chip and in positioning the chip within the notch, particularly when the notch is larger than the chip in top view and the shim is interposed between at least one edge of the notch and the chip, the shim being selected from among a number of existing shims depending on the type of chip used, all of which are adapted to be positioned within the notch of the lower housing element.

[0038] Shims, for example, a shim, preferably of substantially constant thickness, having two opposing openings on its long sides and one opening on its short side, the dimensions of the shim substantially corresponding to the dimensions of the cutout in the first housing element; a shim having two opposing openings in its long sides and one opening in its short side, the dimensions of the shim substantially corresponding to the dimensions of the notch in the first housing element, the shim having opposing lateral folds on its surface facing the tip, each for interposing between a long side of the tip and a corresponding edge of the first notch, at least one end tab for interposing between a short side of the tip and a corresponding edge of the first notch, and at least one portion opposite the end tab for engaging a notch between the tip and the lower housing element; a shim having two opposing openings in its long sides and one opening in its short side, the dimensions of the shim substantially corresponding to the dimensions of a cutout in the first housing element, the shim having at least two portions each for interposing between the short sides of the shim and a corresponding edge of the cutout, the shim having opposing lateral folds on its surface facing the chip each for interposing between the long sides of the chip and the corresponding edge of the first cutout, the shim also having at least one conductive track arranged to be at least partially overlapped with contacts and connection elements of the chip; The opening in each shim may be in the form of a notch.

[0039] In an exemplary implementation of the present invention, a method includes: introducing an upper housing element having a second notch for receiving a second tip; introducing an intermediate housing element disposed between the upper element and the lower element; introducing a second tip having electrical contacts at least partially received within the second notch; Introducing a connecting element electrically connected to the electrical contacts of the chip; introducing at least one capacitor electrically connected to at least one of the chips and / or the connection element; Includes.

[0040] The method advantageously comprises the step of using an assembly guide having at least a primary notch adapted to receive at least the lower housing element, the assembly guide preferably having a secondary notch adapted to receive the connecting element.

[0041] The main notch may have a bottom with at least one recess for receiving a nut or a screw head, and the method may include a step of positioning at least one nut or screw head in the main notch before the lower housing element is introduced in particular into said main notch.

[0042] The method may comprise the step of placing a heat transfer element, in particular a metal, preferably copper, plate, at the bottom of the main cutout.

[0043] In an exemplary implementation, the method comprises the following sequence of steps: - optionally introducing a nut into a corresponding notch potentially provided at the bottom of a main notch of the assembly guide; - introducing a heat transfer element, preferably in the form of a metal plate, into the main recess, where appropriate covering the nut; Introducing a lower housing element into the heat transfer element; Introducing a first tip into a notch defined by a first housing element; introducing a shim into the first chip; - introducing a connection element adapted to cover at least one contact of the chip and / or a track electrically connected to the contact of the chip; Introducing an intermediate housing element; - introducing a capacitor into one of the connection elements, in particular into a corresponding cutout of the intermediate housing element, said capacitor having a first electrical contact facing the connection element on which the capacitor is arranged; introducing at least one other connection element extending at least partially facing the second electrical contact of the capacitor; Introducing the upper housing element into the assembly present in the main cutout of the assembly guide; Introducing a second tip into the notch of the upper housing element; introducing a second heat transfer element, in particular in the form of a metal, preferably copper, plate; assembling the housing elements thus superimposed, if necessary by means of screws engaged with nuts; In particular, establishing electrical contact by subjecting the assembly to a temperature that melts the solder paste present between the surfaces to be soldered; Includes.

[0044] The method may include replacing a shim with a differently shaped shim adapted to a different chip model.

[0045] Further subject-matter of the invention is such an assembly guide, as well as an assembly guide and an assembly of modular components to be assembled using the guide.

[0046] The invention can be better understood upon reading the following detailed description of non-limiting exemplary implementations and upon examining the accompanying drawings, in which: [Brief description of the drawings]

[0047] [Figure 1] FIG. 1 is a perspective view of an example of a power module according to the present invention. [Diagram 2] FIG. 2 is an exploded view of the module and the assembly guide in FIG. [Diagram 3] FIG. [Figure 4] FIG. 13 shows the introduction of a nut into the bottom of the main notch of the assembly guide. [Diagram 5] FIG. 13 shows the introduction of the first copper plate into the main notch of the assembly guide. [Figure 6] FIG. 13 shows the introduction of the first housing element into the main recess of the assembly guide. [Figure 7] FIG. 13 illustrates the introduction of a first tip into a notch defined by a first housing element. [Figure 8] FIG. 13 is a diagram showing the introduction of a shim into a first chip. [Figure 9] FIG. 13 shows the introduction of the first connecting element. [Figure 10] FIG. 13 illustrates the introduction of an intermediate housing element. [Figure 11] FIG. 1 illustrates the introduction of a capacitor. [Figure 12] FIG. 13 illustrates the introduction of another connecting element. [Figure 13] FIG. 13 shows the introduction of the upper housing element. [Figure 14] FIG. 13 illustrates the introduction of a second tip into a notch in an upper housing element. [Figure 15] FIG. 13 illustrates the introduction of a second copper plate to a second chip. [Figure 16] FIG. 13 illustrates the introduction of a retention screw. [Figure 17] FIG. [Figure 18] FIG. 8 is a view similar to FIG. 7, but using a different chip. [Figure 19] FIG. 19 shows an example of a shim fitted to the chip of FIG. 18 in isolation. [Figure 20]FIG. 20 is a perspective view of the shim in FIG. 19 from a different viewing angle. [Figure 21] FIG. 8 is a view similar to FIG. 7, but using a different chip. [Figure 22] FIG. 22 shows an example of a shim fitted to the chip of FIG. 21 in isolation. [Diagram 23] FIG. 23 is a perspective view of the shim in FIG. 22 from a different viewing angle. [Figure 24] FIG. 1 illustrates the establishment of an electrical connection between a connection element and a chip. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0048] The power module 1 shown in FIG. 1 comprises three superimposed housing elements, namely a first lower housing element 10, a second intermediate housing element 20 and a third upper housing element 30.

[0049] The module 1 also comprises connection elements, i.e. in the illustrated example metal tabs 41 and 42 extending on opposite sides of a first side of the module 1, a metal tab 43 extending on the opposite sides thereof, and opposite metal tabs 44 and 45 extending from the other two sides.

[0050] The module 1 may, as shown, be provided with heat transfer plates on its major surfaces, one of which 50 is visible in FIG.

[0051] The different housing elements and the heat transfer plate may be held together by screws 60 as shown.

[0052] The module 1 prior to potential encapsulation is shown in FIG.

[0053] At least one of the housing elements, for example the bottom element 10, may be provided with an opening 11 for injecting a filling insulating resin, called "underfiller".

[0054] With reference to FIG. 2, it can be seen that the module 1 comprises a first electronic chip 70 and a second electronic chip 80 , and at least one shim 90 .

[0055] Also visible in this view is the lower heat transfer plate 51 and the nuts 61 into which the screws 60 engage.

[0056] A capacitor 100 may be disposed between the connection element 41 and the connection element 42 .

[0057] Chips 80 and 90 are, for example, power transistors, for example based on GaN, with, for example, the source of one connected to the drain of the other by a center tap, connection elements 41 and 42 connected, for example, to the drain of one and the source of the other, connection element 43 connected to the center tap, and connection elements 44 and 45 connected, for example, to the gates of these transistors.

[0058] The capacitor 100 is, for example, a decoupling capacitor, and its value is, for example, several nF.

[0059] FIG. 2 also shows an assembly guide 200 that is used during the manufacture of the module 1 .

[0060] The guide 200 may be made, for example, from a plastic material and manufactured to relatively close manufacturing tolerances by injection molding.

[0061] The assembly guide 200 may comprise a horizontal base 201 covered by a vertical wall 207 that defines a primary notch 202 and four secondary notches 203-206 arranged around the primary notch 202 in the same manner as the connecting elements on the module.

[0062] The assembly guide is shown in isolation in figure 3. It can be seen that the bottom of the main notch 201 is provided with a recess 208 for receiving the nut 61.

[0063] A further description will now be given, with reference to Figures 4 to 17, of the various elements that make up the module and an example of a method for manufacturing said module.

[0064] If screws are used to hold the assembled housing elements together, the manufacturing method may begin by placing nuts 61 in corresponding recesses 208, as shown in FIG.

[0065] A lower plate 51 is then placed at the bottom of the notch 201, as shown in FIG. 5, this plate including holes 52 for the screws 60 to pass through.

[0066] In the example considered, the plate 51 is made of copper, but it can be replaced by any suitable heat sink, for example made of another metal or made of a thermally conductive ceramic.

[0067] The various elements that make up the module can be placed by means of any suitable tool, in particular a conventional "pick and place" tool.

[0068] The lower housing element 10 can then be placed into the notch 101 .

[0069] This element 10 comprises a first central through-cutout 12 for receiving the first tip 70 and not completely through-cutouts 13, 14 and 15 for receiving the connecting elements 41, 45 and 43, respectively. These cutouts 13, 14 and 15 open into notches 203, 204 and 205, respectively, of the guide 200. Holes 16 are provided for the passage of the screws 60.

[0070] FIG. 7 shows the guide 200 after the tip 70 has been placed into the notch 12 .

[0071] In this example, the tip 70 has the overall shape of a parallelepiped, the contour of which in top view substantially corresponds to the contour of the notch 12 .

[0072] Tip 70 may have electrical contacts 71, 72, and 73 on its interior surface.

[0073] The shim 90 is shown in isolation in FIG.

[0074] The shim has a length and width adapted for its placement in the notch 12 with a small clearance.

[0075] The shims may be made of any electrically insulating material compatible with the conditions of use, such as a ceramic or polymeric material.

[0076] The shim 90 has two side openings 91 and 92 and an opening 93 in the form of a notch at the end.

[0077] When shim 90 is placed on chip 70, contacts 71, 72, and 73 remain accessible through openings 91, 92, and 93, respectively, as shown in FIG.

[0078] The connecting elements 41 and 45 can then be placed into the notches 203 and 204, respectively, so as to partially cover the contacts 71 and 73, as shown in Figure 9. Solder paste can be deposited at the interfaces between the chip contacts and the connecting elements for the purpose of a subsequent soldering operation.

[0079] To improve the positioning and retention of the connecting elements during the assembly operation, it may be useful to form in the notches 13 and 15 reliefs 313 and 315 intended to cooperate with corresponding reliefs of the connecting elements received in these notches. The reliefs 313 or 315 are, for example, in the form of bosses opposed to one another, in which case the connecting elements have two notches 341 or 343, respectively, visible in Figures 10 and 12, intended to fit into these bosses.

[0080] Cooperative reliefs in the form of bosses and notches between the housing element and the connecting elements may be present for each of the five connecting elements of the module, as can be seen in the figures and will not be described in detail each time below.

[0081] The intermediate housing element 20 can then be introduced into the cutout 201 to cover the already existing components.

[0082] Element 20 has a hole 23 for receiving screw 60 and openings 24, 25, and 26 for receiving connecting elements 44, 42, and 43, respectively.

[0083] Opening 26 provides access to contacts 72 of chip 70 .

[0084] In the step shown in FIG. 11, the capacitor 100 is placed on the connecting element 41 in the opening 25 .

[0085] Then, as shown in FIG. 12, connecting element 42 can be introduced to cover capacitor 100, with capacitor 100 acting as a spacer between connecting element 41 and connecting element 42.

[0086] A connecting element 43 is introduced on the opposite side.

[0087] If necessary, solder paste is disposed between the components to be soldered, in particular between the capacitors and the connection elements 41 and 42, and between the connection element 43 and the corresponding contacts 72 of the chip 70.

[0088] The connecting element 44 is introduced into a corresponding notch 27 in the housing element 20 .

[0089] The housing element 30 is then introduced into the previously installed connecting element, as shown in FIG.

[0090] The housing element 30 has a central opening 33, for example of rectangular shape, as shown, which provides access to the connection elements 42, 43, and 44.

[0091] The housing element 30 includes a hole 32 for receiving a screw 60 therethrough.

[0092] A second tip 80 may then be placed into the notch 33, as shown in FIG.

[0093] This chip 80 has contacts on its inwardly facing surface which are arranged facing the connecting elements 42, 43 and 44, respectively.

[0094] A solder paste may be disposed at the interfaces between the contacts of chip 80 and the connecting elements to enable soldering during a subsequent heating step.

[0095] Once the chip 80 is installed, a second heat transfer plate 50, for example made of copper, can be placed against the chip 80, as shown in Figure 15, this plate 50 being for example identical to the first plate 51 and, like the first plate 51, provided with holes for the passage of screws 60. These screws can be attached and engaged in nuts 61 present at the bottom of the main notches 202 of the guide 200, as shown in Figure 16.

[0096] Once the screws 60 are tightened, the assembly can be removed from the guide 200 and heated in an oven to a suitable temperature to melt the solder paste and produce the soldered joints made between the different components of the module.

[0097] After soldering, a filling resin can be injected through the orifices 11 and, if necessary, the assembly can be encapsulated in an encapsulating resin, leaving the connection elements accessible and, if appropriate, the copper plates accessible if thermal coupling to a radiator is intended.

[0098] The use of shim 90 is advantageous because it allows for the replacement of first tip 70 with a second tip 70' of a different format without having to modify lower housing element 10, as shown in FIG.

[0099] In the illustrated example, tip 70 ′ has dimensions that are smaller than the dimensions of tip 70 .

[0100] Shim 90 can be replaced with shim 90' shown in isolation in Figures 19 and 20 which, like shim 90, has openings 91', 92', and 93' and has a protruding portion on one side for engaging in the space provided between tip 70' and the edge of notch 12.

[0101] In the example considered, the shim 90' thus has two end tabs 94' located on either side of the opening 93', the end tabs 94' intended to engage between the tip 70' and the short side 12a of the notch 12.

[0102] The shim 90' also includes two lateral tabs 95' each configured to be inserted between a long side of the tip 70' and a long side 12b of the notch.

[0103] The shim 90' includes a stub 96' positioned opposite the tab 94' to engage between the tip 70' and the other short side 12a of the notch 12. As shown in FIG.

[0104] Thus, due to its outer dimensions, the shim 90' is precisely positioned within the notch 12 while precisely holding the chip 70' within the notch 12 in the proper position for establishing an electrical connection with the associated connection element.

[0105] If the chip model used does not have the same electrical contacts as the electrical contacts of the other chips used, the shim may comprise at least one conductive track for electrically connecting at least one corresponding contact of the chip to an associated connecting element.

[0106] By way of example, Figures 21 to 24 show such a situation.

[0107] FIG. 21 shows chip variation 70'', which, like chip 70', is not only smaller than chip 70 but also has differently arranged contacts 71'', 72'', and 73'', in particular, contact 73'' is laterally offset relative to connecting element 45. In FIG. 21, the connecting element is shown to illustrate this offset, even though it will be introduced later.

[0108] Shim 90'', like the other shims 90 and 90', has notches 91'', 92'', and 93'' for receiving the ends of connecting elements 41, 43, and 45, respectively.

[0109] The shim 90 ″ includes reliefs, such as lateral tabs 95 ″ and ends 96 ″, for locating the tip 70 ″ within the notch 12 .

[0110] Some of the tabs 95'' may extend to the adjacent ends.

[0111] The shim 90" comprises a conductive track 97" arranged to overlap the contact 73" with its end 97a", for example in the form of a bend as shown. The track 97" extends at its other end 97b" to the bottom of the notch 93" so as to be connected to the connecting element 45.

[0112] The track 97" is incorporated into the shim 90" during the manufacturing process for the shim 90", for example. It may be a metal part inserted into ceramic, or may be manufactured by injection molding or screen printing.

[0113] The housing elements 10, 20 and 30 as well as the shims 90, 90' or 90" can be manufactured to be already present during assembly and can be made of any electrically insulating material compatible with the desired application, for example made of ceramic, in particular by 3D printing or sintering methods. The material is selected to be thermally resistant to the soldering operations of the contacts, the heat released during normal use of the module and the operating environment, so that the assembly can withstand temperatures of, for example, at least 150°C.

[0114] A solder paste may be used to create the electrical connection, and the present invention is not limited to any particular technique for establishing the electrical connection.

[0115] The invention is not limited to the examples described here.

[0116] For example, the module may include two or more shims, in particular a second shim may be used to allow mounting of a chip of a different size and / or implementation of contacts as well as a second chip, and where appropriate intermediate housing elements are also modified to facilitate the accommodation of different chip models.

[0117] It is also possible to assemble more than two chips in a module, and to use one or more shims that allow for the use of different chip models.

[0118] The cutout in the housing element for receiving the chip can have a shape other than rectangular, such as a square or other shape. It is also possible to have multiple cutouts for receiving individual chips in the same housing element and to have one or more shims associated with those chips.

[0119] Some connection elements, for example elements 44 and 45 connected to the gates of the transistors, may exit from the same side of the housing to facilitate control of the module. [Explanation of symbols]

[0120] 1 Power module, module 10 first lower housing element, lower element, lower housing element 11 Opening 12 1st center through notch, notch 12a Short side 12b Long side 13 Notch 14 Notch 15 Notch 16 holes 20 second intermediate housing element, intermediate housing element, element 23 holes 24 Opening 25 Opening 26 Opening 30 third upper housing element, housing element 32 holes 33 Central opening, opening 41 Metal tab, connecting element 42 Metal tab, connecting element 43 Metal tab, connecting element 44 Metal tab, connecting element, element 45 Metal tabs, connecting elements, elements 50 Heat transfer plate, plate 51 Lower heat transfer plate, lower plate, plate, first plate 52 holes 60 Screw 61 Nut 70 First Electronic Chip, Chip, First Chip 70' 2nd tip, tip 70" Tip Variation 71 Electrical contacts, contacts 71” Contact 72 Electrical contacts, contacts 72” Contact 73 Electrical contacts, contacts 73” Contact 80 Second electronic chip, chip 90 Sim 90' Shim 90” Shim 91 Side opening, opening 91' Opening 91” notch 92 Side opening, opening 92' Opening 92” notch 93 Opening 93' Opening 93” notch 94' End tab 95' Horizontal tab 95” horizontal tabs 96' Stub 96” End 97” Truck 97a” end 97b” end 100 Capacitor 101 Notch 200 Assembly guide, guide 201 Horizontal base, main notch, notch 202 Main notch 203 Secondary notch, notch 204 Secondary notch, notch 205 Secondary notch 206 Secondary notch 207 Vertical Wall 208 Hollow 313 Relief 315 Relief

Claims

1. a first housing element (10) having a first notch (12) for receiving a first tip (70; 70'; 70''); a first tip (70; 70'; 70") having electrical contacts (71, 72, 73; 71', 72', 73'; 71", 72", 73") at least partially received within said first notch; a connecting element (41, 43, 45) electrically connected to the electrical contacts of the first chip; at least one insulating shim (90; 90'; 90") at least partially arranged in said first recess so as to at least partially cover said first chip, said insulating shim (90; 90'; 90") having at least one opening (91, 92; 91', 92'; 91", 92") providing access through said shim to at least one electrical contact of said first chip and / or at least one track (97") ensuring a connection to one of said connecting elements and / or potential capacitors; The power module (1) comprises:

2. a second housing element (30) having a second notch (33) for receiving a second tip (80); a third housing element (20) disposed between the first housing element and the second housing element, the third housing element having at least a third recess (25) for receiving in particular a capacitor (100); a second tip (80) having electrical contacts at least partially received within the second notch; a connecting element (42, 44) electrically connected to the electrical contacts of the second chip; at least one capacitor (100) at least partially received in said third recess (25) and electrically connected to at least one of said chips and / or to said connection elements (41, 42); The power module of claim 1 , comprising:

3. 3. Power module according to claim 1 or 2, wherein said shim (90; 90'; 90") has at least one lateral opening at its edge into which a corresponding connecting element electrically connected to a contact of said chip engages.

4. 4. The power module according to claim 3, wherein the shim has, at two opposite longitudinal edges, two separate lateral openings into which two corresponding connecting elements electrically connected to two separate contacts of the chip engage.

5. 5. A power module according to claim 3 or 4, wherein the connection elements are soldered to the corresponding contacts of the chip.

6. 6. A power module according to claim 5, wherein the shim, at an edge substantially perpendicular to the longitudinal edge, has additional openings (93; 93'; 93") into which additional connection elements electrically connected to individual contacts of the chip engage.

7. 7. The power module of claim 6, wherein the additional connection elements are soldered to corresponding contacts of the chip.

8. 7. A power module according to claim 6, wherein the shim has electrical tracks (73") soldered to corresponding contacts of the chip, and the additional connection elements are soldered to the tracks.

9. 9. A power module according to claim 1, wherein the shim is longer than the tip at its contact point and has at least one portion (96'; 96") engaged in the notch between the tip and the housing element defining the notch for receiving the tip in contact with the shim.

10. 10. The power module according to claim 9, wherein the shim is interposed on at least three sides, in particular four sides, between the chip and the housing element defining the cutout for receiving the chip in contact with the shim.

11. 11. A power module according to claim 1, wherein the shim has a surface that is substantially flush with a surface of the housing element that defines the notch that receives the chip in contact with the shim.

12. 12. The power module according to claim 1, wherein the intermediate housing element (20) has a notch for receiving the connection element arranged to enable the connection element to be overlapped with an electrical contact of the second chip.

13. 13. A power module according to claim 1, wherein the housing elements are pierced by holes allowing the passage of retaining members, in particular screws (60), for holding the housing elements in the assembled state.

14. 14. A power module according to any one of claims 1 to 13, comprising at least one heat transfer element (50; 51) in contact with an external surface of the chip, more preferably two heat transfer elements each in contact with an external surface of a respective chip, preferably the or each heat transfer element comprising a plate of metal, preferably of copper.

15. 15. An array of power modules comprising at least a first and a second power module (1) according to any one of claims 1 to 14, wherein at least one of the chips of the first power module is different from the corresponding chip of the other power module, the two power modules comprising different shims and identical housing elements (10, 20).

16. Array according to claim 15, wherein the connecting elements (41, 42, 43, 44, 45) are identical.

17. A method for manufacturing a power module, in particular a power module (1) according to any one of claims 1 to 16, which comprises the steps of: a lower housing element (10) having a first notch for receiving a first tip; a first tip (70; 70'; 70") having electrical contacts at least partially received within said first notch; Equipped with The method further comprising: covering said chip present in said first recess with an insulating shim (90; 90'; 90"), said shim defining at least one opening (91, 92; 91', 92'; 91", 92") superimposed with at least one electrical contact of said chip or having electrical tracks (97") connected to said electrical contacts of said chip, in particular tracks leading to openings in said shim for receiving connecting elements, method.

18. The shim is selected from among a number of existing shims (90; 90'; 90") depending on the type of tip used, all of which are adapted to be placed in the cutout of the lower housing element, and the shim preferably comprises: a shim (90), preferably of substantially constant thickness, having two opposing openings on its long sides and one opening on its short side, the dimensions of said shim substantially corresponding to the dimensions of said cutout in said first housing element; a shim (90') having two opposing openings in its long sides and one opening in its short side, the dimensions of which correspond substantially to the dimensions of the notch in the first housing element, the shim having, on its surface facing the tip, opposed lateral folds, each for interposing between the long side of the tip and the corresponding edge of the first notch, at least one end tab for interposing between the short side of the tip and the corresponding edge of the first notch, and at least one portion opposite the end tab for engaging in the notch between the tip and the lower housing element; a shim (90") having two opposing openings in its long sides and one opening in its short side, the dimensions of which correspond substantially to the dimensions of the cutout in the first housing element, the shim having at least two portions each intended to be interposed between the short sides of the shim and the corresponding edge of the cutout, the shim having, on its side facing the chip, opposing lateral folds each intended to be interposed between the long side of the chip and the corresponding edge of the first cutout, the shim also having at least one conductive track (97") arranged so as to be at least partially overlapped with contacts and connection elements of the chip; 20. The method of claim 17, wherein the shim is selected from a set of shims including:

19. The method further comprising: Introducing an upper housing element (30) having a second notch (33) for receiving a second tip; introducing an intermediate housing element (20) disposed between the upper housing element and the lower housing element, the intermediate housing element having at least a third notch for receiving a capacitor; introducing a second tip having electrical contacts at least partially received within the second notch; introducing a connecting element electrically connected to the electrical contacts of the chip; introducing at least one capacitor electrically connected to at least one of the chips and / or the connecting element, the at least one capacitor being at least partially received within the third recess; 19. The method of claim 17 or 18, comprising:

20. 20. The method according to any one of claims 17 to 19, comprising the step of using an assembly guide (200) having at least a main notch (201) adapted to receive at least said lower housing element.

21. The method according to claim 19 or 20, wherein the assembly guide has a secondary notch adapted to receive the connecting element.

22. 22. The method according to claim 20 or 21, wherein the main notch has a bottom with at least one recess (208) for receiving a nut or a screw head, the method comprising the step of placing at least one nut or a screw head in the main notch before the first housing element is introduced in particular into the main notch.

23. 23. The method according to any one of claims 20 to 22, comprising the step of arranging a heat transfer element, in particular a metal, preferably copper, plate, at the bottom of the main cutout.

24. The following sequence of steps: - optionally introducing a nut into the main cut-out of the assembly guide into a corresponding cut-out potentially provided at the bottom of the main cut-out; - introducing a heat transfer element, preferably in the form of a metal plate, into said main cutout and optionally covering said nut; Introducing the lower housing element (10) into the heat transfer element; introducing said first tip (70; 70'; 70") into said recess (12) defined by said first housing element; introducing said shim (90; 90'; 90") into said first chip; introducing a connection element that comes to cover at least one contact of said chip and / or to cover a track electrically connected to a contact of said chip; Introducing said intermediate housing element (20); - introducing said capacitor (100) into one of said connection elements, in particular in a corresponding cut-out of said intermediate housing element, said capacitor having a first electrical contact facing the connection element on which said capacitor is arranged; introducing at least one other connection element extending at least partially facing a second electrical contact of said capacitor (100); Introducing the upper housing element (30) into an assembly present in the main notch of the assembly guide; introducing the second tip (80) into the notch of the upper housing element; Introducing a second heat transfer element (50), in particular in the form of a metal, preferably copper, plate (50); assembling said housing elements thus superimposed, if necessary with screws (60) engaged in said nuts; establishing electrical contact by soldering; 24. The method of any one of claims 17 to 23, comprising:

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