Cooling device and manufacturing method of the cooling device

Abstract

To provide a cooling device capable of securing a cooling performance of both surfaces of the cooling device to which a cooling object is mounted to both surfaces, and provide a manufacturing method of the cooling device.SOLUTION: A cooling device 100 for cooling a cooling objective material to be mounted onto both surfaces of a housing 3 comprises: a first lid 111 that constructs one surface onto which a cooling object of the housing 3 is mounted; a first heat radiation fin 112 that is provided onto a back side of the cooling objective material of the first lid 111; a second lid 121 that constructs the other surface to which the cooling objective material of the housing 3 is mounted; a second heat radiation fin 122 that is provided to the back side of the cooling objective material of a second lid 121; and a frame body 130 that constructs a frame part 131 of the housing, and in which the first lid 111 and the second lid 121 are bonded.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a cooling device and a method for manufacturing the cooling device.

Background Art

[0002] As a cooling device for a semiconductor module, there is known one including a lid on which a semiconductor module is mounted on the surface, a plurality of heat dissipation fins joined by brazing to the back surface of the lid, and a housing joined by brazing to the back surface of the lid (see, for example, Patent Document 1). The cooling device described in Patent Document 1 is manufactured by first brazing the heat dissipation fins to the housing and then brazing the lid to the housing and the heat dissipation fins.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Consider the case where a cooling object such as a semiconductor module is mounted on both sides of the cooling device described in Patent Document 1. In this case, although details will be described later, it is considered that it is difficult to ensure the brazing accuracy of the heat dissipation fins to the lid and the housing, and thus the cooling performance on both sides of the cooling device cannot be ensured.

[0005] In view of the above circumstances, an object of the present invention is to provide a cooling device capable of ensuring the cooling performance on both sides of a cooling device on which a cooling object is mounted on both sides, and a method for manufacturing the cooling device.

Means for Solving the Problems

[0006] The cooling device of the present invention is a cooling device for cooling objects to be cooled mounted on both sides of a housing, and includes a first lid constituting one surface of the housing on which the object to be cooled is mounted, a first heat radiation fin provided on the back side of the object to be cooled of the first lid, a second lid constituting the other surface of the housing on which the object to be cooled is mounted, a second heat radiation fin provided on the back side of the object to be cooled of the second lid, and a frame body constituting the frame portion of the housing and to which the first lid and the second lid are joined.

[0007] The manufacturing method of the cooling device of the present invention is a manufacturing method of a cooling device for cooling objects to be cooled mounted on both sides of a housing, and includes providing a first heat radiation fin on the back side of the object to be cooled of a first lid constituting one surface of the housing on which the object to be cooled is mounted, providing a second heat radiation fin on the back side of the object to be cooled of a second lid constituting the other surface of the housing on which the object to be cooled is mounted, and joining the first lid provided with the first heat radiation fin and the second lid provided with the second heat radiation fin to a frame body constituting the frame portion of the housing.

Effect of the Invention

[0008] According to the present invention, it is possible to ensure the cooling performance of both sides of a cooling device on which objects to be cooled are mounted on both sides.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

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DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, the present invention will be described in accordance with preferred embodiments. Note that the present invention is not limited to the embodiments shown below, and the embodiments shown below can be appropriately modified without departing from the gist of the present invention. In addition, in the embodiments shown below, there are some places where the illustration and description of some configurations are omitted. For the details of the omitted technology, publicly known or well-known technologies are appropriately applied within the range that does not conflict with the content described below.

[0011] FIG. 1 is a perspective view showing a cooling device 100 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the cooling device 100 shown in FIG. 1. As shown in these figures, the cooling device 100 is a water-cooled cooling device in which a refrigerant flow path is formed inside a thin housing 3, and cooling objects 1 and 2 such as power semiconductor devices are mounted on both surfaces of the housing 3.

[0012] The cooling device 100 includes a first lid assembly 110, a second lid assembly 120, and a frame body 130. The first lid assembly 110 includes a rectangular plate-shaped first lid 111 that constitutes one surface of the thin housing 3 and on which the cooling object 1 is mounted on the surface (outer surface). The second lid assembly 120 includes a rectangular plate-shaped second lid 121 that constitutes the other surface of the thin housing 3 and on which the cooling object 2 is mounted on the surface (outer surface). The first lid 111 and the second lid 121 face each other in the thickness direction of the housing 3.

[0013] The frame body 130 includes a rectangular frame portion 131 that constitutes the frame portion of the thin housing 3, an inlet portion 132 formed at the longitudinal center of one side among the four sides of the frame portion 131, and an outlet portion 133 formed at the longitudinal center of one side parallel to the said one side. That is, in the cooling device 100, the refrigerant flows from one side of the frame portion 131 where the inlet portion 132 is formed toward one side of the frame portion 131 where the outlet portion 133 is formed.

[0014] The first lid 111 is fitted inside the frame portion 131, and the peripheral edge of the first lid 111 is joined to the inner peripheral surface of the frame portion 131 by friction stir welding or the like. Also, the second lid 121 is fitted inside the frame portion 131, and the peripheral edge of the second lid 121 is joined to the inner peripheral surface of the frame portion 131 by friction stir welding or the like. In addition, as methods for joining the first lid 111 and the second lid 121 to the frame portion 131, in addition to friction stir welding, screwing, brazing, etc. can also be mentioned. Also, it is not essential that the first lid 111 and the second lid 121 are fitted inside the frame portion 131, and the peripheral edges of the first lid 111 and the second lid 121 may be overlapped with the frame portion 131. Furthermore, the first lid 111 and the second lid 121 may be configured in a plate shape other than a rectangle such as an oval shape, and the frame portion 131 may also be in a shape other than a rectangle such as an oval shape.

[0015] As shown in FIG. 2, the first lid assembly 110 includes a plurality of first heat dissipation fins 112 brazed to the back surface (inner surface) of the first lid 111. The plurality of first heat dissipation fins 112 are arranged in parallel at a predetermined interval and extend along the flow direction of the refrigerant. Also, the second lid assembly 120 includes a plurality of second heat dissipation fins 122 brazed to the back surface (inner surface) of the second lid 121. The plurality of second heat dissipation fins 122 are arranged in parallel at a predetermined interval and extend along the flow direction of the refrigerant.

[0016] FIG. 3 is a perspective sectional view of the cooling device 100 shown in FIGS. 1 and 2. Further, FIG. 4 is a cross-sectional view of the cooling device 100 shown in FIGS. 1 and 2. As shown in these figures, the plurality of first heat dissipation fins 112 are elongated plate-like members protruding from the back surface of the first lid 111 toward the second lid assembly 120 side. Also, the plurality of second heat dissipation fins 122 are elongated plate-like members protruding from the back surface of the second lid 121 toward the first lid assembly 110 side. Each of the plurality of first heat dissipation fins 112 and each of the plurality of second heat dissipation fins 122 face each other with a gap therebetween. Note that it is not essential for there to be a gap between the first heat dissipation fin 112 and the second heat dissipation fin 122, and the first heat dissipation fin 112 and the second heat dissipation fin 122 may be in contact with each other.

[0017] Heat generated in the object to be cooled 1 is propagated through the first lid 111 to the plurality of first heat dissipation fins 112, and the plurality of first heat dissipation fins 112 dissipate heat to the refrigerant. Also, heat generated in the object to be cooled 2 is propagated through the second lid 121 to the plurality of second heat dissipation fins 122, and the plurality of second heat dissipation fins 122 dissipate heat to the refrigerant. Note that a heat dissipation sheet (not shown) may be provided between the object to be cooled 1 and the first lid 111 and between the object to be cooled 2 and the second lid 121 to promote heat dissipation of the objects to be cooled 1 and 2.

[0018] The materials of the first lid 111, the second lid 121, the first heat dissipation fins 112, and the second heat dissipation fins 122 are formed of a metal material including an aluminum alloy. Also, the frame body 130 is formed of a metal material including an aluminum alloy or a resin material. Examples of the brazing material include aluminum brazing mainly composed of aluminum and silicon, but it is not particularly limited as long as it is a material that does not cause water leakage due to water pressure.

[0019] Hereinafter, a manufacturing method of the cooling device 100 of the present embodiment will be described.

[0020] First, prepare a first lid 111, a plurality of first heat dissipation fins 112, a second lid 121, a plurality of second heat dissipation fins 122, and a frame body 130. The first lid 111 and the second lid 121, which are rectangular plates, are prepared by pressing. Also, the first heat dissipation fins 112 and the second heat dissipation fins 122, which are long and narrow plates, are also prepared by pressing. The frame body 130 is made by casting or the like if it is made of metal, and by injection molding or the like if it is made of resin. Note that the frame portion 131, the inlet portion 132, and the outlet portion 133 may be integrally formed, or the inlet portion 132 and the outlet portion 133 may be joined to the frame portion 131.

[0021] Next, prepare a first lid assembly 110 by brazing a plurality of first heat dissipation fins 112 to the first lid 111, and prepare a second lid assembly 120 by brazing a plurality of second heat dissipation fins 122 to the second lid 121.

[0022] In the process of preparing the first lid assembly 110, apply a brazing material to the back surface of the first lid 111, and arrange a plurality of first heat dissipation fins 112 on the back surface of the first lid 111 to which the brazing material is applied. Then, while heating the brazing material to a predetermined brazing temperature by a gas or an electric heater or the like, press a plurality of first heat dissipation fins 112 against the first lid 111.

[0023] In the process of preparing the second lid assembly 120, apply a brazing material to the back surface of the second lid 121, and arrange a plurality of second heat dissipation fins 122 on the back surface of the second lid 121 to which the brazing material is applied. Then, while heating the brazing material to a predetermined brazing temperature by a gas or an electric heater or the like, press a plurality of second heat dissipation fins 122 against the second lid 121.

[0024] Finally, a joining step is performed to join the first lid assembly 110 and the second lid assembly 120 to the frame body 130. In this joining step, with the first lid 111 to which a plurality of first heat dissipation fins 112 are brazed fitted inside the frame portion 131, the peripheral edge portion of the first lid 111 is joined to the inner peripheral surface of the frame portion 131 by friction stir joining or the like. Also, with the second lid 121 to which a plurality of second heat dissipation fins 122 are brazed fitted inside the frame portion 131, the peripheral edge portion of the second lid 121 is joined to the inner peripheral surface of the frame portion 131 by friction stir joining or the like.

[0025] By the way, in the manufacturing process of the cooling device described in Patent Document 1 above, two brazing steps are required: a step of brazing the lower storage portion, in which the bottom portion and the frame portion are integrated, and the heat dissipation fins, and a step of brazing the heat dissipation fins brazed to the lower storage portion and the lid. Here, the shapes of the lower storage portion and the lid are different, and it is necessary to braze the lower storage portion and the lid having different shapes to the common heat dissipation fins from both sides. Therefore, it is difficult to uniformly braze the lower storage portion and the lid to the common heat dissipation fins. Accordingly, in the cooling device described in Patent Document 1 above, it is difficult to ensure the brazing accuracy of the heat dissipation fins of the lid and the lower storage portion, and a difference is likely to occur in the cooling performance on both sides of the cooling device.

[0026] On the other hand, in the cooling device 100 of the present embodiment, the first lid assembly 110 in which the first heat dissipation fins 112 are brazed to the first lid 111 and the second lid assembly 120 in which the second heat dissipation fins 122 are brazed to the second lid 121 are assembled to the frame body 130. Thereby, it is easy to uniformly braze the first heat dissipation fins 112 to the first lid 111 and to uniformly braze the second heat dissipation fins 122 to the second lid 121. Accordingly, the cooling device 100 of the present embodiment can easily ensure the brazing accuracy of the first heat dissipation fins 112 with respect to the first lid 111 and the brazing accuracy of the second heat dissipation fins 122 with respect to the second lid 121, and it is possible to ensure the cooling performance on both sides of the housing 3.

[0027] FIG. 5 is a perspective sectional view showing a cooling device 200 according to another embodiment of the present invention. FIG. 6 is a view showing a first lid assembly 210 and a second lid assembly 220 of the cooling device 200 shown in FIG. 5. In addition, the same components as those in the above embodiment are denoted by the same reference numerals, and the description of the above embodiment is incorporated by reference, omitting repeated explanations.

[0028] As shown in FIGS. 5 and 6, the first lid assembly 210 includes a first lid 111 and a plurality of first heat dissipation fins 212 brazed to the back surface of the first lid 111. The second lid assembly 220 includes a second lid 121 and a plurality of second heat dissipation fins 222 brazed to the back surface of the second lid 121. The plurality of first heat dissipation fins 212 are arranged in parallel at an interval P1 and project from the back surface of the first lid 111 toward the second lid assembly 220 side. The plurality of second heat dissipation fins 222 are arranged in parallel at an interval P2 and project from the back surface of the second lid 121 toward the first lid assembly 210 side.

[0029] Here, the object to be cooled (not shown) mounted on the surface of the first lid 111 has a larger heat dissipation amount than the object to be cooled (not shown) mounted on the surface of the second lid 121. Therefore, a higher cooling performance is required for the surface of the first lid 111 (the portion shown hatched in the figure) than for the surface of the second lid 121.

[0030] Therefore, in the cooling device 200 of the present embodiment, the interval (pitch) P1 of the plurality of first heat dissipation fins 212 is made narrower than the interval P2 of the plurality of second heat dissipation fins 222, so that the heat dissipation area of the plurality of first heat dissipation fins 212 is made wider than the heat dissipation area of the plurality of second heat dissipation fins 222. This makes it possible to satisfy the higher cooling performance required for the surface of the first lid 111 than for the second lid 121. In addition, by making the interval P2 of the plurality of second heat dissipation fins 222 wider than the interval P1 of the plurality of first heat dissipation fins 212, while satisfying the cooling performance required for the second lid 121, the material cost of the second heat dissipation fins 222 can be reduced, and the pressure loss of the refrigerant by the second heat dissipation fins 222 can be reduced.

[0031] Note that the heat dissipation area of the plurality of first heat dissipation fins 212 may be made wider than the heat dissipation area of the plurality of second heat dissipation fins 222. For example, the interval P1 between the plurality of first heat dissipation fins 212 and the interval P2 between the plurality of second heat dissipation fins 222 may be made equal, and the width of the plurality of first heat dissipation fins 212 may be made wider than the width of the plurality of second heat dissipation fins 222. In this case, the width of the flow path between adjacent first heat dissipation fins 212 becomes shorter than the width of the flow path between adjacent second heat dissipation fins 222.

[0032] FIG. 7 is a perspective view showing a cooling device 300 according to another embodiment of the present invention from the side of the first lid 111. FIG. 8 is a perspective view showing the cooling device 300 shown in FIG. 7 from the side of the second lid 121. Note that the same reference numerals are given to the same configurations as those in the above-described embodiment, and the description of the above-described embodiment is incorporated by reference, omitting the repeated description.

[0033] As shown in FIGS. 7 and 8, the cooling device 300 includes a first lid assembly 310, a second lid assembly 320, and a frame body 330. The first lid assembly 310 includes a first lid 111 that forms one surface of the thin housing 3 and on which a plurality of objects to be cooled 1A, 1B are mounted on the surface (outer surface). The second lid assembly 320 includes a second lid 121 that forms the other surface of the thin housing 3 and on which a plurality of objects to be cooled 2A, 2B are mounted on the surface (outer surface). The first lid 111 and the second lid 121 face each other in the thickness direction of the housing 3.

[0034] The plurality of objects to be cooled 1A are arranged side by side in the longitudinal direction at the center in the width direction of the surface of the first lid 111. Also, a pair of objects to be cooled 1B are arranged side by side in the width direction of the surface at the longitudinal ends of the surface of the first lid 111. Further, the plurality of objects to be cooled 2A are arranged side by side in the longitudinal direction on one end side in the width direction of the surface of the second lid 121, and the plurality of objects to be cooled 2B are arranged side by side in the longitudinal direction on the other end side in the width direction of the surface of the second lid 121.

[0035] The frame body 330 includes a rectangular frame portion 331 that constitutes the frame portion of the thin housing 3, and an inlet portion 132 and an outlet portion 133 formed on one of the opposite sides facing the longitudinal direction of the frame portion 331. The inlet portion 132 and the outlet portion 133 are arranged apart from each other in the longitudinal direction of one of the opposite sides of the frame portion 331.

[0036] That is, in the cooling device 300, the refrigerant flows into the housing 3 from the inlet portion 132, flows from one of the opposite sides to the other, turns back and flows toward one of the opposite sides, and flows out from the outlet portion 133.

[0037] The peripheral edge of the first lid 111 is overlapped on one side in the thickness direction of the frame portion 331 and joined by friction stir welding or the like. Also, the peripheral edge of the second lid 121 is overlapped on the other side in the thickness direction of the frame portion 331 and joined by friction stir welding or the like. In addition, as a method of joining the first lid 111 and the second lid 121 to the frame portion 331, in addition to friction stir welding, screwing, brazing, etc. can also be mentioned. Also, it is not essential that the first lid 111 and the second lid 121 are overlapped on the frame portion 331, and they may be fitted inside the frame portion 331. Furthermore, the first lid 111 and the second lid 121 may be configured in a plate shape other than a rectangle such as an oval shape, and the frame portion 331 may also be in a shape other than a rectangle such as an oval shape.

[0038] FIG. 9 is an exploded perspective view showing the cooling device 300 shown in FIGS. 7 and 8. As shown in this figure, the first lid assembly 310 includes first heat dissipation fins 312A and 312B brazed to the back surface (inner surface) of the first lid 111. The first heat dissipation fin 312A extends from one end side to the other end side in the longitudinal direction of the first lid 111 along the arrangement direction of the plurality of objects to be cooled 1A, and is arranged so as to overlap with the rows of the plurality of objects to be cooled 1A in the thickness direction of the first lid 111.

[0039] The first heat dissipation fin 312B includes an arc-shaped guide surface 312G for turning back the refrigerant, and is arranged on the other end side in the longitudinal direction of the first lid 111 so as to overlap with the pair of objects to be cooled 1B in the thickness direction of the first lid 111.

[0040] The second lid assembly 320 includes second heat dissipation fins 322A and 322B brazed to the back surface (inner surface) of the second lid 121. The second heat dissipation fins 322A and 322B extend from one longitudinal end side to the other end side of the second lid 121 along the arrangement direction of the plurality of objects to be cooled 2A and 2B. The second heat dissipation fin 322A is arranged so as to overlap with the row of the plurality of objects to be cooled 2A in the thickness direction of the second lid 121. Also, the second heat dissipation fin 322B is arranged so as to overlap with the row of the plurality of objects to be cooled 2B in the thickness direction of the second lid 121.

[0041] As described above, in the cooling device 300 according to the present embodiment, the first heat dissipation fins 312A are arranged so as to overlap with the first lid 111 in the thickness direction with the plurality of objects to be cooled 1A separated from the first lid 111, thereby promoting heat dissipation of the plurality of objects to be cooled 1A. Also, the first heat dissipation fins 312B are arranged so as to overlap with the first lid 111 in the thickness direction with the pair of objects to be cooled 1B separated from the first lid 111, thereby promoting heat dissipation of the pair of objects to be cooled 1B. Also, the second heat dissipation fins 322A are arranged so as to overlap with the second lid 121 in the thickness direction with the plurality of objects to be cooled 2A separated from the second lid 121, thereby promoting heat dissipation of the plurality of objects to be cooled 2A. Further, the second heat dissipation fins 322B are arranged so as to overlap with the second lid 121 in the thickness direction with the plurality of objects to be cooled 2B separated from the second lid 121, thereby promoting heat dissipation of the plurality of objects to be cooled 2B.

[0042] In the present embodiment, the objects to be cooled 1A and 1B and the objects to be cooled 2A and 2B are arranged so as not to overlap in the thickness direction of the housing 3, but they may be arranged so as to overlap in the thickness direction of the housing 3. In this case, both the first heat dissipation fins 312A and 312B and the second heat dissipation fins 322A and 322B are provided, and their heights may be adjusted so that the first heat dissipation fins 312A and 312B and the second heat dissipation fins 322A and 322B do not interfere with each other.

[0043] The present invention has been described based on the above embodiments. However, the present invention is not limited to the above embodiments, and modifications may be made to the above embodiments without departing from the spirit of the present invention, or known and well-known technologies may be appropriately combined.

[0044] For example, in the above embodiment, the power semiconductor device is cited as an example of the objects to be cooled 1, 1A, 1B, 2, 2A, 2B. However, any heat-generating body that requires cooling can be the object to be cooled by the cooling device of the present invention.

[0045] Also, in the above embodiment, the first heat-radiating fins 112, 212, 312A, 312B are brazed to the first lid 111, and the second heat-radiating fins 122, 222, 322A, 322B are brazed to the second lid 121. However, brazing is not essential. The first heat-radiating fins 112, 212, 312A, 312B and the first lid 111 may be integrally manufactured by die casting or cutting. Similarly, the second heat-radiating fins 122, 222, 322A, 322B and the second lid 121 may be integrally manufactured by die casting or cutting. In this case, since brazing is not required, it becomes easier to ensure the cooling performance on both sides of the housing 3.

Explanation of Reference Numerals

[0046] 1: Object to be cooled 1A: Object to be cooled 1B: Object to be cooled 2: Object to be cooled 2A: Object to be cooled 2B: Object to be cooled 3: Housing 100: Cooling device 111: First lid 112: First heat-radiating fin 121: Second lid 122: Second heat-radiating fin 130: Frame 131: Frame portion 200: Cooling device 212: First heat-radiating fin 222: Second heat-radiating fin 300: Cooling device 312A: First heat dissipation fin 312B: First heat dissipation fin 322A: Second heat dissipation fin 322B: Second heat dissipation fin 330: Frame 331: Frame part P1: Interval (first interval) P2: Interval (second interval)

Claims

1. A cooling device that cools objects to be cooled that are mounted on both sides of a housing, a first lid constituting one surface of the housing on which the object to be cooled is mounted; a first heat dissipation fin provided on a rear side of the first lid facing the object to be cooled; a second cover that configures the other surface of the housing on which the object to be cooled is mounted; and a second heat dissipation fin provided on a rear side of the object to be cooled of the second lid; a frame body that constitutes a frame portion of the housing and to which the first lid and the second lid are joined; A cooling device comprising:

2. The first heat dissipation fins are arranged in parallel at a first interval, The second heat dissipation fins are arranged in parallel at a second interval, The first interval is smaller than the second interval. The cooling device according to claim 1 .

3. The heat dissipation area of ​​the first heat dissipation fin is larger than the heat dissipation area of ​​the second heat dissipation fin.

3. The cooling device according to claim 1 or 2.

4. A method for manufacturing a cooling device that cools objects to be cooled that are mounted on both sides of a housing, comprising the steps of: a first radiating fin is provided on a rear side of the object to be cooled of a first lid constituting one surface of the housing on which the object to be cooled is mounted; a second radiating fin is provided on a rear side of the object to be cooled of a second lid constituting the other surface of the housing on which the object to be cooled is mounted; The first lid provided with the first heat dissipation fins and the second lid provided with the second heat dissipation fins are joined to a frame body that constitutes a frame portion of the housing. A method for manufacturing a cooling device.

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