Electronic apparatus

Abstract

To provide an electronic apparatus capable of improving a cooling capacity.SOLUTION: An electronic apparatus comprises: a housing 12 that includes a first exhaust port 32A and a second exhaust port 32B; a substrate (motherboard 25) in which heat generation bodies 25a and 25b are mounted; a first heat sink part 28 that is arranged facing the first exhaust port, and arranges a plurality of fins 28a with a predetermined interval; a heat transportation device 27 that transports a heat of each heat generation body to the first heat sink part; a fan 30 that includes a first discharge port 30a that can discharge an air toward the first heat sink part, and a second discharge port 30b that can discharge an air toward a front surface of the substrate; and a second heat sink part 29 that is connected to the substrate, is arranged so as to be face a second exhaust port on a circulation path of the air flowing to the second exhaust port from the second discharge port, and arranges the plurality of fins with the predetermined interval.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic device provided with a heat sink portion.

Background Art

[0002] An electronic device such as a notebook PC mounts heat generating components such as a CPU and a GPU. Such an electronic device mounts a fan and a heat sink in the housing, absorbs the heat generated by the heat generating components, and dissipates the heat to the outside (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the housing of the electronic device as described above, in addition to the CPU and the GPU, a large number of heat generating components such as power components serving as power sources for these are accommodated. Since the CPU and the GPU are accompanied by a large amount of heat generation, a configuration for transporting heat to the heat sink using a heat pipe is common. On the other hand, for other power components, cooling mainly by dissipating heat to the air when the air in the housing is sucked in by the fan. For this reason, in the conventional configuration, there are cases where the power components cannot be sufficiently cooled, and there are also cases where the cooling capacity of the entire device is insufficient.

[0005] The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device capable of improving the cooling capacity.

Means for Solving the Problems

[0006] The electronic device according to the first aspect of the present invention includes a housing having a first exhaust port and a second exhaust port, a substrate on which a heating element is mounted, a first heat sink portion disposed facing the first exhaust port and having a plurality of fins arranged in parallel at a predetermined interval, a heat transport device for transporting the heat of the heating element to the first heat sink portion, a first discharge port capable of discharging air toward the first heat sink portion, a fan having a second discharge port capable of discharging air toward the surface of the substrate, a second heat sink portion connected to the substrate and disposed facing the second exhaust port on the air flow path from the second discharge port to the second exhaust port and having a plurality of fins arranged in parallel at a predetermined interval.

Advantages of the Invention

[0007] According to the above aspect of the present invention, the cooling capacity can be improved.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments of the electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic plan view of an electronic device 10 according to an embodiment as viewed from above. As shown in FIG. 1, the electronic device 10 of the present embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are relatively rotatably connected by a hinge 14. In the present embodiment, the electronic device 10 of the notebook PC is exemplified, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game machine.

[0011] The lid 11 is a thin and flat box-shaped housing. The lid 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin and flat box. A keyboard device 18 and a touch pad 19 face the upper surface (surface 12a) of the housing 12. Hereinafter, regarding the housing 12 and each component mounted thereon, based on the posture of the operator operating the keyboard device 18, the width direction (left and right) of the housing 12 will be referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 will be referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 will be referred to as the Z1 and Z2 directions for explanation. The X1 and X2 directions may also be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may also be similarly referred to as the Y direction and the Z direction. These directions are directions defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 is composed of a housing member 20 that forms the upper surface and the four peripheral side surfaces, and a cover material 21 that forms the lower surface. The housing member 20 is formed by forming vertical walls 20B at the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a substantially bathtub shape with an open lower surface. The cover material 21 has a substantially flat plate shape and serves as a lid that closes the lower surface opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and detachably connected to each other. The vertical wall 20B may be formed on the cover material 21. In this case, the housing member 20 may be composed of only the cover plate 20A.

[0014] The hinge 14 is installed in a concave hinge placement groove 12b formed at the rear edge of the housing 12 and connects the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft 14a serving as a rotation axis is supported at both longitudinal ends of a hinge housing 14b (see FIG. 5). The hinge 14 of the present embodiment is configured in a so-called one-bar shape in which the hinge housing 14b extends along the longitudinal direction of the hinge placement groove 12b. The hinge 14 rotates with the hinge housing 14b integrated with the lid 11 and descends obliquely rearward (see FIG. 5). The hinge 14 has a structure that gains the rotation angle of the lid 11 in this way, a so-called drop-down structure. The structure of the hinge 14 may be other than the above.

[0015] FIG. 2 is a plan view schematically showing the internal structure of the housing 12. FIG. 2 is a view of the inside of the housing member 20 seen from the lower surface side with the cover material 21 removed.

[0016] As shown in FIG. 2, a cooling module 24, a motherboard 25, and a battery device 26 are housed inside the housing 12. Various electronic components, mechanical components, etc. are further provided inside the housing 12.

[0017] The motherboard (substrate) 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source of the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of the present embodiment mounts a CPU (Central Processing Unit) 25a, a GPU (Graphics Processing Unit) 25b, power components 25c, 25d, and a memory 25e. The CPU 25a is a processing device that performs operations related to the main control and processing of the electronic device 10. The GPU 25b is a processing device that performs operations necessary for image rendering such as 3D graphics. The power component 25c is composed of a plurality of chips arranged in parallel, for example, on the rear side of the CPU 25a, and serves as the power source for the CPU 25a. The power component 25d is composed of a plurality of chips arranged in parallel, for example, on the rear side of the GPU 25b, and serves as the power source for the GPU 25b. The memory 25e is composed of a plurality of chips arranged in parallel, for example, on the front side of the GPU 25b, and serves as the storage device for the GPU 25b. Various electronic components such as a memory module 25f, a storage device 25g, and a communication module are further mounted on the motherboard 25. The memory module 25f is, for example, a CAMM (Compression Attached Memory Modul) or a DIMM (Dual Inline Memory Module). The storage device 25g is, for example, an SSD (Solid State Drive).

[0019] For example, the upper surface (the first surface 25A) of the motherboard 25 serves as the mounting surface for the housing member 20, and the lower surface (the second surface 25B) serves as the mounting surface for the CPU 25a and the like.

[0020] The CPU 25a and the GPU 25b are heat generators with the largest heat generation amount among the electronic components mounted in the housing 12. The cooling module 24 can absorb and dissipate the heat generated by the CPU 25a and the GPU 25b and discharge it outside the housing 12. The power components 25c, 25d, the memory 25e, and the memory module 25f are heat generators with a heat generation amount second only to that of the CPU 25a and the GPU 25b. The cooling module 24 of the present embodiment can also cool these power components 25c and the like.

[0021] As shown in FIG. 2, the cooling module 24 of the present embodiment includes a pair of heat pipes 27, a pair of first heat sink portions 28, 28, a second heat sink portion 29, and a pair of fans 30, 30.

[0022] The heat pipe 27 is a pipe-type heat transport device. The heat pipe 27 is formed by flattening a metal pipe thinly into an elliptical cross-sectional shape and enclosing a working fluid in an inner sealed space. Examples of the working fluid include water, alternative Freon, acetone, or butane. The heat pipe 27 can be used, for example, in a pair of two. A part of the heat pipe 27 overlaps with the CPU 25a and the GPU 25b in the Z direction and is connected to these CPU 25a and GPU 25b. Both ends of the heat pipe 27 are respectively connected to the first heat sink portions 28. Thereby, the heat pipe 27 transports the heat generated by the CPU 25a and the GPU 25b to the left and right first heat sink portions 28 with high efficiency.

[0023] The heat pipe 27 of the present embodiment is connected to the CPU 25a and the GPU 25b with the vapor chamber 31 interposed therebetween (see also FIG. 5). The vapor chamber 31 is a plate-type heat transport device. The vapor chamber 31 forms a sealed space between two thin metal plates and encloses a working fluid in this sealed space. The working fluid can be the same as or similar to that of the heat pipe 27. The electronic device 10 may omit the heat pipe 27 and connect the CPU 25a and the GPU 25b to the first heat sink portion 28 with the vapor chamber 31.

[0024] FIG. 3 is a perspective view schematically showing the configuration of the fan 30 and its peripheral portion. FIG. 4 is an enlarged perspective view of the exhaust port 32 of the housing 12 and its peripheral portion.

[0025] As shown in FIGS. 2 to 4, the first heat sink portions 28 are respectively provided at positions close to the X1 and X2 side edges of the housing 12. Each first heat sink portion 28 has a structure in which a plurality of fins 28a formed of thin metal plates are arranged at equal intervals in the X direction. Each fin 28a stands in the Z direction and extends in the Y direction. The upper and lower end faces (Z-direction end faces) of each fin 28a are integrally supported by a base plate 28b formed of a thin metal plate. A gap through which the air sent from the fan 30 passes is formed between adjacent fins 28a, 28a. The fins 28a and the base plate 28b are formed of a metal having a high thermal conductivity such as aluminum or copper. A narrow plate piece obtained by bending the upper and lower end portions of each fin 28a by 90 degrees may be formed, and the plate pieces of each fin 28a may be connected to form the base plate 28b. The first heat sink portion 28 is disposed to face the Y2 side surface (the first discharge port 30a) of the fan 30. Thereby, the air sent from the first discharge port 30a of the fan 30 passes through the first heat sink portion 28 and is discharged to the outside of the housing 12 from the exhaust port 32.

[0026] The second heat sink portion 29 is connected and supported to the Y2 side edge portion (one edge portion 25C) of the motherboard 25 and extends in the X direction. The detailed configuration of the second heat sink portion 29 will be described later.

[0027] As shown in FIGS. 2 and 3, the fans 30 are respectively provided at positions close to the Y1 sides of the left and right first heat sink portions 28. The fan 30 has a first discharge port 30a and a second discharge port 30b. The fan 30 has an intake port 30c formed on the upper and lower surfaces (both Z-direction surfaces) or one of the upper and lower surfaces. The fan 30 discharges the air sucked from the intake port 30c from the discharge ports 30a, 30b. The intake port 30c can also intake the air outside the housing 12 from the bottom surface opening 33 that opens to the bottom surface (cover material 21) of the housing 12 (see FIG. 5).

[0028] The first air outlet 30a discharges air in the Y2 direction. The air sent from the first air outlet 30a passes through the first heat sink portion 28 and is discharged to the outside of the housing 12 from the exhaust port 32 (the first exhaust port 32A).

[0029] The second air outlet 30b discharges air in the X1 or X2 direction. In FIG. 2, for the fan 30 arranged on the X1 side, the second air outlet 30b is open on its X2 side surface. In FIG. 2, for the fan 30 arranged on the X2 side, the second air outlet 30b is open on its X1 side surface. Thus, the second air outlets 30b of the left and right fans 30 face each other with the motherboard 25 interposed therebetween. Preferably, the position of the second air outlet 30b in the Z direction faces the side end surface of the motherboard 25 (see FIG. 5). Thereby, the second air outlet 30b of each fan 30 can discharge air toward the upper and lower surfaces (surfaces 25A, 25B) of the motherboard 25. The air sent from the second air outlet 30b cools each heat-generating component such as the CPU 25a, GPU 25b, power components 25c, 25d, memory 25e, and memory module 25f while flowing along the surfaces 25A, 25B. This air passes through the second heat sink portion 29 and is discharged to the outside of the housing 12 from the exhaust port 32 (the second exhaust port 32B).

[0030] As shown in FIGS. 2 and 4, the exhaust port 32 is provided at a position corresponding to the hinge arrangement groove 12b in the vertical wall 20B on the Y2 side edge of the housing member 20. The exhaust port 32 is constituted by, for example, a plurality of window-shaped openings 32a arranged substantially over the entire length in the longitudinal direction of the vertical wall 20B. For the exhaust port 32, a plurality of openings 32a located closer to both ends in the X direction of the vertical wall 20B are respectively close to and face the first heat sink portions 28, 28. For the exhaust port 32, a plurality of openings 32a near the center in the X direction of the vertical wall 20B are close to and face the second heat sink portion 29.

[0031] Hereinafter, with respect to the exhaust port 32, a portion constituted by those within the range facing the first heat sink portion 28 among the openings 32a arranged in parallel in the X direction may be referred to as the "first exhaust port 32A". Further, with respect to the exhaust port 32, a portion constituted by those within the range facing the second heat sink portion 29 may be referred to as the "second exhaust port 32B".

[0032] Next, a specific configuration example of the second heat sink portion 29 and its peripheral portion will be described.

[0033] FIG. 5 is a schematic side cross-sectional view of the second heat sink portion 29 and its peripheral portion. FIG. 5 shows the configuration of the second heat sink portion 29 and its peripheral portion in a state where the lid body 11 is opened from the housing 12 and the electronic device 10 is in an operating mode.

[0034] As shown in FIGS. 2 to 5, the second heat sink portion 29 is attached to one edge portion 25C of the motherboard 25. The second heat sink portion 29 is provided near the center in the X direction at a position facing the Y2 side edge portion in the housing 12. As shown in FIGS. 3 and 5, the second heat sink portion 29 of the present embodiment has fin parallel bodies 29A and 29B that are divided in the vertical (Z direction).

[0035] The fin parallel bodies 29A and 29B each have a structure in which a plurality of fins 29a formed of thin metal plates are arranged at equal intervals in the X direction. Each fin 29a stands up in the Z direction and extends in the Y direction. The upper and lower end surfaces (Z-direction end surfaces) of each fin 29a are integrally supported by a base plate 29b formed of a thin metal plate. A gap through which air sent from the fan 30 passes is formed between adjacent fins 29a and 29a. The fins 29a and the base plate 29b are formed of a metal having a high thermal conductivity such as aluminum or copper. A narrow plate piece obtained by bending the upper and lower end portions of each fin 29a by 90 degrees may be formed, and the plate pieces of each fin 29a may be connected to form the base plate 29b.

[0036] The first fin parallel body 29A is connected to the first surface 25A of the motherboard 25. The second fin parallel body 29B is connected to the second surface 25B of the motherboard 25. The fin parallel bodies 29A and 29B are fixed to ground planes (ground patterns) 25D formed on the surfaces 25A and 25B of the motherboard 25, respectively. The ground plane 25D may be a through-hole that penetrates the motherboard 25 in the thickness direction. The second heat sink portion 29 and the ground plane 25D are fixed, for example, by reflow soldering.

[0037] The fin parallel bodies 29A and 29B each have a protruding portion 29c configured such that the height in the Z direction is lower at the Y1-side end than at the Y2-side end. The protruding portion 29c is flush with the end face of one edge portion 25C of the motherboard 25. The protruding portion 29c and the one edge portion 25C are provided only at positions corresponding to the respective openings 32a with reference to the X direction. That is, the second heat sink portion 29 and the motherboard 25 have a concavo-convex shape in which the protruding portion 29c and the one edge portion 25C, which are the Y2-side ends thereof, are concave and convex in the Y direction. Each protruding portion 29c and the one edge portion 25C sandwiched therebetween are inserted into the inner peripheral space of each opening 32a (see FIGS. 4 and 5).

[0038] In this way, the second heat sink portion 29 is connected to one edge portion 25C of the motherboard 25 and is disposed opposite to the second exhaust port 32B, and each protruding portion 29c is inserted into each opening 32a. As a result, the air sent from the second discharge port 30b of the fan 30 flows along the surfaces 25A and 25B of the motherboard 25 around the CPU 25a and the like, then passes through the second heat sink portion 29, and is discharged to the outside of the housing 12 from the second exhaust port 32B. That is, in the housing 12, an air flow path 34 from the second discharge port 30b to the second exhaust port 32B is formed, and the second heat sink portion 29 is disposed on this flow path 34. The arrows indicated by the dashed-dotted lines in FIGS. 2, 3, and 5 schematically show the air flow.

[0039] As shown in FIG. 2, a space (duct structure portion 35) for making the air flow in the flow path 34 smoother may be formed inside the housing 12. The range of the duct structure portion 35 is formed between the first surface 25A of the motherboard 25 and the cover plate 20A and between the second surface 25B and the cover material 21 in the Z direction. The range of the duct structure portion 35 is formed between the left and right fans 30, 30 and between the first heat sink portions 28, 28 in the X direction. A second exhaust port 32B is provided on the Y2 side of the duct structure portion 35.

[0040] It is preferable to provide an airtight wall 35a on the Y1 side of the duct structure portion 35 to prevent it from being opened into the housing 12. The airtight wall 35a is a member formed by, for example, sponges or rubbers in a strip shape. The airtight wall 35a does not need to completely block the passage of air, but needs to have a certain degree of ventilation resistance and be able to regulate the direction of air flow. The airtight wall 35a stands between the first surface 25A and the cover plate 20A and between the second surface 25B and the cover material 21, respectively. The airtight wall 35a extends in the X direction so as to connect, for example, the Y1 side end portions of the left and right fans 30, and has a crank shape to avoid the memory module 25f in part.

[0041] An airtight wall 35b formed of a member similar to the airtight wall 35a may be provided at the peripheral edge of the duct structure portion 35. The airtight wall 35b is provided so as to surround the peripheral edge of the fan 30. The airtight wall 35b forms the X-direction end portion of the duct structure portion 35, particularly the portion that stands between the upper and lower edges of the second discharge port 30b and the cover plate 20A and the cover material 21. The airtight wall 35b is preferably further provided at the peripheral edge of the first heat sink portion 28.

[0042] Next, the operation and effects of the cooling module 24 in the electronic device 10 will be described.

[0043] As shown in FIGS. 2 to 5, the electronic device 10 includes a housing 12 having a first exhaust port 32A and a second exhaust port 32B in a vertical wall (outer wall) 20B. The housing 12 mounts a substrate (motherboard 25) on which heat-generating components such as a CPU 25a and a GPU 25b are mounted. The electronic device 10 includes a first heat sink portion 28 having a plurality of fins 28a arranged in parallel at a predetermined interval, facing the first exhaust port 32A, a heat transport device (heat pipe 27) that transports heat from the CPU 25a or the like to the first heat sink portion 28, and a fan 30. The fan 30 has a first discharge port 30a that discharges air toward the first heat sink portion 28 and a second discharge port 30b that discharges air toward the surface of the motherboard 25. The electronic device 10 is connected to the motherboard 25 and includes a second heat sink portion 29 having a plurality of fins 29a arranged in parallel at a predetermined interval, facing the second exhaust port 32B on the air flow path 34.

[0044] In such an electronic device 10, the heat generated by a heat-generating component such as the CPU 25a is efficiently transported to the first heat sink portion 28 via the heat pipe 27. The heat transported to the first heat sink portion 28 is smoothly discharged outside the housing 12 by the air flowing from the first discharge port 30b of the fan 30 to the first exhaust port 32A.

[0045] On the other hand, a part of the heat generated by the CPU 25a or the like and a part of the heat generated by other heat-generating components such as a power component 25c that is not directly connected to the heat pipe 27 are radiated to the flow path 34. This heat is smoothly discharged outside the housing 12 by the air flowing from the second discharge port 30b to the second exhaust port 32B. Also, a part of the heat generated by the CPU 25a, GPU 25b, power components 25c, 25d, memory 25e, and memory module 25f is also transmitted to the motherboard 25 itself through the mounting pins and is transmitted to the second heat sink portion 29 along the motherboard 25. As a result, this heat is efficiently discharged from the second heat sink portion 29 outside the housing 12.

[0046] Here, inside the housing 12, the air pressure at the intake port 30c of the fan 30 and its peripheral part becomes negative pressure due to the suction of the fan 30. On the other hand, the air pressure in the flow path 34 (duct structure part 35) where air is discharged from the second discharge port 30b of the fan 30 becomes positive pressure due to pressurization. Therefore, the air discharged from the second discharge port 30b to the flow path 34 flows more smoothly to the second exhaust port 32B which is an open port, and while promoting the heat dissipation of the second heat sink part 29 on the way, it is discharged outside the housing 12.

[0047] In this way, by providing the electronic device 10 with the second heat sink part 29, in addition to main heat generating bodies such as the CPU 25a and the GPU 25b, other heat generating bodies such as the power component 25c can also be efficiently cooled, and the cooling capacity is improved.

[0048] At this time, the second heat sink part 29 is installed facing the opening 32a of the second exhaust port 32B. Therefore, each fin 29a of the second heat sink part 29 also functions as a lattice that closes each opening 32a from the inside. As a result, the second heat sink part 29 also functions as a foreign matter intrusion prevention member that prevents foreign matters such as dust, insects, and parts from entering the housing 12 through the second exhaust port 32B.

[0049] Note that each fin 29a of the second heat sink part 29 is formed of an extremely thin metal plate, and its plate thickness can be, for example, about 0.1 mm. Also, the arrangement interval (pitch) of each fin 29a can be, for example, about 1 mm. On the other hand, the width (opening width) in the X direction of each opening 32a constituting the second exhaust port 32B is, for example, about 5 mm to 10 mm. Therefore, the second heat sink part 29 can sufficiently exhibit the function of preventing foreign matter from entering from the opening 32a.

[0050] Moreover, each fin 29a of the second heat sink part 29 can be formed of an extremely thin metal plate with a plate thickness of about 0.1 mm, for example. The second heat sink part 29 does not become a ventilation resistance for the air discharged from the second discharge port 30b to the second exhaust port 32B, and contributes to increasing the air volume of the fan 30.

[0051] For example, in the opening 32a, a grid 40 for preventing foreign matter from entering is installed at a position that does not form the first exhaust port 32A and the second exhaust port 32B (see FIG. 4). The grid 40 is integrally formed with the housing member 20 from a constituent material of the housing member 20, such as metal or resin. Due to the limitations of miniaturization and thinning in such molding, the grid 40 needs to have a thickness in the X direction of a certain value or more, for example, 1 mm or more, and the gap between adjacent grids 40 is set to about 1 mm, similar to the second heat sink portion 29. That is, if the grid 40 is used instead of the second heat sink portion 29 as a foreign matter prevention member at the second exhaust port 32B, it is assumed that the grid 40 will cause a large ventilation resistance and hinder the air flow from the second discharge port 30b to the second exhaust port 32B.

[0052] Here, the experimental results of comparing the cooling performance of the electronic device 10 of the embodiment using the second heat sink portion 29 as a foreign matter prevention member at the second exhaust port 32B and the electronic device of the comparative example using the grid 40 will be described.

[0053] Table 1 shows the results of a simulation experiment comparing the temperatures of each part and the flow rate of the fan 30 between the electronic device 10 of the embodiment in which the second heat sink portion 29 is disposed facing the second exhaust port 32B and the electronic device of the comparative example in which the grid 40 is installed in each opening 32a constituting the second exhaust port 32B.

[0054] In Table 1, "Fan rotation speed (rpm)" indicates the driving rotation speed of the fan 30. "CPU temperature (°C)" indicates the surface temperature of the CPU 25a, and "GPU temperature (°C)" indicates the surface temperature of the GPU 25b. "Housing top surface temperature - center (°C)" indicates the surface temperature near the center at the Y2 side edge of the surface 12a of the housing 12, that is, near the center at the rear of the keyboard device 18. "Housing top surface temperature - side (°C)" indicates the surface temperature near the end at the X1 side or X2 side at the Y2 side edge of the surface 12a of the housing 12. "Housing bottom surface temperature (°C)" indicates the bottom surface of the housing 12, that is, the surface temperature of the cover material 21. "Fan flow rate (cfm)" indicates the total flow rate of the fan 30. In Table 1, "Difference" indicates the difference obtained by subtracting the measurement result of the comparative example from the measurement result of the embodiment.

[0055] As shown in Table 1, this experiment was carried out with the rotation speed of the fan 30 kept constant. As a result, it was found that in the examples, the temperature at all the measurement positions decreased compared with the comparative examples, with a maximum decrease of 1.6 (°C). Moreover, it was also found that the flow rate of the fan 30 increased in the examples compared with the comparative examples. This result is considered to be due to the heat dissipation effect in the second heat sink portion 29 and the effect of reducing the ventilation resistance. From the above, it was confirmed that the electronic device 10 of the present embodiment has improved cooling performance compared with the configuration of the comparative example in which the grating 40 was simply installed in the opening 32a by installing the second heat sink portion 29 facing the second exhaust port 32B.

[0056]

Table 1

[0057] Incidentally, in the electronic device 10 of the present embodiment, the first heat sink portion 28 and the second heat sink portion 29 may be constituted by a single component. For example, the heat sink portions 28, 29 may share the base plates 28b, 29b as the same component. However, in the electronic device 10 of the present embodiment, the first heat sink portion 28 and the second heat sink portion 29 are each separate components. Thereby, the installation freedom degree of each heat sink portion 28, 29 of the electronic device 10 is improved. Further, since the heat sink portions 28, 29 are separate bodies, it is also possible to suppress the high-temperature heat transported to the first heat sink portion 28 by the heat pipe 27 from being transmitted to the second heat sink portion 29 and returning to the CPU 25a etc. through the motherboard 25, and the cooling efficiency is further improved.

[0058] In other words, it is preferable that the second heat sink portion 29 is not connected to a heat transport device such as a heat pipe 27 or a vapor chamber 31 that is connected to a heat generating body such as the CPU 25a, GPU 25b, power components 25c, 25d, etc. (see FIGS. 2 and 5). Thereby, the second heat sink portion 29 can suppress the high-temperature heat transported by such a heat transport device from being reversely transmitted to the motherboard 25 and returning to the CPU 25a etc. through the motherboard 25, and can prevent a decrease in the cooling efficiency.

[0059] The second heat sink portion 29 may be configured to include a first fin parallel body 29A connected to the first surface 25A and a second fin parallel body 29B connected to the second surface 25B. As a result, the second heat sink portion 29 can expand its heat dissipation area as much as possible, and it becomes easier to connect to the motherboard 25 that is generally installed at an intermediate height position in the Z direction of the housing 12.

[0060] The second heat sink portion 29 may also be configured to have a protruding portion 29c disposed in the inner peripheral space of the opening 32a that forms the second exhaust port 32B. In this case, the second heat sink portion 29 can further expand its heat dissipation area, and the effect of preventing foreign matter from entering is also further improved. By configuring one edge portion 25C of the motherboard 25 to be similarly disposed in the inner peripheral space of the opening 32a, it becomes possible to more smoothly install the protruding portion 29c into the opening 32a. At this time, the hinge 14 of the electronic device 10 has the hinge housing 14b in the shape of a one-bar as described above. Therefore, when the electronic device 10 is in use, as is clear from FIG. 5, the protruding portion 29c and the one edge portion 25C protruding into the opening 32a are hidden by the hinge housing 14b, so that they are not conspicuous in terms of appearance.

[0061] The second heat sink portion 29 and the motherboard 25 may be configured not to be inserted into the opening 32a. FIG. 6 is a schematic side cross-sectional view of an enlarged part of the electronic device 10 including the second heat sink portion 50 according to the first modification.

[0062] The second heat sink portion 50 shown in FIG. 6 is different from the second heat sink portion 29 shown in FIG. 5 in that it does not have the protruding portion 29c. The second heat sink portion 50 is disposed facing the opening 32a in the same manner as the first heat sink portion 28 shown in FIG. 4. Therefore, the second heat sink portion 50 has sufficient performance in preventing foreign matter from entering, and its shape is simplified. As a result, the second heat sink portion 50 can further reduce the component cost, and the installation work on the housing 12 becomes easier. In this case, the uneven shape of the one edge portion 25C of the motherboard 25 to which the second heat sink portion 50 is connected is also unnecessary, and the cost reduction effect and the like are further improved.

[0063] Figure 7 is an enlarged schematic side cross-sectional view of a part of the electronic device 10 including the second heat sink portion 51 according to the second modification example.

[0064] The second heat sink portion 51 shown in FIG. 7 is different from the second heat sink portion 29 shown in FIG. 5 in that it includes a protruding portion 29d formed by integrally forming the protruding portions 29c of the upper and lower fin parallel bodies 29A and 29B. In the configuration example shown in FIG. 7, one edge portion 25C of the motherboard 25 has a flat shape in the X direction without an uneven shape. On the other hand, the second heat sink portion 51 is installed so as to sandwich one edge portion 25C of the motherboard 25, and the protruding portion 29d is inserted into the opening 32a. For this reason, the second heat sink portion 51 has the advantage that the shape of the motherboard 25 can be simplified while ensuring high foreign matter intrusion prevention performance.

[0065] Note that the present invention is not limited to the above-described embodiments, and it goes without saying that it can be freely changed without departing from the gist of the present invention.

Explanation of Reference Numerals

[0066] 10 Electronic device 11 Cover 12 Housing 20 Housing member 24 Cooling module 25 Motherboard 25a CPU 25b GPU 27 Heat pipe 28 First heat sink portion 28a, 29a Fins 29, 50, 51 Second heat sink portion 29c, 29d Protruding portions 30 Fan 30a First discharge port 30b Second discharge port 32 Exhaust port 32A First exhaust port 32a Opening 32B Second exhaust port 34 Flow path 35 Duct structure part

Claims

1. An electronic device, a housing having a first exhaust port and a second exhaust port; A substrate on which a heating element is mounted; a first heat sink portion disposed facing the first exhaust port and having a plurality of fins arranged in parallel at predetermined intervals; a heat transport device that transports heat from the heat generating body to the first heat sink portion; a fan having a first outlet capable of discharging air toward the first heat sink portion and a second outlet capable of discharging air toward a surface of the substrate; a second heat sink portion connected to the substrate and disposed facing the second exhaust port on a flow path of air flowing from the second outlet port to the second exhaust port, the second heat sink portion having a plurality of fins arranged in parallel at predetermined intervals; An electronic device comprising:

2. 2. The electronic device according to claim 1, The distance between the adjacent fins in the second heat sink portion is smaller than the opening width of the second exhaust port.

1. An electronic device comprising:

3. 3. The electronic device according to claim 2, A portion of the second heat sink portion is disposed in an inner peripheral space of the second exhaust port.

1. An electronic device comprising:

4. 4. The electronic device according to claim 3, A portion of the substrate is disposed in the inner peripheral space of the second exhaust port.

1. An electronic device comprising:

5. The electronic device according to any one of claims 1 to 4, The first heat sink portion and the second heat sink portion are separate components.

1. An electronic device comprising:

6. 6. The electronic device according to claim 5, The second heat sink portion is a first fin array connected to a first surface of the substrate; a second fin parallel body connected to a second surface of the substrate opposite to the first surface; have 1. An electronic device comprising:

7. 6. The electronic device according to claim 5, The second heat sink portion is not connected to a heat transport device that is connected to the heat generating body.

1. An electronic device comprising:

Images