Laminated type electronic component

Abstract

To provide a laminated type electronic component which improves a contact area between an internal electrode and an external electrode, and prevents permeation of oxygen or moisture.SOLUTION: A laminated type electronic component includes: a body including a lamination part 110 including a dielectric layer 111 and internal electrodes 121 and 122 which are alternately arranged across the dielectric layer in a first direction, when a direction vertical to the first direction is a second direction, and a direction vertical to the first direction and the second direction is a third direction, connection electrodes 141 and 142 which are arranged on a surface facing the second direction of the lamination part, and come into contact with the internal electrodes, and an extension part which is arranged on the connection electrodes and has insulation layers 151a and 152a; and external electrodes 130 and 140 arranged on the body, wherein the extension part further includes via electrodes 151b and 152b contacting at least a part of the connection electrode and the external electrodes.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is attached to a printed circuit board of various electronic products such as video devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays a role in charging or discharging electricity.

[0003] Such a multilayer ceramic capacitor has the advantages of being small in size while ensuring high capacitance and being easy to mount, and thus can be used as a component of various electronic devices. With the miniaturization and high-power output of various electronic devices such as computers and mobile devices, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] In recent years, the industry's interest in automotive electrical components has been increasing, and in the case of multilayer ceramic capacitors as well, high-reliability characteristics are required for use in automobiles or infotainment systems.

[0005] A conventional multilayer ceramic capacitor has a structure in which internal electrodes and dielectric layers are laminated, one end of an internal electrode is exposed in a direction perpendicular to the lamination direction, and one end of the exposed internal electrode is in contact with an external electrode.

[0006] One end of the internally exposed electrode is close to the corner of the body or the band portion of the external electrode, so it may act as a main path for oxygen or moisture to penetrate. Also, when a plurality of internal electrodes are laminated, it becomes impossible to sufficiently secure the contact area between one end of the plurality of internal electrodes and the external electrode, and there is a risk that the equivalent series resistance (ESR) of the multilayer ceramic capacitor will increase.

[0007] Therefore, there is a need for a structural improvement of the multilayer electronic component that can improve the contact area between the internal electrode and the external electrode and prevent the penetration of oxygen or moisture.

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] One of the various objects of the present invention is to solve the problem that it is difficult to ensure the connectivity between the internal electrode and the external electrode when one end of the internal electrode is in direct contact with the external electrode.

[0009] One of the various objects of the present invention is to solve the problem that it is vulnerable to the penetration of moisture or oxygen when one end of the internal electrode is in direct contact with the external electrode.

[0010] However, the object of the present invention is not limited to the above description, and can be more easily understood in the process of describing specific embodiments of the present invention.

MEANS FOR SOLVING THE PROBLEM

[0011] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, a multilayer portion including internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, a second direction perpendicular to the first direction, and a third direction perpendicular to the first direction and the second direction. A main body disposed on opposite surfaces of the multilayer portion in the second direction, including a connection electrode in contact with the internal electrode, and an extension portion disposed on the connection electrode and including an insulating layer; and an external electrode disposed on the main body. The extension portion may further include at least a part of the connection electrode and a via electrode in contact with the external electrode.

Advantages of the Invention

[0012] One of the various effects of the present invention is to minimize the penetration of moisture and oxygen from the outside into the internal electrodes and improve the moisture resistance reliability of the multilayer electronic component.

[0013] One of the various effects of the present invention is to improve the moisture resistance reliability of a multilayer electronic component having a structure in which an internal electrode and an external electrode are connected via a connection electrode, and to ensure excellent ESR characteristics by connecting the connection electrode and the external electrode via a via electrode.

[0014] However, the various and beneficial advantages and effects of the present invention are not limited to the above description and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

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Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Mode for Carrying Out the Invention

[0016] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be deformed into various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the technical field. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation.

[0017] In addition, for the purpose of clearly explaining the present invention, parts not related to the explanation are omitted in the drawings, the thickness is enlarged to clearly show various layers and regions, and components having the same function within the scope of the same idea are described using the same reference numerals. Furthermore, throughout the specification, when a component is described as "including", it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0018] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0019] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a perspective view of a stacked portion according to an embodiment, FIG. 3 schematically shows an exploded perspective view of a stacked portion according to an embodiment, FIG. 4 schematically shows a perspective view of a main body according to an embodiment, FIG. 5 schematically shows an exploded perspective view of a main body according to an embodiment, FIG. 6 is a cross-sectional view taken along line I-I' of FIG. 1, FIG. 7 is a cross-sectional view taken along line II-II' of FIG. 1, and FIG. 8 is a plan view schematically showing the structure of a connecting electrode according to an embodiment.

[0020] Hereinafter, with reference to FIGS. 1 to 8, a stacked electronic component 1000 according to an embodiment of the present invention will be described in detail.

[0021] A stacked electronic component 1000 according to an embodiment of the present invention includes a stacked portion 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged in the first direction with the dielectric layer 111 interposed therebetween, a main body 100 disposed on the surfaces of the stacked portion 110 facing each other in the second direction when the direction perpendicular to the first direction is defined as the second direction and the direction perpendicular to the first and second directions is defined as the third direction, the main body 100 including connecting electrodes 141 and 142 in contact with the internal electrodes 121 and 122, and extensions 151 and 152 including insulating layers 151a and 152a disposed on the connecting electrodes 141 and 142, and external electrodes 130 and 140 disposed on the main body 100. The extensions 151 and 152 may further include via electrodes 151b and 152b in contact with at least a part of the connecting electrodes 141 and 142 and the external electrodes 130 and 140.

[0022] Referring to FIGS. 2 and 3, the stacked portion 110 may include a dielectric layer 111 and internal electrodes 121 and 122. The internal electrodes 121 and 122 may be alternately arranged in the first direction with the dielectric layer 111 interposed therebetween.

[0023] The plurality of dielectric layers 111 forming the stacked portion 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0024] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based dielectric material, a normal dielectric material based on CaZrO3, etc. can be used. For example, a barium titanate-based (BaTiO3) dielectric material includes BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1) can be one or more of them, and the normal dielectric material based on CaZrO3 can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0025] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the dielectric layer 111 according to the object of the present invention.

[0026] The average thickness td of the dielectric layer 111 is not particularly limited.

[0027] When aiming at miniaturization and high capacitance of the multilayer electronic component 1000, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 1000 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 3 μm or more.

[0028] The average thickness td of the dielectric layer 111 can be measured by image scanning the cross-section (L-T cross-section) of the main body 100 in the third direction and the first direction with a scanning electron microscope (SEM).

[0029] For example, the average thickness td of the dielectric layer 111 is extracted from an image scanned by a scanning electron microscope (SEM) of the cross-section in the length and thickness directions (L-T) cut at the central part in the width direction of the main body 100. In the dielectric layer, based on one layer of the dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact, for a total of five layers of the dielectric layer, two layers on the upper part and two layers on the lower part, with the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact as a reference, after determining five points, two points on the left side and two points on the right side, at equal intervals around the one reference point, the thickness of each point is measured, and the average value can be measured.

[0030] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122.

[0031] The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 can be exposed on one surface of the stacked portion 110 in the second direction, and the second internal electrode 122 can be exposed on the other surface of the stacked portion 110 in the second direction.

[0032] Referring to FIG. 6, the first internal electrode 121 can be arranged at a certain distance from the other surface of the stacked portion 110 in the second direction, and the second internal electrode 122 can be arranged at a certain distance from one surface of the stacked portion 110 in the second direction. At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0033] The stacked portion 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0034] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0035] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on the ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method or a gravure printing method can be used, but the present invention is not limited thereto.

[0036] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and varies depending on the purpose. For the miniaturization of the multilayer electronic component 1000, the average thickness te of the internal electrodes 121 and 122 can be 0.35 μm or less, and for improving the reliability of the multilayer electronic component 1000 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 can be 3 μm or more.

[0037] The average thickness te of the internal electrodes 121 and 122 can be measured by scanning an image of a cross-section in the length and thickness directions (L-T) of the main body 100 cut at the central part in the width direction with a scanning electron microscope (SEM). In the internal electrode layer extracted from the image, based on one layer of the internal electrode layer at the point where the center line in the length direction of the main body and the center line in the thickness direction meet, for a total of five layers of internal electrode layers, two layers on the upper part and two layers on the lower part, with the point where the center line in the length direction of the main body and the center line in the thickness direction meet as the reference, after determining five points, two points on the left and two points on the right, at equal intervals around the one reference point, the thickness of each point is measured, and the average value can be measured.

[0038] Referring to FIGS. 2 and 6, in the stacked portion 110, a region where the internal electrodes 121 and 122 overlap in the first direction can be defined as a capacitance forming portion Ac.

[0039] The capacitance forming portion Ac can play a role in forming capacitance by arranging the first and second internal electrodes 121 and 122 to overlap in the first direction.

[0040] On the other hand, cover portions 112 and 113 can be included on one surface and the other surface of the capacitance forming portion Ac in the first direction.

[0041] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and basically can play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0042] The cover portions 112 and 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0043] That is, the cover portions 112 and 113 can include a ceramic material, for example, the same substance as the dielectric layer 111.

[0044] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. For example, the thickness tc of the cover portions 112 and 113 can be 20 μm or less respectively.

[0045] The average thickness tc of the cover portions 112 and 113 means the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0046] Width-margin portions 114 and 115 can be arranged on one surface and the other surface in the third direction of the capacitance forming portion Ac.

[0047] As shown in FIG. 2, the width-margin portions 114 and 115 can mean the regions between the end surfaces in the second direction of the stacked portion 110 and the boundary surfaces between the third-direction ends on both sides of the first and second internal electrodes 121 and 122 and the stacked portion 110.

[0048] Basically, the width-margin portions 114 and 115 can play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0049] The width-margin portions 114 and 115 can be formed by applying a conductive paste on the ceramic green sheet except for the locations where the margin portions are to be formed to form the internal electrodes.

[0050] Also, in order to suppress the step due to the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed at both end faces in the third direction of the stacked portion after stacking, a single dielectric layer or two or more dielectric layers are stacked on both side faces of the capacitance forming portion Ac in the third direction (width direction) to form the width-margin portions 114 and 115.

[0051] On the other hand, the width of the width-margin portions 114 and 115 does not need to be particularly limited. For example, the average width of the width-margin portions 114 and 115 can be 20 μm or less respectively.

[0052] The average widths of the width - margin portions 114 and 115 mean the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the width - margin portions 114 and 115 measured at five equally - spaced points on the side surface of the capacitance - forming portion Ac.

[0053] Length - margin portions can be arranged on one surface and the other surface of the capacitance - forming portion Ac in the second direction. Specifically, as shown in FIG. 6, the length - margin portion can mean the region between both ends in the second direction of the first and second internal electrodes 121 and 122 and the end surface in the second direction of the stacked portion 110.

[0054] The margin portions 114 and 115 in the second direction can mean the region between both ends in the second direction of the first and second internal electrodes 121 and 122 and the end surface in the second direction of the stacked portion 110, as shown in FIG. 6.

[0055] The length - margin portion can play a role of connecting the first internal electrode 121 and the second internal electrode 122 to power supplies with different polarities respectively. On the other hand, since one of the first internal electrode 121 and the second internal electrode 122 includes the dielectric layer 111, it cannot contribute to the formation of capacitance, and since it includes the first or second internal electrode exposed on the end surface of the stacked portion 110, there is a possibility of becoming a penetration path for moisture from the outside.

[0056] Referring to FIG. 4, when the direction perpendicular to the first direction is defined as the second direction and the direction perpendicular to the first direction and the second direction is defined as the third direction, the main body 100 can have a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 facing each other in the second direction and connected to the first and second surfaces 1 and 2, and a fifth surface 5 and a sixth surface 6 facing each other in the third direction and connected to the first and second surfaces 1 and 2 and also connected to the third and fourth surfaces 3 and 4.

[0057] The specific shape of the main body 100 is not particularly limited. As shown in the figures, the main body 100 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 100 during the firing process, the main body 100 may not have a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0058] Referring to FIG. 5, the main body 100 can be disposed on the surfaces of the laminated portion 110 facing each other in the second direction and include connection electrodes 141 and 142 that are in contact with the internal electrodes 121 and 122.

[0059] The method of printing the connection electrodes 141 and 142 on the extension portions 151 and 152 is diverse according to the purpose. For example, when it is necessary to print the connection electrodes 141 and 142 in various and complex forms, they can be formed by screen printing, but are not limited thereto.

[0060] The components of the connection electrodes 141 and 142 are not particularly limited and can include the same conductive metal as the internal electrodes 121 and 122 or metal elements different from the conductive metals contained in the internal electrodes 121 and 122.

[0061] Referring to FIG. 5, the main body 100 can include extension portions 151 and 152 disposed on the connection electrodes. The extension portions 151 and 152 include insulating layers 151a and 152a to improve the sealing characteristics and minimize the penetration of moisture, plating solution, etc. from the outside. By including via electrodes 151b and 152b, they can play a role in connecting all of the internal electrodes 121 and 122, the connection electrodes 141 and 142, and the external electrodes 130 and 140.

[0062] The extension portions 151 and 152 are disposed so as to cover the end faces of the laminated portion 110 and the connection electrodes 141 and 142 in the second direction, and the sealing performance of the multilayer electronic component 1000 can be improved. From this perspective, the extension portions 151 and 152 can be disposed so as to cover all of the end faces of the connection electrodes 141 and 142 in the second direction.

[0063] The insulating layers 151a and 152a can be made of a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc., but are not limited thereto. Since the extension portions 151 and 152 do not contribute to capacitance formation in the same way as the dielectric layer 111, they do not necessarily have to be formed of a material with a high permittivity, and can include a material with excellent sealing properties, strength, and adhesion.

[0064] The via electrodes 151b and 152b can be formed by forming via holes in the insulating layers 151a and 152a using a drill or a laser and filling the inside of the via holes with a conductive material. The via electrodes 151b and 152b can be arranged in a form that penetrates the insulating layers 151a and 152a in the second direction, and thereby can be connected to the external electrodes 130 and 140 and the connection electrodes 141 and 142 at the same time.

[0065] The extension portions 151 and 152 can be formed by a transfer method, similar to the connection electrodes 141 and 142, and then can undergo a sintering process. Also, they can be fired simultaneously with the stacked portions 110, the connection electrodes 141, and 142.

[0066] The external electrodes 130 and 140 are arranged on the main body 100 and can be connected to the via electrodes 151b and 152b.

[0067] The external electrodes 130 and 140 can be formed using any material that has electrical conductivity, such as a metal, and a specific material can be determined considering electrical characteristics, structural stability, etc. Further, they can have a multilayer structure.

[0068] For example, the external electrodes 130 and 140 can include an electrode layer disposed on the main body 100 and a plating layer formed on the electrode layer.

[0069] As a more specific example of the electrode layer, the electrode layer can be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.

[0070] Also, the external electrodes 130 and 140 can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 100. Further, the external electrodes 130 and 140 can be formed by dipping or wheel methods on the main body 100 with a sheet containing a conductive metal, but are not limited thereto.

[0071] As the conductive metal included in the external electrodes 130 and 140, a material having excellent electrical conductivity can be used, and it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), palladium (Pd), and alloys thereof.

[0072] Conventionally, in a multilayer electronic component, in order to connect each of the first internal electrode 121 and the second internal electrode 122 to terminal electrodes of different polarities, the first and second internal electrodes and the external electrodes are in contact with each other on both sides facing each other in the second direction of the multilayer portion 110.

[0073] In this case, in order to increase the capacitance per unit volume of the multilayer electronic component, it is necessary to minimize the length in the second direction of the length-margin portion that does not contribute to the formation of capacitance. However, as the length in the second direction of the length-margin portion becomes smaller, the penetration path of moisture or oxygen from the outside becomes shorter, so there is a possibility that the moisture resistance reliability becomes weaker.

[0074] Therefore, in one embodiment of the present invention, by disposing the extension portions 151 and 152 including the insulating layers 151a and 152a on the connection electrodes 141 and 142, the length-margin portion is formed to a minimum to improve the capacitance per unit volume of the multilayer electronic component 1000, and the moisture resistance reliability of the multilayer electronic component 1000 can be improved by increasing the penetration path of moisture or oxygen from the outside.

[0075] On one hand, since the extension parts 151 and 152 including the insulating layers 151a and 152a are arranged on the connection electrodes 141 and 142, in order for the connection electrodes 141 and 142 to be connected to the external electrodes 130 and 140 without the via electrodes 151b and 152b described later, the ends of the connection electrodes 141 and 142 need to be exposed on the surface facing the first direction of the main body 100 or the surface facing the third direction. In this case, since the ends of the connection electrodes 141 and 142 in the first direction or the third direction need to be connected to the external electrodes 130 and 140, it is difficult to ensure a sufficient bonding area between the connection electrodes 141 and 142 and the external electrodes 130 and 140.

[0076] Therefore, in one embodiment of the present invention, by making the extension parts 151 and 152 further include at least a part of the connection electrodes 141 and 142 and the via electrodes 151b and 152b in contact with the external electrodes 130 and 140, the electrical connectivity between the connection electrodes 141 and 142 and the external electrodes 130 and 140 can be improved, and thereby, the ESR characteristics of the multilayer electronic component 1000 can be improved.

[0077] In one embodiment, the connection electrodes 141 and 142 can be arranged at a distance from one or more of the surfaces 1 and 2 facing the first direction of the main body 100 and the surfaces 5 and 6 facing the third direction of the main body 100.

[0078] According to one embodiment of the present invention, since the via electrodes 151b and 152b are in direct contact with the external electrodes 130 and 140 and the connection electrodes 141 and 142 to ensure electrical connectivity, the connection electrodes 141 and 142 do not need to be directly connected to the external electrodes 130 and 140. Thereby, in one embodiment, by making the connection electrodes 141 and 142 be separated from one or more of the surfaces 1 and 2 facing the first direction of the main body 100 and the surfaces 5 and 6 facing the third direction of the main body 100, the moisture resistance reliability of the multilayer electronic component 1000 can be improved.

[0079] In one embodiment, the connection electrodes can be disposed at a distance from the surfaces of the main body facing the first direction and the surfaces of the main body facing the third direction. Thereby, by separating the connection electrodes 141 and 142 from both the surfaces 1 and 2 of the main body 100 facing the first direction and the surfaces 5 and 6 of the main body 100 facing the third direction, the moisture resistance reliability of the multilayer electronic component 1000 can be further improved.

[0080] In one embodiment, a plurality of via electrodes 151b and 152b can be included in the extension portions 151 and 152. Thereby, by improving the area where the via electrodes 151b and 152b are in contact with the external electrodes 130 and 140 and the connection electrodes 141 and 142, the ESR characteristics of the multilayer electronic component 1000 can be improved.

[0081] In one embodiment, the ratio of the area where the via electrodes 151b and 152b are in contact with the surfaces 3 and 4 of the main body 100 facing the second direction to the area of the surfaces 3 and 4 of the main body 100 facing the second direction can be 15% or more and 65% or less. The surfaces 3 and 4 of the main body 100 facing the second direction are the surfaces where the ends of the via electrodes 151b and 152b are exposed and can be the surfaces where the external electrodes 130 and 140 are in contact with the via electrodes 151b and 152b. At this time, when the ratio of the area where the via electrodes 151b and 152b are in contact with the surfaces 3 and 4 of the main body 100 facing the second direction to the area of the surfaces 3 and 4 of the main body 100 facing the second direction is less than 15%, the area where the via electrodes 151b and 152b are in contact with the external electrodes 130 and 140 and the connection electrodes 141 and 142 is insufficient, and it may be difficult to improve the ESR characteristics of the multilayer electronic component 1000. Also, when the ratio of the area where the via electrodes 151b and 152b are in contact with the surfaces 3 and 4 of the main body 100 facing the second direction to the area of the surfaces 3 and 4 of the main body 100 facing the second direction exceeds 65%, the via electrodes 151b and 152b act as permeation paths for moisture or oxygen from the outside, and the moisture resistance reliability of the multilayer electronic component 1000 may decrease.

[0082] Therefore, in one embodiment, by adjusting the ratio of the area of the surfaces 3 and 4 of the main body 100 facing the second direction to the area of the surfaces of the via electrodes 151b and 152b in contact with the surfaces 3 and 4 of the main body 100 facing the second direction to be 15% or more and 65% or less, sufficient ESR characteristics of the multilayer electronic component 1000 can be ensured, and a decrease in moisture resistance reliability can be suppressed.

[0083] On the other hand, the ratio of the area of the surfaces of the via electrodes 151b and 152b in contact with the surfaces 3 and 4 of the main body 100 facing the second direction to the area of the surfaces 3 and 4 of the main body 100 facing the second direction can be adjusted by adjusting the diameters of the via electrodes 151b and 152b.

[0084] In FIG. 6, it is shown that the via electrodes 151b and 152b are arranged at the central portion in the first direction of the main body 100. However, in the present invention, the positions of the via electrodes 151b and 152b can vary depending on the purpose. Specifically, in one embodiment, when the surfaces of the main body 100 facing the first direction are defined as the first surface and the second surfaces 1 and 2, respectively, the via electrodes 151b and 152b can be arranged to be biased toward either one of the first surface and the second surfaces 1 and 2. Thereby, by blocking the penetration path of moisture from the outside, the moisture resistance reliability of the multilayer electronic component 1000 can be further improved.

[0085] Also, in one embodiment, the via electrodes 151b and 152b include a first via electrode 151b in contact with the third surface 3 and a second via electrode 152b in contact with the fourth surface 4, and the first via electrode 151b can be arranged to be biased toward the first surface 1, and the second via electrode 152b can be arranged to be biased toward the second surface 2.

[0086] In one embodiment, the via electrodes 151b and 152b can be arranged separated from the surfaces 1 and 2 of the main body 100 facing the first direction and the surfaces 5 and 6 of the main body 100 facing the third direction. Thereby, the penetration path of moisture or oxygen from the outside to the first surface to the sixth surface can be blocked, and the moisture resistance reliability of the multilayer electronic component 1000 can be further improved.

[0087] Referring to FIG. 8, in one embodiment, the connecting electrodes 141 and 142 can cover one end of the internal electrodes 121 and 122 in the second direction. Specifically, the connecting electrodes 141 and 142 can be arranged to cover the ends of the internal electrodes 121 and 122 exposed on the surfaces facing each other in the second direction of the stacked portion 110. Thereby, the contact area between the internal electrodes 121 and 122 and the connecting electrodes 141 and 142 can be increased, and thereby, the ESR characteristics of the stacked electronic component 1000 can be further improved.

[0088] FIG. 9 is a plan view schematically showing the structure of the connecting electrode according to one embodiment, FIG. 10 is a plan view schematically showing the structure of the connecting electrode according to one embodiment, FIG. 11 is a plan view schematically showing the structure of the connecting electrode according to one embodiment, and FIG. 12 is a plan view schematically showing the structure of the connecting electrode according to one embodiment.

[0089] In one embodiment, the connecting electrodes 141 and 142 can cover a part of the cover portions 112 and 113.

[0090] Referring to FIG. 9, the connecting electrode 141-1 can be arranged to extend in the first direction or the third direction so as to cover not only the capacitance forming portion Ac but also beyond the capacitance forming portion Ac.

[0091] Referring to FIG. 6, since the cover portions 112 and 113 are located on one surface and the other surface of the capacitance forming portion Ac in the first direction, the connecting electrode 141-1 can cover a part of the cover portions 112 and 113. Thereby, the connectivity between the connecting electrodes 141 and 142 and the internal electrodes 121 and 122 can be ensured, and the bonding strength between the stacked portion 110 and the connecting electrodes 141 and 142 can be improved.

[0092] Referring to FIG. 10, the connecting electrode 141-2 can be arranged to contact one end of the internal electrode in the second direction and include a plurality of body portions 141a arranged separately from each other. The direction in which the plurality of body portions 141a are separated from each other is not particularly limited, and the plurality of body portions 141a can be separated from each other in the first direction and / or the third direction. Thereby, compared with the case where the connecting electrodes 141 and 142 entirely cover the ends of the internal electrodes 121 and 122 in the second direction, the moisture resistance reliability of the multilayer electronic component 1000 can be improved.

[0093] Referring to FIG. 11, the connecting electrode 141-3 can be arranged to contact one end of the internal electrode in the second direction and include a plurality of body portions 141a arranged separately from each other and a connecting portion 141b connecting the plurality of body portions 141a. Thereby, by integrally connecting the plurality of body portions 141a separated from each other, the connectivity between the internal electrode and the connecting electrode can be improved.

[0094] Referring to FIG. 12, the connecting electrode 141-4 can be arranged to contact one end of the internal electrode in the second direction and include a plurality of body portions 141a arranged separately from each other and a connecting portion 141c connecting the plurality of body portions 141a. A plurality of the connecting portions 141c can be arranged, and the plurality of connecting portions 141c can be connected to each other. Thereby, by integrally connecting the plurality of body portions 141a separated from each other, the effect of improving the connectivity between the internal electrode and the connecting electrode can be further enhanced.

[0095] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not deviating from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.

[0096] Also, the expression "an embodiment used in the present invention" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented embodiment does not exclude the case where it is implemented in combination with the features of other embodiments. For example, even if a matter described in a specific embodiment is not described in other embodiments, it can be interpreted as an explanation related to other embodiments as long as there is no explanation contrary to that matter or an explanation conflicting with that matter in other embodiments.

[0097] The terms used in the present invention are only described for the purpose of explaining an example and are not intended to limit the present invention. At this time, the singular expression includes the plural unless the context clearly indicates a different meaning.

Description of Reference Numerals

[0098] 1000 Multilayer Electronic Component 100 Body 110 Laminated Portion 111 Dielectric Layer 112, 113 Cover Portions 114, 115 Width-Margin Portions 121, 122 Internal Electrodes 130, 140 External Electrodes 141, 142 Connecting Electrodes 151, 152 Extension Portions 151a, 152a Insulating Layers 151b, 152b Via Electrodes

Claims

1. A stacked body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer therebetween. When a direction perpendicular to the first direction is defined as a second direction and a direction perpendicular to both the first direction and the second direction is defined as a third direction, a main body including a connection electrode disposed on a surface of the stacked body facing the second direction and in contact with the internal electrode, and an extension portion disposed on the connection electrode and including an insulating layer. An external electrode disposed on the main body. The extension portion further includes at least a part of the connection electrode and via electrodes in contact with the external electrode. A multilayer electronic component.

2. The connection electrode is disposed at a distance from one or more surfaces of the main body facing the first direction and the third direction of the main body. The multilayer electronic component according to claim 1.

3. The connection electrode is disposed at a distance from the surfaces of the main body facing the first direction and the third direction of the main body. The multilayer electronic component according to claim 1.

4. A plurality of the via electrodes are included in the extension portion. The multilayer electronic component according to claim 1.

5. The ratio of the area of the via electrodes in contact with the surface of the main body facing the second direction to the area of the surface of the main body facing the second direction is 15% or more and 65% or less. The multilayer electronic component according to claim 1.

6. When the surfaces of the main body facing the first direction are defined as a first surface and a second surface, respectively, the via electrodes are disposed biased toward either one of the first surface and the second surface. The multilayer electronic component according to claim 1.

7. When the surfaces of the main body facing the first direction are defined as a first surface and a second surface, respectively, and the surfaces of the main body facing the second direction are defined as a third surface and a fourth surface, respectively, the via electrodes include a first via electrode in contact with the third surface and a second via electrode in contact with the fourth surface. The first via electrode is disposed biased toward the first surface, and the second via electrode is disposed biased toward the second surface. The multilayer electronic component according to claim 1.

8. The via electrodes are disposed at a distance from the surfaces of the main body facing the first direction and the third direction of the main body. The multilayer electronic component according to claim 1.

9. The connection electrode covers one end of the internal electrode in the second direction. The multilayer electronic component according to claim 1.

10. In the stacked portion, when a region where the internal electrodes overlap in the first direction is defined as a capacitance forming portion, and regions disposed on one surface and the other surface of the capacitance forming portion in the first direction are defined as cover portions, The laminated electronic component according to claim 1, wherein the connecting electrode covers a part of the cover portion.

11. The laminated electronic component according to claim 1, wherein the connecting electrode includes a plurality of body portions that are arranged to be in contact with one end of the internal electrode in the second direction and are spaced apart from each other.

12. The laminated electronic component according to claim 11, wherein the connecting electrode further includes a connecting portion that connects the plurality of body portions.

13. The laminated electronic component according to claim 11, wherein the number of the plurality of body portions is three or more.

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