Laminated type electronic component

Abstract

To reduce ESR of a laminated type electronic component, in such a structure that an additional extraction electrode is formed in the cross section of a body where one end of the internal electrode is exposed.SOLUTION: A laminated type electronic component includes a body including a dielectric layer and an internal electrode alternately arranged across the dielectric layer in a first direction, an extension part arranged on the body, and an external electrode arranged on the extension part, wherein the extension part can include a plurality of extraction electrodes arranged at intervals in a second direction vertical to the first direction, a plurality of via electrodes connecting the plurality of extraction electrodes, and an insulation part covering the plurality of extraction electrodes.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] Conventionally, in order to minimize the proportion of the external electrodes in the entire multilayer ceramic capacitor and minimize the area where the external electrodes are exposed outside the multilayer ceramic capacitor, attempts have been made to introduce a structure in which a separate lead-out electrode is formed on the cross-section of the main body where one end of the internal electrode is exposed, the lead-out electrode is covered with a ceramic layer, and the lead-out electrode is exposed only on one side in the thickness direction. When having such a structure, the proportion of the external electrodes in the multilayer ceramic capacitor can be minimized, and the moisture resistance reliability can be improved. However, it is difficult to sufficiently ensure the electrical connectivity between the internal electrode and the lead-out electrode and the electrical connectivity between the lead-out electrode and the external electrode, which may cause a problem that the ESR of the multilayer ceramic capacitor decreases.

[0005] Therefore, even if a separate lead electrode is formed on the cross-section of the main body where one end of the internal electrode is exposed, a structural improvement is required to prevent the problem of deterioration of the ESR characteristics.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various objects of the present invention is to reduce the ESR of a multilayer electronic component in a structure where a separate lead electrode is formed on the cross-section of the main body where one end of the internal electrode is exposed.

[0007] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0008] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, a main body including internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, an extension portion arranged on the main body, and an external electrode arranged on the extension portion. The extension portion may include a plurality of lead electrodes arranged at intervals in a second direction perpendicular to the first direction, a plurality of via electrodes connecting the plurality of lead electrodes, and an insulating portion covering the plurality of lead electrodes.

Effects of the Invention

[0009] One of the various effects of the present invention is to improve the connectivity between the internal electrode and the lead electrode, thereby reducing the equivalent series resistance (ESR) of the multilayer electronic component.

[0010] However, the various and significant advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Best Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numeral in the drawings are the same elements.

[0013] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the illustration. Further, components having the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0014] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0015] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1. FIG. 3 is a cross-sectional view taken along line II-II' of FIG. 1. FIG. 4 schematically shows a perspective view of a main body according to an embodiment. FIG. 5 schematically shows an exploded perspective view of a stacked electronic component according to an embodiment. FIG. 6 is an enlarged view of the P region of FIG. 2.

[0016] Hereinafter, with reference to FIGS. 1 to 6, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail.

[0017] A stacked electronic component 1000 according to an embodiment of the present invention includes a main body 110 including a dielectric layer 111 and internal electrodes 121 and 212 alternately arranged in the first direction with the dielectric layer 111 interposed therebetween, extension portions 141 and 142 disposed on the main body 110, and external electrodes 131 and 132 disposed on the extension portions 141 and 142. The extension portions 141 and 142 include a plurality of lead electrodes 141a and 142a spaced apart in the second direction perpendicular to the first direction of the main body 110, a plurality of via electrodes 141b and 142b connecting the plurality of lead electrodes 141a and 142a, and insulating portions 141c and 142c covering the plurality of lead electrodes 141a and 142a.

[0018] Referring to FIGS. 2 and 3, the main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122.

[0019] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0020] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based dielectric material, a normal dielectric material of a CaZrO3 substrate, etc. can be used. For example, a barium titanate (BaTiO3)-based dielectric material includes BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3 (0 < y < 1) can be one or more of them, and the normal dielectric material of the CaZrO3 substrate can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0021] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the dielectric layer 111 according to the purpose of the present invention.

[0022] The average thickness of the dielectric layer 111 is not particularly limited.

[0023] When aiming for miniaturization and high capacitance of the multilayer electronic component 1000, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 1000 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 3 μm or more.

[0024] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section (L-T cross-section) of the main body 110 in the third and first directions with a scanning electron microscope (SEM).

[0025] For example, the average thickness td of the dielectric layer 111 is extracted from the dielectric layer scanned with a scanning electron microscope (SEM) of the cross-section in the length and thickness directions (L-T) cut at the central part in the width direction of the main body 110. Among the dielectric layers, for a total of 5 dielectric layers, 2 layers above and 2 layers below, with the reference being the dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet. After determining 5 points at equal intervals, 2 points to the left and 2 points to the right centered on one reference point, the thickness at each point is measured and the average value can be measured.

[0026] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122.

[0027] The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 can be exposed on one surface of the main body 110 in the second direction, and the second internal electrode 122 can be exposed on the other surface of the main body 110 in the second direction.

[0028] Referring to FIG. 2, the first internal electrode 121 can be arranged at a certain distance from the other surface of the main body 110 in the second direction, and the second internal electrode 122 can be arranged at a certain distance from one surface of the main body 110 in the second direction. At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the dielectric layer 111 disposed in the middle.

[0029] The main body 110 can be formed by alternately laminating a ceramic green sheet printed with the first internal electrode 121 and a ceramic green sheet printed with the second internal electrode 122, and then firing.

[0030] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0031] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, etc. can be used, but the present invention is not limited thereto.

[0032] The average thickness of the internal electrodes 121 and 122 is not particularly limited and can vary according to the purpose. For the miniaturization of the multilayer electronic component 1000, the average thickness of the internal electrodes 121 and 122 can be 0.35 μm or less, and for improving the reliability of the multilayer electronic component 1000 under high temperature and high pressure, the average thickness of the internal electrodes 121 and 122 can be 3 μm or more.

[0033] The average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at five points, with two points on the left and two points on the right at equal intervals centered around one reference point, with respect to a total of five internal electrode layers, two layers above and two layers below, based on the internal electrode layer at the point where the center line in the length direction of the main body and the center line in the thickness direction are in contact, and extracting the internal electrode layer from the image scanned by a scanning electron microscope (SEM) of the cross-section in the length and thickness directions (L-T) cut at the central part in the width direction of the main body 110.

[0034] Referring to FIGS. 2 and 3, in the main body 110, a region where the internal electrodes 121 and 122 overlap in the first direction can be defined as a capacitance forming portion Ac.

[0035] The capacitance forming portion Ac can serve to form a capacitance by arranging the first and second internal electrodes 121 and 122 to overlap in the first direction.

[0036] On the other hand, cover portions 112 and 113 can be included on one surface and the other surface of the capacitance forming portion Ac in the first direction.

[0037] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0038] The cover portions 112 and 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0039] That is, the cover portions 112 and 113 can include a ceramic material, for example, the same substance as the dielectric layer 111.

[0040] On the one hand, the thicknesses of the cover portions 112 and 113 do not need to be particularly limited. For example, the thicknesses of the cover portions 112 and 113 can each be 20 μm or less.

[0041] The average thickness of the cover portions 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0042] Margin portions 114 and 115 can be arranged on one surface and the other surface of the capacitance forming portion Ac in the third direction.

[0043] As shown in FIG. 3, the margin portions 114 and 115 can mean the regions between the boundaries of the third-direction ends of both the first and second internal electrodes 121 and 122 and the main body 110 in the cross-section (end surfaces) of the main body 110 in the second direction.

[0044] The margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0045] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes except where the margin portions are formed on the ceramic green sheet.

[0046] Also, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on both end surfaces (end surfaces) of the main body in the third direction after lamination, a single dielectric layer or two or more dielectric layers are laminated on both side surfaces of the capacitance forming portion Ac in the third direction (width direction) to form the margin portions 114 and 115.

[0047] On the one hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. For example, the average widths of the margin portions 114 and 115 can each be 20 μm or less.

[0048] The average widths of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrode is spaced from the fifth surface and the average size in the third direction of the region where the internal electrode is spaced from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0049] Referring to FIG. 4, when the direction perpendicular to the first direction is the second direction and the direction perpendicular to the first and second directions is the third direction, the main body 110 includes first and second surfaces 1 and 2 facing each other in the first direction, connected to the first and second surfaces 1 and 2, third and fourth surfaces 3 and 4 facing each other in the second direction, connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and fifth and sixth surfaces 5 and 6 facing each other in the third direction.

[0050] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect straight hexahedron shape, but can have a substantially hexahedron shape.

[0051] Referring to FIG. 5, extension portions 141 and 142 can be arranged on the main body 110. The extension portions 141 and 142 are arranged on the third surface 3 and the fourth surface 4 which are the surfaces of the main body facing each other in the second direction, and can cover the ends of the internal electrodes 121 and 122 in the second direction.

[0052] Referring to FIGS. 1 and 6, in one embodiment of the present invention, the extension portions 141 and 142 can include a plurality of extraction electrodes 141a and 142a arranged at intervals in the second direction, a plurality of via electrodes 141b and 142b connecting the plurality of extraction electrodes 141a and 142a, and insulating portions 141c and 142c covering the plurality of extraction electrodes 141a and 142a.

[0053] In one embodiment, the extension portions 141 and 142 are disposed on the third surface and the fourth surface 3 and 4 which are the surfaces facing each other in the second direction of the main body 110, and the plurality of extraction electrodes 141a and 142a can be in contact with the internal electrodes 121 and 122 on the third surface and the fourth surface 3 and 4 of the main body 110. Thereby, the internal electrodes 121 and 122 can be directly in contact with the plurality of extraction electrodes 141a and 142a without directly contacting the external electrodes 131 and 132 described later.

[0054] The plurality of extraction electrodes 141a and 142a can play a role of ensuring electrical connectivity by directly contacting the internal electrodes.

[0055] The plurality of extraction electrodes 141a and 142a can include a conductive metal. The type of the conductive metal included in the plurality of extraction electrodes 141a and 142a is not particularly limited. However, in one embodiment, the plurality of extraction electrodes 141a and 142a can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0056] The plurality of via electrodes 141b and 142b can connect the plurality of extraction electrodes 141a and 142a. Specifically, the plurality of via electrodes 141b and 142b can be disposed between a pair of adjacent extraction electrodes among the plurality of extraction electrodes 141a and 142a.

[0057] The plurality of via electrodes 141b and 142b can include a conductive metal. The type of the conductive metal included in the plurality of via electrodes 141b and 142b is not particularly limited. However, in one embodiment, the plurality of via electrodes 141b and 142b can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0058] The insulating portions 141c and 142c can cover the plurality of extraction electrodes 141a and 142a. Specifically, the insulating portions 141c and 142c can fill a region in the space between the plurality of extraction electrodes 141a and 142a where the plurality of via electrodes 141b and 142b are not formed, and can be arranged to cover the surfaces of the plurality of extraction electrodes 141a and 142a. Thereby, the moisture resistance reliability of the multilayer electronic component 100 can be ensured.

[0059] The insulating portions 141c and 142c can contain the same dielectric material as the dielectric layer 111, but are not limited thereto, and can contain a material having excellent insulation or rigidity.

[0060] As an example of a method of forming the extension portions 141 and 142 on the main body 110, after pressing and adhering an extension portion forming sheet formed by printing a plurality of extraction electrode patterns on a ceramic sheet and sandwiching another ceramic sheet on the main body 110, it can be formed by firing. At this time, the printing area of the extraction electrode pattern can be adjusted to adjust the formation area of the plurality of extraction electrodes 141a and 142a, and a separate ceramic sheet can be printed on the ceramic sheet where the plurality of extraction electrodes 141a and 142a are not formed. On the other hand, the via electrodes 141b and 142b can be formed by forming via holes through a laser drill or a punch every time the extraction electrode pattern is printed in two layers, applying a conductive paste to the via holes, or filling the via holes with a conductive material using a method such as plating. On the other hand, the via electrodes 141b and 142b can also be formed by forming via holes so as to penetrate all the plurality of extraction electrode patterns after all the plurality of extraction electrode patterns are printed, and filling the via holes with a conductive material.

[0061] In the conventional case, in order to minimize the proportion of the external electrodes in the entire multilayer ceramic capacitor and minimize the area where the external electrodes are exposed to the outside of the multilayer ceramic capacitor, a separate lead-out electrode is formed on the cross-section of the main body where one end of the internal electrode is exposed, and the lead-out electrode is covered with a ceramic layer so that the lead-out electrode is exposed only on one side in the thickness direction. There has been an attempt to introduce such a structure. When having such a structure, the proportion of the external electrodes in the multilayer ceramic capacitor can be minimized and the moisture resistance reliability can be improved. However, it is difficult to sufficiently ensure the electrical connectivity between the internal electrode and the lead-out electrode and the electrical connectivity between the lead-out electrode and the external electrode. As a result, there may arise a problem that the ESR of the multilayer ceramic capacitor decreases.

[0062] According to an embodiment of the present invention, since a plurality of lead-out electrodes are formed at intervals in the second direction, the contact area between the external electrodes 131 and 132 and the plurality of lead-out electrodes 141a and 142a can be increased. Thereby, the ESR of the multilayer electronic component 100 can be reduced.

[0063] According to an embodiment of the present invention, since the plurality of lead-out electrodes 141a and 142a are connected via the plurality of via electrodes 141b and 142b, the connectivity between the plurality of lead-out electrodes 141a and 142a is ensured, and the total area of the plurality of lead-out electrodes 141a and 142a can be increased. Thereby, the ESR of the multilayer electronic component 100 can be reduced.

[0064] That is, according to an embodiment of the present invention, when the extension portions 141 and 142 include the plurality of lead-out electrodes 141a and 142a arranged at intervals in the second direction and the plurality of via electrodes 141b and 142b connecting the plurality of lead-out electrodes 141a and 142a, the contact area between the external electrodes 131 and 132 and the plurality of lead-out electrodes 141a and 142a increases, the connectivity between the plurality of lead-out electrodes 141a and 142a is ensured, and the total area of the plurality of lead-out electrodes 141a and 142a increases, whereby the ESR reduction effect of the multilayer electronic component 100 can become remarkable.

[0065] In one embodiment, the plurality of extraction electrodes 141a and 142a can be in contact with the external electrodes 131 and 132 on one surface of the extension parts 141 and 142 in the first direction. Thereby, the proportion occupied by the external electrodes 131 and 132 in the entire multilayer electronic component 100 can be minimized. At this time, the external electrodes 131 and 132 can be arranged only on one surface of the extension parts 141 and 142 in the first direction, and cannot be arranged on both surfaces in the second direction and both surfaces in the third direction of the extension parts 141 and 142.

[0066] In one embodiment, one end of the plurality of extraction electrodes 141a and 142a in the first direction is exposed on one surface of the extension parts 141 and 142 in the first direction, and the other end of the plurality of extraction electrodes 141a and 142a in the first direction can be not exposed on the other surface of the extension parts 141 and 142 in the first direction. Thereby, the thickness of the multilayer electronic component 100 in the first direction can be minimized. On the other hand, when the other end of the plurality of extraction electrodes 141a and 142a in the first direction is not exposed on the other surface of the extension parts 141 and 142 in the first direction, the plurality of extraction electrodes 141a and 142a can cover only a part of each of one surface and the other surface of the main body 110 in the second direction. At this time, the plurality of extraction electrodes 141a and 142a are preferably arranged to cover the ends of the internal electrodes in the second direction, and the portions not covered by the plurality of extraction electrodes 141a and 142a can be covered by the insulating parts 141c and 142c.

[0067] In one embodiment, the plurality of via electrodes 141b and 142b are arranged between a pair of adjacent extraction electrodes among the plurality of extraction electrodes 141a and 142a, and the diameters of the plurality of via electrodes 141b and 142b can have a maximum value on the surface in contact with the extraction electrode arranged closer to the main body 110 among a pair of adjacent extraction electrodes with which the plurality of via electrodes 141b and 142b are adjacent to each other.

[0068] Referring to FIG. 6, the plurality of via electrodes 141b and 142b can be disposed between a pair of adjacent extraction electrodes among the plurality of extraction electrodes 141a and 142a. Specifically, the plurality of via electrodes 141b-1 can be disposed between a pair of adjacent extraction electrodes 141a-1 and 141a-2, and the plurality of via electrodes 141b-2 can be disposed between a pair of adjacent extraction electrodes 141a-2 and 141a-3. At this time, the diameters of the plurality of via electrodes 141b and 142b can have a maximum value on the surface that contacts the extraction electrode that is disposed closer to the main body 110 among the pair of adjacent extraction electrodes. For example, the diameter of the plurality of via electrodes 141b-1 can be larger on the surface where the plurality of via electrodes 141b-1 contact the extraction electrode 141a-1 than on the surface where the plurality of via electrodes 141b-1 contact the extraction electrode 141a-2, and the diameter of the plurality of via electrodes 141b-1 can have a maximum value on the surface where the plurality of via electrodes 141b-1 contact the extraction electrode 141a-1.

[0069] In one embodiment, in the cross-sections of the stacked electronic component 100 in the first direction and the second direction, the plurality of via electrodes 141b and 142b can be trapezoidal in shape. At this time, the two lower sides of the trapezoid can be formed at the boundaries between the plurality of via electrodes 141b and 142b and the extraction electrodes 141a and 142a.

[0070] On the other hand, referring to FIG. 6, the plurality of extraction electrodes 141a can include a first extraction electrode 141a01 that contacts the internal electrode 121, a second extraction electrode 141a-2 that is spaced apart from the first extraction electrode 141a-1 in the second direction, and a third extraction electrode 141a-3 that is spaced apart from the second extraction electrode 141a-2 in the second direction.

[0071] In FIG. 6, the case where the plurality of extraction electrodes 141a of the present invention are three layers is shown, but the number of extraction electrodes 141a in the present invention is not limited to three.

[0072] At this time, the plurality of via electrodes 141b can include a first via electrode 141b-1 that connects the first extraction electrode 141a-1 and the second extraction electrode 141a-2, and a second via electrode 141b-2 that connects the second extraction electrode 141a-2 and the third extraction electrode 141a-3.

[0073] In one embodiment, at least a part of the first via electrode 141b-1 and at least a part of the second via electrode 141b-2 can overlap in the second direction. Thereby, the connectivity between the plurality of extraction electrodes 141a and 142a can be improved.

[0074] In one embodiment, the plurality of extraction electrodes 141a and 142a can be arranged so as to extend beyond both ends of the internal electrodes 121 and 122 in the first direction. Specifically, the plurality of extraction electrodes 141a and 142a can be arranged so as to extend beyond the end portions of the internal electrodes exposed in the second direction and located outermost in the first direction. Thereby, a sufficient contact area can be ensured between the plurality of extraction electrodes 141a and 142a and the internal electrodes 121 and 122.

[0075] Referring to FIG. 6, the maximum length in the second direction of the extension portions 141 and 142 is denoted as LM, the maximum length in the second direction of the plurality of extraction electrodes 141a and 142a is denoted as LC, the maximum thickness in the first direction of the extension portions 141 and 142 is denoted as TM, and the maximum thickness in the first direction of the plurality of extraction electrodes 141a and 142a is denoted as TC.

[0076] At this time, in one embodiment, LM and LC can satisfy 0.01 < LC / LM < 0.9.

[0077] When LC / LM is less than 0.01, there may be problems such as a decrease in the connectivity between the internal electrodes 121 and 122 and the plurality of extraction electrodes 141a and 142a, or an increase in the ESR of the multilayer electronic component 100. When LC / LM exceeds 0.9, there may be a problem that the multilayer electronic component 100 becomes vulnerable to external impacts.

[0078] Therefore, in one embodiment, by making LM and LC satisfy 0.01 < LC / LM < 0.9, the problems of an increase in the ESR of the multilayer electronic component 100 and vulnerability to external impacts can be alleviated.

[0079] Also, in one embodiment, TM and TC can satisfy 0.85 < TC / TM < 0.95.

[0080] The lower limit value of TC / TM does not particularly need to be restricted, but when it exceeds 0.85, it can be more advantageous for realizing the capacitance. When TC / TM exceeds 0.95, the moisture penetration path from the outside may be shortened, and the moisture resistance reliability of the multilayer electronic component 100 may decrease.

[0081] Therefore, in one embodiment, by making TM and TC satisfy 0.85 < TC / TM < 0.95, while realizing a sufficient capacitance of the multilayer electronic component 100, a decrease in the moisture resistance reliability can be prevented.

[0082] The maximum length in the second direction of the extension portions 141 and 142 is LM, the maximum length in the second direction of the plurality of lead electrodes 141a and 142a is LC, the maximum thickness in the first direction of the extension portions 141 and 142 is TM, and the maximum thickness in the first direction of the plurality of lead electrodes 141a and 142a is TC, which can be measured in the cross sections in the first and second directions polished up to the central portion in the third direction of the multilayer electronic component 100. LM is the maximum length in the second direction from one end to the other end in the second direction of the extension portions 141 and 142, LC is the maximum length in the second direction from one end to the other end in the second direction of the plurality of lead electrodes 141a and 142a, TM is the maximum thickness in the first direction from one end to the other end in the first direction of the extension portions 141 and 142, and TC can be measured as the maximum thickness in the first direction from one end to the other end in the first direction of the plurality of lead electrodes 141a and 142a.

[0083] The external electrodes 131 and 132 can be disposed on the extension portions 141 and 142, and the external electrodes 131 and 142 can be in contact with one end in the first direction of the plurality of lead electrodes 141a and 142a.

[0084] The external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity, such as metal. Specific materials can be determined considering electrical properties, structural stability, etc., and they can further have a multilayer structure.

[0085] For example, the external electrodes 131 and 132 can include an electrode layer disposed on the extension portions 141 and 142 and a plating layer formed on the electrode layer.

[0086] Also, the external electrodes 131 and 132 can be formed by methods such as attaching a sheet containing a conductive metal onto the main body 110, printing a paste containing a conductive metal, etc., but are not limited thereto.

[0087] Materials with excellent electrical conductivity can be used as the conductive metal contained in the external electrodes 131 and 132, but are not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), palladium (Pd), and their alloys.

[0088] The size of the multilayer electronic component 100 is not particularly limited. For example, the multilayer electronic component 100 can have a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less in order to simultaneously achieve miniaturization and high capacitance. In the case of products where reliability in a high-temperature and high-pressure environment is important, it can have a size of 3216 (length × width, 3.2 mm × 1.6 mm) or more, but is not limited thereto.

[0089] On the one hand, when the maximum thickness of the multilayer electronic component 100 in the first direction is 120 μm or less, since the areas of the internal electrodes 121 and 122, the lead-out electrodes 141a and 142a, and the external electrodes 131 and 132 decrease, it is difficult to ensure the ESR characteristics. However, in one embodiment of the present invention, an extension portion is arranged on the main body 110, and the extension portion includes a plurality of lead-out electrodes arranged at intervals in the second direction, a plurality of via electrodes connecting the plurality of lead-out electrodes, and an insulating portion covering the plurality of lead-out electrodes, so as to improve the ESR characteristics. Therefore, even when the maximum thickness of the multilayer electronic component 100 in the first direction is 120 μm or less, a decrease in the ESR characteristics can be prevented.

[0090] FIG. 7 schematically shows a cross-sectional view corresponding to FIG. 2 of a multilayer electronic component according to an embodiment, and FIG. 8 is an enlarged view of the P' region in FIG. 7.

[0091] Referring to FIGS. 7 and 8, a multilayer electronic component 100' according to an embodiment includes extension portions 141' and 142' arranged on the main body 110 and external electrodes 131 and 132 arranged on the extension portions 141' and 142'. The extension portions 141' and 142' include a plurality of lead-out electrodes 141a and 142a arranged at intervals in the second direction, a plurality of via electrodes 141b' and 142b' connecting the plurality of lead-out electrodes 141a and 142a, and insulating portions 141c and 142c covering the plurality of lead-out electrodes 141a and 142a. The plurality of via electrodes 141b' and 142b' can be continuously arranged along the second direction. Thereby, the connectivity between the plurality of lead-out electrodes 141a and 142a can be further improved.

[0092] When a plurality of via electrodes 141b' and 142b' are continuously arranged in the second direction as in an embodiment, the plurality of via electrodes 141b' and 142b' can be arranged to penetrate through the lead electrodes arranged between the lead electrodes arranged at both ends in the second direction among the plurality of lead electrodes 141a and 142a. Referring to FIG. 8, the plurality of via electrodes 141b' can be arranged to penetrate through the lead electrode 141a-2 arranged between the lead electrodes 141a-3 and 141a-1 arranged at both ends in the second direction among the plurality of lead electrodes 141a.

[0093] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field within the scope not departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0094] In addition, the expression "an embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-described one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0095] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Explanation of Reference Numerals

[0096] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover parts 114, 115 Margin parts 121, 122 Internal electrodes 131, 132 External electrodes 141, 142, 141', 142' Extension parts 141a, 142a Multiple extraction electrodes 141b, 142b Multiple via electrodes 141c, 142c Insulating parts

Claims

1. A main body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, an extension portion disposed on the main body, and an external electrode disposed on the extension portion, wherein the extension portion includes a plurality of extraction electrodes spaced apart in a second direction perpendicular to the first direction, a plurality of via electrodes connecting the plurality of extraction electrodes, and an insulating portion covering the plurality of extraction electrodes, which is a multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the plurality of extraction electrodes are in contact with the external electrode on one surface of the extension portion in the first direction.

3. The multilayer electronic component according to claim 1, wherein one end of the plurality of extraction electrodes in the first direction is exposed on one surface of the extension portion in the first direction, and the other end of the plurality of extraction electrodes in the first direction is not exposed on the other surface of the extension portion in the first direction.

4. The multilayer electronic component according to claim 1, wherein the plurality of via electrodes are disposed between a pair of adjacent extraction electrodes among the plurality of extraction electrodes, and the diameter of the plurality of via electrodes has a maximum value on a surface in contact with the extraction electrode disposed closer to the main body among the pair of extraction electrodes adjacent to each other among the plurality of via electrodes.

5. The multilayer electronic component according to claim 1, wherein the plurality of via electrodes are continuously arranged along the second direction.

6. The multilayer electronic component according to claim 1, wherein the plurality of extraction electrodes include a first extraction electrode in contact with the internal electrode, a second extraction electrode spaced apart from the first extraction electrode in the second direction, and a third extraction electrode spaced apart from the second extraction electrode in the second direction.

7. The multilayer electronic component according to claim 6, wherein the plurality of via electrodes include a first via electrode connecting the first extraction electrode and the second extraction electrode, and a second via electrode connecting the second extraction electrode and the third extraction electrode.

8. The multilayer electronic component according to claim 7, wherein at least a part of the first via electrode is disposed at a position overlapping at least a part of the second via electrode in the second direction.

9. In a cross section of the multilayer electronic component in the first direction and the second direction, the plurality of via electrodes are trapezoidal in shape, which is the multilayer electronic component according to claim 1.

10. The laminated electronic component according to claim 1, wherein the plurality of lead-out electrodes are arranged so as to extend beyond both ends of the internal electrode in the first direction.

11. When the maximum length of the extension portion in the second direction is LM, and the maximum length of the plurality of lead-out electrodes in the second direction is LC, the laminated electronic component according to claim 1, wherein LM and LC satisfy 0.01 < LC / LM < 0.

9.

12. When the maximum thickness of the extension portion in the first direction is TM, and the maximum thickness of the plurality of lead-out electrodes in the first direction is TC, the laminated electronic component according to claim 1, wherein TM and TC satisfy 0.85 < TC / TM < 0.

95.

13. The maximum thickness of the laminated electronic component in the first direction is 120 μm or less, the laminated electronic component according to claim 1.

14. The laminated electronic component according to claim 1, wherein the external electrode is arranged only on one surface of the extension portion in the first direction.

15. The laminated electronic component according to claim 1, wherein the extension portion is arranged on one surface and the other surface of the main body facing each other in the second direction, and the plurality of lead-out electrodes are in contact with the internal electrode on one surface and the other surface of the main body facing each other in the second direction.

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