Laminated type electronic component

Abstract

To provide a laminated type electronic component which is excellent in mechanical strength and electric characteristics.SOLUTION: A laminated electronic component 100a includes a body 110 which includes a dielectric layer 111 and first and second internal electrodes 121 and 122 that are alternately arranged in a first direction, and is partitioned into first to fourth parts P1 to P4, first and second external electrodes 131 and 132 which are arranged on each of the first and second parts P1 and P2, and are connected to the first internal electrode; third and fourth external electrodes 133 and 134 which are arranged on each of third and fourth parts P3 and P4, and are connected to the second external electrode, and connection electrodes 141 to 144 which are arranged on at least one of the first to fourth parts and penetrate into the dielectric layer 111, and connect the two first internal electrodes adjacent to each other in the first direction or connect the two second internal electrodes adjacent to each other in the first direction, wherein in the connection electrodes, a plurality of via electrodes arranged so as to be shifted from each other in a direction vertical to the first direction is laminated in the first direction.SELECTED DRAWING: Figure 4a

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-type capacitor that is mounted on a printed circuit board of various electronic products such as video equipment such as a liquid crystal display (LCD) and a plasma display panel (PDP), a computer, a smartphone, and a mobile phone, and serves to charge or discharge electricity. The MLCC is small in size but has a high capacitance, and is used as a component of various electronic devices due to its advantage of easy mounting.

[0003] The MLCC generally includes a main body including a plurality of internal electrodes alternately arranged with dielectric layers, and external electrodes arranged outside the main body and connected to the plurality of internal electrodes.

[0004] On the other hand, in the firing process for manufacturing the MLCC, the internal electrodes may shrink, cracks may occur in the main body, and the connection between the internal electrodes and the external electrodes may be broken. Due to such a phenomenon, there is a problem that the capacitance of the MLCC decreases.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of several objects of the present invention is to provide a multilayer electronic component excellent in mechanical strength and electrical characteristics.

[0006] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0007] A dielectric layer and first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a main body divided into first to fourth portions, first and second external electrodes respectively disposed on the first and second portions and connected to the first internal electrode, third and fourth external electrodes respectively disposed on the third and fourth portions and connected to the second internal electrode, and a connection electrode disposed in at least one of the first to fourth portions to penetrate the dielectric layer and connect two adjacent first internal electrodes in the first direction or connect two adjacent second internal electrodes in the first direction, wherein the first to fourth portions divide the main body into two equal parts in the second and third directions respectively, the first portion includes a corner where the third surface and the fifth surface are in contact, the second portion includes a corner where the fourth surface and the sixth surface are in contact, the third portion includes a corner where the fourth surface and the fifth surface are in contact, the fourth portion includes a corner where the third surface and the sixth surface are in contact, and the connection electrode provides a stacked electronic component in which a plurality of via electrodes arranged to be offset from each other in a direction perpendicular to the first direction are stacked in the first direction.

[0008] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. The body is divided into first to fourth portions, and includes a first dielectric layer, a first internal electrode disposed on the first dielectric layer, and a first internal electrode layer including third and fourth auxiliary electrodes disposed on the first dielectric layer, spaced apart from the first internal electrode, and respectively disposed in the third and fourth portions. The body also includes a second dielectric layer, a second internal electrode disposed on the second dielectric layer, and a second internal electrode layer including first and second auxiliary electrodes disposed on the second dielectric layer, spaced apart from the second internal electrode, and respectively disposed in the first and second portions. The first and second internal electrode layers are alternately arranged in the first direction. The body further includes first and second external electrodes respectively disposed on the first and second portions and connected to the first internal electrode, third and fourth external electrodes respectively disposed on the third and fourth portions and connected to the second internal electrode, a first via electrode disposed in the first portion and penetrating the first dielectric layer to connect the first internal electrode and the first auxiliary electrode, and a second via electrode disposed in the first portion and penetrating the second dielectric layer to connect the first internal electrode and the first auxiliary electrode. The first to fourth portions divide the body into two equal parts in the second and third directions respectively. The first portion includes a corner where the third surface and the fifth surface are in contact, the second portion includes a corner where the fourth surface and the sixth surface are in contact, the third portion includes a corner where the fourth surface and the fifth surface are in contact, and the fourth portion includes a corner where the third surface and the sixth surface are in contact. The first via electrode and the second via electrode are arranged to be offset from each other in a direction perpendicular to the first direction, providing a multilayer electronic component.

Advantages of the Invention

[0009] As one of various advantages of the present invention, a multilayer electronic component excellent in mechanical strength and electrical characteristics can be provided.

Brief Description of the Drawings

[0010]

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Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of the elements in the drawings can be exaggerated for a clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0012] And in the drawings, parts not related to the explanation are omitted for the purpose of clearly explaining the present invention, and the size and thickness of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. Note that components having the same function within the scope of the same idea are described using the same reference numerals. Further, throughout the specification, when a certain part says that a certain component "includes", this means that other components can be further included, rather than excluding other components, unless otherwise stated.

[0013] In the drawings, the first direction can be defined as the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0014] (First Embodiment) FIG. 1 is a perspective view schematically showing a multilayer electronic component according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut cross-section along line I1-I1' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut cross-section along line II1-II1' of FIG. 1, FIG. 4a is a cross-sectional view schematically showing a cut cross-section along line III1-III1' of FIG. 2, FIG. 4b is a cross-sectional view schematically showing a cut cross-section along line IV1-IV1' of FIG. 2, and FIG. 5 is a partially enlarged view schematically showing region A of FIG. 2.

[0015] Hereinafter, with reference to FIGS. 1 to 5, the multilayer electronic component 100a according to the first embodiment of the present invention will be described in detail. Further, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto, and it can also be applied to various multilayer electronic components, for example, inductors, piezoelectric elements, varistors, or thermistors.

[0016] The size of the multilayer electronic component 100a is not particularly limited. However, when the maximum dimensions of the multilayer electronic component 100a in the first to third directions are T, L, and W, respectively, the above L may be, for example, 0.5 mm to 1.7 mm, the above W may be, for example, 0.5 mm to 1.7 mm, and the above T may be, for example, 0.05 mm to 3.5 mm. In one embodiment, the ratio of T to L (T / L) and the ratio of T to W (T / W) can each satisfy 0.6 or less. The lower limits of the above T / L and T / W are not particularly limited, but may be, for example, 0.05 or more each. The multilayer electronic component 100a can have, for example, a 0606 size (L = about 0.6 mm, W = about 0.6 mm, T = 0.3 mm).

[0017] The multilayer electronic component 100a according to the first embodiment of the present invention can include a main body 110, external electrodes 131, 132, 133, 134, and connection electrodes 141, 142, 143, 144.

[0018] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. During the firing process, the main body 110 shrinks, or through a polishing process on the corners of the main body 110, the main body 110 may not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0019] The main body 110 can have a first surface and a second surface 1, 2 that face each other in a first direction, a third surface and a fourth surface 3, 4 that are connected to the first surface and the second surface 1, 2 and face each other in a second direction, and a fifth surface and a sixth surface 5, 6 that are connected to the first to fourth surfaces 1, 2, 3, 4 and face each other in a third direction.

[0020] The main body 110 can be divided into first to fourth portions P1, P2, P3, P4. The first to fourth portions P1, P2, P3, P4 can divide the main body 110 into two equal parts in the second and third directions respectively. For example, referring to FIGS. 4a and 4b, the first portion P1 includes a corner E1 where the third surface and the fifth surface are in contact, the second portion P2 includes a corner E2 where the fourth surface and the sixth surface are in contact, the third portion P3 includes a corner E3 where the fourth surface and the fifth surface are in contact, and the fourth portion P4 can include a corner E4 where the third surface and the sixth surface are in contact. Hereinafter, the corner E1 where the third surface and the fifth surface are in contact is defined as the first corner, the corner E2 where the fourth surface and the sixth surface are in contact is defined as the second corner, the corner E3 where the fourth surface and the fifth surface are in contact is defined as the third corner, and the corner E4 where the third surface and the sixth surface are in contact is defined as the fourth corner.

[0021] The main body 110 can include a dielectric layer 111 and internal electrodes 121, 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0022] The dielectric layer 111 can include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x ≤ 0.5, 0 < y ≤ 0.5) may also be used.

[0023] The main body 110 may include first and second internal electrodes 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, may be arranged to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0024] The metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably may contain Ni, but the present invention is not limited thereto.

[0025] Referring to FIG. 4a, the first internal electrode 121 includes a first main portion 123 that overlaps the second internal electrode 122 in the first direction, a first lead portion 125 that extends from the first main portion 123 and does not overlap the second internal electrode 122 and is exposed on at least one of the third and fifth surfaces 3 and 5, and a second lead portion 127 that extends from the first main portion 123 and does not overlap the second internal electrode 122 and is exposed on at least one of the fourth and sixth surfaces 4 and 6.

[0026] The first main part 123 can have, for example, a flat plate shape perpendicular to the first direction. The first main part 123 may be arranged in the first to fourth parts P1, P2, P3, P4. The first main part 123 can have a rectangular shape, but the present invention is not limited thereto, and the edge of the first main part 123 may be inclined with respect to the second or third direction or may be curved.

[0027] The first and second lead parts 125, 127 can be exposed on the outer surfaces of the first and second parts P1, P2, respectively. Although not shown, the edges of the first and second lead parts 125, 127 connected to the first main part 123 may extend in a direction inclined with respect to the second or third direction from the first main part 123 toward the outer surface of the main body 110.

[0028] Referring to FIG. 4b, the second internal electrode 122 includes a second main part 124 that overlaps the first internal electrode 121 in the first direction, a third lead part 126 that extends from the second main part 124 and does not overlap the first internal electrode 121 and is exposed on at least one of the fourth and fifth surfaces 4 and 5, and a fourth lead part 128 that extends from the second main part 124 and does not overlap the first internal electrode 121 and is exposed on at least one of the third and sixth surfaces 3 and 6.

[0029] The second main part 124 can have, for example, a flat plate shape perpendicular to the first direction. The second main part 124 may be arranged in the first to fourth parts P1, P2, P3, P4. The second main part 124 can have a rectangular shape, but the present invention is not limited thereto, and the edge of the second main part 124 may be inclined with respect to the second or third direction or may be curved.

[0030] The third and fourth lead parts 126, 128 can be exposed on the outer surfaces of the third and fourth parts P3, P4, respectively. Although not shown, the edges of the third and fourth lead parts 126, 128 connected to the second main part 124 may extend in a direction inclined with respect to the second or third direction from the second main part 124 toward the outer surface of the main body 110.

[0031] The average thicknesses of the dielectric layer 111 and the internal electrodes 121 and 122 are not particularly limited. The average thickness of the dielectric layer 111 may be, for example, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm. The average thicknesses of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0032] The average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 respectively mean the average dimensions of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, after measuring the thicknesses at a number of points on one dielectric layer 111, for example, 30 points equally spaced in the second direction, the average thickness of the dielectric layer 111 can be measured by taking the average value. Also, after measuring the thicknesses at a number of points on one internal electrode 121 or 122, for example, 30 points equally spaced in the second direction, the average thickness of the internal electrode 121 or 122 can be measured by taking the average value. The 30 equally spaced points can be specified in the capacitance forming portion Ac. On the other hand, after performing such measurement of the average value for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 can be further generalized.

[0033] The main body 110 includes a capacitance forming portion Ac which is disposed inside the main body 110 and in which first and second internal electrodes 121 and 122 are alternately arranged in a first direction with a dielectric layer 111 interposed therebetween to form a capacitance, and cover portions 112 and 113 which are disposed on both surfaces facing the first direction of the capacitance forming portion Ac. The capacitance forming portion Ac can be defined as a region in which first and second main portions 123 and 124 are arranged so as to face each other with the dielectric layer 111 interposed therebetween. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111, except that they do not include internal electrodes.

[0034] The average thickness of the cover portions 112 and 113 is not particularly limited. The average thickness of the cover portions 112 and 113 may be, for example, 40 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112 and 113 may be, for example, 5 μm or more, or 10 μm or more. Here, the average thickness of the cover portions 112 and 113 means the average thickness of each of the first cover portion 112 and the second cover portion 113.

[0035] The average thickness of the cover portions 112 and 113 can mean the average dimension of the cover portions 112 and 113 in the first direction, and can be a value obtained by averaging the dimensions of the cover portions 112 and 113 in the first direction measured at five points equally spaced in the second direction in the cross section in the first and second directions obtained by cutting at the center in the third direction of the main body 110.

[0036] The first and second external electrodes 131 and 132 can be respectively disposed on the first and second portions P1 and P2 and connected to the first internal electrode 121. The first external electrode 131 can be disposed on at least one of the third surface and the fifth surface 3 and 5 and connected to the first lead portion 125. The second external electrode 132 can be disposed on at least one of the fourth surface and the sixth surface 4 and 6 and connected to the second lead portion 127.

[0037] The third and fourth external electrodes 133 and 134 can be respectively disposed on the third and fourth portions P3 and P4 and connected to the second internal electrode 122. The third external electrode 133 can be disposed on at least one of the fourth and fifth surfaces 4 and 5 and connected to the third lead portion 126. The fourth external electrode 134 can be disposed on at least one of the third and sixth surfaces 3 and 6 and connected to the fourth lead portion 128.

[0038] For example, the first external electrode 131 can be disposed on the third and fifth surfaces 3 and 5 and extend onto a part of the first and second surfaces 1 and 2. The second external electrode 132 can be disposed on the fourth and sixth surfaces 4 and 6 and extend onto a part of the first and second surfaces 1 and 2. The third external electrode 133 can be disposed on the fourth and fifth surfaces 4 and 5 and extend onto a part of the first and second surfaces 1 and 2. The fourth external electrode 134 can be disposed on the third and sixth surfaces 3 and 6 and extend onto a part of the first and second surfaces 1 and 2. However, the present invention is not limited thereto. When introducing the contact electrodes described later, the external electrodes 131, 132, 133, and 134 may be disposed only on the first and / or second surfaces 1 and 2.

[0039] The types of the external electrodes 131, 132, 133, and 134 are not particularly limited and may have a multilayer structure. The external electrodes 131, 132, 133, and 134 can include, for example, an underlying electrode layer in contact with the internal electrodes 121 and 122 and a plating layer disposed on the underlying electrode layer. The underlying electrode layer can include, for example, one or more of a fired electrode layer, a conductive resin layer, and a thin film electrode layer.

[0040] The fired electrode layer can include metal and glass. The metal included in the fired electrode layer can include one or more of Cu, Ni, Pd, Pt, Au, Ag, Pb, and their alloys, but the present invention is not limited thereto. The glass included in the underlying electrode layer can include oxides of one or more of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0041] The above conductive resin layer can contain metal particles and a resin. The metal particles contained in the above conductive resin layer can contain one or more of spherical particles and flake-like particles. Here, the spherical particles can also include forms that are not completely spherical. For example, they can include forms where the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake-like particles mean particles having a flat and elongated shape. For example, the length ratio of the major axis to the minor axis (major axis / minor axis) can be 1.95 or more. The metal particles contained in the above conductive resin layer can contain, for example, one or more of Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and their alloys. The resin contained in the above conductive resin layer can contain, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose.

[0042] The above conductive resin layer can also be made of a conductive polymer. The above conductive polymer can contain, for example, one or more of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS.

[0043] The above thin film electrode layer can be formed, for example, using an electrolytic plating method, electroless plating method, atomic layer deposition (ALD) method, chemical vapor deposition (CVD) method, and / or sputtering method.

[0044] The above base electrode layer can be, for example, the above fired electrode layer, or can be in a form where the above fired electrode layer and the conductive resin layer are sequentially laminated, or can be in a form where the above thin film electrode layer and the fired electrode layer are sequentially laminated.

[0045] The above plating layer can contain, for example, Ni, Sn, Pd, and / or their alloys, and can also be formed of multiple layers. The above plating layer can be, for example, a Ni plating layer or a Sn plating layer, or can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed. Also, the above plating layer can contain multiple Ni plating layers and / or multiple Sn plating layers.

[0046] In the drawings, the structure of the multilayer electronic component 100a having four external electrodes 131, 132, 133, and 134 is described. However, the present invention is not limited thereto, and the number, shape, etc. of the external electrodes 131, 132, 133, and 134 can be changed according to the form of the internal electrodes 121, 122 and other purposes.

[0047] The multilayer electronic component 100a can include connection electrodes 141, 142, 143, and 144 that are disposed in at least one of the first to fourth portions P1, P2, P3, and P4, penetrate the dielectric layer 111, and connect two adjacent first internal electrodes 121 in the first direction to each other, or connect two adjacent second internal electrodes 122 in the first direction to each other.

[0048] For example, the first connection electrode 141 can be disposed in the first portion P1, penetrate the dielectric layer 111, and connect two adjacent first internal electrodes 121 in the first direction to each other, and the second connection electrode 142 can be disposed in the second portion P2, penetrate the dielectric layer 111, and connect two adjacent first internal electrodes 121 in the first direction to each other.

[0049] The first connection electrode 141 can penetrate a region adjacent to the first corner E1 of the main body 110 and connect adjacent ones among the plurality of first lead portions 125 to each other. The first connection electrode 141 can penetrate a region (hereinafter referred to as a first margin region) where the third surface and the fifth surface 3, 5 and the second internal electrode 122 are separated between two adjacent first lead portions 125 in the first direction.

[0050] The second connection electrode 142 can penetrate a region adjacent to the second corner E2 of the main body 110 and connect adjacent ones among the plurality of second lead portions 127 to each other. The second connection electrode 142 can penetrate a region (hereinafter referred to as a second margin region) where the fourth surface and the sixth surface 4, 6 and the second internal electrode 122 are separated between two adjacent second lead portions 127 in the first direction.

[0051] For example, the third connecting electrode 143 is disposed in the third portion P3, penetrates the dielectric layer 111, and connects two adjacent second internal electrodes 122 in the first direction to each other. The fourth connecting electrode 144 can be disposed in the fourth portion P4, penetrate the dielectric layer 111, and connect two adjacent second internal electrodes 122 in the first direction to each other.

[0052] The third connecting electrode 143 can penetrate a region adjacent to the third corner E3 of the main body 110 and connect adjacent ones of the plurality of third lead portions 126 to each other. The third connecting electrode 143 can penetrate a region where the fourth and fifth surfaces 4 and 5 and the first internal electrode 121 are separated (hereinafter referred to as the third margin region) between two adjacent third lead portions 126 in the first direction.

[0053] The fourth connecting electrode 144 can penetrate a region adjacent to the fourth corner E4 of the main body 110 and connect adjacent ones of the plurality of fourth lead portions 128 to each other. The fourth connecting electrode 144 can penetrate a region where the third and sixth surfaces 3 and 6 and the first internal electrode 121 are separated (hereinafter referred to as the fourth margin region) between two adjacent fourth lead portions 128 in the first direction.

[0054] In the conventional case, there has been a problem that the connection between the internal electrode and the external electrode is broken due to shrinkage of the internal electrode in the firing process or cracks generated in the main body. As the number of internal electrodes whose connection to the external electrode is broken increases among the plurality of internal electrodes, the capacitance of the multilayer electronic component may decrease.

[0055] On the other hand, according to the first embodiment of the present invention, even if some of the internal electrodes 121 and 122 shrink due to the firing process and the contact with the external electrodes 131, 132, 133, and 134 is broken, the internal electrodes can be electrically connected to the external electrodes 131, 132, 133, and 134 via the connecting electrodes 141, 142, 143, and 144 and the internal electrodes 121 and 122 of other layers. Thereby, it is possible to prevent the capacitance of the multilayer electronic component 100a from decreasing.

[0056] Further, the connection electrodes 141, 142, 143, and 144 are disposed in the margin region, and can suppress the phenomenon that the margin region sinks due to a step difference caused by a difference in the number of stacked internal electrodes 121 and 122 between the margin region and the capacitance forming portion Ac or an external stress.

[0057] According to the first embodiment of the present invention, at least one of the first to fourth connection electrodes 141, 142, 143, and 144 can have a form in which a plurality of via electrodes arranged to be displaced from each other in a direction perpendicular to the first direction are stacked in the first direction. For example, the first connection electrode 141 can have a form in which a plurality of first via electrodes 141a and 141b are stacked in the first direction, the second connection electrode 142 can have a form in which a plurality of second via electrodes 142a and 142b are stacked in the first direction, the third connection electrode 143 can have a form in which a plurality of third via electrodes 143a and 143b are stacked in the first direction, and the fourth connection electrode 144 can have a form in which a plurality of fourth via electrodes (not shown) are stacked in the first direction.

[0058] Referring to FIG. 5, the fact that the plurality of via electrodes 141a and 141b are arranged to be displaced from each other in a direction perpendicular to the first direction means that in a cross section of the main body 110 in the first direction and the second direction, a virtual line L11a connecting the upper and lower half points of one via electrode 141a and a virtual line L11b connecting the upper and lower half points of another via electrode 141b adjacent in the first direction do not coincide with each other. For example, the virtual line L11a connecting the upper and lower half points of the first via electrode 141a and the virtual line L11b connecting the upper and lower half points of another adjacent first via electrode 141b can be in a range greater than 0 and less than or equal to 50% of the width of the upper surface of the first via electrode 141b.

[0059] The connecting electrodes 141, 142, 143, and 144 can be formed, for example, in the process of laminating two dielectric sheets in which vias are formed. At this time, the vias formed in each dielectric sheet may not be perfectly aligned with each other. As a result, the two via electrodes formed by lamination may be arranged so as to be displaced from each other in a direction perpendicular to the first direction. Different from the conventional method of drilling the fired body using a drill or a punching machine to form the connecting electrode, in the first embodiment of the present invention, since the connecting electrodes 141, 142, 143, and 144 can be formed by laminating dielectric sheets in which vias are formed, the problem of cracks occurring in the main body 110 due to drilling can be prevented.

[0060] In one embodiment, a plurality of connecting electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 can be arranged. The plurality of connecting electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 can be arranged in the second and third directions. Here, the plurality of connecting electrodes penetrating the same dielectric layer means each of the plurality of first to fourth connecting electrodes 141, 142, 143, and 144 penetrating the same dielectric layer.

[0061] For example, the plurality of connecting electrodes 141, 142, 143, and 144 arranged at the same level may be arranged in the second and third directions. Here, the plurality of connecting electrodes arranged at the same level means each of the plurality of first to fourth connecting electrodes 141, 142, 143, and 144 arranged at the same level.

[0062] The number of the connecting electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 is not particularly limited and may vary according to the size of the stacked electronic component 100a, the size of the connecting electrodes 141, 142, 143, and 144, etc. For example, the number of the connecting electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 may be 5 or more and 300 or less. Here, the number of the connecting electrodes 141 and 143 means the number of each of the first to fourth connecting electrodes 141, 142, 143, and 144.

[0063] In one embodiment, referring to FIG. 5, the width of the upper surface of via electrodes 141a and 141b may be wider than the width of the lower surface of via electrodes 141a and 141b. The vias formed in the dielectric sheet can be formed, for example, by irradiating the dielectric sheet with a laser. At this time, the amount of energy of the laser light can become lower as it goes from one surface of the dielectric sheet irradiated with the laser to the other surface on the opposite side. As a result, the widths of via electrodes 141a and 141b can gradually become narrower from the upper surfaces of via electrodes 141a and 141b toward the lower surfaces of via electrodes 141a and 141b.

[0064] On the other hand, in the drawings, the cross-sections of via electrodes 141a and 141b are trapezoidal, but the present invention is not limited to this, and by adjusting the irradiation conditions of the laser, the cross-sections of via electrodes 141a and 141b can have various forms, and the side walls of via electrodes 141a and 141b can also have curved surfaces.

[0065] On the other hand, the maximum widths of via electrodes 141a and 141b may vary according to the size of the multilayer electronic component 100a, the thickness of the dielectric layer 111, etc. The maximum widths of via electrodes 141a and 141b are not particularly limited, but may be 0.03 μm to 10 μm.

[0066] FIG. 6 is a perspective view schematically showing a multilayer electronic component according to a first modification of the first embodiment of the present invention, FIG. 7 is a cross-sectional view schematically showing a cut cross-section along line I2-I2' of FIG. 6, FIG. 8 is a cross-sectional view schematically showing a cut cross-section along line II2-II2' of FIG. 6, FIG. 9a is a cross-sectional view schematically showing a cut cross-section along line III2-III2' of FIG. 7, and FIG. 9b is a cross-sectional view schematically showing a cut cross-section along line IV2-IV2' of FIG. 7.

[0067] Hereinafter, with reference to FIGS. 6 to 9b, the multilayer electronic component 100b according to the first modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100a described with reference to FIGS. 1 to 5, and the overlapping description will be omitted.

[0068] The stacked electronic component 100b can be disposed in at least one of the first to fourth portions P1, P2, P3, P4, and can include auxiliary electrodes 151, 152, 153, 154 disposed between those of the plurality of via electrodes that are adjacent to each other in the first direction.

[0069] For example, the first auxiliary electrode 151 can be disposed in the first portion P1 and between two first via electrodes 141a, 141b stacked in the first direction, the second auxiliary electrode 152 can be disposed in the second portion P2 and between two second via electrodes 142a, 142b stacked in the first direction, the third auxiliary electrode 153 can be disposed in the third portion P3 and between two third via electrodes 143a, 143b stacked in the first direction, and the fourth auxiliary electrode 154 can be disposed in the fourth portion P4 and between two fourth via electrodes (not shown) stacked in the first direction.

[0070] The first auxiliary electrode 151 can be exposed on at least one of the third and fifth surfaces 3, 5 and connected to the first external electrode 131, the second auxiliary electrode 152 can be exposed on at least one of the fourth and sixth surfaces 4, 6 and connected to the second external electrode 132, the third auxiliary electrode 153 can be exposed on at least one of the fourth and fifth surfaces 4, 5 and connected to the third external electrode 133, and the fourth auxiliary electrode 154 can be exposed on at least one of the third and sixth surfaces 3, 6 and connected to the fourth external electrode 134. However, the present invention is not limited thereto, and the auxiliary electrodes 151, 152, 153, 154 may be disposed apart from the third to sixth surfaces 3, 4, 5, 6.

[0071] The first and second auxiliary electrodes 151, 152 can be disposed on the first and second corner E1, E2 sides, respectively, and can extend in the second and third directions toward the third and fourth portions P3, P4. The first and second auxiliary electrodes 151, 152 can be disposed only in the first and second portions P1, P2, respectively, but the present invention is not limited thereto.

[0072] The third and fourth auxiliary electrodes 153 and 154 are respectively arranged on the third and fourth corner E3 and E4 sides, and can extend in the second and third directions toward the first and second portions P1 and P2. The third and fourth auxiliary electrodes 153 and 154 can be arranged only in the third and fourth portions P3 and P4 respectively, but the present invention is not limited thereto.

[0073] The first and second auxiliary electrodes 151 and 152 are arranged substantially on the same plane as the second internal electrode 122 and are spaced apart from the second internal electrode 122. The third and fourth auxiliary electrodes 153 and 154 can be arranged substantially on the same plane as the first internal electrode 121 and are spaced apart from the first internal electrode 121.

[0074] The first auxiliary electrode 151 can be connected to a plurality of first connection electrodes 141 passing through the same dielectric layer 111. The second auxiliary electrode 152 can be connected to a plurality of second connection electrodes 142 passing through the same dielectric layer 111. The third auxiliary electrode 153 can be connected to a plurality of third connection electrodes 143 passing through the same dielectric layer 111. The fourth auxiliary electrode 154 can be connected to a plurality of fourth connection electrodes 144 passing through the same dielectric layer 111.

[0075] By arranging the auxiliary electrodes 151, 152, 153, and 154, it is possible to suppress the occurrence of a step due to the difference in the number of stacked layers between the margin region and the capacitance forming portion Ac, and thereby suppress the phenomenon that the margin region sinks. Further, by appropriately arranging the auxiliary electrodes 151, 152, 153, and 154, even if the alignment of the via electrodes constituting the connection electrodes 141, 142, 143, and 144 is excessively distorted, the electrical connection between the adjacent internal electrodes 121 and 122 can be ensured.

[0076] The metal included in the auxiliary electrodes 151, 152, 153, and 154 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. The auxiliary electrodes 151, 152, 153, and 154 can include the same metal as the internal electrodes 121 and 122, but the present invention is not limited thereto.

[0077] The distance in the second direction between the first internal electrode 121 and the third auxiliary electrode 153 may be 10% to 90% of the distance between the first internal electrode 121 and the fourth surface 4, and the distance in the third direction between the first internal electrode 121 and the third auxiliary electrode 153 may be 10% to 90% of the distance between the first internal electrode 121 and the fifth surface 5. This can be similarly applied to the distance between the first internal electrode 121 and the fourth auxiliary electrode 154, and the distances between the second internal electrode 122 and the first and second auxiliary electrodes 151 and 152.

[0078] FIGS. 10a and 10b are cross-sectional views schematically showing a multilayer electronic component according to a second modification of the first embodiment of the present invention, and are views corresponding to FIGS. 9a and 9b.

[0079] Hereinafter, with reference to FIGS. 10a and 10b, a multilayer electronic component 100c according to a second modification of the first embodiment of the present invention will be described. For configurations identical / similar to those of the multilayer electronic components 100a and 100b described with reference to FIGS. 1 to 9b, the same / similar reference numerals are used, and redundant descriptions are omitted.

[0080] Referring to FIG. 10a, the first internal electrode 121c can include a first main portion 123c, a first lead portion 125c extending from the first main portion 123c and exposed to at least one of the third and fifth surfaces 3 and 5, and a second lead portion 127c extending from the first main portion 123c and exposed to at least one of the fourth and sixth surfaces 4 and 6.

[0081] Referring to FIG. 10b, the second internal electrode 122c can include a second main portion 124c, a third lead portion 126c extending from the second main portion 124c and exposed on at least one of the fourth and fifth surfaces 4 and 5, and a fourth lead portion 128c extending from the second main portion 124c and exposed on at least one of the third and sixth surfaces 3 and 6.

[0082] The multilayer electronic component 100c can be disposed in at least one of the first to fourth portions P1, P2, P3, P4 and can include auxiliary electrodes 151c, 152c, 153c, 154c disposed between those of the plurality of via electrodes adjacent to each other in the first direction.

[0083] For example, the first to fourth auxiliary electrodes 151c, 152c, 153c, 154c can be disposed in the first to fourth portions P1, P2, P3, P4 respectively and can be connected to the first to fourth connection electrodes 141, 142, 143, 144 and the first to fourth external electrodes 131, 132, 133, 134. However, the present invention is not limited thereto, and the first to fourth auxiliary electrodes 151c, 152c, 153c, 154c may be disposed separately from the first to fourth external electrodes 131, 132, 133, 134.

[0084] The second internal electrode 122c can include first and second cutout portions 161, 162 disposed in the first and second portions P1, P2 respectively, and the first internal electrode 121c can include third and fourth cutout portions 163, 164 disposed in the third and fourth portions P3, P4 respectively. Here, the cutout portions 161, 162, 163, 164 can be defined as regions within the internal region defined by a virtual line extending the long-side edges of the main portions 123c, 124c where the internal electrodes 121c, 122c are not disposed.

[0085] For example, first and second cuts 161 and 162 may be respectively disposed at both corners of the second internal electrode 122c disposed in the first and second portions P1 and P2, and third and fourth cuts 163 and 164 may be respectively disposed at both corners of the first internal electrode 121c disposed in the third and fourth portions P3 and P4. By the cuts 161, 162, 163, and 164, the first and second main portions 123c and 124c can be provided, for example, in a "+" shape.

[0086] In one embodiment, the first to fourth cuts 161, 162, 163, and 164 can have a shape corresponding to the shape of the auxiliary electrodes 151c, 152c, 153c, and 154c. For example, as shown in FIGS. 10a and 10b, the first to fourth cuts 161, 162, 163, and 164 can have a rectangular shape corresponding to the shape of the auxiliary electrodes 151c, 152c, 153c, and 154c. However, the present invention is not limited thereto, and the auxiliary electrodes 151c, 152c, 153c, and 154c can have various shapes such as an arc shape, and the first to fourth cuts 161, 162, 163, and 164 can also have various shapes corresponding to the shape of the auxiliary electrodes 151c, 152c, 153c, and 154c. A part of the auxiliary electrodes 151c, 152c, 153c, and 154c can be disposed inside the cuts 161, 162, 163, and 164.

[0087] FIGS. 11a and 11b are cross-sectional views schematically showing a multilayer electronic component according to a third modification of the first embodiment of the present invention, and are views corresponding to FIGS. 9a and 9b.

[0088] Hereinafter, with reference to FIGS. 11a and 11b, a multilayer electronic component 100d according to a third modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic components 100a, 100b, and 100c described with reference to FIGS. 1 to 10b, and redundant descriptions are omitted.

[0089] Referring to FIG. 11a, the first internal electrode 121d can include a first main portion 123d, a first lead portion 125d extending from the first main portion 123d and exposed on at least one of the third and fifth surfaces 3 and 5, and a second lead portion 127d extending from the first main portion 123d and exposed on at least one of the fourth and sixth surfaces 4 and 6.

[0090] Referring to FIG. 10b, the second internal electrode 122d can include a second main portion 124d, a third lead portion 126d extending from the second main portion 124d and exposed on at least one of the fourth and fifth surfaces 4 and 5, and a fourth lead portion 128d extending from the second main portion 124d and exposed on at least one of the third and sixth surfaces 3 and 6.

[0091] The multilayer electronic component 100d can include auxiliary electrodes 151d, 152d, 153d, 154d that are disposed in at least one of the first to fourth portions P1, P2, P3, P4 and are disposed between ones of the plurality of via electrodes that are adjacent to each other in the first direction.

[0092] For example, the first to fourth auxiliary electrodes 151d, 152d, 153d, 154d can be respectively disposed in the first to fourth portions P1, P2, P3, P4 and can be connected to the first to fourth connection electrodes 141, 142, 143, 144 and the first to fourth external electrodes 131, 132, 133, 134.

[0093] The first auxiliary electrode 151d can include a first connection portion 151d1 that is exposed on a part of the third surface 3 and a part of the fifth surface 5, a first extension portion 151d2 that extends from the first connection portion 151d1 toward the third portion P3 and has a dimension in the third direction smaller than that of the first connection portion 151d1, and a second extension portion 151d3 that extends from the first connection portion 151d1 toward the fourth portion P4 and has a dimension in the second direction smaller than that of the first connection portion 151d1.

[0094] The second auxiliary electrode 152d can include a second connection portion 152d1 that is exposed on a part of the fourth surface 4 and a part of the sixth surface 6, a third extension portion 152d2 that extends from the second connection portion 152d1 toward the third portion P3 and has a dimension in the second direction smaller than that of the second connection portion 152d1, and a fourth extension portion 152d3 that extends from the second connection portion 152d1 toward the fourth portion P4 and has a dimension in the third direction smaller than that of the second connection portion 152d1.

[0095] The third auxiliary electrode 153d can include a third connection portion 153d1 that is exposed on a part of the fourth surface 4 and a part of the fifth surface 5, a fifth extension portion 153d2 that extends from the third connection portion 153d1 toward the first portion P1 and has a dimension in the third direction smaller than that of the third connection portion 153d1, and a sixth extension portion 153d3 that extends from the third connection portion 153d1 toward the second portion P2 and has a dimension in the second direction smaller than that of the third connection portion 153d1.

[0096] The fourth auxiliary electrode 154d can include a fourth connection portion 154d1 that is exposed on a part of the third surface 3 and a part of the sixth surface 6, a seventh extension portion 154d2 that extends from the fourth connection portion 154d1 toward the first portion P1 and has a dimension in the second direction smaller than that of the fourth connection portion 154d1, and an eighth extension portion 154d3 that extends from the fourth connection portion 154d1 toward the second portion P2 and has a dimension in the third direction smaller than that of the fourth connection portion 154d1.

[0097] By including the first to eighth extension portions 151d2, 151d3, 152d2, 152d3, 153d2, 153d3, 154d2, 154d3, the stacked electronic component 100d can more effectively suppress the phenomenon that the margin region sinks due to external stress or the like.

[0098] FIG. 12 is a perspective view schematically showing a stacked electronic component according to a fourth modification of the first embodiment of the present invention, FIG. 13 is a cross-sectional view schematically showing a cut cross-section along line I3-I3' of FIG. 12, FIG. 14 is a cross-sectional view schematically showing a cut cross-section along line II3-II3' of FIG. 12, FIG. 15a is a cross-sectional view schematically showing a cut cross-section along line III3-III3' of FIG. 13, and FIG. 15b is a cross-sectional view schematically showing a cut cross-section along line IV3-IV3' of FIG. 13.

[0099] Hereinafter, with reference to FIGS. 12 and 15b, a stacked electronic component 100e according to a fourth modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the stacked electronic component 100a described with reference to FIGS. 1 to 5, and redundant descriptions are omitted.

[0100] According to a fourth modification of the first embodiment of the present invention, two adjacent connection electrodes 141e, 142e, 143e, 144e in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction.

[0101] For example, two adjacent first connection electrodes 141e in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction, two adjacent second connection electrodes 142e in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction, two adjacent third connection electrodes 143e in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction, and two adjacent fourth connection electrodes 144e in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction.

[0102] Here, two adjacent first connection electrodes 141e in the first direction can mean one first connection electrode 141e that contacts the upper surface of the same first internal electrode 121 and the other first connection electrode 141e that contacts the lower surface of the same first internal electrode 121 in a cross-section of the main body 110 in the first and second directions or in a cross-section of the main body in the first and third directions.

[0103] In addition, when there are a plurality of first connection electrodes 141e that contact the upper surface and the lower surface, respectively, two adjacent first connection electrodes 141e in the first direction mean one first connection electrode 141e that contacts the upper surface of the same first internal electrode 121 and, among the plurality of first connection electrodes 141e that contact the lower surface of the same first internal electrode 121, another first connection electrode 141e that is most adjacent to the one first connection electrode 141e in the second or third direction.

[0104] In addition, the fact that two adjacent first connection electrodes 141e are arranged so as to be displaced from each other means that, in a cross-section of the main body 110 in the first and second directions or in a cross-section of the main body 110 in the first and third directions, a virtual line connecting the midpoints of the upper and lower surfaces of one first connection electrode 141e and a virtual line connecting the midpoints of the upper and lower surfaces of the other first connection electrode 141e do not coincide with each other.

[0105] According to the third modification of the first embodiment of the present invention, two adjacent first connection electrodes 141e in the first direction are arranged so as to be displaced from each other, and the first connection electrodes 141e can be dispersedly arranged within the first margin region. Thereby, the mechanical strength of the stacked electronic component 100e can be effectively improved as compared with the number of the first connection electrodes 141e.

[0106] On the other hand, since the second to fourth connection electrodes 142e, 143e, and 144e can have a structure similar to that of the first connection electrode 141e, detailed descriptions of the second to fourth connection electrodes 142e, 143e, and 144e are omitted. The above description of the first connection electrode 141e can be similarly applied to the second to fourth connection electrodes 142e, 143e, and 144e as long as there is no contradiction.

[0107] FIG. 16 is a perspective view schematically showing a multilayer electronic component according to a fifth modification of the first embodiment of the present invention, FIG. 17 is a cross-sectional view schematically showing a cut cross-section along the line I4-I4' of FIG. 16, FIG. 18 is a cross-sectional view schematically showing a cut cross-section along the line II4-II4' of FIG. 16, FIG. 19a is a cross-sectional view schematically showing a cut cross-section along the line III4-III4' of FIG. 17, and FIG. 19b is a cross-sectional view schematically showing a cut cross-section along the line IV4-IV4' of FIG. 17.

[0108] Hereinafter, with reference to FIGS. 16 and 19b, a multilayer electronic component 100f according to a fifth modification of the first embodiment of the present invention will be described. For configurations that are the same as / similar to those of the multilayer electronic components 100a, 100b, and 100c described with reference to FIGS. 1 to 10b, the same / similar reference numerals will be used, and duplicate explanations will be omitted.

[0109] Referring to FIG. 19a, the first internal electrode 121f includes a first main portion 123f that overlaps the second internal electrode 122f in the first direction, a first lead portion 125f that is disposed in the first portion P1, extends from the first main portion 123f, and does not overlap the second internal electrode 122f, and a second lead portion 127f that is disposed in the second portion P2, extends from the first main portion 123f, and does not overlap the second internal electrode 122f.

[0110] Referring to FIG. 19b, the second internal electrode 122f includes a second main portion 124f that overlaps the first internal electrode 121f in the first direction, a third lead portion 126f that is disposed in the third portion P3, extends from the second main portion 124f, and does not overlap the first internal electrode 121f, and a fourth lead portion 128f that is disposed in the fourth portion P4, extends from the second main portion 124f, and does not overlap the first internal electrode 121f.

[0111] The multilayer electronic component 100f can include auxiliary electrodes 151f, 152f, 153f, and 154f that are disposed in at least one of the first to fourth cut portions 161, 162, 163, and 164 and are disposed between those of the plurality of via electrodes that are adjacent to each other in the first direction.

[0112] For example, the first to fourth auxiliary electrodes 151f, 152f, 153f, and 154f can be respectively arranged in the first to fourth cut portions 161, 162, 163, and 164 and connected to the first to fourth connection electrodes 141, 142, 143, and 144. The first to fourth auxiliary electrodes 151f, 152f, 153f, and 154f can be arranged separately from the first to fourth external electrodes 131, 132, 133, and 134.

[0113] The first to fourth auxiliary electrodes 151f, 152f, 153f, and 154f may be respectively arranged inside the first to fourth cut portions 161, 162, 163, and 164, but the present invention is not limited thereto, and a part of the auxiliary electrodes 151f, 152f, 153f, and 154f may be arranged outside the cut portions 161, 162, 163, and 164.

[0114] The first to fourth auxiliary electrodes 151f, 152f, 153f, and 154f can respectively have a shape corresponding to the shape of the first to fourth cut portions 161, 162, 163, and 164. For example, they can have a rectangular shape, but the present invention is not limited thereto.

[0115] The stacked electronic component 100f is arranged in at least one of the first to fourth portions P1, P2, P3, and P4, penetrates the cover portions 112 and 113, and connects the first internal electrode 121f arranged on the outermost periphery with reference to the first direction and the first or second external electrode 131, 132, or connects the second internal electrode 122f arranged on the outermost periphery with reference to the first direction and the third or fourth external electrode 133, 134 to each other, and can include contact electrodes 171, 172, and 173.

[0116] For example, the first contact electrode 171 is disposed in the first portion P1, penetrates the cover portions 112 and 113, and can connect the first internal electrode 121f, the first auxiliary electrode 151, and the first external electrode 131 that are disposed on the outermost contour with respect to the first direction. The second contact electrode 172 is disposed in the second portion P2, penetrates the cover portions 112 and 113, and can connect the first internal electrode 121f or the second auxiliary electrode 152f disposed on the outermost contour with respect to the first direction and the second external electrode 132.

[0117] The third contact electrode 173 is disposed in the third portion P3, penetrates the cover portions 112 and 113, and can connect the second internal electrode 122f or the third auxiliary electrode 153f disposed on the outermost contour with respect to the first direction and the third external electrode 133. A fourth contact electrode (not shown) is disposed in the fourth portion P4, penetrates the cover portions 112 and 113, and can connect the second internal electrode 122f or the fourth auxiliary electrode 154f disposed on the outermost contour with respect to the first direction and the fourth external electrode 134. The first to fourth contact electrodes can be respectively disposed on the first and second cover portions 112 and 113.

[0118] The contact electrodes 171, 172, and 173 can be formed by laminating two or more cover portion forming sheets in which vias are formed. Therefore, the contact electrodes 171, 172, and 173 can have a form similar to that of the connection electrodes. In one embodiment, the contact electrodes 171, 172, and 173 can include a plurality of through electrodes laminated in the first direction, and two adjacent through electrodes among the plurality of through electrodes can be arranged to be displaced from each other in a direction perpendicular to the first direction. Although the drawing shows a contact electrode in which two through electrodes are laminated, the number of laminated through electrodes constituting the contact electrodes 171, 172, and 173 is not particularly limited, and this may vary depending on the number of the cover portion forming sheets.

[0119] For contact with the contact electrodes, the first to fourth external electrodes 131, 132, 133, and 134 are preferably arranged on the first surface and / or the second surface 1, 2 respectively. For example, the first to fourth external electrodes 131, 132, 133, and 134 can be arranged on the upper surface and / or the lower surface of the main body 110 and extend on the side surface of the main body 110. The contact electrodes connect between the internal electrodes 121, 122 or the auxiliary electrodes 151f, 152f, 153f, 154f arranged on the outermost periphery with reference to the first direction and the regions extending on the first surface 1 and / or the second surface 2 of the external electrodes 131, 132, 133, and 134, thereby increasing the current path of the multilayer electronic component 100f and reducing the equivalent series resistance (ESR).

[0120] On the other hand, since the electrical connection between the internal electrodes 121f, 122f and the external electrodes 131, 132, 133, and 134 can be ensured through the contact electrodes, the first and second internal electrodes 121f, 122f, and the first to fourth auxiliary electrodes 151f, 152f, 153f, 154f can be arranged separated from the third to sixth surfaces 3, 4, 5, 6. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 100f from decreasing.

[0121] FIG. 20 is a perspective view schematically showing a multilayer electronic component according to a sixth modification of the first embodiment of the present invention, FIG. 21 is a cross-sectional view schematically showing a cut cross-section along the line I5-I5' of FIG. 20, and FIG. 22 is a cross-sectional view schematically showing a cut cross-section along the line II5-II5' of FIG. 20.

[0122] Hereinafter, with reference to FIGS. 20 to 22, the multilayer electronic component 100g according to the sixth modification of the first embodiment of the present invention will be described. The same / similar components as those of the multilayer electronic component 100f described in FIGS. 16 to 19b are denoted by the same / similar reference numerals, and the overlapping description will be omitted.

[0123] The first external electrodes 131g1 and 131g2, the second external electrodes 132g1 and 132g2, the third external electrodes 133g1 and 133g2, and the fourth external electrodes 134g1 and 134g2 can be respectively arranged on the first surface and the second surfaces 1 and 2. The first to fourth external electrodes 131g1, 132g1, 133g1, 134g1 arranged on the first surface 1 and the first to fourth external electrodes 131g2, 132g2, 133g2, 134g2 arranged on the second surface 2 can be arranged at intervals from each other. That is, the external electrodes of the multilayer electronic component 100g can have the form of so-called bottom electrodes.

[0124] The first external electrodes 131g1 and 131g2, the second external electrodes 132g1 and 132g2, the third external electrodes 133g1 and 133g2, and the fourth external electrodes 134g1 and 134g2 do not have to extend on the third to sixth surfaces 3, 4, 5, and 6 respectively, but the present invention is not limited thereto, and the first external electrodes 131g1 and 131g2, the second external electrodes 132g1 and 132g2, the third external electrodes 133g1 and 133g2, and / or the fourth external electrodes 134g1 and 134g2 may extend on at least one of the third to sixth surfaces 3, 4, 5, and 6.

[0125] Since the multilayer electronic component 100g can ensure electrical connection between the internal electrodes and the external electrodes via the contact electrodes 171, 172, and 173, the first and second internal electrodes 121f and 122f and the auxiliary electrodes 151f, 152f, 153f, and 154f can be arranged at intervals from the third to sixth surfaces 3, 4, 5, and 6. Further, since the external electrodes have the form of bottom electrodes arranged on the first surface and the second surfaces 1 and 2, the capacitance and bending strength per unit volume of the multilayer electronic component 100g can be improved.

[0126] Note that the drawings show the form of the bottom electrode in which the external electrodes are arranged on the first surface and the second surfaces 1 and 2, respectively. However, the present invention is not limited to this, and the first to fourth external electrodes may be arranged on either one of the first surface and the second surfaces 1 and 2 and not arranged on the other surface. That is, the first to fourth external electrodes may be arranged on the first surface 1 but not on the second surface 2, or may be arranged on the second surface 2 but not on the first surface 1.

[0127] (Second Embodiment) FIG. 23 is a perspective view schematically showing a multilayer electronic component according to a second embodiment of the present invention, FIG. 24 is an exploded perspective view schematically showing the main body of the multilayer electronic component according to the second embodiment of the present invention, FIG. 25 is a cross-sectional view schematically showing a cut cross-section along line I6-I6' of FIG. 23, FIG. 26 is a cross-sectional view schematically showing a cut cross-section along line II6-II6' of FIG. 23, FIG. 27a is a cross-sectional view schematically showing a cut cross-section along line III6-III6' of FIG. 25, FIG. 27b is a cross-sectional view schematically showing a cut cross-section along line IV6-IV6' of FIG. 25, and FIG. 28 is a partially enlarged view schematically showing region B of FIG. 25.

[0128] Hereinafter, with reference to FIGS. 23 to 28, the multilayer electronic component 200a according to the second embodiment of the present invention will be described. The same / similar reference numerals will be used for the same / similar configurations as those of the multilayer electronic components 100a and 100b described with reference to FIGS. 1 to 9b, and redundant descriptions will be omitted.

[0129] The multilayer electronic component 200a according to the second embodiment of the present invention may include a main body 210, external electrodes 231, 232, 233, 234, and via electrodes 241a, 241b, 242a, 242b, 243a, 243b, 244a, 244b.

[0130] The main body 210 may have a first surface and a second surface 1 and 2 facing each other in a first direction, a third surface and a fourth surface 3 and 4 facing each other in a second direction and connected to the first surface and the second surface 1 and 2, and a fifth surface and a sixth surface 5 and 6 facing each other in a third direction.

[0131] The main body 210 can be divided into first to fourth parts P1, P2, P3, and P4. The first to fourth parts P1, P2, P3, and P4 can divide the main body 210 into two equal parts in the second and third directions respectively. For example, referring to FIGS. 27a and 27b, the first part P1 includes a corner E1 where the third surface and the fifth surface are in contact, the second part P2 includes a corner E2 where the fourth surface and the sixth surface are in contact, the third part P3 includes a corner E3 where the fourth surface and the fifth surface are in contact, and the fourth part P4 can include a corner E4 where the third surface and the sixth surface are in contact.

[0132] The main body 210 can include a first internal electrode layer 220a and a second internal electrode layer 220b alternately arranged in the first direction. The main body 210 is disposed inside the main body 210, and a capacitance forming portion Ac is formed by alternately arranging first and second internal electrodes 221 and 222 with the first dielectric layer 211a or the second dielectric layer 211b interposed therebetween, and cover portions 212 and 213 disposed on both surfaces of the capacitance forming portion Ac facing each other in the first direction can be included.

[0133] The first internal electrode layer 220a can include the first dielectric layer 211a, the first internal electrode 221 disposed on the first dielectric layer 211a, and third and fourth auxiliary electrodes 253 and 254 disposed on the first dielectric layer 211a, separated from the first internal electrode 221, and disposed in the third and fourth parts P3 and P4 respectively.

[0134] The second internal electrode layer 220b can include the second dielectric layer 211b, the second internal electrode 222 disposed on the second dielectric layer 211b, and first and second auxiliary electrodes 251 and 252 disposed on the second dielectric layer 211b, separated from the second internal electrode 222, and disposed in the first and second parts P1 and P2 respectively.

[0135] Referring to FIG. 27a, the first internal electrode 221 includes a first main portion 223 that overlaps the second internal electrode 222 in the first direction, a first lead portion 225 that extends from the first main portion 223 and does not overlap the second internal electrode 222 and is exposed on at least one of the third surface and the fifth surface 3 and 5, and a second lead portion 227 that extends from the first main portion 223 and does not overlap the second internal electrode 222 and is exposed on at least one of the fourth surface and the sixth surface 4 and 6.

[0136] Referring to FIG. 27b, the second internal electrode 222 includes a second main portion 224 that overlaps the first internal electrode 221 in the first direction, a third lead portion 226 that extends from the second main portion 224 and does not overlap the first internal electrode 221 and is exposed on at least one of the fourth surface and the fifth surface 4 and 5, and a fourth lead portion 228 that extends from the second main portion 224 and does not overlap the first internal electrode 221 and is exposed on at least one of the third surface and the sixth surface 3 and 6.

[0137] The first auxiliary electrode 251 can be disposed between adjacent ones of the plurality of first lead portions 225, the second auxiliary electrode 252 can be disposed between adjacent ones of the plurality of second lead portions 227, the third auxiliary electrode 253 can be disposed between adjacent ones of the plurality of third lead portions 226, and the fourth auxiliary electrode 254 can be disposed between adjacent ones of the plurality of fourth lead portions 228.

[0138] The first auxiliary electrode 251 can be exposed on at least one of the third surface and the fifth surface 3, 5 and connected to the first external electrode 231. The second auxiliary electrode 252 can be exposed on at least one of the fourth surface and the sixth surface 4, 6 and connected to the second external electrode 232. The third auxiliary electrode 253 can be exposed on at least one of the fourth surface and the fifth surface 4, 5 and connected to the third external electrode 233. The fourth auxiliary electrode 254 can be exposed on at least one of the third surface and the sixth surface 3, 6 and connected to the fourth external electrode 234. However, the present invention is not limited thereto, and the auxiliary electrodes 251, 252, 253, 254 may be arranged separately from the third surface to the sixth surface 3, 4, 5, 6.

[0139] The first and second auxiliary electrodes 251, 252 are respectively arranged on the first and second corner E1, E2 sides and can extend in the second and third directions toward the third and fourth portions P3, P4. The first and second auxiliary electrodes 251, 252 may be arranged only on the first and second portions P1, P2 respectively, but the present invention is not limited thereto.

[0140] The third and fourth auxiliary electrodes 253, 254 are respectively arranged on the third and fourth corner E3, E4 sides and can extend in the second and third directions toward the first and second portions P1, P2. The third and fourth auxiliary electrodes 253, 254 may be arranged only on the third and fourth portions P3, P4 respectively, but the present invention is not limited thereto.

[0141] The first and second external electrodes 231, 232 are respectively arranged on the first and second portions P1, P2 and can be connected to the first internal electrode 221. The first external electrode 231 may be arranged, for example, on at least one of the third surface and the fifth surface 3, 5 and connected to the first lead portion 225. The second external electrode 232 may be arranged, for example, on at least one of the fourth surface and the sixth surface 4, 6 and connected to the second lead portion 227.

[0142] The third and fourth external electrodes 233 and 234 are respectively disposed on the third and fourth portions P3 and P4 and can be connected to the second internal electrode 222. The third external electrode 233 may be disposed on at least one of the fourth and fifth surfaces 4 and 5, for example, and may be connected to the third lead portion 226. The fourth external electrode 234 may be disposed on at least one of the third and sixth surfaces 3 and 6, for example, and may be connected to the fourth lead portion 228.

[0143] For example, the first external electrode 231 can be disposed on the third and fifth surfaces 3 and 5 and extend onto a part of the first and second surfaces 1 and 2. The second external electrode 232 can be disposed on the fourth and sixth surfaces 4 and 6 and extend onto a part of the first and second surfaces 1 and 2. The third external electrode 233 can be disposed on the fourth and fifth surfaces 4 and 5 and extend onto a part of the first and second surfaces 1 and 2. The fourth external electrode 234 can be disposed on the third and sixth surfaces 3 and 6 and extend onto a part of the first and second surfaces 1 and 2. However, the present invention is not limited thereto. When introducing the contact structure described later, the external electrodes 231, 232, 233, and 234 may be disposed only on the first surface and / or the second surface 1 and 2.

[0144] The external electrodes 231, 232, 233, and 234 can include, for example, a base electrode layer that contacts the internal electrodes 221 and 222 and a plating layer disposed on the base electrode layer. The base electrode layer can include, for example, one or more of a fired electrode layer, a conductive resin layer, and a thin film electrode layer.

[0145] The multilayer electronic component 200a according to the second embodiment of the present invention includes a first via electrode 241a that is disposed in the first portion P1, penetrates the first dielectric layer 211a, and connects the first internal electrode 221 and the first auxiliary electrode 251, and a second via electrode 241b that is disposed in the first portion P1, penetrates the second dielectric layer 211b, and connects the first internal electrode 221 and the first auxiliary electrode 251.

[0146] The first and second via electrodes 241a and 241b can connect the first lead portion 225 and the first auxiliary electrode 251 to each other through regions adjacent to the first corner E1 of the first and second dielectric layers 211a and 211b, respectively. The first and second via electrodes 241a and 241b can penetrate through a margin region where the third and fifth surfaces 3 and 5 and the capacitance forming portion Ac are separated from each other between the first lead portion 225 and the first auxiliary electrode 251.

[0147] According to the second embodiment of the present invention, even if a part of the first internal electrodes 221 shrink due to the firing process and the contact with the first external electrode 231 is broken, the first internal electrodes can be electrically connected to the first external electrode 231 through the first and second via electrodes 241a and 241b and the first internal electrodes of other layers. Thereby, a capacitance decrease of the multilayer electronic component 200a can be prevented.

[0148] According to the second embodiment of the present invention, the first via electrode 241 and the second via electrode 241b can be arranged so as to be displaced from each other in a direction perpendicular to the first direction.

[0149] Referring to FIG. 28, the fact that the first via electrode 241a and the second via electrode 241b are arranged so as to be displaced from each other in a direction perpendicular to the first direction means that in a cross section of the main body 210 in the first and second directions, a virtual line L21a connecting the half points of the upper and lower surfaces of the first via electrode 241a and a virtual line L21b connecting the half points of the upper and lower surfaces of the second via electrode 241b do not coincide with each other.

[0150] By arranging the first via electrode 241a and the second via electrode 241b so as to be displaced from each other, the via electrodes 241a and 241b can be dispersedly arranged within the margin region. Thereby, it is possible to suppress the phenomenon in which the margin region sinks due to a density difference between a region where the via electrodes 241a and 241b are arranged and a region where the via electrodes 241a and 241b are not arranged within the margin region, or an external stress. Further, by dispersedly arranging the via electrodes 241a and 241b within the margin region, the mechanical strength of the stacked electronic component 200a can be effectively improved as compared with the number of the via electrodes 241a and 241b.

[0151] In one embodiment, the first via electrode 241a and the second via electrode 241b may not overlap each other in the first direction. When the first via electrode 241a and the second via electrode 241b are arranged so as to be displaced from each other, the effect of improving the mechanical strength of the stacked electronic component 200a intended in the present invention can be exhibited. However, when the first via electrode 241a and the second via electrode 241b are arranged so as not to overlap each other in the first direction, the effect of improving the mechanical strength of the present invention can be more remarkable.

[0152] Referring to FIG. 28, the fact that the first via electrode 241a does not overlap the second via electrode 241b in the first direction means that a virtual line TL in the first direction in contact with the second via electrode 241b does not intersect the first via electrode 241a at a point where the width of the second via electrode 241b is maximum.

[0153] In one embodiment, a plurality of first via electrodes 241a penetrating the same first dielectric layer 211a can be arranged, and the plurality of first via electrodes 241a penetrating the same first dielectric layer 211a can be arranged in the second and third directions. For example, the plurality of first via electrodes 241a arranged at the same level may be arranged in the second and third directions.

[0154] Similarly, a plurality of second via electrodes 241b penetrating the same second dielectric layer 211b can be arranged, and the plurality of second via electrodes 241b penetrating the same second dielectric layer 211b can be arranged in the second and third directions. For example, the plurality of second via electrodes 241b arranged at the same level may be arranged in the second and third directions.

[0155] Referring to FIGS. 27a and 27b, the plurality of first via electrodes 241a penetrating the same first dielectric layer 211a are arranged so as to be displaced from each other with reference to the second and third directions, thereby forming a first lattice pattern LP1a. The plurality of second via electrodes 241b penetrating the same second dielectric layer 211b are arranged so as to be displaced from each other with reference to the second and third directions, thereby forming a second lattice pattern LP1b.

[0156] The first lattice pattern LP1a and the second lattice pattern LP1b can be arranged in the main body 210 so as to be displaced from each other with the first internal electrode 221 or the first auxiliary electrode 251 interposed therebetween. The first lattice pattern LP1a and the second lattice pattern LP1b each include a plurality of first and second via electrodes 241a, 241b arranged in a staggered manner and do not overlap each other in the first direction, thereby effectively improving the mechanical strength of the multilayer electronic component 200a.

[0157] In one embodiment, the first dielectric layer 211a includes a first region R1 disposed between two first via electrodes 241a adjacent to each other in the second or third direction among the plurality of first via electrodes 241a, and the plurality of second via electrodes 241b can overlap the first region R1.

[0158] In one embodiment, the width of the upper surface of the first via electrode 241a may be wider than the width of the lower surface of the first via electrode 241a, and the width of the upper surface of the second via electrode 241b may be wider than the width of the lower surface of the second via electrode 241b. The width of the first via electrode 241a may gradually decrease, for example, from the upper surface of the first via electrode 241a toward the lower surface of the first via electrode 241a, and the width of the second via electrode 241b may gradually decrease, for example, from the upper surface of the second via electrode 241b toward the lower surface of the second via electrode 241b.

[0159] On the other hand, via electrodes similar in form to the first and second via electrodes 241a and 241b disposed in the first portion P1 can also be disposed in the second to fourth portions P2, P3, and P4.

[0160] The multilayer electronic component 200a includes a third via electrode 242a disposed in the second portion P2 and penetrating the first dielectric layer 211a to connect the first internal electrode 221 and the second auxiliary electrode 252, and a fourth via electrode 242b disposed in the second portion P2 and penetrating the second dielectric layer 211b to connect the first internal electrode 221 and the second auxiliary electrode 252. The third via electrode 242a and the fourth via electrode 242b may be arranged to be offset from each other in a direction perpendicular to the first direction.

[0161] The multilayer electronic component 200a includes a fifth via electrode 243a disposed in the third portion P3 and penetrating the first dielectric layer 211a to connect the second internal electrode 222 and the third auxiliary electrode 253, and a sixth via electrode 243b disposed in the third portion P3 and penetrating the second dielectric layer 211b to connect the second internal electrode 222 and the third auxiliary electrode 253. The fifth via electrode 243a and the sixth via electrode 243b may be arranged to be offset from each other in a direction perpendicular to the first direction.

[0162] The stacked electronic component 200a is disposed in the fourth portion P4, penetrates the first dielectric layer 211a, and includes a seventh via electrode 244a that connects the second internal electrode 222 and the fourth auxiliary electrode 254, and a stacked electronic component 200a that is disposed in the fourth portion P4 and penetrates the second dielectric layer 211b, and may include an eighth via electrode 244b that connects the second internal electrode 222 and the fourth auxiliary electrode 254. The seventh via electrode 244a and the eighth via electrode 244b may be arranged so as to be displaced from each other in a direction perpendicular to the first direction.

[0163] Referring to FIGS. 27a and 27b, a plurality of third via electrodes 242a penetrating the same first dielectric layer 211a can form a third lattice pattern LP2a by being arranged so as to be displaced from each other with reference to the second and third directions, and a plurality of fourth via electrodes 242b penetrating the same second dielectric layer 211b can form a fourth lattice pattern LP2b by being arranged so as to be displaced from each other with reference to the second and third directions. The third lattice pattern LP2a and the fourth lattice pattern LP2b each include a plurality of third and fourth via electrodes 242a, 242b arranged in a staggered manner, and can be arranged so as not to overlap each other in the first direction.

[0164] In one embodiment, the first dielectric layer 211a includes a second region R2 disposed between two third via electrodes 242a adjacent to each other in the second or third direction among the plurality of third via electrodes 242a, and the plurality of fourth via electrodes 242b can overlap with the second region R2.

[0165] A plurality of fifth via electrodes 243a penetrating the same first dielectric layer 211a can form a fifth lattice pattern LP3a by being arranged so as to be displaced from each other with reference to the second and third directions, and a plurality of sixth via electrodes 243b penetrating the same second dielectric layer 211b can form a sixth lattice pattern LP3b by being arranged so as to be displaced from each other with reference to the second and third directions. The fifth lattice pattern LP3a and the sixth lattice pattern LP3b each include a plurality of fifth and sixth via electrodes 243a, 243b arranged in a staggered manner, and can be arranged so as not to overlap each other in the first direction.

[0166] In one embodiment, the first dielectric layer 211a includes a third region R3 disposed between two of the plurality of fifth via electrodes 243a that are adjacent to each other in the second or third direction, and the plurality of sixth via electrodes 243b can overlap with the third region R3.

[0167] The plurality of seventh via electrodes 244a passing through the same first dielectric layer 211a can form a seventh lattice pattern LP4a by being arranged so as to be offset from each other with reference to the second and third directions, and the plurality of eighth via electrodes 244b passing through the same second dielectric layer 211b can form an eighth lattice pattern LP4b by being arranged so as to be offset from each other with reference to the second and third directions. The seventh lattice pattern LP4a and the eighth lattice pattern LP4b each include a plurality of seventh and eighth via electrodes 244a, 244b arranged in a staggered manner, and can be arranged so as not to overlap with each other in the first direction.

[0168] In one embodiment, the first dielectric layer 211a includes a fourth region R4 disposed between two of the plurality of seventh via electrodes 244a that are adjacent to each other in the second or third direction, and the plurality of eighth via electrodes 244b can overlap with the fourth region R4.

[0169] Hereinafter, detailed descriptions of the third to eighth via electrodes 242a, 242b, 243a, 243b, 244a, 244b will be omitted. However, the descriptions of the first and second via electrodes 241a, 242b can be similarly applied to the third to eighth via electrodes 242a, 242b, 243a, 243b, 244a, 244b as long as there is no contradiction.

[0170] FIGS. 29a and 29b are cross-sectional views schematically showing a stacked electronic component according to a first modification of the second embodiment of the present invention, and are views corresponding to FIGS. 27a and 27b.

[0171] Hereinafter, with reference to FIGS. 29a and 29b, the stacked electronic component 200b according to the first modification of the second embodiment of the present invention will be described. For the configurations that are the same as / similar to those of the stacked electronic components 100c and 200a described with reference to FIGS. 10a to 10b and FIGS. 23 to 28, the same / similar reference numerals are used, and redundant descriptions are omitted.

[0172] Referring to FIG. 29a, the first internal electrode 221b can include a first main portion 223b, a first lead portion 225b extending from the first main portion 223b and exposed on at least one of the third and fifth surfaces 3 and 5, and a second lead portion 227b extending from the first main portion 223b and exposed on at least one of the fourth and sixth surfaces 4 and 6.

[0173] Referring to FIG. 29b, the second internal electrode 222b can include a second main portion 224b, a third lead portion 226b extending from the second main portion 224b and exposed on at least one of the fourth and fifth surfaces 4 and 5, and a fourth lead portion 228b extending from the second main portion 224b and exposed on at least one of the third and sixth surfaces 3 and 6.

[0174] The second internal electrode 222b can include first and second cutout portions 261 and 262 respectively disposed in the first and second portions P1 and P2, and the first internal electrode 221b can include third and fourth cutout portions 263 and 264 respectively disposed in the third and fourth portions P3 and P4. Here, the cutout portions 261, 262, 263, and 264 can be defined as the regions within the internal regions defined by the virtual lines extending the long-side edges of the main portions 223b and 224b where the internal electrodes 221b and 222b are not disposed.

[0175] For example, first and second cutouts 261 and 262 may be respectively disposed at both corners of the second internal electrode 222b disposed in the first and second portions P1 and P2, and third and fourth cutouts 263 and 264 may be respectively disposed at both corners of the first internal electrode 221b disposed in the third and fourth portions P3 and P4. By the cutouts 261, 262, 263, and 264, the first and second main portions 223b and 224b can be provided, for example, in a "+" shape.

[0176] In one embodiment, the first to fourth cutouts 261, 262, 263, and 264 can each have a shape corresponding to the shape of the first to fourth auxiliary electrodes 251b, 252b, 253b, and 254b. For example, as shown in FIGS. 29a and 29b, the first to fourth cutouts 261, 262, 263, and 264 can have a rectangular shape corresponding to the shape of the auxiliary electrodes 251b, 252b, 253b, and 254b. However, the present invention is not limited thereto, and the auxiliary electrodes 251b, 252b, 253b, and 254b can have various shapes such as an arc shape, and the first to fourth cutouts 261, 262, 263, and 264 can also have various shapes corresponding to the shape of the auxiliary electrodes 251b, 252b, 253b, and 254b. A part of the auxiliary electrodes 251b, 252b, 253b, and 254b can be disposed inside the cutouts 261, 262, 263, and 264.

[0177] FIGS. 30a and 30b are cross-sectional views schematically showing a multilayer electronic component according to a second modification of the second embodiment of the present invention, and are views corresponding to FIGS. 27a and 27b.

[0178] Hereinafter, with reference to FIGS. 30a and 30b, a multilayer electronic component 200c according to a second modification of the second embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic components 100d and 200a described with reference to FIGS. 11a to 11b and FIGS. 23 to 28, and redundant descriptions are omitted.

[0179] Referring to FIG. 30a, the first internal electrode 221c can include a first main portion 223c, a first lead portion 225c extending from the first main portion 223c and exposed on at least one of the third and fifth surfaces 3 and 5, and a second lead portion 227c extending from the first main portion 223c and exposed on at least one of the fourth and sixth surfaces 4 and 6.

[0180] Referring to FIG. 30b, the second internal electrode 222c can include a second main portion 224c, a third lead portion 226c extending from the second main portion 224c and exposed on at least one of the fourth and fifth surfaces 4 and 5, and a fourth lead portion 228c extending from the second main portion 224c and exposed on at least one of the third and sixth surfaces 3 and 6.

[0181] The auxiliary electrodes 251c, 252c, 253c, 254c are respectively disposed in the first to fourth portions P1, P2, P3, P4 and can be connected to the first to fourth external electrodes 231, 232, 233, 234.

[0182] The first auxiliary electrode 251c can include a first connection portion 251c1 exposed on a part of the third surface 3 and a part of the fifth surface 5, a first extension portion 251c2 extending from the first connection portion 251c1 toward the third portion P3 and having a dimension in the third direction smaller than that of the first connection portion 251c1, and a second extension portion 251c3 extending from the first connection portion 251c1 toward the fourth portion P4 and having a dimension in the second direction smaller than that of the first connection portion 251c1.

[0183] The second auxiliary electrode 252c can include a second connection portion 252c1 exposed on a part of the fourth surface 4 and a part of the sixth surface 6, a third extension portion 252c2 extending from the second connection portion 252c1 toward the third portion P3 and having a dimension in the second direction smaller than that of the second connection portion 252c1, and a fourth extension portion 252c3 extending from the second connection portion 252c1 toward the fourth portion P4 and having a dimension in the third direction smaller than that of the second connection portion 252c1.

[0184] The third auxiliary electrode 253c can include a third connection portion 253c1 that is exposed on a part of the fourth surface 4 and a part of the fifth surface 5, a fifth extension portion 253c2 that extends from the third connection portion 253c1 toward the first portion P1 and has a dimension in the third direction smaller than that of the third connection portion 253c1, and a sixth extension portion 253c3 that extends from the third connection portion 253c1 toward the second portion P2 and has a dimension in the second direction smaller than that of the third connection portion 253c1.

[0185] The fourth auxiliary electrode 254c can include a fourth connection portion 254c1 that is exposed on a part of the third surface 3 and a part of the sixth surface 6, a seventh extension portion 254c2 that extends from the fourth connection portion 254c1 toward the first portion P1 and has a dimension in the second direction smaller than that of the fourth connection portion 254c1, and an eighth extension portion 254c3 that extends from the fourth connection portion 254c1 toward the second portion P2 and has a dimension in the third direction smaller than that of the fourth connection portion 254c1.

[0186] By including the first to eighth extension portions 151d2, 151d3, 152d2, 152d3, 153d2, 153d3, 154d2, 154d3, the multilayer electronic component 200c can more effectively suppress the phenomenon that the margin region sinks due to external stress or the like.

[0187] FIG. 31 is a perspective view schematically showing a multilayer electronic component according to a third modification of the second embodiment of the present invention, FIG. 32 is a cross-sectional view schematically showing a cut section along line I7-I7' of FIG. 31, FIG. 33 is a cross-sectional view schematically showing a cut section along line II7-II7' of FIG. 31, FIG. 34a is a cross-sectional view schematically showing a cut section along line III7-III7' of FIG. 32, and FIG. 34b is a cross-sectional view schematically showing a cut section along line IV7-IV7' of FIG. 32.

[0188] Hereinafter, with reference to FIGS. 31 and 34b, a multilayer electronic component 200d according to a third modification of the second embodiment of the present invention will be described. For configurations that are the same as / similar to those of the multilayer electronic components 100f and 200a described in FIGS. 16 to 19b and FIGS. 23 to 28, the same / similar reference numerals will be used, and duplicate explanations will be omitted.

[0189] Referring to FIG. 34a, the first internal electrode 221d includes a first main portion 223d that overlaps with the second internal electrode 222d in the first direction, a first lead portion 225d that is disposed in the first portion P1, extends from the first main portion 223d, and does not overlap with the second internal electrode 222d, and a second lead portion 227d that is disposed in the second portion P2, extends from the first main portion 223d, and does not overlap with the second internal electrode 222d.

[0190] Referring to FIG. 34b, the second internal electrode 222d includes a second main portion 224d that overlaps with the first internal electrode 221d in the first direction, a third lead portion 226d that is disposed in the third portion P3, extends from the second main portion 224d, and does not overlap with the first internal electrode 221d, and a fourth lead portion 228d that is disposed in the fourth portion P4, extends from the second main portion 224d, and does not overlap with the first internal electrode 221d.

[0191] The second internal electrode 222d can include first and second cut portions 261 and 262 disposed in the first and second portions P1 and P2 respectively, and the first internal electrode 221d can include third and fourth cut portions 263 and 264 disposed in the third and fourth portions P3 and P4 respectively.

[0192] The first to fourth auxiliary electrodes 251d, 252d, 253d, and 254d can be respectively disposed in the first to fourth cut portions 161, 162, 163, and 164. The first to fourth auxiliary electrodes 251d, 252d, 253d, and 254d can be disposed at a distance from the first to fourth external electrodes 231, 232, 233, and 234. The first to fourth auxiliary electrodes 251d, 252d, 253d, and 254d can be respectively disposed inside the first to fourth cut portions 261, 262, 263, and 264, but the present invention is not limited thereto, and a part of the auxiliary electrodes 251d, 252d, 253d, and 254d may be disposed outside the cut portions 261, 262, 263, and 264.

[0193] The first to fourth auxiliary electrodes 251d, 252d, 253d, and 254d may each have a shape corresponding to the shapes of the first to fourth incision portions 261, 262, 263, and 264, for example, may have a rectangular shape, but the present invention is not limited thereto.

[0194] The stacked electronic component 200d is disposed in the first portion P1 and may include a first contact structure 271 that connects the first internal electrode 221d or the first auxiliary electrode 251d disposed on the outermost periphery with reference to the first direction through the cover portions 212 and 213 and the first external electrode 231.

[0195] The first contact structure 271 may include first through electrodes 271a and first dummy electrodes 271b alternately arranged in the first direction. The first dummy electrode 261b may be connected to the first external electrode 231 on the third surface and the fifth surface 3 and 5, but the present invention is not limited thereto. The first contact structure 271 may be disposed on the first and second cover portions 212 and 213, respectively.

[0196] The first contact structure 271 can be formed in a manner similar to that of the auxiliary electrode and the via electrode. For example, the first contact structure 271 can be formed by forming a dummy electrode pattern on a cover portion forming sheet in which vias are formed and laminating two or more cover portion forming sheets on which the dummy electrode pattern is formed.

[0197] The first contact structure 271 can have a structure similar to that of the auxiliary electrode and the via electrode. For example, a plurality of the first through electrodes 271a may be arranged, and the plurality of first through electrodes 271a may be arranged in the second and third directions. For example, the plurality of first through electrodes 271a arranged at the same level may have a first or second lattice pattern. The two first through electrodes 271a adjacent to each other in the first direction may not overlap each other in the first direction.

[0198] Similarly, the multilayer electronic component 200d can include a second contact structure 272 that is disposed in the second portion P2, passes through the cover portions 212 and 213, and connects a first internal electrode 221d or a second auxiliary electrode 252d disposed on the outermost periphery with reference to the first direction and a second external electrode 232. The second contact structure 272 can include second through electrodes 272a and first dummy electrodes 272b that are alternately arranged in the first direction. The second contact structure 272 may be disposed on the first and second cover portions 212 and 213, respectively.

[0199] The multilayer electronic component 200d can include a third contact structure 273 that is disposed in the third portion P3, passes through the cover portions 212 and 213, and connects a second internal electrode 222d or a third auxiliary electrode 253d disposed on the outermost periphery with reference to the first direction and a third external electrode 233. The third contact structure 273 can include third through electrodes 273a and third dummy electrodes 273b that are alternately arranged in the first direction. The third contact structure 273 may be disposed on the first and second cover portions 212 and 213, respectively.

[0200] The multilayer electronic component 200d can include a fourth contact structure (not shown) that is disposed in the fourth portion P4, passes through the cover portions 212 and 213, and connects a second internal electrode 222d or a fourth auxiliary electrode 254d disposed on the outermost periphery with reference to the first direction and a fourth external electrode 234. The fourth contact structure can include fourth through electrodes and fourth dummy electrodes that are alternately arranged in the first direction. The fourth contact structure may be disposed on the first and second cover portions 212 and 213, respectively.

[0201] Hereinafter, specific descriptions of the second to fourth contact structures are omitted. However, the second to fourth contact structures can have a configuration similar to that of the first contact structure. Therefore, the description of the first contact structure 271 can be similarly applied to the second to fourth contact structures as long as there is no contradiction.

[0202] For contact with the contact structure, it is preferable that the first to fourth external electrodes 231, 232, 233, 234 are respectively arranged on the first surface and / or the second surface 1, 2. The first to fourth external electrodes 231, 232, 233, 234 are arranged on the upper surface and / or the lower surface of the main body 210 and can extend on the side surface of the main body 210.

[0203] Since electrical connection between the internal electrodes 221d, 222d and the external electrodes 231, 232, 233, 234 can be ensured through the contact structure, the first and second internal electrodes 221d, 222d can be arranged spaced apart from the third to sixth surfaces 3, 4, 5, 6. That is, the first to fourth lead portions 225d, 227d, 226d, 228d may be arranged spaced apart from the outer surface of the main body 210. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 200d from deteriorating.

[0204] FIG. 35 is a perspective view schematically showing a multilayer electronic component according to a fourth modification of the second embodiment of the present invention, FIG. 36 is a cross-sectional view schematically showing a cut cross-section along line I8-I8' of FIG. 32, and FIG. 37 is a cross-sectional view schematically showing a cut cross-section along line II8-II8' of FIG. 32.

[0205] Hereinafter, with reference to FIGS. 35 to 37, a multilayer electronic component 200e according to a third modification of the second embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic components 100g, 200d described in FIGS. 20 to 22, FIG. 31, and FIG. 34b, and the overlapping description will be omitted.

[0206] The first external electrodes 231e1 and 231e2, the second external electrodes 232e1 and 232e2, the third external electrodes 233e1 and 233e2, and the fourth external electrodes 234e1 and 234e2 can be respectively arranged on the first surface and the second surfaces 1 and 2. The first to fourth external electrodes 231e1, 232e1, 233e1, and 234e1 arranged on the first surface 1 and the first to fourth external electrodes 231e2, 232e2, 233e2, and 234e2 arranged on the second surface 2 can be arranged at intervals from each other. That is, the external electrodes of the multilayer electronic component 200e can have the form of so-called bottom electrodes.

[0207] The first external electrodes 231e1 and 231e2, the second external electrodes 232e1 and 232e2, the third external electrodes 233e1 and 233e2, and the fourth external electrodes 234e1 and 234e2 do not have to extend to the third to sixth surfaces 3, 4, 5, and 6, respectively. However, the present invention is not limited thereto, and the first external electrodes 231e1 and 231e2, the second external electrodes 232e1 and 232e2, the third external electrodes 233e1 and 233e2, and / or the fourth external electrodes 234e1 and 234e2 may extend on at least one of the third to sixth surfaces 3, 4, 5, and 6.

[0208] Since the multilayer electronic component 200e can ensure electrical connection between the internal electrodes and the external electrodes through the contact structures 271, 272, and 273, the first and second internal electrodes 221d and 222d can be arranged at intervals from the third to sixth surfaces 3, 4, 5, and 6. Further, since the external electrodes have the form of bottom electrodes arranged on the first surface and the second surfaces 1 and 2, the capacitance and the bending strength per unit volume of the multilayer electronic component 200e can be improved.

[0209] Note that although the drawings show the form of a bottom electrode in which external electrodes are disposed on the first surface and the second surfaces 1 and 2 respectively, the present invention is not limited thereto, and the first to fourth external electrodes may be disposed on either one of the first surface and the second surfaces 1 and 2 and may not be disposed on the other surface. That is, the first to fourth external electrodes may be disposed on the first surface 1 but not on the second surface 2, or may be disposed on the second surface 2 but not on the first surface 1.

[0210] (Method for manufacturing a multilayer electronic component) FIG. 38 is a cross-sectional view schematically showing a filling and printing step for manufacturing a multilayer electronic component according to the first or second embodiment of the present invention.

[0211] Hereinafter, with reference to FIG. 38, an example of a method for manufacturing the multilayer electronic components 100a and 200a according to the first or second embodiment of the present invention will be described.

[0212] On the other hand, the method for manufacturing a multilayer electronic component will be described based on the multilayer electronic components 100a and 200a according to the first or second embodiment, but this can be directly applied to the multilayer electronic components 100b, 100c, 100d, 100e, 100f, 100g according to the first to sixth modification examples of the first embodiment and the multilayer electronic components 200b, 200c, 200d, 200e according to the first to fourth modification examples of the second embodiment as long as there is no contradiction.

[0213] Hereinafter, the method for manufacturing a multilayer electronic component will be described step by step.

[0214] (Dielectric sheet preparation step) First, a dielectric powder for forming a dielectric sheet 10 is prepared. Examples of the dielectric powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y)O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x ≤ 0.5, 0 < y ≤ 0.5), etc. Examples of BaTiO3 powder include those synthesized by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the method for synthesizing the dielectric powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto.

[0215] Next, after drying and pulverizing the prepared dielectric powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a dielectric slurry, and then the dielectric sheet 10 can be produced by applying and drying the dielectric slurry on a carrier film.

[0216] The dielectric layer can be formed by firing the unit laminate described later on the dielectric sheet 10.

[0217] (Via formation step) The produced dielectric sheet 10 can be continuously supplied, for example, by moving from a supply roller (not shown) around which the dielectric sheet 10 is wound to a recovery roller (not shown) that unwinds the dielectric sheet 10.

[0218] At this time, vias 20 can be formed in the continuously supplied dielectric sheet 10. The step of forming the vias 20 can be performed, for example, by irradiating the dielectric sheet 10 with a laser. The laser may be irradiated from a laser device 50 disposed on the dielectric sheet 10.

[0219] The type of the laser device 50 is not particularly limited. For example, a CO2 laser, a YAG laser, a femtosecond laser, a picosecond UV laser, etc. can be used. The via 20 can have a tapered shape in which the width gradually decreases from one surface of the dielectric sheet 10 irradiated with the laser toward the opposite surface as it is formed by laser processing.

[0220] (Filling step) Next, a filling step of filling the via 20 with an electrode paste (EP) can be performed. The electrode paste (EP) can contain, for example, metal powder, a binder, an organic solvent, etc.

[0221] The method of filling the via 20 with the electrode paste (EP) is not particularly limited. For example, as shown in FIG. 38, the dielectric sheet 10 can pass between the coating roller 61 and the cylinder 71. The coating roller 61 can be in contact with the electrode paste (EP), and the recess (not shown) formed on the outer peripheral surface of the coating roller 61 can be filled with the electrode paste (EP) by the rotational drive of the coating roller 61.

[0222] On the other hand, the coating roller 61 and the cylinder 71 can rotate in opposite directions to apply pressure to the dielectric sheet 10. The electrode paste (EP) applied to the outer peripheral surface of the coating roller 61 can be filled into the via 20 formed in the dielectric sheet 10 as it moves. The electrode paste (EP) filled in the via 20 can form a via electrode by firing the unit laminate described later.

[0223] The excess electrode paste (EP) applied to the outer surface of the coating roller 61 can be removed using a doctor blade (DB).

[0224] (Printing step) A printing step of printing an internal electrode pattern 30 connected to the via 20 on the dielectric sheet 10 can be performed. The method of forming the internal electrode pattern 30 is not particularly limited. For example, the internal electrode pattern 30 can be formed using an application roller 61 and a cylinder 71. That is, the printing step can include a step of supplying an electrode paste (EP) to the outer peripheral surface of the application roller 61 and a step of bringing the dielectric sheet 10 into contact with the application roller 61 to apply the electrode paste (EP) on the dielectric sheet 10.

[0225] In this case, by adjusting the form of the recess (not shown) formed on the outer surface of the application roller 61, the inside of the via 20 can be filled with the electrode paste (EP) and the internal electrode pattern 30 can be formed. That is, in one embodiment, the filling step and the printing step can be performed simultaneously. The printed internal electrode pattern 30 can be dried using a drying device or the like.

[0226] The internal electrode pattern 30 can form an internal electrode by firing a unit laminate described later. Although not shown, an auxiliary electrode pattern for forming an auxiliary electrode by firing a unit laminate can also be formed in the same manner as the internal electrode pattern 30.

[0227] (Lamination step) In order to form the multilayer electronic component 100a according to the first embodiment, a predetermined number of dielectric sheets 10 printed with different internal electrode patterns 30 can be laminated to form a laminate. In order to form the connection electrodes 141, 142, 143, 144, it is necessary to align the alignment between the vias 20 formed in the different dielectric sheets 10 in the lamination step. However, the vias 20 formed in each dielectric sheet 10 may not be completely aligned with each other. As a result, the laminated vias 20 may be laminated such that their central axes are shifted from each other. On the other hand, since the via 20 has a tapered shape, the alignment between the vias formed in different dielectric sheets 10 can be more easily aligned.

[0228] When forming the multilayer electronic component 200a according to the second embodiment, when forming a laminate by laminating a predetermined number of dielectric sheets 10 printed with different internal electrode patterns 30, an auxiliary electrode pattern can be appropriately formed between the internal electrode patterns 30.

[0229] In the case of the laminate for forming the multilayer electronic component 200a according to the second embodiment, since it includes an auxiliary electrode pattern, it is not necessary to align the vias 20 formed in the different dielectric sheets 10 with each other, so the convenience of the process can be ensured.

[0230] On the upper and lower parts of the laminate in the first direction, a cover part forming sheet on which no internal electrode pattern and auxiliary electrode pattern are formed can be laminated in a predetermined number of layers in order to form a cover part after firing.

[0231] On the other hand, in order to form the multilayer electronic components 100f and 100g according to the fifth and sixth modification examples of the first embodiment of the present invention, on the upper and lower parts of the laminate in the first direction, a cover part forming sheet with vias formed can be laminated in a predetermined number of layers.

[0232] Also, in order to manufacture the multilayer electronic components 200d and 200e according to the third and fourth modification examples of the second embodiment of the present invention, on the upper and lower parts of the laminate in the first direction, a cover part forming sheet with vias and dummy electrode patterns formed can be laminated in a predetermined number of layers.

[0233] (Cutting and Firing Stages) Thereafter, after pressing the laminate, a unit laminate can be obtained by cutting the laminate along a plurality of cutting lines. Also, the unit laminate can be fired to obtain a main body. The firing can be performed at a temperature of, for example, 1000°C or higher and 1400°C or lower, but the present invention is not limited thereto.

[0234] (External Electrode Formation Stage) Thereafter, an external electrode can be formed on the above-mentioned main body. The method for forming the external electrode is not particularly limited.

[0235] When the external electrode includes a fired electrode layer, the external electrode formation step can include a step of dipping the main body into a fired paste containing metal powder, glass frit, binder, organic solvent, etc., and then firing the fired paste at a temperature of 500°C to 900°C.

[0236] However, the present invention is not limited thereto. In order to manufacture the multilayer electronic components 100g and 200e according to the sixth modification of the first embodiment and the fourth modification of the second embodiment of the present invention having a bottom electrode structure, the external electrode formation step can also include a step of transferring a sheet containing metal to the main body.

[0237] When the external electrode includes a conductive resin layer, the external electrode formation step can include a step of dipping the main body into a conductive resin composition containing metal powder, resin, binder, organic solvent, etc., and then performing a curing heat treatment at a temperature of 250°C to 550°C.

[0238] When the external electrode includes a thin film electrode layer, the external electrode formation step can include a step of performing an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, and / or a sputtering method.

[0239] Also, an electrolytic plating method and / or an electroless plating method can be further performed to form a plating layer.

[0240] FIGS. 39 to 41 are cross-sectional views showing a modification of FIG. 38.

[0241] Hereinafter, with reference to FIGS. 39 to 41, a modification of the method for manufacturing the multilayer electronic component according to the first embodiment or the second embodiment of the present invention will be described.

[0242] For the configurations that are the same as or similar to the configurations described in FIG. 38, the same or similar reference numerals are used, and the overlapping descriptions are omitted.

[0243] Referring to FIG. 39, the step of forming via 20 can be performed by bringing dielectric sheet 10 into contact with an imprint roller 80 having a convex portion 81 disposed on its outer peripheral surface.

[0244] Specifically, dielectric sheet 10 can pass between imprint roller 80 and cylinder 72. At this time, imprint roller 80 and cylinder 72 can rotate in opposite directions to apply pressure to dielectric sheet 10. Via 20 can be formed in dielectric sheet 10 by the above pressure and convex portion 81.

[0245] The convex portion 81 formed on the outer peripheral surface of the imprint roller 80 can have a pattern corresponding to the grid pattern of the via electrodes.

[0246] Referring to FIG. 40, after irradiating dielectric sheet 10 with a laser to form via 20, electrode paste (EP) can be filled into via 20 using coating roller 61 and cylinder 71.

[0247] Thereafter, electrode paste (EP) can be applied onto dielectric sheet 10 using coating roller 62 and cylinder 73 to separately form internal electrode pattern 30. That is, the above filling step and printing step can be performed sequentially.

[0248] Referring to FIG. 41, after forming via 20 using dielectric sheet 10, imprint roller 80 having a convex portion 81 disposed on its outer peripheral surface, and cylinder 72, electrode paste (EP) can be filled into via 20 using coating roller 61 and cylinder 71.

[0249] Specifically, dielectric sheet 10 can pass between imprint roller 80 and cylinder 72. At this time, imprint roller 80 and cylinder 72 can rotate in opposite directions to apply pressure to dielectric sheet 10, whereby via 20 can be formed in dielectric sheet 10.

[0250] Next, an internal electrode pattern 30 can be separately formed by applying an electrode paste (EP) onto the dielectric sheet 10 using the coating roller 62 and the cylinder 73. That is, the above filling step and printing step can be sequentially performed.

[0251] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the art without departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0252] Also, the expression "one embodiment" does not mean the same embodiment as each other, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood and related to the description of another one embodiment as long as there is no description contrary to or conflicting with that matter in another one embodiment.

[0253] Furthermore, expressions such as "first", "second", etc. are used to distinguish one component from another component, and do not limit the order and / or importance, etc. of the component. In some cases, within the scope not departing from the scope of rights, the first component may be named the second component, and similarly, the second component may be named the first component.

Explanation of Reference Numerals

[0254] 100a, 100b, 100c, 100d, 100e, 100f, 100g, 200a, 200b, 200c, 200d, 200e: Multilayer electronic components 110, 210: Bodies P1, P2, P3, P4: First to fourth parts 111, 211a, 211b: Dielectric layers 112, 113, 212, 213: Cover part 121, 122, 221, 222: Internal electrode 151, 152, 153, 154, 251, 252, 253, 254: Auxiliary electrode 131, 132, 133, 134, 231, 232, 233, 234: External electrode 141, 142, 143, 144: Connecting electrode 141a, 141b, 142a, 142b, 143a, 143b, 241a, 241b, 242a, 242b, 243a, 243b, 244a, 244b: Via electrode 161, 162, 163, 164, 261, 262, 263, 264: Cut part 171, 172, 173: Contact electrode 271, 272, 273: Contact structure 271a, 272a, 273a: Through electrode 271b, 272b, 273b: Dummy electrode

Claims

1. It includes a dielectric layer and first and second internal electrodes that are alternately arranged in the first direction with the dielectric layer therebetween, a first surface and a second surface that face each other in the first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and face each other in the second direction, and a fifth surface and a sixth surface that are connected to the first surface to the fourth surface and face each other in the third direction, and a main body that is divided into first to fourth portions. First and second external electrodes that are respectively arranged on the first and second portions and are connected to the first internal electrode. Third and fourth external electrodes that are respectively arranged on the third and fourth portions and are connected to the second internal electrode. A connection electrode that is arranged in at least one of the first to fourth portions, penetrates the dielectric layer, and connects two adjacent first internal electrodes in the first direction to each other, or connects two adjacent second internal electrodes in the first direction to each other. The first to fourth portions are divided by bisecting the main body in the second and third directions respectively. The first portion includes a corner where the third surface and the fifth surface are in contact. The second portion includes a corner where the fourth surface and the sixth surface are in contact. The third portion includes a corner where the fourth surface and the fifth surface are in contact. The fourth portion includes a corner where the third surface and the sixth surface are in contact. The connection electrode is a stacked electronic component in which a plurality of via electrodes arranged to be offset from each other in a direction perpendicular to the first direction are stacked in the first direction.

2. The stacked electronic component according to claim 1, wherein a plurality of the connection electrodes penetrating the same dielectric layer are arranged.

3. The stacked electronic component according to claim 2, wherein the plurality of connection electrodes penetrating the same dielectric layer are arranged in the second and third directions.

4. The first internal electrode includes a first main portion that overlaps the second internal electrode in the first direction, a first lead portion that extends from the first main portion and does not overlap the second internal electrode and is exposed on at least one of the third surface and the fifth surface, and a second lead portion that extends from the first main portion and does not overlap the second internal electrode and is exposed on at least one of the fourth surface and the sixth surface. The second internal electrode includes a second main portion that overlaps with the first internal electrode in the first direction, a third lead portion that extends from the second main portion and does not overlap with the first internal electrode and is exposed on at least one of the fourth and fifth surfaces, and a fourth lead portion that extends from the second main portion and does not overlap with the first internal electrode and is exposed on at least one of the third and sixth surfaces. The multilayer electronic component according to claim 1.

5. The multilayer electronic component according to claim 1, further comprising an auxiliary electrode disposed in at least one of the first to fourth portions and disposed between ones of the plurality of via electrodes that are adjacent to each other in the first direction.

6. The second internal electrode includes first and second cutout portions respectively disposed in the first and second portions. The first internal electrode includes third and fourth cutout portions respectively disposed in the third and fourth portions. The multilayer electronic component according to claim 1.

7. The multilayer electronic component according to claim 1, further comprising an auxiliary electrode disposed in at least one of the first to fourth portions and disposed between ones of the plurality of via electrodes that are adjacent to each other in the first direction. The first to fourth cutout portions have shapes corresponding to the shape of the auxiliary electrode. The multilayer electronic component according to claim 6.

8. The multilayer electronic component according to claim 6, further comprising a first auxiliary electrode disposed in the first portion and disposed between ones of the plurality of via electrodes that are adjacent to each other in the first direction. The first auxiliary electrode includes a first connection portion exposed on a part of the third surface and a part of the fifth surface, a first extension portion extending from the first connection portion toward the third portion and having a dimension in the third direction smaller than that of the first connection portion, and a second extension portion extending from the first connection portion toward the fourth portion and having a dimension in the second direction smaller than that of the first connection portion.

9. The first and second internal electrodes are spaced apart from the third to sixth surfaces. The second internal electrode includes first and second cutout portions respectively disposed in the first and second portions. The first internal electrode includes third and fourth cutout portions respectively disposed in the third and fourth portions. The multilayer electronic component according to claim 1, further comprising an auxiliary electrode disposed in at least one of the first to fourth cutout portions and disposed between ones of the plurality of via electrodes that are adjacent to each other in the first direction.

10. The laminated electronic component according to claim 1, wherein two of the connecting electrodes adjacent to each other in the first direction are arranged so as to be displaced from each other in a direction perpendicular to the first direction.

11. The main body includes a capacitance forming portion in which the first and second internal electrodes are alternately arranged in the first direction with the dielectric layer therebetween, and cover portions arranged on both surfaces of the capacitance forming portion facing the first direction. The laminated electronic component according to claim 1, further including a contact electrode disposed in at least one of the first to fourth portions, penetrating the cover portion, and connecting a first internal electrode disposed on the outermost periphery with reference to the first direction and a first or second external electrode to each other, or connecting a second internal electrode disposed on the outermost periphery with reference to the first direction and a third or fourth external electrode to each other.

12. The contact electrode includes a plurality of through electrodes laminated in the first direction. The laminated electronic component according to claim 11, wherein two of the plurality of through electrodes adjacent to each other are arranged so as to be displaced from each other in a direction perpendicular to the first direction.

13. The first to fourth external electrodes are respectively arranged on the first surface and the second surface. The laminated electronic component according to claim 11, wherein the first to fourth external electrodes arranged on the first surface are separated from the first to fourth external electrodes arranged on the second surface.

14. The laminated electronic component according to claim 11, wherein the first to fourth external electrodes are arranged on either one of the first surface and the second surface and not arranged on the other surface.

15. When the maximum dimensions of the laminated electronic component in the first to third directions are T, L, and W respectively. The laminated electronic component according to claim 1, wherein T / L and T / W each satisfy 0.6 or less.

16. Including a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in the second direction, connected to the first surface and the second surface, a fifth surface and a sixth surface facing each other in the third direction, connected to the first surface to the fourth surface, and divided into first to fourth portions. A first dielectric layer, a first internal electrode disposed on the first dielectric layer, and a first internal electrode layer including a third and a fourth auxiliary electrode disposed on the first dielectric layer, separated from the first internal electrode, and disposed in the third and fourth portions respectively. a second dielectric layer, a second internal electrode disposed on the second dielectric layer, and a second internal electrode layer including first and second auxiliary electrodes disposed on the second dielectric layer, spaced apart from the second internal electrode, and disposed on the first and second portions, respectively, a body in which the first and second internal electrode layers are alternately arranged in the first direction, first and second external electrodes disposed on the first and second portions, respectively, and connected to the first internal electrode, third and fourth external electrodes disposed on the third and fourth portions, respectively, and connected to the second internal electrode, a first via electrode disposed in the first portion, penetrating the first dielectric layer, and connecting the first internal electrode and the first auxiliary electrode, a second via electrode disposed in the first portion, penetrating the second dielectric layer, and connecting the first internal electrode and the first auxiliary electrode, the first to fourth portions divide the body into two equal parts in the second and third directions, respectively, the first portion includes a corner where the third and fifth surfaces are in contact, the second portion includes a corner where the fourth and sixth surfaces are in contact, the third portion includes a corner where the fourth and fifth surfaces are in contact, and the fourth portion includes a corner where the third and sixth surfaces are in contact, a multilayer electronic component, wherein the first via electrode and the second via electrode are arranged to be displaced from each other in a direction perpendicular to the first direction.

17. The multilayer electronic component according to claim 16, wherein the first and second via electrodes do not overlap each other in the first direction.

18. a plurality of the first via electrodes penetrating the same first dielectric layer are arranged, and a plurality of the second via electrodes penetrating the same second dielectric layer are arranged, the first via electrodes penetrating the same first dielectric layer are arranged in the second and third directions, and the second via electrodes penetrating the same second dielectric layer are arranged in the second and third directions, the multilayer electronic component according to claim 16.

19. the first dielectric layer includes a first region disposed between two first via electrodes adjacent to each other in the second or third direction among the plurality of the first via electrodes, the plurality of the second via electrodes overlap the first region in the first direction, the multilayer electronic component according to claim 18.

20. The first internal electrode includes a first main portion that overlaps the second internal electrode in the first direction, a first lead portion that extends from the first main portion and does not overlap the second internal electrode and is exposed on at least one of the third surface and the fifth surface, and a second lead portion that extends from the first main portion and does not overlap the second internal electrode and is exposed on at least one of the fourth surface and the sixth surface. The second internal electrode includes a second main portion that overlaps the first internal electrode in the first direction, a third lead portion that extends from the second main portion and does not overlap the first internal electrode and is exposed on at least one of the fourth surface and the fifth surface, and a fourth lead portion that extends from the second main portion and does not overlap the first internal electrode and is exposed on at least one of the third surface and the sixth surface. The multilayer electronic component according to claim 16.

21. The second internal electrode includes first and second cutout portions respectively disposed in the first and second portions. The first internal electrode includes third and fourth cutout portions respectively disposed in the third and fourth portions. The multilayer electronic component according to claim 16.

22. The first to fourth cutout portions each have a shape corresponding to the shape of the first to fourth auxiliary electrodes. The multilayer electronic component according to claim 21.

23. The first auxiliary electrode includes a first connection portion exposed on a part of the third surface and a part of the fifth surface, a first extension portion extending from the first connection portion toward the third portion and having a dimension in the third direction smaller than that of the first connection portion, and a second extension portion extending from the first connection portion toward the fourth portion and having a dimension in the second direction smaller than that of the first connection portion. The multilayer electronic component according to claim 21.

24. The first and second internal electrodes are spaced apart from the third to sixth surfaces. The second internal electrode includes first and second cutout portions respectively disposed in the first and second portions. The first internal electrode includes third and fourth cutout portions respectively disposed in the third and fourth portions. The first to fourth auxiliary electrodes are respectively disposed in the first to fourth cutout portions. The multilayer electronic component according to claim 16.

25. The main body includes a capacitance forming portion in which the first and second internal electrodes are alternately arranged in the first direction with the first or second dielectric layer interposed therebetween, and cover portions disposed on both surfaces of the capacitance forming portion facing each other in the first direction. The laminated electronic component according to claim 16, further comprising a first contact structure that is disposed in the first portion, penetrates the cover portion, and connects a first internal electrode or a first auxiliary electrode disposed on the outermost periphery with reference to the first direction and the first external electrode.

26. The first to fourth external electrodes are respectively disposed on the first surface and the second surface. The laminated electronic component according to claim 25, wherein the first to fourth external electrodes disposed on the first surface are separated from the first to fourth external electrodes disposed on the second surface.

27. The laminated electronic component according to claim 25, wherein the first to fourth external electrodes are disposed on one of the first surface and the second surface and are not disposed on the other surface.

28. When the maximum dimensions of the laminated electronic component in the first to third directions are T, L, and W, respectively, the laminated electronic component according to claim 16, wherein T / L and T / W each satisfy 0.6 or less.

29. A third via electrode that is disposed in the second portion, penetrates the first dielectric layer, and connects the first internal electrode and the second auxiliary electrode. A fourth via electrode that is disposed in the second portion, penetrates the second dielectric layer, and connects the first internal electrode and the second auxiliary electrode. A fifth via electrode that is disposed in the third portion, penetrates the first dielectric layer, and connects the second internal electrode and the third auxiliary electrode. A sixth via electrode that is disposed in the third portion, penetrates the second dielectric layer, and connects the second internal electrode and the third auxiliary electrode. A seventh via electrode that is disposed in the fourth portion, penetrates the first dielectric layer, and connects the second internal electrode and the fourth auxiliary electrode, and further comprising an eighth via electrode that is disposed in the fourth portion, penetrates the second dielectric layer, and connects the second internal electrode and the fourth auxiliary electrode. The third via electrode and the fourth via electrode are disposed so as to be offset from each other in a direction perpendicular to the first direction. The fifth via electrode and the sixth via electrode are disposed so as to be offset from each other in a direction perpendicular to the first direction. The laminated electronic component according to claim 16, wherein the seventh via electrode and the eighth via electrode are disposed so as to be offset from each other in a direction perpendicular to the first direction.

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