Wiring body and antenna

Abstract

To provide a wiring body and an antenna in which adhesion of a conductor pattern to a member supporting the conductor pattern is high and a transmission loss can be reduced.SOLUTION: A conductor pattern 3 is embedded in an adhesive layer 2, so that the adhesion of the conductor pattern 3 to a member (a substrate 1 and the adhesive layer 2) that supports the conductor pattern 3 can be increased. A first surface 3a is a surface embedded in the adhesive layer 2 on the substrate 1 side. A second surface 3b is a surface exposed from the adhesive layer 2 on the opposite side to the substrate 1. A surface roughness of the first surface 3a is smaller than a surface roughness of the second surface 3b. Therefore, a transmission loss of the conductor pattern can be reduced. As described above, the adhesion of the conductor pattern to the member supporting the conductor pattern is high, and the transmission loss can be reduced.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a wiring body and an antenna. [Background technology]

[0002] Conventionally, a wiring body having a conductor pattern on a substrate has been known (for example, Patent Document 1). This wiring body includes a substrate, an adhesive layer disposed on the substrate, and a conductor pattern embedded in the adhesive layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2021-501445 Summary of the Invention [Problem to be solved by the invention]

[0004] In the wiring body as described above, it has been desired to reduce transmission loss of signals flowing through the conductor pattern while ensuring adhesion of the conductor pattern to a member that supports the conductor pattern.

[0005] Therefore, an object of the present disclosure is to provide a wiring body and an antenna that enable a conductor pattern to have high adhesion to a member that supports the conductor pattern and that can reduce transmission loss. [Means for solving the problem]

[0006] A wiring body according to one aspect of the present disclosure comprises a substrate, an adhesive layer disposed on the substrate, and a conductor pattern embedded in the adhesive layer, wherein the surface roughness of a first surface of the conductor pattern on the substrate side is smaller than the surface roughness of a second surface on the opposite side to the substrate.

[0007] An antenna according to one aspect of the present disclosure includes the wiring body described above, and the conductor pattern is a radiation conductor. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, it is possible to provide a wiring body and an antenna that have high adhesion between a conductor pattern and a member that supports the conductor pattern, and that can reduce transmission loss. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic perspective view showing a wiring body according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is an enlarged cross-sectional view of a portion of a cross-sectional view of a conductor pattern. [Figure 4] FIG. 1 is a schematic perspective view of an antenna including a wiring body. [Figure 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.

[0011] FIG. 1 is a schematic perspective view showing a wiring body 100 according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1. As shown in FIGS. 1 and 2, the wiring body 100 includes a substrate 1, an adhesive layer 2, a conductor pattern 3, and a ground conductor 15. In the following description, an XYZ coordinate system may be used. The Y-axis direction is perpendicular to the X-axis direction. The Z-axis direction is perpendicular to the X-axis and Y-axis directions. The X-axis and Y-axis directions are planar directions along which the substrate 1 extends. The Z-axis direction is the thickness direction of the substrate 1.

[0012] The wiring body 100 shown in FIG. 1 has conductor patterns 3A, 3B, and 3C. The conductor pattern 3A is a linear pattern extending in the Y-axis direction. The conductor patterns 3B and 3C are planar patterns arranged on both sides of the conductor pattern 3A in the X-axis direction. The conductor pattern 3B is arranged at a position spaced apart from the conductor pattern 3A toward the negative side in the X-axis direction. The conductor pattern 3C is arranged at a position spaced apart from the conductor pattern 3A toward the positive side in the X-axis direction. As a result, a gap GP1 extending in the Y-axis direction is formed between the conductor patterns 3A and 3B. A gap GP2 extending in the Y-axis direction is formed between the conductor patterns 3A and 3C. In this configuration, the conductor pattern 3A is used as a transmission line for transmitting electrical signals. The conductor patterns 3B and 3C are used as ground patterns. In the following description, when the term "conductor pattern 3" is simply used, it is assumed that the term applies to any of the conductor patterns 3A, 3B, and 3C.

[0013] The wiring body 100 having the above-described conductor patterns 3A, 3B, and 3C may be used as the transmission section of the antenna 200. The conductor pattern 3A may be used to transmit high-frequency signals. Additionally, the wiring body 100 may be used as the transmission section of a filter, a branching filter, or the like.

[0014] The substrate 1 is a member that serves as the base of the wiring body 100. The substrate 1 is a plate-like member extending parallel to the XY plane. The substrate 1 has a surface 1a on the positive side in the Z-axis direction and a surface 1b on the negative side in the Z-axis direction (see FIG. 2). The substrate 1 supports an adhesive layer 2 and conductive patterns 3A, 3B, and 3C on the surface 1a (see FIG. 2). The thickness of the substrate 1, i.e., the dimension in the Z-axis direction, is not particularly limited, but may be set to, for example, 25 μm or more and 1.0 mm or less. Although the substrate 1 is a plate-like member extending parallel to the XY plane, it may also be a sheet-like member, or may be arranged in layers when applied to a multilayer substrate.

[0015] The material of the substrate 1 is not particularly limited, but the substrate 1 may be made of an inorganic material or an organic material. As the substrate 1 made of an inorganic material, for example, a ceramic substrate, a glass substrate, a silicon substrate, an enamel substrate, etc. may be used. As the ceramic substrate, LTCC (low temperature co-fired ceramics) may be used.

[0016] Examples of inorganic materials include ceramics {metal oxides (quartz, alumina or aluminum oxide, zirconia, sapphire, ferrite, titania or titanium oxide, zinc oxide, niobium oxide, mullite, beryllia, etc.), silicon oxides (silicon dioxide, etc.), metal nitrides (aluminum nitride, titanium nitride, etc.), silicon nitride, boron nitride, carbon nitride, metal carbides (titanium carbide, tungsten carbide, etc.), silicon carbide, boron carbide, metal borides (titanium boride, zirconium boride, etc.), metal composite oxides [metal titanates (titanium Examples of inorganic materials include metal salts (barium zirconate, strontium titanate, lead titanate, niobium titanate, calcium titanate, magnesium titanate, etc.), metal zirconates (barium zirconate, calcium zirconate, lead zirconate, etc.), glasses (soda glass, borosilicate glass, crown glass, barium-containing glass, strontium-containing glass, boron-containing glass, low-alkali glass, alkali-free glass, crystallized transparent glass, silica glass, quartz glass, heat-resistant glass, etc.), and silicons (semiconductor silicon, etc.). The inorganic material may be a composite material of these inorganic materials and a metal (for example, enamel, etc.).

[0017] When the substrate 1 is made of an organic material, for example, epoxy resin, bismaleimide resin, polyimide resin, LCP (liquid crystal polymer), PPE (polyphenylene ether), PEEK (polyether ether ketone), PEA (polyetheramine), PTFE (polytetrafluoroethylene), FEP (perfluoroethylene propene copolymer), ECTFE (ethylene chlorotrifluoroethylene copolymer), ETFE (ethylene tetrafluoroethylene), etc. may be used.

[0018] The ground conductor 15 is disposed on the surface 1b on the negative side in the Z-axis direction of the substrate 1. The ground conductor 15 is made of the same material as the conductor patterns 3A, 3B, and 3C.

[0019] As shown in FIG. 2, the adhesive layer 2 is a member for bonding the conductive pattern 3 to the substrate 1. The adhesive layer 2 is disposed on the surface 1a of the substrate 1. The adhesive layer 2 may be formed by disposing an adhesive sheet on the surface 1a of the substrate 1. The adhesive layer 2 has surfaces 2a and 2b that face each other in the Z-axis direction. Surface 2b is formed on the positive side of the adhesive layer 2 in the Z-axis direction. Surface 2a is formed on the negative side of the adhesive layer 2 in the Z-axis direction. Surface 2a on the negative side in the Z-axis direction becomes the bonding surface that comes into contact with the surface 1a of the substrate 1. The thickness of the adhesive layer 2, i.e., the dimension in the Z-axis direction, is not particularly limited as long as it is a dimension that allows the conductive pattern 3 to be embedded, but may be set to, for example, 1.0 μm or more and 50 μm or less.

[0020] The material of the adhesive layer 2 is not particularly limited, but may be made of a thermoplastic resin. Examples of the thermoplastic resin that may be used include polyethylene, polypropylene, polyvinyl chloride, polyurethane, polyamide, and acrylic resin. The material of the adhesive layer 2 is not limited to a thermoplastic resin, and a thermosetting resin may also be used.

[0021] The conductor patterns 3A, 3B, and 3C are arranged on the surface 2b side of the adhesive layer 2, which is on the positive side in the Z-axis direction. The conductor pattern 3A has a first surface 3a and a second surface 3b facing each other in the Z-axis direction, and side surfaces 3c and 3d facing each other in the X-axis direction. The first surface 3a is formed on the substrate 1 side of the conductor pattern 3A, i.e., on the negative side in the Z-axis direction. The second surface 3b is formed on the opposite side of the conductor pattern 3A from the substrate 1, i.e., on the positive side in the Z-axis direction. The side surfaces 3c and 3d connect the first surface 3a and the second surface 3b at both ends of the conductor pattern 3A in the X-axis direction. The side surface 3c is formed on the positive side of the conductor pattern 3A in the X-axis direction. The side surface 3d is formed on the negative side of the conductor pattern 3A in the X-axis direction. The conductor patterns 3B and 3C also have a first surface 3a, a second surface 3b, and side surfaces 3c and 3d.

[0022] In this specification, "facing" means that one surface and another surface overlap when viewed from one direction, and in this case, the one direction is the facing direction. In other words, facing not only refers to a state in which flat surfaces face each other in parallel, but also includes a state in which inclined surfaces overlap when viewed from one direction (for example, a pair of side surfaces 3c and 3d when viewed from the X-axis direction) and a state in which a flat surface and a curved surface overlap when viewed from one direction (for example, the second surface 3b and the first surface 3a when viewed from the Z-axis direction). Therefore, in this embodiment, the Z-axis direction in which the first surface 3a and the second surface 3b face each other corresponds to the "first direction" in the claims, and the X-axis direction in which the pair of side surfaces 3c and 3d face each other corresponds to the "second direction" in the claims.

[0023] The conductor patterns 3A, 3B, and 3C are embedded in the adhesive layer 2. When the conductor patterns 3A, 3B, and 3C are embedded in the adhesive layer 2, it is acceptable for the vicinity of the positive end of the conductor patterns 3A, 3B, and 3C in the Z-axis direction to be exposed or protrude from the surface 2b of the adhesive layer 2 on the positive side in the Z-axis direction. The amount by which the conductor patterns 3A, 3B, and 3C protrude from the surface 2b toward the positive side in the Z-axis direction is not particularly limited, as long as the adhesive layer 2 covers more than half of the area of ​​the side surfaces 3c and 3d in the Z-axis direction. Note that the second surfaces 3b of the conductor patterns 3A, 3B, and 3C may be embedded so that they are positioned on the negative side of the surface 2b of the adhesive layer 2 in the Z-axis direction. In this case, the second surfaces 3b of the conductor patterns 3A, 3B, and 3C may be at the same height as the surface 2b of the adhesive layer 2 in the Z-axis direction.

[0024] In the X-axis direction, the first surface 3a of the conductor pattern 3A has a first portion 22 in which the distance DS1 from the substrate 1 in the Z-axis direction increases from the central portion 20 to the peripheral portion 21 in the X-axis direction. Here, the distance DS1 near the peripheral portion 21 is greater than the distance DS1 at the central portion 20. The first portion 22 has a curved surface that curves toward the negative side in the Z-axis direction as it extends from the peripheral portion 21 toward the central portion 20. The first portion 22 is formed on both sides of the central portion 20 in the X-axis direction. However, it is sufficient that the first portion 22 is provided on at least one side of the central portion 20 in the X-axis direction. With this configuration, the thickness of the conductor pattern 3A in the Z-axis direction is thinner near the peripheral portion 21 than in the region on the central portion 20 side. In the figure, the first portion 22 is provided over the entire region between the central portion 20 and the peripheral portion 21, but it is sufficient that the first portion 22 is provided over at least a portion of this region. The conductor patterns 3B and 3C may also have the first portion 22, similar to the conductor pattern 3A.

[0025] The side surfaces 3c and 3d have second portions 23 in which the dimension DS2 of the conductor pattern 3A in the X-axis direction decreases with increasing distance from the substrate 1 in the Z-axis direction. The dimension DS2 near the first surface 3a on the negative side in the Z-axis direction is larger than the dimension DS2 near the second surface 3b on the positive side in the Z-axis direction. The second portions 23 have surfaces that slope toward the center in the X-axis direction as they extend from the first surface 3a toward the positive side in the Z-axis direction. The second portions 23 are formed on the side surfaces 3c and 3d on both sides in the X-axis direction. However, the second portions 23 only need to be provided on at least one side of the side surfaces 3c and 3d. With this configuration, the width of the conductor pattern 3A in the X-axis direction is narrower near the second surface 3b than in the region on the first surface 3a. In the figure, the second portions 23 are provided over the entire region of the side surfaces 3c and 3d, but they may be provided over at least a portion of these regions. The conductor patterns 3B and 3C may also have the second portion 23, similar to the conductor pattern 3A.

[0026] In the Z-axis direction, the thickness of the adhesive layer 2 located between the substrate 1 and the conductor patterns 3A, 3B, and 3C is equal to or greater than the thickness of the conductor patterns 3A, 3B, and 3C. The thickness of the conductor patterns 3A, 3B, and 3C is the dimension DS3 in the Z-axis direction at the thickest part. The thickness of the adhesive layer 2 located between the substrate 1 and the conductor patterns 3A, 3B, and 3C is the distance DS1 at the thinnest part of the above-mentioned distance DS1. The distance DS1 is equal to or greater than the dimension DS3.

[0027] Next, the surface roughness of the conductor pattern 3A will be described with reference to FIG. 3. FIG. 3 is an enlarged cross-sectional view of a portion of the conductor pattern 3A. While the conductor pattern 3A will be described here, the same configuration applies to the conductor patterns 3B and 3C. The second surface 3b of the conductor pattern 3A, facing away from the substrate 1, has a greater surface roughness than the other surfaces of the conductor pattern 3A. Therefore, the surface roughness of the first surface 3a of the conductor pattern 3A facing the substrate 1 is smaller than the surface roughness of the second surface 3b facing away from the substrate 1. The second surface 3b also has a greater surface roughness than the side surface 3c (3d). Here, the term "surface roughness" used in this specification refers to the arithmetic mean height Sa, one of the surface roughness parameters defined in ISO 25178, which is expressed as the average absolute value of the peak heights and valley depths on the measured surface. The surface roughness can be measured non-contact using, for example, a laser microscope. In this case, the surface roughness of the second surface 3b may be in the range of 0.2 μm to 5.0 μm, whereas the surface roughness of the other surfaces, i.e., the first surface 3a and the side surfaces 3c (3d), may be in the range of 0.001 μm to 0.2 μm.

[0028] As shown in Fig. 4, the structure of the wiring body 100 may be employed in a radiation portion that radiates radio waves in an antenna 200. As shown in Fig. 4, the antenna 200 includes the wiring body 100. The wiring body 100 includes a substrate 1, an adhesive layer 2, and a plurality of conductor patterns 3D. The conductor patterns 3D are radiating conductors 201 in the antenna 200. The conductor patterns 3D have a rectangular shape when viewed from the Z-axis direction. The conductor patterns 3D having such a shape are arranged in a lattice pattern on the adhesive layer 2. The radiating conductors 201 formed by these conductor patterns 3D function as patch conductors.

[0029] 5 is a cross-sectional view taken along line VV in FIG. 4. As shown in FIG. 5, the cross-sectional shape of the conductor pattern 3D when viewed from the Y-axis direction has the same configuration as the conductor pattern 3A shown in FIG. 2. Since the conductor pattern 3D has a rectangular shape, the cross-sectional shape of the conductor pattern 3D when viewed from the X-axis direction has the same configuration as the cross-sectional shape when viewed from the Y-axis direction. The ground conductor 15 is disposed on the surface 1b on the negative side in the Z-axis direction of the substrate 1. However, another substrate or the like may be disposed between the surface 1b and the ground conductor 15.

[0030] There are no particular limitations on the method for manufacturing the wiring body 100. For example, the conductive pattern 3 may be supported by a support, and the support may be removed after the conductive pattern 3 is embedded in the adhesive layer 2. In this case, when the support is removed, a difference in roughness occurs between the first surface 3a and the second surface 3b.

[0031] Next, the functions and effects of the wiring body 100 and the antenna 200 according to this embodiment will be described.

[0032] A wiring body according to one aspect of the present disclosure comprises a substrate 1, an adhesive layer 2 disposed on the substrate 1, and a conductor pattern 3 embedded in the adhesive layer 2, wherein the surface roughness of a first surface 3a of the conductor pattern 3 on the substrate 1 side is smaller than the surface roughness of a second surface 3b on the opposite side to the substrate 1.

[0033] The conductive pattern 3 is embedded in the adhesive layer 2, which improves adhesion of the conductive pattern 3 to the member (substrate 1 and adhesive layer 2) that supports the conductive pattern 3. The first surface 3a is the surface that is embedded in the adhesive layer 2 on the substrate 1 side. The second surface 3b is the surface that is exposed from the adhesive layer 2 on the opposite side of the substrate 1. The surface roughness of the first surface 3a is smaller than that of the second surface 3b. Here, when the conductive pattern 3 is directly patterned on the surface 1a of the substrate 1, a roughening treatment of the surface 1a is required. As a result, the surface roughness of the first surface 3a, which is the interface between the member (substrate 1) that supports the conductive pattern 3 and the conductive pattern 3, becomes large, resulting in increased transmission loss. In contrast, the wiring body 100 of this embodiment has a small surface roughness of the first surface 3a. A ground conductor 15 is disposed on the substrate 1 side of the conductive pattern 3. Therefore, the first surface 3a is the surface facing the ground conductor 15. The surface roughness of the first surface 3a, which is the facing surface, is smaller than that of the second surface 3b, which enables transmission loss to be reduced. The second surface 3b has a rougher surface than the first surface 3a, but is still less rough than when conventional roughening treatment is performed. Therefore, the overall transmission loss of the conductive pattern 3 can be reduced compared to conventional conductive patterns. As a result, the conductive pattern 3 has high adhesion to the member supporting the conductive pattern 3, reducing transmission loss.

[0034] The surface roughness of the second surface 3b may be greater than the surface roughness of the side surfaces 3c and 3d of the conductive pattern 3 connecting the first surface 3a and the second surface 3b. In this case, when another member is laminated on the conductive pattern 3, adhesion to the member can be ensured.

[0035] If the direction in which the first surface 3a and the second surface 3b face each other is defined as a first direction, and the direction in which a pair of side surfaces 3c, 3d of the conductive pattern 3 connecting the first surface 3a and the second surface 3b face each other is defined as a second direction, then in the second direction, the first surface 3a may have a first portion 22 in which the distance from the substrate 1 in the first direction increases from the central portion 20 toward the peripheral edge portion 21. In this case, the shape of the first portion 22 can increase the adhesion between the conductive pattern 3 and the adhesive layer 2.

[0036] If the direction in which the first surface 3a and the second surface 3b face each other is defined as a first direction, and the direction in which a pair of side surfaces 3c, 3d of the conductive pattern 3 connecting the first surface 3a and the second surface 3b face each other is defined as a second direction, the side surfaces 3c, 3d may have second portions 23 whose dimensions in the second direction of the conductive pattern 3 decrease with increasing distance from the substrate 1 in the first direction. In this case, the anchor effect of the second portions 23 on the adhesive layer 2 can increase the adhesion between the conductive pattern 3 and the adhesive layer 2.

[0037] The direction in which the first surface 3a and the second surface 3b face each other is defined as a first direction, and the thickness of the adhesive layer 2 located between the substrate 1 and the conductive pattern 3 in the first direction may be equal to or greater than the thickness of the conductive pattern 3. In this case, by ensuring a sufficient thickness of the adhesive layer 2, it is possible to ensure adhesion between the adhesive layer 2 and the substrate 1.

[0038] The substrate 1 may be made of an inorganic material. In this case, the dimensional accuracy of the component can be improved by suppressing shrinkage while ensuring adhesion between the adhesive layer 2 and the substrate 1. Furthermore, by using a material with a high Q value for the substrate 1, transmission loss can be reduced, especially when used in high-frequency applications.

[0039] The substrate 1 may be a glass substrate. In this case, the dimensional accuracy of the component can be improved by suppressing shrinkage while ensuring adhesion between the adhesive layer 2 and the substrate 1.

[0040] The substrate 1 may be made of an organic material, which ensures adhesion between the adhesive layer 2 and the substrate 1 while also being suitable for applications requiring a low dielectric constant.

[0041] The antenna 200 according to this embodiment includes the wiring body 100 described above, and the conductor pattern 3 is a radiation conductor 201.

[0042] According to the antenna 200, the radiation conductor 201 has high adhesion to the substrate 1, and transmission loss can be reduced.

[0043] The present disclosure is not limited to the above-described embodiments.

[0044] For example, the layer structure of the wiring body 100 is not limited to the above-described embodiment and may be modified as appropriate without departing from the spirit of the invention. For example, other layers may be added to the above-described embodiment. Furthermore, the shape, arrangement, and number of the conductor patterns are not limited to the above-described embodiment and may be modified as appropriate.

[0045] [Form 1] A substrate; an adhesive layer disposed on the substrate; a conductive pattern embedded in the adhesive layer, A wiring body, wherein the surface roughness of a first surface of the conductor pattern facing the substrate is smaller than the surface roughness of a second surface facing away from the substrate. [Form 2] The wiring body according to aspect 1, wherein the second surface has a surface roughness greater than a surface roughness of a side surface of the conductor pattern connecting the first surface and the second surface. [Form 3] When the direction in which the first surface and the second surface face each other is defined as a first direction, and the direction in which a pair of side surfaces of the conductor pattern connecting the first surface and the second surface face each other is defined as a second direction, A wiring body according to embodiment 1 or 2, wherein in the second direction, the first surface has a first portion in which the distance from the substrate in the first direction increases from the central portion toward the peripheral portion. [Form 4] When the direction in which the first surface and the second surface face each other is defined as a first direction, and the direction in which a pair of side surfaces of the conductor pattern connecting the first surface and the second surface face each other is defined as a second direction, A wiring body according to any one of the first to third embodiments, wherein the side surface has a second portion in which the dimension of the conductor pattern in the second direction decreases with increasing distance from the substrate in the first direction. [Form 5] A wiring body according to any one of embodiments 1 to 4, wherein the direction in which the first surface and the second surface face each other is defined as a first direction, and the thickness of the adhesive layer located between the substrate and the conductive pattern in the first direction is equal to or greater than the thickness of the conductive pattern. [Form 6] 6. The wiring body according to any one of aspects 1 to 5, wherein the substrate is made of an inorganic material. [Form 7] The wiring body according to aspect 6, wherein the substrate is a glass substrate. [Form 8] 8. The wiring body according to any one of aspects 1 to 7, wherein the substrate is made of an organic material. [Form 9] A wiring body according to any one of aspects 1 to 8, The antenna, wherein the conductor pattern is a radiating conductor. [Explanation of symbols]

[0046] 1...substrate, 2...adhesive layer, 3...conductor pattern, 3a...first surface, 3b...second surface, 3c, 3d...side surface, 20...central portion, 21...peripheral portion, 22...first portion, 23...second portion, 100...wiring body, 200...antenna.

Claims

1. A substrate; an adhesive layer disposed on the substrate; a conductive pattern embedded in the adhesive layer, A wiring body, wherein the surface roughness of a first surface of the conductor pattern facing the substrate is smaller than the surface roughness of a second surface facing away from the substrate.

2. The wiring body according to claim 1 , wherein the second surface has a surface roughness greater than a surface roughness of a side surface of the conductor pattern connecting the first surface and the second surface.

3. When a direction in which the first surface and the second surface face each other is defined as a first direction, and a direction in which a pair of side surfaces of the conductor pattern connecting the first surface and the second surface face each other is defined as a second direction, The wiring body according to claim 1 , wherein the first surface has a first portion in which the distance from the substrate in the first direction increases from the central portion toward the peripheral portion in the second direction.

4. When a direction in which the first surface and the second surface face each other is defined as a first direction, and a direction in which a pair of side surfaces of the conductor pattern connecting the first surface and the second surface face each other is defined as a second direction, The wiring body according to claim 1 , wherein the side surface has a second portion in which the dimension of the conductor pattern in the second direction decreases with increasing distance from the substrate in the first direction.

5. 2. The wiring body according to claim 1, wherein the direction in which the first surface and the second surface face each other is defined as a first direction, and in the first direction, the thickness of the adhesive layer located between the substrate and the conductor pattern is equal to or greater than the thickness of the conductor pattern.

6. The wiring body according to claim 1 , wherein the substrate is made of an inorganic material.

7. The wiring body according to claim 6 , wherein the substrate is a glass substrate.

8. The wiring body according to claim 1 , wherein the substrate is made of an organic material.

9. A wiring body according to any one of claims 1 to 8, The antenna, wherein the conductor pattern is a radiating conductor.

Images