Substrate fixing device

Abstract

To provide a substrate fixing device excellent in workability and cost reduction.SOLUTION: A substrate fixing device includes: a gripping part nipping a substrate; a curvature part that is subsequent to the gripping part and curved in order to avoid a groove of a container when inserting the gripping part into the container; a holding part that is subsequent to the gripping part; and a support part that is subsequent to the holding part, in which the gripping part grips the substrate and which can be fixed to a mounting surface in parallel. The gripping part includes a first protruding part, the supporting part includes a second protruding part protruding in the same direction as the first protruding part, and a third protruding part protruding in the opposite direction to the second protruding part. The first protruding part and the second protruding part support the substrate fixing device substantially parallel to the mounting surface, and the third protruding part and a top part of the curving part support the vertically inverted substrate fixing device substantially parallel to the mounting surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate holding device that grips and holds a substrate, and more particularly to a substrate holding device that is suitably used for immersing a substrate in a chemical agent for chemical processing such as substrate development or wet etching. [Background technology]

[0002] Devices such as semiconductor elements and spatial light modulators are produced by depositing other substances onto substrates made of various materials such as silicon (Si) or glass, or by creating masks using resist or other materials and etching the substrate to produce the desired device. When such devices are fabricated at the research stage, substrates of various sizes and shapes are processed. Therefore, when developing the resist, each exposed substrate is set on a substrate holder with tweezers, and is successively immersed in containers containing chemicals such as developing solution or rinse solution, and then removed from the holder with tweezers and dried with a blower. When performing such processing, a substrate holding device that grips and holds the substrate during processing is desired in order to improve work efficiency and reduce costs. 2. Description of the Related Art A soldering board holder described in Patent Document 1, for example, is known as a board fixing device that grips and fixes a board. The soldering board holder of Patent Document 1 is used for soldering the lead wires of an electronic component inserted from the front side of a through-hole board by protruding them from the back side of the through-hole board, and is equipped with a gripping member that grips the through-hole board, a fixing member that is fixed in a predetermined position, and a support mechanism that is interposed between the gripping member and the fixing member and supports the gripping member so that its position can be changed. For example, a clip is used as the gripping member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Utility Model Registration No. 3219502 Summary of the Invention [Problem to be solved by the invention]

[0004] The process of immersing a substrate in a solution for developing or wet etching the substrate and then drying the substrate has the following operational and cost problems. (1) Regarding work When using tweezers to grip and work on a circuit board, the following problems arise. A. Development involving fine structures requires strict time management, and there is a risk of missing the target when scooping it up with tweezers. If you miss the target, it takes extra time and reduces reproducibility. (i) There is a concern about the risk of damage to the board itself or the structure on the board if the board falls. (c) When using tweezers to scoop up a substrate from the developer or rinse solution, the substrate is not very stable, which raises safety concerns such as chemicals scattering or sticking to fingers.

[0005] (2) Cost Since containers for developing solutions and other liquids must also be made larger to accommodate the substrate holder, more chemicals will be used, which raises concerns about cost and safety. One way to reduce the amount of chemicals used is to create a dedicated holder that can be used for development in a spin developing machine or a petri dish, but if experiments at universities or laboratories use substrates of various sizes or the substrates used are non-standard (shapes other than the usual round or square), it is necessary to prepare a base for the chuck of the spin developing machine or a dedicated holder for development in a petri dish, which would be too costly.

[0006] An object of the present invention is to provide a substrate fixing device that is excellent in workability and cost reduction. [Means for solving the problem]

[0007] (1) An aspect of the present invention is a substrate fixing device that includes a gripping portion that clamps a substrate, a curved portion that is connected to the gripping portion and is curved to avoid the edge of a container when the gripping portion is inserted into the container, a handle portion that is connected to the curved portion, and a support portion that is connected to the handle portion, and that can fix the substrate with the gripping portion and approximately parallel to a placement surface, The gripping portion includes a first protruding portion, the support portion includes a second protruding portion that protrudes in the same direction as the first protruding portion, and a third protruding portion that protrudes in an opposite direction to the second protruding portion, the first protruding portion and the second protruding portion support the substrate fixing device substantially parallel to the mounting surface; The substrate holding device is configured so that the third protruding portion and the top of the curved portion support the upside-down substrate holding device substantially parallel to the placement surface.

[0008] (2) In the substrate holding device described in (1) above, the gripping portion may have a flat surface on which the substrate is placed and a sloped surface that is cut obliquely so that the tip forms an acute angle.

[0009] (3) In the substrate holding device described in (1) above, the shape of the curved portion may be an arc shape obtained by cutting a polygon in half, an arc shape, or an ellipse in half in the long axis direction.

[0010] (4) In the substrate fixing device described in any one of (1) to (3) above, the container may be a container for containing an agent for chemically treating the substrate, and may be used to chemically treat the substrate within the container. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a substrate fixing device that is excellent in workability and cost reduction. [Brief explanation of the drawings]

[0012] [Figure 1]1A and 1B are a plan view and a cross-sectional view taken along line XX' shown in the plan view, showing the configuration of a first embodiment of a substrate fixing device according to the present invention. [Figure 2] 2A and 2B are a plan view and a cross-sectional view taken along line XX' showing a state in which a substrate is fixed in the substrate fixing device of the first embodiment, and a cross-sectional view taken along line XX' showing a state in which a substrate is attached or detached. [Figure 3] FIG. 10 is an explanatory diagram showing a state in which a substrate is immersed in a petri dish containing a chemical by a substrate holding device. [Figure 4] (A) is a diagram showing the state in which the substrate holding device is positioned to scoop up the substrate, (B) is a diagram showing the state in which the substrate holding device has scooped up the substrate, and (C) is a diagram showing the state in which the substrate holding device has scooped up the substrate and fixed it. [Figure 5] FIG. 10 is a diagram showing a state in which the substrate fixing device, to which the substrate is fixed, is placed on a mounting surface in order to dry the substrate. [Figure 6] (A) is a diagram showing two support points and fulcrums of the substrate holding device when developing a substrate, and (B) is a diagram showing two support points and fulcrums of the substrate holding device when drying a substrate. [Figure 7] (A) and (B) are side views showing the configuration of a substrate fixing device according to a first and second modified example of this embodiment, respectively, and (C) and (D) are side views showing the configuration of a substrate fixing device according to a third and fourth modified example of this embodiment, respectively. [Figure 8] (A) and (B) are a partial plan view and a partial side view showing the state when a substrate is fixed in a substrate fixing device of a second embodiment of the substrate fixing device according to the present invention, and (C) is a partial side view showing the state when a substrate is attached or detached in the substrate fixing device of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. (First embodiment) 1A and 1B are a plan view and a cross-sectional view taken along line X-X' in the plan view, showing the configuration of a first embodiment of a substrate fixing device according to the present invention. 2A and 2B are a plan view and a cross-sectional view taken along line X-X', showing the state of the substrate fixing device of this embodiment when a substrate is fixed, and 2C is a cross-sectional view taken along line X-X', showing the state of the substrate fixing device of this embodiment when a substrate is attached or detached. The substrate fixing device 10 of this embodiment is used to chemically treat the substrate 20 with a chemical for development, etching, or the like in a container such as a petri dish or tray that contains the chemical, and then dry the substrate 20. The container is a container that holds the chemical for chemically treating the substrate 20, and is used to chemically treat the substrate 20 within the container. 1, the substrate holding device 10 includes a gripping portion 11A that holds the substrate 20, a curved portion 11B that avoids the edge of a container such as a petri dish that contains a chemical when the substrate 20 is immersed in the chemical, a handle portion 11C that is used to lift and move the substrate holding device 10, and a support portion 11D that supports the substrate holding device 10 when the substrate holding device 10 is placed on a mounting surface with the substrate 20 held between them. The gripping portion 11A, curved portion 11B, handle portion 11C, and support portion 11D are arranged in this order. The substrate holding device 10 can hold the substrate 20 with the holding portion 11A and fix the substrate 20 approximately parallel to the placement surface. The support portion 11D serves as a weight portion that prevents the substrate holding device 10 from tilting due to the weight of the substrate 20 when the substrate holding device 10 is placed on the placement surface. "Approximately parallel" refers to a state that can be considered parallel or substantially parallel.

[0014] The substrate holding device 10 includes a main body 11 extending from a gripping portion 11A to a support portion 11D. The gripping portion 11A of the substrate holding device 10 includes a protruding portion 12 (which serves as a first protruding portion), a butting portion 13, a moving portion 14, and a substrate pressing portion 15 on an end portion 11T of the main body 11. Furthermore, the substrate holding device 10 includes protruding portions 16 and 17 (which serve as a second and third protruding portion) on the support portion 11D, which are provided in opposite directions above and below the main body 11. The protruding portion 16 protrudes in the same direction as the protruding portion 12, and the protruding portion 17 protrudes in the opposite direction from the protruding portion 16. The protruding portions 16 and 17 function as weights to prevent the substrate holding device 10 from tilting due to the weight of the substrate 20 when the substrate holding device 10 is placed on a mounting surface. The moving part 14 passes through the protruding part 12 and is movable parallel to the end part 11T of the main body 11 at the grip part 11A.

[0015] (Gripping part 11A) As described above, the gripping portion 11A includes the protruding portion 12, the abutting portion 13, the moving portion 14, and the substrate pressing portion 15 on the end portion 11T of the main body 11. The operation of attaching, detaching and fixing the substrate in the gripping part 11A will be described with reference to (A) to (C) of FIG.

[0016] 2(C), when attaching or detaching the board 20, the board 20 is inserted between the end 11T of the main body 11 and the board pressing part 15 until the board 20 hits the abutment part 13. At this time, the moving part 14 is pulled toward the curved part 11B side of the end 11T (the right side of FIG. 2(C)), the end of the board pressing part 15 is in a floating state, and the board 20 can be inserted or removed between the end 11T of the main body 11 and the board pressing part 15.

[0017] 2A and 2B, when the substrate is fixed, the substrate is maintained inserted up to the abutment portion 13 between the end portion 11T of the main body 11 and the substrate pressing portion 15. When the moving portion 14 moves to the tip side of the end portion 11T (the left side of FIG. 2B) and the end portion of the substrate pressing portion 15 is pressed against the substrate 20, the substrate 20 is gripped and fixed between the end portion 11T of the main body 11 and the substrate pressing portion 15. The upper surface of the end 11T of the main body 11 functions as a stage for placing the substrate 20, and is cut obliquely to form a slope TS with an acute tip so that the substrate 20 can be stably scooped up when the substrate 20 is placed on the placement surface.

[0018] The substrate fixing device 10 has a gripping portion 11A at its tip, so that once the substrate 20 is gripped, the substrate 20 can be taken out, transported, developed, dried, and other processing steps performed in the same manner.

[0019] (Curved portion 11B) Curved portion 11B is provided to avoid the edge of a container such as a petri dish that holds a medicine. The shape of curved portion 11B is not particularly limited as long as it is curved to avoid the edge of the container, and for example, an arc shape formed by cutting a polygon in half, a U-shape, an arc shape, an ellipse cut in half in the long axis direction, etc. Here, an example of an arc shape formed by cutting a polygon in half is shown, which is an arc shape consisting of four sides formed by cutting an octagon in half. 3 is an explanatory diagram showing a state in which the substrate 20 is immersed in a petri dish 30 containing a chemical 40 by the substrate fixing device 10. The substrate fixing device 10 shown in FIG. 3 is in a state in which the substrate fixing device 10 shown in FIGS. 1 and 2 is turned upside down. In this way, the surface of the substrate 20 (the surface to be processed) can be oriented downward in the chemical 40.

[0020] In the curved portion 11B, the height H between the inner top P1 of the curved portion 11B and the lower surface of the protruding portion 12 is set to exceed the height of the edge of the Petri dish 30 so that the substrate holding device 10 will not hit the edge of the Petri dish 30 when the substrate 20 is immersed in the Petri dish 30. It is desirable that the height H be set with a margin relative to the height of the edge of the Petri dish 30 so that the substrate holding device 10 will not hit the edge of the Petri dish 30 even if the position where the substrate holding device 10 is placed is shifted.

[0021] 1, the slope BS of the curved portion 11B is arranged parallel to the extension of the slope TS of the end portion 11T. By arranging the slopes BS and TS in this manner, it becomes easier to maintain balance when scooping up the substrate 20. Fig. 4(A) is a diagram showing a state in which the substrate fixing device 10 is positioned to scoop up the substrate 20. Fig. 4(B) is a diagram showing a state in which the substrate fixing device 10 has scooped up the substrate 20. Fig. 4(C) is a diagram showing a state in which the substrate fixing device 10 has scooped up the substrate 20 and fixed the substrate 20.

[0022] 4(A), with the slopes BS and TS horizontal, the acute-angled tip of the end 11T is inserted between the substrate and the placement surface, and the substrate holding device 10 is pushed toward the substrate 20. At this time, since the slope BS is arranged parallel to the extension of the slope TS, the acute-angled tip of the end 11T does not wobble, making it easy to maintain balance when scooping up the substrate. 4(B), when the substrate fixing device 10 is pushed toward the substrate 20, the end of the substrate 20 is lifted, and the substrate 20 is inserted between the end 11T and the substrate pressing portion 15, and the substrate 20 is sandwiched between the end 11T and the substrate pressing portion 15. The upper surface of the end 11T, which serves as a stage on which the substrate 20 is placed, has a large area so that the substrate 20 will not fall even if the substrate 20 is not fixed by the end of the substrate pressing portion 15. When the moving part 14 is moved while the substrate 20 is sandwiched, as shown in (C) of Figure 4, the substrate 20 is gripped and fixed between the end part 11T and the substrate pressing part 15.

[0023] (Handle part 11C) The handle 11C is provided so that researchers and the like can carry the substrate holding device 10. By providing the handle 11C, it becomes possible to fix the substrate 20 to the substrate holding device 10 and lift and move the substrate 20 parallel to the floor surface.

[0024] (Support part 11D) As described above, the support portion 11D has the protruding portions 16 and 17 provided in opposite directions above and below the main body 11. 1, the outer end surface RS1 of the protruding portion 16 is disposed at approximately the same height as the outer end surface LS1 of the protruding portion 12 so as to be approximately parallel to an extension of the outer end surface LS1, and the protruding portions 16 and 12 support the substrate holding device 10 approximately parallel to the placement surface. As shown in FIG. 3, when the substrate 20 is immersed in the petri dish 30 containing the chemical 40 by the substrate holding device 10, the substrate 20 is disposed approximately parallel to the bottom surface of the petri dish 30. Since the protruding portion 12 is placed inside the dish 30, the outer end surface LS1 of the protruding portion 12 is located on the inner bottom surface of the dish 30. Therefore, in order to keep the substrate fixing device 10 approximately parallel to the placement surface, it is preferable to adjust the height of the protruding portion 12 or the protruding portion 16 so that the outer end surface LS1 of the protruding portion 12 is higher than the outer end surface RS1 of the protruding portion 16 by the thickness of the dish 30.

[0025] As shown in FIG. 5, the protruding portion 17 and the apex of the curved portion 11B support the upside-down substrate holding device 10 substantially parallel to the placement surface. The outer end P2 (which serves as the apex) of the curved portion 11B is located on an extension of the outer end surface RS2 of the protruding portion 17, allowing the substrate 20 to be stably placed substantially parallel to the placement surface when drying the substrate 20. Here, "being able to be placed stably" means that the device can stand on its own even when released and is unlikely to lose balance even when a blower is applied to the substrate 20. However, since the effect of the blower varies depending on its strength, the handle may be held down by hand to maintain balance. The apex of the curved portion 11B does not have to be the outer end P2, which is an arc-shaped outer end formed by cutting an octagon in half and has four sides. A convex portion may be provided on the outer end P2 to form the apex.

[0026] The protruding portions 16, 17 act as weights, and the weight of the protruding portions 16, 17 is set so that the substrate fixing device 10 does not tilt and the substrate 20 is positioned approximately parallel to the bottom surface and the placement surface of the dish 30, regardless of whether the substrate fixing device 10 is positioned as shown in Figure 3 or as shown in Figure 5.

[0027] When developing the substrate 20, the substrate fixing device 10 supports the outer end surfaces LS1 and RS1 as shown in FIG. 6(A), and when drying the substrate 20, the substrate fixing device 10 supports the outer end surface P2 and RS2 as shown in FIG. 6(B). In order for the substrate holding device 10 to be disposed substantially parallel to the bottom surface and the mounting surface of the Petri dish 30 without tilting, it is sufficient that the moment when the outer end surface LS1 and the outer end P2 are used as fulcrums is larger in the clockwise direction than in the counterclockwise direction. The clockwise moment when the outer end P2 is used as a fulcrum is smaller than the clockwise moment when the outer end surface LS1 is used as a fulcrum. Therefore, the weights of the protruding portions 16 and 17 should be set so that the clockwise moment when the outer end P2 is used as a fulcrum is larger than the counterclockwise moment. When the outer end P2 is used as a fulcrum, if the length from the outer end P2 to the end of the protruding portions 16, 17 is greater than the length from the outer end P2 to the end of the substrate 20, the weight of the handle portion 11C + support portion 11D can be adjusted so that the weight of the handle portion 11C + support portion 11D is heavier than the weight of the substrate 20 + gripping portion 11A.

[0028] The materials of the substrate fixing device 10 will be described below. The material of the substrate pressing portion 15 of the gripping portion 11A is preferably a material that is soft to some extent so as not to damage the substrate 20, and for example, plastic such as polyethylene (PE) can be used. The material of the substrate fixing device 10 other than the substrate pressing portion 15 is preferably a strong, hard material, and stainless steel, metal processed with a fluororesin, fluororesin PFA (perfluoroalkoxyalkane), or the like can be used.

[0029] The material of the substrate fixing device 10 is preferably resistant to acidic or basic chemicals and corrosion, etc. In particular, the material of the gripping part 11A is required to satisfy this condition because it is immersed in chemicals for development, etc.

[0030] (Variation) 7A and 7B are side views showing the configurations of substrate fixing devices according to first and second modified examples of this embodiment, respectively. 7C and 7D are side views showing the configurations of substrate fixing devices according to third and fourth modified examples of this embodiment, respectively.

[0031] 7A, the main body 11 is provided with a protruding portion 18, and when the substrate is immersed in the petri dish 30, the substrate holding device 10 holding the substrate is supported by the protruding portions 12, 16, and 18. By supporting the substrate holding device 10 at three points, the substrate holding device 10 can be supported more stably. 7(A), the protruding portion 16 of the support portion 11D does not have to be provided at the same position as the protruding portion 17, and may be shifted inward relative to the protruding portion 17. The protruding portion 17 and the main body 11 may be integrated together. In other words, the protruding portion 17 may be formed by bending an end portion of the main body 11.

[0032] 7(B), the protruding portion 17 of the support portion 11D may be shifted inward relative to the protruding portion 16. The protruding portion 16 and the main body 11 may be integrated together. In other words, the protruding portion 16 may be formed by bending the end of the main body 11.

[0033] The protruding portions 16 and 17 attached to the ends of the main body 11 may be detachable from the main body 11. As shown in Fig. 7(C), magnet protrusions 16A and 17A can be attached and detached by attaching them to the end of main body 11. Also, as shown in Fig. 7(D), columnar protrusion 16B with an open interior can be inserted into the end of main body 11 to make it detachable. By making protrusions 16A and 17A, or protrusion 16B detachable from main body 11, the weight of protrusions 16A and 17A, or protrusion 16B, can be changed to match the weight of the board.

[0034] According to the substrate holding device of the first embodiment and the modified example described above, it is possible to provide a substrate holding device that is excellent in workability and cost reduction, as will be described below. 1. Regarding the work A. The substrate can be stably and easily clamped and fixed, and processing such as development can be performed, making it easy to prevent damage to the substrate and manage development time. (i) The substrate is securely fixed in place by the gripping part, preventing the chemicals from scattering or sticking to fingers. 2. Cost A) Because the mechanism simply clamps the substrate in the gripping section, it can handle not only existing standard substrates but also substrates of various shapes and sizes. This single device can process all types of substrates, thereby reducing costs. Since development is carried out in a container such as a petri dish, the amount of chemicals used is small, making it possible to carry out accurate processing even in a local exhaust system or glove box. 3.Other It can be used not only for development but also for wet etching, making it a versatile device that can meet the needs of a variety of processes.

[0035] Furthermore, according to the substrate holding device of the first embodiment and the modified example, even if the device is inverted upside down, the substrate can be placed on the holding surface while being fixed substantially parallel to the holding surface. Also, when the substrate held by the holding part is placed in a container for chemical processing or the like, the substrate holding device can be placed avoiding the edge of the container.

[0036] (Second embodiment) Figures 8(A) and 8(B) are partial plan views and partial side views showing the state of the substrate fixing device of this embodiment when fixing a substrate, and Figure 8(C) is a partial side view showing the state of the substrate fixing device of this embodiment when attaching or detaching a substrate. In a substrate holding device 10A of this embodiment, the gripping portion 11A and the bending portion 11B of the substrate holding device 10 shown in FIG. 1 are replaced with a gripping portion 21A and a bending portion 21B. The gripping portion 21A has a clothespin structure, and the rotating portion 19 can rotate on the end portion 11T. As shown in Figures 8(A) and (B), when the worker does not apply force, the substrate 20 is gripped and fixed between the rotating portion 19, which is pushed by the force of the spring, and the end portion 11T. On the other hand, as shown in Figure 8(C), when the worker applies force, the spring contracts, opening the gap between the rotating portion 19 and the end portion 11T, making it possible to attach and detach the substrate 20. The height of the rotating portion 19 is set so that it is not higher than the height of the protruding portion 12B when in the fixed state shown in Figures 8(A) and (B). The shape of the curved portion 21B is a semicircular arc. By adopting such a shape, when the substrate holding device 10A having the substrate 20 fixed thereto is placed on a placement surface to dry the substrate 20, the area of ​​the curved portion 21B in contact with the placement surface increases, and the substrate holding device 10A can be stably placed on the placement surface. Note that the arc is a shape obtained by cutting out a portion of the circumference, and is not limited to a semicircular arc.

[0037] The substrate holding device 10A can be made of the same material as the substrate holding device 10. The portion where the rotating part 19 comes into contact with the substrate 20 is preferably made of a material that is somewhat soft so as not to damage the substrate 20, and plastic such as PE can be used. In this embodiment, the same effects as those of the first embodiment and the modified example can be obtained.

[0038] The embodiments described above are preferred embodiments of the present invention, but the scope of the present invention is not limited to the above-described embodiments and examples, and the present invention can be implemented in various modified forms within the scope that does not deviate from the gist of the present invention. For example, the gripping portion 11A and the bending portion 11B may be detachable. This allows the gripping portion 11A to be replaced when the gripping portion 11A deteriorates or when the gripping portion needs to be replaced to accommodate the size of the substrate. The bending portion 11B may also be detachable. This allows the bending portion 11B to be replaced to match the shape of the edge of the petri dish or tray when the petri dish or tray is replaced. [Explanation of symbols]

[0039] 10, 10A PCB fixing device 11 Main body 11A, 21A grip part 11B, 21B curved section 11C Handle part 11D Support part 12, 12B, 16, 16A, 16B, 17, 17A, 18 protruding parts 13 Stopping part 14 Moving section 15 Board pressing part 19 Rotating part 20 PCB 30 Petri dishes 40 Drugs

Claims

1. a substrate fixing device including a gripping portion for clamping a substrate, a curved portion connected to the gripping portion and curved to avoid the edge of a container when the gripping portion is inserted into the container, a handle portion connected to the curved portion, and a support portion connected to the handle portion, the substrate being fixed approximately parallel to a mounting surface by the gripping portion, the grip portion includes a first protruding portion, the support portion includes a second protruding portion that protrudes in the same direction as the first protruding portion, and a third protruding portion that protrudes in an opposite direction to the second protruding portion, the first protruding portion and the second protruding portion support the substrate fixing device substantially parallel to the mounting surface; The substrate holding device supports the upside-down substrate holding device approximately parallel to the placement surface by the third protruding portion and the top of the curved portion.

2. The substrate fixing device according to claim 1 , wherein the gripping portion has a flat surface on which the substrate is placed and a sloped surface that is beveled so that the tip forms an acute angle.

3. 2. The substrate fixing device according to claim 1, wherein the shape of the curved portion is an arc shape obtained by cutting a polygon in half, a U shape, a circular arc shape, or an ellipse cut in half in the long axis direction.

4. The substrate fixing device according to claim 1 , wherein the container is a container for containing an agent for chemically treating the substrate, and is used for chemically treating the substrate within the container.

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