Semiconductor manufacturing device, thrust-up unit, and manufacturing method of semiconductor manufacturing device

Abstract

To provide a new mechanism for driving a plurality of blocks of a thrust-up unit.SOLUTION: A thrust-up unit is provided with a mechanism unit for independently applying vertical movement to each of the plurality of blocks. The mechanism unit includes a first mechanism unit having: (a) a member having an upper surface, a lower surface opposite to the upper surface, and a through-hole penetrating between the upper surface and the lower surface; (b) a first rod connected to the upper surface of the member and transmitting the vertical movement of the member to the block; and (c) a second rod extending from below through the through-hole and transmitting the vertical movement to the block.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to semiconductor manufacturing equipment and is applicable to, for example, a die bonder having a push-up unit. [Background technology]

[0002] One step in the manufacturing process of a semiconductor device is a peeling process in which dies separated from a wafer are peeled off from the dicing tape. In this peeling process, for example, a push-up unit pushes up the dies from the backside of the dicing tape, and the dies are peeled off one by one from the dicing tape held by a wafer supply unit, and the dies are picked up using a suction nozzle such as a collet attached to a pickup head or bond head.

[0003] For example, a push-up unit moves multiple blocks up and down to peel off the dicing tape from the periphery of the die. Each block may be provided with a drive unit consisting of a motor and a plunger mechanism (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-224640 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present disclosure is to provide a new mechanism for driving a plurality of blocks of a thrust-up unit. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A brief summary of representative aspects of this disclosure is as follows. That is, the push-up unit includes a mechanism for independently applying vertical movement to each of a plurality of blocks. The mechanism includes a first mechanism including: (a) a member having an upper surface, a lower surface opposite the upper surface, and a through-hole penetrating between the upper surface and the lower surface; (b) a first rod connected to the upper surface of the member and transmitting the vertical movement of the member to the blocks; and (c) a second rod extending from below through the through-hole and transmitting the vertical movement to the blocks. [Effects of the Invention]

[0007] According to the present disclosure, for example, the number of thrust blocks can be increased. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic top view showing an example of the configuration of a die bonder according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view showing a main part of the wafer supply unit shown in FIG. [Figure 4] FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 5] FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 6] FIG. 6 is a front view of the push-up unit in the embodiment. [Figure 7] FIG. 7 is a diagram schematically illustrating the push-up unit shown in FIG. [Figure 8] FIG. 8 is a top view of the head portion shown in FIG. [Figure 9] 9 is a vertical cross-sectional view of the upper plate portion shown in FIG. [Figure 10] 10 is a cross-sectional view of the upper plate portion taken along line CC shown in FIG. [Figure 11] 11 is a cross-sectional view of the upper plate portion taken along line EE shown in FIG. [Figure 12] 12 is a vertical cross-sectional view of the lower block portion shown in FIG. [Figure 13] 13 is a cross-sectional view of the lower block portion taken along line FF shown in FIG. [Figure 14] FIG. 14 is a top view showing an example of the arrangement of the drive units shown in FIG. [Figure 15] FIG. 15 is a side view showing an example of the arrangement of the drive unit shown in FIG. [Figure 16] FIG. 16 is a diagram showing an example of the configuration of the drive unit shown in FIG. [Figure 17] FIG. 17 is a diagram showing another example of the configuration of the drive unit shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, in order to clarify the description, the width, thickness, shape, etc. of each part may be shown schematically compared to the actual embodiment. Furthermore, the dimensional relationships, ratios, etc. of each element between multiple drawings do not necessarily match.

[0010] The configuration of a die bonder, which is one embodiment of semiconductor manufacturing equipment, will be described with reference to Figures 1 to 3. Figure 1 is a schematic top view showing an example of the configuration of the die bonder in the embodiment. Figure 2 is a diagram explaining the schematic configuration as seen from the direction of arrow A in Figure 1. Figure 3 is a schematic cross-sectional view showing the main parts of the wafer supply unit shown in Figure 1.

[0011] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-to-rear direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-to-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0012] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holder 12, a push-up unit 13, and a wafer recognition camera 14.

[0013] A wafer cassette lifter 11 moves a wafer cassette (not shown), which stores multiple wafer rings WR, up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0014] The wafer holder 12 has an expand ring 121 that holds the wafer ring WR, and a support ring 122 that is held by the wafer ring WR and horizontally positions the dicing tape DT. The push-up unit 13 is disposed inside the support ring 122.

[0015] A wafer W is adhered (attached) onto a dicing tape DT, and the wafer W is divided into multiple dies D. The dicing tape DT is transparent to visible light. A film-like adhesive material DF called a die attach film (DAF) is attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0016] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by a drive unit (not shown), and moves the die D to be picked up to the position of the push-up unit 13. The wafer holder 12 also rotates the wafer ring WR in the XY plane by a drive unit (not shown). The push-up unit 13 moves in the vertical direction by a drive unit (not shown). The push-up unit 13 peels the die D from the dicing tape DT. The wafer holder 12 and the push-up unit 13 form a pickup device. The pickup device may include a pickup unit 20.

[0017] When the die D is pushed up, the wafer holder 12 lowers the expand ring 121 holding the wafer ring WR. At this time, the support ring 122 does not descend, so the dicing tape DT held by the wafer ring WR is stretched, widening the gap between the dies D, preventing interference and contact between the dies D and making it easier for the individual dies to separate and be pushed up. The expand ring 121 and support ring 122 are collectively called the expander. The push-up unit 13 pushes up the die D from below, accelerating the separation of the die D and improving the pick-up ability of the die D by the collet.

[0018] The wafer recognition camera 14 recognizes the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0019] The pickup unit 20 has a pickup head 21 and a Y drive unit 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has various drive units (not shown) that raise and lower, rotate, and move the pickup head 21 in the X direction.

[0020] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed and a pickup stage on which the die D is picked up.

[0021] The bonding unit 40 includes a bond head 41, a Y-axis drive unit 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds a die D at its tip. The Y-axis drive unit 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) on the substrate S to recognize the bond position. The substrate S has multiple product areas (hereinafter referred to as package areas P) that will ultimately become a single package. A position recognition mark is provided for each package area P. The bond stage 46 is raised when the die D is placed on the substrate S and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-suctioning the substrate S, allowing the substrate S to be fixed in place. The bond stage 46 also has a heating unit (not shown) for heating the substrate S. The bonding section 40 has driving sections (not shown) for raising and lowering, rotating and moving the bond head 41 in the X direction.

[0022] With this configuration, the bond head 41 corrects the pickup position and posture based on the image data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the image data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die that has already been bonded onto the package area P of the substrate S.

[0023] The transport unit 50 has transport claws 51 that grip and transport the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X direction by driving a nut (not shown) of the transport claws 51 provided on the transport lane 52 with a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 70 and hands the substrate S over to the substrate unloading unit 70.

[0024] The substrate supply unit 60 removes the substrate S, which has been stored in a transport jig and carried in, from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S, which has been carried in by the transport unit 50, in the transport jig.

[0025] Next, the control unit 80 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in Fig. 1.

[0026] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, an optical system 88, etc. The control unit 80 broadly includes a control and arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, etc. required for control.

[0027] The input / output device 83 includes a monitor 83a that displays the device status and other information, a touch panel 83b that inputs operator instructions, a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from the optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the XY table (not shown) of the wafer supply unit 10, the ZY drive axis of the bond head table, and the drive unit of the push-up unit 13. The I / O signal control device 83f captures or controls signals from a signal unit 87 that includes switches and volumes that control the brightness of various sensors and lighting devices. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44. The control / arithmetic unit 81 captures and calculates necessary data via the bus line 84, controls the pickup head 21, and sends information to the monitor 83a.

[0028] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0029] (Wafer loading process: process S1) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12.

[0030] (Substrate loading process: Process S2) The transport jig storing the substrate S is supplied to the substrate supply unit 60. In the substrate supply unit 60, the substrate S is taken out of the transport jig and fixed to the transport claws 51.

[0031] (Pickup process: process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by the photograph. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the wafer holder 12 as the initial setting for the device. The image data is processed to inspect the surface of the die D.

[0032] The positioned die D is peeled off from the dicing tape DT by the push-up unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0033] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0034] After transporting the die D to the intermediate stage 31, the pickup head 21 is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the dies D are peeled off one by one from the dicing tape DT following the same procedure.

[0035] (Bond process: Process S4) The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and the positioning and surface inspection of the substrate S are performed based on the image data acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device. The image data is processed to perform surface inspection of the substrate S.

[0036] The suction position of the bond head 41 is corrected based on the deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41, which has suctioned the die D from the intermediate stage 31, bonds the die D to a predetermined location on the substrate S supported by the bond stage 46. Here, the predetermined location on the substrate S is the package area P of the substrate S, or an area on which an element is already placed and an element is to be bonded in addition to that, or a bonding area for an element to be stacked and bonded. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data obtained by photographing to determine whether the die D has been bonded in the desired location, etc.

[0037] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to all the package areas P of the substrate S.

[0038] (Substrate unloading process: Process S5) The substrate S with the die D bonded thereto is transported to the substrate unloading section 70. At the substrate unloading section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is unloaded from the die bonder 1.

[0039] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0040] Next, an overview of the push-up unit 13 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a front view of the push-up unit in this embodiment. Fig. 7 is a diagram schematically showing the push-up unit shown in Fig. 6.

[0041] As shown in FIG. 6, the push-up unit 13 includes a head section 100, a mechanism section 200, and a drive section 300. As shown in FIG. 7, the head section 100 includes a push-up block section BLK having a plurality of blocks B1 to B8. The mechanism section 200 drives the blocks B1 to B8 in the vertical direction. The mechanism section 200 includes an upper plate section 210 serving as a first or second mechanism section, and a lower block section 220 serving as a first or second mechanism section. The drive section 300 generates vertical movement and transmits it to the lower block section 220. The lower block section 220 transmits the vertical movement generated by the drive section 300 to the upper plate section 210. The upper plate section 210 transmits the vertical movement generated by the lower block section 220 to the head section 100.

[0042] The mechanism unit 200 may be composed of an upper plate unit 210 and a drive unit 300. In this case, the drive unit 300 generates up and down movement and transmits it to the upper plate unit 210. The upper plate unit 210 transmits the up and down movement generated by the drive unit 300 to the head unit 100. The mechanism unit 200 may be composed of a lower block unit 220 and a drive unit 300. In this case, the drive unit 300 generates up and down movement and transmits it to the lower block unit 220. The lower block unit 220 transmits the up and down movement generated by the drive unit 300 to the head unit 100.

[0043] As shown in Fig. 7, blocks B1 to B8 can move up and down independently using drive shafts ND1 to ND8 of mechanism unit 200 and drive unit 300. Each of drive shafts ND1 to ND8 is composed of a motor M (see Fig. 16) described below and a plunger mechanism that converts the rotation of motor M into up and down movement, and applies up and down movement to blocks B1 to B8. The plunger mechanism is composed of upper plate unit 210, lower block unit 220, and drive unit 300 excluding motor M.

[0044] The head unit 100 will be described with reference to Figures 6 and 8. Figure 8 is a top view of the head unit shown in Figure 6.

[0045] As shown in FIG. 8, the head unit 100 includes a dome 110 and a push-up block unit BLK provided within the dome 110. The dome 110 is composed of a cylindrical member 111, a disk-shaped member 112 provided at the upper end of the cylindrical member 111, and a cylindrical member 113. An opening is provided in the center of the disk-shaped member 112, through which the push-up block unit BLK can move up and down. The peripheral portion of the disk-shaped member 112 is provided with multiple suction ports 112a and multiple grooves 112b connecting the multiple suction ports 112a. The interior of the suction ports 112a is depressurized by a suction mechanism (not shown) when the push-up unit 13 is raised and its upper surface contacts the backside of the dicing tape DT. At this time, the backside of the dicing tape DT is sucked downward and comes into close contact with the upper surface of the dome 110 (disk-shaped member 112). As shown in FIG. 6, the annular member 114 is provided on the outside of the cylindrical member 113. The dome 110 is fixed to the upper plate portion 210 by an annular member 114 .

[0046] The blocks B1 to B8 of the push-up block unit BLK push the dicing tape DT upward. The seven outer blocks B1 to B7 are hollow columns (e.g., rectangular cylinders) with openings that penetrate in the Z1-Z2 direction and have the same shape as the outer shapes of the blocks inside them. The innermost block B8 is solid and cylindrical (e.g., rectangular prism). Block B2 is placed inside the largest block B1, block B3 is placed inside block B2, and block B4 is placed inside block B3. Block B5 is placed inside block B4, block B6 is placed inside block B5, block B7 is placed inside block B6, and the smallest block B8 is placed inside that.

[0047] Of the eight blocks B1 to B8, the outermost block B1, which is the largest in size, is preferably slightly smaller than the outer periphery of the die D to be peeled. This positions the outer corner of the top surface of block B1 slightly inside the outer edge of the die D, allowing the force to peel the die D and dicing tape DT to be concentrated at the point (the outermost periphery of die D) that serves as the starting point for peeling them. Here, the outer periphery of die D protruding outward from the end of the outermost block B1 is called an overhang (OH).

[0048] The upper plate portion 210 of the mechanism portion 200 will be described with reference to Fig. 9 to Fig. 11. Fig. 9 is a vertical cross-sectional view of the upper plate portion shown in Fig. 6. Fig. 10 is a horizontal cross-sectional view of the upper plate portion shown in Fig. 9 taken along line CC. Fig. 11 is a horizontal cross-sectional view of the upper plate portion shown in Fig. 9 taken along line EE.

[0049] As shown in Fig. 9, the upper plate portion 210 includes an upper rod UR, an upper plate UP, and a dome that covers the upper rod UR and the upper plate UP. This dome is composed of a cylindrical member 211 and a disk-shaped member 212 attached to the upper end of the cylindrical member 211. An annular member 213 is attached to the outside of the cylindrical member 211. The cylindrical member 211 is fixed to the lower block portion 220 by the annular member 213. An opening 212a is provided in the center of the disk-shaped member 212, and the upper rod UR can move up and down through this opening 212a. The upper rod UR includes rods UR1 to UR7. The upper plate UP includes plates UP1 to UP7.

[0050] Each of the rods UR1 to UR7 is provided on the upper surface of the corresponding plate UP1 to UP7 and extends in the Z direction. One end of the rods UR1 to UR7 is fixed to the plate UP1 to UP7, and the other end is fixed to the blocks B1 to B7. It is preferable to use the topmost plate UP1 as the outermost block B1. This allows the rod UR1, which is the shortest, most rigid pin, to be thrust up the outer block B1, which has a large outer shape and requires rigidity, as a plunger.

[0051] As shown in FIG. 10, four rods UR1 are provided and three each of rods UR2 to UR7 are provided. This allows block B1 to be supported at four points and blocks B2 to B7 to be supported at three points, thereby increasing the rigidity between block portion BLK and upper plate UP and improving parallelism during lifting and lowering. Three or more each of rods UR1 to UR7 may be provided. The multiple rods that make up rod UR1 are preferably arranged concentrically and at equal intervals. The multiple rods that make up each of rods UR2 to UR7 are also preferably arranged concentrically and at equal intervals. This further improves the parallelism of blocks B1 to B7 during lifting and lowering. Rods UR1 to UR7 transmit the up and down movement of plates UP1 to UP7 to blocks B1 to B7.

[0052] The mechanism section 200 has a rod LR8 that passes through the upper plate section 210. One end of the rod LR8 is fixed to a block LB8 of the lower block LB (described later), and the other end is fixed to a block B8 of the block section BLK. Only one rod LR8 is provided. It is preferable that the diameter of the rod LR8 be larger than the diameters of the rods UR1 to UR7.

[0053] The plates UP1 to UP7 are arranged vertically (in the Z direction) at predetermined intervals. The plates UP1 to UP7 are disk-shaped members. Furthermore, the plates UP1 to UP7 are provided with a clearance on the inner wall of the dome (cylindrical member 211) that allows for movement. This configuration allows many rods to be arranged while maintaining parallelism and perpendicularity during movement. The number of plates in the upper plate UP is one less than the number of blocks in the block unit BLK, but it may be the same number (eight). However, by pushing up the innermost block B8 as it is (without using a plate) with the rod LR8, the innermost block B8 has a small outer shape and is easy to maintain parallelism, simplifying the mechanism.

[0054] The plates UP1 to UP6 each have through holes PTH through which rods UR2 to UR7 pass, which are connected to the plates UP2 to UP7 below. The plates UP2 to UP7 also have through holes PTH through which rods LR1 to LR6 pass, which are connected to blocks LB1 to LB7 (described later) for connecting to the plates UP1 to UP6 above. The plates UP1 to UP7 also have a through hole PTH through which rod LR8 passes. The through holes PTH and the rods UR2 to UR7 and LR8 preferably have the same shape in top view, with clearance provided to allow for drive. The through holes PTH and the rods UR2 to UR7 and LR8 do not necessarily have to have the same shape. This allows the link mechanism that transmits multiple driving forces from the lower block portion 220 to the push-up block portion BLK to be housed within the dome.

[0055] The lower block portion 220 of the mechanism portion 200 will be described with reference to Figures 6, 12, and 13. Figure 12 is a vertical cross-sectional view of the lower block portion shown in Figure 6. Figure 13 is a horizontal cross-sectional view of the lower block portion shown in Figure 12 taken along line FF.

[0056] 12, the lower block part 220 includes a lower rod LR, a lower block LB, and a housing that covers the lower rod LR and the lower block LB. This housing is made up of members 221 provided on both sides and the back. The lower rod LR includes rods LR1 to LR8. The lower block LB includes blocks LB1 to LB8.

[0057] Each of the rods LR1 to LR8 is provided on the upper surface of the corresponding block LB1 to LB8 and extends in the Z direction. One end of each of the rods LR1 to LR8 is fixed to the block LB1 to LB8, and the other end of each of the rods LR1 to LR7 is fixed to the plates UP1 to UP7. The other end of the rod LR8 is fixed to the block B8.

[0058] As shown in FIG. 13, three rods LR1 to LR7 are provided. This allows each of the blocks B1 to B7 to be supported at three points, thereby increasing the rigidity between the upper plate UP and the lower block LB and improving parallelism during lifting and lowering. Four or more rods LR1 to LR7 may be provided. The multiple rods constituting rod LR1 are preferably arranged concentrically and at equal intervals. The multiple rods constituting each of rods LR2 to LR7 are preferably arranged concentrically and at equal intervals. Furthermore, the multiple rods constituting rod LR1 are preferably arranged at equal angular intervals. The multiple rods constituting each of rods LR2 to LR7 are preferably arranged at equal angular intervals. This further improves the parallelism of the blocks B1 to B7 during lifting and lowering. Rods LR1 to LR7 transmit the up and down movement of blocks LB1 to LB7 to plates UP1 to UP7. Rod LR8 transmits the up and down movement of block LB8 to block B8.

[0059] The blocks LB1 to LB8 are arranged in the vertical direction. The blocks LB1 to LB8 are circular, rectangular, or polygonal members. The blocks LB1 to LB8 are formed thicker than the plates UP1 to UP7. The blocks LB1 to LB7 each have a through hole BTH through which the rods LR2 to LR8 connected to the blocks LB2 to LB8 below pass. The through hole BTH and the rods LR2 to LR8 preferably have the same shape when viewed from above, and each has a clearance that allows them to be driven independently. Note that the through hole PTH and the rods UR2 to UR7 and LR8 do not necessarily have to have the same shape.

[0060] The driving unit 300 will be described with reference to Figs. 14 to 17. Fig. 14 is a top view showing an example of the arrangement of the driving unit shown in Fig. 6. Fig. 15 is a side view showing an example of the arrangement of the driving unit shown in Fig. 6. Fig. 16 is a diagram showing an example of the configuration of the driving unit shown in Fig. 15. Fig. 17 is a diagram showing another example of the configuration of the driving unit shown in Fig. 15.

[0061] The drive unit 300 includes drive units DU1 to DU8. Drive units DU1 to DU8 are arranged around the lower block unit 220 and fixed to the member 221. Drive units DU1, DU7, and DU8 are arranged on the X2 side of the lower block unit 220. Drive units DU2, DU5, and DU6 are arranged on the X1 side of the lower block unit 220. Drive units DU3 and DU4 are arranged on the Y1 side of the lower block unit 220. Drive units DU1 and DU2 are arranged on the upper side of the lower block unit 220. Drive units DU5 to DU8 are arranged on the lower side of the lower block unit 220.

[0062] The drive units DU1 to DU8 drive the blocks LB1 to LB8 in the up and down direction, respectively. Each of the drive units DU1 to DU8 has a motor M and a drive output unit PM that converts the rotation of the motor M into up and down movement.

[0063] The drive output part PM is composed of a ball screw BS. The ball screw BS is composed of a screw shaft SS connected to the motor M and a nut part NU that screws onto the screw shaft SS, and the nut part NU is fixed to the lower block LB with a screw or the like. The motor M is arranged so that the output shaft of the motor M extends in the vertical direction. In other words, the screw shaft SS of the ball screw BS is arranged so that it extends in the vertical direction.

[0064] As shown in Fig. 16, the motor M may be arranged with its output shaft (motor shaft) facing upward, or as shown in Fig. 17, it may be arranged with its output shaft facing downward. In other words, the drive output unit PM may be arranged above the motor M, or the drive output unit PM may be arranged below the motor M. The motors M of the drive units DU1, DU2, and DU5 to DU8 are arranged as shown in Fig. 16. The motors M of the drive units DU3 and DU4 are arranged as shown in Fig. 17. This allows the motors M to be housed compactly while ensuring freedom of arrangement.

[0065] Furthermore, the lower block portion 220 receives the thrust of the drive output unit PM on either the side or the top or bottom surface of the lower block LB, and transmits the power to the lower rod LR. This allows for greater freedom in arranging the drive output units PM and the power sources (motors M) when multiple power sources (motors M) are provided.

[0066] According to this embodiment, at least one of the following effects (a) to (g) is achieved.

[0067] (a) It is possible to increase the number of blocks in the thrust block portion BLK.

[0068] (b) (a) makes it possible to reduce the peeling area per block (width of the block), thereby reducing stress on the die when the die is peeled.

[0069] (c) (a) makes it possible to reduce overhang even when the die size increases.

[0070] (d) (c) allows the outer periphery of the die to separate at a low thrust height, and the outermost thrust block can be made lower than the total thrust height, reducing deformation of the peripheral die. This shortens the distance from the end face of the outermost thrust block to the end face of the pickup die, making it less likely to deform.

[0071] (e)(d) makes it possible to reduce product defects.

[0072] (f)(d) enables stable processing of thin dies.

[0073] (g) Because the upper plate portion 210 is composed of a disk-shaped member and a rod, it is possible to suppress an increase in the dome diameter even if the number of blocks in the thrust block portion BLK increases. This makes it possible to maintain compatibility with thrust units with fewer blocks. This will be explained below.

[0074] As described above, the wafer holder 12 moves in the X and Y directions using the XY table, and the die D to be picked up moves to the position of the push-up unit 13. However, if the die D to be picked up is close to the wafer ring WR, the push-up unit 13 is positioned near components of the wafer holder 12, such as the support ring 122 and the XY table. If the dome 110 of the push-up unit 13 and the dome of the upper plate portion 210 are large, these components of the wafer holder 12 become an obstacle, preventing the die D to be picked up from moving to the position of the push-up unit 13. In other words, the area on the wafer that can be picked up (the pickup area) is reduced. Therefore, unless the configuration of the wafer holder 12 is changed, the size of the push-up unit 13 cannot be increased beyond a predetermined value. Note that, if the second unit 13b in Patent Document 1 is composed of multiple cylindrical blocks, increasing the number of blocks will result in a larger diameter for machining accuracy reasons.

[0075] The disclosure made by the present inventors has been specifically described above based on the embodiments, but it goes without saying that the present disclosure is not limited to the above embodiments and can be modified in various ways.

[0076] For example, in the embodiment, an example has been described in which the thrust-up block portion BLK includes eight blocks B1 to B8, but the number of blocks in the thrust-up block portion BLK may be more or less than eight. The number of blocks in the thrust-up block portion BLK may be two or more.

[0077] If the number of blocks in the thrust block unit BLK is different from eight, the configuration of the head unit 100 and the configuration of the mechanism unit 200 are changed. The numbers of upper plates, lower blocks, and motors are changed according to the number of blocks. For example, if the thrust block unit BLK has two blocks, it will be composed of one upper plate, two lower blocks, and two motors.

[0078] If the number of blocks in the push-up block unit BLK is less than eight, only the configuration of the head unit 100 needs to be changed, and there is no need to change the configuration of the mechanism unit 200. In this case, there is an upper rod that is not connected to the block unit BLK, but the motor that moves the upper rod up and down is not operated.

[0079] In the embodiment, an example has been described in which the through-hole BTH of the lower block LB and the lower rod LR are provided with a clearance that allows them to be driven independently, but a bearing or the like may also be provided. In this case, the plunger (rod) that transmits power between the plates (surfaces) is kept perpendicular and can be operated with high precision.

[0080] In the embodiment, the upper plate UP is described as being disk-shaped, but it may be polygonal and contact the inner surface of the dome at multiple points or surfaces (three or more), with bearings or pulleys provided on its edges, which makes it possible to maintain the parallelism of the multiple upper plates UP.

[0081] In the embodiment, an example in which a die attach film is used has been described, but a preform portion for applying adhesive to the substrate may be provided, and the die attach film may not be used.

[0082] In the embodiment, a die bonder has been described in which a die is picked up from a wafer supply unit by a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is bonded to a substrate by a bonding head. However, the present invention is not limited to this and can be applied to a die bonding apparatus that picks up a die from a die supply unit.

[0083] For example, the present invention can be applied to a die bonder that does not have an intermediate stage and a pickup head and that bonds dies from a wafer supply unit to a substrate with a bonding head.

[0084] It is also applicable to a flip chip bonder that does not have an intermediate stage, picks up a die from a wafer supply unit, rotates the die pickup head upward, and delivers the die to the bonding head, which then bonds the die to a substrate.

[0085] In the embodiment, a die bonder has been described as an example, but the present invention can also be applied to semiconductor manufacturing equipment that places a picked-up die on a tray. [Explanation of symbols]

[0086] 1. Die bonder (semiconductor manufacturing equipment) 13 Thrust unit 100···Head unit B1 to B7 blocks 200... Mechanism section 210 Upper plate portion (first mechanism portion, second mechanism portion) UP: Upper plate (first member, second member) UR···Upper rod (first rod) 220 Lower block part (first mechanism part, second mechanism part) LB: Lower block (first member, second member) LR···Lower rod (first rod, second rod) 300···Drive unit M···Motor PM...Drive output unit

Claims

1. a thrust unit including a head portion having a plurality of blocks, a mechanism portion that independently applies vertical movement to each of the plurality of blocks, and a drive portion that includes a motor and a drive output portion that converts the power of the motor into vertical movement; a head having a collet for adsorbing a die; Equipped with The mechanism unit includes: a first member having an upper surface, a lower surface opposite to the upper surface, and a through hole penetrating between the upper surface and the lower surface; a first rod connected to the upper surface of the member and transmitting the vertical movement of the member to the block; a second rod extending from below through the through hole and transmitting vertical movement to the block; A semiconductor manufacturing apparatus comprising a first mechanism having:

2. 2. The semiconductor manufacturing apparatus of claim 1, The mechanism unit further includes: a third rod connected to the lower surface of the member; a second member having an upper surface, a lower surface opposite to the upper surface, and a through-hole penetrating between the upper surface and the lower surface, the second member having the third rod connected to the upper surface; A semiconductor manufacturing apparatus comprising a second mechanism having the above structure.

3. 2. The semiconductor manufacturing apparatus of claim 1, The mechanism unit further includes: a second member having an upper surface, a lower surface opposite to the upper surface, and a through hole penetrating between the upper surface and the lower surface, the first rod being connected to the lower surface; a third rod connected to the top surface of the member; a second mechanism having A semiconductor manufacturing device comprising:

4. 3. The semiconductor manufacturing apparatus according to claim 2, a plurality of first members of the first mechanism unit are arranged in a vertical direction, a plurality of second members of the second mechanism unit are arranged in a vertical direction, the drive unit includes a plurality of motors and a plurality of drive output units, The semiconductor manufacturing apparatus, wherein the number of the first members of the first mechanism section is equal to or smaller than the number of the second members of the second mechanism section.

5. 3. The semiconductor manufacturing apparatus according to claim 2, a plurality of first members of the first mechanism unit are arranged in a vertical direction, a plurality of second members of the second mechanism unit are arranged in a vertical direction, the drive unit includes a plurality of motors and a plurality of drive output units, the number of the first members of the first mechanism unit is equal to or less than the number of the blocks, the number of the second members of the second mechanism unit is the same as the number of the drive output units, The semiconductor manufacturing device, wherein the number of the drive output units is the same as the number of the motors.

6. 6. The semiconductor manufacturing apparatus according to claim 4, At least three of the first rods are provided on an upper surface of each of the plurality of first members of the first mechanism unit, one second rod is provided on an upper surface of one of the second members of the second mechanism section, The semiconductor manufacturing apparatus, wherein at least three of the third rods are provided on the top surface of each of the other members of the second mechanism section.

7. 7. The semiconductor manufacturing apparatus according to claim 6, The first rods are arranged concentrically and at equal intervals, The third rods are arranged concentrically and at equal intervals in the semiconductor manufacturing device.

8. 6. The semiconductor manufacturing apparatus according to claim 4, the first mechanism is housed in a cylindrical housing, The semiconductor manufacturing apparatus, wherein the first member of the first mechanism portion has a circular or polygonal shape when viewed from above, and has a clearance that allows it to be driven between the first member and the inner diameter of the housing.

9. 3. The semiconductor manufacturing apparatus according to claim 2, The semiconductor manufacturing apparatus, wherein the second member of the second mechanism section has a circular, rectangular or polygonal shape when viewed from above.

10. 6. The semiconductor manufacturing apparatus according to claim 4, a first rod provided on an upper one of the first members of the first mechanism section to push up an outer block of the plurality of blocks;

11. 6. The semiconductor manufacturing apparatus according to claim 4, The semiconductor manufacturing apparatus is configured such that the second rod is not connected to the plurality of first members of the first mechanism unit and pushes up the block that is positioned innermost among the plurality of blocks.

12. 6. The semiconductor manufacturing apparatus according to claim 5, The semiconductor manufacturing device, wherein the plurality of drive output units are fixed to the plurality of second members of the second mechanism unit, respectively.

13. 13. The semiconductor manufacturing apparatus of claim 12, The driving unit is disposed around, above, or below the second mechanism unit in the semiconductor manufacturing apparatus.

14. 14. The semiconductor manufacturing apparatus of claim 13, The motor shafts of the plurality of motors are arranged facing upward or downward.

15. a head unit having a plurality of blocks, a mechanism unit that independently applies up and down motion to each of the plurality of blocks, a drive unit having a motor and a drive output unit that converts the power of the motor into up and down motion; Equipped with The mechanism unit includes: a member having an upper surface, a lower surface opposite to the upper surface, and a through hole penetrating between the upper surface and the lower surface; a first rod connected to the upper surface of the member and transmitting the vertical movement of the member to the block; a second rod extending from below through the through hole and transmitting vertical movement to the block; A push-up unit including a first mechanism having the above structure.

16. a step of carrying a wafer ring holding a dicing tape into the semiconductor manufacturing apparatus of claim 1; picking up the die attached to the dicing tape; A method for manufacturing a semiconductor device comprising:

Images