Confirmation method, wiring board, program, and confirmation device

Abstract

To provide a confirmation method, a wiring board, a program, and a confirmation device capable of suppressing peeling of a solder resist.SOLUTION: According to an embodiment of the present disclosure, there is provided a confirmation method in which a mark isolated from a solder resist and formed of an insulating material is provided at a groove processing location of a substrate of a wiring substrate having a substrate having a wiring and the solder resist covering the wiring, and whether or not a groove processing is performed at the groove processing location is determined based on a shape of the mark.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a verification method, a wiring board, a program, and a verification device. [Background technology]

[0002] In the manufacturing process of a printed wiring board (PWB), V-groove processing is performed using marks provided on the board as guides.

[0003] For example, Patent Document 1 discloses a technique relating to an aggregated printed wiring board in which a V-groove is machined along a parting line using a triangular V-groove machining confirmation mark provided on the board as a guide. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 61-033461 Summary of the Invention [Problem to be solved by the invention]

[0005] In the technology described in Patent Document 1, when cutting the mark during V-groove processing, burrs may occur due to the cut pieces of the mark, and the tension of the burrs may cause the solder resist to peel off when the printed wiring board is used.

[0006] An object of the present disclosure is to provide a verification method, a wiring board, a program, and a verification device that solve the above-mentioned problems. [Means for solving the problem]

[0007] A verification method according to one aspect of the present disclosure provides a mark formed of an insulating material and isolated from the solder resist at a groove processing location on a wiring board having a substrate with wiring and a solder resist covering the wiring, and determines whether groove processing has been performed at the groove processing location based on the shape of the mark.

[0008] A wiring board according to one embodiment of the present disclosure comprises a substrate having wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist, the mark being provided at a groove processing location on the substrate.

[0009] A program according to one aspect of the present disclosure causes a computer to perform the following steps: recognize the mark on a wiring board comprising a substrate having wiring, a solder resist covering the wiring, and a mark that is isolated from the solder resist at a groove processing location on the substrate and is formed of an insulating material; recognize the mark before groove processing is performed on the substrate; recognize the mark after groove processing is performed on the substrate; and determine whether groove processing has been performed at the groove processing location based on the shape of the mark.

[0010] A verification method according to one aspect of the present disclosure includes a substrate having wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist at a groove processing location on the substrate, the method recognizing the mark on the wiring substrate before groove processing on the substrate, recognizing the mark after groove processing on the substrate, and determining whether groove processing has been performed at the groove processing location based on the shape of the mark.

[0011] A verification device according to one aspect of the present disclosure includes a wiring board having a substrate with wiring, a solder resist covering the wiring, and a mark that is isolated from the solder resist at a groove processing location on the substrate and is formed of an insulating material. The verification device includes: a first recognition unit that recognizes the mark on the wiring board before groove processing is performed on the substrate; a second recognition unit that recognizes the mark after groove processing is performed on the substrate; and a determination unit that determines whether groove processing has been performed at the groove processing location based on the shape of the mark. [Effects of the Invention]

[0012] According to the above aspect, peeling of the solder resist can be suppressed. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view showing a wiring substrate according to the present disclosure. [Figure 2] 1 is a plan view showing a confirmation mark on a wiring board according to the present disclosure; [Figure 3] 3 is a plan view showing the state after groove processing has been performed on the confirmation mark of FIG. 2.

[0023] FIG. [Figure 4] 1 is a flowchart illustrating a verification method according to the present disclosure. [Figure 5] 1 is a plan view illustrating features of a wiring board according to the present disclosure. [Figure 6] 1 is a flowchart illustrating a verification method according to the present disclosure. [Figure 7] FIG. 1 is a block diagram illustrating a verification device according to the present disclosure. [Figure 8] 1 is an example of a hardware configuration of a computer for realizing the functions of a confirmation device according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, each embodiment will be described with reference to the drawings. In all drawings, the same or corresponding components are denoted by the same reference numerals, and common descriptions will be omitted. It should be noted that in this disclosure, the drawings may relate to one or more embodiments.

[0015] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 1, the wiring board 1 includes a substrate 2 and a solder resist 3. For example, the wiring board 1 may be a PWB.

[0016] The substrate 2 has wiring 21 . The solder resist 3 is an insulating material. The solder resist 3 covers the wiring 21 . In FIG. 1, an area E shown in the center of the board 2 is a component mounting area where electronic components are mounted.

[0017] For example, the substrate 2 may have a copper foil portion including wiring 21 and soldering pads. In this case, the solder resist 3 may cover the wiring 21 while avoiding the soldering pads. Furthermore, the solder resist 3 may cover the substrate 2 while avoiding the peripheral edge portion 2A of the substrate 2 and the substrate dividing area 4.

[0018] The substrate dividing area 4 is positioned across the substrate 2 and is a zone for dividing the substrate 2 along the central cutting lines L1 and L2. Then, in the subsequent V-groove processing step, a V-groove is formed along the cutting lines L1 and L2 using a cutting method such as an upper and lower disc cut method or a linear split method. The upper and lower disc cutter is a cutting method that cuts the V-groove with upper and lower rotating circular blades, and is divided into two types: an electric type that forcibly rotates the blade, and a manual type that rotates the blade naturally by pressing on the board. The linear split type is a cutting method that combines a rotating circular blade (upper blade) and a linear blade (lower blade).The V-groove part of the board is set on the lower blade while it is being split, so the cutting line does not shift.

[0019] Next, the confirmation mark 10 (mark) for ensuring that no omissions are made in the V-groove processing step will be described with reference to FIGS. The confirmation mark 10 is placed in the substrate dividing area 4 where the grooves of the substrate 2 will be processed, and is made of the same insulating material as the solder resist 3.

[0020] The confirmation mark 10 is also placed away from the solder resist 3 via an isolation area 11 that has a certain distance between it and the solder resist 3 . Furthermore, this isolation area 11 is provided along the periphery of the confirmation mark 10 with the substrate dividing area 4 interposed therebetween, i.e., it is provided around the entire periphery of the confirmation mark 10, thereby isolating the confirmation mark 10 from the solder resist 3.

[0021] Furthermore, the confirmation mark 10 is not a simple circle or square, but is formed in a special shape (a polygonal shape in the illustrated example) as shown in FIGS. The confirmation mark 10 illustrated in this embodiment is formed in an arrow feather shape with the corners of the periphery (indicated by symbols 10A and 10B in Figures 2 and 3) aligned with the cutting lines L1 and L2 of the substrate dividing area 4. Furthermore, although the illustrated confirmation mark 10 is divided into two separate portions (indicated by reference numerals 12 and 13 in FIGS. 2 and 3), the number of portions into which it is divided can be selected as appropriate.

[0022] Furthermore, such an arrow feather-shaped confirmation mark 10 makes it easy for an operator or a monitoring device to determine whether or not groove processing (the groove processing portion is indicated by the symbol M in Figures 1 and 3) has been performed in the board division area 4 of the wiring board 1 along the cutting lines L1 and L2. In other words, because the confirmation mark 10 has a special shape, it is easy for the worker or the monitoring device to recognize that the confirmation mark 10 before groove processing (see Figure 2) changes to its shape after groove processing (see Figure 3), thereby preventing omissions in groove processing work.

[0023] In the wiring board 1 of this embodiment described above, at the time of design, V-groove processing omission confirmation marks 10 prepared in advance in a library are placed on the front and back surfaces at the V-groove processing locations, thereby clearly indicating the V-groove processing positions. This allows the state of the V-groove to be clearly confirmed during the manufacturing of the wiring board 1 and in subsequent processes such as an inspection process and a component mounting process. That is, before the V-groove processing, the confirmation mark 10 has a shape as shown in the left-hand diagram of FIG. 1 and FIG. 2, but after the V-groove processing, it has a shape with a groove processing portion M as shown in the right-hand diagram of FIG. 1 and FIG. 3, and it can be confirmed whether or not the product is a "good product" that has been V-grooved. As a result, with the wiring board 1 of this embodiment, it is possible to prevent the need to discard the board together with the mounted components or to go back and do the work again, which would occur if the V-groove processing was forgotten.

[0024] On the other hand, if the groove processing portion M is not found in the confirmation mark 10, the wiring board 1 is determined to be a "defective product" in which the V-groove processing has not been performed. This confirmation work can be performed not only by visual inspection by an operator, but also by an image recognition device that has previously stored the shape of the confirmation mark 10 as reference data.

[0025] Furthermore, in the wiring board 1 of this embodiment, the confirmation mark 10 is positioned away from the solder resist 3 on the substrate 2, so that if a burr occurs in the confirmation mark 10 during V-groove processing and the portion peels off, there is little impact on the solder resist 3. Therefore, according to the wiring board 1 of this embodiment, peeling of the solder resist can be suppressed. For example, if peeling of the solder resist can be prevented, short circuits of the copper wires of the substrate 2 can be prevented.

[0026] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 4, the checking method includes steps S1 and S2.

[0027] The wiring board has a substrate having wiring and a solder resist covering the wiring. In step S1, a mark that is isolated from the solder resist and made of an insulating material is provided in the divided area of ​​the board where the grooves will be processed. In the next step S2, it is determined based on the shape of the mark whether or not groove processing has been performed in the substrate division area where the grooves are to be processed on the substrate.

[0028] According to the above-described confirmation method, if the mark does not show the groove processing area M that would be formed when groove processing is performed, it can be confirmed that the wiring board 1 is a "defective product" in which V-groove processing has not been performed. Furthermore, since the mark is disposed separately from the solder resist on the board, even if a burr occurs in the mark during V-groove processing and the burr peels off, the impact on the solder resist is minimal. Therefore, according to the checking method of this embodiment, peeling of the solder resist can be suppressed.

[0029] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 5, the wiring board 1-1 includes a substrate 2-1 having wiring 21-1, a solder resist 3-1, and a mark 10-1. The solder resist 3-1 covers the wiring 21-1. The mark 10-1 is provided in the groove processing location 4-1 of the substrate 2-1, is isolated from the solder resist 3-1, and is made of an insulating material.

[0030] With the wiring board 1-1 described above, if the mark 10 does not show the groove processing portion formed after the groove processing, it can be confirmed that the wiring board 1-1 is a "defective product" in which V-groove processing has not been performed.

[0031] Furthermore, since the mark 10-1 is disposed separately from the solder resist 3-1 on the substrate 2-1, even if a burr occurs in the mark 10-1 during V-groove processing and the burr peels off, the impact on the solder resist 3-1 is minimal. Therefore, according to the wiring board 1 of this embodiment, peeling of the solder resist can be suppressed.

[0032] <Fourth embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 6, the checking method includes steps S20 to S22.

[0033] In step S20, the marks on the wiring board are recognized before grooves are formed on the wiring board 1. The wiring board 1 includes wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist in a substrate dividing area where grooves will be processed in the substrate.

[0034] In the next step S21, the mark on the wiring board is recognized after the groove is formed in the wiring board 1. In the next step S22, it is determined whether or not groove processing has been performed in the substrate division area where groove processing is to be performed, based on the shape of the mark.

[0035] According to the above-described confirmation method, if it is determined based on the result of step S22 that the mark on the wiring board does not show the groove processing portion that will be formed after groove processing, it can be confirmed as a "defective product" that has not undergone V-groove processing.

[0036] Furthermore, since the mark is disposed separately from the solder resist on the board, even if a burr occurs in the mark during V-groove processing and the burr peels off, the impact on the solder resist is minimal. Therefore, according to the checking method of this embodiment, peeling of the solder resist can be suppressed.

[0037] Fifth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 7, the verification device 100 includes a first recognition unit 101, a second recognition unit 102, and a determination unit 103.

[0038] The first recognition unit 101 recognizes the mark on the wiring board before grooves are formed in the wiring board. The wiring board includes a substrate having wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist in a substrate dividing area where the grooves are to be processed in the substrate.

[0039] The second recognition unit 102 recognizes the mark on the wiring board after the groove is formed in the wiring board. The determining unit 103 determines whether or not groove processing has been performed in the substrate division area where groove processing is to be performed, based on the shape of the mark.

[0040] According to the above-described verification device 100, if it is determined based on the result of the determination unit 103 that the mark on the wiring board does not show the groove processing portion that is formed after the groove processing, it can be confirmed as a "defective product" that has not undergone V-groove processing.

[0041] Furthermore, since the mark is disposed separately from the solder resist on the board, even if a burr occurs in the mark during V-groove processing and the mark peels off, the effect on the solder resist is minimal. Therefore, the checking device 100 of this embodiment can prevent the solder resist from peeling off.

[0042] <Hardware configuration of each device> An example of a hardware configuration for realizing all or part of the verification device 100 in the above-described embodiment will be described with reference to FIG. As shown in Figure 8, the verification device includes a computer 90 having the following hardware: a processor 91, a memory 92, a storage / playback device 93, a communication I / F (communication interface) 94, and an IO I / F (input output interface) 95.

[0043] The processor 91 is, for example, a CPU (Central Processing Unit). The memory 92 is a storage medium such as a RAM (Random Access Memory) or a ROM (Read Only Memory). The storage / playback device 93 is a device for storing programs, data, etc. on external media such as CD-ROM (Compact Disc Read Only Memory), DVD (Digital Versatile Disc), flash memory, etc., and for playing back programs, data, etc. from external media. The communication I / F 94 is an interface for communicating between the computer 90 and other devices via a communication line such as the Internet or a dedicated communication line. The IO I / F 95 is an interface for inputting a source program and inputting and outputting information between the computer 90 and other devices.

[0044] <Computer Program> A program for realizing all or part of the functions of the verification device 100 in the above-described embodiment may be stored in a computer-readable storage medium, and all or part of the processing may be performed by loading and executing the program stored in this storage medium into a computer system. The term "computer system" as used herein includes hardware such as an OS (Operating System) and peripheral devices.

[0045] Furthermore, if a WWW (World Wide Web) system is used, the "computer system" also includes the homepage providing environment (or display environment).

[0046] In addition, "computer-readable storage medium" refers to portable media such as flexible disks, optical magnetic disks, ROMs, CD-ROMs, and storage devices such as hard disks built into computer systems.

[0047] In addition, "computer-readable storage medium" includes a medium that dynamically stores a program for a short period of time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line.

[0048] Furthermore, the term "computer-readable storage medium" also includes a medium that stores a program for a certain period of time, such as volatile memory within a computer system that serves as a server or client when transmitting a program via a network such as the Internet or a communication line such as a telephone line.

[0049] For example, the program may be designed to realize some of the functions described above, or may be designed to realize the functions described above in combination with a program already stored in the computer system.

[0050] Although the embodiments of the present disclosure have been described above, these embodiments are provided as examples and are not intended to limit the scope of the present disclosure. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0051] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0052] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0053] (Appendix 1) a wiring board having a substrate with wiring and a solder resist covering the wiring, the wiring board having a groove processing portion of the substrate, the groove processing portion being separated from the solder resist and being made of an insulating material; determining whether or not groove processing has been performed on the groove processing location based on the shape of the mark; How to check.

[0054] (Appendix 2) The isolation area of ​​the mark is provided around the entire periphery of the mark. Verification method described in Appendix 1.

[0055] (Appendix 3) the isolation area of ​​the mark is provided at a fixed interval from the solder resist; The verification method described in either Appendix 1 or 2.

[0056] (Appendix 4) the mark has an arrow feather shape with a corner of its periphery aligned with the cutting line of the substrate; A confirmation method according to any one of appendices 1 to 3.

[0057] (Appendix 5) The mark comprises a plurality of portions spaced apart from one another. A confirmation method according to any one of appendices 1 to 4.

[0058] (Appendix 6) The determination of whether or not the groove processing has been performed is performed by determining that the groove processing portion has been processed if the shape of the mark after the groove processing on the substrate is deformed compared to the shape before the groove processing. A confirmation method according to any one of appendices 1 to 5.

[0059] (Appendix 7) The determination of whether or not the groove processing has been performed is performed by image recognition. A confirmation method according to any one of appendices 1 to 6.

[0060] (Appendix 8) a substrate having wiring; a solder resist covering the wiring; a mark provided in a groove processing location of the substrate, isolated from the solder resist, and made of an insulating material; Equipped with Wiring board.

[0061] (Appendix 9) The isolation area of ​​the mark is provided around the entire periphery of the mark. 9. The wiring substrate according to claim 8.

[0062] (Appendix 10) the isolation area of ​​the mark is provided at a fixed interval from the solder resist; 10. The wiring board according to claim 8 or 9.

[0063] (Appendix 11) the mark has an arrow feather shape with a corner of its periphery aligned with the cutting line of the substrate; 11. The wiring board according to any one of claims 8 to 10.

[0064] (Appendix 12) The mark comprises a plurality of portions spaced apart from one another. 12. The wiring board according to any one of claims 8 to 11.

[0065] (Appendix 13) In determining whether or not the groove processing has been performed, if the shape of the mark after the groove processing on the substrate is deformed compared to the shape before the groove processing, it is determined that the groove processing location has been processed. 13. The wiring board according to any one of claims 8 to 12.

[0066] (Appendix 14) The determination of whether the groove processing portion has been processed or not is performed by image recognition. 14. The wiring board according to any one of claims 8 to 13.

[0067] (Appendix 15) On the computer, a mark formed of an insulating material and isolated from the solder resist at a groove processing location of the substrate, the mark being on a wiring substrate after the groove processing; determining whether or not groove processing has been performed on the groove processing location based on the shape of the mark; To make it happen, program.

[0068] (Appendix 16) The isolation area of ​​the mark is provided around the entire periphery of the mark. 15. The program described in Appendix 15.

[0069] (Appendix 17) the isolation area of ​​the mark is provided at a fixed interval from the solder resist; 17. The program according to any one of appendix 15 or 16.

[0070] (Appendix 18) the mark has an arrow feather shape with a corner of its periphery aligned with the cutting line of the substrate; A program according to any one of appendices 15 to 17.

[0071] (Appendix 19) The mark comprises a plurality of portions spaced apart from one another. A program according to any one of appendices 15 to 18.

[0072] (Appendix 20) Whether or not the groove processing has been performed is determined based on whether or not the shape of the mark after the groove processing on the substrate has been deformed compared to the shape before the groove processing. A program according to any one of appendices 15 to 19.

[0073] (Appendix 21) The determination of whether the groove processing portion has been processed or not is performed by image recognition. A program according to any one of appendices 15 to 20.

[0074] (Appendix 22) a substrate having wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist at a groove processing location of the substrate, the mark being recognized before groove processing is performed on the substrate; Recognizing the mark after groove processing on the substrate; determining whether or not groove processing has been performed on the groove processing location based on the shape of the mark; How to check.

[0075] (Appendix 23) The isolation area of ​​the mark is provided around the entire periphery of the mark. Verification method described in Appendix 22.

[0076] (Appendix 24) the isolation area of ​​the mark is provided at a fixed interval from the solder resist; 2. A verification method as set forth in any one of Appendix 22 or 23.

[0077] (Appendix 25) the mark has an arrow feather shape with a corner of its periphery aligned with the cutting line of the substrate; A confirmation method according to any one of appendices 22 to 24.

[0078] (Appendix 26) The mark comprises a plurality of portions spaced apart from one another. A confirmation method according to any one of appendices 22 to 25.

[0079] (Appendix 27) Whether or not the groove processing has been performed is determined based on whether or not the shape of the mark after the groove processing on the substrate has been deformed compared to the shape before the groove processing. A confirmation method according to any one of appendices 22 to 26.

[0080] (Appendix 28) The determination of whether the groove processing portion has been processed or not is performed by image recognition. A confirmation method according to any one of appendices 22 to 27.

[0081] (Appendix 29) a first recognition unit that recognizes a mark on a wiring board, the wiring board including a substrate having wiring, a solder resist covering the wiring, and a mark that is isolated from the solder resist at a groove processing location on the substrate and is made of an insulating material, before the groove processing is performed on the substrate; a second recognition unit that recognizes the mark after groove processing on the substrate; a determination unit that determines whether or not groove processing has been performed on the groove processing location based on the shape of the mark; Equipped with Verification device.

[0082] (Appendix 30) The isolation area of ​​the mark is provided around the entire periphery of the mark. 29. The verification device of claim 29.

[0083] (Appendix 31) the isolation area of ​​the mark is provided at a fixed interval from the solder resist; 31. The verification device of any one of appendix 29 or 30.

[0084] (Appendix 32) the mark has an arrow feather shape with a corner of its periphery aligned with the cutting line of the substrate; 32. The confirmation device according to any one of appendices 29 to 31.

[0085] (Appendix 33) The mark comprises a plurality of portions spaced apart from one another. 33. The confirmation device according to any one of appendices 29 to 32.

[0086] (Appendix 34) Whether or not the groove processing has been performed is determined based on whether or not the shape of the mark after the groove processing on the substrate has been deformed compared to the shape before the groove processing. 34. The confirmation device according to any one of appendices 29 to 33.

[0087] (Appendix 35) The determination of whether the groove processing portion has been processed or not is performed by image recognition. 33. The confirmation device according to any one of appendices 29 to 32. [Explanation of symbols]

[0088] 1. Wiring board 1-1 Wiring board 2 boards 2-1 Circuit board 2A Periphery 3 Solder resist 3-1 Solder resist 4 PCB division area 4-1 Grooving area 10 Confirmation mark (mark) 10-1 mark 11 Quarantine Area 12 parts 13 parts 21 Wiring 21-1 Wiring 90 Computer 91 processors 92 memory 93 Storage / playback device 94 Communication I / F 95 IO I / F 100 Confirmation device 101 First recognition part 102 Second recognition part 103 Judgment section E Area L1 cutting line L2 cutting line M Grooving area

Claims

1. a wiring board having a substrate with wiring and a solder resist covering the wiring, the wiring board having a groove processing portion of the substrate, the groove processing portion being separated from the solder resist and being made of an insulating material; determining whether or not groove processing has been performed on the groove processing location based on the shape of the mark; How to check.

2. The isolation area of ​​the mark is provided around the entire periphery of the mark. The verification method according to claim 1 .

3. the isolation area of ​​the mark is provided at a fixed interval from the solder resist; The verification method according to claim 1 .

4. the mark has an arrow feather shape with a corner of its periphery aligned with the cutting line of the substrate; The verification method according to claim 1 .

5. The mark comprises a plurality of portions spaced apart from one another. The verification method according to claim 1 .

6. Whether or not the groove processing has been performed is determined based on whether or not the shape of the mark after the groove processing on the substrate has been deformed compared to the shape before the groove processing. The verification method according to claim 1 .

7. a substrate having wiring; a solder resist covering the wiring; a mark provided in a groove processing location of the substrate, isolated from the solder resist, and made of an insulating material; Equipped with Wiring board.

8. On the computer, a substrate having wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist at a groove processing location of the substrate, the mark being recognized before groove processing is performed on the substrate; Recognizing the mark after groove processing on the substrate; determining whether or not groove processing has been performed on the groove processing location based on the shape of the mark; To make it happen, program.

9. a substrate having wiring, a solder resist covering the wiring, and a mark formed of an insulating material and isolated from the solder resist at a groove processing location of the substrate, the mark being recognized before groove processing is performed on the substrate; Recognizing the mark after groove processing on the substrate; determining whether or not groove processing has been performed on the groove processing location based on the shape of the mark; How to check.

10. a first recognition unit that recognizes a mark on a wiring board, the wiring board including a substrate having wiring, a solder resist covering the wiring, and a mark that is isolated from the solder resist at a groove processing location on the substrate and is made of an insulating material, before the groove processing is performed on the substrate; a second recognition unit that recognizes the mark after groove processing on the substrate; a determination unit that determines whether or not groove processing has been performed on the groove processing location based on the shape of the mark; Equipped with Verification device.

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