Inspection device

Abstract

To provide an inspection device capable of moving a turbulent flow generation position away from a substrate.SOLUTION: An inspection device 1 includes: a chamber 10; a stage 21; an outer peripheral member 3; a measurement part 4; a first displacement drive part 5; and a gas supply part 8. The stage 21 has a first upper surface 21a that supports a second main surface Wb of a substrate W, and a side surface 21b. The outer peripheral member 3 has an inner side surface 3c located outside the side surface 21b of the stage 21 and a peripheral edge of the substrate W, an outer side surface 3b, and a second upper surface 3a having a horizontal portion. The measurement part 4 includes: a light emitting part 4 that emits a measurement light L1 to a first main surface Wa of the substrate W; and a light receiving part 42 that receives the measurement light L1 reflected by the first main surface Wa of the substrate W. The first displacement driving part 5 changes the positional relationship between the stage 21 and the measuring part 4 to move a spot SP1 to an edge position on the outer peripheral member 3 side of the first main surface Wa. A gas supply part 8 has an air supply port 8a, and supplies gas into a chamber 10 through the air supply port 8a.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an inspection apparatus. [Background technology]

[0002] Conventionally, inspection devices for inspecting the surface of a substrate have been provided (for example, Patent Document 1). In Patent Document 1, the inspection device includes an inspection chamber, a stage, an optical inspection unit, a gas supply unit, and a rectifying vane. The stage is provided in the inspection chamber, and a substrate is placed on the stage in a horizontal position. The stage rotates the substrate around a vertical axis. The optical inspection unit is provided above the substrate in the inspection chamber. The optical inspection unit inspects the surface of the substrate. The gas supply unit supplies gas to the inspection chamber from the side. The rectifying vane is provided in the measurement chamber, and guides the gas from the gas supply unit above the substrate and to an exhaust port provided in the measurement chamber.

[0003] The rectifying plate includes a first portion extending vertically between the gas supply unit and the stage, and a second portion extending horizontally from above the first portion. The second portion is provided above the substrate, and has an opening formed in a position facing the substrate in the vertical direction. The inner peripheral surface of the second portion (the outline surface of the opening) is located inside the periphery of the substrate in a plan view.

[0004] The gas supplied from the gas supply unit into the measurement chamber collides with the first part of the straightening plate, is guided upward along the first part, and flows along the upper surface of the second part. As the substrate rotates, part of the gas flows around the inner circumferential surface of the second part, is drawn between the second part and the substrate, and flows below the second part. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-43361 Summary of the Invention [Problem to be solved by the invention]

[0006] When inspecting a substrate, light can be irradiated onto a main surface of the substrate in a spot, and an inspection device can inspect the surface of the substrate by detecting the light reflected by the spot on the substrate.

[0007] On the other hand, turbulence can occur when the gas collides with various components in the measurement chamber. When turbulence acts on light, the light fluctuates, which can result in a decrease in measurement accuracy.

[0008] Therefore, an object of the present disclosure is to provide an inspection apparatus that can move the position where turbulence occurs away from the substrate. [Means for solving the problem]

[0009] a stage provided in the chamber and having a first upper surface supporting a second main surface of a substrate having a first main surface and a second main surface, and a side surface connected to a periphery of the first upper surface; an outer peripheral member provided in the chamber and having an inner side surface positioned outside the side surface of the stage and the periphery of the substrate, an outer side surface positioned outside the inner side surface, and a second upper surface connecting an upper end of the inner side surface to an upper end of the outer side surface and having a horizontal portion; a measurement unit provided in the chamber and including an emitter that emits measurement light to the first main surface of the substrate and a light receiver that receives the measurement light reflected by the first main surface of the substrate; a first displacement drive unit that changes the positional relationship between the stage and the measurement unit to move a spot of the measurement light relative to the first main surface of the substrate and move the spot to an edge position of the first main surface that is on the outer peripheral member side; and a gas supply unit that has an air inlet and supplies gas into the chamber from the air inlet.

[0010] The second aspect is an inspection device according to the first aspect, wherein, in a plan view, the air intake port is provided outside the stage, and the peripheral member is located closer to the air intake port than the substrate on the stage.

[0011] A third aspect is an inspection device according to the first or second aspect, wherein the height position of the second upper surface of the peripheral member is at a position equal to or higher than a first height position that is twice the thickness of the substrate below the first upper surface of the stage, and at a position equal to or lower than a second height position that is twice the thickness of the substrate above the first main surface of the substrate.

[0012] A fourth aspect is the inspection device according to any one of the first to third aspects, wherein the height position of the lower end of the outer side surface is higher than the lower end of the side surface of the stage.

[0013] A fifth aspect is the inspection device according to any one of the first to fourth aspects, wherein the height and width of the outer side surface are thinner than the side surface of the stage.

[0014] A sixth aspect is the inspection device according to any one of the first to fifth aspects, wherein the outer peripheral member has an annular shape surrounding the substrate in a plan view.

[0015] A seventh aspect is an inspection device according to any one of the first to sixth aspects, wherein the outer peripheral member has a shape that avoids the transport path through which the hand of the transport unit that transports the substrate to the stage passes.

[0016] An eighth aspect is an inspection device according to the seventh aspect, wherein the outer peripheral member has a shape that extends along the periphery of the substrate in a planar view, the first displacement drive unit rotates the stage and the outer peripheral member together, the transport unit transfers the substrate to the stage while the first displacement drive unit positions the outer peripheral member at a transport rotation position, and the transport rotation position is a position where the outer peripheral member avoids the transport path of the transport unit, and the light emitting unit emits the measurement light while the first displacement drive unit positions the outer peripheral member at a measurement rotation position different from the transport rotation position.

[0017] A ninth aspect is an inspection device according to any one of the first to eighth aspects, wherein the first displacement driving unit displaces the stage and the outer peripheral member together, and the density of the outer peripheral member is smaller than the density of the stage.

[0018] A tenth aspect is an inspection device according to any one of the first to ninth aspects, further comprising a second displacement drive unit that moves the peripheral member between a measurement position that is adjacent to the stage or the substrate in the horizontal direction and a transport position that is farther from the stage than the measurement position, and the transport position is a position that avoids the transport path of a transport unit that transports the substrate.

[0019] An eleventh aspect is an inspection device according to any one of the first to tenth aspects, further comprising a first bottom portion located above the peripheral member, below a first portion of the optical path of the measurement light, and vertically opposite the first portion of the measurement light, wherein the light-emitting unit emits the measurement light diagonally downward, and when the first displacement driving unit positions the spot at the edge position, at least a portion of the first bottom portion is located on the opposite side of the substrate from the peripheral member in a planar view.

[0020] A twelfth aspect is an inspection device according to the eleventh aspect, further comprising a second bottom portion provided above the outer peripheral member, below a second portion of the optical path of the measurement light that is on the opposite side of the spot from the first portion, and vertically opposite the second portion of the measurement light.

[0021] A thirteenth aspect is the inspection device according to the eleventh or twelfth aspect, further comprising a light path enclosing member that includes the first bottom and encloses the first portion of the measurement light. [Effects of the Invention]

[0022] According to the first aspect, when gas flows from the outside toward the peripheral member, it collides with the outer surface of the peripheral member. This can cause turbulence. If the peripheral member were not provided, the gas would collide with the side surface of the stage. This would cause turbulence to occur closer to the edge position (spot). In contrast, according to the first aspect, the peripheral member can move the position where turbulence occurs away from the spot. This makes it less likely that turbulence will affect the measurement light near the spot.

[0023] According to the second aspect, since the outer peripheral member is located upstream of the strong gas flow, the position where turbulence caused by the gas occurs can be kept away from the spot.

[0024] According to the third aspect, the step between the outer peripheral member and the stage or the substrate can be reduced, thereby reducing the occurrence of turbulent gas flow.

[0025] According to the fourth aspect, the gas flowing toward the outer surface of the peripheral member collides with the outer surface of the peripheral member and flows separately above and below the peripheral member. Because the lower end of the outer surface is relatively high, the amount of gas flowing above the substrate via the upper part of the peripheral member can be reduced. In other words, the amount of gas flowing toward the measurement light can be reduced, and the influence of the gas on the measurement light can be reduced.

[0026] According to the fifth aspect, the region where turbulence occurs can be narrowed.

[0027] According to the sixth aspect, it is possible to improve the measurement accuracy at any edge position on the peripheral portion of the substrate.

[0028] According to the seventh aspect, the outer peripheral member does not hinder the transfer of the substrate by the transfer section.

[0029] According to the eighth aspect, the transport unit can appropriately transfer the substrate to the stage with the outer peripheral member positioned at the transport rotation position. Meanwhile, the light emitting unit emits the measurement light with the outer peripheral member positioned at a rotation position different from the transport rotation position. Therefore, the light emitting unit can emit the measurement light with the outer peripheral member positioned at a measurement rotation position suitable for measurement.

[0030] According to the ninth aspect, the load on the first displacement drive section can be reduced.

[0031] According to the tenth aspect, the transfer unit can transfer the substrate to the stage appropriately while the peripheral member is positioned at the transfer position. Also, the light emitting unit can emit measurement light while the peripheral member is positioned at the measurement position. This reduces the effect of turbulence on the measurement light.

[0032] According to the eleventh aspect, the first bottom is located directly above the position where the turbulence occurs. Therefore, the turbulence is blocked by the first bottom and hardly affects the measurement light above the first bottom. This further reduces the influence of the turbulence on the measurement light.

[0033] According to the twelfth aspect, when the first displacement drive unit positions the spot at the edge position of the substrate on the second bottom side, the second bottom is located directly above the position where turbulence occurs. Therefore, the turbulence is blocked by the second bottom and hardly affects the measurement light above the second bottom. This further reduces the effect of turbulence on the measurement light.

[0034] According to the thirteenth aspect, the gas flowing toward the first portion is blocked by the light path enclosing member, so that the influence of the gas on the measurement light can be reduced. [Brief explanation of the drawings]

[0035] [Figure 1] FIG. 1 is a diagram schematically illustrating an example of the configuration of an inspection device according to a first embodiment. [Figure 2]FIG. 2 is a diagram schematically illustrating an example of the configuration of an inspection device in the vicinity of the periphery of a substrate. [Figure 3] FIG. 2 is a plan view schematically showing an example of the configuration of a substrate, a stage, and a peripheral member. [Figure 4] FIG. 2 is a block diagram schematically illustrating an example of the internal configuration of a control unit. [Figure 5] FIG. 10 is a diagram schematically illustrating an example of a comparative example. [Figure 6] FIG. 2 is a diagram schematically illustrating an example of a configuration of an inspection device in the vicinity of the periphery of a substrate. [Figure 7] FIG. 10 is a plan view schematically showing a first example of the configuration of the outer peripheral member according to the second embodiment. [Figure 8] FIG. 10 is a plan view schematically showing a second example of the configuration of the outer peripheral member according to the second embodiment. [Figure 9] 10 is a flowchart showing an example of the operation of the inspection device according to the second embodiment. [Figure 10] FIG. 10 is a diagram schematically illustrating an example of a part of the configuration of an inspection device according to a third embodiment. [Figure 11] FIG. 10 is a diagram schematically illustrating an example of a part of the configuration of an inspection device according to a fourth embodiment. [Figure 12] FIG. 10 is a plan view schematically illustrating an example of a part of the configuration of an inspection device according to a fourth embodiment. [Figure 13] FIG. 2 is a perspective view schematically illustrating an example of the configuration of an optical path enclosing member. [Figure 14] FIG. 10 is a plan view schematically showing another example of a part of the configuration of the inspection device according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0036] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the drawings, the dimensions and numbers of parts are exaggerated or simplified as necessary for ease of understanding. Parts having similar configurations and functions are designated by the same reference numerals, and duplicate explanations will be omitted below.

[0037] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

[0038] Furthermore, in the following description, even if ordinal numbers such as "first" or "second" are used, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the order that may result from these ordinal numbers.

[0039] When expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) are used, unless otherwise specified, the expressions not only strictly represent the positional relationship but also represent a state in which there is a relative displacement in terms of angle or distance within a range in which tolerance or equivalent functionality is obtained. When expressions indicating an equal state (e.g., "identical," "equal," "homogeneous," etc.) are used, the expressions not only represent a state in which there is strict quantitative equality but also represent a state in which there is a difference in which tolerance or equivalent functionality is obtained, unless otherwise specified. When expressions indicating a shape (e.g., "rectangular shape" or "cylindrical shape," etc.) are used, the expressions not only represent a geometrically strict shape but also represent a shape with, for example, irregularities or chamfers within a range in which equivalent effects are obtained, unless otherwise specified. When the expressions "comprise," "include," "have," "includes," "includes," or "have" are used to describe one component, the expressions are not exclusive expressions that exclude the presence of other components. When the phrase "at least one of A, B, and C" is used, the phrase includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0040] First Embodiment FIG. 1 is a diagram schematically illustrating an example of the configuration of an inspection apparatus 1 according to the first embodiment. The inspection apparatus 1 is an apparatus that optically measures parameters of a substrate W. The inspection apparatus 1 can also be considered an optical measurement apparatus. The substrate W has, for example, a plate-like shape and has a first main surface Wa and a second main surface Wb. The second main surface Wb is the surface opposite to the first main surface Wa. The substrate W may be, for example, a semiconductor substrate. The substrate W has, for example, a disk shape. The diameter of the substrate W is, for example, about 300 mm, and the thickness of the substrate W is, for example, about 1 mm (specifically, about 0.7 mm). As an example, a thin film is formed on the first main surface Wa of the substrate W. In this embodiment, as an example, the inspection apparatus 1 measures the thickness of the thin film on the first main surface Wa of the substrate W. The inspection apparatus 1 may be a so-called ellipsometer.

[0041] Each figure referred to below is appropriately assigned a Cartesian coordinate system. The Cartesian coordinate system includes an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. The Z-axis is an axis that runs along the vertical direction, and each of the X-axis and Y-axis is an axis that runs along the horizontal direction. Below, the direction along the X-axis will also be referred to as the X-axis direction. The same applies to the Y-axis and Z-axis.

[0042] As shown in Fig. 1, the inspection device 1 includes a chamber (housing) 10, a stage 21, a peripheral member 3, a measurement unit 4, and a first displacement drive unit 5. Fig. 2 is a diagram schematically showing an example of the configuration of the inspection device 1 near the periphery of a substrate W. Fig. 3 is a plan view schematically showing an example of the configuration of the substrate W, the stage 21, and the peripheral member 3.

[0043] The chamber 10 has a box-like shape with an internal space, and the internal space has a measurement space RM1. As shown in Fig. 1, a transfer space RM2 may also be formed in the internal space of the chamber 10, and a transfer unit 7 may be provided in the transfer space RM2. The transfer unit 7 will be described later.

[0044] The stage 21 is provided in the chamber 10. Specifically, the stage 21 is provided in the measurement space RM1. The stage 21 supports the substrate W in a horizontal position. Here, the horizontal position means that the thickness direction of the substrate W is along the Z-axis direction. The stage 21 has, for example, a plate-like shape, and is provided with its thickness direction along the Z-axis direction.

[0045] The stage 21 has a first upper surface 21a, a side surface 21b, and a first lower surface 21c. The first upper surface 21a faces the second main surface Wb of the substrate W and supports the second main surface Wb of the substrate W. The first upper surface 21a has a horizontal portion and may specifically be a horizontal, flat surface. The first upper surface 21a of the stage 21 can be in surface contact with the second main surface Wb of the substrate W. This first upper surface 21a can also be said to be a mounting surface on which the substrate W is placed. The first lower surface 21c is the surface opposite the first upper surface 21a, and the side surface 21b connects the periphery of the first upper surface 21a to the periphery of the first lower surface 21c. The stage 21 may have a circular shape in a planar view. Here, planar view refers to viewing an object with the line of sight along the Z-axis direction.

[0046] In the example of FIG. 2, the side surface 21b of the stage 21 is located outside the periphery of the substrate W. In other words, in a planar view, the stage 21 protrudes outward from the periphery of the substrate W. That is, the diameter of the stage 21 is larger than the diameter of the substrate W. The side surface 21b of the stage 21 may be located near the periphery of the substrate W. For example, the protrusion amount of the stage 21 from the substrate W in a planar view (i.e., the difference between the radius of the stage 21 and the radius of the substrate W) may be 1 / 10 or less, 1 / 20 or less, or 1 / 40 or less of the radius of the substrate W. As a specific example, the protrusion amount may be 10 mm or less, 5 mm or less, or 3 mm or less. Furthermore, the thickness of the stage 21 may be, for example, 3 mm or more, 10 mm or more, or 20 mm or more.

[0047] The stage 21 may hold the substrate W. The stage 21 may hold the substrate W by, for example, electrostatic force or suction force. In the example of FIG. 1, the stage 21 is connected to a suction unit 22 and suction-holds the substrate W. A plurality of suction ports (not shown) are formed in a dispersed manner on the first upper surface 21a of the stage 21. The stage 21 also has internal flow paths 211 connected to the respective suction ports. That is, the stage 21 has a thickness sufficient to allow the internal flow paths 211 to be formed. The internal flow paths 211 are connected to the upstream end of a suction pipe 23. The downstream end of the suction pipe 23 is connected to the suction unit 22. The suction unit 22 includes, for example, a pump (not shown). The suction unit 22 is controlled by the control unit 9. When the suction unit 22 performs a suction operation, air is sucked through the suction ports on the first upper surface 21a of the stage 21, resulting in the second main surface Wb of the substrate W being sucked to the first upper surface 21a of the stage 21. In this case, the stage 21 may also be referred to as a suction stage.

[0048] The measurement unit 4 is provided in the chamber 10 (specifically, the measurement space RM1) and includes a light-emitting unit 41 and a light-receiving unit 42. The light-emitting unit 41 and the light-receiving unit 42 are fixed to the chamber 10 via a fixing member (not shown). The light-emitting unit 41 is provided above the first main surface Wa of the substrate W and emits measurement light L1 toward the first main surface Wa of the substrate W. In the example of FIG. 1, the light-emitting unit 41 emits measurement light L1 obliquely downward. The incident angle θ1 of the measurement light L1 with respect to the first main surface Wa is, for example, not less than 60 degrees and not more than 70 degrees.

[0049] The light-emitting unit 41 includes a light source (not shown) and a first optical system (not shown). The light source is, for example, a semiconductor laser (laser diode). The first optical system includes a lens. In addition to the lens, the first optical system may also include an aperture stop, a polarizing plate, and a wavelength plate. The measurement light L1 emitted from the light source passes through the first optical system and is incident on the first main surface Wa of the substrate W. When a polarizing plate and a wavelength plate are provided, the polarization state of the measurement light L1 can be set to a predetermined elliptical polarization. The light-emitting unit 41 (e.g., a light source) is controlled by the control unit 9, which switches on and off the emission of the measurement light L1 from the light-emitting unit 41. The measurement light L1 emitted from the light-emitting unit 41 is incident on a partial incident region (hereinafter referred to as spot SP1) of the first main surface Wa of the substrate W and is reflected by the spot SP1. The spot SP1 has, for example, an elliptical shape, and its major axis is, for example, 100 μm or less. The measurement light L1 reflected by the spot SP1 is received by the light-receiving unit 42. Hereinafter, the measurement light L1 reflected by the spot SP1 will also be referred to as reflected light L2.

[0050] The light receiving unit 42 receives the reflected light L2 and outputs an electrical signal indicating its intensity to the control unit 9. The light receiving unit 42 includes a light receiving sensor (not shown) and a second optical system (not shown). The second optical system includes a lens. In addition to the lens, the second optical system may include a field stop and a rotatably arranged polarizing plate. The polarizing plate is arranged to be rotatable around its optical axis by a rotation drive unit (not shown, including, for example, a stepping motor). The rotation drive unit is controlled by the control unit 9. The reflected light L2 enters the light receiving sensor via the second optical system. The light receiving sensor includes a photoelectric conversion element such as a photodiode, and outputs an electrical signal indicating the intensity of the reflected light L2 to the control unit 9.

[0051] The control unit 9 rotates the polarizing plate of the light receiving unit 42, so that linearly polarized components of the reflected light L2 at each angle are incident on the light receiving sensor. Therefore, the light receiving sensor measures the intensity of the linearly polarized components of the reflected light L2 at each angle and outputs the measurement results to the control unit 9. The control unit 9 performs known polarization analysis to calculate the thickness of the thin film at the spot SP1.

[0052] 2, the light receiving unit 42 may face the substrate W in the Z-axis direction, or may be located outside the substrate W in a plan view as shown in Fig. 1. The same applies to the light emitting unit 41.

[0053] The first displacement driver 5 is provided in the chamber 10 (specifically, the measurement space RM1) and changes the positional relationship between the stage 21 and the measurement unit 4. The first displacement driver 5 may displace either the measurement unit 4 or the stage 21. In the example of FIG. 1, the first displacement driver 5 displaces the stage 21. In other words, the first displacement driver 5 fixes the stage 21 to the chamber 10 so that the stage 21 can be displaced. In the example of FIG. 1, the first displacement driver 5 includes an X-axis driver 51, a Y-axis driver 52, and a rotation driver 53. The X-axis driver 51 moves the stage 21 along the X-axis direction. As a result, the spot SP1 moves along the X-axis direction relative to the first main surface Wa of the substrate W. The Y-axis driver 52 moves the stage 21 along the Y-axis direction. As a result, the spot SP1 moves along the Y-axis direction relative to the first main surface Wa of the substrate W. Each of the X-axis driver 51 and the Y-axis driver 52 includes, for example, a drive source (not shown) such as a motor, and a power transmission unit (not shown) such as a ball screw mechanism. The rotation driver 53 rotates the stage 21 around a rotation axis extending along the Z-axis direction. This causes the spot SP1 to move along the circumferential direction about the rotation axis, relative to the first main surface Wa of the substrate W. The rotation driver 53 includes, for example, a drive source (not shown) such as a motor. The first displacement driver 5 is controlled by the controller 9.

[0054] The control unit 9 controls the first displacement drive unit 5 to move (scan) the spot SP1 on the first main surface Wa of the substrate W. For example, the control unit 9 controls at least two of the X-axis drive unit 51, the Y-axis drive unit 52, and the rotation drive unit 53 to move (scan) the spot SP1 two-dimensionally on the first main surface Wa. The control unit 9 then calculates the film thickness at each position based on the measurement results of the light receiving unit 42 at each position. This allows the control unit 9 to determine the thickness of the thin film over almost the entire surface of the substrate W.

[0055] A circular region having a predetermined width from the periphery of the first main surface Wa of the substrate W may be set as the non-measurement region R1. The predetermined width of the non-measurement region R1 may be, for example, 1 / 50 or less, or 1 / 100 or less, of the diameter of the substrate W. Specifically, the predetermined width may be 3 mm or less, or 1 mm or less. The first displacement driver 5 does not need to move the spot SP1 to the non-measurement region R1. Conversely, the first displacement driver 5 may move the spot SP1 within a measurement region R2 surrounded by the non-measurement region R1 on the first main surface Wa of the substrate W. The spot SP1 moves to the outermost position of the measurement region R2 (a position near the boundary between the non-measurement region R1 and the measurement region R2). Hereinafter, each position on the outermost periphery of the measurement region R2 will be referred to as the edge position. In the examples of FIGS. 2 and 3, the spot SP1 is located at the edge position. The non-measurement region R1 does not necessarily have to be set. In other words, the width of the non-measurement region R1 may be zero. In this case, the position on the peripheral edge of the substrate W corresponds to the edge position.

[0056] The outer peripheral member 3 is provided in the chamber 10 (specifically, the measurement space RM1). The outer peripheral member 3 is provided outside the side surface 21b of the stage 21 and the periphery of the substrate W. As shown in Fig. 3, the outer peripheral member 3 may have an annular shape that surrounds the substrate W in a plan view. In the example of Fig. 3, the outer peripheral member 3 has an annular shape.

[0057] The outer peripheral member 3 may have a plate-like shape. The outer peripheral member 3 has a second upper surface 3a, an outer surface 3b, an inner surface 3c, and a second lower surface 3d. The second upper surface 3a may be a flat surface or a horizontal surface. In the example of FIG. 3, the second upper surface 3a has an annular shape in a plan view. The second lower surface 3d is the surface opposite to the second upper surface 3a and has, for example, the same shape as the second upper surface 3a. The second lower surface 3d is located below the first main surface Wa of the substrate W on the stage 21. The inner surface 3c connects the inner peripheral edge of the second upper surface 3a to the inner peripheral edge of the second lower surface 3d, and the outer surface 3b connects the outer peripheral edge of the second upper surface 3a to the outer peripheral edge of the second lower surface 3d. The outer surface 3b corresponds to the outer peripheral surface of the outer peripheral member 3, and the inner surface 3c corresponds to the inner peripheral surface of the outer peripheral member 3. The outer surface 3b can also be said to be the surface of the outer peripheral member 3 opposite to the substrate W, and the inner surface 3c can also be said to be the surface of the outer peripheral member 3 on the substrate W side.

[0058] The height position of the second upper surface 3a may be close to the height position of the first main surface Wa of the substrate W. Here, if the height positions at different points within the second upper surface 3a are different, the height position of the second upper surface 3a may be the height position of the inner periphery of the second upper surface 3a. The height position of the second upper surface 3a may be at the same height position as the first main surface Wa of the substrate W. In other words, if the second upper surface 3a is a horizontal plane, the second upper surface 3a may be flush with the first main surface Wa. The height position of the second upper surface 3a will be described in detail later.

[0059] The inner surface 3c of the outer peripheral member 3 is located outside the periphery of the substrate W in plan view. In the example of FIG. 2, the inner surface 3c faces the substrate W in the horizontal direction. The distance between the inner surface 3c of the outer peripheral member 3 and the substrate W may be, for example, 1 mm or less, or 0.5 mm or less. In the example of FIG. 1, the inner surface 3c of the outer peripheral member 3 is located inside (toward the substrate W) the side surface 21b of the stage 21, and a portion of the inner side of the second lower surface 3d of the outer peripheral member 3 is located on the first upper surface 21a of the stage 21. This portion of the second lower surface 3d may be in contact with, or specifically, may be in surface contact with, the first upper surface 21a of the stage 21. The outer surface 3b of the outer peripheral member 3 is located outside the side surface 21b of the stage 21. In other words, the outer peripheral member 3 protrudes outward from the stage 21 in plan view. The protrusion amount D1 of the outer peripheral member 3 may be, for example, 1 / 50 or more of the substrate W. As a specific example, the protrusion amount D1 may be 10 mm or more, 20 mm or more, or 30 mm or more.

[0060] The outer peripheral member 3 may be attached to the stage 21 by an attachment member (not shown). The attachment member may be, for example, a screw to attach the outer peripheral member 3 to the stage 21. In this case, the first displacement driver 5 moves the stage 21 and the outer peripheral member 3 together.

[0061] According to the inspection apparatus 1, when gas flows from the outside toward the outer peripheral member 3 within the chamber 10, the gas collides with the outer surface 3b of the outer peripheral member 3. This collision may cause turbulence to occur near the outer surface 3b of the outer peripheral member 3. In the example of FIG. 3, the gas flow is schematically indicated by thick arrows, and the turbulence is schematically indicated by spiral lines. In the inspection apparatus 1, the outer surface 3b of the outer peripheral member 3 is located outside the periphery of the substrate W and the side surface 21b of the stage 21, so the position where turbulence occurs can be kept away from the substrate W.

[0062] In the example of FIG. 1, a transfer space RM2 is formed inside the chamber 10, adjacent to the measurement space RM1 in the horizontal direction (here, the X-axis direction). In the example of FIG. 1, a downflow is formed in the transfer space RM2 by the gas supply unit 8. The transfer space RM2 is connected to the measurement space RM1 in the horizontal direction (here, the X-axis direction), and a portion of the gas that flows into the transfer space RM2 from the gas supply unit 8 flows into the measurement space RM1 and flows inside the measurement space RM1 mainly along the X-axis direction toward the outer peripheral member 3. A portion of the gas collides with the outer surface 3b of the outer peripheral member 3.

[0063] 1, a partition wall 13 that partially separates the measurement space RM1 and the transfer space RM2 may be provided inside the chamber 10. A transfer opening 13a is formed in the partition wall 13, and the measurement space RM1 and the transfer space RM2 are connected to each other through the transfer opening 13a.

[0064] The transfer space RM2 is provided with a transfer unit 7 that transfers the substrate W to and from the stage 21. The transfer unit 7 may also be called a transfer robot. The transfer unit 7 includes a hand 71 and a transfer drive unit 72 that moves the hand 71. The transfer drive unit 72 includes, for example, a drive source such as a motor, and a power transmission unit such as a ball screw mechanism and an arm multi-joint mechanism. The transfer drive unit 72 is controlled by the control unit 9. The substrate W is placed on the hand 71. The transfer unit 7 transfers an unmeasured substrate W to the stage 21 through the transfer opening 13a, or removes a measured substrate W from the stage 21, by moving the hand 71 using the transfer drive unit 72.

[0065] The inspection apparatus 1 may include a plurality of lift pins. The plurality of lift pins have a rod-like shape extending in the Z-axis direction and move up and down while penetrating the stage 21 in the Z-axis direction. The plurality of lift pins move up and down between an upper position where their tips are above the first upper surface 21a of the stage 21 and a lower position where their tips are below the first upper surface 21a of the stage 21. The transport unit 7 may place an unmeasured substrate W on the tips of the plurality of lift pins located at the upper position, and then lower the plurality of lift pins to the lower position, thereby placing the substrate W on the first upper surface 21a of the stage 21. Alternatively, the substrate W after measurement may be lifted by raising the plurality of lift pins, and the transport unit 7 may remove the substrate W from the plurality of lift pins.

[0066] In the example of FIG. 1, the gas supply unit 8 is provided on the ceiling of the chamber 10. Specifically, the gas supply unit 8 is provided at a position opposite the transfer space RM2 in the Z-axis direction. The gas supply unit 8 is, for example, a fan filter unit. The gas supply unit 8 includes a blower (e.g., a fan) and a filter. The gas supply unit 8 also has an air inlet 8a opening in the ceiling of the chamber 10. In the example of FIG. 1, the air inlet 8a faces the transfer space RM2 in the Z-axis direction but does not face the measurement space RM1 in the Z-axis direction. In other words, the air inlet 8a is provided outside the stage 21 in a plan view. The gas supply unit 8 takes in gas (e.g., air) from outside the chamber 10 by rotating the fan, reduces the amount of impurities in the gas through a filter, and then supplies the gas to the transfer space RM2 through the air inlet 8a. The gas mainly flows downward, preventing impurities such as particles from adhering to the main surface of the substrate W. A part of the gas also flows into the measurement space RM1 and collides with the outer surface 3b of the outer peripheral member 3.

[0067] The control unit 9 controls various components of the inspection device 1. For example, the control unit 9 controls the suction unit 22, the measurement unit 4, the first displacement drive unit 5, the transport unit 7, and the gas supply unit 8. The control unit 9 also receives an electrical signal indicating the intensity of the reflected light L2 from the light receiving unit 42 of the measurement unit 4, and calculates the film thickness of the substrate W by polarization analysis based on the intensity.

[0068] FIG. 4 is a block diagram schematically illustrating an example of the internal configuration of the control unit 9. The control unit 9 is an electronic circuit and includes, for example, a data processing unit 91 and a storage unit 92. In the specific example of FIG. 4, the data processing unit 91 and the storage unit 92 are connected to each other via a bus. The data processing unit 91 may be, for example, an arithmetic processing device such as a CPU (Central Processor Unit). The storage unit 92 may include a non-transitory storage unit (e.g., a ROM (Read Only Memory)) 921 and a temporary storage unit (e.g., a RAM (Random Access Memory)) 922. The non-transitory storage unit 921 may store, for example, a program that defines the processing to be performed by the control unit 9. The data processing unit 91 executes this program, allowing the control unit 9 to perform the processing defined in the program. Of course, some or all of the processing performed by the control unit 9 may be performed by hardware such as a dedicated logic circuit.

[0069] Next, an example of a measurement process performed by the inspection apparatus 1 will be outlined. This measurement process is performed by the control unit 9 controlling each component of the inspection apparatus 1. First, the gas supply unit 8 supplies gas. This gas supply continues until the measurement process is completed. Next, the transport unit 7 places the unmeasured substrate W on the stage 21. The stage 21 suction-holds the substrate W. Next, while the light-emitting unit 41 emits the measurement light L1, the first displacement driver 5 moves the stage 21 to two-dimensionally move (scan) the spot SP1 within the measurement region R2 of the substrate W. The light-receiving unit 42 measures the intensity of the reflected light L2 at each position and outputs the measurement results to the control unit 9. The control unit 9 calculates the film thickness at each position based on the intensity of the reflected light L2. When the first displacement driver 5 finishes moving the spot SP1, the light-emitting unit 41 stops emitting the measurement light L1. Next, the transport unit 7 removes the measured substrate W from the stage 21. As described above, the inspection apparatus 1 can measure the film thickness of the substrate W.

[0070] During measurement, part of the gas from the gas supply unit 8 passes through the transfer port 13a in the X-axis direction and may collide with the outer surface 3b of the peripheral member 3. For example, the gas collides with a portion of the outer surface 3b of the peripheral member 3 that faces the transfer port 13a in a plan view. This collision may cause turbulence. However, the position where the turbulence occurs is farther from the substrate W than when the peripheral member 3 is not provided.

[0071] FIG. 5 is a diagram schematically illustrating an example of a comparative example. In the example of FIG. 5, the peripheral member 3 is not provided. As a result, the gas collides with the side surface 21b of the stage 21. This collision can cause turbulence. In the comparative example, since the peripheral member 3 is not provided, the position where the turbulence occurs is close to the substrate W. For example, if the amount of protrusion of the stage 21 from the periphery of the substrate W is less than 1 / 50 or 1 / 100 of the diameter of the substrate W, more specifically, if the protrusion is 3 mm or less, the position where the turbulence occurs will be very close to the periphery of the substrate W.

[0072] During measurement, the first displacement driver 5 moves the spot SP1 on the first main surface Wa of the substrate W as described above. During this movement, the spot SP1 may be positioned at the edge position of the substrate W on the transfer space RM2 side (see FIG. 5). That is, when measuring the film thickness at the edge position of the first main surface Wa of the substrate W on the transfer space RM2 side, the spot SP1 is positioned at the edge position. The distance between the edge position and the periphery of the substrate W is, for example, several mm (e.g., 1 mm), which is close to the periphery of the substrate W. In this case, turbulence occurs at a position relatively close to the spot SP1. As a result, the turbulence acts on the measurement light L1 near the spot SP1. This causes, for example, the measurement light L1 to fluctuate, resulting in a decrease in measurement accuracy.

[0073] In contrast, the inspection device 1 according to the first embodiment is provided with the outer peripheral member 3. This allows the position where turbulence occurs to be moved horizontally away from the substrate W. Therefore, the turbulence is less likely to affect the measurement light L1 near the spot SP1, and as a result, the measurement accuracy of the inspection device 1 can be improved.

[0074] As described above, if the protrusion amount D1 (see FIG. 2) of the peripheral member 3 is 1 / 50 or more of the diameter of the substrate W, the position where turbulence occurs can be more appropriately distanced from the substrate W, and the influence of turbulence on the measurement light L1 can be more appropriately reduced. Specifically, if the protrusion amount D1 is 10 mm or more, the influence of turbulence can be more appropriately reduced, and if the protrusion amount D1 is 20 mm or more (2 / 30 or more of the diameter of the substrate W), the influence of turbulence on the measurement light L1 can be further reduced.

[0075] Furthermore, the width T2 in the Z-axis direction of the outer surface 3b of the peripheral member 3 (hereinafter referred to as the height width) may be smaller than, for example, the height width T1 of the side surface 21b of the stage 21. In other words, the outer surface 3b may be thinner than the side surface 21b of the stage 21. When the peripheral member 3 has a flat plate shape, the height width T2 of the outer surface 3b corresponds to the thickness of the peripheral member 3. Similarly, when the stage 21 has a flat plate shape, the height width T1 of the side surface 21b corresponds to the thickness of the stage 21.

[0076] Thus, if the height T2 of the outer surface 3b of the peripheral member 3 is small, the generation of turbulence itself can be reduced. As shown in FIG. 5, because the height T1 of the stage 21 is relatively large, in the comparative example, the gas collides with the side surface 21b of the stage 21 over a wide area. This collision generates turbulence, resulting in a relatively wide turbulent generation area. In contrast, if the height T2 of the peripheral member 3 is small, the turbulent generation area can be narrowed, thereby reducing the generation of turbulence. Therefore, the turbulent flow is less likely to reach the measurement light L1, further reducing the effect of the turbulence on the measurement light L1. For example, if the height T2 of the peripheral member 3 is half or less of the height T1 of the stage 21, the turbulent generation area can be appropriately reduced. If it is one-quarter or less, the turbulent generation area can be further reduced. Alternatively, the height T2 may be two times or less the thickness of the substrate W or less. As a more specific example, if the height width T2 of the outer peripheral member 3 is 2 mm or less, the area where turbulence occurs can be more appropriately reduced, and if the height width T2 is 1 mm or less, the area where turbulence occurs can be further reduced.

[0077] The gas that collides with the outer surface 3b of the peripheral member 3 splits into two flows, one above the peripheral member 3 and one below the peripheral member 3. In the example of FIG. 2, the height position of the lower end of the outer surface 3b of the peripheral member 3 is lower than the first main surface Wa of the substrate W and higher than the lower end of the side surface 21b of the stage 21. For example, the lower end of the outer surface 3b may be higher than the center of the side surface 21b; in the example of FIG. 2, it is at the same height as the first upper surface 21a of the stage 21. Because the lower end of the outer surface 3b is located relatively high, more gas can flow below the peripheral member 3. Conversely, the amount of gas flowing above the peripheral member 3 toward the first main surface Wa of the substrate W can be reduced. This reduces the effect of the gas on the measurement light L1, further improving measurement accuracy.

[0078] Furthermore, as shown in FIG. 2, when the height position of the second upper surface 3a of the peripheral member 3 is near the height position of the first main surface Wa of the substrate W, the gas tends to flow along the second upper surface 3a of the peripheral member 3 and the first main surface Wa of the substrate W. In other words, turbulence is unlikely to occur. The height position of the second upper surface 3a of the peripheral member 3 does not necessarily have to coincide with the height position of the first main surface Wa of the substrate W; some deviation is acceptable. FIG. 6 is a diagram schematically illustrating an example of the configuration of the inspection apparatus 1 near the periphery of the substrate W. The second upper surface 3a of the peripheral member 3 may be located above a first height position H1 and below a second height position H2, which will be described below. The first height position H1 is, for example, a position two times the thickness of the substrate W below the first upper surface 21a of the stage 21, and the second height position H2 is, for example, a position two times the thickness of the substrate W above the first main surface Wa of the substrate W. According to this, the step generated between the outer peripheral member 3 and the stage 21 is small, so that the turbulence of the gas can be appropriately reduced.

[0079] Furthermore, the height position of the second upper surface 3a of the peripheral member 3 may be equal to or higher than a height position H11, which will be described next. The height position H11 is the same height position as the first upper surface 21a of the stage 21. Furthermore, the height position of the second upper surface 3a of the peripheral member 3 may be equal to or lower than a height position H21, which will be described next. The height position H21 is the same height position as the first main surface Wa of the substrate W. In the example of FIG. 6, the second upper surface 3a is flush with the first upper surface 21a. This range can further reduce the step that occurs between the peripheral member 3 and the stage 21.

[0080] As shown in FIG. 6, the inner surface 3c of the outer peripheral member 3 may be in contact with the side surface 21b of the stage 21. Alternatively, as shown in FIG. 2, the inner surface 3c may be located more inward (toward the substrate W) than the side surface 21b. In this case, the gap between the outer peripheral member 3 and the substrate W may be 1 mm or less, 0.5 mm or less, or 0.3 mm or less. The inner surface 3c of the outer peripheral member 3 may be in contact with the substrate W. If the gap between the outer peripheral member 3 and the substrate W is narrow in this way, the flow of gas is less likely to be disturbed.

[0081] The gas inside the chamber 10 collides with the inner wall of the chamber 10 and various components inside the chamber 10. This collision changes the direction of the gas flow, and as a result, for example, the gas may flow toward the stage 21 from the side opposite the transfer port 13a (see the dashed arrow in FIG. 3). The direction in which the gas flows depends on the shape of the inner wall of the chamber 10 and the shapes of the various components inside the chamber 10. In the first embodiment, the gas also flows in parts of the outer peripheral member 3 other than the part directly facing the transfer port 13a in a plan view.

[0082] In the above example, the peripheral member 3 has an annular shape that surrounds the entire periphery of the substrate W in plan view, and therefore the gas also collides with the outer surface 3b of the peripheral member 3. Therefore, the peripheral member 3 can also move the position where turbulence caused by the gas is generated away from the substrate W.

[0083] During measurement, the first displacement driver 5 moves (scans) the spot SP1 over the first main surface Wa of the substrate W, so that the spot SP1 is also positioned at the edge position on the opposite side from the transfer space RM2. Although the spot SP1 may approach the position where turbulence is generated by the gas, the peripheral member 3 can increase the distance between the spot SP1 and the position where turbulence is generated, thereby reducing the influence of turbulence on the measurement light L1. In other words, because the peripheral member 3 has an annular shape, even if an airflow is generated from any position around the peripheral member 3 toward the peripheral member 3, the position where turbulence is generated by the airflow can be moved radially outward from the substrate W. This improves the measurement accuracy of the film thickness at any edge position on the periphery of the measurement region R2 of the substrate W.

[0084] Furthermore, in the first embodiment, the outer peripheral member 3 is formed separately from the stage 21. This eliminates the need to increase the diameter of the first upper surface 21a of the stage 21. This makes it easier to manufacture a stage 21 with a highly flat first upper surface 21a. This allows the stage 21 to adsorb the substrate W more appropriately.

[0085] Furthermore, the outer peripheral member 3 may be formed from a material different from that of the stage 21. The stage 21 is formed from, for example, at least one of metal, ceramic, and glass. The outer peripheral member 3 is formed from, for example, a material having a density lower than that of the stage 21. The material of the outer peripheral member 3 may be metal or resin. When the outer peripheral member 3 is formed from a material with a low density, the mass of the outer peripheral member 3 can be reduced. This reduces the load on the first displacement drive unit 5. As a result, the power consumption of the first displacement drive unit 5 can be reduced.

[0086] When the thickness of the peripheral member 3 is smaller than the thickness of the stage 21, the mass of the peripheral member 3 can be appropriately reduced. The thickness of the peripheral member 3 may be half or less of the thickness of the stage 21, or may be one-fourth or less of the thickness of the substrate W, or may be two times or less than the thickness of the substrate W. This allows the load on the first displacement driver 5 to be appropriately reduced.

[0087] Second Embodiment An example of the configuration of the inspection device 1 according to the second embodiment is similar to that of the inspection device 1 according to the first embodiment. However, a specific example of the peripheral member 3 differs from that of the peripheral member 3 according to the first embodiment. FIG. 7 is a plan view schematically showing a first example of the configuration of the peripheral member 3 according to the second embodiment. In the second embodiment, the peripheral member 3 does not surround the entire periphery of the substrate W in plan view, but is provided at a position adjacent to a part of the peripheral edge of the substrate W in plan view. In the example of FIG. 7, the peripheral member 3 has an arc shape extending in a direction along the peripheral edge of the substrate W in plan view. In the example of FIG. 6, the central angle of the arc is smaller than 180 degrees.

[0088] The inspection device 1 according to the second embodiment also allows the peripheral member 3 to move the turbulent flow generation position away from the edge position (i.e., spot SP1) when measuring the edge position of the substrate W that is adjacent to the peripheral member 3 in the radial direction. This improves the measurement accuracy for the film thickness at the edge position.

[0089] In plan view, the peripheral member 3 may be located upstream of the substrate W on the stage 21 in the airflow flowing toward the stage 21. As shown in FIG. 7, an exhaust port 13b may be formed in the sidewall of the chamber 10. In the example of FIG. 7, the exhaust port 13b is aligned horizontally (here, in the X-axis direction) with the transfer port 13a in plan view. The peripheral member 3, stage 21, and substrate W are located between the transfer port 13a and the exhaust port 13b in plan view. Gas within the chamber 10 may be sucked through the exhaust port 13b. In this case, the gas flows mainly from the transfer port 13a toward the exhaust port 13b. Conversely, almost no airflow is generated from the exhaust port 13b toward the stage 21.

[0090] Therefore, in the second embodiment, the peripheral member 3 is provided upstream of the airflow in plan view, that is, closer to the air supply port 8a (transfer port 13a) than the substrate W. The transfer port 13a can be said to function as an air supply port for the measurement space RM1. As a specific example, the peripheral member 3 may be provided in a region of the periphery of the substrate W that directly faces the transfer port 13a in plan view. Conversely, the peripheral member 3 is provided in plan view, avoiding at least a part of the side of the substrate W opposite the air supply port 8a (that is, the exhaust port 13b side).

[0091] Also, here, as an example, the rotation driver 53 rotates the peripheral member 3 integrally with the stage 21. In this case, the control unit 9 may control the rotation driver 53 to rotate the stage 21 and peripheral member 3 to a measurement rotation position, which will be described below, before measurement of the substrate W. The measurement rotation position is a rotation position suitable for measurement, specifically, a rotation position where the peripheral member 3 is located upstream of the airflow relative to the substrate W (i.e., closer to the air inlet 8a). Then, with the peripheral member 3 located at the measurement rotation position, the control unit 9 controls the measurement unit 4, the X-axis driver 51, and the Y-axis driver 52. As a result, with the peripheral member 3 located at the measurement rotation position, the spot SP1 moves (scans) two-dimensionally within the measurement region R2 of the substrate W. The control unit 9 calculates the film thickness at each position by performing ellipsometry on the reflected light L2 at each position.

[0092] As described above, the peripheral member 3 is located closer to the gas inlet 8a than the substrate W in a plan view, at least during measurement. Therefore, the gas flowing with relatively high momentum from the gas inlet 8a toward the peripheral member 3 collides with the outer surface 3b of the peripheral member 3. This makes it possible to move the position where turbulence is generated by the peripheral member 3 away from the substrate W. This makes it possible to improve the measurement accuracy at the edge position adjacent to the peripheral member 3.

[0093] In the second embodiment, although gas may flow from the outside toward a portion of the stage 21 where the peripheral member 3 is not provided, it is desirable that the gas flow in that portion have a force that is acceptable for measurement. In other words, the peripheral member 3 is provided in the portion where the gas flows with a force that is not acceptable for measurement, and the peripheral member 3 is omitted when the gas flows with a force that is acceptable for measurement. This makes it possible to reduce the manufacturing cost of the inspection device 1 while improving the measurement accuracy.

[0094] FIG. 8 is a plan view schematically illustrating a second example of the configuration of the peripheral member 3 according to the second embodiment. As shown in FIG. 8, the peripheral member 3 has a shape that avoids the transport path of the transport unit 7. The transport path of the transport unit 7 is a space through which the substrate W and hand 71 move when transferring the substrate W to and from the stage 21. For example, the transport unit 7 moves the hand 71 on which the substrate W is placed to just above the stage 21 and then lowers it. Here, as an example, it is assumed that no lift pins are provided. This lowering allows the substrate W to be transferred from the hand 71 to the first upper surface 21a of the stage 21. Note that the stage 21 has a recess 212 into which the lowered hand 71 is inserted. The recess 212 may penetrate the stage 21 in the Z-axis direction or may be a groove.

[0095] The peripheral member 3 has a shape that avoids the transport path through which the hand 71 passes while descending. In the example of FIG. 8, the peripheral member 3 has a C-shape in a plan view. The central angle of the peripheral member 3 is greater than 180 degrees. In other words, the peripheral member 3 has a first end 31 and a second end 32 that face each other with a gap between them, and has a shape that extends in an arc from the first end 31 to the second end 32. The gap between the first end 31 and the second end 32 is wider than that of the hand 71. Therefore, the hand 71 can pass through the gap between the first end 31 and the second end 32.

[0096] 9 is a flowchart showing an example of the operation of the inspection apparatus 1 according to the second embodiment. Here, the gas supply unit 8 continues to supply gas. First, the rotation drive unit 53 rotates the stage 21 to a transfer rotation position, which will be described next (step S1: transfer position process). The transfer rotation position is a rotation position where the space between the first end 31 and the second end 32 is located on the transfer space RM2 side, and where the hand 71 can pass through the space between the first end 31 and the second end 32 when transferring the substrate W in and out (FIG. 8).

[0097] Next, the transfer unit 7 delivers the substrate W to the stage 21 (step S2: loading step). At this time, the outer peripheral member 3 is positioned at the transfer rotation position, so that collision between the transfer unit 7 and the outer peripheral member 3 can be avoided.

[0098] Next, the rotation driver 53 rotates the outer peripheral member 3 to the measurement rotation position (step S3: measurement position process). The measurement rotation position is a rotation position different from the transfer rotation position, and is a rotation position where the outer peripheral member 3 is located upstream of the substrate W in the airflow. As an example, the measurement rotation position is a rotation position where the outer peripheral member 3 is located closer to the transfer opening 13a than the substrate W. The measurement rotation position may be a position shifted by half a circumference (180 degrees) from the transfer rotation position. When the outer peripheral member 3 is located at the measurement rotation position, the gas flowing from the transfer opening 13a can be caused to collide with the outer peripheral member 3, and the position where turbulence occurs can be moved away from the substrate W.

[0099] Next, the inspection apparatus 1 measures the film thickness of the substrate W (step S4: measurement step). Specifically, while the light emitting unit 41 emits the measurement light L1, the X-axis driving unit 51 and the Y-axis driving unit 52 move (scan) the spot SP1 two-dimensionally within the measurement region R2 of the substrate W. The control unit 9 then calculates the film thickness based on the intensity of the reflected light L2 measured at each position. During this measurement, the outer peripheral member 3 is positioned at the measurement rotation position, so that the position where turbulence caused by the relatively powerful airflow from the transfer port 13a occurs can be moved away from the substrate W. This allows the inspection apparatus 1 to measure the film thickness with high measurement accuracy.

[0100] When the measurement is completed, the rotation drive unit 53 rotates the outer peripheral member 3 again to the transfer rotation position (step S5: transfer position step). Next, the transfer unit 7 removes the measured substrate W from the stage 21 (step S6: carry-out step).

[0101] This operation can also be applied to the outer peripheral member 3 according to the first example of the second embodiment (FIG. 7). In the example of FIG. 7, the outer peripheral member 3 positioned at the transfer rotation position is shown schematically by imaginary lines. In other words, it can be said that the outer peripheral member 3 according to the first example also has a shape that avoids the transfer path of the transfer unit 7.

[0102] In the above example, the peripheral member 3 is positioned on the transfer port 13a side during measurement, but this is not necessarily limited to this. For example, it is also possible that during measurement, almost no gas flows from the transfer port 13a, and gas flows toward the stage 21 from another direction. For example, it is also possible that the transfer port 13a is closed by a shutter, and gas is supplied to the measurement space RM1 from another direction. In this case, the peripheral member 3 is positioned in the other direction (i.e., upstream of the airflow) relative to the substrate W, at least during measurement. This can improve the measurement accuracy of the inspection device 1.

[0103] Third Embodiment FIG. 10 is a diagram schematically illustrating an example of a portion of the configuration of the inspection apparatus 1 according to the third embodiment. The inspection apparatus 1 according to the third embodiment has the same configuration as the first or second embodiment, except for the second displacement drive unit 33. The second displacement drive unit 33 moves the peripheral member 3 between a measurement position and a transfer position, which will be described below. The measurement position is a position where the peripheral member 3 is horizontally adjacent to the substrate W or the stage 21. Specifically, the measurement position is a position where the second upper surface 3a of the peripheral member 3 is equal to or greater than the first height position H1 and equal to or less than the second height position H2. More specifically, the measurement position may be a position where the second upper surface 3a of the peripheral member 3 is equal to or greater than the height position H11 and equal to or less than the height position H21. In the example of FIG. 10, the peripheral member 3 positioned at the measurement position is indicated by a solid line.

[0104] The transport position is a position farther from the stage 21 than the measurement position, and is a position where the outer peripheral member 3 does not interfere with the transport path of the transport unit 7. The second displacement drive unit 33 may raise the outer peripheral member 3. The transport position may be higher than the measurement position. In Figure 10, the outer peripheral member 3 positioned at the transport position is shown by an imaginary line. In this case, the second displacement drive unit 33 can also be said to be an elevation drive unit. The second displacement drive unit 33 may be an air cylinder. Alternatively, the second displacement drive unit 33 may include a drive source such as a motor and a power transmission unit having a feed screw or the like.

[0105] The second displacement drive unit 33 may be movable by the first displacement drive unit 5. In other words, the first displacement drive unit 5 may displace the stage 21, the second displacement drive unit 33, and the outer peripheral member 3 as a unit. In other words, the first displacement drive unit 5 is connected to the second displacement drive unit 33.

[0106] An example of the operation of the inspection apparatus 1 according to the third embodiment is the same as that shown in FIG. 9. However, in steps S1 and S5, the second displacement drive unit 33 moves the outer peripheral member 3 to the transfer position, and in step S3, the second displacement drive unit 33 moves the outer peripheral member 3 to the measurement position. According to the third embodiment, even if the outer peripheral member 3 has an annular shape, the second displacement drive unit 33 can move the outer peripheral member 3 between the transfer position and the measurement position. Furthermore, if the outer peripheral member 3 has an annular shape, the position where turbulence caused by gas from any position outside the outer peripheral member 3 is generated can be moved away from the substrate W, as in the first embodiment.

[0107] The outer peripheral member 3 may be divided into multiple members in the circumferential direction. In this case, multiple second displacement drivers 33 may be provided to move each of the multiple arc members that make up the outer peripheral member 3. Each second displacement driver 33 may, for example, move the corresponding arc member between its respective transport position and measurement position. The measurement position for each arc member is a position where the multiple arc members form the annular outer peripheral member 3. The transport position may, for example, be a position outside the measurement position in a plan view.

[0108] <Fourth embodiment> In the first to third embodiments, the peripheral member 3 moves the turbulent flow generation position away from the substrate W in the horizontal direction. This allows the turbulent flow generation position to be moved away from the measurement light L1 near the spot SP1. However, referring to FIG. 2, part of the optical path of the measurement light L1 may be located on top of the turbulent flow generation position. The distance in the Z-axis direction between the turbulent flow generation position and the optical path of the measurement light L1 in FIG. 2 is shorter than in the case of FIG. 4. Therefore, although the influence of the turbulence is relatively small, there may be cases where the influence cannot be ignored. Therefore, the fourth embodiment aims to further reduce the influence of the turbulence on the measurement light L1.

[0109] Fig. 11 is a diagram schematically showing an example of a part of the configuration of the inspection device 1 according to the fourth embodiment. Fig. 12 is a plan view schematically showing an example of a part of the configuration of the inspection device 1 according to the fourth embodiment. The inspection device 1 according to the fourth embodiment differs from the inspection devices 1 according to the first to third embodiments at least in the presence or absence of a first bottom portion 61.

[0110] The first bottom 61 is provided in the chamber 10 at a position described below. That is, the first bottom 61 is provided above both the second upper surface 3a of the outer peripheral member 3 and the first main surface Wa of the substrate W, below a first portion of the optical path of the measurement light L1 emitted from the light-emitting unit 41, and opposite the first portion in the Z-axis direction. The first bottom 61 is also provided at a position that avoids the optical path of the measurement light L1. In the examples of FIGS. 11 and 12, the first portion of the optical path is a part of the optical path of the measurement light L1 between the light-emitting unit 41 and the spot SP1.

[0111] The first bottom 61 is provided above both the second upper surface 3a of the peripheral member 3 and the first main surface Wa of the substrate W, and therefore does not interfere with the displacement of the stage 21 by the first displacement drive unit 5. Furthermore, the first bottom 61 is provided below the first portion of the optical path of the measurement light L1 and at a position that avoids the optical path of the measurement light L1, and therefore does not interfere with the measurement light L1 either.

[0112] Here, the positional relationship between the first bottom portion 61 and the peripheral member 3 during measurement of the edge position of the substrate W on the light-emitting unit 41 side will be described. The first bottom portion 61 has a portion located outside the outer surface 3b of the peripheral member 3 in a planar view. In other words, when the first displacement driver 5 positions the spot SP1 at a predetermined edge position (here, the edge position on the light-emitting unit 41 side), at least a portion of the first bottom portion 61 is located outside the peripheral member 3 (on the opposite side from the substrate W) in a planar view. As an example, the first bottom portion 61 extends from inside to outside the outer surface 3b of the peripheral member 3 in a planar view. In other words, the inner portion of the first bottom portion 61 faces the peripheral member 3 in the Z-axis direction, and the outer portion of the first bottom portion 61 does not face the peripheral member 3 in the Z-axis direction. Directly below the outer portion of the first bottom portion 61, gas collides with the outer surface 3b of the peripheral member 3, generating turbulence.

[0113] 11 and 12, the first bottom portion 61 may have a plate-like shape. The first bottom portion 61 is provided, for example, with its thickness direction aligned with the Z-axis direction. The first bottom portion 61 may have a rectangular shape in a plan view.

[0114] In the example of FIG. 11, the inspection device 1 is also provided with a side wall 63. The side wall 63 extends upward from the end of the first bottom portion 61 on the light-emitting unit 41 side. In the example of FIG. 11, the light-emitting unit 41 is disposed so as to penetrate the side wall 63. That is, in the example of FIG. 11, the side wall 63 and the first bottom portion 61 are fixed to the light-emitting unit 41. The light-emitting unit 41 may be attached to the side wall 63 by an attachment member such as a screw.

[0115] 11 and 12, the inspection device 1 is also provided with a second bottom 62. In a plan view, the second bottom 62 is provided on the opposite side of the spot SP1 from the first bottom 61. The second bottom 62 is provided above both the second upper surface 3a of the peripheral member 3 and the first main surface Wa of the substrate W, below a second portion of the optical path of the measurement light L1 emitted from the light-emitting unit 41, and opposite the second portion in the Z-axis direction. In the examples of FIGS. 11 and 12, the second portion of the optical path is a part of the optical path of the measurement light L1 between the spot SP1 and the light-receiving unit 42. The second bottom 62 is provided at a position that avoids the optical path of the measurement light L1.

[0116] The measurement light L1 emitted from the light-emitting unit 41 passes through the space between the first bottom 61 and the second bottom 62 and is incident on the spot SP1. The measurement light L1 reflected by the spot SP1 (i.e., the reflected light L2) passes through the space between the first bottom 61 and the second bottom 62 and is incident on the light-receiving unit 42. The second bottom 62 may have a plate-like shape, or may have a rectangular shape in a planar view as shown in FIG. 12. The second bottom 62 is provided, for example, with its thickness direction aligned with the Z-axis direction.

[0117] In the example of FIG. 11, the inspection device 1 is also provided with a side wall 64. The side wall 64 extends upward from the end of the second bottom portion 62 on the light receiving unit 42 side. The side wall 64 is a member facing the side wall 63. In the example of FIG. 11, the light receiving unit 42 is disposed to pass through the side wall 64. That is, in the example of FIG. 11, the side wall 64 and the second bottom portion 62 are fixed to the light receiving unit 42. The light receiving unit 42 may be attached to the side wall 64 by an attachment member such as a screw.

[0118] In the example of FIG. 11, the inspection device 1 is also provided with a ceiling portion 67. The ceiling portion 67 is provided above the optical path of the measurement light L1 and connects the upper ends of the side walls 63 and 64. The ceiling portion 67 is a member facing each of the first bottom portion 61 and the second bottom portion 62. The ceiling portion 67 has, for example, a plate-like shape and is provided with its thickness direction along the Z-axis direction. The ceiling portion 67 has, for example, a rectangular shape in a plan view. In the example of FIG. 11, the first bottom portion 61, the second bottom portion 62, the side walls 63 and 64, and the ceiling portion 67 can form an optical path enclosing member 6 that encloses a first portion and a second portion of the optical path of the measurement light L1.

[0119] FIG. 13 is a perspective view schematically illustrating an example of the configuration of the light path enclosing member 6. The light path enclosing member 6 further includes a side wall 65 and a side wall 66. The side wall 65 connects one end of the first bottom 61, the second bottom 62, the side wall 63, the side wall 64, and the ceiling 67, and the side wall 66 connects the other end of the first bottom 61, the second bottom 62, the side wall 63, the side wall 64, and the ceiling 67. The side wall 66 faces the side wall 65 across the optical path of the measurement light L1. The space between the first bottom 61 and the second bottom 62 may also be referred to as an opening. In the illustrated example, the side wall 63 to the side wall 66 have a plate-like shape. Therefore, in the illustrated example, the light path enclosing member 6 is a rectangular hollow member.

[0120] 11, the spot SP1 is located at the edge of the substrate W on the side of the light-emitting unit 41. In this state, part of the measurement light L1 traveling diagonally downward from the light-emitting unit 41 toward the spot SP1 approaches the position where turbulence occurs in the Z-axis direction. In particular, when the incident angle θ1 of the measurement light L1 is large, such as 60 degrees or more, the distance in the Z-axis direction between the measurement light L1 and the position where turbulence occurs becomes short.

[0121] However, in the fourth embodiment, the first bottom 61 is interposed between a portion of the measurement light L1 and the position where the turbulence is generated. Therefore, the turbulence is blocked by the first bottom 61 and hardly affects the measurement light L1 above the first bottom 61. That is, in the fourth embodiment, the peripheral member 3 generates turbulence at a position horizontally separated from the substrate W, and the first bottom 61 is positioned above the position where the turbulence is generated, thereby further reducing the effect of the turbulence on the measurement light L1. Therefore, according to the fourth embodiment, the measurement accuracy of the inspection device 1 can be further improved.

[0122] In the above example, a second bottom 62 is also provided. Here, a case will be described in which the spot SP1 is located at the edge position of the substrate W on the light receiving unit 42 side. In FIG. 12, the first bottom 61 and the second bottom 62 at this time are indicated by dashed lines. At this time, the second bottom 62 has a portion located outside the outer surface 3b of the peripheral member 3 in a planar view. More specifically, the second bottom 62 extends from the inside to the outside of the outer surface 3b of the peripheral member 3 in a planar view. In other words, the inner portion of the second bottom 62 faces the peripheral member 3 in the Z-axis direction, and the outer portion of the second bottom 62 does not face the peripheral member 3 in the Z-axis direction.

[0123] Directly below the outer portion of the second bottom 62, gas may collide with the outer surface 3b of the outer peripheral member 3, causing turbulence. The turbulence is blocked by the second bottom 62, and therefore has almost no effect on the measurement light L1 directly above the second bottom 62. This further improves the measurement accuracy of the inspection device 1.

[0124] In the above example, the light path enclosing member 6 also includes side walls 63, 64, 65, and 66. Therefore, gas flowing horizontally toward the measurement light L1 is blocked by these side walls. In the above example, the light path enclosing member 6 also includes a ceiling portion 67. Therefore, gas flowing from above toward the measurement light L1 is blocked by the ceiling portion 67. Therefore, the gas is less likely to affect the measurement light L1, and the light path enclosing member 6 can further improve the measurement accuracy of the inspection device 1.

[0125] In the above example, the light path enclosing member 6 is connected to the measurement unit 4 (i.e., the light emitter 41 and the light receiver 42), but this is not necessarily limited to this. The light path enclosing member 6 may be fixed to the chamber 10 via a fixing member different from that of the measurement unit 4.

[0126] Furthermore, the light path enclosing member 6 only needs to enclose the measurement light L1 while avoiding the light path of the measurement light L1, and may have, for example, a cylindrical shape that encloses a part of the light path of the measurement light L1. In this case, a first light path enclosing member having a cylindrical shape that encloses a first part of the light path of the measurement light L1, and a second light path enclosing member having a cylindrical shape that encloses a second part of the light path of the measurement light L1 may be provided. The part of the first light path enclosing member below the measurement light L1 corresponds to the first bottom 61, and the part of the second light path enclosing member below the measurement light L1 corresponds to the second bottom 62.

[0127] In each figure, the light-emitting unit 41 and the light-receiving unit 42 are aligned in the X-axis direction in a plan view. However, this is not necessarily limited to this. FIG. 14 is a plan view schematically illustrating another example of a portion of the configuration of the inspection device 1 according to the fourth embodiment. In the example of FIG. 14, the light-emitting unit 41 and the light-receiving unit 42 are aligned in a direction intersecting the X-axis direction. In the example of FIG. 14, when measuring the edge position of the substrate W on the light-emitting unit 41 side, a portion of the first bottom 61 is located outside the peripheral member 3 in a plan view. As a result, turbulence is blocked by the first bottom 61, and therefore has almost no effect on the measurement light L1 above the first bottom 61. The same applies to the second bottom 62.

[0128] As described above, the inspection device 1 has been described in detail, but the above description is merely an example in all respects, and this disclosure is not limited thereto. Furthermore, the various modifications described above can be combined and applied as long as they are not mutually inconsistent. It is understood that many modifications not exemplified can be envisioned without departing from the scope of this disclosure. [Explanation of symbols]

[0129] 10 Chambers 21 Stages 21a 1st top surface 21b Side 3 Peripheral parts 33 Second displacement drive unit 3a 2nd top surface 3b External surface 3c Inside surface 4 Measuring part 41 Light-emitting part 42 Light receiving part 5. First displacement drive unit 6 Optical path enclosing member 61 1st bottom 62 2nd bottom 7. Conveyor 71 hands 8 Gas supply section 8a Air supply port W substrate Wa First principal surface Wb 2nd principal surface H1 First height position H2 Second height position

Claims

1. a chamber; a stage provided in the chamber, the stage having a first upper surface supporting a second main surface of a substrate having a first main surface and a second main surface, and a side surface connected to a periphery of the first upper surface; an outer peripheral member provided within the chamber, the outer peripheral member having an inner surface located outside the side surface of the stage and the periphery of the substrate, an outer surface located outside the inner surface, and a second upper surface connecting an upper end of the inner surface and an upper end of the outer surface and having a horizontal portion; a measurement unit provided in the chamber, the measurement unit including a light-emitting unit that emits measurement light onto the first main surface of the substrate, and a light-receiving unit that receives the measurement light reflected by the first main surface of the substrate; a first displacement driving unit that changes a positional relationship between the stage and the measurement unit to move a spot of the measurement light relatively to the first main surface of the substrate and move the spot to an edge position of the first main surface on the outer peripheral member side; a gas supply unit having an air inlet and supplying gas from the air inlet into the chamber; An inspection device comprising:

2. The inspection device according to claim 1, In a plan view, the air supply port is provided outside the stage, The outer peripheral member is positioned closer to the air intake port than the substrate on the stage in a plan view.

3. The inspection device according to claim 1 or 2, an inspection device, wherein the height position of the second upper surface of the peripheral member is at or above a first height position that is twice the thickness of the substrate below the first upper surface of the stage, and at or below a second height position that is twice the thickness of the substrate above the first main surface of the substrate.

4. The inspection device according to claim 1 or 2, An inspection apparatus, wherein the height position of the lower end of the outer surface is higher than the lower end of the side surface of the stage.

5. The inspection device according to claim 1 or 2, An inspection apparatus, wherein the height and width of the outer surface are thinner than the side surfaces of the stage.

6. The inspection device according to claim 1 or 2, The outer peripheral member has an annular shape surrounding the substrate in a plan view.

7. The inspection device according to claim 1 or 2, An inspection device, wherein the outer peripheral member has a shape that avoids a transport path through which a hand of a transport unit that transports the substrate to the stage passes.

8. The inspection device according to claim 7, the peripheral member has a shape extending along the periphery of the substrate in a plan view, the first displacement driving unit rotates the stage and the outer peripheral member together, the transport unit delivers the substrate to the stage in a state where the first displacement drive unit positions the outer peripheral member at a transport rotation position; the conveying rotation position is a position where the outer peripheral member avoids the conveying path of the conveying section, An inspection device, wherein the light emitting unit emits the measurement light while the first displacement driving unit positions the outer peripheral member at a measurement rotation position different from the transport rotation position.

9. The inspection device according to claim 1 or 2, the first displacement drive unit displaces the stage and the outer peripheral member together, An inspection apparatus, wherein the density of the peripheral member is lower than the density of the stage.

10. The inspection device according to claim 1 or 2, a second displacement driving unit that moves the outer peripheral member between a measurement position that is adjacent to the stage or the substrate in the horizontal direction and a transport position that is farther from the stage than the measurement position, The transport position is a position that avoids a transport path of a transport unit that transports the substrate.

11. The inspection device according to claim 1 or 2, a first bottom portion provided above the outer peripheral member, below a first portion of the optical path of the measurement light, and facing the first portion of the measurement light in the vertical direction; the light emitting unit emits the measurement light obliquely downward, An inspection apparatus wherein, when the first displacement driving unit positions the spot at the edge position, at least a portion of the first bottom is located on the opposite side of the outer peripheral member from the substrate in a planar view.

12. The inspection device according to claim 11, The inspection device further includes a second bottom portion located above the outer peripheral member, below a second portion of the optical path of the measurement light that is on the opposite side of the spot from the first portion, and vertically opposite the second portion of the measurement light.

13. The inspection device according to claim 11, An inspection device comprising: an optical path enclosing member that includes the first bottom and encloses the first portion of the measurement light.

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