Probe with planar non-biased spring element for contacting electronic components, method for making same, and method for using same - Patents.com

Abstract

A probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mount and retention arrangement. The probes may include a lower retention mechanism protruding from a probe body having a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes in a lower array plate, and an upper retention mechanism extending laterally from the probe body and undergoing lateral displacement relative to the upper plate probe holes such that the upper retention mechanism can no longer longitudinally pass the extension of the upper plate probe holes in the upper array plate.

Description

[Technical field]

[0001] [Related Applications] This application claims priority to and benefit of the filing date of U.S. Patent Application No. 18 / 295,712, filed April 4, 2023, and U.S. Provisional Patent Application No. 63 / 327,926, filed April 6, 2022, the entire disclosures of which are hereby incorporated by reference in their entireties.

[0002] Embodiments of the invention relate to microprobes (e.g., for use in water level testing or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components), and more particularly to pin-like microprobes (i.e., microprobes having a vertical or longitudinal height that is greater than their width (e.g., in some embodiments, 5 times greater, in other embodiments, 10 times greater, and in still other embodiments, 20 times greater) or button-like probes in which the spring elements have a planar configuration when in an unactuated state. In some embodiments, the microprobes are produced, at least in part, by electrochemical manufacturing methods, and more particularly by multi-layer, multi-material electrochemical manufacturing methods, where in some embodiments, a plurality of probes are used while secured in an array format that includes one or more plates with through holes that engage features on the probes and / or other array retention structures. [Background technology]

[0003] probe Many electrical contact probe and pin configurations have been commercially used or proposed, some of which may qualify as prior art and others of which may not. Such pins, probes, and methods of making are described, for example, in Patent Publication Nos. U.S. 2005-0104609, U.S. 2006-0006888, U.S. 2005-0184748, U.S. 2006-0108678, U.S. 2006-0238209, and in Patent Nos. U.S. 7,640,651, U.S. 7,265,565, U.S. 7,412,767, U.S. 7,273,812, U.S. 10,215,775, and U.S. 11,262,383. Electrochemical manufacturing:

[0004] Electrochemical fabrication techniques for forming three-dimensional structures from multiple adhesive layers have been or are being purchased commercially from Microfabrica® Inc. (formerly MEMGen Corporation) of Van Nuys, Calif., under the process names EFAB and MICA FREEFORM.

[0005] Various electrochemical fabrication techniques are described in US Pat. No. 6,027,630, issued Feb. 22, 2000 to Adam Cohen.

[0006] Another method for forming microstructures using electrochemical fabrication techniques is taught in U.S. Pat. No. 5,190,637 to Henry Guckel, entitled "Formation of Microstructures by Multilevel Deep X-Ray Lithography Using Sacrificial Metal Layers."

[0007] Electrochemical manufacturing provides the capability to form prototype and commercial quantities of small objects, parts, structures, devices, and the like at reasonable cost and in reasonable time. Indeed, electrochemical manufacturing enables the formation of many structures that were previously impossible to produce. Electrochemical manufacturing opens up the possibility for new designs and products in many industrial sectors. Electrochemical manufacturing provides this new capability, and while it is understood that electrochemical manufacturing techniques can be combined with known designs and structures in various fields to produce new structures, specific uses of electrochemical manufacturing provide designs, structures, capabilities, and / or mechanisms that are not known or apparent in view of the state of the art.

[0008] There is a need in various fields for microdevices having improved features, reduced manufacturing times, reduced manufacturing costs, simplified manufacturing processes, greater versatility in device design, improved material choices, improved material properties, more cost-effective and lower risk production of such devices, and / or greater independence between geometric configuration and selected manufacturing process. Summary of the Invention

[0009] It is an object of some embodiments of the invention to provide improved probe arrays comprising probes including compliant elements formed from a plurality of compliant modules that include a planar but non-linear (i.e., not straight) spring configuration (i.e., the spring configuration is not a straight bar with no bends or angles, but has some two-dimensional configuration in the plane of at least one layer that provides a bend or curvature) when in an unactuated state, where the plane of the spring is perpendicular to and provides compliance along the longitudinal axis of the probe, and where the compliant modules are stacked in a continuous manner. A probe with a non-linear spring configuration may provide a linear spring return force or a non-linear return force when actuated.

[0010] In a further aspect of the invention, a probe array includes: (1) a plurality of probes for making contact between two electronic circuit elements, each probe including: (a) (i) at least one relatively stiff standoff having first and second ends spaced apart longitudinally; (ii) at least one first compliant element comprising a two-dimensional substantially planar spring when unbiased, the first compliant element providing compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first compliant element is operatively coupled to the at least one standoff and a second portion of the first compliant element is operatively coupled to a first distal arm that is compliantly movable relative to the standoff, wherein when the first compliant element is unbiased, the first distal arm directly or indirectly secures a first distal end extending longitudinally beyond the first end of the at least one standoff; and (iii) at least one second compliant element comprising a spring, the second compliant element providing compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first compliant element is operatively coupled to the at least one standoff and a second portion of the first compliant element is operatively coupled to a first distal arm that is compliantly movable relative to the standoff, wherein when the first compliant element is unbiased, the first distal arm directly or indirectly secures a first distal end that extends longitudinally beyond the first end of the at least one standoff. (1) a lower array plate with a plurality of lower plate probe holes; (2) a lower array plate with a plurality of lower plate probe holes; (3) a second compliant element having a first portion operably coupled to the at least one standoff and a second portion operably coupled to a second distal arm compliantly movable relative to the standoff, wherein when the second compliant element is not biased, the second distal arm directly or indirectly secures a second distal end extending longitudinally beyond an end of the second end of the at least one standoff, wherein the first portions of the first and second compliant elements are longitudinally spaced apart from one another, and wherein when at least one of the first and second distal ends is biased towards the other, the second portions of the first and second compliant elements longitudinally move in a manner selected from the group consisting of: (A) moving closer together, and (B) moving further apart; (2) a lower array plate with a plurality of lower plate probe holes;(3) an upper array plate with a plurality of upper probe holes, where at least some of the upper probe holes include at least one sidewall feature providing an extension of the upper probe holes to a width greater than a corresponding portion of a corresponding lower hole on the lower array plate; where the lower plate is configured to receive the probes from above the lower array plate; where the upper plate is configured to receive the probes from below the upper array plate; where at least some of the plurality of probes further include at least one lower retention mechanism and at least one upper retention mechanism, where the at least one lower retention mechanism is configured to engage at least the lower array plate and the at least one upper retention mechanism is configured to engage at least the upper array plate; where the at least one lower retention mechanism is configured to engage at least the upper array plate; at least one laterally extending feature protruding from the body of each probe with a size and configuration that limits the longitudinal extent to which it may be inserted; wherein the at least one upper retention feature includes at least one tab-like feature extending laterally from the body of the probe at a level above the lower retention feature and spaced longitudinally from the lower retention feature by a gap greater than a thickness of the longitudinal engagement portion of the upper array plate, wherein the at least one upper retention feature has a lateral configuration sized to pass an extension provided by the sidewall feature when aligned; and wherein after longitudinal placement of the upper retention feature over an extension of the holes in the upper array, the retention feature undergoes a lateral displacement relative to the holes such that the at least one upper retention feature can no longer longitudinally pass over the extension of the holes in the upper array plate;

[0011] Many variations of the above-described embodiments of the invention exist and will become apparent to those of ordinary skill in the art upon consideration of the teachings herein.

[0012] Other aspects of the invention will be understood by those skilled in the art upon consideration of the teachings herein. Other aspects of the invention may involve combinations of the aspects described above. These other aspects of the invention may provide various combinations of the aspects presented above, as well as other configurations, structures, functional relationships, and processes not specifically described above but taught by other specific teachings described herein, by the teachings of the specification as a whole, or by teachings incorporated herein by reference. [Brief description of the drawings]

[0013] [Figure 1A] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1B] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1C] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1D] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1E] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1F] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself.

[0014] [Figure 1G]1 depicts the completion of formation of the first layer resulting in planarization of the deposited material to a desired level.

[0015] [Figure 1H] 1 depicts the state of the process after formation of multiple layers of the structure. [Figure 1I] 1 depicts the state of the process after release of the structure from the sacrificial material.

[0016] [Diagram 2] 1 depicts an isometric view of an exemplary spring or compliant module having two connected spring elements, a base, and a connecting support or standoff that can be used in or as a probe.

[0017] [Diagram 3] 1 depicts an isometric view of a second exemplary spring or compliant module that may be used in or as a probe similar to the module of FIG. 2, except that the two spring elements are thicker and therefore provide a greater spring constant than the element of FIG.

[0018] [Figure 4A] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4B1] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4B2] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4C1]Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4C2] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4D1] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4D2] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4D3] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff. [Figure 4D4] Various views of a probe are provided, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also serves as a standoff.

[0019] [Figure 4E1] 4A-4D4 provide side views of the probe showing 17 sample layer levels in which the probe may be fabricated, where not all layers have a unique configuration.

[0020] [Fig. 4E2-A] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E2-A showing a view of layers L1 and L17. [Fig. 4E2-B]A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E2-B showing a view of layers L1 and L17. [Fig. 4E3-A] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, and FIG. 4E3-A shows a view of layers L2, L4, L6 and L8. [Fig. 4E3-B] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, and FIG. 4E3-B shows a view of layers L2, L4, L6 and L8. [Fig. 4E4-A] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E4-A showing a view of layers L3 and L7. [Fig. 4E4-B] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, and FIG. 4E4-B shows a view of layers L3 and L7. [Fig. 4E5-A] FIG. 4E5-A shows a cross-sectional view of the unique configuration of layers L1-L17 shown in both top (-A view) and isometric (-B view) views, with FIG. 4E5-A showing a view of layer L5. [Fig. 4E5-B] FIG. 4E5-B shows a cross-sectional configuration shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E5-B showing a view of layer L5. [Fig. 4E6-A] 4E6-A shows a cross-sectional view of the specific configuration of layers L1-L17 shown in both top (-A view) and isometric (-B view) views, with FIG. 4E6-A showing a view of layer L9. [Fig. 4E6-B] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, and FIG. 4E6-B shows a view of layer L9. [Fig. 4E7-A] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E7-A showing a view of layers L10, L12, L14 and L16. [Fig. 4E7-B]A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, and FIG. 4E7-B shows a view of layers L10, L12, L14 and L16. [Fig. 4E8-A] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E8-A showing a view of layers L11 and L15. [Fig. 4E8-B] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, and FIG. 4E8-B shows a view of layers L11 and L15. [Fig. 4E9-A] 4E9-A shows a cross-sectional view of the specific configuration of layers L1-L17 shown in both top (-A view) and isometric (-B view) views, with FIG. 4E9-A showing a view of layer L13. [Fig. 4E9-B] A cross-sectional configuration is shown in both top (-A view) and isometric (-B view) views of the unique configuration of layers L1-L17, with FIG. 4E9-B showing a view of layer L13.

[0021] 5A1-5H show exemplary probe and dual array plate mounting and retention configurations according to embodiments of the invention using lateral slide locks or tabs and retaining rings in combination with two array plates.

[0022] [Figure 5A1] 1 provides an isometric view from above of an exemplary probe according to an embodiment of the invention, where the probe includes a mount or stop ring for engaging with the top edge of a circular shaped through-hole in a lower engagement plate, and a sliding clip or tab on the right side of the probe for engaging with the upper right edge of an oval shaped through-hole in an upper array plate. [Figure 5A2] 1 provides an isometric view from below of an exemplary probe according to an embodiment of the invention, where the probe includes a mount or stop ring for engaging with the top edge of a circular shaped through-hole in a lower engagement plate, and a sliding clip or tab on the right side of the probe for engaging with the upper right edge of an oval shaped through-hole in an upper array plate.

[0023] [Figure 5B1] FIG. 5A provides an isometric view of a portion of a lower array plate showing a single circular through-hole into which the lower portion of the probe of FIGS. 5A1 and 5A2 can be inserted. [Figure 5B2] FIG. 5A provides a top view of a portion of a lower array plate showing a single circular through-hole into which the lower portion of the probe of FIGS. 5A1 and 5A2 can be inserted.

[0024] [Figure 5C1] FIG. 5A provides an isometric view of an upper array plate portion showing a single oval shaped through-hole into which the upper portion of the probe of FIGS. 5A1 and 5A2 can be inserted longitudinally and then shifted laterally. [Figure 5C2] FIG. 5A provides a top view of a portion of an upper array plate showing a single oval shaped through-hole into which the upper portion of the probe of FIGS. 5A1 and 5A2 can be inserted longitudinally and then shifted laterally.

[0025] [Figure 5D] 5A1 and 5A2 are provided as isometric views of the probes of FIGS. 5A1 and 5A2 aligned laterally over the circular openings of the lower array plate portions of FIGS. 5B1 and 5B2 in preparation for relative longitudinal shifting or loading of the probes into the circular openings in the lower array plate by relatively moving the probes in the direction indicated by the arrows.

[0026] [Figure 5E] 5A1 and 5A2, 5B1 and 5B, and 5D are isometric views of the probe and lower array plate portion after the probe has been loaded longitudinally into the circular opening in the lower array plate portion such that the probe's retaining ring abuts the upper surface of the lower array plate and such that lateral alignment of the probe and lower array plate is maintained by appropriate sizing and tolerancing of the probe diameter and the diameter of the opening in the array plate.

[0027] [Figure 5F]5A1 and 5A2 are provided in their final position relative to the lower array plate portion of FIGS. 5B1 and 5B2, and aligned laterally below the elliptical opening of the upper array plate portion of FIGS. 5C1 and 5C2, in preparation for relative longitudinal shifting or loading of the probe into the elliptical opening by relative movement of the upper array plate in the direction indicated by the arrow, where lateral alignment allows the upper array plate to slide beyond a position below and near the retention tabs by longitudinal movement alone.

[0028] [Figure 5G] Provides an isometric view of the probes, lower array plate, and upper array plate portions in their final longitudinal positions after the movements described in FIG. 5F, without completing the required relative lateral movement of the upper array plate with respect to the probes and lower array plate, as indicated by the arrows, to complete the interlocking of the edges of the upper array plate between the probe retaining ring and the retaining tabs.

[0029] [Figure 5H] FIG. 5G provides an isometric view of the probe, lower array plate, and upper array plate portions in their final longitudinal and lateral positions after the movements described above, with retention of the longitudinal position of the plates in their relative positions providing retention of the probe with position and alignment dictated by the dimensions and tolerances that define these three components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Electrochemical Manufacturing Overview 1A-1I show side views of various states in an exemplary multi-layer, multi-material electrochemical manufacturing process. FIGS. 1A-1G show various stages in the formation of a single layer of a multi-layer manufacturing process in which a second metal is deposited on a first metal and into openings in the first metal such that the first and second metals form part of the layer. In FIG. 1A, a side view of a substrate 82 is shown having a surface 88 on which a patternable photoresist 84 is disposed as shown in FIG. 1B. In FIG. 1C, the pattern in the resist resulting from curing, exposing, and developing the resist is shown. Patterning of the photoresist 84 results in openings or apertures 92(a)-92(c) that extend from a surface 86 of the photoresist through the thickness of the photoresist to a surface 88 of the substrate 82. In FIG. 1D, a metal 94 (e.g., nickel) is shown electroplated into the openings 92(a)-92(c). In FIG. 1E, the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate, exposing areas of the substrate 82 not covered with the first metal 94. In FIG. 1F, a second metal 96 (e.g., silver) is shown blanket electroplated over the entire exposed portion of the substrate 82 (conductive) and over the first metal 94 (also conductive). FIG. 1G depicts the completed first layer of the structure resulting from exposing the first metal and planarizing the first and second metals to a height that sets the thickness for the first layer. In FIG. 1H, the results of repeating the process steps shown in FIGS. 1B-1G multiple times to form a multi-layer structure, each layer being made of two materials. In most applications, one of these materials is removed to produce a desired three-dimensional structure 98 (e.g., a component or device) or multiple such structures, as shown in FIG. 1I.

[0031] Various embodiments of various aspects of the invention relate to the formation of three-dimensional structures from materials that may be partially or fully electrochemically deposited or non-electrochemically deposited (as shown in the examples of FIGS. 1A-1I and as described in various patent applications incorporated herein by reference). Some of these structures may be formed from a single build level formed from one or more types of deposited materials, while others are formed from multiple build layers (e.g., 2 or more layers, more preferably 5 or more layers, and most preferably 10 or more layers) each including at least two types of materials. In some embodiments, layer thicknesses may be as small as 1 micron or as large as 50 microns. In other embodiments, thinner layers may be used, while in other embodiments, thicker layers may be used. In some embodiments, microscale structures have lateral features with minimum feature sizes on the order of microns to tens of microns, located with precision at the 0.1 to 10 micron level. In other embodiments, structures with less precision in feature placement and / or larger minimum features may be formed. In still other embodiments, greater precision and smaller minimum feature sizes may be desirable. In this application, mesoscale and millimeter scale have the same meaning and refer to devices that may have one or more dimensions that may extend in the range of 0.5 to 50 millimeters or greater, and features that are located with precision in the range of microns to 100 microns, with minimum feature sizes on the order of tens of microns to hundreds of microns.

[0032] Various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique for all layers, or using different patterning techniques for different layers. For example, various embodiments of the present invention may perform selective patterning operations using conformal contact masks and masking operations (i.e., operations using a mask that is in contact with but not bonded to the substrate), proximity masks and masking operations (i.e., operations using a mask that selectively protects at least a portion of the substrate by being in proximity to the substrate even when not in contact), non-conformal masks and masking operations (i.e., masks and operations based on masks whose contacting surfaces are significantly non-conformal), and / or bonded masks and masking operations (masks and operations using a mask that is bonded to the substrate as opposed to only being in contact with the substrate where selective deposition or etching occurs). Conformal contact masks, proximity masks, and non-conformal contact masks share the property of being pre-formed and brought to or near the surface to be treated (i.e., the exposed portion of the surface to be treated). These masks can generally be removed without damaging the mask or the surface to which they were in contact or near. Adhesion masks are generally formed on and bonded to the surface to be processed (i.e., the portion of that surface to be masked) such that they cannot be completely destroyed or separated from the surface without damage beyond any point of reuse. Adhesion masks can be formed in a number of ways, including (1) application of photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of a pre-patterned masking material, and / or (3) direct formation of the mask by computer-controlled deposition of material. In some embodiments, the adhesion mask material can be used as a sacrifice for a layer, or can be used only as a masking material that is replaced by another material (e.g., a dielectric or conductive material) before completion of the formation of the layer, where the replacement material is considered the sacrificial material of the respective layer. The masking material may or may not be planarized before or after depositing material into the voids or openings contained therein.

[0033] Patterning operations may be used in selectively depositing materials and / or in selectively etching materials. The selectively etched regions may be selectively filled with a different desired material or filled via blanket deposition, or the like. In some embodiments, layer-by-layer stacking may involve simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in deposition in regions associated with other layer levels (i.e., regions that reside within top and bottom boundary levels that define different layer geometries). Such use of selective etching and / or interlaced material deposition in association with multiple layers is currently described in U.S. Patent Application Serial No. 10 / 434,519 (now U.S. Patent No. 7,252,861), entitled "Method and Apparatus for Electrochemically Fabricating Structures Through Selective Etching and Filling of Interlaced Layers or Voids," filed May 7, 2003 by Smalley. The referenced application is incorporated herein by reference.

[0034] Temporary substrates on which structures may be formed may be of the sacrificial type (i.e., destroyed or damaged during separation of the deposited materials to such an extent that they cannot be reused) or of the non-sacrificial type (i.e., not destroyed or excessively damaged, i.e., not damaged to such an extent that they cannot be reused, e.g., a sacrificial or release layer is located between the substrate and the initial layer of the structure to be formed). Non-sacrificial substrates may be considered reusable with little or no rework (e.g., re-planarizing one or more selected surfaces or applying a release layer, and the like), although for a variety of reasons they may or may not be reused.

[0035] Definitions of various terms and concepts (whether relating to the device itself, particular methods for making the device, or particular methods for using the device) that may be used in understanding embodiments of the present invention will be understood by those of skill in the art. Some such terms and concepts are described herein, while other such terms are addressed in various patent applications to which this application claims priority and / or which are incorporated by reference herein (e.g., U.S. Patent Application Serial No. 16 / 584,818).

[0036] As used herein, "longitudinal" refers to the long dimension of a probe, the end-to-end dimension of a probe, or the tip-to-tip dimension of a probe. Longitudinal may refer to a generally straight line extending from one end of a probe to another end of the probe, or it may refer to a curved or stepped path that has an incline or even changes direction along the height of the probe. When referring to a probe array, or to probes loaded in an array configuration, the longitudinal dimension may refer to a particular direction in which the probes in the array are oriented or extend, but may also simply refer to the overall height of the array, beginning with a plane that includes the first end, tip or base of the plurality of probes and extending perpendicular to a plane that includes the second end, tip or top of the probes. The context of use will usually make clear what is meant, especially to those skilled in the art. It is intended that the interpretation applied to the terms herein be as narrow as is justified by the details of the description provided or the context in which the terms are used. However, if such a narrow interpretation is not justified, the broadest reasonable interpretation is intended to apply.

[0037] The term "lateral" as used herein is related to the term longitudinal. In the context of stacking layers, the lateral direction refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions that lie in the plane of the layers that are substantially perpendicular to the stacking direction of the layers). When referring to a probe array, the lateral direction generally has a similar meaning, and the lateral dimension is generally a dimension that lies in a plane that is parallel to the plane of the top or bottom of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to the probe itself, the lateral dimension may be perpendicular to the overall longitudinal axis of the probe, the local longitudinal axis of the probe (local lateral dimension), or simply a similar dimension as described for the array or layer. The context of use will usually make clear what is meant, especially to those skilled in the art. It is intended that the interpretation applied to the terms herein may be as narrow as is justified by the details of the description provided or the context in which the terms are used. If such a narrow interpretation is not justified, the broadest reasonable interpretation is intended to apply.

[0038] As used herein, "substantially parallel" means parallel or nearly parallel, i.e., within 15° of parallel, more preferably within 10° of parallel, even more preferably within 5° of parallel, and most preferably within 1° of parallel. When the term is used without clarification, it should be interpreted as within 15° of parallel. When used with a specific clarification, the term should be interpreted according to the specific clarification.

[0039] As used herein, "substantially perpendicular" or "substantially normal" means perpendicular or close to perpendicular, i.e., within 15° of perpendicular, more preferably within 10° of perpendicular, even more preferably within 5° of perpendicular, and most preferably within 1° of perpendicular. When the term is used without clarification, it should be interpreted as within 15° of perpendicular. When used with a specific clarification, the term should be interpreted according to the specific clarification.

[0040] As used herein, "substantially planar," when referring to a surface, refers to a surface that is intended to be planar, but as one of ordinary skill in the art would understand, there may be some imperfections (i.e., when referring to millimeter and microscale devices, such as the main device embodiments described herein, imperfections that may deviate from planarity by up to 1-5 microns, but often by substantially less than a micron). When the term is used without clarification, it should be interpreted as having imperfections that deviate from planarity by 5 microns or less. When used with a specific clarification, the term should be interpreted according to the specific clarification. When referring to a structure, the term does not refer to an infinitely thin structure, but rather to one formed with substantially planar top and bottom surfaces, such as the top and bottom surfaces of each layer, or a group of successively formed layers of a structure formed using a multi-material, multi-layer electrochemical manufacturing method, particularly when each layer undergoes a planarization operation such as lapping, fly-cutting, chemical mechanical planarization, spinning coating, and the like. In some cases, a substantially planar structure may also imply that the height or thickness of the structure or an element of the structure is small compared to the size of the structure in the two perpendicular dimensions (i.e., the ratio of the vertical footprint to the thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200). When the term is used in relation to a structure without clarification, it should be interpreted as meeting the criteria of a substantially planar surface for both the upper and lower surfaces. In some contexts, a ratio requirement may also be applied, i.e. a ratio of at least 25. When the term is used in relation to a structure with a specific clarification, it should be interpreted according to the specific clarification.

[0041] "Relatively stiff" as used herein refers to a comparison of stiffness between two structural elements when the two structural elements are subjected to processing loads or stresses, where the relatively stiff structural element should experience at least 2 times, more preferably 5 times, and most preferably 10 times less deflection or strain compared to the other structural element. When the term is used in reference to a structural element without clarification, it should be interpreted as meeting the 2 times requirement. When the term is used in reference to a structural element with a specific clarification, it should be interpreted according to the specific clarification.

[0042] "Non-linear configuration" as used herein, particularly when applied to physical structures or elements, refers to a configuration that is not a straight rod-like configuration. A non-linear configuration is one that is two or three dimensional in nature with features that include one or more bends or curves. For example, a planar, non-linear structure can be a flat, helical structure. Non-linear configuration as used herein, when referring to a spring, does not refer to a force-deflection relationship unless such a relationship is specifically and explicitly indicated. Probe with planar spring module

[0043] The planar springs or planar compliant elements of the present invention can be formed in a number of different ways and can take on a number of different configurations. In general, the compliant elements include planar springs having portions that extend from a standoff to a tip or tip arm in a cantilever or bridge fashion (e.g., two or more springs originating at different lateral standoff locations and connecting to a common tip arm - here commonly referred to as a cantilever or cantilevers) across a gap or open area into which the spring may deflect during normal operation. These compliant portions generally have a two-dimensional non-linear configuration in a lateral plane and a thickness (e.g., longitudinal) extending perpendicular to the plane, where the two-dimensional configuration may be in the form of a beam structure with a curved or angled configuration, the length being much greater than its width, e.g., at least 5, 10, 20, or even 50 times or more in some variations, where the thickness is generally less than the length of the beam, e.g., at least 5, 10, 20, or even 50 times or more in some variations, or less than the lateral dimension of the spring element, e.g., 2, 5, 10, or even 20 times or more in some variations. In some embodiments, the plane of such configuration may be parallel to a layer plane (e.g., XY plane) when the probe or module is formed from multiple adhesive layers. The thickness of the spring (e.g., Z direction) may be the thickness of a single layer or may be the thickness of multiple layers. In some embodiments, the compliant element comprises multiple spaced planar spring elements.

[0044] In some embodiments, the compliant elements may include planar spring elements that are connected to such end elements at intermediate locations as well as to one another at standoff or tip structures. In some such embodiments, the planar spring elements may start out at one end (e.g., the standoff or tip arm) as one or more thick springs with a relatively high spring constant, and then be provided with a reduced spring constant by removal of some intermediate spring material between the top and bottom of the initial spring structure, such that what starts out as a small number of thicker planar compliant elements (e.g., 1, 2, or 3 elements) transitions to a larger number of thinner planar elements, with some initial planar elements splitting into 2, 3, 4, 5 or more planar but thinner elements before reaching the other end (e.g., the tip arm of the standoff), so that, for example, the spring constant, force requirements, excess travel, stress, strain, current carrying capacity, overall size, and other operating parameters can be tailored to meet the requirements of a given application.

[0045] Reference numbers are included in many of Figures 2-5H, where like numbers are used to denote similar structures or features in different embodiments.

[0046] An exemplary spring module is shown in Figures 2-3. Figure 2 depicts an isometric view of an exemplary spring module 200 with two non-flexible spring elements 221-1 and 221-2, a base 201 spaced apart from the spring elements, and a connecting support (e.g., standoff or bridge) 211 bridging the longitudinal module gap MG between the spring elements and the base. In the example of Figure 2, each of the two spring elements takes the form of a planar, radially extending helix, extending from the radially displaced bridge 211 to a centrally or axially located tip element 231 via a downwardly extending portion of the tip structure. The springs are longitudinally spaced apart by a gap SG. In this example, the bridge 211 connects one end of each spring element together, while the tip element 231 connects the other ends of the spring elements together via an extending portion of the tip structure. The tip elements 231 are formed with a desired width TW and a desired tip height TH extending above the upper spring, with each spring element formed with a desired material, beam thickness or spring height SH, beam width or spring width SW, spacing CS between the spring coils, and coiled beam length that allows the spring to deflect a desired amount without exceeding the elastic deflection limits of the structure and associated material from which it is formed, while providing a desired fixed or variable spring force over its deflection range. In particular, the tip length may be such that a desired compression of the module tip toward the base may occur without the base, bridge, and spring elements interfering with one another. In some embodiments, for example, the maximum travel distance for the tip of each module may be as little as 5 μm (μm=microns) or less, or as much as 500 μm (e.g., 25 μm, 50 μm, 100 μm, or 200 μm) or more. For example, in some embodiments the maximum travel distance per module may be between 25 μm and 200 μm, while in other example embodiments the maximum travel distance per module may be between 50 μm and 150 μm. In some embodiments the maximum tip travel distance may be set by a hard stop such as a spring or a flexure of the tip contacting the base, a stop structure on the base, or in some cases a surface contacting the tip that contacts the upper portion of the bridge (e.g., a surface of an adjacent module).In other embodiments, the maximum travel distance may be determined by a compliant spring or tip portion contacting a soft stop or compliance reducing structure. The force to achieve maximum deflection (or travel) may be as little as 0.1 grams to as much as 20 grams or more. In some embodiments, a force target of 0.5 grams may be appropriate. In other embodiments, 1 gram, 2 grams, 4 grams, 8 grams, or more may be appropriate. In some embodiments, the module height MH (longitudinal dimension) may be targeted to 50 μm or less, while in other embodiments, the module height may be targeted to 500 μm or more. In some embodiments, the overall module radial diameter or width MW may be 100 μm or less or 400 μm or more (e.g., 150 μm, 200 μm, or 250 μm). The spring beam elements or beam elements of the module may have a spring height SH of 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm) and a beam or spring width SW of 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm). The tips may have a uniform or varying shape (e.g., cylindrical, rectangular, conical, polygonal, or other configuration or combination of configurations). The tips that connect to the spring beams generally have a cross-sectional width TW that is greater than the width SW of the beam or beams to which they connect.

[0047] Figure 3 depicts an isometric view of a second exemplary spring module 300 that is similar to the module of Figure 2, except that the two spring elements are thicker, and therefore provide a greater spring constant than the elements of Figure 2. Viewed from another perspective, the example of Figure 3 requires more force for a given deflection, and therefore reaches the yield strength of the combined materials and structural geometry (e.g., reaches the elastic deflection limit) at a smaller deflection than the example of Figure 2.

[0048] In other embodiments, the spring modules may take different forms than those shown in Figures 2 or 3. For example, (1) a module may have a single spring element or more than two spring elements; (2) each of the spring elements may have variations in one or more of the following ranges: width, thickness, length, or rotation; (3) the spring elements may vary over the length of the element; (4) the spring elements may have configurations other than Euler spirals, such as rectangular spirals, rectangular spirals with rounded corners, S-shaped configurations, or C-shaped configurations; (5) individual spring elements may connect to more than a single bridge connection, such as bridge connection points located at 180 degrees, 120 degrees, or 90 degrees of the module; (6) the bridge connections may be on different bridges; (7) the base element may have a smaller radial extent than the spring / bridge connection so that when the modules are stacked, when the module tip is sufficiently compressed, the base of a higher module may extend below the upper extent of a lower adjacent module; (8) the module base may be replaced with an additional spring that, by flexure, allows compression of the module spring from both directions, and (9) the probe tip may not be laterally centered with respect to the overall lateral configuration of the module (i.e., not coincident with, or even collinear with, the main axis of compression or the main build axis when formed layer by layer).

[0049] 4A-4D4 provide various views of a probe 3400, or portions of such a probe, formed from two back-to-back (or base-to-base) modules, where the two modules share a common base having an annular configuration, and the probe includes several different features: (1) an annular base that anchors the upper helical spring array 3421-UC and the lower helical spring array 3421-LC by their outermost lateral extents to provide a basic standoff function between the upper and lower spring arrays; or frame 3401, where base or frame 3401 has a circular exterior with an internal opening having opposing arched sides 3401-A and narrower opposing flat sides 3401-F, where the upper and lower surfaces connecting the flat sides provide attachment areas for connecting with upper and lower supports or standoffs 3411-1, 3411-2, 3412-1, and 3412-2 which support the ends of the helical spring element, while the arched areas are where the outermost cantilevered portions of the springs may reside (before deformation). (2) each of the upper and lower spring arrays begins their inward path from an opposing pair of standoffs as two longitudinally spaced, coplanar pairs of wound helical cantilevers 3421-1U and 3421-2U ​​above the base, and 3421-1L and 3421-2L below the base, and each cantilever of each element extends along their inward movement (3) the helical spring elements connecting the upper contact tips have an opposite sense of rotation to the helical spring elements connecting the lower contact tips; (4) the helical spring elements connecting the upper contact tips split into two longitudinally spaced apart cantilevers, whereby four upper cantilever elements UC1-UC4 connect each side of upper end arm 3431-UA, while four lower cantilever elements LC1-LC4 connect either side of lower end arm 3431-LA which supports contact or coupling tips 3431-U and 3431-L, respectively; (3) the sense of rotation of the helical spring elements connecting the upper contact tips has an opposite sense of rotation to the helical spring elements connecting the lower contact tips;and (4) standoffs 3411-1, 3411-2, 3412-1, and 3412-2 provide only intermediate standoff functionality between the beams of the upper spiral array and between the helical beams of the lower spiral array, and do not provide standoff functionality between the two groups of springs (that functionality is provided directly by base 3401);

[0050] Figures 4A, 4B1 and 4B2 provide a side view, an upper isometric view, and a lower isometric view of probe 3400, respectively, in which different features of the probe can be seen. Figure 4B1 provides a view of the uppermost pair of helical springs in the upper spring section of the probe, while Figure 4B2 provides a view of the lowermost pair of helical springs in the lower spring section of the probe. Figures 4A, 4B1 and 4B2 each provide a view of upper and lower tips 3431-U and 3431-L along with central base 3401. 4A, 4B1, and 4B2 also provide views of the upper and lower standoffs 3411-1 and 3411-2, as well as views of the outer portions of the longitudinally spaced upper and lower cantilever elements 3421-1U and 3421-2U ​​and 3421-1L and 3421-2L. It can also be seen that the interleaved paths of pairs of coplanar cantilever elements proceed inwardly from their respective standoffs to their respective central tips.

[0051] Figures 4C1 and 4C2 provide exploded isometric views of the probe 3400 from the top and bottom perspectives, respectively, where the bottom of the lower cantilever element and the top of the upper cantilever element are visible, as well as the top of the lower cantilever element and the bottom of the upper cantilever element, and the interior of the annular base 3401, including flat and arched sidewalls 3401-F and 3401-A. In Figures 4C1 and 4C2, the upper spring section or upper compliant element 3421-UC of the probe is spaced from the central frame or base element 3401, which is spaced from the lower spring section or lower compliant element 3421-LC of the probe. The upper tip 3431-U is visible in Figure 4C1, along with the tops of the upper and lower spring sections and the top of the central frame element. Lower tip 3431-L can be seen in Figure 4C2 along with the bottom of upper and lower spring sections 3421-UC and 3421-LC and the bottom of central frame element 3401. As can be seen by the dotted lines connecting the exploded elements, central frame element 3401 supports the outermost lateral extents of the upper and lower spring sections, and more specifically, standoffs 3411-1, 3411-2, 3412-1, and 3412-2, which support their cantilever elements.

[0052] 4D1-4D4 provide four different cutaway views of probe 3400, in which increasingly larger portions of the side of the probe have been cut away to reveal the internal structure of the probe so that the changes in the cantilever can be more easily seen and understood. As the helical element rotates inward toward the laterally central tip element, the cantilever elements transition from two longitudinally spaced cantilever elements 3421-2U ​​and 3421-1U above the base 3401 and two longitudinally spaced cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally spaced cantilever elements UC1 to UC4 above the base and four longitudinally spaced elements LC1 to LC4 below the base, where the beam reaches respective longitudinally movable tip arm elements 3431-UA and 3431-LA, which connect to or become tips 3431-U and 3431-L, respectively (best seen in Figure 4D3).

[0053] Figure 4E1 provides a side view of probe 3400 similar to Figure 4A, but with 17 sample layer levels L1-L17 identified, each layer having an identified thickness along the longitudinal axis of the probe (i.e., the Z-axis as shown), from which the probe may be fabricated via a multilayer fabrication process, such as a multilayer, multi-material electrochemical fabrication process, using single or multiple structural materials (along with sacrificial materials) and with a build or stack axis corresponding to the longitudinal axis of the probe. In such fabrication embodiments, the probes may be formed one at a time, although it is generally preferred to form the probes in batches of hundreds or even thousands of probes that are formed simultaneously by successive layer and layer stacking.

[0054] 4E2-A to 4E9-B show cross-sectional configurations shown in both top (-A) and isometric (-B) views for eight unique configurations of layers L1 to L17.

[0055] 4E2-A and 4E2-B show views of layers L1 and L17, where one can see the tips, which are the lower tip 3431-L for L1 and the upper tip 3431-U for layer L17.

[0056] Figures 4E3-A and 4E3-B show views of L2, L4, L6 and L8 which provide portions of planar spring spirals 3421-1L, 3421-2L and their innermost regions forming cantilever sections LC1 to LC4 (not shown), portions of the lower central tip arm 3431-LA and portions of the lower standoffs 3412-1 and 3412-2, where the double interlaced spiral configuration can be seen.

[0057] Figures 4E4-A and 4E4-B show views of L3 and L7, where incomplete helical elements 3421-1L, 3421-2L and standoffs 3412-1 and 3412-2 (similar to the features in Figures 4E3-A and 4E3-B, but without the LC1-LC4 portions) can be seen. The helical portions reflected in these figures combine with the upper and lower portions of Figures 4E3-A and 4E3-B to form a thick helical section in the outermost lateral portion of the spring, where the lower compliant element 3421-LC includes only two thick cantilever elements, as opposed to the four thinner cantilever elements LC1-LC4 that connect to the tip arm in the innermost lateral portion of the spring.

[0058] 4E5-A and 4E5-B show views of L5 including portions of the lower tip arm 3431-LA and standoffs 3412-1 and 3412-2, which provide a connection between the 3421-1L and 3421-2L cantilever spring portions.

[0059] 4E6-A and 4E6-B show views of L9 including a ring-like base 3401 that separates and connects upper and lower compliant elements 3421-UC and 3421-LC via two portions of the base that act as standoffs, where several lateral portions of the base align and engage with springs in their standoff regions 3411-1, 3411-2, 3412-1 and 3412-2. The actual start of the inwardly rotating helix of the probe 3400 depends on how the features of L8 interface with those of L9, and similarly how the features of L9 interface with those of L10. In particular, the interface is not perpendicular to the local length of the winding helix (e.g., so that a minimal width interface is provided), but is angled such that the outer portions of the helical beam that interface with the base are supported a different amount along their length than the inner portions. In some variations, the interfaces may be provided in such a manner that the interfaces are provided perpendicular to the local length of the beam, whereby the support provided by the base (or other standoff region) provides a laterally vertical or substantially vertical transition between supported and unsupported beam regions. In particular, vertical transitions are provided in other beam to standoff regions, such as can be seen at the interfaces formed by L4 and L5, L5 and L6, L12 and L13, and L13 and L14, and in other beam splitting regions, such as L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16, where the beam transitions extend along a lateral line substantially perpendicular to the direct or local length of the beam. Such perpendicular and non-perpendicular interfaces and their consistent or varying use may be used in tuning probe performance or operating characteristics.In particular, due to the non-vertical interface with the base and due to the interfaces provided by and between the other beams of the cantilever, the outer portion of the cantilever is provided as a single thick beam, while the inner portion of the cantilever structure starts as two beams of intermediate thickness and ends with the cantilever in the probe arm as four thinner beams. In some variations, the initial cantilever structure (exiting laterally from the base) may start as a single thick beam or multiple beams throughout their width. Other transitions along the beam length may also be configured to provide smooth or vertical transitions, or to provide variable or non-vertical transitions. 4E7-A and 4E7-B show views of L10, L12, L14 and L16, which provide (1) portions of upper planar spring helices 3421-1U and 3421-2U ​​and their innermost extensions forming cantilever portions UC1-UC4 (not shown), and (2) portions of upper central tip arm 3431-UA and upper standoffs 3411-1 and 3411-2, where the double interlaced helical configuration can be seen. These are the upper compliant element counterparts to the lower compliant element mechanism shown in FIGS. 4E3-A and 4E3-B. Comparison of these views shows that the helical rotation sense of the upper and lower compliant elements has an inverted rotation sense. This inversion of sense may be considered beneficial in some cases and unnecessary or even harmful in other cases. When the spring elements are compressed, the tips may tend to rotate in a direction opposite to the inward rotation of the helical elements, which may create a frictional or rubbing effect that may tend to break down oxide coatings or cause damage to the surfaces in contact. Reversal of the direction of friction between the lower and upper probe tips may or may not be desirable and therefore may be taken into account during initial probe design. Similarly, reversal of the relative direction of the spaced apart upper spring elements is possible, as is reversal of the direction of the spaced apart lower spring elements.

[0060] Figures 4E8-A and 4E8-B show views of layers L11 and L15 where one can see the incomplete helical elements 3421-1U and 3421-2U ​​and the connection regions of standoffs 3411-1 and 3411-2 that bridge portions of the helix in Figures 4E7-A and 4E7-B to form a thick helical section in the outermost lateral portion of the spring, where the upper compliant element 3421-UC includes only two thick elements, in contrast to the four thinner elements that connect the tip arms 3431-UA in the innermost lateral region of the helix. Figures 4E8-A and 4E8-B provide the counterpart of the upper compliant element to the lower compliant element shown in Figures 4E4-A and 4E4-B.

[0061] Figures 4E9-A and 4E9-B show views of layers including portions of upper tip arm 3431-UA and standoffs 3411-1 and 3411-2L13 that provide connections between cantilevers 3421-1U and 3421-2U. Figures 4E9-A and 4E9-B provide images of portions of an upper compliant element that are counterparts to the counterparts of the lower compliant element seen in Figures 4E5-A and 4E5-B.

[0062] Many additional variations of the probes of FIGS. 4A-4E9-B are possible and will be apparent to those of skill in the art upon consideration of the teachings herein, including, for example, (1) variations in materials; (2) the number of turns or partial turns that each spring element incorporates, the number of interleaved springs used at each longitudinal level, the number of longitudinally spaced springs used (e.g., even, odd, and the like), the number and locations of longitudinal beam transitions that occur along the length of the helix, the direction of rotation that successive helices take (e.g., clockwise-counterclockwise-clockwise-counterclockwise-clockwise, clockwise-counterclockwise-counterclockwise-clockwise, and the like), tip shape, and the width and thickness of the cantilever beam. , variations in configuration; (3) the use of standoffs that space one or both of the upper and lower spring modules from the annular frame, (4) the use of standoffs closer to a central portion of the probe as opposed to the periphery of the probe; (5) the use of different types of frames or base structures and / or openings in such frames and base structures; (6) the use of spring structures that are a single helix at a given longitudinal level, or more than two interlaced helices at a given longitudinal level, rather than a pair of coplanar interlaced helices supported by different standoffs, and (7) variations obtained from the features of other embodiments and aspects described herein and variations thereof.

[0063] 5A1-5H show an exemplary probe 3500 and dual array plate mounting and retention configuration according to an embodiment of the invention using lateral slide locks or tabs 3502 and a retaining ring or annular base 3501 in combination with two array plates 3540-L and 3540-U.

[0064] 5A1 and 5A2 provide isometric views from above and below, respectively, of an exemplary probe 3500 according to an embodiment of the invention, where the probe includes a probe body 3504 (e.g., a portion of the probe excluding laterally extending peripheral features such as structures whose primary purpose is mounting or alignment), a mount ring, stop ring, or base 3501 that engages around the top edge of a circular through-hole or lower plate probe hole 3541-C in a lower engagement plate or lower array plate 3540-L, and a slide clip or tab 3502 on the right side of the probe 3500 for engaging an upper right edge region of an elliptical through-hole 3541-O in an upper array plate 3540-U. In a dual approach, a slide clip or tab 3502 may be provided on the left side of the probe 3500 for engaging an upper left edge region of an elliptical through-hole 3541-O in an upper array plate 3540-U.

[0065] The probe 3500 includes a compliant structure including standoffs having first and second ends, a first compliant element 3500-U including a longitudinally spaced, two-dimensional, substantially planar spring 3521-U, and a second compliant element 3500-L including a spring 3521-L. Alternatively, both the first compliant element 3500-U and the second compliant element 3500-L include respective two-dimensional, substantially planar springs.

[0066] More specifically, the first compliant element 3500-U provides compliance in a direction substantially perpendicular to the planar configuration, where a first portion of the first compliant element is operatively coupled to the at least one standoff and a second portion of the first compliant element is operatively coupled to a first distal arm that is resiliently moveable relative to the at least one standoff, where the first distal arm directly or indirectly secures a first distal end 3531-U that extends longitudinally beyond a first end of the at least one standoff when the first compliant element is unbiased.

[0067] Additionally, the second compliant element 3500-L provides compliance in a direction substantially perpendicular to the planar configuration, where a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently movable relative to the at least one standoff, where the second distal arm directly or indirectly secures a second distal end 3531-L that extends longitudinally beyond a second end of the at least one standoff when the second compliant element is unbiased.

[0068] Figures 5B1 and 5B2 provide isometric and top views, respectively, of the lower array plate 3540-L portion, showing a single lower plate probe hole, in particular a single circular through-hole 3541-C into which the lower portion of probe 3500 of Figures 5A1 and 5A2 can be inserted.

[0069] Figures 5C1 and 5C2 provide isometric and top views, respectively, of the upper array plate 3540-U portion and show a single upper plate probe hole, in particular a single elliptical through hole 3541-O into which the upper portion of probe 3500 of Figures 5A1 and 5A2 can be inserted longitudinally (and then shifted laterally so that a sliding clip or tab 3502 provided on the side of probe 3500 engages with the upper edge region of the elliptical through hole 3541-O).

[0070] Figure 5D provides an isometric view of the probe 3500 of Figures 5A1 and 5A2 aligned laterally over the circular through-hole 3541-C of the lower array plate 3540-L portion of Figures 5B1 and 5B2 in preparation for relative longitudinal shifting or loading of the probe 3500 into the circular through-hole 3541-C in the lower array plate 3540-L by relatively moving the probe 3500 in the direction indicated by arrow 3545.

[0071] 5E provides an isometric view of the probe 3500 and lower array plate 3540-L portions of FIGS. 5A1 and 5A2, 5B1 and 5B, and 5D after the probe 3500 has been loaded longitudinally into the circular through-hole or opening 3541-C in the lower array plate 3540-L such that the retaining ring 3501 of the probe 3500 abuts the upper surface of the lower array plate 3540-L and lateral alignment of the probe 3500 and lower array plate 3540-L is maintained by appropriate sizing and tolerancing of the probe diameter and the diameter of the circular through-hole 3541-C in the lower array plate 3540-L. In this manner, the retaining ring 3501 acts as a lower retention mechanism for the probe 3500 that is configured to engage at least the power array plate 3540-L.

[0072] 5A1 and 5A2 in a final position relative to the lower array plate 3540-L portion of FIGS. 5B1 and 5B2, and aligned laterally below the elliptical through-hole or opening 3541-O of the upper array plate 3540-U portion of FIGS. 5C1 and 5C2, in preparation for relative longitudinal shifting or loading of the probe 3500 into the elliptical through-hole 3541-O by relative movement of the upper array plate 3540-U in the direction indicated by arrow 3545, where the lateral alignment allows the upper array plate 3540-U to slide beyond a position below and near the retention tabs 3502 which act as an upper retention mechanism configured to engage at least the upper array plate 3540-U. The retention tabs 3502 are longitudinally spaced from the retention ring 3501 by a gap 3543 that is greater than the thickness of the longitudinally engaged portion of the upper array plate 3540-U.

[0073] Figure 5G provides an isometric view of the probe 3500, lower array plate 3540-L, and upper array plate 3540-U portions in their final longitudinal positions after the movements described in Figure 5F, but not having completed the required relative lateral movement of the upper array plate 3540-U with respect to the probe 3500 and lower array plate 3540-L to shift the gap 3543 from the right side of the probe body 3504 to the left side of the probe body 3504, as indicated by arrow 3545, to complete the interlocking of the edges of the upper array plate 3540-U between the probe retaining ring 3501 and the retaining tabs 3502.

[0074] Figure 5H provides an isometric view of the probe 3500, lower array plate 3540-L, and upper array plate 3540-U portions in their final longitudinal and lateral positions after the movements described in Figure 5G, such that the gap 3543 between the edges of the elliptical opening 3541-O in the probe body and upper array plate 3540-U moves from the right side of the probe body 3504 (between the retaining ring 3501 and the retaining tabs 3502) to the left side of the probe body 3504, and retention of the longitudinal position of the plates in their relative positions provides retention of the probe 3500 in a position and alignment defined by the dimensions and tolerances set for these three components.

[0075] Many alternative forms of the embodiment of Figures 5A1-5H are possible, including, for example, (1) changes in the aperture shape from one or both of circular and elliptical configurations to some other configuration, such as a square, rectangle, triangle, or some other simple or complex polygon, or a single rotational orientation in one or both of the top and bottom plates, or even a closed curvilinear configuration that may or may not limit probe loading to an orientation that ensures that the probes and each plate are right side up during loading and / or that the lower and upper plates are properly stacked; (2) changes in the shape of the probe body, tabs, and / or retaining ring; (3) holes or apertures in the array plate may include steps, protrusions, notches, and the like, or countersunk portions that may provide enhanced engagement to each other or to the probes themselves, rather than straight longitudinally extending through holes; and (4) other variations described with respect to other embodiments described herein. In most practical implementations, the array plates each include a plurality of through holes in a desired array pattern. In some variations, the array plate may be limited to a dielectric material while the probes may be limited to a conductive material, hi other variations, the array plate may include probes that include conductive elements (e.g., traces) that provide electrical contact to some or all of the probes, and dielectric elements that provide electrical isolation of different elements in a single probe or between adjacent probes. Further comments and conclusions

[0076] Although many embodiments have been presented above, many additional embodiments are possible without departing from the spirit of the present invention. Some of these additional embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. Some fabrication embodiments may use a multi-layer electrochemical deposition process and others may not. Some embodiments may use a combination of selective and blanket deposition processes and others may use neither, while still others may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and / or they may not use a planarization process in the formation of successive layers. Some embodiments may use a selective deposition process or a blanket deposition process for some layers that is not an electrochemical deposition process. Some embodiments may use, for example, nickel (Ni), nickel phosphorus (Ni-P), nickel cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chromium, chromium copper (CrCu), other palladium alloys, copper silver alloys as structural or sacrificial materials, while other embodiments may use different materials. Some of the above materials may be used preferentially for their spring properties, for example, while others may be used for their enhanced electrical conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength or high heat conductivity at high temperatures), while some may be selected for their bonding characteristics, their separability from other substances, or even other characteristics of interest in the desired application or use.Other embodiments may use different materials or combinations of different materials as structural, sacrificial, or patterning materials, including dielectrics (e.g., ceramics, plastics, photoresists, polyimides, glasses, ceramics, or other polymers), other metals, semiconductors, and the like. Some embodiments may use, for example, copper, tin, zinc, solder, photoresist, or other substances as sacrificial materials. Some embodiments may use different structural materials in different layers or in different portions of a single layer. Some embodiments may remove sacrificial materials, while others may not. Some embodiments may form probe structures, while others may use the spring modules of the present invention for non-probe purposes (e.g., to bias other operating devices with a desired spring force or for compliant engagement).

[0077] It is also understood that probe elements of some embodiments of the invention may be formed by processes quite different from those described herein, and it is not intended that structural aspects of the invention need to be formed exclusively by processes taught herein or by processes that become evident from the teachings herein.

[0078] Although headers have been provided in various portions of this specification, the headers are not intended to be used to limit the application of teachings found in one portion of the specification from their application to other portions of the specification. For example, alternatives noted in the context of one embodiment are intended to apply to all embodiments to the extent that features of the different embodiments facilitate such application and do not contradict or eliminate any of the benefits of the embodiment employed.

[0079] Any aspect of the invention described herein is intended to represent a description of an independent invention that the applicant believes to be a full and complete description of the invention that may be written as an independent claim, without the need to incorporate additional limitations or elements from other embodiments or aspects described herein for interpretation or clarification, other than as expressly recited in the written independent claim. Any variations of the aspects described herein are also understood to represent separate and distinct features that, if written, would form a separate independent claim and that may be added separately to the independent claim or added as a dependent claim to further define the invention claimed by the respective dependent claim.

[0080] Numerous further embodiments and alternatives in the design and use of the embodiments of the present invention will be apparent to those skilled in the art in view of the teachings herein. As such, it is not intended that the invention be limited to the specific exemplary embodiments, alternatives, and uses described above. Rather, it is intended to be limited only by the scope of the claims set forth below. (Other possible items) (Item 1) (1) a plurality of probes (3500) for making contact between two electronic circuit elements, each probe comprising: (i) at least one standoff having a first end and a second end spaced longitudinally; (ii) at least one first compliant element (3500-U) comprising a two-dimensional substantially planar spring (3521-U) when unbiased, wherein the first compliant element (3500-U) provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element operatively couples with the at least one standoff and a second portion of the first compliant element operatively couples with a first distal arm that is resiliently moveable relative to the at least one standoff, wherein the first distal arm directly or indirectly secures a first distal end (3531-U) extending longitudinally beyond the first end of the at least one standoff when the first compliant element is unbiased; and (iii) at least one second compliant element (3500-L) including a spring (3521-L), wherein the second compliant element (3500-L) provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently movable relative to the at least one standoff, wherein the second distal arm directly or indirectly secures a second distal end (3531-L) extending longitudinally beyond the second end of the at least one standoff when the second compliant element is unbiased; wherein the first portions of the first and second compliant elements (3500-U, 3500-L) are longitudinally spaced apart from one another by the at least one standoff, and wherein when at least one of the first and second distal ends is biased towards the other, the second portions of the first and second compliant elements move longitudinally in a manner selected from the group consisting of: (A) moving closer together, and (B) moving further apart; at least one compliant structure including; (2) a lower array plate (3540-L) with multiple lower plate probe holes (3541-C); (3) an upper array plate (3540-U) with a plurality of upper plate probe holes (3541-O), wherein at least a portion of the upper plate probe holes (3541-O) include at least one sidewall feature that provides for extension of each upper plate probe hole (3541-O) on the upper array plate (3540-U) to a width greater than a corresponding portion of a corresponding lower plate probe hole (3541-C) on the lower array plate (3540-L); wherein the lower array plate (3540-L) is configured to receive the probe (3500) from above the lower array plate (3540-L); wherein the upper array plate (3540-U) is configured to receive probes from below the upper array plate (3540-U); wherein at least a portion of the plurality of probes further includes at least one lower retention mechanism (3501) and at least one upper retention mechanism (3502), the at least one lower retention mechanism (3501) configured to engage with at least the lower array plate (3540-L), and the at least one upper retention mechanism (3502) configured to engage with at least the upper array plate (3540-U); wherein the at least one lower retention feature (3501) includes at least one laterally extending feature protruding from a body of each of the probes (3500) with a size and configuration that limits the longitudinal extent over which each of the probes (3500) can be inserted into the lower plate probe holes (3541-C) of the lower array plate (3540-L); wherein the at least one upper retention mechanism (3502) includes at least one tab-like mechanism extending laterally from the body of each of the probes (3500) at a level above the lower retention mechanism (3501) and spaced longitudinally from the lower retention mechanism (3501) by a gap (3543) greater than a thickness of a longitudinal engagement portion of the upper array plate (3540-U), wherein the at least one upper retention mechanism (3502) has a lateral configuration that is sized to pass through the extension provided by the sidewall mechanism of the upper plate probe hole (3541-O) on the upper array plate (3540-U) when aligned; and wherein, after longitudinally positioning the upper retention mechanism (3502) over the extension of the upper plate probe hole (3541-O) in the upper array plate (3540-U), the upper retention mechanism (3502) undergoes a lateral displacement relative to the upper plate probe hole (3541-O), such that the at least one upper retention mechanism (3502) can no longer longitudinally pass through the extension of the upper plate probe hole (3541-O) in the upper array plate (3540-U); A probe array comprising: (Item 2) 2. The probe array of claim 1, wherein lateral displacement of the upper array plate (3540-U) causes the upper array plate (3540-U) to slide beyond a position below and adjacent the upper retention mechanism (3502). (Item 3) 2. The probe array of claim 1, wherein the lateral displacement of the upper retention mechanism (3502) relative to the upper plate probe holes (3541-O) in the upper array plate (3540-U) causes the gap (3543) between the body of each of the probes (3500) and the edges of the upper plate probe holes (3541-O) in the upper array plate (3540-U) to move from one side of the body to the opposite side of the body, such that retention of the longitudinal positions of the lower array plate (3540-L) and the upper array plate (3540-U) in their relative positions provides retention of the probes (3500) in a position and alignment defined by dimensions and tolerances set for the upper retention mechanism (3502), the upper plate probe holes (3541-O), and the diameter of the probes (3500). (Item 4) 2. The probe array of item 1, wherein the lower plate probe holes (3541-C) of the lower array plate (3540-L) have a shape selected from the group consisting of: (A) circular; (B) elliptical; (C) square; (D) rectangular; (E) triangular; (F) simple polygon; (G) complex polygon; and (H) closed curved configuration. (Item 5) 2. The probe array of item 1, wherein the upper plate probe holes (3541-O) of the upper array plate (3540-U) have a shape selected from the group consisting of: (A) circular; (B) elliptical; (C) square; (D) rectangular; (E) triangular; (F) simple polygon; (G) complex polygon; and (H) closed curved configuration. (Item 6) 2. The probe array of claim 1, wherein the lower plate probe holes (3541-C) of the lower array plate (3540-L) have a shape selected from the group consisting of: (A) straight longitudinally extending through holes; (B) holes including a step; (C) holes including a protrusion; (D) holes including a notch; (E) holes including countersunk portions that engage with each other; and (F) holes including countersunk portions that engage with the respective probes. (Item 7) 2. The probe array of claim 1, wherein the upper plate probe holes (3541-O) of the upper array plate (3541-U) have a shape selected from the group consisting of: (A) straight longitudinally extending through holes; (B) holes including a step; (C) holes including a protrusion; (D) holes including a notch; (E) holes including countersunk portions that engage with each other; and (F) holes including countersunk portions that engage with the respective probes. (Item 8) 2. The probe array of item 1, wherein the probes (3500) are made of a conductive material. (Item 9) 2. The probe array of claim 1, wherein the lower array plate (3540-L) and the upper array plate (3540-U) are made of a dielectric material. (Item 10) 10. The probe array of item 9, wherein the lower array plate (3540-L) and the upper array plate (3540-U) further include conductive elements for providing electrical contact to at least one probe (3500). (Item 11) Item 11. The probe array of item 10, wherein the probes (3500) include dielectric elements that provide electrical isolation of different elements in a single probe or between adjacent probes. (Item 12) 2. The probe array of item 1, wherein the lower retention mechanism (3501) has an annular configuration. (Item 13) 1. A probe for making contact between two electronic circuit elements, comprising: (i) at least one standoff having a first end and a second end spaced longitudinally; (ii) at least one first compliant element (3500-U) comprising a two-dimensional substantially planar spring (3521-U) when unbiased, wherein the first compliant element (3500-U) provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element operatively couples with the at least one standoff and a second portion of the first compliant element operatively couples with a first distal arm that is resiliently moveable relative to the at least one standoff, wherein the first distal arm directly or indirectly secures a first distal end (3531-U) extending longitudinally beyond the first end of the at least one standoff when the first compliant element is unbiased; and (iii) at least one second compliant element (3500-L) including a spring (3521-L), wherein the second compliant element (3500-L) provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently movable relative to the at least one standoff, wherein the second distal arm directly or indirectly secures a second distal end (3531-L) extending longitudinally beyond the second end of the at least one standoff when the second compliant element is unbiased; wherein the first portions of the first and second compliant elements (3500-U, 3500-L) are longitudinally spaced apart from one another by the at least one standoff, and wherein when at least one of the first and second distal ends is biased towards the other, the second portions of the first and second compliant elements move longitudinally in a manner selected from the group consisting of: (A) moving closer together, and (B) moving further apart; At least a portion of the probe further includes at least one lower retention feature (3501) and at least one upper retention feature (3502); the at least one lower retention feature (3501) includes at least one laterally extending feature that protrudes from a body of the probe (3500); the at least one upper retention mechanism (3502) includes at least one tab-like mechanism extending laterally from the body of the probe (3500) at a level above the lower retention mechanism (3501) and spaced longitudinally from the lower retention mechanism (3501) by a gap (3543); A probe comprising at least one compliant structure comprising: (Item 14) Item 14. The probe of item 13, wherein the probe (3500) is made of a conductive material. (Item 15) Item 15. The probe of item 14, wherein the probe (3500) includes a dielectric element that provides electrical isolation of different elements in a single probe or between adjacent probes. (Item 16) Item 14. The probe of item 13, wherein the lower retention feature (3501) has an annular configuration.

Claims

1. (1) a plurality of probes for making contact between two electronic circuit elements, each probe comprising: (i) at least one standoff having a first end and a second end spaced longitudinally therebetween; (ii) at least one first compliant element comprising a two-dimensional substantially planar spring when unbiased, wherein the first compliant element provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element operatively couples with the at least one standoff and a second portion of the first compliant element operatively couples with a first distal arm that is resiliently movable relative to the at least one standoff, wherein the first distal arm directly or indirectly secures a first distal end extending longitudinally beyond the first end of the at least one standoff when the first compliant element is unbiased; and (iii) at least one second compliant element comprising a spring, wherein the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently moveable relative to the at least one standoff, wherein the second distal arm directly or indirectly secures a second distal end extending longitudinally beyond the second end of the at least one standoff when the second compliant element is unbiased; wherein the first compliant element and the first portion of the second compliant element are longitudinally spaced from one another by the at least one standoff, and wherein when at least one of the first distal end and the second distal end is biased toward the other, the first compliant element and the second portion of the second compliant element move longitudinally in a manner selected from the group consisting of: (A) moving closer together, and (B) moving further apart; at least one compliant structure comprising: (2) a lower array plate with a plurality of lower plate probe holes; (3) an upper array plate with a plurality of upper plate probe holes, at least some of said upper plate probe holes including at least one sidewall feature providing an extension of each upper plate probe hole on said upper array plate to a width greater than a corresponding portion of a corresponding lower plate probe hole on said lower array plate; wherein the lower array plate is configured to receive the probes from above the lower array plate; wherein the upper array plate is configured to receive the probes from below the upper array plate; wherein at least a portion of the plurality of probes further include at least one lower retention mechanism and at least one upper retention mechanism, the at least one lower retention mechanism configured to engage at least the lower array plate, and the at least one upper retention mechanism configured to engage at least the upper array plate; wherein the at least one lower retention feature includes at least one laterally extending feature protruding from a body of each of the probes with a size and configuration that limits the longitudinal extent over which each of the probes can be inserted into the lower plate probe holes of the lower array plate; wherein the at least one upper retention feature includes at least one tab-like feature extending laterally from the body of each of the probes at a level above the lower retention feature and spaced longitudinally from the lower retention feature by a gap greater than a thickness of a longitudinal engagement portion of the upper array plate, wherein the at least one upper retention feature has a lateral configuration that is sized to pass through the extension provided by the sidewall feature of the upper plate probe hole on the upper array plate when aligned; and wherein after longitudinal positioning of the upper retention mechanism over the extension of the upper plate probe hole in the upper array plate, the upper retention mechanism undergoes a lateral displacement relative to the upper plate probe hole, such that the at least one upper retention mechanism can no longer longitudinally pass over the extension of the upper plate probe hole in the upper array plate. A probe array comprising:

2. The probe array of claim 1 , wherein lateral displacement of the upper array plate causes the upper array plate to slide past a position below and adjacent the upper retention mechanism.

3. 2. The probe array of claim 1, wherein the lateral displacement of the upper retention features relative to the upper plate probe holes in the upper array plate causes the gap between the body of each of the probes and an edge of the upper plate probe hole in the upper array plate to move from one side of the body to the opposite side of the body such that retention of the longitudinal positions of the lower array plate and the upper array plate in their relative positions provides retention of the probes in positions and alignments defined by dimensions and tolerances set for the upper retention features, the upper plate probe holes, and diameters of the probes.

4. 2. The probe array of claim 1, wherein the lower plate probe holes of the lower array plate have a shape selected from the group consisting of: (A) circular; (B) elliptical; (C) square; (D) rectangular; (E) triangular; (F) simple polygon; (G) complex polygon; and (H) closed curved configuration.

5. 2. The probe array of claim 1, wherein the upper plate probe holes of the upper array plate have a shape selected from the group consisting of: (A) circular; (B) elliptical; (C) square; (D) rectangular; (E) triangular; (F) simple polygon; (G) complex polygon; and (H) closed curved configuration.

6. 2. The probe array of claim 1, wherein the lower plate probe holes of the lower array plate have a shape selected from the group consisting of: (A) straight longitudinally extending through holes; (B) holes including a step; (C) holes including a protrusion; (D) holes including a notch; (E) holes including countersunk portions that engage with each other; and (F) holes including countersunk portions that engage with the respective probes.

7. 2. The probe array of claim 1, wherein the upper plate probe holes of the upper array plate have a shape selected from the group consisting of: (A) straight longitudinally extending through holes; (B) holes including a step; (C) holes including a protrusion; (D) holes including a notch; (E) holes including countersunk portions that engage with each other; and (F) holes including countersunk portions that engage with the respective probes.

8. The probe array of claim 1 , wherein the probes are made of a conductive material.

9. The probe array of claim 1 , wherein the lower array plate and the upper array plate are made of a dielectric material.

10. The probe array of claim 9 , wherein the lower array plate and the upper array plate further include a conductive element for providing electrical contact to at least one probe.

11. The probe array of claim 10 , wherein the probes include dielectric elements that provide electrical isolation of different elements in a single probe or between adjacent probes.

12. The probe array of claim 1 , wherein the lower retention feature has an annular configuration.

13. 1. A probe for making contact between two electronic circuit elements, comprising: (i) at least one standoff having a first end and a second end spaced longitudinally therebetween; (ii) at least one first compliant element comprising a two-dimensional substantially planar spring when unbiased, wherein the first compliant element provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element operatively couples with the at least one standoff and a second portion of the first compliant element operatively couples with a first distal arm that is resiliently movable relative to the at least one standoff, wherein the first distal arm directly or indirectly secures a first distal end extending longitudinally beyond the first end of the at least one standoff when the first compliant element is unbiased; and (iii) at least one second compliant element comprising a spring, wherein the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently movable relative to the at least one standoff, wherein the second distal arm directly or indirectly secures a second distal end extending longitudinally beyond the second end of the at least one standoff when the second compliant element is unbiased. wherein the first compliant element and the first portion of the second compliant element are longitudinally spaced from one another by the at least one standoff, and wherein when at least one of the first distal end and the second distal end is biased toward the other, the first compliant element and the second portion of the second compliant element move longitudinally in a manner selected from the group consisting of: (A) moving closer together, and (B) moving further apart; At least a portion of the probe further includes at least one lower retention feature and at least one upper retention feature; the at least one lower retention feature includes at least one laterally extending feature protruding from a body of the probe; the at least one upper retention mechanism includes at least one tab-like mechanism extending laterally from the body of the probe at a level above the lower retention mechanism and spaced longitudinally from the lower retention mechanism by a gap; A probe comprising at least one compliant structure comprising:

14. The probe of claim 13 , wherein the probe is made from a conductive material.

15. The probe of claim 14 , wherein the probe includes a dielectric element that provides electrical isolation of different elements in a single probe or between adjacent probes.

16. The probe of claim 13 , wherein the lower retention feature has an annular configuration.

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