Lifting device and lifting method

Abstract

To contribute to suppression of the number of components and space saving, and to enable stable and smooth elevation of a moving member.SOLUTION: An elevating device for raising and lowering a movable member which is movable in the vertical direction in a processing chamber in which a substrate is processed under reduced pressure, the elevating device comprising: a cylindrical portion; a pressure-receiving portion which is movable in the central axis direction of the cylindrical portion by receiving pressure of a gas in the cylindrical portion; a connecting portion for connecting the pressure-receiving portion to the movable member; a first extendable portion which is arranged on one side in the central axis direction with respect to the pressure-receiving portion in the cylindrical portion and is extendable and retractable in the central axis direction with the movement of the pressure-receiving portion; and a second extendable portion which is arranged on the other side in the central axis direction with respect to the pressure-receiving portion in the cylindrical portion. The pressure receiving portion moves along the central axis direction of the cylindrical portion by adjusting the pressure of the gas in at least one of a first space between the cylindrical portion and the first expansion and contraction portion and a second space between the cylindrical portion and the second expansion and contraction portion, and raises and lowers the moving member together with the connecting portion.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a lifting device and a lifting method. [Background technology]

[0002] Substrate processing apparatuses that perform substrate processing such as etching and deposition on substrates are known. One such substrate processing apparatus includes a plurality of lift pins that are movable up and down relative to a support (mounting table) that supports a substrate to be processed, and a cylinder that serves as a drive unit that moves each lift pin up and down (see, for example, Patent Document 1). In this substrate processing apparatus, the substrate can be raised and lowered on the support by the up and down movement of each lift pin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2023-515063 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology disclosed herein contributes to reducing the number of components and saving space, and also enables stable and smooth lifting and lowering of moving members. [Means for solving the problem]

[0005] One aspect of the technology according to the present disclosure is an elevating device that elevates a moving member that is movable in a vertical direction within a processing chamber in which a substrate is processed under reduced pressure, the elevating device comprising: a cylindrical portion; a pressure receiving portion that is disposed within the cylindrical portion and that is movable along a central axis direction of the cylindrical portion by receiving gas pressure within the cylindrical portion; a connecting portion that connects the pressure receiving portion and the moving member; and a connecting portion that is disposed within the cylindrical portion on one side of the pressure receiving portion in the central axis direction, that is cylindrical, that has an inside that communicates with the processing chamber, and that moves along the central axis direction as the pressure receiving portion moves. and a second expandable section that is arranged within the cylindrical section on the other side of the pressure-receiving section in the direction of the central axis relative to the pressure-receiving section, is cylindrical, its inside is connected to the processing chamber, and is expandable and contractable in the direction of the central axis as the pressure-receiving section moves. The pressure-receiving section moves along the direction of the central axis by adjusting the pressure of gas in at least one of a first space between the cylindrical section and the first expandable section and a second space between the cylindrical section and the second expandable section, thereby raising and lowering the moving member together with the connecting section. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to reduce the number of components and save space, and also to enable stable and smooth raising and lowering of the moving member. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a vertical cross-sectional perspective view showing an example of a substrate processing apparatus. [Figure 2] 1 is a vertical cross-sectional view showing an example of a lifting device (lifter pins in a raised state) included in the substrate processing apparatus. FIG. [Figure 3] 1 is a vertical cross-sectional view showing an example of a lifting device (lifter pins in a lowered state) included in the substrate processing apparatus. FIG. [Figure 4] FIG. 1 is a vertical cross-sectional perspective view showing an example of a conventional lifting device. DETAILED DESCRIPTION OF THE INVENTION

[0008] An embodiment of the technology according to the present disclosure will be described below with reference to the drawings. However, the configurations described in the following embodiments are merely examples and are not intended to be limiting. For example, each component included in this configuration can be replaced with any component that can perform the same function. Furthermore, any component may be added. FIG. 1 is a vertical cross-sectional perspective view showing an example of a substrate processing apparatus. For convenience of explanation, the upper side in FIG. 1 (and similarly in FIGS. 2 to 4) will be referred to as "upper" (or upper side) and the lower side as "lower" (or lower side).

[0009] The substrate processing apparatus 10 shown in FIG. 1 is an apparatus used, for example, in the manufacture of semiconductors. The substrate processing apparatus 10 includes a processing chamber 11 in which a wafer (substrate) W is processed under reduced pressure, a mounting portion (stage) 12 on which the wafer W is placed, and a lifter portion 13 as a moving member that can move up and down relative to the mounting portion 12. The processing chamber 11 is box-shaped and includes a ceiling portion 111 at an upper portion, a bottom portion 112 at a lower portion, and a sidewall portion 113 connecting the ceiling portion 111 and the bottom portion 112. In this embodiment, a processing gas is supplied into the processing chamber 11. The processing chamber 11 is then placed in a reduced pressure state (vacuum state), and a thin film is formed on the wafer W using plasma. The sidewall portion 113 is also provided with an inlet / outlet 114 through which the wafer W is loaded and unloaded by a transfer arm (not shown).

[0010] A mounting section 12 and a lifter section 13 are disposed within the processing chamber 11. The mounting section 12 has a disk-shaped disk section 121 and a support section 122 that supports the disk section 121. The upper surface of the disk section 121 serves as a mounting surface on which a wafer W is placed. The support section 122 connects and fixes the center of the lower surface of the disk section 121 to the bottom section 112 of the processing chamber 11. The lifter section 13 has a disk-shaped disk section (lifter base) 131 and a plurality of lifter pins 132 supported on the disk section 131. The disk section 131 is disposed below the disk section 121 of the mounting section 12 and concentrically with the disk section 121. The plurality of lifter pins 132 are disposed at equal intervals along the circumferential direction of the disk section 131. The number of lifter pins 132 is preferably, for example, three, but is not limited thereto. Each lifter pin 132 penetrates the disk portion 121 of the mounting portion 12 and can be in a protruding state (the state shown in FIG. 1 ) protruding from the mounting portion 12 or a retracted state retracted from the protruding state. This lifter portion 13 is used when loading a wafer W into or unloading it from the processing chamber 11. When loading a wafer W into the processing chamber 11, each lifter pin 132 is placed in the protruding state, and the wafer W from the transfer arm can be temporarily supported on each lifter pin 132 in the protruding state. The lifter pins 132 then descend while supporting the wafer W until they are retracted. This allows thin film formation processing on the wafer W on the mounting portion 12. When unloading the wafer W from the processing chamber 11 after the thin film formation processing, each lifter pin 132 is placed in the protruding state again, and the wafer W is temporarily supported on each lifter pin 132 in the protruding state. This allows the transfer arm to unload the wafer W.

[0011] FIG. 2 is a vertical cross-sectional view showing an example of a lifting device (lifter pins raised) provided in a substrate processing apparatus. FIG. 3 is a vertical cross-sectional view showing an example of a lifting device (lifter pins lowered) provided in a substrate processing apparatus. The substrate processing apparatus 10 includes a lifting device 1 as a drive source for vertically moving, i.e., raising and lowering, a lifter unit 13. The lifting device 1 is used in a method for raising and lowering a moving member (lifter unit 13). As shown in FIGS. 2 and 3, the lifting device 1 includes a cylindrical portion 2, a pressure-receiving portion 3, a sliding portion 4, a connecting portion 5, a first expandable portion (first bellows) 6A, a second expandable portion (second bellows) 6B, and a guide portion 7.

[0012] The tubular portion 2 has a cylindrical (cylindrical) body portion 21, a sealing portion 22 that seals the upper opening of the body portion 21, and a sealing portion 23 that seals the lower opening of the body portion. The body portion 21 is oriented such that its central axis O21 is aligned in the vertical direction. The sealing portion 22 is provided with a flow path 221 through which the gas GS1 passes. One end of the flow path 221 is a first outer opening (first opening) 222 that opens to the outside of the tubular portion 2, and the other end is a first inner opening 223 that opens to the inside of the tubular portion 2. A joint is connected to the first outer opening 222. The sealing portion 23 is provided with a flow path 231 through which the gas GS2 passes. One end of the flow path 231 is a second outer opening (second opening) 232 that opens to the outside of the tubular portion 2, and the other end is a second inner opening 233 that opens to the inside of the tubular portion 2. A joint is connected to the second outer opening 232. The constituent material of the cylindrical portion 2 is not particularly limited, and for example, stainless steel such as SUS316 can be used. A seal material 26 is disposed between the body portion 21 and the sealing portion 22, and a seal material 27 is disposed between the body portion 21 and the sealing portion 23. The gas GS1 and the gas GS2 may each be, for example, air or an inert gas.

[0013] The pressure-receiving portion 3 is disk-shaped with an outer diameter smaller than the inner diameter of the cylindrical portion 2, and is disposed inside the cylindrical portion 2 concentrically with the cylindrical portion 2. When the pressure-receiving portion 3 receives the pressure of gas GS1 within the cylindrical portion 2, it can move downward along the central axis O2 (see FIG. 3). When the pressure-receiving portion 3 receives the pressure of gas GS2 within the cylindrical portion 2, it can move upward along the central axis O2 (see FIG. 2). A flange portion 31 is formed on the outer periphery of the pressure-receiving portion 3 along the circumferential direction. A sliding portion 4 is provided on this flange portion 31.

[0014] The sliding portion 4 is a ring-shaped elastic member arranged concentrically with the cylindrical portion 2. The sliding portion 4 is compressed between the outer periphery of the pressure-receiving portion 3 and the inner periphery of the cylindrical portion 2. As a result, the sliding portion 4 slides against the inner periphery of the cylindrical portion 2 as the pressure-receiving portion 3 moves. The sliding portion 4 also divides the interior of the cylindrical portion 2 into a space above the pressure-receiving portion 3 (first space SP1) and a space below the pressure-receiving portion 3 (second space SP2). In other words, the sliding portion 4 separates the first space SP1 from the second space SP2. This prevents the gas GS1 and the gas GS2 from passing between the first space SP1 and the second space SP2. Note that the cross-sectional shape of the sliding portion 4 is "Y"-shaped in the configurations shown in FIGS. 2 and 3, but is not limited thereto. Furthermore, the elastic material constituting the sliding portion 4 is not particularly limited, and various rubber materials such as nitrile rubber and fluororubber can be used. Nitrile rubber is preferable when the substrate processing apparatus 10 performs processing at room temperature, and fluororubber is preferable when the substrate processing apparatus 10 performs processing at high temperature.

[0015] The connecting portion 5 extends along the central axis O2 and has a cylindrical (columnar) shape concentrically disposed with the cylindrical portion 2. The connecting portion 5 connects the pressure-receiving portion 3 and the disk portion 131 of the lifter portion 13. The outer diameter of the connecting portion 5 is smaller than the outer diameter of the pressure-receiving portion 3. The connecting portion 5 is formed integrally with the center of the pressure-receiving portion 3, but is not limited thereto. For example, the connecting portion 5 may be formed separately from the pressure-receiving portion 3. The constituent materials of the connecting portion 5 and the pressure-receiving portion 3 are not particularly limited. For example, the same material as the constituent material of the cylindrical portion 2 can be used. As shown in FIG. 1 , the connecting portion 5 is connected to a portion of the disk portion 131 of the lifter portion 13 that is eccentric from the center. In this embodiment, the lifting device 1 is cantilevered relative to the lifter portion 13 and is configured to lift and lower the lifter portion 13. Furthermore, a through-hole 224 through which the connecting portion 5 passes is formed in the sealing portion 22 of the cylindrical portion 2, and a through-hole 234 is also formed in the sealing portion 23 on the opposite side to the sealing portion 22.

[0016] The first expandable portion 6A is disposed within the cylindrical portion 2 above (one side of) the pressure-receiving portion 3 in the direction of the central axis O2, and the second expandable portion 6B is disposed within the cylindrical portion 2 below (the other side of) the pressure-receiving portion 3 in the direction of the central axis O2. That is, the first expandable portion 6A and the second expandable portion 6B are disposed in the direction of the central axis O21 via the pressure-receiving portion 3. The first expandable portion 6A and the second expandable portion 6B are each formed of a cylindrical member and are disposed concentrically with the cylindrical portion 2. A flange portion 61A is formed at the upper portion of the outer periphery of the first expandable portion 6A along the circumferential direction. The flange portion 61A is connected to the sealing portion 22 of the cylindrical portion 2 by, for example, welding. In addition, a sealant 28 is disposed between the flange portion 61A and the sealing portion 22. A lower portion 62A of the first expandable portion 6A is connected to the pressure-receiving portion 3 by, for example, welding. Meanwhile, a flange portion 61B is formed along the circumferential direction at the lower part of the outer periphery of the second expandable portion 6B. The flange portion 61B is connected to the sealing portion 23 of the tubular portion 2 by, for example, welding. A sealant 29 is disposed between the flange portion 61B and the sealing portion 23. An upper portion 62B of the second expandable portion 6B is connected to the pressure-receiving portion 3 by, for example, welding.

[0017] The pressure-receiving section 3 has a communication section 32 that connects the inside of the first expandable section 6A with the inside of the second expandable section 6B. In this embodiment, the communication section 32 is composed of a plurality of through holes 321 that penetrate the pressure-receiving section 3 in the vertical direction (thickness direction). The inside of the first expandable section 6A is connected to the inside of the processing chamber 11, and the inside of the second expandable section 6B is connected to the inside of the processing chamber 11 via the communication section 32 and the first expandable section 6A. This communication allows, for example, air inside the first expandable section 6A and the second expandable section 6B and the processing chamber 11 to be discharged to the outside.

[0018] The first and second elastic portions 6A and 6B are each bellows-shaped. This allows the first and second elastic portions 6A and 6B to expand and contract along the central axis O21 in response to the movement of the pressure-receiving portion 3. As shown in FIG. 2, when the pressure-receiving portion 3 moves upward, the first elastic portion 6A contracts and the second elastic portion 6B expands. On the other hand, as shown in FIG. 3, when the pressure-receiving portion 3 moves downward, the first elastic portion 6A expands and the second elastic portion 6B contracts. Thus, the first and second elastic portions 6A and 6B can expand and contract in response to the movement of the pressure-receiving portion 3. The first and second elastic portions 6A and 6B are made of the same metal material. While the metal material is not particularly limited, it is preferable to use a flexible metal material such as Hastelloy. This allows the first and second elastic portions 6A and 6B to easily expand and contract.

[0019] In the lifting device 1, a first space SP1 is defined by the body 21 and sealing portion 22 of the cylindrical portion 2, the first expandable portion 6A, the pressure-receiving portion 3, and the sliding portion 4, and a second space SP2 is defined by the body 21 and sealing portion 23 of the cylindrical portion 2, the second expandable portion 6B, the pressure-receiving portion 3, and the sliding portion 4. Both the first space SP1 and the second space SP2 are sealed spaces.

[0020] The guide portion 7 is a portion that guides the pressure receiving portion 3 when the pressure receiving portion 3 moves in the up and down direction. The guide portion 7 has a first sliding portion 71 arranged in the first space SP1, a second sliding portion 72 arranged in the second space SP2, and a support portion 73 that supports the first sliding portion 71 and the second sliding portion 72 relative to the pressure receiving portion 3. The first sliding portion 71 and the second sliding portion 72 are each annular (ring-shaped) members that are arranged concentrically with the cylindrical portion 2.

[0021] There are two support portions 73. Each support portion 73 can be used to support both the first sliding portion 71 and the second sliding portion 72 by being turned upside down. Hereinafter, the support portion 73 for supporting the first sliding portion 71 may be referred to as the "support portion 73A," and the support portion 73 for supporting the second sliding portion 72 may be referred to as the "support portion 73B." The support portion 73 includes a first annular portion 74 that is annular and concentric with the cylindrical portion 2, a second annular portion 75 that is spaced from the first annular portion 74 along the central axis O21 and is also annular and concentric with the cylindrical portion 2, and a connecting portion 76 that connects the first annular portion 74 and the second annular portion 75. A groove 741 is formed in the outer periphery of the first annular portion 74 along the circumferential direction. The first sliding portion 71 fits into the groove 741 of the support portion 73A. This prevents the first sliding portion 71 from coming off the support portion 73A. The second sliding portion 72 fits into the groove 741 of the support portion 73B. This prevents the second sliding portion 72 from coming off the support portion 73B. The second annular portion 75 of the support portion 73A is fixed to the upper surface of the pressure-receiving portion 3. The second annular portion 75 sandwiches the sliding portion 4 between itself and the flange portion 31 of the pressure-receiving portion 3. This prevents the sliding portion 4 from coming off the pressure-receiving portion 3. Meanwhile, the second annular portion 75 of the support portion 73B is fixed to the lower surface of the pressure-receiving portion 3. The connecting portion 76 is composed of a plurality of columnar portions 761 extending along the central axis O2. These columnar portions 761 are arranged at equal angular intervals around the central axis O21. The number of columnar portions 761 is preferably, for example, eight, but is not limited thereto.

[0022] In the guide portion 7, when the pressure-receiving portion 3 moves up and down, the first sliding portion 71 and the second sliding portion 72 slide against the inner periphery of the cylindrical portion 2. This allows the pressure-receiving portion 3 to move up and down stably. In the guide portion 7, it is preferable to space the first sliding portion 71 and the second sliding portion 72 as far apart as possible. This allows the pressure-receiving portion 3 to move up and down more stably. As shown in FIG. 2 , when the pressure-receiving portion 3 moves upward, the first annular portion 74 of the support portion 73A abuts against the sealing portion 22 of the cylindrical portion 2. This limits the upward movement of the pressure-receiving portion 3, thereby preventing the lifter pins 132 from protruding excessively and stably supporting the wafer W on the lifter pins 132. In this way, the support portion 73A functions as a limiting portion that limits the upward movement of the pressure-receiving portion 3. On the other hand, the support portion 73B can restrict the downward movement limit of the pressure receiving portion 3.

[0023] The constituent materials of the first sliding portion 71 and the second sliding portion 72 are not particularly limited, and various thermoplastic elastomers such as polyether ether ketone (PEEK) can be used, for example. This allows the first sliding portion 71 and the second sliding portion 72 to slide smoothly and suppresses wear during sliding, that is, provides high slidability and wear resistance. The constituent material of the support portion 73 is not particularly limited, and for example, metal materials such as aluminum and stainless steel, as well as resin materials, can be used.

[0024] The operation of the lifting device 1 configured as described above, i.e., the lifting and lowering of the lifter section 13 by the lifting device 1, will now be described. When lifting the lifter section 13, as shown in FIG. 2, gas GS2 is supplied to the second space SP2 of the lifting device 1. This supply of gas GS2 increases the pressure in the second space SP2, making it higher than the pressure in the first space SP1. This allows the pressure-receiving section 3 to move upward along the central axis O2, i.e., in the direction of arrow α. This movement in the direction of arrow α allows the pressure-receiving section 3 to lift the lifter section 13 together with the connecting section 5. Furthermore, as the pressure-receiving section 3 moves in the direction of arrow α, gas GS1 is discharged from the first space SP1. This allows the lifter section 13 to rise stably and smoothly.

[0025] On the other hand, when the lifter unit 13 is lowered, as shown in FIG. 3 , gas GS1 is supplied to the first space SP1 of the lifting device 1. This supply of gas GS1 increases the pressure in the first space SP1, making it higher than the pressure in the second space SP2. This allows the pressure-receiving unit 3 to move downward along the central axis O2, i.e., in the direction of arrow β. This movement in the direction of arrow β allows the pressure-receiving unit 3 to lower the lifter unit 13 together with the connecting unit 5. Furthermore, as the pressure-receiving unit 3 moves in the direction of arrow β, gas GS2 is discharged from the second space SP2. This allows the lifter unit 13 to lower stably and smoothly. In this way, the lifting device 1 adjusts the pressure in at least one of the first space SP1 and the second space SP2. This allows the pressure-receiving unit 3 to move along the central axis O2, allowing the lifter unit 13 to be raised and lowered stably and smoothly.

[0026] Furthermore, when the lifter unit 13 is raised or lowered, if the gas pressure in the first space SP1 and the second space SP2 is lower than the gas pressure in the first and second telescopic units 6A and 6B, buckling may occur in the bellows-shaped first and second telescopic units 6A and 6B. Therefore, it is preferable that the gas pressure in the first and second spaces SP1 and SP2 be higher than the gas pressure in the first and second telescopic units 6A and 6B when the lifter unit 13 is raised or lowered. This prevents buckling in the first and second telescopic units 6A and 6B, thereby extending the service life of the first and second telescopic units 6A and 6B. This pressure relationship, combined with the stable vertical movement of the pressure-receiving unit 3 due to the guide unit 7, further contributes to extending the service life of the first and second telescopic units 6A and 6B.

[0027] Furthermore, the sliding part 4 and the first sliding part 71 and second sliding part 72 of the guide part 7 are all disposed in a space that is cut off from communication with the processing chamber 11. This allows a lubricant to be applied to each sliding part. It is preferable that the lubricant is prevented from being mixed into the processing chamber 11. Furthermore, the lifting device 1 can also stop the pressure-receiving part 3 at an intermediate position between the position shown in FIG. 2 and the position shown in FIG. 3 by adjusting the pressure in the first space SP1 and the second space SP2.

[0028] Next, a comparison will be made between the lifting device 1 and a conventional lifting device 300. FIG. 4 is a vertical cross-sectional perspective view showing an example of a conventional lifting device. As shown in FIG. 4, the lifting device 300 includes an air cylinder 302, a linear slide 308, and a bracket 312 to which the air cylinder 302 and the linear slide 308 are fixed. The lifting device 300 also includes a slide carriage 310 that moves up and down by the linear slide 308 in response to operation of the air cylinder 302. The lifting device 300 also includes a ball joint 306 that connects the shaft 302a of the air cylinder 302 to the slide carriage 310, and a bellows 316 that is disposed and fixed between the eaves portion 312a of the bracket 312 and the slide carriage 310. A lifter pin 314 is fixed to the slide carriage 310 and extends through the bellows 316 into a processing chamber (not shown). The lifter pin 314 can be in a protruding state or a retracted state in accordance with the up and down movement of the slide carriage 310. In addition, the bellows 316 expands and contracts between the eaves portion 312a of the bracket 312 and the slide carriage 310 in accordance with the up and down movement of the slide carriage 310.

[0029] In the lifting device 300 configured as described above, the inside of the bellows 316 is in communication with the processing chamber but is isolated from the outside. Therefore, when the processing chamber is particularly depressurized, the shaft 302a of the air cylinder 302 is pulled upward and moves along with the slide carriage 310. To counteract this pulling movement of the shaft 302a, it is necessary to increase the thrust (holding force) of the air cylinder 302. To increase the thrust, the lifting device 300 requires, for example, increasing the size of the air cylinder 302 or adding auxiliary members to increase the thrust. This results in a complex overall structure, making it difficult to simplify the overall structure. Hereinafter, this problem (issue) with the lifting device 300 will be referred to as "Problem 1."

[0030] Furthermore, in the elevator device 300, the gap (clearance) between the lifter pins 314 and the insertion holes 312b through which the lifter pins 314 pass is very small. It is also preferable to prevent buckling of the bellows 316. Therefore, it is necessary to prevent the lifter pins 314 from ascending and descending at an angle, even to a small extent. The central axis of the lifter pins 314 and the central axis of the shaft 302a of the air cylinder 302 that ascends and descends the lifter pins 314 are not coaxial. In this positional relationship, in order to prevent the lifter pins 314 from ascending and descending at an angle, even to a small extent, the slide carriage 310 must be made more rigid or a reinforcing member must be added to reinforce the slide carriage 310, resulting in a complex overall structure. Hereinafter, this problem (issue) with the elevator device 300 will be referred to as "Problem 2."

[0031] It is clear that, compared to the lifting device 300, the lifting device 1 solves problems 1 and 2 with the above-described configuration. Therefore, this configuration can reduce the number of components of the lifting device 1 and contribute to space saving in the installation area where the lifting device 1 is installed. Reducing the number of components also makes it possible to reduce the weight of the lifting device 1 and reduce manufacturing costs.

[0032] Although the preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and various modifications and alterations are possible within the scope of the gist thereof. Furthermore, in the above embodiment, the lifting device 1 lifts and lowers the lifter portion 13 by cantilevering the lifter portion 13, but this is not limited thereto. For example, the lifter portion 13 may be supported at multiple points (e.g., by double-sided support) to lift and lower the lifter portion 13. Furthermore, the moving member moved up and down by the lifting device 1 is the lifter portion 13 (lifter pins 132) in the above embodiment, but is not limited thereto. For example, the moving member may be the placement portion 12 depending on the configuration of the substrate processing apparatus 10. Furthermore, the processing object processed by the substrate processing apparatus 10 is the wafer W in the present embodiment, but is not limited thereto. For example, the processing object may be a glass substrate depending on the configuration of the substrate processing apparatus 10. [Explanation of symbols]

[0033] 1 Lifting device 2 Cylindrical part 3 Pressure receiving part 5 Connecting part 6A 1st telescopic section 6B 2nd telescopic part 11 Processing Room 132 Lifter pin GS1 Gas GS2 Gas O21 center axis SP1 1st space SP2 2nd space W wafer

Claims

1. A lifting device that lifts and lowers a moving member that is movable in a vertical direction within a processing chamber in which a substrate is processed under reduced pressure, a cylindrical portion having a cylindrical shape; a pressure-receiving portion that is disposed within the cylindrical portion and that is movable along a central axis of the cylindrical portion by receiving gas pressure within the cylindrical portion; a connecting portion that connects the pressure receiving portion and the moving member; a first expandable portion that is arranged on one side of the pressure-receiving portion in the central axis direction within the cylindrical portion, has a cylindrical shape, the inside of which communicates with the inside of the processing chamber, and is expandable and contractable in the central axis direction in response to movement of the pressure-receiving portion; a second expandable portion that is arranged on the other side of the pressure-receiving portion in the central axis direction within the cylindrical portion, has a cylindrical shape, the inside of which communicates with the inside of the processing chamber, and is expandable and contractable in the central axis direction in accordance with movement of the pressure-receiving portion, The pressure-receiving portion moves along the central axis direction by adjusting the gas pressure in at least one of the first space between the tubular portion and the first telescopic portion and the second space between the tubular portion and the second telescopic portion, thereby raising and lowering the movable member together with the connecting portion.

2. The lifting device according to claim 1, further comprising a sliding portion provided between the pressure-receiving portion and the cylindrical portion, which isolates the first space from the second space and slides against the inner periphery of the cylindrical portion as the pressure-receiving portion moves.

3. The lifting device according to claim 2 , wherein the sliding portion is in the shape of a ring arranged concentrically with the cylindrical portion.

4. The lifting device according to claim 1 , further comprising a guide portion that guides the pressure receiving portion when the pressure receiving portion moves.

5. 5. The lifting device according to claim 4, wherein the guide portion has: a first sliding portion that is disposed in the first space and slides against the inner periphery of the cylindrical portion as the pressure-receiving portion moves; a second sliding portion that is disposed in the second space and slides against the inner periphery of the cylindrical portion as the pressure-receiving portion moves; and a support portion that supports the first sliding portion and the second sliding portion relative to the pressure-receiving portion, respectively.

6. The lifting device according to claim 5 , wherein the first sliding portion and the second sliding portion each have a ring shape and are arranged concentrically with the cylindrical portion.

7. The lifting device according to claim 5 , wherein the support portion functions as a restricting portion that restricts a movement limit of the pressure receiving portion.

8. The lifting device according to claim 1 , wherein the first telescopic section and the second telescopic section are each arranged concentrically with the cylindrical section.

9. The lifting device according to claim 1 , wherein the pressure of the gas in the first space and the second space when the moving member is lifted or lowered is higher than the pressure of the gas in the first extension / contraction section and the second extension / contraction section.

10. The lifting device according to claim 1 , wherein the pressure-receiving portion is in the shape of a disk and is arranged concentrically with the cylindrical portion.

11. The lifting device according to claim 1 , wherein the pressure-receiving portion has a communication portion that connects the inside of the first extendable portion with the inside of the second extendable portion.

12. The lifting device according to claim 1 , wherein the cylindrical portion has a first opening through which gas is supplied to and discharged from the first space, and a second opening through which gas is supplied to and discharged from the second space.

13. The lifting device according to claim 1 , wherein the connecting portion has a columnar shape that extends along the central axis direction and is arranged concentrically with the cylindrical portion.

14. the substrate is a wafer, a mounting portion on which the wafer is placed, and a plurality of lifter pins that can be in a protruding state where they protrude from the mounting portion and temporarily support the wafer, and a retracted state where they are retracted from the protruding state, are provided within the processing chamber; 2. The lifting device according to claim 1, wherein the lifting device is used to lift and lower the lifter pins, with the lifter pins serving as the moving members.

15. the substrate is a wafer, a mounting portion on which the wafer is placed is provided in the processing chamber, The lifting device according to claim 1 , wherein the lifting device is used to lift and lower the placement unit, with the placement unit serving as the moving member.

16. A method for raising and lowering a movable member that is movable in a vertical direction within a processing chamber in which a substrate is processed under reduced pressure, comprising: a cylindrical portion having a cylindrical shape; a pressure-receiving portion that is disposed within the cylindrical portion and that is movable along a central axis of the cylindrical portion by receiving gas pressure within the cylindrical portion; a connecting portion that connects the pressure receiving portion and the moving member; a first expandable portion that is arranged on one side of the pressure-receiving portion in the central axis direction within the cylindrical portion, has a cylindrical shape, the inside of which communicates with the inside of the processing chamber, and is expandable and contractable in the central axis direction in response to movement of the pressure-receiving portion; a second expansion / contraction part that is arranged on the other side of the pressure-receiving part in the central axis direction within the cylindrical part, has a cylindrical shape, the inside of which communicates with the inside of the processing chamber, and is expandable and contractable in the central axis direction in accordance with movement of the pressure-receiving part, is used; In the lifting device, the pressure of the gas in at least one of the first space between the tubular portion and the first telescopic portion and the second space between the tubular portion and the second telescopic portion is adjusted to move the pressure-receiving portion along the central axis direction, thereby lifting and lowering the moving member together with the connecting portion.

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