Method for transferring objects and object transfer machine

Abstract

We propose a method and apparatus for transferring devices arranged on a first substrate to a second substrate using laser light, while correcting for any positional misalignment. [Solution] The actual position information of the devices on the first substrate is acquired, and the devices are grouped according to a criterion determined based on the acceptable amount of positional deviation. For each group, the position of the first substrate is corrected so that the device position falls within the range of the acceptable amount of positional deviation, and the device is transferred to the second substrate by irradiating it with laser light from the back of the first substrate.

Description

Technical Field

[0001] The present invention relates to a method for transferring an object and a transfer machine for an object.

Background Art

[0002] In recent years, nitride semiconductor optical devices have come to be used as backlights for liquid crystal displays and as displays for signage. In these applications, since a large number of optical devices are used at once, a high-speed transfer technology is required. As a high-speed transfer technology, batch transfer by a stamp method or the like has been performed, and it has become possible to transfer about 1,000 to several tens of thousands at a time.

[0003] Microdevices up to a size of about 100 μm have been manufactured on the extension of the manufacturing process of conventional semiconductor devices. A dicing tape is attached to a semiconductor wafer, and the devices are divided by a mechanical dicer or by scribing with laser irradiation or generating internal cracks, and the interval between individual devices is widened by stretching the dicing tape so that a handler can pick them up. The positional accuracy due to stretching of the dicing tape is about ±30 μm.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the positional accuracy achieved by stretching the dicing tape is approximately ±30 μm. While this is sufficient for a handler to pick up individual devices for transfer, it presents a challenge when performing bulk transfer using methods such as stamping, as this positional accuracy directly translates to the device mounting accuracy.

[0006] Patent Document 1 proposes a method in which the misalignment of each device is measured before transfer, and the misalignment is corrected for each device before transferring it to the bonded sheet. However, because each device is transferred one by one, it takes an enormous amount of time with a single machine. While it is possible to use multiple machines in parallel, this would increase costs and would prevent the utilization of high-speed transfer technology in subsequent processes.

[0007] Furthermore, while Patent Document 2 proposes a technique for selectively transferring microdevices at high speed using a galvanometer scanner, it does not mention a method for correcting positional misalignment in the arrangement of the devices to be transferred.

[0008] Therefore, the present invention proposes a method to solve the above-mentioned problems of achieving both improved positional accuracy and high speed. [Means for solving the problem]

[0009] To solve the above problems, the present invention provides a method for transferring a device from a first substrate to a second substrate, which is characterized by the following steps: using a first substrate on which devices are mounted at approximately equal intervals with a tolerance misalignment exceeding a tolerance amount, and a second substrate which is arranged opposite the first substrate with a substantially uniform gap and has an adhesive layer on its surface, the method provides an actual position information of the devices on the first substrate; comparing ideal position information with the actual position information and grouping the devices according to a predetermined criterion determined from the tolerance misalignment amount; selecting a group to be transferred; correcting the relative position of the first substrate and the second substrate in the planar direction of the substrates based on the predetermined criterion of the selected group; and transferring only the devices included in the selected group by continuously irradiating them with a laser from the back of the first substrate to the second substrate. [Effects of the Invention]

[0010] This allows for the rapid production of a second substrate in which the positional accuracy of all transferred devices falls within an acceptable margin of error, by correcting the misalignment amount for each group while transferring the devices. [Brief explanation of the drawing]

[0011] [Figure 1] This figure shows the configuration of an LED supply board according to an embodiment of the present invention. [Figure 2] This is a schematic diagram showing the arrangement of LEDs according to an embodiment of the present invention. (In this diagram, there is a certain degree of positional misalignment between the individual LEDs.) [Figure 3] This is a schematic diagram illustrating the acquisition of actual position information of an LED according to an embodiment of the present invention. [Figure 4] This figure shows the LED grouping algorithm according to an embodiment of the present invention. [Figure 5] This figure shows the flow of the transfer operation of a device transfer machine according to an embodiment of the present invention. [Figure 6] This figure shows the processing operation flow of a device transfer machine according to an embodiment of the present invention. [Modes for carrying out the invention]

[0012] An example of an embodiment of the present invention will be described below. In all drawings, the dimensions and proportions of each component have been appropriately altered from those of the actual components in order to make them easier to recognize in the drawings.

[0013] In this embodiment, the device is described as an LED (light-emitting diode) made of GaN (gallium nitride) semiconductor. Generally, LED manufacturers form a large number of LEDs on a sapphire substrate, and after that process, they attach a dicing tape to the sapphire substrate, divide it using a laser-based dicer, stretch the dicing tape with a high-precision expander to spread the individual LEDs at predetermined intervals, transfer them to a sheet or substrate, and supply them to manufacturers of displays using LEDs. Here, we will describe the processing of a substrate on which LEDs are mounted at approximately equal intervals.

[0014] First, the configuration of the LED supply board will be explained using Figure 1. Figure 1 is an overall view of the LED supply board. The LED supply board is an example of a board on which the target device is mounted using the device transfer method according to this embodiment.

[0015] The LED supply substrate consists of multiple LEDs 2 arranged in a matrix on a double-sided polished synthetic quartz substrate 1. Each LED 2 is arranged at equal intervals within a predetermined precision. The positional precision of each LED is defined as the amount of deviation from a grid point, where the ideal position of the LED is defined as a grid point at equal intervals in the horizontal XY direction relative to the center of the synthetic quartz substrate 1, and the amount of deviation in the rotational direction Θ from the grid line connecting the grid points.

[0016] Figure 2 shows the relationship among LED 2, grid points 3, and grid lines 4. The predetermined accuracy depends on the characteristics of the dicing tape, the mechanical accuracy and control of the expander, and is within ±30 μm in the horizontal XY direction. The predetermined accuracy in the rotation direction Θ of each device is within ±1°. The actual position information of each LED 2 used in transfer may be obtained by coordinate transformation of the position information previously acquired by the appearance inspection machine, but a method of timely acquisition in the device transfer machine will be described.

[0017] In the device transfer machine, the synthetic quartz substrate 1, which is the LED supply substrate, and the carrier substrate 7 are respectively arranged on the XYΘ upper substrate stage and the XYZΘ lower substrate stage. Figure 3 shows a schematic diagram at the time of acquiring actual position information. The device transfer machine moves the synthetic quartz substrate 1 so that the observation lens barrel 6 comes directly above the grid point 5 corresponding to the ideal position of each LED, based on the center of the synthetic quartz substrate 1. The control unit (not shown) of the device transfer machine photographs the LED 2 through the quartz substrate 1 and calculates the amount of position deviation from the grid point 5 by image processing. As shown in Figure 3, the intervals A and B between the LEDs are not the same and vary within a predetermined accuracy. This is repeated and accumulated for all the LEDs on the synthetic quartz substrate 1 to obtain the actual position information. In addition, an appearance inspection such as cracks and defects other than position deviation may be performed, and the appearance defect information may be included in the actual position information.

[0018] Next, the algorithm for grouping the LEDs 2 will be described using Figure 4. Judgment for grouping is performed individually for all the LEDs.

[0019] The first judgment is whether the amount of position deviation in XYΘ is within the reference value for all. If this judgment is met, the LED is added to the first group. Here, the reference value is the allowable amount of position deviation targeted for the substrate after transfer. For XY, it is ±10 μm each, and since the deviation in the rotation direction is small, for Θ, it is ±1 μm.

[0020] The second judgment is whether the amount of deviation in the positive X direction exceeds the reference value of 10 μm and is within 30 μm, which is three times the reference value. If this judgment is met, the LED is added to the second group.

[0021] The third determination is whether the deviation amount in the negative X direction exceeds the reference value of -10 μm and is within -30 μm, which is three times the reference value. If this determination is met, the LED is added to the third group.

[0022] Similarly, determinations are also made for the positive and negative Y directions, the four diagonal directions of XY, and the positive and negative Θ. If applicable, they are respectively added to the fourth to eleventh groups.

[0023] If none of the determinations are met, it is considered that the positional deviation amount exceeds the allowable value, or if the actual position information includes appearance defect information, it is managed as a defective LED group.

[0024] Next, the flow of the transfer operation of the device transfer machine will be described using FIG. 5. First, as the first step, the lower substrate stage is moved to the handover position, the carrier substrate is set, loaded to the alignment position, and alignment is performed based on the outer shape reference. Specifically, the end of the carrier substrate is detected using an observation lens barrel, and for a circular substrate, at the position of the orifice, and for a rectangular substrate, at the positions of the ends and corners, a predetermined alignment operation is performed to match the stage coordinate system, and the center coordinates and rotation coordinates of the set carrier substrate based on the observation lens barrel are saved. The rotation direction within the alignment operation has been adjusted to match the stage coordinate system.

[0025] As the second step, the upper substrate stage is moved to the handover position, the synthetic quartz substrate is set, loaded to the alignment position, and alignment is performed based on the LED reference. Specifically, the end of the LED array is searched for using an observation lens barrel, and a predetermined alignment operation is performed to match the stage coordinate system with the searched end and the corners of the LED array, and the center coordinates and rotation coordinates of the set synthetic quartz substrate based on the observation lens barrel are saved. The rotation direction within the alignment operation has been adjusted to match the stage coordinate system.

[0026] The third step involves inputting the LED array information and the allowable positional deviation amount into the control unit's GUI. The input values ​​are the total number of LEDs, the number of LEDs per row, the column pitch in the X direction, and the row pitch in the Y direction as array information, and EX in the X direction, EY in the Y direction, and EΘ in the Θ direction as allowable positional deviation amounts. Note that these deviation amounts are treated as the same value in both the positive and negative directions.

[0027] In the fourth step, the actual position information of each LED is obtained based on the input array information. Specifically, the ideal position coordinates of the corner LEDs are calculated based on the center coordinates of the synthetic quartz substrate and the input array information, and the upper substrate stage is moved to those ideal position coordinates. The LEDs are photographed with an observation microscope tube, the amount of positional displacement is calculated using image processing, and saved. This is repeated for all LEDs to obtain the actual position information.

[0028] The fifth step, grouping based on actual location information, is as explained earlier using Figure 4.

[0029] As the sixth step, processing operations are performed for each group. The specific processing operations are explained using the processing operation flow in Figure 5. Note that the processing operations for groups of defective LEDs will be skipped. If there are LEDs assigned to the defective LED group, this will be indicated on the GUI of the device transfer machine.

[0030] As the first step in the machining operation, the synthetic quartz substrate and the carrier substrate 5 are moved to the machining center of the galvanoscanner, using the mechanically determined horizontal distance between the observation tube and the galvanoscanner, and the previously acquired center coordinates of the synthetic quartz substrate relative to the observation tube and the center coordinates of the carrier substrate 5 relative to the observation tube.

[0031] As the second step of the processing operation, the gap between the synthetic quartz substrate and the carrier substrate 5 is moved along the Z-axis of the lower substrate stage to twice the height of the LED plus a little extra; for example, if the height is 100 μm, the gap at the center is 220 μm. The gap is determined at the center because the center of the synthetic quartz substrate sags depending on its size. If the process range becomes narrower depending on the material and precise adjustment is required, the gap at the center may be measured each time using a height sensor that can detect transparent materials.

[0032] As the third step of the processing operation, the ideal position information (coordinate data set) of the LEDs included in the currently selected group is input to the control unit of the galvanometer scanner as the laser irradiation position. As the fourth step of the processing operation, the upper substrate stage is moved using a correction value corresponding to the currently selected group to correct the relative position of the synthetic quartz substrate and the carrier substrate 5. The correction values ​​will be explained in detail. For example, if the allowable positional displacement EX is 10 μm, then the second group of X(+) is misaligned by more than 10 μm but within 30 μm in the positive X direction, while the others are within the standard value. In this case, the correction value is -20 μm in the X direction. Similarly, for the other groups, the correction value is twice the standard value with the sign reversed.

[0033] As the final step of the processing operation, a processing instruction is sent to the control unit of the galvanometer scanner. Upon receiving this instruction, the control unit of the galvanometer scanner adjusts the laser irradiation position based on the input coordinate data set, sends an oscillation trigger to the laser, and irradiates the LED from the back of the synthetic quartz substrate. This operation is performed for all coordinate data. The irradiated LED is ejected by thermomechanical phenomena and / or chemical explosion phenomena and transferred to the carrier substrate.

[0034] While embodiments of the present invention have been described in detail above, the present invention can also be expressed from a different perspective as follows (1) to (42). (1) A method for transferring a device from a first substrate to a second substrate, A first substrate is used, on which devices are mounted at approximately equal intervals on the surface of the first substrate, with a margin of error exceeding an allowable misalignment; and a second substrate is positioned opposite the first substrate with a substantially uniform gap between them, and is configured to have an adhesive layer on its surface. A step of acquiring the actual position information of a device on the first substrate, A step of comparing the ideal position information of a device on a first substrate with the actual position information, and grouping the devices according to a predetermined criterion determined from the allowable positional deviation amount, The step of selecting the group to transfer, A step of correcting the relative position of the first substrate and the second substrate in the planar direction of the substrates based on the predetermined criteria of the selected group, The steps include: continuously irradiating only the devices included in the selected group with a laser from the back of the first substrate and transferring them to the second substrate; A method for transferring a device having [a certain feature]. (2) The method for transferring a device according to (1), wherein the allowable positional deviation is the amount of deviation in the vertical (X) and / or horizontal (Y) and / or rotational (Θ) directions of the substrate surface relative to the ideal positional information, and the predetermined standard is less than or equal to the allowable positional deviation. (3) The grouping is a step of comparing ideal position information with actual position information and designating devices in which each of XYΘ is within the predetermined criteria as the first group, The method for transferring a device as described in (2), comprising the steps of grouping devices into 2 to 7 groups, wherein, in order, for six positive and negative X, Y, and Θ values, the device exceeds the predetermined standard and is within three times the value of the predetermined standard, and each of the other five values ​​is within the predetermined standard. (4) The grouping includes the steps of comparing ideal location information with actual location information and adding devices that are within the predetermined criteria to the first group, A method for transferring a device as described in (2), comprising the steps of selecting at least one pattern from among 10 possible grouping patterns, which can be 6 positive / negative combinations of X, Y, and Θ, and 4 positive / negative combinations of X and Y; sequentially comparing the selected patterns; and adding a device to the group (2nd to 11th) corresponding to the next selected pattern if the pattern being compared exceeds a predetermined standard and is within 3 times the value of the predetermined standard, and the other selected patterns are within the predetermined standard. (5) A method for transferring devices according to any one of (1) to (4), wherein the actual position information of the devices on the first substrate includes information about defects, and the selected group for irradiation is grouped so that no defective devices are included. (6) A method of transferring a device according to any one of (1) to (5), wherein the laser is irradiated through a galvanometer scanner. (7) The device is an LED. A method for transferring the device as described in any of (1) to (6). (8) A method for transferring the device according to any one of (1) to (7), wherein the device is arranged in a matrix on the first substrate. (9) A method for transferring a device according to any one of (1) to (8), wherein the device is arranged with an accuracy of ±30 μm or less in the longitudinal direction (X) of the first substrate surface with respect to the ideal position information. (10) A method for transferring a device according to any one of (1) to (9), wherein the device is arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate plane relative to the ideal position information. (11) A method for transferring a device according to any one of (1) to (10), wherein the devices are arranged within an accuracy of ±1 degree or less in the rotational direction (Θ) in the direction of the first substrate surface with respect to the ideal position information. (12) A device transfer machine for transferring a device from a first substrate, on which the device is mounted at approximately equal intervals with a distance exceeding an allowable misalignment on the surface of the first substrate, to a second substrate, which is positioned opposite the first substrate with a substantially uniform gap between them and has an adhesive layer on its surface, An image processing device that acquires the actual position information of a device on a first substrate, A processing unit that compares the ideal position information of a device on a first substrate with the actual position information, groups the devices according to a predetermined criterion determined from the allowable positional deviation amount, and selects a group to transfer, A stage and a stage controller that correct the relative position of the first substrate and the second substrate in the planar direction of the substrates based on the predetermined criteria of the selected group, A device transfer machine characterized by including a laser device and a galvanometer scanner optical system that continuously irradiates only the devices included in the selected group with laser light from the back surface of the first substrate. (13) A transfer method for transferring an object from a first substrate to a second substrate, Using a first substrate having a region where the object is positioned in a state exceeding an allowable positional displacement amount, and a second substrate arranged opposite to the first substrate with a gap between them, A step of acquiring the actual position information of an object on the first substrate, The steps include comparing the ideal position information of an object on a first substrate with the actual position information and grouping the objects, The step of selecting the group to transfer, The steps include irradiating the objects included in the selected group with a laser and transferring them to a second substrate, A method for transferring an object having [a certain characteristic]. (14) The method for transferring an object according to (13), wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount in the direction of the first substrate surface relative to the ideal position information. (15) The method for transferring objects according to (13) or (14), wherein the step of comparing the ideal position information of the objects on the first substrate with the actual position information and grouping the objects is performed by grouping them according to a predetermined criterion determined from the allowable positional deviation amount. (16) The allowable displacement amount is the predetermined standard, the method for transferring the object as described in (15). (17) The allowable positional displacement in the vertical (X) direction in the first substrate surface direction is within ±10 μm. A method for transferring an object according to any one of (14) to (16). (18) The allowable lateral (Y) displacement in the direction of the first substrate surface is within ±10 μm. A method for transferring an object as described in any of (14) to (17). (19) The allowable positional displacement in the rotational direction (Θ) in the direction of the first substrate surface is within ±1 degree. A method for transferring an object according to any one of (14) to (18). (20) The grouping is a step of comparing ideal position information with actual position information and designating objects for which at least one of XYΘ is within the predetermined criteria as the first group, A method for transferring an object according to any one of (15) to (19), further comprising the step of making a second group an object in which at least one of the remaining XYΘ that has not been determined in the first group is within the predetermined standard, or an object in which at least one of the XYΘ determined in the first group exceeds the predetermined standard. (21) The method for transferring objects according to any of (13) to (20), wherein the step of irradiating the objects included in the selected group with a laser and transferring them to the second substrate is to irradiate the objects included in the selected group with a laser continuously. (22) The object is a device, and the method for transferring the object described in any of (13) to (21). (23) The method for transferring the object described in (22), wherein the device is an LED. (24) The object is arranged within an accuracy of ±30 μm or less in the vertical (X) direction of the first substrate surface relative to the ideal position information, as described in any of (13) to (23). (25) The object is arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information, as described in any of (13) to (24). (26) The object is arranged within an accuracy of ±1 degree or less in the rotation direction (Θ) in the direction of the first substrate surface with respect to the ideal position information, as described in any of (13) to (25). (27) An object transfer machine for transferring an object from a first substrate in which the object is positioned in a state exceeding an allowable positional displacement amount to a second substrate which is positioned opposite the first substrate with a gap between them, An image processing device that acquires the actual position information of an object on a first substrate, A processing unit that compares the ideal position information of an object on a first substrate with the actual position information, groups the objects, and selects a group to transfer, An object transfer device including a laser device and optical system that irradiates laser light only onto objects included in a selected group. (28) The object transfer machine according to (27), wherein the laser device and optical system continuously irradiate only objects included in the selected group with laser light. (29) The object transfer machine according to (27) or (28), wherein the optical system is a galvanoscanner optical system. (30) The object transfer machine according to any one of (27) to (29), wherein the allowable positional deviation amount includes at least one selected from the group consisting of the vertical (X) deviation amount, the horizontal (Y) deviation amount, and the rotational (Θ) deviation amount in the direction of the first substrate surface relative to the ideal position information. (31) The arithmetic processing unit is a transfer machine for objects according to any of (27) to (30) which are grouped according to a predetermined standard determined from the allowable positional deviation amount. (32) The allowable positional displacement is the predetermined standard described in (31), which is the transfer machine for the object. (33) The transfer machine for objects as described in any of (27) to (32), wherein the allowable positional deviation in the vertical (X) direction in the first substrate surface direction is within ±10 μm. (34) The allowable lateral (Y) displacement in the direction of the first substrate surface is within ±10 μm, as described in any of (27) to (33). (35) The transfer machine for objects as described in any of (27) to (34), wherein the allowable positional deviation in the rotational direction (Θ) in the direction of the first substrate surface is within ±1 degree. (36) The grouping is a step of comparing ideal position information with actual position information and designating objects for which at least one of XYΘ is within the predetermined criteria as the first group, A transfer machine for objects according to any one of (31) to (35), further comprising the step of making objects a second group objects in which at least one of the remaining XYΘ that has not been determined in the first group is within the predetermined standard, or objects in which at least one of the XYΘ determined in the first group exceeds the predetermined standard. (37) A transfer machine for objects according to any one of (31) to (36), having a stage and a stage controller that correct the relative position of the first substrate and the second substrate in the planar direction of the substrates based on the predetermined criteria of the selected group. (38) The object is a device, which is a transfer machine for the object described in any of (27) to (37). (39) The device is an LED, which is a transfer machine for the object described in (38). (40) A transfer machine for objects according to any one of (27) to (39), wherein the objects are arranged within an accuracy of ±30 μm or less in the vertical (X) direction of the first substrate surface with respect to the ideal position information. (41) A transfer machine for objects according to any one of (27) to (40), wherein the objects are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (42) A transfer machine for objects according to any one of (27) to (41), wherein the objects are arranged within an accuracy of ±1 degree or less in the rotational direction (Θ) in the direction of the first substrate surface with respect to the ideal position information.

[0035] Furthermore, the present invention can be described from yet another perspective as follows (U1) to (U42). (U1) A system for transferring a device from a first substrate to a second substrate, A first substrate is used, on which devices are mounted at approximately equal intervals on the surface of the first substrate, with a margin of error exceeding an allowable misalignment; and a second substrate is positioned opposite the first substrate with a substantially uniform gap between them, and is configured to have an adhesive layer on its surface. A mechanism for acquiring the actual position information of a device on the first substrate, A mechanism that compares the ideal position information of a device on a first substrate with the actual position information, and groups the devices according to a predetermined criterion determined from the allowable positional deviation amount, A mechanism for selecting the group to transfer, A mechanism for correcting the relative position of the first substrate and the second substrate in the planar direction of the substrates based on the predetermined criteria of the selected group, A mechanism that continuously irradiates only the devices included in the selected group with a laser from the back of the first substrate and transfers them to the second substrate, A device transfer system having (U2) The device transfer system according to (U1), wherein the allowable positional deviation is the amount of deviation in the longitudinal (X) and / or lateral (Y) and / or rotational (Θ) directions of the substrate surface relative to the ideal position information, and the predetermined standard is less than or equal to the allowable positional deviation. (U3) The grouping is a step of comparing ideal position information with actual position information and designating devices whose XYΘ values ​​are within the predetermined criteria as the first group, A device transfer system according to (U2), comprising the steps of grouping devices into 2 to 7 groups, wherein, in six positive and negative cases for X, Y, and Θ, the devices in order exceed the predetermined standard and are within three times the value of the predetermined standard, while each of the other five cases is within the predetermined standard. (U4) The grouping includes the steps of comparing ideal location information with actual location information and adding devices that are within the predetermined criteria to the first group, A device transfer system according to (U2), comprising the steps of selecting at least one pattern from 10 possible grouping patterns, which can be 6 positive / negative combinations of X, Y, and Θ, and 4 positive / negative combinations of X and Y; sequentially comparing the selected patterns; and adding a device to the group (2nd to 11th) corresponding to the next selected pattern if the pattern being compared exceeds a predetermined standard and is within 3 times the value of the predetermined standard, and the other selected patterns are within the predetermined standard. (U5) A device transfer system according to any one of (U1) to (U4), wherein the actual position information of the devices on the first substrate includes information about defects, and the selected group for irradiation is grouped so that no defective devices are included. (U6) A laser is irradiated through a galvanometer scanner, and the device transfer system is one of the devices described in (U1) to (U5). (U7) The device is an LED, and the device transfer system is one of the devices described in (U1) to (U6). (U8) A transfer system for any of the devices described in (U1) to (U7) arranged in a matrix on the first substrate. (U9) A device transfer system according to any one of (U1) to (U8), wherein the devices are arranged with an accuracy of ±30 μm or less in the longitudinal (X) direction of the first substrate surface relative to the ideal position information. (U10) A device transfer system according to any one of (U1) to (U9), wherein the devices are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate plane relative to the ideal position information. (U11) A device transfer system according to any one of (U1) to (U10), wherein the devices are arranged within an accuracy of ±1 degree or less in the rotational direction (Θ) in the direction of the first substrate surface with respect to the ideal position information. (U12) A device transfer machine on which a first substrate is installed, wherein the first substrate is installed, and the devices are mounted on the surface of the first substrate at approximately equal intervals with the devices mounted on the surface of the first substrate with a margin exceeding an allowable misalignment amount, and the devices are transferred from the first substrate to the second substrate which is positioned opposite the first substrate with a substantially uniform gap and is configured to have an adhesive layer on its surface, An image processing device that acquires the actual position information of a device on a first substrate, A processing unit that compares the ideal position information of a device on a first substrate with the actual position information, groups the devices according to a predetermined criterion determined from the allowable positional deviation amount, and selects a group to transfer, A stage and a stage controller that correct the relative position of the first substrate and the second substrate in the planar direction of the substrates based on the predetermined criteria of the selected group, A device transfer machine on which a substrate is mounted, characterized by including a laser device and a galvanometer scanner optical system that continuously irradiates only the devices included in the selected group with laser light from the back of the first substrate. (U13) A transfer system for transferring an object from a first substrate to a second substrate, Using a first substrate having a region where the object is positioned in a state exceeding an allowable positional displacement amount, and a second substrate arranged opposite to the first substrate with a gap between them, A mechanism for acquiring the actual position information of an object on the first substrate, A mechanism for comparing the ideal position information of an object on a first substrate with the actual position information and grouping the objects, A mechanism for selecting the group to transfer, A mechanism that irradiates objects included in the selected group with a laser and transfers them to a second substrate, A transfer system for objects having a specific feature. (U14) The object transfer system according to (U13), wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount in the direction of the first substrate surface relative to the ideal position information. (U15) A transfer system for objects according to (U13) or (U14) wherein the mechanism for comparing the ideal position information of objects on the first substrate with the actual position information and grouping the objects is a mechanism for grouping objects according to a predetermined criterion determined from the allowable positional deviation amount. (U16) The allowable positional displacement is the predetermined standard for the object transfer system described in (U15). (U17) The allowable positional deviation in the vertical (X) direction in the first substrate surface direction is within ±10 μm. The object transfer system according to any one of (U14) to (U16). (U18) The allowable lateral (Y) displacement in the direction of the first substrate surface is within ±10 μm. The object transfer system according to any one of (U14) to (U17). (U19) The allowable positional displacement in the rotational direction (Θ) in the direction of the first substrate surface is within ±1 degree. The object transfer system according to any one of (U14) to (U18). (U20) The grouping is a step of comparing ideal position information with actual position information and designating objects for which at least one of XYΘ is within the predetermined criteria as the first group, A transfer system for objects according to any one of (U15) to (U19), comprising the step of making a second group objects in which at least one of the remaining XYΘ that has not been determined in the first group is within the predetermined standard, or objects in which at least one of the XYΘ determined in the first group exceeds the predetermined standard. (U21) The mechanism for transferring objects included in the selected group to a second substrate by irradiating them with a laser is an object transfer system according to any one of (U13) to (U20), in which the objects included in the selected group are continuously irradiated with a laser. (U22) The object is a device, which is an object transfer system as described in any of (U13) to (U21). (U23) The object transfer system described in (U22), wherein the device is an LED. (U24) The object transfer system according to any one of (U13) to (U23), wherein the object is arranged within an accuracy of ±30 μm or less in the longitudinal (X) direction of the first substrate surface relative to the ideal position information. (U25) The object transfer system according to any one of (U13) to (U24), wherein the object is arranged within an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (U26) The object transfer system according to any one of (U13) to (U25), wherein the object is arranged within an accuracy of ±1 degree in the rotation direction (Θ) in the direction of the first substrate surface with respect to the ideal position information. (U27) An object transfer machine on which an object is placed, wherein the first substrate is installed, and the object is transferred from a first substrate on which the object is placed in a state exceeding an allowable positional displacement amount to a second substrate which is placed opposite the first substrate with a gap between them, An image processing device that acquires the actual position information of an object on a first substrate, A processing unit that compares the ideal position information of an object on a first substrate with the actual position information, groups the objects, and selects a group to transfer, A transfer machine for objects on which substrates are mounted, including a laser device and optical system that irradiates laser light only onto objects included in a selected group. (U28) A transfer machine for objects on which the substrate described in (U27) is installed, wherein the laser device and optical system continuously irradiate only objects included in the selected group with laser light. (U29) The optical system is a galvanoscanner optical system, and the object transfer machine on which the substrate described in (U27) or (U28) is installed. (U30) A transfer machine for an object on which a substrate described in any of (U27) to (U29) is installed, wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount in the direction of the first substrate surface relative to the ideal position information. (U31) The arithmetic processing unit is a transfer machine for objects on which any of the substrates described in (U27) to (U30) are installed, which are grouped according to a predetermined criterion determined from the allowable positional deviation amount. (U32) The allowable positional displacement is the predetermined standard, a transfer machine for an object on which the substrate described in (U31) is installed. (U33) The allowable positional deviation in the vertical (X) direction in the first substrate surface direction is within ±10 μm. A transfer machine for an object on which a substrate described in any of (U27) to (U32) is installed. (U34) The allowable lateral (Y) displacement in the direction of the first substrate surface is within ±10 μm. A transfer machine for an object on which a substrate described in any of (U27) to (U33) is installed. (U35) The allowable positional deviation in the rotational direction (Θ) in the direction of the first substrate surface is within ±1 degree. A transfer machine for an object on which a substrate described in any of (U27) to (U34) is installed. (U36) The grouping is a step of comparing ideal position information with actual position information and designating objects for which at least one of XYΘ is within the predetermined criteria as the first group, A transfer machine for objects on which a substrate described in any of (U31) to (U35) is installed, comprising the step of making a second group objects in which at least one of the remaining XYΘ that has not been determined in the first group is within the predetermined standard, or objects in which at least one of the XYΘ determined in the first group exceeds the predetermined standard. (U37) A transfer machine for an object on which a substrate described in any of (U31) to (U36) is installed, having a stage and a stage controller that correct the relative position of the first substrate and the second substrate in the planar direction of the substrate based on the predetermined criteria of the selected group. (U38) The object is a transfer machine for objects on which any of the substrates described in (U27) to (U37), which are devices, is installed. (U39) The device is an LED, and the substrate of the object described in (U38) is mounted on a transfer machine. (U40) A transfer machine on which a substrate of the object described in any of (U27) to (U39) is installed, wherein the object is arranged within an accuracy of ±30 μm or less in the vertical (X) direction of the first substrate surface relative to the ideal position information. (U41) A transfer machine for objects on which any of the substrates described in (U27) to (U40) is installed, wherein the objects are arranged within an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (U42) A transfer machine for objects on which any of the substrates described in (U27) to (U41) is installed, wherein the objects are arranged within an accuracy of ±1 degree or less in the rotational direction (Θ) in the direction of the first substrate surface with respect to the ideal position information.

[0036] Furthermore, the various mechanisms may each have a different function, or a single mechanism may have multiple functions. [Industrial applicability]

[0037] This invention can be used in a device transfer method and a device transfer machine. [Explanation of symbols]

[0038] 1 Synthetic quartz substrate 2 LED 3 grid points 4 grid lines 5 Carrier board 6. Observation tube

Claims

1. A transfer method for transferring an object from a first substrate to a second substrate, Using a first substrate having a region in which the object is positioned in a misaligned state relative to the first substrate, and a second substrate arranged opposite to the first substrate with a gap between them, A step of acquiring the actual position information of an object on the first substrate, The steps include comparing the ideal position information of an object on a first substrate with the actual position information and grouping the objects, The step of selecting the group to transfer, The steps include irradiating the objects included in the selected group with a laser and transferring them to the second substrate, A method for transferring an object having [a certain characteristic].

2. Furthermore, the method for transferring an object according to claim 1, comprising the step of correcting the relative position of the first substrate and the second substrate in the planar direction of the first substrate by a correction value corresponding to the selected group.

3. The method for transferring an object according to claim 1 or 2, wherein the positional deviation includes at least one selected from the group consisting of a vertical (X) deviation, a horizontal (Y) deviation, and a rotational (Θ) deviation in the planar direction of the first substrate relative to the ideal position information.

4. The object is a device, as described in any one of claims 1 to 3, and the method for transferring the object is described in claim 1 to 3.

5. The method for transferring an object according to claim 4, wherein the device is an LED.

6. The method for transferring an object according to claim 4 or 5, wherein the devices on the first substrate are obtained by spreading the individual devices to a predetermined interval after dicing.

7. The method for transferring an object according to claim 6, wherein each of the devices is stretched to the predetermined interval by stretching the dicing tape and transferred to a sheet or substrate.

8. The method for transferring an object according to any one of claims 1 to 7, wherein the first substrate is a sheet or a substrate.

9. An object transfer machine that transfers an object from a first substrate, in which the object is positioned misaligned on the first substrate, to a second substrate, which is positioned opposite the first substrate with a gap between them, An image processing device that acquires the actual position information of an object on a first substrate, A processing unit that compares the ideal position information of an object on a first substrate with the actual position information, groups the objects, and selects a group to transfer, An object transfer device including a laser device and optical system that irradiates laser light only onto objects included in a selected group.

10. Furthermore, the object transfer machine according to claim 9, further comprising a stage and a stage controller that correct the relative position of the first substrate and the second substrate in the planar direction of the first substrate with a correction value corresponding to the selected group.

11. The object transfer machine according to claim 9 or 10, wherein the positional deviation includes at least one selected from the group consisting of a vertical (X) deviation, a horizontal (Y) deviation, and a rotational (Θ) deviation in the planar direction of the first substrate with respect to the ideal position information.

12. The object transfer machine according to any one of claims 9 to 11, wherein the laser device and optical system continuously irradiate only objects included in a selected group with laser light.

13. The object transfer machine according to any one of claims 9 to 12, wherein the optical system is a galvanoscanner optical system.

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