Multi-element transfer device and method for manufacturing element arrays

Abstract

To provide a multi-element transfer device for efficiently transferring an element to be transferred such as an element by using a stamp tool, and a manufacturing method of an element array using the multi-element transfer device.SOLUTION: A device includes a stamp table 100 to which an installation stage 82 on which a stamp tool 10 is detachably installed is fixed, a transport head 22 capable of picking up the stamp tool 10 installed on the installation stage 82, a first table 102 to which a first substrate 50 on which an element 32r is arranged is detachably fixed, and a second table 104 to which a second substrate 70 having a surface on which the element 32r arranged on the first substrate 50 is transferred and replaced by the stamp tool 10 is detachably fixed.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a multi-element transfer device and a method for manufacturing an array of elements. [Background technology]

[0002] In the transportation of extremely small parts, the use of a stamp-shaped transportation tool (stamp tool) having many protrusions on its surface is being considered. An example of the stamp-shaped transportation tool is disclosed in the following Patent Document 1. Conventionally, a stamp tool that enables the detachment of a transportation target due to thermal expansion has been disclosed.

[0003] One example of a very small part that is expected to be transported by the stamp tool is an LED element called a mini LED or micro LED.Mini LEDs and micro LEDs are extremely small, measuring 1-8μm in width, 5-10μm in length, and 0.5-3μm in height, compared to conventional general LED elements.

[0004] As in the prior art, LED displays are manufactured by picking up elements from a wafer containing a large number of such LED elements and transferring them to a substrate that corresponds to the display, but there is a need for an apparatus and method for efficiently transferring elements or other elements to be transferred using a stamp tool. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] US Publication No. 2017 / 0173852A1 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made in consideration of the above-mentioned circumstances, and its object is to provide a multi-element transfer device for efficiently transferring elements to be transported, such as elements, using a stamp tool, and a method for manufacturing an element array using the same. [Means for solving the problem]

[0007] In order to achieve the above object, the multi-element transfer device according to the present invention comprises: a stamp table on which at least one stamp tool is removably mounted, the stamp tool having a stamp layer having a portion to which a plurality of transport target elements can be removably attached; A conveying head capable of picking up at least one of the stamp tools placed on the stamp table; a first table to which a first substrate, on whose surface the transport target elements are to be arranged, is removably fixed; a second table to which a second substrate having a surface to which the elements to be transferred arranged on the first substrate are transferred and transferred by the stamp tool is removably fixed, the stamping table and the first table are arranged along a first axis; the first table and the second table are disposed along a second axis intersecting the first axis; the transport head is movable relative to at least the stamping table along a third axis intersecting both the first axis and the second axis; the stamp tool has an attachment surface on the opposite side to the stamp layer to which the transport head is detachably attached; the stamp tool is attached to the stamping table such that the mounting surface faces upward along the third axis; the first table and the second table are relatively movable with respect to the transport head at least along the second axis; The stamping table is capable of moving relatively to the transport head at least along the first axis.

[0008] In the multi-element transfer device of the present invention, the stamp tool is attached to the stamping table with the mounting surface facing upward along the third axis, the first table and the second table are movable relative to the transport head at least along the second axis, and the stamping table is movable relative to the transport head at least along the first axis.

[0009] Therefore, the transport head can move relatively over the stamping table, the first table, and the second table. Also, by using the stamp tool held by the transport head, it is possible to simultaneously transfer a large number of transport target elements from the surface of the first substrate on the first table to the surface of the second substrate on the second table. Also, after transferring the transport target elements from the first substrate to the second substrate, the stamp tool is returned to the original stamping table by the transport head. In this way, in the multi-element transport device of the present invention, the transport target elements such as elements can be efficiently transported by using the stamp tool.

[0010] Furthermore, when elements to be transferred, such as multiple types of elements, are transferred from multiple corresponding first substrates to a single second substrate, it is possible to transfer the elements to be transferred using a different stamp tool for each type. This makes it easy to transfer elements to be transferred of different types to a single second substrate in a set arrangement, making it easy to efficiently manufacture an element array with few pixel defects, for example.

[0011] Preferably, the first substrate includes a plurality of element placement substrates on which the transport target elements of different types are respectively placed, the second substrate is a single mounting substrate or a single transfer substrate, The stamp table includes a plurality of setting stages which detachably hold stamp tools corresponding to the plurality of component placement substrates, respectively.

[0012] Also preferably, the multi-element transfer device comprises: The conveying head is picking up stamp tools corresponding to the plurality of component placement substrates from the corresponding placement stages; using the picked-up stamp tool to pick up the transfer target element from the corresponding component placement substrate; transferring the removed conveying element to the second substrate; The apparatus further includes a control means for driving and controlling the positional relationship among the transport head, the first table, the second table, and the stamping table.

[0013] With this configuration, when elements to be transported, such as multiple types of elements, are transferred from multiple corresponding element placement substrates to a single second substrate, it is possible to transfer the elements to be transported using a different stamp tool for each type. This makes it easy to transfer elements to be transported of different types in a set arrangement to a single second substrate, making it easy to efficiently manufacture an element array with few pixel defects, for example.

[0014] Preferably, the multi-element transfer device comprises: When the transport head holding the stamp tool is positioned above the first substrate, an imaging means capable of imaging simultaneously in two directions is further provided, the imaging means being capable of entering a space between the surface of the first substrate and the stamp layer of the stamp tool, The imaging means simultaneously images the stamp surface of the stamp layer and the surface of the first substrate.

[0015] Preferably, the multi-element transfer device further includes a fine adjustment mechanism that changes the relative position between the transfer head and the first substrate based on a detection signal captured by the imaging means. By adjusting the relative position between the transfer head and the first substrate with the fine adjustment mechanism, accurate alignment is achieved between the stamp layer of the stamp tool and the elements to be transferred that are arranged on the surface of the first substrate, making it possible to hold a large number of small-sized elements to be transferred on the stamp surface of the stamp layer with high precision.

[0016] The fine adjustment mechanism may change the relative rotation angle of the transport head about the third axis based on the detection signal captured by the imaging means. By configuring in this way, the alignment between the stamp surface of the stamp layer and the transport target element disposed on the surface of the first substrate can be more accurately achieved.

[0017] Preferably, the multi-element transfer device comprises: a first axis positioning mechanism for positioning and adjusting a relative position of the stamp tool with respect to the transfer head along a first axis; and a second axis positioning mechanism that positions and adjusts the relative position of the stamp tool with respect to the stamping table along a second axis that intersects the first axis.

[0018] With this configuration, the positioning of the stamp tool along the second axis is performed by using the second axis positioning mechanism with the stamp table as a reference, and the positioning of the stamp tool along the first axis is performed by using the first axis positioning mechanism with the transport head as a reference. Therefore, the positioning mechanism for the transport head is simple and lightweight. As a result, the drive control of the transport head is made easier and the transport position accuracy by the transport head is improved.

[0019] In addition, the positioning of the stamp tool along the second axis is performed relative to the stamping table, but accurate positioning of the stamp tool along the first axis is not required. This simplifies the positioning mechanism on the stamping table and minimizes the space required for the stamping table. This also makes it easier to control the movement of the stamping table. Furthermore, the alignment of the stamping table and the transport head only needs to be performed with high precision along the second axis, for example, and the alignment along the first axis can be roughly performed. This is because the alignment of the stamp tool along the first axis is performed by the first positioning mechanism using the transport head as a reference.

[0020] Preferably, the first axis positioning mechanism also serves as a mounting means for detachably mounting the stamp tool to the transport head. By the mounting means also serving as the positioning mechanism, it becomes unnecessary to provide the transport head with a separate positioning mechanism as a part other than the mounting means.

[0021] The mounting means is not particularly limited, but may be, for example, a chuck mechanism (clamp mechanism), etc. The chuck mechanisms are provided on opposite sides of the first axis of the transport head, and are movable toward and away from the stamp tool.

[0022] Preferably, the second axis positioning mechanism comprises: The stamp table has at least one pair of second positioning members arranged on both sides of a setting stage fixed to the stamp table along the second axial direction and movable toward and away from a stamp tool set on the setting stage.

[0023] With this configuration, it is possible to perform highly accurate positioning of the stamp tool along the second axis relative to the installation stage, and it is also easier to position the stamp tool relative to the transfer head when the stamp tool is picked up by the transfer head.

[0024] Preferably, the installation stage has an installation surface in which a recess for accommodating the stamp layer is formed, and the installation surface has a suction hole formed therein that can detachably adsorb a portion of the stamp tool located around the stamp layer.

[0025] With this configuration, when the stamp layer is accommodated inside the accommodation recess, negative pressure is introduced into the suction hole, and a part of the stamp tool is adsorbed to the installation surface in a freely attachable and detachable manner. As a result, the inside of the accommodation recess is sealed, and dirt and dust are less likely to adhere to the stamp surface of the stamp layer accommodated inside the accommodation recess, making it possible to install the stamp tool while keeping the stamp surface clean.

[0026] Preferably, the installation stage is detachably fixed to a base fixed to the stamp table. The stamp tool needs to be replaced according to the customer's request or the substrate on which the element to be transported is fabricated. By preparing a plurality of installation stages in accordance with the change of the stamp tool, it is possible to respond to the change of the stamp tool size by replacing only the installation stage without replacing the base. In addition, it is preferable that the flatness of each installation stage with respect to the base is ensured, and there is no need to adjust the flatness when replacing the stamp tool.

[0027] Preferably, the installation stage is formed with a gas circulation hole that communicates with the space in the accommodation recess and exchanges the gas in the accommodation recess. By exchanging the gas in the recess, dirt and dust adhering to the surface of the stamp layer accommodated inside the accommodation recess can be discharged together with the gas, improving the cleanliness of the stamp layer.

[0028] Preferably, the installation stage is provided with a guide means for guiding the stamp tool at least along the first axis. By providing the guide means on the installation stage, it becomes easy to roughly position the stamp tool along the first axis. In addition, when the stamp tool is picked up by the transport head, it becomes easy to position the stamp tool with high precision along the first axis relative to the transport head.

[0029] Preferably, the guiding means includes a plurality of guiding members detachably attached to both sides of the installation stage along the first axis. Preferably, each of the guiding members has an inclined surface that can engage with a tapered surface of the stamp tool. This configuration makes it easier to roughly position the stamp tool along the first axis.

[0030] Preferably, at least two guide members are attached to each of both sides of the installation stage along the first axis, and the first axis positioning mechanism is inserted along the gap between the two guide members so as to be able to abut against the stamp tool. With this configuration, it is possible to easily position the stamp tool with respect to the transport head with high accuracy, despite the simple configuration.

[0031] The method for producing an element array of the present invention is characterized in that a plurality of elements to be transported are simultaneously removed from a substrate and transported using any of the multi-element transport devices described above, thereby producing an element array.

[0032] According to the method for manufacturing an element array of the present invention, an element array having a large number of elements that are positioned and arranged with high precision can be manufactured easily, in a short time, and at low cost.

[0033] Preferably, the stamp tool comprises: a stamp layer having a portion to which an element to be transported can be detachably attached; A support plate to which the stamp layer is fixed; The support plate is replaceably attached, and an adapter plate has a mounting surface to which the transport head can be detachably attached.

[0034] In this stamp tool, only the support plate to which the stamp layer is fixed can be replaced from the adapter plate without replacing the entire stamp tool. Therefore, stamp tools having different types of stamp layers can be easily prepared at low cost. In addition, even if the size of the stamp layer or the size of the support plate is changed, the size of the adapter plate can be easily unified, and the transfer head or the installation stage can be easily shared. In addition, since the stamp layer is fixed to the support plate, it is easy to ensure the flatness of the stamp surface of the stamp layer.

[0035] Preferably, the support plate is replaceably attached to the adapter plate by an adhesive layer. By using the adhesive layer, the support plate can be easily and replaceably attached to the adapter plate, and the flatness of the support plate, i.e., the flatness of the stamp surface of the stamp layer, can be easily ensured.

[0036] Preferably, the elements to be transported are a plurality of elements formed on the surface of a substrate, the stamp layer has a plurality of protrusions formed thereon corresponding to the elements, and the elements are detachably attached to each of the protrusions. By configuring in this way, it becomes easy to simultaneously take out a plurality of elements as the elements to be transported from the substrate and transfer or mount them.

[0037] Preferably, the support plate has a glass plate or a ceramic plate having a flat surface. By configuring in this way, it is easy to ensure the flatness of the support plate, i.e., the flatness of the stamp surface of the stamp layer. In particular, by configuring the support plate with a glass plate, it is easy to form an adsorbable surface around the stamp layer.

[0038] Preferably, a tapered surface is formed on the side surface of the adapter plate, the outer diameter of which decreases toward the support plate. The claws of a clamping mechanism (chuck mechanism) can be detachably engaged with the tapered surface formed on the side surface of the adapter plate. Also, the force with which the clamping mechanism attaches the stamp tool to the transport head can be increased. Furthermore, the stamp tool can be easily positioned along the inclined surface of a guide member installed on the upper part of the installation stage for the stamp tool.

[0039] Preferably, the maximum width of the adapter plate is greater than the width of the support plate, which allows the inclined surface of the guide member to easily engage with the tapered surface of the stamp tool.

[0040] Preferably, the support plate has an insertable surface facing the tapered surface of the adapter plate on the surface facing the adapter plate. The insertable surface on the support plate of the stamp tool makes it easier for the claws of the clamping mechanism to detachably engage with the tapered surface on the side of the adapter plate.

[0041] Preferably, the surface of the support plate facing the stamp layer has an adsorbable surface formed around the stamp layer. The presence of the adsorbable surface on the support plate of the stamp tool makes it possible to adsorb the support plate on the installation surface of the installation stage for the stamp tool, making it easier to seal and hold the stamp layer inside the accommodating recess. The stamp layer inside the accommodating recess is kept clean.

[0042] A shim plate for adjusting the parallelism (flatness) of the support plate may be interposed between the stamp layer and the adapter plate. By configuring in this way, the flatness of the support plate is improved, and the flatness of the stamp surface is also improved. [Brief description of the drawings]

[0043] [Figure 1A] FIG. 1A is a schematic front view and an enlarged view of a main part of a stamp tool according to an embodiment of the present invention. [Figure 1B] FIG. 1B is a schematic front view of a stamp tool according to another embodiment of the present invention. [Figure 2A] FIG. 2A is a schematic diagram of a transport device including a transport head that detachably transports the stamp tool shown in FIG. 1A. [Figure 2B] FIG. 2B is a schematic diagram of the transport device showing a state in which the transport head shown in FIG. 2A is gripping the stamp tool. [Figure 3A] FIG. 3A is a schematic diagram of the transfer device showing a state before an element is picked up from a semiconductor substrate. [Figure 3B] FIG. 3B is a schematic diagram of the transfer device illustrating a state in which the stamp layer of the stamp tool is being pressed against an element on a semiconductor substrate from the state shown in FIG. 3A. [Figure 3C] FIG. 3C is a schematic diagram of the transfer device showing a state after the element has been picked up from the semiconductor substrate. [Figure 4A] FIG. 4A is a partial schematic view showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention. [Figure 4B]FIG. 4B is a partial schematic view showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention. [Figure 5A] FIG. 5A is a schematic cross-sectional view of an element formed on a semiconductor substrate. [Figure 5B] FIG. 5B is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transfer device. [Figure 5C1] FIG. 5C1 is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transfer device and then placed on a mounting substrate (sheet). [Figure 5C2] FIG. 5C2 is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transfer device and then placed on a first transfer substrate (sheet). [Figure 5D] FIG. 5D is a schematic cross-sectional view showing a state in which the element array arranged on the first transfer substrate (sheet) has been transferred to the second transfer substrate (sheet). [Figure 5E] FIG. 5E is a schematic cross-sectional view showing the state before the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet). [Figure 5F] FIG. 5F is a schematic cross-sectional view showing the state after the element array arranged on the second transfer substrate (sheet) has been transferred to the mounting substrate (sheet). [Figure 6A] FIG. 6A is a schematic perspective view of a stamp stage on which the stamp tool shown in FIG. 1A is placed. [Figure 6B] FIG. 6B is a plan view of the stamp stage shown in FIG. 6A, showing the positioning members in an open state. [Figure 6C] FIG. 6C is a plan view of the stamp stage shown in FIG. 6A, showing the positioning member in a closed state. [Figure 7] FIG. 7 is a schematic cross-sectional view of the stamp stage taken along line VII-VII shown in FIG. 6A. [Figure 8] FIG. 8 is a side view of the stamp stage shown in FIG. 6A as viewed from the Y-axis direction, to which the transport head shown in FIG. 2A is added. [Figure 9]Figure 9 is a schematic diagram showing the relationship between a stamp table on which the stamp stage shown in Figure 6A is placed, an element table on which the element formation substrate shown in Figure 5A is placed, a mounting table on which the mounting substrate shown in Figure 5C1 is placed, and a transport head. [Figure 10] FIG. 10 is a schematic diagram showing a state in which the relative position between the transport head and the table is changed from the state shown in FIG. [Figure 11] FIG. 11 is a schematic diagram showing a state in which the relative position between the transport head and the table is changed from the state shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0044] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0045] First embodiment 9 to 11, the multi-element transfer device 200 has a transport device 20, a stamp table 100, an element table 102 as a first table, and a mounting table 104 as a second table. As shown in Fig. 2A, the transport device 20 has a transport head 22 that detachably transports the stamp tool 10.

[0046] (Stamp tool) First, a description will be given mainly of the stamp tool 10. As shown in FIG 1A, the stamp tool 10 includes a stamp layer 12, a support plate 14, and an adapter plate 16.

[0047] The stamp layer 12 has a matrix of protrusions 11 protruding downward along the Z axis at predetermined intervals in the X-axis and Y-axis directions. The X-axis width x1 of the protrusions 11 and the X-axis interval x2 between adjacent protrusions 11 are determined according to the X-axis width x3 of an element 32r for emitting red light (an example of an element to be transported) mounted on the surface of a mounting substrate (hereinafter, the substrate may be a sheet) 70 shown in FIG. 5F and the X-axis interval x4 between them.

[0048] 1A, the same applies to the width of the protrusions 11 in the Y-axis direction and the distance in the Y-axis direction between adjacent protrusions 11. The protrusions 11 are arranged in a matrix on the lower surface of the stamp layer 12, and the number of the protrusions 11 arranged is not particularly limited, but may be one to several hundred thousand.

[0049] In this embodiment, in the drawing, the X-axis (first axis), Y-axis (second axis) and Z-axis (third axis) are approximately perpendicular to each other, the X-axis and Y-axis are parallel to the planar direction of the stamp layer 12, and the Z-axis is parallel to the protruding direction of the convex portion 11.

[0050] As shown in Fig. 1A, the protruding height z1 of the convex portion 11 of the stamp layer 12 is determined in relation to the Z-axis height z2 of the element 32r shown in Fig. 5B, and is preferably, for example, 1 to 8 times the Z-axis height z2. The thickness z3 of the stamp layer 12 in the Z-axis direction is not particularly limited, but is preferably about 0.25 times or more the protruding height z1 of the convex portion 11. The width x3 in the X-axis direction of the element 32r (and the width in the Y-axis direction is approximately the same) is, for example, 1 to 150 µm, and the height z2 is, for example, 1 to 150 µm.

[0051] The stamp layer 12 and the protrusion 11 may be made of different materials as long as they are strongly bonded to each other, but may be made of the same material. By being made of the same material, the risk of the protrusion 11 peeling off from the stamp layer 12 is reduced. At least the protrusion 11 is made of a material having adhesive properties, and can adhere the element 32r arranged on the element formation substrate 30 shown in FIG. 5B with a predetermined fixing force F1 with a predetermined adhesive force F2. The material and shape of the protrusion 11 are determined so that when the lower end of the protrusion 11 is pressed against the upper surface of the element 32r with a predetermined force, the adhesive force F2 of the protrusion 11 to the element 32r is greater than the fixing force F1 of the element 32r to the substrate 30.

[0052] The material of the protrusions 11 is not particularly limited, but examples thereof include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organic silicon compounds, and polyether rubber. The stamp layer 12 may be made of the same material as the protrusions 11, but it is preferable that the surface of the stamp layer 12 other than the protrusions 11 does not have adhesiveness. It is preferable that the element 32r is not picked up by adhesive force other than the protrusions 11.

[0053] 1A, the stamp layer 12 is fixed to a support plate 14. The support plate 14 is made of a material having higher rigidity and excellent flatness than the stamp layer 12, and is preferably made of a glass plate, a metal plate, a ceramic plate, etc. The thickness of the support plate 14 is not particularly limited, but is preferably 0.5 mm or more.

[0054] The stamp layer 12 may be formed directly on the surface of the support plate 14, or may be fixed thereto by an adhesive layer. In either case, the stamp layer 12 is fixed to the surface of the support plate 14 with an adhesion force sufficiently higher than the adhesive force F2 shown in Fig. 5B. Since the element 32r is peeled off from the protrusion 11 in a later process and disposed on, for example, a mounting substrate 70 shown in Fig. 5C1, it is important that the stamp layer 12 does not peel off from the support plate 14 at that time.

[0055] As shown in Fig. 1A, the support plate 14 is detachably fixed to the adhesive surface 16b of the adapter plate 16 by an adhesive layer 15 on the surface opposite to the stamp layer 12. The adhesive strength between the support plate 14 and the adapter plate 16 by the adhesive layer 15 is sufficiently higher than the adhesive strength F2 shown in Fig. 5B. However, when replacing the stamp layer 12 after repeated use, the support plate 14 can be removed from the adhesive surface 16b of the adapter plate 16. The adhesive layer 15 may be made of a double-sided adhesive tape or the like.

[0056] The widths of the support plate 14 in the X-axis direction and the Y-axis direction are preferably larger than those of the stamp layer 14, and also larger than the widths of the adhesive surface 16b of the adapter plate 16 in the X-axis direction and the Y-axis direction. A flat adsorbable surface 14b on which the stamp layer 12 is not formed is formed around the stamp layer 12 on the surface of the support plate 14 on the stamp layer side. In this embodiment, the stamp layer 12 is rectangular when viewed from the Z-axis direction, but the support plate 14 may be rectangular or circular. The adsorbable surface 14b can be detachably attached to the installation surface 84 of the installation stage 82 shown in FIG. 7.

[0057] The upper surface of the adapter plate 16 opposite to the adhesive surface 16b is a flat mounting surface 16a, and at least both side surfaces in the X-axis direction of the adapter plate 16 are tapered surfaces 16c so that the area of ​​the mounting surface 16a is larger than the area of ​​the adhesive surface 16b. That is, at least the side surfaces in the X-axis direction of the adapter plate 16 are formed with tapered surfaces 16c whose outer diameter becomes smaller toward the stamp layer 12.

[0058] In this embodiment, the tapered surfaces 16c are also formed on both side surfaces in the Y-axis direction of the adapter plate 16, and the tapered surfaces 16c are formed along the entire circumference of the side surfaces of the adapter plate 16. In this embodiment, the adapter plate 16 has a rectangular shape when viewed from the Z-axis direction, and it is preferable that at least the maximum width of the adapter plate 16 in the X-axis direction is larger than the width of the support plate 14 in the X-axis direction. Note that, as shown in FIG. 7, the maximum width of the adapter plate 16 in the Y-axis direction may be approximately equal to the width of the support plate 14 in the Y-axis direction, or may be larger or smaller than that.

[0059] On the surface opposite to the suction surface 14b of the support plate 14 shown in Fig. 1A, a flat insertable surface 14c facing the tapered surface 16c is formed around the adhesive surface 16b of the adapter plate 16. On the insertable surfaces 14c located on both sides in the X-axis direction, the tapered surfaces 16c of the adapter plate 16 are engaged with the claws 26a of the chuck mechanism (also called a clamp mechanism / first axis positioning mechanism) 26 shown in Fig. 2B. Also, the tapered surfaces 16c of the adapter plate 16 located on both sides in the X-axis direction are engaged with the inclined surfaces 89 of the guide members 88 of the installation stage 82 shown in Figs. 6A and 8.

[0060] 1A is sufficiently larger than the thickness of the support plate 14, and is preferably 1.2 times or more, and more preferably about 2 to 6 times, the thickness of the support plate 14. The adapter plate 16 has a mounting surface 16a on its upper surface, on its outer periphery, formed with a chamfered or rounded edge 16d.

[0061] 6A to 6C and 7 come into contact with edge portions 16d of the adapter plate 16 located on both sides in the Y-axis direction, thereby positioning the stamp tool 10 placed on the installation stage 82 in the Y-axis direction. The stamp tool 10 is roughly positioned in the X-axis direction by an inclined surface 89 of a guide member 88 shown in Fig. 6A and Fig. 8, and highly accurately positioned by a claw portion 26b of a clamp mechanism 26 of the transport device 20 shown in Fig. 2B and Fig. 8.

[0062] (Transportation device) Next, the conveying device will be mainly described. The attachment surface 16a on the upper surface of the adapter plate 16 shown in Fig. 1A is capable of adsorbing the suction surface 24 of the conveying head 22 of the conveying device 20 shown in Fig. 2A. The suction surface 24 of the conveying head 22 is formed with vacuum suction holes as a main attachment means, and the attachment surface 16a of the adapter plate 16 of the stamp tool 10 is vacuum-adsorbed to the suction surface 24 by generating negative pressure in the vacuum suction holes. The vacuum adsorption force of the suction surface 24 to the attachment surface 16a of the adapter plate 16 of the stamp tool 10 is tentatively defined as a main attachment force F3a.

[0063] In this embodiment, the chuck mechanism 26 is attached to the transport head 22 via an opening / closing mechanism 28. Claw portions 26a are formed on the inside of the chuck mechanism 26. The chuck mechanism 26 including the claw portions 26a is moved in the X-axis direction by the opening / closing mechanism 28, for example, so that the claw portions 26a open the entire lower surface of the suction surface 24 as shown in Fig. 2A, or the claw portions 26a are positioned below both sides of the suction surface 24 in the X-axis direction as shown in Fig. 2B.

[0064] Each claw portion 26a is formed with a tapered engagement surface 26b. The tapered surface of the engagement surface 26b is shaped to match the tapered surface 16c of the adapter plate 16 of the stamp tool 10, and is capable of engaging with the tapered surface 16c. As shown in FIGS. 2A and 2B, before the mounting surface 16a of the adapter plate 16 is attracted to the suction surface 24 of the transport head 22, the claw portion 26a of the chuck mechanism 26 is opened by the opening / closing mechanism 28. After the mounting surface 16a of the adapter plate 26 is attracted to the suction surface 24 of the transport head 22, the chuck mechanism 26 moves in a direction in which the claw portion 26a is closed by the opening / closing mechanism 28, and the engagement surface 26b engages with the tapered surface 16c.

[0065] As a result, the stamp tool 10 is attached to the transport head 22 by a total attachment force F3 consisting of a main attachment force F3a by the vacuum suction holes formed in the transport head 22 as the main attachment means and a secondary attachment force F3b by the chuck mechanism 26 as the secondary attachment means. As the transport head 22 becomes smaller, it tends to be difficult to make the main attachment force F3 by the vacuum suction holes of the transport head 22 alone larger than the fixing force F1 shown in Fig. 5B. In this embodiment, the secondary attachment force F3b by the chuck mechanism 26 as the secondary attachment means is added to the main attachment force F3a, so that the total attachment force F3 (=F3a+F3b) is reliably larger than the fixing force F1.

[0066] Furthermore, the stamp tool 10 is attached to the transport head 22 by the chuck mechanism 26, whereby the stamp tool 10 (specifically, the convex portion of the stamp layer 12) is positioned relative to the transport head 22 along the X-axis.

[0067] (Display element array manufacturing method and device used for manufacturing the same) Next, a method for manufacturing a display element array according to this embodiment, a mounting stage which is a part of the stamp tool positioning device, and other devices will be described.

[0068] First, the conveying device 20 shown in Fig. 2A picks up the stamp tool 10 arranged on the installation stage 82 shown in Fig. 6A to Fig. 8. In this embodiment, it is preferable to prepare at least three stamp tools, for example, for R, G, and B, which are the three primary colors of light, and each stamp tool is preferably installed on its respective installation stage 82. Alternatively, the installation stage 82 is replaced with respect to the base 81 for each of the stamp tools 10 for R, G, and B.

[0069] The base 81 of the installation stage 82 is positioned and fixed on the stamping table 100 shown in Figures 9 to 11. The stamping table 100 is positioned and fixed, for example, on the integrated table 110. In the example shown in Figures 9 to 11, only a single stamping table is shown to be installed on the integrated table 110.

[0070] However, on the integrated table 110, for example, three stamp tables 100 to which bases 81 for three mounting stages 82 are respectively fixed, one for each stamp tool 10 for R, G and B, may be arranged side by side at a predetermined interval in the Y-axis direction.

[0071] In addition to the three stamp tables 100, three large stamp tables to which bases for three installation stages are fixed may be arranged side by side at predetermined intervals in the Y-axis direction, for each stamp tool of different sizes for R, G, and B. These three large stamp tables of different sizes are arranged outside the three stamp tables 100 of smaller sizes in the X-axis direction.

[0072] 9 to 11, in addition to the stamping table 100, an element table 102 and a mounting table 104 are positioned and fixed on the integrated table 110. The element table 102 is a table on which the element formation substrate 30 shown in FIG. 5A is positioned and detachably fixed.

[0073] 9 to 11, only a single element table 102 is shown to be installed. However, on the integrated table 110, for example, three element tables 102 on which three element formation substrates 30 are positioned and detachably fixed for each of the elements 32r, 32g, and 32b for R, G, and B may be arranged side by side at a predetermined interval in the Y-axis direction. Alternatively, in this embodiment, three element formation substrate element arrangement substrates 30 may be positioned and detachably fixed on a single element table 102. The element table 102 and the stamp table 100 are arranged apart from each other in the X-axis direction on the integrated table 110.

[0074] The mounting table 104 is a table on which the mounting board 70 shown in Fig. 5C1 is positioned and detachably fixed. The mounting board 70 is disposed on the integrated table 110, separated from the element table 102 in the Y-axis direction. In this embodiment, a single mounting board 70 is positioned and fixed to the integrated table 110. Alternatively, a plurality of mounting boards 70 may be positioned and fixed to the integrated table 110.

[0075] The upper surfaces of the tables 100, 102, and 104, which are positioned and fixed on the integrated table 110, are preferably substantially on the same XY plane, but are not necessarily on the same plane. By making the upper surfaces of the tables 100, 102, and 104 substantially on the same XY plane, the movement amount along the Z axis of the transport head 22 that moves relatively above the tables 100, 102, and 104 can be made substantially the same, and the movement control along the Z axis of the transport head 22 can be easily performed. Above the Z axis of the tables 100, 102, and 104, which are positioned and fixed on the integrated table 110, the transport head 22 of the transport device 20 can be moved in the X-axis and Y-axis directions and arranged. The integrated table 110 is configured to be relatively movable with respect to the transport head 22 along the XY plane including the X-axis and Y-axis.

[0076] In order to improve positioning accuracy, it is preferable that the transport head 22 moves only in the Z-axis direction relative to each of the tables 100, 102, and 104, and each of the tables 100, 102, and 104 moves along the XY plane relative to the transport head 22. Alternatively, the transport head may move only in the X-axis or Y-axis and Z-axis directions, and each of the tables 100, 102, and 104 may move along the Y-axis or X-axis relative to the transport head 22. Alternatively, the transport head may move in the X-axis, Y-axis, and Z-axis directions, and each of the tables 100, 102, and 104 may be fixed and not move.

[0077] 9 to 11 is illustrated as a single member, but may be composed of multiple members. The element table 102 and the mounting table 104 may be positioned and fixed to the same base and move in the same direction (for example, the Y-axis direction) in common. Furthermore, the integrated table 110 may be separated so that the stamp table 100 (including stamp tables of different sizes) moves in the Y-axis direction, for example, separately from the tables 102 and 104. In that case, it is preferable that the transport head 22 is movable in the X-axis direction as well as the Z-axis direction.

[0078] In the following description, one installation stage 82 shown in Figs. 6A to 8 will be described, but the same applies to the other installation stages. As shown in Figs. 6A and 7, the block-shaped installation stage 82 is installed on a base 81 so as to be freely attached, detached, and replaceable, for example, using bolts. As shown in Fig. 7, an accommodating recess 86 and an installation surface 84 are formed in the upper part of the installation stage 82 in the Z-axis direction so as to surround the accommodating recess 86. The accommodating recess 86 is formed, for example, by countersinking the center part of the upper surface of the stage 82 in the shape of a rectangular prism. As shown in Fig. 7, the stamp layer 12 of the stamp tool 10 is configured to completely fit into the accommodating recess 86.

[0079] In addition, the installation surface 84 formed around the accommodation recess 86 has suction holes 85 formed at multiple locations in the circumferential direction, so that the adsorbable surface 14b of the support plate 14 can be adsorbed and held on the installation surface 84 in a freely detachable manner. In addition, the accommodation recess 86 is connected to multiple gas circulation holes 83 formed in the stage 82. By adsorbing the adsorbable surface 14b of the support plate 14 to the installation surface 84, the accommodation recess 86 can be sealed except for the gas circulation holes 83. By flowing clean gas into the accommodation space 86 through the gas circulation holes 83, dust and impurities adhering to the stamp layer 12 can be discharged to the outside.

[0080] Two guide members 88 are detachably attached to the upper side of both sides of the stage 82 that are approximately perpendicular to the X-axis by bolts or the like. An inclined surface 89 is formed on the upper side of the inner surface of the guide member 88. The tapered surface 16c of the adapter plate 16 shown in FIG. 1A can contact each of the inclined surfaces 89, and the tapered surface 16c of the adapter plate 16 facing the X-axis direction slides along each inclined surface 89. Therefore, the adapter plate 16 of the stamp tool 10 is dropped onto the stage 82 while sliding on the inclined surface 89, and the stamp layer 12 is accommodated inside the accommodation recess 86 as shown in FIG. 7. Furthermore, the stamp tool 10 is roughly aligned with the stage 82 in the X-axis direction.

[0081] As shown in Fig. 6A, the four guide members 88 are attached to the stage 82 so as to be located inside both edge portions 16d in the Y-axis direction of the adapter plate 16 of the stamp tool 10. On both sides of the stage 82 in the Y-axis direction, Y-axis positioning members (second axis positioning mechanisms) 90 are respectively arranged so as to be movable in the Y-axis direction. The positioning members 90 each have a tip surface 92, which face each other along the Y-axis and can abut against the edge portions 16d in the Y-axis direction of the adapter plate 16 as shown in Fig. 7. The tip surfaces 92 abut against the edge portions 16d in the Y-axis direction of the adapter plate 16, whereby the stamp tool 10 is positioned in the Y-axis direction relative to the stage 82.

[0082] Next, a method of picking up the stamp tool 10 from the installation stage 82 shown in FIGS. 6A and 7 using the transfer device 20 shown in FIG. 2A will be described.

[0083] First, the stamp tool 10 is positioned in the Y-axis direction on the stage 82 using the positioning member 90. After that, as shown in Fig. 9, the positional relationship between the stamp table 100 and the transport head 22 in the XY axes is changed, and the stage 82 shown in Fig. 8 moves together with the base 81 to position the stage 82 below the transport head 22 of the transport device 20 shown in Fig. 2A. The transport head 22 may be moved without moving the stage 82, or both may be moved. The transport head 22 may be rotated around the Z-axis as necessary.

[0084] After the stamp tool 10 on the stage 82 is positioned below the Z axis of the transport head 22, the head 22 is moved downward along the Z axis, the lower end of the transport head 22 is brought into contact with the mounting surface 16a of the adapter plate 16, and vacuum suction by the transport head 22 is started. Next, as shown in Figs. 2A and 2B, the clamp mechanism 26 is closed, and the engagement surfaces 26b of the claws 26a are engaged with the tapered surfaces 16c located on both sides of the adapter plate 16 in the X axis direction to perform positioning in the X axis direction. In addition, the engagement surfaces 26b of the claws 26a may be provided with stopper surfaces as necessary, and the stopper surfaces may be brought into contact with the edge portions 16d of the adapter plate 16 in the X axis direction to perform positioning in the X axis direction of the stamp tool 10.

[0085] 7 is opened in the Y-axis direction, and the contact between the tip surfaces 92 and the edge portion 16d of the adapter plate 16 is released. Before and after this, the suction holes 85 of the stage 82 release the support plate 14 from the stage installation surface 84. Thereafter, by moving the transport head 22 upward on the Z-axis, the stamp tool 10 is positioned on the lower end of the transport head 22 in the X-axis and Y-axis as shown in FIG. 2B, and the stamp tool 10 is held in a state in which its horizontality is maintained.

[0086] Next, as shown in FIG. 2B, with the stamp tool 10 attached to the transport head 22, the transport device 20 is moved relatively in the X-axis and Y-axis directions to be positioned above the element table 102 as shown in FIG. 10. As shown in FIG. 10, the multi-element transfer device 200 has an imaging device 122 as an imaging means capable of imaging simultaneously in two directions and capable of entering the space between the surface of the element formation substrate 30 (see FIG. 3A) placed on the element table 102 and the stamp layer 12 of the stamp tool 10 held by the transport head 22. The imaging device 122 can be moved to retract from under the transport head 22. In addition, a similar imaging device 122 may be inserted between the transport head 22 and the mounting table 104 when the transport head 22 moves above the mounting table 104.

[0087] As shown in Fig. 3A, the imaging device 122 can simultaneously capture images of the convex portions 11 (see Fig. 2B) on the stamp surface of the stamp layer 12 and the surface of the element formation substrate 30. As shown in Fig. 10, the imaging device 122 is communicatively connected to a control device 120 serving as a control means. The control device 120 receives a detection signal from the imaging device 122 and controls a fine adjustment mechanism (not shown) that changes the relative position between the transport head 22 and the element formation substrate 30.

[0088] The fine adjustment mechanism may include a mechanism for finely adjusting and moving the relative position of the transport head 22 with respect to the substrate 30 along the X-axis and Y-axis, and a mechanism for finely adjusting and moving the relative angle of the transport head 22 itself with respect to the substrate 30 around the Z-axis. The mechanism for finely adjusting and moving the relative position of the transport head 22 with respect to the substrate 30 along the X-axis and Y-axis may be included in a main drive device that changes the relative position of the transport head 22 with respect to the element table 102 (mounting table 104 or stamp table) along the X-axis and Y-axis. The main drive device and the fine adjustment mechanism are controlled by the control device 120. The control device 120 also controls the movement of the transport device 20 including the transport head 22 shown in FIG. 8 in the Z-axis direction, the drive of the chuck mechanism 26, the drive of the positioning member 90 shown in FIG. 6A, and the like.

[0089] As shown in Fig. 3A, an element formation substrate 30 is positioned and placed on an element table 102 shown in Fig. 10. For example, red light emitting elements 32r, green light emitting elements 32g, or blue light emitting elements 32b are fabricated on the surface of the element formation substrate 30 as shown in Fig. 5A. The substrate 30 may be a sapphire substrate, a glass substrate, a GaAs substrate, a SiC substrate, or the like, depending on the type of element (blue light emitting element, red light emitting element, green light emitting element, etc.).

[0090] In this embodiment, the elements 32r, 32g, and 32b are, for example, micro LED elements. In the following description, only the element 32r will be described, but the other elements 32g and 32b are similarly processed using different stamp tools 10. It is preferable to prepare a stamp tool 10 for each of the different types of elements 32r, 32g, and 32b, but the transport head 22 can be used in common.

[0091] The stamp tool 10 in the standby state is placed on the stage 82 shown in Fig. 6A and Fig. 7, for example, and the stamp layer 12 is sealed inside the receiving recess 86 and kept in a clean state. The stamp tool 10 in the standby state that is not held by the transport head 22 may be placed on the stamp table 100 shown in Fig. 9, for example, or may be placed on a separate stamp table that is adjacent to the table 100 shown in Fig. 9 along the Y axis.

[0092] The imaging device 122 shown in Fig. 3A simultaneously captures images of the convex parts 11 (see Fig. 2B) on the stamp surface of the stamp layer 12 and the surface of the element formation substrate 30, and the detection signal is received by the control device 120 shown in Fig. 10, which uses a fine adjustment mechanism to change the relative position of the transport head 22 shown in Fig. 3A and the element formation substrate 30. As a result, the arrangement of the convex parts 11 on the stamp surface of the stamp layer 12 is accurately aligned with the arrangement of the elements 32r formed on the surface of the substrate 30. As a result, it becomes possible to hold a large number of small-sized elements 32r on the stamp surface of the stamp layer 12 with high precision.

[0093] Thereafter, as shown in FIG. 3A to FIG. 3B, the imaging device 122 is moved from the position below the transport head 22 and retracted, and then the transport device 20 is moved downward in the Z-axis direction, and the protrusions 11 of the stamp tool 10 are pressed against the upper surface of the element 32r of the substrate 30. As a result, the element 32r adheres to the protrusions 11. Thereafter, as shown in FIG. 3C, the stamp tool 10 is lifted upward in the Z-axis direction together with the transport device 20. As a result, as shown in FIG. 5B, the element 32r adheres to each protrusion 11, and the element 32r is picked up from the substrate 30 together with the protrusions 11. The element 32r left on the substrate 30 is picked up by the stamp layer 10 of the transport device 20 in the same manner later.

[0094] Next, the element 32r picked up by the convex portion 11 of the stamp layer 10 is transported by the transport device 20 to be mounted on a mounting substrate (the substrate may be a sheet; the same applies below) 70 shown in Fig. 5C1, for example. The mounting substrate 70 shown in Fig. 5C1 is positioned and placed on a mounting table 104 shown in Fig. 10. Therefore, as shown in Figs. 10 and 11, the control device 120 drives the main drive device to move the element table 102 and the mounting table 104 relative to the transport head 22 in the Y-axis direction, and the transport head 22 is positioned above the mounting table.

[0095] Thereafter, the array of elements 32r adhered to the convex portion 11 of the stamp layer 12 shown in FIG. 5B is transferred onto the mounting substrate 70 shown in FIG. 5C1. To this end, the elements 32r adhered to the convex portion 11 of the stamp layer 12 are pressed against the surface of the mounting substrate 70, and then the stamp layer 12 is lifted together with the conveying device 20. As a result, a plurality of elements 32r are simultaneously transferred onto the surface of the mounting substrate 70. By repeating the above operation according to the size of the mounting substrate 70, a large number of elements 32r are arranged in a matrix on the mounting substrate 70. After use, the stamp tool 10 is returned by the conveying head 22 to the stage 82 of the original stamp tool holding device 80 installed on the stamp table 100.

[0096] 5C1, the other elements 32g, 32b are also transferred to the substrate 70 in the same manner as described above, using a different stamp tool 10 for each type of element 32g, 32b. Three elements 32r, 32g, 32b of R, G, and B make up one pixel unit, and these pixel units are arranged in a matrix to form a color display screen.

[0097] It is preferable that an anisotropic conductive paste (ACP) is applied to the surface of the mounting substrate 70. Alternatively, it is preferable that an anisotropic conductive film (ACF) is arranged on the surface of the mounting substrate 70. As shown in FIG. 5C1, after the elements 32r, 32g, and 32b are arranged on the substrate 70 via the ACP or ACF, each of the elements 32r, 32g, and 32b is pressed toward the substrate 70 and heated using a heating and pressurizing device (not shown). As a result, the terminals of each of the elements 32r, 32g, and 32b can be connected to the circuit pattern of the mounting substrate.

[0098] In the transport device 20 according to this embodiment, the mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 shown in Fig. 2B is greater than the fixing force F1 shown in Fig. 5B, and the adhesive force F2 of the protrusions 11 of the stamp layer 12 to the element 32r is greater than the fixing force F1. Therefore, the stamp tool 10 can easily pick up and transport the element 32r arranged on the surface of the substrate 30 from the substrate 30 without being left on the substrate 30 side.

[0099] In this embodiment, the mounting force F3 applied by the transport head 22 to the mounting surface 16a of the adapter plate 16 shown in Fig. 2B is the sum of the main mounting force F3a corresponding to the suction force of the vacuum suction holes and the secondary mounting force F3b applied by the clamp mechanism 26 as the secondary mounting means. That is, in this embodiment, simply by providing the clamp mechanism 26 to a general transport head 22 having vacuum suction holes, it becomes easy to make the mounting force F3 applied by the transport head 22 to the mounting surface 16a of the adapter plate 16 larger than the fixing force F1 of the element 32r to the substrate 30 shown in Fig. 5B.

[0100] Furthermore, in this embodiment, tapered surfaces 16c are formed on both side surfaces of the adapter plate 16 in the X-axis direction, with the outer diameter decreasing toward the stamp layer 12. The claws 26a of the clamping mechanism 26 can be engaged with the tapered surfaces 16c. This configuration makes it easier for the claws 26a of the clamping mechanism 26 to detachably engage with the tapered surfaces 16c on the side surfaces of the adapter plate 16. In addition, the mounting force F3 of the stamp tool 10 to the transport head 22 by the clamping mechanism 26 can be increased. In addition, the claws 26a of the clamping mechanism 26 detachably engage with the tapered surfaces 16c on the side surfaces of the adapter plate 16, so that the stamp tool 10 can be positioned in the X-axis direction relative to the transport head 22 at the same time.

[0101] In addition, tapered surfaces 16c whose outer diameter decreases toward the stamp layer 12 are formed on both side surfaces in the X-axis direction of the adapter plate 16, which facilitates rough positioning of the stamp tool 10 in the X-axis direction along the inclined surface 89 of the guide member 88 installed on the upper part of the stage 82 shown in Fig. 6A. In particular, as shown in Fig. 1A, the maximum width of the adapter plate 16 in the X-axis direction is larger than the width of the support plate 14, which facilitates engagement between the inclined surface 89 of the guide member 88 and the tapered surface 16c of the stamp tool 10.

[0102] Furthermore, the presence of the insertable surface 14c on the support plate 14 of the stamp tool 10 allows the claws 26a of the clamp mechanism 26 to easily detachably engage with the tapered surface 16c on the side surface of the adapter plate 16. Furthermore, the presence of the suction surface 14b on the support plate 14 of the stamp tool 10 allows the support plate 14 to be suctioned on the installation surface 84 of the stage 82 as shown in Fig. 7, making it easier to seal and hold the stamp layer 12 inside the accommodation recess 86. The suction surface 14b can be easily formed around the stamp layer 12 by forming the support plate 14 from a glass plate or the like.

[0103] The stamp tool 10 further includes a support plate 14 to which the stamp layer 12 is fixed and to which an adapter plate 16 is replaceably attached. With this configuration, it is possible to replace only the support plate 14 to which the stamp layer 12 is fixed from the adapter plate 16 without replacing the entire stamp tool 10. This makes it easy to prepare stamp tools 10 having different types of stamp layers 12 at low cost. In addition, by sharing the adapter plate 16, it is not necessary to use different types of transport heads according to the stamp tools, and the overall configuration of the transport device can be simplified.

[0104] In this embodiment, a plurality of protrusions 11 corresponding to the elements 32r (32g, 32b) are formed on the stamp layer 12, and the elements 32r (32g, 32b) are detachably attached to each protrusion 11. With this configuration, a large number of elements 32r (32g, 32b) can be simultaneously extracted from the substrate 30. With the method for manufacturing an element array of this embodiment, an element array having a large number of elements 32r (32g, 32b) can be easily manufactured.

[0105] In this embodiment, as shown in Fig. 6A, the installation stage 82 is replaceably attached to the base 81. Therefore, a stage 82 corresponding to the stamp tool 10 may be prepared in advance, and when replacing with a different type of stamp tool 10, only the stage 82 may be replaced. Since the flatness of the stage 82 is ensured with respect to the base 81, it is not necessary to adjust the flatness of the stamp tool when replacing the stamp tool 10.

[0106] Therefore, in this embodiment, the transport head 22 can successfully pick up the stamp tool 10 from the installation stage 82 without causing suction errors by the transport head 22 or gripping errors by the clamp mechanism 26 .

[0107] 7, in the stamp tool holding device 80 according to this embodiment, the adapter plate 14 of the stamp tool 10 is detachably adsorbed to the installation surface 84 by introducing negative pressure into the suction hole 85 while the stamp layer 12 is accommodated inside the accommodation recess 86. As a result, the inside of the accommodation recess 86 is sealed, and dirt, dust, etc. are less likely to adhere to the stamp surface (convex portion 11) of the stamp layer 12 accommodated inside the accommodation recess 86, making it possible to install the stamp tool 10 while keeping the stamp surface clean.

[0108] In this embodiment, the setting stage 82 is detachably fixed to the base 81. The stamp tool 10 needs to be replaced in response to a customer's request or the substrate 30 on which an element as an element to be transported is fabricated. By preparing a plurality of setting stages 82 in accordance with changes in the stamp tool 10, it is possible to respond to changes in the size of the stamp tool 10 by replacing only the setting stages 82 without replacing the base 81. Furthermore, the flatness of each setting stage 82 relative to the base 81 is ensured, and therefore there is no need to adjust the flatness when replacing the stamp tool 10.

[0109] Furthermore, in this embodiment, the setting stage 82 is formed with a gas circulation hole 83 that communicates with the space in the accommodating recess 86 and replaces the gas in the accommodating recess 86. By replacing the gas in the recess 86, dirt and dust adhering to the surface of the stamp layer 12 accommodated inside the accommodating recess 86 can be discharged together with the gas, and the cleanliness of the stamp layer 12 is improved.

[0110] 6A, in this embodiment, a guide member 88 is attached to the upper portion of the installation stage 82, which guides the stamp layer 12 of the stamp tool 10 at least along the X-axis so that the stamp layer 12 is dropped into the accommodating recess 86. By providing the guide member 88 on the installation stage 82, it becomes easy to roughly position the stamp tool 10 at least along the X-axis. In addition, when the stamp tool 10 is picked up by the transport head 22, it becomes easy to position the stamp tool 10 relative to the transport head 22.

[0111] In this embodiment, the guide members 88 are detachably attached to both sides of the installation stage 82 along the X-axis, and each guide member 88 has an inclined surface 89 that can engage with the tapered surface 16c of the stamp tool 10. This configuration makes it easier to roughly position the stamp tool 10 at least along the X-axis. In addition, when the stamp tool 10 is picked up by the transport head 22, it also becomes easier to position the stamp tool 10 relative to the transport head 22.

[0112] In this embodiment, at least two guide members 88 are attached to each side of the installation stage 82 along the X-axis, and the claws 26a of the chuck mechanism 26 shown in FIG. 2A can be inserted along the gap between the two guide members 88. This configuration makes it possible to position the stamp tool 10 with high accuracy at least along the X-axis. Furthermore, when the stamp tool 10 is picked up by the transport head 22, the positioning of the stamp tool 10 relative to the transport head 22 (particularly along the X-axis) can be made even more accurate.

[0113] 6A to 6C, a pair of positioning members 90 that can move to come into contact with and separate from the edge 16d of the stamp tool 10 placed on the upper part of the setting stage 82 are arranged on both sides of the setting stage 82 along the Y axis direction. This configuration makes it possible to perform high-precision positioning of the stamp tool 10 along the Y axis in addition to the X axis. Furthermore, when the stamp tool 10 is picked up by the transport head 22, it becomes even easier to position the stamp tool 10 relative to the transport head 22.

[0114] The stamp tool positioning device of this embodiment includes a mounting stage 82 shown in FIG. 7, a transport head 22 shown in FIG. 8, a clamp mechanism 26 as a first axis positioning mechanism, and a positioning member 90 as a second axis positioning mechanism. That is, in this embodiment, the positioning of the stamp tool 10 along the Y axis is performed using the positioning member 90 with the mounting stage 82 as a reference as shown in FIG. 7, and the positioning of the stamp tool along the X axis is performed using the clamp mechanism 26 with the transport head 22 as a reference as shown in FIG. 2B. Therefore, the positioning mechanism for the transport head 22 is simplified, and the transport head can be made lighter. As a result, the drive control of the transport head 22 is facilitated, and the transport position accuracy by the transport head 22 is improved.

[0115] In the stamp tool positioning device of this embodiment, the stamp tool 10 is positioned along the Y axis relative to the installation stage 82, but accurate positioning of the stamp tool 10 along the X axis is not required. This simplifies the positioning mechanism in the installation stage 82 and minimizes the required space for the installation stage 82. This also facilitates movement control of the installation stage 82. Furthermore, the alignment between the installation stage 82 and the transport head 22 only needs to be performed with high accuracy along the Y axis, for example, and the alignment along the X axis can be performed roughly. This is because the stamp tool 10 is aligned along the X axis by the clamp mechanism 26 with the transport head 22 as a reference.

[0116] In this embodiment, the clamp mechanism 26 also serves as a mounting means for detachably mounting the stamp tool 10 to the transport head 22. The clamp mechanism 26 as a mounting means also serves as a positioning mechanism, so that it is not necessary to provide the transport head 22 with a separate positioning mechanism as a part other than the mounting means.

[0117] In the multi-element transfer device 200 according to this embodiment shown in Fig. 10, the stamp tool 10 is attached to the stage 82 of the stamping table 100 so that the attachment surface 16 faces upward along the Z axis, as shown in Fig. 8. Also, as shown in Fig. 10, the element table 102 and the mounting table 104 are relatively movable with respect to the transport head 22 at least along the Y axis, and the stamping table 100 is relatively movable with respect to the transport head 22 at least along the X axis.

[0118] Therefore, the transport head 22 can move relatively above the stamp table 100, the element table 102, and the mounting table 104. In addition, it is possible to simultaneously transfer a large number of elements 32r (32g, 32b) from the surface of the element formation substrate 30 of the element table 102 to the surface of the mounting substrate 70 of the mounting table 104 using the stamp tool 10 held by the transport head 22. In addition, after transferring the elements 32r from the element formation substrate 32r to the mounting substrate 70, the stamp tool 10 is returned to the original installation stage 82 of the stamp table 100 using the transport head 22. In this way, in the multi-element transfer device 200 of this embodiment, a large number of elements 32r (32g, 32b) can be efficiently transferred using the stamp tool 10.

[0119] Furthermore, when multiple types of elements 32r, 32g, and 32b are transferred from the corresponding multiple element formation substrates 30 to a single mounting substrate 70, each of the elements 32r, 32g, and 32b can be transferred using a different stamp tool 10 for each type. This makes it easy to transfer different types of elements 32r, 32g, and 32b to a single mounting substrate 70 in a set arrangement, and makes it easy to efficiently manufacture an element array with few pixel defects, for example.

[0120] The method for manufacturing an element array according to the present embodiment includes the steps of: transporting the stamp tool 10 positioned by the stamp tool positioning device using a transport head 22; and using the stamp tool 10 attached to the transport head 22, simultaneously picking up and transporting a plurality of elements 32r (32g, 32b) as transport target elements from the substrate 30.

[0121] According to the method for manufacturing an element array of this embodiment, an element array having a large number of elements that are positioned and arranged with high precision can be manufactured easily, in a short time, and at low cost.

[0122] A method for manufacturing an element array according to another embodiment includes the steps of: preparing stamp tool holding devices 80 in a number equal to or greater than the number of substrates 30 on which a plurality of types of elements as elements to be transported are arranged; A step of placing stamp tools 10 prepared for each of the plurality of types of elements in each stamp tool holding device 80; a step of picking up the stamp tools 10 held by the stamp tool holding devices 80 corresponding to the respective substrates 30 with the transport head 22 from the stamp tool holding devices 80, and simultaneously removing and transporting a plurality of elements 32r (or 32g, 32b) from the substrates 30 corresponding to the picked-up stamp tools 10 using the stamp tool 10 attached to the transport head 22; The method includes a step of simultaneously removing and transporting the multiple elements 32r (or 32g, 32b), and then returning the stamp tool 10 from which the multiple elements 32r (or 32g, 32b) have been removed to the corresponding empty stamp tool holding device 80.

[0123] In the manufacturing method of the element array according to the present embodiment, an element array in which many types of elements 32r, 32g, and 32b are arranged can be manufactured easily, in a short time, and at low cost. Moreover, the stamp tools 10 used for the substrates 30 corresponding to the various types of elements 32r, 32g, and 32b are installed and stored in a dedicated stamp tool holding device 80, so that it is easy to maintain high cleanliness of the stamp surface of each stamp tool 10 while effectively preventing misalignment of the elements 32r, 32g, and 32b.

[0124] Second embodiment 1B, in the stamp tool 10a used in the transport device of this embodiment, a shim plate 18 for adjusting the parallelism of the support plate 14 is interposed between the stamp layer 12 and the adapter plate 16. An inclined surface 14a is formed on a part of the side surface of the support plate, and the shim plate 18 engages with the inclined surface 14a, making it possible to adjust the parallelism of the support plate 14.

[0125] Other configurations and effects of the transport device and stamp tool of this embodiment are similar to those of the first embodiment, and detailed description thereof will be omitted.

[0126] Third embodiment As shown in FIG. 4A, in the conveying device of this embodiment, an elastically deformable engagement protrusion 26c is attached to the engagement surface 26b of the claw portion 26a of the chuck mechanism 26, and the engagement protrusion 26c is capable of engaging with the tapered surface 16c of the adapter plate 16. The engagement protrusion 26c may be made of, for example, a spring material and may protrude in an arc shape from the engagement surface 26b. Also, as shown in FIG. 4B, the engagement surface 26b does not necessarily have to be a flat surface, and may be a convex curved surface capable of engaging with the tapered surface 16c of the adapter plate 16. The other configurations and effects of the conveying device and stamp tool of this embodiment are similar to those of the first or second embodiment, and detailed description thereof will be omitted.

[0127] Fourth embodiment In this embodiment, a method for mounting an element by a transfer method using the apparatus according to the first to third embodiments will be described. In the following description, the description of the parts that overlap with the first to third embodiments will be omitted.

[0128] In the method of this embodiment, as shown in Figure 5B, the element 32r picked up by the convex portion 11 of the stamp layer 10 is transported by a transport device 20, for example, onto a first transfer substrate (second substrate) 50 shown in Figure 5C2, and placed on an adhesive layer 52.

[0129] The array of elements 32r adhered to the convex parts 11 of the stamp layer 12 shown in FIG. 5B is transferred onto the adhesive layer 52 of the substrate 50, which is made of an adhesive sheet or the like, shown in FIG. 5C2. To this end, the elements 32r adhered to the convex parts 11 of the stamp layer 12 are pressed against the surface of the adhesive layer 52, and then the stamp layer 12 is lifted together with the conveying device 20. As a result, a plurality of elements 32r are simultaneously transferred onto the surface of the adhesive layer 52. Note that, prior to this, the conveying device 20 shown in FIG. 3C is moved above the substrate 50 shown in FIG. 5C2 by the conveying mechanism of the conveying device 20.

[0130] The adhesive strength of the adhesive layer 52 of the adhesive sheet made of the substrate 50 is adjusted so as to be greater than that of the protrusions 11. The adhesive layer 52 is made of an adhesive resin such as natural rubber, synthetic rubber, acrylic resin, or silicone rubber, and the thickness z4 is preferably about 0.5 to 2.0 times the height z2 (see FIG. 5B) of the element 32r. Note that, in order to facilitate the movement of the element 32r from the protrusions 11 to the adhesive layer 52, an operation (such as applying heat) may be performed to facilitate the peeling of the element 32r from the protrusions 11.

[0131] In the same manner as above, the other elements 32g, 32b are also transferred to the adhesive layer 52 of the substrate 50. Three elements 32r, 32g, 32b of R, G and B constitute one pixel unit, and these pixel units are arranged in a matrix to form a color display screen.

[0132] Next, as shown in Fig. 5D, the arrangement of the three elements 32r, 32g, and 32b arranged on the surface of the first transfer substrate 50 is transferred to the adhesive layer 62 of the second transfer substrate 60, and the terminals of the elements 32r, 32g, and 32b are arranged so as to face the outside of the substrate 60. For this transfer, a method such as a laser lift method, a transfer using a difference in adhesive strength, or a transfer involving heat peeling may be used. With the terminals of the elements 32r, 32g, and 32b facing the outside of the substrate 60, a tin plating film may be formed on each terminal by electroless plating or the like.

[0133] 5E and 5F, the entire arrangement of the three elements 32r, 32g, and 32b is transferred from the adhesive layer 62 of the substrate 60 to the mounting substrate 70. For this transfer, a method such as a laser lift method may be used, or a method such as a transfer using a difference in adhesive strength or a transfer involving heat peeling may be used.

[0134] After the transfer, in order to connect the terminals of the elements 32r, 32g, and 32b to the circuit pattern of the mounting substrate, it is preferable to apply anisotropic conductive paste (ACP) or place anisotropic conductive film on the surface of the mounting substrate 70. As shown in FIG. 5F, after the elements 32r, 32g, and 32b are placed on the substrate 70 via ACP or ACF, the elements 32r, 32g, and 32b are pressed toward the substrate 70 and heated using a heating and pressurizing device (not shown). As a result, the terminals of the elements 32r, 32g, and 32b can be connected to the circuit pattern of the mounting substrate.

[0135] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0136] For example, the stamp tool is not limited to the stamp tool 10 of the above-described embodiment, and other stamp tools can be used. In addition, the transport head 22 may use an electrostatic adsorption mechanism, a fitting mechanism, a screw mechanism, or the like as a first axis positioning mechanism other than the clamp mechanism 26. By providing the transport head with these mechanisms, the stamp tool 10 can be easily positioned relative to the transport head 22.

[0137] In the above-described embodiment, vacuum suction by a vacuum suction hole is used as the main mounting means of the transport head 22, but in the present invention, it is not necessarily required to use vacuum suction, and the stamp tool 10 may be detachably mounted to the transport head 22 only by a first axis positioning mechanism such as the clamp mechanism 26. In the above-described embodiment, if positioning is possible without using the clamp mechanism 26 and the stamp tool 10 can be detachably held to the transport head 22 with sufficient holding force, a vacuum suction mechanism or an electrostatic suction mechanism may be attached to the transport head.

[0138] Further, in the above-described embodiment, as shown in FIG. 8, a single stamp table 100 is prepared for each single setting stage 82, but since all of these multiple stamp tables 100 are driven along the X-axis and / or Y-axis in the same manner, they can be regarded as a single stamp table 100. Of course, three or more setting stages 82 may be arranged on a single stamp table 100. Similarly, as shown in FIG. 3A, a single element table 102 is prepared for each single element formation substrate 30, but since all of these multiple element tables 102 are driven along the X-axis and / or Y-axis in the same manner, they can be regarded as a single element table 102. Of course, three or more element formation substrates 30 may be arranged on a single element table 100.

[0139] In addition, the conveying device 20 having the stamp tool positioning device of this embodiment is used to pick up the elements 32r (32g, 32b) from the element formation substrate 30, but the use is not limited to this, and the conveying device 20 may also be used to pick up the elements 32r (32g, 32b) from a substrate (sheet) with an adhesive layer transferred from the substrate 30 by a laser lift method or the like.

[0140] Furthermore, the conveying device 20 having the stamp tool positioning device according to this embodiment can also be used to pick up elements other than the red, green, and blue light emitting elements 32r, 32g, and 32b. Examples of other display elements include fluorescent elements. Furthermore, the other elements are not limited to display elements, and may be electronic elements such as light receiving elements, ceramic capacitors, chip inductors, or semiconductor elements. [Explanation of symbols]

[0141] 10. Stamp tool 11… Convex part 12… Stamp layer 14... Support plate 14a… Inclined surface 14b… Adsorption possible surface 14c… Insertable surface 15… Adhesive layer 16... Adapter plate 16a… Mounting surface 16b... Adhesive surface 16c... Tapered surface 16d…Edge 18… Shim plate 20...Transportation device 22...Transport head 24... Adsorption surface 26... Chuck mechanism (first axis positioning mechanism) 26a...Claw part 26b…Engagement surface 26c... Engagement convex part 28... Opening and closing mechanism 30... Element formation substrate (first substrate / element placement substrate) 32r, 32g, 32b... Element 50... First transfer substrate (second substrate / sheet) 52… Adhesive layer 60... Second transfer substrate (sheet) 62… Adhesive layer 70... Mounting board (second board / sheet) 80… Stamp tool holding device 81…Bass 82… Stage 83... Gas flow hole 84… Installation surface 85…Suction hole 86… Storage recess 88... Guide member 89… Inclined surface 90... Positioning member (second axis positioning mechanism) 92...Tip surface 100…Stamp table 102... Element table (first table) 104... Mounting table (second table) 110… Integrated table 120... Control device (control means) 122... Imaging device (imaging means) 200... Multi-element transfer device

Claims

1. a stamp table on which at least one stamp tool is removably mounted, the stamp tool having a stamp layer with a portion to which a plurality of transport target elements can be removably attached; A conveying head capable of picking up at least one of the stamp tools placed on the stamp table; a first table to which a first substrate, on whose surface the transport target elements are to be arranged, is removably fixed; a second table to which a second substrate having a surface to which the elements to be transferred arranged on the first substrate are transferred and transferred by the stamp tool is removably fixed, the stamping table and the first table are arranged along a first axis; the first table and the second table are arranged along a second axis intersecting the first axis; the transport head is movable relative to at least the stamping table along a third axis intersecting both the first axis and the second axis; the stamp tool has an attachment surface on the opposite side to the stamp layer to which the transport head is detachably attached; the stamp tool is attached to the stamping table such that the mounting surface faces upward along the third axis; the first table and the second table are relatively movable with respect to the transport head at least along the second axis, A multi-element transfer apparatus, wherein the stamping table is movable relative to the transport head along at least the first axis.

2. the first substrate includes a plurality of element placement substrates on which the transport target elements of different types are respectively placed, the second substrate is a single mounting substrate or a single transfer substrate, the stamp table includes a plurality of installation stages that detachably hold stamp tools corresponding to the plurality of component placement substrates, The conveying head is picking up stamp tools corresponding to the plurality of component placement substrates from the corresponding placement stages; using the picked-up stamp tool to pick up the transfer target element from the corresponding component placement substrate; transferring the removed conveying element to the second substrate; 2. The multi-element transfer device according to claim 1, further comprising a control means for driving and controlling the positional relationships among said transfer head, said first table, said second table and said stamping table.

3. When the transport head holding the stamp tool is positioned above the first substrate, an imaging means capable of imaging simultaneously in two directions is provided, the imaging means being capable of entering a space between the surface of the first substrate and the stamp layer of the stamp tool, 3. The multi-element transfer device according to claim 1, wherein the imaging means simultaneously images the stamp surface of the stamp layer and the surface of the first substrate.

4. 4. The multi-element transfer device according to claim 3, further comprising a fine adjustment mechanism for changing a relative position between said transfer head and said first substrate based on a detection signal captured by said imaging means.

5. 5. The multi-element transfer device according to claim 4, wherein the fine adjustment mechanism changes a relative rotation angle of the transfer head about the third axis based on a detection signal captured by the imaging means.

6. a first axis positioning mechanism for positioning and adjusting the relative position of the stamp tool with respect to the transfer head along the first axis; 6. The multi-element transfer device of claim 1, further comprising: a second axis positioning mechanism for positioning and adjusting a relative position of the stamp tool with respect to the stamping table along the second axis.

7. 7. The multi-element transfer device according to claim 6, wherein said first axis positioning mechanism also serves as mounting means for detachably mounting said stamp tool to said transfer head.

8. 8. The multi-element transfer device according to claim 7, wherein the mounting means comprises chuck mechanisms provided on opposite sides of the transport head along the first axis and movable toward and away from the stamp tool.

9. The second axis positioning mechanism includes: The stamp table has at least one pair of second positioning members that are arranged on both sides of a setting stage fixed to the stamp table along the second axial direction and are movable in contact with and away from a stamp tool set on the setting stage. A multi-component transfer device according to any one of claims 6 to 8.

10. The multi-element transfer device described in claim 9, wherein the installation stage has an installation surface in which an accommodating recess for accommodating the stamp layer is formed, and the installation surface has a suction hole formed therein that can detachably adsorb a portion of the stamp tool located around the stamp layer.

11. 11. A multi-element transfer apparatus according to claim 9 or 10, wherein the mounting stage is fitted with a guide means for guiding the stamp tool along at least a first axis.

12. A method for producing an element array, comprising the steps of: simultaneously removing and transferring a plurality of elements to be transferred from a substrate using the multi-element transfer device according to any one of claims 1 to 11; and producing an element array.

13. preparing a number of mounting stages on which stamp tools are detachably held, the number of stages being equal to or greater than the number of component placement substrates on which a plurality of types of elements are respectively arranged; a step of placing stamp tools on each of the placement stages, the stamp tools being prepared for each of the plurality of types of elements; picking up stamp tools held on respective mounting stages corresponding to the respective component placement substrates from the mounting stages with a transport head, and simultaneously removing and transporting a plurality of the elements from the component placement substrates corresponding to the picked-up stamp tools using the stamp tools attached to the transport head; and then returning the stamp tool from which the elements have been removed to the corresponding empty setting stage after simultaneously removing and transporting the plurality of elements.

Images