Component mounting device and component mounting method

Abstract

To provide a component mounting device and the like capable of suppressing production time loss.SOLUTION: A component mounting apparatus 1 is a component mounting apparatus 1 for mounting a component onto a circuit board 3. The component mounting apparatus 1 includes: a first suction nozzle 15b1 for sucking a component; a second suction nozzle 15b2 for sucking the component provided alongside the first suction nozzle 15b1; and a recognition unit (component recognition camera 11) that recognizes the component sucked by the first suction nozzle 15b1 or the second suction nozzle 15b2. In a state that the first suction nozzle 15b1 sucks the component and the second suction nozzle 15b2 does not suck any component, the recognition unit recognizes a component sucked by the first suction nozzle 15b1 and a tip 15a of the second suction nozzle 15b2 when the first suction nozzle 15b1 and the second suction nozzle 15b2 pass over the recognition part.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] Conventional Patent Document 1 discloses a component mounting device that first images the suction surface of the suction nozzle with a camera, and then, after production has concluded and the printed circuit board has been removed, images the suction surface of the suction nozzle again with a camera, and compares the images to determine whether or not there are any abnormalities on the suction surface.

[0003] Furthermore, the conventional Patent Document 2 discloses a component mounting device in which, if a suction nozzle is found to be defective during production, a flow measurement unit measures the air flow rate of the suction nozzle without the component suction operation, and the measured value is input into a control unit to determine whether the suction nozzle is good or bad. Only if the nozzle is determined to be defective two or more times in a row, is the suction nozzle replaced with a new one by a nozzle replacement unit. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 3901344 [Patent Document 2] Japanese Patent Application Publication No. 7-22783 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the component mounting device of Patent Document 1, the suction surface of the suction nozzle is imaged again by a camera after production to determine whether or not there is an abnormality in the suction surface of the suction nozzle, which takes time outside of production.

[0006] In addition, in the component mounting device of Patent Document 2, the tip of the suction nozzle is moved to the measurement block during production, and then the air flow rate of the suction nozzle is measured. Even in this case, it takes time to allow the suction nozzle to access the measurement block.

[0007] Therefore, an object of the present disclosure is to provide a component mounting device and a component mounting method that can suppress the occurrence of time loss in production. [Means for solving the problem]

[0008] A component mounting apparatus according to one aspect of the present disclosure is an apparatus for mounting components on a board, comprising: a mounting head including a plurality of suction nozzles for suctioning the components; Adsorbed to The above a recognition unit for recognizing a part; a determination unit that determines whether or not there is a suction nozzle that is not suctioning the component, among the plurality of suction nozzles provided on the mounting head; Equipped with A state in which the mounting head is suctioning the component using a first suction nozzle as the suction nozzle. In The mounting head When passing over the recognition unit, Based on the determination result by the determination unit, The recognition unit As a result, the suction nozzle that is not suctioning the component is Tip of the second suction nozzle Department Recognize. Effect of the Invention

[0009] According to the component mounting device and the component mounting method of the present disclosure, it is possible to suppress the occurrence of time loss in production. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view showing a component mounting device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view showing a mounting head used in the component mounting device according to the embodiment. [Diagram 3] FIG. 3 is a block diagram showing the configuration of a vacuum suction system and an air blow system in the component mounting device according to the embodiment. [Figure 4] FIG. 4 is a block diagram showing the configuration of a control system of the component mounting apparatus according to the embodiment. [Diagram 5] FIG. 5 is a flowchart showing the processing operation of the component mounting device according to the embodiment. [Figure 6] FIG. 6 is a plan view showing a state in which a suction nozzle of a component mounting device according to an embodiment passes above a component recognition camera. [Figure 7] FIG. 7 is a diagram showing the relationship between time and the flow rate when a component is picked up on the tip of the suction nozzle and when no component is picked up. [Figure 8] FIG. 8 is a diagram showing the relationship between time and flow rate when switching from the vacuum flow rate to the blow flow rate. [Figure 9] FIG. 9 is a diagram showing the relationship between time and flow rate for the vacuum flow rate or blow flow rate. [Figure 10] FIG. 10 is an image diagram showing a suction nozzle with a normal suction surface and its brightness distribution diagram. [Figure 11] FIG. 11 is an image diagram showing a suction nozzle with an abnormal suction surface and a brightness distribution diagram thereof. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component arrangement and connection forms, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims are described as optional components.

[0012] Moreover, each figure is a schematic diagram and is not necessarily illustrated precisely. In each figure, the same components are given the same reference numerals. Furthermore, in the following embodiments, expressions such as "approximately horizontal" are used. For example, "approximately horizontal" does not only mean completely horizontal, but also means substantially horizontal, that is, including an error of, for example, about several percent. Furthermore, "approximately horizontal" means horizontal within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately".

[0013] In addition, in the following embodiments, the substrate transport direction is defined as the X-axis direction (left-right direction in FIG. 1), the direction perpendicular to the substrate transport direction and parallel to the horizontal plane is defined as the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis directions is defined as the Z-axis direction (up-down direction).

[0014] Hereinafter, the embodiment will be specifically described with reference to the drawings.

[0015] (Embodiment) <Configuration: Component mounting device 1> FIG. 1 is a plan view of a component mounting apparatus 1 according to an embodiment.

[0016] 1, component mounting apparatus 1 can manufacture a mounted board by mounting (mounting) components (electronic components) at predetermined positions on substrate 3. Note that component mounting apparatus 1 can also mount components other than electronic components onto a mounting target.

[0017] The component mounting apparatus 1 of this embodiment comprises a base 1a, a board transport section 2, a component supply section 4, a Y-axis beam 6, an X-axis beam 7, a mounting head 8, a component recognition camera 11, a component disposal box 10, and a board recognition camera 12.

[0018] The base 1a is capable of arranging the substrate 3, the substrate transport section 2, etc. The substrate transport section 2 is disposed on the upper surface of the base 1a, and extends along the X-axis direction.

[0019] The board transport unit 2 transports the board 3 delivered from an upstream device, thereby positioning and holding the board 3 at a mounting work position. Component supply units 4 are disposed on both sides of the board transport unit 2 in the Y-axis direction.

[0020] The component supply unit 4 is a structure for allowing the mounting head 8 to pick up components, in other words, for supplying components to the mounting head 8. A plurality of tape feeders 5 are mounted in parallel on the component supply unit 4. The tape feeders 5 feed the carrier tape holding the components at a pitch, allowing the mounting head 8, which constitutes the component mounting mechanism, to position the components at the mounting position.

[0021] A long Y-axis beam 6 is disposed substantially horizontally along the Y-axis at one end on the X-axis positive side of the upper surface of the base 1a. A pair of long X-axis beams 7 are attached to the Y-axis beam 6 so as to be slidable along the Y-axis direction.

[0022] One of the pair of X-axis beams 7 is disposed on the positive Y-axis side relative to the substrate transport section 2, and the other of the pair of X-axis beams 7 is disposed on the negative Y-axis side relative to the substrate transport section 2. In addition, the pair of X-axis beams 7 are disposed approximately horizontally along the X-axis direction.

[0023] The pair of X-axis beams 7 can move in the Y-axis direction by a linear drive mechanism of the Y-axis beam 6. A mounting head 8 is slidably attached to each of the pair of X-axis beams 7.

[0024] The mounting head 8 has a plurality of nozzle units 9. In addition, the mounting head 8 can move along the X-axis direction by a linear drive mechanism of the X-axis beam .

[0025] The linear drive mechanism allows the X-axis beam 7 and mounting head 8 to move freely in the XY plane, and the mounting head 8 uses multiple suction nozzles 15 provided on the nozzle unit 9 to vacuum suction (suction) components from the tape feeders 5 arranged in each component supply section 4, removes the components, and moves above the board 3 to mount the components on the mounting position on the board 3.

[0026] Furthermore, on the base 1a, a component recognition camera 11 and a component disposal box 10 are disposed between the board transport unit 2 and each component supply unit 4. When the mounting head 8 which has taken out a component from the component supply unit 4 passes above the component recognition camera 11, the component recognition camera 11 captures an image of the component held by the first suction nozzle 15b1 or the second suction nozzle 15b2 of the multiple suction nozzles 15 mounted on the mounting head 8 at the imaging timing when the mounting head 8 passes by. Therefore, the component recognition camera 11 can recognize the component picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2 of the multiple suction nozzles 15.

[0027] The component disposal box 10 is on the path that the mounting head 8 passes above the component recognition camera 11, and is arranged along the X-axis direction together with the component recognition camera 11 so as to be adjacent to the component recognition camera 11. When the mounting head 8 picks up a component, it can discard the component when it is positioned above the component disposal box 10.

[0028] In addition, when the first suction nozzle 15b1 picks up a component and the second suction nozzle 15b2 does not pick up a component, the first suction nozzle 15b1 and the second suction nozzle 15b2 pass above the component recognition camera 11, and the component recognition camera 11 recognizes the component picked up by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2. The component recognition camera 11 recognizes the suction surface 15a1 of the second suction nozzle 15b2 or the length of the second suction nozzle 15b2 as the tip 15a of the second suction nozzle 15b2. That is, the component recognition camera 11 can perform planar (two-dimensional) recognition and stereoscopic (three-dimensional) recognition. In this embodiment, the second suction nozzle 15b2 is provided alongside the first suction nozzle 15b1. The first suction nozzle 15b1 and the second suction nozzle 15b2 may be collectively referred to as suction nozzles 15. The part recognition camera 11 is an example of a recognition unit.

[0029] The first suction nozzle 15b1 and the second suction nozzle 15b2 can pick up (vacuum pick up) components and can separate the picked up components. The first suction nozzle 15b1 and the second suction nozzle 15b2 can also blow in addition to vacuum pick-up.

[0030] In addition, the second suction nozzle 15b2 may not be used to pick up a component during a particular mounting turn, which provides the component recognition camera 11 with an opportunity to determine whether the tip 15a of the second suction nozzle 15b2 is an object to be recognized.

[0031] When the component recognition camera 11 recognizes the component picked up by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2, the component recognition camera 11 recognizes the component under a first illumination condition and recognizes the tip 15a under a second illumination condition different from the first illumination condition. That is, the component recognition camera 11 has an illumination unit that illuminates the component and the tip 15a of the suction nozzle 15, and an illumination control unit that controls the light emission of the illumination unit based on the image capture timing. The illumination control unit illuminates the component picked up by the first suction nozzle 15b1 under the first illumination condition based on the image capture timing of the component recognition camera 11, so that the component recognition camera 11 can recognize the component. The illumination control unit illuminates the tip 15a of the second suction nozzle 15b2 under the second illumination condition based on the image capture timing of the component recognition camera 11, so that the component recognition camera 11 can recognize the tip 15a of the second suction nozzle 15b2. The first illumination condition is an illumination condition for recognizing a component, and is light having a predetermined irradiation angle. The illumination control unit can switch the illumination conditions by changing the brightness, illumination angle, or type of illumination (e.g., transmitted illumination and reflected illumination) of the light irradiated to the component. Here, the first illumination condition is an illumination condition under which the component can be recognized, for example, an illumination condition under which light having a predetermined illumination angle is irradiated to the component. The second illumination condition is an illumination condition under which the tip 15a can be recognized, for example, an illumination condition under which light is irradiated perpendicularly to the tip 15a.

[0032] A board recognition camera 12 is disposed on the coupling plate 8a to which the mounting head 8 is attached, the board recognition camera 12 being located on the underside of the X-axis beam 7 and moving integrally with the mounting head 8. The board recognition camera 12 is disposed on the coupling plate 8a with its imaging direction facing downward. By moving the mounting head 8 above the board 3 held by the board transport unit 2, the board recognition camera 12 captures images of position recognition marks and the like on the board 3, and after components are mounted, moves above the board 3 to capture images of the components mounted on the board 3.

[0033] By performing image recognition processing on the image data acquired by component recognition camera 11 and board recognition camera 12, it is possible to detect positional misalignment of the component held by suction nozzle 15 in mounting head 8, and positional misalignment of board 3 held by board transport unit 2. During component mounting operation, mounting head 8 takes these positional misalignments into account, corrects the position, and mounts the component at the mounting position on board 3.

[0034] Next, the mounting head 8 will be described with reference to Figures 1 and 2. Figure 2 is a perspective view showing the mounting head 8 used in the component mounting apparatus 1 according to the embodiment.

[0035] As shown in FIG. 1 and FIG. 2, the mounting head 8 is attached to the X-axis beam 7 via a connecting plate 8a. The mounting head 8 has a plurality of nozzle units 9 arranged side by side. Each nozzle unit 9 is arranged so that a nozzle shaft 13 extends downward from a nozzle drive unit 9a. A plurality of suction nozzles 15 are detachably attached to a nozzle mounting unit 14 connected to the lower end of the nozzle shaft 13. Each nozzle drive unit 9a has a nozzle lifting mechanism that uses a linear motor to lift and lower an elevation shaft connected to the nozzle shaft 13. When the nozzle drive unit 9a is driven, the plurality of suction nozzles 15 attached to the nozzle mounting unit 14 are lifted and lowered individually. In addition to the plurality of nozzle units 9, the mounting head 8 has a nozzle drive unit 9a, a nozzle shaft 13, a nozzle mounting unit 14, and a suction nozzle 15. The mounting head 8 has multiple nozzle units 9, multiple nozzle drive units 9a, multiple nozzle shafts 13, multiple nozzle mounting units 14, and multiple suction nozzles 15; however, unless otherwise specified, the following description will focus on one nozzle unit 9, one nozzle drive unit 9a, one nozzle shaft 13, one nozzle mounting unit 14, and one suction nozzle 15.

[0036] There are several types of suction nozzles 15 available depending on the size and shape of the component to be vacuum-sucked. For example, for a large-sized component, a suction nozzle 15 having a large suction surface 15a1 at the lower end of the suction nozzle 15 as shown in FIG.

[0037] Furthermore, multiple types of mounting heads 8 are prepared according to the type of suction nozzle 15 to be mounted. For example, when mounting a large suction nozzle 15 for suctioning a large component, a mounting head 8 having a large nozzle unit 9 is used.

[0038] Next, the vacuum suction system and the air blow system will be described with reference to Figures 1 to 3. Figure 3 is a block diagram showing the configuration of the vacuum suction system and the air blow system in the component mounting device 1 according to the embodiment.

[0039] 1 to 3, the nozzle shaft 13 is inserted through the nozzle mounting portion 14 and communicates with the suction nozzle 15. A flow path hole provided inside the nozzle shaft 13 is connected to an output path 17 via a flow sensor 16. In other words, the suction hole of the nozzle shaft 13 and the output path 17 are connected to an output port A1 of a switching valve 18 via the flow sensor 16 and the output path 17, thereby forming a suction / air blow circuit that connects the switching valve 18 and the suction nozzle 15.

[0040] The flow sensor 16 measures the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2. That is, the flow sensor 16 measures the flow rate of air flowing inside a specific suction nozzle 15 among the plurality of suction nozzles 15. For example, the flow sensor 16 measures the flow rates of air in two directions, a positive direction flowing out from the flow sensor 16 in the direction of the nozzle axis 13 (arrow a) and a negative direction flowing from the nozzle axis 13 in the direction of the flow sensor 16 (arrow b). In other words, the flow sensor 16 measures the vacuum flow rate when the suction nozzle 15 sucks, or the blow flow rate when the suction nozzle 15 blows. The flow sensor 16 outputs the measurement results of the suction flow rate and the blow flow rate to the determination unit 25 included in the nozzle control unit 23. The flow sensor 16 is an example of a measurement unit.

[0041] The switching valve 18 is composed of a solenoid valve or the like having two input ports P1 and P2 and an output port A1. In the switching valve 18, a state in which a path from the input port P1 to the output port A1 is opened and a state in which a path from the input port P2 to the output port A1 is opened are switched by a selection signal from the outside. The input port P1 of the switching valve 18 is connected to a vacuum pump 19, the input port P2 is connected to an output port A2 of a blow valve 20, and the output port A1 is connected to an output path 17 leading to the flow sensor 16. The vacuum pump 19 can generate a negative pressure (vacuum).

[0042] The blow valve 20 is composed of an electromagnetic valve having two input ports P3 and P4 and an output port A2. In the blow valve 20, a state in which the path from the input port P3 to the output port A2 is opened and a state in which the path from the input port P4 to the output port A2 is opened are switched by a selection signal from the outside. The input port P3 of the blow valve 20 is connected to an air supply source 21, the input port P4 is connected to an air supply source 22, and the output port A2 is connected to the input port P2 of the switching valve 18. The air supply source 21 can supply positive pressure air. The air supply source 22 can supply atmospheric air. The air supply source 22 can also be realized by opening the input port P4 of the blow valve 20.

[0043] The switching valve 18 and the blow valve 20 are connected to a valve control unit 24 included in the nozzle control unit 23. The measurement result of the flow sensor 16 is input to a judgment unit 25 included in the nozzle control unit 23. A valve memory unit 26 included in the nozzle control unit 23 stores timing information for switching the states of the switching valve 18 and the blow valve 20 by the valve control unit 24, timing information for judging whether the air flow rate measured by the flow sensor 16 is normal or not by the judgment unit 25, and a predetermined value (judgment value). The nozzle control unit 23 is disposed in the mounting head 8, and is connected to the device control unit 30 with the mounting head 8 attached to the coupling plate 8a.

[0044] When the valve control unit 24 controls the switching valve 18 to open the path from the input port P1 to the output port A1 (suction state), the vacuum pump 19 communicates with the suction nozzle 15 via the switching valve 18 and the flow sensor 16, and the suction nozzle 15 performs vacuum suction from the suction surface 15a1 at the lower end.

[0045] When the suction nozzle 15 vacuum-sucks a component while the component is in contact with the suction surface 15a1, the component is vacuum-sucked by the suction nozzle 15. At this time, the air flow rate (vacuum flow rate) measured by the flow sensor 16 is substantially zero. When the suction nozzle 15 vacuum-sucks a component while the component is not in contact with the suction surface 15a1, outside air (air) is sucked in by the suction nozzle 15. Therefore, the flow sensor 16 can measure a negative air flow rate.

[0046] When the valve control section 24 controls the switching valve 18 to open the path from the input port P2 to the output port A1, and controls the blow valve 20 to open the path from the input port P3 to the output port A2 (blow state), the air supply source 21 communicates with the suction nozzle 15 via the blow valve 20, the switching valve 18, and the flow sensor 16, and positive pressure air is discharged from the suction nozzle 15. In other words, the air supply source 21 serves as air blowing means for discharging positive pressure air from the suction nozzle 15. At this time, the flow sensor 16 measures the flow rate of the positive air.

[0047] When the valve control section 24 controls the switching valve 18 to open the path from the input port P2 to the output port A1, and controls the blow valve 20 to open the path from the input port P4 to the output port A2 (atmospheric pressure state), the air supply source 22 communicates with the suction nozzle 15 via the blow valve 20, the switching valve 18, and the flow sensor 16, and the suction nozzle 15 becomes at atmospheric pressure. At this time, the air flow rate measured by the flow sensor 16 becomes substantially zero.

[0048] In this way, the switching valve 18 and the blow valve 20 serve as switching means for selectively connecting the vacuum pump 19 and the air supply source 21 to the suction nozzle 15. The flow rate sensor 16 is disposed in the suction / air blow circuit that connects this switching means (the switching valve 18 and the blow valve 20) to the suction nozzle 15, and measures the flow rate of air passing through the suction / air blow circuit in two directions, forward and reverse.

[0049] The determination unit 25 compares the air flow rate measured by the flow rate sensor 16 with a predetermined value stored in the valve memory unit 26 to determine whether the air flow rate exceeds the predetermined value. Specifically, the determination unit 25 determines whether a component is picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2 based on the flow rate measured by the flow rate sensor 16. For example, if the flow rate measured by the flow rate sensor 16 after the second suction nozzle 15b2 picks up the component is equal to or greater than the predetermined value, the determination unit 25 determines that the component is not picked up by the second suction nozzle 15b2. Also, if the flow rate measured by the flow rate sensor 16 after the second suction nozzle 15b2 picks up the component is less than the predetermined value, the determination unit 25 determines that the component is picked up by the second suction nozzle 15b2. The timing at which the determination unit 25 makes the determination is controlled by the valve control unit 24 based on timing information stored in the valve memory unit 26. The result of the determination by the determination unit 25 is transmitted to the device control unit 30 via the valve control unit 24.

[0050] Furthermore, the determination unit 25 determines whether the second suction nozzle 15b2 is defective based on the recognition result of the tip 15a of the second suction nozzle 15b2 by the component recognition camera 11. If the determination unit 25 determines that the second suction nozzle 15b2 is abnormal (defective product), it outputs a determination result indicating that the second suction nozzle 15b2 is abnormal to the notification unit 34. If the determination unit 25 determines that the second suction nozzle 15b2 is normal (non-defective product), it outputs a determination result indicating that the second suction nozzle 15b2 is normal to the notification unit 34.

[0051] Next, the configuration of the component mounting device 1 will be described with reference to Figures 1 to 4. Figure 4 is a block diagram showing the configuration of a control system of the component mounting device 1 according to the embodiment.

[0052] 1 to 4, the component mounting device 1 includes an apparatus control unit 30, an apparatus memory unit 31, a board transport unit 2, a component supply unit 4, a mounting head 8, a Y-axis beam 6, an X-axis beam 7, a component recognition camera 11, a board recognition camera 12, a vacuum pump 19, an air supply source 21, an atmospheric supply source 22, an input unit 32, a display unit 33, and a notification unit 34. The mounting head 8 further includes a nozzle control unit 23.

[0053] The nozzle control unit 23 includes a valve control unit 24, a determination unit 25, and a valve storage unit 26. To the nozzle control unit 23, the flow rate sensor 16, the switching valve 18, and the blow valve 20 are connected.

[0054] The device control unit 30 is a calculation processing device with a CPU function, and has an implementation control unit 30a and an abnormality processing unit 30b as internal processing functions. The device storage unit 31 is a storage device, and stores production data such as implementation data 31a, valve control data 31b, and judgment control data 31c.

[0055] The mounting data 31a includes information such as the mounting position of the component on the board 3 and the type (name) of the component to be mounted. The mounting control unit 30a controls the board transport unit 2, the component supply unit 4, the mounting head 8, the nozzle driving unit 9a, the Y-axis beam 6, and the X-axis beam 7 based on the mounting data 31a, thereby controlling so that the component can be mounted at the mounting position on the board 3 by the suction nozzle 15.

[0056] The valve control data 31b includes information such as timing information for the valve control unit 24 to switch the switching valve 18 and the blow valve 20 when the suction nozzle 15 mounts the component vacuum-sucked by the suction nozzle 15 onto the board 3.

[0057] The judgment control data 31c stores timing information for judging the measurement result of the flow sensor 16 by the judgment section 25 of the nozzle control section 23, a predetermined value which is a threshold value for judging whether the measured air flow rate is normal, etc.

[0058] The timing information of the valve control data 31b, the timing information of the judgment control data 31c, and the predetermined values ​​are determined in advance based on experiments and experience, and correspond to the type of mounting head 8 (such as the number of nozzle units 9) and the type of suction nozzle 15 attached to the mounting head 8. Various data corresponding to the configuration of the component mounting device 1, such as the type of mounting head 8 attached to the component mounting device 1 and the type of suction nozzle 15 attached to the nozzle unit 9, are transferred from the valve control data 31b and the judgment control data 31c to the valve memory unit 26 of the nozzle control unit 23 and stored therein.

[0059] The input unit 32 is an input device such as a keyboard, a touch panel, a mouse, etc., and is used when inputting operation commands and data.

[0060] The display unit 33 is a display device such as a liquid crystal panel, and displays various information such as an operation screen for operation by the input unit 32, as well as images captured by the board recognition camera 12.

[0061] The notification unit 34 is a notification light, a flash lamp, a buzzer, etc., and notifies an operator of an operating condition such as an abnormality of the component mounting device 1. For example, when the determination unit 25 determines that the second suction nozzle 15b2 is abnormal, the notification unit 34 notifies an error indicating that the second suction nozzle 15b2 is abnormal.

[0062] The abnormality processing unit 30b executes abnormality processing when the determination unit 25 detects an abnormality in the vacuum suction system or the air blow system. Specifically, the abnormality processing unit 30b causes the board recognition camera 12 to capture an image of the mounting position of the component mounted on the board 3 when the abnormality was detected, and causes the captured image to be displayed on the display unit 33. Furthermore, the abnormality processing unit 30b activates the notification unit 34 to notify the operator of the abnormality.

[0063] That is, when the determination unit 25 determines that any of the vacuum pump 19, the air supply source 21, the switching valve 18, the blow valve 20, and the suction / air blow circuit is abnormal, the board recognition camera 12 captures an image of the mounting position on the board 3 where the component is expected to be mounted when the determination unit 25 determines that there is an abnormality. Then, the display unit 33 displays the captured image of the position on the board 3 captured by the board recognition camera 12, and the notification unit 34 also notifies the abnormality.

[0064] <Processing Operation> Next, the processing operation of the component mounting device 1 and the component mounting method according to the present embodiment will be described. Fig. 5 is a flowchart showing the processing operation of the component mounting device 1 according to the embodiment. Note that, in Fig. 5, the nozzle unit 9 is provided with a plurality of suction nozzles 15, but unless otherwise specified, only one of the plurality of suction nozzles 15 will be described.

[0065] 5, the determination unit 25 determines whether or not the suction nozzle 15 of the nozzle unit 9 provided on the mounting head 8 is the suction nozzle 15 to be used in the current mounting turn (S11). For example, the determination unit 25 determines whether or not the suction nozzle 15 to be used in the current mounting turn is attached to the nozzle unit 9 based on the production data stored in the device storage unit 31 or the valve storage unit 26.

[0066] Next, when the determination unit 25 determines that the suction nozzle 15 is to be used in the current mounting turn (YES in S11), the mounting head 8 uses the suction nozzle 15 provided in the nozzle unit 9 to pick up and remove the component from the tape feeder 5 arranged in the component supply unit 4 (performs a suction operation). At this time, the flow sensor 16 measures the flow rate of air flowing through the suction nozzle 15 to check the flow rate after the component suction operation (S12). The flow sensor 16 outputs the measurement result to the determination unit 25.

[0067] Next, when the determination unit 25 acquires the measurement result from the flow rate sensor 16, it determines whether or not the flow rate in the suction nozzle 15 is normal (S13).

[0068] Here, the determination of whether the flow rate in suction nozzle 15 is normal or not based on the flow rate check after the component suction operation will be described with reference to Fig. 7. Fig. 7 is a diagram showing the relationship between time and flow rate when a component is picked up at tip 15a of suction nozzle 15 (Fig. 7a) and when no component is picked up (Fig. 7b). In Fig. 7, the horizontal axis represents time and the vertical axis represents flow rate.

[0069] As shown by the solid line in FIG. 7a, when a component is picked up by the tip 15a of the suction nozzle 15, the flow rate is higher than the first predetermined value shown by the dashed line before the component is picked up, and the flow rate is lower than the first predetermined value shown by the dashed line after the component is picked up because the component covers the opening of the tip 15a, and the flow rate is substantially zero. Therefore, before the component is picked up, if the flow rate of the suction nozzle 15 (second suction nozzle 15b2) measured by the flow rate sensor 16 is equal to or greater than the first predetermined value, the determination unit 25 determines that the component is not picked up by the second suction nozzle 15b2. After the component is picked up, the determination unit 25 determines that the component is picked up by the second suction nozzle 15b2, for example, if the flow rate measured by the flow rate sensor 16 after the second suction nozzle 15b2 picks up the component is less than the first predetermined value (the flow rate is substantially zero in FIG. 7a). The first predetermined value is an example of a predetermined value.

[0070] However, as shown by the solid line in Fig. 7b, the flow rate of suction nozzle 15 temporarily drops but then returns to the original flow rate. This is because suction nozzle 15 picks up a component but fails to pick up the component, so the flow rate drops once and then returns to the original flow rate. In this case, because the flow rate of second suction nozzle 15b2 is equal to or greater than the first predetermined value, determination unit 25 determines that the component has not been picked up by second suction nozzle 15b2.

[0071] From the above description, for example, when the determination unit 25 determines that the flow rate in the suction nozzle 15 is normal (YES in S13), the component recognition camera 11 recognizes the component picked up by the first suction nozzle 15b1 of the multiple suction nozzles 15 (S14). That is, as shown by the solid arrow in Fig. 6, the component recognition camera 11 recognizes the component by capturing an image of the component based on the imaging timing, which is the timing when the first suction nozzle 15b1 passes above the component recognition camera 11 while picking up the component. Fig. 6 is a plan view showing the suction nozzle 15 of the component mounting device 1 according to the embodiment passing above the component recognition camera 11.

[0072] Next, the component recognition camera 11 determines whether the recognized component is a normal component (S15). For example, the component recognition camera 11 determines whether the component is a normal component based on the production data, the orientation of the component, whether the component is damaged, whether foreign matter is attached to the component, etc.

[0073] Next, if the component recognition camera 11 determines that the recognized component is a normal component (YES in S15), the judgment unit 25 judges whether or not there is a suction nozzle 15 (first suction nozzle 15b1) with a component mounted on the nozzle unit 9 (S16).

[0074] If the determination unit 25 determines that there is no suction nozzle 15 that has already mounted a component on the nozzle unit 9 (NO in S16), the component is mounted by the suction nozzle 15 that is holding the component (S20), and the process proceeds to step S21. For example, if none of the multiple suction nozzles 15 has finished mounting a component in the current mounting turn, the determination unit 25 determines that there is no suction nozzle 15 that has already mounted a component.

[0075] On the other hand, if the judgment unit 25 judges that there is a suction nozzle 15 with a component already mounted on the nozzle unit 9 (YES in S16), in parallel with the component mounting by the suction nozzle 15 holding the component, the flow sensor 16 measures the vacuum flow rate of the suction nozzle 15 with a component already mounted or the blow flow rate of the suction nozzle 15 (S17).

[0076] Here, the measurement of the vacuum flow rate or the blow flow rate will be described with reference to Fig. 8. Fig. 8 is a diagram showing the relationship between time and flow rate when switching from the vacuum flow rate to the blow flow rate. In Fig. 8, the horizontal axis represents time and the vertical axis represents flow rate.

[0077] Normally, the vacuum flow rate is constantly measured, but when measuring the blow flow rate, the switching valve 18 closes the path from the input port P1 to the output port A1, and then switches to an open state of the path from the input port P2 to the output port A1. As shown in Figures 5 and 8, when the suction nozzle 15 is switched from suction (suction direction) to blow (discharge direction), the flow sensor 16 measures the blow flow rate at the suction nozzle 15. The flow sensor 16 outputs the measurement result of the vacuum flow rate or the measurement result of the blow flow rate to the determination unit 25.

[0078] Next, when the determination unit 25 acquires the measurement result of the vacuum flow rate or the blow flow rate from the flow rate sensor 16, it determines whether the flow rate (vacuum flow rate or blow flow rate) of the suction nozzle 15 in step S17 is normal or not (S18).

[0079] For example, in the case of the blow flow rate, when the flow rate of the suction nozzle 15 is less than the second predetermined value shown by the dashed line as shown by the dashed line in Fig. 8, the judgment unit 25 judges that the flow rate is abnormal (not normal) (NO in S18). For example, when the blow flow rate of the suction nozzle 15 is less than the second predetermined value shown by the dashed line, the judgment unit 25 judges that the flow rate is abnormal as shown by the dashed line in Fig. 8. The same applies to the vacuum flow rate. The second predetermined value is an example of a predetermined value.

[0080] Next, if the result of step S18 is NO, the notification unit 34 notifies an error indicating that the suction nozzle 15 is abnormal (S19). This allows the operator to recognize that the suction nozzle 15 is abnormal.

[0081] For example, on the other hand, when the blow flow rate of the suction nozzle 15 is equal to or greater than the second predetermined value shown by the dashed line as shown by the solid line in Fig. 8, the determination unit 25 determines that the flow rate is normal (YES in S18). For example, when the blow flow rate of the suction nozzle 15 is equal to or greater than the second predetermined value, the determination unit 25 determines that the flow rate is normal as shown by the solid line in Fig. 8. The same applies to the vacuum flow rate.

[0082] 5, if the answer is YES in step S18, or if the process has gone through step S20, the determination unit 25 determines whether or not the component mounting operation on the board 3 has been completed by the normal suction nozzle 15 (S21). A normal suction nozzle 15 is a nozzle that can properly supply a component to the board 3.

[0083] When the determining unit 25 determines that the operation of mounting the components on the board 3 has not been completed (NO in S21), the process returns to step S16.

[0084] On the other hand, if the determination unit 25 determines that the operation of mounting the components on the board 3 has been completed (YES in S21), the component mounting device 1 advances the processing operation to step S22.

[0085] Returning to the explanation of step S15.

[0086] If the component recognition camera 11 determines that the recognized component is an abnormal component (an abnormal component) (NO in S15), the judgment unit 25 determines whether or not the component is adsorbed to the tip 15a of the suction nozzle 15 (S23).

[0087] As shown in FIG. 5, when the determining unit 25 determines that no component is picked up by the tip 15a of the suction nozzle 15 (NO in S23), the process proceeds to step S31.

[0088] On the other hand, when the judgment unit 25 judges that a component has been adsorbed to the tip 15a of the suction nozzle 15 (YES in S23), it judges whether the operation of mounting the component on the board 3 has been completed by the normal suction nozzle 15 (S24).

[0089] When the determination unit 25 determines that the operation of mounting the components on the board 3 has not been completed (NO in S24), the process returns to step S24.

[0090] On the other hand, if the determination unit 25 determines that the operation of placing the component on the board 3 is completed (YES in S24), the flow rate sensor 16 measures the blow flow rate of the suction nozzle 15 (S25).

[0091] The flow rate sensor 16 outputs the measurement result of the blow flow rate to the determination unit 25.

[0092] If the result of step S24 is YES and a component has been picked up by the suction nozzle 15 during step S25, a processing operation for discarding the component in the component disposal box 10 may be executed.

[0093] Next, when the determination unit 25 acquires the measurement result of the blow flow rate from the flow rate sensor 16, it determines whether or not the blow flow rate of the suction nozzle 15 in step S25 is normal (S26).

[0094] Here, a method for determining whether the blow flow rate of the suction nozzle 15 is normal or not by measuring the blow flow rate of the suction nozzle 15 while a normal suction nozzle 15 is performing a component mounting operation will be described with reference to Fig. 9. Fig. 9 is a diagram showing the relationship between time and flow rate for the vacuum flow rate (Fig. 9b) or the blow flow rate (Fig. 9a). In Figs. 9a and 9b, the horizontal axis represents time and the vertical axis represents flow rate. In principle, the vacuum flow rate is always ON from when the component is picked up until it is moved to the component disposal box 10, but when checking the blow flow rate, the switching valve 18 is operated to turn the vacuum flow rate OFF and temporarily turn the blow flow rate ON.

[0095] As shown in FIG. 5 and FIG. 9a, the determination unit 25 determines whether the blow flow rate of the suction nozzle 15 shown by the dashed line in FIG. 9a is equal to or greater than the second predetermined value. If the blow flow rate of the suction nozzle 15 shown by the dashed line in FIG. 9a is less than the second predetermined value shown by the broken line, the tip 15a of the suction nozzle 15 may be deformed or a foreign object may be attached. Therefore, if the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than the second predetermined value, the determination unit 25 determines that the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (NO in S26). Then, the notification unit 34 notifies an error indicating that the suction nozzle 15 is abnormal (S27). This allows the operator to recognize that the suction nozzle 15 is abnormal.

[0096] On the other hand, if the blow flow rate of the suction nozzle 15 shown by the solid line in Fig. 9a is equal to or greater than the predetermined value shown by the dashed line, it is considered that the tip 15a of the suction nozzle 15 is normal. Therefore, if the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than the second predetermined value, the determination unit 25 determines that the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal (YES in S26). Then, the component mounting device 1 advances the processing operation to step S22.

[0097] The description returns to steps S11 and S13.

[0098] If the determination unit 25 determines that the suction nozzle 15 is not the one to be used in the current mounting turn (NO in S11), or if the determination unit 25 determines that the flow rate at the suction nozzle 15 is abnormal (not normal) (NO in S13), the component recognition camera 11 recognizes the tip 15a of the suction nozzle 15. Specifically, at the timing when the multiple suction nozzles 15 pass above the component recognition camera 11, the component recognition camera 11 recognizes the tip 15a of an unused suction nozzle 15 among the multiple suction nozzles 15, or the tip 15a of an suction nozzle 15 with a flow rate equal to or greater than a first predetermined value (S28).

[0099] Next, the component recognition camera 11 judges whether the tip 15a of the recognized suction nozzle 15 is normal or not (S29).

[0100] Here, the determination of whether the tip 15a of the suction nozzle 15 is normal or not will be specifically described with reference to Fig. 10 and Fig. 11. Fig. 10 is an image (Fig. 10a) of a suction nozzle 15 whose tip 15a is normal, and its brightness distribution (Fig. 10b). Fig. 11 is an image (Fig. 11a) of a suction nozzle 15 whose tip 15a is abnormal, and its brightness distribution (Fig. 11b).

[0101] As shown in Fig. 10(a), image A1 shows tip 15a of suction nozzle 15. Line A2 is a straight line indicating a set of pixels whose luminance is to be measured. Also, as shown in Fig. 10(b), waveform B1 represents the luminance distribution of pixels on line A2, and is a graph with the horizontal axis representing the relative position on line A2 of image A1 of tip 15a and the vertical axis representing luminance.

[0102] First, the component recognition camera 11 captures an image of the tip 15a of the normal suction nozzle 15 in advance, and stores the captured image in the device storage unit 31 in advance. The component recognition camera 11 captures an image of the tip 15a of the suction nozzle 15 again when the suction nozzle 15 passes above the component recognition camera 11. The component recognition camera 11 compares the image of the tip 15a of the suction nozzle 15 stored in advance in the device storage unit 31 (first image) with the image of the tip 15a of the suction nozzle 15 captured again (second image). For example, if the luminance distribution of the first image on the line A2 appears as a waveform B1 and the luminance distribution of the second image on the line A4 appears as a waveform B2, the luminance distribution of the portion C at b in FIG. 11 differs from the luminance distribution of the similar portion at b in FIG. 10, and therefore the component recognition camera 11 determines that an abnormality has occurred in the tip 15a. It is expected that even if the suction nozzle 15 is determined to have no abnormality in the tip 15a, variations in the position, brightness, etc. will occur during repeated photographing. In this case, a predetermined allowable range may be set for each of the position and brightness, and only the tip 15a outside this range may be determined to be abnormal.

[0103] In this way, the component recognition camera 11 determines whether the tip 15a of the recognized suction nozzle 15 is normal or not, but this is merely an example and the determination means is not limited to the above.

[0104] When the determination unit 25 determines that the tip 15a of the recognized suction nozzle 15 is abnormal (not normal) (NO in S29), the notification unit 34 notifies an error indicating that the tip 15a of the suction nozzle 15 is abnormal (S30). This allows the operator to recognize that the tip 15a of the suction nozzle 15 is abnormal.

[0105] On the other hand, if the determination unit 25 determines that the tip 15a of the recognized suction nozzle 15 is normal (YES in S29), the flow sensor 16 measures the vacuum flow rate of the suction nozzle 15 whose tip 15a has been determined to be normal during the component mounting operation by the normal suction nozzle 15 (S31). The flow sensor 16 outputs the measurement result of the vacuum flow rate to the determination unit 25.

[0106] Next, when the determination unit 25 acquires the measurement result of the vacuum flow rate from the flow rate sensor 16, it determines whether or not the vacuum flow rate of the suction nozzle 15 in step S31 is normal (S32).

[0107] Here, using FIG. 9B, we will explain how to determine whether the vacuum flow rate of a normal suction nozzle 15 is normal by measuring the vacuum flow rate of the normal suction nozzle 15 while the normal suction nozzle 15 is performing a component mounting operation.

[0108] As shown in FIG. 5 and FIG. 9b, in the vacuum flow rate of the suction nozzle 15, the determination unit 25 determines whether the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than a first predetermined value. If the vacuum flow rate of the suction nozzle 15 shown by the dashed line in FIG. 9b is less than the predetermined value shown by the broken line, deformation of the tip 15a of the suction nozzle 15 or adhesion of a foreign object may occur. Therefore, if the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than the first predetermined value, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (NO in S32). Then, the notification unit 34 notifies an error indicating that the tip 15a of the suction nozzle 15 is abnormal (S33). This allows the operator to recognize that the tip 15a of the suction nozzle 15 is abnormal.

[0109] 9b is equal to or greater than the predetermined value indicated by the dashed line, the tip 15a of the suction nozzle 15 is considered to be normal. Therefore, if the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than the first predetermined value, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal (YES in S32).

[0110] Next, the determination unit 25 determines whether or not the component mounting operation on the board 3 has been completed by the normal suction nozzle 15 (S34).

[0111] The determination unit 25 determines that the operation of mounting components on the board 3 is not complete (NO in S34). Then, the component mounting device 1 returns the processing operation to step S34.

[0112] On the other hand, if the determination unit 25 determines that the operation of mounting the components on the board 3 has been completed (YES in S34), the component mounting device 1 advances the processing operation to step S22.

[0113] As described above, if the answer is YES in step S21, if the answer is YES in step S26, or if the answer is YES in step S34, the component mounting apparatus 1 determines whether or not production is completed (S22).

[0114] When it is determined that the production is not completed (NO in S22), the component mounting apparatus 1 returns the processing operation to step S11.

[0115] On the other hand, if the component mounting apparatus 1 determines that the production is completed (YES in S22), it ends the processing operation.

[0116] <Action and effect> Next, the effects of the component mounting apparatus 1 and the component mounting method according to this embodiment will be described.

[0117] As described above, the component mounting device 1 of this embodiment is a component mounting device 1 that mounts components on a board 3, and includes a first suction nozzle 15b1 that picks up a component, a second suction nozzle 15b2 that picks up a component and is provided alongside the first suction nozzle 15b1, and a recognition unit (component recognition camera 11) that recognizes the component picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2. When the first suction nozzle 15b1 picks up a component and the second suction nozzle 15b2 does not pick up a component, the recognition unit recognizes the component picked up by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2 when the first suction nozzle 15b1 and the second suction nozzle 15b2 pass above the recognition unit.

[0118] For example, in the conventional case where only the component picked up by the first suction nozzle is recognized when the first and second suction nozzles pass above the component recognition camera, a separate process and operation for recognizing the tip of the second suction nozzle is required, which takes time. This essentially stops the production of products by the component mounting device, which may reduce the productivity of the component mounting device.

[0119] However, according to this embodiment, the component recognition camera 11 can simultaneously recognize, among the multiple suction nozzles 15, the first suction nozzle 15b1 that is suctioning a component and the second nozzle that is not suctioning a component. In other words, the component recognition camera 11 can recognize the component picked up by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2 in parallel when the first suction nozzle 15b1 and the second suction nozzle 15b2 pass above the component recognition camera 11. For this reason, in this embodiment, there is no need to separately recognize only the tip 15a of the second suction nozzle 15b2, as in the conventional case.

[0120] Therefore, it is possible to suppress the occurrence of time loss in production in the component mounting device 1. As a result, for example, it is not necessary to stop the component mounting device 1 in order to recognize only the tip 15a of the second suction nozzle 15b2, or to take time to recognize only the tip 15a of the second suction nozzle 15b2, so that it is possible to suppress a decrease in productivity in the component mounting device 1.

[0121] The component mounting method of this embodiment is a component mounting method for mounting components on a board 3 using a component mounting device 1, which has a first suction nozzle 15b1 for suctioning a component and a second suction nozzle 15b2 for suctioning a component, which is provided alongside the first suction nozzle 15b1. In the component mounting method, when the first suction nozzle 15b1 is suctioning a component and the second suction nozzle 15b2 is not suctioning a component, the component picked up by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2 are recognized when the first suction nozzle 15b1 and the second suction nozzle 15b2 pass above a recognition section.

[0122] This component mounting method also provides the same effects as those described above.

[0123] Furthermore, in the component mounting device 1 of this embodiment, the component recognition camera 11 recognizes the suction surface 15a1 of the second suction nozzle 15b2 or the length of the second suction nozzle 15b2 as the tip 15a of the second suction nozzle 15b2.

[0124] According to this, the component recognition camera 11 can recognize the suction surface 15a1 and the length of the second suction nozzle 15b2, and thereby can grasp the state of the second suction nozzle 15b2 with higher accuracy.

[0125] The component mounting device 1 of this embodiment further includes a measurement unit (flow sensor 16) that measures the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2, and a determination unit 25 that determines whether a component is being picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2 based on the flow rate measured by the measurement unit. The determination unit 25 determines that a component is not being picked up by the second suction nozzle 15b2 when the flow rate measured by the measurement unit after the second suction nozzle 15b2 has performed a component pickup operation is equal to or greater than a predetermined value (first predetermined value or second predetermined value).

[0126] According to this, by measuring the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2, it is possible to accurately determine whether a component is being picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2. Also, for example, if the flow rate of the second suction nozzle 15b2 is equal to or greater than a predetermined value even though the second suction nozzle 15b2 has performed a suction operation of a component, it is possible to accurately determine that a component is not being picked up by the second suction nozzle 15b2.

[0127] Furthermore, in the component mounting device 1 of this embodiment, if the flow rate measured by the measuring unit after the second suction nozzle 15b2 performs the component suction operation is less than a predetermined value, the judgment unit 25 judges that the component is being suctioned by the second suction nozzle 15b2.

[0128] According to this, by measuring the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2, it is possible to accurately determine whether a component is being picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2.

[0129] Furthermore, in the component mounting apparatus 1 of this embodiment, the second suction nozzle 15b2 is not used for component pickup in a specific mounting turn.

[0130] This provides an opportunity to determine whether or not the tip 15a of the second suction nozzle 15b2 is a target for recognition when the second suction nozzle 15b2 is not being used to pick up a component.

[0131] In the component mounting device 1 of the present embodiment, the recognition unit recognizes the component under a first illumination condition, and recognizes the tip portion 15a under a second illumination condition different from the first illumination condition.

[0132] This allows the component to be recognized under the first illumination condition, and allows the tip 15a to be recognized under the second illumination condition. This allows the component recognition camera 11 to recognize only the component picked up by the first suction nozzle 15b1, or only the tip 15a of the second suction nozzle 15b2. In other words, the component recognition camera 11 can accurately recognize the component and the state of the tip 15a.

[0133] In the component mounting device 1 of the present embodiment, the judging unit 25 judges whether the second suction nozzle 15b2 is good or bad based on the recognition result of the tip portion 15a by the recognition unit.

[0134] According to this, it is possible to accurately recognize whether the second suction nozzle 15b2 is normal or abnormal, and therefore it is possible to take measures such as replacing the abnormal second suction nozzle 15b2, etc. Therefore, it is possible to suppress a decrease in the product yield in the component mounting apparatus 1.

[0135] Moreover, the component mounting apparatus 1 of the present embodiment further includes a notification unit 34 that notifies an error when the determination unit 25 determines that the second suction nozzle 15b2 is abnormal.

[0136] According to this, since it is possible to notify that the second suction nozzle 15b2 is abnormal, the operator of the component mounting device 1 can recognize that the component mounting device 1 has an abnormal second suction nozzle 15b2. This allows the operator to take measures such as immediately replacing the abnormal second suction nozzle 15b2. This makes it possible to suppress a decrease in the product yield in the component mounting device 1.

[0137] (Other variations) Although the component mounting device and the component mounting method according to the present disclosure have been described based on the above-mentioned embodiments, the present disclosure is not limited to these embodiments. As long as the modifications do not deviate from the spirit of the present disclosure, modifications that are conceivable by those skilled in the art may also be included in the scope of the present disclosure.

[0138] For example, in the component mounting device and the component mounting method according to the above-described embodiment, the determination by the component recognition camera as to whether the component is normal or not, the determination as to whether the tip of the suction nozzle is normal or not, etc. may be performed by a determination unit. In this case, the component recognition camera may output image data obtained by capturing an image of the component and the tip of the suction nozzle to the determination unit.

[0139] Furthermore, each unit included in the component mounting apparatus and the component mounting method according to the above-described embodiments is typically realized as an LSI, which is an integrated circuit. These units may be individually implemented as single chips, or some or all of them may be integrated into a single chip.

[0140] The integrated circuit is not limited to an LSI, but may be realized by a dedicated circuit or a general-purpose processor. A field programmable gate array (FPGA) that can be programmed after the LSI is manufactured, or a reconfigurable processor that can reconfigure the connections and settings of the circuit cells inside the LSI may also be used.

[0141] In each of the above embodiments, each component may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded on a storage medium such as a hard disk or semiconductor memory.

[0142] Furthermore, all the numbers used above are merely examples for the purpose of specifically explaining the present disclosure, and the embodiments of the present disclosure are not limited to the numbers exemplified.

[0143] In addition, the division of functional blocks in the block diagram is an example, and multiple functional blocks may be realized as one functional block, one functional block may be divided into multiple blocks, or some functions may be transferred to another functional block. Furthermore, the functions of multiple functional blocks having similar functions may be processed in parallel or in a time-sharing manner by a single piece of hardware or software.

[0144] In addition, the order in which each step is performed in the flowchart is merely for illustrative purposes and may be other than the above. In addition, some of the steps may be performed simultaneously (in parallel) with other steps.

[0145] In addition, the present disclosure also includes forms obtained by applying various modifications to the above-described embodiments that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present disclosure. [Industrial Applicability]

[0146] The component mounting apparatus and component mounting method of the present disclosure are useful in the field of mounting components onto circuit boards. [Explanation of symbols]

[0147] 1 Component placement device 3. Substrate 11 Part recognition camera (recognition section) 15 Suction nozzle 15a Tip 15b1 First suction nozzle (suction nozzle) 15b2 Second suction nozzle (suction nozzle) 16 Flow sensor (measuring part) 25 Judgment section 34 Notification Department

Claims

1. A component mounting device that mounts components on a board, a mounting head including a plurality of suction nozzles for suctioning the components; a recognition unit that recognizes the component picked up by the suction nozzle of the mounting head; a determination unit that determines whether or not there is a suction nozzle that is not suctioning the component, among the plurality of suction nozzles that the mounting head has, when the mounting head is in a state where the first suction nozzle serves as the suction nozzle and the mounting head passes above the recognition unit, the recognition unit recognizes a tip end of a second suction nozzle serving as the suction nozzle that is not suctioning the component based on a determination result by the determination unit. Parts mounting device.

2. The recognition unit recognizes a suction surface of the second suction nozzle or a length of the second suction nozzle as the tip of the second suction nozzle.

2. The component mounting apparatus according to claim 1.

3. Further comprising a measuring unit for measuring the flow rate of air flowing through the suction nozzle, the determining unit determines whether or not there is a suction nozzle that is not suctioning the component based on the flow rate measured by the measuring unit after the suction nozzle has performed a suction operation of the component.

3. The component mounting device according to claim 1 or 2.

4. When the flow rate measured by the measuring unit after the suction nozzle has performed a suction operation of the component is less than a predetermined value, the recognition unit does not recognize the tip of the suction nozzle.

4. The component mounting apparatus according to claim 3.

5. the second suction nozzle is a suction nozzle that is not used for suctioning components in a specific mounting turn; 2. The component mounting apparatus according to claim 1.

6. the recognition unit recognizes the component under a first illumination condition, and recognizes the tip portion under a second illumination condition different from the first illumination condition.

6. The component mounting device according to claim 1.

7. the determining unit determines whether the second suction nozzle is good or bad based on a recognition result of the tip portion by the recognizing unit.

5. The component mounting device according to claim 3 or 4.

8. a notification unit that notifies an error when the determination unit determines that the second suction nozzle is abnormal, 8. The component mounting apparatus according to claim 7.

9. A component mounting method for mounting a component on a substrate using a component mounting device having a mounting head equipped with a suction nozzle, comprising: a recognition unit recognizing the component picked up by the suction nozzle of the mounting head; a determination unit determining whether or not there is a suction nozzle that is not suctioning the component among the plurality of suction nozzles included in the mounting head; and when the mounting head passes above the recognition unit in a state in which the mounting head is suctioning the component with a first suction nozzle serving as the suction nozzle, the recognition unit recognizes, based on a determination result by the determination unit, a tip portion of a second suction nozzle serving as the suction nozzle that is not suctioning the component. How to install parts.

Images