Stretchable mounting substrate

Abstract

To provide an elastic property mounting substrate with thermal reliability.SOLUTION: An elastic property mounting substrate (100) comprises: an elastic property base material (1); a first elastic property wiring (2) provided onto the elastic property base material; a first electron component (3) that is mounted onto the elastic property base material (1), and is connected to the first elastic property wiring (2); a second elastic property wiring (4) that is provided on the elastic property base material (1); and a first insulation layer (6). The first elastic property wiring (2) includes a component connection part (5) connected to the first electron component (3). One part of the second elastic property wiring (4) is overlapped with the first electron component (3) or the component connection part (5) in view of a thickness direction of the elastic property base material (1).SELECTED DRAWING: Figure 2B

Description

[Technical Field]

[0001] The present invention relates to a stretchable mounting substrate. [Background technology]

[0002] Conventionally, stretchable mounting substrates in which electronic components connected to stretchable wiring are mounted on a stretchable substrate have been widely known. For example, a substrate described in Patent Document 1 includes stretchable wiring formed on a stretchable substrate and electronic components mounted on the stretchable substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6518451 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, stretchable mounting substrates mounted with electronic components that generate heat during use have come into use. In such mounting substrates, it is necessary to dissipate the heat generated by the electronic components in order to improve the thermal reliability of the mounting substrate. However, with the structure described in Patent Document 1, heat transfer becomes difficult when the stretchable wiring and the electronic components reach a state of thermal equilibrium, and there is a risk that sufficient heat dissipation cannot be achieved relative to the amount of heat generated by the electronic components. This tendency is particularly pronounced when the electronic components have a covering. [Means for solving the problem]

[0005] The present invention provides a stretchable mounting substrate comprising a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring, and a stretchable heat dissipation member provided on the stretchable substrate, wherein the first stretchable wiring has a component connection part connected to the first electronic component, and the stretchable heat dissipation member has a part overlapping with the electronic component or the component connection part when viewed in the thickness direction of the stretchable substrate.

[0006] The present invention also provides a stretchable mounting substrate comprising: a stretchable substrate; a first stretchable wiring provided on the stretchable substrate; a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; a stretchable heat dissipation member provided on the stretchable substrate; and a sealing layer that seals the first electronic component, wherein the first stretchable wiring has a component connection part that is connected to the first electronic component, and at least a portion of the stretchable heat dissipation member overlaps with the sealing layer when viewed in the thickness direction of the stretchable substrate. [Effects of the Invention]

[0007] The stretchable mounting board according to one aspect of the present invention can provide a sufficient heat dissipation effect for electronic components, and therefore can provide a stretchable mounting board with high thermal reliability. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a top view of the stretchable mounting substrate according to the first embodiment. [Figure 2A] FIG. 2A is a partial top view of a stretchable mounting substrate according to the first embodiment. [Figure 2B] FIG. 2B is a partial cross-sectional view (cross-sectional view along line AA in the top view) of the stretchable mounting substrate according to the first embodiment. [Figure 3A] FIG. 3A is a partial top view of a stretchable mounting substrate according to a first modified example of the first embodiment. [Figure 3B] FIG. 3B is a partial cross-sectional view (cross-sectional view along line BB in the top view) of a stretchable mounting board according to a first modified example of the first embodiment. [Figure 4A] FIG. 4A is a partial top view of a stretchable mounting substrate according to a second modified example of the first embodiment. [Figure 4B] FIG. 4B is a partial cross-sectional view (cross-sectional view taken along line CC in the top view) of a stretchable mounting board according to a second modified example of the first embodiment. [Figure 5A] FIG. 5A is a partial top view of a stretchable mounting substrate according to a third modified example of the first embodiment. [Figure 5B]FIG. 5B is a partial cross-sectional view (cross-sectional view taken along line DD in the top view) of a stretchable mounting board according to a third modified example of the first embodiment. [Figure 6A] FIG. 6A is a partial top view of a stretchable mounting substrate according to a fourth modified example of the first embodiment. [Figure 6B] FIG. 6B is a partial cross-sectional view (cross-sectional view taken along line EE in the top view) of a stretchable mounting board according to a fourth modified example of the first embodiment. [Figure 7] FIG. 7 is a partial top view of a stretchable mounting substrate according to a fifth modified example of the first embodiment. [Figure 8] FIG. 8 is a partial top view of a stretchable mounting substrate according to a sixth modified example of the first embodiment. [Figure 9] FIG. 9 is a partial cross-sectional view of the stretchable mounting substrate according to the second embodiment. [Figure 10A] FIG. 10A is a partial top view of a stretchable mounting substrate according to a third embodiment. [Figure 10B] FIG. 10B is a partial cross-sectional view (cross-sectional view taken along line FF in the top view) of the stretchable mounting board according to the third embodiment. [Figure 11] FIG. 11 is a partial top view of a stretchable mounting substrate according to a first modified example of the third embodiment. [Figure 12A] FIG. 12A is a partial top view of a stretchable mounting substrate according to a fourth embodiment. [Figure 12B] FIG. 12B is a partial cross-sectional view (cross-sectional view taken along line GG in the top view) of the stretchable mounting board according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component arrangements, and connection configurations shown in the following embodiments are merely examples and are not intended to limit the present invention. Components in the following embodiments that are not recited in independent claims are described as optional components. Furthermore, the size and size ratios of components shown in the drawings are not necessarily strict. Furthermore, in each figure, substantially identical components are assigned the same reference numerals, and redundant descriptions may be omitted or simplified. Each embodiment is an example, and partial substitution or combination of components shown in a different embodiment is possible. Each embodiment will mainly describe the differences from previous descriptions of that embodiment.

[0010] [First embodiment] The structure of a stretchable mounting board 100 in which electronic components are mounted on a stretchable substrate will be described with reference to FIGS. 1, 2A, and 2B. As shown in FIG. 1, the stretchable mounting board 100 has a shape including a rectangular main portion on the left side and a convex secondary portion on the right side in a plan view. The shape of the stretchable mounting board 100 is not limited to that shown in FIG. 1 and may be, for example, circular or rectangular. Also, in FIG. 1, the expected stretch direction when the stretchable mounting board 100 is used is indicated by a double-headed arrow X. Note that this stretch direction arrow does not mean that the stretchable mounting board 100 will stretch only in this direction; the stretchable mounting board 100 may stretch in other directions. Also, in FIG. 2B, the area where the first electronic component 3 or the component connection portion 5 is arranged is indicated by a mounting area Z indicated by a double-headed arrow. Note that the mounting area Z indicated by a double-headed arrow is merely an example and may be of any size. This stretchable mounting substrate 100 is attached to a curved surface of a living body such as the human body with its upper or lower main surface as the attachment surface, and is used as a thin and stretchable wearable device.

[0011] The stretchable mounting substrate 100 shown in FIGS. 1, 2A, and 2B comprises a stretchable substrate 1, a first stretchable wiring 2 provided on the stretchable substrate 1, a first electronic component 3 mounted on the stretchable substrate 1 and connected to the first stretchable wiring 2, a second stretchable wiring 4 provided on the stretchable substrate 1, and a first insulating layer 6 provided on the stretchable substrate 1. The first stretchable wiring 2 has a component connection part 5 connected to the first electronic component 3, and a part of the second stretchable wiring 4 overlaps with the first electronic component 3 or the component connection part 5 in a plan view, that is, when viewed in the thickness direction of the stretchable substrate 1. Note that, for convenience, in the top view of FIG. 1 and the top view of FIG. 2A, the first stretchable wiring 2, the second stretchable wiring 4, the first insulating layer 6, and the bonding part 10 are indicated by hatching. This also applies to the following top views.

[0012] The second elastic wire 4 corresponds to the elastic heat dissipation member in the present disclosure.

[0013] With the above-described configuration, the portion of the second stretchable wiring 4 that overlaps with the first electronic component 3 and the component connection portion 5 when viewed in the thickness direction of the stretchable substrate 1 functions as a heat absorption portion. The heat absorbed by the heat absorption portion spreads throughout the entire second stretchable wiring 4. That is, the heat generated from the first electronic component 3 can be absorbed by the heat absorption portion and released via the second stretchable wiring 4 that extends in a direction away from the first electronic component 3. Therefore, with the above-described configuration, it is possible to provide a stretchable mounting board with high thermal reliability.

[0014] In this specification, thermal reliability refers to the rate of malfunction or failure due to heat generation during use of electronic components. In other words, the higher the thermal reliability, the lower the possibility of malfunction or failure occurring in a stretchable mounting substrate including electronic components, and the lower the thermal reliability, the higher the possibility of malfunction or failure occurring.

[0015] The stretchable substrate 1 is a sheet- or film-like stretchable substrate, and is made of, for example, a stretchable resin material. Examples of resin materials include thermoplastic polyurethane. The thickness of the stretchable substrate 1 is not particularly limited, but from the viewpoint of not inhibiting the stretching of the surface of the living body when attached to the living body, it is preferably 1 mm or less, more preferably 100 μm or less, and even more preferably 1 μm or less. Furthermore, the thickness of the stretchable substrate 1 is preferably 0.1 μm or more.

[0016] The first stretchable wiring 2 refers to the stretchable wiring that is directly connected to the first electronic component 3 among the stretchable wirings routed in a predetermined pattern on the main surface of the stretchable substrate 1 and the main surface of the first insulating layer 6. The first stretchable wiring 2 contains conductive particles and a resin. For example, a mixture of metal powder such as Ag, Cu, or Ni as the conductive particles and an elastomer resin such as a silicone resin can be used. The average particle size of the conductive particles is not particularly limited, but is preferably 0.01 μm or more and 10 μm or less. Furthermore, the conductive particles are preferably spherical in shape.

[0017] The thickness of the first stretchable wire 2 is not particularly limited, but is preferably 100 μm or less, and more preferably 50 μm or less. Furthermore, the thickness of the first stretchable wire 2 is preferably 0.01 μm or more. The line width of the first stretchable wire 2 is not particularly limited, but is preferably 0.1 μm or more, and more preferably 10 mm or less. Furthermore, the number of stretchable wires included in the first stretchable wire 2 is not particularly limited.

[0018] The first electronic component 3 is mounted on the stretchable substrate 1. Examples of the first electronic component 3 include an acceleration sensor and a temperature sensor. The first electronic component 3 is not particularly limited, and may be an amplifier (an operational amplifier, a transistor, etc.), a chip capacitor, a chip resistor, an LED, a semiconductor IC, a chip inductor, etc. The first electronic component 3 has an external electrode 13, and the external electrode 13 is electrically connected to the component connection portion 5 of the first stretchable wiring 2 via a joint portion 10. From the viewpoint of being able to significantly improve the thermal reliability of the electronic component, and therefore the thermal reliability of the stretchable mounting substrate 100, the first electronic component 3 is preferably a heat-generating electronic component such as an active element, but may also be a passive element.

[0019] The first electronic component 3 is connected to the first stretchable wiring 2 via a joint 10. Examples of materials that form the joint 10 include solder and conductive adhesive, but the materials do not have to be the above. The joint 10 is a so-called fillet, and is not limited to the shape shown in FIG. 1, and may be, for example, semicircular. Furthermore, the arrangement of the first electronic component 3 is not limited to the arrangement shown in FIG. 1, and it may be arranged anywhere on the stretchable substrate 1.

[0020] The second stretchable wiring 4 is routed in a predetermined pattern on the main surface of the stretchable substrate 1 and contains conductive particles and resin. For example, a mixture of metal powder such as Ag, Cu, or Ni as conductive particles and an elastomer resin such as silicone resin can be used. The average particle size of the conductive particles is not particularly limited, but is preferably 0.01 μm or more and 10 μm or less. Furthermore, the conductive particles are preferably spherical.

[0021] The thickness of the second stretchable wiring 4 is not particularly limited, but is preferably 100 μm or less, and more preferably 50 μm or less. Furthermore, the thickness of the second stretchable wiring 4 is preferably 0.01 μm or more. The line width of the second stretchable wiring 4 is not particularly limited, but is preferably 0.1 μm or more, and more preferably 10 mm or less. Furthermore, the number of stretchable wirings included in the second stretchable wiring 4 is not particularly limited. The second stretchable wiring 4 is not directly electrically connected to the first electronic component 3.

[0022] The first stretchable wiring 2 and the second stretchable wiring 4 may each contain conductive particles of the same average particle size, or may contain different conductive particles. Similarly, the width and thickness of the stretchable wiring may each have the same value or may be different. It is preferable that the line width of the second stretchable wiring 4 is thicker than that of the first stretchable wiring 2, as this can improve heat dissipation properties.

[0023] The stretchable heat dissipation member in the present disclosure is not limited to stretchable wiring, and may be, for example, a patterned stretchable heat dissipation pattern. In other words, it may be a pattern that is not connected to an electronic component or wiring and has a function specialized for heat dissipation. The shape of stretchable heat dissipation members other than stretchable wiring is also not particularly limited, as long as a portion of them overlaps with the first electronic component or the component connection portion when viewed in the thickness direction of the stretchable substrate.

[0024] Furthermore, the first stretchable wiring 2 and the second stretchable wiring 4 may be connected in a region that does not overlap with the first electronic component 3 and the component connection portion 5 when viewed in the thickness direction of the stretchable substrate 1. The first stretchable wiring 2 and the second stretchable wiring 4 are stretched in the same direction so as to be parallel to and overlap with each other at least in the vicinity of the first electronic component 3, and heat can be transferred efficiently from the first stretchable wiring 2 to the second stretchable wiring 4.

[0025] The component connection part 5 is a part that functions as a land or pad for mounting electronic components, and refers to a part of the first stretchable wiring 2 that overlaps with the joint part 10 when viewed from the thickness direction of the stretchable substrate 1. The joint part 10 may include a region that does not overlap with the first stretchable wiring 2 when viewed from the thickness direction of the stretchable substrate 1, or the entire joint part 10 may overlap with the first stretchable wiring 2.

[0026] The first insulating layer 6 is preferably made of a resin material or a mixture of a resin material and an inorganic material, and examples of the resin material include urethane-based, styrene-based, olefin-based, silicone-based, fluorine-based, nitrile rubber, latex rubber, vinyl chloride, ester-based, amide-based, and other elastomer-based resins, epoxy, phenolic, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins.

[0027] In the thickness direction of the stretchable substrate 1, a first insulating layer 6 is disposed between the first electronic component 3 and the second stretchable wiring 4. By disposing the first insulating layer 6 in this manner, efficient heat dissipation from the first electronic component 3 to the second stretchable wiring 4 becomes possible. Note that, as shown in FIG. 1, the first insulating layer 6 may be disposed only in the region where the first stretchable wiring 2 and the second stretchable wiring 4 overlap, or may be disposed so as to overlap the entire substrate.

[0028] The closer the distance between the first electronic component 3 and the second stretchable wire 4, the more efficiently the second stretchable wire 4 can absorb heat generated from the first electronic component 3. However, if the distance between the first electronic component 3 and the second stretchable wire 4 is short in the thickness direction of the stretchable substrate 1, the possibility of a short circuit due to contact between the two increases. By disposing a first insulating layer 6 between the first stretchable wire 2 and the second stretchable wire 4 as shown in Figures 2A and 2B, the distance between the first electronic component 3 and the second stretchable wire 4 can be made sufficiently short while reducing the possibility of a short circuit. Therefore, the second stretchable wire 4 can efficiently absorb heat generated from the first electronic component 3.

[0029] As shown in Figures 2A and 2B, the stretchable mounting board 100 according to the first embodiment has a second stretchable wiring 4 provided on a stretchable substrate 1, and a component connection section 5 provided above the second stretchable wiring 4 via a first insulating layer 6. By using the above configuration, it is possible to provide a stretchable mounting board with high thermal reliability. Note that the up-down direction in this specification is defined as the stretchable substrate 1 in Figures 2A and 2B being the "lower side" and the first electronic component 3 being the "upper side," but this does not have to match the actual up-down direction during use.

[0030] The above effects will be explained in more detail. It is generally known that the resistance of a stretchable wire increases and the thermal conductivity decreases when the wire is stretched. In other words, the heat dissipation performance of the first stretchable wire 2 and the second stretchable wire 4 decreases when the wire is stretched. Therefore, when the stretchable mounting substrate 100 undergoes deformation such as stretching or bending, it is preferable that the first stretchable wire 2 and the second stretchable wire 4 do not stretch uniformly. For this reason, it is preferable that the first stretchable wire 2 and the component connection section 5, and the second stretchable wire 4 are provided in different layers in the vicinity of the electronic component.

[0031] By configuring the first stretchable wiring 2 and the second stretchable wiring 4 so that they do not stretch uniformly, even when the thermal conductivity of one stretchable wiring decreases, the decrease in the thermal conductivity of the other stretchable wiring can be suppressed, thereby providing a stretchable mounting substrate with higher thermal reliability.

[0032] The component connection section 5 and the second stretchable wire 4 are provided at different distances from the stretchable base material. This prevents the first stretchable wire 2 and the second stretchable wire 4 from stretching uniformly when the stretchable mounting board 100 is flexed or bent. Therefore, even when the stretchable mounting board 100 is flexed, heat can be sufficiently dissipated from the vicinity of the first electronic component 3.

[0033] As shown in FIG. 1, the first stretchable wiring 2 and the second stretchable wiring 4 are connected to a connector 12. That is, the stretchable wiring board 11 can be connected to another device via the connector 12. Furthermore, the first stretchable wiring 2 is connected to an electronic component 11A that is different from the first electronic component 3, and the second stretchable wiring 4 is connected to an electronic component 11B. When the first stretchable wiring 2 is connected to a plurality of electronic components, a stretchable heat-dissipating member may be disposed on each of the plurality of electronic components, or, as shown in FIG. 1, a stretchable heat-dissipating member may be disposed only on the first electronic component 3. When a plurality of stretchable heat-dissipating members are disposed, the respective stretchable heat-dissipating members may be different members or the same member. When the same heat-dissipating member is used, the members may be formed integrally or separately.

[0034] The first stretchable wiring 2 and the second stretchable wiring 4 are not limited to the arrangement shown in FIG. 1, and may be arranged in any manner on the stretchable substrate 11. Furthermore, there is no particular limitation on the number of each. Furthermore, there is no particular limitation on the type of the other electronic component 11, and it may be the same as or different from the first electronic component 3. Furthermore, there is no particular limitation on the number of electronic components 11. There is no particular limitation on the arrangement position and number of connectors 12. The electronic components 11A, 11B and the connector 12 are not essential components of the present disclosure.

[0035] [First Modification of the First Embodiment] A first modified example of the first embodiment will be described with reference to Figures 3A and 3B. A stretchable mounting board 100A according to the first modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wire 2 and the second stretchable wire 4. As shown in Figure 3A, in a region overlapping with the first electronic component 3 in a plan view, the extension direction (Y direction) of the first stretchable wire 2 and the extension direction (X direction) of the second stretchable wire 4 intersect.

[0036] By using the above configuration, it is possible to suppress a decrease in heat dissipation performance when the stretchable mounting substrate 100A expands or contracts. Specifically, when the stretchable mounting substrate 100A expands or contracts in the direction of the double-headed arrow Y shown in Fig. 3A, the resistance of the first stretchable wiring 2 increases and the thermal conductivity decreases due to the expansion or contraction. In other words, there is a risk that the heat dissipation performance will decrease.

[0037] However, since the second stretchable wire 4 extends in the Y direction, that is, in a direction perpendicular to the first stretchable wire 2 when viewed from the first electronic component 3, the amount of expansion and contraction in the Y direction is smaller than that of the first stretchable wire 2. In other words, a decrease in thermal conductivity is also suppressed, and therefore a state with high thermal reliability can be maintained even when the stretchable mounting board 100A expands and contracts.

[0038] Similarly, when the stretchable mounting substrate 100A stretches in a direction (Y direction) parallel to the extension direction of the second stretchable wire 4, the thermal conductivity of the second stretchable wire 4 decreases, but it is possible to suppress the decrease in the thermal conductivity of the first stretchable wire 2. That is, the extension direction of the first stretchable wire and the extension direction of the second stretchable wire intersect at least near the first electronic component, so that the stretchable mounting substrate 100A can maintain a state with high thermal reliability regardless of the direction in which it stretches. Note that "near the electronic component" refers to a region that is 1 mm or less away from the electronic component in a planar view.

[0039] The second stretchable wire 4 has an intersection with the extension direction of the first stretchable wire 2 when viewed from the thickness direction of the stretchable substrate 1, and it is more preferable that the intersection overlaps with the first electronic component 3 or the joint 10 when viewed from the thickness direction of the stretchable substrate 1. By arranging the second stretchable wire 4 in this way, it is possible to further improve the thermal reliability of the stretchable mounting board 100A.

[0040] The first stretchable wire 2 and the second stretchable wire 4 do not have to extend in one direction over the entire length of the wires. Specifically, as shown in FIGS. 3A and 3B , the first stretchable wire 2 may have a region that extends in a direction perpendicular to the extension direction of the second stretchable wire 4, and a region that extends parallel to the second stretchable wire 4. In such a case, since the extension direction in the region close to the first electronic component 3 has a large influence, it is sufficient that the extension direction in the first stretchable wire 2 near the component connection part 5 and the extension direction of the second stretchable wire 4 intersect. Furthermore, the second stretchable wire 4 may have a region that branches out and extends in multiple directions. In this case as well, since the extension direction in the region close to the first electronic component 3 has a large influence, it is sufficient that the extension direction in the first stretchable wire 2 near the component connection part 5 and the extension direction of the second stretchable wire 4 intersect.

[0041] The extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4 are not limited to the arrangements shown in Figures 3A and 3B. As mentioned above, if the extension direction of each wire is different, the decrease in thermal conductivity for a specific stretch direction will be different. For example, if a stretchable mounting substrate stretches in the X direction, the thermal conductivity of the wires extending in the X direction will decrease significantly, while the decrease in thermal conductivity of the wires extending in the Y direction will be small. In other words, the larger the angle between the stretch direction of the stretchable mounting substrate and the extension direction of the wires, the more suppressed the decrease in thermal conductivity. Note that the "angle" in this specification refers to the smaller of the two angles formed at the intersection. In other words, it is a maximum of 90 degrees.

[0042] Therefore, when the first stretchable wire 2 and the second stretchable wire 4 intersect, the decrease in the thermal conductivity of the second stretchable wire 4 is suppressed in response to stretching that significantly reduces the thermal conductivity of the first stretchable wire 2. At this time, the larger the angle between the first stretchable wire 2 and the second stretchable wire 4, the more the decrease in the thermal conductivity of the second stretchable wire 4 is suppressed. In response to stretching that significantly reduces the thermal conductivity of the second stretchable wire 4, the decrease in the thermal conductivity of the first stretchable wire 2 is suppressed. That is, by arranging the extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4 so that they intersect at least in the vicinity of the first electronic component 3, and more specifically by arranging them so that they intersect in a region that overlaps with the first electronic component 3 in a planar view, it is possible to suppress the decrease in thermal conductivity regardless of the direction in which the stretchable mounting substrate 100A expands and contracts. Furthermore, the larger the angle formed by the extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4, the more preferable, and it is more preferable that they are perpendicular.

[0043] Furthermore, when a plurality of second stretchable wires 4 are provided, the extension directions of the respective second stretchable wires 4 may be different. By arranging the second stretchable wires 4 in this manner, it is possible to suppress a decrease in the thermal conductivity of the entire second stretchable wire 4. When stretching in all directions is expected, by having the extension directions of the plurality of second stretchable wires 4 differ from one another, it is possible to suppress a decrease in the thermal conductivity of the second stretchable wire 4 when stretched in a specific direction. On the other hand, when a single expected stretching direction is determined, it is effective to arrange the plurality of second stretchable wires 4 so that they are perpendicular to that direction. Because it is possible to significantly suppress a decrease in the thermal conductivity of the second stretchable wire 4 in a specific stretching direction, it is possible to provide a stretchable mounting substrate 100A with higher thermal reliability.

[0044] [Second Modification of the First Embodiment] A second modified example of the first embodiment will be described with reference to Figures 4A and 4B. A stretchable mounting board 100B according to the second modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wire 2 and the second stretchable wire 4. Specifically, as shown in Figures 4A and 4B, in the thickness direction of the stretchable base material 1, the second stretchable wire 4 is arranged above the electronic component.

[0045] That is, similar to the first embodiment, the component connection section 5 and the second stretchable wire 4 are provided at different distances from the stretchable substrate 1. By arranging them in this manner, as described above, even when the stretchable mounting board 100B is bent, heat can be sufficiently dissipated from the vicinity of the first electronic component 3. Furthermore, this arrangement is suitable when using electronic components that require high heat dissipation, because the first stretchable wire 2 is responsible for heat dissipation from the lower surface side of the first electronic component 3, and the second stretchable wire 4 is responsible for heat dissipation from the upper surface side.

[0046] It should be noted that the stretchable mounting board 100B is not limited to the arrangement shown in Figures 4A and 4B. In Figures 4A and 4B, the second stretchable wiring 4 is arranged so as to overlap the first electronic component 3 when viewed in the thickness direction of the stretchable substrate 1, but it may also be arranged so as to overlap the joint 10. Furthermore, the number and extension direction of the second stretchable wiring 4 are not limited.

[0047] [Third Modification of the First Embodiment] A third modified example of the first embodiment will be described with reference to Figures 5A and 5B. A stretchable mounting board 100C according to the third modified example of the first embodiment differs from the first embodiment in the configuration of the first stretchable wire 2. Specifically, as shown in Figures 5A and 5B, the numbers of first stretchable wires 2 and second stretchable wires 4 in the vicinity of the first electronic component 3 are different.

[0048] 5A and 5B, the first stretchable wire 2 is composed of three stretchable wires connected to the first electronic component 3A, and the second stretchable wire 4 is composed of two stretchable wires. That is, the wiring density of the first stretchable wire 2 provided on the upper side of the first insulating layer 6 is greater than the wiring density of the second stretchable wire 4 provided on the lower side of the first insulating layer 6.

[0049] It is assumed that the stretchable mounting substrate 100C will be used by bending it so that the second stretchable wiring 4 is on the inside and the first stretchable wiring 2 is on the outside, for example. If the stretchable substrate 1 is made of a material of uniform thickness, the amount of stretch increases the further from the center of bending in the thickness direction of the stretchable substrate 1 when bent. In other words, there will be parts where the amount of stretch varies, and these parts may become the starting point of breakage. With the above configuration, in the stretchable mounting substrate 100C, parts farther from the stretchable substrate 1 are less likely to stretch, so the amount of stretch when bent approaches uniformity. Therefore, breakage when bent can be suppressed.

[0050] In this specification, the magnitude of the wiring density can be compared by the magnitude of the wiring cross-sectional area in a specific region. That is, saying that the wiring density of the first stretchable wiring 2 provided on the upper side of the first insulating layer 6 is greater than the wiring density of the second stretchable wiring 4 provided on the lower side of the first insulating layer 6 can be rephrased as saying that the cross-sectional area of ​​the first stretchable wiring 2 is greater than the cross-sectional area of ​​the second stretchable wiring 4. As shown in this example, when there are a plurality of first stretchable wirings 2 and second stretchable wirings 4, the totals of their cross-sectional areas are to be compared.

[0051] The number of first stretchable wires 2 and the number of second stretchable wires 4 may be the same. In that case, the cross-sectional area can be changed by changing the width or thickness of each stretchable wire. The above methods may be combined to change the cross-sectional area. Furthermore, since the ease of stretching the wire is determined by the total cross-sectional area, there are no particular limitations on the size relationship between the cross-sectional area and the number of each stretchable wire included in the first stretchable wire 2 and the second stretchable wire 4.

[0052] Furthermore, the cross-sectional areas of the respective stretchable wires included in the first stretchable wire 2 may be the same or different. The same applies to the second stretchable wire 4. Furthermore, when viewed in the thickness direction of the stretchable substrate 1, the first stretchable wire 2 and the second stretchable wire 4 are not limited to the arrangements shown in Figures 5A and 5B, and they may be partially overlapping or completely overlapping.

[0053] Furthermore, the cross-sectional area of ​​the stretchable wire refers to any cross section perpendicular to the extension direction of the stretchable wire. As shown in Figures 2A and 2B, it is preferable to compare the cross-sectional areas of the region where the first stretchable wire 2 and the second stretchable wire 4 overlap in the thickness direction of the stretchable substrate 1, but if the first stretchable wire 2 and the second stretchable wire 4 do not overlap, it is preferable to compare in a region near the electronic component. Note that, as in Figures 5A and 5B, if the specific cross section is a cross section perpendicular to the extension direction of the stretchable wires included in the first stretchable wire 2 and the second stretchable wire 4, it is more preferable to compare that portion.

[0054] Furthermore, the extension directions of the respective stretchable wires included in the first stretchable wire 2 may be different. In that case, the totals of the cross-sectional areas perpendicular to the respective extension directions are compared. The same applies to the second stretchable wire 4. Furthermore, it is preferable that the extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4 are parallel to each other at least in the vicinity of the first electronic component 3.

[0055] As described above, when the stretchable substrate 1 is bent so that the second stretchable wiring 4 is on the inside and the first stretchable wiring 2 is on the outside, by arranging the first stretchable wiring 2 and the second stretchable wiring 4 so that they are parallel and so that the wiring density of the first stretchable wiring 2 that is farther from the stretchable substrate 1 is higher than the wiring density of the second stretchable wiring 4 that is closer to the stretchable substrate 1, the amount of stretch near the electronic component can be made closer to uniform when bending in that direction.

[0056] As in the first modified example of the first embodiment, the first stretchable wire 2 and the second stretchable wire 4 may each have regions with different stretching directions.

[0057] Furthermore, as shown in FIGS. 5A and 5B , when a second stretchable wiring 4 is provided on a stretchable substrate 1 and a component connection section 5 is provided above the second stretchable wiring 4 via a first insulating layer 6, it is preferable to select the function of each wiring so that the current density of the first stretchable wiring 2 is greater than the current density of the second stretchable wiring 4. The current density of a stretchable wiring is the value obtained by dividing the current flowing through the stretchable wiring by the cross-sectional area of ​​the stretchable wiring. In other words, the higher the current density, the more heat the stretchable wiring will generate. With this configuration, heat transfer is easier in the second stretchable wiring 4 than in the first stretchable wiring 2, and heat dissipation from the first electronic component 3 to the second stretchable wiring 4 can be performed more efficiently.

[0058] [Fourth Modification of the First Embodiment] 6A and 6B, a fourth modified example of the first embodiment will be described. A stretchable mounting board 100D according to the fourth modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wiring 4. Specifically, when viewed in the thickness direction of the stretchable substrate 1, the second stretchable wiring 4 does not overlap the first electronic component 3, but overlaps the component connection portion 5.

[0059] As mentioned above, the closer the distance between the second stretchable wiring 4 and the first electronic component 3, the more efficiently heat can be dissipated from the first electronic component 3. Therefore, from the viewpoint of heat dissipation, it is preferable that the area of ​​the stretchable heat dissipation member in the vicinity of the first electronic component 3 is large, and it is more preferable that the stretchable heat dissipation member overlaps the entire first electronic component 3 when viewed in the thickness direction of the stretchable substrate 1. However, increasing the area of ​​the stretchable heat dissipation member will reduce the stretchability of the stretchable mounting board 100D.

[0060] That is, in order to improve the heat dissipation performance from the first electronic component 3 while suppressing a decrease in the stretchability of the stretchable mounting board 100D, it is preferable to arrange the second stretchable wiring 4 so that the portion of the first electronic component 3 from which heat dissipation is most desired overlaps with the second stretchable wiring 4 when viewed in the thickness direction of the stretchable substrate 1. By arranging them as shown in Figures 6A and 6B, heat can be efficiently dissipated from the region of the first electronic component 3 that is close to the component connection portion 5.

[0061] The second stretchable wire 4 is not limited to being arranged as shown in Figures 6A and 6B. In Figures 6A and 6B, the second stretchable wire 4 is arranged so as to overlap all of the component connection parts 5 when viewed in the thickness direction of the stretchable substrate 1, but it is sufficient that it overlaps with at least one component connection part 5. Furthermore, the extension direction of the second stretchable wire 4 does not have to be perpendicular to the extension direction of the first stretchable wire 2 as in Figures 6A and 6B.

[0062] [Fifth Modification of the First Embodiment] A fifth modified example of the first embodiment will be described with reference to Fig. 7. A stretchable mounting board 100E according to the fifth modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wiring 4. Specifically, when viewed in the thickness direction of the stretchable substrate 1, the second stretchable wiring 4 does not overlap the component connection portion 5, but overlaps the first electronic component 3.

[0063] As described above, the closer the distance between the first electronic component 3 and the second stretchable wiring 4, the more efficient the heat dissipation. By arranging the second stretchable wiring 4 as described above, heat can be efficiently dissipated from the center of the first electronic component 3. Generally, when an electronic component generates heat, the most heat is often generated from the center of the component. Therefore, by arranging as shown in FIG. 7, heat can be dissipated from the first electronic component 3 more efficiently while suppressing an increase in the area of ​​the second stretchable wiring 4.

[0064] The second stretchable wire 4 is not limited to the arrangement shown in Fig. 7. For example, the second stretchable wire 4 may be arranged so that the extension direction of the second stretchable wire 4 is perpendicular to the extension direction of the first stretchable wire 2. Furthermore, the number of stretchable wires included in the second stretchable wire 4 is not particularly limited.

[0065] [Sixth Modification of the First Embodiment] A sixth modified example of the first embodiment will be described with reference to Fig. 8. A stretchable mounting board 100F according to the sixth modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wire 2 and the second stretchable wire 4. Specifically, the extension direction of the first stretchable wire 2 changes at the boundary of connection with the first electronic component 3, and the extension direction of the second stretchable wire 4 changes in the same way as the first stretchable wire 2. Note that, for clarity, Fig. 8 illustrates only the electrode 13 of the first electronic component 3B that is connected to the first stretchable wire 2.

[0066] 8, the extension direction of the first stretchable wire 2 may be changed on either side of the first electronic component 3B. In other words, the routing direction of the first stretchable wire 2 can be changed to be optimal for the arrangement and shape of the first electronic component. Similarly, the extension direction of the second stretchable wire 4 may be changed so that it coincides with the extension direction of the first stretchable wire 2.

[0067] The sixth modified example of the first embodiment is not limited to the arrangement shown in Fig. 8. For example, the second stretchable wire 4 may extend in one direction near the component. When viewed from the thickness direction of the stretchable substrate 1, the first stretchable wire 2 and the second stretchable wire 4 may be arranged so as to overlap each other.

[0068] 8, when the first stretchable wire 2 stretches in a plurality of directions in the vicinity of the first electronic component 3, the second stretchable wire 4 preferably stretches in a direction different from any of the directions in which the first stretchable wire 2 stretches, in a region that overlaps with the first electronic component 3 or the component connection part 5 when viewed from the thickness direction of the stretchable substrate 1. By arranging them in this manner, when the first stretchable wire 2 stretches in a manner that reduces the thermal conductivity thereof, the reduction in the thermal conductivity of the second stretchable wire 4 can be suppressed.

[0069] [Second embodiment] The second embodiment will be described with reference to Fig. 9. The stretchable mounting substrate 101 according to the second embodiment further includes a second insulating layer 7, compared to the stretchable mounting substrate 100 according to the first embodiment.

[0070] A second insulating layer 7 is further provided between the second stretchable wiring 4 and the stretchable substrate 1 in a region where the second stretchable wiring 4 and the first electronic component or the component connection portion overlap when viewed in the thickness direction of the stretchable substrate 1. By disposing the second insulating layer 7 in this manner, it is possible to reduce the expansion and contraction of the second stretchable wiring 4 when the stretchable mounting board 101 is bent, and to suppress a decrease in the thermal conductivity of the second stretchable wiring 4.

[0071] The second insulating layer 7 is preferably made of a resin material or a mixture of a resin material and an inorganic material, and examples of the resin material include urethane-based, styrene-based, olefin-based, silicone-based, fluorine-based, nitrile rubber, latex rubber, vinyl chloride, ester-based, amide-based and other elastomer-based resins, epoxy, phenolic, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins.

[0072] The second insulating layer 7 may be made of the same material as the first insulating layer 6, or may be made of a different material. Furthermore, when the second insulating layer 7 and the first insulating layer 6 are made of the same material, the two may be integrated.

[0073] When viewed from the thickness direction of the stretchable substrate 1, the second insulating layer 7 is disposed between the second stretchable wiring 4 and the stretchable substrate 1 in a region where the second stretchable wiring 4 and the first electronic component or component connection portion overlap, thereby making it possible to adjust the position of the second stretchable wiring 4 in the thickness direction of the stretchable substrate 1. When the stretchable mounting board 101 bends and vibrates in the vertical direction, there are parts where the displacement is large and parts where the displacement is small depending on the position in the thickness direction. Specifically, the part with the largest displacement corresponds to the antinode of the vibration, and the part with the smallest displacement corresponds to the node of the vibration. In other words, by disposing the second insulating layer 7, it is possible to move the second stretchable wiring 4 closer to the part with the smallest displacement in the thickness direction.

[0074] In this case, the position with the smallest displacement is not limited to simply the center of the thickness, but varies depending on the Young's modulus of each component element, etc. The second insulating layer 7 may be disposed between the entire second stretchable wiring 4 and the stretchable substrate 1. Furthermore, as shown in FIG. 9, a portion of the second insulating layer 7 may be disposed between the stretchable substrate 1 and the first stretchable wiring 2. Furthermore, the second insulating layer 7 may be disposed over the entire stretchable substrate 1.

[0075] [Third embodiment] A third embodiment will be described with reference to Figures 10A and 10B. Compared to the stretchable mounting substrate 100 according to the first embodiment, a stretchable mounting substrate 102 according to the third embodiment further includes a sealing layer 8. Note that in the top view of Figure 10A, the first insulating layer 6 inside the sealing layer 8 is not shown, and the sealing layer 8 is indicated by hatching. As shown in Figure 10B, the first insulating layer 6 may be disposed only inside the sealing layer 8, or may extend outside the sealing layer 8 and cover the entire first stretchable wiring 2.

[0076] The sealing layer 8 seals the first electronic component 3 to protect it from external forces. There are no particular limitations on the material of which the sealing layer 8 is made, and examples include elastomer resins such as polyvinyl chloride, polyethylene, polystyrene, polycarbonate, polyvinylidene fluoride, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenolic resin, epoxy resin, urethane resin, acrylic resin, silicone resin, and styrene-butadiene resin.

[0077] By providing the sealing layer 8, it is possible to protect the first electronic component 3 from external forces, but it also suppresses the diffusion of heat from the vicinity of the component. When providing the sealing layer 8, the second stretchable wire 4 is provided so as to overlap part of the sealing layer 8 in the thickness direction of the stretchable substrate 1, and the second stretchable wire 4 is routed to the outside of the sealing layer 8, thereby making it possible to dissipate heat from the first electronic component 3.

[0078] That is, the stretchable mounting board 102 according to the third embodiment comprises a stretchable substrate 1, a first stretchable wiring 2 provided on the stretchable substrate 1, a first electronic component 3 mounted on the stretchable substrate 1 and connected to the first stretchable wiring 2, a second stretchable wiring 4 provided on the stretchable substrate 1, and a sealing layer 8 that seals the first electronic component 3, wherein the first stretchable wiring 2 has a component connection part 5 that is connected to the first electronic component 3, and a part of the second stretchable wiring 4 overlaps with the sealing layer 8 when viewed in the thickness direction of the stretchable substrate 1. The second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.

[0079] By using the above structure, heat inside the sealing layer 8 moves to the area of ​​the second stretchable wiring 4 that overlaps with the sealing layer 8 when viewed from the thickness direction of the stretchable substrate 1, and is then diffused to the remaining area of ​​the second stretchable wiring 4, i.e., the outer area of ​​the sealing layer 8, thereby allowing the heat trapped inside the sealing layer 8 to escape.

[0080] The size of sealing layer 8 only needs to be larger than first electronic component 3. There are also no particular limitations on the shape, and when viewed in the thickness direction of stretchable substrate 1, it may be rectangular or circular.

[0081] 10A and 10B, a portion of the second stretchable wire 4 is disposed inside the sealing layer 8. By disposing the second stretchable wire 4 inside the sealing layer 8, it is possible to reduce the distance between the first electronic component 3 and the second stretchable wire 4 when viewed from the thickness direction of the stretchable substrate 1. In other words, heat can be dissipated from the sealing layer 8 more efficiently. 10A and 10B, the second stretchable wire 4 is disposed inside the sealing layer 8, and the first stretchable wire 2 is disposed at the interface between the sealing layer 8 and the stretchable substrate 1. In FIG.

[0082] 10A and 10B, and may be disposed below the first stretchable wire 2, for example, as in the first embodiment. Also, the second stretchable wire 4 is preferably disposed in the vicinity of the first electronic component 3. Also, the arrangement of the first electronic component, the first stretchable wire, the second stretchable wire, and the first insulating layer can be similar to that of the first embodiment.

[0083] [First Modification of the Third Embodiment] A first modified example of the third embodiment will be described with reference to Fig. 11. A stretchable mounting board 102A according to the first modified example of the third embodiment differs from the stretchable mounting board 102 according to the third embodiment in the arrangement of the second stretchable wires 4.

[0084] As shown in Fig. 11, the extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4 may be parallel. The second stretchable wire 4 is provided so as to overlap the first electronic component 3 when viewed from the thickness direction of the stretchable substrate 1. Although the first insulating layer 6 is not shown in Fig. 11, similarly to the first embodiment, by disposing the first insulating layer between the first stretchable wire and the second stretchable wire, the first insulating layer 6 can suppress short-circuiting between the first stretchable wire and the second stretchable wire, and therefore the distance between the first electronic component 3 and the second stretchable wire 4 in the thickness direction of the stretchable substrate 1 can be reduced. In other words, heat can be dissipated efficiently.

[0085] The arrangement of the first stretchable wire 2 and the second stretchable wire 4 is not limited to the arrangements shown in Figures 10A and 10B. By adopting the arrangements shown as the respective modified examples of the first embodiment, the above-mentioned effects can be achieved.

[0086] [Fourth embodiment] The fourth embodiment will be described with reference to FIGS. 12A and 12B. The stretchable mounting board 103 according to the fourth embodiment differs from the stretchable mounting board 100 according to the first embodiment in that it includes a second electronic component 9. In the description of FIGS. 12A and 12B, for clarity, different reference numerals are used to denote the respective parts of the first stretchable wire and the second stretchable wire, but this does not indicate that they are different stretchable wires. Specifically, in the descriptions up to the third embodiment, the same reference numerals were used before and after connection to the electronic component, but in the fourth embodiment, different reference numerals will be used for the description. Furthermore, in the descriptions up to the third embodiment, when there were multiple first stretchable wires 2 or second stretchable wires 4, all were used to denote the same reference numeral, but in the fourth embodiment, different reference numerals will be used for the description.

[0087] The stretchable mounting substrate 103 further includes a second electronic component 9. The second electronic component 9 is connected to the second stretchable wiring 4. The second electronic component 9 is sealed by a sealing layer 8. Specific examples of the second electronic component 9 include an acceleration sensor and a temperature sensor. The second electronic component 9 is not particularly limited, and may be an amplifier (an operational amplifier, a transistor, etc.), a chip capacitor, a chip resistor, an LED, a semiconductor IC, a chip inductor, etc. Furthermore, the second electronic component 9 may be the same component as the first electronic components 3B and 3C, or may be different. Furthermore, like the first electronic components 3B and 3C, the second electronic component 9 is preferably an active element, but may also be a passive element.

[0088] As shown in the top view of FIG. 12A , the first stretchable wirings 2A and 2B are connected to the first electronic components 3B and 3C, and the second stretchable wirings 4A, 4B, 4C, and 4D are connected to the second electronic component 9. As shown in the cross-sectional view of FIG. 12B , the second stretchable wirings 4A and 4B function as the stretchable heat-dissipating member of the first electronic component 3B. Similarly, the second stretchable wirings 4C and 4D function as the stretchable heat-dissipating member of the first electronic component 3C. Furthermore, the mounting area of ​​the first electronic component 3B is indicated by Z1, and the mounting area of ​​the first electronic component 3C is indicated by Z2. Note that when a plurality of first electronic components are provided in this manner, a common second stretchable wiring 4 may be disposed for each first electronic component, or a different second stretchable wiring 4 may be provided for each first electronic component. Alternatively, a stretchable heat-dissipating member having a different function, such as a wiring pattern or a heat-dissipating pattern, may be provided for each of the plurality of first electronic components. It goes without saying that a plurality of first electronic components 3 may be provided in embodiments other than the fourth embodiment as well.

[0089] On the other hand, the second electronic component 9 to which the second elastic wire 4 is connected may also generate heat during use. That is, the second electronic component 9 also needs to dissipate heat, but since the second elastic wire 4 corresponds to the first elastic wire 2 in the first electronic components 3B and 3C, there is a risk that heat dissipation will be insufficient.

[0090] 12A and 12B, by arranging the first stretchable wiring 2B in the vicinity of the second electronic component 9, the first stretchable wiring 2B functions as a heat dissipation member for the second electronic component 9. Specifically, as shown in Fig. 12A and 12B, when viewed in the thickness direction of the stretchable substrate 1, a portion of the first stretchable wiring 2B overlaps with the sealing layer 8 that seals the second electronic component 9.

[0091] That is, wiring connected to a certain electronic component can be made to function as a heat dissipation member for other electronic components. There may be a plurality of first electronic components 3 and second electronic components 9, or stretchable wirings other than the first stretchable wiring 2 and the second stretchable wiring 4 may be provided. As shown in FIGS. 12A and 12B, it is preferable that the first electronic component 3 and the second electronic component 9 are sufficiently close to each other. As described above, each stretchable wiring more reliably functions as a heat dissipation member for the electronic component connected to the other. Even if the first electronic components 3B and 3C are far from the second electronic component 9, the current density of the second stretchable wiring 4 can be adjusted by making the second electronic component 9 generate less heat than the first electronic components 3B and 3C. That is, as described above, heat can be dissipated more efficiently from the first electronic components 3B and 3C.

[0092] The fourth embodiment has been described using a combination of the first and third embodiments, but multiple first embodiments may be combined, or multiple second embodiments may be combined. It should be clearly stated that the present invention as described above includes the following aspects. First aspect: A stretchable substrate; A first elastic wiring provided on the elastic base material; A first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; an elastic heat dissipation member provided on the elastic base material, The first elastic wiring has a component connection portion connected to the first electronic component, When viewed in the thickness direction of the stretchable base material, a part of the stretchable heat-dissipating member is overlapping with the child component or the component connection portion; Stretchable mounting substrate. Second aspect: In the thickness direction of the stretchable base material, between the first electronic component and the stretchable heat dissipation member , a first insulating layer is disposed; The stretchable mounting substrate according to the first embodiment. Third aspect: The elastic heat dissipation member is a second elastic wiring. The stretchable mounting substrate according to the first or second aspect. Fourth aspect: The component connection portion and the second elastic wiring are at different distances from the elastic base material. It is provided in the part The stretchable mounting substrate according to the third aspect. Fifth aspect: In the thickness direction of the stretchable base material, between the first electronic component and the stretchable heat dissipation member a first insulating layer is disposed; The second elastic wiring is provided on the elastic base material, and the first insulating layer is interposed between the second elastic wiring and the elastic base material. The component connection portion is provided on the upper side of the second elastic wiring. The stretchable mounting substrate according to the fourth aspect. Sixth aspect: The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is is greater than the wiring density of the second elastic wiring provided below The stretchable mounting substrate according to the fifth aspect. Seventh aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least are parallel in the vicinity of the first electronic component; The stretchable mounting substrate according to any one of the fourth to sixth aspects. Eighth aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least intersect in the vicinity of the first electronic component; The stretchable mounting substrate according to any one of the fourth to sixth aspects. Ninth aspect: When viewed from the thickness direction of the stretchable substrate, the second stretchable wiring and the first electronic component or the In the region where the component connection portion overlaps with the second elastic wiring, a second elastic wiring is provided between the second elastic wiring and the elastic base material. 2 further comprising an insulating layer; The stretchable mounting substrate according to any one of the fourth to eighth aspects. Tenth aspect: Further comprising a second electronic component; The second elastic wiring is connected to the second electronic component. The stretchable mounting substrate according to any one of the fourth to ninth aspects. Eleventh aspect: A stretchable substrate; A first elastic wiring provided on the elastic base material; A first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; an elastic heat dissipation member provided on the elastic base material; a sealing layer that seals the electronic component, The first elastic wiring has a component connection portion that is connected to the electronic component, When viewed in the thickness direction of the stretchable base material, a part of the stretchable heat dissipation member is overlaps with, Stretchable mounting substrate. 12th aspect: A portion of the elastic heat dissipation member is disposed inside the sealing layer. The stretchable mounting substrate according to an eleventh aspect. Thirteenth aspect: In the thickness direction of the stretchable base material, between the first electronic component and the stretchable heat dissipation member , a first insulating layer is disposed; The stretchable mounting substrate according to the eleventh or twelfth aspect. Fourteenth aspect: The elastic heat dissipation member is a second elastic wiring. The stretchable mounting substrate according to any one of the eleventh to thirteenth aspects. Fifteenth aspect: The component connection portion and the second elastic wiring are at different distances from the elastic base material. It is provided in the part The stretchable mounting substrate according to a fourteenth aspect. Sixteenth aspect: In the thickness direction of the stretchable base material, between the first electronic component and the stretchable heat dissipation member a first insulating layer is disposed; The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is is greater than the wiring density of the second elastic wiring provided below The stretchable mounting substrate according to the fourteenth or fifteenth aspect. Seventeenth aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least are parallel in the vicinity of the first electronic component; The stretchable mounting substrate according to the fifteenth or sixteenth aspect. 18th aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least intersect in the vicinity of the first electronic component; The stretchable mounting substrate according to the fifteenth or sixteenth aspect. 19th aspect: When viewed from the thickness direction of the stretchable substrate, the second stretchable wiring and the first electronic component or the In the region where the component connection portion overlaps with the second elastic wiring, a second elastic wiring is provided between the second elastic wiring and the elastic base material. 2 further comprising an insulating layer; The stretchable mounting substrate according to any one of the fifteenth to eighteenth aspects. 20th aspect: Further comprising a second electronic component; The second elastic wiring is connected to the second electronic component. The stretchable mounting substrate according to any one of the fifteenth to nineteenth aspects. [Explanation of symbols]

[0093] 1: Stretchable base material 2, 2A, 2B: 1st elastic wiring 3, 3A, 3B, 3C, 3D: 1st electronic component 4, 4A, 4B, 4C, 4D: 2nd elastic wiring (stretchable heat dissipation member) 5: Part connection 6: First insulating layer 7: Second insulating layer 8: Sealing layer 9: Second electronic component 10: Connection 11A, 11B: Electronic components 12: Connector 100, 100A, 100B, 100C, 100D, 100E, 100F, 101, 102, 102A, 103: Stretchable mounting substrate Z, Z1, Z2: Mounting area

Claims

1. A stretchable substrate; A first elastic wiring provided on the elastic base material; A first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; an elastic heat dissipation member provided on the elastic base material; a sealing layer that seals the electronic component, The first elastic wiring has a component connection portion connected to the electronic component, a portion of the stretchable heat dissipation member overlaps with the sealing layer when viewed in the thickness direction of the stretchable base material; a first insulating layer is disposed between the first electronic component and the stretchable heat dissipation member in the thickness direction of the stretchable base material; Stretchable mounting substrate.

2. A portion of the elastic heat dissipation member is disposed inside the sealing layer. The stretchable mounting substrate according to claim 1 .

3. The elastic heat dissipation member is a second elastic wiring, The stretchable mounting substrate according to claim 1 .

4. The component connection portion and the second elastic wiring are provided at different distances from the elastic base material, The stretchable mounting substrate according to claim 3 .

5. a first insulating layer is disposed between the first electronic component and the stretchable heat dissipation member in a thickness direction of the stretchable base material; The wiring density of the first elastic wire provided on the upper side of the first insulating layer is greater than the wiring density of the second elastic wire provided on the lower side of the first insulating layer, The stretchable mounting substrate according to claim 3 .

6. The extension direction of the first elastic wire and the extension direction of the second elastic wire are parallel to each other at least in the vicinity of the first electronic component. The stretchable mounting substrate according to claim 4 .

7. The extension direction of the first elastic wire and the extension direction of the second elastic wire intersect at least in the vicinity of the first electronic component, The stretchable mounting substrate according to claim 4 .

8. A second insulating layer is further provided between the second stretchable wiring and the stretchable substrate in a region where the second stretchable wiring and the first electronic component or the component connection portion overlap when viewed from the thickness direction of the stretchable substrate, The stretchable mounting substrate according to claim 4 .

9. Further comprising a second electronic component; The second elastic wiring is connected to the second electronic component. The stretchable mounting substrate according to claim 4 .

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