thermistor

Abstract

Provided is a highly reliable chip-type electronic component 10 having little change in electrical characteristics even after undergoing a reliability test involving heating. A chip-type electronic component 10 comprising a ceramic element assembly 20, wherein the volume V of the ceramic element assembly 20 is 0.12 mm3 or less, the ceramic element assembly 20 contains a perovskite compound containing Ti and Ba and also contains at least Si, and the Si content of the ceramic element assembly 20 satisfies formula (1).　Formula (1): 0 mol%<[Si]≤0.62 mol%. In the formula, [Si] represents the Si content (mol%) relative to the total content value 100 mol% for the elements (except for oxygen) contained in the ceramic element assembly.

Description

[Technical Field]

[0001] The present invention relates to a chip-type electronic component, and more particularly to a chip-type electronic component containing semiconductor ceramics. [Background technology]

[0002] Some ceramics are known to exhibit the piezoresistance phenomenon, where the resistance value changes when stress is applied. For example, La 1-X Sr X Ceramics such as MnO3 and BaTiO3 have the property of changing resistance depending on the magnitude of strain and stress (piezoresistive effect) (see, for example, Patent Document 1). Perovskite-type manganese oxide La 1-X Sr X MnO3 exhibits a relatively high piezoresistance effect at room temperature when x = 0.25, and the resistivity changes by 7% when strained at 150 MPa. Also, ceramics such as the semiconductor BaTiO3 exhibit a giant piezoresistance effect. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4611127 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, chip-type electronic components, including ceramic elements, have become increasingly miniaturized. However, as chip-type electronic components become smaller, a phenomenon has become apparent in which the electrical characteristics (e.g., resistance) of chip-type electronic components change when subjected to reliability tests (e.g., weathering tests, thermal shock tests, etc.) that involve heating to 150°C or higher. In particular, in the case of chip-type electronic components using semiconductor ceramics, such as positive temperature coefficient (PTC) thermistors using semiconductor BaTiO3 ceramics, the resistance of the chip-type electronic components changes significantly before and after reliability tests. This has led to a risk of reducing the reliability of the chip-type electronic components.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a highly reliable chip-type electronic component that exhibits minimal change in electrical characteristics even after undergoing a reliability test involving heating. [Means for solving the problem]

[0006] According to one aspect of the present invention, A chip-type electronic component having a ceramic body, The volume V of the ceramic body is 0.12 mm 3 is as follows: the ceramic body contains a perovskite compound containing Ti and Ba, and also contains at least Si; There is provided a chip-type electronic component in which the Si content in the ceramic body satisfies the following formula (1): 0 mol%<[Si]≦0.62 mol% (1) Here, [Si] is the Si content (mol %) relative to 100 mol % of the total content of elements (excluding oxygen) contained in the ceramic body. [Effects of the Invention]

[0007] According to the chip-type electronic component of the present invention, even after undergoing a reliability test involving heating, the change in electrical characteristics is small, and a highly reliable chip-type electronic component can be provided. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic perspective view of a chip-type electronic component according to a first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view of the chip-type electronic component according to the first embodiment. [Figure 3] FIG. 3 is a schematic partially enlarged cross-sectional view showing another form of the chip-type electronic component according to the first embodiment. [Figure 4] FIG. 4(a) is a graph showing the rate of resistance change versus the Si content in the ceramic body, and FIG. 4(b) is a graph showing the rate of resistance change versus the piezo-resistance coefficient of the ceramic body. [Figure 5] FIG. 5 is a graph showing the piezo-resistivity coefficient versus the resistivity of the ceramic body. DETAILED DESCRIPTION OF THE INVENTION

[0009] There is a demand for miniaturization of chip-type electronic components that use semiconducting ceramics, such as positive temperature coefficient (PTC) thermistors. However, when miniaturized, the electrical characteristics of chip-type electronic components can change significantly after being subjected to heat treatment at 150°C or higher during reliability tests. To elucidate this phenomenon, the inventors investigated the changes in electrical properties before and after heat treatment for PTC thermistors of different sizes (1005 mm and 0603 mm) made from the same material. While the rate of change in resistance after heat treatment (referred to as the "resistance change rate") relative to the resistance before heat treatment (initial resistance) was sufficiently small for PTC thermistors, the rate of change in resistance for smaller 0603 mm PTC thermistors was sometimes unacceptably large.

[0010] The inventors of the present invention have therefore conducted extensive research to determine the reason why the resistance change rate of small chip-type electronic components increases when they are heat-treated, and as a result have discovered for the first time that the Si content of the ceramic body affects the resistance change rate of electronic components.

[0011] It was previously unknown that the Si content of a ceramic body could affect the resistance change rate. The inventors conducted a detailed study to determine why this was the case. They discovered that the effect of the Si content on the resistance change rate becomes apparent only when the chip-type electronic component is small. The present inventors have discovered a new problem that arises only in small chip-type electronic components, and have completed the present invention to solve this problem.

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0013] [Embodiment 1] FIG. 1 is a schematic perspective view of a chip-type electronic component 10 (hereinafter sometimes simply referred to as "electronic component 10") according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the electronic component 10. The electronic component 10 includes at least a ceramic body 20. The electronic component 10 may further include external electrodes 30, 40 at the ends of the ceramic body 20.

[0014] (Ceramic body 20) In the compact electronic component 10 according to the present invention, the ceramic body 20 used is also small in size. The volume V of the ceramic body 20 is 0.12 mm 3 The following is the result. In the present invention, the Si content in the ceramic body 20 is controlled to make the volume V 0.12 mm 3 The rate of resistance change after heat treatment can also be suppressed in a small electronic component 10 having a ceramic body 20 with the following small dimensions. The volume V of the ceramic body 20 is preferably 0.001 mm 3 More than 0.12mm 3 The following is the result.

[0015] As shown in FIG. 1, when the ceramic body 20 is a square pillar shape with a length of 20L (mm), a width of 20W (mm), and a thickness of 20T (mm), the volume V (mm 3 ) is calculated as V = 20L x 20W x 20T. The ceramic body 20 preferably has dimensions of a length 20L of 0.6 mm or less, a width 20W of 0.3 mm or less, and a thickness 20T of 0.3 mm or less (that is, 0603 mm or less).

[0016] The ceramic body 20 contains a perovskite compound containing Ti and Ba, and also contains at least Si. The perovskite compound containing Ti and Ba is represented by the general formula BaTiO3. The material that constitutes the ceramic body 20 is a so-called semiconducting ceramic material, and may be referred to as "semiconducting BaTiO3 ceramics" in this specification.

[0017] In electronic component 10 of the present invention, when the total content of elements (excluding oxygen) contained in ceramic body 20 is taken as 100 mol %, the Si content in ceramic body 20 is greater than 0 mol % and not more than 0.62 mol %. In other words, the Si content in ceramic body 20 satisfies the following formula (1): 0 mol%<[Si]≦0.62 mol% (1) Here, [Si] is the content (mol %) of Si relative to 100 mol % of the total content of elements (excluding oxygen) contained in the ceramic body.

[0018] The Si content in the ceramic body 20 is preferably 0.10 mol % or more and 0.50 mol % or less. That is, the Si content in the ceramic body 20 preferably satisfies the following formula (2). 0.10mol%≦[Si]≦0.50mol% (2)

[0019] By controlling the Si content in the ceramic body 20 within the above range, the rate of resistance change before and after a reliability test can be kept small. The reason for this is unclear, but is presumed to be as follows. Note that the present invention is not limited by the presumption described below.

[0020] When subjected to stress, the ceramic body 20 included in the electronic component 10 changes its resistance due to the piezoresistance effect. When the electronic component 10 is reflow-mounted on a mounting board with solder and then subjected to a reliability test (weather resistance test or thermal shock test), the heating during reflow mounting and the heating and cooling during the reliability test cause changes in the state of the mounting board and solder (such as embrittlement, deterioration, deformation, expansion, and contraction). When such changes occur, compressive or tensile stress acts on the ceramic body 20 of the electronic component 10.

[0021] It is estimated that the stress acting on the ceramic body 20 at each stage changes as follows. First, after reflow mounting and before the reliability test, tensile stress acts on the ceramic body 20. During the reliability test, the tensile stress is relaxed and compressive stress acts, so the stress in the tensile direction after the reliability test is lower than before the reliability test. In other words, it can be said that the stress in the compressive direction increases as a result of the reliability test. Note that "stress in the compressive direction increases" includes (a) a case where compressive stress acts on the ceramic body 20 after the reliability test, and the compressive stress increases relatively compared to before the reliability test, and (b) a case where tensile stress acts on the ceramic body 20 after the reliability test, and the tensile stress decreases relatively compared to before the reliability test.

[0022] In order to reduce the change (rate of resistance change) from the initial resistance of the electronic component 10 before the reliability test (when tensile stress acts) to the resistance of the electronic component 10 after the reliability test (when compressive stress increases), it is necessary to reduce the change in resistance of the ceramic body 20 when compressive stress increases. Here, the piezo-resistance coefficient π is used as an index of the change in resistance when compressive stress increases. c Introduce.

[0023] Pressure resistance coefficient π cis the rate of change in resistance of an electronic component per unit stress (compressive stress), and in this specification, it refers to the piezoresistive coefficient in the compressive direction. The "piezoresistive coefficient in the compressive direction" is the piezoresistive coefficient π calculated from the resistance value obtained by measuring the resistance value by passing a current through the electronic component so that the current direction during resistance measurement is parallel to the direction of action of the compressive stress. c When the change in resistance R of the ceramic body 20 in the compression direction due to the application of compressive stress σ (MPa) is denoted as ΔR (Ω), the pressure resistance coefficient π of the ceramic body 20 in the compression direction is c (Ω% / MPa) can be expressed by the following formula (3). π c =ΔR / σ×100 (3)

[0024] In other words, when the x-axis is the compressive stress σ and the y-axis is the resistance R, the compressive stress and the resistance in the compressive direction are in a linear function relationship, and the slope of the graph is the pressure resistance coefficient π in the compressive direction. c This becomes: Based on actual measurement data, the pressure resistance coefficient π c To calculate the coefficient of pressure resistance, measure the resistance R under different compressive stresses σ and obtain three or more data points. Plot the data with the x-axis representing compressive stress and the y-axis representing resistance, and draw a regression line. The slope of the regression line (converted into a percentage) is the pressure resistance coefficient π. c The resistance R measured under conditions of small compressive stress σ (for example, less than 7 MPa) is used as the reference resistance when converting to %.

[0025] Piezoresistive coefficient π of ceramic body 20 c The present inventors have conducted extensive research into the correlation between the piezoelectric coefficient π of the ceramic body 20 and the component composition. c It was found that the Si content in the ceramic body 20 affects the thermal conductivity.

[0026] The Si content is the pressure resistance coefficient π c Although the reason for this effect is unclear, it is speculated that the mechanism is as follows.

[0027] A large number of ceramic particles are present adjacent to each other inside the ceramic body 20. The piezo-resistance coefficient π of the ceramic body 20 c is affected by the resistance at the grain boundaries of ceramic particles (grain boundary resistance). When the grain boundary resistance increases, the piezo-resistivity coefficient π c becomes larger. The grain boundary resistance increases when an insulating layer exists at the grain boundary, and the thicker the insulating layer at the grain boundary, the higher the grain boundary resistance becomes.

[0028] The Si contained in the ceramic body 20 is in the form of SiO2 or a complex oxide with a perovskite compound containing Ti and Ba (for example, BaTiSi z O 3+2z =BaO-TiO2-zSiO2) at the grain boundaries of ceramic particles. As the Si content in the ceramic body 20 increases, the SiO2 layer at the grain boundaries becomes thicker. As a result, the grain boundary resistance increases, and the piezo-resistance coefficient π of the ceramic body 20 decreases. c becomes larger. For this reason, when the Si content in the ceramic body 20 increases, the piezo-resistance coefficient π c is expected to become larger.

[0029] As described above, the piezo-resistance coefficient π of the ceramic body 20 c If the resistance change rate of electronic component 10 is reduced, it is possible to reduce the resistance change rate of electronic component 10 before and after reliability testing. In order to reduce the resistance change rate of electronic component 10 as much as possible, it may be desirable to completely eliminate Si from ceramic body 20. However, since SiO2 is useful as a sintering aid when sintering the ceramic body 20, and Si can be contained in trace amounts in other raw materials, and furthermore, trace amounts can be mixed in as contamination from materials and equipment, it is difficult to completely eliminate Si from the ceramic body 20.

[0030] The inventors have discovered that in order to allow the ceramic body 20 to contain Si while keeping the resistance change rate before and after a reliability test within an acceptable range (10% or less), it is effective to set the Si content to more than 0 mol% and 0.62 mol% or less.

[0031] FIG. 4 shows the relationship between the rate of change in resistance of the electronic component 10 before and after the reliability test, the Si content in the ceramic body 20, and the piezo-resistance coefficient π of the ceramic body 20. c 10 is a graph showing the relationship between The seven data points in the graph were obtained using the measurement samples prepared in Examples 1 to 6 and Comparative Example 1.

[0032] FIG. 4(a) is a graph showing the resistance change rate versus the Si content of the ceramic body 20. The solid line in FIG. 4(a) is a regression line obtained by fitting using the least squares method. The regression equation is the following equation (4), and the coefficient of determination (R 2 value) is 0.90. Resistivity change rate (%) = 11.886 + 3.9103 × Ln[Si] (4) In the formula, [Si] is the content (mol %) of Si relative to the total content (100 mol %) of elements (excluding oxygen) contained in the ceramic body 20 . The dotted line in FIG. 4(a) indicates the range of the 95% confidence interval (equivalent to 2σ) of the regression line (solid line).

[0033] From the graph in FIG. 4(a), it can be seen that the rate of change in resistance before and after the reliability test can be suppressed to 10% or less by setting the Si content to 0.62 mol % or less.

[0034] FIG. 4(b) shows the piezoelectric coefficient π of the ceramic body 20. c The solid line in Figure 4(b) is the regression line obtained by fitting using the least squares method. The regression equation is the following equation (5), and the coefficient of determination (R 2 value) is 0.78. Resistance change rate (%) = 18.685 + 9.0541 × Ln(π c ) (5) π in the formula c is the pressure resistance coefficient (Ω% / MPa), which is calculated using the above formula (3). The dotted line in FIG. 4(b) indicates the range of the 95% confidence interval (equivalent to 2σ) of the regression line (solid line).

[0035] From the graph of FIG. 4(b), the piezo-resistance coefficient π of the ceramic body 20 c It can be seen that by making the resistance change rate before and after the reliability test 10% or less, the resistance change rate before and after the reliability test can be kept 10% or less. That is, FIG. 4(b) shows the relationship between the pressure resistance coefficient π when the ceramic body 20 is compressed. c indicates that it is preferable that the elastic modulus is 0.382 Ω% / MPa or less.

[0036] In addition, the piezoelectric resistance coefficient π of the ceramic body 20 c can also be affected by the resistivity of the ceramic body 20. This is because the grain boundary resistance within the ceramic body 20 increases as the resistivity increases. c The relationship between the resistivity and the surface tension can be seen in Figure 5. FIG. 5 shows the relationship between the resistivity ρ and the piezo-resistivity coefficient π for the ceramic body 20 manufactured from a semiconducting ceramic material having a Si concentration of 0.11 to 0.15 mol %. c 5 is a graph showing the relationship between the resistivity ρ and the piezo-resistivity coefficient π c It can be seen that there is a linear functional relationship between

[0037] As a result of investigations conducted by the present inventors, it was found that electronic components including a ceramic body 20 with a resistivity ρ25 of 2.9 Ωcm or more at 25°C experience a large rate of resistance change when subjected to heat treatment at 150°C or more during reliability testing or the like. However, by controlling the Si content of the ceramic body 20, as in the present invention, it is possible to suppress changes in electrical characteristics. Therefore, the present invention is particularly suitable for electronic components including a ceramic body 20 with a resistivity ρ25 of 2.9 Ωcm or more at 25°C.

[0038] The resistivity ρ25 of the ceramic body 20 can be controlled by the following method. The Ba- and Ti-containing perovskite structure (BaTiO3) contained in ceramic body 20 is an insulator when its composition conforms to the theoretical formula, and has a high resistivity ρ25. However, the resistivity ρ25 can be reduced by introducing oxygen vacancies into the grain boundaries and intragrains within ceramic body 20. The amount of oxygen vacancies at the grain boundaries can be adjusted by adjusting the firing atmosphere, firing temperature, and firing time when ceramic body 20 is fired. Furthermore, the resistivity can be reduced by adding elements other than Ba ​​and Ti to the raw material of the ceramic body 20 .

[0039] In addition to the essential elements Ba, Ti, and Si, the ceramic body 20 may further contain the following optional elements. The ceramic body 20 preferably contains at least one element selected from the group consisting of Ca, Sr, and Pb in a perovskite compound. The ceramic body 20 may contain a rare earth element. The rare earth element preferably contains at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Oxides of these rare earth elements may be added as semiconducting agents during production of the ceramic body 20. The ceramic body 20 preferably contains Mn. When the ceramic body 20 is manufactured, an oxide of Mn (Mn2O3) may be added as a property improver.

[0040] (External electrodes 30, 40) The external electrodes 30 and 40 are provided on at least one end of the ceramic body 20, preferably on both ends. The external electrodes 30, 40 may include first electrode layers 31, 41 covering the end faces 21, 22 of the ceramic body 20, and second electrode layers 33, 43 covering the first electrode layers 31, 41. Furthermore, the external electrodes 30, 40 may include a plating layer covering the second electrode layers 33, 43.

[0041] The first electrode layers 31 and 41 are formed from a metal material that has ohmic contact with the semiconductor BaTiO3 ceramics and can withstand reliability tests. The first electrode layers 31 and 41 can be formed from at least one of a Cr film, a NiCr alloy film, an Al film, an ohmic Ag electrode (containing Ag and Zn), etc.

[0042] The second electrode layers 33, 43 are formed from a material that is electrically conductive with the first electrode layer, protects the first electrode layer, and allows a plating layer to be formed on the surface thereof. The second electrode layers 33, 43 can be formed from at least one of a conductive resin layer, a baked electrode layer, etc. The conductive resin layer is formed from a conductive resin material containing resin and conductive powder. The baked electrode layer is formed by baking a metal paste material containing metal and organic components.

[0043] The plating layer may be formed from a single plating layer, or may have a multi-layer structure made up of a plurality of plating layers. An example of a multi-layered plating layer is a two-layer structure consisting of first plating layers 34, 44 in contact with second electrode layers 33, 43 and second plating layers 35, 45 covering the first plating layers 34, 44 (see FIGS. 2 and 3).

[0044] The electronic component 10 of the present invention may be a thermistor, and is particularly suitable as a PTC thermistor.

[0045] [Method of manufacturing chip-type electronic component 10] A method for manufacturing the electronic component 10 according to the first embodiment will be described using a PTC thermistor having the structure shown in FIG. 1 as an example.

[0046] (Fabrication of ceramic body 20) The raw materials for the ceramic body 20 necessarily contain BaCO3 and TiO2 to form a perovskite-type compound containing Ti and Ba. SiO2 may also be included as a silicon source. SiO2 can function as a sintering aid.

[0047] To fabricate the ceramic element 20, first, predetermined amounts of ceramic raw materials such as BaCO3, TiO2, PbO, SrCO3, and CaCO3 and a rare earth additive (semiconducting agent) are weighed out. The rare earth additive may be an oxide of at least one rare earth element selected from Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. In addition to the ceramic raw materials and rare earth additive, a property improver such as Mn2O3 or a sintering aid such as SiO2 may also be used as the raw materials for the ceramic element. The weighed raw materials are then placed in a ball mill together with milling media such as partially stabilized zirconia (PSZ) (hereinafter also referred to as PSZ balls) and pure water for wet mixing and milling. The resulting mixture is calcined at a predetermined temperature (for example, 1000 to 1200° C.) to obtain a calcined powder.

[0048] The resulting calcined powder is mixed with an organic binder, a dispersant, and pure water, and then dried to form granules. The resulting granules are molded to obtain a green body. The green body is then degreased and debindered, and fired at a predetermined temperature (1200 to 1400°C) in a predetermined atmosphere for a predetermined time to obtain the ceramic body 20.

[0049] (Formation of first electrode layers 31, 41) As shown in Figures 2 and 3, first electrode layers 31, 41 are formed so as to cover the end portions of the ceramic body 20 (only the end faces 21, 22 of the ceramic body 20 as shown in Figure 2, or the end faces 21, 22 and part of the side face 23 of the ceramic body 20 as shown in Figure 3).

[0050] The material of the first electrode layers 31, 41 is not particularly limited as long as it can obtain ohmic contact with the ceramic body 20 and can withstand a reliability test. The first electrode layers 31, 41 are formed from a metal material that can make ohmic contact with the ceramic body 20, such as metal materials such as Zn, Ni, Al, Cr, V, and W, alloys of these metals with Ag, and alloy materials such as NiCr. In particular, solid metal materials such as Cr, NiCr alloys, Al, and Zn-Ag (ohmic Ag) are suitable.

[0051] The first electrode layers 31 and 41 can be formed by a known film formation method, such as sputtering, vapor deposition, coating (applying a conductive paste to a predetermined position and then baking it), or dipping. For example, a sputtering method is suitable for a Cr film, a NiCr alloy film, and an Al film, and a method of baking after coating is suitable for a Zn-Ag film (ohmic Ag film).

[0052] (Formation of second electrode layers 33, 43) As shown in FIGS. 2 and 3, second electrode layers 33 and 43 are formed to cover first electrode layers 31 and 41. The material of the second electrode layer 33, 43 is not particularly limited as long as it is conductive with the first electrode layer, protects the first electrode layer, and allows a plating layer to be formed on its surface. The second electrode layer 33, 43 can be formed, for example, from at least one of a conductive resin layer and a baked electrode layer. The conductive resin layer and the baked electrode layer are described in detail below.

[0053] Conductive resin layer The conductive resin layer is provided by curing a fluid resin electrode paste. The resin electrode paste contains a conductive powder and a resin raw material. After the resin electrode paste is applied to the end of the ceramic body 20 so as to cover the first electrode layers 31 and 41, the resin raw material in the resin electrode paste is cured. As the conductive powder contained in the resin electrode paste, metal powders such as Ag, Au, Ni, Cu, Pt, Pd and Al can be used. Examples of resin raw materials that can be used in the resin electrode paste include epoxy resin, phenol resin, urethane resin, silicone resin, and polyimide resin.

[0054] Baked electrode layer The baked electrode layers are formed by baking a fluid metal paste. The metal paste contains metal powder, an organic binder, and an organic solvent. The metal paste is applied to the ends of the ceramic body 20 so as to cover the first electrode layers 31 and 41, and then the metal paste is dried and baked at 300 to 900°C. The metal powder contained in the metal paste may be Ag, Au, Ni, Cu, Pt, Pd, or the like. As the organic binder, a cellulose-based resin such as ethyl cellulose or nitrocellulose, or an acrylic-based resin such as butyl methacrylate or methyl methacrylate can be used. As the organic solvent, terpene-based solvents such as terpineol and dihydroterpineol, hydrocarbon-based solvents such as cyclohexane and trimethylbenzene, and ketone-based solvents such as methyl ethyl ketone can be used.

[0055] (Formation of first plating layers 34, 44 and second plating layers 35, 45) The surfaces of the second electrode layers 33 and 43 are covered with plating. LayerThe plating layer preferably has a multilayer structure including a first plating layer 34, 44 in contact with the second electrode layer 33, 43, and a second plating layer 35, 45 covering the first plating layer 34, 44. In this case, the first plating layer 34, 44 is formed to cover the surface of the second electrode layer 33, 43, and then the second plating layer 35, 45 is formed to cover the first plating layer 34, 44.

[0056] The first plating layers 34, 44 can be formed by electrolytic plating of at least one of Ni and Cu, for example. The second plating layers 35, 45 can be formed by electrolytic plating of Sn, for example. The first plating layers 34, 44 and the second plating layers 35, 45 can be formed by a known plating method, such as barrel plating using a ball.

[0057] The method for manufacturing the chip-type electronic component 10 according to the first embodiment of the present invention has been described above using a PTC thermistor as an example, but other chip-type electronic components can also be manufactured as appropriate based on the description in this specification. [Example]

[0058] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. In the example, a PTC thermistor was fabricated as the measurement sample (electronic component 10). In the PTC thermistor according to the example, ceramic body 20 contained a perovskite compound containing Ba, Ca, Sr, Pb, and Ti, as well as Sm, Er, Mn, and Si. Measurement samples were prepared according to the following procedure: Approximately 5,000 measurement samples can be produced in one production run.

[0059] (Examples 1 to 6, Comparative Example 1) A ceramic body 20 was prepared having the component composition and resistivity ρ25 shown in Table 1. External electrodes 30, 40 were provided on both ends of the ceramic body 20 to prepare a measurement sample (electronic component 10) for use in the measurement.

[0060] The ceramic element 20 was prepared by grinding and mixing the raw materials, calcining, molding, firing, and cutting. The raw materials were ground and mixed, crushed, and dried to the composition shown in Table 1. These included BaCO3, CaCO3, SrCO3, PbO, TiO2, at least one of Sm2O3 and Er2O3 as a rare earth element, MnO2 as a property improver, and SiO2 as a sintering aid. The resulting dried powder was calcined in an air atmosphere at a maximum temperature of 1200°C. Note that a line (-) in Table 1 indicates that the component was not added (and therefore would not be detected by measurement). The calcined powder was mixed with an organic binder, dispersant, and pure water, mixed, and dried to form granules. The resulting granules were compression-molded. The compact was degreased and debindered, and then fired at a maximum temperature of 1380°C. The fired compact was cut to the specified dimensions to obtain ceramic elements (measurement samples). The firing was carried out in an air atmosphere. The resistivity ρ25 of the electronic component was adjusted by adjusting the firing time.

[0061] The ceramic body 20 used in Examples 1 to 6 and Comparative Example 1 was a square pillar shape with the following dimensions (corresponding to a 0603 mm chip): These dimensional values ​​were used as the dimensional values ​​of the ceramic body 20 in the Examples. Length 20L: 0.53mm Width 20W:0.28mm Thickness 20T: 0.28mm Volume V: 0.042mm 3

[0062] Furthermore, first electrode layers 31, 41 were formed as external electrodes on both ends of the ceramic body 20 by laminating a Cr film, a NiCu film, and an Ag film by a sputtering method, and resin electrode layers containing Ag powder were formed by a dipping method as second electrode layers 33, 43. No plating layers were formed. In this manner, an electronic component 10 for measurement (a measurement sample) was produced.

[0063] In each of the examples and comparative examples, the number of samples required for each measurement was randomly selected from the approximately 5,000 measurement samples prepared, and used for the measurement.

[0064] (Composition analysis of ceramic body 20) The composition of the ceramic body 20 was analyzed using wavelength dispersive X-ray fluorescence spectrometry (WD-XRF) and inductively coupled plasma mass spectrometry (ICP-MS). WD-XRF was used to measure the content of high concentration elements and Si. Specifically, the contents of Ba, Ti, Sr, Pb, Ca, and Si were measured by WD-XRF. ICP-MS was used to measure the contents of low-concentration elements. Specifically, the contents of Er, Sm, and Mn were measured by ICP-MS. The content of Ba was also measured by ICP-MS to provide a reference for integration with the WD-XRF results. The methods for measuring the content using WD-XRF and ICP-MS are described in detail below.

[0065] WD-XRF: The measurement sample was cut and the composition inside the ceramic body 20 was analyzed. This allows accurate analysis of element concentrations without being affected by foreign matter, coatings, etc. attached to the outer surface of the measurement sample. In the present invention, a 0603 mm sized electronic component was embedded in a two-component curable resin and polished using abrasive paper with grit sizes ranging from 500 to 4000 until the inside of the electronic component was exposed. The polished surface was then cleaned by ultrasonic cleaning with ion-exchanged water, and then subjected to ion milling using an IM4000PLUS manufactured by Hitachi High-Tech Corporation.

[0066] The WD-XRF instrument used was a Rigaku ZSX series tube with an Rh target, a vacuum atmosphere (13 Pa), and a 0.1 mm diameter attachment. Three measurements were performed on different samples for each of the examples and comparative examples. The tube voltage, tube current, and measurement time were set appropriately depending on the element being measured, with measurements ranging from 30 to 50 kV for the tube voltage, 60 to 133 mA for the tube current, and 60 to 480 seconds per element for the measurement time. For each measurement, spectral intensity data for the target element was obtained. Measurement samples were replaced, and measurements and data acquisition were repeated to obtain three sets of measurement data. The average value (average intensity) of the measurement data for each target element was calculated, and the average intensity was converted to the content of the target element using the calibration curve recorded inside the instrument.

[0067] In this example, one measurement sample was used for one measurement. If the spectral intensity is weak due to the small size of the measurement sample, multiple measurement samples may be used. For example, the spectral intensity can be increased by arranging multiple measurement samples on the measurement stage to increase the measurement area and then increasing the spot diameter during measurement. Furthermore, even if the number of measurement samples is the same, the spectral intensity can be increased by extending the measurement time.

[0068] ICP-MS The measurement sample was completely dissolved in mixed acid, diluted to a predetermined concentration according to the element to be measured, and analyzed. When completely dissolving a sample, if it is composed not only of ceramics but also of plating, electrodes, coating materials, etc., and these contain the same components as the ceramics but at concentrations that would interfere with the analytical results, it is desirable to remove the plating, electrodes, and coating materials beforehand. Methods for removal include selectively dissolving the target materials and mechanically polishing them.

[0069] 2.5 mg of the measurement sample was placed in 10 g of mixed acid and completely dissolved in a microwave pressure dissolution device to prepare a measurement solution (stock solution). The same procedure was repeated twice to prepare two stock solutions. The stock solutions were diluted to the specified concentrations and used as measurement solutions. ICP-MS measurements were performed on the measurement solutions prepared from each stock solution, and the average values ​​of the obtained results (element contents) were calculated.

[0070] The mixed acid was prepared by mixing ultra-high purity grade hydrofluoric acid (46 to 51%) manufactured by Kanto Chemical Co., Inc., ultra-high purity grade nitric acid (46 to 51%), and ultra-pure water in a weight ratio of 1:34:65.

[0071] The ICP-AES instrument used was the iCAP6300 manufactured by Thermo Fisher Scientific, and the ICP-MS instrument used was the Agilent7500cx manufactured by Agilent Technologies.

[0072] The results of the WD-XRF measurement and the ICP-MS measurement were integrated using the following procedure. The ratio of the Er, Sm, and Mn contents to the Ba content measured by ICP-MS was calculated, and this ratio was multiplied by the Ba content measured by WD-XRF. This was then converted to the Er, Sm, and Mn contents measured by WD-XRF. The total amount of all elements (WD-XRF measurement value or value converted to WD-XRF measurement) was then normalized to 100.0 mol% to determine the content of each element. For normalization, the numbers were rounded to three significant digits for the content of each element.

[0073] (Measurement of resistivity ρ25) Of the approximately 5,000 measurement samples produced, 50 were randomly selected, and the resistance (resistance R25 at 25°C) of the measurement samples was measured. The resistivity was calculated from the measured resistance value and the dimensions of the measurement sample. Note that, because the resistance of the external electrodes and the interface resistance between the electrodes and the ceramic were negligibly small, the resistivity of the measurement sample (electronic component) was considered to be the resistivity of the ceramic body 20.

[0074] Any commercially available digital multimeter can be used as the resistance measuring device for measuring the resistance R25. Regardless of which digital multimeter is used, nearly similar measurement results will be obtained. The resistance is measured by contacting the digital multimeter with the external electrodes of the test sample.

[0075] In the example, the resistance R25 was measured using an R6451A digital multimeter manufactured by ADVANTEST as the resistance measuring device. The resistance R25 (Ω) of each measurement sample was measured, and the resistivity ρ25 (Ωcm) was calculated using the following formula (6): The ceramic body 20 (measurement sample) was a roughly rectangular parallelepiped with dimensions of a width of 20W (mm), a length of 20L (mm), and a thickness of 20T (mm). Resistivity (ρ25) = Resistance (R25) × Width (20W) × Thickness (20T) / Length (20L) × 10 (6)

[0076] The resistivity was measured for each of the 50 measurement samples, and the average value was calculated and shown in Table 1 as "ρ25".

[0077] (reliability test) Using the 50 measurement samples selected for the resistivity ρ25 measurement, a reliability test was conducted using the following procedure: The reliability test (thermal shock test) was conducted in accordance with the AEC-Q200 standard. First, the measurement sample was reflow-mounted at a reflow temperature of 250°C on a mounting board made of glass epoxy resin (Panasonic FR-4, thickness 1.6 mm) using solder paste (M705-GRN360-K2K-J manufactured by Senju Metal Industry Co., Ltd.). Next, the measurement samples mounted on the board were subjected to a thermal shock test at a low temperature of -55°C and a high temperature of 150°C, with 1000 cycles.

[0078] (Piezoelectric resistance coefficient π c (Calculation of Pressure resistance coefficient π cThe resistance measurement for calculating is carried out using a device that can measure the room temperature resistance (resistance R25 at 25°C) of an electronic component under the action of compressive stress. The apparatus includes a compression jig for applying a compressive stress to the electronic component 10, and a resistance measuring device for measuring the resistance of the electronic component in a state where a compressive stress is applied.

[0079] The compression jig is a jig that sandwiches the electronic component 10 and applies compressive stress to it. The compression jig used has a surface area that comes into contact with the electronic component 10 that is larger than the surface area of ​​the electronic component 10 that comes into contact with the jig surface. This allows a uniform compressive stress to be applied to the entire surface of the electronic component 10. The compression jig includes a stress generating means for applying compressive stress, such as a push-pull gauge or a spring. A commercially available digital multimeter can be used as the resistance measuring device.

[0080] The range of compressive stress when measuring is not particularly limited, but the upper limit is set to the compressive stress until the ceramic body 20 elastically deforms, that is, the compressive stress immediately before the yield point. If the measurement data is plotted with compressive stress on the x-axis and resistance on the y-axis, the resistance increases proportionally as the compressive stress increases. If the compressive stress exceeds the yield point of the ceramic body 20, the ceramic body 20 may begin to break, and the proportional relationship between compressive stress and resistance may no longer hold. It is most preferable to perform the measurements in a stress range where the compressive stress and resistance are proportional to each other.

[0081] In this example, a compression jig using a spring and a digital multimeter were used. The compression jig had a pair of opposing compression arms, between which a test sample (electronic component) was placed. After each of the compression arms was brought into contact with a pair of external electrodes provided on the end face of the test sample, the gap between the compression arms was narrowed, thereby applying compressive stress to the test sample in a direction perpendicular to the end face.

[0082] The compression jig was equipped with a conductive part, and the external electrodes of the test sample, which was in contact with the compression jig, were electrically connected to a digital multimeter via the conductive part. The direction of the compressive load on the test sample was parallel to the direction of the electricity flowing through the test sample. Then, with the compressive load applied, the resistance R25 of the test sample at room temperature (25°C) was measured.

[0083] The magnitude of the compressive load was varied using Hooke's law (F = kx, where F is the load (N), k is the spring constant (N / mm), and x is the compressed and tensile length of the spring (mm)). In other words, the compressive load F applied to the measurement sample was varied by using springs with various spring constants k and by varying the compressed and tensile length x of the spring. The applied compressive load was 0.59 to 3.43 N. The compressive load was determined based on the area of ​​the WT surface of the ceramic body 20 of the measurement sample (0.28 mm × 0.28 mm = 0.0784 mm 2 ) and converted to a compressive stress of 7.5 to 43.8 MPa.

[0084] The measured data is plotted with the x-axis representing compressive stress and the y-axis representing resistance. A regression line is then drawn based on the plot, and the slope of the line (converted into a percentage) is used to calculate the pressure resistance coefficient π. c The resistance measured under a compressive stress of less than 7 MPa was used as the reference resistance when converting the resistance into a percentage. The piezo-resistance coefficient π for each of the three measurement samples c The average value of these values ​​is calculated and the "piezoelectric coefficient π c " is shown.

[0085] (Evaluation of resistance change rate) Ten measurement samples were heated in a reflow oven and mounted on a board. A reliability test (thermal shock test) was performed on the measurement samples mounted on the board. The resistance (resistance R25 at 25°C) was measured before and after the thermal shock test. The resistance was measured using the same digital multimeter as that used in the "measurement of specific resistance" described above. However, a digital multimeter different from that used in the "measurement of specific resistance" may also be used. A digital multimeter was brought into contact with the substrate wiring to measure the resistance of the measurement sample.

[0086] For each measurement sample, the resistance R25b of the measurement sample before the reliability test (thermal shock test) and the resistance R25a after the test were measured, and the resistance change rate was calculated using the following equation (7). Resistance change rate (%) = (R25a / R25b-1) × 100 (7) The resistance change rate was determined for each of the 10 measurement samples, and the average value was calculated and shown in Table 2 under "Resistance Change Rate."

[0087] [Table 1]

[0088] [Table 2]

[0089] In Examples 1 to 6, the Si content was within the range of the present invention, and therefore the resistance change rate before and after the reliability test was 10% or less. In Comparative Example 1, the Si content was outside the range of the present invention, and therefore the resistance change rate before and after the reliability test exceeded 10%.

[0090] The present invention may include the following aspects. (Aspect 1) A chip-type electronic component having a ceramic body, The volume V of the ceramic body is 0.12 mm 3 is as follows: the ceramic body contains a perovskite compound containing Ti and Ba, and also contains at least Si; A chip-type electronic component, wherein the Si content in the ceramic body satisfies the following formula (1): 0 mol%<[Si]≦0.62 mol% (1) Here, [Si] is the content (mol %) of Si relative to 100 mol % of the total content of elements (excluding oxygen) contained in the ceramic body.

[0091] (Aspect 2) 2. The chip-type electronic component according to claim 1, wherein the Si content satisfies the following formula (2): 0.10mol%≦[Si]≦0.50mol% (2)

[0092] (Aspect 3) 3. The chip-type electronic component according to aspect 1 or 2, wherein the ceramic body has a piezoelectric coefficient of 0.382 Ω% / MPa or less in the compression direction when compressed.

[0093] (Aspect 4) 4. The chip-type electronic component according to any one of aspects 1 to 3, wherein the ceramic body further includes at least one of (a) to (c). (a) at least one element selected from the group consisting of Ca, Sr, and Pb in the perovskite compound; (b) at least one selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu (c) Mn

[0094] (Aspect 5) 5. The chip-type electronic component according to any one of aspects 1 to 4, which is a thermistor.

[0095] This application claims priority based on Japanese Patent Application No. 2022-067837, filed on April 15, 2022, the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0096] 10 Chip-type electronic components 20 Ceramic element 21, 22 End faces of ceramic element 23 Side of ceramic body 30, 40 external electrode 31, 41 1st electrode layer 33, 43 Second electrode layer 34, 44 First plating layer 35, 45 Second plating layer

Claims

1. A thermistor including a semiconductor ceramic, The volume V of the semiconductor ceramic is 0.12 mm ３ is as follows: the semiconductor ceramic contains a perovskite-type compound containing Ti and Ba, and also contains at least Si; The Si content in the semiconductor ceramic satisfies the following formula (1), A thermistor in which the semiconducting ceramic has a pressure resistance coefficient of less than 0.29 Ω% / MPa in the compression direction when compressed. 0mol%<[Si]≦0.192mol% (1) Here, [Si] is the content (mol %) of Si relative to 100 mol % of the total content of elements (excluding oxygen) contained in the semiconductor ceramic.

2. 2. The thermistor according to claim 1, wherein the Si content satisfies the following formula (2): 0.10mol%≦[Si]≦0.170mol% (2)

3. A thermistor as described in claim 1 or 2, wherein [Si] is 0.110 or more.

4. A thermistor as described in claim 1, wherein the pressure resistance coefficient is 0.27 Ω% / MPa or less.

5. 2. The thermistor according to claim 1, wherein the semiconductor ceramic further comprises at least one of (a) to (c). (a) at least one element selected from the group consisting of Ca, Sr, and Pb in a perovskite-type compound; (b) at least one selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu (c) Mn

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