Base for electronic component, manufacturing method thereof, and electronic component

Abstract

To increase the fixation strength of an auxiliary terminal for a pedestal, improve the vibration resistance of an electronic component such as a capacitor, and enhance the reliability of surface mounting of the electronic component.SOLUTION: A pedestal for an electronic component comprises: a groove part (14) which houses lead terminals (8-1, 8-2); and auxiliary terminals (16-1, 16-2) arranged in a direction crossing the lead terminals. The auxiliary terminal comprises: a lead terminal receiving part (18-1); internal regions (internal regions 18-3, 18-5, 18-6, 18-6') which are in the pedestal; and exposure regions (exposure regions 18-2, 18-4, 18-4') which are exposed from the pedestal. The internal regions are arranged between the lead terminal receiving part and the exposure regions.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a base that is a surface mounting member to be mounted on an electronic component, such as a chip capacitor or a coil. [Background technology]

[0002] It is already known to provide electronic components such as capacitors and coils with a surface-mounting base on a printed wiring board. By attaching a base to the component body to form a chip, surface-mountable products are available, similar to surface-mountable transistors. Electronic components with bases are electrically connected by soldering lead terminals that penetrate the base to the wiring conductors of the wiring board. Capacitors and other electronic components with such bases are widely used in power supplies for various devices.

[0003] With regard to chip-type capacitors, it is known that a base plate is placed on a metal case sealed with a sealing material, a metal plate is provided in a groove of the base plate, and lead wires are soldered to the metal plate to form the capacitor into a chip (for example, Patent Document 1).

[0004] Regarding chipping of capacitors, it is known that an insulating plate is placed on the sealing body side of the capacitor body, a metal terminal is embedded in this insulating plate, and a lead terminal drawn out from the insulating plate is fitted into a lead terminal fitting groove of this metal terminal (for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-25859 [Patent Document 2] Japanese Utility Model Application Publication No. 62-82727 Summary of the Invention [Problem to be solved by the invention]

[0006] In chip capacitors, the base has holes through which the lead terminals pass, and these lead terminals are bent and placed on the base. The base of this chip capacitor is placed on a wiring board, and the lead terminals and auxiliary terminals on the base are connected to the wiring conductors on the wiring board with solder.

[0007] Regarding the connection between the wiring conductor and the lead terminal, if the mounting area of ​​the base is increased, the bonding area between the auxiliary terminal and the wiring board can be increased, thereby improving the vibration resistance of the electronic component on the wiring board. However, if the fixing area of ​​the auxiliary terminal is not expanded in proportion to the increased mounting area, the ratio of the fixing area to the mounting area will decrease. In such a case, the pull-out force of the auxiliary terminal from the base will decrease, the fixing strength of the auxiliary terminal will decrease, and the auxiliary terminal will become more likely to come off.

[0008] Generally, the base is made of a molded insulating resin, which can absorb vibrations from the wiring board and cushion the vibrations to the capacitor, providing a damping effect and vibration-damping function.

[0009] However, if the strength of the auxiliary terminal's attachment to the base is low, the connection strength between the auxiliary terminal and the wiring board will decrease. Vibrations from the device on which the wiring board is mounted will cause resonant vibrations and parasitic vibrations in the base, which will cause deterioration of the attachment between the base and the auxiliary terminal and lead to problems such as unwanted vibrations within the capacitor.

[0010] The inventors of the present disclosure have discovered that for electronic components such as capacitors that have a base, the fixing strength between the base and the auxiliary terminal is essential for improving the vibration resistance and durability of electronic components that have a base, including capacitors.

[0011] In view of the above problems and findings, an object of the present disclosure is to increase the fixing strength of an auxiliary terminal to a base and improve the vibration resistance of an electronic component such as a capacitor. [Means for solving the problem]

[0012] In order to achieve the above object, according to one aspect of an electronic component base of the present disclosure, there is provided a base for an electronic component, the base including a groove portion for accommodating a lead terminal, and an auxiliary terminal arranged in a direction intersecting the lead terminal, the auxiliary terminal including a lead terminal receiving portion, an internal region within the base, and Within the range from the center to the edge of the base exposed from the base Multiple The lead terminal receiving portion has an exposed area, and the underlying area is provided between the lead terminal receiving portion and the exposed area.

[0013] In this electronic component base, the exposed area may be located at a position that is at least one-third of the length from the center of the base to the edge.

[0014] In this electronic component holder, the length of the embedded region may be 0.4 mm or more, and may be ¼ or more of the length of the exposed region.

[0015] In this electronic component holder, the length of the inherent region relative to the exposed region may be such that the inherent region is greater than the exposed region.

[0017] This electronic component for The base may have a through hole or an uneven portion in the internal region.

[0018] In this electronic component seat, the auxiliary terminal may have an area where it overlaps with the upright wall portion of the seat, with the seat sandwiched therebetween.

[0019] In order to achieve the above object, according to one aspect of the method for manufacturing a base of the present disclosure, there is provided a lead terminal receiving portion, an internal region of the base, and Within the range from the center to the edge of the base exposed from the base Multiple The method includes a step of molding an auxiliary terminal having an exposed area, and a step of placing the lead terminal receiving portion in a groove portion, having the internal area internal, and molding a base with the exposed area exposed using insulating resin.

[0020] In order to achieve the above object, according to one aspect of an electronic component of the present disclosure, the electronic component includes the electronic component seat. [Effects of the Invention]

[0021] According to the present disclosure, any of the following effects can be obtained. (1) The auxiliary terminal arranged in a direction intersecting the lead terminal housed in the groove of the base has a lead terminal receiving portion, an internal region that is internal to the base, and an exposed region that is exposed from the base. By providing the internal region between the lead terminal receiving portion and the exposed region, the exposed region and the internal region are dispersed, thereby increasing the fixing strength of the auxiliary terminal, improving the vibration resistance of electronic components such as capacitors, and increasing the reliability of surface mounting of electronic components.

[0022] (2) The proportion of the embedded area of ​​the auxiliary terminal fixed to the base is larger than the exposed area, which can improve the anchoring effect of the auxiliary terminal to the base and the vibration damping effect on the electronic component.

[0023] (3) Since an internal region is provided between the lead terminal receiving portion and the exposed region, the spacing of the exposed region that contributes to electrical connection with the wiring board is increased, and the effective fixing distance provided by the base is enlarged, thereby improving the connection function with the wiring conductor of the wiring board, preventing vibration of the electronic component, and improving the reliability of the electronic component connection.

[0024] (4) By simply storing the lead terminal in the lead terminal receiving portion located in the groove of the base, the lead terminal, auxiliary terminal, and wiring conductor can be fixedly connected with solder during mounting, thereby increasing the wiring strength of the electronic component and improving electrical connectivity. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a diagram showing a chip capacitor according to a first embodiment of the present disclosure. [Figure 2] 2A is a cross-sectional view taken along line IIA-IIA in FIG. 1, and FIG. 2B is a cross-sectional view showing a base according to a second embodiment of the present disclosure. [Figure 3] FIG. 10 is a cross-sectional view showing a base according to a third embodiment of the present disclosure. [Figure 4] 10A and 10B are cross-sectional views showing bases according to comparative examples 1 and 2 of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0026] The base according to the present disclosure is for electronic components and can be widely used for surface mounting of electronic components, such as chipping of electronic components such as capacitors and coils.

[0027] The base is provided with grooves for accommodating the lead terminals, and auxiliary terminals arranged in a direction intersecting the lead terminals. The length of the grooves is set to a length that can accommodate the lead terminals required for surface mounting, and the base is formed with grooves of this length, and is provided with a surface portion of sufficient width and length for installing the auxiliary terminals.

[0028] The auxiliary terminal has a lead terminal receiving portion, an embedded region embedded in the base, and an exposed region exposed from the base. The lead terminal receiving portion receives the lead terminal of the electronic component and primarily functions to electrically connect the lead terminal and the auxiliary terminal. The embedded region is the region where the auxiliary terminal is embedded in the base and functions to fix the auxiliary terminal to the base. The exposed region is the region where the auxiliary terminal is exposed from the base and functions to electrically connect and fix the auxiliary terminal by soldering it to a wiring conductor, for example.

[0029] The internal region is provided between the lead terminal receiving portion and the exposed region and is arranged with the lead terminal receiving portion in between, so that the fixing positions of the auxiliary terminals relative to the base are dispersed, and the lead terminal receiving portion is fixed to the base by being sandwiched between the internal region.

[0030] The exposed areas are disposed on either side of the lead terminal receiving portion and the internal area, so that the connection points of the auxiliary terminal are dispersed and the exposed areas are disposed on the base at a distance of at least the length of the lead terminal receiving portion and the internal area, and therefore the exposed areas are connected to the wiring conductor with an expanded connection or fixing distance, which disperses the stress received from the wiring conductor side and strengthens the fixing strength of the auxiliary terminal to the wiring board.

[0031] Accordingly, one embodiment includes the following features. A) Auxiliary terminal expandability The installation area of ​​the auxiliary terminal on the base can be expanded, and the base is provided with an auxiliary terminal having a sufficient area.

[0032] a) Strengthening the fixing strength of auxiliary terminals by dispersing the internal area The auxiliary terminal has a plurality of internal regions, each of which sandwiches a lead terminal receiving portion, thereby increasing the strength with which the auxiliary terminal is fixed to the base. The auxiliary terminal can be expanded in length and width, so the expansion of the internal region increases the strength with which the auxiliary terminal is fixed to the base.

[0033] c) Strengthening the connection strength between the auxiliary terminal and the wiring conductor by dispersing the exposed area The length and width of the auxiliary terminal can be expanded, and the expanded exposed area can strengthen the connection strength between this exposed area and the wiring conductor on the wiring board, thereby increasing the fixing strength of the electronic component on the wiring board via the base.

[0034] D) Strengthening the base Since the auxiliary terminals are firmly fixed to the mounting surface of the base, the base can be strengthened by joining the auxiliary terminals, and the mechanical strength of the base can be increased. In other words, the installation of the extended auxiliary terminals allows for a thinner and lighter base. [Example]

[0035] Example 1 Fig. 1 shows a chip capacitor according to Example 1 as seen from the rear surface (=mounting surface) of a base. Fig. 2A shows a cross section taken along line IIA-IIA in Fig. 1. The configurations shown in Fig. 1 and Fig. 2A are merely examples, and the present disclosure is not limited to such configurations.

[0036] This chip capacitor (hereinafter simply referred to as "capacitor") 2 is an example of an electronic component. This capacitor 2 includes, for example, a cylindrical capacitor body 4, and a base 6 is installed on the sealing side of this capacitor body 4. This base 6 is an example of a capacitor base or an electronic component base.

[0037] <Capacitor body 4> Capacitor body 4 is an example of an electronic component body. This capacitor body 4 is, for example, the body of an aluminum electrolytic capacitor, and is made of a cylindrical outer case that houses a cylindrical capacitor element and is sealed with a sealing portion. Lead terminals 8-1 and 8-2 (hereinafter simply referred to as "lead terminals 8") extending from the sealing portion of capacitor body 4 penetrate base 6, are formed into an L-shape, and are disposed on base 6.

[0038] <Pedestal 6> The base 6 is a molded body made of insulating synthetic resin and has a hexagonal flat plate portion. Four sets of ribs 10-1, 10-2, 10-3, and 10-4 (hereinafter simply referred to as "ribs 10") are erected on the upper surface of the base 6 as an example of a standing wall portion, and each rib 10 has a curved surface that is similar in shape to the outer shape of the capacitor body 4. Therefore, the capacitor body 4 on the base 6 is surrounded by the four sets of ribs 10.

[0039] The base 6 is formed with a pair of through holes 12 through which the lead terminals 8 pass, as well as a pair of grooves 14 for accommodating each lead terminal 8. Each through hole 12 corresponds to a position from which the lead terminal 8 is drawn out of the capacitor body 4. Each lead terminal 8 is bent and accommodated in the groove 14.

[0040] A pair of auxiliary terminals 16-1 and 16-2 (hereinafter simply referred to as "auxiliary terminals 16") are arranged on this base 6 in a direction perpendicular to the lead terminals 8 housed in each groove 14. The perpendicular direction indicating the arrangement direction of the auxiliary terminals 16 (auxiliary terminal 16-1 or auxiliary terminal 16-2) is an example of a direction intersecting with the lead terminals 8.

[0041] <Auxiliary terminal 16> The auxiliary terminal 16 has a lead terminal receiving portion 18-1 in the center, and on either side of the lead terminal receiving portion 18-1, a pair of exposed regions 18-2, a pair of underlying regions 18-3, a pair of exposed regions 18-4, and a pair of underlying regions 18-5.

[0042] The lead terminal receiving portion 18-1 is disposed in the groove portion 14 and exposed from the base 6, receives the lead terminal 8 of the capacitor 2, and forms an electrical connection portion between the lead terminal 8 and the auxiliary terminal 16.

[0043] The exposed area 18-2 is exposed to the base 6 across the lead terminal receiving portion 18-1, and is a connection surface to be soldered during mounting.

[0044] The intrinsic region 18-3 is embedded in the base 6 and is fixed to the base 6.

[0045] The exposed area 18-4 is exposed from the base 6 and is a connection surface to be soldered when the capacitor 2 is mounted.

[0046] The intrinsic region 18-5 is embedded in the base 6 and is fixed to the base 6.

[0047] <Molding form of each part of the auxiliary terminal 16> Auxiliary terminal 16 is formed from a conductive material such as copper plate, phosphor bronze, brass, etc. As shown in Fig. 2A, auxiliary terminal 16 is formed by bending a conductive material to have lead terminal receiving portion 18-1, a pair of exposed regions 18-2, an underlying region 18-3, an exposed region 18-4, and a pair of underlying regions 18-5.

[0048] The lead terminal receiving portion 18-1 is formed to have a C-shaped cross section and is placed in the groove portion 14. The internal region 18-3 is formed to have a mountain-shaped cross section with a flat portion sandwiched between inclined portions, and is embedded in the base 6. The angle of the inclined portion of the internal region 18-3 is not particularly limited, and may be, for example, in the range of 30 degrees to 150 degrees.

[0049] The embedded region 18-5 is bent, for example, at 45 degrees from the end of the exposed region 18-4 toward the inside of the base 6. The angle of the end of the exposed region 18-4 is not particularly limited and may be, for example, in the range of 30 degrees to 90 degrees.

[0050] <Pedestal 6 thickness and vertical wall height> 2A, where t1 is the thickness of the flat portion of base 6 and t2 is the height of the highest point of auxiliary terminal 16, t1 is set to be 1.5 times or more of t2. As a result, auxiliary terminal 16 has exposed areas 18-4 and 18-2 exposed on the back surface of base 6, and inherent areas 18-3 and 18-5 are securely molded into the resin of base 6 and firmly fixed.

[0051] If the height of the rib 10 is h, this height h is set to be at least twice the thickness t1. As a result, the corners of the base 6 are reinforced by the ribs 10, and the base 6 is strengthened by each rib 10.

[0052] In the first embodiment, for example, t1 is set to 1 mm, t2 is set to 0.5 mm or less, and h is set to about 7 mm, and the thickness of the auxiliary terminal 16 is, for example, 0.1 mm.

[0053] <Molding of base 6> The base 6 may be molded by any molding method, such as transfer molding or injection molding. The molding resin for the base 6 may be either a thermoplastic resin or a thermosetting resin, such as epoxy resin, polyester resin, polyamide resin, or polyphenylene sulfide (PPS) resin. The molding method and molding conditions, such as temperature, for these resins may be determined depending on the resin selected. In these molding methods, the base 6 may be molded from a molding resin, and the auxiliary terminal 16 may be insert-molded into the molding resin.

[0054] <Mounting area of ​​base 6, width of auxiliary terminal 16, and groove length of groove portion 14> As shown in Fig. 1, when the lengths of each side of the pedestal 6 (= pedestal width Wm) are La and Lb, the missing areas of the pedestal 6 are S1 and S2, and the mounting area of the pedestal 6 on a wiring board (not shown) is Sf, this mounting area Sf can be generally expressed by Equation (1).

[0055] Sf = La × Lb - (S1 + S2) ···(1)

[0056] If La = Lb = L, the mounting area Sf can be expressed by Equation (2). Sf = L 2 - (S1 + S2) ···(2)

[0057] For example, if L = 10.3 mm, the mounting area Sf is approximately Sf = 100.6 - (S1 + S2) mm 2 and if (S1 + S2) is ignored, Sf is ≒ 100.6 mm 2 That is.

[0058] When the terminal width of the auxiliary terminal 16 is W and the groove length of the groove portion 14 is Ld, the terminal width W is set to be narrower than the groove length Ld, W < Ld. As a result, the auxiliary terminal 16 is firmly fixed within the pedestal 6.

[0059] <Lengths of the auxiliary terminal 16, the lead terminal receiving portion 18-1, the exposed region 18-2, the internal region 18-3, the exposed region 18-4, and the internal region 18-5> In Example 1, when the terminal length of the auxiliary terminal 16 is Lm1, the length of the lead terminal receiving portion 18-1 is L1, the length of the exposed region 18-2 is L2, the length of the internal region 18-3 is L3, the length of the exposed region 18-4 is L4, and the length of the internal region 18-5 is L5, the terminal length Lm1 can be expressed by Equation (3).

[0060] Lm1 = L1 + 2×(L2 + L3 + L4 + L5) ···(3)

[0061] When the exposed length composed of the lead terminal receiving portion 18-1 and the exposed region 18-2 is Ln, this exposed length Ln can be expressed by Equation (4).

[0062] Ln=L1+2×L2 (4)

[0063] If the exposed length consisting of each exposed region 18-4 and each exposed region 18-2 is Lo1, this exposed length Lo1 can be expressed by equation (5).

[0064] Lo1=2×(L2+L4) (5)

[0065] If the intrinsic length consisting of each intrinsic region 18-3 and each intrinsic region 18-5 is Li1, this intrinsic length Li1 can be expressed by equation (6). Li1=2×(L3+L5) (6)

[0066] If the exposed area of ​​exposed region 18-4 is W×L2, the exposed area of ​​exposed region 18-2 is W×L4, and the connectable connection area of ​​auxiliary terminal 16 to the wiring conductor of the wiring board is Sc1, the connection area Sc1 of each auxiliary terminal 16 can be expressed by equation (7).

[0067] Sc1=2×W×L2+2×W×L4=2×W(L2+L4) ···(7)

[0068] If the ratio of Lo1 to the terminal length (Lm1-L1) of the groove 14 not including the lead terminal receiving portion 18-1 is Lo1 / (Lm1-L1), then Lo1 / (Lm1-L1) can be expressed by equation (8).

[0069] Lo1 / (Lm1-L1)=2×(L2+L4) / 2×(L2+L3+L4+L5) =(L2+L4) / (L2+L3+L4+L5) ···(8)

[0070] If the proportion of Li1 to the terminal length (Lm1-L1) of the groove 14 not including the lead terminal receiving portion 18-1 is Li1 / (Lm1-L1), then Li1 / (Lm1-L1) can be expressed by equation (9).

[0071] Li1 / (Lm1-L1)=2×(L3+L5) / 2×(L2+L3+L4+L5) =(L3+L5) / (L2+L3+L4+L5) ···(9)

[0072] In this Example 1, if Lm1=6.2 mm, L1=1.2 mm, L2=0.5 mm, L3=1.0 mm, L4=0.5 mm, L5=0.5 mm, and W=1.7 mm, Lo1, Li1, and Sc1 are as follows.

[0073] Lo1=2×(L2+L4)=2×(0.5+0.5)=2.0mm Li1=2×(L3+L5)=2×(1.0+0.5)=3.0mm Sc1 = 2 × W × L2 + 2 × W × L4 = 3.4 mm 2

[0074] Therefore, Lo1 / (Lm1-L1) and Li1 / (Lm1-L1) are as follows.

[0075] Lo1 / (Lm1-L1)=2.0 / (6.2-1.2) = 2.0 / 5.0 ≒ 0.40 Li1 / (Lm1-L1)=3.0 / 5.0≒0.60

[0076] Therefore, in this Example 1, the ratio of the total exposed area to the total area of ​​one auxiliary terminal 16 not including the lead terminal receiving portion 18-1 is 40%, and the ratio of the total embedded area is 60%.

[0077] The connection area Sc1 of the auxiliary terminal 16 is 3.4 mm 2 With this area, the auxiliary terminal 16 contributes to electrical connection and mechanical fixation with the wiring conductor of the wiring board.

[0078] <Location of exposed area 18-4 on pedestal 6> In the first embodiment, as shown in FIG. 1, the distance A from the center N of the base 6 to the edge N′ of the base 6 is: A=L / 2=10.3 / 2=5.15mm The distance B from the center N of the base 6 to the end side edge of the exposed area 18-4 is B=(L1 / 2)+L2+L3+L4 =1.2 / 2+0.5+1+0.5=2.6mm In this case, the length L4 of the exposed area 18-4 is 0.5 mm. The distance C from the end side edge of the exposed area 18-4 to the edge of the base 6 is C=AB=10.3 / 2-2.6=5.15-2.6=2.55mm and the distance D from the center N of the base 6 to the exposed area 18-4 is D=B-L4=2.6-0.5=2.1mm is.

[0079] B is the distance from the center N of the base 6 to the exposed area 18-4. The placement of 18-4 is B / A=2.6 / 5.15=0.50 based on the B / A relationship.

[0080] 2A, the exposed area 18-4 is disposed at a position that is at least 1 / 3 of the distance from the center N of the base 6 to the edge N'. In other words, when the length L' from the center N to the edge N' is divided into thirds, the exposed area 18-4 is disposed in a range that is at least 1 / 3 of the distance from the center N of the base 6 to the edge N' and at most 2 / 3 of the distance to the edge N'.

[0081] <Manufacturing Capacitor 2> The manufacturing process of this capacitor 2 is an example of a manufacturing method of an electronic component base or an electronic component according to the present disclosure. The manufacturing process of this capacitor 2 includes a manufacturing process of the base 6, a manufacturing process of the capacitor body 4, and a manufacturing process of the capacitor 2.

[0082] The manufacturing process of the base 6 includes a processing step of the auxiliary terminal 16, a molding step of the auxiliary terminal 16, and a molding step of the base 6.

[0083] In the processing step of the auxiliary terminal 16, the original shape of the auxiliary terminal 16 is punched out from a conductive material plate by punching. In the molding step of the auxiliary terminal 16, the original shape of the auxiliary terminal 16 before insert molding is bent and molded into the base 6. In the molding step of the base 6, the molded body of the auxiliary terminal 16 is placed in a mold, and insulating synthetic resin is injected to form the base 6.

[0084] In addition to the manufacturing process for the base 6, the manufacturing process for the capacitor body 4 also includes a process for generating a capacitor element, a process for molding and processing an outer case, an encapsulation process, etc. The capacitor element is housed in an outer case, and the outer case is sealed with a sealing member to manufacture the capacitor body 4.

[0085] Then, in the assembly process of the capacitor 2, the base 6 is attached to the capacitor body 4, and the lead terminals 8 (8-1, 8-2) drawn out from the through holes 12 of the base 6 are bent onto the auxiliary terminals 16 above the grooves 14, thereby completing the capacitor 2.

[0086] <Effects of Example 1> According to the first embodiment, any of the following effects can be obtained. (1) The pair of exposed areas 18-4 and 18-2 distributes the exposed portions that contribute to the electrical connection of the auxiliary terminal 16, thereby increasing the connection area and strengthening the connection strength to the wiring conductor.

[0087] (2) It is preferable that there are a plurality of exposed areas 18-4 in the range from the center N to the edge N' of the base 6.

[0088] (3) The pair of internal regions 18-3 and the pair of internal regions 18-5 distribute the molded portion of the auxiliary terminal 16 relative to the base 6, and the expansion of the fixed area increases the strength with which the auxiliary terminal 16 can be pulled out from the base 6.

[0089] (4) By using the base 6, the strength with which the capacitor 2 is fixed to the wiring conductor of the wiring board can be increased, and the reliability of the connection can be improved.

[0090] <Example 2> Fig. 2B shows a cross section of the base 6 according to Example 2. The configuration shown in Fig. 2B is an example, and the present disclosure is not limited to such a configuration. In Fig. 2B, the same parts as those in Fig. 2A are denoted by the same reference numerals.

[0091] As in the case of the first embodiment, the auxiliary terminal 16 of the second embodiment has a lead terminal receiving portion 18-1 in the center, and a pair of internal regions 18-6, a pair of exposed regions 18-4 and a pair of internal regions 18-5 on either side of the lead terminal receiving portion 18-1.

[0092] In this Example 2, the exposed region 18-2 of Example 1 is omitted and replaced with an inherent region 18-6, and the inherent region 18-6 is expanded compared to the inherent region 18-3 of Example 1. Since the rest is the same as Example 1, a description thereof will be omitted.

[0093] <Mounting area of ​​base 6, width of auxiliary terminal 16, and groove length of groove portion 14> The mounting area of ​​the base 6, the width of the auxiliary terminal 16, and the groove length of the groove portion 14 in Example 2 are the same as in Example 1, so explanations thereof will be omitted. However, in Example 2 as well, each auxiliary terminal 16 can be fixed within the effective range of the base 6.

[0094] <Length of auxiliary terminal 16, length of lead terminal receiving portion 18-1, embedded region 18-6, exposed region 18-4, and embedded region 18-5> Assuming that the terminal length of each auxiliary terminal 16 in Example 2 is Lm2, the length of the lead terminal receiving portion 18-1 is L1, the length of the inherent region 18-6 is L6, the length of the exposed region 18-4 is L4, and the length of the inherent region 18-5 is L5, the terminal length Lm2 can be expressed by equation (10).

[0095] Lm2=L1+2×(L6+L4+L5) ···(10)

[0096] If the exposed length consisting of the exposed region 18-4 is Lo2, this exposed length Lo2 can be expressed by equation (11).

[0097] Lo2=2×L4 (11)

[0098] If the intrinsic length consisting of the intrinsic region 18-6 and the intrinsic region 18-5 is Li2, this intrinsic length Li2 can be expressed by equation (12).

[0099] Li2=2×(L6+L5) (12)

[0100] Since the exposed area of ​​the exposed region 18-4 is W×L4, the connection area Sc2 of one auxiliary terminal 16 can be expressed by equation (13).

[0101] Sc2=2×W×L4 (13)

[0102] The ratio Lo2 / (Lm2-L1) of Lo2 to the terminal length (Lm2-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (14). Lo2 / (Lm2-L1)=2×L4 / 2×(L6+L4+L5) =L4 / (L6+L4+L5) (14)

[0103] The ratio Li2 / (Lm2-L1) of Li2 to the terminal length (Lm2-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (15).

[0104] Li2 / (Lm2-L1)=2×(L6+L5) / 2×(L6+L4+L5) =(L6+L5) / (L6+L4+L5) ···(15)

[0105] In this Example 2, if Lm2=6.2 mm, L1=1.2 mm, L6=1.5 mm, L4=0.5 mm, L5=0.5 mm, and W=1.7 mm, Lo2, Li2, and Sc2 are as follows. Lo2=2×L4=2×0.5=1.0mm Li2=2×(L6+L4)=2×(1.5+0.5)=4.0mm Sc2=2×W×L4=1.7mm 2

[0106] Therefore, in this Example 2, Lo2 / (Lm2-L1) and Li2 / (Lm2-L1) are as follows. Lo2 / (Lm2-L1)=1.0 / (6.2-1.2) = 1.0 / 5.0 ≒ 0.2 Li2 / (Lm2-L1)=4.0 / 5.0≒0.8

[0107] Therefore, in Example 2, the ratio of the total exposed area to one auxiliary terminal 16 excluding the lead terminal receiving portion 18 is 20%, and the ratio of the total internal area is 80%, and the connection area Sc2 is half the connection area Sc1 (= Example 1).

[0108] <Location of exposed area 18-4 on pedestal 6> In Example 2, B is the distance from the center N of the base 6 to the exposed area 18-4. B=(L1 / 2)+L6+L4 =1.2 / 2+0.4+1.6=2.6mm The arrangement of the exposed area 18-4 is such that the relationship of B / A is B / A=2.6 / 5.15=0.50.

[0109] 2B, the exposed area 18-4 is disposed at a position that is at least 1 / 3 of the distance from the center N of the base 6 to the edge N'. In other words, when the length L' from the center N to the edge N' is divided into thirds, the exposed area 18-4 is disposed in a range that is at least 1 / 3 of the distance from the center N of the base 6 to the edge N' and at most 2 / 3 of the distance to the edge N'.

[0110] <Effects of Example 2> According to the second embodiment, one of the following effects can be obtained. (1) The pair of exposed regions 18-4 distributes the exposed portions that contribute to the electrical connection of the auxiliary terminal 16, thereby increasing the connection area and strengthening the connection strength to the wiring conductor.

[0111] (2) The pair of internal regions 18-6 and the pair of internal regions 18-5 distribute the molded portion of the auxiliary terminal 16 relative to the base 6, and the expansion of the fixed area increases the strength with which the auxiliary terminal 16 can be pulled out from the base 6.

[0112] Example 3 Fig. 3 shows a cross section of the base 6 according to Example 3. The configuration shown in Fig. 3 is an example, and the present disclosure is not limited to such a configuration. In Fig. 3, the same parts as those in A of Fig. 2 are denoted by the same reference numerals.

[0113] As in the case of the first embodiment, the auxiliary terminal 16 of the third embodiment has a lead terminal receiving portion 18-1 in the center, and a pair of internal regions 18-6', a pair of exposed regions 18-4', and a pair of internal regions 18-5 on either side of the lead terminal receiving portion 18-1.

[0114] In Example 3, an internal region 18-6' is formed contiguous with the lead terminal receiving portion 18-1 of Example 1, and a pair of exposed regions 18-4' are formed sandwiching the pair of internal regions 18-6'. In other words, the internal region 18-3 is omitted and the exposed regions 18-4' are formed. Since the rest is the same as Example 1, a description thereof will be omitted.

[0115] <Mounting area of ​​base 6, width of auxiliary terminal 16, and groove length of groove portion 14> The mounting area of ​​the base 6, the width of the auxiliary terminal 16, and the groove length of the groove portion 14 in Example 3 are the same as in Example 1, so explanations thereof will be omitted. However, in Example 3 as well, each auxiliary terminal 16 can be fixed within the effective range of the base 6.

[0116] <Length of auxiliary terminal 16, length of lead terminal receiving portion 18-1, embedded region 18-6', exposed region 18-4', and embedded region 18-5> Assuming that the terminal length of each auxiliary terminal 16 in Example 3 is Lm3, the length of the lead terminal receiving portion 18-1 is L1, the length of the internal region 18-6' is L6, the length of the exposed region 18-4' is L4, and the length of the internal region 18-5 is L5, the terminal length Lm3 can be expressed by equation (16). Lm3=L1+2×(L6´+L4´+L5) ···(16)

[0117] If the internal length consisting of the internal region 18-6' and the internal region 18-5 is Li3, this internal length Li3 can be expressed by equation (17). Li3=2×(L6´+L5) (17)

[0118] Since the exposed area of ​​the exposed region 18-4' is W×L4', the connection area Sc3 of one auxiliary terminal 16 can be expressed by equation (18). Sc3=2×W×L4´ (18)

[0119] The ratio Lo3 / (Lm3-L1) of Lo3 to the terminal length (Lm3-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (19). Lo3 / (Lm3-L1)=2×L4´ / 2×(L6´+L4´+L5) =L4´ / (L6´+L4´+L5) ···(19)

[0120] The ratio Li3 / (Lm3-L1) of Li3 to the terminal length (Lm3-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (20). Li3 / (Lm3-L1)=2×(L6´+L5) / 2×(L6´+L4´+L5) =(L6´+L5) / (L6´+L4´+L5) ···(20)

[0121] In this Example 3, if Lm3=6.2 mm, L6'=0.4 mm, and L4'=1.6 mm, Lo3, Li3, and Sc3 are as follows. Lo3=2×L4´=2×1.6=3.2mm Li3=2×(L6´+L5)=2×(0.4+0.5)=1.8mm Sc3=2×W×L4´=5.44mm 2

[0122] Therefore, in this Example 3, Lo3 / (Lm3-L1) and Li3 / (Lm3-L1) are as follows. Lo3 / (Lm3-L1)=3.2 / (6.2-1.2) = 3.2 / 5.0 ≒ 0.64 Li3 / (Lm3-L1)=1.8 / 5.0≒0.36

[0123] Therefore, in Example 3, the ratio of the total exposed area to one auxiliary terminal 16 not including the lead terminal receiving portion 18 is 64%, and the ratio of the total embedded area is 36%.

[0124] <Location of exposed area 18-4' on pedestal 6> In Example 3, B is the distance from the center N of the base 6 to the exposed area 18-4'. B=(L1 / 2)+L6´+L4´ =1.2 / 2+0.4+1.6=2.6mm The layout of exposed area 18-4' is as follows: B / A=2.6 / 5.15=0.50 is.

[0125] 3, the exposed area 18-4' is disposed at a position that is 1 / 3 or more away from the center N of the base 6 to the edge N'. In other words, when the length L' from the center N to the edge N' is divided into thirds, the exposed area 18-4' is disposed at a position that is 1 / 3 or less away from the center N of the base 6 to the edge N' and at least 2 / 3 of the length to the edge N'.

[0126] Therefore, it is desirable that the exposed area 18-4' be disposed on the base 6 at a position that is at least one-third of the distance from the center of the base 6 to the edge.

[0127] <Effects of Example 3> According to the third embodiment, similarly to the first or second embodiment, the strength with which the capacitor 2 is fixed to the wiring conductor of the wiring board can be increased, and the reliability of the connection can be improved.

[0128] <Comparative Example 1> Fig. 4A shows a base 6 according to Comparative Example 1. In Fig. 4A, the same parts as in Fig. 1 are given the same reference numerals. Comparative Example 1 includes an auxiliary terminal 16A, which includes a lead terminal receiving portion 18-1, an exposed region 18-21, and an embedded region 18-31.

[0129] <Length of auxiliary terminal 16A, length of lead terminal receiving portion 18-1, exposed area 18-21, and embedded area 18-31> If the terminal length of the auxiliary terminal 16A is Ln1, the length of the lead terminal receiving portion 18-1 is L1, the length of the exposed area 18-21 is L7, and the length of the embedded area 18-31 is L8, the terminal length Ln1 can be expressed by equation (21).

[0130] Ln1=L1+2×(L7+L8) (21)

[0131] If the exposed length consisting of the exposed regions 18-21 is Lo4, this exposed length Lo4 can be expressed by equation (22).

[0132] Lo4=2×L7 (22)

[0133] If the intrinsic length of the intrinsic region 18-31 is Li4, this intrinsic length Li4 can be expressed by equation (23).

[0134] Li4=2×L8 (23)

[0135] Since the exposed area of ​​the exposed region 18-21 is W×L7, the connection area Sc4 of one auxiliary terminal 16 can be expressed by equation (24).

[0136] Sc4=2×W×L7 (24)

[0137] The ratio Lo4 / (Ln1-L1) of Lo4 to the terminal length (Ln1-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (25).

[0138] Lo4 / (Ln1-L1)=2×L7 / 2×(L7+L8) = L7 / (L7+L8) (25)

[0139] The ratio Li4 / (Ln1-L1) of Li4 ​​to the terminal length (Ln1-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (26).

[0140] Li4 / (Ln1-L1)=2×L8 / 2×(L7+L8) =L8 / (L7+L8) (26)

[0141] In this comparative example 1, if Ln1=3.2 mm, L1=1.2 mm, L7=0.5 mm, and L8=0.5 mm, Lo4, Li4, and Sc4 are as follows. Lo4=2×L7=2×0.5=1.0mm Li4=2×L8=2×0.5=1.0mm Sc4=2×W×L7=2×1.7×0.5=1.7mm 2

[0142] Therefore, in this Comparative Example 1, Lo4 / (Ln1-L1) and Li4 / (Ln1-L1) are as follows. Lo4 / (Ln1-L1)=1.0 / (3.2-1.2) =1.0 / 2.0=0.5 Li4 / (Ln1-L1)=1.0 / 2.0=0.5

[0143] Therefore, in Comparative Example 1, the ratio of the total exposed area to one auxiliary terminal 16 excluding the lead terminal receiving portion 18 is 50%, and the ratio of the total internal area is 50%, and the connection area Sc4 is half the connection area Sc1 (= Example 1) and is the same as the connection area Sc2 (= Example 2).

[0144] <Comparative Example 2> Fig. 4B shows such a base 6 in Comparative Example 2. In Fig. 4B, the same parts as in Fig. 1 are given the same reference numerals. This Comparative Example 2 includes an auxiliary terminal 16B, which includes a lead terminal receiving portion 18-1, an exposed area 18-22, and an embedded area 18-32.

[0145] <Length of the auxiliary terminal 16B, length of the lead terminal receiving portion 18-1, exposed region 18-22, and embedded region 18-32> If the terminal length of the auxiliary terminal 16B is Ln2, the length of the lead terminal receiving portion 18-1 is L1, the length of the exposed area 18-22 is L9, and the length of the embedded area 18-32 is L10, the terminal length Ln2 can be expressed by equation (27).

[0146] Ln2=L1+2×(L9+L10) (27)

[0147] The exposed length Lo5 consisting of the exposed regions 18-22 can be expressed by equation (28).

[0148] Lo5=2×L9 (28)

[0149] The intrinsic length Li5 consisting of the intrinsic regions 18-32 can be expressed by equation (29).

[0150] Li5=2×L10 (29)

[0151] Since the exposed area of ​​the exposed region 18-22 is W×L9, the connection area Sc5 of one auxiliary terminal 16 can be expressed by equation (30).

[0152] Sc5=2×W×L9 (30)

[0153] The ratio Lo5 / (Ln2-L1) of Lo5 to the terminal length (Ln2-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (31).

[0154] Lo5 / (Ln2-L1)=2×L9 / 2×(L9+L10) =L9 / (L9+L10) (31)

[0155] The ratio Li5 / (Ln2-L1) of Li5 to the terminal length (Ln2-L1) of the groove 14 not including the lead terminal receiving portion 18-1 can be expressed by equation (32).

[0156] Li5 / (Ln2-L1)=2×L10 / 2×(L9+L10) =L10 / (L9+L10) (32)

[0157] In this comparative example 2, if Ln2=6.2 mm, L1=1.2 mm, L9=2.0 mm, and L10=0.5 mm, Lo5, Li5, and Sc5 are as follows. Lo5=2×L9=2×2.0=4.0mm Li5 = 2 × L10 = 2 × 0.5 = 1.0 mm Sc5=2×W×L9=2×1.7×2.0=6.8mm 2

[0158] Therefore, in this Comparative Example 2, Lo5 / (Ln2-L1) and Li5 / (Ln2-L1) are as follows. Lo5 / (Ln2-L1)=4.0 / (6.2-1.2) = 4.0 / 5 ≒ 0.8 Li5 / (Ln2-L1)=1.0 / 5≒0.2

[0159] Therefore, in Comparative Example 2, the ratio of the total exposed area to one auxiliary terminal 16 not including the lead terminal receiving portion 18 is 80%, the ratio of the total embedded area is 20%, and the connection area Sc4 is 6.8 mm.

[0160] <Measurement of resonance frequency> Generally, when an object is vibrated, the specific frequency at which the vibration becomes large is called the resonant frequency. When an object is vibrated at this resonant frequency, it resonates and shakes greatly, and it is this shaking that is thought to be the cause of the object's destruction. When an object resonates, if the acceleration (think of it as the force of the shaking) is the same, the higher the resonant frequency, the smaller the object's amplitude. Smaller amplitude = smaller deformation = smaller stress, so it can be assumed that the object is less likely to break. In other words, the higher the resonant frequency, the higher the vibration resistance, and the more durable (less likely to break) the object will be.

[0161] Therefore, measurements of the resonant frequencies of the capacitors according to Example 1, Example 2, Example 3, Comparative Example 1, and Comparative Example 2 of the present disclosure were carried out. For this measurement, a simulation (Simulation 1) was carried out simulating an actual vibration resistance test using a 3D model of a capacitor mounted on a wiring board (=printed circuit board), and the vibration resistance of capacitors 2 according to Example 1, Example 2, Example 3, Comparative Example 1, and Comparative Example 2, which are provided with a base 6, was verified. In Simulation 1, the test conditions were a vibration frequency of 1000 Hz to 4000 Hz and an acceleration of 1 G, and the resonant frequency was determined. Each value is an example for carrying out Simulation 1 of the present disclosure, and the present disclosure is not limited to these values.

[0162] <Results of Simulation 1> The results of this Simulation 1 are shown in Table 1. In Table 1, the value of the resonance frequency of Comparative Example 1 is set as a reference value: 1, and the ratios of the resonance frequencies of Examples 1, 2, and 3 and Comparative Examples 1 and 2 are shown relative to this.

[0163] [Table 1]

[0164] The results of Simulation 1 show that the resonant frequencies are high in Example 1, Example 2, Example 3, and Comparative Example 2. Therefore, it is estimated that providing the base 6 of Example 1, Example 2, Example 3, and Comparative Example 2 can improve vibration resistance and realize a capacitor with high durability.

[0165] It can be said that the resonant frequencies are almost the same among Examples 1, 2, and 3 and Comparative Example 2. This is presumably because the overall lengths of auxiliary terminals 16 are the same and the exposed areas are uniformly located on the rear surface of base 6.

[0166] The resonance frequency of Comparative Example 1 is lower than that of Examples 1, 2, 3, and Comparative Example 2. This is presumably because the overall length of the auxiliary terminal 16 of Comparative Example 1 is shorter than that of Examples 1, 2, 3, and Comparative Example 2.

[0167] <Measurement of the pull-out force of the auxiliary terminal 16> Capacitor 2 is generally mounted on a wiring board, connected to the wiring conductors using solder and fixed to the wiring board. It is expected that the wiring board and the mounted capacitor will be subjected to vibrations from the device on which the wiring board is installed. This vibration applies a tensile force between the mounting surface of the capacitor and the wiring board. This tensile force generates stress in auxiliary terminal 16, causing a decrease in connection strength and fixing strength in the area where this stress is concentrated. In other words, if the pull-out force of auxiliary terminal 16 from base 6 is high, the decrease in connection strength and fixing strength can be suppressed.

[0168] Therefore, measurements were carried out on the pull-out force of the auxiliary terminals 16 from the pedestals 6 according to Example 1, Example 2, Example 3, Comparative Example 1, and Comparative Example 2 of the present disclosure. For this measurement, a simulation was carried out (Simulation 2) simulating an actual pull-out force test using a 3D model of the pedestal 6 mounted on a wiring board (=printed circuit board). In Simulation 2, the pull-out force (maximum stress value) from the pedestal 6 was determined when a certain force was applied from the pedestal 6 to the exposed area (exposed area not including the lead terminal receiving portion 18 that houses the lead terminals 8) of the auxiliary terminals 16 in Example 1, Example 2, Example 3, Comparative Example 1, and Comparative Example 2 that include the pedestal 6, and the ease with which the auxiliary terminals 16 can be removed was verified.

[0169] The conditions such as the shape of Examples 1, 2, 3, Comparative Examples 1 and 2 are the same as those in the case of measuring the resonance frequency, and therefore the description thereof will be omitted.

[0170] <Results of Simulation 2> The results of Simulation 2 are shown in Table 2. Table 2 shows the ratio of the pull-out force of Examples 1, 2, and 3 and Comparative Examples 1 and 2 to the pull-out force of Comparative Example 1, which is set as a reference value of 1.

[0171] [Table 2]

[0172] Comparing the results of Simulation 2 between Example 1 and Example 2, the pull-out force (maximum stress value) of Example 1 is smaller than that of Example 2. This is presumably because, compared to Example 2, Example 1 has more exposed portions of auxiliary terminal 16 from base 6, which allows the applied force to be dispersed, thereby reducing the pull-out stress equivalent to the pull-out force.

[0173] Comparing Example 2 with Comparative Example 1, the pull-out force of Example 2 is smaller than that of Comparative Example 1. This is presumably because, compared to Comparative Example 1, the exposed area of ​​auxiliary terminal 16 from base 6 in Example 2 is relatively smaller than the area inside (fixed area with) base 6, making it difficult for stress to concentrate.

[0174] Comparing Comparative Example 2 with Example 2, the pull-out force of Example 2 is smaller than that of Comparative Example 2. In Example 2, which has a bent portion (internal area), the exposed area of ​​the auxiliary terminal 16 from the base 6 is smaller and the buried portion (internal area) of the auxiliary terminal 16 internal to the base 6 is larger than in Comparative Example 2. For this reason, it can be inferred that even if a pull-out force is applied to the exposed surface from the base 6, the deformation amount of the auxiliary terminal 16 is small and the stress due to the pull-out force (maximum stress value) is also small.

[0175] Comparing Example 3 with Comparative Example 1, the pull-out force of Example 3 is smaller than that of Comparative Example 1. In Example 3, which has a bent portion (internal area), the exposed area of ​​the auxiliary terminal 16 from the base 6 is larger than in Comparative Example 1, but since the internal area of ​​the auxiliary terminal 16 is within the base 6, it can be assumed that even if a pull-out force is applied to the exposed surface from the base 6, the deformation amount of the auxiliary terminal 16 is small, and the stress due to the pull-out force (maximum stress value) is also small.

[0176] Other Embodiments (1) In the above embodiment, a capacitor is illustrated, but the present disclosure may be applied to components such as a coil, an inductor, a resistor, and a battery.

[0177] (2) Although a wiring board is used as an example of a mounting member for the capacitor 2, the present invention is not limited to a wiring board and can be applied to various mounting members in addition to a printed circuit board.

[0178] (3) In the electronic component base of the present disclosure, if a through-hole is provided in the internal region, the base resin can be inserted into the through-hole by insert molding, thereby increasing the fixing strength between the base and the auxiliary terminal. Furthermore, the internal region may be provided with an uneven portion, which increases the bonding area between the uneven portion and the base resin, thereby improving the anchoring effect of the auxiliary terminal to the base.

[0179] (4) In the electronic component base of the present disclosure, if the auxiliary terminal has an area where it overlaps with the vertical wall portion of the base, the earthquake resistance of the auxiliary terminal relative to the base is improved and the auxiliary terminal can prevent distortion of the base and deformation of the auxiliary terminal.

[0180] (5) In the electronic component base of the present disclosure, each auxiliary terminal has four exposed areas as the multiple exposed areas. However, multiple exposed areas may be provided on either one of the auxiliary terminals.

[0181] (6) In Examples 1 and 2, the exposed area 18-4 is positioned at a distance of at least 1 / 3 of the length from the center N of the base 6 to the edge N' and at a distance of not more than 2 / 3 of the length to the edge N', but it may also be positioned at a distance of not more than 1 / 3 of the length from the center N of the base 6 to the edge N' and at a distance of not less than 2 / 3 of the length to the edge N'.

[0182] (7) In Example 3, the exposed area 18-4' is positioned at a distance of less than 1 / 3 of the length from the center N of the base 6 to the edge N' and at a distance of more than 2 / 3 of the length to the edge N'. However, the exposed area 18-4' may also be positioned at a distance of more than 1 / 3 of the length from the center N of the base 6 to the edge N' and at a distance of less than 2 / 3 of the length to the edge N'.

[0183] As described above, the most preferred embodiment of the present invention has been described. The technology of the present disclosure is not limited to the above description. Various modifications and changes are possible for those skilled in the art based on the gist of the invention described in the claims or disclosed in the specification. It goes without saying that such modifications and changes are included within the scope of the present invention. [Industrial Applicability]

[0184] In the present disclosure, an auxiliary terminal is provided with a lead terminal receiving portion, an internal region that is internal to the base, and an exposed region that is exposed from the base, and this auxiliary terminal is provided on the base. Therefore, when a surface-mounted electronic component such as a capacitor or coil is placed on this base, the auxiliary terminal has a high pull-out force and can have an increased fixing strength to a wiring board, thereby advantageously improving durability and connection reliability. [Explanation of symbols]

[0185] 2 Chip capacitors 4. Capacitor body 6. Pedestal 8-1, 8-2 Lead terminals 10-1, 10-2, 10-3, 10-4 Ribs 12 Through hole 14 Groove 16-1, 16-2, 16A, 16B auxiliary terminal 18-1 Lead terminal receiving part 18-2, 18-4, 18-4´, 18-21, 18-22 exposure range 18-3, 18-5, 18-6, 18-6´, 18-31, 18-32 internal area

Claims

1. A base for an electronic component, the base includes a groove for accommodating the lead terminal and an auxiliary terminal disposed in a direction intersecting the lead terminal, the auxiliary terminal includes a lead terminal receiving portion, an internal region that is internal to the base, and a plurality of exposed regions that are exposed from the base in a range from the center to the edge of the base, The electronic component seat is provided with the embedded area between the lead terminal receiving portion and the exposed area.

2. The electronic component base according to claim 1 , wherein the exposed area is located at a distance of at least one-third of the length from the center of the base to the edge.

3. 3. The electronic component holder according to claim 1, wherein the length of the embedded region is 0.4 mm or more and is ¼ or more of the length of the exposed region.

4. 4. The electronic component holder according to claim 1, wherein a length of the inherent region relative to the exposed region satisfies the relationship: inherent region > exposed region.

5. 5. The electronic component holder according to claim 1, wherein the internal region has a through hole or an uneven portion.

6. 6. The electronic component base according to claim 1, wherein the auxiliary terminal has an area overlapping the upright wall of the base with the base sandwiched therebetween.

7. a step of molding an auxiliary terminal having a lead terminal receiving portion, an internal region that is internal to a base, and a plurality of exposed regions that are exposed from the base in a range from the center to the edge of the base; a step of molding a base with an insulating resin, the base having the lead terminal receiving portion disposed in a groove portion, the embedded region embedded therein, and the exposed region exposed thereto; A method for manufacturing a base, comprising:

8. An electronic component comprising the electronic component seat according to any one of claims 1 to 6.

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