Semiconductor manufacturing equipment

Abstract

A film application apparatus (100), which is an example of a semiconductor manufacturing apparatus according to the embodiment of this disclosure, comprises a table (TB) on which a semiconductor wafer (W) is placed, a pressing roller (20) for pressing a film (6) to be applied to the semiconductor wafer (W) placed on the table (TB), and a vacuum chamber (VC) for housing the semiconductor wafer (W) placed on the table (TB) and the pressing roller (20).

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus.

Background Art

[0002] Conventionally, a film sticking apparatus including a table on which a semiconductor wafer is placed and a pressing member that presses a film applied to the semiconductor wafer placed on the table is known (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above-described apparatus is configured to stick a film to a semiconductor wafer under atmospheric pressure. Therefore, in the above-described apparatus, there is a possibility that air is trapped between the semiconductor wafer and the film.

[0005] Therefore, it is desirable to provide a semiconductor manufacturing apparatus that can suppress the trapping of air between the semiconductor wafer and the film.

Means for Solving the Problems

[0006] A semiconductor manufacturing apparatus according to an embodiment of the present disclosure includes a table on which a semiconductor wafer is placed, a pressing member that presses a film to be attached to the semiconductor wafer placed on the table, and a vacuum chamber that houses the semiconductor wafer placed on the table and the pressing member. A film cutting device for cutting the film attached to the semiconductor wafer, and comprises The vacuum chamber houses a film supply unit in which the film is wound before being attached to the semiconductor wafer, and a film winding unit in which the used film is wound. The film cutting device is located outside the vacuum chamber. it.

Effects of the Invention

[0007] The aforementioned semiconductor manufacturing equipment can prevent air from becoming trapped between the semiconductor wafer and the film. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of a film application apparatus according to an embodiment of the present disclosure. [Figure 2] Figure 1 is a right side view of the film application device. [Figure 3] Figure 1 shows the components of the film application apparatus: conduit, vacuum port, table, vacuum chamber, vacuum valve, and vacuum pump. [Figure 4] Figure 1 is a perspective view of the vacuum chamber that makes up the film application apparatus shown. [Figure 5] Figure 1 is a perspective view of the vacuum chamber that makes up the film application apparatus shown. [Figure 6] Figure 1 is a cross-sectional view of the vacuum chamber and the components housed within it, which constitute the film application apparatus shown. [Figure 7] Figure 1 is a flowchart showing the procedure performed by the film application device. [Figure 8] This is a rear view of the components that make up the film application device shown in Figure 1. [Modes for carrying out the invention]

[0009] Hereinafter, a film application apparatus 100, which is an example of a semiconductor manufacturing apparatus according to the embodiment of this disclosure, will be described with reference to the drawings. The film application apparatus 100 is also called a laminator. Figure 1 is a diagram showing an example of the configuration of the film application apparatus 100. Specifically, the upper part of Figure 1 is a perspective view of the film application apparatus 100, and the lower part of Figure 1 is a perspective view of the film application apparatus 100 with the upper cover member CBU removed.

[0010] In Figure 1, X1 represents one direction of the X-axis in the three-dimensional Cartesian coordinate system, and X2 represents the other direction of the X-axis. Similarly, Y1 represents one direction of the Y-axis in the three-dimensional Cartesian coordinate system, and Y2 represents the other direction of the Y-axis. Likewise, Z1 represents one direction of the Z-axis in the three-dimensional Cartesian coordinate system, and Z2 represents the other direction of the Z-axis. In Figure 1, the X1 side of the film application device 100 corresponds to the front side of the film application device 100, and the X2 side of the film application device 100 corresponds to the rear side of the film application device 100. Furthermore, the Y1 side of the film application device 100 corresponds to the left side of the film application device 100, and the Y2 side of the film application device 100 corresponds to the right side of the film application device 100. Furthermore, the Z1 side of the film application device 100 corresponds to the upper side of the film application device 100, and the Z2 side of the film application device 100 corresponds to the lower side of the film application device 100. The same applies to other components in the other figures.

[0011] The film application apparatus 100 is a device used when applying a film to a semiconductor wafer. Note that "applying a film to a semiconductor wafer" is also expressed as "laminating a semiconductor wafer." In the illustrated example, as shown in the upper diagram of Figure 1, the film application apparatus 100 includes a main body MB covered by a cover member CB composed of an upper cover member CBU and a lower cover member CBD, and a load-side load port LD, an unload-side load port UL, and a vacuum pump VP located outside the cover member CB. As shown in the lower diagram of Figure 1, the main body MB is composed of an aligner AL, a film cutting device CU, a robot RB, a table TB, and a vacuum chamber VC.

[0012] Figure 2 is a right side view of the film application device 100. Specifically, the top image in Figure 2 is a right side view of the film application device 100 with the upper cover member CBU removed, the middle image in Figure 2 is a right side view of the film application device 100 with the lower cover member CBD removed, and the bottom image in Figure 2 is a right side view of the film application device 100 with the aligner AL, load-side load port LD, robot RB, and unload-side load port UL removed.

[0013] Figure 3 shows the conduit CD, vacuum port PT, table TB, vacuum chamber VC, vacuum valve VL, and vacuum pump VP. Specifically, the left side of Figure 3 is a right side view of the conduit CD, vacuum port PT, table TB, vacuum chamber VC, vacuum valve VL, and vacuum pump VP, corresponding to the bottom side view of Figure 2. The right side of Figure 3 is a front view of the conduit CD, vacuum port PT, table TB, vacuum chamber VC, vacuum valve VL, and vacuum pump VP.

[0014] The load-side load port LD is a device for loading semiconductor wafers without film (tape) attached into the film application apparatus 100. In the illustrated example, the semiconductor wafers before film application are housed in a hoop (FOUP: Front Opening Unified Pod) or magazine set in the load-side load port LD (see Figure 1), and are removed one by one.

[0015] The unload-side load port UL is a device for removing semiconductor wafers to which film has been attached by the film attachment device 100. In the illustrated example, the semiconductor wafers with the attached film are placed one by one into hoops set in the unload-side load port UL (see Figure 1).

[0016] The vacuum pump VP is a pump for evacuating the space inside the vacuum chamber VC. In the illustrated example, the vacuum pump VP is configured to be able to reduce the pressure inside the vacuum chamber VC to 1 to 10 Pa. Specifically, the vacuum pump VP is connected to three vacuum ports PT provided in the vacuum chamber VC by a conduit CD. The conduit CD includes a large-diameter pipe CDM connected to the vacuum pump VP and three small-diameter pipes (first small-diameter pipe CD1, second small-diameter pipe CD2, and third small-diameter pipe CD3) that branch from the large-diameter pipe CDM and are connected to the vacuum ports PT. And in the middle of the three small-diameter pipes (first small-diameter pipe CD1, second small-diameter pipe CD2, and third small-diameter pipe CD3), vacuum valves VL (first vacuum valve VL1, second vacuum valve VL2, and third vacuum valve VL3) are respectively attached. Also, one of the three vacuum valves VL (first vacuum valve VL1) is a slow vent valve.

[0017] The robot RB is an example of a transfer device for transferring a semiconductor wafer from one position to another within the film sticking device 100. In the illustrated example, the robot RB is a multi-axis robot for transfer and is configured to be able to transfer a semiconductor wafer between an aligner AL, a load side load port LD, a table TB, and an unload side load port UL.

[0018] The aligner AL is a device for detecting the center position and notch position of a semiconductor wafer. In the illustrated example, the aligner AL is configured to be able to align the center of the semiconductor wafer with the center of the table TB on which the semiconductor wafer is placed. That is, the aligner AL can perform centering of the semiconductor wafer.

[0019] The table TB is a device on which a semiconductor wafer is placed. In the illustrated example, the table TB is configured to be slidable in the X-axis direction, elevable in the Z-axis direction, so that a film can be attached to the semiconductor wafer placed on the table TB inside the vacuum chamber VC.

[0020] The film cutting apparatus CU is a device for cutting a film attached to a semiconductor wafer. In the illustrated example, the film cutting apparatus CU is configured to cut the film attached to the semiconductor wafer inside the vacuum chamber VC using a blade BD (see upper diagram in Figure 5). The film cutting apparatus CU may also be a device capable of irradiating a laser for cutting the film attached to the semiconductor wafer inside the vacuum chamber VC. The laser may be, for example, a UV laser or a CO2 laser.

[0021] The vacuum chamber VC is a structure that encloses the space that is evacuated by the vacuum pump VP. In the illustrated example, the vacuum chamber VC is a structure that encloses a space that is a combination of three roughly rectangular parallelepiped spaces. The space that is a combination of three roughly rectangular parallelepiped spaces is a first roughly rectangular parallelepiped space extending in the Y-axis direction, a second roughly rectangular parallelepiped space extending downward from the left end (Y1 side end) of the first space, and a third roughly rectangular parallelepiped space extending downward from the right end (Y2 side end) of the first space. Note that the vacuum chamber VC may be a structure that encloses a space of any shape, such as a single roughly rectangular parallelepiped, roughly cylindrical, roughly polygonal prism, or roughly spherical, or it may be a structure that encloses a space that is a combination of two or more spaces of any shape, such as a roughly rectangular parallelepiped, roughly cylindrical, roughly polygonal prism, or roughly spherical.

[0022] Figures 4 and 5 are perspective views of the vacuum chamber VC, and Figure 6 is a cross-sectional view of the vacuum chamber VC. Specifically, the upper part of Figure 4 is a perspective view of the vacuum chamber VC showing the front, top, and right side, and the lower part of Figure 4 is a perspective view of the vacuum chamber VC showing the rear, top, and left side. Furthermore, the upper part of Figure 5 is a perspective view of the vacuum chamber VC showing the front, top, and right side, and the lower part of Figure 5 is a perspective view of the vacuum chamber VC showing the rear, bottom, and right side. Note that the upper part of Figure 5 includes a perspective view of the film cutting device CU to show the positional relationship between the vacuum chamber VC and the film cutting device CU. The upper part of Figure 6 shows a cross-section of the vacuum chamber VC and the components housed within the vacuum chamber VC on a virtual plane parallel to the YZ plane containing the cutting line L1 in the lower part of Figure 4. Furthermore, the lower left diagram of Figure 6 is an enlarged view of the area R1 enclosed by the dashed line, and the lower right diagram of Figure 6 is an enlarged view of the area R2 enclosed by the dashed line. Note that in Figure 6, for the sake of clarity, the table TB and the lower cover member BC are shown, while the table lifting mechanism EM, which is the mechanism for raising and lowering the table TB, is omitted from the illustration.

[0023] Specifically, the vacuum chamber VC is formed by welding together a plurality of plate members 10. In the illustrated example, the plate members 10 are made of aluminum and include a rear plate member 10B, a central lower plate member 10DC, a left lower plate member 10DL, a right lower plate member 10DR, a front plate member 10F, a left inner plate member 10IL, a right inner plate member 10IR, a left plate member 10L, a right plate member 10R, and an upper plate member 10U.

[0024] Furthermore, as shown in the lower part of Figure 5, the central lower plate member 10DC is provided with a lower opening LH as a first through-hole to allow the table TB to be inserted and removed. In the illustrated example, the lower opening LH is a substantially rectangular opening when viewed from below, and is configured to have an opening area larger than the surface area of ​​the table TB. The lower opening LH is then sealed by a lower cover member BC, as shown in the upper part of Figure 6. Specifically, as shown in the lower right part of Figure 6, a lower groove GVD is formed on the upper surface of the lower cover member BC, into which a lower O-ring RGD, which is positioned to surround the lower opening LH, is fitted. The lower groove GVD is configured to have a trapezoidal cross-section with a bottom width wider than the width of the opening in order to prevent the lower O-ring RGD from falling out.

[0025] Furthermore, as shown in the lower right side plate member 10DR, three vacuum ports PT are provided. Each of the three vacuum ports PT is connected to a conduit CD that leads to a vacuum pump VP.

[0026] Furthermore, a door member 11 is attached to a part of the plate member 10. In the illustrated example, the door member 11 is made of aluminum and includes a rear door member 11B, a left door member 11L, and a right door member 11R. Specifically, the rear door member 11B is attached to the rear plate member 10B, the left door member 11L is attached to the left plate member 10L, and the right door member 11R is attached to the right plate member 10R. The rear door member 11B includes a central rear door member 11BC, a left rear door member 11BL, and a right rear door member 11BR.

[0027] The door member 11 is configured to be opened and closed by a lever lock mechanism 12, and a sealing member such as an O-ring is placed between the plate member 10 and the door member 11. Specifically, the rear door member 11B is configured to be opened and closed by a rear lever lock mechanism 12B, the left door member 11L is configured to be opened and closed by a left lever lock mechanism 12L, and the right door member 11R is configured to be opened and closed by a right lever lock mechanism 12R. More specifically, the central rear door member 11BC is configured to be opened and closed by a pair of central rear lever lock mechanisms 12BC, the left rear door member 11BL is configured to be opened and closed by a left rear lever lock mechanism 12BL, and the right rear door member 11BR is configured to be opened and closed by a right rear lever lock mechanism 12BR.

[0028] Furthermore, a reinforcing member 13 is attached to a part of the plate member 10. In the illustrated example, the reinforcing member 13 is made of aluminum and includes a front reinforcing member 13F and an upper reinforcing member 13U. Specifically, the front reinforcing member 13F is attached to the front plate member 10F, and the upper reinforcing member 13U is attached to the upper plate member 10U. The front reinforcing member 13F includes a left front reinforcing member 13FL and a right front reinforcing member 13FR. In addition, the upper reinforcing member 13U is provided with an upper opening UH as a second penetration part, as shown in the upper part of Figure 5, to enable the film attached to the semiconductor wafer to be cut by the film cutting device CU. In the illustrated example, the upper opening UH is a substantially rectangular opening when viewed from above and is configured to have an opening area larger than the cross-sectional area of ​​the film cutting device CU. The upper opening UH is then sealed by an upper cover member TC, as shown in the upper part of Figure 6. Specifically, as shown in the lower left of Figure 6, an upper groove GVU is formed on the lower surface of the upper cover member TC, into which the upper O-ring RGU, which is positioned to surround the upper opening UH, is fitted. The upper groove GVU is configured to have a trapezoidal cross-section with a bottom width wider than the width of the opening in order to prevent the upper O-ring RGU from falling out.

[0029] Furthermore, a translucent member 14 (see upper diagram in Figure 4) is fitted into a portion of the door member 11 and the reinforcing member 13. In the illustrated example, the translucent member 14 is made of resin (typically transparent resin) and includes a rear translucent member 14B, a front translucent member 14F, and an upper translucent member 14U. Specifically, the rear translucent member 14B is fitted into the rear door member 11B, the front translucent member 14F is fitted into the front reinforcing member 13F, and the upper translucent member 14U is fitted into the upper reinforcing member 13U. More specifically, the left rear translucent member 14BL is fitted into the left rear door member 11BL, the right rear translucent member 14BR is fitted into the right rear door member 11BR, the left front translucent member 14FL is fitted into the left front reinforcing member 13FL, and the central front translucent member 14FC and the right front translucent member 14FR are fitted into the right front reinforcing member 13FR.

[0030] Furthermore, sensors 15, such as optical sensors, are attached to the outside of the light-transmitting member 14. In the illustrated example, the sensors 15 are infrared sensors and include a rear sensor 15B attached to the outside of the rear light-transmitting member 14B. Specifically, a first left rear sensor 15BL1 and a second left rear sensor 15BL2 are attached to the outside of the left rear light-transmitting member 14BL, and a right rear sensor 15BR is attached to the outside of the right rear light-transmitting member 14BR. Sensors 15 located outside the vacuum chamber VC are not adversely affected by rapid pressure changes inside the vacuum chamber VC. Therefore, this configuration, in which sensors 15 are located outside the vacuum chamber VC, can improve the durability of the film application device 100.

[0031] Furthermore, a vacuum connector 16 is provided on a part of the plate member 10, which hermetically seals the inside and outside of the vacuum chamber VC while relaying the electrical connection between equipment inside the vacuum chamber VC and equipment outside the vacuum chamber VC. Specifically, a front vacuum connector 16F is provided on the front plate member 10F.

[0032] In the illustrated example, the door member 11, lever lock mechanism 12, reinforcing member 13, light-transmitting member 14, and sensor 15 are attached to the plate member 10 using bolts, but the bolt holes are formed so as not to penetrate the plate member 10. This is to improve the airtightness of the vacuum chamber VC.

[0033] Next, with reference to Figure 7, the operations performed by the film application device 100 will be described. Figure 7 is a flowchart showing the procedure for the operations performed by the film application device 100.

[0034] First, the film application apparatus 100 transfers a semiconductor wafer from the load-side load port LD to the aligner AL using the robot RB (step ST1). Specifically, the film application apparatus 100 operates the robot RB to grasp one of the multiple semiconductor wafers placed on the load-side load port LD, and transfers that semiconductor wafer onto the aligner AL as shown by arrow AR1 in Figure 1 and arrow AR1 in the upper diagram of Figure 2.

[0035] Subsequently, the film application apparatus 100 detects the center position and notch position of the semiconductor wafer in the aligner AL (step ST2).

[0036] Subsequently, the film application apparatus 100 transfers the semiconductor wafer from the aligner AL to the table TB using the robot RB (step ST3). Specifically, the film application apparatus 100 operates the robot RB to grasp the semiconductor wafer whose center position and notch position have been detected in the aligner AL, and transfers the semiconductor wafer onto the table TB, aligning the center position and the direction of the notch, as shown by arrow AR2 in Figure 1 and arrow AR2 in the upper part of Figure 2.

[0037] Subsequently, the film application device 100 adsorbs the semiconductor wafer (step ST4). Specifically, the film application device 100 uses a vacuum chuck provided on the table TB to adsorb the lower surface of the semiconductor wafer placed on the table TB.

[0038] Subsequently, the film application device 100 slides the table TB to below the lower opening LH of the vacuum chamber VC (step ST5). Specifically, the film application device 100 operates a linear actuator (not shown) to slide the table TB toward the X2 side (rear side) as indicated by arrow AR3 in the lower diagram of Figure 2 and arrow AR3 in the left diagram of Figure 3.

[0039] Subsequently, the film application device 100 raises the table TB (lower lid member BC) to seal the lower opening LH of the vacuum chamber VC (step ST6). Specifically, the film application device 100 operates the table lifting mechanism EM to raise the table TB and the lower lid member BC as shown by arrow AR4 in the right diagram of Figure 3. In the illustrated example, the film application device 100 raises the lower lid member BC to the position shown in the upper diagram of Figure 6. That is, the film application device 100 presses the lower lid member BC against the central lower plate member 10DC from below.

[0040] Subsequently, the film application device 100 slides the upper cover member TC over the upper opening UH of the vacuum chamber VC (step ST7). Specifically, the film application device 100 operates a linear actuator (not shown) to slide the upper cover member TC to the Y2 side (right side), as indicated by arrow AR5 in the right-hand diagram of Figure 3.

[0041] Subsequently, the film application device 100 lowers the upper lid member TC to seal the upper opening UH of the vacuum chamber VC (step ST8). Specifically, the film application device 100 lowers the upper lid member TC by operating an upper lid member lifting mechanism (not shown). In the illustrated example, the film application device 100 lowers the upper lid member TC to the position shown in the upper diagram of Figure 6. That is, the film application device 100 presses the upper lid member TC against the upper reinforcing member 13U from above.

[0042] The film application device 100 may, after pressing the upper cover member TC against the upper reinforcing member 13U, press the lower cover member BC against the central lower plate member 10DC.

[0043] Subsequently, the film application device 100 performs vacuuming using the vacuum pump VP (step ST9). Specifically, the film application device 100 operates the vacuum pump VP to discharge the air inside the vacuum chamber VC to the outside through the vacuum port PT and conduit CD until the pressure inside the vacuum chamber VC reaches 1 to 10 Pa.

[0044] Subsequently, the film application apparatus 100 performs the film application (step ST10). Specifically, the film application apparatus 100 operates the film application mechanism FPM housed in the vacuum chamber VC to apply the film to the semiconductor wafer under near-vacuum conditions.

[0045] Here, with reference to Figure 8, the film application mechanism FPM housed in the vacuum chamber VC will be described. Figure 8 is a rear view of the film application mechanism FPM. Specifically, the top image in Figure 8 shows the state of the film application mechanism FPM before the film 6 is applied to the semiconductor wafer W, the second image from the top of Figure 8 shows the state of the film application mechanism FPM while the film 6 is being applied to the semiconductor wafer W, the third image from the top of Figure 8 shows the state of the film application mechanism FPM after the film 6 has been applied to the semiconductor wafer W, and the bottom image in Figure 8 shows the state of the film application mechanism FPM after the unnecessary portion (the portion other than the portion applied to the semiconductor wafer W) of the single-layer film F1 (film 6) attached to the outer peripheral support member 5 has been peeled off from the outer peripheral support member 5.

[0046] In the illustrated example, the film application mechanism FPM is a mechanism used when applying a film 6, such as a dry film resist, to a semiconductor wafer W. It is configured to apply the film 6 to a semiconductor wafer W, which is circular in top view and placed on a table TB, which is circular in top view. In the illustrated example, the film application mechanism FPM includes a film supply unit 3, a film winding unit 4, a carrier film winding unit 8, and a moving unit MU. Specifically, as shown in the upper diagram of Figure 8, the film supply unit 3 is located on the Y1 side of the table TB, and the film winding unit 4 is located on the Y2 side of the table TB. A two-layer film F2 is supplied from the film supply unit 3. In the illustrated example, the first left rear sensor 15BL1 and the second left rear sensor 15BL2 (see the lower diagram of Figure 4) are provided to detect the state of the two-layer film F2 in the film supply unit 3 (remaining amount or sagging, etc.). The same applies to the sensor 15 located outside the left front light-transmitting member 14FL (see the upper diagram of Figure 4). Furthermore, the right rear sensor 15BR (see lower diagram in Figure 4) is provided to detect the condition of the used film in the film winding section 4 (amount recovered or sagging, etc.). The same applies to the sensors 15 located on the outside of the right front light-transmitting member 14FR (see upper diagram in Figure 4) and the upper light-transmitting member 14U (see lower diagram in Figure 4). In the illustrated example, the left door member 11L (see lower diagram in Figure 4) is opened and closed when the film supply section 3 is replaced, and the right door member 11R (see upper diagram in Figure 4) is opened and closed when the film winding section 4 is replaced. In the illustrated example, the two-layer film F2 is formed by laminating a carrier film 7 onto one surface of a film 6 having a functional adhesive surface. The two-layer film F2 is formed by peeling off the carrier film 7 by the pinch roller 9 to become a single-layer film F1 (film 6). The carrier film 7 is then wound onto the carrier film winding section 8. Then, as the moving unit MU (second moving unit MU2) moves in the Y2 direction as indicated by arrow AR7 in the second figure from the top of Figure 8, the single-layer film F1 (film 6) is attached to the surface of the semiconductor wafer W and the outer peripheral support member 5 (see the lower figure of Figure 1), respectively, and the single-layer film F1 (film 6) is cut along the semiconductor wafer W by the film cutting device CU.Subsequently, the movement of the moving unit MU in the Y1 direction, as indicated by arrow AR9 in the third figure from the top of Figure 8, causes the unnecessary portion of the single-layer film F1 (film 6) attached to the outer peripheral support member 5 (the portion other than the portion attached to the semiconductor wafer W) to be peeled off from the outer peripheral support member 5. Note that the two-layer film F2 may be a three-layer film with a protective film on the opposite side of the carrier film.

[0047] The table TB is configured to be raised and lowered by a table lifting mechanism EM that includes slide rods RD and a lower cover member BC. Specifically, the table TB is fixed to the upper ends of four slide rods RD, which are supported on the frame FM so as to be able to move up and down, via the lower cover member BC. That is, the table lifting mechanism EM is configured to raise and lower the table TB by raising and lowering the slide rods RD with the driving force of a drive source (not shown), such as an air cylinder. The table TB also has a part of an intake passage formed therein, one end of which opens to the mounting surface and the other end of which is connected to an intake source (not shown), such as a pump. In the illustrated example, the intake passage includes a groove formed on the mounting surface (upper surface) of the table TB, and a plurality of through holes (holes that penetrate the table TB in the vertical direction) formed in the groove. Therefore, the semiconductor wafer W is attracted onto the table TB by the intake action of the intake source.

[0048] As shown in the upper part of Figure 6, a pair of sliding shaft members SX extending horizontally (in the direction perpendicular to the rotation axis of the pinch roller 9 (Y-axis direction)) are arranged on one side (X1 side) of the table TB in the direction parallel to the rotation axis of the pinch roller 9 (X-axis direction). A moving unit MU, including a first moving unit MU1 and a second moving unit MU2, is supported on these sliding shaft members SX so as to be able to slide horizontally. The moving unit MU is configured to move horizontally by the driving force of a drive source (not shown), such as an air cylinder. In the illustrated example, the central rear door member 11BC (see lower part of Figure 4) is opened and closed when maintaining the moving unit MU, the left rear door member 11BL (see lower part of Figure 4) is opened and closed when maintaining the film supply unit 3 and the carrier film winding unit 8, and the right rear door member 11BR (see lower part of Figure 4) is opened and closed when maintaining the film winding unit 4.

[0049] The second moving unit MU2 has a pressing roller 20 that presses the film 6, which is placed on the surface side of the semiconductor wafer W on the table TB. The pressing roller 20 is an example of a pressing member, and at least the roller surface of the pressing roller 20 is made of an elastic material such as rubber. The pressing roller 20 is also called a laminating roller. The film 6, which is placed on the surface side of the semiconductor wafer W on the table TB, is stretched at an angle under tension in a vacuum. Due to the absence of air in the vacuum chamber VC and the angle (inclination) when tension is applied, even when the film 6 is attached to a semiconductor wafer W with an uneven surface, air bubbles are less likely to form and wrinkles are less likely to form, enabling high-quality lamination with a high yield.

[0050] As shown in the top diagram of Figure 8, the film application mechanism FPM can apply a single layer film F1 (film 6) to the surface side of the semiconductor wafer W by positioning the first moving unit MU1 on one end (Y1 side) of the slide shaft member SX. The top diagram of Figure 8 shows the state of the film application mechanism FPM when the single layer film F1 (film 6) is applied to the surface side of the semiconductor wafer W in an inclined state (the Y2 side portion is higher than the Y1 side portion).

[0051] Subsequently, the table TB is raised by the table lifting mechanism EM, as indicated by arrow AR6 in the top diagram of Figure 8, and the Y1 side edge of the semiconductor wafer W placed on the table TB is brought into contact with the single layer film F1 (film 6), as shown in the second diagram from the top of Figure 8.

[0052] Subsequently, the film application mechanism FPM moves the second moving unit MU2, located at one end (Y1 side) of the slide shaft member SX, to the other end (Y2 side) of the slide shaft member SX, as shown by arrow AR7 in the second figure from the top of Figure 8. This allows the pressing roller 20 to press and attach the single-layer film F1 (film 6) to the surface of the semiconductor wafer W. The third figure from the top of Figure 8 shows the state of the film application mechanism FPM when the single-layer film F1 (film 6) has been attached to the surface of the semiconductor wafer W.

[0053] The pressing roller 20 may be configured to adjust its pressing force according to the pressing area of ​​the semiconductor wafer W (the contact area between the pressing roller 20 and the semiconductor wafer W) by a pressing force adjustment mechanism (not shown).

[0054] Furthermore, a rectangular annular outer peripheral support member 5 (see lower diagram in Figure 1) is provided on the outer periphery of the table TB. The outer peripheral support member 5 is also called a bumper member and has an upper surface 5a that functions as a contact surface against which the film 6 comes into contact when the pressing roller 20 presses the film 6. The outer peripheral support member 5 is also supported so as to be able to move up and down by a lifting support mechanism (not shown), and the height of each of the four corners of the outer peripheral support member 5 is configured to be adjusted separately. In the illustrated example, the height level of the outer peripheral support member 5 is adjusted by computer control, and therefore it is also called a digital bumper.

[0055] When pressing the single-layer film F1 (film 6), the pressing roller 20 rolls on the upper surface 5a of the outer peripheral support member 5, which has an adjusted height level, while in contact with the upper surface 5a. The upper surface 5a of the outer peripheral support member 5 may be coated with Teflon® coating or Toshical® coating, etc., to make it easier to peel off the attached film 6.

[0056] Now, referring again to Figure 7, we will explain the procedure for the work performed by the film application apparatus 100 after the film 6 has been attached to the semiconductor wafer.

[0057] After the film 6 is attached to the semiconductor wafer, the film attachment apparatus 100 performs vacuum breaking (releasing to the atmosphere) using a slow vent valve (step ST11). Specifically, the film attachment apparatus 100 opens the first vacuum valve VL1, which is one of the three vacuum valves VL, and slowly increases the pressure in the vacuum chamber VC. This is to prevent a rapid increase in pressure in the vacuum chamber VC from adversely affecting the components of the film attachment apparatus 100. It is also to prevent the generation of relatively loud noise (vacuum breaking noise) as a result of a rapid increase in pressure in the vacuum chamber VC.

[0058] Subsequently, the film application device 100 raises the upper lid member TC to open the upper opening UH of the vacuum chamber VC (step ST12). Specifically, the film application device 100 operates an upper lid member lifting mechanism (not shown) to raise the upper lid member TC.

[0059] Subsequently, the film application device 100 slides the upper cover member TC to the outside of the upper opening UH of the vacuum chamber VC (step ST13). Specifically, the film application device 100 operates a linear actuator (not shown) to slide the upper cover member TC to the Y1 side (right side) to the position shown in the right-hand diagram of Figure 3, that is, until the upper opening UH is completely exposed.

[0060] Subsequently, the film application device 100 performs film cutting using the film cutting device CU (step ST14). Specifically, the film application device 100 lowers the film cutting device CU to bring the blade BD into contact with the film 6 and trim the film 6. The arrow AR8 in the third figure from the top of Figure 8 represents the circular motion of the blade BD along the edge of the semiconductor wafer W. The film cutting device CU may be configured to cut the film 6 using a laser. In this case, a part of an exhaust passage may be formed between the table TB and the outer peripheral support member 5, with one end opening to the mounting surface and the other end connected to an exhaust device (not shown), such as an exhaust fan. The exhaust passage is a passage for discharging smoke and the like generated when the film is cut by the laser-using film cutting device CU, and includes an annular gap between the table TB and the outer peripheral support member 5. That is, the exhaust device and exhaust passage may be configured not only to remove unwanted materials generated when the film is cut by the film cutting device CU, but also to realize an air knife function. This configuration allows the air flowing through the exhaust passage to instantly cool the cut surface of the film 6 cut by the film cutting device CU, resulting in a relatively clean cut surface of the film 6 with fewer burrs and other defects.

[0061] Subsequently, the film application device 100 peels off the unnecessary portion of the film 6 from the table TB (step ST15). In the example shown in Figure 8, the unnecessary portion (residual film), which is the portion of the single-layer film F1 (film 6) other than the portion attached to the surface of the semiconductor wafer W by the pressing roller 20, is peeled off by the first moving unit MU1, which functions as a remove head, and wound onto the film winding unit 4. Specifically, the film application mechanism FPM peels off the unnecessary portion from the upper surface 5a of the outer peripheral support member 5 by moving the first moving unit MU1 and the second moving unit MU2 to the position shown in the bottommost figure of Figure 8, as indicated by arrow AR9 in the third figure from the top of Figure 8. The peeled unnecessary portion is then wound onto the film winding unit 4. Arrow AR10 in the bottommost figure of Figure 8 represents the movement of the film winding unit 4 as it winds up the film 6, including the residual film, to a set length. As a result, a single layer of film F1 (film 6) remains only on the surface of the semiconductor wafer W, and the film application apparatus 100 can obtain a semiconductor wafer W with film 6 attached.

[0062] Subsequently, the film application device 100 lowers the table TB (lower lid member BC) to open the lower opening LH of the vacuum chamber VC (step ST16). Specifically, the film application device 100 operates the table lifting mechanism EM to lower the table TB and lower lid member BC to the position shown in the uppermost part of Figure 8, as indicated by arrow AR11 in the bottommost part of Figure 8. The film application device 100 also moves the first moving unit MU1 to the position shown in the uppermost part of Figure 8, as indicated by arrow AR12 in the bottommost part of Figure 8. As a result, the film application mechanism FPM returns to the state shown in the uppermost part of Figure 8, and is ready to apply the film 6 to the next semiconductor wafer W.

[0063] Subsequently, the film application device 100 slides the table TB to the outside of the vacuum chamber VC (step ST17). Specifically, the film application device 100 operates a linear actuator (not shown) to slide the table TB toward X1 (front) to the position shown in the left diagram of Figure 3.

[0064] Subsequently, the film application device 100 breaks the suction of the semiconductor wafer (step ST18). Specifically, the film application device 100 stops the suction by the vacuum chuck provided on the table TB and releases the suction from the underside of the semiconductor wafer placed on the table TB.

[0065] Subsequently, the film application device 100 transfers the semiconductor wafer from the table TB to the unload-side load port UL using the robot RB (step ST19). Specifically, the film application device 100 operates the robot RB to grasp the semiconductor wafer with the film applied, which is placed on the table TB, and transfers the semiconductor wafer into the hoop or magazine of the unload-side load port UL.

[0066] In this way, the film application apparatus 100 can apply a film to a semiconductor wafer under vacuum. Therefore, the film application apparatus 100 can suppress the trapping of air between the semiconductor wafer and the film.

[0067] As described above, the semiconductor manufacturing apparatus (film application apparatus 100) according to the embodiment of the present disclosure, as shown in the upper figure of Figure 6, comprises a table TB on which a semiconductor wafer W is placed, a pressing member (pressing roller 20) for pressing a film 6 to be applied to the semiconductor wafer W placed on the table TB, and a vacuum chamber VC for housing the semiconductor wafer W placed on the table TB and the pressing member (pressing roller 20).

[0068] This configuration allows the film 6 to be attached to the semiconductor wafer W under vacuum while tension is applied to the film 6, thus suppressing the trapping of air between the semiconductor wafer W and the film 6. Furthermore, this configuration suppresses defects such as wrinkles and air bubbles forming in the film 6 attached to the semiconductor wafer W.

[0069] Furthermore, the film application device 100 preferably includes a lower cover member BC that covers the lower opening LH, which serves as a first penetration in the vacuum chamber VC, allowing the table TB to pass through, as shown in the upper diagram of Figure 6. The lower cover member BC is configured to move up and down together with the table TB.

[0070] This configuration allows the lower opening LH of the vacuum chamber VC to be sealed by a lower lid member BC that can be raised and lowered together with the table TB, thus facilitating the application of the film 6 to the semiconductor wafer W under vacuum.

[0071] Furthermore, the film application apparatus 100 preferably includes, as shown in the upper diagram of Figure 5, a film cutting apparatus CU for cutting the film 6 applied to the semiconductor wafer W, and an upper cover member TC (see upper diagram of Figure 6) that covers the upper opening UH, which serves as a second penetration portion and is provided in the vacuum chamber VC so as to face the film cutting apparatus CU located outside the vacuum chamber VC.

[0072] This configuration allows the upper opening UH of the vacuum chamber VC to be sealed by the upper cover member TC, which has the effect of facilitating the attachment of the film 6 to the semiconductor wafer W under vacuum. Furthermore, this configuration allows the film cutting device CU to be positioned outside the vacuum chamber VC so as to face the upper opening UH of the vacuum chamber VC, which has the effect of facilitating the cutting of unwanted portions of the film 6 attached to the semiconductor wafer W.

[0073] Furthermore, the vacuum chamber VC preferably has a light-transmitting member 14, as shown in Figure 4. A sensor 15 is provided on the outside of the light-transmitting member 14.

[0074] This configuration allows the sensor 15 for detecting the state of each component within the vacuum chamber VC to be placed outside the vacuum chamber VC, thus suppressing the adverse effects of rapid pressure changes within the vacuum chamber VC on the sensor 15. Therefore, this configuration enables more accurate detection of the state of each component within the vacuum chamber VC compared to when the sensor for detecting the state of each component within the vacuum chamber VC is placed inside the vacuum chamber VC. Furthermore, this configuration can reduce the frequency of malfunctions such as sensor 15 failures, thereby increasing the availability of the film application device 100.

[0075] Furthermore, the vacuum chamber VC houses a film supply unit 3, on which the film 6 is wound before being attached to the semiconductor wafer W, and a film winding unit 4, on which the used film is wound. In other words, preferably, at least the main parts of the film attachment mechanism FPM (film supply unit 3 and film winding unit 4) are housed in the vacuum chamber VC, and more preferably, the entire film attachment mechanism FPM is housed in it. Note that the main parts of the film attachment mechanism FPM may also include a carrier film winding unit 8, a pressing roller 20, and a moving unit MU.

[0076] This configuration ensures that at least the main part or all of the film application mechanism (FPM) is housed within the vacuum chamber (VC). This has the effect of making it easier to achieve a vacuum state within the vacuum chamber (VC) compared to when a part of the film application mechanism (FPM) is located outside the vacuum chamber (VC).

[0077] Specifically, this configuration, compared to another configuration in which, for example, a pre-cut film 6 is placed on a semiconductor wafer W on a table TB, a vacuum chamber VC (vacuum cup) slightly larger than the semiconductor wafer W on which the pre-cut film 6 is placed is placed over the semiconductor wafer W, the air in the vacuum chamber VC is removed with a vacuum pump VP to create a near-vacuum state, and the film 6 is pressed onto the semiconductor wafer W using a pressing roller or diaphragm installed in the vacuum chamber VC, thereby attaching the film 6 to the semiconductor wafer W, has the effect of more reliably suppressing the occurrence of the aforementioned problems. This is because, in the other configuration, the pre-cut film 6 is placed on the semiconductor wafer W by a robot RB or a transporter, so the film 6 is not attached to the semiconductor wafer W while under tension. In other words, in a configuration in which at least the main part or all of the film attachment mechanism FPM is housed in a vacuum chamber VC, the film 6 is attached to the semiconductor wafer W under tension in a near-vacuum environment within the vacuum chamber VC. This has the effect of more reliably suppressing problems such as wrinkles forming in the film 6 attached to the semiconductor wafer W, or air bubbles being trapped between the semiconductor wafer W and the film 6.

[0078] Preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the embodiments described above. Various modifications and substitutions can be applied to the embodiments described above without departing from the scope of the present invention. Furthermore, each of the features described with reference to the embodiments described above may be combined as appropriate, as long as they do not conflict technically.

[0079] This application claims priority based on Japanese Patent Application No. 2024-119254, filed on 25 July 2024, and the entire contents of that Japanese Patent Application are incorporated herein by reference. [Explanation of Symbols]

[0080] 3...Film supply section 4...Film winding section 5...Outer peripheral support member 5a...Top surface 6...Film 7...Carrier film 8...Carrier film winding section 9...Pinch roller 10...Plate member 10B...Rear plate member 10DC...Center lower plate member 10DL...Left lower plate member 10DR...Right lower plate member 10F...Front plate member 10IL...Left inner plate member 10IR...Right inner plate member 10L...Left plate member 10R...Right plate member 10U...Upper plate member 11...Door member 11B...Rear door member 11BC...Center rear door member 11BL...Left rear door member 11BR...Right rear door member 11L...Left door component 11R...Right door component 12...Lever lock mechanism 12B...Rear lever lock mechanism 12BC...Center rear lever lock mechanism 12BL...Left rear lever lock mechanism 12BR...Right rear lever lock mechanism 12L...Left lever lock mechanism 12R...Right lever lock mechanism 13...Reinforcement component 13F...Front reinforcement component 13FL...Left front reinforcement component 13FR...Right front reinforcement component 13U...Upper reinforcement component 14...Translucent component 14B...Rear translucent component 14BL...Left rear translucent component 14BR...Right rear translucent component 14F...Front translucent component 14FC...Center front translucent component 14FL...Left front translucent component 14FR...Right front light-transmitting member 14U...Upper light-transmitting member 15...Sensor 15B...Rear sensor 15BL1...First left rear sensor 15BL2...Second left rear sensor 15BR...Right rear sensor 16...Vacuum connector 16F...Front vacuum connector 20...Pressing roller 100...Film application device AL...Aligner BC...Lower cover member BD...Blade CB...Cover member CBD...Lower cover member CBU...Upper cover member CD...Conduit CD1...First small diameter pipe CD2...Second small diameter pipe CD3...Third small diameter pipe CDM...Large diameter pipe CU...Film cutting device EM...Table lifting mechanism F1...Single layer film F2...Double layer film FPM...Film application mechanism FM...Frame GVD...Lower groove GVU...Upper groove LD...Load side load portLH...Lower opening MB...Main body MU...Mobile unit MU1...First mobile unit MU2...Second mobile unit PT...Vacuum port RB...Robot RD...Slide rod RGD...Lower O-ring RGU...Upper O-ring SX...Slide shaft member TB...Table TC...Upper cover member UH...Upper opening UL...Unload side load port VC...Vacuum chamber VL...Vacuum valve VL1...First vacuum valve VL2...Second vacuum valve VL3...Third vacuum valve VP...Vacuum pump W...Semiconductor wafer

Claims

1. A table on which semiconductor wafers are placed, A pressing member for pressing a film to be attached to the semiconductor wafer placed on the table, A vacuum chamber housing the semiconductor wafer and the pressing member placed on the table, A film cutting device for cutting the film attached to the semiconductor wafer, Equipped with, The vacuum chamber houses a film supply unit in which the film is wound before being attached to the semiconductor wafer, and a film winding unit in which the used film is wound. The film cutting device is located outside the vacuum chamber. Semiconductor manufacturing equipment.

2. The vacuum chamber is provided with a lower cover member that covers a first penetration portion so that the table can pass through, The lower cover member is configured to move up and down together with the table. The semiconductor manufacturing apparatus according to claim 1.

3. The vacuum chamber is provided with an upper cover member that covers a second penetration portion, which is located outside the vacuum chamber and faces the film cutting device, The film is positioned under a near-vacuum so as not to come into contact with the upper lid member. The semiconductor manufacturing apparatus according to claim 1.

4. The vacuum chamber has a light-transmitting member, A sensor for detecting the state of a component located inside the vacuum chamber is provided on the outside of the light-transmitting member. The semiconductor manufacturing apparatus according to claim 1.

5. The table moves up and down when the inside of the vacuum chamber is at atmospheric pressure, with the semiconductor wafer adsorbed on it, and stops when the inside of the vacuum chamber is in a near-vacuum state. The semiconductor manufacturing apparatus according to claim 1.

6. A film application mechanism is housed within the vacuum chamber. The semiconductor manufacturing apparatus according to claim 1.

7. Within the vacuum chamber, the film is attached to the semiconductor wafer under tension in a near-vacuum state. The semiconductor manufacturing apparatus according to claim 1.

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