Component mounting machine

Abstract

A component mounting machine is provided with: a substrate transport device which transports a substrate and positions the substrate at a predetermined work position; a component supply device which supplies components to be mounted on the substrate; a component transfer device which collects the components from the component supply device and performs mounting work for mounting the collected components on the substrate positioned at the work position; a carrier member on which the substrate and at least a part of the components to be mounted on the substrate are placed and which is positioned at the work position by the substrate transfer device; and a mode switching unit which switches between a first work mode in which the component transfer device performs mounting work for mounting the components supplied from the component supply device to a first substrate which is a substrate positioned at a work position without using the carrier member, and a second work mode in which the component transfer device performs mounting work for mounting at least the components placed on the carrier member to a second substrate which is a substrate placed on the carrier member positioned at the work position.

Description

Component placement machine

[0001] The present specification relates to a component mounting machine that performs a mounting operation of mounting components onto a board.

[0002] A technology for mass-producing board products by performing substrate-related operations on boards on which circuit patterns are formed is becoming widespread. A typical example of a substrate-related operation machine that performs substrate-related operations is a component placement machine that performs a placement operation to place components on a board. Generally, a component placement machine is equipped with a board transport device, a component supply device, and a component transfer device, and performs placement operations based on a work program created for each type of board. When changing the type of board (board product) to be produced, it is necessary to change the setup of the above three devices and replace the work program. Examples of technology related to the production of this type of board are disclosed in Patent Documents 1 and 2.

[0003] Patent Document 1 discloses a component mounting machine that transports and positions a board using a board transport lane, transports and positions a component mounting member using a component transport lane, and uses a work device to pick up electronic components from the component mounting member and mount them on the board. According to this, it is said that large electronic components that cannot be supplied from the component supply device provided in the component mounting machine or components that require pre-assembly can be supplied from the component mounting member, eliminating the need for a dedicated supply device and preventing the electronic component mounting system from becoming larger.

[0004] Furthermore, Patent Document 2 discloses an assembly device that includes a pallet on which an assembly object and assembly parts are simultaneously placed, a conveying device that conveys the pallet and positions it at a work position, and assembly means that assembles the assembly parts at predetermined assembly locations on the assembly object, with the placement positions of the assembly parts being on a straight line in a specific direction to the assembly location. This is said to reduce equipment costs and improve work efficiency by minimizing the movement mechanism of the assembly means.

[0005] JP 2011-176078 A International Publication No. 2007 / 049341

[0006] While a component placement machine is producing boards (planned production boards) based on a production plan, an interrupt request may occur to produce repair boards or prototype boards (interrupt production boards) that are not scheduled in the production plan. In this case, the board transport device, component supply device, component transfer device, and work program must be reconfigured to accommodate the interrupt production boards, and then reconfigured again to resume production of the planned production boards after production of the interrupt production boards is completed. In other words, a significant amount of reconfiguration work is required for the limited number of interrupt production boards. Furthermore, the component supply pattern may differ from normal production when producing interrupt production boards. In such cases, a countermeasure is required because the built-in component supply device cannot be used.

[0007] Furthermore, when repairing a PCB, it is difficult to reproduce the setup conditions during production, and the production work program cannot be used as is. Furthermore, the external shape of the repair PCB differs from that of the original PCB, making it difficult to transport using a PCB transport device, and countermeasures may be required. On the other hand, it may not be possible to perform mounting work on a prototype PCB using a work program. As described above, a significant amount of work is required to change the setup in response to an interrupt request for an interrupt production PCB, and the technical examples of Patent Documents 1 and 2 cannot efficiently address this issue.

[0008] Furthermore, some types of boards cannot be transported by a board transport device alone. Special setup using jigs or other tools is required for these types of boards that are difficult to transport. Also, there are cases where two types of board products are produced by changing the types of components mounted on the same type of board (for example, two types of components with the same external shape but different electrical characteristics). In these cases, setup by an operator is often required.

[0009] Therefore, an object of this specification is to provide a component mounting machine that can efficiently perform setup changes related to board transport and component supply.

[0010] This specification discloses a component mounting machine including a board transporting device that transports a board and positions it at a predetermined work position; a component supplying device that supplies components to be mounted on the board; a component transfer device that performs a mounting operation of picking up the components from the component supplying device and mounting the picked components on the board positioned at the predetermined work position; a carrier member on which the board and at least some of the components to be mounted on the board are placed and which is positioned at the work position by the board transporting device; and a mode switching unit that switches between a first work mode in which the component transfer device performs a mounting operation of mounting the components supplied by the component supplying device onto a first board, which is the board positioned at the work position without using the carrier member, and a second work mode in which the component transfer device performs a mounting operation of mounting at least the components placed on the carrier member onto a second board, which is the board placed on the carrier member positioned at the work position.

[0011] In this specification, the technical idea of ​​changing "the component placement machine according to claim 1" in claim 4 as originally filed to "the component placement machine according to any one of claims 1 to 3," the technical idea of ​​changing "the component placement machine according to claim 1" in claim 5 as originally filed to "the component placement machine according to any one of claims 1 to 3," the technical idea of ​​changing "the component placement machine according to claim 5" in claim 7 as originally filed to "the component placement machine according to claim 5 or 6," the technical idea of ​​changing "the component placement machine according to any one of claims 1 to 7" in claim 11 as originally filed to "the component placement machine according to any one of claims 1 to 10," the technical idea of ​​changing "the component placement machine according to any one of claims 1 to 7" in claim 15 as originally filed to "the component placement machine according to any one of claims 1 to 14," the technical idea of ​​changing "the component placement machine according to claim 1" in claim 2 as originally filed to "the component placement machine according to claim 2" The present application discloses the technical idea of ​​changing "the component mounting machine according to claim 15" in claim 17 to "the component mounting machine according to claim 15 or 16," the technical idea of ​​changing "the component mounting machine according to claim 15" in claim 18 as originally filed to "the component mounting machine according to claim 15 or 16," the technical idea of ​​changing "the component mounting machine according to any one of claims 1 to 7" in claim 19 as originally filed to "the component mounting machine according to any one of claims 1 to 18," the technical idea of ​​changing "the component mounting machine according to any one of claims 1 to 7" in claim 20 as originally filed to "the component mounting machine according to any one of claims 1 to 19," and the technical idea of ​​changing "the component mounting machine according to any one of claims 1 to 7" in claim 21 as originally filed to "the component mounting machine according to any one of claims 1 to 20."

[0012] In the component mounting machine disclosed in this specification, the mode switching unit switches between a first operation mode that does not use a carrier member and a second operation mode that uses a carrier member to transport boards and supply components. This reduces the amount of setup work related to the board transport device and the component supply device, and allows for more efficient setup.

[0013] 5 is a plan view schematically showing the overall configuration of a component mounting machine of a first embodiment, and the implementation status of mounting work in a first work mode. FIG. 6 is a plan view illustrating a carrier member on which a second board and components are placed. FIG. 7 is an image diagram illustrating intra-carrier position information and the function of a camera position command unit. FIG. 8 is a diagram illustrating an example of a screen displayed by a display device. FIG. 9 is an operation flow diagram illustrating the operation of the component mounting machine. FIG. 10 is a sub-operation flow diagram illustrating details of the setup change work of step S5 in FIG. 5. FIG. 11 is a plan view schematically showing the overall configuration of a component mounting machine of a second embodiment. FIG. 12 is a plan view illustrating a first carrier member and a second carrier member used in the second embodiment. FIG. 13 is a plan view schematically showing the overall configuration of a component mounting machine of a third embodiment, and the implementation status of mounting work in a second work mode. FIG. 14 is a plan view illustrating a first carrier member, a second carrier member, and a positioning jig used in the third embodiment. FIG. 15 is a plan view illustrating a carrier member used in a fourth embodiment together with a mounted item. FIG. 16 is a plan view illustrating a carrier member used in a fifth embodiment together with a mounted item.

[0014] 1. Overall Configuration of the Component Mounting Machine 1 of the First Embodiment First, the overall configuration of the component mounting machine 1 of the first embodiment will be described with reference to FIG. 1 . In FIG. 1 , the horizontal direction from left to right represents the X-axis direction along which the first substrate K1 and the carrier member 7 (described later) are transported, the horizontal direction from the bottom (front) to the top (rear) of the page represents the Y-axis direction, and the vertical direction represents the Z-axis direction. The component mounting machine 1 is configured by assembling a substrate transport device 2, a component supply device 3, a component transfer device 4, a control device 5, and other components to a base 10. The base 10 has a generally rectangular parallelepiped shape and is robust. A manually openable protective cover (not shown) is provided above the base 10. The protective cover ensures the safety of the operator and prevents dust and other particles from entering the machine.

[0015] The substrate transport device 2 is composed of a pair of guide rails 21, a pair of conveyor belts (not shown), a belt drive unit (not shown), and a clamp mechanism 22. The pair of guide rails 21 extend in the X-axis direction across the upper surface of the base 10 slightly toward the rear, and are attached to the base 10 parallel to each other. The distance between the pair of guide rails 21 is adjusted according to the width dimensions of the first substrate K1 and the carrier member 7, which are the objects to be transported. The minimum and maximum width dimensions of the objects that can be transported are determined according to the adjustment range of this distance. Note that the "first" in "first substrate K1" is a term used to distinguish it from the second substrate K2 described below, and does not refer to a specific substrate.

[0016] The pair of conveyor belts are driven by a belt drive unit, and rotate along guide rails 21 with two parallel sides of a rectangular object being placed on them. As a result, board transport device 2 carries the object into the machine from the carry-in end (left end in FIG. 1 ) and transports it to a predetermined work position near the center of base 10. Clamping mechanism 22 pushes up the object that has stopped at the work position and clamps it between guide rails 21 to position it. After component transfer device 4 completes the mounting operation, clamping mechanism 22 releases the object, and the conveyor belts transport the object to the carry-out end (right end in FIG. 1 ) and remove it from the machine.

[0017] An upstream transfer device 2U is provided upstream of the carry-in end of the board transfer device 2. The upstream transfer device 2U receives a first board K1 on which paste solder has been printed or applied from an upstream board-related operation machine such as a solder printer or print inspection machine (not shown), and hands it over to the board transfer device 2. A downstream transfer device 2D is provided downstream of the carry-out end of the board transfer device 2. The downstream transfer device 2D receives the first board K1 on which component mounting has been completed from the board transfer device 2, and hands it over to a downstream board-related operation machine such as a board appearance inspection machine (not shown).

[0018] The component supply device 3 is composed of a pallet table 31 and multiple tape feeders 32. The pallet table 31 is a generally rectangular member in a plan view. The pallet table 31 has multiple slots that extend parallel to each other in the Y-axis direction and are aligned in the X-axis direction. Tape feeders 32 are detachably attached to and aligned in the multiple slots. Each of the tape feeders 32 uses a carrier tape to supply components to be mounted on the first board K1. Note that the component supply device 3 may be a device that uses a tray feeder, a device that uses both a tape feeder 32 and a tray feeder, or a device with another configuration.

[0019] The component transfer device 4 is composed of a pair of guide rails 40, a Y-axis movable body 41, an X-axis movable body 42, a mounting head 43, a nozzle tool 44, a suction nozzle 45, a mark camera 46, and a component camera 47. The pair of guide rails 40 are arranged on both edges of the base 10 spaced apart in the X-axis direction and extend parallel to each other in the Y-axis direction. The Y-axis movable body 41 is formed of a member that is long in the X-axis direction and is mounted on the pair of guide rails 40. The Y-axis movable body 41 is driven by a Y-direction drive mechanism (not shown) to move in the Y-axis direction. The X-axis movable body 42 is mounted on the Y-axis movable body 41 and driven by an X-direction drive mechanism (not shown) to move in the X-axis direction.

[0020] The mounting head 43 is provided in front of the X-axis movable body 42 and is positioned higher than the board transport device 2 and the component supply device 3. The mounting head 43 moves horizontally in two directions together with the X-axis movable body 42. A rotationally symmetric nozzle tool 44 is rotatably provided below the mounting head 43. The nozzle tool 44 is driven by an R-axis drive mechanism (not shown) to rotate about a vertical central axis. The nozzle tool 44 interchangeably holds multiple suction nozzles 45 (eight in the example of FIG. 1 ) at positions equidistant from the vertical central axis.

[0021] The suction nozzle 45 is driven to move up and down by a not-shown lifting mechanism and rotates around a vertical axis by a not-shown Q-axis driving mechanism. Furthermore, the suction nozzle 45 is selectively supplied with negative or positive pressure air from a not-shown air supply mechanism. This allows the suction nozzle 45 to pick up a component from the tape feeder 32 and place it on the positioned first board K1. The suction nozzle 45 is one form of a first component placement tool that picks up and places the component to be placed on the first board K1. The placement head 43 may hold a single suction nozzle 45 without the nozzle tool 44, or may hold multiple suction nozzles 45 arranged in a row or a grid. The placement head 43 may also hold a first component placement tool other than the suction nozzle 45, such as a clamping chuck that clamps a component.

[0022] The mark camera 46 is mounted on the X-axis movable body 42 facing downward, alongside the mounting head 43, and moves integrally with the X-axis movable body 42 and the mounting head 43. The mark camera 46 has a square or rectangular imaging range that is significantly narrower than the size of the first substrate K1, yet is capable of capturing high-resolution image data through imaging. The first substrate K1, which serves as the subject of the mark camera 46, has substrate position marks M1 attached near two diagonally opposite corners. The mark camera 46 captures images of the two substrate position marks M1 separately in two separate attempts to capture image data. An image processing unit attached to the mark camera 46 processes the image data to detect the exact positions of the two substrate position marks M1, thereby detecting the exact working position of the first substrate K1 and the rotation angle of the first substrate K1 in the horizontal plane.

[0023] The component camera 47 is mounted facing upward on the base 10 between the board transport device 2 and the component supply device 3. The component camera 47 captures an image of the component held by the suction nozzle 45 from below while the mounting head 43 is moving from the component supply device 3 to the first board K1, and recognizes the component. This allows the correctness of the component type to be determined, and the position and orientation of the component relative to the suction nozzle 45 to be detected and reflected in the mounting operation. Examples of the mark camera 46 and the component camera 47 include digital imaging devices having imaging elements such as CCDs (Charge Coupled Devices) and CMOSs ​​(Complementary Metal Oxide Semiconductors).

[0024] The control device 5 is mounted on the base 10, and its position is not limited. The control device 5 is configured as a computer device having a CPU and operating on software. The control device 5 may be configured with multiple CPUs distributed throughout the machine and connected to each other for communication. The control device 5 has a storage device 51 that stores various information. The control device 5 also has an input device 52 such as a keyboard or touch panel that accepts commands and selection operations from the worker, etc. The control device 5 also has a display device 53 such as a liquid crystal display that displays various information to the worker, etc.

[0025] The control device 5 receives an operation program 54 transferred from the production management device 6 and stores it in the storage device 51. The operation program 54 is used for the mounting operation and is created for each type of board (board product). The operation program 54 for the first board K1 includes design data for each type of first board K1 and component data summarizing the type, shape, and number of components to be mounted on the first board K1. The operation program 54 also includes coordinate data for component pick-up positions (component suction positions) and coordinate data for component mounting positions on the first board K1. The operation program 54 also includes data regarding the type and arrangement of the tape feeders 32 and suction nozzles 45 to be used, as well as detailed procedure data for the mounting operation. Based on the operation program 54, the control device 5 controls the board transport device 2, the upstream transport device 2U, the downstream transport device 2D, the component supply device 3, and the component transfer device 4 to proceed with the mounting operation.

[0026] 2. Issues with Conventional Component Mounting Machines The production management device 6 stores and manages production plans 62 for multiple types of boards, including the first board K1, and work programs 54 for each type of board, in a storage device 61. The production plan 62 includes at least the production sequence and production quantities for the multiple types of boards. When the production time for the first board K1 in the production plan 62 arrives, the production management device 6 transfers the work program 54 for the first board K1 to the component mounting machine 1 and other board-related operation machines, and commands the production of the first board K1. While the component mounting machine 1 is producing the first board K1 in accordance with the command, an interrupt request to produce a second board K2, which is not planned in the production plan 62, may occur.

[0027] In the first embodiment, the first substrate K1 refers to a substrate that is transported independently by the substrate transport device 2 and positioned at the work position. On the other hand, the second substrate K2 refers to a substrate that is not transported independently by the substrate transport device 2, but is placed on a carrier member 7 (described later) and transported. The first substrate K1 can also be described as a planned production substrate that is produced based on the production plan 62. On the other hand, the second substrate K2 is of a different type from the first substrate K1, and can also be described as an interruption production substrate that is produced by interrupting the production plan 62. The second substrate K2 is a prototype substrate, a repair substrate, or the like, and in many cases the production quantity is limited.

[0028] When an interrupt request occurs, a conventional component mounting machine must reconfigure the board transport device 2, component supply device 3, component transfer device 4, and work program 54 to accommodate the second board K2, and then reconfigure again to resume production of the first board K1 after production of the second board K2 is completed. In other words, a significant amount of reconfiguration work is required for a limited number of second boards K2. For example, the components to be mounted on the second board K2 may be of a different type from the components supplied by the tape feeders 32 arranged on the pallet table 31, which requires reconfiguration of the tape feeders 32 and requires additional work.

[0029] Furthermore, the components to be mounted on the second board K2 may be supplied in a different form than usual, and may not be usable by the built-in component supply device 3. For example, if the components are supplied in the form of cut strips of carrier tape, they cannot be used by a general tape feeder 32. Or, if the components are supplied in the form of individual trays removed from packages, they cannot be used by a general tray feeder. For this reason, a special device is required to replace the built-in component supply device 3. In addition, it becomes necessary to correct the coordinate value data of the component picking position in the work program 54.

[0030] Furthermore, in the mounting work for repairing a repaired PCB, it is difficult to reproduce the setup conditions at the time of production, and the work program 54 used at the time of production cannot be used as is. For example, since the repaired PCB only requires remounting some of the components involved in the failure, it is necessary to specify whether or not remounting is required for each type of component in the work program 54. Furthermore, the repaired PCB may have a different outer shape or size than the original PCB. For example, the repaired PCB may be a non-rectangular irregularly shaped board with a portion of its periphery cut off to fit its final use, or a small piece of a multi-panel PCB that has been divided into pieces smaller than the minimum transportable width. Since irregularly shaped boards and small piece boards cannot be transported and positioned by the board transport device 2, a special device must be prepared for use with the board transport device 2. Even if the repaired PCB can be transported by the board transport device 2, it may be necessary to correct the coordinate value data of the component mounting positions in the work program 54.

[0031] On the other hand, there are cases where the mounting work cannot be performed on a prototype board using the operation program 54. For example, there may be cases where the operation program 54 has not been created or where compatibility has not been sufficiently verified. In such cases, the worker must proceed with the mounting work manually while checking the components at the component picking positions and the component mounting positions on the second board K2. Furthermore, an operation program 54 created with mass production in mind may need to be partially modified for the prototype.

[0032] As described above, worker man-hours are required to perform setup changes in response to an interrupt request to produce the second substrate K2, which is not scheduled in the production plan 62. Furthermore, after production of the second substrate K2 is completed, another setup man-hour is required to return to the original setup state and resume production of the first substrate K1. In other words, a large number of man-hours are required for two setup changes, and the setup time is long. As a countermeasure to this, in the first embodiment, a carrier member 7 is used in the production of the second substrate K2, and whether or not to use the carrier member 7 is switched by the mode switching unit 55.

[0033] 3. Structure of Carrier Member 7 and Placed Article As shown in FIG. 2, the carrier member 7 comprises a rectangular plate-shaped carrier body 71 and guide portions 72 attached to each of two parallel sides of the carrier body 71. The carrier body 71 is formed larger than the second substrate K2 that is expected to be produced. The guide portions 72 are formed elongated and are held by the conveyor belt of the substrate transport device 2 and are movable along the guide rails 21. As a result, the carrier member 7, like the first substrate K1, is transported by the substrate transport device 2 and positioned at the work position.

[0034] The carrier member 7 carries a second substrate K2, which is a different type from the first substrate K1, and at least some of the components to be mounted on the second substrate K2. In the example of FIG. 2 , the carrier member 7 carries one second substrate K2, three trays (TR1, TR2, TR3), two carrier tapes (CT1, CT2) with relatively small tape widths, and one carrier tape CT3 with a relatively large tape width. Hereinafter, the multiple components carried on the carrier member 7 will be collectively referred to as "carrier items." To position the mounted items, a worker can attach them using, for example, double-sided tape. Without being limited thereto, the carrier body 71 may have a positioning protrusion or recess on its upper surface. For example, the carrier body 71 may have a protrusion for positioning the edges of the second substrate K2 or the trays (TR1, TR2, TR3), or a groove for accommodating the carrier tapes (CT1, CT2, CT3).

[0035] A plurality of second substrates K2 may be placed on the carrier member 7. In this case, the plurality of second substrates K2 are placed in the same orientation, thereby improving the efficiency of the mounting operation (see FIG. 11). The second substrates K2 may or may not have substrate position marks M2 attached. Because the second substrate K2 is not transported by the substrate transport device 2 alone, it does not have to be rectangular and may have a width less than the minimum width described above.

[0036] The trays (TR1, TR2, TR3) are individual items removed from a package. The trays (TR1, TR2, TR3) are a type of component container that stores components in multiple storage compartments arranged in a grid pattern. The types of components supplied by the trays (TR1, TR2, TR3) are different from the types of components supplied by the tape feeders 32 arranged on the pallet table 31. Because the trays (TR1, TR2, TR3) are individual items, they cannot be used with a general tray feeder. If the storage compartments of the trays (TR1, TR2, TR3) are covered with a protective sheet, the protective sheet is removed by an operator at the appropriate time.

[0037] The carrier tapes (CT1, CT2, CT3) are formed by cutting portions of a long tape and have a strip-like shape (a long, thin rectangle). The carrier tapes (CT1, CT2, CT3) are a type of component container that stores components in each of a plurality of cavities arranged in a row. The carrier tapes (CT1, CT2) have the same tape width as the carrier tape used by tape feeder 32, but cannot be used with tape feeder 32 because they have been cut. The carrier tape CT3 has a relatively larger tape width and is used with a different type of tape feeder that is larger than tape feeder 32. The cover tape that covers the cavities of the carrier tapes (CT1, CT2, CT3) is removed by an operator at an appropriate time.

[0038] The worker uses the input device 52 to input known shape information of component containers, such as trays (TR1, TR2, TR3) and carrier tapes (CT1, CT2, CT3), in advance, and stores it in the storage device 51. The shape information of the component container includes at least the quantity, arrangement, and storage pitch distance of the components stored therein. The shape information of the component container is referenced when detecting the position of a specific component or when determining the positions of other components. Note that if the second board K2 is a prototype board and the components to be mounted have not yet been used, the worker newly registers component data, including the component shapes and specifications, in the storage device 61.

[0039] The upper surface of the carrier body 71 is divided into a plurality of elements 73 arranged in a grid pattern. In the example shown in FIG. 3 , 40 elements 73 are arranged horizontally and 20 elements vertically, for a total of 800 elements. The elements 73 may be represented as virtual images, or may be represented by actual grid lines drawn on the upper surface of the carrier body 71. Furthermore, the elements 73 may be represented by a combination of row and column numbers assigned to two perpendicular sides of the carrier body 71. The size of each element 73 is not particularly limited. That is, each element 73 may be the same shape and size as the imaging range of the mark camera 46, smaller than the imaging range, or larger than the imaging range.

[0040] The approximate position of the loaded item is indicated by the intra-carrier position information represented by any of the elements 73. The worker uses the input device 52 to input the intra-carrier position information for each positioned loaded item. In the example shown in FIG. 3 , the approximate position of tray TR1 is indicated by the intra-carrier position information representing element 731, which is the third row from the top and the fifth column from the left, where the upper leftmost storage section (or component), which is the specific position, is located. Furthermore, the approximate position of second substrate K2 is indicated by the intra-carrier position information representing element 732, which is the ninth row from the top and the fourth column from the left, where substrate position mark M2 is located.

[0041] 4. Functions of the Three Functional Units of the Control Device 5 As shown in FIG. 1 , the control device 5 has three functional units configured using software: a mode switching unit 55, a camera position command unit 56, and a display control unit 57. The mode switching unit 55 switches between a first work mode and a second work mode. In the first embodiment, the mode switching unit 55 sets the first work mode during normal operation when no interrupt request for producing the second substrate K2 has occurred, and controls the system to continue production of the first substrate K1. Furthermore, the mode switching unit 55 switches to the second work mode in response to an interrupt request from the production management device 6 or an interrupt request from the operator's input device 52, and controls the system to suspend production of the first substrate K1 and produce the second substrate K2. Furthermore, the mode switching unit 55 switches to the first work mode after production of the second substrate K2 has finished, and controls the system to resume production of the first substrate K1. Switching between modes requires a setup change by the operator (described in detail below).

[0042] 1 , in the first work mode, the carrier member 7 is not used. The board transport device 2 transports the first board K1 and positions it at the work position. The component transfer device 4 picks up components from the tape feeder 32 of the component supply device 3 and performs a mounting operation to mount the picked components on the positioned first board K1.

[0043] 2, the carrier member 7 is set up, transported by the board transport device 2, and positioned at the work position. The component transfer device 4 performs a mounting operation of picking up components from the positioned carrier member 7 and mounting the picked up components onto the second board K2 placed on the carrier member 7. Note that the component transfer device 4 may also perform a mounting operation of picking up components from the tape feeder 32 and mounting them onto the second board K2.

[0044] In the second operation mode, the placement operation cannot be performed with only the approximate position information of the placed item indicated by the intra-carrier position information, and information on the exact position of the placed item is required. Therefore, the control device 5 detects the exact position of the placed item using the mark camera 46 prior to the placement operation. The mark camera 46 captures images of the second board K2 and components, which are placed on the positioned carrier member 7, and detects their positions.

[0045] Specifically, the mark camera 46 captures images of two board position marks M2 on the second board K2. The image processing unit of the mark camera 46 processes the acquired image data to detect the exact position and rotation angle of the second board K2 in a horizontal plane. If the second board K2 does not have the board position marks M2, the mark camera 46 captures images of multiple characteristic locations on the second board K2 instead of the board position marks M2, thereby enabling the accurate position and rotation angle of the second board K2 to be detected. Examples of characteristic locations on the second board K2 include printed character strings or component symbols, mounted components with known coordinate values ​​on the repair board, and component mounting positions (exposed portions of the wiring pattern) with known coordinate values ​​on the prototype board.

[0046] The mark camera 46 also refers to shape information of the component container (tray (TR1, TR2, TR3), carrier tape (CT1, CT2, CT3)) to capture an image of a specific position in the component container or a specific component contained in a specific position. The image processing unit of the mark camera 46 processes the acquired image data to detect the exact position of at least one component. Furthermore, by referring to the shape information of the component container, the mark camera 46 can determine the exact positions of all components in the component container. Examples of the specific position include a container at one corner of the tray (TR1, TR2, TR3) or a cavity at one end of the carrier tape (CT1, CT2, CT3). As described above, accurately determining the positions of the second substrate K2 and the components enables the placement operation.

[0047] The camera position command unit 56 uses the intra-carrier position information to command the position of the mark camera 46 when capturing an image of the second board K2 or the component container (or component). When each element 73 is set to have the same shape and size as the imaging range of the mark camera 46, the mark camera 46 can acquire image data of the entire area of ​​the commanded element 73 in a single imaging.

[0048] Furthermore, when each of the elements 73 is set smaller than the imaging range of the mark camera 46, the mark camera 46 can image not only the commanded element 73 but also at least some of the surrounding elements 73. Furthermore, nine elements 73 arranged in a 3 x 3 pattern may be set to match the imaging range of the mark camera 46. In this way, the mark camera 46 can collectively image the nine elements 73 with the commanded element 73 positioned in the center.

[0049] On the other hand, when each element 73 is set to be larger than the imaging range of the mark camera 46, the mark camera 46 cannot acquire image data of the entire area of ​​the element 73 in a single imaging operation. In this mode, the camera position command unit 56 commands the mark camera 46 to capture images at multiple positions within the element 73. This allows the mark camera 46 to combine the image data acquired by imaging at the multiple positions to create image data that covers the entire area of ​​the specified element 73.

[0050] Therefore, the acquired image data reliably captures the board position mark M2, characteristic features of the second board K2, specific positions of the component container, and specific components, enabling accurate position detection through image processing. In other words, the mark camera 46 can detect the exact position of the placed item without repeated trial-and-error imaging. If the mark camera 46 is unable to detect the exact position of the placed item, the camera position command unit 56 issues a command to image elements 73 surrounding the initially commanded element 73 as the next image capture target, causing the mark camera 46 to capture an image again. Therefore, the mark camera 46 can detect the exact position of the placed item through a limited number of image captures.

[0051] The display control unit 57 edits and controls the display content of the display device 53 to improve the visibility of the image data when the worker visually checks it, and to support intuitive understanding. The display device 53, under control of the display control unit 57, displays image data and image position information indicating the position or imaging range of the mark camera 46 at the time of imaging on a single screen. The image position information of the mark camera 46 at the time of imaging is represented by numerical information such as coordinate values ​​within the control device 5. However, this numerical information is not suitable for intuitive understanding by the worker. Therefore, the display device 53 displays an overall image of one or more of the carrier member 7, the second substrate K2, and the component containers (trays (TR1, TR2, TR3), carrier tapes (CT1, CT2, CT3)), in which the image position information is graphically superimposed on the overall image acquired from outside the machine.

[0052] As the overall image of the carrier member 7, for example, image data separately acquired by an optical camera with a wide imaging range can be used. Furthermore, as the overall image of the second substrate K2, for example, a design drawing of the second substrate K2 can be used. The design drawing of the second substrate K2 is often included in the work program 54, or can be acquired from an external CAD system or the like. Furthermore, as the overall image of the component containers (trays (TR1, TR2, TR3), carrier tapes (CT1, CT2, CT3)), image data acquired by the optical camera or shape information of the component containers that can be acquired from a catalog, specification, or the like can be used.

[0053] On the screen DSP of the display device 53 shown in FIG. 4 , the imaging range AR captured by the mark camera 46 is displayed as a diagram superimposed on the overall image K20 of the second substrate K2. Furthermore, image data FD capturing the imaging range AR is enlarged and displayed. The image data FD is associated with the imaging range AR within the overall image K20 using an enlargement assist line LL. The image data FD is an image of the components P mounted on the second substrate K2. The worker can visually check this image data FD to confirm the actual position and mounting posture of the mounted components P. The imaging range AR may be displayed as a diagram superimposed on the overall image of the carrier member 7, rather than the overall image K20 of the second substrate K2.

[0054] The image capture position information is not limited to the image capture range AR, but may be a symbol or the like that pinpoints the position of the mark camera 46 when capturing an image. The display device 53, which displays the image capture position information (image capture range AR) and the image data FD on a single screen DSP, can also be used to check other parts. Examples of checking other parts include checking the position of the second board K2, checking the state of the component mounting position on the second board K2, and checking the position and state of the component to be picked up.

[0055] That is, the mark camera 46 captures an image of a predetermined component mounting position or an already-mounted component on the second board K2 placed on the positioned carrier member 7. The mark camera 46 also captures an image of a component accommodated in a component container (tray (TR1, TR2, TR3) or carrier tape (CT1, CT2, CT3)) placed on the carrier member 7. The image processing unit of the mark camera 46 detects the position of the object by image processing the acquired image data. The display device 53 then displays the image shown in FIG. 4. By checking the displayed content, the operator can efficiently set up a work program 54 for the second board K2 (described later) and manually perform mounting work. The display device 53 may also enlarge and display the image data captured by the component camera 47 so that the operator can confirm the state in which the suction nozzle 45 is suctioning a component.

[0056] After switching to the second operation mode as described above, the mode switching unit 55 selects and sets one of the automatic placement mode and the manual placement mode in response to a command from the operator. Furthermore, the mode switching unit 55 sets the setup mode prior to setting the automatic placement mode. In the setup mode, the operator refers to the display on the display device 53 and sets up the operation program 54 for the second board K2 so that the component transfer device 4 automatically performs the placement operation. "Setup" refers to creating or editing the operation program 54 to suit the current state of the items placed on the carrier member 7, storing it in the storage device 51, and preparing the control device 5 to be executable.

[0057] If the second board K2 is a prototype board, the worker must edit or modify at least the coordinate data indicating the position of the second board K2 and the coordinate data of the component pick-up position in the work program 54. If the second board K2 is a repair board, in addition to editing the two types of coordinate data described above, the worker must also specify whether or not remounting is required for each type of component described in the work program 54. In the next automatic mounting mode, the component mounting machine 1 automatically performs mounting on the second board K2 based on the work program 54.

[0058] In manual placement mode, the worker manually performs placement on the second board K2 while referring to the display on the display device 53. At this time, the worker can manually control the component transfer device 4 and proceed with the placement work while referring to the image data FD displayed on the screen DSP to check the position and status of the component to be picked up, the status of the component placement position on the second board K2, and the actual position and placement posture of the placed component P. Note that in manual placement mode, an optional work program 54 may be created or edited. This allows the worker to efficiently proceed with manual placement work by referring to the description of the work program 54 along with the enlarged display of the image data FD.

[0059] 5. Operation of the Component Mounting Machine 1 Next, the operation of the component mounting machine 1 will be described with reference to Figures 5 and 6. The operation flow shown in Figure 5 is mainly controlled by the control device 5, and partly by the operator. As a prerequisite, it is assumed that the first board K1 is scheduled to be the first board in the production order in the production plan 62, and that production of the second board K2 is not currently planned.

[0060] 5, the mode switching unit 55 of the control device 5 sets the first work mode to produce the first board K1 in accordance with the production plan 62. The worker performs setup work to suit the first board K1. The setup work includes, as necessary, adjusting the separation distance between the pair of guide rails 21 of the board transport device 2, replacing the tape feeder 32 or carrier tape of the component supply device 3, replacing the suction nozzle 45 of the component transfer device 4, and transferring and storing the work program 54 for the first board K1.

[0061] In the next step S2, the control device 5 starts production (mounting work) of the first substrate K1. Production of the first substrate K1 continues until an interrupt request to produce the second substrate K2 is generated in step S3. In step S4 after the interrupt request is generated, the mode switching unit 55 switches to the second work mode. In the next step S5, the worker performs a setup change work to suit the production of the second substrate K2. Details of the setup change work are shown in the sub-operation flow of FIG. 6.

[0062] 6, the worker stores the currently prepared work program 54 for the second substrate K2 in the storage device 51. In the next step S22, if the width dimensions of the first substrate K1 and the carrier member 7 differ, the worker adjusts the separation distance between the pair of guide rails 21 of the substrate transport device 2. Here, even if the second substrate K2 is an irregularly shaped substrate or a small piece substrate as described above, it can be placed on the carrier member 7 and transported, so there is no need for a special device to be used in conjunction with the substrate transport device 2.

[0063] In the next step S23, the worker replaces the suction nozzle 45 as necessary. At this step, the worker does not need to change the setup of the component supply device 3. In the next step S24, the worker places and positions the second substrate K2, trays (TR1, TR2, TR3), and carrier tapes (CT1, CT2, CT3) on the carrier member 7. Note that the second substrate K2 has already had paste solder printed or applied to the component mounting positions by an upstream solder printing machine or another device.

[0064] In the next step S25, the worker inputs intra-carrier position information indicating the approximate position of each of the placed items using the input device 52. In the next step S26, the worker loads the carrier member 7 onto the upstream transport device 2U. The control device 5 controls the upstream transport device 2U and the substrate transport device 2 to load and transport the carrier member 7 into the machine and position it at the work position.

[0065] In a production line where the upstream transport device 2U is omitted and no working space is secured between the component mounting machine 1 and the upstream substrate-to-substrate operating machine, the worker opens the protective cover and places the carrier member 7 directly on the board transport device 2. In this case, the board transport device 2 transports the carrier member 7 over a shorter distance than when transporting the first board K1. Alternatively, the worker places the carrier member 7 directly at the work position, and only the clamp mechanism 22 of the board transport device 2 operates.

[0066] In the next step S27, the camera position command unit 56 uses the intra-carrier position information input in step S25 to command the position of the mark camera 46 when capturing an image of the second board K2, a component, or other mounted item. The mark camera 46 captures an image of the mounted item in accordance with the command. In the next step S28, the image processing unit of the mark camera 46 performs image processing on the acquired image data to detect the exact position of the mounted item. Steps S27 and S28 are repeatedly executed according to the number of mounted items. Thereafter, the control device 5 ends the sub-operation flow and returns control of the operation flow execution to step S6 in FIG. 5.

[0067] In step S6, the mode switching unit 55 uses the display device 53 to inquire of the operator whether or not to perform automatic placement. The operator uses the input device 52 to command either automatic placement or manual placement. If automatic placement is commanded, in step S7, the mode switching unit 55 sets the setup mode. The operator edits and sets up the exact positions of the placed items detected in step S28 using the work program 54 prepared in step S21. In the next step S8, the mode switching unit 55 sets the automatic placement mode. As a result, the component placement machine 1 automatically performs placement work based on the work program 54.

[0068] Furthermore, in step S9, when manual placement is instructed, the mode switching unit 55 sets the manual placement mode. The worker manually controls the component transfer device 4 while referring to the display on the display device 53 to perform the placement operation. Because manual placement requires a longer time than automatic placement, there is a risk of the paste solder cooling and hardening. In this case, the worker divides the multiple component placement positions on the second board K2 into multiple work groups. The worker then proceeds with manual placement by repeatedly printing or applying paste solder for each work group, carrying in the carrier member 7, performing placement for each work group, and carrying out the carrier member 7. After step S8 or step S9 is completed, the operational flow merges in step S10. If the production quantity of the second board K2 is one in step S10, production of the second board K2 is completed.

[0069] When the production quantity of the second board K2 is more than one, the control device 5 operates the board transport device 2 and the downstream transport device 2D to temporarily transport the carrier member 7 outside the machine. In a production line where the downstream transport device 2D is omitted and no working space is secured between the component mounting machine 1 and the downstream board-to-board operating machine, the worker opens the protective cover and directly removes the carrier member 7. Next, the worker removes the second board K2 that has been mounted from the carrier member 7 and places another second board K2 that is yet to be mounted. Furthermore, the worker and the control device 5 repeat step S25 and subsequent steps in FIG. 6 .

[0070] Furthermore, if there is a shortage of components in the component containers (trays (TR1, TR2, TR3), carrier tapes (CT1, CT2, CT3)), the worker unloads the carrier member 7, replaces the component container to replenish the components, and then reloads the carrier member 7. Furthermore, the worker and the control device 5 execute step S25 and subsequent steps to continue the mounting operation. In this way, the component mounting machine 1 continues the mounting operation by repeatedly unloading and reloading the carrier member 7, thereby producing multiple second boards K2.

[0071] In step S11 after the production of the second board K2 is completed, the mode switching unit 55 switches to the first work mode. The worker resets the work program 54 for the first board K1, readjusts the separation distance between the pair of guide rails 21, and replaces the suction nozzle 45 as necessary to suit the production of the first board K1 (reverse steps S21 to S23). Here, the worker does not need to change the setup of the component supply device 3. After this, the operation flow returns to step S2, and the control device 5 resumes production of the first board K1.

[0072] In the component mounting machine 1 of the first embodiment, the mode switching unit 55 switches between a first operation mode in which the carrier member 7 is not used and a second operation mode in which the second board K2 is transported and components are supplied using the carrier member 7. This reduces the amount of setup changeover work related to the board transport device 2 and the component supply device 3, thereby enabling setup changeover to be performed more efficiently.

[0073] Furthermore, the area of ​​the carrier member 7 other than where the second substrate K2 is placed can be effectively utilized as component supply space. Therefore, when producing the second substrate K2, a setup change that disrupts the arrangement of the tape feeders 32 of the component supply device 3 is not necessary. Furthermore, the labor required to resume production of the first substrate K1 can be reduced and the resumption time can be accelerated. Furthermore, by placing multiple component containers (trays (TR1, TR2, TR3)) and carrier tapes (CT1, CT2, CT3) on the carrier member 7, it is possible to supply a wide variety of components in excess of the number of tape feeders 32 and tray feeders. In addition, single trays (TR1, TR2, TR3) removed from packages and cut carrier tapes (CT1, CT2, CT3) can be easily set up and used. The number of components to be supplied can be as low as one, or as many as needed if some operator effort is acceptable.

[0074] 6. Second Embodiment Next, the second embodiment will be described with reference to FIGS. 7 and 8, focusing on differences from the first embodiment. In the overall configuration of the component mounting machine 1A of the second embodiment shown in FIG. 7, the board transport device 2A differs from that of the first embodiment. In addition, in the second embodiment, as shown in FIG. 8, a first carrier member 75 and a second carrier member 76 are used to produce the second board K2. In addition, a positioning jig 79 is used.

[0075] The first carrier member 75 and the second carrier member 76 each include a carrier body 71 that is smaller than that of the first embodiment, and elongated guide portions 72 attached to two parallel sides of the carrier body 71. The first carrier member 75 carries one second substrate K2, and may carry multiple second substrates K2. The second carrier member 76 carries two trays (TR4, TR5), three carrier tapes (CT3, CT4, CT5) with relatively small tape widths, and two carrier tapes (CT6, CT7) with relatively large tape widths. The trays (TR4, TR5) and carrier tapes (CT3, CT4, CT5, CT6, CT7) are a form of component containers and store at least some of the components to be mounted on the second substrate K2.

[0076] The positioning jig 79 is a jig for positioning mounted articles such as the second substrate K2 and component containers (trays (TR4, TR5), carrier tapes (CT3, CT4, CT5, CT6, CT7)). In FIG. 8, one positioning jig 79 is used for the second substrate K2 of the first carrier member 75. Also, one positioning jig 79 is used for each of the seven component containers of the second carrier member 76. Note that the positioning jig 79 does not have to be used for all of the mounted articles placed on the first carrier member 75 and the second carrier member 76, and may be used for only some of the mounted articles.

[0077] The positioning jig 79 is formed in an L-shape with a long arm and a short arm intersecting at right angles. The positioning jig 79 is formed using a magnet. Meanwhile, the first carrier member 75 and the second carrier member 76 are formed of a ferromagnetic material such as iron or an alloy containing iron. Therefore, the positioning jig 79 is attracted to the first carrier member 75 and the second carrier member 76 by the action of magnetic force, and is fixed in position so that it does not easily move.

[0078] Jig position marks M3 are attached to two spaced apart locations on the positioning jig 79. The first jig position mark M3 is located at the intersection of the long arm and short arm. The second jig position mark M3 is located at the tip of the long arm. The positioning jig 79 contacts two sides of the second substrate K2 or component container, which are rectangular in plan view, to perform positioning. As in the first embodiment, the top surfaces of the carrier bodies 71 of the first carrier member 75 and the second carrier member 76 are divided into a plurality of elements 73. The approximate position of the positioning jig 79 is indicated by intra-carrier position information represented by the element 73 on which the jig position mark M3 is located.

[0079] The worker places the positioning jig 79 so that it contacts two sides of one corner of the placed workpiece. Alternatively, the worker places the workpiece so that two sides contact the placed positioning jig 79. At this time, the positioning jig 79 is attracted to the first carrier member 75 and the second carrier member 76 by the action of magnetic force, facilitating the worker's work of positioning the workpiece. After the positioning work, the worker uses the input device 52 to input information about the elements 73 corresponding to the intra-carrier position information of each of the multiple jig position marks M3.

[0080] In the second embodiment, steps S27 and S28 in FIG. 6 are modified as follows. That is, the mark camera 46 performs a two-stage detection operation when detecting the position of the second substrate K2 on the positioned first carrier member 75 and the positions of components on the positioned second carrier member 76. In the first detection operation, the mark camera 46 captures an image of the jig position mark M3 based on intra-carrier position information commanded by the camera position command unit 56. Next, the image processing unit of the mark camera 46 processes the acquired image data to detect the exact position of the positioning jig 79 and its rotation angle in the horizontal plane. Furthermore, the mark camera 46 can perform estimation processing to estimate the positions and rotation angles of the second substrate K2 and the component container in the horizontal plane.

[0081] In the second detection operation, the mark camera 46 captures images of the two board position marks M2 on the second board K2 or multiple characteristic locations on the second board K2 based on the results of the estimation process. The image processing unit of the mark camera 46 then processes the captured image data to detect the exact position and rotation angle of the second board K2 in the horizontal plane. The mark camera 46 also captures an image of a specific position or a specific component on the component container by referring to the results of the estimation process and the shape information of the component container. The image processing unit of the mark camera 46 then processes the captured image data to detect the exact position of the specific component. The mark camera 46 then determines the exact positions of all components in the component container by referring to the shape information of the component container.

[0082] The two-stage detection operation makes it possible to detect the position of the second board K2 and the positions of the components housed in the component container more reliably than in the first embodiment. Even if the positioning work by the worker is inaccurate and there is a gap between the second board K2 and the positioning jig 79 or between the component container and the positioning jig 79, the second detection operation ensures highly accurate position detection.

[0083] Alternatively, a simplified method may be employed in which the first detection operation and estimation process are performed and the second detection operation is omitted. Furthermore, the positioning jigs 79 may be positioned in pairs at two diagonally opposite corners of the second substrate K2 or the component container. This configuration doubles the number of positioning jigs 79 used, but enables more accurate detection of the position and rotation angle. Furthermore, since the pair of positioning jigs 79 eliminates the risk of sideways sliding during transport for the second substrate K2 or the trays (TR4, TR5), it is possible to omit the need for double-sided tape.

[0084] As shown in FIG. 7 , the substrate transport device 2A has a first transport section 25 and a second transport section 26 that are divided into two sections, one upstream and one downstream in the X-axis direction. The first transport section 25 and the second transport section 26 share a pair of guide rails 21 (single-lane structure). The first transport section 25 and the second transport section 26 each have a pair of conveyor belts, a belt drive section, and a clamping mechanism 22, and are configured to operate independently of each other. Nevertheless, in the first operation mode, the first transport section 25 and the second transport section 26 operate synchronously to transport and position the first substrate K1, similar to the substrate transport device 2 of the first embodiment. Note that the first transport section 25 and the second transport section 26 are not limited to the single-lane structure described above, and may have a dual-lane structure in which a pair of guide rails 21 is provided separately, and the transport directions may be different.

[0085] In the second operation mode, the first transport unit 25 transports the first carrier member 75 into the component mounting device 1B from the upstream side (left side in FIG. 7 ) and positions it at the first operation position. Meanwhile, the second transport unit 26 transports the second carrier member 76 into the component mounting device 1B from the downstream side (right side in FIG. 7 ) and positions it at the second operation position. The first operation position and the second operation position are set so as to roughly divide one operation position in the first embodiment into two halves. Alternatively, the above arrangement may be reversed, with the first transport unit 25 transporting and positioning the second carrier member 76 and the second transport unit 26 transporting and positioning the first carrier member 75. Furthermore, the board transport device 2A may have three or more pairs of transport lanes and transport units.

[0086] The first transport unit 25 and the second transport unit 26 enable the first carrier member 75 and the second carrier member 76 to be loaded, unloaded, transported, and positioned independently and separately. For example, when the mounting operation on the first second substrate K2 is completed, the first transport unit 25 can transport only the first carrier member 75. The worker replaces the mounted second substrate K2 with the second second substrate K2 before the mounting operation. The first transport unit 25 can then reload the first carrier member 75. Furthermore, when components are in short supply in the component containers (trays (TR4, TR5), carrier tapes (CT3, CT4, CT5, CT6, CT7)), the second transport unit 26 can transport only the second carrier member 76. The worker replaces the component container and replenishes the components. The second transport unit 26 can then reload the second carrier member 76.

[0087] As described above, in the second embodiment, by using a positioning jig 79 with two jig position marks M3, the accurate positions of the second board K2 and components can be detected even more reliably than in the first embodiment. Furthermore, the first conveying unit 25 and the second conveying unit 26 allow for the replacement of multiple second boards K2 and the replenishment of components independently, allowing for more efficient mounting operations than in the first embodiment. Furthermore, in the second embodiment, similar to the first embodiment, setup changes can be efficiently performed when switching the production target between the first board K1 and the second board K2.

[0088] 7. Third Embodiment Next, the third embodiment will be described with reference to Figures 9 and 10, focusing on differences from the first and second embodiments. The overall configuration of a component mounting machine 1B of the third embodiment shown in Figure 9 differs from the first embodiment in that a bonding material applicator 8 is added. The same first and second carrier members 75 and 76 as in the second embodiment are used, but as shown in Figure 10, the third embodiment differs from the second embodiment in that a tool station 77 is used instead of a positioning jig 79.

[0089] 10 , one second substrate K2 is placed on the first carrier member 75, although multiple second substrates K2 may be placed thereon. The second carrier member 76 is loaded with two trays (TR4, TR5), three carrier tapes (CT3, CT4, CT5) with relatively small tape widths, two carrier tapes (CT6, CT7) with relatively large tape widths, and a tool station 77. The substrate transport device 2 transports the first carrier member 75 and the second carrier member 76 aligned in the X-axis direction. The substrate transport device 2 also positions the first carrier member 75 and the second carrier member 76 together at the work position using a single clamping mechanism 22.

[0090] In the third embodiment, the carrier member is divided into two parts, which makes setup easier for the operator. For example, by setting up the second carrier member 76 first and then the first carrier member 75, the cooling and hardening time of the paste solder printed or applied to the second substrate K2 can be delayed. Furthermore, the operator can open the protective cover to remove and reinsert only one of the first carrier member 75 and the second carrier member 76, which makes insertion and removal easier than the large carrier member 7 of the first embodiment.

[0091] For example, when producing a plurality of second substrates K2, the worker can remove the first carrier member 75, replace the second substrate K2 that has already been mounted with the second substrate K2 that has not yet been mounted, and then re-insert the first carrier member 75. Also, when components are in short supply in the component containers (trays (TR4, TR5), carrier tapes (CT3, CT4, CT5, CT6, CT7)), the worker can remove the second carrier member 76, replace the component container to replenish the components, and then re-insert the second carrier member 76. These insertion and removal operations can be performed by operating only the clamp mechanism 22, without operating the conveyor belt of the substrate transport device 2.

[0092] The tool station 77 is formed, for example, in the shape of an elongated rectangular parallelepiped and has multiple holding holes 78 on its upper surface. The tool station 77 automatically replaceably holds a suction nozzle 45B in each of the multiple holding holes 78. The suction nozzle 45B is a form of a second component placement tool that picks up and places components to be placed on the second board K2. The suction nozzle 45B picks up components that are difficult to pick up using the suction nozzle 45 (first component placement tool) and places them on the second board K2. For example, the suction nozzle 45 is prone to suction errors when picking up relatively large components housed in trays (TR4, TR5) or carrier tapes (CT6, CT7), making it virtually unusable. In contrast, the suction nozzle 45B has a larger tip opening than the suction nozzle 45, allowing it to stably pick up relatively large components.

[0093] In the third embodiment, the operation flow of FIG. 5 and the sub-operation flow of FIG. 6 are partially modified. That is, step S23 after switching to the second operation mode is omitted, and the operator is not required to replace the suction nozzle 45. Instead, an "automatic nozzle replacement" step is added before step S27 or after step S28. In the "automatic nozzle replacement" step, the component transfer device 4 moves the mounting head 43 above the tool station 77 and automatically replaces the suction nozzle 45 with the suction nozzle 45B. Furthermore, when switching to the first operation mode in step S11, instead of the operator having to replace the suction nozzle 45 again, the component transfer device 4 automatically replaces the suction nozzle 45B with the suction nozzle 45. This reduces the number of steps required for the setup changeover work for the component transfer device 4 compared to the first and second embodiments.

[0094] The number of holding holes 78 in the tool station 77 is preferably greater than the maximum number of suction nozzles (45, 45B) that the nozzle tool 44 can hold. For example, in a configuration in which the nozzle tool 44 holds a maximum of eight suction nozzles (45, 45B), it is preferable to have nine or more holding holes 78. This allows the maximum number of suction nozzles 45 held by the nozzle tool 44 to be replaced with suction nozzles 45B. The number of suction nozzles (45, 45B) that are actually replaced can be changed within a range from one to the maximum number. Note that the tool station 77 may automatically replace a second component placement tool other than the suction nozzles 45B, such as a clamping chuck, and provide it to the placement head 43.

[0095] As shown by dashed lines in FIG. 9 , the bonding material applicator 8 is provided at one or more locations on the mounting head 43, the X-axis movable body 42, and the base 10. The bonding material applicator 8 applies bonding material for electrical connection to predetermined component mounting positions on the second substrate K2 placed on the positioned first carrier member 75. Alternatively, the bonding material applicator 8 applies bonding material to electrodes of components to be mounted on the second substrate K2. The bonding material is not limited to paste solder, and may be conductive ink that dries to become conductive. Note that the bonding material applicator 8 may be a pre-installed unit that operates on the first substrate K1 or components.

[0096] An inkjet nozzle device can be exemplified as the bonding material applicator 8, but is not limited to this. The inkjet nozzle device includes a nozzle disposed in the mounting head 43 or the X-axis movable body 42, and a maintenance unit disposed on the base 10. The nozzle has an ejection or dripping port facing downward, and is driven by the component transfer device 4 to move horizontally. The nozzle ejects or drips conductive ink toward the component mounting position on the second board K2. The maintenance unit cleans the nozzle when it reaches above, replenishes conductive ink, and so on.

[0097] The bonding material applicator 8 can operate based on the work program 54 or in response to instructions from an operator. The bonding material applicator 8 can operate on the second substrate K2 or components at any desired time after the first carrier member 75 and the second carrier member 76 have been positioned. Therefore, there is no need to print or apply solder paste to the second substrate K2 in advance using a solder printer or other device, eliminating the risk of the solder paste cooling and hardening. Furthermore, in the third embodiment, as in the first embodiment, setup changes can be efficiently performed when switching between the first substrate K1 and the second substrate K2.

[0098] 8. Fourth Embodiment Next, the fourth embodiment will be described with reference to FIG. 11 , focusing on the differences from the first to third embodiments. The overall configuration of the component mounting machine 1 in the fourth embodiment is the same as that in the first embodiment. In the fourth embodiment, as shown in FIG. 11 , a second substrate K2C (a difficult-to-transport substrate) that cannot be transported by the substrate transport device 2 alone is placed on a carrier member 7C. Furthermore, three trays (TR1, TR2, TR3) and two carrier tapes (CT1, CT2) that contain at least some of the components to be mounted on the second substrate K2C are placed on the carrier member 7C.

[0099] The six second substrates K2C placed on the carrier member 7C are small substrates obtained by dividing a multi-panel substrate. Since their widths are less than the minimum transportable width, they cannot be transported by the substrate transport device 2. Other examples of substrates that are difficult to transport include irregularly shaped substrates and flexible substrates. Irregularly shaped substrates are rectangular when produced, but have a non-rectangular outer shape in which a portion of the periphery is cut off to fit the final use. For this reason, irregularly shaped substrates cannot be stably placed on the conveyor belt of the substrate transport device 2, making them difficult to transport. Flexible substrates are formed into a rectangular shape using soft plastic resin or the like, making them flexible. Therefore, when a flexible substrate is placed on the conveyor belt of the substrate transport device 2, its center portion sags downward, making it difficult to transport. Nevertheless, the second substrates K2C can be placed on the carrier member 7 and transported, eliminating the need for special equipment to be used in conjunction with the substrate transport device 2.

[0100] There are no particular restrictions on when production of the second substrate K2C can begin. That is, production of the second substrate K2C may be scheduled in the production plan 62, or may be started in response to an interrupt request during production of the first substrate K1. Furthermore, there are no restrictions on the production quantity of the second substrate K2C. In either case, the mode switching unit 55 switches from the first work mode to the second work mode when the production target is changed from the first substrate K1 to the second substrate K2C.

[0101] In the second operation mode, the board transport device 2 transports the carrier member 7C and positions it at the operation position. The component transfer device 4 picks up components from the positioned carrier member 7C and performs a mounting operation to mount the picked components on the second board K2C placed on the carrier member 7C. The component transfer device 4 may also perform a mounting operation to pick up components from the tape feeder 32 and mount them on the second board K2C. Furthermore, depending on the type of second board K2C, component supply using trays (TR1, TR2, TR3) and carrier tapes (CT1, CT2) may not be required. In this case, the carrier member 7C is transported and positioned with only six second boards K2C placed on it. The component transfer device 4 only performs a mounting operation to pick up components from the tape feeder 32 and mount them on the second board K2C.

[0102] In the fourth embodiment, by using the carrier member 7C, it becomes possible to easily transport the second substrate K2C, which cannot be transported by the substrate transport device 2 alone, and it is not necessary to change the setup of the component supply device 3 when switching the production target between the first substrate K1 and the second substrate K2C. In other words, it is possible to reduce the setup work related to the substrate transport device 2 and the component supply device 3 for the second substrate K2C, which cannot be transported by the substrate transport device 2 alone, and the setup can be performed more efficiently accordingly.

[0103] 9. Fifth Embodiment Next, the fifth embodiment will be described with reference to FIG. 12 , focusing on differences from the first to fourth embodiments. The overall configuration of the component mounting machine 1 in the fifth embodiment is the same as that in the first embodiment. In the fifth embodiment, the second substrate placed on the carrier member 7D is the same type as the first substrate K1. Therefore, for simplicity, the following description will be simplified assuming that the first substrate K1 is placed on the carrier member 7D as shown in FIG. 12 . Two more carrier tapes (CT1, CT2) are placed on the carrier member 7D. In the fifth embodiment, components supplied from the tape feeder 32 are referred to as first components, and components supplied from the carrier tapes (CT1, CT2) of the carrier member 7D are referred to as second components. The first and second components are different types. In the first operation mode, the first substrate K1 positioned at the operation position has first components mounted thereon to become a first substrate product. In addition, in the second operation mode, the first substrate K1 placed on the positioned carrier member 7D has a second component attached in place of at least a portion of the first component, becoming a second substrate product that is different from the first substrate product.

[0104] An example of this type of combination of a first component and a second component is a combination of a first chip component with a resistance value of 1 kΩ and a second chip component with the same shape as the first chip component but with a resistance value of 2 kΩ. The second chip component is mounted on the first substrate K1 in place of the first chip component at the component mounting position of the first chip component. A first substrate product in which the first chip component is mounted on the first substrate K1 and a second substrate product in which the second chip component is mounted on the first substrate K1 have different electrical circuit configurations and are therefore different products.

[0105] There are no particular restrictions on when production of the second board product can begin. That is, production of the second board product may be scheduled in the production plan 62, or may be started in response to an interrupt request during production of the first board K1. Furthermore, there are no restrictions on the production quantities of the first board product and the second board product. In either case, the mode switching unit 55 switches from the first work mode to the second work mode when the production target is changed from the first board product to the second board product.

[0106] In the second operation mode, the width dimension of the carrier member 7D is larger than the width dimension of the first substrate K1, so it is necessary to adjust the separation distance between the pair of guide rails 21 of the substrate transport device 2. After completing the adjustment, the substrate transport device 2 transports the carrier member 7D and positions it at the operation position. The component transfer device 4 performs a mounting operation of picking up a second component from the positioned carrier member 7D and mounting the picked second component on the first substrate K1 placed on the carrier member 7D. Note that the component transfer device 4 may also perform a mounting operation of picking up a first component from the tape feeder 32 and mounting it on the first substrate K1, in addition to the second component supplied from the carrier tape (CT1, CT2).

[0107] In the fifth embodiment, by using the carrier member 7D, it is possible to supply the second components using strip-shaped carrier tapes (CT1, CT2). Therefore, when switching the production target between the first board product and the second board product, it is not necessary to change the setup of the tape feeder 32 of the component supply device 3. In other words, the setup work related to the component supply device 3 can be reduced, and the setup can be performed more efficiently.

[0108] 10. Applications and Modifications of the Embodiments In the first to third embodiments, if all components to be mounted on a prototype board or repair board can be supplied from the tape feeder 32, the prototype board or repair board can be treated as the first board K1. That is, when an interrupt request to produce the prototype board or repair board occurs, the mode switching unit 55 maintains the first operation mode. The board transport device 2 transports and positions the prototype board or repair board independently. The component transfer device 4 performs the mounting work of picking up components from the tape feeder 32 and mounting them on the prototype board or repair board.

[0109] Furthermore, in each embodiment, components that can be supplied from the tape feeder 32 can be placed on the carrier members (7, 75, 76, 7C, 7D) and supplied. For example, components of the same type as components supplied from the tape feeder 32 but with different supplementary information such as lot or supplier can be placed on the carrier members (7, 75, 76, 7C, 7D) and supplied. The component transfer device 4 mounts components picked up from the tape feeder 32 onto the first substrate K1 to produce a first substrate product, and mounts components picked up from the carrier members (7, 75, 76, 7C, 7D) onto the first substrate K1 to produce a second substrate product. In this way, the first and second substrate products are of the same type in terms of design, and comparative testing can be conducted to verify the impact of differences in the supplementary information of the components.

[0110] Furthermore, the embodiments can be implemented in appropriate combinations. For example, the positioning jig 79 described in the second embodiment can also be used in the first, third, and fifth embodiments. The tool station 77 described in the third embodiment can also be used in the first, second, fourth, and fifth embodiments. In the fourth and fifth embodiments, the first and second carrier members 75 and 76 of the second and third embodiments can be used instead of one carrier member (7C, 7D). Furthermore, the carrier members (7, 75, 76, 7C, 7D) may carry items other than those described in the first to fifth embodiments. For example, a component to be fixed to a component mounting position on a board using adhesive can be placed on the carrier member (7, 76, 7C, 7D), and the bonding material applicator 8 described in the third embodiment can be configured to apply the adhesive. Various other applications and modifications are possible for the first to fifth embodiments.

[0111] 1, 1A, 1B: Component mounting machine 2, 2A: Board transport device 21: Guide rail 22: Clamping mechanism 25: First transport section 26: Second transport section 3: Component supply device 32: Tape feeder 4: Component transfer device 43: Mounting head 45, 45B: Suction nozzle 46: Mark camera 5: Control device 53: Display device 54: Work program 55: Mode switching section 56: Camera position command section 57: Display control section 6: Production management device 62: Production plan 7, 7C, 7D: Carrier member 73, 731, 732: Element 75: First carrier member 76: Second carrier member 77: Tool station 79: Positioning jig 8: Bonding material application section K1: First board K2, K2C: Second board M1, M2: Board position mark M3: Jig position mark TR1 to TR5: Tray CT1 to CT7: Carrier tape DSP: Screen K20: Overall image AR: Imaging range FD: Image data P: Part

Claims

a component transfer device that performs a mounting operation of picking up the components from the component supply device and mounting the picked components on the board positioned at the work position; a carrier member on which the board and at least some of the components to be mounted on the board are placed and which is positioned at the work position by the board transport device; and a mode switching unit that switches between a first work mode in which the component transfer device performs a mounting operation of mounting the components supplied by the component supply device onto a first board, which is the board positioned at the work position without using the carrier member, and a second work mode in which the component transfer device performs a mounting operation of mounting at least the components placed on the carrier member onto a second board, which is the board placed on the carrier member positioned at the work position.

2. The component mounting machine of claim 1, wherein the first board is a planned production board produced based on a production plan, and the second board is an interrupt production board produced by interrupting the production plan, and the mode switching unit sets the first work mode during normal times when no interrupt request has occurred to produce the interrupt production board, switches to the second work mode when the interrupt request has occurred, and switches to the first work mode after production of the interrupt production board has been completed.

3. The component mounting machine of claim 1, wherein a second component of a different type from a first component supplied by the component supply device is placed on the carrier member, the first component is mounted on the first board in the first work mode to become a first board product, and the second board is of the same type as the first board and the second component is mounted on the second board in the second work mode in place of at least a portion of the first component to become a second board product different from the first board product.

4. The component transfer device has a mark camera that images the second board or the component placed on the carrier member positioned in the second operation mode to detect the position of the second board or the component, and the component mounting machine is equipped with a camera position command unit that divides the upper surface of the carrier member into a plurality of elements arranged in a lattice pattern, and commands the position of the mark camera when imaging the second board or the component using intra-carrier position information that represents the approximate position of the second board or the component placed on the carrier member by any of the elements.

5. A component mounting machine as described in claim 1, wherein the carrier member has a positioning jig that positions the second board or a component container that contains the component and is equipped with a jig position mark, and the component transfer device has a movable mark camera that, in the second operation mode, captures an image of the jig position mark equipped on the positioning jig of the positioned carrier member, thereby detecting the position of the positioning jig and enabling the position of the second board or the component container to be estimated.

6. A component mounting machine as described in claim 5, wherein the positioning jig is formed in an L-shape that contacts two sides of the second board or the component container which is rectangular in a plan view and is provided with a plurality of the jig position marks, and the mark camera captures an image of the plurality of the jig position marks to detect the position of the positioning jig and its rotation angle in a horizontal plane, and is capable of estimating the position of the second board or the component container and its rotation angle in the horizontal plane.

7. A component mounting machine as described in claim 5, further comprising a camera position command unit which divides the upper surface of the carrier member into a plurality of elements arranged in a grid pattern, and which commands the position of the mark camera when capturing an image of the jig position mark using intra-carrier position information which represents the approximate position of the jig position mark by any one of the elements.

8. A component mounting machine as claimed in claim 4 or 7, wherein each of the plurality of elements is the same in shape and size as the imaging range of the mark camera, or is smaller than the imaging range.

9. A component mounting machine as described in claim 4 or 7, wherein each of the multiple elements is larger than the imaging range of the mark camera, and the camera position command unit commands the mark camera to capture images at multiple positions within the element.

10. A component mounting machine as claimed in any one of claims 5 to 7, wherein the carrier member has ferromagnetic properties, and the positioning jig is formed so as to be attracted to the carrier member by using a magnet.

11. A component mounting machine as claimed in any one of claims 1 to 7, wherein the carrier member includes a first carrier member on which the second substrate is placed, and a second carrier member on which at least a portion of the component to be mounted on the second substrate is placed.

12. A component mounting machine as described in claim 11, wherein the board transport device has at least a first transport section and a second transport section capable of independently transporting the board and the carrier member, the first carrier member being positioned at a first working position by the first transport section, and the second carrier member being positioned at a second working position by the second transport section.

13. A component mounting machine as described in claim 12, wherein the first carrier member is brought in from one side of the component mounting machine and positioned at the first working position, and the second carrier member is brought in from the other side of the component mounting machine and positioned at the second working position.

14. The component mounting machine according to claim 11, wherein the board transport device transports the first carrier member and the second carrier member side by side and positions them at the work position.

15. A component mounting machine as claimed in any one of claims 1 to 7, wherein the component transfer device has a movable mark camera that captures images of one or more of a predetermined component mounting position or an already-mounted component on the second board placed on the positioned carrier member, the component contained in a component container placed on the carrier member, and a jig position mark affixed to a positioning jig that positions the component container, as objects, and detects the position of the objects by image processing of the acquired image data, and the component mounting machine is provided with a display device that displays image-capture position information indicating the position or image-capture range of the mark camera at the time of image capture and the image data on a single screen.

16. A component mounting machine as described in claim 15, wherein the display device displays an overall image of one or more of the carrier member, the second substrate, and the component container, the overall image being acquired from outside the machine, and the position information at the time of imaging is illustrated and superimposed on the overall image.

17. A component mounting machine as described in claim 15, wherein the second work mode includes: a setup mode in which an operator sets up a work program for automatically performing mounting work on the second board by referring to the display on the display device; and an automatic mounting mode in which the component mounting machine automatically performs mounting work on the second board based on the work program.

18. The component mounting machine according to claim 15, wherein the second operation mode includes a manual mounting mode in which an operator manually performs mounting work on the second board while referring to the display on the display device.

19. A component mounting machine as claimed in any one of claims 1 to 7, wherein the carrier member comprises a tray which accommodates the components in a number of accommodation sections arranged in a lattice pattern, and a strip-shaped carrier tape which accommodates the components in a number of cavities arranged in a row.

20. A component mounting machine as claimed in any one of claims 1 to 7, wherein the component transfer device has a first component mounting tool which picks up and mounts the components to be mounted on the first board, and a mounting head which is movable and can replaceably hold the first component mounting tool, the carrier member carries a second component mounting tool which picks up and mounts the components to be mounted on the second board, and in the second work mode, the component transfer device replaces the first component mounting tool held by the mounting head with the second component mounting tool placed on the carrier member.

21. A component mounting machine as claimed in any one of claims 1 to 7, comprising an adhesive application section which applies adhesive for electrical connection to predetermined component mounting positions on the second board placed on the positioned carrier member, or to electrodes of the components to be mounted on the second board.