Component mounter and component mounting method

Abstract

This component mounter comprises: a substrate transport device that transports a substrate and positions the same at a prescribed work position; a carrier member that carries a strip-shaped carrier tape, in which components that are to be mounted on the substrate are respectively accommodated in a plurality of cavities arranged in a row, and a tray, in which components are respectively accommodated in a plurality of accommodation sections arranged in a lattice shape, and is placed inside the component mounter; and a component transfer device that can extract a component from the carrier member and mount the extracted component on the substrate which has been positioned at the work position.

Description

Component placement machine and component placement method

[0001] The present specification relates to a component mounting machine that performs a mounting operation of mounting components onto a board, and a component mounting method using the component mounting machine.

[0002] A technology for mass-producing board products by performing substrate-related operations on boards on which circuit patterns are formed is becoming widespread. A typical example of a substrate-related operation machine that performs substrate-related operations is a component placement machine that performs a placement operation to place components on a board. Generally, a component placement machine is equipped with a board transport device, a component supply device, and a component transfer device, and performs placement operations based on a work program created for each type of board. When changing the type of board (board product) to be produced, it is necessary to change the setup of the above three devices and replace the work program. Examples of technology related to the production of this type of board are disclosed in Patent Documents 1 to 3.

[0003] Patent Literature 1 discloses a production plan determination method for when a production plan for multiple types of board products includes a changeover for at least one of a component feeder, a nozzle, and a mounting head, and when interrupt production of another board product is performed, the method includes the steps of: searching for an insertion candidate in the initial production plan into which the interrupt production can be inserted; calculating the changeover time required before and after the interrupt production for each insertion candidate; and determining a production plan by inserting the interrupt production into one of the insertion candidates based on the calculated changeover time. According to this method, it is said that even if interrupt production is inserted, the impact on overall production time can be reduced.

[0004] Furthermore, Patent Document 2 discloses a method for determining a setup change plan, which includes a step of determining an initial setup plan for setup change parts such as component feeders and suction nozzles provided in a component mounting machine that produces a board product, and a step of determining an interrupt setup plan for the setup change parts based on the installation positions of the setup change parts before and after the interrupt production when performing interruption production of another board product, and inserting the plan into the initial setup plan. According to this method, it is possible to reduce the number of setup changes by taking into account the installation positions of the setup change parts in production before and after the interruption production, and to shorten the time required for setup change.

[0005] Furthermore, Patent Document 3 discloses an assembly device that includes a pallet on which an assembly object and assembly parts are simultaneously placed, a conveying device that conveys the pallet and positions it at a work position, and assembly means that assembles the assembly parts at predetermined assembly locations on the assembly object, with the placement positions of the assembly parts being on a straight line in a specific direction to the assembly location. This is said to reduce equipment costs and improve work efficiency by minimizing the movement mechanism of the assembly means.

[0006] International Publication No. 2013 / 124959 Japanese Patent Application Laid-Open No. 2011-146551 International Publication No. 2007 / 049341

[0007] While a component mounting machine is producing a board (a planned production board) based on a production plan, an interrupt request may occur to produce a repair board or a prototype board (an interrupt production board) that is not included in the production plan. In this case, the board transport device, component supply device, component transfer device, and work program must be reconfigured to accommodate the interrupt production board, and then reconfigured again to resume production of the planned production board after production of the interrupt production board is completed. In other words, a significant amount of reconfiguration work is required for a limited number of interrupt production boards. In particular, because component supply devices supply various types of components using multiple carrier tapes or trays, reconfiguration often requires a significant amount of work.

[0008] Furthermore, during interrupt production of PCBs, the component supply system may differ from that during normal production. In such cases, the built-in component supply device cannot be used, necessitating countermeasures. Furthermore, when repairing a PCB, it is difficult to reproduce the setup conditions during production, and the production work program cannot be used as is. Furthermore, the external shape of the repair PCB may differ from that of the original PCB. On the other hand, it may not be possible to perform the placement work on a prototype PCB using the work program. Thus, interrupt requests for interrupt production PCBs require special setup changes, which require a significant amount of man-hours to address. The problem of requiring a large amount of man-hours for setup changes is not limited to interrupt production, as described above, but can generally occur when changing the type of PCB.

[0009] To address the above-mentioned problems, the technical example of Patent Document 1 selects an insertion candidate time that reduces the setup time and inserts interruption production. However, interruption production generally requires early response, and the technical example of Patent Document 1 does not allow for early response. Furthermore, the technical example of Patent Document 2 performs setup changes to reduce the number of setup changes by taking into account the installation positions of the setup change components before and after interruption production. However, even though the technical example of Patent Document 2 can reduce the number of setup changes, it does not change the work content itself, so it cannot be said that setup changes are sufficiently efficient. Furthermore, the technical example of Patent Document 3 does not specifically describe how to make setup changes more efficient when changing the assembly target and assembly parts.

[0010] Therefore, the problem to be solved in this specification is to provide a component mounting machine and a component mounting method that can make setup changes more efficient than before by changing the work content of setup changes related to component supply.

[0011] This specification discloses a component mounting machine that includes a substrate transport device that transports a substrate and positions it at a predetermined working position, a carrier member that is placed inside the machine and that carries a strip-shaped carrier tape that stores components to be mounted on the substrate, each in a plurality of cavities arranged in a row, and trays that store the components in a plurality of storage sections arranged in a grid pattern, and a component transfer device that picks up the components from the carrier member and mounts the picked up components on the substrate that has been positioned at the working position. This specification also discloses a component mounting method using a component mounting machine equipped with a tray feeder, a board transport device, and a component transfer device, the component mounting method comprising: a setup step of arranging in the tray feeder a carrier member on which a strip-shaped carrier tape having components to be mounted on a board, each of which is accommodated in a plurality of cavities arranged in a row, and a tray on which trays each of which accommodates the components in a plurality of accommodation sections arranged in a grid pattern; a first work step of using the component transfer device to mount, onto a first board positioned at a predetermined work position by the board transport device, components accommodated in a second tray, the second tray accommodating components of a different type from the components accommodated in the tray, without using the carrier member; and a second work step of using the component transfer device to mount, onto a second board positioned at the predetermined work position by the board transport device, the components accommodated in the carrier member.

[0012] In this specification, the technical idea of ​​changing "the component placement machine according to claim 1" in claim 5 as originally filed to "the component placement machine according to any one of claims 1 to 4"; the technical idea of ​​changing "the component placement machine according to claim 10" in claim 12 as originally filed to "the component placement machine according to claim 10 or 11"; the technical idea of ​​changing "the component placement machine according to claim 1" in claim 14 as originally filed to "the component placement machine according to any one of claims 1 to 13"; the technical idea of ​​changing "the component placement machine according to claim 1" in claim 15 as originally filed to "the component placement machine according to claims 1 to 14"; The present application discloses the technical idea of ​​changing "the component mounting machine according to any one of claims 1 to 7" in claim 17 at the time of filing to "the component mounting machine according to claim 15 or 16", the technical idea of ​​changing "the component mounting machine according to claim 15" in claim 20 at the time of filing to "the component mounting machine according to any one of claims 15 to 17", and the technical idea of ​​changing "the component mounting machine according to any one of claims 1 to 7" in claim 23 at the time of filing to "the component mounting machine according to any one of claims 1 to 22".

[0013] The component mounting machine and component mounting method disclosed in this specification can perform a changeover operation for supplying components by placing a carrier member carrying a strip of carrier tape and a tray inside the machine. This allows for changeover operation targeting a carrier member capable of supplying components, instead of the conventional changeover operation targeting a reel wound with a long carrier tape, a tape feeder that supplies components using the reel, and a pallet with a tray. Therefore, changeover can be performed more efficiently than before.

[0014] 7 is a plan view schematically showing the overall configuration of a component mounting machine of a first embodiment; FIG. 8 is a side view schematically showing the detailed configuration of a tray feeder; FIG. 9 is a plan view illustrating a pallet and a placed second tray; FIG. 10 is a plan view illustrating a carrier member, and a placed carrier tape and tray; FIG. 11 is an image diagram explaining the functions of the intra-carrier position information and camera position command unit; FIG. 12 is a diagram showing an example of a screen displayed by a display device; FIG. 13 is an operation flow diagram explaining the operation of the component mounting machine; FIG. 14 is a sub-operation flow diagram explaining the details of the setup change work of step S5 in FIG. 7; FIG. 15 is a plan view schematically showing the overall configuration of a component mounting machine of a second embodiment; FIG. 16 is a plan view illustrating an example of a carrier member, a tool station, and a positioning jig used in the second embodiment; FIG. 17 is an image diagram explaining the functions of the intra-carrier position information and camera position command unit in the second embodiment;

[0015] 1. Overall Configuration of the Component Mounting Machine 1 of the First Embodiment The overall configuration of the component mounting machine 1 of the first embodiment will be described with reference to FIG. 1 . In FIG. 1 , the horizontal direction from left to right of the page is the X-axis direction along which the first substrate K1 and the second substrate K2 are transported, the horizontal direction from the bottom (front) to the top (rear) of the page is the Y-axis direction, and the vertical direction is the Z-axis direction. Note that the terms "first" and "second" used for the first substrate K1 and the second substrate K2 indicate different types of substrates and do not refer to specific substrates. Hereinafter, when there is no need to distinguish between the first substrate K1 and the second substrate K2, they will simply be referred to as "substrates." The component mounting machine 1 is configured by assembling a substrate transport device 2, a component supply device 3, a component transfer device 4, a control device 5, and other components to a base 10. The base 10 has a generally rectangular parallelepiped shape and is robust. A manually openable protective cover 11 (see FIG. 2) is provided above the base 10. The protective cover 11 ensures the safety of the operator and prevents dust and other particles from entering the machine.

[0016] The substrate transport device 2 is composed of a pair of guide rails 21, a pair of conveyor belts (not shown), a belt drive unit (not shown), and a clamp mechanism 22. The pair of guide rails 21 extend in the X-axis direction across the upper surface of the base 10 slightly toward the rear, and are attached to the base 10 parallel to each other. The distance between the pair of guide rails 21 is adjusted according to the width dimension (dimension in the Y-axis direction) of the substrates (first substrate K1, second substrate K2). The minimum and maximum width dimensions of the substrates that can be transported are determined according to the adjustment range of this distance.

[0017] The pair of conveyor belts are driven by a belt drive unit, and rotate along guide rails 21 with two parallel sides of a rectangular board placed on them. As a result, board transport device 2 loads the board into the machine from the load end (left end in FIG. 1 ) and transports it to a predetermined work position near the center of base 10. Clamping mechanism 22 pushes up the board that has stopped at the work position and clamps and positions it between guide rails 21. After the mounting operation by component transfer device 4 is completed, clamping mechanism 22 releases the board, and the conveyor belts transport the board to the load end (right end in FIG. 1 ) and remove it from the machine.

[0018] The component supply device 3 is disposed on one side of the base 10 in the Y-axis direction (the lower side in FIG. 1 ). The component supply device 3 is composed of a mounting table 31, multiple tape feeders 32, a tray feeder 8, and the like. The mounting table 31 is a generally rectangular member in a plan view. As shown in FIG. 1 , the mounting table 31 has multiple slots extending parallel to each other in the Y-axis direction and aligned in the X-axis direction in approximately half of its downstream area in the transport direction (X-axis direction). Tape feeders 32 are detachably attached to and aligned in the multiple slots. Each tape feeder 32 feeds a second carrier tape wound on a reel to a component supply position to supply components to be mounted on a board. The "second" prefixed to the second carrier tape indicates that the type of components supplied is different from the carrier tapes (CT11, CT12, and CT13) described below, and does not refer to a specific carrier tape.

[0019] A tray feeder 8 is attached to the mounting base 31 in approximately half of the area on the upstream side in the conveying direction. The tray feeder 8 supplies components to be mounted on a board using a second tray. The "second" in "second tray" indicates that the type of components supplied is different from the tray TR11 described below, and does not refer to a specific tray. The tray feeder 8 may be either a fixed type fixed to the mounting base 31 or a detachable type detachable from the mounting base 31. Furthermore, a detachable tray feeder 8 may be configured in a cart shape. The detailed configuration of the tray feeder 8 will be described later. The component supply device 3 may be arranged on both sides in the Y-axis direction (the lower and upper sides in FIG. 1 ). Furthermore, the entire component supply device 3 may be configured in a cart shape detachable from the base 10.

[0020] The component transfer device 4 is composed of a pair of guide rails 40, a Y-axis movable body 41, an X-axis movable body 42, a mounting head 43, a nozzle tool 44, a suction nozzle 45, a mark camera 46, and a component camera 47. The pair of guide rails 40 are arranged on both edges of the base 10 spaced apart in the X-axis direction and extend parallel to each other in the Y-axis direction. The Y-axis movable body 41 is formed of a member that is long in the X-axis direction and is mounted on the pair of guide rails 40. The Y-axis movable body 41 is driven by a Y-direction drive mechanism (not shown) to move in the Y-axis direction. The X-axis movable body 42 is mounted on the Y-axis movable body 41 and driven by an X-direction drive mechanism (not shown) to move in the X-axis direction.

[0021] The mounting head 43 is provided in front of the X-axis movable body 42 and is positioned higher than the board transport device 2 and the component supply device 3. The mounting head 43 moves horizontally in two directions together with the X-axis movable body 42. A rotationally symmetric nozzle tool 44 is rotatably provided below the mounting head 43. The nozzle tool 44 is driven by an R-axis drive mechanism (not shown) to rotate about a vertical central axis. The nozzle tool 44 interchangeably holds multiple suction nozzles 45 (eight in the example of FIG. 1 ) at positions equidistant from the vertical central axis.

[0022] The suction nozzle 45 is driven to move up and down by a not-shown lifting mechanism and rotates around a vertical axis by a not-shown Q-axis driving mechanism. Furthermore, the suction nozzle 45 is selectively supplied with negative or positive pressure air from a not-shown air supply mechanism. This allows the suction nozzle 45 to pick up components from the component supply positions of the tape feeder 32 and the tray feeder 8 and place them on the positioned board. The suction nozzle 45 is one form of a first component placement tool that picks up components from the tape feeder 32 or the second tray. The placement head 43 may omit the nozzle tool 44 and hold a single suction nozzle 45, or it may hold multiple suction nozzles 45 arranged in a row or a grid. The placement head 43 may also hold a first component placement tool other than the suction nozzle 45, such as a clamping chuck that clamps components.

[0023] The mark camera 46 is mounted on the X-axis mover 42 facing downward, alongside the mounting head 43, and moves integrally with the X-axis mover 42 and the mounting head 43. The mark camera 46 has a square or rectangular imaging range that is significantly smaller than the size of the board, yet is capable of capturing high-resolution image data through imaging. The board, which serves as the subject of the mark camera 46, has board position marks M1 attached near two diagonally opposite corners. The mark camera 46 captures the two board position marks M1 separately twice to capture image data. An image processing unit attached to the mark camera 46 processes the image data to detect the exact positions of the two board position marks M1, thereby detecting the exact working position of the board and its rotation angle in the horizontal plane. This detection result is reflected in the mounting operation.

[0024] The component camera 47 is mounted facing upward on the base 10 between the board transport device 2 and the component supply device 3. The component camera 47 captures an image of the component held by the suction nozzle 45 from below while the mounting head 43 is moving from the component supply device 3 to the first board K1, and recognizes the component. This allows the correctness of the component type to be determined, and the position and orientation of the component relative to the suction nozzle 45 to be detected and reflected in the mounting operation. Examples of the mark camera 46 and the component camera 47 include digital imaging devices having imaging elements such as CCDs (Charge Coupled Devices) and CMOSs ​​(Complementary Metal Oxide Semiconductors).

[0025] The control device 5 is mounted on the base 10, and its position is not limited. The control device 5 is configured as a computer device having a CPU and operating on software. The control device 5 may be configured with multiple CPUs distributed throughout the machine and connected to each other for communication. The control device 5 has a storage device 51 that stores various information. The control device 5 also has an input device 52 such as a keyboard or touch panel that accepts commands and selection operations from the worker, etc. The control device 5 also has a display device 53 such as a liquid crystal display that displays various information to the worker, etc.

[0026] The control device 5 receives an operation program 54 transferred from the host production management device 6 and stores it in the storage device 51. The operation program 54 is used for the mounting operation and is created for each type of board (board product). The operation program 54 includes design data for each type of board, as well as design data summarizing the type, shape, and number of components to be mounted on the board. The operation program 54 also includes coordinate data for component supply positions (component suction positions) and coordinate data for component mounting positions on the board. The operation program 54 also includes data related to the types and arrangement positions of the tape feeders 32, tray feeders 8, and suction nozzles 45, as well as detailed procedure data for the mounting operation. Based on the operation program 54, the control device 5 controls the board transport device 2, component supply device 3, and component transfer device 4 to proceed with the mounting operation.

[0027] 2. Detailed Configuration of Tray Feeder 8 The tray feeder 8 is a device that places a pallet 84 on which a second tray is placed inside the machine and supplies parts. As shown in FIG. 2, the tray feeder 8 is composed of a housing 81, a tray stocker 82, and a tray transport unit 83. The housing 81 is a vertically elongated, roughly rectangular box-shaped enclosure. A tray loading unit 811 is provided at the top of the housing 81, and a tray discharging unit 812 is provided at the bottom of the housing 81. A tray transport opening 813 opens at the front side of the housing 81, approximately at the mid-height.

[0028] The tray stocker 82 is disposed inside the housing 81. The tray stocker 82 is a generally box-shaped member having five storage shelves 821 arranged vertically. Each of the storage shelves 821 stores a pallet 84 so that the pallet 84 can be pulled out to the front. In other words, the tray stocker 82 stores a plurality of pallets 84 arranged vertically and so that the pallets 84 can be pulled out. The pallets 84 are members used to supply parts. In the example of FIG. 2 , the tray stocker 82 stores pallets 84 in the third and fourth storage shelves 821 from the top.

[0029] The tray stocker 82 is driven by an elevator mechanism (not shown) to move up and down inside the housing 81. A ball screw feed mechanism or a linear motor mechanism can be used as the elevator mechanism. A carry-in holding section 822 is provided on the upper surface of the tray stocker 82, and a discharge holding section 823 is provided on the lower surface of the tray stocker 82. The carry-in holding section 822 receives and temporarily holds a pallet 84 carried into the tray carry-in section 811. The discharge holding section 823 temporarily holds a pallet 84 that has run out of parts, and discharges it to the tray discharge section 812.

[0030] The tray transport unit 83 is disposed on the front side of the housing 81. The tray transport unit 83 is composed of a transport unit main body 831, a pair of transport conveyors 832, a drive sprocket 833, multiple support sprockets (not shown), and a pallet connector 834. The transport unit main body 831 is disposed so that its rear faces the tray transport opening 813 and its front is located within the movement range of the mounting head 43. The pair of transport conveyors 832 are endless annular and disposed spaced apart from each other in the width direction of the transport unit main body 831. The pair of transport conveyors 832 are rotatably supported by multiple support sprockets and the drive sprocket 833, which are axially supported on the transport unit main body 831, and extend in the front-to-rear direction. The pair of transport conveyors 832 are driven by the drive sprocket 833 and a motor (not shown) for rotation. A pallet connector 834 is disposed midway along the transport conveyor 832. The pallet connector 834 releasably holds the pallet 84.

[0031] The tray transport unit 83 grips the pallet 84 with the pallet connector 834 and places it on the transport conveyor 832, which then transports the pallet 84 by rotating the transport conveyor 832. As a result, the tray transport unit 83 performs the operation of pulling the pallet 84 out of the tray stocker 82 to the top surface of the transport unit main body 831 via the tray transport opening 813, and the operation of storing the pallet 84 in the reverse direction. In the example of Figure 2, the tray transport unit 83 pulls out the pallet 84 that was stored on the fifth level from the top of the tray stocker 82 to the component supply position set on the top surface of the transport unit main body 831.

[0032] As shown in FIG. 3 , the pallet 84 is formed using a generally rectangular plate-shaped member. Second trays are placed on the pallet 84, and in the example of FIG. 3 , two second trays (TR21, TR22) are placed on it. The pallet 84 positions the second trays (TR21, TR22) using upwardly protruding frame portions 841 arranged on the four sides of the rectangle and movable set pieces 842. Specifically, the two second trays (TR21, TR22) are positioned by their four sides contacting two adjacent sides of the frame portion 841 and the two set pieces 842. Note that the pallet 84 may not have the frame portion 841, and the second trays may be positioned using only the set pieces 842. Alternatively, the set pieces 842 may be formed in an L-shape and contact two adjacent sides of the rectangular second trays.

[0033] Next, the carry-in operation, component supply operation, and carry-out operation of the tray feeder 8 will be described. Prior to the carry-in operation, the worker carries the pallet 84 on which the second tray is placed into the tray carry-in section 811. Then, the tray feeder 8 starts the carry-in operation, the tray stocker 82 rises, and the carry-in holder 822 receives and holds the pallet 84. Next, the tray stocker 82 descends so that the pallet 84 faces the tray transport opening 813, and the tray transport section 83 pulls out the pallet 84. Next, the tray stocker 82 rises so that one of the storage shelves 821 faces the tray transport opening 813, and the tray transport section 83 stores the pallet 84 in the storage shelf 821.

[0034] In the component supply operation, the tray stocker 82 is raised or lowered so that one of the pallets 84 faces the tray transport opening 813, and the tray transport unit 83 pulls out the pallet 84 from the storage shelf 821 to the component supply position. After the suction nozzle 45 picks up a component from the second tray (TR21, TR22) on the pallet 84, the tray transport unit 83 stores the pallet 84 back into the storage shelf 821. Next, another pallet 84 is designated to change the type of component to be supplied, and the tray stocker 82 is raised or lowered, and the tray transport unit 83 pulls out and stores the designated pallet 84. Furthermore, the process of designating another pallet 84, raising or lowering the tray stocker 82, and the tray transport unit 83 pulling out and storing the designated pallet 84 is repeated.

[0035] When the pallet 84 at the component supply position runs out of components, in other words, when all of the storage sections SQ of one or both of the two second trays (TR21, TR22) become empty, a carry-out operation is performed. In the carry-out operation, first, the tray stocker 82 rises, and the discharge holder 823 faces the tray transport opening 813. Next, the tray transport section 83 moves the pallet 84 in question to the discharge holder 823, which receives and holds the pallet 84. Next, the tray stocker 82 descends, and the discharge holder 823 discharges the pallet 84 in question to the tray discharge section 812. Because the carry-out operation leaves space in the storage shelf 821, the tray feeder 8 can carry in another pallet 84 as needed.

[0036] The number of tray stockers 82 arranged inside the housing 81 may be multiple, and the number of stages of the storage shelf 821 is not limited to five. The tray feeder 8 may have a replacement door on the rear surface of the housing 81, allowing an operator to directly insert and remove pallets 84 into and from the storage shelf 821 through the replacement door. The tray feeder 8 may be replaced not in units of pallets 84, but in units of tray stockers 82. The tray feeder 8 may also be configured such that the pallets 84 are omitted, the tray stocker 82 stores the second tray in the storage shelf 821, and the tray transport unit 83 pulls out the second tray to the component supply position. The tray feeder 8 may also be configured such that the housing 81 is omitted, the tray stocker 82 is held at a predetermined height, and the tray transport unit 83 moves up and down to select a specified pallet 84.

[0037] 3. Issues with Conventional Component Mounting Machines The production management device 6 stores and manages production plans 62 for multiple types of boards and work programs 54 for each type of board in a storage device 61. The production plan 62 includes at least the production sequence and production quantities for the multiple types of boards. When the production time for the first board K1 in the production plan 62 arrives, the production management device 6 transfers the work program 54 for the first board K1 to the component mounting machine 1 and other board-related operation machines, and commands the production of the first board K1. While the component mounting machine 1 is producing the first board K1 in accordance with the command, an interrupt request to produce a second board K2, which is not planned in the production plan 62, may occur.

[0038] The first board K1 can be rephrased as a planned production board that is produced based on the production plan 62. On the other hand, the second board K2 is a different type from the first board K1, and can be rephrased as an interruption production board that is produced by interrupting the production plan 62. The second board K2 is a prototype board, a repair board, or the like, and requires early response, and in many cases the production quantity is limited.

[0039] When an interrupt request occurs, conventional component mounting machines must reconfigure the board transport device 2, component supply device 3, component transfer device 4, and work program 54 to accommodate the second board K2. After production of the second board K2 is completed, the reconfiguration must be repeated to resume production of the first board K1. This requires a significant amount of reconfiguration work for a limited number of second boards K2. For example, the components to be mounted on the second board K2 may be different from the components supplied by the tape feeders 32 arranged on the mounting base 31, necessitating the reconfiguration of the tape feeders 32, which requires additional work. Furthermore, reconfiguring multiple tape feeders 32 often requires a significant amount of work. Even with tray feeders 8, reconfiguring multiple pallets 84 often requires a significant amount of work.

[0040] Furthermore, the components to be mounted on the second board K2 may be supplied in a different form than usual and may not be usable with the built-in component supply device 3. For example, if the components are supplied in the form of cut strips of carrier tape, they cannot be used with a general tape feeder 32. This requires a special device to replace the built-in component supply device 3. In addition, it becomes necessary to correct the coordinate value data of the component supply position in the work program 54.

[0041] Furthermore, in the mounting work for repairing a PCB, it is difficult to reproduce the setup conditions at the time of production, and the work program 54 used at the time of production cannot be used as is. For example, since the repair PCB only requires remounting some of the components involved in the failure, it is necessary to specify whether or not remounting is required for each type of component in the work program 54. Furthermore, the size and shape of the repair PCB may differ from those at the time of production. For example, the outer periphery of the repair PCB may be cut off to suit the final use, which requires correction of the coordinate value data of the component mounting positions in the work program 54.

[0042] On the other hand, there are cases where the mounting work cannot be performed on a prototype board using the operation program 54. For example, there may be cases where the operation program 54 has not been created or where compatibility has not been sufficiently verified. In such cases, the worker must proceed with the mounting work manually while checking the components at the component supply positions and the component mounting positions on the second board K2. Furthermore, an operation program 54 created with mass production in mind may need to be partially modified for the prototype.

[0043] As described above, worker man-hours are required to perform setup changes in response to an interrupt request to produce the second board K2, which is not scheduled in the production plan 62. Furthermore, after production of the second board K2 is completed, another setup man-hour is required to return to the original setup state and resume production of the first board K1. In other words, a significant amount of man-hours is required for two setup changes, and the setup time is long. In particular, since the component supply device 3 supplies various types of components using multiple carrier tapes and trays, there are many cases where a large amount of man-hours is required for setup changes. As a countermeasure to this, in the first embodiment, a carrier member 7 is used in the production of the second board K2. Additionally, the mode switching unit 55 switches whether or not to use the carrier member 7.

[0044] 4. Carrier Member 7 The carrier member 7, like the pallet 84, is a member used to supply components. The carrier member 7 is formed using a rectangular plate-like member having roughly the same shape and size as the pallet 84. The carrier member 7 is handled in the same manner as the pallet 84 in the tray feeder 8. That is, the carrier member 7 is stored in the storage shelf 821 of the tray stocker 82, and in the example of FIG. 2, it is stored in the storage shelf 821 on the first level from the top. Furthermore, the carrier member 7 is pulled out to the component supply position by the tray transport unit 83. Therefore, the tray feeder 8 can supply components by selectively and automatically arranging the pallet 84 on which the second tray is placed and the carrier member 7 inside the machine. Furthermore, the component transfer device 4 can pick up components from the carrier member 7 and mount the picked up components on a board positioned at the work position.

[0045] A strip-shaped carrier tape and a tray are placed on the carrier member 7. In the example of Fig. 4, one carrier tape CT11 with a relatively small tape width, two carrier tapes (CT12, CT13) with relatively large tape widths, and one tray TR11 are placed on the carrier member 7. In the following description, the carrier tapes (CT11, CT12, CT13) and the tray TR11 placed on the carrier member 7 may be referred to as a component container. To position the component container, an operator can attach the component containers using, for example, double-sided tape.

[0046] The carrier tapes (CT11, CT12, CT13) accommodate components in each of the multiple cavities CV arranged in a row. The carrier tapes (CT11, CT12, CT13) are formed by cutting portions of a long tape and have a strip-like shape (a long, thin rectangle). Carrier tape CT11 has the same tape width as the second carrier tape used by tape feeder 32 arranged on mounting base 31, but cannot be used by tape feeder 32 because it has been cut. Carrier tapes CT12 and CT13 have relatively larger tape widths and are used in different types of tape feeders that are larger than tape feeder 32. The types of components supplied by the carrier tapes (CT11, CT12, CT13) are different from the types of components supplied by the second carrier tape of tape feeder 32 arranged on mounting base 31. The cover tapes covering the cavities CV of the carrier tapes (CT11, CT12, CT13) are removed by an operator at an appropriate time.

[0047] On the other hand, tray TR11 stores components in a plurality of storage compartments SQ arranged in a grid pattern. The types of components supplied by tray TR11 differ from the types of components supplied by the second trays (TR21, TR22) on the pallet 84 stored in tray stocker 82. If the storage compartments SQ of tray TR11 are covered with a protective sheet, this protective sheet is removed by an operator at an appropriate time. The components supplied by carrier member 7, i.e., the carrier tapes (CT11, CT12, CT13) and the components supplied by tray TR11, are mounted on the second board K2 but not on the first board K1.

[0048] The worker uses the input device 52 to input in advance known shape information of the component container (carrier tape (CT11, CT12, CT13), tray TR11) and information about the type of components contained therein, and stores this information in the memory device 51. The shape information includes at least the quantity, arrangement, and storage pitch distance of the components contained therein. The shape information is referenced when detecting the position of a specific component or when determining the position of other components. Information about the type of components is referenced during the mounting work. Note that if the second board K2 is a prototype board and the components to be mounted have no history of use, the worker newly registers component data in the memory device 61 that summarizes the shape, specifications, etc. of the components.

[0049] The upper surface of the carrier member 7 is divided into a plurality of elements 73 arranged in a grid pattern. In the example shown in FIG. 5 , 18 elements 73 are arranged in the left-right direction and 15 elements in the up-down direction in the figure, for a total of 270 elements. The elements 73 may be represented as virtual images, or may be represented by actual grid lines drawn on the upper surface of the carrier member 7. Furthermore, the elements 73 may be represented by a combination of row and column numbers assigned to two orthogonal sides of the carrier member 7. The size of each element 73 is not particularly limited. That is, each element 73 may be the same shape and size as the imaging range of the mark camera 46, smaller than the imaging range, or larger than the imaging range.

[0050] The approximate position of the component container is indicated by the intra-carrier position information represented by any of the elements 73. The operator inputs the intra-carrier position information of each positioned component container using the input device 52. In the example shown in Fig. 5, the approximate position of the carrier tape CT11 is indicated by the intra-carrier position information representing the element 731 in the third row from the top and the third column from the left, which represents the position of the cavity CV (or component) at one end (the upper end in Fig. 5), which is the specific position.

[0051] 5. Functions of the Three Functional Units of the Control Device 5 As shown in FIG. 1 , the control device 5 has three functional units configured using software: a mode switching unit 55, a camera position command unit 56, and a display control unit 57. The mode switching unit 55 switches between a first work mode and a second work mode. In the first embodiment, the mode switching unit 55 sets the first work mode during normal operation when no interrupt request for producing the second substrate K2 has occurred, and controls the system to continue production of the first substrate K1. Furthermore, the mode switching unit 55 switches to the second work mode in response to an interrupt request from the production management device 6 or an interrupt request from the operator's input device 52, and controls the system to suspend production of the first substrate K1 and produce the second substrate K2. Furthermore, the mode switching unit 55 switches to the first work mode after production of the second substrate K2 has finished, and controls the system to resume production of the first substrate K1.

[0052] In the first work mode, the carrier member 7 is not used. In other words, the tray stocker 82 does not store the carrier member 7, or even if the tray stocker 82 stores the carrier member 7, the tray transport unit 83 does not pull out the carrier member 7. The board transport device 2 transports the first board K1 and positions it at the work position. The component transfer device 4 picks up components from at least one of the tape feeder 32 and the second tray (TR21, TR22) on the pallet 84, and performs a mounting operation to mount the picked components on the positioned first board K1. Naturally, the component transfer device 4 does not pick up components from a component container on a carrier member 7 that has not been set up.

[0053] In the second operation mode, the carrier member 7 is set up and stored in the tray stocker 82 as illustrated in FIG. 4 . The board transport device 2 transports the second board K2 and positions it at the operation position. The component transfer device 4 performs a mounting operation of picking up components from a component container on the carrier member 7 that has been pulled out to the component supply position and mounting the picked components on the second board K2. Note that the component transfer device 4 may also perform a mounting operation of picking up components from at least one of the tape feeder 32 and the second tray (TR21, TR22) and mounting them on the second board K2.

[0054] In the second operation mode, the placement operation cannot be performed with only the approximate position information of the component container indicated by the intra-carrier position information, and the exact position information of the component container is required. Therefore, prior to the placement operation, the control device 5 acquires the exact position of the component container using the mark camera 46. The mark camera 46 captures an image of the component container on the carrier member 7 and detects its position.

[0055] Specifically, the mark camera 46 captures an image of a specific position in the component container or a specific component contained in a specific position by referencing the shape information of the component container. The image processing unit of the mark camera 46 processes the acquired image data to detect the exact position of at least one component. Furthermore, by referencing the shape information of the component container, the mark camera 46 can determine the exact positions of all components in the component container. Examples of the specific position include a cavity CV at one end of the carrier tape (CT11, CT12, CT13) or a container section SQ at one of the corners of the tray TR11. By accurately determining the positions of the components as described above, the placement operation becomes possible.

[0056] The camera position command unit 56 uses the above-mentioned intra-carrier position information to command the position of the mark camera 46 when capturing an image of a component container (or a component). When each element 73 is set to have the same shape and size as the imaging range of the mark camera 46, the mark camera 46 can capture image data of the entire area of ​​the commanded element 73 in a single image capture.

[0057] Furthermore, when each of the elements 73 is set smaller than the imaging range of the mark camera 46, the mark camera 46 can image not only the commanded element 73 but also at least some of the surrounding elements 73. Furthermore, nine elements 73 arranged in a 3 x 3 pattern may be set to match the imaging range of the mark camera 46. In this way, the mark camera 46 can collectively image the nine elements 73 with the commanded element 73 positioned in the center.

[0058] On the other hand, when each element 73 is set to be larger than the imaging range of the mark camera 46, the mark camera 46 cannot acquire image data of the entire area of ​​the element 73 in a single imaging operation. In this mode, the camera position command unit 56 commands the mark camera 46 to capture images at multiple positions within the element 73. This allows the mark camera 46 to combine the image data acquired by imaging at the multiple positions to create image data that covers the entire area of ​​the specified element 73.

[0059] Therefore, the acquired image data reliably captures the specific position of the component container and the specific component, enabling accurate position detection through image processing. In other words, the mark camera 46 can detect the exact position of the component container without repeated trial-and-error imaging. If the mark camera 46 is unable to detect the exact position of the component container, the camera position command unit 56 issues a command to image the next element 73 surrounding the initially specified element 73, causing the mark camera 46 to take another image. Therefore, the mark camera 46 can detect the exact position of the component container through a limited number of image captures.

[0060] Note that the second substrate K2 may be a repaired substrate, and its size and shape may differ from those at the time of production. In this case, the two substrate position marks M1 of the second substrate K2 positioned at the work position may be displaced from the positions described in the work program 54 at the time of production, making their approximate positions unknown. Therefore, the control device 5 acquires the exact work position of the second substrate K2 using the mark camera 46 prior to the mounting operation. At this time, the top surface of the second substrate K2 is divided into a plurality of elements 73 arranged in a grid pattern, similar to the top surface of the carrier member 7. The worker inputs intra-carrier position information representing the approximate position of the substrate position mark M1 of the second substrate K2 using any of the elements 73. This allows the camera position command unit 56 to use the intra-carrier position information to command the position at which the mark camera 46 captures the substrate position mark M1. The mark camera 46 can detect the exact position of the substrate position mark M1 without repeated trial-and-error imaging, and thus detect the exact work position of the second substrate K2 and the rotation angle of the second substrate K2 in the horizontal plane.

[0061] Furthermore, the second board K2 may be a repair board, a small piece of a large board divided during production, and may not have a board position mark M1. In this case, the exact position of the second board K2 positioned at the work position and the component mounting positions on the second board K2 are unknown. Therefore, as described above, the top surface of the second board K2 is divided into multiple elements 73, and the worker inputs intra-carrier position information representing the approximate component mounting positions on the second board K2 using any of the elements 73. The camera position command unit 56 then uses the intra-carrier position information to command the position of the mark camera 46 when capturing an image of the component mounting positions. The mark camera 46 can accurately detect the component mounting positions without repeated trial-and-error imaging.

[0062] The display control unit 57 edits and controls the display content of the display device 53 to improve the visibility of the image data when the worker visually checks it, and to support intuitive understanding. The display device 53, under the control of the display control unit 57, displays image data and image position information indicating the position or imaging range of the mark camera 46 at the time of imaging on a single screen. The image position information of the mark camera 46 at the time of imaging is expressed as numerical information such as coordinate values ​​within the control device 5. However, this numerical information is not suitable for intuitive understanding by the worker. Therefore, the display device 53 displays an overall image of one or more of the carrier member 7 and the component containers (carrier tapes (CT11, CT12, CT13), tray TR11) acquired from outside the machine, with the image position information superimposed on the overall image.

[0063] For example, image data separately acquired by an optical camera with a wide imaging range can be used as the overall image of the carrier member 7. Furthermore, image data acquired by the optical camera or shape information of the component container that can be acquired from a catalog, specification, or the like can be used as the overall image of the component container.

[0064] On the screen DSP of the display device 53 shown in FIG. 6 , the imaging range AR captured by the mark camera 46 is illustrated and superimposed on the overall image 7A of the carrier member 7. Furthermore, image data FD captured within the imaging range AR is enlarged and displayed. The image data FD is associated with the imaging range AR within the overall image 7A using an enlargement assist line LL. The image data FD is an image of the vicinity of the end of the carrier tape CT12. By visually viewing this image data FD, the worker can confirm the actual positions and orientations of the components accommodated in the cavities CV of the carrier tape CT12.

[0065] The operator can also input a command to move the mark camera 46 by clicking on the four-way arrows YZ displayed on the screen DSP. The control device 5 controls the movement of the mark camera 46 together with the X-axis movable body 42 based on the command from the click operation. The mark camera 46 automatically captures an image after its movement is completed. The display device 53 automatically updates and redisplays the position of the imaging range AR and the image data FD. Note that the imaging range AR may be illustrated and superimposed on the overall image of the carrier tape CT12, rather than the overall image 7A of the carrier member 7.

[0066] The image capture position information is not limited to the image capture range AR, but may be a symbol or the like that pinpoints the position of the mark camera 46 at the time of image capture. The display device 53, which displays the image capture position information (image capture range AR) and the image data FD on a single screen DSP, can also be used to check other parts. Examples of checking other parts include checking the position of the second board K2, checking the state of the component mounting positions on the second board K2, and checking the actual positions and mounting states of the components mounted on the second board K2.

[0067] As described above, the mark camera 46 captures an image of the component container (carrier tapes (CT11, CT12, CT13) and tray TR11) placed on the carrier member 7 as a subject. The mark camera 46 also captures an image of a predetermined component mounting position or a mounted component on the second board K2 as a subject. The image processing unit of the mark camera 46 processes the acquired image data to detect the position of the component container and to confirm the component mounting position and the status of the mounted component on the second board K2. The display device 53 then displays the image as shown in FIG. 6 . By checking the displayed content, the operator can efficiently set up a work program 54 for the second board K2 (described later) and manually perform mounting work. The display device 53 may also enlarge and display the image data captured by the component camera 47 so that the operator can confirm the state in which the suction nozzle 45 is suctioning a component.

[0068] After switching to the second operation mode as described above, the mode switching unit 55 selects and sets one of the automatic placement mode and the manual placement mode in response to a command from the operator. Furthermore, the mode switching unit 55 sets the setup mode prior to setting the automatic placement mode. In the setup mode, the operator refers to the display on the display device 53 and sets up the operation program 54 for the second board K2 so that the component transfer device 4 automatically performs the placement operation. "Setup" refers to creating or editing the operation program 54 to suit the current state of the component containers on the carrier member 7, storing it in the storage device 51, and preparing it for execution by the control device 5.

[0069] If the second board K2 is a prototype board, the worker must at least edit or correct the coordinate data of the component supply position in the work program 54. If the second board K2 is a repair board, the worker must not only edit the coordinate data of the component supply position, but also specify whether or not remounting is required for each type of component described in the work program 54. In the next automatic mounting mode, the component mounting machine 1 automatically performs mounting on the second board K2 based on the work program 54.

[0070] In manual placement mode, the worker manually performs placement on the second board K2 while referring to the display on the display device 53. At this time, the worker can manually control the component transfer device 4 and proceed with the placement work while referring to the image data FD displayed on the screen DSP to check the position and status of the component to be picked up, the status of the component placement position on the second board K2, and the actual position and placement status of the placed component. Note that in manual placement mode, an optional work program 54 may be created or edited. This allows the worker to efficiently proceed with manual placement work by referring to the description of the work program 54 along with the enlarged display of the image data FD.

[0071] 6. Operation of the Component Mounting Machine 1 Next, the operation of the component mounting machine 1 will be described with reference to Figures 7 and 8. The operation flow shown in Figure 7 is mainly controlled by the control device 5, with some operations being performed by the operator. As a prerequisite, it is assumed that the first board K1 is scheduled to be the first board in the production order of the production plan 62, and that production of the second board K2 is not currently planned. Note that the following description includes a section regarding the component mounting method of the embodiment.

[0072] 7, the mode switching unit 55 of the control device 5 sets the first work mode to produce the first board K1 in accordance with the production plan 62. The worker performs setup work to suit the first board K1. In the setup work, as necessary, the separation distance between the pair of guide rails 21 of the board transport device 2 is adjusted, the tape feeder 32 or the second carrier tape of the component supply device 3 is replaced, the pallet 84 of the tray feeder 8 is replaced, and the suction nozzle 45 of the component transfer device 4 is replaced. In addition, the work program 54 for the first board K1 is transferred and stored.

[0073] In the next step S2, the control device 5 starts production (mounting work) of the first substrate K1. Production of the first substrate K1 continues until an interrupt request to produce the second substrate K2 is generated in step S3. Step S2 is a process of mounting components stored in a second tray (TR21, TR22) or components stored on a second carrier tape attached to the tape feeder 32 onto the first substrate K1 without using the carrier member 7, and corresponds to the first work step of the component mounting method of the embodiment. In step S4 after the interrupt request is generated, the mode switching unit 55 switches to the second work mode. In the next step S5, the operator performs a setup work to adapt to the production of the second substrate K2. Details of the setup work are shown in the sub-operation flow of FIG. 8.

[0074] 8, the worker stores the work program 54 currently prepared for the second board K2 in the storage device 51. In the next step S22, the worker adjusts the separation distance between the pair of guide rails 21 of the board transport device 2 when the width dimensions of the first board K1 and the second board K2 differ.

[0075] In the next step S23, the worker replaces the suction nozzle 45 as necessary. In the next step S24, the worker places the component container (carrier tapes (CT11, CT12, CT13), tray TR11) on the carrier member 7 and positions it. The worker then loads the carrier member 7 into the tray loading section 811 of the tray feeder 8. Step S24 is a process of setting up the carrier member 7 and placing it in the tray feeder 8, and corresponds to the setup process of the component mounting method of the embodiment. The tray feeder 8 stores the carrier member 7 in an empty storage shelf 821 of the tray stocker 82. If there is no empty storage shelf 821, the tray feeder 8 temporarily retracts a pallet 84 not used in the production of the second board K2 to the tray discharge section 812, thereby securing an empty storage shelf 821 and storing the carrier member 7 therein. Here, the worker does not need to perform the labor-intensive setup of multiple tape feeders 32 and pallets 84.

[0076] In the next step S25, the operator uses the input device 52 to input intra-carrier position information indicating the approximate position of the component container. In the next step S26, the tray feeder 8 pulls out the carrier member 7 to the component supply position. In the next step S27, the camera position command unit 56 uses the intra-carrier position information input in step S25 to command the position of the mark camera 46 when capturing an image of the component container. The mark camera 46 captures an image of the component container in accordance with the command. In the next step S28, the image processing unit of the mark camera 46 performs image processing on the acquired image data to detect the exact position of the component container. Steps S27 and S28 are repeatedly executed according to the number of component containers. Thereafter, the control device 5 ends the sub-operation flow and returns control of the operation flow to step S6 in FIG. 7.

[0077] In step S6, the mode switching unit 55 uses the display device 53 to inquire of the operator whether or not to perform automatic placement. The operator uses the input device 52 to command either automatic placement or manual placement. If automatic placement is commanded, the mode switching unit 55 sets the setup mode in step S7. The operator edits and sets up the exact positions of the component containers detected in step S28 using the work program 54 prepared in step S21. In the next step S8, the mode switching unit 55 sets the automatic placement mode. As a result, the component placement machine 1 automatically performs placement work based on the work program 54.

[0078] Furthermore, in step S9, when manual placement is instructed, the mode switching unit 55 sets the manual placement mode. The board transport device 2 transports the second board K2, on which cream solder has been printed or applied by an upstream solder printer or the like, to the component placement position and positions it at the work position. The worker manually controls the component transfer device 4 while referring to the display on the display device 53 to perform the placement work. This manual placement takes longer than automatic placement, and there is a risk of the cream solder deteriorating or hardening. In this case, the worker divides the multiple component placement positions on the second board K2 into multiple work groups. The worker then proceeds with manual placement by repeating the printing or application of cream solder for each work group, the transport and positioning of the second board K2, the placement work for each work group, and the transport of the second board K2. Step S8 or step S9 is a process of mounting components housed on a carrier member 7 onto the second board K2, and corresponds to the second work step of the component mounting method of the embodiment.

[0079] After step S8 or step S9 is completed, the operation flow merges at step S10. In step S10, if the production quantity of the second substrate K2 is one, production of the second substrate K2 is completed. If the production quantity of the second substrate K2 is multiple, the control device 5 operates the substrate transport device 2 to transport the second substrate K2 for which the mounting work has been completed out of the machine. Next, the control device 5 operates the substrate transport device 2 to transport the next second substrate K2 into the machine, and step S6 and subsequent steps are repeated.

[0080] Furthermore, if any of the component containers on the carrier member 7 runs out of components during the mounting operation, the tray feeder 8 discharges the carrier member 7 to the tray discharge section 812. The operator removes the carrier member 7 from the tray discharge section 812, replaces the out-of-component container with another component container (corresponding to step S24), and then loads the carrier member 7 back into the tray load section 811. The operator and the control device 5 then execute step S25 and onward to continue the mounting operation. In this way, the component mounting machine 1 sequentially loads and mounts multiple second boards K2, and also discharges and reloads the out-of-component carrier member 7 to replenish the components, thereby producing multiple second boards K2.

[0081] In step S11, after the production of the second substrate K2 is completed, the mode switching unit 55 switches to the first work mode. The worker resets the work program 54 for the first substrate K1, readjusts the separation distance between the pair of guide rails 21, and replaces the suction nozzle 45 as necessary to match the production of the first substrate K1 (reverse steps S21 to S23). Here, the worker does not need to perform the labor-intensive setup of multiple tape feeders 32 and pallets 84. After this, the operation flow returns to step S2, and the control device 5 resumes production of the first substrate K1. Note that setup similar to that described above is performed even when the production of the second substrate K2 is not an interrupt but is incorporated into the production of the first substrate K1 in the production plan 62.

[0082] The component mounting machine 1 of the first embodiment can perform a changeover operation for component supply, in which a carrier member 7 carrying strip-shaped carrier tapes (CT11, CT12, CT13) and a tray TR11 is placed inside the machine. This allows for a changeover operation targeting the carrier member 7 capable of supplying components, instead of the conventional changeover operation targeting a reel wound with a long second carrier tape, a tape feeder 32 that supplies components using the reel, and a pallet 84 carrying second trays (TR21, TR22). In other words, while the conventional technology required changeover of three tape feeders 32 and one pallet 84 corresponding to the four types of components supplied by the carrier member 7, the first embodiment requires changeover of only one carrier member 7. Therefore, the first embodiment allows for more efficient changeover than the conventional technology.

[0083] Furthermore, because the carrier member 7 is used to supply components to be mounted on the second substrate K2, setup changes that disrupt the arrangement of the tape feeders 32 of the component supply device 3 are not required when producing the second substrate K2, and setup changes that disrupt the arrangement of multiple pallets 84 are minimized. Furthermore, the labor required to resume production of the first substrate K1 can be reduced and the resumption time can be accelerated. Furthermore, by placing multiple component containers (carrier tapes (CT11, CT12, CT13), trays TR11) on the carrier member 7, it is possible to supply a wide variety of components in excess of the number of tape feeders 32 and pallets 84. In addition, cut carrier tapes (CT11, CT12, CT13) can be easily arranged and used. The number of components to be supplied can be as small as one, or as many as needed if some operator effort is acceptable.

[0084] 7. Modification of the First Embodiment Next, a modification of the first embodiment will be described. In this modification, the substrate transport device 2 transports the first substrate K1 and positions it at the work position in both the first work mode and the second work mode. In the first work mode, components other than those supplied from the carrier member 7 are attached to the first substrate K1, thereby becoming a first substrate product. On the other hand, in the second work mode, components supplied from the carrier member 7 are attached to the first substrate K1, thereby becoming a second substrate product of a different type from the first substrate product.

[0085] More specifically, in the first work mode, the carrier member 7 is not used. The board transport device 2 transports the first board K1 and positions it at the work position. The component transfer device 4 picks up components from at least one of the tape feeder 32 and the second trays (TR21, TR22) on the pallet 84, and performs a mounting operation to mount the picked components on the positioned first board K1. Naturally, the component transfer device 4 does not pick up components from a component container on a carrier member 7 that has not been set up.

[0086] In the second operation mode, the carrier member 7 is set up and stored in the tray stocker 82 as illustrated in FIG. 4 . The board transport device 2 transports the first board K1 and positions it at the operation position. The component transfer device 4 performs a mounting operation of picking up components from a component container on the carrier member 7 pulled out to the component supply position and mounting the picked components on the first board K1. Note that the component transfer device 4 may also perform a mounting operation of picking up components from at least one of the tape feeder 32 and the second tray (TR21, TR22) and mounting them on the first board K1. In the second operation mode, as in the first embodiment, the control device 5 acquires the exact position of the component container on the carrier member 7 using the mark camera 46.

[0087] This type of first board product and second board product have different types of components mounted at specific component mounting positions on the first board K1. For example, the first board product is formed by mounting a first chip component with a resistance of 1 kΩ at a specific component mounting position on the first board K1, and the second board product is formed by mounting a second chip component with the same shape as the first chip component but a resistance of 2 kΩ at a specific component mounting position on the first board K1. The first board product and the second board product are different products because they have different electrical circuit configurations.

[0088] There are no particular restrictions on when production of the second board product can begin. That is, production of the second board product may be scheduled in the production plan 62, or may be started in response to an interrupt request during production of the first board product. Furthermore, there are no restrictions on the production quantities of the first board product and the second board product. In either case, the mode switching unit 55 switches from the first work mode to the second work mode when the production target is changed from the first board product to the second board product.

[0089] In the modified embodiment, by using the carrier member 7, when switching the production target between the first substrate product and the second substrate product, it is not necessary to change the setup of the tape feeder 32 of the component supply device 3, and the change of the setup of the pallet 84 can be minimized. In other words, the setup work related to the component supply device 3 can be reduced, and the setup can be performed more efficiently accordingly.

[0090] 8. Component Mounting Machine 1A of Second Embodiment Next, a component mounting machine 1A of a second embodiment will be described with reference to Figures 9 to 11, focusing on differences from the first embodiment. The overall configuration of the component mounting machine 1A of the second embodiment shown in Figure 9 differs from the first embodiment in that a bonding material applicator 9 is added. Also, in the second embodiment, as in the first embodiment, a carrier member 7 is used to supply components to be mounted on the second board K2. However, as illustrated in Figure 10, a tool station 77 and a positioning jig 79 are used on the carrier member 7, which differs from the first embodiment.

[0091] 10 , four carrier tapes (CT14, CT15, CT16, CT17), two trays (TR12, TR13), and a tool station 77 are placed on the carrier member 7. The tool station 77 is formed, for example, in the shape of an elongated rectangular parallelepiped, and has a plurality of holding holes 78 on its upper surface. The tool station 77 holds a suction nozzle 45B in each of the plurality of holding holes 78 in an automatically replaceable manner.

[0092] The suction nozzle 45B is a type of second component mounting fixture that is different from the first component mounting fixture and picks up components from the carrier member 7. The suction nozzle 45B picks up components that are difficult to pick up with the suction nozzle 45 (first component mounting fixture) and places them on the second board K2. For example, the suction nozzle 45 is prone to suction errors when picking up relatively large components housed on the carrier tape CT17 or trays (TR12, TR13), making it virtually unusable. In contrast, the suction nozzle 45B has a larger tip opening than the suction nozzle 45, allowing it to stably pick up relatively large components.

[0093] In the second embodiment, the operation flow of FIG. 7 and the sub-operation flow of FIG. 8 are partially modified. That is, step S23 after switching to the second operation mode is omitted, and the operator is not required to replace the suction nozzle 45. Instead, an "automatic nozzle replacement" step is added before step S27 or after step S28. In the "automatic nozzle replacement" step, the component transfer device 4 moves the mounting head 43 above the tool station 77 and automatically replaces the suction nozzle 45 with the suction nozzle 45B. Furthermore, when switching to the first operation mode in step S11, instead of the operator having to replace the suction nozzle 45 again, the component transfer device 4 automatically replaces the suction nozzle 45B with the suction nozzle 45. This reduces the number of steps required for the setup changeover work for the component transfer device 4 compared to the first embodiment.

[0094] The number of holding holes 78 in the tool station 77 is preferably greater than the maximum number of suction nozzles (45, 45B) that the nozzle tool 44 can hold. For example, in a configuration in which the nozzle tool 44 holds a maximum of eight suction nozzles (45, 45B), it is preferable to have nine or more holding holes 78. This allows the maximum number of suction nozzles 45 held by the nozzle tool 44 to be replaced with suction nozzles 45B. The number of suction nozzles (45, 45B) that are actually replaced can be changed within a range from one to the maximum number. Note that the tool station 77 may automatically replace a second component placement tool other than the suction nozzles 45B, such as a clamping chuck, and provide it to the placement head 43.

[0095] The positioning jig 79 is a jig that positions the component containers (carrier tapes (CT14, CT15, CT16, CT17), trays (TR12, TR13)) and the tool station 77. In FIG. 10, one positioning jig 79 is used for each component container. Also, one positioning jig 79 is used for the tool station 77. Note that the positioning jig 79 may be used for only some of the component containers.

[0096] The positioning jig 79 is formed in an L-shape with a long arm and a short arm intersecting at right angles. The positioning jig 79 is formed using a magnet. On the other hand, the carrier member 7 is formed of a ferromagnetic material such as iron or an alloy containing iron. Therefore, the positioning jig 79 is attracted to the carrier member 7 by the action of magnetic force, and the position is fixed so that it does not easily move.

[0097] Jig position marks M3 are marked at two spaced locations on the positioning jig 79. The first jig position mark M3 is located at the intersection of the long arm and short arm. The second jig position mark M3 is located at the tip of the long arm. The positioning jig 79 positions the rectangular component container and tool station 77 by contacting two adjacent sides of the rectangular component container and tool station 77 in a plan view.

[0098] 11 , the upper surface of the carrier member 7 is divided into a total of 380 elements 73, with 19 elements arranged horizontally and 20 elements arranged vertically in the figure. The approximate position of the positioning jig 79 is indicated by intra-carrier position information represented by the element 73 where the jig position mark M3 is located. In the example shown in FIG. 11 , the approximate position of the positioning jig 79 that has positioned the tray TR12 is indicated by intra-carrier position information representing element 732, which is in the sixth row from the top and the second column from the left and represents the position of the jig position mark M3, and element 733, which is in the sixth row from the top and the sixth column from the left.

[0099] The worker places the positioning jig 79 so that it contacts two sides of one corner of the placed component container and tool station 77. Alternatively, the worker places the component container and tool station 77 so that two sides contact the placed positioning jig 79. At this time, the positioning jig 79 is attracted to the carrier member 7 by the action of magnetic force, facilitating the positioning work by the worker. After the positioning work, the worker uses the input device 52 to input information on elements (73, 732, 733) corresponding to the intra-carrier position information of each of the multiple jig position marks M3.

[0100] In the second embodiment, steps S27 and S28 in FIG. 8 are modified as follows. That is, the mark camera 46 performs a two-stage detection operation when detecting the position of a component on the carrier member 7 pulled out to the component supply position. In the first detection operation, the mark camera 46 captures an image of the jig position mark M3 based on the intra-carrier position information commanded by the camera position command unit 56. Next, the image processing unit of the mark camera 46 processes the acquired image data to detect the exact position and rotation angle of the positioning jig 79 in the horizontal plane. Furthermore, the mark camera 46 can perform an estimation process to estimate the position and rotation angle of the component container in the horizontal plane based on the known size and shape of the positioning jig 79.

[0101] In the second detection operation, the mark camera 46 captures an image of a specific position or a specific component in the component container by referring to the results of the estimation process and the shape information of the component container. Next, the image processing unit of the mark camera 46 processes the acquired image data to detect the exact position of the specific component. Furthermore, the mark camera 46 determines the exact positions of all components in the component container by referring to the shape information of the component container. This two-stage detection operation allows for even more reliable detection of the positions of the components contained in the component container compared to the first embodiment. Even if the operator's positioning work is inaccurate and a gap exists between the component container and the positioning jig 79, the second detection operation ensures highly accurate position detection.

[0102] The first and second detection operations are performed on the tool station 77, and the accurate positions of the multiple suction nozzles 45B are determined and reflected in the automatic exchange. A simplified method may be adopted in which the first detection operation and estimation process are performed and the second detection operation is omitted. Furthermore, the positioning jigs 79 may be positioned in pairs at two diagonally opposite corners of the component container and the tool station 77. This configuration doubles the number of positioning jigs 79 used, but enables more accurate detection of the position and rotation angle. Furthermore, the pair of positioning jigs 79 eliminates the risk of sideways sliding during transport for the trays (TR12, TR13) and the tool station 77, making it possible to omit the use of double-sided tape.

[0103] As shown by the dashed lines in FIG. 9 , the bonding material applicator 9 is provided at one or more locations on the mounting head 43, the X-axis movable body 42, and the base 10. The bonding material applicator 9 applies bonding material for electrical connection to a predetermined component mounting position on the positioned board. Alternatively, the bonding material applicator 9 applies bonding material to the electrodes of the components to be mounted on the board. The bonding material is not limited to cream solder, and may be conductive ink that dries to become conductive. Note that the bonding material applicator 9 may be an existing one.

[0104] An example of the bonding material applicator 9 is, but is not limited to, an inkjet nozzle device. The inkjet nozzle device includes a nozzle disposed on the mounting head 43 or the X-axis movable body 42, and a maintenance unit disposed on the base 10. The nozzle has an ejection or dripping port facing downward, and is driven by the component transfer device 4 to move horizontally. The nozzle ejects or drips conductive ink toward the component mounting position on the board. The maintenance unit cleans the nozzle when it reaches above, replenishes conductive ink, and so on.

[0105] The bonding material applicator 9 can operate based on the work program 54 or in accordance with instructions from the operator. The bonding material applicator 9 can operate at any desired time on a board positioned at the work position or on components picked up from the component supply position. This eliminates the need to print or apply cream solder to the board in advance using a solder printer or other device, eliminating the risk of the cream solder deteriorating or hardening. In addition, even if the second board K2 is a repair board and a solder printer cannot be used due to the presence of mounted components, the bonding material can be applied by the bonding material applicator 9.

[0106] As described above, in the second embodiment, the use of the tool station 77 reduces the man-hours required for the setup work of the component transfer device 4. Furthermore, the use of the positioning jig 79 with two jig position marks M3 allows for even more reliable detection of the exact position of the component on the carrier member 7 compared to the first embodiment. Furthermore, the use of the bonding material applicator 9 eliminates the risk of the solder paste deteriorating and hardening, which is particularly effective for time-consuming manual placement work and enables repair of PCBs. Furthermore, while the prior art required the setup of four tape feeders 32 and at least one pallet 84 corresponding to the six types of components supplied by the carrier member 7, the second embodiment requires only the setup of one carrier member 7. Therefore, according to the second embodiment, setup can be efficiently performed when switching the production target between the first board K1 and the second board K2, as in the first embodiment.

[0107] 9. Applications and Modifications of the Embodiments In the first and second embodiments, it is possible to store a plurality of carrier members 7 in the tray stocker 82 of the tray feeder 8, or to store a plurality of carrier members 7 in the tray stocker 82 in rotation, thereby increasing the number and types of components supplied from the carrier members 7. It is also possible to use carrier members 7 by means other than the tray feeders 8 that constitute the component supply device 3.

[0108] For example, the tray feeder 8 may be omitted, and the worker may open the protective cover 11 and carry the carrier member 7 into the machine. In this embodiment, the worker places the carrier member 7 at a position within the movement range of the mounting head 43 on the upper surface of the mounting table 31 or the base 10. In the first operation mode, the component transfer device 4 picks up components from the tape feeder 32 and performs the mounting operation on the first board K1 (or the mounting operation of the first board product) without picking up components from the carrier member 7. In the second operation mode, the component transfer device 4 picks up components from the carrier member 7 and, if necessary, also picks up components from the tape feeder 32 and performs the mounting operation on the second board K2 (or the mounting operation of the second board product).

[0109] Also, the tape feeder 32 of the component supply device 3 may be omitted. In this embodiment, in the first operation mode, the component transfer device 4 picks up components from the pallet 84 and performs the mounting work on the first board K1 (or the mounting work on the first board product) without picking up components from the carrier member 7. Furthermore, in the second operation mode, the component transfer device 4 picks up components from the carrier member 7 and, if necessary, also picks up components from the pallet 84 and performs the mounting work on the second board K2 (or the mounting work on the second board product).

[0110] Furthermore, in the first and second embodiments, components that can be supplied from the tape feeder 32 and the pallet 84 can also be placed on the carrier member 7 and supplied. For example, components of the same type as components supplied from the tape feeder 32 and the pallet 84 but with different supplementary information such as lot or supplier can be placed on the carrier member 7 and supplied. The component transfer device 4 mounts components picked up from the tape feeder 32 or the pallet 84 onto the first board K1 to produce a first board product, and mounts components picked up from the carrier member 7 onto the first board K1 to produce a second board product. In this way, the first board product and the second board product are of the same type in terms of design, and it is possible to verify the impact of differences in the supplementary information of the components by conducting a comparative test.

[0111] Furthermore, the tool station 77 and positioning jig 79 described in the second embodiment can also be used in the first embodiment. Furthermore, a component other than the component container described in the first and second embodiments may be placed on the carrier member 7. For example, a component to be fixed to a component mounting position on a circuit board using an adhesive may be placed on the carrier member 7, and the bonding material applicator 9 described in the second embodiment may apply the adhesive. Furthermore, the first and second embodiments can be applied and modified in various ways.

[0112] DESCRIPTION OF SYMBOLS 1, 1A: Component placement machine 2: Board transport device 3: Component supply device 32: Tape feeder 4: Component transfer device 43: Placement head 45, 45B: Suction nozzle 46: Mark camera 5: Control device 53: Display device 54: Work program 55: Mode switching unit 56: Camera position command unit 57: Display control unit 6: Production management device 62: Production plan 7: Carrier member 73, 731, 732, 733: Element 77: Tool station 79: Positioning jig 7A: Overall image 8: Tray feeder 84: Pallet 9: Bonding material application unit K1: First board K2: Second board M1: Board position mark M3: Jig position mark CT11 to CT17: Carrier tape TR11 to TR13: Tray TR21, TR22: Second tray DSP: Screen AR: Imaging range FD: Image data

Claims

1. A component mounting machine comprising: a carrier member that is placed inside the machine and that has a rectangular carrier tape with components to be mounted on a board, each of which is accommodated in a number of cavities arranged in a row, and a tray that has the components accommodated in a number of storage sections arranged in a grid pattern, and a component transfer device that can pick up the components from the carrier member and mount the picked up components on the board positioned at a work position.

2. A component mounting machine as described in claim 1, further comprising a tray feeder that selectively and automatically replaceably positions the carrier member and a pallet carrying a second tray that stores a different type of component from the components stored in the tray placed on the carrier member within the machine.

3. A component mounting machine as described in claim 2, comprising: a board transporting device which transports the board and positions it at a predetermined work position; and a mode switching unit which switches between a first work mode in which the component transfer device mounts the components contained in the second tray without using the carrier member to a first board positioned at the work position by the board transporting device, and a second work mode in which the component transfer device mounts at least the components contained in the carrier member to a second board which is a different type from the first board and which is positioned at the work position by the board transporting device.

4. A component mounting machine as described in claim 2, comprising: a board transporting device which transports the board and positions it at a predetermined work position; and a mode switching unit which switches between a first work mode in which the component transfer device mounts the components contained in the second tray without using the carrier member, and a second work mode in which the component transfer device mounts at least the components contained in the carrier member, on the board positioned at the work position by the board transporting device.

5. The component mounting machine according to claim 1, further comprising a tape feeder that supplies the components using a second carrier tape that contains components of a different type than the components contained in the strip-shaped carrier tape placed on the carrier member.

6. A component mounting machine as described in claim 5, comprising: a board transporting device which transports the board and positions it at a predetermined work position; and a mode switching unit which switches between a first work mode in which the component transfer device mounts the components contained in the tape feeder without using the carrier member to a first board positioned at the work position by the board transporting device, and a second work mode in which the component transfer device mounts at least the components contained in the carrier member to a second board positioned at the work position by the board transporting device, the second board being a different type from the first board.

7. A component mounting machine as described in claim 5, comprising: a board transporting device which transports the board and positions it at a predetermined work position; and a mode switching unit which switches between a first work mode in which the component transfer device mounts the components contained in the tape feeder without using the carrier member, and a second work mode in which the component transfer device mounts at least the components contained in the carrier member, on the board positioned at the work position by the board transporting device.

8. A component mounting machine as described in claim 3 or 6, wherein the first board is a planned production board produced based on a production plan, the second board is an interrupt production board produced by interrupting the production plan, and the mode switching unit sets the first work mode during normal times when no interrupt request has occurred to produce the interrupt production board, switches to the second work mode when the interrupt request has occurred, and switches to the first work mode after production of the interrupt production board has been completed.

9. A component mounting machine as described in claim 4 or 7, wherein the board becomes a first board product when the components housed in the carrier member are not mounted in the first work mode, and becomes a second board product of a different type from the first board product when at least the components housed in the carrier member are mounted in the second work mode.

10. A component mounting machine as claimed in any one of claims 3, 4, 6 and 7, wherein the component transfer device has a movable mark camera which, in the second work mode, captures an image of a predetermined component mounting position or a mounted component on the board positioned at the work position, and either the carrier tape or the tray placed on the carrier member, to obtain image data, and the component mounting machine is provided with a display device which displays image-capturing position information indicating the position or imaging range of the mark camera at the time of imaging, and the image data on a single screen.

11. The component mounting machine according to claim 10, wherein the display device displays an overall image of either the carrier member, the carrier tape, or the tray, the overall image being acquired from outside the machine, and the position information at the time of imaging is illustrated and superimposed on the overall image.

12. A component mounting machine as described in claim 10, wherein the second work mode includes: a setup mode in which an operator refers to the display on the display device and sets up a work program for the component transfer device to automatically perform the mounting work; and an automatic mounting mode in which the component transfer device automatically performs the mounting work based on the work program.

13. The component mounting machine according to claim 10, wherein the second operation mode includes a manual mounting mode in which an operator manually performs mounting work while referring to the display on the display device.

14. The component transfer device has a movable mark camera which images the carrier tape or the tray placed on the carrier member and detects the position of the carrier tape or the tray, and the component mounting machine according to claim 1, further comprising a camera position command unit which divides at least one of the upper surface of the board positioned at the work position and the upper surface of the carrier member placed inside the machine into a plurality of elements arranged in a grid pattern, and commands the position of the mark camera when imaging at least one of the board position mark, the component mounting position, the carrier tape, and the tray, using intra-carrier position information which represents the approximate position of at least one of the board position mark affixed to the board, the component mounting position determined on the board, the carrier tape, and the tray by any of the elements.

15. A component mounting machine as described in claim 1, wherein the carrier member has a positioning jig that positions the carrier tape or the tray and has a jig position mark attached thereto, and the component transfer device has a movable mark camera that images the jig position mark attached to the positioning jig of the positioned carrier member, detects the position of the positioning jig, and enables the position of the carrier tape or the tray to be estimated.

16. A component mounting machine as described in claim 15, wherein the positioning jig is formed in an L-shape that contacts two sides of the carrier tape or tray which is rectangular in a plan view and is provided with a plurality of jig position marks, and the mark camera images the plurality of jig position marks to detect the position of the positioning jig and its rotation angle in a horizontal plane, and is capable of estimating the position of the carrier tape or tray and its rotation angle in a horizontal plane.

17. A component mounting machine as described in claim 15, further comprising a camera position command unit which divides the upper surface of the carrier member into a plurality of elements arranged in a grid pattern, and which uses intra-carrier position information which represents the approximate position of the jig position mark by any one of the elements to command the position of the mark camera when capturing an image of the jig position mark.

18. A component mounting machine as claimed in claim 14 or 17, wherein each of the plurality of elements is the same in shape and size as the imaging range of the mark camera, or is smaller than the imaging range.

19. A component mounting machine as described in claim 14 or 17, wherein each of the multiple elements is larger than the imaging range of the mark camera, and the camera position command unit commands the mark camera to capture images at multiple positions within the element.

20. The component mounting machine according to claim 15, wherein the carrier member has ferromagnetic properties, and the positioning jig is formed so as to be attracted to the carrier member by using a magnet.

21. A component mounting machine as described in claim 3 or 4, wherein the component transfer device has a first component mounting tool that picks up the components from the second tray, and a mounting head that is movable and can replaceably hold the first component mounting tool, the carrier member carries a second component mounting tool that is a different type from the first component mounting tool and picks the components from the carrier member, and the component transfer device replaces the first component mounting tool held by the mounting head with the second component mounting tool placed on the carrier member in the second work mode.

22. A component mounting machine as described in claim 6 or 7, wherein the component transfer device has a first component mounting tool that picks up the components from the tape feeder, and a moving mounting head that replaceably holds the first component mounting tool, the carrier member carries a second component mounting tool that is of a different type from the first component mounting tool and picks up the components from the carrier member, and the component transfer device replaces the first component mounting tool held by the mounting head with the second component mounting tool placed on the carrier member in the second work mode.

23. A component mounting machine as claimed in any one of claims 1 to 7, comprising an adhesive application section which applies adhesive for electrical connection to a predetermined component mounting position on the positioned board, or to the carrier tape placed on the carrier member or to electrodes of the components contained in the tray.

24. A component mounting method using a component mounting machine equipped with a tray feeder, a board transport device, and a component transfer device, comprising: a setup step of arranging in the tray feeder a carrier member on which a rectangular carrier tape having components to be mounted on a board, each of which is accommodated in a plurality of cavities arranged in a row, and a tray having the components accommodated in a plurality of accommodation sections arranged in a grid pattern, respectively; a first work step of the component transfer device mounting, to a first board positioned at a predetermined work position by the board transport device, components accommodated in a second tray, the second tray housing components of a different type from the components accommodated in the tray, without using the carrier member; and a second work step of the component transfer device mounting, to a second board positioned at a predetermined work position by the board transport device, the components accommodated in the carrier member.

25. A component mounting method using a component mounting machine equipped with a tape feeder, a board transport device, and a component transfer device, comprising: a setup step of arranging inside the machine a carrier member on which a rectangular carrier tape having components to be mounted on a board, each of which is accommodated in a plurality of cavities arranged in a row, and a tray having the components accommodated in a plurality of accommodation sections arranged in a grid pattern, is placed; a first work step in which the component transfer device mounts the components accommodated on a second carrier tape attached to the tape feeder, without using the carrier member, onto a first board positioned at a predetermined work position by the board transport device; and a second work step in which the component transfer device mounts the components accommodated on the carrier member onto a second board positioned at a predetermined work position by the board transport device.