Display module and method for producing same

Abstract

The invention relates to a display module comprising a first contact element, which is arranged in a first plane and which has a metal layer and a conductive transparent layer; a plurality of second contact elements which are arranged at a distance from one another and at a distance from the first contact element in the first plane; a plurality of vertical optoelectronic components, in particular µLEDs, which are arranged in such a way that a first contact surface of the vertical optoelectronic components is electrically connected to the first contact element, and a second contact surface, opposite the first contact surface, of the vertical optoelectronic components is electrically connected to one of the plurality of second contact elements; a dielectric first material layer in which the vertical optoelectronic components are embedded and which surrounds the vertical optoelectronic components in a lateral direction, in such a way that at least the first and second contact surfaces are exposed; and an electrically conductive transparent contact layer which is adjacent to the dielectric first material layer and which covers an upper surface of the dielectric first material layer and the first contact surfaces, wherein the contact layer electrically connects the first contact element to the first contact surfaces.

Description

[0001] DISPLAY MODULE AND ITS MANUFACTURE METHOD

[0002] This application claims priority from German patent application No. 10 2023 115 548 . 2 filed on June 14, 2023, the disclosure of which is hereby incorporated by reference into this application.

[0003] The present invention relates to a display module with a plurality of optoelectronic components, in particular pLEDs, and to a method for producing a display module with a plurality of optoelectronic components, in particular pLEDs.

[0004] BACKGROUND

[0005] When manufacturing display arrangements with multiple optoelectronic components such as pLEDs, it is expedient to provide a common conductive plane or a common conductive element that simultaneously contacts the multiple optoelectronic components. Such a common conductive element can be formed, for example, by a conductive transparent contact layer arranged on the optoelectronic components and electrically contacting them.

[0006] To electrically contact the conductive transparent contact layer, a metallic contact is usually applied, extending over the edge of the conductive transparent contact layer and along a side surface of the arrangement to a carrier on which the optoelectronic components are arranged. The metallic contact is accordingly designed as a metallic contact ramp and must bridge a height difference that is essentially of the same order of magnitude as the height of the optoelectronic components.

[0007] For very small optoelectronic components arranged in rows and columns, such a formation of a metallic contact is difficult to realize, since the conductive transparent contact layer as well as the metallic contact tend to crack and form a potential fracture point, leading to higher resistance or even a complete short circuit.

[0008] There is therefore a need to provide a display arrangement with a large number of pLEDs which has a less error-prone structure with higher reproducibility and lower costs.

[0009] SUMMARY OF THE INVENTION

[0010] This need is met by the subject matter of the independent patent claims. Further developments and embodiments of the proposed principle are specified in the subclaims.

[0011] The inventor proposes to provide individual display modules for a display arrangement which can be combined together to form a display arrangement. The display modules are designed such that they have a common conductive element and a contact structure designed such that no metallic contact ramps are required to supply electricity to the optoelectronic components, in particular pLEDs. In contrast, top-side contacting of the optoelectronic components takes place via non-metallic transparent contacts or by means of the common conductive element, and contact ramps to a ground plane of the modules are formed by the material of the non-metallic transparent contacts or by the material of the common conductive element.Such a module can be substantially completely transparent or have reflective layers that favor light guidance in a desired direction. Furthermore, such a module can have contact tabs by means of which several modules can be connected to one another in rows and columns, for example, to enable matrix interconnection of a resulting display arrangement.

[0012] Some aspects relate to a display module having a plurality of optoelectronic components. The display module comprises a first contact element, which is arranged in a first plane and which comprises a metal layer and a conductive transparent layer, as well as a plurality of second contact elements, which are arranged at a distance from one another and at a distance from the first contact element in the first plane. The plurality of second contact elements can each likewise comprise a metal layer and a conductive transparent layer, but can also be formed solely by a conductive transparent layer.

[0013] In particular, both the first contact element and optionally the second contact elements comprise a metal layer arranged directly on the first level and a conductive transparent layer covering the metal layer, which encapsulates the metal layers together with the first level. The conductive transparent layer, which is in particular not a metal layer but, for example, a transparent conductive oxide layer (TCO), "protects" the metal layers on the first level by encapsulating them. The combination of a TCO and a metal layer ensures, on the one hand, good conductivity in order to supply the subsequently arranged pLEDs with current homogeneously, and on the other hand, the metal layers ensure good reflectivity because they act as mirrors beneath the pLEDs.

[0014] A large number of vertical optoelectronic components, in particular pLEDs, are arranged in such a way that a first contact surface of the vertical optoelectronic components is electrically connected to the first contact element, and a second contact surface of the vertical optoelectronic components, opposite the first contact surface, is in each case electrically connected to one of the large number of second contact elements. By means of the first contact element, a common potential can be provided for the vertical optoelectronic components, whereas a different potential can be provided for the vertical optoelectronic components via the second contact elements, so that the vertical optoelectronic components can be controlled individually. In this context, a pLED is an optoelectronic component which is very small, i.e.a diameter or edge length of less than 50 pm and down to 2 pm or even less. Typical diameters or edge lengths include 25 pm, 20 pm, 15 pm, 10 pm, and 5 pm. For the purposes of this application, the terms vertical optoelectronic component and pLED are used synonymously, although vertical optoelectronic components are generally not limited to these small sizes. Thus, the display module can also comprise optoelectronic components with larger dimensions. The term "vertical" refers to an optoelectronic component that has its respective contact pads on two opposite sides.

[0015] The vertical optoelectronic components are embedded in a dielectric first material layer, in particular such that the dielectric first material layer surrounds the vertical optoelectronic components in the lateral direction and the first and second contact surfaces are exposed. Adjacent to the dielectric first material layer is an electrically conductive, transparent contact layer that covers an upper side of the dielectric first material layer and the first contact surfaces. The contact layer electrically connects the first contact element to the first contact surfaces of the vertical optoelectronic components.

[0016] In some aspects, the first contact element is loop-shaped, and the second contact elements cross the loop-shaped first contact element, consisting of the first contact element and spaced apart from one another. In particular, the second contact elements cross the loop-shaped first contact element, electrically insulated from the loop-shaped first contact element. Alternatively, the first contact element is ring-shaped, and the second contact elements are arranged in the center of the ring-shaped first contact element, electrically insulated from the ring-shaped first contact element (2a), spaced apart from one another.

[0017] In some aspects, the first contact element at least partially surrounds the second contact elements in the first plane in a circumferential direction. In some aspects, the first contact element surrounds the second contact elements in the first plane in the circumferential direction with the exception of contact lugs that extend from the second contact elements in the direction of side surfaces of the display module. As a result, a supply current can be fed into the contact layer over a large area in order to supply the optoelectronic components homogeneously with a supply current. In particular, the first contact element can be a loop-shaped or ring-shaped element that is interrupted by the second contact elements in the form of, for example, conductor tracks, wherein, for example, contact lugs of the second contact elements cross the loop-shaped or ring-shaped first contact element at a distance from the first contact element.

[0018] In some aspects, the second contact elements are formed . In particular, the strip-shaped contact elements can be arranged substantially parallel to one another and spaced apart from one another in the first plane. For example, the first contact element can also be formed in a strip shape or in the form of a plurality of strips that are spaced apart from the second contact elements and, in particular, substantially parallel to them in the first plane.

[0019] In some aspects, the second contact elements and optionally the first contact element comprise contact lugs which extend in particular parallel to the first plane and in particular extend from the respective contact element in the direction of a side surface of the display module.

[0020] The term "contact lug" can be understood in particular to mean that the first and / or second common contact element has a section that protrudes laterally from a main body of the first and / or second common contact element, wherein the protruding section is particularly small compared to the main body. By means of the contact lug(s), a supply current can in particular be applied to the respective common contact element.

[0021] In some aspects, the vertical optoelectronic components are each arranged on one of the second contact elements and electrically contact the respective second contact element with their second contact surface. The vertical optoelectronic components are correspondingly arranged between the second contact elements and the transparent contact layer and contact a second contact element and the transparent contact layer with their opposite sides. Accordingly, the dielectric first material layer is also arranged between the second contact elements and the transparent contact layer and embeds the vertical optoelectronic components in this area.

[0022] In some aspects, the dielectric first material layer fills gaps between the first contact element and the second contact elements and is substantially flush with the first plane. The dielectric first material layer can, for example, contribute to mechanical stability of the display module and provide an electrical insulation layer between the first contact element and the second contact elements. Furthermore, the dielectric first material layer can be reflective or can have reflective particles or reflective regions in order to achieve emission of light in the direction of an upper side of the dielectric first material layer.

[0023] In some aspects, the transparent contact layer extends from the top side of the dielectric first material layer along at least one side wall of the dielectric first material layer to the first contact element. In some aspects, the contact layer encapsulates the dielectric first material layer with the exception of contact regions between the dielectric first material layer and the second contact elements on a side facing away from the first plane. As a result, almost the entire dielectric first material layer can be protected from external influences and possible damage or cracks between the dielectric material of the dielectric first material layer and the transparent contact layer can be prevented to the greatest possible extent. In addition, by leaving the contact region orthe contact areas of the second contact elements and the dielectric second material layer of the conductive transparent contact layer, a short circuit between the second contact elements and the conductive transparent contact layer is prevented.

[0024] According to a further aspect, the vertical optoelectronic components are arranged on the contact layer on a side opposite the first contact element. The vertical optoelectronic components are correspondingly arranged on the transparent contact layer on a side opposite the first level. Accordingly, the dielectric first material layer is also arranged on the transparent contact layer on a side opposite the first level and embeds the vertical optoelectronic components in this region.

[0025] In some aspects, the display module further comprises a dielectric second material layer that is formed between the transparent contact layer and the first plane, and fills the spaces between the first contact element and the second contact elements and is substantially flush with the first plane. The dielectric first material layer can, for example, contribute to mechanical stability of the display module and provide an electrical insulation layer between the first contact element and the second contact elements. In addition, the dielectric second material layer electrically insulates the second contact elements from the transparent contact layer. The dielectric second material layer can be reflective or have reflective particles or reflective regions in order to achieve emission of light in the direction of an upper side of the dielectric first material layer.

[0026] In some aspects, the transparent contact layer extends from a top side of the dielectric second material layer along at least one side wall of the dielectric second material layer to the first contact element. In some aspects, the transparent contact layer encapsulates the dielectric second material layer with the exception of contact regions between the dielectric second material layer and the second contact elements on a side facing away from the first plane. As a result, almost the entire dielectric second material layer can be protected from external influences and possible damage or cracks between the dielectric second material layer and the transparent contact layer can be prevented to the greatest possible extent. In addition, by leaving the contact region orthe contact areas of the second contact elements and the dielectric second material layer of the conductive transparent contact layer, a short circuit between the second contact elements and the conductive transparent contact layer is prevented.

[0027] In some aspects, the display module further comprises a plurality of third contact elements, each of which electrically connects one of the second contact elements to a second contact surface of one of the vertical optoelectronic components. The third contact elements are, in particular, transparent and extend, in particular, along a sidewall of the first and second dielectric material layers.

[0028] In some aspects, the display module further comprises a carrier substrate, on the upper side of which the first contact element and the plurality of second contact elements are arranged, wherein the carrier substrate in particular comprises a layer stack of at least one semiconductor layer and a dielectric layer, wherein the dielectric layer forms the upper side of the carrier substrate. In particular, the upper side of the carrier substrate forms the first plane.

[0029] In some aspects, the carrier substrate comprises a supply circuit or an integrated circuit which is in electrical contact with the first and / or the second contact element(s). This makes it possible, for example, to dispense with contact tab(s) or contact pad(s), since the vertical optoelectronic components can be supplied / controlled via the supply circuit(s) which is in electrical contact with the first and / or the second contact element(s). In such a case, the conductive transparent contact layer can, for example, completely enclose the dielectric first or second material layer together with the carrier substrate, and an electrical connection to the first and / or the second contact element(s) results from the supply circuit(s) within the carrier substrate.

[0030] In some aspects, the carrier substrate comprises a reflective region that is arranged adjacent to the first contact element and extends from the top side of the carrier substrate toward a side of the carrier substrate opposite the top side of the carrier substrate. In particular, the reflective region extends below the entire first contact element from the top side of the carrier substrate toward a side of the carrier substrate opposite the top side of the carrier substrate. This makes it possible to create a reflective border within the carrier substrate, by means of which an increase in the efficiency of the display module can be achieved.

[0031] In some aspects, the dielectric first and / or second material layer comprises an inactivated photoactive material or a spin-on-glass material. In particular, various dielectric materials can be used for embedding the vertical optoelectronic components. For example, spin-on-glass material can be used, but also inactivated photoactive material.

[0032] In some cases, the sidewall(s) of the first and / or second dielectric material layer have a contact angle to a plane parallel to the first plane of less than 60°, and in particular between 35° and 55°. The small contact angle prevents cracking or breaking of the conductive transparent contact layer during its deposition process and allows the conductive transparent contact layer to be extended to the first contact element without the need for additional metallic contact.

[0033] In some aspects, a contact pad is arranged on each or at least one of the first and second contact elements and in particular on a contact tab of the respective contact element. By means of the contact pad(s), for example, a plurality of display modules can be electrically connected to one another. In some aspects, the conductive transparent contact layer and / or the third contact elements comprise indium tin oxide (ITO) with an optional thickness that is less than the distance between the first or second contact element(s) and the top side of the optoelectronic components. Therefore, the conductive transparent contact layer is thinner than the distance between the first or second contact element(s) and the top side of the optoelectronic components.

[0034] Some aspects of the proposed principle relate to a method for manufacturing a display module with a plurality of optoelectronic components, particularly pLEDs. This method results in a less error-prone structure with higher reproducibility and reduced costs.

[0035] For this purpose, the method comprises a step of providing a carrier substrate, a first contact element arranged on the carrier, which comprises a metal layer and a conductive transparent layer, and a plurality of second contact elements which are arranged on the carrier substrate at a distance from one another and at a distance from the first contact element. Optionally, the second contact elements can each comprise a metal layer on the carrier substrate and a conductive transparent layer encapsulating the metal layer. In particular, both the first and the second contact elements comprise a metal layer arranged directly on an upper side of the carrier substrate, and a conductive transparent layer covering the metal layer, which encapsulates the metal layers together with the upper side of the carrier substrate.The conductive transparent layer, which is not a metal layer but, for example, a transparent conductive oxide layer (TCO), "protects" the metal layers on the carrier substrate by encapsulating them. The combination of a TCO and a metal layer ensures good conductivity, on the one hand, to supply the pLED(s) later arranged on the carrier substrate with power evenly, and on the other hand, can ensure good reflectivity.In a further step, a plurality of vertical optoelectronic components are provided such that a first contact surface of the vertical optoelectronic components is electrically connected to the first contact element, and a second contact surface of the vertical optoelectronic components opposite the first contact surface is electrically connected to one of the plurality of second contact elements. The vertical optoelectronic components can in particular be arranged in rows and / or columns.

[0036] The vertical optoelectronic components are subsequently embedded in a dielectric first material layer, wherein the dielectric first material layer surrounds the vertical optoelectronic components in the lateral direction such that at least the first and second contact surfaces of the vertical optoelectronic components are exposed. This can in particular also be carried out by an etching-back / cleaning step, by means of which all contact regions on the upper side of the vertical optoelectronic components are exposed, and thus any dielectric material of the dielectric first material layer that is arranged on the corresponding contact regions on the upper side of the vertical optoelectronic components is removed.

[0037] In addition , a conductive , transparent contact layer is also provided such that it adjoins the dielectric first material layer and covers a first upper side of the dielectric first material layer and the first contact surfaces , wherein the contact layer electrically connects the first contact element to the first contact surfaces .

[0038] In some aspects, the step of providing a plurality of vertical optoelectronic components comprises providing one of the plurality of vertical optoelectronic components on one of the plurality of second contact elements. The provision is carried out in such a way that the second contact surface of the vertical optoelectronic components is in electrical contact with one of the plurality of second contact elements. Furthermore, the step of embedding the plurality of vertical optoelectronic components can take place after the step of providing a plurality of vertical optoelectronic components and can in particular comprise filling gaps between the first contact element and the second contact elements.Furthermore, the step of providing a conductive, transparent contact layer can take place after the step of embedding the plurality of vertical optoelectronic components and in particular comprises providing the transparent contact layer such that the contact layer extends from the top side of the dielectric first material layer along at least one side wall of the dielectric first material layer to the first contact element.

[0039] The vertical optoelectronic components can be arranged accordingly between the second contact elements and the transparent contact layer, and their opposite sides can contact a second contact element and the transparent contact layer. Accordingly, the dielectric first material layer is also arranged between the second contact elements and the transparent contact layer and embeds the vertical optoelectronic components in this region. The dielectric first material layer can fill gaps between the first contact element and the second contact elements and be essentially flush with the first plane.

[0040] In some aspects, the method comprises the step of filling gaps between the first contact element and the second contact elements with a dielectric second material layer and / or the step of providing a plurality of third contact elements, each of which electrically connects one of the second contact elements to a second contact surface of one of the vertical optoelectronic components. The third contact elements are in particular transparent and extend in particular along a side wall of the first and in particular second dielectric material layer.The step of providing a conductive, transparent contact layer can take place after the step of filling gaps, and in particular comprises providing the contact layer such that the contact layer extends from a top side of the dielectric second material layer along at least one side wall of the dielectric second material layer to the first contact element. Furthermore, the step of providing a plurality of vertical optoelectronic components can take place after the step of providing a conductive, transparent contact layer and comprises providing the vertical optoelectronic components on the contact layer.In addition, the step of embedding the plurality of vertical optoelectronic components can be carried out after the step of providing a plurality of vertical optoelectronic components and the step of providing a plurality of third contact elements can be carried out after the step of embedding the plurality of vertical optoelectronic components.

[0041] The vertical optoelectronic components can be arranged accordingly on the transparent contact layer on a side opposite the first contact element and can be embedded by the dielectric first material layer on the transparent contact layer on a side opposite the first plane. For this purpose, the display module comprises a dielectric second material layer formed between the transparent contact layer and the carrier substrate, filling the spaces between the first contact element and the second contact elements and essentially flush with the first plane.Electrical contacting of the vertical optoelectronic components with the second contact elements is then effected via third contact elements which are formed on the dielectric first material layer and each electrically connect one of the second contact elements to a second contact surface of one of the vertical optoelectronic components.

[0042] According to some aspects, the method further comprises a step of applying a photomask layer to the dielectric first or second material layer before the conductive transparent contact layer or the third contact elements is / are applied to the corresponding dielectric material layer. Subsequently, the photomask layer is structured such that the part of the dielectric material of the corresponding dielectric material layer that borders on or lies above the first or second contact element(s) is exposed. As a result, the region(s) bordering on or lying above the first or second contact element(s) becomes accessible for a subsequent etching step.

[0043] In some cases, the contact angle between the photomask layer and a portion of the dielectric material is less than 90°, and in particular less than 60°. In some cases, it is between 35° and 55°. In other words, the sidewalls of the photomask layer disposed adjacent to or above the first or second contact element(s) are inclined, but not perpendicular, with respect to a plane parallel to the top surface of the carrier.

[0044] The subsequent etching step transfers the inclination of the sidewall of the photomask layer to the dielectric material next to or above the first or second contact element(s) at least partially to the etched sidewalls of the dielectric material. As a result, the dielectric material is not etched perpendicular to its upper side, but rather at an angle, so that an inclination is created along the edges of the dielectric material adjacent to or lying above the first or second contact element(s). This inclination can be adjusted, for example, but not only, by changing etching parameters, but also by the selectivity of the photomask layer to the etching process, so that the shape of the structured mask layer is transferred to the dielectric material at the edges by the etching process.

[0045] Some aspects relate to the etching step and its results. In some aspects, the etching is performed by a plasma etching process, a chemical etching, or a combination thereof. Due to the inclined sidewalls of the photomask layer, the inclination is converted during the etching process such that a sidewall of the dielectric first or second material layer is created adjacent to or above the first or second contact element(s), which sidewall at least partially has the same angle as the contact angle between the photomask material and the dielectric first or second material layer. Therefore, in some aspects, the etching of the sidewalls of the dielectric first or second material layer may follow the inclination of the sidewalls of the photomask layer during the etching step.

[0046] In addition, the conductive transparent contact layer or the third contact elements are applied after removal of the photomask layer and optionally opening of the contact regions on the top side of the vertical optoelectronic components. This last step is necessary if the dielectric first or second material layer has not been previously processed to open the corresponding contact regions on the top side of the vertical optoelectronic components. When using a photoactive layer as the dielectric material, parts of the photoactive material on the top side of the vertical optoelectronic components can be illuminated and then removed in a simple photoresist removal process.In some aspects, the step of embedding a plurality of vertical optoelectronic components already comprises removing parts of the dielectric material of the dielectric first material layer in order to expose at least the first or second contact regions.

[0047] In some aspects, the step of embedding the vertical optoelectronic components and / or the step of filling gaps between the first and second contact elements comprises spin-coating the dielectric material of the dielectric first and / or second material layer. Alternatively, the dielectric material may be sputtered, dispensed, or sprayed. In some cases, particularly when applying or spraying the dielectric material, the material may contain a solvent during deposition, which is subsequently evaporated to form a planar dielectric material layer.

[0048] Any spin-on glass material may be used for this purpose, but is not limited to it. In some cases, the dielectric material may be a photoactive material, particularly an inactivated photoactive material. This may simplify the subsequent etching process. Some aspects further relate to various possible dielectric materials. In some aspects, the dielectric material may consist of a resin, a siloxane, or a glass material. The latter may be applied using spin-on-glass techniques.

[0049] In some aspects, the step of providing a carrier substrate comprises at least one of the following steps:

[0050] Providing a layer stack comprising at least one semiconductor layer and a dielectric layer or release layer, wherein the dielectric layer or release layer forms the upper side of the carrier substrate;

[0051] Providing a first metal layer on top of the carrier substrate and optionally a plurality of second metal layers on top of the carrier substrate, wherein the first metal layer and the optional plurality of second metal layers are spaced apart from each other;

[0052] Covering the first metal layer and optionally the plurality of second metal layers each with a conductive transparent layer, so that in particular the conductive transparent layer each encloses the first and the optional plurality of second metal layers together with the carrier substrate.

[0053] In some aspects, the method further comprises detaching the carrier substrate, in particular by dissolving, evaporating, or removing the release layer. The resulting display module can accordingly be substrate-free.

[0054] A further aspect relates to a display arrangement comprising a multiplicity of display modules according to at least some of the above-mentioned aspects. The display modules are in particular arranged next to one another in rows and columns and are electrically coupled to one another. In particular, the vertical optoelectronic components of the display modules can be coupled in such a way that they can be controlled or operated according to a matrix circuit. For this purpose, for example, the individual second contact elements can be coupled to one another in series along a column of display modules and the first contact elements can be coupled to one another in series along a row of display modules.

[0055] BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Further aspects and embodiments according to the proposed principle will become apparent with reference to the various embodiments and examples which will be described in detail in conjunction with the accompanying drawings.

[0057] Figure 1 shows a display arrangement with a plurality of optoelectronic components;

[0058] Figures 2A and 2B show a plan view and a perspective view of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle;

[0059] Figures 3A to 3C show a side view and cross sections of the

[0060] Display module from Figure 2;

[0061] Figures 4A and 4B show a top view and a perspective

[0062] View of another embodiment of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle;

[0063] Figure 5 shows a plan view of another embodiment of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle;

[0064] Figures 6A to 6C show a side view and cross sections of the display module of Figure 5;

[0065] Figure 7 shows a plan view of another embodiment of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle;

[0066] Figure 8 shows a display arrangement according to some aspects of the proposed principle;

[0067] Figure 9 shows a plan view of another embodiment of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle;

[0068] Figures 10A and 10B show possible cross sections of the display module of Figure 9; and

[0069] Figures 11A to 11C show further cross sections of a display module.

[0070] DETAILED DESCRIPTION

[0071] The following embodiments and examples show various aspects and their combinations according to the proposed principle. The embodiments and examples are not always true to scale. Likewise, various elements can be shown enlarged or reduced in size to emphasize individual aspects. It goes without saying that the individual aspects and features of the embodiments and examples shown in the figures can be combined with one another without thereby impairing the inventive principle. Some aspects have a regular structure or shape. It should be noted that in practice slight deviations from the ideal shape can occur without, however, contradicting the inventive idea.

[0072] Furthermore, the individual figures, features, and aspects are not necessarily shown in the correct size, and the proportions between the individual elements may not always be correct. Some aspects and features are emphasized by being shown enlarged. However, terms such as "top", "above", "below", "below", "larger", "smaller", and the like are correctly represented with reference to the elements in the figures. This makes it possible to infer such relationships between the elements from the illustrations.

[0073] When processing a display arrangement with several optoelectronic components, it is expedient to provide a common conductive level or a common conductive element that contacts the several optoelectronic components simultaneously.

[0074] Figure 1 shows such a display arrangement in a side view. The display arrangement comprises a carrier structure 10 with a carrier substrate 10a and a dielectric layer 11 arranged on the carrier substrate 10a. A metallic contact layer 13 is arranged on the carrier structure 10. Furthermore, a plurality of optoelectronic components 20 with corresponding contacts are arranged on the metallic contact layer 13.

[0075] The optoelectronic components are designed as vertical optoelectronic components 20 which have a bottom side and a top side opposite the bottom side. Each of these top and bottom sides has a corresponding contact area. In particular, the contact areas of the bottom sides 22 of the plurality of vertical optoelectronic components 20 are connected to the metallic contact layer 13. The top sides 21 of the optoelectronic components also each have a contact area. The optoelectronic components 20 are designed as pLEDs with a diameter or edge length of less than 50 pm up to, for example, approximately 2 pm. Typical dimensions and sizes for pLEDs are between 30 pm and 10 pm, but can also be somewhat smaller, for example, 5 pm.

[0076] The optoelectronic components 20 are arranged above the metallic contact layer 13 and attached thereto. A thin dielectric material layer 14, e.g. SiO2, is deposited on the surface of the carrier structure 10 and on the sidewalls of the plurality of vertical optoelectronic components. The remaining space between the optoelectronic components is filled with another dielectric material 40, thereby completely embedding the optoelectronic components 20. The top surfaces of the optoelectronic components and the dielectric material 40 are now covered with a conductive, transparent upper contact layer 30, e.g. ITO.As shown here, the conductive transparent upper contact layer 30 contacts the respective contact area on the upper sides of the optoelectronic components and extends over the dielectric material 40 and the optoelectronic components to form a structure shown on the right.

[0077] A contact 15 made of gold or a similar metal is applied to the conductive, transparent upper contact layer 30 and establishes electrical contact with a common contact element 12 arranged on the dielectric layer 11 of the carrier structure 10. This element, circled in Figure 1, provides a so-called contact ramp for the common contacting of pLEDs and optoelectronic components, which are used, for example, for display applications. Consequently, the metal structure must be deposited over the edge created by the height difference between the top side of the conductive, transparent upper contact layer 30 and the application of the plurality of optoelectronic components on the carrier structure. As shown in Figure 1, the step is very steep and amounts to approximately 90°.In particular, the metal contact 15 requires a height that is in the same order of magnitude as the height of the respective optoelectronic components.

[0078] For very small optoelectronic components arranged in rows and columns, such a formation of the metal contacts is difficult to achieve because the transparent conductive material 30 as well as the metal contact tend to crack and form a potential fracture point, resulting in higher resistance or even a complete short circuit. Furthermore, a step of etching back the dielectric materials 40 and 14 leads to contamination of the etching chamber due to the presence of exposed metal areas, particularly the metal contact 13, on the carrier.

[0079] Consequently, the inventor proposes an alternative solution for forming a display arrangement. In particular, the inventor proposes providing individual display modules for a display arrangement, which can be combined together to form a display arrangement. The display modules are designed such that they have a common conductive element and a contact structure designed such that no metallic contact ramps are required to supply electrical power to the optoelectronic components, in particular pLEDs.

[0080] Figures 2A, 2B, 3A, 3B, and 3C each show an embodiment of a display module with a plurality of optoelectronic components 20, in particular pLEDs. Figure 2A shows a top view of the display module 1, Figure 2B shows a perspective view of the display module 1, and Figures 3A to 3C show cross-sectional and side views of the display module 1 at a location indicated in Figure 2A by the section lines AA, BB, and CC.

[0081] The display module 1 comprises a first contact element 2a, which is arranged in a first plane 3 and which comprises a metal layer 4a and a conductive transparent layer 5a covering the metal layer 4a. In addition, the display module 1 comprises a plurality of second contact elements 2b, which are arranged at a distance from one another and at a distance from the first contact element 2a in the first plane 3. As shown in the cross-sectional view in Figures 3B and 3C, the plurality of second contact elements 2b also each comprises a metal layer 4b and a conductive transparent layer 5b covering the metal layer, but the second contact elements 2b can also be formed solely by a conductive transparent layer 5b or a metal layer 4b.In the event that the second contact elements 2b are formed only by a conductive transparent layer 5b, for example, light emission in opposite directions of the display module 1 can be ensured or the display module can be designed to be substantially completely transparent, at least in the emission region of the display module.

[0082] In the case shown, the first contact element 2a is loop-shaped and the second contact elements 2b cross the loop-shaped first contact element 2a in the form of elongated conductor tracks, electrically insulated from the loop-shaped first contact element 2a. Accordingly, the loop-shaped first contact element 2a surrounds the second contact elements 2b. However, it is also possible for the first and second contact elements to be designed differently, for example in the form of essentially parallel elongated conductor tracks arranged next to one another. For example, the first contact element can comprise two elongated conductor tracks between which the second contact elements are arranged at a distance from one another, but the first and second contact elements can also be designed by flat contacts and not elongated conductor tracks that are arranged differently from one another.

[0083] The display module 1 additionally comprises a multiplicity of vertical optoelectronic components 20, in particular pLEDs, one of which is arranged on each of the second contact elements 2b and makes electrical contact with the second contact element 2b via a second contact surface 6b of the vertical optoelectronic component 20, said second contact element 2b being opposite a first contact surface 6a. In the case illustrated, the display module 1 comprises three vertical optoelectronic components 20 and correspondingly three second contact elements 2b, on which the optoelectronic components 20 are arranged. However, the number of three optoelectronic components 20 or second contact elements is to be understood as an example, and the display module 1 can also comprise more than three or, for example, only two optoelectronic components 20 or second contact elements.In the case of three optoelectronic components, the display module can, for example, form an RGB module and accordingly comprise an optoelectronic component for emitting red light, an optoelectronic component for emitting green light, and an optoelectronic component for emitting blue light. Furthermore, it is also possible for not only one optoelectronic component but also, for example, several optoelectronic components to be arranged on a second contact element, which are, for example, redundant to one another.

[0084] The vertical optoelectronic components 20 are embedded in a dielectric first material layer 40 such that the first and second contact regions 6a, 6b are exposed and the vertical optoelectronic components 20 are laterally surrounded by the dielectric first material layer 40. Furthermore, the dielectric first material layer 40 extends adjacent to and partially onto the first and second contact elements 2a, 2b, fills spaces between the first and second contact elements 2a, 2b, terminates substantially flush with the first plane 3, and covers the first and second contact elements 2a, 2b adjacent to the vertical optoelectronic components 20.

[0085] A conductive transparent contact layer 30, which electrically contacts the first contact regions 6a, is arranged on the upper side 7 of the dielectric first material layer 40 and on the upper side of the vertical optoelectronic components 20. The transparent contact layer 30 covers the vertical optoelectronic components 20 and the dielectric first material layer and extends along the side walls 16 of the dielectric first material layer 40, thereby contacting the first contact element 2a. By means of the conductive transparent contact layer 30, the first contact element 2a is electrically coupled to the first contact areas 6a, such that a supply current can be applied to the vertical optoelectronic components 20 via the first and second contact elements 2a, 2b.

[0086] The conductive transparent contact layer 30 covers / encapsulates in particular the dielectric first material layer 40 completely except for the contact region of the second contact elements 2b and the dielectric first material layer 40, wherein the conductive transparent contact layer 30 is only arranged on the dielectric first material layer 40, but does not extend as far as the second contact elements 2b. As a result, the dielectric first material layer 40 is almost completely covered by the conductive transparent contact layer 30, so that the dielectric first material layer 40 is protected from external influences by means of the conductive transparent contact layer 30. The dielectric first material layer 40 can, as shown, be a single layer, but can also, as shown in Figure 1, consist of more than one layer in which the optoelectronic components are embedded.The conductive transparent contact layer 30 can in particular consist of a conductive transparent oxide such as ITO, which, together with the conductive transparent layer 5a of the first contact element 2a, has better adhesion strength than a non-metal with a metal, as would be the case if the first contact element 2a were not covered with the conductive transparent layer 5a. This can be advantageous, in particular, in the transition region of the conductive transparent contact layer 30 from the top side of the dielectric first material layer 40 along the side walls 16 to the first contact element 2a, where the greatest stresses and strains prevail.

[0087] The illustrated display module 1 is substrate-free, i.e., it does not comprise a carrier substrate, which may be required in particular for producing the display module 1. Mechanical stability of the display module 1 can be provided by the dielectric first material layer 40 and by the transparent contact layer 30. In the event that the second contact elements 2b are formed merely by a conductive transparent layer, the display module 1 can form a substantially completely transparent module, at least in its central light-emitting region.

[0088] Figures 4A and 4B show a further embodiment of a display module 1 with a plurality of optoelectronic components 20, in particular pLEDs. Figure 4A shows a plan view of the display module 1, while Figure 4B shows a perspective view of the display module 1.

[0089] In the case shown, in contrast to the embodiment described above, the first contact element 2a has contact lugs 17 which extend laterally outwards from the first contact element 2a in the direction of side surfaces of the display module 1. In particular, the first contact element 2a has two contact lugs 17 which extend in opposite directions from the first contact element. By means of these contact lugs, the first contact elements of a series of several display modules arranged in rows and columns can be electrically connected to one another, for example. In addition, it can be seen from the perspective view that the central region inside the loop-shaped first contact element forms a transparent region of the display module 1.

[0090] Figures 5, 6A, 6B, and 6C each show a further embodiment of a display module with a plurality of optoelectronic components 20, in particular pLEDs. Figure 5 shows a plan view of the display module 1, and Figures 6A to 6C show cross-sectional and side views of the display module 1 at a location indicated in Figure 5 by the section lines AA, BB, and CC.

[0091] The display module 1 comprises a first contact element 2a, which is arranged in a first plane 3 and which comprises a metal layer 4a and a conductive transparent layer 5a covering the metal layer 4a. In addition, the display module 1 comprises a plurality of second contact elements 2b, which are arranged at a distance from one another and at a distance from the first contact element 2a in the first plane 3. As shown in the cross-sectional view in Figures 6B and 6C, the plurality of second contact elements 2b also each comprises a metal layer 4b and a conductive transparent layer 5b covering the metal layer, but the second contact elements 2b can also be formed solely by a conductive transparent layer 5b or a metal layer 4b.

[0092] In the case shown, the first contact element 2a is loop-shaped and the second contact elements 2b cross the loop-shaped first contact element 2a in the form of elongated conductor tracks, electrically insulated from the loop-shaped first contact element 2a. Accordingly, the loop-shaped first contact element 2a surrounds the second contact elements 2b. However, it is also possible for the first and the second contact elements to be designed differently, for example in the form of essentially parallel elongated conductor tracks that are arranged next to one another. For example, the first contact element can comprise two elongated conductor tracks between which the second contact elements are arranged at a distance from one another, but the first and the second contact elements can also be designed by flat contacts and not elongated conductor tracks that are arranged differently from one another.In contrast to the embodiments described above, however, the optoelectronic components 20 are not arranged on the second contact elements 2b, but rather a dielectric second material layer 50 is arranged between the transparent contact layer 30 and the first or second contact elements 2a, 2b, which fills spaces between the first and second contact elements 2a, 2b and is substantially flush with the first plane 3.

[0093] This dielectric second material layer 50 is covered with the transparent contact layer 30, on which in turn the optoelectronic components 20 are arranged and encapsulated by means of the dielectric first material layer 40.

[0094] The conductive transparent contact layer 30 is arranged on the top side 7 of the dielectric second material layer 40 and contacts the first contact element 2a as well as the optoelectronic components 20 arranged on the transparent contact layer 30 or their first contact regions 6a. The transparent contact layer 30 covers the dielectric second material layer 50 and extends along the side walls 16 of the dielectric second material layer 40, thereby contacting the first contact element 2a. The first contact element 2a is electrically coupled to the first contact surfaces 6a by means of the conductive transparent contact layer 30.

[0095] The conductive transparent contact layer 30 covers / encapsulates, in particular, the dielectric second material layer 50 completely except for the contact area of ​​the second contact elements 2b and the dielectric second material layer 40, wherein the conductive transparent contact layer 30 is arranged only on the dielectric second material layer 50, but does not extend as far as the second contact elements 2b. As a result, the dielectric second material layer 50 is almost completely covered by the conductive transparent contact layer 30, so that the dielectric second material layer 50 is protected from external influences by means of the conductive transparent contact layer 30.The vertical optoelectronic components 20 are embedded in the dielectric first material layer 40, so that the first and second contact regions 6a, 6b are exposed and the vertical optoelectronic components 20 are laterally surrounded by the dielectric first material layer 40. Furthermore, the dielectric first material layer 40 extends adjacent to the transparent contact layer 30.

[0096] Third contact elements 2c are arranged on the dielectric first material layer or on the second contact regions 6b of the optoelectronic components 20, which third contact elements 2c each electrically connect one of the second contact elements 2b to a second contact surface 6b of one of the vertical optoelectronic components 20. The third contact elements 2c are in particular transparent and extend along a side wall 16 of the first and second dielectric material layers 40, 50. The third contact elements 2c are, as shown, designed as elongated conductor tracks which extend once across the entire display module 1 and extend in particular along two opposite side walls 16 of the first and second dielectric material layers 40, 50.However, it is also possible for the third contact elements to extend only along one of the side walls 16 of the first and second dielectric material layers 40, 50.

[0097] Figure 7 shows a further embodiment of a display module 1 with a plurality of optoelectronic components 20, in particular pLEDs, in particular a plan view of the display module 1.

[0098] In the case shown, in contrast to the embodiment described above, the first contact element 2a has contact lugs 17 which extend laterally outwards from the first contact element 2a in the direction of side surfaces of the display module 1. In particular, the first contact element 2a has two contact lugs 17 which extend in opposite directions away from the first contact element. By means of these contact lugs, the first contact elements of a series of several display modules arranged in rows and columns can be electrically connected to one another, for example. Figure 8 shows an embodiment of a display arrangement 100 with a large number of display modules 1. The display modules are arranged next to one another in rows and columns and electrically coupled to one another. In particular, the vertical optoelectronic components of the display modules 1 are coupled in such a way that they can be controlled orcan be operated. For this purpose, the individual second contact elements are coupled together in series along a column of display modules 1 and the first contact elements are coupled together in series along a row of display modules 1.

[0099] Figure 9 shows a further embodiment of a display module with a plurality of optoelectronic components 20, in particular pLEDs. Figure 9 shows a plan view of the display module 1, and Figures 10A and 10B show possible cross-sectional views of the display module 1 at a location indicated in Figure 9 by the section lines AA.

[0100] The display module 1 comprises a first contact element 2a, which is arranged in a first plane 3 and which comprises a metal layer 4a and a conductive transparent layer 5a covering the metal layer 4a. In addition, the display module 1 comprises a plurality of second contact elements 2b, which are arranged at a distance from one another and at a distance from the first contact element 2a in the first plane 3. As shown in the cross-sectional view in Figure 10A, the plurality of second contact elements 2b in one case also each comprises a metal layer 4b and a conductive transparent layer 5b covering the metal layer, however the second contact elements 2b can be formed solely by a conductive transparent or metallic layer, as shown in Figure 10B.

[0101] In the illustrated case, the first contact element 2a is annular, and the second contact elements 2b are arranged in the center of the annular first contact element 2a, electrically insulated from the latter. The second contact elements 2b are designed as flat contact elements. Accordingly, the annular first contact element 2a surrounds the second contact elements 2b.

[0102] The cross-sectional views of Figures 10A and 10B differ in that the display module 1 of Figure 10B has a carrier substrate on which the first and second contact elements 2a, 2b are arranged and whose upper side forms the first plane 3.

[0103] The carrier substrate 10 also has an integrated circuit 8 or supply circuit, which is in electrical contact with the first and second contact elements 2a, 2b and is designed to supply power to the optoelectronic components 20. In the case of Figure 10A, a different type of electrical supply to the optoelectronic components 20 can also be adjacent to the first contact element and in electrical contact with the first and second contact elements 2a, 2b.

[0104] Furthermore, the carrier substrate 10 has a reflective region 9, which is arranged adjacent to the first contact element 2a and extends from the top side of the carrier substrate 10 in the direction of a side of the carrier substrate 10 opposite the top side of the carrier substrate. In particular, the reflective region is also annular and extends below the entire first contact element 2a from the top side of the carrier substrate 10 in the direction of a side of the carrier substrate 10 opposite the top side of the carrier substrate. The efficiency of the display module can be increased even further by this annular reflective region, since light emitted into the carrier substrate is reflected at the reflective region, so that it cannot propagate further in the carrier substrate.

[0105] Figures 11A to 11C show further possible cross-sectional views of a display module 1 and in particular of the display module 1 of Figure 9 at a location indicated in Figure 9 by the section lines AA.

[0106] In contrast to the embodiment described in Figure 10B, the carrier substrate has recesses in which the second contact elements 2b are arranged and on which the optoelectronic components 20 are arranged. The optoelectronic components 20 can be controlled either, as shown in Figure 11A, via an integrated circuit 8 or a supply circuit which is in electrical contact with the first and second contact elements 2a, 2b and which is designed to supply the optoelectronic components 20 with electrical power.

[0107] Alternatively, a contact structure can be provided in the carrier substrate 10 at different levels, which contact structure is in electrical contact with the first and second contact elements 2a, 2b and is designed to supply electrical power to the optoelectronic components 20. This is illustrated by way of example in Figure 11B.

[0108] The illustrated display module can, as shown in Figure 11C, also comprise a further optoelectronic component 20 adjacent to the first and second contact elements 2a, 2b, which is integrated into the carrier substrate 10 or arranged thereon. For example, this can be a sensor component. However, it is also possible (both for the illustrated embodiment and for all further embodiments of the present application) that the optoelectronic components 20 embedded in the dielectric first material layer 40 are formed by light-emitting and / or light-detecting components.

[0109] LIST OF REFERENCE SYMBOLS Display module a , 2b , 2c Contact element Level a , 4b Metal layer a , 5b Conductive transparent layer a , 6b Contact area Top side Integrated circuit Reflective area 0 Carrier structure 0a Carrier substrate 1 Dielectric layer 2 Contact element 3 Contact layer 4 Dielectric material 5 Metal contact 6 Side wall 7 Contact lug 0 Optoelectronic component 1 Top side 2 Bottom side 0 Transparent conductive contact layer 0 Dielectric material layer 0 Dielectric material layer 00 Display arrangement

Claims

PATENT CLAIMS 1. Display module (1) comprising: a first contact element (2a) arranged in a first plane (3) and comprising a metal layer (4a) and a conductive transparent layer (5a); a plurality of second contact elements (2b) arranged at a distance from one another and at a distance from the first contact element (2a) in the first plane (3), wherein the plurality of second contact elements (2b) optionally each comprise a metal layer (4b) and a conductive transparent layer (5b); a plurality of vertical optoelectronic components (20), in particular pLEDs, arranged such that a first contact surface (6a) of the vertical optoelectronic components (20) is electrically connected to the first contact element (2a), and a second contact surface (6b) of the vertical optoelectronic components (20), opposite the first contact surface (6a), is each electrically connected to one of the plurality of second contact elements (2b);a dielectric first material layer (40) in which the vertical optoelectronic components (20) are embedded and which surrounds the vertical optoelectronic components (20) in the lateral direction such that at least the first and second contact surfaces (6a, 6b) are exposed; and an electrically conductive, transparent contact layer (30) which adjoins the dielectric first material layer (40) and covers an upper side (7) of the dielectric first material layer (40) as well as the first contact surfaces (6a), wherein the transparent contact layer (30) electrically connects the first contact element (2a) to the first contact surfaces (6a).

2. Display module according to claim 1, wherein the first contact element (2a) is loop-shaped and wherein the second contact elements (2b) are electrically insulated from the loop-shaped first Contact element (2a) cross this at a distance from one another, or wherein the first contact element (2a) is annular and the second contact elements (2b) are arranged electrically insulated from the annular first contact element (2a) at a distance from one another in the center of the annular first contact element (2a).

3. Display module according to claim 1 or 2, wherein the vertical optoelectronic components (20) are each arranged on one of the second contact elements (2b) and electrically contact the second contact element (2b) with their second contact surface (6b).

4. Display module according to one of claims 1 to 3, wherein the transparent contact layer (30) extends from the top side (7) of the dielectric first material layer (40) along at least one side wall (16) of the dielectric first material layer (40) to the first contact element (2a).

5. Display module according to one of claims 1 to 4, wherein the dielectric first material layer (40) fills spaces between the first contact element (2a) and the second contact elements (2b) and is substantially flush with the first plane (3).

6. Display module according to one of claims 1 to 5, wherein the transparent contact layer (30) encapsulates the dielectric first material layer (40) with the exception of contact regions between the dielectric first material layer (40) and the second contact elements (2b) on a side facing away from the first plane (3).

7. Display module according to claim 1 or 2, wherein the vertical optoelectronic components (20) are arranged on the transparent contact layer (30) on a side opposite the first contact element (2a).

8. Display module according to claim 7, further comprising a dielectric second material layer (50) which is formed between the transparent contact layer (30) and the first plane (3) and fills the spaces between the first contact element (2a) and the second contact elements (2b) and is substantially flush with the first plane (3).

9. Display module according to claim 8, wherein the transparent contact layer (30) encapsulates the dielectric second material layer (50) with the exception of contact regions between the dielectric second material layer (50) and the second contact elements (2b) on a side facing away from the first plane (3).

10. Display module according to one of claims 7 to 9, further comprising a plurality of third contact elements (2c), each of which electrically connects one of the second contact elements (2b) to a second contact surface (6b) of one of the vertical optoelectronic components (20), wherein the third contact elements (2c) are in particular transparent, and wherein the third contact elements (2c) extend in particular along a side wall (16) of the first and / or second dielectric material layer (40, 50).

11. Display module according to one of claims 1 to 10, further comprising a carrier substrate (10), on the upper side of which the first contact element (2a) and the plurality of second contact elements (2b) are arranged, wherein the carrier substrate (10) in particular comprises a layer stack of at least one semiconductor layer and a dielectric layer, wherein the dielectric layer forms the upper side of the carrier substrate (10) and in particular the upper side of the carrier substrate (10) forms the first plane (3).

12. Display module according to claim 11, wherein the carrier substrate (10) comprises at least one integrated circuit (8) which is electrically connected to the first contact element (2a) and / or at least one of the plurality of second contact elements (2b).

13. Display module according to claim 11 or 12, wherein the carrier substrate (10) comprises a reflective region (9) which is arranged adjacent to the first contact element (2a) and extends from the upper side of the carrier substrate (10) in the direction of a side of the carrier substrate (10) opposite the upper side of the carrier substrate, wherein in particular the reflective region (9) extends below the entire first contact element (2a) from the upper side of the carrier substrate (10) in the direction of a side of the carrier substrate (10) opposite the upper side of the carrier substrate.

14. Display module according to one of claims 1 to 13, wherein the second contact elements (2b) and optionally the first contact element (2a) are strip-shaped, and wherein the strip-shaped contact elements are arranged in particular substantially parallel to one another.

15. Display module according to one of claims 1 to 14, wherein the second contact elements (2b) and optionally the first contact element (2a) comprise contact lugs (17) which extend in particular parallel to the first plane (3).

16. Display module according to one of claims 1 to 15, wherein the dielectric first and / or second material layer (40, 50) comprises an inactivated photoactive material or a spin-on-glass material.

17. A method for producing a display module (1) with a plurality of vertical optoelectronic components (20), in particular pLEDs, comprising the steps: Providing a carrier substrate with a first contact element (2a) arranged on the carrier substrate, which comprises a metal layer (4a) and a conductive transparent layer (5a), and with a plurality of second contact elements (2b) which are arranged on the carrier substrate at a distance from one another and at a distance from the first contact element (2a), wherein optionally the plurality of second contact elements (2b) each comprise a metal layer (4b) and a conductive transparent layer (5b); Providing a plurality of vertical optoelectronic components (20) such that a first contact surface (6a) of the vertical optoelectronic components (20) is electrically connected to the first contact element (2a), and a second contact surface (6b) of the vertical optoelectronic components (20) opposite the first contact surface (6a) is electrically connected to one of the plurality of second contact elements (2b); Embedding the plurality of vertical optoelectronic components (20) in a dielectric first material layer (40) such that the vertical optoelectronic components (20) are surrounded in the lateral direction by the dielectric first material layer (40) and at least the first and second contact surfaces (6a, 6b) are exposed; Providing a conductive, transparent contact layer (30) such that it adjoins the dielectric first material layer (40) and covers an upper side (7) of the dielectric first material layer (40) and the first contact surfaces (6a), wherein the transparent contact layer (30) electrically connects the first contact element (2a) to the first contact surfaces (6a).

18. The method according to claim 17, wherein the step of providing a plurality of vertical optoelectronic components (20) comprises providing each one of the plurality of vertical optoelectronic components (20) on one of the plurality of second contact elements (2b), such that the respective second contact surface (6b) of the vertical optoelectronic components (20) is in electrical contact with one of the plurality of second contact elements (2b); and / or wherein the step of embedding the plurality of vertical optoelectronic components (20) takes place after the step of providing a plurality of vertical optoelectronic components (20) and in particular a filling of intermediate spaces between the first contact element (2a) and the second contact elements (2b); and / or wherein the step of providing a conductive, transparent contact layer (30) takes place after the step of embedding the plurality of vertical optoelectronic components (20) and in particular comprises providing the transparent contact layer (30) such that the transparent contact layer (30) extends from the top side (7) of the dielectric first material layer (40) along at least one side wall (16) of the dielectric first material layer (40) to the first contact element (2a).

19. The method according to claim 17, further comprising the step of: filling gaps between the first contact element (2a) and the second contact elements (2b) with a dielectric second material layer (50); and / or providing a plurality of third contact elements (2c), each of which electrically connects one of the second contact elements (2b) to a second contact surface (6b) of one of the vertical optoelectronic components (20), wherein the third contact elements (2c) are in particular transparent, and wherein the third contact elements (2c) extend in particular along a side wall (16) of the first and in particular second dielectric material layer (40, 50);wherein the step of providing a conductive, transparent contact layer (30) takes place after the step of filling gaps, and in particular comprises providing the transparent contact layer (30) such that the transparent contact layer (30) extends from a top side (7) of the dielectric second material layer (50) along at least one side wall (16) of the dielectric second material layer (50) to the first contact element (2a); and / or wherein the step of providing a plurality of vertical optoelectronic components (20) takes place after the step of providing a conductive, transparent contact layer (30) and providing the vertical optoelectronic; three components (20) on the transparent contact layer (30); and / or wherein the step of embedding the plurality of vertical optoelectronic components (20) occurs after the step of providing a plurality of vertical optoelectronic components (20); and / or wherein the step of providing a plurality of third contact elements (2c) occurs after the step of embedding the plurality of vertical optoelectronic components (20).

20. The method according to any one of claims 17 to 19, wherein the step of embedding comprises the step of: Removing parts of the dielectric material of the dielectric first material layer (40) to expose at least the first or second contact regions (6a, 6b).

21. A method according to any one of claims 17 to 20, wherein the embedding step and / or the filling step comprises one of the following steps: Spinning the dielectric material of the dielectric first and / or second material layer (40, 50); Sputtering the dielectric material of the dielectric first and / or second material layer (40, 50; Applying the dielectric material of the dielectric first and / or second material layer (40, 50; Spraying the dielectric material of the dielectric first and / or second material layer (40, 50).

22. The method according to any one of claims 17 to 21, wherein the step of providing a carrier substrate comprises at least one of the following steps: Providing a layer stack comprising at least one semiconductor layer and a dielectric layer or release layer, wherein the dielectric layer or release layer forms the top side of the carrier substrate; Providing a first metal layer (4a) on top of the carrier substrate and optionally a plurality of second metal layers (4b) on the top side of the carrier substrate, wherein the first metal layer (4a) and the optional plurality of second metal layers (4b) are spaced apart from one another; Covering the first metal layer (4a) and optionally the plurality of second metal layers (4b) each with a conductive transparent layer (5a, 5b), so that in particular the conductive transparent layer (5a, 5b) each encloses the first metal layer (4a) and optionally the plurality of second metal layers (4b) together with the carrier substrate.

23. The method of any one of claims 17 to 22, further comprising detaching the carrier substrate.

24. Display arrangement (100) comprising a plurality of display modules (1) according to one of claims 1 to 16, wherein the display modules (1) are arranged next to one another, in particular in rows and columns, and are electrically coupled to one another, in particular such that the vertical optoelectronic components (20) are coupled to one another in a matrix circuit.

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