Mounting device and processing region setting method

Abstract

Provided is a mounting device that uses a suction member to suction a component supplied to a supply position, performs image processing on an image captured after the suctioning to recognize a suction deviation of the component, and mounting the component after correcting the suction deviation. The mounting device comprises: an acquisition unit which, when simultaneous suctioning of a plurality of components is performed by means of a plurality of suction members, acquires, for each suction member, a position deviation of the suction member with respect to each supply position of a target component for simultaneous suction; and a setting unit for setting a processing region of the image processing for each target component by offsetting a predetermined region, which is determined in the image for each of the suction members that have suctioned the target components simultaneously, on the basis of the positional deviation of each suction member acquired by the acquisition unit.

Description

Mounting device and processing area setting method

[0001] The present specification discloses a mounting apparatus and a processing region setting method.

[0002] In a conventional mounting device capable of simultaneously picking up multiple components using multiple pickup members, a system has been proposed in which images of the simultaneously picked up components are image-processed to recognize pickup misalignment of the components, and the components are then mounted by correcting the pickup misalignment. For example, in the mounting device disclosed in Patent Document 1, an area is set for each component by adding a constant to the component size, taking into account the component inclination, pickup misalignment, etc., and image processing is performed on the set area as a processing area to recognize pickup misalignment for each component.

[0003] Japanese Patent Application Laid-Open No. 2004-055702

[0004] In this case, the pickup positions of the pickup members that simultaneously pick up components may be misaligned with the supply positions where the components are supplied. Therefore, it is conceivable to set a processing area larger than that of the above-mentioned Patent Document 1 in consideration of the misalignment of the pickup positions themselves, but this would result in image processing taking longer than necessary.

[0005] A main object of the present disclosure is to prevent the processing area of ​​image processing from becoming larger than necessary when simultaneous adsorption is performed.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The mounting device disclosed herein is a mounting device that uses an adsorption member to adsorb components supplied to a supply position, processes images taken after adsorption to recognize adsorption misalignment of the components, and corrects the adsorption misalignment to mount the components, and is equipped with an acquisition unit that, when multiple components are simultaneously adsorbed by multiple adsorption members, acquires, for each adsorption member, the positional misalignment of each adsorption member with respect to each supply position of the target components that are simultaneously adsorbed, and a setting unit that sets a processing area of ​​the image processing for each target component by offsetting a predetermined area defined in the image for each adsorption member that simultaneously adsorbs the target components based on the positional misalignment for each adsorption member acquired by the acquisition unit.

[0008] The mounting device disclosed herein acquires the positional deviation of each pickup member relative to the respective supply positions of the target components for simultaneous pickup for each pickup member. Furthermore, a processing area is set for each target component by offsetting a predetermined area defined in the image for each pickup member based on the positional deviation of each pickup member. This prevents the processing area for image processing from becoming larger than necessary when performing simultaneous pickup.

[0009] 1 is a schematic diagram of a mounting device 10. A schematic diagram of a head 40. A block diagram showing the electrical connection relationship of the mounting device 10. A flowchart showing an example of a feeder position recognition process. A flowchart showing an example of a simultaneous pickup process. An explanatory diagram showing an example of a center FC between target feeders and a center NC between target nozzles. An explanatory diagram showing an example of a center FC between target feeders and a center NC between target nozzles. An explanatory diagram showing an example of a positional deviation during simultaneous pickup. A flowchart showing an example of a processing area setting process. An explanatory diagram showing an example of a reference processing area A0. An explanatory diagram showing an example of a processing area A1. An explanatory diagram showing an example of a processing area A2 of a comparative example.

[0010] An embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a schematic diagram of a mounting apparatus 10. Fig. 2 is a schematic diagram of a head 40. Fig. 3 is a block diagram showing the electrical connections of the mounting apparatus 10. In this embodiment, the left-right direction (X-axis), front-rear direction (Y-axis), and up-down direction (Z-axis) are as shown in Fig. 1.

[0011] As shown in Fig. 1, the mounting apparatus 10 includes a tape feeder 20, a board transport device 24, a moving device 30, a head 40, a mark camera 25, a parts camera 26, and a control device 90 (see Fig. 3). A plurality of mounting apparatuses 10 are arranged in the board transport direction (X-axis direction) to form a mounting line. The mounting line is managed by a management device 100 (see Fig. 3).

[0012] The tape feeders 20 supply components to the mounting device 10. They are removably set in slots formed in a feeder table at the front of the mounting device 10, with multiple tape feeders 20 aligned in the X-axis direction (left-right direction). Each tape feeder 20 includes a feeder section 21 and a reel 22 around which a tape 23 is wound. A feeding mechanism (not shown) of the feeder section 21 pulls the tape 23 from the reel 22 and feeds it to a component supply position. The tape 23 has cavities 23a (see FIG. 2) formed at predetermined intervals along its length. Components P are accommodated in the cavities 23a. The components P accommodated in the cavities 23a are protected by a film covering the surface of the tape 23. The film is peeled off just before the supply position, exposing the components P at the supply position and enabling them to be picked up by the suction nozzle 44 (suction member) of the head 40. A guide 23b, which guides the tape 23 in the feed direction, has a reference mark M (see FIG. 2) formed at a predetermined position on its top surface.

[0013] The substrate transport device 24 is configured to load, secure, and unload the substrate S in the left-right direction (X-axis direction). The substrate transport device 24 has a pair of conveyor belts that are spaced apart from each other and span the left-right direction in FIG. 1. The substrate S is transported by these conveyor belts.

[0014] The moving device 30 includes an X-axis slider 32 and a Y-axis slider 36 and moves the head 40 on an XY plane along the surface of the substrate S. The moving device 30 also includes an X-axis position sensor (not shown) that detects the position of the X-axis slider 32 in the X-axis direction and a Y-axis position sensor (not shown) that detects the position of the Y-axis slider 36 in the Y-axis direction. The X-axis slider 32 is supported by a pair of upper and lower X-axis guide rails 31 that extend left and right on the front surface of the Y-axis slider 36. The X-axis slider 32 can be moved left and right (in the X-axis direction) by driving an X-axis motor 33 (see FIG. 3). The Y-axis slider 36 is supported by a pair of left and right Y-axis guide rails 35 that extend forward and backward on the upper portion of the housing 12. The Y-axis slider 36 can be moved forward and backward (in the Y-axis direction) by driving a Y-axis motor 37 (see FIG. 3). A head 40 is attached to the X-axis slider 32. Therefore, the head 40 can be moved in the X and Y directions by the moving device 30.

[0015] The head 40 picks up components P supplied from the tape feeder 20 with suction nozzles 44 and mounts them on the board S. As shown in Fig. 2, the head 40 includes a head main body 41, a nozzle holder 42, a suction nozzle 44, an R-axis drive unit 50, a Q-axis drive unit 60, a first Z-axis drive unit 70, and a second Z-axis drive unit 75. The head 40 is configured as a rotary head in which a plurality of (e.g., 8, 20, or 28) suction nozzles 44 are held by the head main body 41.

[0016] The head body 41 is a rotating body that can be rotated by the R-axis drive device 50. The nozzle holders 42 are arranged at predetermined angular intervals in the circumferential direction of the head body 41 and are supported by the head body 41 so as to be freely movable up and down. A suction nozzle 44 is detachably attached to the tip of the nozzle holder 42. The suction nozzle 44 sucks the component P by negative pressure supplied by a pressure supply device (not shown) through an internal flow path of the nozzle holder 42. The suction nozzle 44 also releases the suction of the component P by positive pressure supplied by the pressure supply device through an internal flow path of the nozzle holder 42. Although not shown, the pressure supply device is configured to include a negative pressure source, a positive pressure source, and a switching valve that can switch the pressure supplied to the suction port of each suction nozzle 44 between negative pressure, positive pressure, and atmospheric pressure.

[0017] The R-axis drive device 50 revolves (revolves) the multiple nozzle holders 42 (multiple suction nozzles 44) in the circumferential direction around the central axis of the head main body 41. As shown in FIG. 2 , the R-axis drive device 50 includes an R-axis motor 51, an R-axis 52 extending axially from the central axis of the head main body 41, a transmission gear 53 that transmits the rotation of the R-axis motor 51 to the R-axis 52, and an R-axis position sensor 55 that detects the rotational position of the R-axis motor 51. The R-axis drive device 50 rotates the head main body 41 by driving the R-axis 52 to rotate via the transmission gear 53 using the R-axis motor 51. As the head main body 41 rotates, each nozzle holder 42 revolves (revolves) in the circumferential direction together with the suction nozzles 44.

[0018] The Q-axis drive device 60 rotates (spins) each nozzle holder 42 (each suction nozzle 44) around its central axis. As shown in FIG. 2 , the Q-axis drive device 60 includes a Q-axis motor 61, a cylindrical member 62, a transmission gear 63, a Q-axis gear 64, and a Q-axis position sensor 65 (see FIG. 3 ) that detects the rotational position of the Q-axis motor 61. The cylindrical member 62 is inserted coaxially with and rotatable relative to the R-axis 52, and has a spur gear 62a formed on its outer circumferential surface. The transmission gear 63 transmits the rotation of the Q-axis motor 61 to the cylindrical member 62. The Q-axis gear 64 is provided on the upper portion of each nozzle holder 42 and meshes with the spur gear 62a of the cylindrical member 62 so as to be slidable in the Z-axis direction (up and down direction). The Q-axis drive device 60 rotates the cylindrical member 62 by using a Q-axis motor 61 via a transmission gear 63, thereby collectively rotating each Q-axis gear 64 that meshes with the spur gear 62a of the cylindrical member 62. Due to the rotation of the Q-axis gear 64, each nozzle holder 42 rotates (spins) around its central axis together with the suction nozzle 44.

[0019] The first and second Z-axis drive devices 70, 75 are configured to be able to individually raise and lower the nozzle holder 42 in the Z-axis direction (lifting direction) at two lifting positions (predetermined positions) on the revolving (revolutionary) orbit of the nozzle holder 42. In this embodiment, the first and second Z-axis drive devices 70, 75 are provided along the alignment direction of the tape feeders 20 (the X-axis direction).

[0020] 2, the first and second Z-axis drive units 70 and 75 include Z-axis sliders 72 and 77, Z-axis motors 71 and 76 that raise and lower the Z-axis sliders 72 and 77, and Z-axis position sensors 74 and 79 (see FIG. 3) that detect the raised and lowered positions of the Z-axis sliders 72 and 77. The first and second Z-axis drive units 70 and 75 drive the Z-axis motors 71 and 76, respectively, to raise and lower the Z-axis sliders 72 and 77, thereby contacting the nozzle holder 42 below the Z-axis sliders 72 and 77 and raising and lowering the nozzle holder 42 together with the suction nozzle 44. The first and second Z-axis drive units 70 and 75 may raise and lower the Z-axis sliders 72 and 77 using linear motors as the Z-axis motors 71 and 76, or may raise and lower the Z-axis sliders 72 and 77 using a rotary motor and a ball screw mechanism. In this way, the head 40 is provided with two Z-axis drive devices 70, 75 that can individually raise and lower the nozzle holders 42 (suction nozzles 44), and can individually perform the suction operation of the suction nozzles 44 to pick up components P. Furthermore, the head 40 can also use the two Z-axis drive devices 70, 75 to lower the two suction nozzles 44 approximately simultaneously, thereby picking up two components P approximately simultaneously.

[0021] Mark camera 25 is provided on head 40 or X-axis slider 32, and is configured to be movable in the X and Y directions by moving device 30. Mark camera 25 captures images of reference marks affixed to substrate S, reference marks M affixed to tape feeder 20, components P supplied to the supply position, etc. from above, and outputs the captured images to control device 90.

[0022] The part camera 26 is disposed between the board transport device 24 and the tape feeder 20. When the suction nozzle 44 that has sucked the part P passes above the part camera 26, the part camera 26 captures an image of the part P from below, and outputs the captured image to the control device 90.

[0023] As shown in FIG. 3 , the control device 90 is configured as a microprocessor centered around a CPU 91 and includes a ROM 92 for storing processing programs, an HDD 93 as an external storage device for storing various data, a RAM 94 used as a work area, an input / output interface, etc. Note that the external storage device is not limited to the HDD 93 and may be an SSD or the like. The control device 90 outputs control signals to the tape feeder 20, the substrate transport device 24, the moving device 30 (X-axis motor 33, Y-axis motor 37), the head 40 (R-axis motor 51, Q-axis motor 61, Z-axis motors 71, 76), the mark camera 25, and the parts camera 26. The control device 90 also receives signals from the head 40 (R-axis position sensor 55, Q-axis position sensor 65, Z-axis position sensors 74, 79), the tape feeder 20, the moving device 30, the mark camera 25, and the parts camera 26.

[0024] As shown in FIG. 3 , the management device 100 is configured as a microprocessor centered around a CPU 101, and includes a ROM 102 for storing processing programs, an HDD 103 as an external storage device for storing various data, a RAM 104 used as a work area, an input / output interface, and the like. The external storage device is not limited to the HDD 103 and may be an SSD or the like. The management device 100 is connected to an input device 105, such as a keyboard and mouse, through which an operator inputs various commands, and a display 106 that displays various information. The HDD 103 stores job information, including a production program and other production information. The production program here refers to a program that determines which components P are to be mounted on which boards S in the mounting device 10, in what order, and how many boards S mounted in this manner are to be produced.

[0025] The mounting device 10 configured in this manner executes processing to recognize the installation position of the tape feeder 20. Figure 4 is a flowchart showing an example of the feeder position recognition processing. The CPU 91 determines whether or not a tape feeder 20 is installed in the mounting device 10 (S100), and if it determines that a tape feeder 20 is not installed, ends the feeder position recognition processing. On the other hand, if the CPU 91 determines that a tape feeder 20 is installed, it moves the mark camera 25 above the tape feeder 20 to capture an image of the reference mark M (S110). Next, the CPU 91 processes the captured image to detect the reference mark M, recognizes the installation position of the tape feeder 20 based on the reference mark M, stores the image in the HDD 103 (S120), and ends the feeder position recognition processing.

[0026] Here, the tape feeders 20 are detachably set in each slot formed in the feeder table of the mounting device 10, and the reference position of the tape feeders 20 is determined by the pitch at which the slots are formed. However, due to dimensional errors or wear of the tape feeders 20 or slots, there may be some variation (error) in the actual installation position relative to the reference position. The CPU 91 can recognize the installation position of the tape feeder 20, including such variation, by performing a feeder position recognition process. In this embodiment, the CPU 91 recognizes the installation position of the tape feeder 20 at least in the X-axis direction.

[0027] Next, the simultaneous pickup process for components P will be described. FIG. 5 is a flowchart illustrating an example of the simultaneous pickup process. In the simultaneous pickup process, the CPU 91 detects the center FC between the target feeders 20 (also referred to as target feeders) that supply the target components to be simultaneously picked up based on the installation positions of the tape feeders 20 (also referred to as target feeders) (S200). In this embodiment, two suction nozzles 44 are used for simultaneous pickup, so there are two target feeders. The installation positions of each target feeder are recognized in the feeder position recognition process and stored in the HDD 103. Next, the CPU 91 controls the moving device 30 so that the head 40 moves to a movement position where the center NC of the suction nozzle 44 (also referred to as target nozzle) that picks up the target components to be simultaneously picked up coincides with the center FC between the target feeders (S210).

[0028] 6 and 7 are explanatory diagrams showing an example of the center FC between the target feeders and the center NC between the target nozzles. In FIGS. 6 and 7, the two target feeders aligned in the left-right direction (X-axis direction) are target feeders 20a and 20b, and the two target nozzles are target nozzles 44a and 44b. The center FC between the target feeders is the center position of the feeder pitch FP in the left-right direction based on the mounting position Pa of the target feeder 20a and the mounting position Pb of the target feeder 20b. The center NC between the target nozzles is the center position of the nozzle pitch NP in the left-right direction based on the positions of the target nozzles 44a and 44b on the head 40. When the mounting positions Pa and Pb of the target feeders 20a and 20b are reference positions, the feeder pitch FP and the nozzle pitch NP coincide. The positions of each suction nozzle 44 on the head 40 are known in advance, for example, by calibration of the head 40 performed before production begins.

[0029] FIG. 6 shows a state in which the mounting positions Pa and Pb of the target feeders 20a and 20b are mounted at the reference position without error. Therefore, the center FC between the target feeders and the center NC between the target nozzles are approximately aligned without adjusting the position of the target nozzle (head 40). On the other hand, FIG. 7 shows a state in which the mounting position Pb of the target feeder 20b is shifted to the right in the figure by a deviation amount Δ from the reference position, resulting in a feeder pitch FP1 (>FP in FIG. 6). Therefore, if target components are simultaneously picked up with the target nozzles in the position shown in FIG. 6 (shown by the dotted line in FIG. 7), the deviation amount Δ may affect the target components picked up by the target nozzle 44b, potentially resulting in pickup or mounting failures. Therefore, in this embodiment, the target nozzle (head 40) is moved to a position shifted to the right in FIG. 7 so that the center NC between the target nozzles is aligned with the center FC between the target feeders. As a result, the effect of the misalignment amount Δ is evenly distributed across the left and right target nozzles 44a, 44b by the same amount (Δ / 2), thereby reducing pickup and mounting defects compared to when the effect of the misalignment amount Δ is distributed across only one side. In this way, in S210, the head 40 is moved to a movement position where the positional misalignment of the target nozzles with respect to the mounting position of the target feeder is not biased toward either one of the target nozzles.

[0030] Next, the CPU 91 simultaneously lowers the two target nozzles using the Z-axis drive devices 70 and 75, causing the two target nozzles to simultaneously pick up target components (S220). The CPU 91 also acquires the positional deviation relative to the target feeder for each simultaneously picked-up target nozzle and stores the deviation in the HDD 103 (S230). FIG. 8 is an explanatory diagram showing an example of positional deviation during simultaneous pick-up, and the positional deviation shown in FIG. 7 is stored. Note that for each target nozzle in FIG. 7, the deviation on the right side is positive and the deviation on the left side is negative. Therefore, the positional deviation (-Δ / 2) is stored in association with the target nozzle 44a, and the positional deviation (+Δ / 2) is stored in association with the target nozzle 44b.

[0031] Next, the CPU 91 determines whether pickup of the target component to each target nozzle is complete (S240). If the CPU 91 determines that pickup of the target component is not complete, it rotates the head main body 41 a predetermined amount to move the next target nozzle that has not yet picked up the target component above the supply position (S250), and then executes the processes of S220 to S240. Therefore, each time simultaneous pickup is performed by each target nozzle, a positional deviation associated with the target nozzle is acquired. On the other hand, if the CPU 91 determines that pickup of the target component is complete, it moves the head 40 above the part camera 26 and causes the part camera 26 to capture an image (of the target component) (S260). Next, the CPU 91 executes a processing area setting process to set a processing area for image processing of each target component in the captured image (S270).

[0032] FIG. 9 is a flowchart showing an example of the processing area setting process. In the processing area setting process, the CPU 91 acquires the positional deviation during simultaneous pickup associated with the target nozzle picking up the target component (S300). In S300, the positional deviation acquired in S230 and stored in the HDD 103 (see FIG. 8) is acquired. Next, the CPU 91 sets an offset amount OS based on the positional deviation during simultaneous pickup (S310), and offsets the reference processing area A0 associated with the target nozzle by the offset amount OS to set a processing area A1 for the target component (S320). The CPU 91 then determines whether setting of the processing area A1 for all target components in the image has been completed (S330). If it determines that setting has not been completed, the process returns to S300. If it determines that setting has been completed, the process ends.

[0033] FIG. 10 is an explanatory diagram showing an example of a reference processing area A0. FIG. 11 is an explanatory diagram showing an example of a processing area A1. FIGS. 10 and 11 show a portion of an image G captured by the part camera 26. As shown in FIG. 10 , the reference processing area A0 is centered on the center position NO of the suction nozzle 44 in the image G, and is determined to a size that takes into account the size of the component P and the amount of deviation m associated with positional variation of the component P within the cavity 23a. The center position NO of the suction nozzle 44 in the image G is determined based on the position of each suction nozzle 44 determined by the calibration of the head 40 described above. Note that the size of the reference processing area A0 may be determined based on the size of the cavity 23a, regardless of the size of the component P.

[0034] 11 shows an example of the processing area A1, i.e., the processing area A1 for the target component picked up by the target nozzle 44b in FIG. 7 . As shown in the figure, the processing area A1 (shown by the solid line in FIG. 11 ) is set by offsetting the reference processing area A0 (shown by the dotted line in FIG. 11 ) to the right by an offset amount OS based on the positional misalignment (+Δ / 2) during simultaneous pickup. That is, because the supply position of the target component is shifted to the right relative to the target nozzle 44b (see FIG. 7 ), the processing area A1 for the target component picked up by the target nozzle 44b is set by offsetting the reference processing area A0 to the right. Also, although not shown, because the supply position of the target component is shifted to the left relative to the target nozzle 44a (see FIG. 7 ), the processing area A1 for the target component picked up by the target nozzle 44a is set by offsetting the reference processing area A0 to the left. In this way, the processing area A1 is set by offsetting the reference processing area A0 in accordance with the positional misalignment (amount and direction of misalignment) during simultaneous pickup.

[0035] FIG. 12 is an explanatory diagram showing an example of a processing area A2 in the comparative example. The processing area A2 in the comparative example is set as an area obtained by enlarging the reference processing area A0 by adding the positional deviation (Δ / 2) during simultaneous pickup to the left and right of the reference processing area A0, for example, as a processing area for each target component picked up by the target nozzles 44a and 44b. Therefore, in the comparative example, the processing area for each target component is larger than in the present embodiment, resulting in a longer image processing time. In particular, since the head 40 is a rotary head capable of picking up multiple components, the number of processing areas within the image G is relatively large, which can cause processing time delays. In the present embodiment, the processing area A1 is set by offsetting the reference processing area A0 without enlarging it, so the processing area A1 does not become larger than necessary, preventing the image processing time from becoming longer.

[0036] After executing the processing area setting process of S270 (FIG. 9), the CPU 91 performs image processing on the processing area A1 of each target component to recognize the pickup deviation of each target component (S280). In S280, the CPU 91 performs image processing on the processing area A1 to recognize the target component and detect its center position. Then, the CPU 91 calculates the positional deviation from the center position NO of each suction nozzle 44 in the image G to recognize the pickup deviation of each target component. The CPU 91 then corrects the mounting position of each target component based on the pickup deviation and mounts the target component on the board S (S290), thereby ending the simultaneous pickup process. In S290, the CPU 91 moves the head 40 so that the target component picked up by the suction nozzle 44 is positioned above the corrected mounting position, and then lowers the suction nozzle 44 to mount the target component on the board S. The CPU 91 performs the mounting operation of S290 until all target components picked up by the multiple suction nozzles 44 have been mounted.

[0037] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The control device 90 that executes S230 of the simultaneous pickup process of this embodiment corresponds to the acquisition unit of this disclosure, and the control device 90 that executes S270 of the simultaneous pickup process corresponds to the setting unit. The head 40 corresponds to the head, the moving device 30 corresponds to the moving unit, and the control device 90 that executes S210 of the simultaneous pickup process corresponds to the movement control unit. The tape feeder 20 corresponds to the feeder, and the mark camera 25 corresponds to the imaging unit. In this embodiment, an example of a processing area setting method of the present disclosure is also clarified by explaining the operation of the mounting device 10.

[0038] In the mounting device 10 of the embodiment described above, when simultaneous pickup is performed, the positional deviation of the target nozzle relative to the attachment position of the target feeder (the supply position of the target components to be simultaneously picked up) is acquired for each target nozzle. Furthermore, a reference processing area A0 (predetermined area) defined in the image G for each target nozzle that is simultaneously picked up is offset based on the positional deviation for each target nozzle, thereby setting a processing area A1 for each target component. This prevents the processing area A1 for image processing from becoming unnecessarily large when simultaneous pickup is performed, thereby preventing the image processing time from becoming too long and enabling the pickup deviation of the target components to be properly recognized.

[0039] Furthermore, in the mounting device 10, the head 40 is moved to a movement position where the positional deviation of the target nozzles relative to the attachment position of the target feeder is not biased towards any one of the target nozzles. Then, the positional deviation of the target nozzles is obtained based on the positions of the target nozzles that will perform simultaneous pickup in the head 40 that has moved to the movement position and the attachment position of the target feeder. Therefore, when simultaneous pickup is performed so that the positional deviation of each target nozzle relative to each supply position is not biased towards any one of the target nozzles, it is possible to prevent the processing area A1 from becoming larger than necessary.

[0040] Furthermore, in the mounting device 10, the head 40 is moved to a position where the center FC between the two target feeders and the center NC between the two target nozzles in the X-axis direction (predetermined direction) coincide, which is set as the movement position. This makes it possible to equalize the positional deviation of each target nozzle, stabilize the pickup of target components, and prevent the processing area A1 from becoming larger than necessary.

[0041] Furthermore, the mounting device 10 processes the image captured by the mark camera 25 to recognize the mounting position of the target feeder, and determines the movement position of the head 40 based on the recognized mounting position, and moves the head 40. Therefore, errors or positional deviations in the mounting position of the target feeder can be appropriately reflected in the setting of the processing area A1.

[0042] Furthermore, in the mounting device 10, each time multiple target nozzles are moved sequentially to the elevation position to perform simultaneous pickup, a positional deviation associated with the target nozzle is acquired, and the reference processing area A0 is offset based on the positional deviation acquired associated with the target nozzle to set the processing area A1. Therefore, when simultaneous pickup is performed using the head 40 configured as a rotary head, the processing area A1 for each target component can be appropriately set.

[0043] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0044] For example, in the above-described embodiment, the present disclosure is applied to the setting of a processing area A1 within a single image, but this is not limited thereto. For example, when super-resolution processing is performed to generate an image of higher image quality using multiple images captured by the part camera 26, the present disclosure may be applied to the setting of processing areas within multiple images. Since super-resolution processing requires image processing of the processing areas of multiple images, offsetting and setting the processing area without enlarging it significantly reduces processing time. For this reason, the application of the present disclosure is highly significant.

[0045] In the above-described embodiment, the head 40 is a rotary head, but this is not a limitation and any configuration is possible as long as it is capable of simultaneous suction with multiple suction nozzles 44. For example, a parallel-type head having multiple suction nozzles 44 arranged along the X-axis direction and each of which can be raised and lowered independently is also possible. Furthermore, the head is not limited to one in which two suction nozzles 44 perform simultaneous suction, and three or more suction nozzles 44 may perform simultaneous suction.

[0046] In the above-described embodiment, the CPU 91 recognizes the attachment position of the tape feeder 20 based on an image, but this is not limiting and the attachment position of the tape feeder 20 may be recognized using a position detection sensor or the like. Furthermore, although the CPU 91 recognizes the attachment position of the tape feeder 20 as the supply position of the target component, the supply position of the target component may be directly recognized by recognizing the component P from an image of the component P in the cavity 23a captured by the mark camera 25. Note that if the supply position of the target component is shifted in the Y direction, the processing area A1 may be set by offsetting the positional shift in the Y direction in the same way as in the X direction.

[0047] In the above-described embodiment, the head 40 is moved to a movement position where the center FC between the target feeders and the center NC between the target nozzles are aligned, thereby equalizing the misalignment between the two target nozzles during simultaneous pickup. However, this is not limited to this. That is, as long as the misalignment during simultaneous pickup is not biased toward one of the target nozzles, the misalignment during simultaneous pickup may be different for the two target nozzles. Alternatively, the misalignment during simultaneous pickup may remain biased toward one of the target nozzles, such as when misalignment occurs in only one of the target nozzles. For example, if the misalignment is less than a predetermined amount, simultaneous pickup may be performed without adjusting the movement position of the target nozzle (head 40) while maintaining the bias toward one of the target nozzles. Even in such cases, applying the present disclosure can prevent the processing area A1 from becoming unnecessarily large during simultaneous pickup.

[0048] In the above-described embodiment, the operation of the mounting device 10 has been described, but the present invention may be embodied as a processing area setting method for setting a processing area A1 for image processing, or as an image processing method for setting a processing area A1 and performing image processing. Also, the acquisition unit for acquiring the positional deviation of each suction nozzle 44 and the setting unit for setting the processing area may be provided in separate devices.

[0049] This specification also discloses the technical idea of ​​changing the "mounting device according to claim 1 or 2" in claim 5 of the original application to "mounting device according to any one of claims 1 to 4."

[0050] The present disclosure is applicable to technical fields such as mounting processing and image processing.

[0051] REFERENCE SIGNS LIST 10 Mounting device, 12 Housing, 20 Tape feeder, 21 Feeder section, 22 Reel, 23 Tape, 23a Cavity, 23b Guide, 24 Substrate transport device, 25 Mark camera, 26 Parts camera, 30 Moving device, 31 X-axis guide rail, 32 X-axis slider, 33 X-axis motor, 35 Y-axis guide rail, 36 Y-axis slider, 37 Y-axis motor, 40 Head, 41 Head body, 42 Nozzle holder, 44 Suction nozzle, 50 R-axis driving device, 51 R-axis motor, 52 R-axis, 53 Transmission gear, 55 R-axis position sensor, 60 Q-axis driving device, 61 Q-axis motor, 62 Cylindrical gear, 62a Spur gear, 63 Transmission gear, 64 Q-axis gear, 65 Q-axis position sensor, 70 First Z-axis drive device, 71, 76 Z-axis motor, 72, 77 Z-axis slider, 74, 79 Z-axis position sensor, 75 Second Z-axis drive device, 90 Control device, 91, 101 CPU, 92, 102 ROM, 93, 103 HDD, 94, 104 RAM, 100 Management device, 105 Input device, 106 Display, A0 Reference processing area, A1, A2 Processing area, M Reference mark, P Component, S Board.

Claims

1. A mounting device which uses an adsorption member to adsorb components supplied to a supply position, processes an image taken after adsorption to recognize adsorption misalignment of the components, and corrects the adsorption misalignment to mount the components, comprising: an acquisition unit which, when multiple components are simultaneously adsorbed by multiple adsorption members, acquires, for each adsorption member, the positional misalignment of each adsorption member with respect to each supply position of the target components that are simultaneously adsorbed; and a setting unit which sets a processing area of ​​the image processing for each of the target components by offsetting a specified area defined in the image for each of the adsorption members that simultaneously adsorbed the target components based on the positional misalignment for each of the adsorption members acquired by the acquisition unit.

2. A mounting device as described in claim 1, comprising: a head configured to raise and lower multiple suction members simultaneously; a moving unit which moves the head along a plane perpendicular to the raising and lowering direction of the suction members; and a movement control unit which causes the moving unit to move the head to a movement position where, when the simultaneous suction is performed, the positional misalignment of each suction member relative to each supply position is not biased towards any one of the suction members, wherein the acquisition unit acquires the positional misalignment of the suction members based on the positions of each suction member performing the simultaneous suction in the head moved to the movement position and each supply position of the target component.

3. The mounting device described in claim 2, further comprising a plurality of feeders arranged in a predetermined direction so as to supply components to the supply position, wherein the simultaneous pickup is performed by two of the suction members respectively picking up two of the target components supplied from the two feeders, and the movement control unit moves the head to a position where the center between the two feeders in the predetermined direction coincides with the center between the two suction members, the movement position being the position where the head is moved.

4. A mounting device as described in claim 2, comprising: a plurality of feeders arranged so as to be detachable so as to supply components to the supply position; and an imaging unit which captures images capable of detecting the mounting positions of the plurality of feeders, wherein the movement control unit processes the images captured by the imaging unit to recognize the mounting positions of the plurality of feeders, and determines the movement position based on the recognized mounting positions to move the head.

5. A mounting device as described in claim 1 or 2, comprising a head in which a plurality of the suction members are movable in a circumferential direction and are configured so that the suction members can be raised and lowered simultaneously at two or more predetermined positions, and which moves the plurality of suction members sequentially to the predetermined positions to perform the simultaneous suction, wherein the acquisition unit acquires the positional deviation associated with the suction members each time the plurality of suction members move sequentially to the predetermined positions to perform the simultaneous suction, and the setting unit offsets and sets the processing area for each of the plurality of target components based on the positional deviation acquired associated with the suction member that has picked up the target component.

6. A processing area setting method for detecting misalignment of a part supplied to a supply position by an suction member and processing an image captured after suction to recognize misalignment of the part, the processing area setting method comprising: (a) a step of acquiring, for each suction member, the misalignment of each suction member with respect to each supply position of the target parts that are simultaneously picked up when multiple parts are simultaneously picked up by multiple suction members; and (b) a step of setting a processing area for the image processing for each target part by offsetting a specified area defined in the image for each suction member that simultaneously picked up the target parts based on the misalignment for each suction member acquired in step (a).

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