Layered body for image display device, image display device, and module

Abstract

A layered body (70) for an image display device comprises: a wiring board (10) having a substrate (11), a mesh wiring layer (20), and a power supply unit (40); a power supply line (85) electrically connected to the power supply unit (40); a first adhesive layer (95); and a second adhesive layer (96). The substrate (11) is transparent. The power supply unit (40) and the power supply line (85) are joined to each other via a joining part (88). The joining part (88) is positioned closer to the second adhesive layer (96) side than a first surface (11a) in a region in which the mesh wiring layer (20) is disposed.

Description

Laminate for image display device, image display device and module

[0001] Embodiments of the present disclosure relate to a laminate for an image display device, an image display device, and a module.

[0002] Currently, mobile terminal devices such as smartphones and tablets are becoming more functional, smaller, thinner, and lighter. These mobile terminal devices use multiple communication bands, requiring multiple antennas corresponding to the communication bands. For example, mobile terminal devices are equipped with multiple antennas, such as a telephone antenna, a Wi-Fi (Wireless Fidelity) antenna, a 3G (Generation) antenna, a 4G (Generation) antenna, a 5G (Generation) antenna, an LTE (Long Term Evolution) antenna, a Bluetooth (registered trademark) antenna, and an NFC (Near Field Communication) antenna. However, as mobile terminal devices become smaller, the space available for antenna installation is limited, limiting the freedom of antenna design. Furthermore, because antennas are built into a limited space, radio wave sensitivity is not always satisfactory.

[0003] For this reason, film antennas that can be mounted in the display area of ​​mobile terminal devices have been developed. These film antennas are transparent antennas in which an antenna pattern is formed on a transparent substrate, and the antenna pattern is formed by a mesh-like conductive mesh layer that consists of conductor portions as formed portions of an opaque conductive layer and numerous openings as non-formed portions.

[0004] JP 2011-66610 A Japanese Patent No. 5636735 Japanese Patent No. 5695947

[0005] Meanwhile, there is a demand for thinner mobile terminal devices, and there is also a demand for larger display areas in mobile terminal devices.

[0006] An object of the present embodiment is to provide a laminate for an image display device and an image display device that can be made thinner and have a larger display area.

[0007] In addition, in a film antenna, a power supply line is connected to a power supply section for electrically connecting the conductive mesh layer to an external device, and in this case, it is required to suppress a decrease in electrical connectivity between the power supply section and the power supply line.

[0008] An object of the present embodiment is to provide a module, a laminate for an image display device, and an image display device that can suppress deterioration of electrical connectivity between a power supply line and a power supply portion.

[0009] A first aspect of the present disclosure is a laminate for an image display device, comprising: a substrate including a first surface and a second surface located opposite the first surface; a wiring board having a mesh wiring layer disposed on the first surface of the substrate and a power supply section electrically connected to the mesh wiring layer; a power supply line electrically connected to the power supply section; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the substrate is transparent; the power supply section and the power supply line are joined to each other via a joint; and the joint is located on the second adhesive layer side rather than the first surface in the area where the mesh wiring layer is disposed.

[0010] A second aspect of the present disclosure is a laminate for an image display device, comprising: a substrate including a first surface and a second surface located opposite the first surface; a wiring board having a mesh wiring layer disposed on the second surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; a power supply line electrically connected to the power supply portion; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the substrate is transparent; the power supply portion and the power supply line are joined to each other via a joint; and the joint is located on the second adhesive layer side rather than the second surface in the area where the mesh wiring layer is disposed.

[0011] A third aspect of the present disclosure is a laminate for an image display device according to the first aspect described above, wherein the angle between the first surface in the region where the joint is formed and the first surface in the region where the mesh wiring layer is arranged may be greater than or equal to 30° and less than 150°.

[0012] A fourth aspect of the present disclosure is a laminate for an image display device according to the second aspect described above, wherein the angle between the second surface in the region where the joint is formed and the second surface in the region where the mesh wiring layer is arranged may be greater than or equal to 30° and less than 150°.

[0013] A fifth aspect of the present disclosure is a laminate for an image display device according to each of the first to fourth aspects described above, wherein the power supply line may be electrically connected to the power supply section via an anisotropic conductive film, and the total thickness of the wiring board, the anisotropic conductive film, and the power supply line at the joint may be 300 μm or less.

[0014] A sixth aspect of the present disclosure is a laminate for an image display device according to each of the first to fifth aspects described above, wherein the tensile modulus of elasticity of the substrate may be 0.5 GPa or more and 4.5 GPa or less.

[0015] A seventh aspect of the present disclosure is the laminate for an image display device according to each of the first to sixth aspects described above, wherein the dielectric loss tangent of the substrate may be 0.005 or less.

[0016] An eighth aspect of the present disclosure is a laminate for an image display device according to each of the first to seventh aspects described above, wherein the mesh wiring layer may have a transmission section connected to the power supply section and a transceiver section connected to the transmission section, the transmission section may constitute a coplanar line, and at least a part of the transmission section or at least a part of the power supply section may be bent.

[0017] A ninth aspect of the present disclosure is a laminate for an image display device according to each of the first to eighth aspects described above, wherein the wiring substrate may have a millimeter wave transmitting and receiving function, and the mesh wiring layer may be configured as an array antenna.

[0018] A tenth aspect of the present disclosure is an image display device comprising a laminate for an image display device according to each of the first to ninth aspects described above, and a display device laminated on the laminate for an image display device.

[0019] An eleventh aspect of the present disclosure is an image display device according to the tenth aspect described above, wherein the image display device may further include a housing that houses the laminate for the image display device and the display device therein, and the power supply line may be fixed to the housing or the display device, and / or the wiring board may be fixed to the housing.

[0020] A twelfth aspect of the present disclosure provides a wiring board including a substrate including a first surface and a second surface located on the opposite side of the first surface, a mesh wiring layer disposed on the first surface of the substrate, and a power supply portion electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply portion via a conductive member, wherein the wiring board has an electromagnetic wave transmitting and receiving function, the substrate is transparent, the mesh wiring layer is configured as a transmitting and receiving portion of electromagnetic waves, the mesh wiring layer and the power supply portion are disposed along a first direction, and the power supply line is a module having a substrate including a third surface facing the first surface and a fourth surface located on the opposite side of the third surface, a metal wiring layer disposed on the third surface of the substrate, and a first ground layer disposed on the fourth surface of the substrate, wherein in a plan view, the first ground layer does not overlap the power supply unit, or in a plan view, the first ground layer overlaps the power supply unit, and the length along the first direction of the area where the first ground layer overlaps the power supply unit is 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board.

[0021] A thirteenth aspect of the present disclosure provides a wiring board including a substrate including a first surface and a second surface located on the opposite side of the first surface, a mesh wiring layer disposed on the second surface of the substrate, and a power supply portion electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply portion via a conductive member, wherein the wiring board has an electromagnetic wave transmitting and receiving function, the substrate is transparent, the mesh wiring layer is configured as a transmitting and receiving portion of electromagnetic waves, the mesh wiring layer and the power supply portion are disposed along a first direction, and the power supply line is a module having a substrate including a third surface facing the second surface and a fourth surface located on the opposite side of the third surface, a metal wiring layer disposed on the third surface of the substrate, and a first ground layer disposed on the fourth surface of the substrate, wherein in a plan view, the first ground layer does not overlap the power supply unit, or in a plan view, the first ground layer overlaps the power supply unit, and the length along the first direction of the area where the first ground layer overlaps the power supply unit is 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board.

[0022] A fourteenth aspect of the present disclosure is a module according to the twelfth aspect or the thirteenth aspect described above, wherein, in a planar view, the first ground layer does not have to overlap the power supply portion, and the distance between the first ground layer and the power supply portion in a planar view may be 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board.

[0023] A fifteenth aspect of the present disclosure is a module according to each of the twelfth to fourteenth aspects described above, wherein the distance between the first ground layer and the power supply portion along the thickness direction of the wiring board may be 0.005 to 0.1 times the wavelength of the electromagnetic waves received by the wiring board.

[0024] A sixteenth aspect of the present disclosure is a module according to each of the twelfth to fifteenth aspects described above, wherein the mesh wiring layer may have a transmission section connected to the power supply section and a transceiver section connected to the transmission section, the power supply section, the transmission section, and the transceiver section may be arranged along the first direction, and the wiring substrate may further have ground power supply sections arranged on both sides of the power supply section in a second direction perpendicular to the first direction.

[0025] A seventeenth aspect of the present disclosure is that, in a module according to each of the twelfth to sixteenth aspects described above, at least a portion of the metal wiring layer of the power supply line may form a coplanar line.

[0026] An eighteenth aspect of the present disclosure is a module according to each of the twelfth to seventeenth aspects described above, wherein the thickness of the power supply line may be 15 μm or more and 250 μm or less.

[0027] A 19th aspect of the present disclosure is a module according to each of the 12th aspect to the 18th aspect described above, wherein the conductive member may be an anisotropic conductive film, and the thickness of the anisotropic conductive film may be 3 μm or more and 30 μm or less.

[0028] A twentieth aspect of the present disclosure is a module according to each of the twelfth aspect to the nineteenth aspect described above, wherein the mesh wiring layer may be configured as a millimeter wave antenna, the substrate of the power feed line may include polyimide, fluororesin, or liquid crystal polymer, and the dielectric loss tangent of the substrate may be 0.005 or less.

[0029] A twenty-first aspect of the present disclosure is a module according to each of the twelfth aspect to the nineteenth aspect described above, wherein the mesh wiring layer may be configured as a 5G antenna.

[0030] A 22nd aspect of the present disclosure is a laminate for an image display device, comprising a module according to each of the 12th aspect to the 21st aspect described above, a first adhesive layer located on the first surface side of the substrate, and a second adhesive layer located on the second surface side of the substrate.

[0031] A 23rd aspect of the present disclosure is a laminate for an image display device according to the 22nd aspect described above, wherein the laminate for an image display device may further include a protective cover adhered to the substrate via the first adhesive layer, and a gap may be formed between the power supply line and the protective cover in an area that overlaps the power supply section in a planar view.

[0032] A 24th aspect of the present disclosure is a laminate for an image display device according to the 23rd aspect described above, wherein the laminate for an image display device may further include a decorative layer located between the protective cover and the first adhesive layer, the power supply unit and the power supply line may be joined to each other via a joint, and the joint may overlap the decorative layer in a planar view, and the total thickness of the power supply unit, the thickness of the conductive member at the joint, the thickness of the power supply line, and the thickness of the decorative layer may be less than the thickness of the first adhesive layer.

[0033] A 25th aspect of the present disclosure is a laminate for an image display device according to each of the 22nd to 24th aspects described above, wherein the laminate for an image display device may further include a second ground layer adhered to the substrate via the second adhesive layer, and in a planar view, the second ground layer may overlap the power supply section.

[0034] A twenty-sixth aspect of the present disclosure provides a module including a substrate including a first surface and a second surface located opposite to the first surface, a wiring board having a mesh wiring layer disposed on the first surface of the substrate and a power supply portion electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply portion via a conductive member, a first adhesive layer located on the first surface side of the substrate, a second adhesive layer located on the second surface side of the substrate, and a second ground layer adhered to the substrate via the second adhesive layer, wherein the wiring board is a laminate for an image display device having a receiving function, the substrate having transparency, the mesh wiring layer configured as a transmitting / receiving unit for electromagnetic waves, the mesh wiring layer and the power supply unit arranged along a first direction, the second ground layer not overlapping the power supply unit in a planar view, or the second ground layer overlapping the power supply unit in a planar view, the length along the first direction of the area where the second ground layer overlaps the power supply unit is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring substrate.

[0035] A 27th aspect of the present disclosure is that, in the laminate for an image display device according to the 26th aspect described above, the power supply line may have a substrate including a third surface facing the first surface and a fourth surface located on the opposite side of the third surface, a metal wiring layer arranged on the third surface of the substrate, and a first ground layer arranged on the fourth surface of the substrate, and in a planar view, the first ground layer may overlap the power supply section.

[0036] A 28th aspect of the present disclosure is a laminate for an image display device according to the 26th aspect or the 27th aspect described above, wherein, in a planar view, the second ground layer does not have to overlap the power supply portion, and the distance between the second ground layer and the power supply portion in a planar view may be 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board.

[0037] A 29th aspect of the present disclosure is a laminate for an image display device according to each of the 26th to 28th aspects described above, wherein the distance between the second ground layer and the power supply section along the thickness direction of the wiring board may be 0.005 to 0.1 times the wavelength of the electromagnetic waves received by the wiring board.

[0038] A 30th aspect of the present disclosure provides a module including a substrate including a first surface and a second surface located opposite to the first surface, a wiring board having a mesh wiring layer disposed on the second surface of the substrate and a power supply portion electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply portion via a conductive member, a first adhesive layer located on the first surface side of the substrate, a second adhesive layer located on the second surface side of the substrate, and a second ground layer adhered to the substrate via the second adhesive layer, wherein the wiring board is a laminate for an image display device having a receiving function, the substrate having transparency, the mesh wiring layer configured as a transmitting / receiving unit for electromagnetic waves, the mesh wiring layer and the power supply unit arranged along a first direction, the second ground layer not overlapping the power supply unit in a planar view, or the second ground layer overlapping the power supply unit in a planar view, the length along the first direction of the area where the second ground layer overlaps the power supply unit is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring substrate.

[0039] A thirty-first aspect of the present disclosure is a laminate for an image display device according to the thirty-first aspect described above, wherein the power supply line may have a substrate including a third surface facing the second surface and a fourth surface located opposite the third surface, a metal wiring layer arranged on the third surface of the substrate, and a first ground layer arranged on the fourth surface of the substrate, and the first ground layer may overlap the power supply section in a planar view.

[0040] A thirty-second aspect of the present disclosure is a laminate for an image display device according to either the thirty-first aspect or the thirty-first aspect described above, wherein, in a planar view, the second ground layer does not have to overlap the power supply portion, and the distance between the second ground layer and the power supply portion in a planar view may be 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board.

[0041] A thirty-third aspect of the present disclosure is a laminate for an image display device according to each of the thirty-second to thirty-first aspects described above, wherein the distance between the second ground layer and the power supply portion along the thickness direction of the wiring board may be 0.005 to 0.1 times the wavelength of the electromagnetic waves received by the wiring board.

[0042] A 34th aspect of the present disclosure is a laminate for an image display device according to each of the 22nd aspect to the 33rd aspect described above, wherein the thickness of the second adhesive layer may be 20 μm or more and 200 μm or less.

[0043] A 35th aspect of the present disclosure is a laminate for an image display device according to each of the 22nd aspect to the 34th aspect described above, wherein the conductive member may be an anisotropic conductive film, and the thickness of the anisotropic conductive film may be 3 μm or more and 30 μm or less.

[0044] A 36th aspect of the present disclosure is an image display device comprising a laminate for an image display device according to each of the 22nd aspect to the 35th aspect described above, and a display device laminated on the laminate for an image display device.

[0045] A thirty-seventh aspect of the present disclosure is the image display device according to the thirty-sixth aspect described above, wherein the display device may have a third ground layer.

[0046] A thirty-eighth aspect of the present disclosure includes a laminate for an image display device, and a display device laminated on the laminate for an image display device, wherein the laminate for an image display device includes: a substrate including a first surface and a second surface located on the opposite side of the first surface; a wiring board having a mesh wiring layer disposed on the first surface of the substrate and a power supply unit electrically connected to the mesh wiring layer; a module having a power supply line electrically connected to the power supply unit via a conductive member; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the wiring board has an electromagnetic wave transmitting and receiving function, the substrate is transparent, the mesh wiring layer is configured as a transmitting and receiving unit of electromagnetic waves, and the mesh wiring layer and the power supply unit are aligned along a first direction. the power supply line includes a substrate including a third surface facing the first surface and a fourth surface located on the opposite side of the third surface, a metal wiring layer disposed on the third surface of the substrate, and a first ground layer disposed on the fourth surface of the substrate, the display device having a third ground layer, wherein at least one of the first ground layer and the third ground layer does not overlap the power supply section in a planar view, or at least one of the first ground layer and the third ground layer overlaps the power supply section in a planar view, and a length along the first direction of a region where at least one of the first ground layer and the third ground layer overlaps the power supply section is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring substrate.

[0047] A thirty-ninth aspect of the present disclosure includes a laminate for an image display device, and a display device laminated on the laminate for an image display device, wherein the laminate for an image display device includes: a substrate including a first surface and a second surface located on the opposite side of the first surface; a wiring board having a mesh wiring layer disposed on the second surface of the substrate and a power supply unit electrically connected to the mesh wiring layer; a module having a power supply line electrically connected to the power supply unit via a conductive member; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the wiring board has an electromagnetic wave transmitting and receiving function, the substrate is transparent, the mesh wiring layer is configured as a transmitting and receiving unit of electromagnetic waves, and the mesh wiring layer and the power supply unit are aligned along a first direction. the power supply line includes a substrate including a third surface facing the second surface and a fourth surface located on the opposite side of the third surface, a metal wiring layer disposed on the third surface of the substrate, and a first ground layer disposed on the fourth surface of the substrate, the display device having a third ground layer, wherein at least one of the first ground layer and the third ground layer does not overlap the power supply section in a planar view, or at least one of the first ground layer and the third ground layer overlaps the power supply section in a planar view, and a length along the first direction of a region where at least one of the first ground layer and the third ground layer overlaps the power supply section is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring substrate.

[0048] According to the embodiments of the present disclosure, it is possible to achieve a thinner image display device and increase the display area of ​​the image display device.

[0049] Furthermore, according to the embodiment of the present disclosure, it is possible to suppress a decrease in electrical connectivity between the power feed line and the power feed unit.

[0050] FIG. 1 is a plan view showing an image display device according to a first embodiment. FIG. 2A is a cross-sectional view (cross-sectional view taken along line II-II in FIG. 1) showing the image display device according to the first embodiment. FIG. 2B is a cross-sectional view (cross-sectional view taken along line II-II in FIG. 1) showing another example of the image display device according to the first embodiment. FIG. 3 is a plan view showing a wiring board according to the first embodiment. FIG. 4 is an enlarged plan view showing a mesh wiring layer of the wiring board according to the first embodiment. FIG. 5 is a cross-sectional view (cross-sectional view taken along line V-V in FIG. 4) showing the wiring board according to the first embodiment. FIG. 6 is a cross-sectional view (cross-sectional view taken along line VI-VI in FIG. 4) showing the wiring board according to the first embodiment. FIG. 7 is a cross-sectional view showing a module according to the first embodiment. FIG. 8A is a cross-sectional view showing a method for manufacturing the wiring board according to the first embodiment. FIG. 8B is a cross-sectional view showing a method for manufacturing the wiring board according to the first embodiment. FIG. 8C is a cross-sectional view showing a method for manufacturing the wiring board according to the first embodiment. FIG. 8D is a cross-sectional view showing a method for manufacturing the wiring board according to the first embodiment. FIG. 8E is a cross-sectional view showing a method for manufacturing a wiring board according to the first embodiment. FIG. 8F is a cross-sectional view showing a method for manufacturing a wiring board according to the first embodiment. FIG. 9A is a cross-sectional view showing a method for manufacturing a module according to the first embodiment. FIG. 9B is a cross-sectional view showing a method for manufacturing a module according to the first embodiment. FIG. 9C is a cross-sectional view showing a method for manufacturing a module according to the first embodiment. FIG. 10A is a cross-sectional view showing a method for manufacturing a laminate for an image display device according to the first embodiment. FIG. 10B is a cross-sectional view showing a method for manufacturing a laminate for an image display device according to the first embodiment. FIG. 10C is a cross-sectional view showing a method for manufacturing a laminate for an image display device according to the first embodiment. FIG. 11 is a plan view showing a wiring board of an image display device according to a first modified example of the first embodiment. FIG. 12 is an enlarged plan view showing a wiring board of an image display device according to the first modified example of the first embodiment. FIG. 13 is a cross-sectional view showing an image display device according to a second modified example of the first embodiment. FIG. 14 is a cross-sectional view showing an image display device according to a third modified example of the first embodiment. FIG. 15 is a cross-sectional view showing an image display device according to a fourth modified example of the first embodiment. FIG. 16 is a cross-sectional view showing another example of the image display device according to the fourth modified example of the first embodiment.FIG. 17 is a cross-sectional view showing an image display device according to a fifth modified example of the first embodiment. FIG. 18 is a cross-sectional view showing another example of an image display device according to the fifth modified example of the first embodiment. FIG. 19 is a cross-sectional view showing another example of an image display device according to the fifth modified example of the first embodiment. FIG. 20 is a cross-sectional view showing another example of an image display device according to the fifth modified example of the first embodiment. FIG. 21 is an enlarged plan view showing a mesh wiring layer of a wiring substrate of an image display device according to a sixth modified example of the first embodiment. FIG. 22 is a plan view showing an image display device according to a second embodiment. FIG. 23 is a cross-sectional view (cross-sectional view taken along line XXIII-XXIII in FIG. 22) showing an image display device according to the second embodiment. FIG. 24 is a plan view showing an image display device according to the second embodiment. FIG. 25 is a cross-sectional view showing another example of an image display device according to the second embodiment. FIG. 26 is a plan view showing a module according to the second embodiment. FIG. 27 is a cross-sectional view (cross-sectional view taken along line XXVII-XXVII in FIG. 26) showing a module according to the second embodiment. FIG. 28A is a cross-sectional view showing a method for manufacturing a module according to the second embodiment. FIG. 28B is a cross-sectional view showing a method for manufacturing a module according to the second embodiment. FIG. 28C is a cross-sectional view showing a method for manufacturing a module according to the second embodiment. FIG. 29A is a cross-sectional view showing a method for manufacturing a laminate for an image display device according to the second embodiment. FIG. 29B is a cross-sectional view showing a method for manufacturing a laminate for an image display device according to the second embodiment. FIG. 29C is a cross-sectional view showing a method for manufacturing a laminate for an image display device according to the second embodiment. FIG. 30 is a cross-sectional view showing an image display device according to a first modified example of the second embodiment. FIG. 31 is a cross-sectional view showing another example of an image display device according to the first modified example of the second embodiment. FIG. 32 is a cross-sectional view showing another example of an image display device according to the first modified example of the second embodiment. FIG. 33 is a plan view showing a laminate for an image display device of an image display device according to a second modified example of the second embodiment. FIG. 34 is a cross-sectional view showing an image display device according to a second modified example of the second embodiment. FIG. 35 is a cross-sectional view showing another example of an image display device according to the second modified example of the second embodiment. FIG. 36 is a plan view showing a laminate for an image display device of an image display device according to a third modified example of the second embodiment.FIG. 37 is a cross-sectional view showing an image display device according to a third modified example of the second embodiment. FIG. 38 is a cross-sectional view showing another example of an image display device according to the third modified example of the second embodiment. FIG. 39 is a cross-sectional view showing another example of an image display device according to the third modified example of the second embodiment. FIG. 40 is a cross-sectional view showing another example of an image display device according to the third modified example of the second embodiment. FIG. 41 is a cross-sectional view showing an image display device according to a fourth modified example of the second embodiment. FIG. 42 is a cross-sectional view showing an image display device according to a fifth modified example of the second embodiment. FIG. 43 is a cross-sectional view showing an image display device according to a sixth modified example of the second embodiment. FIG. 44 is a cross-sectional view showing another example of an image display device according to the sixth modified example of the second embodiment. FIG. 45 is a cross-sectional view showing another example of an image display device according to the sixth modified example of the second embodiment. FIG. 46 is a cross-sectional view showing another example of an image display device according to the sixth modified example of the second embodiment. FIG. 47 is a cross-sectional view showing an image display device according to a seventh modified example of the second embodiment. FIG. 48 is a cross-sectional view showing another example of an image display device according to the seventh modified example of the second embodiment. Fig. 49 is a cross-sectional view showing another example of an image display device according to a seventh modified example of the second embodiment. Fig. 50 is a cross-sectional view showing another example of an image display device according to a seventh modified example of the second embodiment. Fig. 51 is a cross-sectional view showing an image display device according to an eighth modified example of the second embodiment. Fig. 52 is a cross-sectional view showing another example of an image display device according to an eighth modified example of the second embodiment. Fig. 53 is a cross-sectional view showing another example of an image display device according to an eighth modified example of the second embodiment. Fig. 54 is a cross-sectional view showing another example of an image display device according to an eighth modified example of the second embodiment. Fig. 55 is a plan view showing a laminate for an image display device of an image display device according to a ninth modified example of the second embodiment.

[0051] First Embodiment First, one embodiment will be described with reference to Figures 1 to 10C. Figures 1 to 10C are diagrams showing this embodiment.

[0052] The figures shown below are schematic diagrams. Therefore, the size and shape of each part are appropriately exaggerated for ease of understanding. Furthermore, appropriate modifications can be made within the scope of the technical concept. In the figures shown below, the same parts are denoted by the same reference numerals, and some detailed descriptions may be omitted. Furthermore, the numerical values, such as dimensions, and material names of each component described in this specification are examples of embodiments, and are not limited to these and may be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are interpreted not only to mean their strict meanings but also to include substantially the same state.

[0053] In the following embodiments, the "X direction" refers to a direction parallel to one side of the image display device. The "Y direction" refers to a direction perpendicular to the X direction and parallel to another side of the image display device. The "Z direction" refers to a direction perpendicular to both the X direction and the Y direction and parallel to the thickness direction of the image display device. The "front surface" refers to the surface on the positive side of the Z direction, which is the light-emitting surface side of the image display device and faces the viewer. The "rear surface" refers to the surface on the negative side of the Z direction, which is the surface opposite to the light-emitting surface of the image display device and the surface facing the viewer. In the present embodiment, the mesh wiring layer 20 is described as having a radio wave transmitting and receiving function (functioning as an antenna), but the mesh wiring layer 20 does not necessarily have to have a radio wave transmitting and receiving function (functioning as an antenna).

[0054] The configuration of the image display device according to this embodiment will be described with reference to FIGS. 1 and 2A.

[0055] 1 and 2A, an image display device 60 according to this embodiment includes a laminate 70 for an image display device and a display device 61 laminated on the laminate 70 for an image display device. The image display device 60 may further include a housing 62 that houses the laminate 70 for an image display device and the display device 61. As shown in FIG. 2A, the laminate 70 for an image display device includes a wiring substrate 10, a power supply line 85 electrically connected to the wiring substrate 10, a first transparent adhesive layer (first adhesive layer) 95, and a second transparent adhesive layer (second adhesive layer) 96. Of these, the wiring substrate 10 and the power supply line 85 electrically connected to the wiring substrate 10 constitute a module 80A.

[0056] The wiring board 10 of the module 80A has a substrate 11, a mesh wiring layer 20, and a power supply unit 40. As shown in FIG. 2A , the substrate 11 includes a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. The mesh wiring layer 20 is disposed on the first surface 11a of the substrate 11. The power supply unit 40 is electrically connected to the mesh wiring layer 20. Furthermore, a communication module 63 is disposed on the negative side in the Z direction relative to the display device 61. The image display device laminate 70, the display device 61, and the communication module 63 are housed in a housing 62 (see FIG. 1 ).

[0057] The image display device 60 shown in FIGS. 1 and 2A can transmit and receive radio waves of a predetermined frequency via a communication module 63, enabling communication. The communication module 63 may include any of a millimeter wave antenna, a telephone antenna, a Wi-Fi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, etc. Examples of such an image display device 60 include mobile terminal devices such as smartphones and tablets. The millimeter wave frequency band is 30 GHz or more and 100 GHz or less. The frequency bands used in 5G are 450 MHz or more and 6000 MHz or less in Fr1 (Frequency Range 1) and 24.25 GHz or more and 52.6 GHz or less in Fr2 (Frequency Range 2).

[0058] 2A , the image display device 60 has a light-emitting surface 64. The image display device 60 includes a wiring board 10 located on the light-emitting surface 64 side (positive side in the Z direction) of the display device 61, and a communication module 63 located on the opposite side of the light-emitting surface 64 of the display device 61 (negative side in the Z direction).

[0059] The display device 61 is, for example, an organic electroluminescence (EL) display device. The display device 61 may include, for example, a metal layer, a support substrate, a resin substrate, a thin film transistor (TFT), and an organic EL layer (not shown). A touch sensor (not shown) may be disposed on the display device 61. A wiring substrate 10 is disposed on the display device 61 via a second transparent adhesive layer 96. A polarizing plate (not shown) may be disposed between the display device 61 and the second transparent adhesive layer 96. The display device 61 is not limited to an organic EL display device. For example, the display device 61 may be another display device that has the ability to emit light itself, or may be a micro LED display device including micro LED elements (light emitters). The display device 61 may also be a liquid crystal display device including liquid crystal. A cover glass (surface protection plate, protective cover) 75 is disposed on the wiring substrate 10 via a first transparent adhesive layer 95. The cover glass 75 may be made of a material such as tempered glass using alkali aluminosilicate or the like, ultra-thin glass (UTG), polycarbonate, or a transparent resin such as transparent PI (CPI). Note that a shock absorbing layer (not shown) or the like may be disposed between the first transparent adhesive layer 95 and the cover glass 75. The thickness T of the display device 61 １１ may be, for example, 100 μm or more and 1000 μm or less.

[0060] Next, the laminate 70 for an image display device will be described in detail. As described above, the laminate 70 for an image display device includes the wiring substrate 10, the power supply line 85, the first adhesive layer 95, and the second adhesive layer 96. Of these, the first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11 of the wiring substrate 10. The second transparent adhesive layer 96 is located on the second surface 11b side of the substrate 11 of the wiring substrate 10. Here, the first transparent adhesive layer 95 of the laminate 70 for an image display device will be described first. The wiring substrate 10 and the power supply line 85 will be described in detail later.

[0061] The first transparent adhesive layer 95 is an adhesive layer that directly or indirectly bonds the wiring substrate 10 to the decorative layer 74 and the cover glass 75 (described later). This first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11. The first transparent adhesive layer 95 is optically transparent and may be an OCA (Optical Clear Adhesive) layer. The OCA layer is a layer prepared, for example, as follows: First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET). Next, the composition is cured using, for example, ultraviolet (UV) light to obtain an OCA sheet. After the OCA sheet is attached to an object, the release film is peeled off and removed to obtain the OCA layer. The material of the first transparent adhesive layer 95 may be an acrylic resin, a silicone resin, a urethane resin, or the like. In particular, the first transparent adhesive layer 95 may contain an acrylic resin. In this case, it is preferable that the second transparent adhesive layer 96 contains an acrylic resin.

[0062] The first transparent adhesive layer 95 may have a visible light transmittance of 85% or more, preferably 90% or more. There is no particular upper limit to the visible light transmittance of the first transparent adhesive layer 95, but it may be, for example, 100% or less. By setting the visible light transmittance of the first transparent adhesive layer 95 within the above range, the transparency of the laminate 70 for an image display device can be increased, making the display device 61 of the image display device 60 easier to see. Visible light refers to light with a wavelength of 400 nm or more and 700 nm or less. A visible light transmittance of 85% or more means that, when the absorbance of the member to be measured (e.g., the first transparent adhesive layer 95) is measured, the transmittance is 85% or more over the entire wavelength range of 400 nm or more and 700 nm or less. Absorbance measurements can be performed using a known spectrophotometer (e.g., a V-670 spectrometer manufactured by JASCO Corporation).

[0063] As described above, the wiring substrate 10 is disposed on the light-emitting surface 64 side of the display device 61. In this case, the wiring substrate 10 is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. The wiring substrate 10 may be disposed over the entire surface of the image display device in a plan view. Alternatively, a portion of the substrate 11 of the wiring substrate 10 may be disposed in at least a portion of the region between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0064] As described above, the wiring substrate 10 includes a transparent substrate 11, a mesh wiring layer 20 disposed on the first surface 11a of the substrate 11, and a power supply unit 40 electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to the communication module 63 via a power supply line 85. Furthermore, a portion of the wiring substrate 10 is not disposed between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, but protrudes outward (toward the negative Y direction) from between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Specifically, the region of the wiring substrate 10 where the power supply unit 40 is provided protrudes outward. This facilitates electrical connection between the power supply unit 40 and the communication module 63. In other words, because the region where the power supply unit 40 is provided protrudes outward (toward the negative Y direction) from between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, the power supply line 85 can be easily connected to the power supply unit 40. In this specification, the portion of the wiring substrate 10 or the power supply line 85 that protrudes outward (toward the negative Y-direction) from between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 is also referred to as the "bent portion." １０ The thickness of the mesh wiring layer 20 may be, for example, 500 μm or more and 2000 μm or less. On the other hand, the region of the wiring substrate 10 where the mesh wiring layer 20 is provided may be located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Details of the wiring substrate 10 and the power supply line 85 will be described later.

[0065] The second transparent adhesive layer 96 is an adhesive layer that directly or indirectly adheres the display device 61 to the wiring substrate 10. This second transparent adhesive layer 96 is located on the second surface 11b side of the substrate 11. The second transparent adhesive layer 96 may have a larger area than the first transparent adhesive layer 95. Like the first transparent adhesive layer 95, the second transparent adhesive layer 96 has optical transparency and may be an OCA (Optical Clear Adhesive) layer. The material of the second transparent adhesive layer 96 may be an acrylic resin, a silicone resin, a urethane resin, or the like. In particular, the second transparent adhesive layer 96 may contain an acrylic resin.

[0066] The second transparent adhesive layer 96 may have a transmittance of 85% or more, preferably 90% or more, for visible light (light having a wavelength of 400 nm or more and 700 nm or less). There is no particular upper limit to the visible light transmittance of the second transparent adhesive layer 96, but it may be, for example, 100% or less. By setting the visible light transmittance of the second transparent adhesive layer 96 to be within the above range, the transparency of the laminate 70 for an image display device can be increased, and the display device 61 of the image display device 60 can be made easier to view.

[0067] In such an image display device 60, it is preferable that the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are the same material. This makes it possible to further reduce the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0068] Thickness T of the first transparent adhesive layer 95 ３ and the thickness T of the second transparent adhesive layer 96 ４ At least one of the thicknesses is the thickness T of the substrate 11. １ The thickness T ３ or the thickness T of the second transparent adhesive layer 96 ４ The thickness of the image display device 60 as a whole can be reduced.

[0069] Thickness T of the first transparent adhesive layer 95 ３ and the thickness T of the second transparent adhesive layer 96 ４ and are the same, the thickness T ３ and the thickness T of the second transparent adhesive layer 96 ４ are the thickness T of the substrate 11, respectively. １ The thickness T ３ , T ４ The thickness of the image display device 60 as a whole can be reduced.

[0070] Specifically, the thickness T of the substrate 11 １ The thickness T of the substrate 11 may be, for example, 2 μm or more, 10 μm or more, and preferably 15 μm or more.１ By setting the thickness T of the substrate 11 to 2 μm or more, the strength of the wiring substrate 10 can be maintained, and the first directional wiring 21 and the second directional wiring 22 of the mesh wiring layer 20, which will be described later, can be made less likely to deform. １ The thickness T of the substrate 11 may be, for example, 200 μm or less, or 50 μm or less, and is preferably 25 μm or less. １ By setting the thickness to 200 μm or less, the overall thickness of the image display device 60 can be reduced.

[0071] Thickness T of the first transparent adhesive layer 95 ３ The thickness T of the first transparent adhesive layer 95 may be, for example, 15 μm or more, and is preferably 20 μm or more. ３ For example, the thickness may be 500 μm or less, 300 μm or less, preferably 250 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less.

[0072] Thickness T of the second transparent adhesive layer 96 ４ The thickness T of the second transparent adhesive layer 96 is preferably 20 μm or more and 200 μm or less. ４ By setting the thickness T of the second transparent adhesive layer 96 to 20 μm or more, the second transparent adhesive layer 96 deforms in the thickness direction in the area overlapping with the touch sensor (not shown) and absorbs the thickness of the touch sensor (not shown). This makes it possible to prevent steps from occurring in the second transparent adhesive layer 96 around the periphery of the touch sensor (not shown). ４ By making the thickness T of the second transparent adhesive layer 96 200 μm or less, the overall thickness of the image display device 60 can be reduced. ４ The thickness T of the second transparent adhesive layer 96 may be, for example, 15 μm or more. ４ may be, for example, 250 μm or less, 300 μm or less, or 500 μm or less.

[0073] Referring again to FIG. 2A , the cover glass 75 is disposed directly or indirectly on the first transparent adhesive layer 95. The cover glass 75 is located on the positive side of the first transparent adhesive layer 95 in the Z direction. The cover glass 75 is a light-transmitting glass member. The cover glass 75 is plate-shaped, and the shape of the cover glass 75 may be rectangular in a plan view. The thickness of the cover glass 75 may be, for example, 200 μm to 1000 μm, and preferably 300 μm to 700 μm. The length of the cover glass 75 in the longitudinal direction (Y direction) may be, for example, 20 mm to 500 mm, and preferably 100 mm to 200 mm. The length of the cover glass 75 in the lateral direction (X direction) may be 20 mm to 500 mm, and preferably 50 mm to 100 mm. A decorative layer 74 is provided between the cover glass 75 and the first transparent adhesive layer 95.

[0074] At least a portion of the decorative layer 74 is disposed on the first transparent adhesive layer 95. The decorative layer 74 may be a decorative film. For example, the decorative layer 74 has an opening in all or part of the portion that overlaps with the display area of ​​the display device 61 when viewed from the viewer side, and blocks light from the portion other than the display area. In other words, the decorative layer 74 is disposed so as to cover the edge of the display device 61 when viewed from the viewer side. The thickness T of the decorative layer 74 １９ may be, for example, 0.005 mm or more and 0.05 mm or less.

[0075] 1, the shape of the image display device 60 is a substantially rectangular shape as a whole in a plan view, with its longitudinal direction parallel to the Y direction and its lateral direction parallel to the X direction. ４ The length L of the image display device 60 in the short side direction (X direction) can be selected, for example, in the range of 20 mm to 500 mm, preferably 100 mm to 200 mm. ５ The distance can be selected, for example, within a range of 20 mm to 500 mm, preferably 50 mm to 100 mm. The planar shape of the image display device 60 may be a rectangle with rounded corners.

[0076] Next, the configuration of the wiring board will be described with reference to Figures 3 to 6. Figures 3 to 6 are diagrams showing the wiring board according to this embodiment.

[0077] The wiring substrate 10 according to this embodiment is a substrate used in the image display device 60 described above (see FIGS. 1 and 2A). The wiring substrate 10 can be disposed closer to the light-emitting surface 64 than the display device 61, between a first transparent adhesive layer 95 and a second transparent adhesive layer 96. As shown in FIG. 3, such a wiring substrate 10 includes a transparent substrate 11, a plurality of mesh wiring layers 20 disposed on the substrate 11, and a power supply unit 40, as described above. The mesh wiring layer 20 is electrically connected to the power supply unit 40. The mesh wiring layer 20 and the power supply unit 40 are disposed along the Y direction (first direction).

[0078] The shape of the substrate 11 is approximately rectangular in plan view. In the illustrated example, its longitudinal direction is parallel to the X direction, and its lateral direction is parallel to the Y direction. The substrate 11 is transparent and has an approximately flat plate shape, and its thickness is approximately uniform overall. The length L of the substrate 11 in the longitudinal direction (Y direction) of the image display device 60 is １ The length L of the substrate 11 in the short-side direction (X direction) of the image display device 60 (see FIGS. 1 and 3) can be selected, for example, from 10 mm to 500 mm. ２ (See FIG. 1) can be selected, for example, in the range of 3 mm to 100 mm. The planar shape of the substrate 11 may be a rectangle with rounded corners.

[0079] The material of the substrate 11 may be any material that is transparent in the visible light region and electrically insulating. The material of the substrate 11 is preferably an organic insulating material such as a polyester resin, an acrylic resin, a polycarbonate resin, a polyimide resin, a polyolefin resin, a cellulose resin, or a fluororesin material. The polyester resin may be polyethylene terephthalate or the like. The acrylic resin may be polymethyl methacrylate or the like. The polyolefin resin may be a cycloolefin polymer or the like. The cellulose resin may be triacetyl cellulose or the like. The fluororesin material may be PTFE or PFA or the like. For example, the material of the substrate 11 may be an organic insulating material such as a cycloolefin polymer (e.g., ZF-16 manufactured by Nippon Zeon Co., Ltd.) or a polynorbornene polymer (manufactured by Sumitomo Bakelite Co., Ltd.). Furthermore, the material of the substrate 11 may be glass, ceramics, or the like, appropriately selected depending on the application. Although the substrate 11 is illustrated as being made up of a single layer, the present invention is not limited to this and may have a structure in which multiple base materials or layers are stacked. Furthermore, the substrate 11 may be a film-like member or a plate-like member.

[0080] The tensile modulus of elasticity of the substrate 11 is preferably 0.5 GPa or more and 4.5 GPa or less. By making the tensile modulus of elasticity of the substrate 11 0.5 GPa or more, the rigidity of the substrate 11 can be maintained, and deformation of the substrate 11 can be suppressed. Furthermore, by making the tensile modulus of elasticity of the substrate 11 4.5 GPa or less, the substrate 11 can be prevented from becoming too hard. This prevents the substrate 11 from being damaged even when the substrate 11 is bent. Therefore, deterioration of antenna performance due to deformation of the wiring board 10 can be suppressed. The tensile modulus of elasticity of the substrate 11 can be measured in accordance with ASTM-D-882. Specifically, the elongation of a test piece is measured using a tensile tester, and the maximum elasticity immediately before plastic deformation (a linear equation of the tangent to the maximum slope of the stress-strain curve) can be obtained.

[0081] The dielectric dissipation factor of the substrate 11 is preferably 0.005 or less. When the dielectric dissipation factor of the substrate 11 is in the above range, the gain loss (reduction in sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced, particularly when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency. Furthermore, the dielectric dissipation factor of the substrate 11 is more preferably 0.002 or less. When the dielectric dissipation factor of the substrate 11 is in the above range, the gain loss (reduction in sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced, particularly when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency.

[0082] The dielectric constant of the substrate 11 is preferably 2 or more and 10 or less. Having a dielectric constant of 2 or more for the substrate 11 allows for a wider range of material options for the substrate 11. Furthermore, having a dielectric constant of 10 or less for the substrate 11 allows for reduced gain loss during transmission and reception of electromagnetic waves. That is, when the dielectric constant of the substrate 11 increases, the thickness of the substrate 11 has a greater effect on the propagation of electromagnetic waves. Furthermore, when the dielectric constant of the substrate 11 increases, there is a tendency to reduce the size of the mesh wiring layer 20, which functions as an antenna, in order to maintain desired performance. In this case, the area through which current flows in the mesh wiring layer 20 may become narrower. As a result, the current flowing through the mesh wiring layer 20 may concentrate in a narrow area, resulting in increased loss. In contrast, having a dielectric constant of 10 or less for the substrate 11 allows for reduced effect of the thickness of the substrate 11 on the propagation of electromagnetic waves. As a result, gain loss during transmission and reception of electromagnetic waves may be reduced. In particular, when the electromagnetic waves (for example, millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency waves, the loss of gain associated with the transmission and reception of the electromagnetic waves can be reduced.

[0083] The dielectric loss tangent and relative dielectric constant of the substrate 11 can be measured in accordance with IEC 62562. Specifically, first, a test piece is prepared by cutting out a portion of the substrate 11 where the mesh wiring layer 20 is not formed. The dimensions of the test piece are a width of 10 mm to 20 mm and a length of 50 mm to 100 mm. Next, the dielectric loss tangent or relative dielectric constant is measured in accordance with IEC 62562.

[0084] In this embodiment, the substrate 11 is transparent. In this specification, "transparent" means that the transmittance of visible light (light having a wavelength of 400 nm or more and 700 nm or less) is 85% or more. The substrate 11 may have a visible light transmittance of 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the substrate 11, but it may be, for example, 100% or less. By setting the visible light transmittance of the substrate 11 to be within the above range, the transparency of the wiring substrate 10 can be increased, and the display device 61 of the image display device 60 can be more easily viewed.

[0085] In this embodiment, the mesh wiring layer 20 is configured as a transmitter / receiver of electromagnetic waves. In this case, the mesh wiring layer 20 is made up of an antenna pattern that functions as an antenna. This mesh wiring layer 20 may be configured as an array antenna. When the mesh wiring layer 20 is configured as an array antenna in this way, it is possible to improve the millimeter wave antenna performance for transmitting and receiving millimeter waves with high linearity. Note that an array antenna is an antenna in which multiple antenna elements (radiating elements) are regularly arranged and in which the amplitude and phase of the excitation of the elements can be independently controlled.

[0086] As shown in Fig. 3, a plurality of mesh wiring layers 20 are formed on the substrate 11. It is preferable that four or more mesh wiring layers 20 are provided. In the illustrated example, four mesh wiring layers 20 are formed on the substrate 11 (see Fig. 1). Also, as shown in Fig. 3, the mesh wiring layers 20 may not be present on the entire surface of the substrate 11, but may be present only in a partial region on the substrate 11. Each mesh wiring layer 20 may have the same shape. In this case, each mesh wiring layer 20 has a length (distance in the Y direction) L of a tip side portion 20b described later. ａ Error and width (X direction distance) W ａ It is preferable that the errors of the above are within 10%. This can effectively improve the performance of the millimeter wave antenna.

[0087] The mesh wiring layer 20 has a base end portion (transmission portion) 20a on the power supply unit 40 side and a tip end portion (transmission / reception portion) 20b connected to the base end portion 20a. The base end portion 20a is connected to the power supply unit 40. The power supply unit 40, the base end portion (transmission portion) 20a, and the tip end portion (transmission / reception portion) 20b are arranged along the Y direction (first direction). In this case, the base end portion (transmission portion) 20a may form a microstrip line or a coplanar line. The base end portion 20a and the tip end portion 20b each have a substantially rectangular shape in a plan view. In this case, the width (X-direction distance) of the tip end portion 20b is wider than the width (X-direction distance) of the base end portion 20a.

[0088] The tip end portion 20b of the mesh wiring layer 20 corresponds to a predetermined frequency band. That is, the tip end portion 20b has a length (distance in the Y direction) L ａ The length L of the distal end portion 20b corresponds to a specific frequency band. ａ The length of the mesh wiring layer 20 becomes longer. In addition to a millimeter-wave antenna, the mesh wiring layer 20 may also be compatible with any of a telephone antenna, a Wi-Fi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth® antenna, an NFC antenna, etc. The lengths of the multiple tip portions 20b may differ from one another and correspond to different frequency bands. Furthermore, by utilizing the radio wave transmission and reception function of the wiring board 10, each mesh wiring layer 20 may perform functions such as fingerprint authentication and a millimeter-wave sensor. Alternatively, if the wiring board 10 does not have a radio wave transmission and reception function, each mesh wiring layer 20 may perform functions such as a hovering function, fingerprint authentication, a heater, and noise reduction (shielding). The hovering function refers to a function that allows the user to operate the display without directly touching it.

[0089] In the illustrated example, the tip portion 20b has a longitudinal direction parallel to the X direction and a lateral direction parallel to the Y direction. Alternatively, the tip portion 20b may have a longitudinal direction parallel to the Y direction and a lateral direction parallel to the X direction. The length L of the tip portion 20b in the Y direction ａThe width W of the tip portion 20b in the X direction can be selected, for example, in the range of 1 mm to 100 mm. ａ In particular, when the mesh wiring layer 20 is a millimeter wave antenna, the length L of the tip side portion 20b can be selected within a range of, for example, 1 mm or more and 100 mm or less. ａ When the mesh wiring layer 20 is a millimeter wave antenna, the length L of the tip side portion 20b can be selected in the range of 1 mm or more, more preferably 1.5 mm or more. ａ can be selected in the range of 10 mm or less, more preferably 5 mm or less.

[0090] The distance between the mesh wiring layers 20 can be set appropriately depending on the corresponding frequency, but is preferably 1 mm or more and 30 mm or less. ２０ｂ (See FIG. 3) is preferably 1 mm or more and 30 mm or less. By setting an appropriate distance, desired antenna directivity and gain improvement can be obtained.

[0091] 4, the mesh wiring layer 20 has a pattern shape in which metal wires are arranged in a lattice or mesh shape. This pattern shape is repeatedly arranged in the X direction and the Y direction. That is, the mesh wiring layer 20 has a pattern shape consisting of a portion (first direction wiring 21 described later) extending in a predetermined direction (first direction (e.g., Y direction)) and a portion (second direction wiring 22 described later) extending in a direction different from the predetermined direction (second direction (e.g., X direction)).

[0092] The mesh wiring layer 20 has a plurality of wires. Specifically, the mesh wiring layer 20 has a plurality of first directional wires 21 and a plurality of second directional wires 22 connecting the plurality of first directional wires 21. The plurality of first directional wires 21 and the plurality of second directional wires 22 are integrated as a whole to form a lattice or mesh shape. Each first directional wire 21 extends in the longitudinal direction (Y direction) of the mesh wiring layer 20. Each second directional wire extends linearly in the width direction (X direction) of the mesh wiring layer 20. Note that the first directional wires 21 and the second directional wires 22 may extend in a direction that is not parallel to either the X direction or the Y direction.

[0093] In the mesh wiring layer 20, a plurality of openings 23 are formed by being surrounded by adjacent first directional wires 21 and adjacent second directional wires 22. The transparent substrate 11 is exposed from each opening 23. This allows the transparency of the wiring substrate 10 as a whole to be increased.

[0094] The planar shape of each opening 23 is approximately square in plan view. That is, the first directional wirings 21 and the second directional wirings 22 are arranged at equal intervals. The first directional wirings 21 are arranged at equal intervals with a pitch P １ The second direction wirings 22 are arranged at equal intervals, and the pitch P ２ The pitch P of the first directional wires 21 can be set to a range of 0.01 mm or more and 1 mm or less, for example. In this way, by arranging the plurality of first directional wires 21 and the plurality of second directional wires 22 at equal intervals, the size of the openings 23 in the mesh wiring layer 20 does not vary, and the mesh wiring layer 20 can be made difficult to see with the naked eye. In addition, the pitch P of the first directional wires 21 can be set to a range of 0.01 mm or more and 1 mm or less. １ is the pitch P of the second directional wiring 22 ２ Therefore, each opening 23 has a substantially square shape in a plan view, and the transparent substrate 11 is exposed from each opening 23. Therefore, by increasing the area of ​​each opening 23, the transparency of the wiring substrate 10 as a whole can be increased. Note that the length L of one side of each opening 23 is ３ can be, for example, in the range of 0.01 mm or more and 1 mm or less. Note that the first directional wirings 21 and the second directional wirings 22 are perpendicular to each other, but are not limited to this and may intersect each other at an acute angle or an obtuse angle. Furthermore, it is preferable that the shape of the openings 23 be the same shape and size over the entire surface, but it is not necessary that the shape be uniform over the entire surface, and the shape may vary depending on the location.

[0095] As shown in FIG. 5 , each first directional wiring 21 has a cross section perpendicular to its longitudinal direction (X-direction cross section) that is substantially rectangular or square. In this case, the cross-sectional shape of the first directional wiring 21 is substantially uniform along the longitudinal direction (Y-direction) of the first directional wiring 21. As shown in FIG. 6 , each second directional wiring 22 has a cross section perpendicular to its longitudinal direction (Y-direction cross section) that is substantially rectangular or square, and has substantially the same shape as the cross-sectional shape (X-direction cross section) of the first directional wiring 21 described above. In this case, the cross-sectional shape of the second directional wiring 22 is substantially uniform along the longitudinal direction (X-direction) of the second directional wiring 22. The cross-sectional shapes of the first directional wiring 21 and the second directional wiring 22 do not necessarily have to be substantially rectangular or square. For example, the cross-sectional shapes of the first directional wiring 21 and the second directional wiring 22 may be approximately trapezoidal in that the front side (positive side in the Z direction) is narrower than the back side (negative side in the Z direction), or may be shaped such that the side surfaces on both sides in the longitudinal direction are curved.

[0096] In this embodiment, the line width W of the first direction wiring 21 １ (see FIG. 5) and the line width W ２ (See FIG. 6) is not particularly limited and can be appropriately selected depending on the application. １ is the width (distance in the X direction) in a cross section perpendicular to the longitudinal direction, and the line width W of the second directional wiring 22 ２ is the width (distance in the Y direction) in a cross section perpendicular to the longitudinal direction. For example, the line width W １ The width W of the second direction wiring 22 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably set to 0.2 μm to 2.0 μm. ２ can be selected from the range of 0.1 μm or more and 5.0 μm or less, and is preferably set to 0.2 μm or more and 2.0 μm or less.

[0097] Height H of the first directional wiring 21 １ (See FIG. 5) and the height H ２ (See FIG. 6) is not particularly limited and can be appropriately selected depending on the application. １ and the height H of the second direction wiring 22 ２are the lengths in the Z direction. １ and the height H of the second direction wiring 22 ２ The height H of the first directional wiring 21 can be selected within a range of, for example, 0.1 μm or more, and is preferably 0.2 μm or more. １ and the height H of the second direction wiring 22 ２ can be selected, for example, in the range of 5.0 μm or less, and is preferably 2.0 μm or less.

[0098] The material of the first directional wiring 21 and the second directional wiring 22 may be any conductive metal material. In the present embodiment, the material of the first directional wiring 21 and the second directional wiring 22 is copper, but is not limited to this. The material of the first directional wiring 21 and the second directional wiring 22 may be, for example, a metal material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals. Furthermore, the first directional wiring 21 and the second directional wiring 22 may be a plating layer formed by electrolytic plating.

[0099] The overall aperture ratio At of the mesh wiring layer 20 may be, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio At of the mesh wiring layer 20 in this range, the conductivity and transparency of the wiring substrate 10 can be ensured. The overall aperture ratio At of the mesh wiring layer 20 is preferably 95% or more and less than 100%. This allows the transparency of the wiring substrate 10 to be increased while ensuring the conductivity of the wiring substrate 10. The aperture ratio refers to the ratio (%) of the area of ​​the open region to the unit area of ​​a predetermined region (e.g., the entire mesh wiring layer 20). The open region refers to a region where no metal parts such as the first directional wiring 21 and the second directional wiring 22 are present and the substrate 11 is exposed.

[0100] Although not shown, a protective layer may be formed on the first surface 11a of the substrate 11 so as to cover the mesh wiring layer 20. The protective layer protects the mesh wiring layer 20 and is formed so as to cover at least the mesh wiring layer 20 of the substrate 11. Examples of materials that can be used for the protective layer include acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate, modified resins thereof, copolymers thereof, polyvinyl resins such as polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, and polyvinyl butyral, copolymers thereof, polyurethane, epoxy resin, polyamide, and chlorinated polyolefin, and other colorless and transparent insulating resins.

[0101] 3 again, a power supply unit 40 is electrically connected to the mesh wiring layer 20. This power supply unit 40 is made of a substantially rectangular conductive thin plate member. The longitudinal direction of the power supply unit 40 is parallel to the X direction, and the lateral direction of the power supply unit 40 is parallel to the Y direction.

[0102] The power supply unit 40 is disposed at the longitudinal end (the end on the negative Y-side) of the substrate 11. The power supply unit 40 may be made of a metal such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing any of these metals.

[0103] When the wiring substrate 10 is incorporated into the image display device 60 (see FIGS. 1 and 2A ), the power supply unit 40 is electrically connected to the communication module 63 of the image display device 60 via a power supply line 85. While the power supply unit 40 is provided on the first surface 11 a of the substrate 11, this is not limiting, and part or all of the power supply unit 40 may be located outside the periphery of the substrate 11. In this embodiment, at least a part of the power supply unit 40 is bent. This allows a bonding portion 88 (described later) to be positioned closer to the second adhesive layer 96 (negative side in the Z direction) than the first surface 11 a in the region where the mesh wiring layer 20 is disposed.

[0104] The mesh wiring layer 20 is electrically connected to the power supply portion 40 on the positive side in the Y direction. In this case, the power supply portion 40 is formed integrally with the mesh wiring layer 20. The thickness T of the power supply portion 40５ (Z-direction distance, see FIG. 6) is the height H of the first direction wiring 21 １ (See FIG. 5) and the height H ２ (see FIG. 6), and can be selected, for example, in the range of 0.1 μm to 5.0 μm.

[0105] Next, the configuration of the module will be described with reference to Fig. 7. Fig. 7 is a diagram showing the module according to this embodiment.

[0106] 7 , module 80A includes the above-described wiring board 10 and power supply line 85 electrically connected to power supply unit 40 via anisotropic conductive film 85c. As described above, when module 80A is incorporated into image display device 60 having display device 61, power supply unit 40 of wiring board 10 is electrically connected to communication module 63 of image display device 60 via power supply line 85.

[0107] The power supply line 85 is pressure-bonded to the wiring board 10 via an anisotropic conductive film (ACF) 85c. The anisotropic conductive film 85c contains a resin material such as acrylic resin or epoxy resin, and conductive particles 85d. In the illustrated example, the anisotropic conductive film 85c covers a portion of the power supply unit 40. This can prevent corrosion of the power supply unit 40.

[0108] The anisotropic conductive film 85c is disposed so as to face the power supply unit 40. Some of the conductive particles 85d are in contact with the power supply unit 40. This electrically connects the power supply line 85 to the power supply unit 40. Note that some of the anisotropic conductive film 85c may be eluted around the power supply line 85 when the power supply line 85 is pressure-bonded to the wiring substrate 10. The particle diameter of the conductive particles 85d may be, for example, approximately 7 μm.

[0109] Thickness T of the anisotropic conductive film 85c ９ The thickness T of the anisotropic conductive film 85c may be 2 μm or more and 20 μm or less. ９ means the thickness of the power supply line 85 when it is crimped to the power supply part 40.

[0110] The power supply line 85 may be, for example, a flexible printed circuit board. The power supply line 85 has a base material 85a and a metal wiring portion 85b laminated on the base material 85a. Of these, the base material 85a may contain, for example, a resin material such as polyimide or a liquid crystal polymer. The metal wiring portion 85b may contain, for example, copper. The metal wiring portion 85b is electrically connected to the power supply unit 40 via conductive particles 85d.

[0111] Here, the power supply unit 40 of the wiring substrate 10 and the power supply line 85 are joined to each other via a joint 88. In this case, as shown in FIG. 2A , the joint 88 is located closer to the second adhesive layer 96 (the negative side in the Z direction) than the first surface 11a in the region where the mesh wiring layer 20 is arranged. This allows the overall thickness of the image display device laminate 70 to be reduced. Therefore, the overall thickness of the image display device 60 can be reduced.

[0112] Furthermore, the joints 88 are provided at positions overlapping the decorative layer 74 in plan view. That is, the joints 88 are covered by the decorative layer 74, and are therefore configured so that they are not visible to an observer when viewed from the positive side in the Z direction. This prevents the power supply lines 85 from extending beyond the display area of ​​the image display device 60, allowing the display area of ​​the image display device 60 to be enlarged.

[0113] As shown in FIG. 2A , the angle θ1 between the first surface 11a in the region where the joint 88 is formed and the first surface 11a in the region where the mesh wiring layer 20 is disposed may be 90°. Also, as shown in FIG. 2B , θ1 may be 30° or greater and 150° or less, preferably 60° or greater and 120° or less. By setting θ1 to 30° or greater and 150° or less, the overall thickness of the image display device laminate 70 can be reduced while preventing the power supply line 85 from extending into the display area of ​​the image display device 60. Therefore, the display area of ​​the image display device 60 can be increased while reducing the overall thickness of the image display device 60. Here, θ1 is the angle between the first virtual line IL1 and the second virtual line IL2. More specifically, θ1 is the angle between the first virtual line IL1 and the second virtual line IL2, that is, the angle formed between the substrate 11 side of the first virtual line IL1 (the positive side in the Y direction) and the substrate 11 side of the second virtual line IL2 (the negative side in the Z direction). The first virtual line IL1 is an extension of the first surface 11a in a region where the bonded portion 88 is formed, in cross sections taken along both the Y and Z directions. The second virtual line IL2 is an extension of the first surface 11a in a region where the mesh wiring layer 20 is disposed, in cross sections taken along both the Y and Z directions. As shown in FIG. 2B , the first surface 11a in a region where the bonded portion 88 is formed may be curved. Therefore, if the first surface 11a is curved, the first virtual line IL1 is a straight line passing through both ends of the first surface 11a in the region where the bonded portion 88 is formed. Furthermore, the first imaginary line IL1 and the second imaginary line IL2 may be parallel to each other by bending the wiring substrate 10. In other words, the angle θ1 may be 0° by bending the wiring substrate 10.

[0114] In the cross section along both the Y direction and the Z direction, the length L of the joint 88 ７ The length L of the joint 88 is preferably 0.3 mm or more. ７ When the thickness is 0.3 mm or more, the adhesion between the power supply part 40 and the power supply line 85 can be improved.

[0115] The thickness T of such a power supply line 85 ７(See FIG. 7) may be 30 μm or more and 280 μm or less.

[0116] Furthermore, it is preferable that the power supply line 85 is fixed to the housing 62. This can improve the operational stability of the image display device 60. Furthermore, when the power supply line 85 is fixed to the housing 62, the joint 88 can be close to the fixing point where the power supply line 85 is fixed to the housing 62. This can improve the stability of the power supply line 85. In this case, the power supply line 85 may be fixed to the housing 62 by, for example, adhesive, tape, or the like.

[0117] Furthermore, the thickness (T １ +T ５ ) and the thickness T of the anisotropic conductive film 85c ９ and the thickness T of the power supply line 85 ７ The total thickness (T １ +T ５ +T ９ +T ７ ) is preferably 50 μm or more and 300 μm or less. When the total thickness is 300 μm or less, the width of the decorative layer 74 can be narrowed and the display area can be enlarged.

[0118] [Methods of Manufacturing a Wiring Substrate, a Module, and a Laminate for an Image Display Device] Next, with reference to Figures 8A to 8F, 9A to 9C, and 10A to 10C, methods of manufacturing a wiring substrate 10, a module 80A, and a laminate for an image display device according to this embodiment will be described. Figures 8A to 8F are cross-sectional views showing a method of manufacturing a wiring substrate 10 according to this embodiment. Figures 9A to 9C are cross-sectional views showing a method of manufacturing a module 80A according to this embodiment. Figures 10A to 10C are cross-sectional views showing a method of manufacturing a laminate for an image display device according to this embodiment.

[0119] First, a method for manufacturing a wiring board according to this embodiment will be described with reference to FIGS. 8A to 8F.

[0120] 8A, a substrate 11 is prepared, which includes a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. The substrate 11 is transparent.

[0121] Next, the mesh wiring layer 20 and the power supply section 40 electrically connected to the mesh wiring layer 20 are formed on the first surface 11 a of the substrate 11 .

[0122] 8B , metal foil 51 is first laminated over substantially the entire first surface 11a of substrate 11. In this embodiment, the thickness of metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In this embodiment, metal foil 51 may contain copper.

[0123] 8C, a photo-curable insulating resist 52 is applied to almost the entire surface of the metal foil 51. As the photo-curable insulating resist 52, for example, an organic resin such as an acrylic resin or an epoxy resin can be used.

[0124] 8D , the insulating layer 54 is formed by photolithography. In this case, the photo-curable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the first-directional wiring 21 and the second-directional wiring 22 is exposed.

[0125] 8E , the metal foil 51 located on the first surface 11 a of the substrate 11 in the portion not covered with the insulating layer 54 is removed. At this time, the metal foil 51 is etched so as to expose the first surface 11 a of the substrate 11 by wet processing using ferric chloride, cupric chloride, a strong acid such as sulfuric acid or hydrochloric acid, persulfate, hydrogen peroxide, an aqueous solution of these, or a combination of these.

[0126] 8F, the insulating layer 54 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or dry treatment using oxygen plasma.

[0127] In this manner, the wiring substrate 10 is obtained, which includes the substrate 11 and the mesh wiring layer 20 provided on the first surface 11a of the substrate 11. In this case, the mesh wiring layer 20 includes first directional wiring 21 and second directional wiring 22. At this time, the power supply unit 40 may be formed by a part of the metal foil. Alternatively, a flat power supply unit 40 may be separately prepared and electrically connected to the mesh wiring layer 20.

[0128] Next, a method for manufacturing the module according to this embodiment will be described with reference to FIGS. 9A to 9C.

[0129] First, as shown in Fig. 9A, the wiring substrate 10 is prepared. At this time, the wiring substrate 10 is fabricated by, for example, the method shown in Figs. 8A to 8F.

[0130] Next, the power supply line 85 is electrically connected to the power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d. At this time, the anisotropic conductive film 85c is first placed on the wiring substrate 10, as shown in FIG. 9B . At this time, the anisotropic conductive film 85c is placed so as to face the power supply unit 40.

[0131] 9C , the power supply line 85 is pressure-bonded to the wiring substrate 10. At this time, pressure and heat are applied to the power supply line 85, thereby pressure-bonding the power supply line 85 to the wiring substrate 10. Then, some of the conductive particles 85d come into contact with the power supply portion 40. In this manner, the power supply portion 40 and the power supply line 85 are joined to each other via the joint portion 88, and the power supply line 85 is electrically connected to the power supply portion 40. When pressure-bonding the power supply line 85 to the wiring substrate 10, the power supply line 85 is pressure-bonded to the wiring substrate 10 so that the anisotropic conductive film 85c covers at least a portion of the power supply portion 40. At this time, part of the anisotropic conductive film 85c may dissolve around the power supply line 85.

[0132] In this way, a module 80A is obtained that includes the wiring substrate 10 and the power supply line 85 electrically connected to the power supply section 40 via the anisotropic conductive film 85c containing conductive particles 85d.

[0133] Next, a method for manufacturing the image display device 60 according to this embodiment will be described with reference to FIGS. 10A to 10C.

[0134] Next, the first transparent adhesive layer 95, the wiring substrate 10 of the module 80A, and the second transparent adhesive layer 96 are laminated together. First, as shown in FIG. 10A , an OCA sheet 90 is prepared, which includes, for example, a polyethylene terephthalate (PET) release film 91 and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. The OCA layer 92 may be formed by applying a liquid curable adhesive layer composition containing a polymerizable compound onto the release film 91 and curing the composition using, for example, ultraviolet (UV) light. This curable adhesive layer composition contains a polar group-containing monomer.

[0135] 10B, the OCA layer 92 of the OCA sheet 90 is attached to the wiring board 10. As a result, the wiring board 10 is sandwiched between the OCA layers 92.

[0136] Next, as shown in Figure 10C, the release film 91 is peeled off and removed from the OCA layer 92 of the OCA sheet 90 attached to the wiring board 10, thereby obtaining a first transparent adhesive layer 95 (OCA layer 92), wiring board 10 and second transparent adhesive layer 96 (OCA layer 92) laminated together.

[0137] Thereafter, a decorative film as the decorative layer 74 and a cover glass 75 are laminated on the first transparent adhesive layer 95 .

[0138] In this way, a laminate 70 for an image display device is obtained, which includes the first transparent adhesive layer 95, the second transparent adhesive layer 96, and the module 80A including the wiring substrate 10.

[0139] Thereafter, the display device 61 is laminated on the laminate 70 for the image display device. At this time, at least a portion of the power supply unit 40 is bent. As a result, the joint 88 is positioned closer to the second adhesive layer 96 (the negative side in the Z direction) than the first surface 11a in the region where the mesh wiring layer 20 is arranged (see FIGS. 2A and 2B ). In this way, the image display device 60 including the laminate 70 for the image display device and the display device 61 laminated on the laminate 70 for the image display device is obtained.

[0140] [Operation of the Present Embodiment] Next, the operation of the present embodiment configured as described above will be described.

[0141] 1 to 2B , the wiring substrate 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring substrate 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring substrate 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40 and the power supply line 85. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0142] According to the present embodiment, the power supply unit 40 and the power supply line 85 are joined to each other via a joint 88. The joint 88 is located closer to the second adhesive layer 96 than the first surface 11a in the region where the mesh wiring layer 20 is arranged. This allows the overall thickness of the laminate 70 for an image display device to be reduced. Therefore, the overall thickness of the image display device 60 can be reduced. In this case, the joint 88 can be prevented from extending beyond the decorative layer 74 into the display region of the image display device 60 in a plan view, thereby increasing the display region of the image display device 60.

[0143] Furthermore, by positioning the bonding portion 88 closer to the second adhesive layer 96 than to the first surface 11 a in the region where the mesh wiring layer 20 is arranged, it is possible to reduce transmission loss in the wiring substrate 10. Note that the fact that transmission loss in the wiring substrate 10 can be reduced will be described later in connection with examples.

[0144] Furthermore, according to this embodiment, the wiring substrate 10 includes a substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The substrate 11 is transparent. The mesh wiring layer 20 has a conductor portion as a forming portion of an opaque conductive layer and a mesh pattern formed by numerous openings. This ensures the transparency of the wiring substrate 10. As a result, when the wiring substrate 10 is placed on a display device 61, the display device 61 can be seen through the openings 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not obstructed.

[0145] Furthermore, according to the present embodiment, the base end portion (transmission portion) 20a of the mesh wiring layer 20 forms a coplanar line. Furthermore, at least a portion of the power supply portion 40 is bent. This allows the joint 88 to be positioned closer to the second adhesive layer 96 (the negative side in the Z direction) than the first surface 11a in the region where the mesh wiring layer 20 is disposed, thereby increasing the display area of ​​the image display device 60.

[0146] Furthermore, according to this embodiment, the power supply line 85 is fixed to the housing 62. This makes it possible to control the influence of unwanted resonance, and improve the operational stability of the image display device 60.

[0147] Next, a modified example of the image display device will be described.

[0148] 11 and 12 show a wiring substrate of a first modified example of an image display device. The modified example shown in Fig. 11 and Fig. 12 differs in that a dummy wiring layer 30 is provided around the mesh wiring layer 20, but other configurations are substantially the same as the embodiment shown in Fig. 1 to Fig. 10C described above. In Fig. 11 and Fig. 12, the same parts as those shown in Fig. 1 to Fig. 10C are given the same reference numerals, and detailed description thereof will be omitted.

[0149] 11, a dummy wiring layer 30 is provided along the periphery of the mesh wiring layer 20. Unlike the mesh wiring layer 20, this dummy wiring layer 30 does not substantially function as an antenna.

[0150] 12, the dummy wiring layer 30 is composed of repeated dummy wirings 30a having a predetermined pattern shape. That is, the dummy wiring layer 30 includes a plurality of dummy wirings 30a, and each dummy wiring 30a is electrically independent from the mesh wiring layer 20 (the first directional wirings 21 and the second directional wirings 22). The plurality of dummy wirings 30a are regularly arranged throughout the dummy wiring layer 30. The plurality of dummy wirings 30a are spaced apart from each other in the planar direction and are arranged to protrude above the substrate 11. That is, each dummy wiring 30a is electrically independent from the mesh wiring layer 20, the power supply section 40, and other dummy wirings 30a. The shape of each dummy wiring 30a is approximately L-shaped in plan view.

[0151] In this case, the dummy wiring 30a has a shape in which a portion of the pattern shape of the mesh wiring layer 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the dummy wiring layer 30, and makes the mesh wiring layer 20 arranged on the substrate 11 less visible. As shown in FIG. 12 , the dummy wiring 30a extends parallel to the first directional wiring 21 or the second directional wiring 22. Specifically, the dummy wiring 30a includes a first portion 31a extending parallel to the first directional wiring 21 and a second portion 32a extending parallel to the second directional wiring 22. In this way, the dummy wiring 30a extending parallel to the first directional wiring 21 or the second directional wiring 22 makes the mesh wiring layer 20 arranged on the substrate 11 even less visible. The aperture ratio of the dummy wiring layer 30 may be the same as or different from the aperture ratio of the mesh wiring layer 20, but is preferably close to the aperture ratio of the mesh wiring layer 20.

[0152] As in this modification, the dummy wiring layer 30 that is electrically independent from the mesh wiring layer 20 is provided around the mesh wiring layer 20, thereby making it possible to obscure the outer edge of the mesh wiring layer 20. This makes it possible to make the mesh wiring layer 20 less visible on the surface of the image display device 60, and makes it difficult for a user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0153] Fig. 13 shows a second modified example of the image display device. The modified example shown in Fig. 13 differs in that the mesh wiring layer 20 is disposed on the second surface 11b of the substrate 11, but other configurations are substantially the same as those of the embodiment shown in Figs. 1 to 12 described above. In Fig. 13, the same parts as those of the embodiment shown in Figs. 1 to 12 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0154] In the wiring substrate 10 shown in Fig. 13, the mesh wiring layer 20 is disposed on the second surface 11b of the substrate 11 of the wiring substrate 10. In this case, as shown in Fig. 13, the bonding portion 88 is located closer to the second adhesive layer 96 (the negative side in the Z direction) than the second surface 11b in the area where the mesh wiring layer 20 is disposed. This allows the overall thickness of the laminate 70 for an image display device to be reduced. Therefore, the overall thickness of the image display device 60 can be reduced.

[0155] 13 , the angle θ2 between the second surface 11b in the region where the joint 88 is formed and the second surface 11b in the region where the mesh wiring layer 20 is disposed may be 90°. θ2 may be 30° or greater and 150° or less, preferably 60° or greater and 120° or less. By setting θ2 to 30° or greater and 150° or less, the overall thickness of the image display device laminate 70 can be reduced while preventing the power supply line 85 from extending into the display area of ​​the image display device 60. Therefore, the display area of ​​the image display device 60 can be increased while reducing the overall thickness of the image display device 60. Here, θ2 is the angle between the third virtual line IL3 and the fourth virtual line IL4. More specifically, θ2 is the angle between the third imaginary line IL3 and the fourth imaginary line IL4, that is, the angle formed between the power supply unit 40 side of the third imaginary line IL3 (the positive side in the Y direction) and the power supply unit 40 side of the fourth imaginary line IL4 (the negative side in the Z direction). The third imaginary line IL3 is an extension of the second surface 11b in a region where the bonding portion 88 is formed, in cross sections taken along both the Y and Z directions. The fourth imaginary line IL4 is an extension of the second surface 11b in a region where the mesh wiring layer 20 is disposed, in cross sections taken along both the Y and Z directions. The second surface 11b in a region where the bonding portion 88 is formed may be curved. Therefore, if the second surface 11b is curved, the third imaginary line IL3 is a straight line passing through both ends of the second surface 11b in a region where the bonding portion 88 is formed.

[0156] According to this modification, the mesh wiring layer 20 is disposed on the second surface 11b of the substrate 11. This reduces the load on the mesh wiring layer 20 and the power supply unit 40 when the wiring substrate 10 is bent toward the second surface 11b of the substrate 11. This effectively prevents the mesh wiring layer 20 and the power supply unit 40 from being damaged.

[0157] In this modification, too, the overall thickness of the laminate 70 for an image display device can be reduced, thereby reducing the overall thickness of the image display device 60. In this case, the bonding portion 88 can be prevented from extending beyond the decorative layer 74 into the display area of ​​the image display device 60 in plan view, thereby increasing the display area of ​​the image display device 60.

[0158] Fig. 14 shows a third modified example of the image display device. The modified example shown in Fig. 14 differs in that at least a portion of the base end portion (transmission portion) 20a of the mesh wiring layer 20 is bent, but the other configurations are substantially the same as those shown in Figs. 1 to 13 described above. In Fig. 14, the same parts as those shown in Figs. 1 to 13 are given the same reference numerals, and detailed description thereof will be omitted.

[0159] 14 , at least a part of the base end portion (transmission portion) 20 a of the mesh wiring layer 20 is bent. Even in this case, the joint 88 can be positioned closer to the second adhesive layer 96 (negative side in the Z direction) than the first surface 11 a in the region where the mesh wiring layer 20 is arranged, and the display area of ​​the image display device 60 can be enlarged.

[0160] Fig. 15 shows a fourth modified example of the image display device. The modified example shown in Fig. 15 differs in that the power supply line 85 is fixed to the display device 61, but other configurations are substantially the same as the embodiment shown in Figs. 1 to 14 described above. In Fig. 15, the same parts as those shown in Figs. 1 to 14 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0161] 15 , the power supply line 85 is fixed to the display device 61. In this case, the power supply line 85 is fixed to a side surface of the display device 61. The power supply line 85 may be fixed to the display device 61 by, for example, adhesive, tape, or the like. By fixing the power supply line 85 to the display device 61, the operational stability of the image display device 60 can be improved.

[0162] 16, the power supply line 85 may be fixed to the rear surface of the display device 61. In this case as well, the operational stability of the image display device 60 can be improved.

[0163] Fig. 17 shows a fifth modified example of the image display device. The modified example shown in Fig. 17 differs in that the wiring board 10 is fixed to a housing 62, but other configurations are substantially the same as the embodiment shown in Figs. 1 to 16 described above. In Fig. 17, the same parts as those shown in Figs. 1 to 16 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0164] 17 , the wiring board 10 is fixed to a housing 62. In this case, the power supply unit 40 of the wiring board 10 is fixed to the housing 62. The power supply unit 40 may be fixed to the housing 62 by, for example, an adhesive, tape, or the like. By fixing the wiring board 10 to the display device 61 in this way, the influence of unwanted resonance can be controlled, and the operational stability of the image display device 60 can be improved.

[0165] 18, the substrate 11 of the wiring board 10 may be fixed to a housing 62. In this case as well, the operational stability of the image display device 60 can be improved.

[0166] 19, the wiring board 10 may be fixed to the housing 62, and the power supply line 85 may be fixed to the housing 62. In this case as well, the operational stability of the image display device 60 can be improved. In the example shown in FIG. 19, the substrate 11 of the wiring board 10 is fixed to the housing 62. However, this is not limiting, and the power supply unit 40 of the wiring board 10 may be fixed to the housing 62, as shown in FIG.

[0167] 20 , the wiring board 10 may be fixed to the housing 62, and the power supply line 85 may be fixed to the display device 61. In this case as well, the operational stability of the image display device 60 can be improved. In the example shown in FIG. 20 , the substrate 11 of the wiring board 10 is fixed to the housing 62. However, this is not limiting, and the power supply unit 40 of the wiring board 10 may be fixed to the housing 62, as shown in FIG.

[0168] Fig. 21 shows a sixth modified example of a laminate for an image display device. The modified example shown in Fig. 21 differs in the planar shape of the mesh wiring layer 20, but other configurations are substantially the same as those shown in Figs. 1 to 20 described above. In Fig. 21, the same parts as those shown in Figs. 1 to 20 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0169] 21 , the first-directional wiring 21 and the second-directional wiring 22 intersect at an angle (not at a right angle), and each opening 23 is formed in a diamond shape in a plan view. The first-directional wiring 21 and the second-directional wiring 22 are not parallel to either the X direction or the Y direction, but either one of the first-directional wiring 21 and the second-directional wiring 22 may be parallel to the X direction or the Y direction.

[0170] [Example] Next, a specific example of the present embodiment will be described.

[0171] Example 1 An image display device 60 having the configuration shown in FIG. 2A was fabricated. In this case, a 40 μm-thick polyethylene terephthalate substrate was used as the substrate 11 of the wiring board 10. Copper wiring was formed on the polyethylene terephthalate substrate as the first directional wiring 21 and the second directional wiring 22. A 50 μm-thick acrylic resin OCA layer was used as the first transparent adhesive layer 95. A 25 μm-thick acrylic resin OCA layer was used as the second transparent adhesive layer 96. Furthermore, a 450 μm-thick display device 61 was used.

[0172] At this time, in the laminate 70 for the image display device of the image display device 60 according to Example 1, the angle θ1 formed by the first surface 11a in the area where the joint 88 was formed and the first surface 11a in the area where the mesh wiring layer 20 was arranged was 90°.

[0173] The total thickness of the laminate 70 for an image display device according to Example 1 and the thickness of the display device 61 was 645 μm. Furthermore, in the laminate 70 for an image display device according to Example 1, the width of the bent portion was 1225 μm.

[0174] Next, a sample having a transmission path with the same configuration as the image display device 60 according to Example 1 was measured for transmission loss using a network analyzer. First, the input and output terminals of the network analyzer (KEYSIGHT E5080B ENA Vector Network Analyzer) were connected with connectors, and the measurement system was calibrated. Next, the connectors were removed from the input and output terminals, and a measurement sample was connected between the input and output terminals, and S21 was measured as transmission loss. The length of the transmission path measured for the sample was 1 cm. S21 is defined by the following formula, where Pin = input power and Pout = output power: S21 (dB) = 10 * Log (Pout / Pin)

[0175] (Example 2) The transmission loss was measured in the same manner as in Example 1, except that the angle θ1 was 60°, the total thickness of the laminate 70 for an image display device and the thickness of the display device 61 was 693 μm, and the width of the bent portion was 1500 μm.

[0176] (Comparative Example 1) The transmission loss was measured in the same manner as in Example 1, except that the angle θ1 was 0°, the total thickness of the laminate for an image display device and the thickness of the display device was 750 μm, and the width of the bent portion was 2180 μm.

[0177] The results are shown in Table 1. In the transmission loss column of Table 1, "A (excellent)" means that the S21 at 28 GHz was a value of -1 dB or more. "B (poor)" means that the S21 at 28 GHz was a value of less than -1 dB.

[0178]

[0179] As a result, as shown in Table 1, the total thickness of the laminate for an image display device and the display device was 750 μm in Comparative Example 1. In contrast, the total thickness of the laminate for an image display device 70 and the display device 61 was 645 μm in Example 1, and the total thickness of the laminate for an image display device 70 and the display device 61 was 693 μm in Example 2. Therefore, it was found that the overall thickness of the image display device 60 could be reduced in this embodiment.

[0180] Furthermore, as shown in Table 1, the width of the bent portion was 2180 μm in Comparative Example 1. In contrast, the width of the bent portion was 1225 μm in Example 1, and the width of the bent portion was 1500 μm in the image display device 60 according to Example 2. Therefore, it was found that the display area of ​​the image display device 60 can be enlarged in this embodiment.

[0181] Furthermore, as shown in Table 1, in the image display device according to Comparative Example 1, S21 at 28 GHz was a value less than -1 dB. In contrast, in the image display devices 60 according to Examples 1 and 2, S21 at 28 GHz was a value of -1 dB or more. Therefore, it was found that the image display device 60 according to this embodiment can reduce transmission loss.

[0182] It is also possible to combine the multiple components disclosed in the above embodiment and each modification as needed, or to delete some of the components disclosed in the above embodiment and each modification.

[0183] Second Embodiment Next, a second embodiment will be described with reference to Figures 22 to 29C. Figures 22 to 29C are diagrams showing this embodiment. In Figures 22 to 29C, the same parts as those in the first embodiment shown in Figures 1 to 21 are designated by the same reference numerals, and detailed descriptions thereof may be omitted.

[0184] The configuration of the image display device according to this embodiment will be described with reference to FIGS.

[0185] 22 and 23 , an image display device 60 according to the present embodiment includes a laminate 70 for an image display device, and a display device 61 laminated on the laminate 70 for an image display device. As shown in Fig. 23 , the laminate 70 for an image display device includes a wiring substrate 10, a power supply line 85 electrically connected to the wiring substrate 10, a first transparent adhesive layer (first adhesive layer) 95, and a second transparent adhesive layer (second adhesive layer) 96. Of these, the wiring substrate 10 and the power supply line 85 electrically connected to the wiring substrate 10 constitute a module 80A.

[0186] In this embodiment, the display device 61 is also formed of, for example, an organic EL (Electro Luminescence) display device. In this embodiment, the display device 61 may have a conductor layer (third ground layer) 61a. The conductor layer 61a may also function as a ground layer (GND). The conductor layer 61a is formed of, for example, a substantially rectangular conductive thin plate-like member. The conductor layer 61a may be formed of, for example, a metal material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals.

[0187] In this embodiment, as shown in Figures 23 and 24, the conductor layer 61a does not overlap the power supply portion 40 of the wiring board 10 in a planar view. Furthermore, the conductor layer 61a does not overlap a ground layer 86 (described later) of the power supply line 85 in a planar view. Note that, as shown in Figure 25, the conductor layer 61a may overlap the power supply portion 40 in a planar view. In this case, the conductor layer 61a is provided so as to cover the entire power supply portion 40 in a planar view. Note that, although not shown, the conductor layer 61a may be provided so as to cover only a partial region of the power supply portion 40 in a planar view. Furthermore, the conductor layer 61a may overlap a ground layer 86 (described later) of the power supply line 85 in a planar view.

[0188] In addition, in a plan view, the distance (Y direction distance) L between the conductor layer 61a of the display device 61 and the power supply unit 40 １５is preferably equal to or less than 0.05 times the wavelength of the electromagnetic waves received by the wiring board 10. This makes it possible to suppress the generation of noise even when unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply portion 40.

[0189] The distance L between the conductor layer 61a and the power supply portion 40 along the thickness direction (Z direction) of the wiring board 10 is １６ (see FIG. 23) is preferably 0.005 to 0.1 times the wavelength of the electromagnetic wave received by the wiring board 10. １６ However, by setting the distance L to be 0.005 times or more the wavelength of the electromagnetic wave received by the wiring board 10, noise interference at the target wavelength can be suppressed, and the high frequency characteristics of the power feed line 85 can be improved. １６ However, since the wavelength is 0.1 times or less the wavelength of the electromagnetic waves received by the wiring board 10, the overall thickness of the image display device 60 can be reduced.

[0190] 23 , in the region overlapping with the power supply unit 40 in a plan view, a gap G is formed between the power supply line 85 and the cover glass (protective cover) 75. This reduces dielectric loss and improves transmission characteristics. A decorative layer 74 may be disposed between the power supply line 85 and the protective cover 75.

[0191] 3 , in the present embodiment, the power supply unit 40 is electrically connected to the mesh wiring layer 20. Note that, although the power supply unit 40 is provided on the first surface 11a of the substrate 11, this is not limiting, and a part or all of the power supply unit 40 may be located outside the periphery of the substrate 11. Furthermore, the power supply unit 40 may be configured to be flexible so that it wraps around the side or back surface of the image display device 60. In this case, the power supply unit 40 may be electrically connected to the communication module 63 on the side or back surface of the image display device 60.

[0192] Next, the configuration of the module will be described with reference to Figures 26 and 27. Figures 26 and 27 are diagrams showing the module according to this embodiment.

[0193] 26 and 27 , module 80A includes the above-described wiring board 10 and a power supply line 85 electrically connected to power supply unit 40 via conductive member 81 (see FIG. 27 ). As described above, when module 80A is incorporated into image display device 60 having display device 61, power supply unit 40 of wiring board 10 is electrically connected to communication module 63 of image display device 60 via power supply line 85. In this case, power supply line 85 is housed in housing 62 with at least a portion bent.

[0194] As shown in FIG. 27 , the power supply line 85 is pressure-bonded to the wiring substrate 10 via a conductive member 81. In this embodiment, the conductive member 81 is an anisotropic conductive film (ACF). The anisotropic conductive film 81 includes a resin material such as acrylic resin or epoxy resin, and a plurality of conductive particles 82. In the illustrated example, the anisotropic conductive film 81 covers a portion of the power supply unit 40. This can suppress corrosion of the power supply unit 40. The conductive member 81 may be an anisotropic conductive paste (ACP), a conductive adhesive, or solder (including low-melting-point solder), or may be a member that is pressure-bonded by caulking or the like. The connection method may be thermocompression bonding, ultrasonic solid-state diffusion bonding, thermal fusion soldering, or pressure bonding using bumps (so-called bump pressure bonding), etc.

[0195] The anisotropic conductive film 81 is disposed so as to face the power supply unit 40. A portion of each conductive particle 82 is in contact with the power supply unit 40. This electrically connects the power supply line 85 to the power supply unit 40. Note that a portion of the anisotropic conductive film 81 may be eluted around the power supply line 85 when the power supply line 85 is pressure-bonded to the wiring substrate 10.

[0196] Thickness T of the anisotropic conductive film (conductive member) 81 １７ The thickness T of the anisotropic conductive film 81 (see FIG. 27) may be 3 μm or more and 30 μm or less. １７ When the thickness T of the anisotropic conductive film 81 is 3 μm or more, the adhesion between the power supply part 40 and the power supply line 85 can be improved. １７By making the thickness T of the anisotropic conductive film 81 30 μm or less, the thickness of the image display device 60 can be reduced. １７ is the thickness after the power supply line 85 is pressure-bonded to the wiring board 10.

[0197] The particle diameter of the conductive particles 82 may be 3 μm or more and 25 μm or less, for example, approximately 10 μm. When measuring the average particle diameter of the conductive particles 82, first, the power supply line 85 is peeled off from the power supply section 40 to expose the plurality of conductive particles 82 from the resin material of the anisotropic conductive film 81. Next, the exposed plurality of conductive particles 82 are photographed using a scanning electron microscope (SEM). Next, the particle diameters of the plurality of conductive particles 82 are measured from the obtained image. The average value of the measured values ​​is then defined as the average particle diameter of the conductive particles 82. The number of conductive particles 82 to be measured is 10 to 100. Note that if the number of measurable conductive particles 82 in one power supply line 85 is 9 or less, the average particle diameter of the conductive particles 82 is calculated using the particle diameters of the conductive particles 82 in the other power supply lines 85.

[0198] The power supply line 85 may be, for example, a flexible printed circuit board. The power supply line 85 has a base material 83, a metal wiring layer 84, and a ground layer (first ground layer) 86. Of these, the base material 83 includes a third surface 83a facing the first surface 11a of the substrate 11 of the wiring board 10, and a fourth surface 83b located on the opposite side of the third surface 83a. The base material 83 may include, for example, a resin material such as polyimide or fluororesin, or a liquid crystal polymer.

[0199] The dielectric dissipation factor of the substrate 83 may be 0.005 or less. Having the dielectric dissipation factor of the substrate 83 within the above range can reduce the gain loss (reduction in sensitivity) associated with the transmission and reception of electromagnetic waves, particularly when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency. The dielectric dissipation factor of the substrate 83 can be measured in accordance with IEC 62562, similar to the dielectric dissipation factor of the substrate 11. The dielectric dissipation factor of the substrate 83 is preferably 0.002 or less. Having the dielectric dissipation factor of the substrate 83 within the above range can reduce the gain loss (reduction in sensitivity) associated with the transmission and reception of electromagnetic waves, particularly when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high frequency.

[0200] The metal wiring layer 84 is disposed on the third surface 83a of the substrate 83. The metal wiring layer 84 may contain, for example, copper. The metal wiring layer 84 is disposed so as to face the power supply unit 40. A portion of the metal wiring layer 84 may be covered with a protective layer 84a (see FIG. 23). The protective layer 84a protects the metal wiring layer 84. Examples of materials that can be used for the protective layer 84a include acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate, modified resins thereof, copolymers thereof, polyvinyl resins such as polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, and polyvinyl butyral, copolymers thereof, polyurethane, epoxy resin, polyamide, and chlorinated polyolefin, and other colorless and transparent insulating resins. The metal wiring layer 84 is electrically connected to the power supply unit 40 via the conductive particles 82.

[0201] At least a part of the metal wiring layer 84 may be configured as a coplanar line, thereby improving the high frequency characteristics of the feeder line 85.

[0202] The ground layer (GND) 86 is disposed on the fourth surface 83b of the substrate 83. The ground layer 86 is, for example, a substantially rectangular conductive thin plate. The ground layer 86 may be made of, for example, a metal material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals. A portion of the ground layer 86 may be covered with a protective layer 86a (see FIG. 23). The protective layer 86a protects the ground layer 86. Examples of materials that can be used for the protective layer 86a include colorless and transparent insulating resins such as acrylic resins (e.g., polymethyl (meth)acrylate, polyethyl (meth)acrylate) and their modified resins and copolymers, polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral and their copolymers, polyurethane, epoxy resin, polyamide, and chlorinated polyolefin.

[0203] 23, the power supply line 85 is joined to the power supply portion 40 of the wiring substrate 10 via a joint 88. The length (distance in the Y direction) L of the joint 88 ７ The length L of the joint 88 is preferably 0.3 mm or more and 20 mm or less. ７ When the length L of the joint 88 is 0.3 mm or more, the adhesion between the power supply line 85 and the power supply part 40 can be improved. ７ By making the length L of the joint 88 20 mm or less, it is possible to prevent the power supply line 85 from protruding into the display area of ​​the display device 61, and the display area of ​​the display device 61 can be enlarged. ７ By keeping the distance 20 mm or less, it is possible to prevent the power feeder 85 from coming too close to the housing 62 (see FIG. 22 ), and to prevent a large load from being applied to the power feeder 85 due to bending of the power feeder 85. This reduces power loss in the power feeder 85. Note that in the illustrated example, the joint 88 is formed over the entire area of ​​the power feeder 40, but this is not limitative. For example, although not illustrated, the joint 88 may be formed over only a partial area of ​​the power feeder 40.

[0204] As shown in FIGS. 23 and 26 , it is preferable that the ground layer 86 of the power feed line 85 does not overlap the power supply unit 40 in a plan view. To ensure electrical connection, the area of ​​the joint 88 is relatively large. Therefore, if the ground layer 86 of the power feed line 85 is located so as to overlap the power supply unit 40 in a plan view, the impedance tends to decrease. As a result, it becomes difficult to achieve impedance matching between the power feed line 85 and the power supply unit 40, and the characteristics may deteriorate. In contrast, by locating the ground layer 86 of the power feed line 85 so as not to overlap the power supply unit 40 in a plan view, changes in impedance can be suppressed. Therefore, impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40, and deterioration of the electrical connectivity between the power feed line 85 and the power supply unit 40 can be suppressed.

[0205] In a plan view, the distance (distance in the Y direction) L between the ground layer 86 and the power supply unit 40 ８is preferably equal to or less than 0.05 times the wavelength of the electromagnetic waves received by the wiring board 10. This makes it possible to suppress the generation of noise even when unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply portion 40.

[0206] Furthermore, the distance L between the ground layer 86 and the power supply portion 40 along the thickness direction (Z direction) of the wiring board 10 is ９ (see FIG. 23) is preferably 0.005 to 0.1 times the wavelength of the electromagnetic wave received by the wiring board 10. ９ However, by setting the distance L to be 0.005 times or more the wavelength of the electromagnetic wave received by the wiring board 10, noise interference at the target wavelength can be suppressed, and the high frequency characteristics of the power feed line 85 can be improved. ９ However, since the wavelength is 0.1 times or less the wavelength of the electromagnetic waves received by the wiring board 10, the overall thickness of the image display device 60 can be reduced.

[0207] The thickness T of such a power supply line 85 ８ The thickness T of the power supply line 85 is preferably 15 μm or more and 250 μm or less. ８ When the thickness T of the power supply line 85 is 15 μm or more, it is possible to easily form the metal wiring layer 84 on the base material 83 of the power supply line 85. ８ When the thickness is 250 μm or less, the metal wiring layer 84 can be easily processed.

[0208] Here, the above-described joint portion 88 overlaps the decorative layer 74 in a plan view. ５ and the thickness T of the anisotropic conductive film (conductive member) 81 at the joint 88 １７ and the thickness T of the power supply line 85 ８ and the thickness T of the decorative layer 74 １９ The total thickness (T ５ +T １７ +T ８ +T １９ ) is the thickness T of the first transparent adhesive layer 95 ３ Below (T ５ +T １７ +T ８ +T １９ ≦T ３) is preferable. This makes it possible to prevent the substrate 11 of the wiring board 10 and the protective cover 75 from applying a load to the joint 88. Therefore, it is possible to reduce unnecessary power loss caused by the bending of the joint 88. In addition, the thickness T １７ refers to the distance from the surface of the power supply part 40 (positive side in the Z direction) to the back surface of the metal wiring layer 84 (negative side in the Z direction).

[0209] [Methods of Manufacturing Wiring Substrate, Module, and Laminate for Image Display Device] Next, with reference to the above-mentioned Figures 8A to 8F, 28A to 28C, and 29A to 29C, methods of manufacturing wiring substrate 10, module 80A, and laminate for image display device 70 according to this embodiment will be described. Figures 28A to 28C are cross-sectional views showing a method of manufacturing module 80A according to this embodiment. Figures 29A to 29C are cross-sectional views showing a method of manufacturing laminate for image display device 70 according to this embodiment.

[0210] First, the method for manufacturing a wiring board according to this embodiment will be described with reference to the above-mentioned FIGS. 8A to 8F.

[0211] First, as shown in FIG. 8A described above, a substrate 11 including a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a is prepared.

[0212] Next, the mesh wiring layer 20 and the power supply section 40 electrically connected to the mesh wiring layer 20 are formed on the first surface 11 a of the substrate 11 .

[0213] At this time, first, as shown in FIG. 8B described above, the metal foil 51 is laminated over substantially the entire area of ​​the first surface 11a of the substrate 11.

[0214] Next, as shown in FIG. 8C, a photo-curable insulating resist 52 is applied to almost the entire surface of the metal foil 51.

[0215] Subsequently, as shown in FIG. 8D, the insulating layer 54 is formed by photolithography.

[0216] Next, as shown in FIG. 8E described above, the metal foil 51 located on the first surface 11a of the substrate 11 in the portion not covered with the insulating layer 54 is removed.

[0217] Subsequently, as shown in FIG. 8F, the insulating layer 54 is removed.

[0218] In this manner, the wiring board 10 having the substrate 11 and the mesh wiring layer 20 provided on the first surface 11a of the substrate 11 is obtained.

[0219] Next, a method for manufacturing the module according to this embodiment will be described with reference to FIGS. 28A to 28C.

[0220] First, as shown in Fig. 28A, the wiring substrate 10 is prepared. At this time, the wiring substrate 10 is fabricated by, for example, the method shown in Figs. 8A to 8F.

[0221] Next, the power supply line 85 is electrically connected to the power supply unit 40 via an anisotropic conductive film 81 containing a plurality of conductive particles 82. At this time, the anisotropic conductive film 81 is first placed on the wiring substrate 10 as shown in FIG. 28B . At this time, the anisotropic conductive film 81 is placed so as to face the power supply unit 40.

[0222] 28C , the power supply line 85 is pressure-bonded to the wiring substrate 10. At this time, pressure and heat are applied to the power supply line 85, thereby pressure-bonding the power supply line 85 to the wiring substrate 10. The conductive particles 82 then come into contact with the power supply portion 40. The conductive particles 82 also come into contact with the metal wiring layer 84 of the power supply line 85. In this way, the power supply portion 40 and the power supply line 85 are joined to each other via the joint 88, and the power supply line 85 is electrically connected to the power supply portion 40.

[0223] In this way, a module 80A is obtained that includes the wiring substrate 10 and the power supply line 85 electrically connected to the power supply section 40 via the anisotropic conductive film 81 containing the conductive particles 82.

[0224] Next, a method for manufacturing the image display device 60 according to this embodiment will be described with reference to FIGS. 29A to 29C.

[0225] Next, the first transparent adhesive layer 95, the wiring substrate 10 of the module 80A, and the second transparent adhesive layer 96 are laminated together. At this time, as shown in FIG. 29A , first, an OCA sheet 90 is prepared, which includes, for example, a polyethylene terephthalate (PET) release film 91 and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. At this time, the OCA layer 92 may be a layer formed by applying a liquid curable adhesive layer composition containing a polymerizable compound onto the release film 91 and curing the composition using, for example, ultraviolet (UV) light. This curable adhesive layer composition contains a polar group-containing monomer.

[0226] 29B, the OCA layer 92 of the OCA sheet 90 is attached to the wiring board 10. As a result, the wiring board 10 is sandwiched between the OCA layers 92.

[0227] Next, as shown in Figure 29C, the release film 91 is peeled off and removed from the OCA layer 92 of the OCA sheet 90 attached to the wiring board 10, thereby obtaining a first transparent adhesive layer 95 (OCA layer 92), wiring board 10 and second transparent adhesive layer 96 (OCA layer 92) laminated together.

[0228] Thereafter, a decorative film as the decorative layer 74 and a protective cover 75 are laminated on the first transparent adhesive layer 95 .

[0229] In this way, a laminate 70 for an image display device is obtained, which includes the first transparent adhesive layer 95, the second transparent adhesive layer 96, and the module 80A including the wiring substrate 10.

[0230] Then, by stacking a display device 61 on the laminate 70 for an image display device, an image display device 60 is obtained, which comprises the laminate 70 for an image display device and the display device 61 stacked on the laminate 70 for an image display device.

[0231] [Operation of the Present Embodiment] Next, the operation of the present embodiment configured as described above will be described.

[0232] 22 and 23 , the wiring substrate 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring substrate 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring substrate 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40 and the power supply line 85. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0233] According to this embodiment, the power supply line 85 is electrically connected to the power supply unit 40 via an anisotropic conductive film (conductive member) 81 containing conductive particles 82. The ground layer 86 of the power supply line 85 does not overlap the power supply unit 40 in a plan view. This makes it possible to suppress changes in impedance. This makes it easy to achieve impedance matching between the power supply line 85 and the power supply unit 40, and suppresses deterioration of the electrical connectivity between the power supply line 85 and the power supply unit 40.

[0234] Furthermore, according to this embodiment, the wiring substrate 10 includes a substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The substrate 11 is transparent. The mesh wiring layer 20 has a conductor portion as a forming portion of an opaque conductive layer and a mesh pattern formed by numerous openings. This ensures the transparency of the wiring substrate 10. As a result, when the wiring substrate 10 is placed on a display device 61, the display device 61 can be seen through the openings 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not obstructed.

[0235] Furthermore, according to this embodiment, the base end side portion (transmission portion) 20a of the mesh wiring layer 20 constitutes a coplanar line, which can improve the high frequency characteristics of the mesh wiring layer 20.

[0236] Furthermore, according to this embodiment, at least a part of the metal wiring layer 84 of the feeder line 85 constitutes a coplanar line, thereby improving the high frequency characteristics of the feeder line 85.

[0237] Furthermore, according to this embodiment, a gap G is formed between the power supply line 85 and the protective cover 75 in the region overlapping the power supply part 40 in a plan view, which can reduce dielectric loss and further improve transmission characteristics.

[0238] Furthermore, according to the present embodiment, the conductor layer 61a does not overlap the power supply portion 40 of the wiring board 10 in a plan view. This further suppresses changes in impedance. This makes it easier to achieve impedance matching between the power supply line 85 and the power supply portion 40, and suppresses deterioration of the electrical connectivity between the power supply line 85 and the power supply portion 40.

[0239] Next, a modified example of the image display device will be described.

[0240] Fig. 30 shows a first modified example of an image display device. The modified example shown in Fig. 30 differs in that the mesh wiring layer 20 is disposed on the second surface 11b of the substrate 11, but other configurations are substantially the same as the embodiment shown in Figs. 22 to 29C described above. In Fig. 30, the same parts as those in the embodiment shown in Figs. 22 to 29C are designated by the same reference numerals, and detailed description thereof will be omitted.

[0241] 30 , the mesh wiring layer 20 is disposed on the second surface 11b of the substrate 11 of the wiring substrate 10. In this case, the third surface 83a of the power supply line 85 may face the second surface 11b of the substrate 11 of the wiring substrate 10. In the example shown in FIG. 30 , the conductor layer 61a of the display device 61 does not overlap the power supply unit 40 in a plan view.

[0242] In this modification, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a plan view. In this case, the ground layer 86 is provided so as to cover the entire power supply unit 40 in a plan view. Although not shown, the ground layer 86 may be provided so as to cover only a part of the power supply unit 40 in a plan view.

[0243] In this modification, the conductor layer 61a does not overlap the power supply portion 40 of the wiring board 10 in a plan view, so that impedance matching can be easily achieved between the power supply line 85 and the power supply portion 40. This makes it possible to prevent a decrease in electrical connectivity between the power supply line 85 and the power supply portion 40.

[0244] Furthermore, according to this modification, the ground layer 86 of the power feed line 85 overlaps the power feed unit 40 in a plan view. This allows the high-frequency characteristics of the power feed line 85 to be improved even when the conductor layer 61 a of the display device 61 is arranged so as not to overlap the power feed unit 40 in a plan view.

[0245] 31 , the ground layer (first ground layer) 86 of the power feed line 85 does not have to overlap the power supply unit 40 in plan view. Even in this case, impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40. This makes it possible to prevent a decrease in electrical connectivity between the power feed line 85 and the power supply unit 40.

[0246] 32, the conductor layer 61a of the display device 61 may overlap the power supply unit 40 in a planar view. In this case, the conductor layer 61a is provided to cover the entire power supply unit 40 in a planar view. Although not shown, the conductor layer 61a may also be provided to cover only a portion of the power supply unit 40 in a planar view. Furthermore, the ground layer (first ground layer) 86 of the power supply line 85 may not overlap the power supply unit 40 in a planar view. Even in this case, since the ground layer 86 of the power supply line 85 does not overlap the power supply unit 40 in a planar view, impedance matching can be easily achieved between the power supply line 85 and the power supply unit 40. This prevents a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40. Furthermore, the high-frequency characteristics of the power supply line 85 can be improved.

[0247] Figures 33 and 34 show a laminate for an image display device according to a second modified example of the image display device, and the second modified example of the image display device. The modified example shown in Figures 33 and 34 differs in that the laminate for an image display device 70 includes a ground layer (second ground layer) 98 bonded to the substrate 11 of the wiring board 10 via a second transparent adhesive layer 96, but the other configurations are substantially the same as those of the embodiment shown in Figures 22 to 32 described above. In Figures 33 and 34, the same parts as those of the embodiment shown in Figures 22 to 32 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0248] In the laminate 70 for the image display device shown in Figures 33 and 34, the laminate 70 for the image display device has a ground layer (second ground layer) 98 adhered to the substrate 11 of the wiring board 10 via a second transparent adhesive layer 96.

[0249] The ground layer (GND) 98 is provided on the negative side in the Z direction of the second transparent adhesive layer 96. In this case, the ground layer 98 is disposed on the light-emitting surface 64 side (positive side in the Z direction) of the display device 61. The ground layer 98 is made of, for example, a substantially rectangular conductive thin plate member. The material of the ground layer 98 can be, for example, a metal material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals.

[0250] 33 and 34 , in this modification, the ground layer 98 overlaps the power supply portion 40 of the wiring board 10 in a plan view. This allows the high-frequency characteristics of the power supply line 85 to be improved even when the ground layer 86 of the power supply line 85 is arranged so as not to overlap the power supply portion 40 in a plan view. In this case, the ground layer 98 is arranged so as to cover the entire power supply portion 40 in a plan view. Although not shown, the ground layer 98 may also be arranged so as to cover only a portion of the power supply portion 40 in a plan view.

[0251] Furthermore, the ground layer 98 is provided so as to cover only a partial area of ​​the substrate 11 of the wiring board 10 in a plan view. In this case, the ground layer 98 may be provided so as not to overlap the ground layer 86 of the power supply line 85 in a plan view.

[0252] In this modification, the thickness T of the second transparent adhesive layer 96 described above is also ４ The thickness T of the second transparent adhesive layer 96 is preferably 20 μm or more. ４ By making the thickness 20 μm or more, the distance from the power feed line 85 to the ground layer (second ground layer) 98 can be increased, thereby improving the high frequency characteristics of the power feed line 85.

[0253] According to this modification, the ground layer 98 of the laminate 70 for an image display device overlaps the power supply unit 40 in a plan view. This allows the high-frequency characteristics of the power supply line 85 to be improved even when the ground layer 86 of the power supply line 85 is arranged so as not to overlap the power supply unit 40 in a plan view. Also in this modification, the ground layer 86 of the power supply line 85 is arranged so as not to overlap the power supply unit 40 in a plan view, so that impedance matching can be easily achieved between the power supply line 85 and the power supply unit 40. This makes it possible to suppress a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40.

[0254] 35 , in the wiring board 10, the mesh wiring layer 20 may be disposed on the second surface 11b of the substrate 11 of the wiring board 10. Even in this case, the ground layer 98 of the laminate 70 for an image display device overlaps the power supply unit 40 in a planar view, so that the high-frequency characteristics of the power supply line 85 can be improved even if the ground layer 86 of the power supply line 85 is arranged so as not to overlap the power supply unit 40 in a planar view. Furthermore, because the ground layer 86 of the power supply line 85 does not overlap the power supply unit 40 in a planar view, impedance matching can be easily achieved between the power supply line 85 and the power supply unit 40, and a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed.

[0255] Figures 36 and 37 show a laminate for an image display device and the third modified example of an image display device. The modification shown in Figures 36 and 37 differs in that, in plan view, the ground layer 98 of the laminate 70 for an image display device does not overlap the power supply section 40, but other configurations are substantially the same as the embodiment shown in Figures 22 to 35 described above. In Figures 36 and 37, the same parts as those shown in Figures 22 to 35 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0256] In the laminate 70 for an image display device shown in FIGS. 36 and 37, the ground layer (second ground layer) 98 does not overlap the power supply section 40 in plan view.

[0257] In a plan view, the distance (distance in the Y direction) L between the ground layer 98 and the power supply unit 40 １２ is preferably equal to or less than 0.05 times the wavelength of the electromagnetic waves received by the wiring board 10. This makes it possible to suppress the generation of noise even when unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply portion 40.

[0258] The distance L between the ground layer 98 and the power supply portion 40 along the thickness direction (Z direction) of the wiring board 10 is １１ (see FIG. 37) is preferably 0.005 to 0.1 times the wavelength of the electromagnetic wave received by the wiring board 10. １１ However, by setting the distance L to be 0.005 times or more the wavelength of the electromagnetic wave received by the wiring board 10, noise interference at the target wavelength can be suppressed, and the high frequency characteristics of the power feed line 85 can be improved. １１ However, since the wavelength is 0.1 times or less the wavelength of the electromagnetic waves received by the wiring board 10, the overall thickness of the image display device 60 can be reduced.

[0259] In this modification, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a plan view. In this case, the ground layer 86 is provided so as to cover the entire power supply unit 40 in a plan view. Although not shown, the ground layer 86 may be provided so as to cover only a part of the power supply unit 40 in a plan view.

[0260] According to this modification, the ground layer 98 of the laminate 70 for an image display device does not overlap the power supply unit 40 in plan view. Even in this case, it is possible to suppress changes in impedance and easily achieve impedance matching between the power supply line 85 and the power supply unit 40. Therefore, it is possible to suppress deterioration in electrical connectivity between the power supply line 85 and the power supply unit 40.

[0261] Furthermore, according to this modification, the ground layer 86 of the power feed line 85 overlaps the power feed section 40 in a plan view. This allows the high-frequency characteristics of the power feed line 85 to be improved even when the ground layer 98 of the image display device laminate 70 is provided so as not to overlap the power feed section 40 in a plan view.

[0262] 38 , the ground layer (first ground layer) 86 of the power feed line 85 does not have to overlap the power supply unit 40 in plan view. Even in this case, impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40. This makes it possible to prevent a decrease in electrical connectivity between the power feed line 85 and the power supply unit 40.

[0263] 39 and 40 , in the wiring board 10, the mesh wiring layer 20 may be disposed on the second surface 11b of the substrate 11 of the wiring board 10. In this case, as shown in FIG. 39 , the ground layer (first ground layer) 86 of the power feed line 85 may overlap the power feed unit 40 in a planar view. In this case, the ground layer 86 may be provided so as to cover the entire power feed unit 40 in a planar view, or the ground layer 86 may be provided so as to cover only a partial area of ​​the power feed unit 40 in a planar view. Furthermore, as shown in FIG. 40 , the ground layer (first ground layer) 86 of the power feed line 85 does not have to overlap the power feed unit 40 in a planar view. Even in these cases, the ground layer 98 of the laminate 70 for an image display device does not overlap the power supply unit 40 in plan view, so impedance matching can be easily achieved between the power supply line 85 and the power supply unit 40, and deterioration of the electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed. Furthermore, as shown in Fig. 39 , when the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in plan view, the high-frequency characteristics of the power supply line 85 can be improved.

[0264] Fig. 41 shows a fourth modified example of the image display device. The modified example shown in Fig. 41 differs in that the mesh wiring layer 20 is disposed on the first surface 11a of the substrate 11 and that, in plan view, the ground layer 86 of the power supply line 85 overlaps the power supply unit 40, but the other configurations are substantially the same as those of the embodiment shown in Figs. 22 to 40 described above. In Fig. 41, the same parts as those of the embodiment shown in Figs. 22 to 40 are designated by the same reference numerals and detailed description thereof will be omitted.

[0265] 41 , the mesh wiring layer 20 is disposed on the first surface 11 a of the substrate 11 of the wiring substrate 10. In this modification, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a planar view. In this case, the ground layer 86 is provided so as to cover the entire power supply unit 40 in a planar view. Although not shown, the ground layer 86 may also be provided so as to cover only a partial area of ​​the power supply unit 40 in a planar view.

[0266] According to this modification, the ground layer 86 of the power feed line 85 overlaps the power supply unit 40 in a planar view. This allows the high-frequency characteristics of the power feed line 85 to be improved even when the conductor layer 61a of the display device 61 is arranged so as not to overlap the power supply unit 40 in a planar view. Also in this modification, the conductor layer 61a of the display device 61 is arranged so as not to overlap the power supply unit 40 in a planar view, so that impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40. This prevents a decrease in electrical connectivity between the power feed line 85 and the power supply unit 40.

[0267] Fig. 42 shows a fifth modified example of an image display device. The modification shown in Fig. 42 differs in that a ground layer 98 is provided so as to cover the entire substrate 11 of the wiring board 10 in a plan view, but other configurations are substantially the same as those of the embodiment shown in Figs. 22 to 41 described above. In Fig. 42, the same parts as those of the embodiment shown in Figs. 22 to 41 are given the same reference numerals, and detailed description thereof will be omitted.

[0268] 42 , the ground layer 98 is provided so as to cover the entire area of ​​the substrate 11 of the wiring board 10 in a plan view. In this case, the ground layer 98 may overlap the ground layer 86 of the power supply line 85 in a plan view.

[0269] In this modification, the ground layer 86 of the power feed line 85 does not overlap the power supply unit 40 in a plan view, so that impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40. This makes it possible to prevent a decrease in electrical connectivity between the power feed line 85 and the power supply unit 40.

[0270] Fig. 43 shows a laminate for an image display device according to a sixth modified example of the image display device. The modified example shown in Fig. 43 differs in that, in plan view, a ground layer (first ground layer) 86 overlaps with power supply unit 40, and the length of the area where ground layer 86 overlaps with power supply unit 40 along the Y direction (first direction) is 0.05 times or less the wavelength of the electromagnetic waves received by wiring board 10. The other configurations are substantially the same as those shown in Figs. 22 to 42 above. In Fig. 43, the same parts as those shown in Figs. 22 to 42 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0271] In the laminate 70 for an image display device shown in Fig. 43, the ground layer (first ground layer) 86 overlaps the power supply unit 40 in a plan view. The length L of the area where the ground layer 86 overlaps the power supply unit 40 along the Y direction (first direction) is ２０ is equal to or less than 0.05 times the wavelength of the electromagnetic wave received by the wiring board 10.

[0272] 43 , in this modification, conductor layer 61 a of display device 61 overlaps power supply unit 40 in plan view. Although not shown, conductor layer 61 a of display device 61 may be arranged so as not to overlap power supply unit 40 in plan view.

[0273] According to this modification, the ground layer (first ground layer) 86 overlaps the power supply unit 40 in a plan view. The length L of the area where the ground layer 86 overlaps the power supply unit 40 along the Y direction (first direction) is ２０ is 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. Even in this case, the change in impedance can be suppressed. Therefore, impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40, and a decrease in the electrical connectivity between the power feed line 85 and the power supply unit 40 can be suppressed. In addition, the length L along the Y direction (first direction) of the area where the ground layer 86 overlaps with the power supply unit 40 is ２０ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0274] 44, the laminate 70 for the image display device may include a ground layer (second ground layer) 98. In this case, as shown in FIG. 44, the ground layer (second ground layer) 98 may overlap the power supply unit 40 in a plan view, or, although not shown, the conductor layer 61a of the display device 61 may be provided so as not to overlap the power supply unit 40 in a plan view. In this case, the length L ２０ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0275] 45, the mesh wiring layer 20 may be disposed on the second surface 11b of the substrate 11 of the wiring board 10. In this case, the length L ２０ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0276] Furthermore, as shown in Fig. 46, the laminate 70 for the image display device may include a ground layer (second ground layer) 98. In this case, as shown in Fig. 46, the ground layer (second ground layer) 98 may overlap the power supply unit 40 in a plan view, or, although not shown, the conductor layer 61a of the display device 61 may be provided so as not to overlap the power supply unit 40 in a plan view. In this case, the length L ２０However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0277] Fig. 47 shows a laminate for an image display device according to a seventh modified example of the image display device. The modified example shown in Fig. 47 differs in that, in plan view, a ground layer (second ground layer) 98 overlaps with the power supply unit 40, and the length of the area where the ground layer 98 overlaps with the power supply unit 40 along the Y direction (first direction) is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board 10. The other configurations are substantially the same as those of the embodiment shown in Figs. 22 to 46 described above. In Fig. 47, the same parts as those of the embodiment shown in Figs. 22 to 46 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0278] 47, the ground layer (second ground layer) 98 overlaps the power supply unit 40 in a plan view. The length L of the area where the ground layer 98 overlaps the power supply unit 40 along the Y direction (first direction) is ２１ is equal to or less than 0.05 times the wavelength of the electromagnetic wave received by the wiring board 10.

[0279] 47 , in this modification, the ground layer (first ground layer) 86 of the power feed line 85 overlaps the power feed unit 40 in a plan view. Although not shown, the ground layer 86 of the power feed line 85 may be arranged so as not to overlap the power feed unit 40 in a plan view.

[0280] According to this modification, the ground layer (second ground layer) 98 overlaps the power supply unit 40 in a plan view. The length L of the area where the ground layer 98 overlaps the power supply unit 40 along the Y direction (first direction) is ２１is 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. Even in this case, the change in impedance can be suppressed. Therefore, impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40, and a decrease in the electrical connectivity between the power feed line 85 and the power supply unit 40 can be suppressed. In addition, the length L along the Y direction (first direction) of the region where the ground layer 98 overlaps with the power supply unit 40 is ２１ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0281] As shown in FIG. 48, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a plan view, and the length L of the area where the ground layer 86 overlaps the power supply unit 40 along the Y direction (first direction) is ２０ However, the length L may be 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. ２０ and length L ２１ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ and length L ２１ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0282] 49, the mesh wiring layer 20 may be disposed on the second surface 11b of the substrate 11 of the wiring board 10. In this case, the length L ２１ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２１However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0283] Furthermore, as shown in FIG. 50, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a plan view, and the length L along the Y direction (first direction) of the area where the ground layer 86 overlaps the power supply unit 40 is ２０ However, the length L may be 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. ２０ and length L ２１ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ and length L ２１ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0284] Fig. 51 shows a laminate for an image display device according to an eighth modified example of the image display device. The modified example shown in Fig. 51 differs in that, in a plan view, a conductor layer (third ground layer) 61a of a display device 61 overlaps with a power supply unit 40, and the length of the region where the conductor layer 61a overlaps with the power supply unit 40 along the Y direction (first direction) is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board 10. The other configurations are substantially the same as those shown in Figs. 22 to 50 described above. In Fig. 51, the same parts as those shown in Figs. 22 to 50 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0285] 51, the conductor layer (third ground layer) 61a of the display device 61 overlaps the power supply unit 40 in a plan view. The length L of the area where the conductor layer 61a overlaps the power supply unit 40 along the Y direction (first direction) is ２２ is equal to or less than 0.05 times the wavelength of the electromagnetic wave received by the wiring board 10.

[0286] 51 , in this modification, the ground layer (first ground layer) 86 of the power feed line 85 overlaps the power feed unit 40 in a planar view. Although not shown, the ground layer 86 of the power feed line 85 may be arranged so as not to overlap the power feed unit 40 in a planar view.

[0287] According to this modification, the conductor layer (third ground layer) 61a overlaps the power supply portion 40 in a plan view. The length L of the area where the conductor layer 61a overlaps the power supply portion 40 along the Y direction (first direction) is ２２ is 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. Even in this case, the change in impedance can be suppressed. Therefore, impedance matching can be easily achieved between the power feed line 85 and the power supply unit 40, and a decrease in the electrical connectivity between the power feed line 85 and the power supply unit 40 can be suppressed. In addition, the length L along the Y direction (first direction) of the region where the conductor layer 61a overlaps with the power supply unit 40 is ２２ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0288] As shown in FIG. 52, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a plan view, and the length L of the area where the ground layer 86 overlaps the power supply unit 40 along the Y direction (first direction) is ２０ However, the length L may be 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. ２０ and length L ２２ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ and length L ２２ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0289] 53, the mesh wiring layer 20 may be disposed on the second surface 11b of the substrate 11 of the wiring board 10. In this case, the length L ２２ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２２ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0290] Furthermore, as shown in FIG. 54, the ground layer (first ground layer) 86 of the power supply line 85 overlaps the power supply unit 40 in a plan view, and the length L along the Y direction (first direction) of the area where the ground layer 86 overlaps the power supply unit 40 is ２０ However, the length L may be 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10. ２０ and length L ２２ However, by setting the length L to 0.05 times or less the wavelength of the electromagnetic wave received by the wiring board 10, it is possible to suppress the change in impedance. Therefore, it is possible to suppress the deterioration of the electrical connectivity between the power supply line 85 and the power supply part 40. ２０ and length L ２２ However, since the wavelength is 0.05 times or less of the electromagnetic waves received by the wiring board 10, noise can be suppressed even if unnecessary radiation of electromagnetic waves occurs from the power supply line 85 or the power supply section 40.

[0291] Figure 55 shows a laminate for an image display device according to a ninth modified example of the image display device. The modified example shown in Figure 55 differs in that the wiring substrate 10 further includes ground power supply portions 41 arranged on both sides of the power supply portion 40, but the other configurations are substantially the same as those shown in Figures 22 to 54 described above. In Figure 55, the same parts as those shown in Figures 22 to 54 are designated by the same reference numerals, and detailed descriptions thereof will be omitted.

[0292] In the image display device laminate 70 shown in FIG. 55 , the wiring substrate 10 further includes ground power feeders 41 arranged on both sides of the power feeder 40 in the X direction (second direction) perpendicular to the Y direction (first direction). The ground power feeders 41 are electrically connected to the power feeder 40. The ground power feeders 41 may also function as a ground layer (GND). The ground power feeders 41 are formed, for example, of a substantially rectangular conductive thin plate member. The ground power feeders 41 may be made of a metal material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals. Although not shown, the ground layer 86 of the power feeder line 85 and the conductor layer 61 a of the display device 61 may be arranged to overlap the ground power feeder 41 in a plan view.

[0293] According to this modification, wiring board 10 further includes ground power supply portions 41 arranged on both sides of power supply portion 40 in the X direction (second direction) perpendicular to the Y direction (first direction). This makes it possible to suppress noise generation even when unwanted electromagnetic radiation occurs from power supply line 85 or power supply portion 40.

[0294] In this embodiment, as in the first variant of the first embodiment, a dummy wiring layer 30 may be provided along the periphery of the mesh wiring layer 20 in the wiring substrate 10 (see Figures 11 and 12).

[0295] Also in this embodiment, as in the sixth variant of the first embodiment, the first directional wiring 21 and the second directional wiring 22 intersect at an angle (non-right angle), and each opening 23 may be formed in a diamond shape in plan view (see Figure 21).

[0296] It is also possible to combine the multiple components disclosed in the above-described embodiments and modifications as needed, or to delete some of the components disclosed in the above-described embodiments and modifications.

Claims

1. A laminate for an image display device comprising: a substrate including a first surface and a second surface opposite to the first surface; a wiring board having a mesh wiring layer disposed on the first surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; a power supply line electrically connected to the power supply portion; a first adhesive layer disposed on the first surface side of the substrate; and a second adhesive layer disposed on the second surface side of the substrate, the substrate being transparent; the power supply portion and the power supply line being joined to each other via a joint, the joint being located on the second adhesive layer side relative to the first surface in the area where the mesh wiring layer is disposed.

2. A laminate for an image display device comprising: a substrate including a first surface and a second surface located opposite the first surface; a wiring board having a mesh wiring layer disposed on the second surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; a power supply line electrically connected to the power supply portion; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the substrate is transparent; the power supply portion and the power supply line are joined to each other via a joint, and the joint is located on the second adhesive layer side of the second surface in the area where the mesh wiring layer is disposed.

3. A laminate for an image display device as described in claim 1, wherein the angle between the first surface in the region where the joint is formed and the first surface in the region where the mesh wiring layer is arranged is greater than or equal to 30° and less than 150°.

4. A laminate for an image display device as described in claim 2, wherein the angle between the second surface in the region where the joint is formed and the second surface in the region where the mesh wiring layer is arranged is greater than or equal to 30° and less than 150°.

5. A laminate for an image display device according to any one of claims 1 to 4, wherein the power supply line is electrically connected to the power supply section via an anisotropic conductive film, and the total thickness of the wiring board, the anisotropic conductive film, and the power supply line at the joint is 300 μm or less.

6. A laminate for an image display device according to any one of claims 1 to 4, wherein the tensile modulus of elasticity of the substrate is 0.5 GPa or more and 4.5 GPa or less.

7. A laminate for an image display device according to any one of claims 1 to 4, wherein the dielectric loss tangent of the substrate is 0.005 or less.

8. A laminate for an image display device as described in any one of claims 1 to 4, wherein the mesh wiring layer has a transmission section connected to the power supply section and a transceiver section connected to the transmission section, the transmission section constitutes a coplanar line, and at least a part of the transmission section or at least a part of the power supply section is bent.

9. A laminate for an image display device according to any one of claims 1 to 4, wherein the wiring board has a millimeter wave transmitting and receiving function, and the mesh wiring layer is configured as an array antenna.

10. An image display device comprising: a laminate for an image display device according to any one of claims 1 to 4; and a display device laminated on the laminate for an image display device.

11. The image display device according to claim 10, further comprising a housing that houses the laminate for the image display device and the display device therein, and the power supply line is fixed to the housing or the display device, and / or the wiring board is fixed to the housing.

12. A wiring board comprising a substrate including a first surface and a second surface located on the opposite side of the first surface, a mesh wiring layer disposed on the first surface of the substrate, and a power supply portion electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply portion via a conductive member, wherein the wiring board has an electromagnetic wave transmitting and receiving function, the substrate is transparent, the mesh wiring layer is configured as an electromagnetic wave transmitting and receiving portion, the mesh wiring layer and the power supply portion are arranged along a first direction, and the power supply line comprises: a base material including a third surface facing the first surface and a fourth surface located on the opposite side of the third surface, a metal wiring layer disposed on the third surface of the base material, and a first ground layer disposed on the fourth surface of the base material, a module in which, in a planar view, the first ground layer does not overlap the power supply portion, or, in a planar view, the first ground layer overlaps the power supply portion, and a length along the first direction of an area where the first ground layer overlaps the power supply portion is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring board.

13. A wiring board comprising a substrate including a first surface and a second surface located opposite to the first surface, a mesh wiring layer disposed on the second surface of the substrate, and a power supply portion electrically connected to the mesh wiring layer, and a power supply line electrically connected to the power supply portion via a conductive member, wherein the wiring board has an electromagnetic wave transmitting and receiving function, the substrate is transparent, the mesh wiring layer is configured as an electromagnetic wave transmitting and receiving portion, the mesh wiring layer and the power supply portion are disposed along a first direction, and the power supply line comprises: a base material including a third surface facing the second surface and a fourth surface located opposite to the third surface, a metal wiring layer disposed on the third surface of the base material, and a first ground layer disposed on the fourth surface of the base material, a module in which, in a planar view, the first ground layer does not overlap the power supply portion, or, in a planar view, the first ground layer overlaps the power supply portion, and a length along the first direction of an area where the first ground layer overlaps the power supply portion is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring board.

14. The module described in claim 12, wherein, in a planar view, the first ground layer does not overlap the power supply portion, and, in a planar view, the distance between the first ground layer and the power supply portion is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board.

15. The module described in claim 12, wherein the distance between the first ground layer and the power supply portion along the thickness direction of the wiring board is greater than or equal to 0.005 and less than or equal to 0.1 times the wavelength of the electromagnetic waves received by the wiring board.

16. The module described in claim 12, wherein the mesh wiring layer has a transmission section connected to the power supply section and a transceiver section connected to the transmission section, the power supply section, the transmission section and the transceiver section being arranged along the first direction, and the wiring board further has ground power supply sections arranged on both sides of the power supply section in a second direction perpendicular to the first direction.

17. The module according to claim 12, wherein at least a portion of the metal wiring layer of the power supply line constitutes a coplanar line.

18. The module according to claim 12, wherein the thickness of the power supply line is not less than 15 μm and not more than 250 μm.

19. The module according to claim 12, wherein the conductive member is an anisotropic conductive film, and the thickness of the anisotropic conductive film is not less than 3 μm and not more than 30 μm.

20. The module described in claim 12, wherein the mesh wiring layer is configured as a millimeter wave antenna, the substrate of the power supply line includes polyimide, fluororesin, or liquid crystal polymer, and the dielectric tangent of the substrate is 0.005 or less.

21. The module of claim 12, wherein the mesh wiring layer is configured as an antenna for 5G.

22. A laminate for an image display device comprising: a module according to any one of claims 12 to 21; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate.

23. A laminate for an image display device as described in claim 22, further comprising a protective cover adhered to the substrate via the first adhesive layer, wherein a gap is formed between the power supply line and the protective cover in a region overlapping the power supply section in a planar view.

24. A laminate for an image display device as described in claim 23, further comprising a decorative layer located between the protective cover and the first adhesive layer, the power supply section and the power supply line being joined to each other via a joint, the joint overlapping the decorative layer in a planar view, and the total thickness of the power supply section, the thickness of the conductive member at the joint, the thickness of the power supply line, and the decorative layer is less than or equal to the thickness of the first adhesive layer.

25. A laminate for an image display device as described in claim 22, further comprising a second ground layer adhered to the substrate via the second adhesive layer, the second ground layer overlapping the power supply section in a plan view.

26. A module comprising: a substrate including a first surface and a second surface located on the opposite side of the first surface; a wiring board having a mesh wiring layer disposed on the first surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; and a power supply line electrically connected to the power supply portion via a conductive member; a first adhesive layer located on the first surface side of the substrate; a second adhesive layer located on the second surface side of the substrate; and a second ground layer adhered to the substrate via the second adhesive layer; the wiring board has an electromagnetic wave transmitting and receiving function; the substrate is transparent; the mesh wiring layer is configured as an electromagnetic wave transmitting and receiving portion; the mesh wiring layer and the power supply portion are arranged along a first direction; a laminate for an image display device, wherein, in a planar view, the second ground layer does not overlap the power supply portion, or, in a planar view, the second ground layer overlaps the power supply portion, and a length along the first direction of an area where the second ground layer overlaps the power supply portion is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring board.

27. A laminate for an image display device as described in claim 26, wherein the power supply line has a base material including a third surface facing the first surface and a fourth surface located opposite the third surface, a metal wiring layer arranged on the third surface of the base material, and a first ground layer arranged on the fourth surface of the base material, and in a planar view, the first ground layer overlaps the power supply section.

28. A laminate for an image display device as described in claim 26, wherein, in a planar view, the second ground layer does not overlap the power supply section, and, in a planar view, the distance between the second ground layer and the power supply section is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board.

29. A laminate for an image display device as described in claim 26, wherein the distance between the second ground layer and the power supply section along the thickness direction of the wiring board is between 0.005 and 0.1 times the wavelength of the electromagnetic waves received by the wiring board.

30. A module comprising: a substrate including a first surface and a second surface located on the opposite side of the first surface; a wiring board having a mesh wiring layer disposed on the second surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; and a power supply line electrically connected to the power supply portion via a conductive member; a first adhesive layer located on the first surface side of the substrate; a second adhesive layer located on the second surface side of the substrate; and a second ground layer adhered to the substrate via the second adhesive layer; the wiring board has an electromagnetic wave transmitting and receiving function; the substrate is transparent; the mesh wiring layer is configured as an electromagnetic wave transmitting and receiving portion; the mesh wiring layer and the power supply portion are arranged along a first direction; a laminate for an image display device, wherein, in a planar view, the second ground layer does not overlap the power supply portion, or, in a planar view, the second ground layer overlaps the power supply portion, and a length along the first direction of an area where the second ground layer overlaps the power supply portion is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring board.

31. A laminate for an image display device as described in claim 30, wherein the power supply line has a base material including a third surface facing the second surface and a fourth surface located opposite the third surface, a metal wiring layer disposed on the third surface of the base material, and a first ground layer disposed on the fourth surface of the base material, and in a planar view, the first ground layer overlaps the power supply section.

32. A laminate for an image display device as described in claim 30, wherein, in a planar view, the second ground layer does not overlap the power supply section, and, in a planar view, the distance between the second ground layer and the power supply section is 0.05 times or less the wavelength of the electromagnetic waves received by the wiring board.

33. A laminate for an image display device as described in claim 30, wherein the distance between the second ground layer and the power supply section along the thickness direction of the wiring board is between 0.005 and 0.1 times the wavelength of the electromagnetic waves received by the wiring board.

34. The laminate for an image display device according to claim 26, wherein the second adhesive layer has a thickness of 20 μm or more and 200 μm or less.

35. The laminate for an image display device according to claim 26, wherein the conductive member is an anisotropic conductive film, and the thickness of the anisotropic conductive film is 3 μm or more and 30 μm or less.

36. An image display device comprising: a laminate for an image display device according to claim 22; and a display device laminated on said laminate for an image display device.

37. The image display device according to claim 36, wherein the display device has a third ground layer.

38. An image display device comprising: a laminate for an image display device according to any one of claims 26 to 35; and a display device laminated on said laminate for an image display device.

39. A laminate for an image display device, comprising: a display device laminated on the laminate for an image display device, wherein the laminate for an image display device comprises: a module including: a substrate including a first surface and a second surface located opposite to the first surface; a wiring board having a mesh wiring layer arranged on the first surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; and a power supply line electrically connected to the power supply portion via a conductive member; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the wiring board has an electromagnetic wave transmitting and receiving function; the substrate has transparency; the mesh wiring layer is configured as a transmitting and receiving portion of an electromagnetic wave; the mesh wiring layer and the power supply portion are arranged along a first direction; the power supply line comprises: a base including a third surface facing the first surface and a fourth surface located opposite to the third surface; a metal wiring layer arranged on the third surface of the base; and a first ground layer arranged on the fourth surface of the base, wherein the display device has a third ground layer, an image display device, in which, in a planar view, at least one of the first ground layer and the third ground layer does not overlap the power supply portion, or, in a planar view, at least one of the first ground layer and the third ground layer overlaps the power supply portion, and a length along the first direction of an area where at least one of the first ground layer and the third ground layer overlaps the power supply portion is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring board.

40. A laminate for an image display device, comprising: a display device laminated on the laminate for an image display device, wherein the laminate for an image display device comprises: a module including: a substrate including a first surface and a second surface located opposite to the first surface; a wiring board having a mesh wiring layer arranged on the second surface of the substrate and a power supply portion electrically connected to the mesh wiring layer; and a power supply line electrically connected to the power supply portion via a conductive member; a first adhesive layer located on the first surface side of the substrate; and a second adhesive layer located on the second surface side of the substrate, wherein the wiring board has an electromagnetic wave transmitting and receiving function; the substrate has transparency; the mesh wiring layer is configured as a transmitting and receiving portion of electromagnetic waves; the mesh wiring layer and the power supply portion are arranged along a first direction; the power supply line includes: a base including a third surface facing the second surface and a fourth surface located opposite to the third surface; a metal wiring layer arranged on the third surface of the base; and a first ground layer arranged on the fourth surface of the base; and the display device has a third ground layer, an image display device, in which, in a planar view, at least one of the first ground layer and the third ground layer does not overlap the power supply portion, or, in a planar view, at least one of the first ground layer and the third ground layer overlaps the power supply portion, and a length along the first direction of an area where at least one of the first ground layer and the third ground layer overlaps the power supply portion is 0.05 times or less the wavelength of an electromagnetic wave received by the wiring board.

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