Electronic device including shielding structure for electronic component

Abstract

An electronic device according to an embodiment may comprise an electronic component and a shield can including an opening facing the electronic component. The electronic device may comprise: a shielding structure on the shield can and covering the opening; and a heat conductive member which is attached to the electronic component, is in contact with the shielding structure through the opening, and is between the electronic component and the shielding structure. The electronic device may comprise a metal plate on the shielding structure and at least one heat dissipation member attached to the metal plate. The shielding structure may include a first shielding member attached to the shield can and a second shielding member attached to the first shielding member. The density of the first shielding member may be smaller than the density of the second shielding member.

Description

Electronic device comprising a shielding structure for electronic components

[0001] The various embodiments described below relate to electronic devices including a shielding structure for electronic components.

[0002] Small electronic devices, such as smartphones or tablet personal computers (PCs), may include electronic components to implement various functions. To reduce performance degradation of electronic components due to radio waves generated by the operation of these components, the electronic devices may include structures that shield the electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] In one embodiment, an electronic device may include a printed circuit board, an electronic component coupled to the printed circuit board, and a shield can on the printed circuit board, the shield can surrounding the electronic component and having an opening facing the electronic component. The electronic device may include a shielding structure on the shield can covering the opening, and a heat conducting member between the electronic component and the shielding structure, the heat conducting member being attached to the electronic component and in contact with the shielding structure through the opening. The electronic device may include a metal plate on the shielding structure, and at least one heat dissipation member attached to the metal plate and configured to receive at least a portion of heat emitted from the electronic component through the heat conducting member. The shielding structure may include a first shielding member attached to the shield can, a first adhesive member interposed between the first shielding member and the shield can to attach the first shielding member to the shield can, a second shielding member attached to the first shielding member, and a second adhesive member interposed between the first shielding member and the second shielding member to attach the second shielding member to the first shielding member. The density of the first shielding member may be lower than the density of the second shielding member.

[0005] In one embodiment, an electronic device may include a printed circuit board, an electronic component coupled to the printed circuit board, and a shield can on the printed circuit board, the shield can surrounding the electronic component and having an opening facing the electronic component. The electronic device may include a shielding structure on the shield can covering the opening, and a heat conducting member between the electronic component and the shielding structure, the heat conducting member being attached to the electronic component and in contact with the shielding structure through the opening. The electronic device may include a metal plate on the shielding structure, and at least one heat dissipation member attached to the metal plate and configured to receive at least a portion of heat emitted from the electronic component through the heat conducting member. The shielding structure may include a first shielding member attached to the shield can, a first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can, a second shielding member attached to the first shielding member, a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member, a protective member disposed on the second shielding member, and a groove recessed from the opening toward the metal plate for accommodating the heat conducting member penetrating the opening. A density of the first shielding member may be less than a density of the second shielding member.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0009] Figure 3a is a partial cross-sectional view of an exemplary electronic device.

[0010] Figure 3b illustrates a portion of an exemplary electronic device.

[0011] Figure 3c illustrates a shielding structure of an electronic component of an exemplary electronic device.

[0012] Figures 4a, 4b, 4c, 4d, and 4e are partial cross-sectional views of exemplary electronic devices.

[0013] Figures 5a and 5b are partial cross-sectional views of an exemplary electronic device.

[0014] Figure 6 is a partial cross-sectional view of an exemplary electronic device.

[0015] Figure 7 illustrates a bonding process of a shielding structure of an exemplary electronic device.

[0016] FIG. 8A illustrates an example of an unfolded state of an exemplary electronic device, according to one embodiment.

[0017] FIG. 8B illustrates an example of a folding state of an exemplary electronic device according to one embodiment.

[0018] FIG. 8C is an exploded view of an exemplary electronic device according to one embodiment.

[0019] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). According to one embodiment, at least one of these components (e.g., the connection terminal (178)) may be omitted, or one or more other components may be added to the electronic device (101). According to one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to one surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to another surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. According to one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0043] Referring to FIG. 2A, an electronic device (101) according to one embodiment may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0044] An electronic device (101) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0045] An electronic device (101) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0046] An electronic device (101) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a back plate (211) to form at least a portion of a side surface (200C) of the electronic device (101). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (101), or, for another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (101) together with the front plate (202) and / or the back plate (211).

[0047] Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (101) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that extends seamlessly from its edge toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0048] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0049] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (not shown) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)) or may additionally include other components.

[0050] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0051] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0052] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (101)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed straight ahead, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed straight ahead, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the front surface (200A) (or the front plate (202)).

[0053] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0054] In one embodiment, the display (201) may include an area where a first camera (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0055] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0056] According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0057] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0058] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212). However, the present invention is not limited thereto.

[0059] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (101). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0060] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole (not shown). For example, the speaker may include a piezo speaker configured to output audio by vibrating a diaphragm within the speaker using a piezoelectric element, but is not limited thereto.

[0061] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0062] According to one embodiment, the camera module (205, 212) may include a first camera (205) positioned to face the front (200A) of the electronic device (101), and a second camera (212) positioned to face the rear (200B).

[0063] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0064] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0065] In one embodiment, the electronic device (101) may include a flash (213) positioned to face the rear (200B). According to one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be positioned on one side of the electronic device (101).

[0066] According to one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (201).

[0067] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0068] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0069] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0070] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0071] Referring to FIG. 2B, an electronic device (101) according to one embodiment may include a display (201), a front plate (202), a rear plate (211), a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., battery (189) of FIG. 1).

[0072] In one embodiment, the frame structure (240) may include a side bezel structure (218) forming an exterior of the electronic device (101) (e.g., side surface (200C) of FIG. 2A) and a support structure (243) extending inwardly from the side bezel structure (218). In one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). In one embodiment, the side bezel structure (218) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support structure (243) of the frame structure (240) may extend from the side bezel structure (218) within the space.

[0073] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support structure (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) can be mounted in recesses defined by the side bezel structure (218) and / or the support structure (243) of the frame structure (240).

[0074] According to one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0075] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -z direction.

[0076] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). Through this, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0077] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0078] According to one embodiment, the display (201) may be disposed between a frame structure (240) and a front plate (202). For example, the front plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0079] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0080] According to one embodiment, the front plate (202) may be coupled with the frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side bezel structure (218)). However, the present invention is not limited to the above-described example.

[0081] According to one embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a nonvolatile memory (e.g., the nonvolatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0082] In one embodiment, the battery (270) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0083] An electronic device (101) according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0084] According to one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support structure (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 1).

[0085] In one embodiment, the second camera (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

[0086] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 1). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0087] According to one embodiment, the housing (e.g., the housing (210) of FIG. 2A) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0088] Figure 3a is a partial cross-sectional view of an exemplary electronic device. Figure 3b illustrates a portion of the exemplary electronic device. Figure 3c illustrates a shielding structure of electronic components of the exemplary electronic device.

[0089] Referring to FIGS. 3A, 3B, and 3C, the electronic device (101) may include a printed circuit board (310) (e.g., the first printed circuit board (250), the second printed circuit board (252) of FIG. 2B), an electronic component (301), a shield can (320), a shielding structure (330), a heat conducting member (340), a metal plate (350), and / or at least one heat dissipating member (360). Hereinafter, the combination of the metal plate (350) and the at least one heat dissipating member (360) may be referred to as a heat dissipating structure. That is, the electronic device (101) may include a printed circuit board (310) (e.g., the first printed circuit board (250) and the second printed circuit board (252) of FIG. 2B), an electronic component (301), a shield can (320), a shielding structure (330), a heat conducting member (340), and a heat dissipation structure. The heat dissipation structure may include a metal plate (350) and / or at least one heat dissipation member (360).

[0090] According to one embodiment, the electronic component (301) may be coupled to a printed circuit board (310). For example, the electronic component (301) may be disposed on the printed circuit board (310). For example, the electronic component (301) may be mounted on the printed circuit board (310). For example, the electronic component (301) may be electrically connected to the printed circuit board (310). For example, the electronic component (301) may be disposed on one surface of the printed circuit board (310) facing the display (e.g., the display (201) of FIG. 2A). For convenience of explanation, the surface on which the printed circuit board (310) is disposed may be referred to as an upper surface of the printed circuit board (310). For example, the electronic component (301) may be powered from a power management module (e.g., power management module (188) of FIG. 1) and / or a battery (e.g., battery (189) of FIG. 1) of the electronic device (101) via a printed circuit board (310).

[0091] For example, the electronic component (301) may be referred to as a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1). The electronic component (301) may emit heat while the electronic device (101) operates. The electronic component (301) may emit electromagnetic waves while the electronic device (101) operates. The electronic device (101) may require a structure to reduce the effect of other electronic components around the electronic component (301) malfunctioning or deteriorating the performance of the other electronic components due to the heat and / or electromagnetic waves emitted from the electronic component (301). Although it has been described that the electronic component (301) may be the processor (120) of the electronic device (101), it is not limited thereto. The electronic component (301) may be referred to as a heating element within the electronic device (101) configured to emit heat or electromagnetic waves while the electronic device (101) is operating. That is, the electronic component (301) may be any component that emits electromagnetic radiation and / or heat.

[0092] According to one embodiment, the shield can (320) may be placed on a printed circuit board (310). The shield can (320) may surround (or enclose) the electronic component (301). The shield can (320) may include an opening (325) facing the electronic component (301). That is, the shield can (320) may surround or enclose the electronic component (301) except for the opening (325). For example, the shield can (320) may be coupled to the printed circuit board (310). For example, the shield can (320) may be connected to the printed circuit board (310). For example, the shield can (320) may be attached to the printed circuit board (310). For example, the shield can (320) may be mounted on the printed circuit board (310) via at least one component (e.g., solder) between the shield can (320) and the printed circuit board (310). For example, the shield can (320) may be welded on the printed circuit board (310).

[0093] For example, the shield can (320) may be placed on one surface (e.g., the upper surface) of the printed circuit board (310) on which the electronic component (301) is placed. For example, the shield can (320) may shield at least a portion of the electronic component (301). For example, the shield can (320) may cover at least a portion of the electronic component (301). For example, the shield can (320) may surround at least a portion of the electronic component (301). For example, the shield can (320) may separate the electronic component (301) from other electronic components (302) mounted on the printed circuit board (310) around the electronic component (301).

[0094] Although the shield can (320) is described as surrounding the electronic component (301), it is not limited thereto. The shield can (320) can surround a plurality of electronic components including the electronic component (301). By surrounding the plurality of electronic components, the shield can (320) can be distinguished from the plurality of electronic components and separate a plurality of other electronic components including other electronic components (302) around the electronic component (301) from the plurality of electronic components.

[0095] For example, the shield can (320) can be connected to the ground within the electronic device (101). For example, the shield can (320) can be electrically connected to the ground of the electronic device (101) through the printed circuit board (310). By being connected to the ground, the shield can (320) can emit electromagnetic waves emitted from the electronic component (301) to the ground. That is, the electromagnetic waves (or noise) emitted from the electronic component (301) can be transmitted to the ground through the shield can (320). By emitting the electromagnetic waves to the ground, the shield can reduce degradation of the performance of other electronic components (302) around the electronic component (301) due to the electromagnetic waves. That is, the shield can (320) can prevent electromagnetic waves (or noise) emitted from electronic components from reaching other electronic components (302).

[0096] For example, the opening (325) can penetrate the shield can (320). That is, the opening (325) can be an opening in a plane of the shield can (320) that is substantially parallel to a plane of the printed circuit board (310). For example, the opening (325) can face the printed circuit board (310). For example, the opening (325) can be formed in a part of the shield can (320) that faces the electronic component (301). For example, the opening (325) can overlap the electronic component (301) when the printed circuit board (310) is viewed from above (e.g., when viewed in the -z direction). That is, the opening (325) can overlap the electronic component (301) in a direction perpendicular to the upper surface of the printed circuit board (310). For example, the opening (325) can allow a heat-conducting member (340) attached to the electronic component (301) to pass through. That is, the heat-conducting member (340) attached to the electronic component (301) can be positioned and configured so that at least a portion of the heat-conducting member (340) passes through the opening (325) of the shield can (320). For example, the opening (325) can be a path for at least a portion of the heat emitted from the electronic component (301) to be emitted through the heat-conducting member (340) attached to the electronic component (301). That is, the heat emitted from the electronic component (301) can be transferred to the outside of the space surrounded by the shield can (320) through the heat-conducting member (340) disposed in the opening (325). Since the shield can (320) includes the opening (325) for dissipating the heat from the electronic component (301), the shield can (320) may be required to have a structure for shielding electromagnetic waves that are emitted from the electronic component (301) and pass through the opening (325).That is, by including an opening (325) in the shield can (320) to transfer heat to the outside of the space surrounded by the shield can (320), the efficiency of the shield can (320) in shielding other electronic components (302) from electromagnetic waves (or noise) emitted by the electronic component (301) may be reduced. Therefore, a shielding structure (330) may be additionally included.

[0097] In one embodiment, the shielding structure (330) may be disposed on the shield can (320). The shielding structure (330) may cover the opening (325) of the shield can (320). For example, the shielding structure (330) may be attached to the shield can (320). For example, the shielding structure (330) may be electrically connected to the shield can (320). For example, at least a portion of the shielding structure (330) may be in contact with the shield can (320). For example, the shielding structure (330) may be disposed between the shield can (320) and the metal plate (350).

[0098] For example, at least a portion of the shielding structure (330) may overlap with the opening (325) of the shield can (320) when the shielding structure (330) is viewed from above (e.g., when viewed in the -z direction). That is, at least a portion of the shielding structure (330) may overlap with the opening (325) in a direction perpendicular to the upper surface of the printed circuit board (310). For example, at least a portion of the shielding structure (330) may face the opening of the shield can (320). For example, at least a portion of the shielding structure (330) may contact the thermally conductive member (340) that has passed through the opening of the shield can (320). That is, one end (or surface) of the thermally conductive member (340) may be attached to the electronic component (301), and the opposite end (or surface) may be attached to the electronic component (301) by passing through the opening (325). For example, at least a portion of the shielding structure (330) may face the electronic component (301) through the opening (325) of the shield can (320). For example, at least a portion of the shielding structure (330) may face at least a portion of the printed circuit board (310) through the opening (325) of the shield can (320). For example, the shielding structure (330) may seal the space between the shield can (320) and the printed circuit board (310) by covering the opening (325) of the shield can (320). That is, the combination of the shield can (320) and the shielding structure (330) may completely surround the space around the electronic component (301). For example, the shielding structure (330) may include a conductive material. Since the above shielding structure (330) covers the opening (325) of the shield can (320), electromagnetic waves emitted from the electronic component (301) through the opening (325) can be reflected by the shielding structure (330) or transmitted through the shielding structure (330) to the shield can (320) that is in contact with the shielding structure (330).The electromagnetic wave transmitted to the shield can (320) through the shield structure (330) can be emitted to the ground of the electronic device (101) connected to the shield can (320). The electronic device (101) can provide a heat transfer path for heat dissipation of the electronic component (301) and shield the electromagnetic wave passing through the opening (325) by including the shield structure (330) covering the opening (325).

[0099] According to one embodiment, a thermally conductive member (340) may be attached to an electronic component (301). The thermally conductive member (340) may be disposed between the electronic component (301) and a shielding structure (330). The thermally conductive member (340) may be in contact with the shielding structure (330) through an opening (325) of the shield can (320). For example, the thermally conductive member (340) may be attached to the electronic component (301). For example, the thermally conductive member (340) may be in contact with the electronic component (301) and the shielding structure (330). For example, the thermally conductive member (340) may transfer at least a portion of the heat emitted from the electronic component (301) to the shielding structure (330). For example, the thermally conductive member (340) can transfer at least a portion of the heat emitted from the electronic component (301) to the shielding structure (330) and / or the metal plate (350) on the thermally conductive member (340) through conduction heat transfer. For example, the thermally conductive member (340) can be supported by the electronic component (301). For example, the thermally conductive member (340) can be fastened between the shielding structure (330) and the electronic component (301) by being attached to the shielding structure (330).

[0100] For example, the thermally conductive member (340) can penetrate at least a portion of the opening (325) of the shield can (320). For example, the thermally conductive member (340) can be attached to a shielding structure (330) that covers the opening (325) by passing through the opening (325). For example, the thermally conductive member (340) can provide a path for heat emitted from the electronic component (301) to be transferred to the shielding structure (330) through the opening (325). For example, the thermally conductive member (340) can extend from the electronic component (301) through the opening (325) to the shielding structure (330). For example, the thermally conductive member (340) can include a material having a relatively high thermal conductivity. The thermally conductive member (340) may be referred to as a TIM (thermal interface material) in that it is interposed between the electronic component (301) and the shielding structure (330), but is not limited thereto. The electronic device (101) includes the thermally conductive member (340) configured to dissipate at least a portion of the heat emitted from the electronic component (301) through the opening (325) of the shielding can (320) to the shielding structure (330) and / or the metal plate (350), thereby reducing degradation of the performance of the electronic component (301) surrounded by the shielding can (320) due to the heat emitted from the electronic component (301).

[0101] In one embodiment, the heat dissipation structure may be disposed on the shielding structure (330). For example, a metal plate (350) or at least one heat dissipation member (360) may be disposed on the shielding structure (330) (e.g., in the z-axis direction). For example, the metal plate (350) may be attached to the shielding structure (330). For example, the metal plate (350) may be attached to the shielding can (320) via the shielding structure (330). For example, the metal plate (350) may support the shielding structure (330). For example, the metal plate (350) may support the shielding can (320) via the shielding structure (330). For example, the metal plate (350) can support the printed circuit board (310) and / or the electronic component (301) on which the shield can (320) is placed by supporting the shield structure (330) and / or the shield can (320). For example, the metal plate (350) can receive at least a portion of the heat emitted from the electronic component (301) through the heat conducting member (340) and the shield structure (330). The metal plate (350) can reduce the performance degradation of the electronic component (301) and / or the display (201) on the metal plate (350) due to the heat by diffusing at least a portion of the received heat. According to one embodiment, the metal plate (350) may be referred to as a structure (e.g., a support structure (243) of FIG. 2B) that forms at least a portion of a frame structure (e.g., a frame structure (240) of FIG. 2B) for supporting a display (201) of an electronic device (101), but is not limited thereto. For example, referring also to FIG. 2B, the metal plate (350) may be a structure (e.g., a cover plate (260)) that supports a rear plate (211) opposite to the display (201).An electronic component (301), a shield can (320), and a shielding structure (330) may be arranged on one side of a printed circuit board (310) facing the rear plate (211). Heat emitted from the electronic component (301) may be transferred to the metal plate (350) supporting the rear plate (211) through the heat conducting member (340) and the shielding structure (330).

[0102] For example, the metal plate (350) may include a first side (351) facing the shield can (320) and a second side (352) opposite to the first side (351). For example, the second side (352) may be a side facing the display (201) of the electronic device (101). For example, the first side (351) may be a side that presses the shielding structure (330) toward the shield can (320). By including the metal plate (350), the electronic device (101) may reduce the separation of the shielding structure (330) from the shield can (320) and reduce performance degradation of the electronic component (301) and / or the display (201) due to heat emitted from the electronic component (301).

[0103] According to one embodiment, at least one heat dissipation member (360) may be attached to the metal plate (350). The at least one heat dissipation member (360) may be configured to receive at least a portion of the heat emitted from the electronic component (301) through the heat conducting member (340). For example, the at least one heat dissipation member (360) may cover at least a portion of the metal plate (350). For example, the at least one heat dissipation member (360) may be in contact with the metal plate (350). For example, the at least one heat dissipation member (360) may be attached to a second surface (352) of the metal plate (350). The at least one heat dissipation member (360) can reduce the performance degradation of the electronic component (301) and / or the display (201) on the at least one heat dissipation member (360) due to the heat by dissipating at least a portion of the heat emitted from the electronic component (301) together with the metal plate (350).

[0104] According to one embodiment, the electronic device (101) may further include an insulating member (370). The insulating member (370) may be attached to the metal plate (350). The insulating member (370) may overlap the electronic component (301) when the metal plate (350) is viewed from above (e.g., when viewed in the -z direction). That is, the insulating member (370) may overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310). For example, the insulating member (370) may be disposed on the electronic component (301). For example, the electronic device (101) may include the insulating member (370) disposed on the electronic component (301) and having relatively low thermal conductivity, thereby reducing degradation of the performance of the display (201) disposed on the metal plate (350) due to heat emitted from the electronic component (301). According to one embodiment, the insulating member (370) may be surrounded by at least one heat dissipation member (360). The at least one heat dissipation member (360) and the insulating member (370) for dissipating and insulating heat emitted from the electronic component (301) will be described later with reference to FIGS. 4A to 6.

[0105] According to one embodiment, the shielding structure (330) may include a first shielding member (331), a second shielding member (332), a first adhesive member (333), and a second adhesive member (334). The first shielding member (331) may be attached to a shield can (320). The first adhesive member (333) may be interposed between the first shielding member (331) and the shield can (320) to attach the first shielding member (331) to the shield can (320). The second shielding member (332) may be attached to the first shielding member (331). The second adhesive member (334) may be interposed between the first shielding member (331) and the second shielding member (332) to attach the second shielding member (332) to the first shielding member (331). In one embodiment, the density (d1) of the first shielding member (331) may be less than the density (d2) of the second shielding member (332).

[0106] For example, the first shielding member (331) may be disposed between the shield can (320) and the second shielding member (332). For example, the first shielding member (331) may be interposed between the shield can (320) and the second shielding member (332). For example, the first shielding member (331) may be attached to the shield can (320) via the first adhesive member (333). For example, the first shielding member (331) may be fastened to the shield can (320) by the first adhesive member (333). For example, as illustrated in FIG. 3C, the first shielding member (331) may include a third face (331a) facing the shield can (320) and a fourth face (331b) opposite to the third face (331a). The third surface (331a) may be in contact with the first adhesive member (333). The fourth surface (331b) may be in contact with the second adhesive member (334). For example, the third surface (331a) of the first shielding member (331) may be covered (or partially covered) by the first adhesive member (333). The fourth surface (331b) opposite the third surface (331a) may be covered (or partially covered) by the second adhesive member (334). For example, the first adhesive member (333) may be applied to the third surface (331a) of the first shielding member (331). The second adhesive member (334) may be applied to the fourth surface (331b) opposite the third surface (331a).

[0107] For example, the second shielding member (332) may be placed between the first shielding member (331) and the metal plate (350). For example, the second shielding member (332) may be attached to the first shielding member (331) via a second adhesive member (334). For example, the second shielding member (332) may be fixed to the first shielding member (331) via the second adhesive member (334).

[0108] For example, the shielding members (331, 332) may include a conductive material. Since the shielding members (331, 332) include a conductive material, the shielding structure (330) may be configured to emit electromagnetic waves emitted from the electronic component (301) through the opening (325) of the shield can (320) to the ground of the electronic device (101) through the shield can (320) attached to the shielding structure (330). That is, electromagnetic radiation (or noise) emitted from the electronic component (301) through the opening (325) may be transmitted to the ground through the connection between the shielding structure (330) and the shield can (320).

[0109] For example, the shielding members (331, 332) may include voids within the shielding members (331, 332). For example, the porosity of the first shielding member (331) may be greater than the porosity of the second shielding member (332). For example, the yarn thickness of the first shielding member (331) may be smaller than the yarn thickness of the second shielding member (332). For example, the air permeability of the first shielding member (331) may be greater than the air permeability of the second shielding member (332). For example, but not limited thereto. The density (d1) of the first shielding member (331) is smaller than the density (d2) of the second shielding member (332), thereby providing space within the first shielding member (331) for adhesive materials from the first adhesive member (333) and the second adhesive member (334) in contact with the first shielding member (331).

[0110] According to one embodiment, the first shielding member (331) may include a first region (331c) including an adhesive material by the first adhesive member (333), and a second region (331d) including an adhesive material by the second adhesive member (334). At least a portion of a fourth surface (331b) of the first shielding member (331) facing the second shielding member (332) may be in contact with the second shielding member (332).

[0111] For example, the first shielding member (331) may include voids within the first shielding member (331). For example, the first adhesive member (333) may be pressed toward the first shielding member (331) by the shield can (320). At least a portion of the adhesive material of the first adhesive member (333) may be introduced into the voids within the first shielding member (331) through the third surface (331a) of the first shielding member (331) by the pressing by the shield can (320). The first region (331c) of the first shielding member (331) may be an region that includes the adhesive material introduced into the first shielding member (331) from the first adhesive member (333). For example, the second adhesive member (334) may be pressed toward the first shielding member (331) by the metal plate (350). At least a portion of the adhesive material of the second adhesive member (334) may flow into the pores within the first shielding member (331) through the fourth surface (331b) of the first shielding member (331) by the pressing by the metal plate (350). The second region (331d) of the first shielding member (331) may be a region that includes the adhesive material that has flowed into the first shielding member (331) from the second adhesive member (334).

[0112] For example, the fourth surface (331b) of the first shielding member (331) and / or the surface of the second shielding member (332) can be configured such that at least a portion of the fourth surface (331b) of the first shielding member (331) is in direct contact with the surface of the second shielding member (332). For example, at least a portion of the adhesive material of the second adhesive member (334) may flow into the second region (331d) through the fourth surface (331b) of the first shielding member (331) (e.g., through the pores of the fourth surface (331b)), such that at least a portion of the fourth surface (331b) facing the second shielding member (332) may come into contact with the second shielding member (332). For example, the shielding structure (330) may include points (P1, P2, P3) where the fourth surface (331b) of the first shielding member (331) is in contact with the second shielding member (332). The shielding structure (330) may increase the shielding performance of the shielding structure (330) for shielding electromagnetic waves emitted from the electronic component (301) through the opening of the shield can (320) by having at least a portion of the fourth surface (331b) be in contact with the second shielding member (332).

[0113] Although the shielding structure (330) has been described as including points (P1, P2, P3) where the fourth surface (331b) contacts the second shielding member (332), it is not limited thereto. The shielding structure (330) may include other points where the third surface (331a), opposite to the fourth surface (331b), contacts the shield can (320). For example, the third surface (331a) of the first shielding member (331) and / or the surface of the shield can (320) may be configured such that at least a portion of the third surface (331a) of the first shielding member (331) directly contacts the surface of the shield can (320). For example, at least a portion of the adhesive material of the first adhesive member (333) may be introduced into the first region (331c) through the third surface (331a) of the first shielding member (331) (e.g., through the pores of the third surface (331a)), so that at least a portion of the third surface (331a) facing the shield can (320) may come into contact with the shield can (320). The shielding structure (330) may increase the shielding performance of the shielding structure (330) for shielding electromagnetic waves emitted from the electronic component (301) through the opening of the shield can (320) by having at least a portion of the third surface (331a) come into contact with the shield can (320). The above shielding structure (330) can increase the structural stability of structures (e.g., metal plate (350) and / or display (201)) on the shielding structure (330) by including areas (331c, 331d) configured to receive an adhesive material.

[0114] According to one embodiment, the thickness (t1) of the first shielding member (331) may be positioned within a range of about 70 μm to 80 μm. The thickness (t2) of the second shielding member (332) may be positioned within a range of about 10 μm to 20 μm. When the thickness (t1) of the first shielding member (331) is positioned within a range of about 70 μm to 80 μm, and the thickness (t2) of the second shielding member (332) is positioned within a range of about 10 μm to 20 μm, the shielding structure (330) may increase the shielding performance of the shielding structure (330) for shielding the electronic component (301) and may enhance the structural stability of structures (e.g., the metal plate (350) and / or the display (201)) on the shielding structure (330).

[0115] According to one embodiment, the thickness (t3) of the first adhesive member (333) and the first thickness (t4) and second thickness (t5) of the second adhesive member (334) may be positioned within a range of about 1 μm or more and 15 μm or less, respectively. For example, since at least a portion of the second adhesive member (334) is in contact with the thermally conductive member (340) through the groove (330a) of the shielding structure (330), the first thickness (t4) of the portion of the second adhesive member (334) disposed between the first shielding member (331) and the second shielding member (332) may be smaller than the second thickness (t5) of the portion disposed between the second shielding member (332) and the thermally conductive member (340). The second thickness (t5) may be positioned within a range of about 1 μm or more and 15 μm or less. Since the thickness (t3) of the first adhesive member (333) and the first thickness (t4) and the second thickness (t5) of the second adhesive member (334) are each positioned within a range of about 1 µm or more and 15 µm or less, the shielding structure (330) can increase the shielding performance of the shielding structure (330) for shielding the electronic component (301) and enhance the structural stability of structures (e.g., the metal plate (350) and / or the display (201)) on the shielding structure (330).

[0116] According to one embodiment, the heat conductive member (340) may include at least one of rubber, paraffin wax, and oil. By including at least one of rubber, paraffin wax, and oil, the heat conductive member (340) may reduce a repulsive force against structures (e.g., a shielding structure (330), a metal plate (350), or a display (201)) on the heat conductive member (340) that pressurize the heat conductive member (340). By reducing the repulsive force against the structures, the heat conductive member (340) may increase the structural stability of the structures.

[0117] In one embodiment, the shielding structure (330) may further include a groove (330a) recessed from the opening (325) toward the metal plate (350) to accommodate a thermally conductive member (340) penetrating at least a portion of the opening (325). That is, the shielding structure (330) may include an indented portion in a surface facing the thermally conductive member (340) to accommodate a portion of the thermally conductive member (340). For example, the groove (330a) may extend from the opening (325) of the shield can (320) to accommodate at least a portion of the thermally conductive member (340) penetrating the opening (325). The groove (330a) may be connected to the opening (325). For example, the depth of the groove (330a) may be substantially equal to the length of the heat conductive member (340) protruding from the opening (325) toward the shielding structure (330) to attach the heat conductive member (340) to the shielding structure (330). For example, the edge of the groove (330a) may be aligned with the edge of the opening (325). For example, the inner surface of the groove (330a) may be in contact with the heat conductive member (340). The shielding structure (330) may provide a space for the heat conductive member (340) protruding through the opening (325) in the shielding structure (330) to shield the opening (325) of the shield can (320) by including the groove (330a).

[0118] In one embodiment, the first shielding member (331) can surround at least a portion of the thermally conductive member (340) that passes through the opening (325). The second shielding member (332) can be attached to the thermally conductive member (340) via a second adhesive member (334). For example, the first shielding member (331) can surround the thermally conductive member (340) that protrudes from the opening (325) toward the shielding structure (330). For example, at least a portion of the first shielding member (331) can face a portion of the thermally conductive member (340) that passes through the opening (325). For example, the second shielding member (332) can cover the opening (325). The second shielding member (332) can shield the space surrounded by the printed circuit board (310), the shield can (320), and the shielding structure (330) by covering the opening (325). The second shielding member (332) can be attached to the heat conducting member (340) passing through the opening (325) via a second adhesive member (334).

[0119] For example, a groove (330a) for accommodating a heat-conducting member (340) protruding from a shield can (320) through an opening (325) may be formed by a first shielding member (331), a first adhesive member (333), and a second adhesive member (334) of the shielding structure (330). For example, the groove (330a) may be formed in the first shielding member (331) and the first adhesive member (333). The first shielding member (331) and the first adhesive member (333) may surround the heat-conducting member (340) that has passed through the opening (325). The second adhesive member (334) may come into contact with the heat-conducting member (340) by covering the heat-conducting member (340) that has passed through the opening (325). The second adhesive member (334) can attach the heat conductive member (340) to the second shielding member (332) by coming into contact with the heat conductive member (340). The heat conductive member (340) can be configured to transfer at least a portion of the heat emitted from the electronic component (301) to the shielding structure (330) by coming into contact with the shielding structure (330).

[0120] According to one embodiment, the shielding structure (330) may further include a protective member (335). For example, the protective member (335) may be disposed on a surface of the shielding structure (330) opposite to a surface that contacts the heat conducting member (340) of the shielding structure (330). The protective member (335) may be disposed on the second shielding member (332). For example, the protective member (335) may be laminated on the second shielding member (332). For example, the protective member (335) may be bonded to the second shielding member (332). For example, the protective member (335) may be attached on the second shielding member (332). For example, the protective member (335) may be disposed on a surface of the second shielding member (332) opposite to the surface of the second shielding member (332) that is in contact with the second adhesive member (334). For example, the protective member (335) may be interposed between the second shielding member (332) and the metal plate (350). For example, the protective member (335) may include, but is not limited to, polyurethane. By including the protective member (335), the shielding structure (330) can reduce performance degradation of the shielding structure (330) caused by a structure on the shielding structure (330) (e.g., the metal plate (350)).

[0121] According to the above-described embodiment, the electronic device (101) can reduce degradation of performance of other electronic components (e.g., other electronic components (302)) around the electronic component (301) due to electromagnetic waves emitted from the electronic component (301) by including a shield can (320). The electronic device (101) can reduce degradation of performance of the electronic component (301) due to heat emitted from the electronic component (301) by including a heat conducting member (340) that passes through an opening (325) of the shield can (320) and is attached to the electronic component (301). The electronic device (101) can reduce degradation of performance of other electronic components around the electronic component (301) due to electromagnetic waves emitted from the electronic component (301) through the opening (325) by including a shielding structure (330) that covers the opening (325). The shielding structure (330) can increase the shielding performance of the shielding structure (330) for the electromagnetic wave emitted from the electronic component (301) through the opening (325) by having a density (d1) of the first shielding member (331) attached to the shield can (320) lower than the density (d2) of the second shielding member (332) attached on the first shielding member (331). The electronic device (101) can reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including a metal plate (350) disposed on the shielding structure (330) and at least one heat dissipation member (360).

[0122] Figures 4a, 4b, 4c, 4d, and 4e are partial cross-sectional views of exemplary electronic devices.

[0123] Referring to FIGS. 4a, 4b, 4c, 4d, and 4e, the electronic device (101) may include a printed circuit board (310) (e.g., the first printed circuit board (250), the second printed circuit board (252) of FIG. 2b), an electronic component (301) coupled to the printed circuit board (310), and a shield can (320) on the printed circuit board (310) that surrounds the electronic component (301) and includes an opening (325) facing the electronic component (301). The electronic device (101) may include a shield structure (330) on the shield can (320) covering the opening (325), and a heat conducting member (340) attached to the electronic component (301) and between the electronic component (301) and the shield structure (330) and in contact with the shield structure (330) through the opening (325). The electronic device (101) may include a metal plate (350) on the shield structure (330), and at least one heat dissipation member (360) attached to the metal plate (350) and configured to transfer at least a portion of heat emitted from the electronic component through the heat conducting member (340). In one embodiment, the shielding structure (330) may include a first shielding member (331) attached on the shield can (320), a first adhesive member (e.g., the first adhesive member (333) of FIG. 3c) interposed between the first shielding member (331) and the shield can (320) to attach the first shielding member (331) to the shield can (320), a second shielding member (332) attached on the first shielding member (331), and a second adhesive member (e.g., the second adhesive member (334) of FIG. 3c) interposed between the first shielding member (331) and the second shielding member (332) to attach the second shielding member (332) to the first shielding member (331).For example, the density (d1) of the first shielding member (331) may be less than the density (d2) of the second shielding member (332). According to one embodiment, the shielding structure (330) may further include a groove (330a) recessed from the opening (325) toward the metal plate (350) to accommodate the heat conducting member (340) penetrating at least a portion of the opening (325).

[0124] Hereinafter, a redundant description of the configuration described in FIGS. 3A to 3C will be omitted. The above-described features related to FIGS. 3A to 3C (e.g., the protective member (335), the first region (331c), the second region (331d), etc.) may be combined with the embodiments described below, even if not illustrated in FIGS. 4A, 4B, 4C, 4D, and 4E.

[0125] According to one embodiment, the metal plate (350) may include a heat dissipation portion (350a) disposed above the electronic component (301). For example, the heat dissipation portion (350a) may overlap the electronic component (301) when the metal plate (350) is viewed from above (e.g., when viewed in the -z direction). For example, the heat dissipation portion (350a) may be configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310). For example, the heat dissipation portion (350a) may be positioned on the thermally conductive member (340). For example, the heat dissipation portion (350a) may overlap the opening (325) of the shield can (320) when the metal plate (350) is viewed from above (e.g., when viewed in the -y direction). For example, the heat dissipation portion (350a) may be positioned on a portion of the shielding structure (330) that covers the opening (325) of the shield can (320). In order to reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301), the electronic device (101) may require a structure for dissipating heat transferred from the electronic component (301) to the heat dissipation portion (350a) of the metal plate (350) through the heat conducting member (340) and the shielding structure (330).

[0126] According to one embodiment, at least one heat dissipation member (360) may include at least one of a vapor chamber, a heat pipe, graphite, and graphene. Since the at least one heat dissipation member (360) includes at least one of a vapor chamber, a heat pipe, graphite, and graphene, the at least one heat dissipation member (360) attached to the metal plate (350) may dissipate heat transferred from the electronic component (301) to the metal plate (350). By dissipating the heat, the at least one heat dissipation member (360) may reduce performance degradation of the electronic device (101) due to the heat.

[0127] Referring to FIGS. 4A, 4B, and 4C, the metal plate (350) may include a recess or a through hole, and the recess or the through hole may be configured to at least partially overlap the electronic component (301) and the upper surface of the printed circuit board (310) in a first direction perpendicular to the upper surface. At least one heat dissipation member (360) may be disposed within the recess or the through hole. For example, a groove may be formed on a first surface (351) of the metal plate (350) facing the shield can (320), and a groove may be formed on a second surface (352) of the metal plate (350) opposite to the first surface (351). For example, the through hole may extend from the first surface (351) of the metal plate (350) to the second surface (352) of the metal plate (350).

[0128] Referring to FIG. 4A, in one embodiment, the metal plate (350) may include a recess (355) extending from a second surface (352) of the metal plate (350) opposite the first surface (351) facing the shield can (320) toward the thermally conductive member (340). That is, the metal plate (350) may include a recess in the second surface (352) (i.e., the surface opposite the surface facing the shield structure (330). At least one heat dissipation member (360) may be disposed within the recess (355) such that the metal plate (350) overlaps with the electronic component (301) when viewed from above (e.g., when viewed in the -z direction).

[0129] For example, the recess (355) may be recessed from the second surface (352) of the metal plate (350) toward the first surface (351) opposite to the second surface (352). For example, the recess (355) may overlap with the electronic component (301) when the metal plate (350) is viewed from above (e.g., when viewed in the -z direction). For example, the recess (355) may be configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310). For example, the recess (355) may be formed within the heat dissipation portion (350a) of the metal plate (350). For example, the recess (355) may be arranged to overlap with the heat conducting member (340). For example, the recess (355) may accommodate at least one heat dissipation member (360). For example, at least one heat dissipation member (360) can be attached to the heat conducting member (340) by being placed within the recess (355). The metal plate (350) can reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including the recess (355) for accommodating at least one heat dissipation member (360).

[0130] According to one embodiment, the electronic device (101) may further include another heat-conducting member (410) that is distinct from the heat-conducting member (340) that is disposed within the recess (355) of the metal plate (350) so as to face the electronic component (301) and is attached to the electronic component (301). For example, the other heat-conducting member (410) may be disposed between the inner surface of the recess (355) and at least one heat-dissipating member (360). By further including the other heat-conducting member (410) that is in contact with the metal plate (350) and the at least one heat-dissipating member (360), the electronic device (101) may reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301). According to one embodiment, the heat-conducting member (340) attached on the electronic component (301) may have a pad shape. Another heat-conducting member (410) disposed within the recess (355) may be disposed so as to be applied to at least a portion of the inner surface of the recess (355), unlike the heat-conducting member (340). However, the present invention is not limited thereto.

[0131] According to one embodiment, the electronic device (101) may further include an insulating member (370) covering a recess (355) in which at least one heat dissipation member (360) is disposed. The insulating member (370) may be attached to the at least one heat dissipation member (360). For example, the insulating member (370) may be supported by the at least one heat dissipation member (360). By including an insulating structure covering the recess (355), the electronic device (101) may reduce degradation of the performance of a display (e.g., display (201) of FIG. 2A) of the electronic device (101) disposed on the insulating member (370) due to heat transferred from the electronic component (301) to the at least one heat conducting member (360) in the recess (355).

[0132] Referring to FIG. 4B, in one embodiment, unlike FIG. 4A, the recess (355) of the metal plate (350) may be recessed from a first surface (351) of the metal plate (350) facing the shield can (320) toward a second surface (352) opposite to the first surface (351). That is, the metal plate (350) may include an indentation in the first surface (351) (i.e., the surface facing the shield structure (330). At least one heat dissipation member (360) facing may be disposed within the recess (355). According to one embodiment, the electronic device (101) may further include another heat conduction member (410) that is distinct from the heat conduction member (340) disposed within the recess (355) and attached to the electronic component (301). The other heat-conducting member (410) may be placed between at least one heat-dissipating member (360) and the shielding structure (330). The other heat-conducting member (410) may be in contact with the shielding structure (330) and the at least one heat-dissipating member (360), thereby reducing performance degradation of the electronic device (101) due to heat emitted from the electronic component (301).

[0133] In one embodiment, the insulating member (370) can be attached on a second surface (352) opposite the first surface (351) on which the recess (355) is formed. The metal plate (350) can include, for example, another recess extending from the second surface (352) toward the first surface (351) to accommodate the insulating member (370). That is, the metal plate (350) can also include an indentation on the second surface (352) (i.e., the surface opposite the surface facing the shielding structure (330). For example, the insulating member (370) can overlap the recess (355) for accommodating at least one heat dissipation member (360) when viewed from above (e.g., when viewed in the -z direction). For example, the insulating member (370) can be disposed above at least one heat dissipation member (360). The electronic device (101) can reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including an insulating member (370) attached to the second surface (352).

[0134] Referring to FIG. 4c, in one embodiment, unlike FIGS. 4a and 4b, the metal plate (350) may further include a through hole (356) formed within the heat dissipation portion (350a). For example, the through hole (356) may extend from a first surface (351) of the metal plate (350) facing the shield can (320) to a second surface (352) opposite to the first surface (351). For example, the through hole (356) may overlap with the electronic component (301) when the metal plate (350) is viewed from above (e.g., when viewed in the -z direction). For example, the through hole (356) may be configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310).

[0135] According to one embodiment, at least one heat dissipation member (360) may be disposed within the through hole (356). The electronic device (101) may further include another heat conducting member (410) that is distinct from the heat conducting member (340) disposed within the through hole (356) and attached to the electronic component (301). The other heat conducting member (410) may be disposed between the at least one heat dissipation member (360) and the shielding structure (330).

[0136] According to one embodiment, the electronic device (101) may further include an insulating member (370) covering the through hole (356). The insulating member (370) may be in contact with at least one heat dissipation member (360) disposed within the through hole (356). By including the insulating member (370) covering the through hole (356), the electronic device (101) may reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301).

[0137] Referring to FIG. 4D, in one embodiment, at least one heat dissipation member (360) may include a first heat dissipation member (361) that covers at least a portion of a second surface (352) of the metal plate (350) opposite the first surface (351) of the metal plate (350) facing the shield can (320). For example, the electronic device (101) may further include an insulating member (370) that is disposed on the heat dissipation portion (350a) of the metal plate (350) and is at least partially surrounded by the first heat dissipation member (361). For example, the first heat dissipation member (361) may be attached on the second surface (352) of the metal plate (350). The insulating member (370) may be surrounded by the first heat dissipation member (361) attached to the second surface (352) and may be disposed above the heat dissipation portion (350a) of the metal plate (350). That is, the insulating member (370) may be configured to overlap at least a portion of the heat dissipation portion (350a) in a first direction perpendicular to the upper surface of the printed circuit board (310). The first heat dissipation member (361) may surround at least a portion of the insulating member (370). For example, the insulating member (370) may be in contact with the first heat dissipation member (361). For example, at least a portion of the first heat dissipation member (361) may be interposed between the insulating member (370) and the heat dissipation portion (350a) of the metal plate (350). For example, the insulating member (370) can reduce heat transfer from the electronic component (301) to the electronic device (101) in a direction (e.g., +z direction) toward the heat dissipation member (350a) by being attached to (or overlapping with) the heat dissipation member (350a) disposed on the electronic component (301). By reducing the heat transfer, the insulating member (370) can reduce performance degradation of a component (e.g., a display (201)) of the electronic device (101) disposed on the insulating member (370).The electronic device (101) includes a first heat dissipation member (361) on the second surface (352) of the metal plate (350), and an insulating member (370) at least partially surrounded by the first heat dissipation member (361), thereby reducing degradation of the performance of the electronic device (101) due to heat emitted from the electronic component (301).

[0138] According to one embodiment, at least one heat dissipation member (360) may further include a second heat dissipation member (362) disposed on the first heat dissipation member (361) and the insulating member (370) and covering the insulating member (370). For example, the second heat dissipation member (362) may cover the insulating member (370) and at least a portion of the first heat dissipation member (361). For example, the second heat dissipation member (362) may be in contact with the insulating member (370). By including the second heat dissipation member (362), the electronic device (101) may dissipate heat transferred from the electronic component (301) through the metal plate (350) to the insulating member (370) and / or the first heat dissipation member (361). The second heat dissipation member (362) may reduce performance degradation of the electronic device (101) caused by the heat by dissipating the heat.

[0139] Referring to FIG. 4E, at least one heat dissipation member (360) may further include a step structure (360a) for accommodating an insulating member (370). For example, the insulating member (370) may be disposed on the step structure (360a). The step structure (360a) may be formed above the heat dissipation portion (350a) of the metal plate (350). The insulating member (370) may overlap the heat dissipation portion (350a) when the metal plate (350) is viewed from above (e.g., when viewed in the -z direction). The at least one heat dissipation member (360) may provide a space in which the insulating member (370) for heat dissipated from the electronic component (301) to the heat dissipation portion (350a) is disposed by including the step structure (360a).

[0140] According to one embodiment, at least one heat dissipation member (360) may include a first heat dissipation member (361) and a second heat dissipation member (362) attached on the first heat dissipation member (361) to form a step structure (360a). For example, a length of the second heat dissipation member (362) disposed on the first heat dissipation member (361) may be shorter than a length of the first heat dissipation member (361). By having the length of the second heat dissipation member (362) be shorter than the length of the first heat dissipation member (361), the at least one heat dissipation member (360) may provide a step structure (360a) for disposing an insulating member (370).

[0141] According to the above-described embodiment, the electronic device (101) can reduce heat transfer from the electronic component (301) toward the heat dissipation portion (350a) by including an insulating member (370) disposed on (or overlapping) the heat dissipation portion (350a) of the metal plate (350). The electronic device (101) can dissipate heat emitted from the electronic component (301) by including at least one heat dissipation member (360) around the heat dissipation member (370). The electronic device (101) can reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including the at least one heat dissipation member (360) and the heat dissipation member (370).

[0142] Figures 5a and 5b are partial cross-sectional views of an exemplary electronic device.

[0143] Referring to FIGS. 5A and 5B, the electronic device (101) may include a printed circuit board (310) (e.g., the first printed circuit board (250), the second printed circuit board (252) of FIG. 2B), an electronic component (301), a shield can (320), a shielding structure (330), a thermally conductive member (340), a metal plate (350), and at least one heat dissipation member (360). According to one embodiment, the metal plate (350) may include a heat dissipation portion (350a) disposed above the electronic component (301). That is, the heat dissipation portion (350a) may be configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310).

[0144] According to one embodiment, at least one heat dissipation member (360) may include at least one of a vapor chamber, a heat pipe, graphite, and graphene.

[0145] Hereinafter, a redundant description of the configuration described in FIGS. 3A to 3C will be omitted. The above-described features related to FIGS. 3A to 3C (e.g., the protective member (335), the first region (331c), the second region (331d), etc.) may be combined with the embodiments described below, even if not illustrated in FIGS. 5A and 5B.

[0146] Referring to FIG. 5A, at least one heat dissipation member (360) may include a third heat dissipation member (363) that covers at least a portion of a first surface (351) of the metal plate (350) facing the shield can (320) and is attached to the shielding structure (330). For example, the third heat dissipation member (363) may be disposed between the shielding structure (330) and the metal plate (350). For example, the third heat dissipation member (363) may be attached on the first surface (351) of the metal plate (350). The third heat dissipation member (363) may dissipate heat transferred from the electronic component (301) to the third heat dissipation member (363) through the thermally conductive member (340), thereby reducing degradation of the electronic device (101) caused by the heat transferred to the third heat dissipation member (363).

[0147] Referring to FIG. 5b, the electronic device (101) may further include an insulating member (370) at least partially surrounded by a third heat dissipation member (363). The insulating member (370) may be attached to a heat dissipation portion (350a) of the metal plate (350). At least one heat dissipation member (360) may further include a fourth heat dissipation member (364) disposed on the third heat dissipation member (363) and the insulating member (370), and covering the insulating member (370).

[0148] For example, the insulating member (370) may be disposed on the first surface (351) of the metal plate (350) and attached to the heat dissipation portion (350a) of the metal plate (350). The third heat dissipation member (363) may surround at least a portion of the insulating member (370). For example, the insulating member (370) may be in contact with the third heat dissipation member (363). For example, a portion of the third heat dissipation member (363) may be interposed between the insulating member (370) and the fourth heat dissipation member (364). For example, the insulating member (370) may be attached to the heat dissipation portion (350a) disposed on the electronic component (301), thereby reducing heat transfer from the electronic component (301) in a direction (e.g., +z direction) in which the electronic device (101) faces the heat dissipation portion (350a). The above-described insulating member (370) can reduce the performance degradation of a component (e.g., a display (201)) of an electronic device (101) disposed on the above-described insulating member (370) by reducing the heat transfer. The electronic device (101) can reduce the performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including a third heat dissipation member (363) on the first surface (351) of the metal plate (350) and an insulation member (370) at least partially surrounded by the third heat dissipation member (363).

[0149] For example, the fourth heat dissipation member (364) can cover at least a portion of the third heat dissipation member (363). For example, although not shown, the fourth heat dissipation member (364) can be in contact with the insulating member (370) and the shielding structure (330). The electronic device (101) can dissipate heat transferred from the electronic component (301) to the fourth heat dissipation member (364) through the shielding structure (330) by including the fourth heat dissipation member (364). The fourth heat dissipation member (364) can reduce performance degradation of the electronic device (101) due to the heat by dissipating the heat.

[0150] In one embodiment, the third heat dissipation member (363) and the fourth heat dissipation member (364) may be formed as an integral part. The insulating member (370) may be surrounded by the heat dissipation member (360) on the first surface (351) formed as an integral part. The insulating member (370) may be covered by the metal plate (350). However, the present invention is not limited thereto. In one embodiment, unlike as illustrated in FIG. 5b, the fourth heat dissipation member (364) may be omitted. The third heat dissipation member (363) may be attached to the shielding structure (330).

[0151] According to the above-described embodiment, the electronic device (101) can reduce heat transfer from the electronic component (301) in a direction toward the heat dissipation portion (350a) by including an insulating member (370) attached to the heat dissipation portion (350a) of the metal plate (350). The electronic device (101) can dissipate heat emitted from the electronic component (301) by including at least one heat dissipation member (360) around the heat dissipation member (370). The electronic device (101) can reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including the at least one heat dissipation member (360) and the heat dissipation member (370).

[0152] Figure 6 is a partial cross-sectional view of an exemplary electronic device.

[0153] Referring to FIG. 6, the electronic device (101) may include a printed circuit board (310) (e.g., the first printed circuit board (250), the second printed circuit board (252) of FIG. 2B), an electronic component (301), a shield can (320), a shielding structure (330), a heat conducting member (340), a metal plate (350), and at least one heat dissipation member (360). According to one embodiment, the metal plate (350) may include a heat dissipation portion (350a) disposed on (or above) the electronic component (301). That is, the heat dissipation portion (350a) may be configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310). Hereinafter, a redundant description of the configuration described in FIGS. 3A to 3C will be omitted. The above described features (e.g., the protective member (335), the first region (331c), the second region (331d), etc.) associated with FIGS. 3a to 3c may be combined with the embodiments described below, even if not illustrated in FIG. 6.

[0154] According to one embodiment, at least one heat dissipation member (360) may include at least one of a vapor chamber, a heat pipe, graphite, and graphene.

[0155] According to one embodiment, the insulating member (370) may include a first insulating member (371) and a second insulating member (372). At least one heat dissipation member (360) may include a first heat dissipation member (361), a second heat dissipation member (362), a third heat dissipation member (363), and / or a fourth heat dissipation member (364).

[0156] For example, the first heat dissipation member (371) may be disposed on the second surface (352) facing the display (e.g., the display (201) of FIG. 2A) of the metal plate (350). For example, the first insulation member (371) may be disposed above the second surface (352). For example, the first insulation member (371) may be configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310). The first insulation member (371) may be at least a portion surrounded by the first heat dissipation member (361). For example, although not illustrated, the first insulation member (371) may be attached to the heat dissipation portion (350a) of the metal plate (350). For example, at least a portion of the first heat dissipation member (361) may be interposed between the first heat dissipation member (371) and the heat dissipation portion (350a). The second heat dissipation member (362) may be attached to the first heat dissipation member (361) and the first heat dissipation member (371). The second heat dissipation member (362) may be disposed between the first heat dissipation member (361) and the display (201). The second heat dissipation member (362) may cover the first heat dissipation member (371).

[0157] For example, the third heat dissipation member (363) may be disposed on the first surface (351) of the metal plate (350) facing the shield can (320). The second insulation member (372) may be disposed on the first surface (351). The second insulation member (372) may be at least partially surrounded by the third heat dissipation member (363). The second insulation member (372) may be attached to the heat dissipation portion (350a) of the metal plate (350). The fourth heat dissipation member (364) may be attached on the third heat dissipation member (363) and the second insulation member (372). For example, at least a portion of the third heat dissipation member (363) may be interposed between the second insulation member (372) and the fourth heat dissipation member (364). The fourth heat dissipation member (364) may be placed between the third heat dissipation member (363) and the shielding structure (330). The second insulation member (372) may be covered by a metal plate (350).

[0158] According to the above-described embodiment, the electronic device (101) can reduce heat transfer from the electronic component (301) toward the heat dissipation portion (350a) by including an insulating member (370) disposed on the heat dissipation portion (350a) of the metal plate (350). The electronic device (101) can dissipate heat emitted from the electronic component (301) by including at least one heat dissipation member (360) around the heat dissipation member (370). The electronic device (101) can reduce performance degradation of the electronic device (101) due to heat emitted from the electronic component (301) by including the at least one heat dissipation member (360) and the heat dissipation member (370).

[0159] Figure 7 illustrates a bonding process of a shielding structure of an exemplary electronic device.

[0160] Referring to FIG. 7, an electronic device (e.g., electronic device (101) of FIG. 1) may include a printed circuit board (310) (e.g., first printed circuit board (250), second printed circuit board (252) of FIG. 2b), an electronic component (301) coupled on the printed circuit board (310), and a shield can (320) on the printed circuit board (310) that surrounds the electronic component (301) and includes an opening (325) facing the electronic component (301). The electronic device (101) may include a shield structure (330) on the shield can (320) covering the opening (325), and a heat conducting member (340) attached to the electronic component (301) and between the electronic component (301) and the shield structure (330) in contact with the shield structure (330) through the opening (325). The shielding structure (330) may include a first shielding member (331) attached to the shield can (320), a first adhesive member (333) interposed between the first shielding member (331) and the shield can (320) to attach the first shielding member (331) to the shield can (320), a second shielding member (332) attached to the first shielding member (331), and a second adhesive member (334) interposed between the first shielding member (331) and the second shielding member (332) to attach the second shielding member (332) to the first shielding member (331). For example, the density (d1) of the first shielding member (331) may be smaller than the density (d2) of the second shielding member (332). According to one embodiment, the shielding structure (330) may further include a recess (330a) recessed from the opening (325) toward the metal plate (350) to accommodate the heat conducting member (340) penetrating at least a portion of the opening (325).

[0161] Referring to step (700a), the shielding structure (330) may be attached on the shield can (320). The members (331, 332, 333, 334, 335) within the shielding structure (330) may be laminated to each other within the shielding structure (330). For example, the first shielding member (331) may be laminated on the first adhesive member (333). The second adhesive member (334) may be laminated on the first shielding member (331). The second shielding member (332) may be laminated on the second adhesive member (334). The protective member (335) may be laminated on the second shielding member (332). The first shielding member (331) can be attached to the shield can (320) by being bonded onto the first adhesive member (333). The second shielding member (332) can be attached to the first shielding member (331) by being bonded onto the second adhesive member (334).

[0162] Referring to step (700b), the shielding structure (330) can be pressed in a direction (e.g., -z direction) toward the printed circuit board (310). The shielding structure (330) can be pressed toward the shield can (320) by a metal plate (e.g., the metal plate (350) of FIG. 3a). For example, since the first shielding member (331) includes gaps, at least a portion of the first adhesive member (333) between the first shielding member (331) and the shield can (320) can be introduced into the gaps within the first shielding member (331) through the third surface (331a) of the first shielding member (331) facing the shield can (320). The first region (331c) of the first shielding member (331) may be formed by the introduction of an adhesive material into the first shielding member (331) by pressure applied from the first adhesive member (333) to the shielding structure (330). At least a portion of the third surface (331a) of the first shielding member (331) may be in contact with the shield can (320). For example, since the first shielding member (331) includes voids and the density (d1) of the first shielding member (331) is less than the density (d2) of the second shielding member (332), at least a portion of the second adhesive member (334) between the first shielding member (331) and the second shielding member (332) can be introduced into the voids within the first shielding member (331) through the fourth surface (331b) of the first shielding member (331) facing the second shielding member (332). The second region (331d) of the first shielding member (331) can be formed by the introduction of adhesive material into the first shielding member (331) by pressure applied to the shielding structure (330) from the second adhesive member (334). At least a portion of the fourth surface (331b) of the first shielding member (331) may be in contact with the second shielding member (332).At least a portion of the second adhesive member (334) may be moved toward the printed circuit board (310) together with the second shielding member (332) by the pressing. The second adhesive member (340) moved toward the printed circuit board (310) may be attached to the heat conducting member (340). That is, by pressing the shielding structure (330) and the shield can (320), the second adhesive member (334) may be brought into contact with the heat conducting member (340) and attached to the heat conducting member (340).

[0163] According to the above-described embodiment, the shielding structure (330) can increase the shielding performance of the shielding structure (330) for the electromagnetic wave emitted from the electronic component (301) through the opening (325) by having a density (d1) of the first shielding member (331) attached to the shield can (320) lower than the density (d2) of the second shielding member (332) attached on the first shielding member (331), and can enhance the structural stability of structures on the shielding structure (330) (e.g., the metal plate (350) and / or the display (201) of FIG. 2A).

[0164] FIG. 8A illustrates an example of an unfolded state of an electronic device according to one embodiment. FIG. 8B illustrates an example of a folded state of an electronic device according to one embodiment. FIG. 8C is an exploded view of an electronic device according to one embodiment.

[0165] Referring to FIGS. 8A, 8B, and 8C, the electronic device (101) may include a housing (210) including a first housing (810) and a second housing (820), a display (201), at least one camera (840) (e.g., the camera module (180) of FIG. 1), a hinge structure (850), and / or at least one electronic component (860) (e.g., the electronic component (301) of FIG. 3A).

[0166] The first housing (810) and the second housing (820) may form at least a portion of an outer surface of the electronic device (101) that may be gripped by a user. At least a portion of the outer surface of the electronic device (101) defined by the first housing (810) and the second housing (820) may come into contact with a portion of the user's body when the electronic device (101) is used by the user. According to one embodiment, the first housing (810) may include a first front surface (811), a first back surface (812) facing the first front surface (811) and spaced apart from the first front surface (811), and a first side surface (813) enclosing at least a portion of the first front surface (811) and the first back surface (812). The first side surface (813) may connect a periphery of the first front surface (811) and a periphery of the first back surface (812). The first front (811), the first rear (812), and the first side (813) may define an internal space of the first housing (810). According to one embodiment, the first housing (810) may provide a space formed by the first front (811), the first rear (812), and the first side (813) as a space for arranging components of the electronic device (101).

[0167] According to one embodiment, the second housing (820) can include a second front surface (821), a second rear surface (822) facing the second front surface (821) and spaced apart from the second front surface (821), and a second side surface (823) surrounding at least a portion of the second front surface (821) and the second rear surface (822). The second side surface (823) can connect a periphery of the second front surface (821) and a periphery of the second rear surface (822). The second front surface (821), the second rear surface (822), and the second side surface (823) can define an interior space of the second housing (820). According to one embodiment, the second housing (820) may provide a space formed by a second front surface (821), a second rear surface (822), and a second side surface (823) surrounding at least a portion of the second front surface (821) and the second rear surface (822), as a space for mounting components of the electronic device (101). According to one embodiment, the second housing (820) may be coupled to the first housing (810) so as to be rotatable with respect to the first housing (810).

[0168] According to one embodiment, each of the first housing (810) and the second housing (820) may include a first protective member (814) and a second protective member (824), respectively. The first protective member (814) and the second protective member (824) may be disposed on the first front surface (811) and the second front surface (821) along the periphery of the display (201). According to one embodiment, the first protective member (814) and the second protective member (824) may prevent foreign substances (e.g., dust or moisture) from entering through the gap between the display (201) and the first housing (810) and the second housing (820). For example, the first protective member (814) may surround an edge of a first display area (831) of the display (201), and the second protective member (824) may surround an edge of a second display area (832) of the display (201). The first protective member (814) may be formed by being attached to a first side (813) of the first housing (810), or may be formed integrally with the first side (813). The second protective member (824) may be formed by being attached to a second side (823) of the second housing (820), or may be formed integrally with the second side (823).

[0169] According to one embodiment, the first side (813) and the second side (823) may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side (823) may include at least one conductive portion (825) and at least one non-conductive portion (826). The at least one conductive portion (825) may include a plurality of conductive portions that are each spaced apart from each other. The at least one non-conductive portion (826) may be disposed between the plurality of conductive portions. The plurality of conductive portions may be isolated from each other by the at least one non-conductive portion (826) disposed between the plurality of conductive portions. According to one embodiment, the plurality of conductive portions and the plurality of non-conductive portions may together form an antenna radiator. The electronic device (101) may be capable of communicating with an external electronic device through the antenna radiator formed by the plurality of conductive portions and the plurality of non-conductive portions.

[0170] The display (201) may be configured to display visual information. According to one embodiment, the display (201) may be disposed on a first front surface (811) of the first housing (810) and a second front surface (821) of the second housing (820) across the hinge structure (850). For example, the display (201) may include a first display area (831) disposed on the first front surface (811) of the first housing, a second display area (832) disposed on the second front surface (821) of the second housing, and a third display area (833) disposed between the first display area (831) and the second display area (832). The first display area (831), the second display area (832), and the third display area (833) may form a front surface of the display (201). According to one embodiment, the display (201) may further include a sub-display panel (835) disposed on the second rear surface (822) of the second housing (820). For example, the display (201) may be referred to as a flexible display. According to one embodiment, the display (201) may include a window exposed toward the outside of the electronic device (101). The window may protect the surface of the display (201) and may include a substantially transparent material to transmit visual information provided by the display (201) to the outside of the electronic device (101). For example, the window may include, but is not limited to, glass (e.g., UTG, ultra-thin glass) and / or polymer (e.g., PI, polyimide). According to one embodiment, the display (201) may be disposed on a metal plate (e.g., the metal plate (350) of FIG. 3A).

[0171] According to one embodiment, the second display area (832) may be spaced apart from the first display area (831). The third display area (833) may connect the first display area (831) and the second display area (832) and may be foldable based on a folding axis (f). The first housing (810) may support the first display area (831). The second housing (820) may support the second display area (832).

[0172] At least one camera (840) may be configured to acquire an image based on receiving light from a subject external to the electronic device (101). According to one embodiment, the at least one camera (840) may include third cameras (841), fourth cameras (842), and / or fifth cameras (843). The third cameras (841) may be disposed in the first housing (810). For example, the third cameras (841) may be disposed inside the first housing (810) and at least a portion of the third cameras (841) may be visible through the first rear surface (812) of the first housing (810). The third cameras (841) may be supported by a bracket (not shown) within the first housing (810). The first housing (810) may include at least one opening (841a) that overlaps the third cameras (841) when viewed from above on the first rear surface (812). The third cameras (841) may acquire images based on receiving light from the outside of the electronic device (101) through the at least one opening (841a).

[0173] According to one embodiment, the fourth camera (842) may be disposed in the second housing (820). For example, the fourth camera (842) may be disposed inside the second housing (820) and may be visible through the sub-display panel (835). The second housing (820) may include at least one opening (842a) that overlaps the fourth camera (842) when the second rear surface (822) is viewed from above. The fourth camera (842) may acquire an image based on receiving light from the outside of the electronic device (101) through the at least one opening (842a).

[0174] In one embodiment, the fifth camera (843) may be disposed in the first housing (810). For example, the fifth camera (843) may be disposed inside the first housing (810) and at least a portion thereof may be visible through the first front surface (811) of the first housing (810). As another example, the fifth camera (843) may be disposed inside the first housing (810) and at least a portion thereof may be visible through the first display area (831) of the display (201). The first display area (831) of the display (201) may include at least one opening (not shown) that overlaps the fifth camera (843) when the display (201) is viewed from above. The fifth camera (843) may acquire an image based on receiving light from outside the display (201) through the at least one opening.

[0175] According to one embodiment, the fourth camera (842) and the fifth camera (843) may be positioned below the display (201) (e.g., toward the inside of the first housing (810) or the inside of the second housing (820). For example, the fourth camera (842) and the fifth camera (843) may be under-display cameras (UDCs). When the fourth camera (842) and the fifth camera (843) are under-display cameras, an area of ​​the display (201) corresponding to the respective positions of the fourth camera (842) and the fifth camera (843) may not be an inactive area. For example, when the fourth camera (842) and the fifth camera (843) are under-display cameras, an area of ​​the display (201) corresponding to the respective positions of the fourth camera (842) and the fifth camera (843) may have a lower pixel density than a pixel density of another area of ​​the display (201). The inactive area of ​​the display (201) may refer to an area of ​​the display (201) that does not include pixels or does not emit light outside of the electronic device (101). For another example, the fourth camera (842) and the fifth camera (843) may be punch-hole cameras. When the fourth camera (842) and the fifth camera (843) are punch-hole cameras, an area of ​​the display (201) corresponding to the respective positions of the fourth camera (842) and the fifth camera (843) may be an inactive area. For example, when the fourth camera (842) and the fifth camera (843) are punch-hole cameras, an area of ​​the display (201) corresponding to the respective positions of the fourth camera (842) and the fifth camera (843) may include an opening that does not include pixels.

[0176] According to one embodiment, the hinge structure (850) can rotatably connect the first housing (810) and the second housing (820). The hinge structure (850) can be positioned between the first housing (810) and the second housing (820) of the electronic device (101) so that the electronic device (101) can be bent, curved, or folded. For example, the hinge structure (850) can be positioned between a portion of the first side (813) and a portion of the second side (823) that face each other. The hinge structure (850) can change the electronic device (101) into an unfolding state in which the first front surface (811) of the first housing (810) and the second front surface (821) of the second housing (820) face substantially the same direction, or into a folding state in which the first front surface (811) and the second front surface (821) face each other. When the electronic device (101) is in a folding state, the first housing (810) and the second housing (820) can be folded or overlapped by facing each other.

[0177] According to one embodiment, the hinge structure (850) may be configured to deform the third display area (833) of the display (201) by rotatably connecting the first housing (810) and the second housing (820).

[0178] According to one embodiment, when the electronic device (101) is in a folded state, the direction in which the first front surface (811) faces and the direction in which the second front surface (821) faces may be different from each other. For example, when the electronic device (101) is in a folded state, the direction in which the first front surface (811) faces and the direction in which the second front surface (821) faces may be opposite to each other. For another example, when the electronic device (101) is in a folded state, the direction in which the first front surface (811) faces and the direction in which the second front surface (821) faces may be inclined with respect to each other. When the direction in which the first front surface (811) faces is inclined with respect to the direction in which the second front surface (821) faces, the first housing (810) may be inclined with respect to the second housing (820). However, the present invention is not limited thereto. For example, in the folded state of the electronic device (101), the first rear surface (812) of the first housing (810) may face the second rear surface (822) of the second housing (820). When the first rear surface (812) and the second rear surface (822) face each other in the folded state of the electronic device (101), the direction in which the first front surface (811) faces and the direction in which the second front surface (821) faces may be opposite to each other. When the first rear surface (812) and the second rear surface (822) face each other in the folded state of the electronic device (101), the display (201) may be directly exposed to the outside in the folded state of the electronic device (101).

[0179] According to one embodiment, the electronic device (101) may be foldable based on a folding axis (f). The folding axis (f) may refer to a virtual line extending through the hinge cover (851) in a direction substantially parallel to the longitudinal direction of the electronic device (101), but is not limited thereto. For example, the folding axis (f) may be a virtual line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101). When the folding axis (f) extends in a direction substantially perpendicular to the longitudinal direction of the electronic device (101), the hinge structure (850) may extend in a direction parallel to the folding axis (f) to connect the first housing (810) and the second housing (820). The first housing (810) and the second housing (820) may be rotatable by the hinge structure (850) extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101).

[0180] According to one embodiment, the hinge structure (850) may include a hinge cover (851), a first hinge plate (852), a second hinge plate (853), and a hinge module (854). The hinge cover (851) may surround internal components of the hinge structure (850) and form an outer surface of the hinge structure (850). According to one embodiment, the hinge cover (851) surrounding the hinge structure (850) may be at least partially exposed to the outside of the electronic device (101) through a space between the first housing (810) and the second housing (820) when the electronic device (101) is in a folded state. According to an embodiment, when the electronic device (101) is in an unfolded state, the hinge cover (851) may be covered by the first housing (810) and the second housing (820) and may not be exposed to the outside of the electronic device (101).

[0181] According to one embodiment, the first hinge plate (852) and the second hinge plate (853) can be coupled with the first housing (810) and the second housing (820), respectively, thereby rotatably connecting the first housing (810) and the second housing (820). For example, the first hinge plate (852) can be coupled with the first front bracket (815) of the first housing (810), and the second hinge plate (853) can be coupled with the second front bracket (827) of the second housing (820). As the first hinge plate (852) and the second hinge plate (853) are coupled to the first front bracket (815) and the second front bracket (827), respectively, the first housing (810) and the second housing (820) can be rotated according to the rotation of the first hinge plate (852) and the second hinge plate (853).

[0182] The hinge module (854) can rotate the first hinge plate (852) and the second hinge plate (853). For example, the hinge module (854) can rotate the first hinge plate (852) and the second hinge plate (853) about the folding axis (f) by including gears that are interlocked with each other and can rotate. According to one embodiment, the hinge module (854) can be a plurality of pieces. For example, the plurality of hinge modules (854) can be arranged spaced apart from each other at both ends of the first hinge plate (852) and the second hinge plate (853), respectively.

[0183] According to one embodiment, the first housing (810) may include a first front bracket (815) and a first rear bracket (816), and the second housing (820) may include a second front bracket (827) and a second rear bracket (828). The first front bracket (815) and the first rear bracket (816) may support components of the electronic device (101). The first front bracket (815) may define the first housing (810) by being coupled with the first rear bracket (816). The first rear bracket (816) may define a portion of an outer surface of the first housing (810). The second front bracket (827) and the second rear bracket (828) may support components of the electronic device (101). The second front bracket (827) can define a second housing (820) by being coupled with the second rear bracket (828). The second rear bracket (828) can define a portion of an outer surface of the second housing (820). For example, the display (201) can be disposed on one side of the first front bracket (815) and one side of the second front bracket (827). The first rear bracket (816) can be disposed on the other side of the first front bracket (815) opposite the one side of the first front bracket (815). The second rear bracket (828) can be disposed on the other side of the second front bracket (827) opposite the one side of the second front bracket (827). The sub display panel (835) can be placed between the second front bracket (827) and the second rear bracket (828).

[0184] In one embodiment, a portion of the first front bracket (815) may be surrounded by the first side (813), and a portion of the second front bracket (827) may be surrounded by the second side (823). For example, the first front bracket (815) may be formed integrally with the first side (813), and the second front bracket (827) may be formed integrally with the second side (823). In another example, the first front bracket (815) may be formed separately from the first side (813), and the second front bracket (827) may be formed separately from the second side (823).

[0185] At least one electronic component (860) may implement various functions to be provided to a user. According to one embodiment, at least one electronic component (860) may include a first printed circuit board (861) (e.g., the first printed circuit board (250) of FIG. 2B), a second printed circuit board (862) (e.g., the second printed circuit board (252) of FIG. 2B), a flexible printed circuit board (863), a battery (864) (e.g., the battery (189) of FIG. 1), and / or an antenna (865) (e.g., the antenna module (197) of FIG. 1). The first printed circuit board (861) and the second printed circuit board (862) may each form an electrical connection between components within the electronic device (101). For example, components for implementing the overall function of the electronic device (101) (e.g., the processor (120) of FIG. 1) may be placed on the first printed circuit board (861), and electronic components for implementing some functions of the first printed circuit board (861) may be placed on the second printed circuit board (862). As another example, components for the operation of the sub-display panel (835) placed on the second rear surface (822) may be placed on the second printed circuit board (862).

[0186] In one embodiment, the first printed circuit board (861) may be disposed within the first housing (810). For example, the first printed circuit board (861) may be disposed on one surface of the first front bracket (815). In one embodiment, the second printed circuit board (862) may be disposed within the second housing (820). For example, the second printed circuit board (862) may be spaced apart from the first printed circuit board (861) and disposed on one surface of the second front bracket (827). A flexible printed circuit board (863) may connect the first printed circuit board (861) and the second printed circuit board (862). For example, the flexible printed circuit board (863) may extend from the first printed circuit board (861) to the second printed circuit board (862).

[0187] The battery (864) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (864) may be arranged substantially on the same plane as the first printed circuit board (861) or the second printed circuit board (862).

[0188] The antenna (865) may be configured to receive power or a signal from outside the electronic device (101). According to one embodiment, the antenna (865) may be positioned between the first rear bracket (816) and the battery (864). The antenna (865) may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna (865) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0189] The following is a list of embodiments and examples. The present disclosure may include any combination of the following embodiments, examples, and features, except where such combination would result in a contradiction.

[0190] According to the above-described embodiment, the electronic device (electronic device (101) of FIG. 1) may include a printed circuit board (e.g., a first printed circuit board (250), a second printed circuit board (252) of FIG. 2b, a printed circuit board (310) of FIG. 3a), an electronic component coupled to the printed circuit board (e.g., a processor (120) of FIG. 1, an electronic component (301) of FIG. 3a), and a shield can (e.g., a shield can (320) of FIG. 3a) on the printed circuit board that surrounds the electronic component and includes an opening (e.g., an opening (325) of FIG. 3a) facing the electronic component. The electronic device may include a shielding structure on the shield can covering the opening (e.g., the shielding structure (330) of FIG. 3A), and a heat conducting member (e.g., the heat conducting member (340) of FIG. 3A) attached to the electronic component and between the electronic component and the shielding structure, which contacts the shielding structure through the opening. The electronic device may include a metal plate on the shielding structure (e.g., the metal plate (350) of FIG. 3A), and at least one heat dissipation member (e.g., at least one heat dissipation member (360) of FIG. 3A) attached to the metal plate and configured to transfer at least a portion of heat emitted from the electronic component through the heat conducting member. The shielding structure may include a first shielding member attached on the shield can (e.g., the first shielding member (331) of FIG. 3a), a first adhesive member interposed between the first shielding member and the shield can to attach the first shielding member to the shield can (e.g., the first adhesive member (333) of FIG. 3c), a second shielding member attached on the first shielding member (e.g., the second shielding member (332) of FIG. 3a), and a second adhesive member interposed between the first shielding member and the second shielding member to attach the second shielding member to the first shielding member (e.g., the second adhesive member (334) of FIG. 3a).The density of the first shielding member (e.g., d1 in FIG. 3c) may be smaller than the density of the second shielding member (e.g., d2 in FIG. 3c). According to the above-mentioned embodiment, the electronic device can reduce degradation of other electronic components around the electronic component due to electromagnetic waves emitted from the electronic component by including the shield can. The electronic device can reduce degradation of the performance of the electronic component due to heat emitted from the electronic component by including the heat conducting member. The electronic device can shield electromagnetic waves emitted from the electronic component through the opening by including a shielding structure covering the opening. The shielding structure can improve the shielding performance of the shielding structure for the electromagnetic waves emitted from the electronic component through the opening by having a density of the first shielding member smaller than that of the second shielding member. The electronic device can reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the metal plate and the at least one heat dissipation member. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0191] In one embodiment, the shielding structure may include a recess (e.g., recess (330a) of FIG. 3A) recessed from the opening toward the metal plate to accommodate the heat-conducting member penetrating at least a portion of the opening. In the aforementioned embodiment, the shielding structure may provide a space for the heat-conducting member by including the recess. The aforementioned embodiment may have various effects, including the aforementioned effects.

[0192] In one embodiment, the first shielding member can surround at least a portion of the heat-conducting member passing through the opening. The second shielding member can be attached to the heat-conducting member via the second adhesive member. In the above-mentioned embodiment, the shielding structure can transmit at least a portion of the heat emitted from the electronic component through the heat-conducting member by being attached to the heat-conducting member. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0193] According to one embodiment, the metal plate may include a heat dissipation portion (e.g., a heat dissipation portion (350a) of FIG. 4A) disposed on the electronic component. The at least one heat dissipation member may include a first heat dissipation member (e.g., a first heat dissipation member (361) of FIG. 4D) covering at least a portion of a second surface (e.g., a second surface (352) of FIG. 3A) of the metal plate opposite a first surface (e.g., a first surface (351) of FIG. 3A) of the metal plate facing the shield can. The electronic device may further include an insulating member (e.g., an insulating member (370) of FIG. 3A) attached to the heat dissipation portion and at least a portion of which is surrounded by the first heat dissipation member. According to the above-mentioned embodiment, the electronic device may reduce degradation of performance of the electronic device due to heat emitted from the electronic component by including the insulating member and the first heat dissipation member. The above-mentioned embodiments may have various effects including the above-mentioned effects.

[0194] According to one embodiment, the at least one heat dissipation member may further include a second heat dissipation member (e.g., the second heat dissipation member (362) of FIG. 4D) disposed on the first heat dissipation member and the insulating member and covering the insulating member. According to the above-mentioned embodiment, the electronic device may reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the second heat dissipation member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0195] According to one embodiment, the first shielding member (331) may include a first region (e.g., the first region (331c) of FIG. 3C) including an adhesive material by the first adhesive member, and a second region (e.g., the second region (331d) of FIG. 3C) including an adhesive material by the second adhesive member. At least a portion (e.g., points (p1, p2, p3)) of one side (e.g., the fourth side (331b) of FIG. 3C) of the first shielding member facing the second shielding member may be in contact with the second shielding member. According to the above-mentioned embodiment, the first shielding member may improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening by at least a portion thereof being in contact with the second shielding member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0196] According to one embodiment, the thickness of the first shielding member (e.g., t1 in FIG. 3c) may be positioned within a range of 70 μm or more and 80 μm or less. The thickness of the second shielding member (e.g., t2 in FIG. 3c) may be positioned within a range of 10 μm or more and 20 μm or less. According to the above-mentioned embodiment, the shielding structure may improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0197] According to one embodiment, the heat-conducting member may include at least one of rubber, paraffin wax, and oil. According to the above-mentioned embodiment, the heat-conducting member may provide structural stability of the structures on the heat-conducting member by reducing the repulsive force against the structures on the heat-conducting member that pressurize the heat-conducting member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0198] In one embodiment, the metal plate may include a recess (e.g., recess (355) of FIG. 4A) that is sunken from a second surface of the metal plate opposite to the first surface of the metal plate facing the shield can toward the heat conducting member. The at least one heat dissipating member may be disposed within the recess so as to overlap the electronic component when the metal plate is viewed from above. In the above-mentioned embodiment, the metal plate may include the recess for accommodating the at least one heat dissipating member, thereby reducing degradation of the performance of the electronic device due to heat emitted from the electronic component. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0199] According to one embodiment, the at least one heat dissipation member may include a third heat dissipation member (e.g., the third heat dissipation member (363) of FIG. 5A) that covers at least a portion of the first surface of the metal plate facing the shield can and is attached to the shielding structure. According to the above-mentioned embodiment, the electronic device may reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the third heat dissipation member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0200] An electronic device according to one embodiment may further include an insulating member at least partially surrounded by the third heat dissipation member. The metal plate may include a heat dissipation portion disposed on the electronic component and to which the insulating member is attached. The at least one heat dissipation member may further include a fourth heat dissipation member (e.g., the fourth heat dissipation member (364) of FIG. 5B) disposed on the third heat dissipation member and the insulating member and covering the insulating member. According to the above-mentioned embodiment, the electronic device may reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the fourth heat dissipation member and the insulating member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0201] According to one embodiment, the at least one heat dissipation member may include at least one of a vapor chamber, a heat pipe, graphite, and graphene. According to the above-mentioned embodiment, the at least one heat dissipation member may reduce performance degradation of the electronic device due to heat emitted from the electronic component. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0202] According to one embodiment, the thickness of the first adhesive member (e.g., t3 in FIG. 3c) and the thickness of the second adhesive member (e.g., t4, t5 in FIG. 3c) may each be positioned within a range of 1 μm or more and 15 μm or less. According to the above-mentioned embodiment, the shielding structure may improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0203] According to one embodiment, the shielding structure may further include a protective member (e.g., the protective member (335) of FIG. 3C) disposed on the second shielding member. According to the above-mentioned embodiment, the shielding structure may reduce performance degradation due to external impact by including the protective member. The above-mentioned embodiment may have various effects, including the above-mentioned effects.

[0204] An electronic device according to one embodiment may include a display (e.g., a display (201) of FIG. 2A) on the metal plate, which includes a first display area (e.g., a first display area (831) of FIG. 8A), a second display area (e.g., a second display area (832) of FIG. 8A) spaced apart from the first display area, and a third display area (e.g., a third display area (833) of FIG. 8A) connecting the first display area and the second display area and foldable with respect to a folding axis. The electronic device may further include a first housing (e.g., a first housing (810) of FIG. 8A) supporting the first display area, a second housing (e.g., a second housing (820) of FIG. 8A) supporting the second display area, and a hinge structure (e.g., a hinge structure (850) of FIG. 8B) configured to deform the third display area by rotatably coupling the first housing and the second housing. According to the above-mentioned embodiment, the electronic device can provide a variety of user experiences to the user by including the hinge structure that rotatably connects the first housing and the second housing. The above-mentioned embodiment can have various effects, including the effects mentioned above.

[0205] In one embodiment, an electronic device may include a printed circuit board, an electronic component coupled to the printed circuit board, and a shield can on the printed circuit board, the shield can surrounding the electronic component and having an opening facing the electronic component. The electronic device may include a shielding structure on the shield can covering the opening, and a heat conducting member between the electronic component and the shielding structure, the heat conducting member being attached to the electronic component and in contact with the shielding structure through the opening. The electronic device may include a metal plate on the shielding structure, and at least one heat dissipation member attached to the metal plate and configured to receive at least a portion of heat emitted from the electronic component through the heat conducting member. The shielding structure may include a first shielding member attached to the shield can, a first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can, a second shielding member attached to the first shielding member, a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member, a protective member disposed on the second shielding member, and a groove recessed from the opening toward the metal plate for accommodating the thermally conductive member penetrating the opening. The density of the first shielding member may be lower than the density of the second shielding member. According to the above-mentioned embodiment, the electronic device may reduce degradation of other electronic components around the electronic component due to electromagnetic waves emitted from the electronic component by including the shield can. The electronic device can reduce performance degradation of the electronic component due to heat emitted from the electronic component by including the heat conducting member.The electronic device can shield electromagnetic waves emitted from the electronic component through the opening by including a shielding structure covering the opening. The shielding structure can improve the shielding performance of the shielding structure for the electromagnetic waves emitted from the electronic component through the opening by having a density of the first shielding member lower than a density of the second shielding member. The electronic device can reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the metal plate and the at least one heat dissipation member. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0206] According to one embodiment, the first shielding member may include a first region including an adhesive material by the first adhesive member, and a second region including an adhesive material by the second adhesive member. At least a portion of one side of the first shielding member facing the second shielding member may be in contact with the second shielding member. According to the above-mentioned embodiment, the first shielding member may improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening by at least a portion of the first shielding member being in contact with the second shielding member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0207] In one embodiment, the heat-conducting member may include at least one of rubber, paraffin wax, and oil. In the aforementioned embodiment, the heat-conducting member may provide structural stability to structures on the heat-conducting member by reducing the repulsive force against the structures on the heat-conducting member that pressurize the heat-conducting member. The aforementioned embodiment may have various effects, including the effects mentioned above.

[0208] According to one embodiment, the metal plate may include a heat dissipation portion disposed on the electronic component. The at least one heat dissipation member may include a first heat dissipation member covering at least a portion of a second surface of the metal plate opposite a first surface of the metal plate facing the shield can. The electronic device may further include an insulating member attached to the heat dissipation portion and at least a portion of which is surrounded by the first heat dissipation member. According to the above-mentioned embodiment, the electronic device may reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the insulating member and the first heat dissipation member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0209] According to one embodiment, the at least one heat dissipation member may further include a second heat dissipation member disposed on the first heat dissipation member and the insulating member and covering the insulating member. According to the above-mentioned embodiment, the electronic device may reduce performance degradation of the electronic device due to heat emitted from the electronic component by including the second heat dissipation member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0210] In a first example, an electronic device is provided, comprising: a printed circuit board; an electronic component disposed on an upper surface of the printed circuit board; a shield can disposed on the printed circuit board and configured to surround the electronic component, the shield can including an opening facing the electronic component; a shielding structure disposed on the shield can and configured to cover the opening; a heat conducting member disposed between the electronic component and the shielding structure, the heat conducting member being attached to the electronic component and configured to contact the shielding structure through the opening; and a heat dissipation structure disposed on the shielding structure, the heat dissipation structure including a metal plate and at least one heat dissipation member attached to the metal plate, the at least one heat dissipation member being configured to receive at least a portion of heat emitted from the electronic component through the heat conducting member; and the shielding structure including: a first shielding member attached on the shield can; A first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can; a second shielding member attached on the first shielding member; and a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member; wherein the density of the first shielding member is lower than the density of the second shielding member.

[0211] In a second example, the electronic device of the first example is provided, wherein the shielding structure further includes a recess extending from the opening toward the metal plate for accommodating the heat conducting member penetrating at least a portion of the opening.

[0212] In a third example, the electronic device of the first example or the second example is provided, wherein the first shielding member surrounds at least a portion of the heat conducting member passing through the opening, and the second shielding member is attached to the heat conducting member by the second adhesive member.

[0213] In a fourth example, the metal plate includes a heat dissipation portion overlapping at least a portion of the electronic component in a first direction perpendicular to an upper surface of the printed circuit board, the at least one heat dissipation member includes a first heat dissipation member covering at least a portion of a second surface of the metal plate opposite a first surface of the metal plate facing the shield can, and the electronic device further includes an insulating member overlapping at least partially with the heat dissipation portion in the first direction, wherein the electronic device is provided with any one of the first to third examples.

[0214] In a fifth example, the electronic device of any one of the first to fourth examples is provided, wherein the insulating member is at least partially surrounded by the first heat dissipation member, and the at least one heat dissipation member further includes a second heat dissipation member disposed on the first heat dissipation member and covering the insulating member.

[0215] In a sixth example, the electronic device of any one of the first to fifth examples is provided, wherein the first shielding member includes a first region comprising an adhesive material from the first adhesive member; and a second region comprising an adhesive material from the second adhesive member, and at least a portion of a surface of the first shielding member facing the second shielding member is in contact with the second shielding member.

[0216] In the seventh example, the electronic device of any one of the first to sixth examples is provided, wherein the thickness of the first shielding member is in a range of 70 μm or more and 80 μm or less, and the thickness of the second shielding member is in a range of 10 μm or more and 20 μm or less.

[0217] In the eighth example, the electronic device of any one of the first to seventh examples is provided, wherein the heat conducting member comprises at least one of rubber, paraffin wax, and oil.

[0218] In a ninth example, the metal plate includes a recess or a through-hole, and the recess or the through-hole is configured to at least partially overlap the electronic component in a first direction perpendicular to an upper surface of the printed circuit board, and the at least one heat dissipation member is disposed in the recess or the through-hole, and the recess is formed on a first surface of the metal plate facing the shield can, or the recess is formed on a second surface of the metal plate opposite to the first surface, or the through-hole extends from the first surface of the metal plate to the second surface of the metal plate, wherein the electronic device of any one of the first to eighth examples is provided.

[0219] In a tenth example, the electronic device of any one of the first to ninth examples is provided, wherein the at least one heat dissipation member further includes a third heat dissipation member covering at least a portion of the first surface of the metal plate facing the shield can.

[0220] In the eleventh example, the electronic device of any one of the first to tenth examples is provided, further comprising an insulating member at least partially surrounded by the third heat dissipation member, wherein the metal plate at least partially overlaps the electronic component in a first direction perpendicular to the upper surface of the printed circuit board and includes a heat dissipation portion to which the insulating member is attached, and wherein the at least one heat dissipation member further comprises a fourth heat dissipation member disposed on the third heat dissipation member.

[0221] In a twelfth example, the electronic device of any one of the first to eleventh examples is provided, wherein the at least one heat dissipating member comprises at least one of a vapor chamber, a heat pipe, graphite, and graphene.

[0222] In the 13th example, the electronic device of any one of the first to twelfth examples is provided, wherein the thickness of the first adhesive member and the thickness of the second adhesive member are each in a range of 1 μm or more and 15 μm or less.

[0223] In a fourteenth example, the electronic device of any one of the first to thirteenth examples is provided, wherein the shielding structure further includes a protective member disposed on the second shielding member.

[0224] In a fifteenth example, the electronic device of any one of the first to fourteenth examples is provided, wherein the display is disposed on the metal plate, the display includes a first display area, a second display area spaced apart from the first display area, and a third display area connecting the first display area and the second display area and foldable with respect to a folding axis; a first housing supporting the first display area; a second housing supporting the second display area; and a hinge structure configured to rotatably couple the first housing and the second housing to deform the third display area.

[0225] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0226] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0227] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0228] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0229] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0230] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Printed circuit board (310); Electronic components (301) placed on the above printed circuit board (310); A shield can (320) configured to surround the electronic component (301) and placed on the printed circuit board (310), the shield can (320) including an opening (325) facing the electronic component (301); A shielding structure (330) configured to cover the above opening (325) and placed on the shield can (320); A heat conducting member (340) disposed between the electronic component (301) and the shielding structure (330), the heat conducting member (340) being attached to the electronic component (301) and configured to be in contact with the shielding structure (330) through the opening (325); It includes a heat dissipation structure arranged on the above shielding structure (330), The above heat dissipation structure includes a metal plate (350), and at least one heat dissipation member (360) attached to the metal plate (350) and configured to transfer at least a portion of the heat emitted from the electronic component (301) through the heat conducting member (340). The above shielding structure (330) is A first shielding member (331) attached to the above shield can (320); In order to attach the first shielding member (331) to the shield can (320), a first adhesive member (333) interposed between the first shielding member (331) and the shield can (320); A second shielding member (332) attached on the first shielding member (331); and In order to attach the second shielding member (332) to the first shielding member (331), a second adhesive member (334) interposed between the first shielding member (331) and the second shielding member (332) is included; The density (d1) of the first shielding member (331) is Smaller than the density (d2) of the second shielding member (332) Electronic devices (101).

2. In paragraph 1, The above shielding structure (330) is In order to accommodate the heat conducting member (340) penetrating at least a portion of the opening (325), further comprising a groove (330a) indented from the opening (325) toward the metal plate (350); Electronic devices (101).

3. In paragraph 1 or 2, The above first shielding member (331) is Surrounding at least a portion of the heat conducting member (340) passing through the opening (325), The above second shielding member (332) is Attached to the heat conducting member (340) by the second adhesive member (334), Electronic devices (101).

4. In any one of paragraphs 1 to 3, The above metal plate (350) is It includes a heat dissipation portion (350a) that overlaps at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310) on which the electronic component (301) is placed; At least one of the above heat dissipation members (360) is A first heat dissipation member (361) covering at least a portion of a second surface (352) of the metal plate (350) opposite to the first surface (351) of the metal plate (350) facing the shield can (320); Further comprising an insulating member (370) that at least partially overlaps the heat dissipation portion (350a) in the first direction; Electronic devices (101).

5. In paragraph 4, The above insulating member (370) is at least partially surrounded by the first heat dissipation member (361), At least one of the above heat dissipation members (360) is Further comprising a second heat dissipation member (362) disposed on the first heat dissipation member (361) and the insulation member (370) and covering the insulation member (370); Electronic devices (101).

6. In any one of paragraphs 1 to 5, The above first shielding member (331) is A first region (331c) including an adhesive material by the first adhesive member (333); and A second region (331d) including an adhesive material by the second adhesive member (334); At least a part of one side (331b) of the first shielding member (331) facing the second shielding member (332), In contact with the second shielding member (332), Electronic devices (101).

7. In any one of paragraphs 1 to 6, The thickness (t1) of the first shielding member (331) is Located within the range of 70㎛ or more and 80㎛ or less, The thickness (t2) of the second shielding member (332) is Located within the range of 10㎛ or more and 20㎛ or less, Electronic devices (101).

8. In any one of paragraphs 1 to 7, The above heat conducting member (340) is Containing at least one of rubber, paraffin wax, and oil; Electronic devices (101).

9. In any one of paragraphs 1 to 3, or paragraphs 6 to 8, The metal plate (350) includes a recess or a through hole, and the recess or the through hole is configured to overlap at least a portion of the electronic component (301) in a first direction perpendicular to the upper surface of the printed circuit board (310) on which the electronic component (301) is placed. At least one of the above heat dissipation members (360) is placed in the recess or the through hole, The above recess is formed on the first surface (351) of the metal plate (350) facing the shield can (320), or on the second surface (352) of the metal plate (350) opposite to the first surface (351). The above through hole extends from the first surface (351) of the metal plate (350) to the second surface (352) of the metal plate (351). Electronic devices (101).

10. In any one of paragraphs 1 to 8, At least one of the above heat dissipation members (360) is A third heat dissipation member (363) covering at least a portion of the first surface (351) of the metal plate (350) facing the shield can (320); Electronic devices (101).

11. In paragraph 10, Further comprising an insulating member (370) at least partially surrounded by the third heat dissipation member (363); The above metal plate (350) is It includes a heat dissipation part (350a) placed on the electronic component (301) and to which the insulating member (370) is attached; At least one of the above heat dissipation members (360) is Further comprising a fourth heat dissipation member (364) arranged on the third heat dissipation member (363); Electronic device (101).

12. In any one of paragraphs 1 to 11, At least one of the above heat dissipation members (360) is Comprising at least one of a vapor chamber, a heat pipe, graphite, and graphene, Electronic device (101).

13. In any one of paragraphs 1 to 12, The thickness (t3) of the first adhesive member (333) and the thickness (t4, t5) of the second adhesive member (334) are Each is located within a range of 1㎛ or more and 15㎛ or less, Electronic device (101).

14. In any one of paragraphs 1 to 13, The above shielding structure (330) is Further comprising a protective member (335) placed on the second shielding member (332). Electronic device (101).

15. In any one of paragraphs 1 to 14, A display (201) on the metal plate (350) including a first display area (831), a second display area (832) spaced apart from the first display area (831), and a third display area (833) connecting the first display area (831) and the second display area (832) and foldable with respect to a folding axis (f); A first housing (810) supporting the first display area (831); A second housing (820) supporting the second display area (832); and Further comprising a hinge structure (850) configured to deform the third display area (833) by rotatably connecting the first housing (810) and the second housing (820); Electronic device (101).

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