Socket device for testing circuit of electronic device

Abstract

Disclosed is a socket device for testing a circuit of an electronic device, the socket device having a structure that combines a MEMS pin and metal powder and thus able to handle fine pitches and high-speed testing as well as have an extended lifespan. The socket device for testing a circuit of an electronic device according to one aspect of the present invention may comprise: a MEMS pin having an upper body, a lower body, and an elastic connection member for connecting the upper body and the lower body; a rubber layer having a through-hole in which the MEMS pin is embedded while supported in a standing position; and a metal powder layer including a plurality of metal powder particles and fixed between the MEMS pin and the rubber layer so as to surround the MEMS pin.

Description

Socket device for circuit inspection of electronic components

[0001] The present invention relates to a socket device for circuit inspection of electronic devices, and more specifically, to a socket device for circuit inspection of electronic devices capable of responding to fine pitch and high-speed inspection while extending the lifespan by presenting a structure that fuses a MEMS pin and a metal powder.

[0002] In general, products with formed circuit patterns, such as semiconductor devices and flat panel displays (FPDs), require a process of inspecting the electrical status of the circuit patterns, etc. during the manufacturing process, and the device applied here can be called a socket device for circuit inspection of electronic devices.

[0003] For example, a semiconductor device with an electrical circuit formed on a silicon wafer undergoes an EDS (Electrical Die Sorting) process to inspect its electrical characteristics. An inspection device can perform the EDS process by applying an electrical signal to a chip formed on a silicon wafer, obtaining an electrical signal output from the chip, and determining whether the chip is defective.

[0004] According to the prior art, various types of sockets are applied to semiconductor device test sockets, such as pogo type, rubber type, and injection molding plate type.

[0005] As semiconductor devices evolve toward higher integration, lower power, and higher speeds, test sockets are increasingly required to handle complex challenges. These challenges include the need to support fine pitch, high speed, and high temperature, while also ensuring product lifespans meet customer demands.

[0006] For the pogo pin type, there are physical limitations to its ability to support fine pitch due to its structural nature. Consequently, there was a problem in which the unit price increased rapidly as miniaturization progressed.

[0007] The rubber type has a problem in that its characteristics vary greatly depending on the test temperature, and there was a problem in that poor characteristics and rapid reduction in lifespan occurred during cold testing of fine pitch products.

[0008] The injection molding plate pin type has problems such as ball damage during ball package inspection in the burn-in process.

[0009] Currently, rubber products using metal powder are mainly used in the fine pitch product group of memory semiconductor products, but there is a problem that many problems occur due to rapid reduction in lifespan in high and low temperature tests (Hot / Cold Test) of fine pitch products.

[0010] In addition, according to the prior art, there were problems in which contact was not properly made due to accumulated processing tolerances of structures that perform electrical contact in various ways and members such as pins installed in the structures.

[0011] That is, referring to Fig. 1, a conventional MEMS pin (10) can be applied. The MEMS pin (10) has an upper body (11) and a lower body (13), and has a connecting portion (12) that elastically connects them. However, since the MEMS pin (10) is manufactured in a thin plate shape, there was a problem that as the terminal pitch became finer due to the accumulation of processing tolerance, the terminal deviated from the upper surface of the plate shape, resulting in a defect.

[0012] The present invention is intended to solve the above problems, and the purpose of the present invention is to provide a socket device for circuit inspection of electronic components that can cope with fine pitch and high-speed inspection and can cope with high temperatures, thereby extending the product lifespan.

[0013] Another object of the present invention is to provide a socket device for circuit inspection of electronic devices that can secure contact stability through surface contact by applying a MEMS pin and metal powder together to the contact.

[0014] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0015] According to one aspect of the present invention, a socket device for circuit inspection of an electronic device is provided, comprising: a MEMS pin having an upper body, a lower body, and an elastic connecting portion connecting the upper body and the lower body; a rubber layer having a through hole for embedding the MEMS pin while the MEMS pin is supported in an upright position; and a metal powder layer including a plurality of metal powders fixed between the MEMS pin and the rubber layer so as to surround the MEMS pin.

[0016] According to another aspect of the present invention, a socket device for circuit inspection of an electronic device is provided, comprising: a MEMS pin having an upper body, a lower body, and an elastic connecting portion connecting the upper body and the lower body; a rubber layer having a through hole for embedding the MEMS pin in a state where the MEMS pin is supported while standing; and a metal powder layer having a recessed portion formed by a portion of the rubber layer being recessed at a position where an upper or lower portion of the MEMS pin is disposed, and including a plurality of metal powders filled and fixed in the recessed portion.

[0017] At this time, the through hole of the rubber layer may have a tapered shape.

[0018] At this time, an upper film and a lower film can be bonded to the upper and lower surfaces of the rubber layer so as to support the MEMS pin.

[0019] At this time, the through hole of the rubber layer through which the MEMS pin penetrates may be empty and not supplied with rubber material.

[0020] At this time, the penetration hole of the rubber layer through which the MEMS pin penetrates may be filled with a rubber material that is softer than other parts.

[0021] At this time, the rubber layers on which the lower body and upper body of the MEMS pin are arranged may be filled with different rubber materials, but the rubber material filled in the upper body may be softer than the rubber material filled in the lower body.

[0022] At this time, the elastic connecting part of the above MEMS pin may not be provided with rubber material, so an air layer may be formed.

[0023] At this time, the metal powder layer may be arranged to surround the entire MEMS pin, or may be arranged to surround only the upper body or lower body of the MEMS pin.

[0024] At this time, the recessed portion may have a larger area so as to cover the area of ​​the end of the upper body or lower body of the MEMS pin.

[0025] At this time, a rubber film layer may be installed to cover all or part of the upper portion of the rubber layer, and may include a connection terminal provided at each position corresponding to the MEMS pin so that the height can be adjusted for all or part of the rubber layer and applied to multiple terminals.

[0026] At this time, the rubber film layer is replaceable.

[0027] At this time, the rubber layer may be made of silicone rubber.

[0028] According to the above configuration, a socket device for circuit inspection of an electronic device according to one aspect of the present invention can support fine pitch and high-speed inspection and can be miniaturized by applying a MEMS pin and metal powder.

[0029] A socket device for circuit inspection of an electronic device according to one aspect of the present invention can completely prevent poor contact by increasing the terminal contact area by having metal powder come into contact with the terminal together with the MEMS pin.

[0030] A socket device for circuit inspection of an electronic device according to one aspect of the present invention can extend the lifespan during high-temperature and low-temperature tests by applying MEMS pins to fine-pitch products.

[0031] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0032] Fig. 1 is a perspective view of a MEMS pin according to the prior art.

[0033] FIG. 2 is a cross-sectional view of a socket device for circuit inspection of an electronic device according to a first embodiment of the present invention.

[0034] FIG. 3 is a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic component according to a first embodiment of the present invention.

[0035] FIG. 4 is a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic component according to a second embodiment of the present invention.

[0036] FIG. 5 is a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic device according to a third embodiment of the present invention.

[0037] Fig. 6 is a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic component according to a fourth embodiment of the present invention.

[0038] Fig. 7 is a cross-sectional view of a socket device for circuit inspection of an electronic device according to a fifth embodiment of the present invention.

[0039] FIG. 8 is a partially exploded perspective view of a socket device for circuit inspection of an electronic device according to a fifth embodiment of the present invention.

[0040] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0041] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0042] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0043] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0044] When a component is said to be "in front of," "behind," "above," or "below" another component, this includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if there is another component intervening therebetween. Furthermore, when a component is said to be "connected" to another component, this includes not only being directly connected to one another, but also being indirectly connected to one another, unless there are special circumstances.

[0045] Hereinafter, a socket device (100) for circuit inspection of an electronic device according to an embodiment of the present invention will be described with reference to the drawings.

[0046] A socket device (100) for circuit inspection of an electronic device according to a first embodiment of the present invention may include a MEMS pin (110), a rubber layer (140), and a metal powder layer (114), as shown in FIGS. 2 and 3.

[0047] The above MEMS pin (110), referring to FIGS. 2 and 3, may be provided with an upper body (111), a lower body (113), and an elastic connecting portion (112) connecting the upper body (111) and the lower body (113).

[0048] At this time, the upper body (111) and the lower body (113) of the MEMS pin (110) can be formed in a panel shape and have a square shape.

[0049] At this time, the elastic connecting portion (112) of the MEMS pin (110) connects the upper and lower bodies (111, 113), but is formed thinly and in a zigzag shape, so that it can be formed in the shape of a two-dimensional spring, for example.

[0050] At this time, the terminal (82) of the inspection object (300) can come into contact with the upper body (111) of the MEMS pin (110), and the PCB terminal of the inspection device can come into contact with the lower body (113).

[0051] Referring to FIGS. 2 and 3, the above rubber layer (140) may be provided with a through hole (115) so that the MEMS pin (110) can be embedded in the MEMS pin (110) while the MEMS pin (110) is erected and supported.

[0052] At this time, the through hole (115) of the rubber layer (140) can be manufactured by pouring liquid silicone rubber and solidifying it while the MEMS pin (110) is standing up. Accordingly, the MEMS pin (110) can be completely fixed and embedded in the rubber layer (140).

[0053] Alternatively, the silicone rubber may be hardened to form a rubber layer (140), a through hole (115) may be formed in the rubber layer (140), and then the MEMS pin (110) may be inserted into the through hole (115). At this time, the MEMS pin (110) may be installed in a force-fit manner in the through hole (115) of the rubber layer (140).

[0054] At this time, since the rubber layer (140) has a material of silicone rubber, it is a very elastic and flexible material, so even when the terminal (82) of the inspection object (300) or the PCT terminal of the inspection device is separated from each other, they can come into contact with each other when pressure is applied.

[0055] At this time, the through hole (115) of the rubber layer (140) may have a tapered shape. By forming the through hole (115) in a tapered shape, stable contact between the metal powders can be ensured.

[0056] At this time, an upper film (130) and a lower film (120) can be adhered to the upper and lower surfaces of the rubber layer (140) so as to support the MEMS pin (110). That is, when manufacturing the rubber layer (140), the upper film (130) and the lower film (120) can serve as a frame for the liquid silicone rubber.

[0057] Of course, the upper film (130) and the lower film (120) may be removed after manufacturing, or a separate jig may be manufactured instead of the upper film (130) and the lower film (120) to replace the mold for manufacturing the rubber layer.

[0058] At this time, the through hole (115) of the rubber layer (140) through which the MEMS pin (110) penetrates may be empty without being supplied with rubber material, or may be filled with a rubber material that is softer than other parts.

[0059] At this time, the rubber layer (140) in which the lower body (113) and the upper body (111) of the MEMS pin (110) are arranged are filled with different rubber materials, but the rubber material filled around the upper body (111) may be made softer than the rubber material filled around the lower body (113).

[0060] At this time, since the rubber material is not provided only around the elastic connecting portion (112) of the MEMS pin (110), an air layer may be formed. In this case, the flexibility of the elastic connecting portion (112) may be improved, and as a result, the flexibility may be improved generally throughout the entire rubber layer (140).

[0061] Referring to FIGS. 2 and 3, the metal powder layer (114) may include a plurality of metal powders fixed between the MEMS pin (110) and the rubber layer (140) so as to surround the MEMS pin (110).

[0062] At this time, the metal powder layer (114) may be arranged to surround the entire MEMS pin (110), or may be arranged to surround only the upper body (111) or lower body (113) of the MEMS pin (110).

[0063] At this time, the metal powder layer (114) can be manufactured by providing a plurality of metal powders in a partially closed space and supplying a bonding material capable of fixing and bonding them. In this way, the metal powders can be bonded and fixed to each other while maintaining an electrical connection state by contacting each other.

[0064] At this time, the metal powder layer (114) produced in this way has a jelly-like form and can move flexibly while also allowing current to flow.

[0065] At this time, when the metal powder layer (114) is installed to surround the upper body (111) of the MEMS pin (110), the space of the through hole (115) through which the metal powder is supplied may have a tapered shape. That is, the diameter of the metal powder layer (140) at the upper portion may be formed larger than that at the lower portion.

[0066] By forming in this way, the metal powder can be more firmly adhered to the upper body (111) of the MEMS pin (110), and the upper part can increase the contact area that can make electrical contact with the terminal (82) of the inspection target (300).

[0067] Referring to FIG. 2, a cross-sectional view of a socket device for circuit inspection of an electronic device according to a first embodiment of the present invention is illustrated. Referring to FIG. 3, a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic device according to a first embodiment of the present invention is illustrated.

[0068] In the illustrated embodiment, a plurality of MEMS pins (110) are erected and embedded in a rubber layer (140). The MEMS pin (110) is composed of an upper body (111) and a lower body (113), like a typical MEMS pin (110), and includes an elastic connecting portion (112) connecting them. The MEMS pin (110) may be formed in a thin plate shape.

[0069] At this time, an upper film (111) and a lower film (113) are installed on the upper and lower sides of the rubber layer (140), respectively.

[0070] At this time, since the MEMS pin (110) is embedded through the upper and lower films (111, 113) and the rubber layer (140), a through hole (115) is formed in each.

[0071] At this time, the through hole (115) of the upper film (130) is formed in a tapered shape and is spaced apart from the upper body (111), and a metal powder layer (114) is installed between them to surround the upper body (111).

[0072] Therefore, the inspection current can flow through the upper body (111), the metal powder layer (114), the elastic connecting portion (112), and the lower body (113).

[0073] In Fig. 2, the terminal (82) of the inspection object (300) is a BGA type terminal. In the illustrated embodiment, the terminal (82) is in contact with the upper body (111), so that inspection current can flow.

[0074] At this time, since the upper body (111) is thin, there may be cases where it is out of contact with the terminal (82). In this case, since the terminal (82) is in contact with the metal powder layer (114), the inspection current can eventually flow through the upper body (111), the elastic connecting portion (112), and the lower body (113).

[0075] Here, since the through hole (115) is formed in a tapered shape and the area of ​​the upper part of the metal powder layer (141) is larger than that of the lower part, electrical contact can be made over a wide area, thereby preventing inspection defects due to non-contact through a stable flow of inspection current.

[0076] At this time, the case in which it is used with the upper and lower films (130, 120) is shown here, but it is of course possible to use it with the film removed, that is, with only the rubber layer (140).

[0077] Meanwhile, referring to FIG. 4, a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic device according to a second embodiment of the present invention is illustrated, and referring to FIG. 5, a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic device according to a third embodiment of the present invention is illustrated.

[0078] In the illustrated embodiment, a socket device for circuit inspection of an electronic component may include a MEMS pin (110) having an upper body (111), a lower body (113), and an elastic connecting portion (112) connecting the upper body (111) and the lower body (113), a rubber layer (140) having a through hole for embedding the MEMS pin (110) in a state in which the MEMS pin (110) is supported while standing up, and a metal powder layer (114) including a recessed portion (215) formed by partially recessing the rubber layer (140) at a position where the upper or lower portion of the MEMS pin (110) is disposed and a plurality of metal powders filled and fixed in the recessed portion (215).

[0079] The difference between the second and third embodiments of the present invention is that the recessed portion (215) where the metal powder layer (114) is formed is formed at the top or bottom of the rubber layer (140).

[0080] In the illustrated embodiment, the metal powder layer (114) is not installed to wrap around the upper and lower bodies (111, 113) of the MEMS pin (110), but is positioned at the upper or lower end, so that only the metal powder layer (114) can directly contact the terminals (82), which is different from the previous embodiment.

[0081] At this time, it goes without saying that the recessed portion (215) where the metal powder layer (114) is placed can be placed directly on the rubber layer (140) in the absence of upper and lower films in addition to the upper and lower films (130, 120).

[0082] At this time, the shape of the recessed portion (215) where the metal powder layer (114) is placed can also be formed in a tapered shape.

[0083] At this time, the recessed portion (215) may preferably have a larger area so as to cover the area of ​​the end of the upper body (111) or the lower body (113) of the MEMS pin (110).

[0084] Meanwhile, referring to FIG. 6, a partially enlarged cross-sectional view of a socket device for circuit inspection of an electronic component according to the fourth embodiment of the present invention is shown.

[0085] In the illustrated embodiment, there is a difference in that, unlike the first embodiment, the metal powder layer (114) is installed not to surround only the upper and lower bodies of the MEMS pin (110), but to surround the entire MEMS pin (110).

[0086] By forming a metal powder layer (114) over the entire MEMS pin (110) in this way, the metal powder layer (114) can be in contact not only with the upper and lower bodies (111, 113) but also with the elastic connecting portion (112). Therefore, even if there is a partial contact failure, for example, a partial break in the elastic connecting portion (112), the inspection current can flow to the upper and lower ends of the MEMS pin (110).

[0087] Meanwhile, referring to FIG. 7, a cross-sectional view of a socket device for circuit inspection of an electronic device according to a fifth embodiment of the present invention is shown, and referring to FIG. 8, a partially exploded perspective view of a socket device for circuit inspection of an electronic device according to a fifth embodiment of the present invention is shown.

[0088] In the illustrated embodiment, a socket device (100) capable of inspecting electronic components (300) having different types of terminals is illustrated.

[0089] In the illustrated embodiment, the terminal (81) on the left side of the electronic component (300) is of the LGA type, and the terminal (82) on the right side is of the BGA type. Therefore, there are multiple types of terminals of the electronic component (300), and the heights of the terminals also differ depending on the type.

[0090] In the illustrated embodiment, the socket device (100) can be manufactured as a single unit, and if the terminals arranged on the upper side are different, the socket device can be manufactured as modules by classifying the socket device according to the terminal type and the different terminals.

[0091] In the illustrated embodiment, the socket device (100) is composed of upper and lower films (120, 130), a rubber layer (140), a MEMS pin (110), and a metal powder layer (114), as described above. The socket device (100) may be manufactured as a single unit or in multiple pieces depending on the terminal. Here, it is manufactured as two socket devices (100a, 100b).

[0092] In the illustrated embodiment, a rubber film layer (150) may be installed to cover all or part of the upper portion of the rubber layer (140), and may include a connection terminal or metal powder layer (151) provided at each position corresponding to the MEMS pin (110) and the metal powder layer (114) so ​​that the height can be adjusted for all or part of the multi-terminal (81, 82).

[0093] At this time, the rubber film layer (150) is replaceable.

[0094] At this time, the rubber film layer (150) can correspond to the step of the terminal (81, 82), is made of the same silicone rubber as the rubber layer (140), and a connecting terminal or a metal powder layer (151) can be fixed at the position of the terminal (81, 82).

[0095] At this time, since the rubber film layer (150) is replaceable, a new rubber film layer can be easily replaced when the expiration date is reached.

[0096] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0097] The present invention can be applied to inspecting semiconductor devices, which are microscopic electronic components.

Claims

1. A MEMS pin having an upper body, a lower body, and an elastic connecting member connecting the upper body and the lower body; A rubber layer having a through hole for embedding the MEMS pin while the MEMS pin is erected and supported; and A metal powder layer including a plurality of metal powders fixed between the MEMS pin and the rubber layer to surround the MEMS pin; Socket device for circuit inspection of electronic components.

2. A MEMS pin having an upper body, a lower body, and an elastic connecting member connecting the upper body and the lower body; A rubber layer having a through hole for embedding the MEMS pin while the MEMS pin is erected and supported; and A metal powder layer including a plurality of metal powders filled and fixed in a depression formed at a position where a portion of the rubber layer is depressed at the upper or lower end of the MEMS pin; Socket device for circuit inspection of electronic components.

3. In paragraph 1 or 2, The penetration hole of the above rubber layer has a tapered shape. Socket device for circuit inspection of electronic components.

4. In paragraph 1 or 2, An upper film and a lower film are bonded to the upper and lower surfaces of the above rubber layer so as to support the MEMS pin. Socket device for circuit inspection of electronic components.

5. In paragraph 1 or 2, The through hole of the rubber layer through which the above MEMS pin penetrates is empty and no rubber material is supplied. Socket device for circuit inspection of electronic components.

6. In paragraph 1 or 2, The penetration hole of the rubber layer through which the above MEMS pin penetrates is filled with a softer rubber material than other parts. Socket device for circuit inspection of electronic components.

7. In paragraph 1 or 2, The rubber layers on which the lower body and upper body of the above MEMS pin are arranged are filled with different rubber materials, but the rubber material filled in the upper body is softer than the rubber material filled in the lower body. Socket device for circuit inspection of electronic components.

8. In paragraph 1 or 2, The elastic connection part of the above MEMS pin is not provided with rubber material, so an air layer is formed. Socket device for circuit inspection of electronic components.

9. In paragraph 1, The metal powder layer is arranged to surround the entire MEMS pin, or to surround only the upper body or lower body of the MEMS pin. Socket device for circuit inspection of electronic components.

10. In paragraph 2, The above recessed portion has a larger area so as to cover the area of ​​the end of the upper body or lower body of the MEMS pin. Socket device for circuit inspection of electronic components.

11. In paragraph 1 or 2, A rubber film layer is installed to cover all or part of the upper portion of the rubber layer, and has connection terminals provided at each position corresponding to the MEMS pin so that the height can be adjusted for all or part of the rubber layer and applied to multiple terminals. Socket device for circuit inspection of electronic components.

12. In paragraph 11, The above rubber film layer is replaceable, Socket device for circuit inspection of electronic components.

13. In paragraph 1 or 2, The above rubber layer is made of silicone rubber. Socket device for circuit inspection of electronic components.

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