Light source, photoelectric conversion apparatus, related device and system

Abstract

A light source, a photoelectric conversion apparatus, a related device and a system. The light source comprises a first substrate (302), a driving circuit and a first laser (202). The double surfaces, i.e., a first surface (321) and a second surface (322), of the first substrate (302) are respectively located in a first packaging space (311) and a second packaging space (312). The first laser (202) is packaged in the first packaging space (311) or the second packaging space (312), and the driving circuit is packaged in at least one of the first packaging space (311) and the second packaging space (312). Moreover, the packaging space in which the first laser (202) is packaged is different from the packaging space in which part of the driving circuit is packaged. The driving circuit is electrically connected to the first laser (202) by means of the first substrate (302), so as to drive the first laser (202) to emit light. The peak optical power outputted by the light source can be increased under the condition that the size of the light source is effectively reduced.

Description

A light source, a photoelectric conversion device, related equipment and a system

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on July 26, 2023, with application number CN202310928570.6 and invention name “A light source, photoelectric conversion device, related equipment and system”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optical communication technology, and in particular to a light source, a photoelectric conversion device, related equipment and a system. Background Art

[0003] Laser light sources are finding increasingly widespread application, including radar, passive optical networks (PONs), optical transport networks (OTNs), and industrial optical networks. For example, in radar applications, the peak optical power output by a light source is positively correlated with the radar's detection range. Therefore, increasing the peak optical power output by a light source can increase the radar's detection range.

[0004] The light source consists of a laser and a heat sink. The heat sink dissipates heat from the laser, ensuring it remains within a preset temperature range and increasing its peak optical power. For example, the heat sink can be bonded to the laser and dissipate heat through water-cooled channels.

[0005] To increase the peak optical power of a laser output, the number of lasers must be increased. To ensure heat dissipation, the heat sink must be increased. Increasing the heat sink size of the light source also increases the size of the light source. Furthermore, increasing the peak optical power of a laser output solely through heat sinks has limited potential.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a light source, a photoelectric conversion device, related equipment, and a system, which improve the peak optical power output by the light source while effectively reducing the volume of the light source.

[0008] In a first aspect, embodiments of the present application provide a light source comprising a first substrate, a driver circuit, and a first laser. The driver circuit is electrically connected to the first laser via the first substrate, and is configured to drive the first laser to emit light. The light source comprises a first packaging space and a second packaging space stacked perpendicular to the first substrate. The first surface of the first substrate is located within the first packaging space, and the second surface of the first substrate is located within the second packaging space, with the first surface and the second surface facing opposite directions. The first laser is packaged in either the first packaging space or the second packaging space, and the driver circuit is packaged in at least one of the first and second packaging spaces. Furthermore, the packaging space encapsulating the first laser is different from the packaging space encapsulating at least a portion of the driver circuit. It is understood that the packaging of the first laser and the driver circuit can be as follows: for example, the first laser is packaged in the first packaging space, and the driver circuit is packaged in the second packaging space. For another example, the first laser is packaged in the first packaging space, with a portion of the driver circuit encapsulated in the first packaging space and another portion encapsulated in the second packaging space. For another example, the first laser is packaged in the second packaging space, and the driver circuit is packaged in the first packaging space. For another example, the first laser is packaged in the second packaging space, a portion of the driving circuit is packaged in the first packaging space, and another portion is packaged in the second packaging space.

[0009] According to the embodiment of the present invention, the driving circuit and the first laser are directly electrically connected through the first substrate, so that the physical length of the electrical connection loop between the driving circuit and the first laser is relatively short. The physical length of the electrical connection loop between the driving circuit and the first laser is negatively correlated with the driving current. The driving current is used to drive the first laser to emit light. The driving current is positively correlated with the peak optical power output by the first laser. Then, when the physical length of the electrical connection loop between the driving circuit and the first laser is relatively short, the peak optical power output by the first laser is effectively improved. It can be understood that the light source shown in this embodiment can improve the peak optical power output by a single first laser included in the light source. Without changing the number of first lasers included in the light source, the peak optical power output by the light source as a whole is improved.

[0010] Based on the first aspect, in an optional implementation, along a direction perpendicular to the first substrate, the light source also includes a circuit board stacked with the first substrate, the surface of the circuit board facing the first substrate is located in the first packaging space, and the first surface is the surface of the first substrate facing the circuit board.

[0011] As shown in this aspect, when the light source includes a circuit board, a first packaging space is formed between the circuit board and the first substrate. Specifically, the surface of the circuit board facing the substrate and the first surface are located in the first packaging space to ensure that the driving circuit and the first laser are directly electrically connected through the first substrate, effectively reducing the physical length of the electrical connection loop between the driving circuit and the first laser, thereby improving the peak optical power output of the light source as a whole.

[0012] Based on the first aspect, in an optional implementation, along a direction perpendicular to the first substrate, the first substrate includes at least a first sub-plate and a second sub-plate stacked in position, and the first sub-plate includes a first current channel passing through the first sub-plate, and the second sub-plate includes a second current channel passing through the second sub-plate, any first current channel among the multiple first current channels is electrically connected to a second current channel among the multiple second current channels, and the driving circuit is electrically connected to the first laser through the first current channel and the second current channel.

[0013] By using the first substrate shown in this implementation method, an electrical connection is achieved between the driving circuit and the first laser in a direction perpendicular to the first substrate, which effectively reduces the physical length of the electrical connection loop between the driving circuit and the first laser and effectively improves the peak optical power outputted by the light source as a whole.

[0014] Based on the first aspect, in an optional implementation, the first orthographic projection and the second orthographic projection partially overlap, wherein the first orthographic projection is the orthographic projection of any first current channel among the multiple first current channels, and the second orthographic projection is the orthographic projection of a second current channel among the multiple second current channels.

[0015] By adopting this implementation method, when the first sub-board includes multiple first current channels, the second sub-board includes multiple second current channels, and the first orthographic projection and the second orthographic projection partially overlap, the uniformity of the current flowing through the first substrate is improved, the parasitic inductance of the driving circuit is effectively reduced, and the peak light power output of the light source as a whole is improved.

[0016] Based on the first aspect, in an optional implementation, the driving circuit includes a first electrical module and a second electrical module, the first electrical module is encapsulated in the first encapsulation space, and the second electrical module is encapsulated in the second encapsulation space.

[0017] With this implementation, the driving circuit is encapsulated in the first encapsulation space and the second encapsulation space, effectively reducing the physical length of the electrical connection loop between the driving circuit and the first laser, and effectively improving the peak optical power outputted by the light source as a whole.

[0018] Based on the first aspect, in an optional implementation, the first laser is packaged in the first packaging space, and the driving circuit is packaged in the second packaging space, or the first laser is packaged in the second packaging space, and the driving circuit is packaged in the first packaging space.

[0019] With this implementation, the driving circuit and the first laser are packaged in different packaging spaces, which can reduce the physical length of the electrical connection loop between the driving circuit and the first laser and effectively improve the peak optical power outputted by the light source as a whole.

[0020] Based on the first aspect, in an optional implementation, the light source further includes a second laser electrically connected to the driving circuit, the driving circuit is electrically connected to the second laser through the first substrate, and the driving circuit is further used to drive the second laser to emit light; the second laser is encapsulated in the first packaging space or the second packaging space.

[0021] With this implementation, the light source includes multiple lasers, and each laser is directly electrically connected to the driving circuit through the first substrate, effectively improving the peak optical power output of the entire light source and improving the integration of the multiple lasers packaged in the light source.

[0022] Based on the first aspect, in an optional implementation, along a direction perpendicular to the first substrate, the light source also includes a second substrate stacked with the first substrate, the second packaging space includes a first sub-packaging space and a second sub-packaging space, the third surface and the second surface of the second substrate are located in the first sub-packaging space, the third surface is the surface of the second substrate facing the first substrate, the fourth surface of the second substrate is located in the second sub-packaging space, and the orientation of the third surface is opposite to that of the fourth surface; the first laser is packaged in one of the first packaging space, the first sub-packaging space and the second sub-packaging space, and the driving circuit is packaged in at least one of the first packaging space, the first sub-packaging space and the second sub-packaging space.

[0023] Using this implementation method, the first laser is encapsulated in one of the first encapsulation space, the first sub-encapsulation space, and the second sub-encapsulation space, and the driving circuit is encapsulated in at least one of the first encapsulation space, the first sub-encapsulation space, and the second sub-encapsulation space, which effectively reduces the physical length of the electrical connection loop between the first laser and the driving circuit and improves the integration of the light source.

[0024] Based on the first aspect, in an optional implementation, the light source further includes a heat sink for dissipating heat from the first laser. The heat sink is packaged on a surface of the circuit board facing away from the first substrate, and the heat sink includes at least one of an air cooling system, a water cooling system, a semiconductor cooler (TEC), a heat sink, or an electric cooler.

[0025] In the second aspect, an embodiment of the present application provides a photoelectric conversion device, comprising a processing module, a modulation module, a demodulation module, a transmitting port, a receiving port, and a light source as described in any one of the first aspects above, wherein the processing module is respectively connected to the modulation module and the demodulation module, the modulation module is respectively connected to the light source and the transmitting port, and the demodulation module is connected to the receiving port; the processing module is used to send a first business electrical signal to the modulation module; the light source is used to send an optical signal to the modulation module; the modulation module is used to modulate the first business electrical signal on the optical signal to obtain a first business optical signal; the transmitting port is used to send the first business optical signal; the receiving port is used to receive a second business optical signal; the demodulation module is used to demodulate the second business electrical signal from the second business optical signal, and send the second business electrical signal to the processing module. For a description of the beneficial effects of this aspect, please refer to the first aspect, and no further details will be given.

[0026] For the description of the beneficial effects of this aspect, please refer to the first aspect and the details will not be repeated here.

[0027] In a third aspect, an embodiment of the present application provides an optical communication device, comprising an outer shell, a processor, and a photoelectric conversion device as described in any one of the first aspects above, wherein the outer shell is used to fix the processor and the photoelectric conversion device, and the processor is connected to the photoelectric conversion device; the processor is used to send the first service electrical signal to the photoelectric conversion device, and is also used to receive the second service electrical signal from the photoelectric conversion device.

[0028] In a fourth aspect, an embodiment of the present application provides a radar, comprising a controller, a receiving device, and a light source as described in any one of the first aspects above, wherein the controller is connected to the light source and the receiving device respectively; the light source is used to emit a laser beam; the receiving device is used to receive an echo light beam, and to perform photoelectric conversion on the echo light beam to obtain a detection electrical signal, wherein the object to be measured is used to reflect the laser beam to reflect the echo light beam toward the receiving device; and the controller is used to detect the object to be measured based on the detection electrical signal.

[0029] In a fifth aspect, an embodiment of the present application provides a projection system, comprising an image modulation module, a lens, and a light source as described in any one of the first aspects above; the image modulation module is used to receive a projection beam from the light source, and to modulate the projection beam to obtain a modulated beam, and also to transmit the modulated beam to the lens; the lens is used to image the modulated beam.

[0030] In a sixth aspect, an embodiment of the present application provides a head-up display system, comprising a light deflection module and a projection system as described in any one of the first aspects above; the projection system is used to transmit the modulated light beam to the light deflection module; the light deflection module is used to transmit the amplified modulated light beam to the windshield, and the modulated light beam reflected by the windshield forms a virtual image.

[0031] In the seventh aspect, an embodiment of the present application provides a vehicle, comprising a vehicle body, a windshield, a processor, and a head-up display system as described in any one of the first aspects above; the vehicle body is used to fix the windshield, the processor, and the head-up display system; the processor is used to transmit vehicle driving related information to the image modulation module; the image modulation module is used to modulate the vehicle driving related information on the projection light beam to obtain the modulated light beam.

[0032] In the eighth aspect, an embodiment of the present application provides an optical communication system, which includes multiple optical communication devices. Among the multiple optical communication devices, two optical communication devices are connected by an optical cable. For the description of the optical communication devices, please refer to the third aspect above, and the details will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a structural diagram illustrating an example of a light source provided by the present application being applied to a vehicle;

[0034] FIG2 is a diagram illustrating a circuit connection structure of an embodiment of a light source provided in the present application;

[0035] FIG3 is a diagram illustrating a packaging structure of a first embodiment of a light source provided in the present application;

[0036] FIG4 is a diagram illustrating a packaging structure of a second embodiment of a light source provided in this application;

[0037] FIG5 is an exemplary diagram of the packaging structure of the third embodiment of the light source provided in this application;

[0038] FIG6 is a diagram illustrating a packaging structure of a fourth embodiment of a light source provided in the present application;

[0039] FIG7 is a diagram illustrating a packaging structure of a fifth embodiment of a light source provided in the present application;

[0040] FIG8 is a diagram illustrating a sixth embodiment of a packaging structure of a light source provided in the present application;

[0041] FIG9 is a diagram illustrating a seventh embodiment of a packaging structure of a light source provided in the present application;

[0042] FIG10 is a diagram illustrating an exemplary packaging structure of an eighth embodiment of a light source provided in the present application;

[0043] FIG11 is a structural diagram illustrating an embodiment of a photoelectric conversion device provided in the present application;

[0044] FIG12 is a diagram illustrating an example structure of an embodiment of an optical communication system provided by the present application;

[0045] FIG13 is a diagram illustrating a structure of a radar according to an embodiment of the present invention;

[0046] FIG14 is a diagram illustrating an exemplary structure of a projection system according to an embodiment of the present application;

[0047] FIG15 is a diagram illustrating the structure of an embodiment of a head-up display system provided in the present application. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0049] The present embodiment provides a light source capable of emitting laser light. This embodiment uses the light source's application to a vehicle as an example for illustrative purposes. It should be noted that this embodiment does not limit the application scenario of the light source. For example, the light source can also be applied to a data center network (DCN), a metropolitan area network, a PON, or an OTN, without specific limitation. The vehicle shown in this example can be a car, truck, motorcycle, bus, lawn mower, recreational vehicle, amusement park vehicle, tram, golf cart, train, cart, or drone.

[0050] FIG1 is a diagram illustrating an exemplary structure of a light source provided by this application applied to a vehicle. This embodiment configures a vehicle 100 for fully or partially autonomous driving. The vehicle shown in this embodiment includes a vehicle body that is used to secure a sensor system 120, an advanced driving assistance system (ADAS) 110, peripheral devices 130, and a computer system 140.

[0051] The sensor system 120 includes one or more sensors that sense environmental information about the vehicle 100's surroundings. For example, the sensor system 120 may include a positioning system, such as the Global Positioning System (GPS) or the Beidou system. The sensor system 120 may also include an inertial measurement unit (IMU), radar, and cameras. The sensor system 120 may also include sensors for monitoring the vehicle 100's internal systems (e.g., an in-vehicle air quality monitor, a fuel gauge, an oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). The positioning system can be used to estimate the vehicle 100's geographic location. The IMU is used to sense changes in the vehicle 100's position and orientation based on inertial acceleration. The IMU may be a combination of an accelerometer and a gyroscope. Radar can use radio signals to detect objects within the vehicle 100's surroundings, such as pedestrians, vehicles, or buildings. Alternatively, the radar can also be used to detect the speed and / or heading of the object. This embodiment does not limit the specific type of radar; for example, the radar may be a millimeter-wave radar or a laser radar. The camera may be used to capture multiple images of the surrounding environment of the vehicle 100. The camera may be a still camera, a video camera, a monocular or binocular camera, or an infrared imager.

[0052] ADAS110 senses the surrounding environment at any time during the driving process of the vehicle, collects data, identifies, detects and tracks static and dynamic objects, and combines navigation map data to perform systematic calculations and analysis, so as to make the driver aware of possible dangers in advance, effectively increasing the comfort and safety of vehicle driving. For example, ADAS110 can control the vehicle through the data obtained by the sensing system 120. For another example, ADAS110 can control the vehicle through vehicle driving related information, where the vehicle driving related information can be the main data on the vehicle dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information, or vehicle body posture data.

[0053] The vehicle 100 interacts with external sensors, other vehicles, other computer systems, or users via the peripheral devices 130. The peripheral devices 130 may include a wireless communication system, an onboard computer, a microphone, and / or a speaker. For example, the onboard computer may provide information to the user of the vehicle 100. The user interface may also operate the onboard computer to receive user input. The onboard computer may be operated via a touch screen. In other cases, the peripheral devices 130 may provide a means for the vehicle 100 to communicate with other devices located within the vehicle. For example, the microphone may receive audio (e.g., voice commands or other audio input) from the user of the vehicle 100. The speaker may output audio to the user of the vehicle 100. The wireless communication system may communicate wirelessly with one or more devices directly or via a communication network.

[0054] Some or all functions of the vehicle 100 are controlled by the computer system 140. The computer system 140 may control the functions of the vehicle 100 based on input received from various systems (e.g., the sensing system 120, the ADAS 110, the peripheral devices 130) and from a user interface. The computer system 140 may include at least one processor that executes instructions stored in a memory.

[0055] This embodiment takes the application of the light source to the radar of a vehicle as an example. In other examples, the light source can also be applied to fixed radars (such as radars fixed on roads, monitoring radars, radars in industrial scenes, etc.). The light source can also be applied to radars of unmanned transport vehicles in logistics warehouses or radars of smart appliances in smart homes (for example, smart appliances are automatic cleaning robots), etc., without specific limitation. It can be understood that the laser beam emitted by the light source in this embodiment can also be called an optical signal, laser pulse, laser, projection beam or emission beam, etc., without limitation. To achieve distinction, when the light source is applied to different scenarios, the name of the light emitted by the light source is different. For example, if the light source is applied to a lidar, the light emitted by the light source is called a laser beam. For another example, if the light source is applied to an optical communication system, the light emitted by the light source is called an optical signal. For another example, if the light source is applied to a projection system, the light emitted by the light source is called a projection beam.

[0056] Taking the light source provided in this embodiment as an example of a radar applied to a vehicle, the specific type of radar is a laser radar, which is used to detect objects to be detected around the vehicle. The laser beam emitted by the light source has a high frequency and a short wavelength, so it can improve the height, distance and speed resolution of laser detection. The detection range of the laser radar is positively correlated with the peak optical power of the laser beam output by the light source. Specifically, the greater the peak optical power of the laser beam emitted by the light source, the longer the laser radar detection distance. Similarly, the smaller the peak optical power of the laser beam emitted by the light source, the closer the laser radar detection distance. For example, if the peak optical power of the laser beam emitted by the light source is 800 watts (W), the detection range of the laser radar is 150 meters (m). For another example, if the peak optical power of the laser beam emitted by the light source is 1500W, the detection range of the laser radar is 220m. For another example, if the peak optical power of the laser beam emitted by the light source is not less than 2000W, the detection range of the laser radar is 300m. The light source provided in the embodiment of the present application effectively reduces the volume of the light source while also increasing the peak optical power output by the light source.

[0057] The light source provided in an embodiment of the present application includes a first laser and a driver circuit, the driver circuit being electrically connected to the first laser and configured to drive the first laser to emit light. The electrical connection shown in this embodiment refers to a physical circuit connection. It is understood that the electrical connection refers to a connection between the first laser and the driver circuit via a physical line capable of transmitting electrical signals.

[0058] Fig. 2 is an example diagram of a circuit connection structure of an embodiment of the light source provided by the present application. The light source shown in this embodiment includes a first laser 202, and a driving circuit includes a capacitor 201, a transistor 203 and a laser driver (laser driver) 204. Specifically, the capacitor 201, the first laser 202, the transistor 203 and the laser driver 204 are connected in series in sequence. Wherein, the capacitor 201 can realize the output of the laser driving current. When the transistor is in the on state, the laser driver 204 loads the driving current to the first laser 202 so that the first laser 202 emits an optical signal under the drive of the laser driver 204. Wherein, the first laser 202 can be a Fabry-Perot (FP) laser, a distributed feedback (DFB) laser or a vertical cavity surface emitting laser (VCSEL) etc. The transistor 203 can be a bipolar transistor (also known as a bipolar junction transistor). The transistor 203 may also be a field-effect transistor (e.g., a metal-oxide-semiconductor field-effect transistor (MOSFET)). This embodiment does not limit the structure of the driving circuit, as long as the driving circuit successfully drives the first laser to emit light. For example, the driving circuit may further include an amplifier circuit for amplifying the current applied to the first laser 202. In another example, the driving circuit may further include an impedance matching circuit for achieving impedance matching.

[0059] The driving current I applied by the driving circuit to the first laser 202 pk It can be expressed by formula 1, which is:

[0060] Among them, V in is the voltage at the voltage input terminal of the driving circuit, V OUT is the voltage at the voltage output terminal of the driving circuit, ESL is the parasitic inductance of the driving circuit, and C is the capacitance value of capacitor 201. As shown in Formula 1, when the V in 、V OUT And if C is fixed, then I pk There is a negative correlation between I pk The larger the value, the smaller the ESL. Similarly, I pk The smaller the value, the greater the ESL. pkThe larger the ESL, the greater the peak optical power output by the first laser 202. As shown in the above example of applying a light source to radar, a higher peak optical power output by the first laser 202 increases the detection distance. Therefore, by reducing the ESL of the driver circuit, the peak optical power output by the first laser can be increased.

[0061] The ESL of the driving circuit can be expressed by Formula 2, which is: ESL=u0*L / 2π(ln(2L / r)-0.75).

[0062] L is the physical length of the electrical connection loop between the driver circuit and the first laser, r is the circuit cross-sectional radius, u0 is the vacuum magnetic permeability, and u0 = 4π*10-7 Henry per meter (H / m). As can be seen from Formula 2, there is a positive correlation between L and the ESL of the driver circuit. Referring to Figure 2, L = L1 + L2 + L3 + L4 + L5, where L1 refers to the physical length of the circuit between the voltage input terminal of the driver circuit and capacitor 201, L2 refers to the physical length of the circuit between capacitor 201 and first laser 202, L3 refers to the physical length of the circuit between first laser 202 and transistor 203, L4 refers to the physical length of the circuit between transistor 203 and laser driver 204, and L5 refers to the physical length of the circuit between laser driver 204 and the voltage output terminal of the driver circuit. When r in Formula 2 is fixed, ESL and L are positively correlated, i.e., the larger L is, the greater the ESL is, and similarly, the smaller L is, the smaller the ESL is.

[0063] Combined with I shown in formula 1 pk There is a negative correlation between ESL and L. As shown in formula 2, there is a positive correlation between ESL and L. It can be understood that I pk There is a negative correlation between I and L. pk The larger L is, the greater the peak optical power output by the first laser. Therefore, to increase the peak optical power output by the first laser, this can be achieved by reducing L. The power supply provided in this embodiment can effectively reduce the physical length L of the electrical connection loop between the driving circuit and the first laser.

[0064] FIG3 is an example diagram of the packaging structure of the first embodiment of the light source provided in this application. The light source shown in this embodiment includes a first substrate 302, which is made of a plate material. This embodiment does not limit the plate material. For example, the plate material may be a paper base, a glass fiber cloth base, a composite base, a ceramic base, a metal core base, or an epoxy glass cloth laminate (FR-4). The surface of the first substrate 302 shown in FIG3 is parallel to or located in the XZ plane. The XZ plane includes a direction X and a direction Z perpendicular to the direction X, and the direction Y is perpendicular to the XZ plane. The direction Y is a direction perpendicular to the first substrate 302. Along the direction Y, the light source includes a first packaging space 311 (shown by the dotted box labeled 311 in FIG3) and a second packaging space 312 (shown by the dotted box labeled 312 in FIG3) that are stacked. It can be understood that along the direction Y, the second packaging space 312 is located above the first packaging space 311, so that the first packaging space 311 and the second packaging space 312 are in a stacked positional relationship along the direction Y. The first surface 321 of the first substrate 302 is located within the first packaging space 311. The second surface 322 of the first substrate 302 is located within the second packaging space 312. The first surface 321 and the second surface 322 of the first substrate 302 are oriented in opposite directions. It will be appreciated that in the example shown in FIG. 3 , the first surface 321 and the second surface 322 are two surfaces of the first substrate 302 that are located opposite each other along the Y direction.

[0065] FIG4 is an example diagram of the packaging structure of the second embodiment of the light source provided in this application. The light source shown in this embodiment also includes a circuit board 401, which can be a printed circuit board (PCB). The first packaging space 311 is formed between the circuit board 401 and the first substrate 302. Specifically, the first packaging space 311 includes the surface of the circuit board 401 facing the first substrate 302 and the first surface 321 of the first substrate 302. Along the direction Y, the first substrate 302 and the circuit board 401 are in a stacked positional relationship. The first surface 321 is the surface of the first substrate 302 facing the circuit board 401.

[0066] In the examples shown in Figures 3 and 4, the first laser 202 is encapsulated in the first encapsulation space 311. The first driving circuit is encapsulated in the first encapsulation space 311 and the second encapsulation space 312. For example, the first driving circuit includes a first electrical module and a second electrical module. The first electrical module is encapsulated in the first encapsulation space 311, and the second electrical module is encapsulated in the second encapsulation space 312. This embodiment does not limit the type and quantity of the first electrical module and the second electrical module. In this embodiment, the first electrical module includes a capacitor 201, and the second electrical module includes a transistor 201 and a laser driver 204. The first driving circuit being encapsulated in the first encapsulation space 311 and the second encapsulation space 312 means that the capacitor 201 is encapsulated in the first encapsulation space 311, and the transistor 203 and the laser driver 204 are encapsulated in the second encapsulation space 312. In order to realize the electrical connection between the driving circuit and the first laser 202, the capacitor 201 and the first laser 202, the first laser 202 and the transistor 203, and the transistor 203 and the laser driver 204 are all connected in series through the first substrate 302. For the description of the circuit, please refer to Figure 2 and the details are not repeated here.

[0067] It should be noted that the description of the components encapsulated in the first encapsulation space 311 and the second encapsulation space 312 shown in Figures 3 and 4 is an optional example and is not limiting. It can be understood that the light source provided in this embodiment includes four components as an example, and the four components are the first laser 202, the capacitor 201, the transistor 203, and the laser driver 204. Among the four components shown in this embodiment, some components are encapsulated in the first encapsulation space 311, while other components are encapsulated in the second encapsulation space 312. This means that the encapsulation space encapsulated by the first laser 202 is different from the encapsulation space encapsulated by at least part of the first driver circuit. Specific examples are as follows:

[0068] Example 1: The first packaging space 311 shown in this example encapsulates one of the four devices, and the second packaging space 312 encapsulates the other three of the four devices. For example, the example shown in Figure 5 is a diagram illustrating the packaging structure of the third embodiment of the light source provided in this application. In the example shown in Figure 5, the first laser 202 is encapsulated in the first packaging space 311, and the capacitor 201, transistor 203, and laser driver 204 of the driving circuit are all encapsulated in the second packaging space 312. It should be understood that Figure 5 is only an optional example of Example 1 and is not intended to be limiting. For example, the capacitor 201 is encapsulated in the first packaging space 311. The first laser 202, transistor 203, and laser driver 204 are all encapsulated in the second packaging space 312. For another example, the transistor 203 is encapsulated in the first packaging space 311. The first laser 202, capacitor 201, and laser driver 204 are all encapsulated in the second packaging space 312. For another example, the laser driver 204 is encapsulated in the first packaging space 311. The first laser 202 , the capacitor 201 and the transistor 203 are all packaged in the second packaging space 312 .

[0069] In Example 2, the first packaging space 311 shown in this example encapsulates two of the four devices, and the second packaging space 312 encapsulates the other two of the four devices, as specifically shown in Figures 3 and 4. Figures 3 and 4 are merely optional examples and are not limiting. For example, the first laser 202 and the transistor 203 are encapsulated in the first packaging space 311. The capacitor 201 and the laser driver 204 are both encapsulated in the second packaging space 312. In another example, the first laser 202 and the laser driver 204 are encapsulated in the first packaging space 311. The capacitor 201 and the transistor 203 are encapsulated in the second packaging space 312. In another example, the capacitor 201 and the transistor 203 are encapsulated in the first packaging space 311. The first laser 202 and the laser driver 204 are encapsulated in the second packaging space 312. In another example, the capacitor 201 and the laser driver 204 are encapsulated in the first packaging space 311. The transistor 203 and the first laser 202 are encapsulated in the second packaging space 312. For another example, the transistor 203 and the laser driver 204 are packaged in the first packaging space 311 , and the first laser 202 and the capacitor 201 are packaged in the second packaging space 312 .

[0070] Example three, the first packaging space 311 shown in this example encapsulates three of the four devices, and the second packaging space 312 encapsulates another of the four devices, specifically for example the example shown in Figure 6, which is an example diagram of the packaging structure of the fourth embodiment of the light source provided in this application. In the example shown in Figure 6, the first laser 202, the capacitor 201, and the transistor 203 are encapsulated in the first packaging space 311. The laser driver 204 is encapsulated in the second packaging space 312. It should be understood that Figure 6 is only an optional example of Example 3 and is not intended to be limiting. For example, the capacitor 201, the laser driver 204, and the first laser 202 are encapsulated in the first packaging space 311. The transistor 203 is encapsulated in the second packaging space 312. For another example, the laser driver 204, the first laser 202, and the first laser 202 are encapsulated in the first packaging space 311. The capacitor 201 is encapsulated in the second packaging space 312. For another example, the laser driver 204, the transistor 203, and the capacitor 201 are encapsulated in the first packaging space 311. The first laser 202 is packaged in the second packaging space 312 .

[0071] In the three examples above, two or more devices packaged in the same package space can be integrated into a system-in-a-package (SIP). For example, in the example shown in FIG3 , transistor 203 and laser driver 204 are integrated into a single package and packaged in a second package space 312 via a SIP. Optionally, first substrate 302 can be packaged within the SIP, so that the SIP integrates first substrate 302, transistor 203, and laser driver 204, thereby increasing the integration of the light source.

[0072] In this embodiment, along the direction Y, the first packaging space and the second packaging space are in a stacked state, and the device packaged in the first packaging space and the device packaged in the second packaging space (see the above examples one to three) are directly electrically connected through the first substrate 302, which effectively reduces the physical length of the electrical connection loop between the device packaged in the first packaging space and the device packaged in the second packaging space. For example, when the first laser is packaged in the first packaging space and the transistor is packaged in the second packaging space, the first laser and the transistor are directly electrically connected along the Y direction through the first substrate 302, which effectively reduces the physical length of the electrical connection loop between the first laser and the transistor. It can be understood that when the first laser and the driving circuit are packaged in the first packaging space and the second packaging space, the physical length of the electrical connection loop between the driving circuit and the first laser is effectively reduced. Therefore, the physical length of the electrical connection loop between the driving circuit and the first laser is proportional to the driving current I pkIn this embodiment, the light source reduces the physical length of the electrical connection loop between the driving circuit and the first laser, thereby effectively increasing the driving current I pk . The light source increases the driving current I pk Under this condition, the peak optical power output by the first laser is effectively improved.

[0073] The first laser and the driving circuit shown in this embodiment are packaged in the first packaging space and the second packaging space in a positional stacking manner, ensuring that the driving circuit successfully drives the first laser to emit light, and increasing the peak optical power of the laser while reducing the physical length of the electrical connection loop between the driving circuit and the first laser.

[0074] In the existing solutions, if it is necessary to increase the peak optical power output by the light source, it is necessary to integrate a larger number of lasers in the light source. The light source shown in the present application effectively increases the peak optical power output by each laser. So, if the light source of the existing solution and the light source provided by the embodiment of the present application have the same peak optical power output, the light source provided by the embodiment of the present application includes a smaller number of lasers, and there is no need to increase the volume of the radiator, thereby effectively reducing the volume of the light source, improving the integration of the light source and the efficiency of volume utilization, and reducing the cost of the light source. Compared with the existing light source, the driving current of the light source provided by the embodiment of the present application is increased by about 75%, thereby increasing the peak optical power output by about 50%.

[0075] 7 , which illustrates the electrical connection between the driving circuit and the first laser via the first substrate, wherein FIG. 7 is an exemplary diagram of the packaging structure of the fifth embodiment of the light source provided in this application.

[0076] The example shown in FIG7 is illustratively described by taking the example of a first laser 202 and a capacitor 201 encapsulated in a first encapsulation space 311, and a transistor 203 and a laser driver 204 encapsulated in a second encapsulation space 312. Along a direction perpendicular to the first substrate (i.e., direction Y), the first substrate includes at least a first sub-plate 701 and a second sub-plate 702 stacked in a certain position. Along direction Y, the distance between the first sub-plate 701 and the circuit board 401 is less than the distance between the second sub-plate 702 and the circuit board 401. The first sub-plate 701 includes multiple first current channels. This embodiment does not limit the number of first current channels included in the first sub-plate 701. For example, in the example shown in FIG7, the first sub-plate 701 includes a first current channel 711, a first current channel 712, a first current channel 713, and a first current channel 714. Each first current channel included in the first sub-plate 701 passes through the first sub-plate 701 along direction Y. The second sub-plate 702 includes multiple second current channels. This embodiment does not limit the number of second current channels included in the second sub-plate 702. For example, in the example shown in FIG7 , the second sub-plate 702 includes a second current channel 721, a second current channel 722, a second current channel 723, and a second current channel 724. Each second current channel included in the second sub-plate 702 passes through the second sub-plate 702 along direction Y. Taking the first current channel 711 as an example, the first current channel 711 is a conductive material that passes through the first sub-plate 701. This embodiment does not limit the conductive material and can be, for example, silver, copper, gold, aluminum, or nickel. For a description of the second current channels, please refer to the description of the first current channel 711, and the details are not repeated here.

[0077] In this embodiment, the first and second current channels, positioned adjacent to each other, contact each other to achieve electrical connection. For example, the first current channel 711 and the second current channel 721 contact each other to achieve electrical connection. Similarly, the first current channel 714 and the second current channel 724 contact each other to achieve electrical connection. The first laser 202 and each component included in the driver circuit are flip-chip soldered to the first substrate 302. Taking the first laser 202 as an example, flip-chip soldering of the first laser 202 to the first substrate 302 means that the electrical connector of the first laser 202 faces the first substrate 302. The electrical connector can be a solder ball. To achieve electrical connection between the first laser 202 and the first substrate 302, the solder ball of the first laser 202 is soldered to the first current channel of the first sub-plate 701. The transistor 203 is flip-chip soldered to the second current channel of the second sub-plate 702. Due to the electrical connection between the first current channel and the second current channel, an electrical connection between the first laser 202 and the transistor 203 is achieved based on the first substrate 302. Furthermore, the physical length of the electrical connection loop between the first laser 202 and the transistor 203 is reduced based on the first substrate 302. This embodiment uses the example of flip-chip packaging of each device in the first packaging space or the second packaging space, but this is not a limitation. In other examples, the devices may be packaged in the first packaging space or the second packaging space using any die bonding method.

[0078] Between the multiple first current channels and the multiple second current channels shown in this embodiment, the first current channel 711 and the second current channel 721 are located close to each other. Therefore, the first orthographic projection of the first current channel 711 and the second orthographic projection of the second current channel 721 partially overlap. The first orthographic projection of the first current channel 711 refers to the orthographic projection formed on the projection plane by multiple mutually parallel projection lines illuminating the first current channel 711. The first sub-plate 701 is parallel to the projection plane, and the multiple projection lines are perpendicular to the projection plane and the first sub-plate 701. For the description of the second orthographic projection of the second current channel 721, please refer to the description of the first orthographic projection of the first current channel 711, and the details are not repeated here. It can be understood that in this embodiment, the first orthographic projection of any first current channel among the multiple first current channels partially overlaps with the orthographic projection of one second current channel among the multiple second current channels.

[0079] The beneficial effect of the first current channel 711 and the second current channel 721 in this embodiment being in contact with each other to achieve electrical connection can be described in Formula 3.

[0080] Formula 3 is:

[0081] Wherein, In is the logarithm with base e, and A is a preset constant, for example, A=5.08. h is the sum of the via depths of the current channels that are in contact with each other to achieve electrical connection and are located on different sub-boards. For example, h is the sum of the depth of the first current channel 711 along the direction Y and the depth of the second current channel 721 along the direction Y. D is the sum of the via diameters of the current channels that are in contact with each other to achieve electrical connection and are located on different sub-boards. For example, D is the sum of the diameter of the first current channel 711 and the diameter of the second current channel 721. As shown in Figure 7, the staggered layout of the current channels of different sub-boards is equivalent to increasing the diameter of the current channel of the substrate. For example, the diameter of one current channel of the substrate is the sum of the diameter of the first current channel 711 and the diameter of the second current channel 721, thereby improving the inductance of the driving circuit.

[0082] Combined with I shown in formula 1 pk There is a negative correlation between D and ESL. As shown in formula 3, there is a negative correlation between D and ESL. Then, I pk It is positively correlated with D, so increasing D can effectively increase the I of the driving circuit. pk The staggered layout of the current channels of different sub-boards shown in this embodiment effectively increases the diameter D of the current channel of the substrate, thereby effectively improving the I pk .

[0083] This embodiment takes the example of the first substrate 302 including two sub-boards. In other examples, the first substrate 302 may include more than two sub-boards. This embodiment does not limit the number of sub-boards included in the first substrate 302. Because the first substrate 302 shown in this embodiment includes multiple layers of sub-boards, and each side of the sub-board includes multiple current channels, and the first orthographic projections and second orthographic projections of different layers partially overlap, the uniformity of the current flowing through the first substrate is improved, and the parasitic inductance of the driving circuit is effectively reduced. For example, compared with the method of connecting the laser and the driving circuit in series in the existing light source, the light source shown in the embodiment of the present application reduces the parasitic inductance of the light source by about 30%.

[0084] It should be clarified that the structure of the circuit board 401 shown in this embodiment may also adopt the structure of the first substrate, that is, the circuit board 401 includes a first sub-board and a second sub-board, the first sub-board includes multiple first current channels, and the second sub-board includes multiple second current channels. For the description of the first sub-board, the second sub-board, the first current channel and the second current channel included in the circuit board 401, please refer to the description of the first substrate structure corresponding to Figure 7, and the details will not be repeated.

[0085] FIG8 is an example diagram of the packaging structure of the sixth embodiment of the light source provided in the present application. The light source shown in this embodiment also includes a radiator 801. Specifically, the surface of the circuit board 401 facing away from the first substrate 302 is packaged with a radiator 801, and the radiator 801 is used to control the optical power of the optical signal emitted by the first laser 202 to be within a preset range, so as to ensure the stability of the peak optical power output by the first laser 202 and avoid the situation where the peak optical power output by the first laser 202 decreases. This embodiment does not limit the specific heat dissipation method of the radiator 801. For example, the radiator 801 includes an air cooling system, a water cooling system, a semiconductor refrigerator (thermo electric cooler, TEC), a heat sink or an electric refrigerator, etc.

[0086] The light source shown in this embodiment includes a first laser array, and the first laser array includes N*M first lasers. For the description of the first lasers, please refer to the above embodiment, and no further details are given. Wherein, N refers to the number of first lasers included in the first laser array along direction X, and M refers to the number of first lasers included in the first laser array along direction Z. For the description of the packaging position of the first laser array shown in this embodiment in the light source, please refer to the description of the packaging position of the first laser 202, and no further details are given. This embodiment does not limit the specific electrical connection form of the first laser array. For example, in the first laser array, different first lasers are connected in parallel so that each first laser is connected in series to the drive circuit. For another example, in the first laser array, some first lasers are connected in series in sequence and connected in series to the drive circuit. Other first lasers are connected in parallel to each other and connected in series to the drive circuit. For another example, in the first laser array, multiple first lasers are connected in series in sequence and connected in series to the drive circuit.

[0087] FIG9 is an example diagram of the seventh embodiment packaging structure of the light source provided in this application. The light source shown in this embodiment includes a first laser array 901 and a second laser array 902. Wherein, the second laser array 902 includes a plurality of second lasers. For the description of the plurality of second lasers included in the second laser array 902, please refer to the description of the first laser array including a plurality of first lasers shown above, and no further details are given. The embodiment shown in FIG9 takes the first laser array 901 and the second laser array 902 as an example of being encapsulated in the first packaging space. The first laser array 901 and the second laser array 902 are in a parallel connection relationship, and the first laser array 901 and the second laser array 902 are respectively connected in series with the driving circuit. For the description of the driving circuit being encapsulated in the light source, please refer to the above example, which is not limited. This embodiment does not limit the electrical connection method between the first laser array 901 and the second laser array 902. In other examples, a portion of the second lasers included in the second laser array 902 is connected in series with the first laser array 901, and another portion of the second lasers is connected in parallel with the first laser array 901. For another example, the second laser array 902 is connected in series with the first laser array 901. In this embodiment, the first laser array 901 and the second laser array 902 are both encapsulated in the first encapsulation space 311 as an example, without limitation. In other examples, the first laser array 901 and the second laser array 902 are both encapsulated in the second encapsulation space 312. For another example, the first laser array 901 is encapsulated in the first encapsulation space 311, and the second laser array 902 is both encapsulated in the second encapsulation space 312. For another example, the first laser array 901 is encapsulated in the second encapsulation space 312, and the second laser array 902 is both encapsulated in the first encapsulation space 311. In this embodiment, the number of laser arrays included in the light source is not limited. When the light source includes multiple laser arrays, the peak optical power output by the light source is increased.

[0088] Figure 10 is an example diagram of the packaging structure of the eighth embodiment of the light source provided in this application. Along the direction Y perpendicular to the first substrate 302, the light source shown in this embodiment also includes a second substrate 1001. It can be understood that along the direction Y perpendicular to the first substrate 302, the first substrate 302 and the second substrate 1001 are in a stacked position relationship. The second packaging space shown in this embodiment specifically includes a first sub-packaging space 1021 and a second sub-packaging space 1011. Specifically, the third surface 1002 of the second substrate 1001 and the second surface 322 of the first substrate 302 are located in the second sub-packaging space 1021. It can be understood that the third surface 1002 of the second substrate 1001 is the surface of the second substrate 1001 facing the first substrate 302. That is, along the direction Y, the second substrate 1001, the first substrate 302 and the circuit board 401 are stacked in sequence. Along the direction perpendicular to the first substrate 302 (i.e., along direction Y), the light source includes a second sub-encapsulation space 1011 (indicated by the dotted box labeled 1011 in Figure 10) that is stacked with the first encapsulation space and the second encapsulation space. The fourth surface 1003 of the second substrate 1001 is located in the second sub-encapsulation space 1011. The orientation of the third surface 1002 is opposite to the orientation of the fourth surface 1003. For the description of the positions of the third surface 1002 and the fourth surface 1003 of the second substrate 1001, please refer to the description of the positions of the first surface 321 and the second surface 322 of the first substrate 302 in the above embodiment, and the details are not repeated here. The driving circuit and the first laser shown in this embodiment are encapsulated in the first encapsulation space, the first sub-encapsulation space 1021, and the second sub-encapsulation space 1011. For example, the first laser 202 and the capacitor 201 are encapsulated in the first encapsulation space 311, the transistor 203 is encapsulated in the second sub-encapsulation space 1021, and the laser driver 204 is encapsulated in the second sub-encapsulation space 1011. It can be understood that the first laser and the driving circuit shown in this embodiment include four devices. In the first packaging space 311, the second sub-packaging space 1021 and the second sub-packaging space 1011, each packaging space encapsulates at least one of the four devices. For specific descriptions, please refer to the description of the four devices encapsulated in the first packaging space 311 and the second packaging space 312 shown in Examples 1 to 3 above, and no further details are given. The light source shown in this embodiment may also include a first laser array and a second laser array. For the description of the first laser array and the second laser array, please refer to the corresponding description of Figure 9, and no further details are given. The first laser array and the second laser array can be encapsulated in the same packaging space in the first packaging space 311, the second sub-packaging space 1021 and the second sub-packaging space 1011. For another example, the first laser array and the second laser array can be encapsulated in any two different packaging spaces in the first packaging space 311, the second sub-packaging space 1021 and the second sub-packaging space 1011.It should be noted that the description of the structure of the second substrate 1001 and the description of how the second substrate 1001 is electrically connected can be found in the description of the structure of the first substrate 302 and the description of how the first substrate 302 is electrically connected in the above embodiment, and will not be repeated here. This embodiment does not limit the number of substrates included in the light source. In other examples, the light source may include any number of substrates, two or more.

[0089] Figure 11 is a diagram illustrating the structure of an embodiment of a photoelectric conversion device provided in the present application. The photoelectric conversion device 1100 shown in this embodiment can be referred to as an optical module (optical transceiver). The photoelectric conversion device 1100 includes a light source 1101, a modulation module 1102, a demodulation module 1104, a transmission (transport, TX) port 1103, a reception port (receive, RX) 1105, and a processing module 1106. The processing module 1106 is connected to the modulation module 1102 and the demodulation module 1104, respectively. The modulation module 1102 is connected to the light source 1101 and the transmission port 1103, respectively, and the demodulation module 1104 is connected to the reception port 1105. The light source 1101 is used to send an optical signal to the modulation module 1102, the processing module 1106 is used to send a first service electrical signal to the modulation module 1102, and the modulation module 1102 is used to receive the optical signal from the light source and to modulate the first service electrical signal on the optical signal to obtain a first service optical signal. The light source 1101 and modulation module 1102 shown in this embodiment can be two separate devices, or the light source 1101 and modulation module 1102 can be a device packaged as one, for performing electrical-to-optical conversion on the first service electrical signal to output the first service optical signal, which is not limited in this embodiment. The transmission port 1103 is used to transmit the first service optical signal from the modulation module 1102.

[0090] The receiving port 1105 is configured to receive a second service optical signal, and the demodulation module 1104 is configured to receive the second service optical signal from the receiving port 1105 and perform optical-to-electrical conversion on the second service optical signal to demodulate a second service electrical signal from the second service optical signal. The demodulation module 1104 is configured to send the second service electrical signal to the processing module 1106.

[0091] This embodiment does not limit the form of the processing module 1106. For example, the processing module 1106 may be one or more chips, or one or more integrated circuits. For example, the processing module 1106 may be one or more optical digital signal processors (oDSPs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), system-on-chips (SoCs), central processor units (CPUs), network processors (NPs), microcontroller units (MCUs), programmable logic devices (PLDs), or other integrated chips, or any combination of the above chips or processing modules, and details are not provided herein.

[0092] The optoelectronic conversion device shown in this embodiment includes an optical fiber connector, which includes a transmitting port 1103 and a receiving port 1105. The transmitting port 1103 is used to connect a first external optical cable and a first internal optical cable. The receiving port 1105 is used to connect a second external optical cable and a second internal optical cable. The first external optical cable and the second external optical cable are located outside the housing of the optoelectronic conversion device 1100. The first internal optical cable and the second internal optical cable are located inside the housing of the optoelectronic conversion device 1100. For example, if the optoelectronic conversion device 1100 is connected to an external device, one end of the first external optical cable is connected to the transmitting port 1103 and the other end is connected to the external device, enabling the optoelectronic conversion device 1100 to transmit a first service optical signal to the external device via the first external optical cable. For another example, one end of the second external optical cable is connected to the receiving port 1105 and the other end is connected to the external device, enabling the optoelectronic conversion device 1100 to receive a second service optical signal from the external device via the second external optical cable. The transmitting port 1103 is connected to the modulation module 1102 via the first internal optical cable. The receiving port 1105 is connected to the demodulation module 1104 via a second internal optical cable.

[0093] The specific type of the optical fiber connector shown in this embodiment can be any of the following. It should be noted that the description of the optical fiber connector type in this embodiment is an optional example and is not limiting:

[0094] Multi fiber push-on (MPO) fiber optic connector, ferrule connector (FC) fiber optic connector, square connector (SC) fiber optic connector, lucent connector (LC) fiber optic connector, straight-tip (ST) fiber optic connector, or fiber distributed data interface (IFDD) fiber optic connector.

[0095] Figure 12 is an example diagram of the structure of an embodiment of the optical communication system provided in this application. The optical communication system 1200 shown in this embodiment includes a core node (central point, CP) 1201 and multiple access nodes (access point, AP) 1202 connected to CP1201. CP1201 can be connected to multiple APs through one or more optical splitters. This embodiment does not limit the number of APs included in the optical communication system 1200. For example, the optical communication system 1200 includes three APs 1202 as an example. CP1201 includes an outer shell, a plug-in frame, a CP side device 1211 and a first optoelectronic conversion device 1212. The CP side device 1211 includes a processor. For a description of the processor type, please refer to the description of the processing module corresponding to Figure 11, and the details are not repeated here. The processor is used to send a first service electrical signal to the first optoelectronic conversion device 1212, and to receive a second service electrical signal from the first optoelectronic conversion device 1212. The plug-in frame of the CP side device 1211 is used to insert one or more first optoelectronic conversion devices 1212. Optionally, the first photoelectric conversion device 1212 may also be integrated with the CP side device 1211. For the description of the first photoelectric conversion device 1212, please refer to the description corresponding to FIG11 , and the details are not repeated here. CP 1201 is connected to AP 1202 via an external optical cable.

[0096] AP1202 includes an outer shell, a second photoelectric conversion device, and AP-side equipment. For example, the second photoelectric conversion device can be directly plugged into the AP-side equipment or integrated with the AP-side equipment. This embodiment uses the example of AP1202 including a single second photoelectric conversion device. In other examples, AP1202 may include multiple second photoelectric conversion devices. The description of the AP1202 structure in this embodiment can be found in the description of the CP1201 structure, and the details are not repeated here.

[0097] This embodiment does not limit the network in which the optical communication system 1200 is applied. For example, if the optical communication system 1200 shown in this embodiment is applied to a PON, the AP can be an optical network unit (ONU) or an optical network terminal (ONT). The core node CP1201 can be an optical line terminal (OLT), a switch (e.g., a core layer switch, a layer 2 switch), or a router. If the optical communication system 1200 is applied to an OTN, both the CP and the AP can be OTN devices.

[0098] An embodiment of the present application provides an optical communication device. For the description of the optical communication device, please refer to the description of CP1201 or AP1202 corresponding to Figure 12, and the details will not be repeated here.

[0099] Figure 13 is a diagram illustrating the structure of an embodiment of a radar provided herein. The radar 1300 shown in this embodiment includes a controller 1301, a light source 1302, and a receiving device 1303. The light source 1302 and the receiving device 1303 are each connected to the controller 1301. The connections between the components included in the radar can be electrical or optical. The controller 1301 is used to control the light source 1302 and the receiving device 1303 to ensure their normal operation. For example, the controller 1301 provides driving voltages to the light source 1302 and the receiving device 1303, respectively. The controller 1301 may also provide a transmission control signal for the light source 1302. For a description of the structure of the light source 1302, please refer to the description of the aforementioned embodiment and will not be further elaborated. For a description of the type of controller 1301, please refer to the description of the processing module type corresponding to Figure 11 and will not be further elaborated.

[0100] The controller 1301 is used to send a control signal to the light source 1302, and the light source 1302 is used to emit a laser beam for realizing radar detection according to the control signal. The laser beam propagates along the emission direction. When the laser beam encounters the object to be measured, it is reflected on the surface of the object to be measured, and the reflected echo beam is received by the receiving device 1303 of the radar 1300. In the embodiment of the present application, the light beam reflected back by the object to be measured is called an echo beam. After receiving the echo beam, the receiving device 1303 performs photoelectric conversion on the echo beam, that is, converts the echo beam into an electrical signal (the electrical signal is referred to as the detection electrical signal below). The receiving device 1303 sends the detection electrical signal to the controller 1301, so that the controller 1301 can obtain the position information of the object to be measured based on the detection electrical signal. Specifically, the controller 1301 can determine the position information of the object to be measured by calculating the time delay between the emission time point of the laser beam and the return time point of the detection electrical signal. At the same time, the radar 1300 can also acquire the position information of each point on the surface of the object to be measured by emitting laser beams with different spatial orientations to the object to be measured, thereby generating a point cloud image of the object to be measured.

[0101] In this embodiment, the radar 1300 is a laser radar as an example. Laser radar is a target detection technology. Laser radar emits a laser beam, which is diffusely reflected when it encounters the object to be measured. The reflected echo beam determines the distance, direction, height, speed, posture, shape and other characteristic quantities of the object to be measured. Laser radar is applied to intelligent driving vehicles, intelligent driving aircraft, 3D printing, virtual reality (VR), augmented reality (AR), service robots and other fields. The intelligent driving in the embodiments of this application can be unmanned driving, automatic driving, or assisted driving.

[0102] Figure 14 is an example diagram of the structure of an embodiment of the projection system provided in this application. The projection system 1400 includes a light source 1401, an image modulation module 1402 and a lens 1403. For the description of the structure of the light source 1401 shown in this embodiment, please refer to the above embodiment, and the details will not be repeated here. The light source 1401 in this embodiment outputs a projection beam (white light) to the image modulation module 1402. The image modulation module 1402 is used to receive the projection beam from the light source 1401, and to modulate the projection beam 1401 to obtain a modulated beam, and is also used to transmit the modulated beam to the lens 1403. The lens 1403 is used to project the modulated beam outward and to image the modulated beam. The lens 1403 can be a short-focus lens.

[0103] In this embodiment, the image modulation module 1402 can be a liquid crystal on silicon (LCOS) display, an organic light-emitting diode (OLED) display, a liquid crystal display (LCD), a digital light processing (DLP) display, or a micro-electro-mechanical systems (MEMS) display.

[0104] The light source 1401 in this embodiment may include a three-color light source (the laser array included in the light source specifically includes a laser for emitting blue light, a laser for emitting red light, and a laser for emitting green light). Optionally, the light source 1401 may include a spectrometer, which may be a wave plate or a semi-reflective semi-transmissive wave plate, etc. The spectrometer is used to filter out the red light in the projection beam output by the light source and transmit it to the image modulation module 1402. The spectrometer is used to filter out the blue light in the projection beam output by the light source and transmit it to the image modulation module 1402. The spectrometer is used to filter out the green light in the projection beam output by the light source and transmit it to the image modulation module 1402.

[0105] The projection system shown in this embodiment can be applied to projection headlights. Specifically, the modulated light beam emitted by the lens 1403 displays a target light pattern on the road surface to form an image. The target light pattern formed by the modulated light beam can be a light carpet displayed on the road surface projection area. The light carpet prompts the driver with the vehicle's ADAS information, main data on the vehicle dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information or vehicle body posture data, etc. through the modulated image, color, light pattern, etc., which is not limited in this embodiment. The modulated light beam emitted by the projection headlight shown in this embodiment, which is displayed in a target light pattern, can also be used to illuminate the road surface around the vehicle, etc., to improve driving safety or navigation efficiency. The projection headlight shown in this embodiment is used for vehicle lighting and image projection, and can be a low beam or an adaptive high beam to realize vehicle-assisted automatic driving.

[0106] Figure 15 is an example diagram of the structure of an embodiment of the head-up display system provided by the present application. The head-up display (HUD) system shown in this embodiment includes a projection system 1401 and a light deflection module 1402. For the description of the projection system 1401, please refer to the corresponding description of Figure 13, and the details are not repeated here. The HUD system projects vehicle-related information in front of the driver's field of view. The vehicle-related information may be instrument information (such as vehicle speed) or navigation information, etc. Then, the driver sees the vehicle-related information in front of the field of view, and does not have to look down at the instrument panel or central control display screen under the steering wheel, thereby improving the braking reaction time in an emergency and improving driving safety.

[0107] The projection system 1401 shown in this embodiment transmits a modulated light beam 1411 to a light deflection module 1402. Specifically, as shown in FIG13 , the projection system 1401 includes a light source, an image modulation module, and a lens. The light source transmits a projection light beam to the image modulation module, which modulates vehicle-related information on the projection light beam to obtain a modulated light beam 1411. The lens 1403 transmits the imaged modulated light beam 1411 to the light deflection module 1402. The light deflection module 1402 forms a magnified virtual image 1412 in front of the vehicle with the modulated light beam. The light deflection module shown in this embodiment includes a curved mirror 1403. This curved mirror 1403 magnifies the light spot of the modulated light beam 1411 and transmits it to the vehicle's windshield 1404. The windshield 1404 reflects the modulated light beam 1411 toward the driver's eyes to form an image. Specifically, the reverse extension of the image formed in the driver's eyes forms a virtual image 1412 in front of the vehicle. This embodiment takes the application of the HUD system to a vehicle as an example. In other examples, the HUD system can also be applied to ships, airplanes, helicopters and other driving tools that require a driver to drive.

[0108] The HUD shown in this embodiment can also be a HUD with three-dimensional (3D) display capabilities. A 3D HUD modulates vehicle driving-related information onto a projection beam emitted by a projection system and displays the vehicle driving-related information in the form of a virtual image in front of the vehicle. This virtual image is then superimposed on the road scene (e.g., roads, buildings, pedestrians, etc.) to achieve a 3D display effect.

[0109] This embodiment also provides a means of transportation. For a description of the specific structure, please refer to the corresponding description of Figure 1 and will not be described in detail.

[0110] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A light source, characterized in that: It comprises a first substrate, a driving circuit and a first laser, wherein the driving circuit is electrically connected to the first laser through the first substrate, and the driving circuit is used to drive the first laser to emit light; Along a direction perpendicular to the first substrate, the light source comprises a first packaging space and a second packaging space stacked in position, a first surface of the first substrate is located in the first packaging space, a second surface of the first substrate is located in the second packaging space, and the first surface and the second surface are oriented in opposite directions; The first laser is packaged in the first packaging space or the second packaging space, the driving circuit is packaged in at least one of the first packaging space and the second packaging space, and the packaging space in which the first laser is packaged is different from the packaging space in which at least part of the driving circuit is packaged.

2. The light source according to claim 1, characterized in that Along a direction perpendicular to the first substrate, the light source further includes a circuit board stacked with the first substrate, a surface of the circuit board facing the first substrate is located in the first packaging space, and the first surface is a surface of the first substrate facing the circuit board.

3. The light source according to claim 1 or 2, characterized in that: Along a direction perpendicular to the first substrate, the first substrate includes at least a first sub-plate and a second sub-plate stacked in position, and the first sub-plate includes a first current channel passing through the first sub-plate, the second sub-plate includes a second current channel passing through the second sub-plate, any first current channel among the plurality of the first current channels is electrically connected to a second current channel among the plurality of the second current channels, and the driving circuit is electrically connected to the first laser through the first current channel and the second current channel.

4. The light source according to claim 3, characterized in that The first orthographic projection partially overlaps with the second orthographic projection, wherein the first orthographic projection is the orthographic projection of any first current channel among the multiple first current channels, and the second orthographic projection is the orthographic projection of one second current channel among the multiple second current channels.

5. The light source according to any one of claims 1 to 4, characterized in that: The driving circuit includes a first electrical module and a second electrical module, wherein the first electrical module is encapsulated in the first encapsulation space, and the second electrical module is encapsulated in the second encapsulation space.

6. The light source according to any one of claims 1 to 4, characterized in that: The first laser is packaged in the first packaging space, and the driving circuit is packaged in the second packaging space, or the first laser is packaged in the second packaging space, and the driving circuit is packaged in the first packaging space.

7. The light source according to any one of claims 1 to 6, characterized in that: The light source further comprises a second laser electrically connected to the driving circuit, the driving circuit is electrically connected to the second laser through the first substrate, and the driving circuit is further used to drive the second laser to emit light; The second laser is packaged in the first packaging space or the second packaging space.

8. The light source according to any one of claims 1 to 7, characterized in that: In a direction perpendicular to the first substrate, the light source further comprises a second substrate stacked with the first substrate, the second encapsulation space comprises a first sub-encapsulation space and a second sub-encapsulation space, the third surface and the second surface of the second substrate are located in the first sub-encapsulation space, the third surface is a surface of the second substrate facing the first substrate, the fourth surface of the second substrate is located in the second sub-encapsulation space, and the orientation of the third surface is opposite to that of the fourth surface; The first laser is packaged in one of the first packaging space, the first sub-packaging space, and the second sub-packaging space, and the driving circuit is packaged in at least one of the first packaging space, the first sub-packaging space, and the second sub-packaging space.

9. A photoelectric conversion device, characterized in that: The method comprises a processing module, a modulation module, a demodulation module, a transmission port, a receiving port and a light source according to any one of claims 1 to 8, wherein the processing module is connected to the modulation module and the demodulation module respectively, the modulation module is connected to the light source and the transmission port respectively, and the demodulation module is connected to the receiving port; The processing module is used to send a first service electrical signal to the modulation module; The light source is used to send an optical signal to the modulation module; The modulation module is used to modulate the first service electrical signal on the optical signal to obtain a first service optical signal; The sending port is used to send the first service optical signal; The receiving port is used to receive a second service optical signal; The demodulation module is used for demodulating the second service electrical signal from the second service optical signal, and sending the second service electrical signal to the processing module.

10. An optical communication device, characterized in that: It comprises an outer shell, a processor and the photoelectric conversion device according to claim 9, wherein the outer shell is used to fix the processor and the photoelectric conversion device, and the processor is connected to the photoelectric conversion device; The processor is used to send the first service electrical signal to the photoelectric conversion device, and is also used to receive the second service electrical signal from the photoelectric conversion device.

11. A radar, characterized in that: It comprises a controller, a receiving device and the light source according to any one of claims 1 to 8, wherein the controller is connected to the light source and the receiving device respectively; The light source is used to emit a laser beam; The receiving device is used to receive the echo light beam and to perform photoelectric conversion on the echo light beam to obtain a detection electrical signal, wherein the object to be measured is used to reflect the laser beam to reflect the echo light beam toward the receiving device; The controller is used to detect the object to be detected according to the detection electrical signal.

12. A projection system, characterized in that: It comprises an image modulation module, a lens and a light source as claimed in any one of claims 1 to 8; The image modulation module is used to receive the projection light beam from the light source, and to modulate the projection light beam to obtain a modulated light beam, and is also used to transmit the modulated light beam to the lens; The lens is used to image the modulated light beam.

13. A head-up display system, characterized in that: comprising a light deflection module and a projection system as claimed in claim 12; The projection system is used to transmit the modulated light beam to the light deflection module; The light deflection module is used to transmit the amplified modulated light beam to the windshield, and the modulated light beam reflected by the windshield forms a virtual image.

14. A means of transport, characterized in that: It comprises a vehicle body, a windshield, a processor and the head-up display system as claimed in claim 13; the vehicle body is used to fix the windshield, the processor and the head-up display system; The processor is used to transmit vehicle driving related information to the image modulation module; The image modulation module is used to modulate the vehicle driving related information on the projection light beam to obtain the modulated light beam.

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