High-pressure substrate processing apparatus

Abstract

Disclosed is a high-pressure substrate processing apparatus. The high-pressure substrate processing apparatus may include an inner chamber, an outer chamber, and a fastening module. The inner chamber is formed to contain a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure. The outer chamber includes an outer housing, an outer door, and an outer sealing material. The outer housing contains the inner chamber. The outer door is formed to be movable between a closed state in which the outer housing is closed and an open state in which the outer housing is opened. The outer sealing material is formed for sealing between the outer housing and the outer door. The outer chamber is formed to contain a protective gas supplied at a second pressure configured in relation to the first pressure. The fastening module includes a support protrusion and an engaging protrusion. The support protrusion is installed on the outer housing. The engaging protrusion is installed on the outer door so as to be disposed on the support protrusion as the outer door rotates in a state in which the outer sealing material is spaced apart from one of the outer housing and the outer door.

Description

High pressure substrate processing equipment

[0001] The present invention relates to a processing device used to process a substrate in a high pressure environment.

[0002]

[0003] Typically, during the semiconductor device manufacturing process, various processing processes are performed on the semiconductor substrate. Examples of these processes include oxidation, nitriding, ion implantation, and deposition. Hydrogen or deuterium heat treatment processes are also used to improve the interface properties of semiconductor devices.

[0004] The gases used to process the substrate are supplied to the chamber at high pressure, acting on the semiconductor substrate. To maintain the chamber at high pressure, the chamber door must be securely closed to the housing. If the chamber's seal is loosened by the high-pressure gas, a gap may form between the housing and the door. This gap can allow gases within the chamber to leak out.

[0005] To securely maintain the closed state between the housing and the door, Korean Patent Publication No. 10-2015-0086831 (July 29, 2015) discloses a rotating locking ring. The rotating locking ring is rotatably installed on the outside of the housing, and as it rotates, a first engaging projection either engages or disengages from a second engaging projection. Due to its size surrounding the housing, the rotating locking ring requires a large amount of power to drive its rotation.

[0006] The background technology described above is technical information that the inventor possessed for the purpose of deriving embodiments of the present invention or acquired during the derivation process, and cannot necessarily be said to be publicly known technology disclosed to the general public prior to the present application.

[0007]

[0008] One object of the present invention is to provide a high-pressure substrate processing device that can maintain a firmly closed state between a housing and a door even under high pressure within a chamber, while reducing the power required for fastening between the housing and the door.

[0009] Another object of the present invention is to provide a high-pressure substrate processing device that prevents the sealing material from being damaged when the door is rotated for fastening between the housing and the door.

[0010]

[0011] According to one aspect of the present invention for achieving the above-described object, a high-pressure substrate processing device may include an inner chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer housing formed to accommodate the inner chamber; an outer door formed to be movable between a closed state for closing the outer housing and an open state for opening the outer housing; an outer sealant formed for sealing between the outer housing and the outer door; and an outer chamber formed to accommodate a protective gas supplied at a second pressure set in relation to the first pressure; and a fastening module including a support protrusion installed on the outer housing and a catch protrusion installed on the outer door such that the external sealant is disposed on the support protrusion as the outer door rotates in a state where the external sealant is spaced apart from one of the outer housing and the outer door.

[0012] Here, the fastening module may further include a sealing adjustment unit formed to adjust the external sealing material to a state in which it is in contact with the external housing and the external door while the catch protrusion is positioned on the support protrusion.

[0013] Here, the sealing adjustment unit may include an actuator that moves the external sealing material in an approach direction from one of the external housing and the external door toward the other.

[0014] Here, the sealing adjustment unit may include an operating channel formed in the other of the outer housing and the outer door; and a connecting member that connects the outer sealing material and the actuator and is positioned within the operating channel so as to be movable along the approach direction.

[0015] Here, the operating channel and the connecting member may have a closed loop shape corresponding to the external sealing material.

[0016] Here, the inner chamber includes an inner housing for accommodating the substrate to be processed, an inner door formed to close the inner housing, an inner sealant formed for sealing between the inner housing and the inner door, and a support member for supporting the inner door with respect to the outer door, and the inner door can be formed to be connected to the outer door through the support member and rotate together with the outer door while the inner sealant is spaced apart from one of the inner housing and the inner door.

[0017] Here, the fastening module may further include a sealing adjustment unit formed to adjust the inner sealing material to a state in which the hooking protrusion is placed on the support protrusion and is in contact with the inner housing and the inner door.

[0018] Here, the sealing adjustment unit may include an actuator that moves the inner sealing material in an approach direction from one of the inner housing and the inner door toward the other.

[0019] Here, the actuator may be connected to the support member to move the support member and the inner door toward the inner housing.

[0020] Here, a door driving module for driving the external door is further included, and the door driving module may include a lifting arm formed to be raised and lowered between the open state and the closed state; and a turntable that supports the external door and is rotatably installed on the lifting arm.

[0021] Here, the door driving module may further include an actuator configured to rotate one of the outer door and the turntable.

[0022] According to another aspect of the present invention, a high-pressure substrate processing device comprises: a chamber having a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure; a door formed to move between a closed state for closing the housing and an open state for opening the housing; and a sealant formed for sealing between the housing and the door; and a fastening module having a support protrusion installed on the housing and a catch protrusion installed on the door and arranged on the support protrusion as the door rotates in the closed state; wherein the sealant may be formed to be spaced apart from one of the housing and the door while the door rotates.

[0023] Here, the fastening module may further include a sealing adjustment unit formed to adjust the sealing material so that it is in contact with the housing and the door while the catch protrusion is positioned on the support protrusion.

[0024] Here, a door driving module for driving the door is further included, and the door driving module may include a lifting arm formed to be raised and lowered between the open state and the closed state; and a turntable that supports the door and is rotatably installed on the lifting arm.

[0025] According to another aspect of the present invention, a high-pressure substrate processing device comprises: an inner chamber formed to accommodate a substrate to be processed, an inner door formed to close the inner housing, an inner sealing material formed for sealing between the inner housing and the inner door, and a support member for supporting the inner door; and configured to accommodate a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer chamber formed to accommodate an outer housing formed to accommodate the inner chamber, an outer door formed to be movable together with the inner door between a closed state for closing the outer housing and an open state for opening the outer housing, and an outer sealing material formed for sealing between the outer housing and the outer door; and configured to accommodate a protective gas supplied at a second pressure set in relation to the first pressure; And it may include a fastening module having a support protrusion installed on the outer housing, and a catch protrusion installed on the outer door so that the inner sealing material faces the inner housing and the outer sealing material faces the outer housing, and is positioned on the support protrusion as the outer door rotates.

[0026]

[0027] According to the high-pressure substrate processing device according to the present invention configured as described above, the housing and the door for accommodating the substrate and the high-pressure gas are maintained in a fastened state by the fastening module, and the fastening module is configured such that the catch projection installed on the door rotates together with the door and is positioned on the support projection installed on the housing, so that the housing and the door can be firmly maintained in a closed state even under high pressure within the chamber due to the fastening between the catch projection and the support projection. In addition, since the catch projection and the support projection are fastened as the door rotates, the power for fastening between the protrusions can be reduced.

[0028] Since the sealant sealing the gap between the housing and the door remains separated from one of the housing and the door during the rotation of the door, the sealant is not damaged when the door rotates.

[0029]

[0030] FIG. 1 is a conceptual diagram of a high-pressure substrate processing device according to one embodiment of the present invention.

[0031] Fig. 2 is an exploded perspective view showing the open state of the high-pressure substrate processing device of Fig. 1.

[0032] Figure 3 is a plan view of the outer door of Figure 2.

[0033] Fig. 4 is a partial cross-sectional view taken along line (Ⅳ-Ⅳ) of one of the closed states of the high-pressure substrate processing device of Fig. 2.

[0034] Fig. 5 is a partial cross-sectional view of another state among the closed states of the high-pressure substrate processing device of Fig. 2.

[0035] Figure 6 is a conceptual diagram showing a door drive module rotating and driving an external door.

[0036] Fig. 7 is a conceptual diagram showing a door drive module according to a modified example of the door drive module of Fig. 6 rotating and driving an external door.

[0037]

[0038]

[0039] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0040] The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and with various modifications. However, these embodiments are provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but should be understood to include all modifications, equivalents, and substitutes included within the technical spirit and scope of the present invention, as well as substitutions or additions of the components of one embodiment with those of another embodiment.

[0041] The attached drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification, but should be understood to encompass all modifications, equivalents, and substitutes included within the spirit and technical scope of the present invention. In the drawings, the components may be expressed in exaggerated sizes or thicknesses for ease of understanding, but the scope of protection of the present invention should not be construed as being limited thereby.

[0042] The terminology used in this specification is only used to describe specific implementations or examples and is not intended to limit the present invention. In addition, the singular expression includes the plural expression unless the context clearly indicates otherwise. In the specification, terms such as "comprises" and "consists of" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification. In other words, it should be understood that terms such as "comprises" and "consists of" do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0043] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0044] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0045] When a component is referred to as being "above" or "below" another component, it should be understood that it is not only positioned directly above that other component, but that there may also be other components present in between.

[0046] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0047] FIG. 1 is a conceptual diagram of a high-pressure substrate processing device according to one embodiment of the present invention.

[0048] Referring to this drawing, the high-pressure substrate processing device (100) may include an inner chamber (110), an outer chamber (120), an air supply module (130), and an exhaust module (140).

[0049] The inner chamber (110) forms a processing space that accommodates an object to be processed, for example, a substrate to be processed. The inner chamber (110) may be made of a non-metallic material, for example, quartz, to reduce contamination in a high temperature and high pressure working environment. Depending on the operation of a heater (not shown) disposed outside the inner chamber (110), the temperature of the inner chamber (110) may reach several hundred to several thousand degrees Celsius. The substrate may be, for example, a semiconductor wafer (W, see FIG. 2) mounted on a holder or glass for a display. The holder may be a wafer boat (113, see FIG. 2) capable of stacking semiconductor wafers (W) in multiple layers.

[0050] The outer chamber (120) forms an internal space that accommodates the inner chamber (110). The outer chamber (120) is positioned outside the inner chamber (110). Unlike the inner chamber (110), the outer chamber (120) is free from concerns about causing contamination to the object, and thus can be made of metal.

[0051] The air supply module (130) is configured to supply gas to the inner chamber (110) and the outer chamber (120). The air supply module (130) has a gas supplier (131) that serves as a gas source. The gas supplier (131) can selectively supply hydrogen gas (H2), deuterium gas (D2), fluorine gas (F2), ammonia gas (NH3), chlorine gas (Cl2), nitrogen gas (N2), etc. as a reaction gas for a heat treatment process to the inner chamber (110). The gas supplier (131) can supply nitrogen gas or argon gas (Ar), which are inert gases, as a protective gas to the outer chamber (120). The reaction gas and the protective gas may be simply referred to as process gases. The process gases are supplied to the inner chamber (110) or the outer chamber (120) through a reaction gas line (133) or a protective gas line (135), respectively. The protective gas supplied to the outer chamber (120) is specifically supplied to the space (protection space) between the outer chamber (120) and the inner chamber (110).

[0052] The process gas may be supplied at a pressure higher than atmospheric pressure (high pressure), for example, a pressure ranging from several atmospheres to several tens of atmospheres. When the pressure of the reaction gas is a first pressure and the pressure of the protective gas is a second pressure, they may be maintained at a set relationship. For example, the second pressure may be set to be slightly greater than the first pressure. Such a pressure difference provides the advantage of preventing the reaction gas from leaking from the internal chamber (110).

[0053] The exhaust module (140) is configured to exhaust the process gas. In order to exhaust the reaction gas from the inner chamber (110), an exhaust pipe (141) is connected to the upper portion of the inner chamber (110). Similarly, in order to exhaust the protective gas from the outer chamber (120), an exhaust pipe (145) connected to the outer chamber (120) may be provided. Since these exhaust pipes (141 and 145) are integrated into one, the reaction gas is diluted in the protective gas during the exhaust process, thereby lowering its concentration.

[0054] The fastening structure of the external chamber (120) is described with reference to FIGS. 2 to 5.

[0055] Fig. 2 is an exploded perspective view showing the open state of the high-pressure substrate processing device of Fig. 1, and Fig. 3 is a plan view of the outer door of Fig. 2.

[0056] Referring to the drawings, the inner chamber (110) may include an inner housing (111, see FIG. 4), an inner door (115), an inner sealant (117), and a support member (119). The inner housing (111) forms the processing space for accommodating a semiconductor wafer (W), and its lower portion may have an open shape. The inner door (115) has a shape that can close the open lower portion of the inner housing (111). The inner door (115) may have a groove shape that is generally open downward. The inner sealant (117) is configured to seal a gap between the inner housing (111) and the inner door (115). The inner sealant (117) may be, for example, an O-ring installed on the inner door (115). The inner sealant (117) is arranged to face the inner housing (111). Alternatively, the inner sealant (117) may be installed in the inner housing (111). The support member (119) supports the inner door (115) against the outer door (125). The support member (119) may have a spring support structure that elastically expands along the opening / closing direction (E). The opening / closing direction (E) is the direction in which the inner door (115) moves to switch between the closed state and the open state (see FIG. 2). When the inner housing (111) is erected, the opening / closing direction (E) may be a direction corresponding to a lifting or vertical direction. The closed state is a state in which the outer door (125) is positioned at the same level as in FIG. 4 along the opening / closing direction (E). In the closed state, the catching protrusion (155) passes through the space between the supporting protrusions (151) and comes close to the outer housing (121) (unfastened state).

[0057] As the inner door (115) descends, the processing space is opened (open state, see Fig. 2). In the open state, the substrate to be processed is unloaded from the boat (113), and a new substrate to be processed is loaded onto the boat (113). In the raised state of the inner door (115), the processing space can be closed (sealed state, see Fig. 5). In the sealed state, processing, such as heat treatment or deposition, is performed on the semiconductor wafer (W).

[0058] The outer chamber (120) also includes an outer housing (121), an outer door (125), and an outer sealant (127). The outer housing (121) has a size to accommodate the inner chamber (110). The inner housing (111) is mounted on the outer housing (121). The outer door (125) can also open and close the outer housing (121) by moving. In the process of switching from the open state to the closed state, the outer door (125) can move toward the inner door (115) by deformation (compression) of the support member (119). The outer sealant (127) is for sealing the gap between the outer housing (121) and the outer door (125). The outer sealant (127) may be, for example, an O-ring installed on the outer door (125) so as to face the outer housing (121). Alternatively, the external sealant (127) may be installed in the external housing (121).

[0059] The outer door (125) opens and closes the outer housing (121) while moving together with the inner door (115) by the support member (119). Unlike the above, the inner door (115) and the outer door (125) are not connected to each other and can be opened and closed independently.

[0060] The high-pressure substrate processing device (100) may further include a fastening module (150) for fastening the outer housing (121) and the outer door (125) in the closed state. Since the inner door (115) is supported by the support member (119) to the outer door (125), the fastening module (150) also allows the inner door (115) to be in close contact with the inner housing (111). The fastening module (150) allows the protective gas to be maintained at the second pressure within the outer chamber (120). The fastening module (150) also exerts a fastening force to maintain the reaction gas at the first pressure within the inner chamber (110).

[0061] The fastening module (150) may specifically include a support protrusion (151), a catch protrusion (155), and a sealing adjustment unit (161, 165).

[0062] The support protrusion (151) is a protrusion installed on the outer housing (121). The support protrusion (151) may be formed to protrude from the inner peripheral surface of the outer housing (121), as in the present embodiment. A plurality of support protrusions (151) may be arranged along the circumferential direction of the inner peripheral surface. A plurality of support protrusions (151) may be arranged on the same level or plane along the elevation direction (E). The support protrusion (151) may be integrally formed with the outer housing (121), or may be manufactured separately and then mounted on the outer housing (121).

[0063] The catch (155) can be installed on the outer door (125). Accordingly, the catch (155) can have a shape that protrudes from the outer surface of the outer door (125). The catch (155) can also be integrally formed with the outer door (125) or can be manufactured separately and then coupled to the outer door (125). The catch (155) has a size that passes between a pair of adjacent support protrusions (151) when the outer door (125) moves in the opening / closing direction (E). The catch (155) can be provided in a number corresponding to the support protrusions (151).

[0064] The sealing adjustment unit (161, 165) is configured to separate or contact the sealing material (inner sealing material (117) or outer sealing material (127)) with respect to the housing (inner housing (111) or outer housing (121)) or the door (inner door (115) or outer door (125)). The sealing adjustment unit (161, 165) can be divided into an (external) sealing adjustment unit (161) that acts on the outer sealing material (127) and an (internal) sealing adjustment unit (165) that acts on the inner sealing material (117). One sealing adjustment unit (161) can be arranged to surround another sealing adjustment unit (165).

[0065] Fig. 4 is a partial cross-sectional view taken along line (Ⅳ-Ⅳ) of one of the closed states of the high-pressure substrate processing device of Fig. 2.

[0066] Referring to this drawing, as the outer door (125) rotates in the closed state, the engaging projection (155) also rotates. The rotated engaging projection (155) is placed on the supporting projection (151) and can be supported by the supporting projection (151) (locked state). During the transition from the closed state to the locked state, the level (height) of the outer door (125) along the opening / closing direction (E) can be maintained unchanged. For this reason, the locked state can be understood as one of the closed states. In the locked state, the outer door (125) does not detach from the outer housing (121) despite the high pressure of the process gas. The outer door (125) can remain firmly locked to the outer housing (121). During the rotation of the outer door (125), the inner door (115) is also connected to the outer door (125) through the support member (119) and rotates together with the outer door (125).

[0067] During the rotation of the outer door (125), the outer sealant (127) {and the inner sealant (117)} face the outer housing (121) {and the inner housing (111)}. Furthermore, the sealants (117, 127) can be maintained in a state of being spaced apart from the housings (111, 121) by the operation of the sealing adjustment unit (161, 165). Specifically, the sealing adjustment unit (161) moves the outer sealant (127) along the direction (D) away from the outer housing (121), thereby causing the outer sealant (127) to separate from the outer housing (121). The sealing adjustment unit (165) also moves the inner sealant (117) along the separation direction (D).

[0068] The sealing adjustment unit (161) includes an actuator (162) for moving the external sealant (127) relative to the external housing (121). For example, a hydraulic / pneumatic cylinder or a linear motor may be employed as the actuator (162). The actuator (162) may be directly connected to the external sealant (127) or may be connected via a connecting member (163). In the latter case, the external sealant (127) may be installed on the connecting member (163). The actuator (162) may be installed to exert a downward pushing force on the external sealant (127). In order to allow movement along the opening / closing direction (E, see FIG. 2) of the connecting member (163), an operating channel (164) may be formed in the external door (125). The connecting member (163) and the operating channel (164) may have a closed loop shape, for example, a circular shape, corresponding to the external sealing material (127) (see FIG. 3).

[0069] The sealing adjustment unit (165) for adjusting the inner sealant (117) is generally the same as the sealing adjustment unit (161) described above. A connecting member (167) is connected to the actuator (166), and an operating channel (168) may also be formed in the outer door (125) for movement of the connecting member (167). However, the actuator (166) may not be directly connected to the inner sealant (117) through the connecting member (167), but may be connected to a supporting member (119). The supporting member (119) may be connected to the inner door (115), and the inner sealant (117) may be installed in the inner door (115). Accordingly, when the actuator (166) is operated, the inner sealant (117) moves together with the connecting member (167), the supporting member (119), and the inner door (115).

[0070] In the above, the external sealant (127) and the sealing adjustment unit (161) are exemplified as being installed in the external door (125), but they (127 and 161) may also be installed in the external housing (121). In addition, if the sealant expands / contracts due to pressure fluctuations caused by the supply / exhaust of the process gas, the sealing adjustment unit (161, 165) may not be necessary. If the sealant contracts while the process gas is exhausted from the chamber (110, 120), the sealant may not be damaged when the external door (125) rotates by being separated from the housing (111, 121). In addition, if the sealing material expands due to the pressure of the process gas supplied to the chamber (110, 120) in the above-mentioned fastening state, the sealing material will seal the gap between the housing (111, 121) and the door (115, 125), thereby achieving the above-mentioned sealing state.

[0071] Fig. 5 is a partial cross-sectional view of another state among the closed states of the high-pressure substrate processing device of Fig. 2.

[0072] Referring further to this drawing, in the above-described fastening state, the external sealant (127) can be moved along the approach direction (A) by the operation of the sealing adjustment unit (161). The approach direction (A) is a direction in which the external sealant (127) approaches the external housing (121), and may follow the direction in which the external door (125) moves toward the external housing (121). The moving end of the actuator (162) exerts force along the approach direction (A). By the operation of the sealing adjustment unit (161), the external sealant (127) comes into contact with the external housing (121), thereby sealing the gap between the external housing (121) and the external door (125) (sealing state).

[0073] Similarly, depending on the operation of the sealing adjustment unit (165), the inner sealing material (117) can seal the gap between the inner housing (111) and the inner door (115).

[0074] By reaching the above-described fastening state and sealing state, the protective gas within the external chamber (120) can be maintained at the second pressure. The reaction gas within the internal chamber (110) can be maintained at the first pressure. In addition, during the fastening state and sealing state, damage to the sealing material due to friction with a counterpart (such as the external housing (121)) can be fundamentally prevented. By not damaging the sealing material, the possibility of particles being generated from the sealing material and the possibility of leakage of the reaction gas and the protective gas can be significantly reduced.

[0075] Next, the method of rotating the outer door (125) will be described with reference to FIGS. 6 and 7.

[0076] Figure 6 is a conceptual diagram showing a door drive module rotating and driving an external door.

[0077] Referring to this drawing, a door driving module (170) may be employed to drive an external door (125).

[0078] The door actuation module (170) may have a frame (171) arranged to extend along the opening / closing direction (E). An elevating arm (173) arranged along a direction generally perpendicular to the opening / closing direction (E) may be connected to the frame (171). The elevating arm (173) moves along the opening / closing direction (E) and moves the outer door (125) along the opening / closing direction (E).

[0079] A turntable (175) may be installed on the lifting arm (173). The turntable (175) is a part that supports the outer door (125). The turntable (175) may be installed to be rotatable with respect to the lifting arm (173). For the rotation of the turntable (175), an actuator (177) may be connected to the turntable (175). The actuator (177) may be installed on the lifting arm (173) and output rotational force. For example, the actuator (177) may be a motor having a rotational shaft connected to the turntable (175).

[0080] According to this configuration, the outer door (125) can be moved from the open state to the closed state according to the operation of the lifting arm (173). When the turntable (175) rotates according to the operation of the actuator (177), the outer door (125) can also be rotated to reach the locked state.

[0081] Fig. 7 is a conceptual diagram showing a door drive module according to a modified example of the door drive module of Fig. 6 rotating and driving an external door.

[0082] Referring further to this drawing, the door drive module (170') may have an actuator (177') that directly rotates the outer door (125).

[0083] The actuator (177') outputs a linear driving force and may be, for example, a hydraulic / pneumatic cylinder or a linear motor. The output end of the actuator (177') may be connected to the bottom surface of the outer door (125). The other end of the actuator (177') may be installed in the outer housing (121). In response to the elevation of the elevation arm (173), the actuator (177') may be installed to be able to be elevated relative to the outer housing (121).

[0084] According to this configuration, the actuator (177') rotates the outer door (125), thereby causing the outer door (125) to rotate together with the turntable (175).

[0085] Although the present specification has described a dual-chamber processing device as an example of a high-pressure substrate processing device (100), the present invention is not limited thereto. A processing device having a single chamber is also within the scope of the present invention. The single chamber is composed of one housing and one door. A wafer substrate is placed within the chamber, and gas for processing the wafer substrate is supplied. The fastening module (150) (and door driving modules (170, 170')) is also applicable to such a single chamber. The fastening module (150) ensures that the door is firmly fastened to the housing despite the gas pressure. In addition, since the sealing material for sealing between the door and the housing is adjusted by a sealing adjustment unit, it may not be damaged when the door rotates.

[0086] The configuration of the fastening module (150) and the like can also be applied to a semi-dual chamber, which is an intermediate form between the dual chamber and the single chamber. The semi-dual chamber can have two housings (an inner housing and an outer housing) and a door. The two housings can correspond to the inner housing (111) and the outer housing (121) of the previous embodiment. The two housings can be combined by their own shapes or by interposing a separate member to form a closed space (corresponding to the protective space). Similar to the previous embodiment, the substrate is placed in the processing space of the inner housing and the reaction gas is injected, and the protective gas can be injected into the closed space. Unlike the previous embodiments, the door is not protected by the protective gas.

[0087] The above door may correspond to the external door (125) in the previous embodiment. The door can open and close the internal housing (and the external housing). The operation between the external housing and the door is performed using the same fastening module (150) {and door operating module (170, 170')} as in the previous embodiment.

[0088] Although this specification exemplifies a batch-type processing device, the present invention is not limited thereto. The present invention can also be applied to a single-wafer type processing device.

[0089]

[0090] The present invention has industrial applicability in the field of manufacturing high-pressure substrate processing devices.

Claims

1. An internal chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; An external chamber having an outer housing that accommodates the inner chamber, an outer door that is formed to be movable between a closed state that closes the outer housing and an open state that opens the outer housing, and an external sealing material formed for sealing between the outer housing and the outer door, and formed to accommodate a protective gas supplied at a second pressure set in relation to the first pressure; and A high-pressure substrate processing device comprising a fastening module having a support protrusion installed on the outer housing and a catch protrusion installed on the outer door so that the outer sealing material is positioned on the support protrusion as the outer door rotates while being spaced apart from one of the outer housing and the outer door.

2. In paragraph 1, The above-mentioned fastening module, A high-pressure substrate processing device further comprising a sealing adjustment unit formed to adjust the external sealing material to a state in which the hooking protrusion is positioned on the support protrusion and the external sealing material is in contact with the external housing and the external door.

3. In paragraph 2, The above sealing adjustment unit, A high-pressure substrate processing device comprising an actuator for moving the external sealing material in an approach direction from one of the external housing and the external door toward the other.

4. In paragraph 3, The above sealing adjustment unit, an operating channel formed in the other of the outer housing and the outer door; and A high-pressure substrate processing device, comprising a connecting member that connects the external sealing material and the actuator and is positioned within the operating channel so as to be movable along the approach direction.

5. In paragraph 4, The above operating channel and the above connecting member, A high-pressure substrate processing device having a closed loop shape corresponding to the above external sealing material.

6. In paragraph 1, The above inner chamber, It includes an inner housing for accommodating the substrate to be processed, an inner door formed to close the inner housing, an inner sealing material formed for sealing between the inner housing and the inner door, and a support member for supporting the inner door with respect to the outer door. The above inner door, A high-pressure substrate processing device, wherein the inner sealing material is formed to rotate together with the outer door by being connected to the outer door through the support member while being spaced apart from one of the inner housing and the inner door.

7. In paragraph 6, The above-mentioned fastening module, A high-pressure substrate processing device further comprising a sealing adjustment unit formed to adjust the inner sealing material to a state in which the catch protrusion is positioned on the support protrusion and the inner sealing material is in contact with the inner housing and the inner door.

8. In paragraph 7, The above sealing adjustment unit, A high-pressure substrate processing device comprising an actuator for moving the inner sealing material in an approach direction from one of the inner housing and the inner door toward the other.

9. In paragraph 8, The above actuator, A high pressure substrate processing device connected to the support member so as to move the support member and the inner door toward the inner housing.

10. In paragraph 1, Further comprising a door driving module for driving the external door, The above door drive module, A lifting arm formed to be raised and lowered between the open state and the closed state; and A high-pressure substrate processing device, comprising a turntable that supports the outer door and is rotatably installed on the lifting arm.

11. In paragraph 10, The above door drive module, A high-pressure substrate processing device further comprising an actuator configured to rotate one of the outer door and the turntable.

12. A chamber having a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure, a door formed to move between a closed state that closes the housing and an open state that opens the housing, and a sealing material formed for sealing between the housing and the door; and A fastening module including a support protrusion installed in the housing and a catch protrusion installed in the door and positioned on the support protrusion as the door rotates in the closed state, The above sealant is, A high-pressure substrate processing device formed so that the housing and one of the doors are spaced apart while the door rotates.

13. In paragraph 12, The above-mentioned fastening module, A high-pressure substrate processing device further comprising a sealing adjustment unit formed to adjust the sealing material to a state in which the catch protrusion is positioned on the support protrusion and the sealing material is in contact with the housing and the door.

14. In paragraph 13, Further comprising a door driving module for driving the above door, The above door drive module, A lifting arm formed to be raised and lowered between the open state and the closed state; and A high-pressure substrate processing device, comprising a turntable that supports the door and is rotatably installed on the lifting arm.

15. An internal chamber having an inner housing for accommodating a substrate to be processed, an inner door formed to close the inner housing, an inner sealing material formed for sealing between the inner housing and the inner door, and a support member for supporting the inner door, and formed to accommodate a reaction gas supplied at a first pressure higher than atmospheric pressure; An outer chamber having an outer housing for accommodating the inner chamber, an outer door connected to the support member and formed to be movable together with the inner door between a closed state for closing the outer housing and an open state for opening the outer housing, and an outer sealing material formed for sealing between the outer housing and the outer door, and formed to receive a protective gas supplied at a second pressure set in relation to the first pressure; and A high-pressure substrate processing device, comprising a fastening module having a support protrusion installed on the outer housing, and a catch protrusion installed on the outer door so that the inner sealing material faces the inner housing and the outer sealing material faces the outer housing, and is positioned on the support protrusion as the outer door rotates.

Images