LED light and LED product

Abstract

Disclosed in the present application are an LED light and an LED product. The LED light comprises a light-emitting assembly, an insulating base, encapsulation adhesive and a plurality of conductive pins, wherein the plurality of conductive pins are arranged on the insulating base; the light-emitting assembly is arranged on the conductive pins and electrically connected to the conductive pins; and the encapsulation adhesive is located outside of the light-emitting assembly for encapsulation. The light-emitting assembly comprises a driving chip and a plurality of light-emitting chip groups which are combined together in parallel or in series, wherein the plurality of light-emitting chip groups are arranged in sequence in the lengthwise direction of the insulating base, each light-emitting chip group comprising one blue chip, one green chip and one red chip, and the driving chip being electrically connected to each of the blue chip, green chip and red chip, and used for driving each of the blue chip, green chip and red chip to emit light.

Description

LED lights and LED products Technical Field

[0001] The present application relates to the field of LED technology, and in particular to an LED lamp and an LED product. Background Art

[0002] LED lights are widely used in the lighting and display industries due to their advantages such as energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most popular products in recent years.

[0003] However, LED products such as LED displays and LED light strips are composed of multiple LED lights with blue chips, green chips and red chips. With the development of technology, the requirements for the dot pitch of LED products are getting higher and higher. Existing LED lights usually only have one blue chip, one green chip and one red chip inside, and are relatively large in size. It is difficult to realize small-pitch LED products, and it is impossible to achieve small-pitch high-density installation, resulting in poor color or display effects.

[0004] Summary of the Invention

[0005] The present application provides an LED lamp and LED product, which can integrate multiple light-emitting chip groups into one LED lamp, so that multiple blue chips, multiple green chips and multiple red chips can be emitted in one LED lamp, thereby realizing small-pitch and high-density installation of LED products, making the color effect, display effect and resolution of LED products more delicate.

[0006] According to a first aspect of the present application, an LED lamp is provided, comprising a light-emitting component, an insulating base, a packaging adhesive, and a plurality of conductive pins, wherein the plurality of conductive pins are disposed on the insulating base, the light-emitting component is disposed on the conductive pins and is electrically connected to the conductive pins, and the packaging adhesive is encapsulated on the outside of the light-emitting component;

[0007] Among them, the light-emitting component includes at least one driving chip and multiple light-emitting chip groups combined together in parallel or series. The multiple light-emitting chip groups are arranged in sequence along the layout direction of the insulating seat, and each of the light-emitting chip groups includes a blue chip, a green chip and a red chip. At least one driving chip is electrically connected to each of the blue chips, each of the green chips and each of the red chips, and is used to drive each of the blue chips, each of the green chips and each of the red chips to emit light.

[0008] According to the second aspect of the present application, the present application further provides an LED product, comprising the above-mentioned LED lamp, wherein a plurality of LED lamps are arranged at equal intervals.

[0009] The technical solution provided by the embodiments of the present application may include the following beneficial effects: The present application designs an LED lamp and an LED product, including a light-emitting component, an insulating seat, a packaging glue and multiple conductive pins, wherein the light-emitting component has a driving chip and multiple light-emitting chip groups combined together in parallel or series, the driving chip and the light-emitting chip group are arranged on the conductive pins and the conductive pins are electrically connected, the conductive pins are integrated on the insulating seat, and the packaging glue is encapsulated on the outside of the light-emitting component, so that an LED lamp can integrate multiple light-emitting chip groups, and each light-emitting chip group has a blue chip, a green chip and a red core, so that the LED lamp can be used for some high-density and small-pitch LED products, so as to improve the color effect and display effect of the LED product, and make the resolution of the LED product more delicate.

[0010] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] FIG1 is a schematic diagram of the structure of an LED lamp according to an embodiment of the present application;

[0013] FIG2 is a schematic structural diagram of the LED lamp in FIG1 at another angle;

[0014] FIG3 is an exploded schematic diagram of the LED lamp in FIG1 ;

[0015] FIG4 is a partial exploded view of the LED lamp in FIG1 ;

[0016] FIG5 is a schematic structural diagram of the light-emitting chip assembly in FIG1 ;

[0017] FIG6 is a schematic structural diagram of the insulating seat in FIG1 ;

[0018] FIG7 is a schematic structural diagram of the conductive foot in FIG1 ;

[0019] FIG8 is a schematic structural diagram of the conductive foot in FIG1 at another angle;

[0020] FIG9 is a second structural diagram of an LED lamp provided in one embodiment of the present application;

[0021] FIG10 is a schematic structural diagram of the conductive foot in FIG9;

[0022] FIG11 is a third structural diagram of an LED lamp provided in one embodiment of the present application;

[0023] FIG12 is a fourth structural diagram of an LED lamp provided in one embodiment of the present application;

[0024] FIG13 is a fifth structural diagram of an LED lamp provided in one embodiment of the present application;

[0025] FIG14 is a sixth structural diagram of an LED lamp provided in one embodiment of the present application;

[0026] FIG15 is an exploded schematic diagram of the LED lamp in FIG14 ;

[0027] FIG16 is a seventh structural diagram of an LED lamp provided in one embodiment of the present application;

[0028] FIG17 is an exploded schematic diagram of the LED lamp in FIG16 ;

[0029] FIG18 is an eighth structural diagram of an LED lamp provided in one embodiment of the present application;

[0030] FIG19 is an exploded schematic diagram of the LED lamp in FIG18 .

[0031] Description of reference numerals:

[0032] 10. Light-emitting component; 11. Driver chip; 12. Light-emitting chip group; 121. Red chip; 122. Blue chip; 123. Green chip;

[0033] 20. Conductive pin; 20a. Via structure; 20b. Accommodation area; 21. Ground pin; 211. First die-bonding portion; 2111. Second extension portion; 212. First soldering portion; 22. Power pin; 221. Second die-bonding portion; 2211. Third extension portion; 2212. Fourth extension portion; 2213. Fifth extension portion; 222. Second soldering portion; 23. Signal input pin; 231. Third die-bonding portion; 232. Third soldering portion; 24. Signal output pin; 241. Fourth die-bonding portion; 242. Fourth soldering portion; 25. Transition pin; 251. Transition die-bonding portion; 2511. First transition die-bonding portion; 2512. Second transition die-bonding portion; 2513. Third transition die-bonding portion;

[0034] 30. Insulating seat; 31. First end face;

[0035] 40. Packaging glue. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] It should also be understood that the terms used in this specification of the present application are only for the purpose of describing specific realities. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0038] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0039] As shown in Figures 1 to 19, according to the first aspect of the present application, the present application provides an LED lamp, including a light-emitting component 10, an insulating base 30, a packaging glue 40 and a plurality of conductive pins 20, the plurality of conductive pins 20 are arranged on the insulating base 30, the light-emitting component 10 is arranged on the conductive pins 20 and is electrically connected to the conductive pins 20, and the packaging glue 40 is encapsulated on the outside of the light-emitting component 10, which can not only protect the light-emitting component 10, but also improve the light transmittance effect of the light-emitting component 10.

[0040] The light-emitting assembly 10 includes a driver chip 11 and multiple light-emitting chip groups 12 connected in parallel or in series. The multiple light-emitting chip groups 12 are arranged in sequence along the layout direction of the insulating base 30. Each light-emitting chip group 12 includes a blue chip 122, a green chip 123, and a red chip 121. The driver chip 11 is electrically connected to each blue chip 122, each green chip 123, and each red chip 121 to drive each blue chip 122, each green chip 123, and each red chip 121 to emit light. The layout direction can be, but is not limited to, the length and width directions of the insulating base 30.

[0041] For example, if the number of light-emitting chip groups 12 is three, then the number of blue chips 122, green chips 123, and red chips 121 is three each. The three blue chips 122 can be combined in series, or in parallel. Similarly, the three green chips 123 can be combined in series, or in parallel. The three red chips 121 can be combined in series, or in parallel. In addition, the blue chip 122, the green chip 123, and the red chip 121 can be combined in series, or in parallel. The blue chip 122, the green chip 123, and the red chip 121 can be combined in series, or in parallel. The number of driver chips 11 can be one or more, and this application does not limit this.

[0042] After adopting the above technical solution, multiple blue chips 122, multiple green chips 123 and multiple red chips 121 are equidistantly integrated in the LED lamp, which not only enables the multiple blue chips 122, multiple green chips 123 and multiple red chips 121 in an LED lamp to emit corresponding light, thereby generating diverse light colors and simulating a colorful flashing effect; but also the LED lamp can be welded on a wire or a carrier board to form an LED product (such as a light strip or a display screen, etc.). The LED lamp can be connected in series or in parallel according to needs, and different driving voltages can also be set to achieve a high-density and small-pitch design of the LED product, thereby improving the color effect and display effect of the LED product and making the resolution of the LED product more delicate.

[0043] In an alternative embodiment, as shown in Figures 1 to 8 , the insulating base 30 has a first end surface 31, and the conductive foot 20 has a die-bonding portion formed on the first end surface 31 and a soldering portion formed on the other end surface. At least a portion of the soldering portion is formed with a via structure 20a to enhance the product's soldering strength, allowing the via structure 20a to accommodate some solder material. The driver chip 11, blue chip 122, green chip 123, and red chip 121 are disposed on and electrically connected to the die-bonding portion, and encapsulation adhesive 40 is encapsulated on the outside of the die-bonding portion.

[0044] After adopting the above technical solution, since the welding portion is formed on the end surface of the insulating base 30 except the first end surface 31, the heat dissipation effect of the LED lamp can be effectively increased, and the welding area and welding firmness of the welding portion can also be increased.

[0045] Since the structural size of the solid crystal part is determined by the number of multiple light-emitting chip groups 12 and the spacing between the multiple light-emitting chips; therefore, in this application, multiple light-emitting chip groups 12 are integrated on the solid crystal part, which can not only increase the heat dissipation effect of the light-emitting chip, but also ensure the luminous effect of the LED lamp, and can be used in various light-uniform scenes.

[0046] In an optional embodiment, the conductive pin 20 includes a power pin 22 and a ground pin 21, wherein the driver chip 11 is electrically connected to the power pin 22 and the ground pin 21, the blue chip 122, the green chip 123 and the red chip 121 are electrically connected to the power pin 22 and the driver chip 11, and the blue chip 122, the green chip 123 and the red chip 121 are equidistantly spaced on the insulating seat 30 to achieve a high-density and small-pitch design of the LED lamp.

[0047] In an optional embodiment, the driving chip 11 is set on at least one of the power pin 22 and the ground pin 21, the light-emitting chip group 12 can be set on the power pin 22 or the ground pin 21, and the light-emitting chip group 12 can also be set on other conductive pins 20 except the power pin 22 and the ground pin 21.

[0048] In an optional embodiment, the light-emitting chip group 12 is set on at least one of the power pin 22 and the ground pin 21, the driver chip 11 can be set on the power pin 22 or the ground pin 21, and the driver chip 11 can also be set on other conductive pins 20 except the power pin 22 and the ground pin 21.

[0049] In an optional embodiment, the driving chip 11 is disposed on the ground pin 21 , and the light-emitting chip group 12 is disposed on the power pin 22 .

[0050] Among them, the second input end of the driving chip 11 is electrically connected to the ground pin 21, the first input end of the driving chip 11 and the light-emitting chip group 12 is electrically connected to the power pin 22, and the second input end of the light-emitting chip group 12 is connected to the driving chip 11, that is, the light-emitting chips in the light-emitting chip group 12 are combined together in parallel, and the light emission can also be controlled by the driving chip 11.

[0051] Alternatively, the first input end of the driving chip 11 is electrically connected to the power pin 22, the second input end of the driving chip 11 is electrically connected to the ground pin 21, and the first input end and the second input end of the light-emitting chip group 12 are connected to the driving chip 11, that is, the light-emitting chips of the light-emitting chip group 12 are combined together in series and obtain the working voltage through the driving chip 11, and the light emission can also be controlled by the driving chip 11.

[0052] For example, as shown in Figures 4 and 5, the number of driving chips 11 and the number of light-emitting chip groups 12 are both three, that is, the number of blue chips 122, green chips 123 and red chips 121 is three, and the three blue chips 122, three green chips 123 and three red chips 121 are correspondingly connected to the three driving chips 11 to form three light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123, the red chip 121 and the driving chip 11 are combined together in parallel, and the three light-emitting groups are arranged at equal intervals in parallel.

[0053] For example, as shown in Figures 5 and 10, the number of driving chips 11 and the number of light-emitting chip groups 12 are both four, that is, the number of blue chips 122, green chips 123 and red chips 121 is four, and the four blue chips 122, four green chips 123 and four red chips 121 are correspondingly connected to the four driving chips 11 to form four light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123, the red chip 121 and the driving chip 11 are combined together in parallel, and the four light-emitting groups are arranged at equal intervals in parallel.

[0054] For example, as shown in Figure 11, the number of driving chips 11 and the number of light-emitting chip groups 12 are three, that is, the number of blue chips 122, green chips 123 and red chips 121 is three, and the three blue chips 122, three green chips 123 and three red chips 121 are correspondingly connected to the three driving chips 11 to form three light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123 and the red chip 121 are combined in series through the driving chip 11, and the three light-emitting groups are arranged at equal intervals in parallel at the same time.

[0055] For example, as shown in Figures 14 and 19, the number of driving chips 11 is one, and the number of light-emitting chip groups 12 is at least two, that is, the number of blue chips 122, green chips 123 and red chips 121 is at least two, at least two blue chips 122 are combined in series to form a first light-emitting group, at least two red chips 121 are combined in series to form a second light-emitting group, and at least two green chips 123 are combined in series to form a third light-emitting group. The first light-emitting group, the second light-emitting group and the third light-emitting group are combined in parallel and electrically connected to the driving chip 11, so that the driving chip 11 can control the first light-emitting group, the second light-emitting group and the third light-emitting group to emit light.

[0056] For example, as shown in Figure 14, the number of driving chips 11 is one, and the number of light-emitting chip groups 12 is two, that is, the number of blue chips 122, green chips 123 and red chips 121 is two, among which one blue chip 122, one green chip 123 and one red chip 121 are located on one side of the insulating base 30 in the length direction, and the other blue chip 122, one green chip 123 and one red chip 121 are located on the other side of the insulating base 30 in the length direction. The driving chip 11 is arranged on one side of the insulating base 30 in the length direction and is electrically connected to the blue chip 122, the green chip 123 and the red chip 121, and is used to control the two blue chips 122, the two green chips 123 and the two red chips 121 to emit light.

[0057] In an optional embodiment, the LED lamp adopts CHIP type packaging technology, that is, the corresponding circuit is first arranged on the packaging substrate, and then the driver chip 11 and the light-emitting chip group 12 are arranged at equal intervals, and finally electrical connections are made.

[0058] In an optional embodiment, the ground pin 21 includes a first soldering portion 212 and a first die-bonding portion 211, and the power pin 22 includes a second soldering portion 222 and a second die-bonding portion 221, wherein portions of the second soldering portion 222 and the first soldering portion 212 are disposed on opposite sides of the insulating base 30, the driver chip 11 is disposed on the first die-bonding portion 211, and the light-emitting chip group 12 is disposed on the second die-bonding portion 221. In this embodiment, the size of the first die-bonding portion 211 corresponds to the number and density of the first die-bonding portions 211, and the size of the second die-bonding portions 221 corresponds to the number and density of the light-emitting chip group 12, so that heat generated by the driver chip 11 and the light-emitting chip group 12 during operation can be transferred to the first soldering portion 212 and the second soldering portion 222 via the first die-bonding portion 211 and the second die-bonding portion 221, respectively, and then transferred to the connected circuit board or dissipated to the external environment via the first soldering portion 212 and the second soldering portion 222.

[0059] In an optional embodiment, the conductive foot 20 also includes a signal input pin 23 and a signal output pin 24, and the signal input pin 23 and the signal output pin 24 are respectively electrically connected to the signal input end and the signal output end of the driver chip 11, or the signal input end and the signal output end between two adjacent driver chips 11 are electrically connected, and the signal input pin 23 and the signal output pin 24 are electrically connected to the signal input end and the signal output end of the driver chip 11 on both sides of the insulating seat 30, so that the signal input pin 23 and the signal output pin 24 can input or output the control signal of the light-emitting chip group 12 to the driver chip 11.

[0060] In an optional embodiment, the signal input pin 23 and the ground pin 21 are arranged on one side of the insulating base 30, and the signal output pin 24 and the power pin 22 are arranged on the other side of the insulating base 30, that is, the signal input pin 23 and the ground pin 21 are located on the same side of the insulating base 30, and the signal output pin 24 and the power pin 22 are located on the side of the insulating base 30 opposite to the signal input pin 23 and the ground pin 21, thereby improving the heat dissipation effect of the ground pin 21 and the power pin 22 during operation.

[0061] In an optional embodiment, the signal input pin 23 includes a third welding portion 232 and a third solid crystal portion 231, and the signal output pin 24 includes a fourth welding portion 242 and a fourth solid crystal portion 241. Part of the structure of the third welding portion 232 is arranged on the adjacent side of the first welding portion 212 and is located on the opposite side of the second welding portion 222. Part of the structure of the fourth welding portion 242 is arranged on the adjacent side of the second welding portion 222 and is located on the opposite side of the first welding portion 212. The third solid crystal portion 231 is connected to the third welding portion 232 and is located on one side of the first solid crystal portion 211. The fourth solid crystal portion 241 is connected to the fourth welding portion 242 and is located on one side of the second solid crystal portion 221. The signal input end and the signal output end between the driving chip 11 on both sides of the insulating seat 30 are electrically connected to the third solid crystal portion 231 and the fourth solid crystal portion 241 respectively.

[0062] In an optional embodiment, as shown in Figures 1 to 13, the number of driving chips 11 and light-emitting chip groups 12 is at least two, and at least two light-emitting chip groups 12 are correspondingly connected to two driving chips 11 and combined together in parallel, so that each driving chip 11 can control each light-emitting chip group 12 connected thereto to emit light.

[0063] In an optional embodiment, the conductive foot 20 also includes at least one transition pin 25, the transition pin 25 has a transition solid crystal portion 251, and the transition solid crystal portion 251 is arranged between two adjacent driver chips 11, and is used to electrically connect the signal input end of one driver chip 11 with the signal output end of the other driver chip 11, thereby reducing the connection length of the bonding wire on the driver chip 11, reducing the difficulty of packaging the LED lamp, and also making the structure of the LED lamp simpler.

[0064] In an optional embodiment, the second crystal-bonding portion 221 and the fourth crystal-bonding portion 241 are disposed on both sides of the second crystal-bonding portion 221 and the first crystal-bonding portion 211 , and the transition crystal-bonding portion 251 is disposed between the second crystal-bonding portion 221 and the first crystal-bonding portion 211 .

[0065] In an optional embodiment, the first die-bonding portion 211 has a first extension portion and at least one second extension portion 2111 perpendicular to the first extension portion. The first extension portion and the second die-bonding portion 221 extend along the length of the insulating seat 30. The second extension portion 2111 extends toward the second die-bonding portion 221 and forms an accommodating area 20b. The transition die-bonding portion 251 is disposed in the accommodating area 20b, so that the signal input and signal output terminals of two adjacent driver chips 11 can be electrically connected through the transition die-bonding portion 251, thereby reducing the length of the bonding wires and thus preventing the bonding wires from breaking during packaging. In addition, the signal input and signal output terminals between two adjacent driver chips 11 can also be electrically connected directly by bonding wires, which is not limited in this application.

[0066] In an optional embodiment, as shown in Figures 1 to 8, the number of driving chips 11 and light-emitting chip groups 12 is three and they are arranged at equal intervals along the length direction of the insulating base 30. The driving chip 11 is arranged on the second extension portion 2111, and the transition solid crystal portion 251 is arranged between two adjacent second extension portions 2111.

[0067] In an optional embodiment, as shown in Figures 9 and 10, the second solid crystal portion 221 has a third extension portion 2211 extending toward the first extension portion, the third extension portion 2211 is arranged adjacent to the second extension portion 2111, the first input end of the driver chip 11 is connected to the third extension portion 2211 through a bonding wire, and the transition solid crystal portion 251 is arranged in the accommodating area 20b formed between the third extension portion 2211 and the second extension portion 2111.

[0068] In an optional embodiment, the number of driving chips 11 and light-emitting chip groups 12 is four and they are arranged at equal intervals along the length direction of the insulating base 30. The driving chip 11 is arranged on the second extension portion 2111, and the transition solid crystal portion 251 is arranged between the third extension portion 2211 and the second extension portion 2111.

[0069] In an optional embodiment, as shown in Figure 11, the number of driving chips 11 and light-emitting chip groups 12 is at least two, at least two light-emitting chip groups 12 are correspondingly connected to two driving chips 11 and combined together in parallel, and the blue chip 122, green chip 123 and red chip 121 on each light-emitting chip group 12 are connected to the driving chip 11 in series.

[0070] Exemplarily, the number of driving chips 11 and light-emitting chip groups 12 is three, that is, the number of blue chips 122, green chips 123 and red chips 121 is three, and the three blue chips 122, three green chips 123 and three red chips 121 are correspondingly connected to the three driving chips 11 to form three light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123 and the red chip 121 are combined in series through the driving chip 11, that is, both ends of the blue chip 122, the green chip 123 and the red chip 121 are electrically connected to the driving chip 11, and the three light-emitting groups are arranged at equal intervals in parallel.

[0071] In an optional embodiment, as shown in Figures 12 and 13, the number of driver chips 11 and light-emitting chip groups 12 is six, that is, the number of blue chips 122, green chips 123 and red chips 121 is six, and the six blue chips 122, six green chips 123 and six red chips 121 are correspondingly connected to the six driver chips 11 to form six light-emitting groups, that is, each driver chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123 and the red chip 121 are combined together in parallel, and the signal input end and the signal output end between two adjacent driver chips 11 among the six driver chips 11 can also be directly bonded for electrical connection.

[0072] In an optional embodiment, as shown in Figures 14 to 19, the number of driving chips 11 is one, the number of light-emitting chip groups 12 is at least two, and the two light-emitting chip groups 12 are connected to the driving chip 11 in series, so that the driving chip 11 can control the light-emitting chips connected in series to emit light.

[0073] In an optional embodiment, the blue chips 122 on multiple light-emitting chips are combined and connected in series, the green chips 123 on multiple light-emitting chips are combined and connected in series, and the red chips 121 on multiple light-emitting chips are combined and connected in series, and the three colors of light-emitting chips, namely the blue chip 122, the green chip 123 and the red chip 121, are arranged in parallel.

[0074] In an optional embodiment, as shown in Figures 14 and 15, the number of light-emitting chip groups 12 is six, the six blue chips 122 are combined and connected in series, the green chips 123 on the six light-emitting chips are combined and connected in series, the red chips 121 on the six light-emitting chips are combined and connected in series, and the six blue chips 122, the six green chips 123 and the six red chips 121 are arranged in parallel.

[0075] In an optional embodiment, the conductive foot 20 also includes at least one transition pin 25, the transition pin 25 has a transition bonding portion 251, and the transition bonding portion 251 is arranged between at least two adjacent bonding portions of the first bonding portion 211, the second bonding portion 221, the third bonding portion 231 and the fourth bonding portion 241, so that at least one of the first bonding portion 211, the second bonding portion 221, the third bonding portion 231 and the fourth bonding portion 241 can be electrically connected to the driving chip 11 and / or the light-emitting chip group 12 through the transition bonding portion 251.

[0076] In an optional embodiment, a protection device 26 is connected between the transition pin 25 and the power pin 22 to protect the device. The protection device 26 can be a resistor and / or a diode, etc., which can perform voltage division and current limiting to protect the device, including but not limited to the driver chip 11 and the light-emitting chip assembly 12.

[0077] In an optional embodiment, at least a portion of the light-emitting chip group 12 is arranged on the transition carrier and the signal input pin 23, and the remaining portion of the light-emitting chip group 12 is arranged on the power pin 22 and electrically connected to the power pin 22, so that the light-emitting chip group 12 can be arranged at equal intervals on the insulating seat 30.

[0078] In an optional embodiment, the second solid crystal portion 221 extends from the power pin 22 and extends vertically toward one side of the insulating seat 30 to form a fourth extension portion 2212. The fourth extension portion 2212 extends a fifth extension portion 2213 toward the other side of the insulating seat 30. The fifth extension portion 2213 is parallel to the fourth extension portion 2212. The driving chip 11 is arranged at the intersection of the fourth extension portion 2212 and the fifth extension portion 2213, and at least part of the light-emitting chip group 12 is arranged on the fifth extension portion 2213.

[0079] In an optional embodiment, the conductive foot 20 also includes three transition pins 25, each transition pin 25 has a transition solid crystal portion 251, and the three transition solid crystal portions 251 are arranged at intervals on the insulating seat 30. The driving chip 11 is correspondingly connected to the blue chip 122, the green chip 123 and the red chip 121 through the three transition solid crystal portions 251.

[0080] Exemplarily, the transition pin 25 includes a first transition pin 25, a second transition pin 25 and a third transition pin 25, the first transition pin 25 has a first transition solid crystal portion 2511, the second transition pin 25 has a second transition solid crystal portion 2512, and the third transition pin 25 has a third transition solid crystal portion 2513, the first transition solid crystal portion 2511 is arranged between the fifth extension portion 2213 and the fourth extension portion 2212, the second transition solid crystal portion 2512 is arranged between the fifth extension portion 2213 and the third transition solid crystal portion 2513, and the third transition solid crystal portion 2513 is arranged adjacent to the third solid crystal portion 231.

[0081] In an optional embodiment, one of the blue chip 122 and the green chip 123 is arranged on one of the transition solid crystal parts 251, the other of the blue chip 122 and the green chip 123 is arranged on another transition solid crystal part 251, and the red chip 121 is arranged on the fifth extension part 2213 and connected to the driving chip 11 through the last transition solid crystal part 251.

[0082] Exemplarily, the blue chip 122 is disposed on the first transitional die-bonding portion 2511 and electrically connected to the fifth extension portion 2213, the green chip 123 is disposed on the third transitional die-bonding portion 2513 and electrically connected to the fifth extension portion 2213, and the red chip 121 is disposed on the fifth extension portion 2213 and electrically connected to the fifth extension portion 2213. The blue chip 122 is connected to the driver chip 11 via the first transitional die-bonding portion 2511, the green chip 123 is connected to the driver chip 11 via the third transitional die-bonding portion 2513, and the red chip 121 is connected to the driver chip 11 via the second transitional die-bonding portion 2512.

[0083] In an optional embodiment, as shown in Figures 16 and 17, the number of light-emitting chip groups 12 is two, two blue chips 122 are arranged at both ends of one transition solid crystal portion 251, two green chips 123 are arranged on the other transition solid crystal portion 251, and two red chips 121 are arranged at both ends of the fifth extension portion 2213.

[0084] Exemplarily, the blue chip 122 is arranged at both ends of the first transition solid crystal portion 2511 and is electrically connected to the fifth extension portion 2213, the green chip 123 is placed at both ends of the third transition solid crystal portion 2513 and is electrically connected to the fifth extension portion 2213, the red chip 121 is arranged at both ends of the fifth extension portion 2213 and is electrically connected to the fifth extension portion 2213, and the blue chip 122 is connected to the driver chip 11 through the first transition solid crystal portion 2511, the green chip 123 is connected to the driver chip 11 through the third transition solid crystal portion 2513, and the red chip 121 is connected to the driver chip 11 through the second transition solid crystal portion 2512.

[0085] In an optional embodiment, as shown in Figures 18 to 19, the number of light-emitting chip groups 12 is at least three, at least three blue chips 122 are equidistantly arranged along the length direction of one of the transition solid crystal parts 251, at least three green chips 123 are equidistantly arranged along the length direction of another transition solid crystal part 251, and at least three red chips 121 are equidistantly arranged along the length direction of the fourth extension part 2212.

[0086] Exemplarily, the number of light-emitting chip groups 12 is six. Six blue chips 122 are equidistantly arranged along the length of the first transitional die-bonding portion 2511 and electrically connected to the fifth extension portion 2213. Six green chips 123 are equidistantly arranged along the length of the third transitional die-bonding portion 2513 and electrically connected to the fifth extension portion 2213. Six red chips 121 are equidistantly arranged along the length of the fifth extension portion 2213 and electrically connected to the fifth extension portion 2213. Specifically, the blue chips 122 are connected to the driver chip 11 via the first transitional die-bonding portion 2511, the green chips 123 are connected to the driver chip 11 via the third transitional die-bonding portion 2513, and the red chips 121 are connected to the driver chip 11 via the second transitional die-bonding portion 2512.

[0087] As shown in Figures 1 to 19 , according to a second aspect of the present application, the present application further provides an LED product comprising the aforementioned LED lamp, wherein a plurality of LED lamps are arranged at equal intervals to achieve a high-density, fine-pitch design for the LED product, thereby improving the color and display effects of the LED product and making the resolution of the LED product more refined. The LED product includes, but is not limited to, display screens and LED light strips.

[0088] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections. They can refer to mechanical connections or electrical connections. They can refer to direct connections or indirect connections through an intermediary. They can refer to internal communication between two components or interactions between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0089] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0090] The disclosure above provides many different embodiments or examples for realizing the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0091] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. An LED lamp, characterized in that: It comprises a light-emitting component, an insulating seat, a packaging glue and a plurality of conductive pins, wherein the plurality of conductive pins are arranged on the insulating seat, the light-emitting component is arranged on the conductive pins and is electrically connected to the conductive pins, and the packaging glue is packaged outside the light-emitting component; Among them, the light-emitting component includes at least one driving chip and a plurality of light-emitting chip groups combined together in parallel or in series, the plurality of light-emitting chip groups are arranged in sequence along the layout direction of the insulating seat, and each of the light-emitting chip groups includes a blue chip, a green chip and a red chip, at least one driving chip is electrically connected to each of the blue chips, each of the green chips and each of the red chips, and is used to drive each of the blue chips, each of the green chips and each of the red chips to emit light.

2. The LED lamp according to claim 1, characterized in that: The insulating seat has a first end surface, the conductive foot has a solid crystal portion formed on the first end surface and a welding portion formed on the other end surfaces, the driving chip, blue chip, green chip and red chip are arranged on the solid crystal portion and are electrically connected to the solid crystal portion, and at least part of the structure of the welding portion is formed with a via structure.

3. The LED lamp according to claim 1, characterized in that: The conductive pin includes a power pin and a ground pin, the driving chip is electrically connected to the power pin and the ground pin, the blue chip, the green chip and the red chip are electrically connected to the power pin and the driving chip, and the blue chip, the green chip and the red chip are equidistantly spaced on the insulating seat.

4. The LED lamp according to claim 3, characterized in that: The driving chip is arranged on at least one of the ground pin and the power pin, and / or the light emitting chip group is arranged on at least one of the power pin and the ground pin.

5. The LED lamp according to claim 3, characterized in that: The ground pin includes a first welding portion and a first crystal-bonding portion, the power pin includes a second welding portion and a second crystal-bonding portion, partial structures of the second welding portion and the first welding portion are arranged on opposite sides of the insulating seat, the driving chip is arranged on the first crystal-bonding portion, and the light-emitting chip group is arranged on the second crystal-bonding portion.

6. The LED lamp according to claim 3, characterized in that: The conductive pin also includes a signal input pin and a signal output pin, and the signal input pin and the signal output pin are electrically connected to the signal input end and the signal output end of the driving chip respectively; or the signal input end and the signal output end between two adjacent driving chips are electrically connected, and the signal input pin and the signal output pin are electrically connected to the signal input end and the signal output end of the driving chips on both sides of the insulating seat.

7. The LED lamp according to claim 6, characterized in that: The signal input pin and the ground pin are arranged on one side of the insulating seat, and the signal output pin and the power pin are arranged on the other side of the insulating seat.

8. The LED lamp according to claim 6, characterized in that: The number of the driving chips and the light-emitting chip groups is at least two, and at least two light-emitting chip groups are correspondingly connected to two driving chips and combined together in parallel, so that each driving chip can correspondingly control each light-emitting chip group connected thereto to emit light.

9. The LED lamp according to claim 8, characterized in that: The conductive foot further includes at least one transition pin having a transition bonding portion, and the transition bonding portion is disposed between the two driver chips and is used to electrically connect a signal input end of one of the driver chips with a signal output end of the other driver chip.

10. The LED lamp according to claim 9, characterized in that: The signal input pin includes a third bonding portion, the signal output pin includes a fourth bonding portion, the third bonding portion and the fourth bonding portion are arranged on both sides of the second bonding portion and the first bonding portion, and the transition bonding portion is arranged between the third bonding portion and the fourth bonding portion.

11. The LED lamp according to claim 10, characterized in that: The first crystal-bonding portion comprises a first extension portion and at least one second extension portion connected to the first extension portion, the first extension portion and the second crystal-bonding portion extend along the length direction of the insulating seat, the second extension portion extends toward the second crystal-bonding portion and forms an accommodating area with the second crystal-bonding portion, and the transition crystal-bonding portion is arranged in the accommodating area.

12. The LED lamp according to claim 11, characterized in that: The number of the driving chips and the light emitting chip group is three and they are arranged at equal intervals along the length direction of the insulating seat. The driving chip is arranged on the second extension part, and the transitional solid crystal part is arranged between two adjacent second extension parts.

13. The LED lamp according to claim 11, characterized in that: The second die-bonding portion has a third extension portion extending toward the first extension portion, the third extension portion is disposed adjacent to the second extension portion, and the first input terminal of the driving chip is connected to the third extension portion through a bonding wire.

14. The LED lamp according to claim 13, characterized in that: The number of the driving chips and the light-emitting chip group is four and they are arranged equidistantly along the length direction of the insulating seat. The driving chip is arranged on the second extension part, and the transitional solid crystal part is arranged between the third extension part and the second extension part.

15. The LED lamp according to claim 7, characterized in that: The number of the driving chips and the light-emitting chip groups is at least two, at least two of the light-emitting chip groups are correspondingly connected to the two driving chips and combined together in parallel, and the blue chip, green chip and red chip on each of the light-emitting chip groups are connected to the driving chip in series.

16. The LED lamp according to claim 7, characterized in that: The number of the driving chip is one, the number of the light-emitting chip groups is at least two, and the two light-emitting chip groups are connected to the driving chip in series, so that the driving chip can control the light-emitting chips connected in series to emit light.

17. The LED lamp according to claim 16, characterized in that: The blue chips on the multiple light-emitting chips are combined and connected in series, the green chips on the multiple light-emitting chips are combined and connected in series, and the red chips on the multiple light-emitting chips are combined and connected in series, and the blue chips, green chips and red chips are arranged in parallel.

18. The LED lamp according to claim 16, characterized in that: The number of the light-emitting chip groups is six, the six blue chips are combined and connected in series, the six green chips on the light-emitting chips are combined and connected in series, the six red chips on the light-emitting chips are combined and connected in series, and the six blue chips, the six green chips and the six red chips are arranged in parallel.

19. The LED lamp according to claim 1 or 16, characterized in that: The conductive foot further includes at least one transition pin having a transition bonding portion, wherein the transition bonding portion is disposed between at least two adjacent bonding portions of the first bonding portion, the second bonding portion, the third bonding portion, and the fourth bonding portion.

20. The LED lamp according to claim 19, characterized in that A protection device is connected between the transition pin and the power pin.

21. The LED lamp according to claim 20, characterized in that: At least a portion of the light emitting chip group is disposed on the transition solid crystal portion and the signal input pin, and the remaining portion of the light emitting chip group is disposed on the power pin and electrically connected to the power pin.

22. The LED lamp according to claim 16, characterized in that: The second die-bonding portion extends from the power pin and then extends vertically toward one side of the insulating seat to form a fourth extension portion. The fourth extension portion has a fifth extension portion extending toward the other side of the insulating seat. The fifth extension portion is parallel to the fourth extension portion. The driving chip is arranged at the intersection of the fourth extension portion and the fifth extension portion, and at least a portion of the light-emitting chip group is arranged on the fifth extension portion.

23. The LED lamp according to claim 22, characterized in that: The conductive foot also includes three transition pins, each of which has a transition solid crystal portion, and the three transition solid crystal portions are arranged at intervals on the insulating seat. The driving chip is correspondingly connected to the blue chip, the green chip and the red chip through the three transition solid crystal portions.

24. The LED lamp according to claim 23, characterized in that: One of the blue chip and the green chip is arranged on one of the transition solid crystal parts, the other of the blue chip and the green chip is arranged on another transition solid crystal part, and the red chip is arranged on the fifth extension part and connected to the driving chip through the last transition solid crystal part.

25. The LED lamp according to claim 24, characterized in that: The number of the light-emitting chip groups is two, the two blue chips are arranged at the two ends of one of the transition solid crystal parts, the two green chips are arranged on the other transition solid crystal part, and the two red chips are arranged at the two ends of the fifth extension part.

26. The LED lamp according to claim 24, characterized in that The number of the light-emitting chip groups is at least three, at least three blue chips are equidistantly arranged along the length direction of one of the transition solid crystal parts, at least three green chips are equidistantly arranged along the length direction of another transition solid crystal part, and at least three red chips are equidistantly arranged along the length direction of the fifth extension part.

27. An LED product, characterized in that: It comprises a plurality of LED lamps as claimed in any one of claims 1 to 26, wherein the plurality of LED lamps are arranged at equal intervals.

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