Light-emitting substrate and display apparatus

Abstract

A light-emitting substrate (100) comprises a display region (AA) and a peripheral region (SA) located on at least one side of the display region (AA). The light-emitting substrate (100) further comprises a substrate (01), and a plurality of connection leads (L1) and auxiliary connection parts (F1) located on the substrate (01). The substrate (01) comprises a first main surface (S1) and a second main surface (S2) opposite to each other in the thickness direction of the substrate (01), and a side surface (S3) located between the first main surface (S1) and the second main surface (S2), the side surface (S3) comprising a set side surface (S31) corresponding to the peripheral region (SA). The plurality of connection leads (L1) are located on the substrate (01), and the plurality of connection leads (L1) extend from the first main surface (S1) via the set side surface (S31) to the second main surface (S2). The plurality of connection leads (L1) are located in the peripheral region (SA). At least one connection lead (L1) among the plurality of connection leads (L1) comprises at least one opening (C). At least part of the auxiliary connection part (F1) is located in the opening (C), and the auxiliary connection part (F1) is connected to the connection lead (L1) where the opening (C) is located.

Description

Light-emitting substrate and display device

[0001] This application claims priority to Chinese patent application No. 202311024311.7 filed on August 14, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate and a display device. Background Art

[0003] Light-emitting diode (LED) chips, including micro organic light-emitting diodes (Micro LEDs) and mini organic light-emitting diodes (Mini LEDs), can be used to achieve seamless display devices. Mini / Micro LED displays offer high contrast, long life, and low power consumption.

[0004] At present, Mini / Micro LED display devices, from small-size products with high precision to high-end large-screen products, have strong commercial demand and a wide range of application scenarios.

[0005] Summary of the Invention

[0006] On the one hand, a light-emitting substrate is provided. The light-emitting substrate includes a display area and a peripheral area located on at least one side of the display area; the light-emitting substrate also includes a substrate, and a plurality of connecting leads and auxiliary connecting parts located on the substrate. The substrate includes a first main surface and a second main surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, and the side surface includes a set side surface corresponding to the peripheral area. A plurality of connecting leads are located on the substrate, and a plurality of connecting leads extend from the first main surface to the second main surface through the set side surface. The plurality of connecting leads are located in the peripheral area. At least one connecting lead among the plurality of connecting leads includes at least one opening. At least part of the auxiliary connecting part is located in the opening, and the auxiliary connecting part is connected to the connecting lead where the opening is located.

[0007] In some embodiments, the auxiliary connection portion is located in the opening, and the auxiliary connection portion abuts against an edge of the connection lead forming the opening.

[0008] In some embodiments, the auxiliary connection portion includes a main portion and at least one overlapping portion connected to the main portion, wherein the main portion is located within the opening, the overlapping portion is located on a side of the connection lead away from the substrate, and the overlapping portion contacts the side of the connection lead away from the substrate.

[0009] In some embodiments, along a direction from the main portion to the overlapping portion, a width of the overlapping portion is greater than or equal to 10 μm.

[0010] In some embodiments, the connecting lead includes three sequentially connected line segments, and at least one of the three line segments in the connecting lead includes the at least one opening. The three line segments are a first line segment located on the first main surface, a third line segment located on the designated side surface, and a second line segment located on the second main surface. The auxiliary connecting portion is located on the line segment having the opening, and along the extension direction of the line segment having the opening, the length of the auxiliary connecting portion is less than or equal to the length of the line segment having the opening.

[0011] In some embodiments, along an extension direction of the connecting lead having the opening, a length of the auxiliary connecting portion is less than or equal to a length of the connecting lead having the opening.

[0012] In some embodiments, along the width direction of the connecting lead, a ratio of the width of the auxiliary connecting portion located in the opening to the width of the opening is greater than or equal to 50%.

[0013] In some embodiments, the width of the auxiliary connection portion ranges from 50 μm to 100 μm.

[0014] In some embodiments, an orthographic projection of the auxiliary connecting portion on the substrate covers an orthographic projection of the opening on the substrate.

[0015] In some embodiments, an orthographic projection of the auxiliary connecting portion on the substrate covers an orthographic projection of the connecting lead having the opening on the substrate.

[0016] In some embodiments, a plurality of the auxiliary connection portions are located in the same opening.

[0017] In some embodiments, the light-emitting substrate further comprises a first electrode. The first electrode is located on a side of the first main surface away from the second main surface, the first end of the connecting lead is electrically connected to the first electrode, the first end includes the opening, and the orthographic projection of the auxiliary connecting portion on the substrate covers the orthographic projection of the first electrode on the substrate.

[0018] In some embodiments, a first distance between a boundary of an orthographic projection of the auxiliary connection portion on the substrate and a boundary of an orthographic projection of the first electrode on the substrate is less than or equal to 5 μm.

[0019] In some embodiments, the square resistance of the auxiliary connection portion is less than or equal to the square resistance of the connection lead.

[0020] In some embodiments, the thickness of the auxiliary connection portion ranges from 5 μm to 20 μm.

[0021] In some embodiments, the auxiliary connection portion is made of a conductive adhesive.

[0022] In some embodiments, the connecting leads are metal traces.

[0023] On the other hand, a method for manufacturing a light-emitting substrate is provided. The light-emitting substrate includes a display area and a peripheral area located on at least one side of the display area. The manufacturing method includes: providing a substrate, the substrate including a first main surface and a second main surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, the side surface including a set side surface corresponding to the peripheral area. A plurality of connecting leads are formed in the peripheral area of ​​the substrate, and the plurality of connecting leads extend from the first main surface to the second main surface through the set side surface. At least one connecting lead among the plurality of connecting leads includes at least one opening. An auxiliary connecting portion is formed on a side of the connecting lead away from the substrate, at least a portion of the auxiliary connecting portion is located in the opening, and the auxiliary connecting portion connects the connecting lead where the opening is located.

[0024] In some embodiments, forming a plurality of connecting leads in the peripheral region of the substrate includes forming the plurality of connecting leads on the substrate using a sputtering process. Forming an auxiliary connecting portion on a side of the connecting lead away from the substrate includes forming the auxiliary connecting portion on a side of the connecting lead away from the substrate using a three-dimensional printing process, such that at least a portion of the auxiliary connecting portion is located within the opening and the auxiliary connecting portion is connected to the connecting lead in the opening.

[0025] In another aspect, a display device is provided, comprising: a light-emitting substrate as described in any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0027] FIG1 is a structural diagram of a display device according to some embodiments;

[0028] FIG2 is a structural diagram of a display device according to some other embodiments;

[0029] FIG3 is a structural diagram of a light emitting surface of a light emitting substrate according to some embodiments;

[0030] FIG4 is a structural diagram of a backlight surface of a light-emitting substrate according to some embodiments;

[0031] FIG5 is a cross-sectional view of a light emitting substrate according to some embodiments;

[0032] FIG6 is a structural diagram of a light-emitting substrate according to some embodiments;

[0033] FIG7 is a cross-sectional view taken along the line BB' in FIG6;

[0034] FIG8 is a structural diagram of a first main surface of a light emitting substrate according to some embodiments;

[0035] FIG9 is a cross-sectional view taken along the line Q-Q' in FIG8;

[0036] FIG10 is a structural diagram of a set side surface in a light emitting substrate according to some embodiments;

[0037] FIG11 is a cross-sectional view of a light emitting substrate according to some embodiments;

[0038] FIG12 is a structural diagram of a second main surface of a light emitting substrate according to some embodiments;

[0039] FIG13 is a cross-sectional view taken along the line FF' in FIG12;

[0040] FIG14 is a structural diagram of a light-emitting substrate according to some other embodiments;

[0041] FIG15 is a structural diagram of a light-emitting substrate according to yet other embodiments;

[0042] FIG16 is a cross-sectional view taken along the line T-T' in FIG15;

[0043] FIG17 is a structural diagram of a light-emitting substrate according to yet other embodiments;

[0044] FIG18 is a structural diagram of a light-emitting substrate according to yet other embodiments;

[0045] FIG19 is a structural diagram of a light-emitting substrate according to yet other embodiments;

[0046] FIG20 is a cross-sectional view of a light-emitting substrate according to some other embodiments;

[0047] FIG21 is a cross-sectional view of a light-emitting substrate according to yet other embodiments;

[0048] FIG22 is a structural diagram of a light-emitting substrate according to yet other embodiments;

[0049] FIG23 is a structural diagram of a light-emitting substrate according to yet other embodiments;

[0050] FIG24 is a structural diagram of a light-emitting substrate according to some embodiments;

[0051] FIG25 is a cross-sectional view taken along the line G-G' in FIG24;

[0052] FIG26 is another cross-sectional view taken along line G-G' in FIG24;

[0053] FIG. 27 is a flow chart of a method for manufacturing a light-emitting substrate according to some embodiments. DETAILED DESCRIPTION

[0054] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0055] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0056] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0057] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0058] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0059] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0060] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0061] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0062] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0063] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0064] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0065] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0066] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0067] FIG1 is a structural diagram of a display device according to some embodiments, and FIG2 is a structural diagram of a display device according to other embodiments.

[0068] 1 and 2 , some embodiments of the present disclosure provide a display device 200 , which includes a light-emitting substrate 100 .

[0069] Exemplarily, the display device 200 may be a liquid crystal display device (LCD), a Mini LED (Mini Light-Emitting Diode, Mini LED) display device, or a Micro LED (Micro Light-Emitting Diode, Micro LED) display device.

[0070] As shown in Figure 1, when the display device 200 is a liquid crystal display device, in some embodiments, the display device 200 includes a cover glass, a liquid crystal display panel, and a backlight assembly. The backlight assembly is used to provide a light source for the liquid crystal display panel. Among them, the backlight assembly includes a light-emitting substrate 100, and the light-emitting substrate 100 provides light to the liquid crystal display panel so that the liquid crystal display panel can display a picture. In some examples, the backlight module in the display device 200 may also include an optical film, which is located on the side of the light-emitting substrate 100 close to the liquid crystal display panel. The optical film may include a reflective sheet, a diffuser, a brightness enhancement film (prism sheet), a diffuser, etc., which can be used to improve the brightness and uniformity of light.

[0071] As shown in FIG2 , when the display device 200 is a Mini LED display device and a Micro LED display device, in some embodiments, the display device 200 includes at least one light-emitting substrate 100 , and the light-emitting substrate 100 can realize picture display.

[0072] In some examples, the display device 200 may include a plurality of light-emitting substrates 100 , which are spliced ​​together to form the display device 200 . Alternatively, the display device 200 may also include a single light-emitting substrate 100 .

[0073] In some examples, the display device 200 may further include an anti-reflection film layer and a protective cover plate. The anti-reflection film layer is located between the light-emitting substrate 100 and the protective cover plate. The anti-reflection film layer includes a polarizer, which may be a circular polarizer. The polarizer can reduce external light emission and prevent the light-emitting substrate 100 from reflecting ambient light, thereby causing glare.

[0074] Exemplarily, the display device 200 can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the display device of the embodiments described can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0075] In some embodiments, the display device 200 also includes a driving circuit board, which is configured as a driving integrated circuit (IC) that drives the light-emitting substrate 100 to display light. The driving circuit board includes, for example, a gate driving circuit, a source driving circuit, a timing controller, and a power supply circuit. The driving circuit board is electrically connected to the light-emitting substrate 100 and is configured to output corresponding signals to control the light-emitting substrate 100 to display light.

[0076] FIG3 is a structural diagram of a light emitting surface of a light emitting substrate according to some embodiments, and FIG4 is a structural diagram of a backlight surface of a light emitting substrate according to some embodiments.

[0077] Referring to Figures 3 and 4 , some embodiments of the present disclosure provide a light-emitting substrate 100 comprising a display area (active area, AA for short; also referred to as the effective display area) AA and a peripheral area SA. The peripheral area SA is located on at least one side (e.g., one side; or, for example, all four sides, i.e., including the upper and lower sides and the left and right sides) of the display area AA. The light-emitting substrate 100 also includes a substrate 01 and a plurality of connecting leads L1 located on the substrate 01.

[0078] In some examples, substrate 01 may be a flexible substrate. Exemplarily, the material of substrate 01 may be an organic material. For example, the material of substrate 01 may be any one of polyimide (PI), polycarbonate (PC), or polyvinyl chloride (PVC).

[0079] In other examples, the substrate 01 may be a rigid substrate, for example, a glass substrate or a PMMA (Polymethyl methacrylate) substrate.

[0080] In some examples, the display area AA includes a plurality of light-emitting chips 10 , and the plurality of light-emitting chips 10 are located on the light-emitting surface of the light-emitting substrate 100 .

[0081] For example, the light-emitting chip 10 may be a micro light-emitting diode (Micro LED) or a mini light-emitting diode (Mini LED). In this embodiment, the light-emitting chip 10 can emit light and can be applied to devices such as display devices and lighting devices.

[0082] In the case where the display device 200 is a liquid crystal display device, in some examples, the light-emitting substrate 100 is the backlight source of the display device 200, used to provide light for the liquid crystal display device. Each light-emitting chip 10 can be independently controlled; in this way, the display device can implement local dimming (Local Dimming), achieve a high dynamic range (HDR) image effect, and improve the display quality of the display device 200.

[0083] In the case where the display device 200 is a Mini LED display device or a Micro LED display device, in some examples, the light-emitting chip 10 (eg, Micro LED, Mini LED, etc.) can emit light to directly display a pattern.

[0084] For example, the light emitting chips 10 can be light emitting elements that can emit light of the same color, such as blue LEDs, red LEDs, green LEDs, or yellow LEDs. In this way, the display device 200 can be a monochrome display device, such as an instrument dial, a signal indicator screen, or the like.

[0085] For example, the light-emitting chip 10 may include light-emitting elements of multiple colors, such as at least two of a red LED, a green LED, a blue LED, or a yellow LED, and the light-emitting elements E of different colors may be independently controlled. Thus, the display device 200 may perform color display by mixing light.

[0086] In some examples, the plurality of light emitting chips 10 on the light emitting substrate 100 are arranged in multiple rows and columns. For the convenience of description, the present disclosure uses the plurality of light emitting chips 10 arranged in a matrix as an example for description.

[0087] For example, the plurality of light emitting chips 10 on the light emitting substrate 100 are arranged in an array with equal spacing along the first direction (row direction) X and the second direction (column direction) Y. This arrangement can improve the uniformity of the distribution of the light emitting chips 10 on the light emitting substrate 100.

[0088] In some examples, the first direction X and the second direction Y may be approximately perpendicular, and in this case, the angle between the first direction X and the second direction Y is approximately 90°. For example, the angle between the first direction X and the second direction Y may be 85°, 90°, or 95°.

[0089] Multiple connecting leads L1 on the light-emitting substrate 100 are located within the peripheral area SA. The light-emitting chip 10 located on the display surface of the light-emitting substrate 100 can be electrically connected to the driver circuit board 210 via the connecting leads L1. Specifically, the light-emitting substrate 100 can use the connecting leads L1 to transmit drive signals provided by the driver circuit board 210 to the light-emitting chip 10 of the light-emitting substrate 100, thereby driving the light-emitting chip 10 to emit light and realize image display on the light-emitting substrate 100.

[0090] Exemplarily, the driving circuit board 210 may be electrically connected to the connection lead L1 via a flexible printed circuit (FPC) 220 .

[0091] FIG5 is a cross-sectional view of a light emitting substrate according to some embodiments.

[0092] In some embodiments, referring to Figures 3 to 5 , the substrate 01 in the light-emitting substrate 100 includes a first main surface S1 and a second main surface S2 that are opposite to each other in the thickness direction Z of the substrate 01, and a side surface S3 located between the first main surface S1 and the second main surface S2. The side surface S3 is used to connect the first main surface S1 and the second main surface S2.

[0093] Exemplarily, substrate 01 includes multiple side surfaces S3, which are used to connect first main surface S1 and second main surface S2. For example, substrate 01 is in the shape of a cuboid, and the shapes of first main surface S1 and second main surface S2 of substrate 01 are, for example, rectangular. In this case, substrate 01 includes four side surfaces S3.

[0094] The plurality of side surfaces S3 include a set side surface S31 corresponding to the peripheral area SA. It should be noted that the “set side surface S31” refers to the side surface corresponding to the peripheral area SA among the plurality of side surfaces S3 of the substrate 01 .

[0095] In some examples, the driver circuit board 210 may be located on a side of the second main surface S2 away from the first main surface S1, that is, the driver circuit board 210 is located on the backlight side of the light-emitting substrate 100. Based on this, a plurality of connecting leads L1 may be provided extending from the first main surface S1 through the designated side surface S31 to the second main surface S2.

[0096] As shown in the above structure, the connecting lead L1 is equivalent to including three line segments located on the first main surface S1, the second main surface S2, and the set side surface S31. The three line segments are a first line segment L11 located on the first main surface S1, a second line segment L12 located on the second main surface S2, and a third line segment L13 located on the set side surface S31. The third line segment L13 is connected to the first line segment L11 and the second line segment L12, respectively, to form the connecting lead L1.

[0097] With this arrangement, the driver circuit board can be disposed on the second main surface S2 of the substrate 01. In other words, the bonding area of ​​the light-emitting substrate 100 can be disposed on the second main surface S2 of the substrate 01. The first segment L11 of the connecting lead L1 is electrically connected to the light-emitting chip 10, and the second segment L12 is electrically connected to the driver circuit board, thereby achieving an electrical connection between the light-emitting chip 10 and the driver circuit board. Based on this, the connecting lead L1 can be used to transmit the driving signal provided by the driver circuit board to the light-emitting chip 10 of the light-emitting substrate 100, thereby controlling the light-emitting substrate 100 to perform a display.

[0098] Furthermore, since the driving circuit board is arranged on the second main surface S2 of the substrate 01, when the light-emitting substrate 100 is subjected to the binding process, there is no need to perform a bending binding process at the edge of the light-emitting substrate 100, which is conducive to achieving a narrow frame of the light-emitting substrate 100 and can be widely used in splicing application products.

[0099] In some examples, the thickness direction Z of the substrate 01 is approximately perpendicular to the first direction X. In this case, the angle between the thickness direction Z of the substrate 01 and the first direction X is approximately 90°. For example, the angle between the thickness direction Z of the substrate 01 and the first direction X can be 85°, 90°, or 95°.

[0100] Furthermore, the thickness direction Z of the substrate 01 is approximately perpendicular to the second direction Y. In this case, the angle between the thickness direction Z of the substrate 01 and the second direction Y is approximately 90°. For example, the angle between the thickness direction Z of the substrate 01 and the second direction Y can be 85°, 90°, or 95°.

[0101] In some examples, the connection lead L1 is a metal trace, and thus the metal trace can be used to transmit the driving signal provided by the driving circuit board to the light-emitting substrate 100 to control the light-emitting substrate 100 to perform display.

[0102] In some examples, the connecting lead L1 may be a laminated metal trace, which can provide the connecting lead with better electrical conductivity and extend its service life.

[0103] The stacked metal routing includes a base layer, a functional layer and a protective layer, and the functional layer is located between the protective layer and the base layer.

[0104] The functional layer in the stacked metal traces can be made of copper, aluminum, molybdenum, etc. Considering that copper has lower resistance in practical applications, the functional layer can be made of copper.

[0105] The base layer and protection layer in the stacked metal trace can be made of inert metal or other alloy materials, such as titanium, nickel-chromium alloy, etc.

[0106] For example, the stacked metal traces may be Ti / Al / Ti stacked metal traces, but the embodiments of the present disclosure are not limited thereto.

[0107] In some examples, the thickness of the connecting lead L1 ranges from 0.5 μm to 4 μm.

[0108] When the thickness of the connecting lead L1 is equal to or close to 0.5 μm, the thinner the thickness of the connecting lead L1, the better contact it makes with the substrate 01, reducing the risk of the connecting lead L1 detaching from the substrate 01. Furthermore, when the thickness of the connecting lead L1 is equal to or close to 0.5 μm, the problem of high resistance in the connecting lead L1 due to its thin thickness can be avoided. Furthermore, this can help reduce the attenuation of the signal transmitted by the connecting lead L1 due to its resistance, thereby improving the display quality of the light-emitting substrate 100.

[0109] When the thickness of the connecting lead L1 is equal to or close to 4 μm, the thicker the thickness of the connecting lead L1, the lower the resistance of the connecting lead L1. This can help reduce the attenuation of the signal transmitted by the connecting lead L1 due to the resistance of the connecting lead L1, thereby improving the display quality of the light-emitting substrate 100. Furthermore, when the thickness of the connecting lead L1 is equal to or close to 4 μm, it can also prevent the risk of the connecting lead L1 being too thick and thus increasing the risk of the connecting lead L1 detaching from the substrate 01.

[0110] In some examples, the thickness of the connecting lead L1 ranges from 1 μm to 2 μm.

[0111] When the thickness of the connecting lead L1 is equal to or close to 1 μm, it can not only make the connecting lead L1 fit more closely on the substrate 01 and reduce the risk of the connecting lead L1 detaching from the substrate 01; it can also prevent the resistance of the connecting lead L1 from being large, thereby reducing the attenuation of the signal transmitted by the resistance of the connecting lead L1.

[0112] When the thickness of the connecting lead L1 is equal to or close to 2μm, the resistance of the connecting lead L1 can be smaller, which can reduce the attenuation of the signal transmitted by the resistance of the connecting lead L1; it can also prevent the thickness of the connecting lead L1 from being too thick, thereby increasing the risk of the connecting lead L1 detaching from the substrate 01.

[0113] For example, the thickness of the connecting lead L1 is approximately any one of 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, or 4 μm. However, this is not limited in the embodiments of the present disclosure.

[0114] Taking the thickness of the connecting lead L1 as about 1 μm as an example, it can not only improve the problem of the connecting lead L1 being separated from the substrate 01, but also improve the attenuation of the signal transmitted by the connecting lead L1 caused by the resistance of the connecting lead L1.

[0115] It should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the thickness error of the connecting lead L1 fluctuates within the range of 10%×1μm, the thickness of the connecting lead L1 can also be considered to be equal to 1μm.

[0116] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error in the thickness of the connecting lead L1 fluctuates within the range of 5%×1μm, it can also be considered that the thickness of the connecting lead L1 satisfies the requirement of being equal to 1μm.

[0117] In some examples, the plurality of connecting leads L1 may be coupled to the plurality of light emitting chips 10 in a one-to-one correspondence. In other examples, one connecting lead L1 may be coupled to multiple light emitting chips 10 , or multiple connecting leads L1 may be coupled to one light emitting chip 10 .

[0118] Hereinafter, the present disclosure takes the coupling of one connecting lead L1 to a plurality of light-emitting chips 10 as an example to schematically illustrate the structure of the display device 200 .

[0119] Figure 6 is a structural diagram of a light-emitting substrate according to some embodiments, and Figure 7 is a cross-sectional view taken along the line B-B' in Figure 6 . Figure 6 illustrates the structure of the first segment of the connecting lead. The structures of the other segments of the connecting lead are similar to those of the first segment and can be discussed in conjunction with the description of the first segment. The structures of the other segments of the connecting lead will also be described in detail below. Furthermore, to illustrate the structure of the connecting lead, Figure 6 also illustrates the underlying substrate.

[0120] The inventors have discovered, as shown in Figures 6 and 7 , that after forming the connecting leads L1 on the light-emitting substrate 100, the connecting leads L1 have a high breakage rate, resulting in a low yield rate for the connecting leads L1. The primary reason for this low yield rate is that the existing manufacturing process fails to meet the environmental cleanliness requirements for the connecting leads L1, causing some of the connecting leads L1 to break off, forming openings C. The presence of openings C affects the yield rate of the connecting leads L1.

[0121] For example, the connecting lead L1 may experience spot-like, edge-like, or large-area detachment, all of which may result in openings C of varying shapes and sizes on the connecting lead L1. Regardless of the type of opening C, the quality of the connecting lead L1 is reduced, thereby reducing the yield rate of the connecting lead L1.

[0122] It should be noted that the opening C on the connecting lead L1 is formed by a portion of the connecting lead L1 naturally falling off from the substrate 01, and is not a gap formed by human manipulation. Therefore, the shape of the opening C cannot be guaranteed. The opening C can be a regular shape, such as a circle, square, polygon, etc. Alternatively, the opening C can be an irregular shape.

[0123] Figure 8 is a structural diagram of the first major surface of a light-emitting substrate according to some embodiments, and Figure 9 is a cross-sectional view taken along the line Q-Q' in Figure 8 . Figure 8 illustrates the structure of a first segment of a connecting lead. The structures of other segments of the connecting lead are similar to those of the first segment and can be discussed in conjunction with the description of the first segment. The structures of other segments of the connecting lead will also be described in detail below. Furthermore, to illustrate the structure of the connecting lead, Figure 8 also illustrates the underlying substrate.

[0124] In view of the above issues, as shown in conjunction with Figures 8 and 9 , at least one of the multiple connecting leads L1 of the light-emitting substrate 100 provided in the present embodiment includes an opening. The light-emitting substrate 100 also includes an auxiliary connecting portion F1. At least a portion of the auxiliary connecting portion F1 is disposed within the opening C, and the auxiliary connecting portion F1 is provided to connect to the connecting lead L1 where the opening C is located.

[0125] Based on this, if a connecting lead L1 with at least one opening C is found among the multiple connecting leads L1 on the light-emitting substrate 100, the auxiliary connecting portion F1 can be used to repair the opening C formed by the connecting lead L1 being detached. In other words, the auxiliary connecting portion F1 can replace the detached portion of the connecting lead L1, allowing the connecting lead L1 to maintain normal circuit continuity. This can help improve the yield rate of the connecting lead L1.

[0126] The above “arranging at least part of the auxiliary connection portion F1 in the opening C” may include the following situations:

[0127] The first method is to place all auxiliary connection parts F1 in the opening C. In this case, the auxiliary connection parts F1 can be placed in the opening C and fit the connection lead L1 with the opening C, so that the auxiliary connection parts F1 are electrically connected to the connection lead L1.

[0128] The second method is to place part of the auxiliary connection portion F1 in the opening C. In this case, the auxiliary connection portion F1 is placed on a portion of the connection lead L1 having the opening C, so that the auxiliary connection portion F1 is electrically connected to the connection lead L1.

[0129] Regardless of which of the above-mentioned configurations of the auxiliary connection portion F1 is used, the auxiliary connection portion F1 can replace the detached portion of the connection lead L1 so that the connection lead L1 can maintain normal circuit continuity, thereby improving the yield rate of the connection lead L1.

[0130] In summary, the embodiments of the present disclosure provide a light-emitting substrate 100 that can utilize the auxiliary connection portion F1, at least partially disposed within the opening C, to replace a detached portion of the connecting lead L1 with the auxiliary connection portion F1, thereby maintaining normal connection of the connecting lead L1. This can help improve the yield rate of the connecting lead L1.

[0131] In some embodiments, as shown in conjunction with Figures 8 and 9 , multiple connecting leads L1 are provided extending from the first main surface S1 through the designated side surface S31 to the second main surface S2. Specifically, the connecting leads L1 include a first line segment L11 located on the first main surface S1, a third line segment L13 located on the designated side surface S31, and a second line segment L12 located on the second main surface S2, which are sequentially connected. The third line segment L13 is connected to the first line segment L11 and the second line segment L12, respectively, to form the connecting leads L1.

[0132] After the connecting lead L1 is formed on the substrate 01, an opening C may appear in the connecting lead L1 on any surface of the substrate 01 (the first main surface S1, the designated side surface S31, and the second main surface S2). In other words, the first segment L11, the second segment L12, and the third segment L13 of the connecting lead L1 may partially fall off, forming at least one opening C.

[0133] That is, the opening C may be located on at least one of the first line segment L11, the second line segment L12, and the third line segment L13. However, the presence of the opening C in any line segment of the connecting lead L1 will affect the yield of the connecting lead L1.

[0134] To address the above issues, auxiliary connecting portions F1 can be positioned on line segments with openings C. This can be used to repair these line segments, thereby ensuring that the connecting lead L1 including these line segments maintains normal continuity and improving the yield rate of the connecting lead L1. The following describes, with reference to the accompanying figures, the situation in which openings C are formed in various line segments of the connecting lead L1.

[0135] In some examples, as shown in Figures 8 and 9 , the extension direction of the first line segment L11 of the connecting lead L1 located on the first main surface S1 of the substrate 01 can be parallel to the first direction X. One end of the first line segment L11 is electrically connected to the light-emitting chip 10, and the other end of the first line segment L11 is electrically connected to the third line segment L13 provided on the predetermined side surface S31. The first line segment L11 of at least one connecting lead L1 can include at least one opening C. "Parallel" includes both absolute parallelism and approximately parallelism, and the acceptable deviation range for approximately parallelism can be, for example, within 5°.

[0136] Based on this, the auxiliary connection portion F1 can be formed on the first main surface S1, such that the auxiliary connection portion F1 is disposed on the first line segment L11, and at least a portion of the auxiliary connection portion F1 is located within the opening C of the first line segment L11, thereby electrically connecting the auxiliary connection portion F1 to the first line segment L11 having the opening C. Furthermore, the auxiliary connection portion F1 can be used to repair the opening C formed in the first line segment L11, replacing a detached portion of the connecting lead L1 with the auxiliary connection portion F1. This allows the connecting lead L1 to maintain normal circuit continuity, thereby improving the yield rate of the connecting lead L1.

[0137] It should be noted that the placement of the auxiliary connection portion F1 on the first line segment L11 can be understood as placing the auxiliary connection portion F1 at the location of the opening C in the first line segment L11. For example, the auxiliary connection portion F1 is formed at the location of the opening C after the connection lead L1 is formed. In other words, at least a portion of the auxiliary connection portion F1 is equivalent to being within the opening C, i.e., this portion of the auxiliary connection portion F1 is not formed on the first line segment L11, but rather is formed on the substrate O1 exposed by the opening C.

[0138] Figure 10 is a structural diagram of a set side surface of a light-emitting substrate according to some embodiments, and Figure 11 is a cross-sectional view of a light-emitting substrate according to some embodiments. Figure 10 illustrates the structure of multiple second line segments in a connecting lead, and Figure 11 is a cross-sectional view of the light-emitting substrate 100 shown in Figure 10 , using the first connecting lead L1 (third line segment L13) on the left side of Figure 10 as an example.

[0139] In some examples, as shown in conjunction with Figures 10 and 11 , the extension direction of the third line segment L13 of the connecting lead L1 located on the designated side surface S31 of the substrate 01 can be parallel to the thickness direction Z of the substrate 01. The ends of the third line segment L13 can be electrically connected to the first line segment L11 and the second line segment L12, respectively. The third line segment L13 of at least one connecting lead L1 can include at least one opening C. "Parallel" includes both absolute parallelism and approximately parallelism, with an acceptable deviation range for approximately parallelism being, for example, within 5°.

[0140] Based on this, the auxiliary connection portion F1 can be formed on a designated side surface S, such that the auxiliary connection portion F1 is disposed on the third line segment L13, with at least a portion of the auxiliary connection portion F1 located within the opening C of the third line segment L13, thereby electrically connecting the auxiliary connection portion F1 to the third line segment L13 having the opening C. Furthermore, the auxiliary connection portion F1 can be used to repair the opening C formed in the third line segment L13, replacing a detached portion of the connecting lead L1 with the auxiliary connection portion F1. This allows the connecting lead L1 to maintain normal circuit continuity, thereby improving the yield rate of the connecting lead L1.

[0141] It should be noted that disposing the auxiliary connection portion F1 on the third line segment L13 can be understood as forming the auxiliary connection portion F1 at the location of the opening C after the connection lead L1 is formed. In other words, at least a portion of the auxiliary connection portion F1 is equivalent to being within the opening C, that is, this portion of the auxiliary connection portion F1 is not formed on the third line segment L13, but is formed on the substrate O1 exposed by the opening C.

[0142] FIG12 is a structural diagram of the second main surface of the light emitting substrate according to some embodiments, and FIG13 is a cross-sectional diagram taken along line FF′ in FIG12 .

[0143] In some examples, referring to FIG. 12 and FIG. 13 , the second line segment L12 in the connecting lead L1 has at least one opening C.

[0144] Based on this, the auxiliary connection portion F1 can be formed on the second main surface S2, such that the auxiliary connection portion F1 is disposed on the second line segment L12, and at least a portion of the auxiliary connection portion F1 is located within the opening C of the second line segment L12, thereby electrically connecting the auxiliary connection portion F1 to the second line segment L12 having the opening C. Furthermore, the auxiliary connection portion F1 can be used to repair the opening C formed in the second line segment L12, replacing the detached portion of the connecting lead L1 with the auxiliary connection portion F1. This allows the connecting lead L1 to maintain normal circuit continuity. This can help improve the yield rate of the connecting lead L1.

[0145] It should be noted that providing the auxiliary connection portion F1 on the second line segment L12 can be understood as forming the auxiliary connection portion F1 at the location of the opening C after the connection lead L1 is formed. In other words, at least a portion of the auxiliary connection portion F1 is equivalent to being within the opening C, that is, this portion of the auxiliary connection portion F1 is not formed on the second line segment L12, but is formed on the substrate O1 exposed by the opening C.

[0146] In summary, no matter which segment of the connecting lead L1 in the light-emitting substrate 100 experiences a partial disconnection, an auxiliary connecting portion F1 can be formed on the surface corresponding to the segment, so that at least a portion of the auxiliary connecting portion F1 is disposed within the opening C of the segment. In other words, the auxiliary connecting portion F1 replaces the disconnected portion of the connecting lead L1, allowing the connecting lead L1 to maintain normal circuit continuity.

[0147] In some examples, the second line segment L12 of the connecting lead L1 is formed on the second main surface S2, and the driving circuit board 210 in the display device 200 (referring to FIG. 4 ) may also be located on the second main surface S2. Based on this, the second line segment L12 of the connecting lead L1 can be electrically connected to the driving circuit board 210 to receive a signal provided by the driving circuit board 210 and transmit it to the light-emitting chip 10 in the display area AA, thereby realizing light-emitting display of the light-emitting substrate 100.

[0148] For example, multiple second line segments L12 of the connecting leads L1 can be set, which tend to converge from the side close to the set side S31 (the side away from the driving circuit board) to the side away from the set side S31 (the side close to the driving circuit board) to facilitate the electrical connection of the second line segments L12 of the connecting leads L1 with the driving circuit board 210.

[0149] The above embodiment describes a case where an opening C is formed in any one line segment of the connecting lead L1 . The following describes a case where at least two line segments of the connecting lead L1 have at least one opening C formed therein.

[0150] In some examples, any two of the first segment L11 , the second segment L12 , and the third segment L13 in the connecting lead L1 may include at least one opening C.

[0151] The above structure can include the following three situations:

[0152] The first type: the first line segment L11 and the second line segment L12 each include at least one opening C.

[0153] The second type: the first line segment L11 and the third line segment L13 each include at least one opening C.

[0154] The third type: the second line segment L12 and the third line segment L13 each include at least one opening C.

[0155] For the first case above:

[0156] Exemplarily, when both the first line segment L11 and the second line segment L12 include at least one opening C, an auxiliary connection portion F1 corresponding to the opening C on the first line segment L11 and an auxiliary connection portion F1 corresponding to the opening C on the second line segment L12 may be provided respectively.

[0157] As shown in the above structure, using two different auxiliary connection parts F1 to repair the first line segment L11 and the second line segment L12, the size and shape of each auxiliary connection part F1 can be set accordingly to the size and shape of the opening C in the line segment (first line segment L11 or second line segment L12) it repairs. On the one hand, the auxiliary connection part F1 can be used to achieve precise repair of the line segment (first line segment L11 or second line segment L12) in the connecting lead L1. On the other hand, only setting the auxiliary connection part F1 corresponding to the line segment with opening C (first line segment L11 or second line segment L12) is equivalent to not having to set the auxiliary connection part F1 at the position of the intact third line segment L13 without opening C, which can help save resources.

[0158] Alternatively, an auxiliary connecting portion F1 can be provided. This auxiliary connecting portion F1 can overlap with both the opening C on the first line segment L11 and the opening C on the second line segment L12, so that the auxiliary connecting portion F1 can be used to repair both the first line segment L11 and the second line segment L12 simultaneously. It is understood that in this case, the auxiliary connecting portion F1 will also span the third line segment L13 located between the first line segment L11 and the second line segment L12.

[0159] As shown in the above structure, the size of the auxiliary connection portion F1 used to simultaneously repair the first and second line segments L11, L12 is larger than the size of the auxiliary connection portion F1 used to repair the first and second line segments L11, L12 using two different auxiliary connection portions F1. Furthermore, when the same auxiliary connection portion F1 is used to simultaneously repair the first and second line segments L11, L12, the larger size of the auxiliary connection portion F1 can help increase the overlap area between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0160] For the second case above:

[0161] Exemplarily, when both the first line segment L11 and the third line segment L13 include at least one opening C, an auxiliary connection portion F1 corresponding to the opening C on the first line segment L11 and an auxiliary connection portion F1 corresponding to the opening C on the third line segment L13 may be provided respectively.

[0162] As shown above, using two different auxiliary connectors F1 to repair the first and third line segments L11 and L13 allows the size and shape of each auxiliary connector F1 to be tailored to the size and shape of the opening C in the line segment (first line segment L11 or third line segment L13) it is repairing. This allows the auxiliary connectors F1 to precisely repair the line segment (first line segment L11 or third line segment L13) in the connecting lead L1. Furthermore, providing auxiliary connectors F1 only for the line segment with the opening C (first line segment L11 or third line segment L13) can help conserve resources.

[0163] Alternatively, since the first line segment L11 and the third line segment L13 are connected, an auxiliary connection portion F1 may also be provided. The auxiliary connection portion F1 may overlap with the opening C on the first line segment L11 and the opening C on the third line segment L13 at the same time, so as to utilize the auxiliary connection portion F1 to modify the first line segment L11 and the third line segment L13 at the same time.

[0164] In the above structure, the size of the auxiliary connection portion F1 used to simultaneously repair the first and third line segments L11 and L13 is larger than the size of the auxiliary connection portion F1 used to repair the first and third line segments L11 and L13 using two different auxiliary connection portions F1. Furthermore, when the same auxiliary connection portion F1 is used to simultaneously repair the first and third line segments L11 and L13, the larger size of the auxiliary connection portion F1 can help increase the overlap area between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0165] Furthermore, the auxiliary connection portion F1 is arranged to overlap both the opening C on the first line segment L11 and the opening C on the third line segment L13, which is equivalent to the auxiliary connection portion F1 including a portion located on the first main surface S1 and a portion located on the predetermined side surface S31, which are connected. Since the portion located on the first main surface S1 and the portion located on the predetermined side surface S31 are connected, the probability of the end of the auxiliary connection portion F1 located on the predetermined side surface S31, which is closer to the first main surface S1, falling off from the substrate 01 (the third line segment L13) can be reduced.

[0166] Regarding the third situation mentioned above:

[0167] Exemplarily, when both the second line segment L12 and the third line segment L13 include at least one opening C, an auxiliary connection portion F1 corresponding to the opening C on the second line segment L12 and an auxiliary connection portion F1 corresponding to the opening C on the third line segment L13 can be provided respectively.

[0168] As shown above, using two different auxiliary connectors F1 to repair the second and third line segments L12 and L13 allows the size and shape of each auxiliary connector F1 to be tailored to the size and shape of the opening C in the line segment (second or third line segment L12 or L13) it is repairing. This allows the auxiliary connectors F1 to precisely repair the line segment (second or third line segment L12 or L13) in the connecting lead L1. Furthermore, providing auxiliary connectors F1 only for the line segment with the opening C (second or third line segment L12 or L13) can help conserve resources.

[0169] Alternatively, since the second line segment L12 and the third line segment L13 are connected, an auxiliary connection portion F1 may also be provided. The auxiliary connection portion F1 may overlap with the opening C on the second line segment L12 and the opening C on the third line segment L13 at the same time, so as to utilize the auxiliary connection portion F1 to modify the second line segment L12 and the third line segment L13 at the same time.

[0170] In the above structure, the size of the auxiliary connection portion F1 used to simultaneously repair the second and third line segments L12 and L13 is larger than the size of the auxiliary connection portion F1 used to repair the second and third line segments L12 and L13 using two different auxiliary connection portions F1. Furthermore, when the same auxiliary connection portion F1 is used to simultaneously repair the second and third line segments L12 and L13, the larger size of the auxiliary connection portion F1 can help increase the overlap area between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1, thereby further ensuring the yield rate of the connecting lead.

[0171] Furthermore, the auxiliary connection portion F1 is arranged to overlap with both the opening C on the second line segment L12 and the opening C on the third line segment L13, which is equivalent to the auxiliary connection portion F1 including a portion located on the second main surface S2 and a portion located on the predetermined side surface S31, which are connected. Since the portion located on the second main surface S2 and the portion located on the predetermined side surface S31 are connected, the probability of the end of the auxiliary connection portion F1 located on the predetermined side surface S31, which is closer to the first main surface S1, falling off from the substrate O1 (the third line segment L13) can be reduced.

[0172] In some other examples, each of the first line segment L11 , the second line segment L12 , and the third line segment L13 in the connecting lead L1 may include at least one opening C.

[0173] At this time, auxiliary connection parts F1 corresponding to the opening C on the first line segment L11, auxiliary connection parts F1 corresponding to the opening C on the second line segment L12, and auxiliary connection parts F1 corresponding to the opening C on the third line segment L13 can be provided respectively.

[0174] As shown above, using two different auxiliary connecting parts F1 to repair the first line segment L11, the second line segment L12, and the third line segment L13 allows the size and shape of each auxiliary connecting part F1 to be set accordingly to the size and shape of the opening C in the line segment (the first line segment L11, the second line segment L12, or the third line segment L13) it repairs. On the one hand, the auxiliary connecting part F1 can be used to achieve precise repair of the line segment (the first line segment L11, the second line segment L12, or the third line segment L13) in the connecting lead L1. On the other hand, only setting the auxiliary connecting part F1 corresponding to the line segment with the opening C (the first line segment L11, the second line segment L12, or the third line segment L13) can help save resources.

[0175] Alternatively, an auxiliary connection portion F1 may be provided, which may overlap with the opening C on the first line segment L11, the opening C on the second line segment L12, and the opening C on the third line segment L13 at the same time, so as to utilize the auxiliary connection portion F1 to modify the first line segment L11, the second line segment L12, and the third line segment L13 at the same time.

[0176] In the above structure, the size of the auxiliary connection portion F1 used to simultaneously repair the first, second, and third line segments L11, L12, and L13 is larger than the size of the auxiliary connection portion F1 used to simultaneously repair the first, second, and third line segments L11, L12, and L13 using three different auxiliary connection portions F1. Furthermore, when the same auxiliary connection portion F1 is used to simultaneously repair the first, second, and third line segments L11, L12, and L13, the larger size of the auxiliary connection portion F1 can help increase the overlap area between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1, further ensuring the yield rate of the connecting lead.

[0177] Furthermore, the auxiliary connection portion F1 is arranged to overlap with both the opening C on the second line segment L12 and the opening C on the third line segment L13, which is equivalent to the auxiliary connection portion F1 including a portion located on the first main surface S1, a portion located on the predetermined side surface S31, and a portion located on the second main surface S2, which are connected to each other. Furthermore, since the portion located on the predetermined side surface S31 can be connected to the portion located on the first main surface S1 and the portion located on the second main surface S2, respectively, the probability of the auxiliary connection portion F1 located on the predetermined side surface S31, which is closer to the first main surface S1 and the end closer to the second main surface S2, falling off from the substrate 01 (third line segment L13) can be reduced.

[0178] In addition, when at least one line segment of the connecting lead L1 includes multiple openings, one auxiliary connecting part F1 may be used to repair the openings C, or multiple auxiliary connecting parts F1 may be used to repair the openings C one by one.

[0179] The above embodiment, combined with the relevant drawings, mainly describes the case where at least one line segment in the connecting lead L1 has at least one opening C. The quantitative relationship between the connecting lead L1 and the openings C will be described below with reference to the relevant drawings.

[0180] In some embodiments, as shown in Figures 8 and 9 , the openings C in the connection lead L1 may correspond to the auxiliary connection parts F1 one by one. That is, one opening in the connection lead L is repaired by one auxiliary connection part F1.

[0181] That is, for each opening C in a connection lead L found in the light emitting substrate 100 , an auxiliary connection portion F1 may be correspondingly provided, so that at least a portion of the auxiliary connection portion F1 is disposed in the opening C and connected to the connection lead L1 .

[0182] Based on this, the auxiliary connector F1 is used to fill at least a portion of the opening C, thereby repairing the opening C formed by the connection lead L1 due to detachment. In other words, the auxiliary connector F1 can replace the detached portion of the connection lead L1, allowing the connection lead L1 to maintain normal circuit continuity. This can help improve the yield rate of the connection lead L1.

[0183] In addition, since the opening C in the connecting lead L1 can correspond one-to-one with the auxiliary connection part F1, the shape and size of the regulator auxiliary connection part F1 can be matched to different openings C, which can achieve fixed-point repair and save resources.

[0184] Figure 14 is a structural diagram of a light-emitting substrate according to other embodiments. Figure 14 illustrates the structure of a first segment in a connecting lead. The structures of other segments in the connecting lead are similar to those of the first segment and can be combined with the description of the first segment structure. The structures of other segments in the connecting lead will also be described in detail below.

[0185] In other embodiments, as shown in FIG. 14 , a connecting lead L1 includes multiple openings C. Each of the multiple openings C in the connecting lead L1 can be provided with an auxiliary connecting portion F1. That is, the auxiliary connecting portion F1 can be simultaneously located within multiple openings C in the connecting lead L1 and connected to the connecting lead L1.

[0186] Based on this, a single auxiliary connector F1 is used to fill multiple openings C formed in the connecting lead L. This allows the auxiliary connector F1 to repair multiple openings C formed by the connecting lead L1 due to detachment. This ensures that the connecting lead L1 maintains normal circuit continuity. This can help improve the yield rate of the connecting lead L1. Furthermore, since multiple openings C in the same connecting lead L1 can be repaired using a single auxiliary connector F1, this can help reduce the precision of the process used to form the auxiliary connector F1.

[0187] Figure 15 is a structural diagram of a light-emitting substrate according to further embodiments, and Figure 16 is a cross-sectional view taken along the line T-T' in Figure 15 . Figure 15 illustrates the structure of a first line segment L11 in the connecting lead. The structures of other line segments in the connecting lead are similar to those of the first line segment L11 and can be discussed in conjunction with the description of the structure of the first line segment. The structures of other line segments in the connecting lead will also be described in detail below.

[0188] In yet other embodiments, as shown in FIG. 15 , at least two auxiliary connectors F1 are disposed within the same opening C. Consequently, multiple auxiliary connectors F1 can be used to repair the same opening C, ensuring that the connecting lead L1 maintains proper continuity. Furthermore, using multiple auxiliary connectors F1 to repair the same opening C allows the auxiliary connectors F1 to occupy a greater portion of the opening C, allowing the auxiliary connectors F1 to better repair any detached portions of the connecting lead L1 and fill the opening C. This helps ensure that the connecting lead L1 maintains proper continuity and improves the yield rate of the connecting lead L1.

[0189] Exemplarily, the plurality of auxiliary connection portions F1 are arranged along a direction perpendicular to the extending direction of the connection lead L1 , and the plurality of auxiliary connection portions F1 are all disposed within the opening C.

[0190] It should be noted that when multiple auxiliary connection parts F1 are located in the same opening C, the connection relationship between the multiple auxiliary connection parts F1 in the same opening C is as follows.

[0191] The first type: as shown in the two auxiliary connection parts corresponding to the lower connecting lead in Figure 15, and the two auxiliary connection parts F1 set corresponding to the left connecting lead L1 in Figure 16, that is, the multiple auxiliary connection parts F1 corresponding to the same opening C can be set at intervals.

[0192] The second type: as shown in FIG15 , the two auxiliary connection parts corresponding to the upper connecting lead, and the two auxiliary connection parts F1 corresponding to the right connecting lead L1 in FIG16 , that is, the multiple auxiliary connection parts F1 corresponding to the same opening C can be electrically connected to each other.

[0193] Regardless of which of the above methods is used, it is sufficient to ensure that each auxiliary connection portion F1 is within the opening C and is connected to the connection lead L1 having the opening C, so that the auxiliary connection portion F1 can be used to repair and replace the opening C formed by the connection lead L1 falling off, thereby ensuring that the connection lead L1 can maintain normal circuit continuity. The embodiments of the present disclosure are not limited to this.

[0194] However, the embodiments of the present disclosure are not limited to this. In the following description, one auxiliary connection portion F1 is used to repair one opening C as an example.

[0195] The above embodiments, combined with the relevant figures, describe the positional relationship and quantity relationship between the connecting leads L1 and the auxiliary connecting portion F1. The following describes various parameters of the auxiliary connecting portion F1, including its square resistance, thickness, and length, in conjunction with the relevant figures.

[0196] In some embodiments, referring to FIG. 8 and FIG. 9 , the square resistance of the auxiliary connection portion F1 is set to be less than or equal to the square resistance of the connection lead L1 .

[0197] In other words, an auxiliary connection portion F1 having a sheet resistance less than or equal to that of the connecting lead L1 is selected to replace the detached portion of the connecting lead L1. This prevents the problem of the auxiliary connection portion F1 having a large sheet resistance, which would otherwise cause the auxiliary connection portion F1 to generate a large impedance during operation of the light-emitting substrate 100. This also reduces the effect of the auxiliary connection portion F1 on the electrical properties of the connecting lead L1.

[0198] In addition, since the auxiliary connection portion F1 needs to contact the connection lead L1 having the opening C, the auxiliary connection portion F1 is electrically connected to the connection lead L1, so that the connection lead L1 can maintain normal circuit conduction by utilizing the auxiliary connection portion F1.

[0199] Based on this, selecting an auxiliary connection portion F1 with a square resistance less than or equal to that of the connection lead L1 can also help reduce the contact resistance between the auxiliary connection portion F1 and the connection lead L1. This can reduce the contact resistance between the auxiliary connection portion F1 and the connection lead L1, reduce the attenuation of the signal transmitted by the connection lead L1, and improve the display quality of the light-emitting substrate 100.

[0200] In some embodiments, referring to Figures 8 and 9 , the auxiliary connection portion F1 may be made of conductive adhesive. At least a portion of the conductive adhesive is placed in the opening C, and the conductive adhesive is used to connect the connection lead L1 where the opening C is located.

[0201] On the one hand, the conductive adhesive is conductive, enabling electrical connection between the auxiliary connection portion F1 (conductive adhesive) and the connecting lead L1, ensuring that the connecting lead L1 maintains normal circuit continuity. On the other hand, the conductive adhesive is sticky, ensuring a secure connection between the auxiliary connection portion F1 (conductive adhesive) and the connecting lead L1, preventing the conductive adhesive from falling off the connecting lead L1, which would again lead to a low yield rate for the connecting lead L1.

[0202] In some examples, the conductive adhesive can include conductive silver paste or conductive gold paste. Because conductive silver paste or conductive gold paste has advantages such as low curing temperature, high bonding strength, and stable electrical properties, the conductive silver paste or conductive gold paste is placed within the opening C, and the conductive adhesive is used to connect the connection lead L1 where the opening C is located. This ensures the electrical performance of the connection lead L1 after repairing it with the auxiliary connection portion F1 (conductive silver paste or conductive gold paste), while also reducing the risk of the auxiliary connection portion F1 (conductive silver paste or conductive gold paste) falling off the connection lead L1.

[0203] In some examples, the conductive adhesive may include an adhesive and metal balls disposed within the adhesive. This arrangement can ensure the electrical performance of the connecting lead L1 after repairing with the auxiliary connecting portion F1 (conductive adhesive) while reducing the risk of the auxiliary connecting portion F1 (conductive adhesive) falling off the connecting lead L1.

[0204] For example, the adhesive material may be ultraviolet rays (UV) or thermosetting adhesive, but the disclosed embodiments are not limited thereto.

[0205] For example, the material of the metal ball can be an inert metal, such as silver and gold. However, the embodiments of the present disclosure are not limited thereto.

[0206] In some embodiments, referring to FIG. 8 and FIG. 9 , in the thickness direction Z of the substrate 01 , the thickness of the auxiliary connection portion F1 ranges from 5 μm to 20 μm.

[0207] When the thickness of the auxiliary connection portion F1 is equal to or close to 5 μm, the auxiliary connection portion F1 can be made thinner, allowing the auxiliary connection portion F1 to fit more closely to the substrate 01 and the connecting lead L1, reducing the risk of the auxiliary connection portion F1 becoming detached from the substrate 01 and the connecting lead L1. Furthermore, when the thickness of the auxiliary connection portion F1 is equal to or close to 5 μm, the problem of high resistance in the auxiliary connection portion F1 due to its thin thickness can be avoided. Furthermore, this can help reduce the attenuation of signals transmitted on the connecting lead it repairs, thereby improving the display quality of the light-emitting substrate 100.

[0208] When the thickness of the auxiliary connection portion F1 is equal to or close to 20 μm, the thickness of the auxiliary connection portion F1 is relatively thick, which can reduce the resistance of the auxiliary connection portion F1. This can help reduce the attenuation of the signal transmitted on the connecting lead it repairs, thereby improving the display quality of the light-emitting substrate 100. Furthermore, when the thickness of the auxiliary connection portion F1 is equal to or close to 20 μm, it can also prevent the auxiliary connection portion F1 from being too thick, which could increase the risk of the auxiliary connection portion F1 detaching from the substrate 01 and the connecting lead L1.

[0209] In some examples, the thickness of the auxiliary connection portion F1 ranges from 10 μm to 15 μm.

[0210] When the thickness of the auxiliary connection part F1 is equal to or close to 10μm, it can not only make the auxiliary connection part F1 fit more closely on the substrate 01 and the connecting lead L1, reducing the risk of the auxiliary connection part F1 detaching from the substrate 01 and the connecting lead L1; it can also prevent the auxiliary connection part F1 from having a large resistance, thereby helping to reduce the attenuation of the signal transmitted on the connecting lead repaired by the auxiliary connection part F1, which can help to improve the display quality of the light-emitting substrate 100.

[0211] When the thickness of the auxiliary connection part F1 is equal to or close to 15μm, the resistance of the auxiliary connection part F1 can be relatively small, thereby reducing the attenuation of the signal transmitted on the connection lead repaired by the auxiliary connection part F1; and the auxiliary connection part F1 can be prevented from being too thick, thereby increasing the risk of the auxiliary connection part F1 detaching from the substrate 01 and the connection lead L1.

[0212] For example, the auxiliary connection portion F1 has a thickness of about 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, or 20 μm, but this is not limited in the present disclosure.

[0213] It should be noted that the thickness of the auxiliary connection portion F1 is approximately 10 μm. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), the thickness of the auxiliary connection portion F1 can be considered to be equal to 10 μm when the error in the thickness of the auxiliary connection portion F1 fluctuates within the range of 10% × 10 μm.

[0214] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error in the thickness of the auxiliary connection part F1 fluctuates within the range of 5%×10μm, it can also be considered that the thickness of the auxiliary connection part F1 satisfies the requirement of being equal to 10μm.

[0215] The material and thickness of the auxiliary connection part F1 are introduced above in conjunction with the relevant drawings. The length and width of the auxiliary connection part F1 and how to set the auxiliary connection part F1 so that the auxiliary connection part F1 is connected to the connecting lead L1 will be introduced below in conjunction with the relevant drawings.

[0216] Fig. 17 is a structural diagram of a light emitting substrate according to some other embodiments, wherein Fig. 17 is a diagram illustrating a first line segment L11 connected to a lead line L1 on the light emitting substrate 100 .

[0217] First, referring to FIG. 17 , the first configuration method described above is described, where all auxiliary connection portions F1 are disposed within the opening C.

[0218] When the connection lead L1 is cut into two parts by the opening C formed by the partial wiring falling off, the connection lead L1 is formed in the connection lead L1. The first edge 11 and the second edge 12 corresponding to the two parts are formed in the connection lead L1. The first edge 11 and the second edge 12 and the middle area thereof are combined into the opening C.

[0219] Based on this, when all the auxiliary connection parts F1 are placed in the opening C, one end of the auxiliary connection part F1 can be placed in contact with the first edge 11, and the other end of the auxiliary connection part F1 can be placed in contact with the second edge 12. In this way, the auxiliary connection part F1 is placed in contact with the connecting lead L1 in the opening C, and the auxiliary connection part F1 can be used to repair the detached portion of the connecting lead L1, so that the auxiliary connection part F1 can maintain normal circuit continuity of the connecting lead L1.

[0220] In some examples, FIG17 only illustrates that one end of the auxiliary connection portion F1 abuts a portion of the first edge 11, and the other end of the auxiliary connection portion F1 abuts a portion of the second edge 12. In other words, the auxiliary connection portion F1 can fill a portion of the opening C. However, the present disclosure is not limited to this, as long as the auxiliary connection portion F1 can maintain normal circuit continuity of the connecting lead L1.

[0221] It is understood that in other examples, one end of the auxiliary connection portion F1 may be arranged to abut against all of the first edges 11, and the other end of the auxiliary connection portion F1 may abut against all of the second edges 12. That is, the auxiliary connection portion F1 may completely fill the opening C, so that the auxiliary connection portion F1 can completely replace and repair the detached portion of the connecting lead L1, and the auxiliary connection portion F1 can be used to ensure that the connecting lead L1 can maintain normal circuit continuity, thereby improving the yield rate of the connecting lead L1.

[0222] When the opening C formed by the partial detachment of the connecting lead L1 does not cut the connecting lead L1 into two parts, the detached part will form an edge in the connecting lead L1, which is relatively sunken relative to the original structure of the connecting lead L1 to form the opening C.

[0223] Based on this, the auxiliary connection portion F1 can be arranged in the opening C, abutting against the edge portion, or abutting against the edge in its entirety, so that the connection lead L1 can maintain normal circuit conduction by utilizing the auxiliary connection portion F1.

[0224] Next, the second arrangement is described above, where part of the auxiliary connection portion F1 is arranged in the opening C.

[0225] In some embodiments, referring back to Figures 8 and 9 , the auxiliary connection portion F1 includes a main portion F11 and at least one lap portion F12 connected to the main portion F11. The main portion F11 is located within the opening C, and the lap portion F12 is located on the side of the connection lead L1 away from the substrate O1, and the lap portion F12 contacts the connection lead L1.

[0226] Such a setting is equivalent to setting part of the auxiliary connection part F1 (main body F11) in the opening C, and setting the other part of the auxiliary connection part F1 (overlapping part F12) on the side of the connecting lead L1 away from the substrate 01, and using the auxiliary connection part F1 (overlapping part F12) to directly contact the connecting lead L1 to achieve electrical connection between the auxiliary connection part F1 and the connecting lead L1.

[0227] Moreover, the presence of the overlap portion F12 can increase the contact area between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability between the auxiliary connection portion F1 and the connecting lead L1 and preventing the auxiliary connection portion F1 from falling off the connecting lead L1.

[0228] The number of overlapping portions F12 in the auxiliary connection portion F1 can be set accordingly according to the position of the opening C in the connection lead L1, so as to achieve the use of the auxiliary connection portion F1 to repair the connection lead L1 and ensure the electrical performance of the connection lead L1.

[0229] FIG18 is a structural diagram of a light-emitting substrate according to some further embodiments, and FIG19 is a structural diagram of a light-emitting substrate according to some further embodiments.

[0230] In some examples, as shown in conjunction with Figures 18 and 19 , when the opening C is located at the end of the connecting lead L1, that is, when the opening C does not truncate the connecting lead L1 into multiple line segments, the auxiliary connecting portion F1 can be configured to include a main portion F11 and a lap portion F12 connected to the main portion F11. The main portion F11 is positioned within the opening C, and the lap portion F12 is positioned on the connecting lead L1. The lap portion F12 is then connected to the connecting lead L1 having the opening C, thereby achieving electrical connection between the auxiliary connecting portion F1 and the connecting lead L1.

[0231] Based on this, the auxiliary connection portion F1 can be used to repair the opening C formed by the connection lead L1 due to partial wiring detachment, so that the connection lead L1 can maintain normal circuit continuity. This can help improve the yield rate of the connection lead L1 and improve the display quality of the light-emitting substrate 100.

[0232] It should be noted that the "end" of the connecting lead L refers to the edge of the connecting lead L1. The presence of an opening C at this location does not directly result in the connecting lead L1 being cut into multiple segments. The "end" can be the edge of the connecting lead L1 along its length or along its width. This is not limited in the presently disclosed embodiments.

[0233] In other examples, when the opening C is located within the connecting lead L1, the opening C divides the connecting lead L1 into multiple sections. Returning to Figures 8 and 9, let's take the example of a connecting lead L1 having an opening C within it. In this case, the connecting lead L1 with the opening C is divided into two sections.

[0234] In this case, the auxiliary connection portion F1 may include a main portion F11 and two overlapping portions F12 connected to the main portion F11, wherein the main portion F11 is located between the two overlapping portions F12.

[0235] Based on this, the auxiliary connection part F1 can use one of the overlapping parts F12 to connect to one portion of the connecting lead L1, and the auxiliary connection part F1 can use the other overlapping part F12 to connect to another portion of the connecting lead L1. Based on this, the auxiliary connection part F1 can be used to repair the connecting lead L1 to ensure that the connecting lead L1 can maintain normal circuit continuity.

[0236] When the opening C penetrates the connecting lead L1 along the length or width direction of the connecting lead L1, the connecting lead L1 is cut into multiple line segments. For example, a connecting lead L1 with one opening C is cut into two line segments. For example, a connecting lead L1 with two openings C is cut into three line segments.

[0237] Based on this, the auxiliary connection part F1 can use one of the overlapping parts F12 to connect to one line segment of the connecting lead L1, and the auxiliary connection part F1 can use the other overlapping part F12 to connect to another line segment of the connecting lead L1. Furthermore, the auxiliary connection part F1 can be used to electrically connect the two broken line segments, so that the two line segments and the auxiliary connection part F1 are combined to form the repaired connecting lead L1, ensuring that the connecting lead L1 can maintain normal circuit continuity.

[0238] In some embodiments, referring to FIG. 8 and FIG. 9 , in the direction from the main portion F11 to the overlapping portion F12 , the width of the overlapping portion F12 is greater than or equal to 10 μm.

[0239] This arrangement is equivalent to extending the auxiliary connection portion F1 inside and outside the opening C onto the connecting lead L1, overlapping the connecting lead L1. Furthermore, the width of the overlapping area between the auxiliary connection portion F1 and the connecting lead L1 is set to be greater than or equal to 10 μm. This ensures sufficient contact between the auxiliary connection portion F1 and the connecting lead L1, thereby improving the stability of the fixed connection between the auxiliary connection portion F1 and the connecting lead L1. This helps prevent the conductive adhesive from falling off the connecting lead L1, which could further lead to a low yield rate for the connecting lead L1.

[0240] When the width of the overlapping portion F12 is equal to or close to 10 μm in the direction from the main body F11 to the overlapping portion F12, the width of the overlapping area between the auxiliary connection portion F1 and the connecting lead L1 can be ensured to be wider, thereby ensuring that the auxiliary connection portion F1 is in full contact with the connecting lead L1, thereby improving the stability of the fixed connection between the auxiliary connection portion F1 and the connecting lead L1.

[0241] It should be noted that since the opening C on the connecting lead L1 is formed by a portion of the connecting lead L1 falling off from the substrate 01, the shape of the opening C cannot be guaranteed. The opening C can be a regular shape, such as a circle, square, polygon, etc. Alternatively, the opening C can be an irregular shape.

[0242] Based on this, the above-mentioned “width of the overlapping portion F12 ” can be understood as the minimum distance between the orthographic projection of the edge of the overlapping portion F12 away from the main portion F11 on the substrate 01 and the orthographic projection of the boundary of the opening C on the substrate 01 .

[0243] In some examples, along the direction from the main portion F11 to the overlapping portion F12 , the width of the overlapping portion F12 is greater than or equal to 15 μm.

[0244] When the width of the overlapping portion F12 is equal to or close to 15 μm in the direction from the main portion F11 to the overlapping portion F12, the auxiliary connecting portion F1 can be ensured to be in full contact with the connecting lead L1, thereby improving the stability of the fixed connection between the auxiliary connecting portion F1 and the connecting lead L1.

[0245] Illustratively, along the direction from the main portion F11 to the overlapping portion F12 , the width of the overlapping portion F12 is approximately any one of 10 μm, 12 μm, 15 μm, 20 μm, 25 μm or 30 μm.

[0246] It should be noted that the width of the overlap portion F12 is approximately 10 μm. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, and measurement errors), the width of the overlap portion F12 can be considered to be equal to 10 μm if the error in the width of the overlap portion F12 fluctuates within a range of 10% × 10 μm.

[0247] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the width of the overlap portion F12 fluctuates within the range of 5%×10μm, it can also be considered that the width of the overlap portion F12 satisfies the requirement of being equal to 10μm.

[0248] The above limits the minimum size of the overlapping area between the auxiliary connection portion F1 and the connection lead L1 in conjunction with the accompanying drawings. The following will describe in detail the maximum size of the overlapping area between the auxiliary connection portion F1 and the connection lead L1 in conjunction with the accompanying drawings.

[0249] FIG20 is a cross-sectional view of a light-emitting substrate according to some other embodiments.

[0250] In some embodiments, referring to FIG. 20 , when any of the first line segment L11, the second line segment L12, and the third line segment L13 in the connecting lead L1 has an opening C, the length of the auxiliary connection portion F1 can be set along the extension direction of the connecting lead L1 to be less than or equal to the length of the line segment having the opening C.

[0251] Based on this, the auxiliary connection portion F1 can be used to repair the line segment with the opening C, thereby improving the yield rate of the connecting lead L1. Furthermore, setting the length of the auxiliary connection portion F1 to be less than or equal to the length of the line segment with the opening C can ensure the overlap width of the auxiliary connection portion F1 and the line segment with the opening C, ensuring that the auxiliary connection portion F1 fully contacts the line segment with the opening C, thereby improving the stability of the fixed connection between the auxiliary connection portion F1 and the connecting lead L1.

[0252] In addition, the length of the auxiliary connection part F1 is less than or equal to the length of the line segment with the opening C along the length direction of the connecting lead L1, which can also prevent the auxiliary connection part F1 from being too long, causing contact with other conductive components in the light-emitting substrate 100 and causing a short circuit, and can also help save resources.

[0253] When the length of the auxiliary connection portion F1 along the length of the connecting lead L1 is equal to or close to the length of the line segment with the opening C, the overlap width between the auxiliary connection portion F1 and the line segment with the opening C can be widened, allowing the auxiliary connection portion F1 to fully repair the line segment with the opening C, ensuring that the line segment maintains normal circuit continuity. This also helps improve the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1.

[0254] Since the three segments of the connecting lead L1 are formed on different surfaces of the substrate 01, the extension directions of the three segments are different. The above-mentioned "extension direction" refers to the extension direction of the segment with the opening C.

[0255] In some examples, when the opening C is formed in the first line segment L11 of the connecting lead L1 , the length of the auxiliary connection portion F1 along the extending direction of the first line segment L11 is less than or equal to the length of the first line segment L11 having the opening C.

[0256] In other examples, when the opening C is formed in the second line segment L12 of the connecting lead L1 , the length of the auxiliary connection portion F1 along the extension direction of the second line segment L12 is less than or equal to the length of the second line segment L12 having the opening C.

[0257] In some other examples, when the opening C is formed in the third segment L13 of the connecting lead L1 , the length of the auxiliary connection portion F1 along the extending direction of the third segment L13 is less than or equal to the length of the third segment L13 having the opening C.

[0258] It should be noted that when the opening C in the connecting lead L1 is located at the intersection of the first line segment L11 and the third line segment L13:

[0259] The first method is to assign the opening C to the first line segment L11 , set the length of the auxiliary connection portion F1 to be less than or equal to the length of the first line segment L11 , and connect the auxiliary connection portion F1 to the first line segment L11 and the third line segment L13 respectively.

[0260] The second method is to assign the opening C to the third line segment L13, set the length of the auxiliary connection portion F1 to be less than or equal to the length of the third line segment L13, and connect the auxiliary connection portion F1 to the first line segment L11 and the third line segment L13 respectively.

[0261] Option 3: The opening C can be divided into two parts: the part of the opening C near the first line segment L11 belongs to the first line segment L11, and the part of the opening C near the third line segment L13 belongs to the third line segment L13. In this case, the length of the opening C can be set to be less than or equal to the sum of the lengths of the first and third line segments L11 and L13, and the auxiliary connection portion F1 can be connected to the first and third line segments L11 and L13, respectively.

[0262] In addition, when the opening C in the connecting lead L1 is located at the intersection of the second line segment L12 and the third line segment L13, it is similar to the above situation when the opening C in the connecting lead L1 is located at the intersection of the first line segment L11 and the third line segment L13, and is not repeated here.

[0263] In some examples, along the extending direction of the connection lead L1 (the extending direction of the line segment having the opening C), the length of the auxiliary connection portion F1 is equal to the length of the line segment having the opening C.

[0264] Based on this, the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 along the extending direction of the connection lead L1 roughly coincides with the boundary of the orthographic projection of the line segment with the opening C on the substrate 01 along the extending direction of the connection lead L1.

[0265] This arrangement is equivalent to aligning the ends of the auxiliary connection portion F1 with the ends of the line segment with the opening C along the extension direction of the connecting lead L1 (the extension direction of the line segment with the opening C). This allows for a wider overlap between the auxiliary connection portion F1 and the line segment with the opening C, allowing the auxiliary connection portion F1 to fully repair the line segment with the opening C, ensuring that the line segment maintains normal circuit continuity. This also helps improve the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1.

[0266] It should be noted that "substantially overlap" includes both absolute overlap and approximate overlap. Specifically, as long as the gap between the orthographic projection boundary of the auxiliary connection portion F1 on substrate 01 and the orthographic projection boundary of the line segment with opening C on substrate 01 does not exceed an error threshold, the auxiliary connection portion F1 and the edge of the line segment can also be considered to relatively "overlap." The error threshold can be less than 10% of the length of the line segment with opening C.

[0267] Furthermore, when multiple openings C are located within the same line segment, the length of the auxiliary connection portion F1 can be set to be less than or equal to the length of the line segment containing the opening C. This allows the auxiliary connection portion F1 to be longer, allowing its orthographic projection on substrate 01 to overlap with the orthographic projections of the multiple openings C on substrate 01. Consequently, the auxiliary connection portion F1 can be used to simultaneously repair multiple openings C within the line segment. This eliminates the need for a corresponding auxiliary connection portion F1 for each opening C, simplifying the process.

[0268] 20 is described by taking the example of the first line segment L11 in the connecting lead L1 having an opening C. However, the embodiments of the present disclosure are not limited thereto.

[0269] FIG21 is a cross-sectional view of a light-emitting substrate according to yet other embodiments.

[0270] In some embodiments, referring to FIG. 21 , along the extending direction of the connecting lead L1 , the length of the auxiliary connecting portion F1 is less than or equal to the length of the connecting lead L1 having the opening C.

[0271] Based on this, the auxiliary connection portion F1 can be used to repair the connecting lead L1 with the opening C, thereby improving the yield rate of the connecting lead L1. Furthermore, the structure of the auxiliary connection portion F1 is similar to that of the connecting lead L1, and the extension direction of the auxiliary connection portion F1 is set to be parallel to the extension direction of the connecting lead L1. Therefore, setting the length of the auxiliary connection portion F1 to be less than or equal to the length of the connecting lead L1 with the opening C can ensure the overlap dimension of the auxiliary connection portion F1 and the connecting lead L1 with the opening C, ensuring sufficient contact between the auxiliary connection portion F1 and the connecting lead L1 with the opening C, thereby improving the stability of the fixed connection between the auxiliary connection portion F1 and the connecting lead L1.

[0272] In addition, the length of the auxiliary connection part F1 is less than or equal to the length of the connecting lead L1 having the opening C along the extension direction of the connecting lead L1. This can also prevent the auxiliary connection part F1 from being too long, which may cause short circuit due to contact with other conductive components in the light-emitting substrate 100, and can also help save resources.

[0273] When the length of the auxiliary connection portion F1 along the extension direction of the connecting lead L1 is equal to or close to the length of the connecting lead L1 having the opening C, the overlapping area between the auxiliary connection portion F1 and the line segment having the opening C can be increased. The auxiliary connection portion F1 can be used to fully repair the connecting lead L1 having the opening C, ensuring that the connecting lead L1 can maintain normal circuit continuity. This can also help improve the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1.

[0274] In some examples, referring to FIG. 21 , along the extending direction of the connecting lead L1 , the length of the auxiliary connecting portion F1 is substantially equal to the length of the connecting lead L1 having the opening C.

[0275] The structure of auxiliary connection portion F1 is similar to that of connection lead L1, extending from first main surface S1 to second main surface S2. Specifically, auxiliary connection portion F1 includes a first auxiliary connection sub-portion corresponding to first line segment L11, a third auxiliary connection sub-portion corresponding to third line segment L13, and a second auxiliary connection sub-portion corresponding to second line segment L12. The third auxiliary connection sub-portion is connected to the first and second auxiliary connection sub-portions, respectively, to form auxiliary connection portion F1.

[0276] As shown above, along the extension direction of the connecting lead L1, the length of the auxiliary connecting portion F1 is approximately equal to the length of the line segment with the opening C. This means that along the extension direction of the first line segment L11, the length of the first auxiliary connecting sub-portion is approximately equal to the length of the first line segment L11; along the extension direction of the third line segment L13, the length of the third auxiliary connecting sub-portion is approximately equal to the length of the third line segment L13; and along the extension direction of the second line segment L12, the length of the second auxiliary sub-portion is approximately equal to the length of the second line segment L12. Thus, along the extension direction of the connecting lead L1, the length of the auxiliary connecting portion F1 is approximately equal to the length of the line segment with the opening C.

[0277] Furthermore, the overlap width between the auxiliary connection portion F1 and the connection lead L1 having the opening C can be made wider, and the auxiliary connection portion F1 can be used to fully repair the connection lead L1 having the opening C, thereby ensuring that the connection lead L1 can maintain normal circuit continuity. This can also help improve the stability of the connection between the auxiliary connection portion F1 and the connection lead L1.

[0278] Furthermore, when the same connecting lead L1 has multiple openings C—for example, when defective channels are formed in different segments of the same connecting lead L1—the length of the auxiliary connecting portion F1 can be set to be less than or equal to the length of the connecting lead L1 having the opening C. This length of the auxiliary connecting portion F1 is long enough so that the orthographic projection of the auxiliary connecting portion F1 on the substrate 01 overlaps with the orthographic projections of multiple openings C on the substrate 01. Consequently, the auxiliary connecting portion F1 can be used to simultaneously repair multiple openings C in the connecting lead L1. This eliminates the need to provide a corresponding auxiliary connecting portion F1 for each opening C, simplifying the process.

[0279] The above mainly introduces the limitation on the length of the auxiliary connection part F1 , and the following will define the width of the auxiliary connection part F1 with reference to the accompanying drawings.

[0280] In some embodiments, returning to FIG. 8 and FIG. 9 , along the width direction of the connection lead L1 , the ratio of the width of the auxiliary connection portion F1 located in the opening C to the width of the opening C is greater than or equal to 50%.

[0281] When the ratio of the width of the auxiliary connection portion F1 located within the opening C to the width of the opening C along the width of the connecting lead L1 is equal to or close to 50%, the auxiliary connection portion F1 can occupy a larger proportion of the opening C, so that the auxiliary connection portion F1 can be used to repair the detached portion of the connecting lead L1 to fill the opening C. This helps ensure that the connecting lead L1 can maintain normal circuit continuity and improve the yield rate of the connecting lead L1.

[0282] In some examples, the width direction of the connecting lead L1 is approximately perpendicular to the extension direction of the connecting lead L1. In this case, the angle between the width direction of the connecting lead L1 and the extension direction of the connecting lead L1 is approximately 90°. For example, the angle between the width direction of the connecting lead L1 and the extension direction of the connecting lead L1 can be 85°, 90°, or 95°.

[0283] In some examples, along the width direction of the connection lead L1 , a ratio of the width of the auxiliary connection portion F1 located within the opening C to the width of the opening C is greater than or equal to 80%.

[0284] When the ratio of the width of the auxiliary connection portion F1 located within the opening C to the width of the opening C along the width of the connecting lead L1 is equal to or close to 80%, the auxiliary connection portion F1 can occupy a larger proportion of the opening C, so that the auxiliary connection portion F1 can be used to better repair the detached portion of the connecting lead L1 and fill the opening C. This helps ensure that the connecting lead L1 can maintain normal circuit continuity and improve the yield rate of the connecting lead L1.

[0285] In some examples, along the width direction of the connection lead L1, the ratio of the width of the auxiliary connection portion F1 in the opening C to the width of the opening C is greater than or equal to 100%. That is, the width of the auxiliary connection portion F1 in the opening C is substantially equal to the width of the opening C.

[0286] With such a configuration, the auxiliary connection portion F1 can be used to fill the opening C, which helps to ensure that the connection lead L1 can maintain normal circuit conduction and improve the yield rate of the connection lead L1.

[0287] For example, along the width direction of the connection lead L1, the ratio of the width of the auxiliary connection portion F1 located in the opening C to the width of the opening C is approximately 50%, 60%, 70%, 80%, 90% or 100%. However, the embodiments of the present disclosure are not limited thereto.

[0288] It should be noted that, in the example described above, the ratio of the width of the auxiliary connection portion F1 located within the opening C to the width of the opening C along the width of the connecting lead L1 is approximately 50%. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the ratio fluctuates within the range of 10% × 50%, it can also be considered that the ratio of the width of the auxiliary connection portion F1 located within the opening C to the width of the opening C is approximately 50%.

[0289] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the ratio fluctuates within the range of 5%×50%, it can also be considered that the ratio of the width of the auxiliary connection part F1 located in the opening C to the width of the opening C is approximately 50%.

[0290] In some embodiments, as shown in FIG. 8 and FIG. 9 , along the width direction of the connecting lead L1 , the width of the auxiliary connecting portion F1 ranges from 50 μm to 100 μm.

[0291] When the width of the auxiliary connection portion F1 along the width of the connecting lead L1 is equal to or close to 50 μm, the width of the auxiliary connection portion F1 can be made wider, so that the auxiliary connection portion F1 occupies a larger proportion of the opening C. This allows the auxiliary connection portion F1 to better repair the detached portion of the connecting lead L1 and fill the opening C. This helps ensure that the connecting lead L1 maintains proper circuit continuity and improves the yield rate of the connecting lead L1. It also helps prevent the excessive width of the auxiliary connection portion F1 from shorting out other connecting leads L1 adjacent to the connecting lead L1 it repairs.

[0292] When the width of the auxiliary connection portion F1 along the width of the connecting lead L1 is equal to or close to 100 μm, the opening C can be better filled to repair the connecting lead L1, thereby improving the yield rate of the connecting lead L1. At the same time, the resistance of the auxiliary connection portion F1 can be reduced, thereby reducing the loss of signals transmitted by the repaired connecting lead L1 caused by the resistance of the auxiliary connection portion F1.

[0293] In some examples, as shown in combination with FIG. 8 and FIG. 9 , along the width direction of the connecting lead L1 , the width of the auxiliary connection portion F1 ranges from 60 μm to 80 μm.

[0294] When the width of the auxiliary connection portion F1 is equal to or close to 60 μm along the width direction of the connecting lead L1, the auxiliary connection portion F1 can occupy a larger proportion of the opening C to repair the connecting lead L1 and improve the yield rate of the connecting lead L1; it can also prevent the auxiliary connection portion F1 from short-circuiting other connecting leads L1 adjacent to the connecting lead L1 it repairs.

[0295] When the width of the auxiliary connection portion F1 along the width direction of the connecting lead L1 is equal to or close to 90 μm, the auxiliary connection portion F1 can better fill the opening C and improve the yield of the connecting lead L1; it can also reduce the resistance of the auxiliary connection portion F1 and improve the loss of the signal transmitted by the repaired connecting lead L1 caused by the resistance of the auxiliary connection sub-portion F1.

[0296] For example, along the width direction of the connection lead L1 , the width of the auxiliary connection portion F1 is approximately any one of 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm. However, the present disclosure is not limited thereto.

[0297] It should be noted that, in the example described above, the width of the auxiliary connection portion F1 along the width of the connecting lead L1 is approximately 50 μm. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, and measurement errors), the width of the auxiliary connection portion F1 can be considered to be 50 μm if the error in the width of the auxiliary connection portion F1 fluctuates within a range of 10% × 50 μm.

[0298] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the width of the auxiliary connection part F1 fluctuates within the range of 5%×50μm, it can also be considered that the width of the auxiliary connection part F1 satisfies the requirement of being equal to 50μm.

[0299] In some embodiments, as shown in FIG8 , the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for greater than or equal to 50% of the area of ​​the orthographic projection of the opening C on the substrate 01 .

[0300] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, when the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to be equal to or close to 50% of the area of ​​the orthographic projection of the opening C on the substrate 01, the auxiliary connection part F1 can be used to replace more than 50% of the detached part of the connecting lead L1, that is, the connecting lead with the opening C can be better repaired, so that the connecting lead L1 can have better electrical performance, ensuring that the connecting lead L1 can maintain normal circuit conduction, thereby improving the yield rate of the connecting lead L1.

[0301] In some examples, the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for approximately 50% of the area of ​​the orthographic projection of the opening C on the substrate 01 .

[0302] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, when the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to account for approximately 50% of the area of ​​the orthographic projection of the opening C on the substrate 01, the auxiliary connection part F1 can be used to connect the connecting lead L1, repair and replace the connecting lead with the opening C, so as to ensure that the connecting lead L1 can maintain normal circuit conduction and improve the yield rate of the connecting lead L1.

[0303] Furthermore, the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to approximately 50% of the orthographic projection of the opening C on the substrate 01. This can also help prevent the auxiliary connection portion F1 from being too large and causing short circuits with other adjacent connection leads. Furthermore, it can save resources.

[0304] It should be noted that, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 10% × 50%, it can also be considered that the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01, the proportion of the overlapping area of ​​the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 is equal to 50%.

[0305] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 5%×50%, it can also be considered that the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 is equal to 50%.

[0306] In addition, it is understandable that due to the limitations of equipment and manufacturing processes, the overlapping area of ​​the orthographic projection of an auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 may not reach a ratio of 50% of the area of ​​the orthographic projection of the opening C on the substrate 01. In this case, 2, 3 or other multiple auxiliary connection parts F1 can be arranged in the same opening C, so that the sum of the overlapping areas of the orthographic projections of the multiple auxiliary connection parts F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for a ratio greater than or equal to 50% of the area of ​​the orthographic projection of the opening C on the substrate 01.

[0307] For example, when the overlapping area of ​​the orthographic projection of one auxiliary connection portion F1 on substrate 01 and the orthographic projection of opening C on substrate 01 accounts for approximately 20% of the orthographic projection area of ​​opening C on substrate 01, three auxiliary connection portions F1 can be arranged within the same opening so that the sum of the overlapping areas of the orthographic projections of the three auxiliary connection portions F1 on substrate 01 and the orthographic projection of opening C on substrate 01 accounts for 60% of the orthographic projection area of ​​opening C on substrate 01, thereby ensuring that the area of ​​opening C on substrate 01 accounts for greater than or equal to 50%. Furthermore, the auxiliary connection portions F1 can be used to connect to the connecting lead L1 and repair or replace the connecting lead with opening C, ensuring that the connecting lead L1 can maintain normal circuit continuity and improving the yield rate of the connecting lead L1.

[0308] It should be noted that when multiple auxiliary connecting portions F1 are located within the same opening C, the corresponding auxiliary connecting portions F1 within the same opening C can be electrically connected to each other. Alternatively, the corresponding auxiliary connecting portions F1 within the same opening C can be arranged at intervals. Regardless of which method is used, as long as each auxiliary connecting portion F1 is ensured to be within the opening C and connected to the connecting lead L1 having the opening C, the auxiliary connecting portion F1 can be used to repair and replace the portion of the opening C formed by the connection lead L1 being detached, thereby ensuring that the connection lead L1 can maintain normal circuit continuity.

[0309] In other embodiments, as shown in FIG8 , the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for greater than or equal to 80% of the area of ​​the orthographic projection of the opening C on the substrate 01 .

[0310] When the auxiliary connection part F1 is set in the opening C, and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to be equal to or close to 80% of the area of ​​the orthographic projection of the opening C on the substrate 01. The auxiliary connection part F1 can be used to replace more than 80% of the detached part of the connecting lead L1, that is, the connecting lead with the opening C can be better repaired, so that the connecting lead L1 can have better electrical performance, ensuring that the connecting lead L1 can maintain normal circuit conduction, thereby improving the yield rate of the connecting lead L1.

[0311] In some examples, the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for approximately 80% of the area of ​​the orthographic projection of the opening C on the substrate 01 .

[0312] When the auxiliary connection part F1 is set in the opening C and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is set to account for approximately 80% of the area of ​​the orthographic projection of the opening C on the substrate 01. The opening C in the connecting lead L1 is basically repaired by using the auxiliary connection part, which can ensure that the connecting lead L1 can maintain normal circuit conductivity and improve the yield rate of the connecting lead L1.

[0313] It should be noted that, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 10% × 80%, it can also be considered that the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 is equal to 80%.

[0314] In addition, in other examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the error of the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 fluctuates within the range of 5%×80%, it can also be considered that the proportion of the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 to the area of ​​the orthographic projection of the opening C on the substrate 01 is equal to 80%.

[0315] FIG22 is a structural diagram of a light-emitting substrate according to still other embodiments.

[0316] In some other embodiments, as shown in FIG. 22 , the overlapping area of ​​the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 accounts for approximately 100% of the area of ​​the orthographic projection of the opening C on the substrate 01 .

[0317] When the auxiliary connection part F1 is set in the opening C and the auxiliary connection part F1 is set to connect the connecting lead L1 with the notch C, when the overlapping area of ​​the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the orthographic projection of the opening C on the substrate 01 is equal to or close to 100% of the area of ​​the orthographic projection of the opening C on the substrate 01, it is equivalent to setting the orthographic projection of the auxiliary connection part F1 on the substrate 01 to cover the orthographic projection of the opening C on the substrate 01.

[0318] Here, “the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the opening C on the substrate 01 ” includes the following two situations:

[0319] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 substantially coincides with the orthographic projection of the opening C on the substrate 01 .

[0320] The second type: the orthographic projection of the opening C on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 .

[0321] In either case, the auxiliary connection F1 can be used to completely fill the opening C on the connecting lead L1 to complete the connecting lead L1. This helps ensure that the connecting lead L1 can maintain normal circuit continuity and improve the yield rate of the connecting lead L1.

[0322] It should be noted that "substantially overlap" includes both absolute overlap and approximate overlap. Specifically, as long as the gap between the orthographic projection boundary of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection boundary of the opening C on the substrate 01 does not exceed an error threshold, the auxiliary connection portion F1 and the opening C can be considered to relatively "overlap." The error threshold can be less than 10% of the length of the line segment containing the opening C.

[0323] FIG23 is a structural diagram of a light-emitting substrate according to still other embodiments.

[0324] In some embodiments, referring to FIG. 23 and combining the orthographic projection of the auxiliary connection portion F1 on the substrate 01 shown in FIG. 20 , the orthographic projection of the line segment having the opening C on the substrate 01 is covered.

[0325] The orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the line segment with the opening C on the substrate 01, including the following two cases:

[0326] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection of the line segment having the opening C on the substrate 01 roughly coincide with each other.

[0327] The second type: the orthographic projection of the line segment having the opening C on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connection portion F1 on the substrate 01 .

[0328] This arrangement allows the auxiliary connection portion F1 to overlap the wire segment with the opening C in a larger area, allowing the auxiliary connection portion F1 to fully repair the wire segment with the opening C, ensuring that the wire segment maintains normal circuit continuity. Furthermore, this ensures sufficient contact between the auxiliary connection portion F1 and the wire segment with the opening C, which helps improve the stability of the connection between the auxiliary connection portion F1 and the connecting lead L1.

[0329] It should be noted that "substantially overlap" includes both absolute overlap and approximate overlap. Specifically, the floating range of the gap between the orthographic projection boundary of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection boundary of the opening C on the substrate 01 does not exceed an error threshold. Alternatively, the auxiliary connection portion F1 and the edge of the line segment can be considered to relatively "overlap." The error threshold can be less than 10% of the length of the line segment containing the opening C.

[0330] In some embodiments, referring to FIG. 23 and FIG. 21 , the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the connection lead L1 having the opening C on the substrate 01 .

[0331] The orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the connection lead L1 having the opening C on the substrate 01 , including the following two cases:

[0332] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 substantially coincides with the orthographic projection of the connection lead L1 having the opening C on the substrate 01 .

[0333] The second type: the orthographic projection of the connecting lead L1 having the opening C on the substrate 01 is located within the boundary of the orthographic projection of the auxiliary connecting portion F1 on the substrate 01 .

[0334] This arrangement allows for a larger overlap area between the auxiliary connection portion F1 and the connection lead L1 having the opening C. The auxiliary connection portion F1 can be used to fully repair the connection lead L1 having the opening C, ensuring that the connection lead L1 maintains normal circuit continuity. Furthermore, the auxiliary connection portion F1 can be ensured to be in full contact with the connection lead L1 having the opening C, thereby improving the stability of the connection between the auxiliary connection portion F1 and the connection lead L1.

[0335] It should be noted that "substantially overlap" includes both absolute overlap and approximate overlap. Specifically, as long as the gap between the orthographic projection boundary of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection boundary of the connection lead L1 with the opening C on the substrate 01 does not exceed a tolerance threshold, the auxiliary connection portion F1 and the connection lead L1 can be considered to relatively "overlap." The tolerance threshold can be less than 10% of the length of the line segment with the opening C.

[0336] FIG. 24 is a structural diagram of a light-emitting substrate according to yet other embodiments, and FIG. 25 is a cross-sectional diagram taken along line G-G' in FIG. 24 .

[0337] In some embodiments, referring to FIG. 24 and FIG. 25 , and returning to FIG. 3 , the light-emitting substrate 100 further includes a first electrode 20 , which is located on a side of the first major surface S1 away from the second major surface S2 .

[0338] The first electrode 20 can be electrically connected to the light-emitting chip 10 and the first end of the connecting lead L1, respectively, to achieve electrical connection between the connecting lead L1 and the light-emitting chip 10. Subsequently, the connecting lead L1 is electrically connected to the driving circuit board, thereby transmitting the driving signal provided by the driving circuit board to the light-emitting substrate 100 through the connecting lead L1 to control the light-emitting substrate 100 to display.

[0339] When the first end portion of the connecting lead L1 electrically connected to the first electrode 20 includes the opening C, the orthographic projection of the auxiliary connecting portion F1 on the substrate 01 may be set to at least partially overlap with the orthographic projection of the first electrode 20 on the substrate 01 .

[0340] Based on this, the auxiliary connecting portion F1 can be used to fill the opening C and connect to the connecting lead L1, thereby repairing the connecting lead L1 and maintaining normal circuit continuity. At the same time, the area where the auxiliary connecting portion F1 overlaps and contacts the first electrode 20 can also be used for electrical connection, thereby achieving electrical connection between the connecting lead L1 and the first electrode 20. This ensures that the drive signal provided by the driver circuit board can be transmitted to the light-emitting substrate 100 via the connecting lead L1, thereby controlling the light-emitting substrate 100 to display. This can help improve the yield rate of the light-emitting substrate 100.

[0341] In some embodiments, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 at least partially overlaps with the orthographic projection of the first electrode 20 on the substrate 01, including the following two situations:

[0342] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 partially overlaps with the orthographic projection of the first electrode 20 on the substrate 01 .

[0343] If the orthographic projection of the auxiliary connection portion F1 on the substrate 01 overlaps with the orthographic projection of the first electrode 20 on the substrate 01, the area where the auxiliary connection portion F1 and the first electrode 20 overlap can be used for electrical connection, thereby achieving electrical connection between the connecting lead L1 and the first electrode 20. This ensures that the driving signal provided by the driver circuit board can be transmitted to the light-emitting substrate 100 via the connecting lead L1 to control the light-emitting substrate 100 to display. This can help improve the yield rate of the light-emitting substrate 100.

[0344] The second type: the orthographic projection of the auxiliary connecting portion F1 on the substrate 01 covers the orthographic projection of the first electrode on the substrate 01 .

[0345] This arrangement allows the auxiliary connection portion F1 and the first electrode 20 to have a larger overlapping area. On the one hand, this allows the auxiliary connection portion F1 to be electrically connected to the first electrode 20, thereby achieving electrical connection between the connection lead L1 and the first electrode 20. On the other hand, it can help improve the stability of the connection between the auxiliary connection portion F1 and the first electrode 20, preventing the auxiliary connection portion F1 from falling off from the first electrode 20, which would cause the connection lead L1 to be disconnected from the first electrode 20.

[0346] The phrase "the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the first electrode 20 on the substrate 01" may include the following two situations: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 substantially overlaps with the orthographic projection of the first electrode on the substrate 01. Alternatively, the orthographic projection of the first electrode on the substrate 01 lies within the boundaries of the orthographic projection of the auxiliary connection portion F1 on the substrate 01. However, this is not a limitation in the present embodiment.

[0347] In some embodiments, please refer to Figures 21 and 22. When the orthographic projection of the auxiliary connection part F1 on the substrate 01 covers the orthographic projection of the first electrode 20 on the substrate 01, the boundary of the orthographic projection of the auxiliary connection part F1 on the substrate 01 can be set, and the first spacing between the boundary of the orthographic projection of the first electrode 20 on the substrate 01 is less than or equal to 10μm.

[0348] When the first spacing between the boundary of the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the boundary of the orthographic projection of the first electrode 20 on the substrate 01 is set to be equal to or close to 10 μm, it can be prevented that the boundary of the auxiliary connection part F1 exceeds the boundary of the first electrode 20 too much, thereby causing other first electrodes 20 adjacent to the first electrode 20 opposite to it to be short-circuited.

[0349] In some examples, a first distance between a boundary of an orthographic projection of the auxiliary connection portion F1 on the substrate 01 and a boundary of an orthographic projection of the first electrode 20 on the substrate 01 is set to be less than or equal to 5 μm.

[0350] When the first spacing between the boundary of the orthographic projection of the auxiliary connection part F1 on the substrate 01 and the boundary of the orthographic projection of the first electrode 20 on the substrate 01 is set to be equal to or close to 5μm, the boundary of the auxiliary connection part F1 can be prevented from exceeding the boundary of the first electrode 20 too much, and space for the auxiliary connection part F1 to overflow glue can also be reserved, thereby preventing the first auxiliary connection part F1 from being too large, resulting in a short circuit between other first electrodes 20 adjacent to the first electrode 20 opposite to it.

[0351] Exemplarily, the first distance between the orthographic projection boundary of the auxiliary connection portion F1 on the substrate 01 and the orthographic projection boundary of the first electrode 20 on the substrate 01 is approximately 3 μm, 5 μm, 8 μm or 10 μm. However, the present disclosure is not limited thereto.

[0352] FIG. 26 is another cross-sectional view taken along line GG′ in FIG. 24 .

[0353] 24, 26 and back to FIG4, the light emitting substrate 100 further includes a second electrode 30. The second electrode 30 is located on a side of the second main surface away from the first main surface S1 and can be electrically connected to the driving circuit board.

[0354] The first end of the connecting lead L1 is electrically connected to the first electrode 20, and the second end of the connecting lead L1 is electrically connected to the second electrode 30. Thus, the driving signal provided by the driving circuit board can be transmitted to the light-emitting substrate 100 through the connecting lead L1 to control the light-emitting substrate 100 to display.

[0355] When the second end portion of the connection lead L1 electrically connected to the second electrode 30 includes the opening C, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 may be set to at least partially overlap with the orthographic projection of the second electrode 30 on the substrate 01 .

[0356] Based on this, the auxiliary connecting portion F1 can be used to fill the opening C and connect to the connecting lead L1, thereby repairing the connecting lead L1 and maintaining normal circuit continuity. At the same time, the area where the auxiliary connecting portion F1 overlaps and contacts the second electrode 30 can also be used for electrical connection, thereby achieving electrical connection between the connecting lead L1 and the second electrode 30. This ensures that the drive signal provided by the driver circuit board can be transmitted to the light-emitting substrate 100 via the connecting lead L1, thereby controlling the light-emitting substrate 100 to display. This can help improve the yield rate of the light-emitting substrate 100.

[0357] In some embodiments, the orthographic projection of the auxiliary connection portion F1 on the substrate 01 at least partially overlaps with the orthographic projection of the second electrode 30 on the substrate 01, including the following two situations:

[0358] The first type: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 partially overlaps with the orthographic projection of the second electrode 30 on the substrate 01 .

[0359] If the orthographic projection of the auxiliary connection portion F1 on the substrate 01 overlaps with the orthographic projection of the second electrode 30 on the substrate 01, the overlapping area of ​​the auxiliary connection portion F1 and the second electrode 30 can be used for electrical connection, thereby achieving electrical connection between the connecting lead L1 and the second electrode 30. This ensures that the driving signal provided by the driver circuit board can be transmitted to the light-emitting substrate 100 via the connecting lead L1 to control the light-emitting substrate 100 to display. This can help improve the yield rate of the light-emitting substrate 100.

[0360] The second type: the orthographic projection of the auxiliary connecting portion F1 on the substrate 01 covers the orthographic projection of the first electrode on the substrate 01 .

[0361] This arrangement allows the auxiliary connection portion F1 and the second electrode 30 to have a larger overlapping area. On the one hand, this allows the auxiliary connection portion F1 to be electrically connected to the second electrode 30, thereby achieving electrical connection between the connection lead L1 and the second electrode 30. On the other hand, it can help improve the stability of the connection between the auxiliary connection portion F1 and the second electrode 30, preventing the auxiliary connection portion F1 from falling off from the second electrode 30 and causing the connection lead L1 to be disconnected from the second electrode 30.

[0362] The phrase "the orthographic projection of the auxiliary connection portion F1 on the substrate 01 covers the orthographic projection of the second electrode 30 on the substrate 01" may include the following two situations: the orthographic projection of the auxiliary connection portion F1 on the substrate 01 substantially overlaps with the orthographic projection of the first electrode on the substrate 01. Alternatively, the orthographic projection of the first electrode on the substrate 01 lies within the boundaries of the orthographic projection of the auxiliary connection portion F1 on the substrate 01. However, this is not a limitation in the present embodiment.

[0363] In some embodiments, the light-emitting substrate 100 may further include a protective layer made of an insulating material. The protective layer covers the connecting lead L1 and the auxiliary connecting portion F1 corresponding to the connecting lead L1. The protective layer has a certain viscosity, so it can be used to help reinforce the connecting portion F1 and the connecting lead L1, improving the stability of the connecting lead L1 in the light-emitting substrate 100 and preventing the connecting lead L1 and the auxiliary connecting portion F1 from falling off. The thickness of the protective layer is greater than the combined thickness of the connecting lead L1 and the auxiliary connecting portion F1, and the surface of the protective layer is flat at all locations. Based on this, the yield rate of the light-emitting substrate 100 is improved.

[0364] In some examples, the material of the protective layer can be at least one of a transparent optical adhesive (OC adhesive) and a fluorinating agent. However, the embodiments of the present disclosure are not limited thereto.

[0365] In addition, in each of the above embodiments, the opening is formed by the connecting lead L1 due to bumps, scratches or natural falling off, and is not an opening deliberately made by humans. For example, the area where the connecting lead L1 is located may have an opening in an area of ​​about 10% or less. Based on this, an auxiliary connection part F1 is added to the light-emitting substrate 100 to repair the fallen connecting lead L1. However, the present disclosure is not limited to this. It is understandable that in other embodiments, after the connecting lead L1 is formed, it is considered that an opening C is formed in the connecting lead L1, and at least part of the auxiliary connection part F1 is set to be located in the opening C, and the auxiliary connection part F1 is set to be electrically connected to the connecting lead L1. Based on this, the auxiliary connection part F1 can be used to replace the structure of the opening area of ​​the connecting lead L1. Furthermore, based on the above structure, the auxiliary connection part F1 can be used to adjust other characteristics such as the resistance of the connecting lead L1.

[0366] In summary, the methods for forming the opening in the connecting lead L1 in the embodiment of the present disclosure may include the above two situations. The first one is non-human operation, and the opening C is formed by the natural falling off of the connecting lead L1. Exemplarily, the opening C is generally irregular in shape. However, the shape of the opening C is not limited thereto, and may also be a regular shape. For example, a square, a circle, a triangle, etc. The second one is human operation, and the opening C is formed in the connecting lead L1 by means of cutting, etching, etc. Exemplarily, the shape of the opening C is generally regular in shape. For example, a square, a circle, a triangle, etc. However, the shape of the opening C is not limited thereto, and may also be an irregular shape.

[0367] FIG. 27 is a flow chart of a method for manufacturing a light-emitting substrate according to some embodiments.

[0368] Please refer to FIG. 27 . Some embodiments of the present disclosure provide a method for manufacturing a light-emitting substrate 100, which is used to manufacture the light-emitting substrate 100 as described in any of the above embodiments. The light-emitting substrate 100 includes a display area and a peripheral area located on at least one side of the display area. Returning to FIG. 3 , the light-emitting substrate 100 includes a display area (full name in English: Active Area, referred to as AA area; also referred to as an effective display area) AA and a peripheral area SA. The peripheral area SA is located on at least one side of the display area AA (for example, one side; for example, all four sides, i.e., including the upper and lower sides and the left and right sides).

[0369] The preparation method includes:

[0370] S01: providing a substrate, the substrate comprising a first main surface and a second main surface opposite to each other in a thickness direction of the substrate, and a side surface between the first main surface and the second main surface, the side surface comprising a set side surface corresponding to a peripheral area.

[0371] S02: forming a plurality of connecting leads in a peripheral region of the substrate, wherein the plurality of connecting leads extend from the first main surface through a predetermined side surface to the second main surface, wherein at least one of the plurality of connecting leads includes at least one opening.

[0372] In step S02 , returning to FIG. 5 , after forming a plurality of connecting leads L1 in the peripheral area SA of the substrate 01 , a circuit breakage test is performed on the light-emitting substrate 100 . At least some of the connecting leads L1 in the light-emitting substrate 100 are broken.

[0373] The inventors have found that the main reason for the low yield of the connecting lead L1 is that the existing manufacturing process cannot meet the environmental cleanliness requirements of the connecting lead L1, which will cause the connecting lead L1 to partially fall off and form an opening C. The existence of the opening C affects the yield of the connecting lead L1.

[0374] For example, the connecting lead L1 may experience spot-like, edge-like, or large-area detachment, all of which may result in openings C of varying shapes and sizes on the connecting lead L1. Regardless of the type of opening C, the quality of the connecting lead L1 is reduced, thereby reducing the yield rate of the connecting lead L1.

[0375] Based on the above problems, the manufacturing method of the light-emitting substrate 100 provided in the embodiment of the present disclosure further includes:

[0376] S03: Returning to FIG6 and FIG7 , an auxiliary connection portion is formed on a side of the connection lead away from the substrate, at least a portion of the auxiliary connection portion is located in the opening, and the auxiliary connection portion is connected to the connection lead where the opening is located.

[0377] In step S03, returning to Figures 8 and 9, when it is found that an opening C is formed on the connecting lead L1 after the short circuit test, an auxiliary connecting portion F1 can be formed at the position of the opening C to set at least part of the auxiliary connecting portion F1 in the opening C, and the auxiliary connecting portion F1 is used to connect the connecting lead L1 where the opening C is located.

[0378] Based on this, the auxiliary connection portion F1 can be used to repair the opening C formed by the connection lead L1 due to detachment. In other words, the auxiliary connection portion F1 can replace the detached portion of the connection lead L1, so that the connection lead L1 can maintain normal circuit continuity. This can help improve the yield rate of the connection lead L1.

[0379] In some examples, one auxiliary connection part F1 can be used to repair one opening C. In other examples, one opening C can be repaired using multiple auxiliary connection parts F1. Exemplarily, multiple auxiliary connection parts F1 are arranged along the length direction of the opening C so that the multiple auxiliary connection parts F1 are all set within the opening C. In some other examples, one auxiliary connection part F1 can be used to repair multiple adjacent openings C. Exemplarily, when the connecting lead L1 has multiple openings C arranged along a certain direction, an auxiliary connection part F1 extending along the direction can be provided to fill multiple openings C with the auxiliary connection part F1. However, the embodiments of the present disclosure are not limited to this. In the following, the example of repairing one opening C with one auxiliary connection part F1 is used for description.

[0380] In summary, the embodiments of the present disclosure provide a light-emitting substrate 100. When an opening C is found in a connecting lead L1, an auxiliary connecting portion F1 can be formed at a location corresponding to the opening C, so that at least a portion of the auxiliary connecting portion F1 is disposed within the opening C. The auxiliary connecting portion F1 is then used to connect to the connecting lead L1 where the opening C is located. This allows the auxiliary connecting portion F1 to replace the portion of the connecting lead L1 that has fallen off, ensuring that the connecting lead L1 maintains normal circuit continuity. This can help improve the yield rate of the connecting lead L1.

[0381] In some embodiments, please continue to refer to FIG. 23 and FIG. 5 . In step S02 , forming a plurality of connecting leads in the peripheral region of the substrate may include forming the plurality of connecting leads on the substrate using a sputtering process (PVD Sputter).

[0382] In some examples, this step may include:

[0383] A protection layer is formed on the substrate 01 , covering the display area AA and exposing the peripheral area SA.

[0384] A metal layer is formed in the peripheral area SA exposed by the protective layer by a sputtering process (PVD Sputter), and the metal line is patterned to form a plurality of connecting leads L1.

[0385] For example, the metal layer may be laser etched to form a plurality of connecting leads L1 .

[0386] In other examples, this step may include:

[0387] A mask is provided, wherein the mask includes openings, wherein the openings of the mask correspond to shapes of a plurality of connecting leads.

[0388] A plurality of connecting leads L1 are formed on the substrate 01 by a sputtering process (PVD Sputter) using a mask.

[0389] Regardless of the aforementioned methods for forming the connecting lead L1, all are formed using a sputtering process (PVD sputter). The inventors have discovered that the sputtering process (PVD sputter) requires a high degree of cleanliness in the working environment to ensure the adhesion of the formed metal layer. However, existing methods fail to meet this cleanliness requirement. Consequently, the connecting lead L1 formed using the sputtering process (PVD sputter) is prone to partial detachment, affecting the yield of the connecting lead L1.

[0390] Based on this, in step S03, forming an auxiliary connection portion on the side of the connecting lead away from the substrate can include: using a three-dimensional printing process to form an auxiliary connection portion on the side of the connecting lead away from the substrate, so that at least part of the auxiliary connection portion F1 is set in the opening C, and using the auxiliary connection portion F1 to connect the connecting lead L1 where the opening C is located.

[0391] Based on this, the auxiliary connector F1 can be used to repair the opening C formed by the connection lead L1 due to detachment. In other words, the auxiliary connector F1 can replace the detached portion of the connection lead L1, allowing the connection lead L1 to maintain normal circuit continuity. This can help improve the yield rate of the connection lead L1. Furthermore, by using a 3D printing process to form the auxiliary connector F1, it can be precisely formed at the location of the opening C in the connection lead L1, improving the accuracy of the auxiliary connector F1's positioning.

[0392] However, the embodiments of the present disclosure are not limited thereto, and other processes that can achieve targeted repair may also be used.

[0393] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting substrate, comprising: A display area and a peripheral area located on at least one side of the display area; The light-emitting substrate further comprises: A substrate, comprising a first main surface and a second main surface opposite to each other in a thickness direction of the substrate, and a side surface between the first main surface and the second main surface, wherein the side surface comprises a set side surface corresponding to the peripheral area; a plurality of connecting leads, located on the substrate and extending from the first main surface through the set side surface to the second main surface, the plurality of connecting leads being located in the peripheral area; at least one connecting lead of the plurality of connecting leads comprising at least one opening; and, An auxiliary connection portion, at least a portion of which is located in the opening, and the auxiliary connection portion is connected to a connection lead where the opening is located.

2. The light-emitting substrate according to claim 1, wherein: The auxiliary connection portion is located in the opening, and the auxiliary connection portion abuts against an edge of the connection lead forming the opening.

3. The light-emitting substrate according to claim 1, wherein: The auxiliary connecting portion includes a main body portion and at least one overlapping portion connected to the main body portion; The main body is located in the opening, the overlapping portion is located on a side of the connecting lead away from the substrate, and the overlapping portion contacts the side of the connecting lead away from the substrate.

4. The light-emitting substrate according to claim 3, wherein: In a direction from the main body to the overlapping portion, a width of the overlapping portion is greater than or equal to 10 μm.

5. The light emitting substrate according to any one of claims 1 to 4, wherein The connecting lead comprises three line segments connected in sequence, and at least one line segment of the three line segments in the connecting lead comprises the at least one opening; wherein the three line segments are respectively a first line segment located on the first main surface, a third line segment located on the set side surface, and a second line segment located on the second main surface; The auxiliary connection portion is located on the line segment having the opening, and along the extending direction of the line segment having the opening, the length of the auxiliary connection portion is less than or equal to the length of the line segment having the opening.

6. The light emitting substrate according to any one of claims 1 to 5, wherein Along the extending direction of the connecting lead having the opening, the length of the auxiliary connecting portion is less than or equal to the length of the connecting lead having the opening.

7. The light-emitting substrate according to any one of claims 1 to 6, wherein In a direction along the width of the connecting lead, a ratio of a width of the auxiliary connecting portion located in the opening to a width of the opening is greater than or equal to 50%.

8. The light-emitting substrate according to any one of claims 1 to 7, wherein The width of the auxiliary connection portion ranges from 50 μm to 100 μm.

9. The light-emitting substrate according to any one of claims 1 to 8, wherein The ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion on the substrate and the orthographic projection of the opening on the substrate to the area of ​​the orthographic projection of the opening on the substrate is greater than or equal to 50%.

10. The light emitting substrate according to any one of claims 1 to 9, wherein The ratio of the overlapping area of ​​the orthographic projection of the auxiliary connection portion on the substrate and the orthographic projection of the connection lead having the opening on the substrate to the orthographic projection area of ​​the opening on the substrate is greater than or equal to 80%.

11. The light emitting substrate according to any one of claims 1 to 10, wherein At least two of the auxiliary connecting parts are located in the same opening.

12. The light-emitting substrate according to any one of claims 1 to 11, further comprising a first electrode, wherein the first electrode is located on a side of the first main surface away from the second main surface; The first end of the connecting lead is electrically connected to the first electrode, the first end includes the opening, and the orthographic projection of the auxiliary connecting portion on the substrate covers the orthographic projection of the first electrode on the substrate.

13. The light emitting substrate according to claim 12, wherein: A first distance between a boundary of an orthographic projection of the auxiliary connection portion on the substrate and a boundary of an orthographic projection of the first electrode on the substrate is less than or equal to 5 μm.

14. The light emitting substrate according to any one of claims 1 to 13, wherein The square resistance of the auxiliary connection portion is less than or equal to the square resistance of the connection lead.

15. The light emitting substrate according to any one of claims 1 to 14, wherein The thickness of the auxiliary connection portion ranges from 5 μm to 20 μm.

16. The light emitting substrate according to any one of claims 1 to 15, wherein The material of the auxiliary connection part includes conductive glue.

17. The light emitting substrate according to any one of claims 1 to 16, wherein The material of the connecting lead includes metal.

18. A method for manufacturing a light-emitting substrate, wherein: The light-emitting substrate comprises a display area and a peripheral area located on at least one side of the display area, and the manufacturing method comprises: Providing a substrate, the substrate comprising a first main surface and a second main surface opposite to each other in a thickness direction of the substrate, and a side surface located between the first main surface and the second main surface, the side surface comprising a set side surface corresponding to the peripheral area; A plurality of connecting leads are formed in the peripheral region of the substrate, and the plurality of connecting leads extend from the first main surface through the set side surface to the second main surface; wherein at least one connecting lead among the plurality of connecting leads includes at least one opening; An auxiliary connection portion is formed on a side of the connection lead away from the substrate, at least a portion of the auxiliary connection portion is located in the opening, and the auxiliary connection portion is connected to the connection lead where the opening is located.

19. The method according to claim 18, wherein: The forming of a plurality of connecting leads in the peripheral region of the substrate comprises: forming the plurality of connecting leads on the substrate by a sputtering process; The auxiliary connection portion is formed on a side of the connection lead away from the substrate, comprising: The auxiliary connection part is formed on the side of the connecting lead away from the substrate by a three-dimensional printing process so that at least part of the The auxiliary connection portion is located in the opening, and the auxiliary connection portion is connected to a connection lead where the opening is located.

20. A display device comprising the light-emitting substrate according to any one of claims 1 to 17.

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