Method for manufacturing probe head produced by stacking probe pins and combined with space transformer by using anisotropic conductive film

Abstract

The present invention relates to a probe head manufacturing method and, specifically, to a probe head manufacturing method in which the pitch between pins can be finely adjusted through stacking of the probe pins and the length and shape of the probe pins can be freely formed. The probe head manufacturing method according to one embodiment of the present invention comprises a first photoresist formation step (S10), a first elastic layer formation step (S20), a hollow portion formation step (S30), a first pin formation step (S40), a second elastic layer lamination step (S50), a layer lamination step (S60), a second photoresist formation step (S70), a sacrificial layer removal step (S80), and a space transformer coupling step (S90). According to the present invention, the provided probe head manufacturing method enables a probe head having pitches at fine intervals to be manufactured, the probe head that can simultaneously inspect a plurality of devices to be provided, and the shape of the probe pin to be easily and freely formed.

Description

A method for manufacturing a probe head manufactured by stacking probe pins and bonding them with a space converter and an anisotropic conductive film.

[0001] The present invention relates to a method for manufacturing a probe head, and more particularly, to a method for manufacturing a probe head in which the pitch between pins can be finely adjusted by stacking probe pins, the length and shape of the probe pins can be freely formed, and a space converter is connected using an anisotropic conductive film.

[0002]

[0003] After an electrical device is manufactured, there is a need to connect testing equipment to the device to inspect its electrical characteristics. While inspection can be accomplished simply by connecting the equipment to the device's electrodes, manual inspection during the production of multiple products is time-consuming and costly. Therefore, probe heads that mechanically contact the device to provide electrical connection have been developed and are being used.

[0004] As technology advances, the integration of electrical circuits increases and the size of electrical devices shrinks day by day, and the size and spacing of electrodes are also reduced to units of sub-micrometers, the corresponding probe heads also need to be reduced to microscopic sizes.

[0005] However, since the probe pins of the probe head manufactured using existing technology are manufactured by growing the probe pins in the longitudinal direction, there is a problem in that it is difficult to freely manufacture the shape of the probe pins and it is difficult to form a fine pitch, which is the gap between the probe pins.

[0006] [Patent Document]

[0007] Prior Document 1: Republic of Korea Utility Model Registration No. 20-0458537 (registered on February 3, 2012)

[0008] Prior Document 2: Republic of Korea Utility Model Registration No. 20-0399963 (registered on October 24, 2005)

[0009]

[0010] The technical object of the present invention is to manufacture a probe head having a fine pitch.

[0011] Another technical object of the present invention is to provide a probe head capable of inspecting multiple devices simultaneously.

[0012] Another technical object of the present invention is to provide a method for manufacturing a probe head that is easy to freely form the shape of a probe pin.

[0013] Another technical object of the present invention is to easily combine a probe head and a space transducer with an anisotropic conductive film.

[0014]

[0015] The present invention comprises a first elastic layer forming step for forming a first elastic layer;

[0016] A method for manufacturing a probe head is provided, comprising: a first pin forming step of forming one or more first probe pins on an upper surface of a first elastic layer; and a second elastic layer laminating step of forming a second elastic layer over the first elastic layer on which the first probe pins are formed.

[0017] In addition, a method for manufacturing a probe head is provided, characterized in that it includes a second pin forming step of forming one or more second probe pins on the upper surface of the second elastic layer.

[0018] In addition, a method for manufacturing a probe head is provided, characterized in that it further includes a layer lamination step of repeatedly laminating layers composed of a pin layer and an elastic layer by repeating the first pin forming step and the second elastic layer lamination step a predetermined number of times.

[0019] In addition, the first pin forming step provides a method for manufacturing a probe head, characterized in that the first probe pins are formed in a manner in which they are arranged in parallel on a plane of the upper surface of the first elastic layer.

[0020] In addition, the first pin forming step provides a probe head manufacturing method characterized in that a second gap between the ends of the first probe pins is larger than a first gap between the ends of the first probe pins, and the first probe pins are formed in a shape in which the first ends and the other ends are connected to each other.

[0021] In addition, in the first paragraph, the first pin forming step provides a method for manufacturing a probe head, characterized in that one end and the other end of the first probe pin have a rod shape, and the center has a shock absorbing structure that absorbs shock.

[0022] In addition, the first elastic layer forming step and the second elastic layer laminating step provide a probe head manufacturing method characterized in that an elastic sacrificial layer is formed at the positions of both ends of the first probe pins.

[0023] In addition, a method for manufacturing a probe head is provided, characterized in that it further includes a first photoresist forming step of forming a first photoresist including a first sacrificial layer at positions of both ends of the first probe pins before the first elastic layer forming step, and a second photoresist forming step of forming a second photoresist including a second sacrificial layer at positions of both ends of the first probe pins after the second elastic layer laminating step.

[0024] In addition, a method for manufacturing a probe head is provided, characterized in that it further includes a sacrificial layer removal step of removing an elastic sacrificial layer, a first sacrificial layer, and a second sacrificial layer.

[0025] In addition, the first elastic layer forming step is performed on the upper surface of the substrate, and a method for manufacturing a probe head is provided, characterized in that it further includes a hollow forming step of forming one or more hollows on the lower surface of the substrate before or after the first elastic layer forming step.

[0026] In addition, a method for manufacturing a probe head is provided, characterized in that after the sacrificial layer removal step, a space converter coupling step for coupling a probe head and a space converter is further included, and the space converter includes a plurality of space converter electrodes connected to the other ends of the first probe pins on one surface of the space converter.

[0027] In addition, the space converter provides a method for manufacturing a probe head, characterized in that an anisotropic conductive film is provided on the surface where the other end of the first probe pins and the space converter are in contact, so that the first probe pins and a plurality of the space converter electrodes provided on the space converter are electrically connected.

[0028]

[0029] According to the present invention, a probe head having a fine pitch can be manufactured.

[0030] Additionally, a probe head capable of inspecting multiple devices simultaneously can be provided.

[0031] In addition, a method for manufacturing a probe head that is easy to freely form the shape of a probe pin can be provided.

[0032] Additionally, the probe head and space converter can be easily combined and insulation can be secured using an anisotropic conductive film.

[0033]

[0034] FIG. 1 is a drawing showing a probe head according to a method for manufacturing a probe head according to one embodiment of the present invention.

[0035] FIG. 2 is a perspective view showing a probe head according to one embodiment of the present invention.

[0036] Figure 3 is a flowchart showing a method for manufacturing a probe head according to one embodiment of the present invention.

[0037] Figure 4 is a perspective view showing a probe head according to one embodiment of the present invention.

[0038] FIG. 5 is a drawing showing the formation of a substrate sacrificial layer according to one embodiment of the present invention.

[0039] FIG. 6 is a drawing showing a first photoresist forming step according to one embodiment of the present invention.

[0040] FIG. 7 is a drawing showing a step of forming a first sacrificial layer on a first photoresist according to one embodiment of the present invention.

[0041] FIGS. 8 to 13 are drawings showing a first elastic layer forming step of forming an elastic sacrificial layer according to one embodiment of the present invention.

[0042] FIG. 14 is a drawing showing a first pin forming step according to one embodiment of the present invention.

[0043] Figure 15 is a drawing showing a second elastic layer forming step in one embodiment of the present invention.

[0044] Fig. 16 is a drawing showing multiple layers stacked through a layer stacking step according to one embodiment of the present invention.

[0045] FIG. 17 is a drawing showing a second photoresist formation step according to one embodiment of the present invention.

[0046] Figure 18 is a drawing showing a sacrificial layer removal step according to one embodiment of the present invention.

[0047] Fig. 19 is a drawing showing a probe pin formed on a plane according to one embodiment of the present invention.

[0048] FIG. 20 is a drawing showing a probe pin including a shock absorbing structure according to one embodiment of the present invention.

[0049] Figure 21 is a drawing showing a hollow formation step according to one embodiment of the present invention.

[0050] Figure 22 is a perspective view from below of a substrate in which a hollow formation step has been performed according to one embodiment of the present invention.

[0051] Fig. 23 is a perspective view showing a space converter according to one embodiment of the present invention combined with a probe head.

[0052] FIG. 24 is a cross-sectional view showing a space converter according to one embodiment of the present invention combined with a probe head.

[0053] Figure 25 is a drawing showing the start of a space converter coupling step according to one embodiment of the present invention.

[0054] Fig. 26 is a drawing showing a space converter combining step performed according to one embodiment of the present invention.

[0055]

[0056] A method for manufacturing a probe head is provided, comprising: a first elastic layer forming step of forming a first elastic layer; a first pin forming step of forming one or more first probe pins on an upper surface of the first elastic layer; and a second elastic layer laminating step of forming a second elastic layer over the first elastic layer on which the first probe pins are formed.

[0057]

[0058] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments disclosed below. Furthermore, in order to clearly disclose the present invention in the drawings, parts unrelated to the present invention have been omitted, and identical or similar symbols in the drawings represent identical or similar components.

[0059] The purpose and effects of the present invention can be naturally understood or made clearer by the following description, and the purpose and effects of the present invention are not limited to the following description alone.

[0060] The purpose, features, and advantages of the present invention will become more apparent through the following detailed description. Furthermore, in describing the present invention, detailed descriptions of known technologies related to the present invention will be omitted if they are deemed to unnecessarily obscure the gist of the invention. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0061] FIG. 1 is a drawing showing a probe head according to a method for manufacturing a probe head according to an embodiment of the present invention. FIG. 2 is a drawing showing a perspective view of a probe head according to an embodiment of the present invention. FIG. 3 is a flowchart showing a method for manufacturing a probe head according to an embodiment of the present invention. FIG. 4 is a perspective view showing a probe head according to an embodiment of the present invention. Referring to FIGS. 1 to 4, a method for manufacturing a probe head (10) according to an embodiment of the present invention includes a first photoresist forming step (S10), a first elastic layer forming step (S20), a hollow forming step (S30), a first pin forming step (S40), a second elastic layer laminating step (S50), a layer laminating step (S60), a second photoresist forming step (S70), and a sacrificial layer removing step (S80). Each step will be described in detail below.

[0062] FIG. 4 is a perspective view showing a probe head (10) according to one embodiment of the present invention. Referring to FIG. 4, the probe head (10) may include a plurality of probe pins, and may include a first photoresist (300) and a second photoresist (700) above and below the plurality of probe pins. At this time, the longitudinal direction of the probe pins is defined as the y-axis direction, and the pin layer is laminated in the vertical direction of the substrate (100). This vertical direction of the substrate (100) is defined as the z-axis direction, and a plurality of probe pins may be provided in a direction parallel to each other in the pin layer. The direction in which the probe pins are arranged in the pin layer is defined as the x-axis direction. Meanwhile, FIGS. 5 to 18 are cross-sectional views viewed in the direction of the arrows in FIG. 3 and are drawings for explaining the lamination process, and FIGS. 19 and 20 are drawings viewed from the z-axis direction.

[0063] The substrate sacrificial layer forming step is a step of forming a substrate sacrificial layer (200) on the substrate (100). Referring to FIG. 5, it can be seen that the substrate sacrificial layer (200) is formed on the substrate (100) by performing the substrate sacrificial layer forming step. At this time, the substrate (100) can be provided with various types of wafers, and the substrate sacrificial layer (200) is a sacrificial layer that is ultimately removed to separate the probe head (10) from the substrate (100), so it can be provided with various materials used as the sacrificial layer, but in one embodiment of the present invention, it is described based on the case where it is provided with aluminum.

[0064] When the substrate sacrificial layer (200) is prepared in this way, the probe head (10) can be separated from the substrate (100) through a final sacrificial layer removal step (S80), and components for forming the probe head (10) can be laminated on top of the substrate sacrificial layer (200).

[0065] Meanwhile, the substrate sacrificial layer formation step described above may be performed before the first photoresist formation step, and such substrate sacrificial layer may be removed by utilizing a cavity formed in the substrate through a cavity formation step (S30), as will be described later.

[0066] The first photoresist formation step (S10) is performed between the substrate sacrificial layer formation step and the first elastic layer formation step (S20), and is a step of coating the first photoresist (300) on the substrate sacrificial layer (200). The first photoresist forming step (S10) includes a step of coating a photoresist on a substrate sacrificial layer (200) and a step of forming a first sacrificial layer (310). FIG. 6 is a step of coating a first photoresist (300) on a substrate sacrificial layer (200), and FIG. 7 shows an exposed area in the center of the first photoresist (300) and non-exposed areas at both ends. After coating the first photoresist (300), the first photoresist (300) is exposed to light in the exposed area to harden the first photoresist (300), so that the first photoresist (300) composed only of the first photoresist (300) in FIG. 6 is formed by being divided into a first photoresist (300) in the center and a first sacrificial layer (310) on both sides, as shown in FIG. 7.

[0067] At this time, the first photoresist (300) may be formed by repeating the coating step at least once to form multiple layers of the first photoresist (300) to a desired thickness, or a method of thickly coating a single photoresist may be used. However, the method of coating multiple layers is advantageous because it allows the first photoresist (300) to be formed efficiently in various thicknesses.

[0068] Meanwhile, although various types of the photoresist described above can be used, one embodiment of the present invention is described based on the use of an epoxy-based negative photoresist made of SU-8, and when a positive photoresist is used, the same result can be obtained by performing the steps by reversing the above-described exposure area and non-exposure area.

[0069] In this way, by providing the first photoresist (300) through the first photoresist formation step (S10), the first probe pin (500) to be laminated in the future can be protected, the thickness of the first photoresist (300) can be efficiently controlled, and finally, the unexposed portion can be removed so that both ends of the first probe pin (500) protrude.

[0070] The first elastic layer formation step (S20) is a step of depositing an elastic layer (400) on a substrate (100).

[0071] The first elastic layer formation step (S20) is divided into an elastic sacrificial layer (410) preparation step and a deposition step, and the elastic sacrificial layer (410) preparation step is a step of providing an elastic sacrificial layer (410) that serves as a basis for performing the subsequent elastic sacrificial layer formation step. Referring to FIGS. 8 and 9, which illustrate the elastic sacrificial layer (410) preparation step, FIG. 8 is a drawing showing that the elastic sacrificial layer (410) has been deposited, and FIG. 9 illustrates that the elastic sacrificial layer (410) of the above-described exposure area is etched to leave only the elastic sacrificial layer (410) of the non-exposure area.

[0072] Afterwards, a deposition step is performed to deposit the first elastic layer (400). Fig. 10 shows a state in which the first elastic layer (400) is deposited. Referring to this, when the first elastic layer (400) is deposited through the deposition step, the first elastic layer (400) is covered over the elastic sacrificial layer (410) and the first photoresist (300).

[0073] Meanwhile, the first elastic layer forming step (S20) may deposit the first elastic layer (400) on the substrate (100) or may only have the first elastic layer (400) alone. If the substrate sacrificial layer forming step is performed before the first elastic layer forming step (S20), the first elastic layer (400) may be deposited on the substrate sacrificial layer (200). If other steps are performed in advance, the first elastic layer (400) may be deposited on the structure provided on the substrate (100) after the steps are performed.

[0074] The elastic sacrificial layer forming step is a step of forming a sacrificial layer at one end of the first elastic layer (400). However, the elastic sacrificial layer forming step may form a sacrificial layer not only at one end of the first elastic layer (400) but also at the other end, so that elastic sacrificial layers (410) may be provided at both ends. FIGS. 10 to 13 are written based on forming a sacrificial layer at both ends, and the following description will be based on forming a sacrificial layer at one end.

[0075] Fig. 10 is a drawing showing a state in which the first elastic layer forming step (S20) is completed, and Figs. 11 to 13 are drawings showing that the elastic sacrificial layer forming step is sequentially performed. Fig. 11 shows that the elastic layer photoresist (420) is deposited on the exposed area of ​​the first elastic layer (400). Thereafter, when dry etching is performed, the elastic layer photoresist (420) and the first elastic layer (400) are etched together, and when the first elastic layer (400) in the non-exposed area is completely etched and the elastic sacrificial layer (410) is exposed, an etch stop is performed to form a shape as shown in Fig. 12. Next, the elastic sacrificial layer (410) is deposited until the heights of the first elastic layer (400) and the elastic sacrificial layer (410) become the same, and then lift-off is performed to remove the elastic layer photoresist (420), thereby forming a shape in which the heights of the first elastic layer (400) and the elastic sacrificial layer (410) become the same, as shown in FIG. 13.

[0076] Meanwhile, the elastic sacrificial layer (410) may be formed of various materials or substances capable of forming a sacrificial layer, but in one embodiment of the present invention, it is described based on the case where it is formed of aluminum, and when the elastic sacrificial layer (410) is formed in the non-exposed area in this way, the non-exposed area can be finally removed to allow both ends of the probe pin to protrude.

[0077] The first pin forming step (S40) is a step of forming a pin layer by depositing a plurality of first probe pins (500) on a plane of the upper surface of the first elastic layer (400). Referring to FIG. 14, it can be confirmed that a plurality of pins are formed on the plane of the upper surface of the first elastic layer (400), and in detail, a plurality of first probe pins (500) are arranged in parallel in the y-axis direction with the x-axis direction as the longitudinal direction to form one layer, thereby becoming a probe pin layer. The first pin forming step (S40) in which the probe pins are arranged can form a pin layer composed of a plurality of first probe pins (500) through an etching or lift-off process.

[0078] Meanwhile, referring to FIGS. 19 and 20, the shape of the first probe pin (500) can be provided in various patterns, such as the first probe pin (500) being bent or curved when viewed from above on the z-axis, and since a plurality of first probe pins (500) are deposited in a manner of arranging them in a longitudinal direction on a plane, the shape of the first probe pin (500) can be easily modified. In addition, since the pins are formed on a plane, the spacing between the pins can be freely adjusted, and it is easy to implement a fine pitch.

[0079] At this time, Fig. 19 shows an example of how the shape of the pin can be configured in various ways in the first pin forming step, and a probe head can be manufactured in which the second gap (520), which is the gap between the ends of the first probe pins (500), is larger than the first gap (510) between the ends of the first probe pins (500), and the first probe pins (500) are formed in a shape in which the ends and the other ends are connected to each other. At this time, one end and the other end of the first probe pin (500) can have a section formed as a partial straight line, which is to absorb the impact by receiving a vertical force when making vertical contact when making contact with the inspection equipment or the inspection target, and the structure between one end and the other end can be made different to absorb the impact. At this time, referring to Fig. 19, one end and the other end are connected diagonally similar to a cantilever structure, and through this, the force can be distributed when a vertical force is received. However, it is not limited to the example in Fig. 19, and one end and the other end of the first probe pin (500) having various shapes and different intervals can be connected. In addition, if the interval between the first probe pins (500) is formed narrow at one end and wide at the other end in this way, even if a narrow pitch is formed at one end to contact the inspection target, the other end has a wide interval, making it easy to connect the probe pin to inspection equipment, etc.

[0080] In addition, referring to FIG. 20, the first probe pin (500) may be formed to have one end and the other end in a rod shape, while having a center portion that has a shock absorbing structure (540) that absorbs shock. The shock absorbing structure (540) is a structure that utilizes various shapes to absorb the shock received when the first probe pin (500) comes into contact with the inspection target, and since the first probe pin (500) is formed on a plane, it is possible to have structures of various shapes. Referring to FIG. 20, various shapes possible for the shock absorbing structure (540) are given as examples, but the present invention is not limited thereto, and various shapes capable of efficiently absorbing shock may be formed on the first probe pin (500).

[0081] Fig. 15 is a drawing showing that a second elastic layer laminating step (S50) is performed on a pin layer according to one embodiment of the present invention. The second elastic layer laminating step (S50) is a step of laminating a second elastic layer (600) by repeating the same method as the first elastic layer forming step (S20) described above, and a first probe pin (500) is placed on the first elastic layer and a second elastic layer is laminated thereon, so that the first elastic layer (400) and the second elastic layer (600) form one elastic layer that surrounds the first probe pin (500).

[0082] In this way, when the second elastic layer (600) is provided, the first probe pin (500) is wrapped so that the pin layer is not exposed to the outside, and the elastic layer wraps around the first probe pin (500), so that the first probe pin (500) can be protected and insulated from the outside, and when the first probe pin (500) surrounded by the elastic layer receives an external force, the force can be distributed to prevent damage to the first probe pin (500).

[0083] However, referring to FIGS. 1 and 2, it can be confirmed that a second pin formation step of forming one or more second probe pins (550) on the upper surface of the second elastic layer (600) after stacking the second elastic layer (600) has been performed. Unlike the layer stacking step (S60) which will be described later, this step is terminated after forming the second probe pin (550). If the second elastic layer stacking step (S50) is repeated after the second pin formation step, layers can be stacked in the same manner as the layer stacking step (S60). However, when forming the second probe pin (550) in this way, it can be utilized in various ways, such as stacking a new layer on top of the second probe pin (550) or combining a joinable part, and it is also possible to end the step in a state where the probe pins are formed on multiple layers by forming the second probe pin (550) after the layer stacking step (S60).

[0084] FIG. 16 is a drawing showing that multiple layers are stacked through a layer stacking step (S60) according to one embodiment of the present invention. Referring to FIG. 16, one embodiment of the present invention may further include a layer stacking step (S60) of repeatedly stacking layers composed of pin layers and elastic layers by repeating the first pin forming step (S40) and the second elastic layer stacking step (S50) a predetermined number of times. FIG. 16 shows a shape in which, after the second elastic layer stacking step (S50), the first pin forming step (S40) and the second elastic layer stacking step (S50) are repeated twice to add a total of two layers, resulting in three layers including the previously formed first layer. Meanwhile, looking at the arrangement of the probe pins provided in the probe head (10), if the number of pins arranged parallel to the x-axis direction forms the number of rows, the total number of pin layers stacked by repeating the layer stacking step (S60) a predetermined number of times in the z-axis forms the number of columns. That is, since the number of predetermined times in the layer stacking step (S60) determines the number of rows or columns of the probe head (10), it is determined by considering the number of rows or columns of the probe head (10) to be manufactured.

[0085] As described above, after the first pin forming step (S40), the second elastic layer lamination step (S50) is performed so that the elastic layer surrounds the pin. At this time, when the pin layers are laminated in the z-axis direction through the first pin forming step (S40) and the second elastic layer lamination step (S50), the thickness of the second elastic layer (600) deposited between the pins determines the pitch between the pins, and by adjusting the thickness of the second elastic layer (600), the spacing between the pins can be adjusted, and a fine pitch can be formed.

[0086] Meanwhile, referring to Fig. 17, when a plurality of pin layers are laminated as described above, a second photoresist forming step (S70) may be further included, and the second photoresist forming step (S70) is a step of coating a second photoresist (700) on the elastic layer. Fig. 17 is a drawing showing a state in which the second photoresist forming step (S70) is performed, and a second photoresist (700) and a second sacrificial layer (710) are laminated on the elastic layer.

[0087] The second photoresist forming step (S70) is formed through the same process as the first photoresist forming step (S10) described above, and the probe head (10) may be equipped with both the first photoresist (300) and the second photoresist (700) or neither, or may be equipped with only one of the first photoresist (300) or the second photoresist (700).

[0088] In this way, if the second photoresist (700) is provided by further including the second photoresist forming step (S70), the probe pin can be protected from external impact, and if both the first photoresist (300) and the second photoresist (700) are provided, the first and second photoresists (700) are formed at both ends of the probe head (10) in the z-axis direction, so that the probe pin can be efficiently protected from external impact, etc.

[0089] The sacrificial layer removal step (S80) is a step for removing the elastic sacrificial layer (410). However, referring to FIG. 18, this is a step for removing all sacrificial layers formed in addition to the elastic sacrificial layer (410). However, if only the elastic sacrificial layer (410) exists as the sacrificial layer, only the elastic sacrificial layer (410) can be removed. Therefore, the sacrificial layer removal step (S80) is a step for removing all of the elastic sacrificial layer (410), the substrate sacrificial layer (200), the first sacrificial layer (310), and the second sacrificial layer (710). The sacrificial layer removal step (S80) can utilize various methods for removing the sacrificial layer, and a method such as etching can be utilized.

[0090] Meanwhile, referring to FIGS. 21 and 22, a hollow formation step of forming one or more hollows (110) on the lower surface of the substrate may be further included before or after the first elastic layer formation step (S20). However, the hollow formation step (S30) is preferably performed after the substrate sacrificial layer formation step. However, if the substrate sacrificial layer or the elastic layer can be formed on the substrate after the hollow (110) is formed in the substrate (100), the hollow formation step (S30) may be performed first. FIG. 21 is a cross-sectional view of a substrate (100) in which a hollow (110) is formed, and FIG. 22 is a perspective view of the substrate (100) in which a hollow (110) is formed, viewed from below. In this way, one or more hollows (110) may be formed, and in addition to a lattice shape, hollows (110) arranged in various ways may be formed. At this time, the hollow (110) can be formed using a laser hole processing method, or a method of physically drilling a hollow can also be used. However, the physical method has the problem of generating foreign substances, so the laser hole processing method is preferable.

[0091] Meanwhile, the hollow space (110) formed in this manner can be used to remove the substrate sacrificial layer (200) in the sacrificial layer removal step (S80). When the substrate sacrificial layer (200) is removed by injecting a solution capable of removing the substrate sacrificial layer (200) into the hollow space (110) to melt the substrate sacrificial layer (200), the substrate (100) can be separated, and the probe head (10) formed by being laminated on the substrate (100) can be secured.

[0092] Even if the hollow (110) is not formed, the substrate can be physically removed by contacting a solution capable of removing the substrate sacrificial layer (200) through the exposed portion of the side surface of the substrate sacrificial layer (200), but if the hollow (110) is formed, the contact area of ​​the solution for removing the substrate sacrificial layer (200) can be maximized, and damage to the probe head (10) that may occur when physically removing the substrate (100) can be prevented.

[0093] The space converter (900) coupling step is a step of coupling the probe head (10) and the space converter (900) after the sacrificial layer removal step (S80), and the space converter (900) is provided to include a plurality of space converter electrodes (910) connected to the other ends of the first probe pins (500) on one side. The space converter (900) can perform a pitch conversion function by forming the pitches of the space converter electrodes (910) on the side in contact with the first probe pins (500) and the opposite side differently.

[0094] Accordingly, when the space converter (900) coupling step is provided in this manner, the probe pins formed at fine intervals on the other end of the probe head (10) are connected to the space converter (900), thereby compensating for the difference in interval between the terminal on the inspection equipment and the probe pins, and enabling them to be connected to each other.

[0095] Referring to FIGS. 23 and 24, the space converter (900) can be formed by including a space converter electrode (910), a body part (920), and a connection part (930), and the space converter electrode (910) is configured to be exposed on the upper part of the space converter (900) and to be electrically connected by contacting the probe pin of the probe head (10), and the body part is configured to be electrically connected so that the space converter electrode (910) is wired and can ultimately be connected to other devices such as inspection equipment at the connection part (930). A space converter (900) having such a configuration may be characterized in that an anisotropic conductive film (800) is provided on the surface where the other ends of the first probe pins (500) and the space converter (900) come into contact, so that the first probe pins (500) and a plurality of space converter electrodes (910) provided in the space converter (900) are electrically connected.

[0096] FIG. 25 and FIG. 26 are drawings showing a space converter (900) coupling step, and show a part where the first probe pin (500) of the probe head (10) and the space converter electrode (910) of the space converter (900) are coupled with an anisotropic conductive film (800) therebetween. Referring to this, the space converter (900) coupling step is performed by positioning an anisotropic conductive film (800) (ACF) between the other ends of the first probe pins (500) of the probe head (10) and the space converter (900) and then pressing them, and when pressing is performed, the configurations on both sides connected with the anisotropic conductive film (800) therebetween conduct electricity to each other.

[0097] Meanwhile, the anisotropic conductive film (800) is formed by including an adhesive material and conductive particles. At this time, the conductive particles are fine, with a diameter of approximately 3 to 15 μm, and occupy approximately 0.5 to 5% of the total volume of the anisotropic conductive film (800). The conductive particles are formed by coating polymer particles with a conductive metal material such as Au, Ni, or Pd. In addition, thermoplastic materials such as styrene butadiene or polyvinyl butylene, and thermosetting materials such as epoxy resin, polyurethane, or acrylic resin can be used as the adhesive material.

[0098] Fig. 25 is a drawing showing that an anisotropic conductive film (800) is positioned between the other ends of the first probe pins (500) of the probe head (10) and the space converter (900), and Fig. 26 shows that the other ends of the first probe pins (500) of the probe head (10) and the space converter (900) are pressed with the anisotropic conductive film (800) therebetween, and the space converter (900) is joined. When pressed in this way, electricity flows in the vertical direction between the first probe pin (500) and the space converter electrode (910), which is the pressing direction, so that it is conductive, and in the vertical direction of the pressing direction, it is insulated, so that no electricity flows. In addition, the first probe pin (500) and the space converter electrode (910) may adhere to each other in the remaining portions where they do not come into contact, so that they may have adhesive properties.

[0099] The space converter (900) bonding step is written based on being executed after the sacrificial layer removal step (S80), but it may also be executed without the sacrificial layer removal step (S80). If it is executed without the sacrificial layer being removed, pressure is applied only from the protruding space converter electrode (910) toward the first probe pin (500). Even in this case, if the first probe pin (500) and the space converter electrode (910) are vertically aligned and not misaligned, the pressure applied from the space converter electrode (910) can provide conductivity in the vertical direction, and since the first probe pin (500) is wrapped by the elastic layer, it is insulated by the elastic layer and can still have insulation without conducting electricity in the horizontal direction. However, it is preferable to execute it after the sacrificial layer removal step (S80) because the first probe pin (500) and the space converter electrode (910) can apply pressure to each other with the anisotropic conductive film (800) therebetween.

[0100] By combining the probe pin of the probe head (10) and the space converter electrode (910) of the space converter (900) with the anisotropic conductive film (800) in this way, the process of combining the space converter (900) can be simplified, and the electrical connection can also be easily performed through the characteristics of the anisotropic conductive film (800).

[0101] Meanwhile, the above-described steps include a step of forming a sacrificial layer at one or both ends, wherein one end and the other end are the parts of the probe pin that are connected to the inspection equipment or the inspection target, and one of these parts or both ends are made to protrude, and it is advantageous for both ends to protrude for contact with the inspection equipment or the inspection target, but depending on the situation, it is also possible to manufacture the probe head (10) in a state where one end does not protrude so that interference or contact does not occur between the pins, and it is also possible to make both ends not protrude. However, in the case where the space converter coupling step (S90) is further provided, as described above, the probe pin part of the probe head (10) that is connected to the space converter (900) protrudes, and since it is easy to connect when the space converter electrode (910) applies pressure with the anisotropic conductive film (800) interposed therebetween, it is preferable that the probe pin is provided to protrude by forming a sacrificial layer and removing the sacrificial layer.

[0102] The above preferred embodiments of the present invention are disclosed for the purpose of illustration, and those skilled in the art with ordinary knowledge of the present invention will be able to make various modifications, changes, and additions within the spirit and scope of the present invention, and such modifications, changes, and additions should be considered to fall within the scope of the above claims.

[0103] Anyone having ordinary skill in the art to which the present invention pertains can make various substitutions, modifications, and changes within the scope that does not depart from the technical spirit of the present invention, and therefore the present invention is not limited to the above-described embodiments and the attached drawings.

[0104] In the exemplary system described above, the methods are described based on a flowchart as a series of steps or blocks. However, the present invention is not limited to the order of the steps, and some steps may occur in a different order or simultaneously with other steps described above. Furthermore, those skilled in the art will understand that the steps depicted in the flowchart are not exclusive, and other steps may be included, or one or more steps in the flowchart may be deleted without affecting the scope of the present invention.

[0105]

[0106] According to the present invention, a probe head having a fine pitch can be manufactured.

[0107] Additionally, a probe head capable of inspecting multiple devices simultaneously can be provided.

[0108] In addition, a method for manufacturing a probe head that is easy to freely form the shape of a probe pin can be provided.

[0109] Additionally, the probe head and space converter can be easily combined and insulation can be secured using an anisotropic conductive film.

Claims

1. First elastic layer forming step (S20) for forming the first elastic layer (400); A first pin forming step (S40) of forming one or more first probe pins (500) on the upper surface of the first elastic layer (400); and A method for manufacturing a probe head, characterized in that it includes a second elastic layer laminating step (S50) of forming a second elastic layer (600) over a first elastic layer (400) on which the first probe pin (500) is formed.

2. In paragraph 1, A method for manufacturing a probe head, characterized in that it includes a second pin forming step of forming one or more second probe pins (550) on the upper surface of the second elastic layer (600).

3. In paragraph 1, A method for manufacturing a probe head, characterized in that it further includes a layer lamination step (S60) of repeatedly laminating layers composed of a pin layer and an elastic layer by repeating the first pin forming step (S40) and the second elastic layer lamination step (S50) a predetermined number of times.

4. In paragraph 1, The above first pin forming step (S40) is A method for manufacturing a probe head, characterized in that the first probe pins (500) are formed in a manner in which they are arranged in parallel on a plane of the upper surface of the first elastic layer (400).

5. In paragraph 1, The above first pin forming step (S40) is The second gap (520), which is the gap between the ends of the first probe pins (500), is provided to be greater than the first gap (510) between the ends of the first probe pins (500). A method for manufacturing a probe head, characterized in that the first probe pins (500) are formed in a shape in which one end and the other end are connected to each other.

6. In paragraph 1, The above first pin forming step (S40) is A method for manufacturing a probe head, characterized in that one end and the other end of the first probe pin (500) have a rod shape, and the center is formed to have a shock absorbing structure (540) that absorbs shock.

7. In paragraph 1, The first elastic layer forming step (S20) and the second elastic layer laminating step (S50) are A method for manufacturing a probe head, characterized in that an elastic sacrificial layer (410) is formed at both ends of the first probe pins (500).

8. In paragraph 1, Before the first elastic layer formation step (S20), A first photoresist forming step (S10) for forming a first photoresist (300) including a first sacrificial layer (310) at both ends of the first probe pins (500); After the second elastic layer lamination step (S50), A method for manufacturing a probe head, characterized in that it further includes a second photoresist forming step (S70) of forming a second photoresist (700) including a second sacrificial layer (710) at both ends of the first probe pins (500).

9. In paragraph 7 or 8, A method for manufacturing a probe head, characterized in that it further includes a sacrificial layer removal step (S80) of removing the elastic sacrificial layer (410), the first sacrificial layer (310), and the second sacrificial layer (710).

10. In paragraph 1, The above first elastic layer forming step (S20) is It is carried out on the upper surface of the substrate (100), Before or after the first elastic layer formation step (S20), A method for manufacturing a probe head, characterized in that it further includes a hollow formation step (S30) of forming one or more hollows (110) on the lower surface of the substrate (100).

11. In paragraph 9, After the above sacrificial layer removal step (S80), It further includes a space converter coupling step (S90) for coupling the above probe head (10) and the space converter (900), The above space converter (900) is A method for manufacturing a probe head, characterized in that it includes a plurality of space converter electrodes (910) connected to the other ends of the first probe pins (500) on one surface of the space converter (900).

12. In paragraph 11, The above space converter (900) is A method for manufacturing a probe head, characterized in that an anisotropic conductive film (800) is provided on the surface where the other end of the first probe pins (500) and the space converter (900) come into contact, so that the first probe pins (500) and a plurality of space converter electrodes (910) provided on the space converter (900) are electrically connected.

Images