Electrode introduction device and semiconductor process apparatus
By using an electrode introduction device in semiconductor process equipment and utilizing the elastic electrical connection parts of the first conductive part and the second conductive part to fit with the boat feet of the carrier boat, the problems of poor contact and short circuit between the electrode and the carrier boat are solved, thereby improving the efficiency and yield of the coating process.
Patent Information
- Application Number
- PCT/CN2024/133739
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-30
- Filing Date
- 2024-11-22
- Publication Date
- 2025-10-16
AI Technical Summary
In the semiconductor manufacturing process, there is a large gap between the electrode and the carrier boat, which leads to poor contact or short circuit problems, affecting the efficiency and yield of the coating process.
An electrode introduction device is used, including a first conductive part, a second conductive part and an elastic electrical connection part. The elastic electrical connection part allows the first conductive part and the second conductive part to fit with the surface of the boat foot of the carrying boat to avoid film layer adhesion and improve electrical connection stability.
The efficiency and yield of the coating process are improved, and the problems of poor contact and short circuit between the electrode and the carrier boat are avoided.
Smart Images
Figure CN2024133739_16102025_PF_FP_ABST
Abstract
Description
Electrode introduction device and semiconductor process equipment TECHNICAL FIELD
[0001] The present application relates to the technical field of coating equipment, and particularly to an electrode introduction device and semiconductor process equipment. BACKGROUND
[0002] PECVD (Plasma-Enhanced Chemical Vapor Deposition) is a commonly used thin film material preparation method in semiconductor manufacturing processes, and is used for depositing semiconductor materials such as silicon dioxide and silicon nitride. In related technologies, an electrode introduction device is used to introduce a radio frequency power source into a reaction chamber, and an electrode located in the reaction chamber is in conductive contact with a carrier boat to complete coating. However, the electrode and the carrier boat have a poor joint, resulting in a large gap between the electrode and the carrier boat. After being exposed to a high-temperature environment and a coating environment for a long time, the surface of the electrode exposed in the gap will be attached with a film layer, causing poor contact or even short circuit between the electrode and the carrier boat, thereby affecting the efficiency and yield of the coating process. SUMMARY
[0003] The present application discloses an electrode introduction device and semiconductor process equipment to solve the problem of poor contact or even short circuit between the electrode and the carrier boat in related technologies.
[0004] To solve the above technical problems, the present application is implemented as follows:
[0005] In a first aspect, the embodiments of the present application disclose an electrode introduction device applied to a semiconductor process equipment, wherein the semiconductor process equipment comprises a carrier boat, and the disclosed electrode introduction device comprises an electrode body and an electrical connection assembly.
[0006] The electrode body comprises a first conductive part, a second conductive part, and an elastic electrical connection part, and the first conductive part and the second conductive part are respectively used for conductive contact with a group of boat feet of the carrier boat.
[0007] The first conductive part and the second conductive part are electrically connected through the elastic electrical connection part, and the elastic electrical connection part is used for pulling the first conductive part and the second conductive part, so that the surfaces of the first conductive part and the second conductive part are attached to the surfaces of the group of boat feet of the carrier boat.
[0008] The electrical connection assembly is electrically connected with the first conductive part or the second conductive part, and is used for electrically connecting the electrode body to a power source.
[0009] In a second aspect, the electrode introduction device disclosed by the embodiments of the present application comprises a reaction chamber, a carrier boat, a support and the electrode body as described above. The support is arranged in the reaction chamber, and the carrier boat is placed on the support during the process. The electrode body is arranged on the support, and a group of boat feet of the carrier boat is in conductive contact with the electrode body.
[0010] The technical scheme adopted by the present application can achieve the following technical effects:
[0011] The electrode introduction device disclosed by the embodiments of the present application improves the related art. The electrode body is connected to the power supply through the electric connection assembly. The electrode body comprises a first conductive part, a second conductive part and an elastic electric connection part. The first conductive part and the second conductive part are electrically connected through the elastic electric connection part. Under the pulling action of the elastic electric connection part, the surface of the first conductive part and the surface of the second conductive part can be attached to the surface of a group of boat feet of the carrier boat. The surface of the first conductive part and the surface of the second conductive part are not easy to attach the film layer, thereby avoiding the problem of poor contact or even short circuit between the electrode body and the group of boat feet of the carrier boat, and further improving the efficiency and yield of the film coating process. BRIEF DESCRIPTION OF DRAWINGS
[0012] FIG. 1 is a structural schematic diagram of an electrode introduction device disclosed by the embodiments of the present application;
[0013] FIG. 2 is a schematic diagram of the assembly structure of a conductive support and an electrode body disclosed by the embodiments of the present application;
[0014] FIG. 3 is a schematic diagram of the assembly structure of a conductive support and an electrode body disclosed by the embodiments of the present application;
[0015] FIG. 4 is a structural schematic diagram of a semiconductor process equipment disclosed by the embodiments of the present application;
[0016] FIG. 5 is a schematic diagram of the assembly structure of a carrier boat and a support disclosed by the embodiments of the present application.
[0017] Explanation of reference signs: 100-carrier boat, 110-first boat, 111-first boat foot, 112-second boat foot, 120-second boat, 121-third boat foot, 122-fourth boat foot; 200-electrode introduction device, 210-bracket, 211-supporting rod, 212-insulating sleeve, 220-electrode body, 221-first conductive part, 2211-bent part, 222-second conductive part, 223-elastic electric connection part, 230-electric connection assembly, 231-conductive support, 2311-connection part, 2312-adjustment part, 2313-main body part, 2314-elastic main body, 2315-rigid main body, 232-insulating layer, 2321-sub-insulating layer, 2322-protection layer; 300-reaction chamber, 310-opening, 320-electrode rod. DETAILED DESCRIPTION
[0018] For the purpose, technical solutions and advantages of the present application to be clearer, the technical solutions of the present application will be described clearly and completely below in combination with the embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0019] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, not to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually a class, not limited to the number of objects, for example, the first object can be one or more.
[0020] The technical solutions disclosed in the various embodiments of the present application will be described in detail below in combination with the drawings.
[0021] Please refer to FIG. 1 to FIG. 5, the electrode introduction device 200 disclosed by the embodiment of the present application is applied to a semiconductor process equipment, the semiconductor process equipment includes a carrier boat 100, the carrier boat 100 is used as a carrier of chemical vapor deposition and is mainly used for carrying a piece to be plated, the carrier boat 100 can be made of graphite or other high-temperature-resistant conductive materials, the piece to be plated can be a chip, a solar cell piece, etc., for example, the PECVD (Plasma-enhanced Chemical Vapor Deposition) technology is used in the processing procedure of the solar cell piece, a layer of deep blue silicon nitride film, i.e., an anti-reflective film, is deposited on the surface of the solar cell piece through the carrier boat 100, a radio frequency power supply and an appropriate amount of reaction gas, which can significantly improve the photoelectric conversion efficiency of the solar cell piece.
[0022] The carrier boat 100 is provided with boat feet, which are in conductive contact with the electrode introduction device 200 to realize circuit conduction, the specific number of the boat feet can be selected according to the specific structure of the electrode introduction device 200, and in general cases, the number of the boat feet is at least two groups, one of which is used for connecting the positive pole of the power supply and the other of which is used for connecting the negative pole of the power supply. At least one boat foot is included in each group of boat feet, and to increase the conductive area of the carrier boat 100 and the electrode introduction device 200, the number of boat feet included in each group of boat feet can be appropriately increased, for example, two boat feet are included in each group of boat feet. In addition, the carrier boat 100 can be connected to the positive pole of the power supply only through the electrode introduction device 200 and connected to the negative pole of the power supply through the plug-in cooperation of the electrode rod 320 and the electrode hole, or the carrier boat 100 can be connected to the negative pole of the power supply only through the electrode introduction device 200 and connected to the positive pole of the power supply through the plug-in cooperation of the electrode rod 320 and the electrode hole, as long as the conduction of the power supply loop can be realized, which is not limited in the embodiment of the present application.
[0023] As shown in FIG. 1 to FIG. 5, the electrode introduction device 200 includes an electrode body 220 and an electric connection assembly 230, the electrode body 220 specifically can include a first conductive part 221, a second conductive part 222 and an elastic electric connection part 223, and the first conductive part 221 and the second conductive part 222 are respectively used for conductive contact with a group of boat feet of the carrier boat 100. Specifically, the first conductive part 221 and the second conductive part 222 form two conductive contact surfaces with two boat feet in a group of boat feet of the carrier boat 100, compared with the scheme of using a single conductive contact surface, the area of the conductive contact between the electrode body 220 and the carrier boat 100 is larger and the contact resistance is smaller in the embodiment of the present application, which can reduce the occurrence of heating problems. The first conductive part 221 and the second conductive part 222 can be made of metal materials and have a certain elasticity.
[0024] The first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electric connecting part 223, the elastic electric connecting part 223 can be a spring, a spring sheet or the like having a certain elasticity, and the elastic electric connecting part 223 is made of a conductive material, and the connection mode of the first conductive part 221 and the second conductive part 222 with the elastic electric connecting part 223 can be welding, bolt connection or the like.
[0025] The electric connecting assembly 230 is used for electrically connecting the electrode body 220 to a power supply, the power supply can be a radio frequency power supply, and the electric connecting assembly 230 can be a conductive cable, a steel rod or the like, in a specific electric connecting mode, the electric connecting assembly 230 is electrically connected to the first conductive part 221 or the second conductive part 222, and the first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electric connecting part 223, and the connection mode of the electric connecting assembly 230 with the first conductive part 221 or the second conductive part 222 can be welding, bolt connection or the like.
[0026] As known from the above, the electrode introduction device 200 disclosed in the embodiment of the present application improves the related art, the electrode body 220 is connected to the power supply through the electric connecting assembly 230, that is, can be in conductive contact with a group of boat feet of the boat 100, facilitating the disassembly and maintenance of the electrode body 220; the electrode body 220 includes the first conductive part 221, the second conductive part 222 and the elastic electric connecting part 223, the first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electric connecting part 223, under the pulling action of the elastic electric connecting part 223, the surfaces of the first conductive part 221 and the second conductive part 222 can be attached to the surfaces of a group of boat feet of the boat 100, the surfaces of the first conductive part 221 and the second conductive part 222 are not easy to attach a film layer, thereby avoiding the problems of poor contact and even short circuit between the electrode body 220 and a group of boat feet of the boat 100, and further improving the efficiency and yield of the film coating process.
[0027] Further, the semiconductor process equipment can further comprise a support 210 for supporting the carrier boat 100, the boat feet of the carrier boat 100 are lapped on the support 210, and the electrode body 220 is also lapped on the support 210, that is, the first conductive part 221 and the second conductive part 222 are respectively lapped on the support 210. The electrode body 220 is located between a group of boat feet of the carrier boat 100 and the support 210, and the electrode body 220 is in insulating contact with the support 210 and in conductive contact with the group of boat feet of the carrier boat 100. In an embodiment in which the support 210 can comprise two support rods 211 extending along the length direction of the carrier boat and parallel to each other (which will be described in detail later), each group of boat feet of the carrier boat 100 comprises two boat feet oppositely arranged along the width direction of the carrier boat 100, each boat foot is supported by one of the two support rods 211, and the first conductive part 221 and the second conductive part 222 are respectively lapped on the two support rods 211. The first conductive part 221 and the second conductive part 222 are respectively located between the two boat feet in the group of boat feet of the carrier boat 100 and the two support rods 211, and the first conductive part 221 and the second conductive part 222 are respectively in insulating contact with the two support rods 211 and in conductive contact with the two boat feet in the group of boat feet of the carrier boat 100. Moreover, the two boat feet in the group of boat feet are electrically connected through the first conductive part 221, the second conductive part 222 and the elastic electric connecting part 223.
[0028] By arranging the support 210, on the one hand, the electrode body 220 and the carrier boat 100 can be stably supported; on the other hand, since the electrode body 220 is lapped on the support 210, the position of the electrode body 220 can be adjusted to improve flexibility, and meanwhile, the electrode body 220 and the support 210 can be respectively disassembled and maintained.
[0029] In some embodiments, as shown in FIGS. 2-3, the structures of the first conductive part 221 and the second conductive part 222 can be the same or different. In the case where the structures of the first conductive part 221 and the second conductive part 222 are the same, the structure of the first conductive part 221 or the second conductive part 222 is described as an example. The first conductive part 221 or the second conductive part 222 can include a plurality of bending parts 2211 connected in sequence. The plurality of bending parts 2211 can be formed by pre-bending processing on the first conductive part 221 or the second conductive part 222, or the plurality of bending parts 2211 can be separately manufactured and then connected together by welding. The elastic electrical connection part 223 is connected to the bending part 2211 at the end position in the plurality of bending parts 2211 to pull the plurality of bending parts 2211 to bend along the connection position, i.e., the connection position between each two adjacent bending parts 2211. The elastic electrical connection part 223 can be connected to the bending part 2211 at the end position in the plurality of bending parts 2211 by welding, bolt connection, or the like. Since the first conductive part 221 or the second conductive part 222 adopts a multi-segment bending design, it is easier to adjust the bending under the pulling action of the elastic electrical connection part 223, thereby being more suitable for fitting the surface of the boat foot of the boat 100.
[0030] In a further aspect, as shown in FIGS. 1-5, the semiconductor process equipment includes two electrode introduction devices 200, and the electrode bodies 220 included in the two electrode introduction devices 200 are arranged at intervals along the length direction of the support 210 (e.g., the length direction of the support rod 211), and the boat 100 is arranged at intervals along the length direction of the boat 100 (parallel to the length direction of the support 210) to have two groups of boat feet, which can be arranged at two ends of the boat 100 along the length direction of the boat 100, respectively. Each electrode body 220 included in each electrode introduction device 200 is in conductive contact with one group of boat feet of the boat 100. According to the functional division, one of the two groups of boat feet of the same boat 100 is an anode boat foot, and the other is a cathode boat foot. To improve the stability of the electrical connection, the electrical contact points of each group of boat feet (anode boat foot or cathode boat foot) with the same electrode body 220 can be two or more. For example, the electrical contact points of each group of boat feet (anode boat foot or cathode boat foot) with the same electrode body 220 are two, and the two electrical contact points are in conductive contact with the first conductive part 221 and the second conductive part 222 in the same electrode body 220, respectively. That is, the first conductive part 221 and the second conductive part 222 of the electrode body 220 included in each electrode introduction device 200 are in conductive contact with two boat feet in the corresponding group of boat feet, and the two boat feet are both anode boat feet or cathode boat feet.
[0031] In some embodiments, the electrode body 220 included in one of the two electrode introduction devices 200 is electrically connected to the positive pole of the power source through the electrical connection assembly 230 therein, forming an anode loop; the electrode body 220 included in the other of the two electrode introduction devices 200 is electrically connected to the negative pole of the power source through the electrical connection assembly 230 therein, forming a cathode loop. The carrier boat 100 is connected to the positive and negative poles of the power source through the two electrode introduction devices 200 respectively, realizing the conduction of the power source loop.
[0032] In some embodiments, as shown in FIGS. 1-5, the electrical connection assembly 230 included in each electrode introduction device 200 includes a conductive support 231 attached to one side bracket 210 (e.g., one of the two support rods 211). When the conductive support 231 electrically connects the electrode body 220 to the positive pole of the power source, an anode loop is formed between the power source and the carrier boat 100; when the conductive support 231 electrically connects the electrode body 220 to the negative pole of the power source, a cathode loop is formed between the power source and the carrier boat 100. In embodiments in which the semiconductor process equipment includes two electrode introduction devices 200, the electrode bodies 220 included in the two electrode introduction devices 200 correspond to two sets of boat foot positions of the carrier boat 100, and the two sets of boat feet are respectively arranged at two ends of the carrier boat 100 along the length direction of the carrier boat 100. In order to achieve connection with the electrode bodies 220 included in the two electrode introduction devices 200, the lengths of the conductive supports 231 included in the two electrode introduction devices 200 are different along the length direction of the bracket 210, and the difference in the lengths of the conductive supports 231 included in the two electrode introduction devices 200 is consistent with the interval distance of the two sets of boat feet of the carrier boat 100 along the length direction of the carrier boat 100. On the one hand, the conductive support 231 can achieve electrical connection between the electrode body 220 and the power source, and on the other hand, the conductive support 231 can also play a certain fixing role on the electrode body 220 lapped on the bracket 210, so as to avoid the electrode body 220 from falling off the bracket 210.
[0033] In further solutions, as shown in FIGS. 1-3, the conductive support 231 can adopt a telescopic rod or a structure with certain elastic telescopic function, which can be elongated or shortened along the length direction of the bracket 210, thereby driving the electrode body 220 to move along the length direction of the bracket 210, so as to achieve good adaptation with the boat foot positions of the carrier boat 100, and improve the accuracy of the conductive contact between the electrode body 220 and the boat feet of the carrier boat 100. When replacing carrier boats 100 of different specifications, only the length of the conductive support 231 needs to be adjusted accordingly, so as to adjust the position of the electrode body 220 along the length direction of the bracket 210, thereby improving the adaptation range of the electrode introduction device 200.
[0034] In some embodiments, as shown in FIGS. 1-3, the conductive support 231 can include a connecting portion 2311, an adjusting portion 2312, and a main body portion 2313. The connecting portion 2311 is used to connect the positive or negative pole of the power supply, and the connecting manner between the connecting portion 2311 and the positive or negative pole of the power supply can be bolt connection, plug-in, clamping, etc. The main body portion 2313 is electrically connected with the connecting portion 2311 and the electrode body 220 respectively, and is used to introduce current to the electrode body 220. The connecting portion 2311 and the main body portion 2313 are connected through the adjusting portion 2312, and the adjusting portion 2312 can be elongated or shortened along the length direction of the bracket 210, so as to realize the elongation or shortening of the conductive support 231 along the length direction of the bracket 210. It should be noted that the connecting portion 2311, the adjusting portion 2312, and the main body portion 2313 all adopt a conductive structure, and the adjusting portion 2312 can include a bolt and a nut.
[0035] For example, a nut can be arranged on one of the connecting portion 2311 and the main body portion 2313, and a bolt can be arranged on the other one of the connecting portion 2311 and the main body portion 2313. The screwing length of the bolt and the nut can be adjusted, so as to realize the telescopic function of the adjusting portion 2312. Alternatively, a sliding rail can be arranged on one of the connecting portion 2311 and the main body portion 2313, and a sliding block can be arranged on the other one of the connecting portion 2311 and the main body portion 2313. The telescopic function is realized by the sliding cooperation of the sliding rail and the sliding block. The present application is not limited in this regard.
[0036] In some embodiments, as shown in FIGS. 2-5, the main body portion 2313 includes an elastic main body 2314 and a rigid main body 2315. The elastic main body 2314 can be a structure such as a cable or an elastic conductive sheet, which can provide a certain elastic deformation amount. The rigid main body 2315 can be a structure such as a steel rod, which has relatively large strength and is not easy to deform. One end of the elastic main body 2314 is connected with the connecting portion 2311 through an adjusting portion 2312, the other end of the elastic main body 2314 is connected with the rigid main body 2315 through another adjusting portion 2312, and one end of the rigid main body 2315 away from the elastic main body 2314 is connected with the first conductive portion 221 or the second conductive portion 222. The rigid main body 2315 is mainly used to ensure the overall strength of the conductive support 231, and to provide sufficient support for the electrode body 220. The elastic main body 2314 is mainly used to provide a certain amount of deformation buffer, so as to avoid the problem of local fracture and damage of the conductive support 231 caused by thermal expansion, and to improve the durability.
[0037] In further solutions, as shown in FIGS. 1-3, in order to avoid the occurrence of electric arc between the conductive support 231 and the carrier boat 100 and to cause safety accidents, an insulating layer 232 can be wrapped outside the connecting portion 2311, the adjusting portion 2312, and the main body portion 2313. The insulating layer 232 can be made of high-temperature-resistant materials such as ceramics and glass.
[0038] In some embodiments, as shown in FIGS. 1-3, when the length of the insulating layer 232 is large, the insulating layer 232 can be designed in segments in consideration of the difficulty in manufacturing and assembly, i.e., the insulating layer 232 includes a plurality of sub-insulating layers 2321, and a protective layer 2322 is sleeved at the connection between adjacent sub-insulating layers 2321, the protective layer 2322 wrapping the exposed area between adjacent sub-insulating layers 2321, and the material of the protective layer 2322 and the sub-insulating layers 2321 can be the same or different.
[0039] Please refer to FIGS. 1-5, the application also discloses a semiconductor process equipment, which can include a reaction chamber 300, a carrier boat 100, a bracket 210, and the electrode introduction device 200 described in the above embodiments. The reaction chamber 300 is used to provide a sealed vacuum chamber for a chemical vapor deposition process. The bracket 210 is arranged in the reaction chamber 300, and can be lapped on the inner wall or other structural members of the reaction chamber 300. The carrier boat 100 can be placed on or separated from the bracket 210 by a transfer mechanism. The conductive support 231 is attached to the bracket 210, and the electrode body 220 is arranged on the bracket 210, and can be lapped on the bracket 210. The boat legs of the carrier boat 100 are in conductive contact with the electrode body 220.
[0040] As described above, the semiconductor process equipment disclosed in the embodiments of the application improves the related art. The electrode body 220 in the semiconductor process equipment is lapped on the bracket 210 and connected to the power supply through the electrical connection assembly 230, so as to be in conductive contact with a group of boat legs of the carrier boat 100, facilitating the disassembly and maintenance of the electrode body 220. The electrode body 220 includes the first conductive part 221, the second conductive part 222, and the elastic electrical connection part 223. The first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electrical connection part 223. Under the pulling action of the elastic electrical connection part 223, the surfaces of the first conductive part 221 and the second conductive part 222 can be attached to the surfaces of the boat legs of the carrier boat 100. The surfaces of the first conductive part 221 and the second conductive part 222 are not easy to attach the film layer, thereby avoiding the problems of poor contact and even short circuit between the electrode body 220 and the group of boat legs of the carrier boat 100, and further improving the efficiency and yield of the film coating process.
[0041] In some embodiments, the reaction chamber 300 has an opening 310 through which the carrier boat 100, the electrode body 220, and other devices can enter and exit the reaction chamber 300. To improve production efficiency, the number of carrier boats 100 is two, including a first boat 110 and a second boat 120, which are placed on the support 210 at a predetermined distance apart. The first boat 110 is close to the opening 310 of the reaction chamber 300, and the second boat 120 is away from the opening 310 of the reaction chamber 300. The first boat 110 is provided with a first set of boat feet 111 at one end close to the opening 310 of the reaction chamber 300, and a second set of boat feet 112 at one end away from the opening 310 of the reaction chamber 300. The second boat 120 is provided with a third set of boat feet 121 at one end close to the opening 310 of the reaction chamber 300, and a fourth set of boat feet 122 at one end away from the opening 310 of the reaction chamber 300.
[0042] The semiconductor process equipment includes two sets of electrode introduction devices 200 corresponding to the first boat 110 and the second boat 120, respectively. Each set of electrode introduction devices 200 includes two electrode introduction devices 200, a total of four electrode introduction devices 200. The electrode bodies 220 included in the four electrode introduction devices 200 are arranged at intervals along the length direction of the support 210. The electrode bodies 220 included in the four electrode introduction devices 200 are in conductive contact with the first set of boat feet 111, the second set of boat feet 112, the third set of boat feet 121, and the fourth set of boat feet 122, respectively. Correspondingly, one of the two electrode introduction devices 200 in conductive contact with the first set of boat feet 111 and the second set of boat feet 112 includes an electrode body 220 electrically connected to the positive electrode of the power supply through the conductive support 231 therein, and the other includes an electrode body 220 electrically connected to the negative electrode of the power supply through the conductive support 231 therein. One of the two electrode introduction devices 200 in conductive contact with the third set of boat feet 121 and the fourth set of boat feet 122 includes an electrode body 220 electrically connected to the positive electrode of the power supply through the conductive support 231 therein, and the other includes an electrode body 220 electrically connected to the negative electrode of the power supply through the conductive support 231 therein.
[0043] The first boat 110 and the second boat 120 described above can be powered by the same power supply, or two power supplies can be used to supply power separately. It should be noted that the lengths of the conductive supports 231 included in the four electrode introduction devices 200 are not the same, and the specific length can be selected according to the positions of the first set of boat feet 111, the second set of boat feet 112, the third set of boat feet 121, and the fourth set of boat feet 122.
[0044] The double-boat scheme can carry more pieces to be plated, thereby improving the efficiency of the plating process. The first boat 110 and the second boat 120 are both electrically connected by the electrode body 220 and the electric connection assembly 230 included in the electrode introduction device 200. The electrode body 220 is lapped on the support 210, which facilitates disassembly and maintenance, and greatly improves the efficiency.
[0045] In some other embodiments, as shown in FIGS. 1-5, the carrying boat 100 includes a first boat 110 close to the opening 310 of the reaction chamber 300 and a second boat 120 away from the opening 310 of the reaction chamber 300; the first boat 110 is provided with a first set of boat feet 111 at one end close to the opening 310 of the reaction chamber 300, and a second set of boat feet 112 at one end away from the opening 310 of the reaction chamber 300; the semiconductor process equipment includes two electrode introduction devices 200, the electrode bodies 220 included in the two electrode introduction devices 200 are spaced apart along the length direction of the support 210, and the electrode bodies 220 included in the two electrode introduction devices 200 are respectively in conductive contact with the first set of boat feet 111 and the second set of boat feet 112. Correspondingly, the electrode body 220 included in one of the two electrode introduction devices 200 is electrically connected to the positive pole of the power supply through the electric connection assembly 230 therein, forming an anode circuit, and the electrode body 220 included in the other of the two electrode introduction devices 200 is electrically connected to the negative pole of the power supply through the electric connection assembly 230 therein, forming a cathode circuit.
[0046] The second boat 120 is electrically connected to the power supply in a different way from the first boat 110. Specifically, the second boat 120 is provided with electrode holes on the side away from the opening 310 of the reaction chamber 300, which are used for plug-in electrical connection with the electrode rods 320 inserted into the reaction chamber 300. It should be noted that the number of the electrode holes and the electrode rods 320 is both two, which are plug-in connected one by one. One of the two electrode rods 320 is electrically connected to the positive pole of the power supply, and the other is electrically connected to the negative pole of the power supply. The positive and negative electrode rods 320 are respectively plug-in connected in the two electrode holes of the second boat 120 to realize electrical connection. The first boat 110 and the second boat 120 can be supplied with power by the same power supply, or can be supplied with power by two power supplies respectively. The second boat 120 uses the plug-in connection of the electrode rods 320 and the electrode holes, which is more stable in the generated electric field than the way of introducing current from the opening 310 of the reaction chamber 300 by the electrode body 220 and the conductive support 231, and can also avoid the problem of uncontrollable displacement caused by the too large extension span of the conductive support 231.
[0047] In a further scheme, as shown in FIG. 1 and FIG. 5, the second boat 120 is provided with a third set of boat feet 121 at one end close to the opening 310 of the reaction chamber 300 and a fourth set of boat feet 122 at one end away from the opening 310 of the reaction chamber 300, and the support 210 can include two parallel support rods 211, each of which is provided with four sets of insulating sleeves 212 along the length direction of the support rod 211, two insulating sleeves in each set of insulating sleeves 212 are oppositely sleeved on the outer surfaces of the two support rods 211, and the four sets of insulating sleeves 212 are respectively used to support one boat foot in the first set of boat feet 111, one boat foot in the second set of boat feet 112, one boat foot in the third set of boat feet 121, and one boat foot in the fourth set of boat feet 122. The insulating sleeves 212 can be made of ceramic or glass material. It is easy to understand that the first set of boat feet 111, the second set of boat feet 112, the third set of boat feet 121, and the fourth set of boat feet 122 each include two boat feet oppositely arranged along the width direction of the first boat 110 or the second boat 120, and each boat foot is supported by the insulating sleeve 212 on one of the two support rods 211. The electrode body 220 included in the electrode introduction device 200 is arranged on the insulating sleeve 212.
[0048] For the scheme that the first boat 110 and the second boat 120 are electrically connected to the power supply in different ways, since the first set of boat feet 111 and the second set of boat feet 112 of the first boat 110 are supported by the electrode body 220 between the first set of boat feet 111 and the second set of boat feet 112 and the insulating sleeve 212, and the third set of boat feet 121 and the fourth set of boat feet 122 of the second boat 120 are not supported by the electrode body 220 between the third set of boat feet 121 and the fourth set of boat feet 122 and the insulating sleeve 212, a height difference between the first boat 110 and the second boat 120 is caused. To make up for the height difference between the first boat 110 and the second boat 120, the wall thickness of the insulating sleeve 212 can be designed differently.
[0049] Specifically, the wall thickness of the insulating sleeve 212 provided at the first set of boat feet 111 and the second set of boat feet 112 can be made smaller than the wall thickness of the insulating sleeve 212 provided at the third set of boat feet 121 and the fourth set of boat feet 122, and the difference value of the wall thickness and the thickness value of the first conductive part 221 or the second conductive part 222 in the electrode body 220 remain consistent. By using the different wall thicknesses of the insulating sleeve 212 at different positions, the first boat 110 and the second boat 120 can be at the same height, and the consistency of the first boat 110 and the second boat 120 in the process, such as the chemical vapor deposition process, is ensured.
[0050] In the above embodiments, the focus is on the differences between the various embodiments. The different technical features between the various embodiments can be combined to form more specific embodiments as long as they are not contradictory. In view of the brevity of the text, further description is omitted here.
[0051] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.
Claims
1. An electrode introduction device, applied to semiconductor process equipment, wherein the semiconductor process equipment includes a carrier boat, characterized in that: The electrode introduction device includes an electrode body and an electrical connection assembly; The electrode body comprises a first conductive portion, a second conductive portion and an elastic electrical connection portion, wherein the first conductive portion and the second conductive portion are respectively used for electrically contacting with a group of boat legs of the carrying boat; The first conductive portion and the second conductive portion are electrically connected via the elastic electrical connection portion, and the elastic electrical connection portion is used to pull the first conductive portion and the second conductive portion so that the surfaces of the first conductive portion and the second conductive portion are in contact with the surfaces of a group of boat legs of the carrying boat; The electrical connection assembly is electrically connected to the first conductive portion or the second conductive portion, and is used to electrically connect the electrode body to a power source.
2. The electrode introduction device according to claim 1, characterized in that: At least one of the first conductive part and the second conductive part includes multiple bending parts, and the multiple bending parts are connected in sequence. The elastic electrical connection part is connected to the bending part located at the end position of the multiple bending parts to pull the multiple bending parts to bend along the docking position.
3. The electrode introduction device according to claim 1, characterized in that: The electrical connection assembly includes a conductive support member, and the conductive support member is used to electrically connect the electrode body to the positive electrode or the negative electrode of the power supply.
4. The electrode introduction device according to claim 3, characterized in that The conductive support member can be extended or shortened along the length direction of the carrying boat to drive the electrode body to move along the length direction of the carrying boat.
5. The electrode introduction device according to claim 4, characterized in that: The conductive support member includes a connecting portion, an adjusting portion and a main body portion. The connecting portion is used to connect the positive or negative pole of the power supply. The connecting portion and the main body portion are connected through the adjusting portion. The adjusting portion can be extended or shortened along the length direction of the carrying boat.
6. The electrode introduction device according to claim 5, characterized in that: The main body includes an elastic body and a rigid body, one end of the elastic body is connected to the connecting part through an adjusting part, the other end of the elastic body is connected to the rigid body through another adjusting part, and the end of the rigid body facing away from the elastic body is connected to the first conductive part or the second conductive part.
7. The electrode introduction device according to claim 5, characterized in that: The outer sides of the connecting portion, the adjusting portion and the main body are all wrapped with an insulating layer.
8. The electrode introduction device according to claim 7, characterized in that: The insulating layer comprises a plurality of sub-insulating layers arranged at intervals, and a protective layer is provided at the connection between adjacent sub-insulating layers.
9. A semiconductor process equipment, characterized in that: It comprises a reaction chamber, a carrying boat, a bracket and the electrode introduction device according to any one of claims 1 to 8, wherein the bracket is arranged in the reaction chamber, the carrying boat is placed on the bracket when the process is carried out, the electrode body is arranged on the bracket, and a group of boat feet of the carrying boat are in conductive contact with the electrode body.
10. The semiconductor process equipment according to claim 9, wherein: The electrode introduction device includes a first conductive part and a second conductive part respectively overlapped on the bracket.
11. The semiconductor process equipment according to claim 10, wherein: The semiconductor process equipment comprises two electrode introduction devices, wherein the electrode bodies included in the two electrode introduction devices are spaced apart along the length direction of the bracket; The carrying boat is provided with two groups of boat feet at intervals along its length direction, and the electrode body included in each of the electrode introduction devices is in conductive contact with one group of boat feet of the carrying boat; The electrode body included in one of the two electrode introduction devices is electrically connected to the positive pole of the power supply through the electrical connection component therein, and the electrode body included in the other of the two electrode introduction devices is electrically connected to the negative pole of the power supply through the electrical connection component therein.
12. The semiconductor process equipment according to claim 11, wherein: The electrical connection assembly included in each of the electrode introduction devices includes a conductive support member, and the conductive support members included in the two electrode introduction devices are used to electrically connect the electrode bodies included in the two electrode introduction devices to the positive and negative poles of the power supply respectively, wherein the lengths of the conductive support members included in the two electrode introduction devices are different along the length direction of the bracket.
13. The semiconductor process equipment according to claim 10 or 12, characterized in that: Also included is an insulating sleeve; The bracket includes two support rods arranged in parallel, and a group of insulating sleeves are relatively sleeved on the outer surfaces of the support rods, wherein the group of insulating sleeves includes two insulating sleeves; The first conductive portion and the second conductive portion are respectively overlapped on the set of insulating sleeves.
14. The semiconductor process equipment according to claim 13, wherein: The carrier boat includes a first boat close to the opening of the reaction chamber and a second boat away from the opening of the reaction chamber; A first group of boat legs is provided at one end of the first boat close to the opening of the reaction chamber, a second group of boat legs is provided at one end of the first boat away from the opening of the reaction chamber, a third group of boat legs is provided at one end of the second boat close to the opening of the reaction chamber, and a fourth group of boat legs is provided at one end of the second boat away from the opening of the reaction chamber; Each of the support rods is provided with four insulating sleeves at intervals along its length direction, and the insulating sleeves are sleeved on the outer side surface of the support rod, and the four insulating sleeves are respectively used to support one boat foot in the first group of boat feet, one boat foot in the second group of boat feet, one boat foot in the third group of boat feet and one boat foot in the fourth group of boat feet, and the outer side surfaces of the insulating sleeves for supporting one boat foot in the first group of boat feet and one boat foot in the second group of boat feet are overlapped with the electrode body, wherein the wall thickness of the insulating sleeves for supporting one boat foot in the first group of boat feet and one boat foot in the second group of boat feet is smaller than the wall thickness of the insulating sleeves for supporting one boat foot in the third group of boat feet and one boat foot in the fourth group of boat feet.