Manufacturing method for SMD network transformer

Abstract

Disclosed in the present invention is a manufacturing method for an SMD network transformer, comprising the following steps: coil soldering: taking a metal material piece and a plurality of coils, the metal material piece comprising a substrate, metal pins, and auxiliary tabs, the auxiliary tabs being connected to the left side ends and / or right side ends of the metal pins, the cross sections of the metal pins being exposed, each coil comprising a magnetic ring and copper wires, tapping the copper wires on the coils, soldering a wire end of each copper wire to the corresponding metal pin at the corresponding position to form a solder joint; frame injection molding: using a glue material to encapsulate the solder joints by means of injection molding, enabling the glue material to form a glue frame by means of injection molding, and the glue frame wrapping the solder joints; encapsulating: using the glue material again to encapsulate the coils in the glue frame; and finishing: cutting the auxiliary tabs, removing the substrate and the auxiliary tabs together, and bending and shaping the metal pins to form a product.

Description

A method for manufacturing an SMD network transformer Technical Field

[0001] The present invention relates to the technical field of network transformers, and in particular to a method for manufacturing an SMD network transformer. Background Art

[0002] The network transformer mainly consists of a coil, a metal PIN and a packaging block. The copper wire of the internal coil of the network transformer is connected to the metal PIN and then injection molded.

[0003] However, in actual production, sometimes the coil needs to be encapsulated to prevent it from loosening, and sometimes it does not need to be encapsulated to prevent the coil inside the colloid from being wrapped by the colloid, causing the magnetic ring of the coil to be subjected to the stress of the colloid, and the inductance value of the coil to be seriously attenuated, affecting the performance of the product. These two methods conflict with each other. If they are manufactured separately, the equipment cost will be high.

[0004] Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing an SMD network transformer, wherein the intermediate component, the colloid frame, is manufactured to encapsulate the welding joints, facilitating the subsequent bonding and complete encapsulation of the coil within the colloid frame.

[0006] A method for manufacturing an SMD network transformer according to an embodiment of the first aspect of the present invention includes the following steps:

[0007] Coil welding: Take a metal sheet and several coils. The metal sheet includes a base plate, a metal PIN, and an auxiliary sheet. The left and / or right ends of the metal PIN are connected to the auxiliary sheet. The cross section of the metal PIN is exposed. The coil includes a magnetic ring and copper wire. The copper wire ends on the coil are tapped and welded to the metal PIN at the corresponding position to form a welding position.

[0008] Frame injection molding: The welding position is encapsulated by injection molding with a rubber compound, and the rubber compound forms a colloid frame after injection molding, and the colloid frame wraps the welding position;

[0009] Encapsulation, again using glue to encapsulate the coil in the colloid frame;

[0010] Trimming, cutting the auxiliary sheet, removing the substrate and the auxiliary sheet together, bending and shaping the metal PIN to form a product.

[0011] According to an embodiment of the present invention, a method for manufacturing an SMD network transformer has at least the following beneficial effects: the metal sheet is arranged so that all sides of the metal PIN are electroplated during electroplating, and the metal sheet and the metal PIN are an integral structure, which is more convenient during welding operations and injection molding and encapsulation welding positions. In addition, the injection molding of the colloid frame as an intermediate piece can provide a product basis for the subsequent production of different forms of network transformers, eliminating the cost of using two production lines, achieving overall production process coordination, saving costs, and improving production efficiency. On the entire injection molding of the colloid frame and the metal sheet, the operation of fixing and encapsulating the coil by spotting glue can be performed, and the operation of completely encapsulating the coil by pouring glue can also be performed.

[0012] According to some embodiments of the present invention, the packaging step further includes a cover, which is installed at one end of the colloid frame, and the coil is glued into the colloid frame at the open end of the colloid frame with glue. The colloid frame is injection molded, and then the cover is installed. After the cover is installed, one side of the colloid frame is open, and then the coil is fixed by dispensing glue, and no glue is poured. In this way, there is no problem of subsequent colloid wrapping the coil, and the magnetic ring in the coil is not subject to the stress of the potting colloid, thereby solving the problem of attenuation of the inductance value of the coil.

[0013] According to some embodiments of the present invention, in the packaging step, the coil is first glued to the colloid frame using glue, and then the interior of the colloid frame is filled by a second injection molding method, so that the coil is encapsulated. During the manufacturing process, the flowing glue is completely blocked and controlled within a specified area, making production convenient and easy to operate; at the same time, the coil and welding position in the colloid frame are encapsulated inside the colloid frame, which prevents the coil from loosening, the copper wire from being scratched, and the copper wire welding position from being oxidized, thereby improving product quality.

[0014] According to some embodiments of the present invention, an external connection recess is provided on the colloid frame.

[0015] According to some embodiments of the present invention, a welding auxiliary groove is provided on the metal PIN. During the coil welding step, the wire end is pulled out, bent and placed in the welding auxiliary groove for further welding. The provided welding auxiliary groove facilitates limiting the wire end in the initial stage of welding, thereby facilitating subsequent welding.

[0016] According to some embodiments of the present invention, two groups of metal PINs are provided, the two groups of metal PINs are arranged opposite to each other in the front-to-back direction, and an installation space is reserved between the two groups of metal PINs. One group of metal PINs includes multiple metal PINs arranged in the left-to-right direction.

[0017] According to some embodiments of the present invention, the metal PIN includes a packaging portion and a contact portion, the soldering auxiliary groove is provided on the packaging portion, and the wire head is connected to the corresponding soldering auxiliary groove on the packaging portion.

[0018] According to some embodiments of the present invention, the packaging portion and the contact portion are integrally formed, and the width of the packaging portion is greater than the width of the contact portion. The packaging portion can be better packaged, thereby improving the strength of the metal PIN after packaging. In addition, it can also increase the stress at the connection between the packaging portion and the contact portion, thereby facilitating the subsequent bending of the contact portion.

[0019] According to some embodiments of the present invention, a rounded corner structure is provided at a connection between the packaging portion and the contact portion.

[0020] According to some embodiments of the present invention, the contact portion is provided with a bending step, and the bending step is used to bend the contact portion.

[0021] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0023] FIG1 is a schematic diagram of a colloid frame injected onto a metal sheet according to an embodiment of the present invention;

[0024] FIG2 is an exploded view of FIG1 ;

[0025] FIG3 is a schematic diagram of the coil being completely encapsulated by injecting glue into the colloid frame;

[0026] FIG4 is an exploded view of FIG3 ;

[0027] FIG5 is a schematic diagram of installing a cover on a colloid frame;

[0028] Figure 6 is an exploded view of Figure 5. Metal sheet 100, substrate 110; metal PIN 120, encapsulation portion 121, contact portion 122, bending step 122a, soldering auxiliary groove 123; auxiliary sheet 130, soldering position 140; coil 200, magnetic ring 210, copper wire 220, wire end 221; colloid frame 300, external connection recess 310, cover 400. DETAILED DESCRIPTION

[0029] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0031] In the description of the present invention, "several" means one or more, "more" means two or more, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0032] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0033] 1 to 6 , a method for manufacturing an SMD network transformer includes the following steps:

[0034] Coil welding: Take a metal sheet 100 and several coils 200. The metal sheet 100 includes a base plate 110, a metal PIN 120, and an auxiliary sheet 130. The left end and / or right end of the metal PIN 120 are connected to the auxiliary sheet 130. The cross section of the metal PIN 120 is exposed. The coil 200 includes a magnetic ring 210 and a copper wire 220. The copper wire 220 on the coil 200 is tapped and the wire ends 221 of the copper wire 220 are welded to the corresponding positions of the metal PIN 120 to form welding positions 140.

[0035] Frame injection molding: The welding position 140 is encapsulated by injection molding with a plastic material, and the plastic material is formed into a colloid frame 300 after injection molding, and the colloid frame 300 wraps the welding position 140;

[0036] Encapsulation: Encapsulating the coil 200 in the colloid frame 300 using glue again;

[0037] After trimming, the auxiliary sheet 130 is cut, the substrate 110 and the auxiliary sheet 130 are removed together, and the metal PIN 120 is bent and shaped to form a product.

[0038] The provided metal sheet 100 enables all sides of the metal PIN 120 to be plated during electroplating, and the metal sheet 100 and the metal PIN 120 are an integral structure, which is more convenient during welding operations and injection molding and encapsulation welding positions 140. In addition, the injection molding colloid frame 300 serves as an intermediate piece and can provide a product basis for the subsequent production of different forms of network transformers, eliminating the cost of adopting two production lines, achieving overall production process coordination, saving costs, and improving production efficiency. On the entire injection molding of the colloid frame 300 and the metal sheet 100, the operation of spot-dispensing and fixing the encapsulated coil 200 can be performed, and the operation of pouring glue to completely encapsulate the coil 200 can also be performed.

[0039] It should be noted that in the past, when manufacturing these two types of network transformers, each was separately molded and injection-molded, and the colloid frame 300 was not used as an intermediate component. In this solution, the colloid frame 300 is first injection-molded as an intermediate component to encapsulate the welding position 140, and then the coil 200 within the colloid frame 300 is encapsulated as needed, forming two products with different packaging specifications.

[0040] In some embodiments, the packaging step further includes a cover 400. The cover 400 is installed at one end of the colloid frame 300, and the coil 200 is glued to the colloid frame 300 at the open end of the colloid frame 300. The colloid frame 300 is injection molded and then the cover 400 is installed. After the cover 400 is installed, one side of the colloid frame 300 is open. Then the coil 200 is fixed by dispensing glue, and no glue is poured. In this way, there is no problem of subsequent colloid wrapping the coil 200. The magnetic ring 210 in the coil 200 is not subject to the stress of the potting colloid, thereby solving the problem of attenuation of the inductance value of the coil 200. It can be understood that the glue-fixing of the coil 200 uses soft glue to stick the coil 200, forming a relatively thin layer of soft glue on the surface of the coil 200. The coil 200 can be seen from the open side of the colloid frame 300. The so-called thinner means that the thickness of the soft glue is between 0-1 mm.

[0041] In some embodiments, in the packaging step, the coil 200 is first glued to the colloid frame 300 with glue, and then the interior of the colloid frame 300 is filled by a second injection molding, so that the coil 200 is encapsulated. During the manufacturing process, the flowing glue is completely blocked and controlled within the specified area, making production convenient and easy to operate; at the same time, the coil 200 and the welding position 140 in the colloid frame 300 are encapsulated inside the colloid frame 300, which prevents the coil 200 from loosening, the copper wire 220 from being scratched, and the copper wire 220 welding position 140 from being oxidized, thereby improving product quality. It can be understood that the coil 200 is glued with soft glue, and bakelite powder is used for packaging. The coil 200 cannot be seen after packaging.

[0042] In some embodiments, the colloid frame 300 is provided with an external connection recess 310 . It is understandable that the external connection recess 310 is used to cooperate with the buckle on the cover 400 to buckle the cover.

[0043] In some embodiments, a welding auxiliary groove 123 is provided on the metal PIN 120. During the coil welding step, the wire end 221 is pulled out, bent and placed in the welding auxiliary groove 123 for welding. The provided welding auxiliary groove 123 facilitates limiting the wire end 221 at the initial stage of welding, thereby facilitating subsequent welding.

[0044] In some embodiments, two groups of metal PINs 120 are provided. The two groups of metal PINs 120 are arranged opposite to each other in the front-to-back direction, and installation spaces are reserved between the two groups of metal PINs 120. One group of metal PINs 120 includes multiple metal PINs 120 arranged in the left-right direction.

[0045] In some embodiments, the metal PIN 120 includes a packaging portion 121 and a contact portion 122 . The soldering auxiliary groove 123 is provided on the packaging portion 121 , and the wire head 221 is connected to the corresponding soldering auxiliary groove 123 on the packaging portion 121 .

[0046] In some embodiments, the packaging portion 121 and the contact portion 122 are integrally formed, and the width of the packaging portion 121 is greater than the width of the contact portion 122. The packaging portion 121 can be better packaged, thereby improving the strength of the metal PIN 120 after packaging. In addition, it can also increase the stress at the connection between the packaging portion 121 and the contact portion 122, thereby facilitating the subsequent bending of the contact portion 122.

[0047] In some embodiments, a rounded corner structure is provided at the connection between the packaging portion 121 and the contact portion 122 .

[0048] In some embodiments, the contact portion 122 is provided with a bending step 122 a , and the bending step 122 a is used to bend the contact portion 122 .

[0049] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A method for manufacturing an SMD network transformer, characterized in that: The following steps are involved: Coil welding, taking a metal sheet (100) and a plurality of coils (200), the metal sheet (100) comprising a substrate (110), a metal PIN (120) and an auxiliary sheet (130), the left end and / or right end of the metal PIN (120) being connected to the auxiliary sheet (130), the cross section of the metal PIN (120) being exposed, the coil (200) comprising a magnetic ring (210) and a copper wire (220), tapping the copper wire (220) on the coil (200), and welding the wire end (221) of the copper wire (220) to the metal PIN (120) at a corresponding position to form a welding position (140); Frame injection molding, encapsulating the welding position (140) with a rubber material by injection molding, the rubber material forms a colloid frame (300) after injection molding, and the colloid frame (300) wraps the welding position (140); Encapsulation, encapsulating the coil (200) in the colloid frame (300) again using the glue; The auxiliary sheet (130) is trimmed and cut, the substrate (110) and the auxiliary sheet (130) are removed together, and the metal PIN (120) is bent and shaped to form a product.

2. The method for manufacturing a SMD network transformer according to claim 1, characterized in that: The packaging step also includes a cover (400), which is installed on one end of the colloid frame (300), and the coil (200) is glued into the colloid frame (300) at the open end of the colloid frame (300).

3. The method for manufacturing a SMD network transformer according to claim 1, characterized in that: In the packaging step, the coil (200) is firstly glued into the colloid frame (300) using glue, and then the interior of the colloid frame (300) is filled by a second injection molding, so that the coil (200) is packaged.

4. The method for manufacturing a SMD network transformer according to claim 1, characterized in that: The colloid frame (300) is provided with an external connection recess (310).

5. A method for manufacturing a SMD network transformer according to any one of claims 1 to 4, characterized in that: The metal PIN (120) is provided with a welding auxiliary groove (123). In the coil welding step, the wire end (221) is drawn out, bent, and accommodated in the welding auxiliary groove (123) for welding.

6. The method for manufacturing a SMD network transformer according to claim 5, characterized in that: The metal PINs (120) are provided in two groups, the two groups of the metal PINs (120) are arranged opposite to each other in the front-to-back direction, and an installation space is reserved between the two groups of the metal PINs (120), and one group of the metal PINs (120) includes a plurality of the metal PINs (120) arranged in the left-right direction.

7. The method for manufacturing a SMD network transformer according to claim 6, characterized in that: The metal PIN (120) comprises a packaging portion (121) and a contact portion (122), the welding auxiliary groove (123) is arranged on the packaging portion (121), and the wire head (221) is connected to the welding auxiliary groove (123) on the corresponding packaging portion (121).

8. The method for manufacturing a SMD network transformer according to claim 7, characterized in that: The packaging portion (121) and the contact portion (122) are integrally formed, and the width of the packaging portion (121) is greater than the width of the contact portion (122).

9. The method for manufacturing a SMD network transformer according to claim 8, characterized in that: A rounded corner structure is provided at the connection between the packaging portion (121) and the contact portion (122).

10. The method for manufacturing a SMD network transformer according to claim 9, characterized in that: The contact portion (122) is provided with a bending step (122a), and the bending step (122a) is used to bend the contact portion (122).

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