Lighting device

Abstract

The present invention provides a lighting device comprising a housing, a globe, a substrate, a plurality of light-emitting elements, one or more drive circuit elements, and a heat sink. One end of the housing has an opening, and the globe is disposed at one end of the housing so as to cover the opening. The substrate is disposed in the housing and includes a central portion and an outer peripheral portion surrounding the central portion. The plurality of light-emitting elements are mounted on a surface of the outer peripheral portion on the side closer to the globe. The one or more drive circuit elements are mounted on a surface of the central portion on the side away from the globe. The heat sink is disposed on the side of the substrate away from the globe. The heat sink includes a flat heat-dissipating portion and a cylindrical heat-dissipating portion. The flat heat-dissipating portion has at least one clearance opening provided corresponding to the drive circuit element. The flat heat-dissipating portion is disposed so as to correspond to the plurality of light emitting elements with the outer peripheral portion interposed therebetween, and abuts on the outer peripheral portion so as to be in surface contact therewith. The cylindrical heat-dissipating portion is formed by extending and folding back an outer edge of the flat heat-dissipating portion, and abuts on an inner wall of the housing so as to be in surface contact therewith.

Description

lighting equipment

[0001] The present disclosure relates to the field of lighting technology, and more particularly to a lighting device in which a part of a driving circuit and a light emitting element are integrated on the same substrate.

[0002] In the prior art, for example, Patent Document 1 (CN219493949U) discloses a lighting device that uses a DOB (Driver on board) power supply. However, the power supply has been improved and simplified, and some of the devices in the power supply, such as electrolytic capacitors and transformers, which are relatively large in volume, have been eliminated. By simplifying the circuit design and devices, the driving circuit and LED light-emitting element are placed on the same board, making it possible to achieve a slimmer appearance and stable functionality of the lighting device.

[0003] Furthermore, to solve the heat dissipation problem, for example, Patent Document 2 (CN217694072U) discloses that a first heat sink 1051 is disposed on the annular base of the storage groove 102, thereby realizing heat dissipation from the circuit board 101 and the LED light-emitting module 106 disposed above the circuit board 101. The first heat sink 1051 is in close contact with the inner wall of the storage groove 102 and has a heat dissipation side portion 10511 that extends until it abuts against the circuit board 101.

[0004] However, although the first heat sink 1051 in the above-described conventional technology auxiliary dissipates heat from the circuit board 101 via the heat dissipation side portion 10511 that abuts against the circuit board 101, because only the end portion of the heat dissipation side portion 10511 abuts against the circuit board 101, the heat dissipation performance is limited and only the temperature requirements of a lamp with low power consumption can be met, making it difficult to realize a lighting device with high power consumption. Moreover, because the heat dissipation side portion 10511 is mainly used to dissipate heat from the circuit board 101, the expected heat dissipation effect for the LED light-emitting module 106 cannot be obtained.

[0005] In addition, in the above-mentioned conventional technology, a relatively complex fixing structure such as the second position limiting portion 104, the first engaging portion 1042, and the second engaging portion 1045 is provided to fix the circuit board 101, which makes the assembling and processing process of the lighting device relatively complicated and hinders cost reduction in the assembly and processing.

[0006] At the same time, the space between the first heat sink 1051 and the circuit board 101 formed when the end of the heat dissipation side portion 10511 abuts against the circuit board 101 also hinders the entire lighting device from being made thinner and more compact.

[0007] As such, the above-mentioned lighting devices disclosed in the prior art have the problem that they are unable to meet the heat dissipation requirements of lighting devices with high power consumption due to insufficient heat dissipation performance, and further have the problem that it is difficult to further thin the entire lighting device, and the cost of assembling and processing the substrate is relatively high.

[0008] Chinese Utility Model No. 219493949 Chinese Utility Model No. 217694072

[0009] The present disclosure aims to provide a lighting device that can solve the problems of poor heat dissipation performance present in conventional technology and the problem of making the entire lighting device thinner.

[0010] A lighting device according to a first aspect of the present disclosure includes a housing, a globe, a substrate, a plurality of light-emitting elements, one or more drive circuit elements, and a heat sink. One end of the housing has an opening, and the globe is disposed at that end to cover the opening. The substrate is disposed within the housing and includes a substrate central portion and a substrate peripheral portion surrounding the substrate central portion. The plurality of light-emitting elements are mounted on a surface of the substrate peripheral portion closer to the globe. The one or more drive circuit elements are mounted on a surface of the substrate remote from the globe. The heat sink is disposed within the housing and located on the side of the substrate remote from the globe. The heat sink includes a planar heat dissipation portion and a tubular heat dissipation portion, the planar heat dissipation portion having at least one escape opening provided corresponding to the drive circuit elements, the planar heat dissipation portion being disposed between the plurality of light-emitting elements and sandwiching the substrate peripheral portion, and abutting in surface-to-surface contact with the substrate peripheral portion, and the tubular heat dissipation portion being formed by extending and folding back the outer edge of the planar heat dissipation portion and abutting in surface-to-surface contact with the inner wall of the housing.

[0011] According to the technical solution provided by the present disclosure, multiple light-emitting elements are mounted on the outer periphery of the substrate, and the multiple light-emitting elements are arranged uniformly and relatively dispersed on the substrate in a ring-like pattern, which is advantageous for achieving a more uniform lighting effect. One or more driving circuit elements are arranged on the surface of the substrate facing away from the globe, so that the driving circuit elements do not block the light emitted from the light-emitting elements, contributing to improved lighting effects. Furthermore, the above-described arrangement of the driving circuit elements provides greater design flexibility, allowing for the use of slightly larger driving circuit elements as long as a thin design is ensured. Furthermore, because the driving circuit elements are arranged on the surface of the substrate facing away from the globe, they can be closer to the heat sink, and if the driving circuit elements include heat-generating elements, the heat sink can also dissipate heat from the driving circuit elements. Furthermore, the multiple light-emitting elements are arranged on either side of the outer periphery of the substrate, corresponding to a planar heat sink with a recess, and the planar heat sink and the outer periphery of the substrate are in surface contact with each other, so that the heat sink efficiently dissipates heat from the light-emitting elements on the outer periphery of the substrate without interfering with the driving circuit elements on the substrate. The heat sink further includes a tubular heat dissipation section formed by extending and folding back the flat heat dissipation section, and the tubular heat dissipation section abuts against the inner wall of the housing so as to be in surface contact with the heat sink, thereby increasing the surface area of ​​the heat sink and dissipating more thermal energy, and allowing the heat energy from the light emitting element and the heat energy from the drive circuit element absorbed by the heat sink to be dissipated to the outside of the housing more quickly. Furthermore, because the flat heat dissipation section abuts against the substrate and the tubular heat dissipation section abuts against the inner wall of the housing, the heat sink not only provides a heat dissipation effect but also serves to fix or position the substrate to a certain extent within the housing, so that the substrate and housing can be fixed with fewer fastening materials or without the need for additional fastening materials, improving assembly and processing efficiency and contributing to reducing assembly and processing costs.

[0012] In a lighting device according to a preferred technical solution of the present disclosure, one or more driving circuit elements are disposed in a central portion of the substrate, and the planar heat dissipation portion is an annular heat dissipation portion, which prevents interference between the heat sink and the driving circuit elements when the driving circuit elements are mounted on the surface of the central portion of the substrate away from the globe, and simplifies the manufacturing process of the heat sink.

[0013] In the lighting device according to the preferred technical solution of the present disclosure, at least some of the driving circuit elements are heat generating elements, and the heat generating elements are one or more of a capacitor, an inductor, or a chip.

[0014] When some circuit elements serving as drive circuit elements, such as capacitors or inductances, operate, heat is generated in response to the operation of the circuit elements. The thermal energy generated by these heat-generating elements is transmitted to the space formed by the heat sink and the housing, where it is absorbed mainly by the cylindrical heat dissipation portion that contacts the inner wall surface of the housing and dissipated to the outside of the housing. In this way, the heat sink according to the present disclosure can achieve a slimmer overall lighting device and effectively improve the heat dissipation performance of the heat-generating elements.

[0015] In the lighting device according to the preferred technical solution of the present disclosure, the heating element has a lead portion, the substrate has a solder hole in the center, the lead portion passes through the solder hole, and the heating element and the substrate are fixed by soldering.

[0016] In a lighting device according to a preferred technical solution of the present disclosure, the driving circuit elements are concentrated in the center of the substrate and pass through the escape openings of the planar heat sink. This allows the driving circuit elements and the light emitting elements to be spaced apart, and some of the heat generated by the heat generating elements is absorbed by the relatively nearby planar heat sink, and then conducted to the tubular heat sink and dissipated to the housing. This larger heat dissipation area effectively improves the heat dissipation performance of the entire lighting device.

[0017] At the same time, the heat sink provides a heat dissipation function for some of the heat-generating driving circuit elements when there is no interference with the driving circuit elements, making the overall structure of the lighting device more compact, the performance more stable, and the service life longer.

[0018] In the lighting device according to the preferred technical solution of the present disclosure, a first fixing part is disposed on the substrate, and the planar heat dissipation part is fixed to the substrate by the first fixing part.

[0019] According to this preferred technical solution, the first fixing portion on the substrate more stably fixes the heat sink and the substrate to each other, thereby maintaining the planar heat dissipation portion in contact with the substrate and improving the heat dissipation effect.

[0020] In the lighting device according to the preferred technical solution of the present disclosure, the first fixing part includes an insertion hole provided on the substrate, and the planar heat dissipation part is provided with a plug that fits into the insertion hole.

[0021] According to this preferred technical solution, the combination of the insertion port and the plug simplifies the assembly process between the substrate and the heat sink, speeds up the insertion assembly, and reduces the process cost.

[0022] In the lighting device according to the preferred technical solution of the present disclosure, a second fixing part is disposed on the inner wall of the housing, and the heat sink is fixed to the housing by the second fixing part.

[0023] According to this preferred technical solution, the second fixing portion on the inner wall of the housing can more stably fix the heat sink and the housing to each other, and the fixing relationship formed by the heat sink abutting against the substrate can be used by the heat sink to play an auxiliary role in fixing the substrate, thereby fixing the substrate within the housing.

[0024] In a preferred technical solution of the present disclosure, the second fixing part includes a protruding block disposed on the inner wall of the housing, the surface of the protruding block closer to the opening being inclined away from the inner wall and away from the opening, and the cylindrical heat dissipation part of the heat sink has an engaging hole that fits the protruding block.

[0025] According to this preferred technical solution, the protruding block is engaged with the engaging hole, which simplifies the assembly process between the heat sink and the housing, realizes high-speed assembly, and reduces process costs.

[0026] The lighting device according to the preferred technical solution of the present disclosure further includes a conductive pin and a connector. The base of the conductive pin is located on one side of the housing away from the opening, and the conductive pin is inserted from the heat sink to the substrate. The connector is mounted on the substrate and electrically connected to the conductive pin.

[0027] According to this preferred technical solution, the conductive pins are arranged to supply power to the lighting device, and also to fix the position of the heat sink and the substrate. Since the connector electrically connected to the conductive pins is mounted on the substrate, the conductive pins can be mounted by assembling the connector and the conductive pins. Compared with the prior art, which requires soldering the conductive pins, this reduces assembly and processing costs and also avoids the problem of solder cracking and reduced conductivity over long-term use.

[0028] In a lighting device according to a preferred technical solution of the present disclosure, the connector is a sheet metal material, and one end of the sheet metal material is formed with a clamping arm that clamps the conductive pin, and the other end is formed with a folded surface that abuts against the surface of the substrate closer to the globe.

[0029] According to this preferred technical solution, since the connector is made of sheet metal, the sheet metal can be easily processed to form a clamping arm at one end and a folded surface at the other end, thereby achieving the effects of ensuring a reliable electrical connection with the conductive pin and stably fixing the conductive pin.

[0030] A lighting device with improved heat dissipation performance can be realized.

[0031] FIG. 1 is a diagram showing the structure of a lighting device of the prior art. FIG. 2 is a diagram schematically showing the structure of a lighting device according to an embodiment of the present disclosure. FIG. 3 is a diagram schematically showing the structure of a substrate and a driving circuit element according to an embodiment of the present disclosure. FIG. 4 is a diagram schematically showing the structure of a housing according to an embodiment of the present disclosure. FIG. 5 is a diagram showing a cross section of a lighting device according to an embodiment of the present disclosure. FIG. 6 is a diagram schematically showing the structure of a conductive pin and a connector according to an embodiment of the present disclosure. FIG. 7 is a diagram schematically showing the structure of a substrate and a heat sink according to an embodiment of the present disclosure.

[0032] (Embodiments) Hereinafter, the operating principles, technical features, advantages, etc. of the lighting device according to the present disclosure will be explained using examples. However, it should be understood that all descriptions are for the purpose of explaining specific examples, and that the present disclosure should not be understood as being limited by these descriptions.

[0033] It should be noted that with regard to any one independent technical feature described or implicitly included in the embodiments of the present text, or any one independent technical feature shown or implicitly included in each drawing, any combination of these technical features (or those considered equivalent) or the deletion of any one of them will not cause any technical problems, and therefore the present disclosure includes many other embodiments not directly described in the present text.

[0034] 2 , a lighting device 100 according to an embodiment of the present disclosure includes a housing 1, a globe 2, a substrate 3, a plurality of light-emitting elements 4, one or more driving circuit elements 5, and a heat sink 6. The housing 1 has an opening 10 at one end, and the globe 2 is disposed at one end of the housing 1 to cover the opening 10. The substrate 3 is disposed within the housing 1. The substrate 3 includes a substrate central portion 31 and a substrate peripheral portion 32 surrounding the substrate central portion 31. The plurality of light-emitting elements 4 are mounted on a surface of the substrate peripheral portion 32 closer to the globe 2. The one or more driving circuit elements 5 are mounted on a surface of the substrate 3 away from the globe 2. The heat sink 6 is disposed inside the housing 1 and located on the side of the substrate 3 away from the globe 2. The heat sink 6 includes a planar heat dissipation portion 61 and a tubular heat dissipation portion 62, the planar heat dissipation portion 61 having at least one escape opening 611 provided corresponding to the drive circuit element 5, the planar heat dissipation portion 61 being arranged in correspondence with the plurality of light-emitting elements 4 with the substrate outer periphery 32 sandwiched therebetween and abutting so as to make surface contact with the substrate outer periphery 32, and the tubular heat dissipation portion 62 being formed by extending and folding back the outer edge of the planar heat dissipation portion 61 and abutting so as to make surface contact with the inner wall of the housing 1.

[0035] Specifically, the light-emitting elements 4 and the drive circuit elements 5 of the lighting device 100 are both disposed on the substrate 3, and are separately disposed on both surfaces of the substrate 3. The light-emitting elements 4 are arranged in an array along the circumferential direction on the surface of the substrate 3, closer to the globe 2, in the outer peripheral portion 32 of the substrate 3 (the upper side in FIG. 2 ), while the drive circuit elements 5 are arranged on the surface of the substrate 3, farther from the globe 2, in the substrate central portion 31 of the substrate 3 (the lower side in FIG. 2 ). It should be noted here that some of the drive circuit elements 5, e.g., relatively large drive circuit elements 5, may be disposed on the lower surface of the substrate 3, and some of the drive circuit elements 5, e.g., relatively small drive circuit elements 5, may be disposed on the upper surface of the substrate 3. Furthermore, in the illustrated embodiment, the position of the drive circuit elements 5 in the substrate central portion 31 is merely a preferred embodiment of the present disclosure. As long as the drive circuit elements 5 and the light-emitting elements 4 can be mounted on the same substrate 3, the specific positions at which the drive circuit elements 5 are mounted on the substrate 3 may be adjusted according to actual needs.

[0036] The plurality of light-emitting elements 4 are arranged in an array in the circumferential direction on the outer periphery 32 of the substrate 3. This allows the plurality of light-emitting elements 4 to be arranged on the substrate 3 in a uniform and relatively dispersed manner, which is advantageous for achieving a more uniform lighting effect.

[0037] At the same time, as shown in FIG. 2 , the drive circuit element 5 is disposed on the lower surface of the substrate 3. This allows the drive circuit element 5 to avoid blocking the light emitted by the light-emitting element 4, thereby contributing to improved lighting effects. Furthermore, the position of the drive circuit element 5 further increases the design freedom of the drive circuit element 5. For example, a slightly larger drive circuit element 5 may be used, provided that the overall thinning of the lighting device 100 is ensured. Furthermore, because the drive circuit element 5 is disposed on the lower surface of the substrate 3, the drive circuit element 5 can be positioned even closer to the heat sink 6. This allows the heat sink 6 to efficiently dissipate heat to the drive circuit element 5 if the drive circuit element 5 includes a heat-generating element.

[0038] It should be noted here that the central portion 31 and the peripheral portion 32 of the substrate 3 are relative concepts and are not limited in size or proportionality to each other. The peripheral portion 32 is closer to the peripheral portion of the substrate 3 than the central portion 31, and the central portion 31 is closer to the central portion of the substrate 3 than the peripheral portion 32. As described above, the light-emitting elements 4 are mounted on the peripheral portion 32 and the driving circuit elements 5 are mounted on the central portion 31, but this is not limited to all the light-emitting elements 4 being located in the peripheral portion 32 and all the driving circuit elements 5 being located in the central portion 31. In a preferred embodiment, some of the light-emitting elements 4 may be located in the central portion 31 and some of the driving circuit elements 5 may be located in the peripheral portion 32. Some of the relatively small driving circuit elements 5 may be located on the upper surface of the substrate 3; that is, some of the relatively small driving circuit elements 5 and the light-emitting elements 4 may be located on the same surface of the substrate 3.

[0039] Specifically, in an embodiment of the present disclosure, the heat sink 6 includes a planar heat dissipation portion 61 and a tubular heat dissipation portion 62, the planar heat dissipation portion 61 is disposed between the plurality of light emitting elements 4, with the substrate outer periphery 32 sandwiched therebetween, and abuts so as to be in surface contact with the substrate outer periphery 32, and the tubular heat dissipation portion 62 is formed by extending and folding back the outer edge of the planar heat dissipation portion 61. In the embodiment shown in the figures, the tubular heat dissipation portion 62 is formed by extending and folding back the outer edge of the planar heat dissipation portion 61 downward, and abuts so as to be in surface contact with the inner wall of the housing 1.

[0040] By arranging the planar heat dissipation section 61 corresponding to and abutting the lower surface of the outer peripheral portion 32 of the substrate 3, heat can be dissipated more efficiently from the light emitting elements 4 arranged on the upper surface of the outer peripheral portion 32 of the substrate 3. Furthermore, because the planar heat dissipation section 61 has an escape opening 611, there is no interference between the planar heat dissipation section 61 and the drive circuit elements 5 on the lower surface of the central portion 31 of the substrate 3. At the same time, by arranging the cylindrical heat dissipation section 62 abutting the inner wall of the housing 1, the heat exchange area of ​​the entire heat sink 6 is increased, allowing more heat to be absorbed and the heat absorbed by the heat sink 6 to be dissipated more quickly to the outside of the housing 1 through the cylindrical heat dissipation section 62.

[0041] Furthermore, the planar heat dissipation portion 61 abuts against the outer peripheral portion 32 of the substrate 3, and the cylindrical heat dissipation portion 62 abuts against the inner wall of the housing 1. In this way, the substrate 3 is fixed to a certain extent by the action of the heat sink 6, or its position is fixed within the housing 1, so that the fastening material for fastening the substrate 3 to the housing 1 can be reduced or even eliminated, which contributes to improving the efficiency of assembly and processing and reducing the cost of assembly and processing.

[0042] What is described here is that the contact between the planar heat dissipation section 61 and the substrate outer peripheral portion 32 includes cases where the planar heat dissipation section 61 is in direct contact with the substrate outer peripheral portion 32, as well as cases where the planar heat dissipation section 61 is in indirect contact with the substrate outer peripheral portion 32 via a thermally conductive layer. In the latter case, the thermally conductive layer can be considered to be part of the planar heat dissipation section 61. In other words, since the heat sink 6 is composed of multiple portions made of different materials, any structure that generates thermal conduction between the planar heat dissipation section 61 and the substrate 3 and dissipates heat for the light emitting elements 4 on the substrate 3 falls within the technical scope of the heat sink 6 described in this disclosure. The same structure is also applicable to a structure in which the cylindrical heat dissipation section 62 is in contact with the inner wall of the housing 1, and therefore a description thereof will be omitted here.

[0043] In the illustrated embodiment, the planar heat dissipation portion 61 is an annular heat dissipation portion, that is, the escape opening 611 of the planar heat dissipation portion 61 is described as a through-hole in the center of the annular heat dissipation portion, but this disclosure is not limited to this, and any planar heat dissipation portion 61 that is disposed in correspondence with the light emitting element 4 across the substrate outer periphery 32 and abuts so as to be in surface contact with the substrate outer periphery 32 is within the technical scope of the disclosure. Furthermore, the size, number, etc. of the escape openings 611 may be determined according to the actual needs of the drive circuit element 5.

[0044] In the illustrated embodiment, the cylindrical heat dissipating portion 62 is formed so that the outer edge of the planar heat dissipating portion 61 extends downward in a folded manner, and the cylindrical heat dissipating portion 62 and the planar heat dissipating portion 61 are described as being basically perpendicular to each other, but the present disclosure is not limited to this, and any cylindrical heat dissipating portion 62 formed so that the outer edge of the planar heat dissipating portion 61 extends in a folded manner and can abut against the inner wall of the housing 1 is included within the technical scope of the present disclosure. In a preferred embodiment, the cylindrical heat dissipating portion 62 may be formed so that the outer edge of the planar heat dissipating portion 61 extends upward in an inclined manner.

[0045] In the illustrated embodiment, the cross section of the entire lighting device 100 is circular and includes a circular substrate 3 and a circular planar heat dissipation portion 61, but the present disclosure is not limited thereto. In other preferred embodiments, the lighting device 100 may be square, diamond-shaped, or have other shapes as a whole, and any technical solution in which the planar heat dissipation portion 61 is disposed in close contact with the substrate 3 corresponding to the light-emitting element 4 and the tubular heat dissipation portion 62 is disposed in close contact with the inner wall of the housing 1 falls within the scope of protection of the present disclosure.

[0046] 2 and 3 , at least some of the driving circuit elements 5 are heating elements 51, which may be one or more types of devices, such as a capacitor, an inductor, or a chip. As shown, the heating elements 51 have lead portions 511, which pass through solder holes 311 arranged in the substrate center portion 31 and are soldered to the substrate 3 on the side closer to the opening 10 of the substrate 3. When the substrate outer periphery 32 of the substrate 3 abuts against the planar heat dissipation portion 61, the driving circuit elements 5 pass through the escape openings 611 of the planar heat dissipation portion 61 and are surrounded by the tubular heat dissipation portion 62.

[0047] As described above, the heat sink 6 not only does not interfere with the drive circuit elements 5, but also uses both the planar heat dissipation portion 61 and the tubular heat dissipation portion 62 to provide heat dissipation for some of the heat-generating drive circuit elements 5, thereby providing more stable performance and extending the service life of the lighting device 100. Specifically, when the drive circuit elements 5 operate as heat-generating elements 51, the thermal energy generated by the heat-generating elements 51 is transferred to the space formed by the heat sink 6 and the housing 1, so that the thermal energy may be directly absorbed by the tubular heat dissipation portion 62 that is in surface contact with the inner wall of the housing 1 and then dissipated to the outside of the housing 1, or the planar heat dissipation portion 61 may absorb the heat and then conduct it to the tubular heat dissipation portion 62, which then dissipates the heat to the outside of the housing 1.

[0048] In a preferred embodiment, the drive circuit element 5 may be an element that generates almost no heat. In this case, the escape opening 611 provided in the center of the planar heat dissipation section 61 mainly serves the function of escape, thereby preventing interference between the drive circuit element 5 and the heat sink 6.

[0049] 2 and 7 , in the above embodiment, a first fixing portion is disposed on the substrate 3, and the planar heat sink 61 is fixed to the substrate 3 by the first fixing portion, the first fixing portion includes an insertion opening 33 provided on the substrate 3, and the planar heat sink 61 is provided with a plug 612 that fits into the insertion opening 33. The first fixing portion of the substrate 3 more stably fixes the heat sink 6 and the substrate 3 to each other, thereby maintaining the planar heat sink 61 in contact with the substrate 3 and improving the heat dissipation effect. The combination of the insertion opening 33 and the plug 612 simplifies the assembly process of the substrate 3 and the heat sink 6, enabling faster assembly by insertion and reducing process costs.

[0050] In the above embodiment, referring to Figures 2 and 4, a second fixing portion is further arranged on the inner wall of the housing 1, and the second fixing portion includes a plurality of convex blocks 12 arranged at intervals along the circumferential direction of the inner wall of the housing 1, and the surface A of the convex blocks 12 on the side closer to the opening 10 is inclined in the direction away from the inner wall and away from the opening 10, that is, as shown in Figure 4, the surface A is inclined downward.

[0051] 2, the cylindrical heat dissipation portion 62 of the heat sink 6 is provided with an engagement opening 621 that engages with the convex block 12, and the heat sink 6 is fixed to the housing 1 by the convex block 12 engaging with the engagement opening 621. Specifically, when assembling the heat sink 6 and the housing 1, when the heat sink 6 is pressed against the housing 1, the cylindrical heat dissipation portion 62 of the heat sink 6 is deformed toward the center by the guiding action of the inclined surface A, and further, the convex block 12 engages with the engagement opening 621, thereby completing the assembly of the heat sink 6 and the housing 1.

[0052] By arranging a simple convex block 12 on the inner wall of the housing 1 and providing a simple engagement opening 621 in the cylindrical heat dissipation section 62, the heat sink 6 and the housing 1 can be more stably fixed to each other by utilizing the relationship in which the two are assembled by engaging with each other, and the heat sink 6 can play the role of assisting the board 3 to fix the board 3 within the housing 1. By engaging the convex block 12 with the engagement opening 621, the assembly process between the heat sink 6 and the housing 1 can be simplified and the assembly process can be speeded up.

[0053] Although the example in which the convex block 12 is disposed on the inner wall of the housing 1 and the engagement opening 621 is provided in the cylindrical heat dissipation portion 62 has been described above, the present disclosure is not limited to this. A technical solution in which the engagement opening 621 is provided on the inner wall of the housing 1 and the convex block 12 is disposed in the cylindrical heat dissipation portion 62 also achieves the same technical effect, and both are within the scope of protection of the present disclosure.

[0054] At the same time, although the present disclosure has described the second fixing portion as an example of the convex block 12 disposed on the inner wall of the housing 1, the present disclosure is not limited thereto. Any structure that can realize fixing the heat sink 6 to the housing 1 or fixing the substrate 3 to the housing 1 falls within the scope of protection of the present disclosure.

[0055] 5 and 6 , in the above embodiment, the lighting device 100 further includes a conductive pin 7 and a connector 8. The conductive pin 7 is disposed in the housing 1, and a base of the conductive pin 7 may be fixed to the inner wall of the housing 1. One end of the conductive pin 7 extends in a direction away from the opening 10 of the housing 1, and the other end of the conductive pin 7 passes through the heat sink 6 and the substrate 3, in that order. The connector 8 is mounted on the side of the substrate 3 closer to the opening 10, and is electrically connected to the end of the conductive pin 7 that passes through the substrate 3.

[0056] The conductive pins 7 are disposed to supply power to the lighting device 100, and also to fix the position of the heat sink 6 and the substrate 3. In the illustrated embodiment, the substrate 3 is fixed within the housing 1 by the conductive pins 7 being fixed to the housing 1. In this embodiment, no fasteners such as screws are used between the substrate 3 and the housing 1, thereby reducing assembly and processing costs. Furthermore, by mounting a connector 8 electrically connected to the conductive pins 7 on the substrate 3, the soldering step of soldering the conductive pins 7 to the surface of the substrate 3, as in the prior art, can be eliminated, thereby reducing assembly and processing costs and avoiding the problem of the solder cracking over long-term use, which requires the conductivity to be determined.

[0057] As a specific example, the use of a sheet metal material 8 as a connector 8 will be described below. The sheet metal material 8 can be easily processed into a shape in which a clamping arm 81 is formed at one end and a folded surface 82 is formed at the other end. The conductive pin 7 is clamped by the clamping arm 81 of the sheet metal material 8, and the folded surface 82 abuts against the upper surface of the substrate 3, and the sheet metal material 8 and the conductive pin 7 are assembled, eliminating the need for a separate processing step such as soldering. This simplifies the assembly process of the conductive pin 7 and achieves the goal of high-speed assembly.

[0058] As described above, the preferred embodiments of the present disclosure have been described, but these embodiments are not intended to limit the present disclosure. Any modifications, equivalent replacements, or improved technical features made within the scope of the present disclosure are all included in the protection scope of the present disclosure.

[0059] REFERENCE SIGNS LIST 100 Lighting device 1 Housing 10 Opening 12 Convex block 2 Globe 3 Board 31 Board center 311 Solder hole 32 Board outer periphery 33 Insertion opening 4 Light emitting element 5 Drive circuit element 51 Heat generating element 511 Lead portion 6 Heat sink 61 Planar heat dissipation portion 611 Retraction opening 612 Plug 62 Cylindrical heat dissipation portion 621 Engagement opening 7 Conductive pin 8 Connector (sheet metal material) 81 Clamping arm 82 Folded surface 101 Circuit board 102 Storage groove 104 Second position limiting portion 1042 First engagement portion 1045 Second engagement portion 1051 First heat sink 10511 Heat dissipation side portion 106 LED light emitting module

Claims

1. A lighting device comprising: a housing having an opening at one end; a globe located at one end of the housing so as to cover the opening; a substrate located within the housing and including a substrate central portion and a substrate outer periphery surrounding the substrate central portion; a plurality of light-emitting elements mounted on a surface of the substrate outer periphery closer to the globe; one or more drive circuit elements mounted on a surface of the substrate away from the globe; and a heat sink located within the housing and on a side of the substrate away from the globe, wherein the heat sink includes a planar heat dissipation portion and a tubular heat dissipation portion, the planar heat dissipation portion has at least one escape opening provided corresponding to the drive circuit elements, the planar heat dissipation portion is located between the plurality of light-emitting elements and the substrate outer periphery and abuts so as to make surface-to-surface contact with the substrate outer periphery, and the tubular heat dissipation portion is formed by extending and folding back an outer edge of the planar heat dissipation portion, and abuts so as to make surface-to-surface contact with an inner wall of the housing.

2. The lighting device according to claim 1, wherein one or more of the driving circuit elements are mounted in a central portion of the substrate, and the planar heat dissipation portion is an annular heat dissipation portion.

3. The lighting device according to claim 2, wherein at least a portion of the driving circuit elements are heat generating elements, and the heat generating elements are either a capacitor, an inductor or a chip.

4. The lighting device according to claim 3, wherein the heat generating element has a lead portion, a solder hole is provided in the center of the substrate, the lead portion passes through the solder hole, and the heat generating element and the substrate are fixed by soldering.

5. The lighting device according to claim 4, wherein the heat generating element passes through a central through hole of the annular heat dissipation portion and is surrounded by the cylindrical heat dissipation portion.

6. The lighting device according to claim 1, wherein a first fixing portion is disposed on the substrate, and the planar heat dissipation portion is fixed to the substrate by the first fixing portion.

7. The lighting device according to claim 6, wherein the first fixing portion includes an insertion opening provided in the substrate, and the flat heat dissipation portion is provided with a plug that fits into the insertion opening.

8. The lighting device according to claim 1, wherein a second fixing portion is disposed on an inner wall of the housing, and the cylindrical heat dissipation portion is fixed to the housing by the second fixing portion.

9. The lighting device as described in claim 8, wherein the second fixing portion includes a convex block placed on the inner wall of the housing, the surface of the convex block closer to the opening is inclined in a direction away from the inner wall in a direction away from the opening, and the cylindrical heat dissipation portion has an engagement opening that fits into the convex block.

10. The lighting device according to claim 1, further comprising: a conductive pin disposed within the housing, one end extending from one side of the housing away from the opening and the other end being inserted through the heat sink and into the board; and a connector mounted on the board and electrically connected to the conductive pin.

11. The lighting device according to claim 10, wherein the connector is a sheet metal material, one end of the sheet metal material is formed with a clamping arm that clamps the conductive pin, and the other end of the sheet metal material is formed with a folded surface that abuts against the surface of the substrate closer to the globe.

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