Electronic device comprising heat dissipation structure

Abstract

The present disclosure relates to an electronic device. An electronic device according to one embodiment of the present disclosure may comprise: a first printed circuit board including a first surface and a second surface facing the opposite direction of the first surface; a second printed circuit board including a third surface facing the first surface and a fourth surface facing the opposite direction of the third surface, and spaced apart from the first printed circuit board; an interposer disposed between the first printed circuit board and the second printed circuit board and extending along at least a portion of an edge of the third surface to form an inner space; an electronic component mounted on the fourth surface of the second printed circuit board; a shield can mounted on the first surface of the first printed circuit board; and a heat dissipation material positioned between the third surface and the shield can.

Description

Electronic devices including heat dissipation structures

[0001] The present disclosure relates to electronic devices, and for example, to electronic devices including a heat dissipation structure of an electronic component.

[0002] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0003] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure may include a first printed circuit board including a first surface and a second surface facing in an opposite direction to the first surface, a second printed circuit board including a third surface facing the first surface and a fourth surface facing in an opposite direction to the third surface and spaced apart from the first printed circuit board, an interposer disposed between the first printed circuit board and the second printed circuit board and extending along at least a portion of an edge of the third surface to form an internal space, an electronic component mounted on the fourth surface of the second printed circuit board, a shield can mounted on the first surface of the first printed circuit board, and a heat dissipation material positioned between the third surface and the shield can.

[0005] An electronic device according to one embodiment of the present disclosure may include a first printed circuit board including a first surface and a second surface facing in an opposite direction to the first surface, a second printed circuit board including a third surface facing the first surface and a fourth surface facing in an opposite direction to the third surface and spaced apart from the first printed circuit board, an interposer disposed between the first printed circuit board and the second printed circuit board and extending along at least a portion of an edge of the third surface to form an internal space, an electronic component mounted on the fourth surface of the second printed circuit board, a shield can mounted on the first surface of the first printed circuit board, a heat dissipation material positioned between the third surface and the shield can, and a heat dissipation member positioned between a first surface of the electronic device and the electronic component and extending along the first surface, wherein the shield can be positioned between a second surface of the electronic device opposite the first surface and the electronic component.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is a perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is a perspective view of an electronic device showing a rear side of the electronic device according to one embodiment of the present disclosure.

[0009] FIG. 4 is an exploded perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0010] FIG. 5 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 6 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 7 is a drawing for explaining injecting a heat dissipating material into an internal space between a first printed circuit board and a second printed circuit board according to one embodiment of the present disclosure.

[0013] FIG. 8 is a drawing for explaining the distribution of a heat dissipation material on a first printed circuit board according to one embodiment of the present disclosure.

[0014] FIG. 9 is a drawing for explaining the distribution of a heat dissipation material on a second printed circuit board according to one embodiment of the present disclosure.

[0015] FIG. 10 is a drawing for explaining a plurality of areas projected onto a second printed circuit board according to one embodiment of the present disclosure.

[0016] FIG. 11 is a drawing for explaining the arrangement of a plurality of shield candles and through holes according to one embodiment of the present disclosure.

[0017] FIG. 12 illustrates a state in which the shield candle is removed from FIG. 11, according to one embodiment of the present disclosure.

[0018] FIG. 13 is a graph showing the temperature of an electronic component according to the amount of injected heat-dissipating material, according to one embodiment of the present disclosure.

[0019] FIG. 14 illustrates the location of a heat dissipating material on a first printed circuit board according to one embodiment of the present disclosure.

[0020] FIG. 15 illustrates the location of a heat dissipating material on a second printed circuit board according to one embodiment of the present disclosure.

[0021] FIG. 16 illustrates a plurality of regions projected onto a second printed circuit board according to one embodiment of the present disclosure.

[0022] FIG. 17 illustrates a shield can and a heat dissipation material according to one embodiment of the present disclosure.

[0023] FIG. 18 illustrates a plurality of regions on a second printed circuit board according to one embodiment of the present disclosure.

[0024] FIG. 19 is a cross-sectional view of a portion of an electronic device showing a plurality of shield candles according to one embodiment of the present disclosure.

[0025] FIG. 20 is a cross-sectional view of a portion of an electronic device showing a first interposer and a second interposer according to one embodiment of the present disclosure.

[0026] FIG. 21 illustrates a first printed circuit board according to one embodiment of the present disclosure.

[0027] FIG. 22 illustrates a second printed circuit board and an interposer according to one embodiment of the present disclosure.

[0028] FIG. 23 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 24 illustrates views of an electronic component and a solid heat transfer member disposed on the electronic component from two directions according to one embodiment of the present disclosure.

[0030] FIG. 25 illustrates views of a heat transfer member and an electronic component on a gel compressed by a conductive layer from two directions according to one embodiment of the present disclosure.

[0031] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0032] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0033] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0035] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0058] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0059] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0060] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0061] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0062] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0063] FIG. 2 is a perspective view of an electronic device (101) showing a front side (210A) of the electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device (101) showing a rear side (210B) of the electronic device (101) according to one embodiment of the present disclosure.

[0064] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment of the present disclosure may include a first surface (or front surface) (210A), a second surface (or back surface) (210B), and a third surface (or side surface) (210C) surrounding a space between the first surface (210A) and the second surface (210B).

[0065] According to one embodiment of the present disclosure, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and includes a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0066] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0067] According to one embodiment of the present disclosure, the display (220) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (220) may be formed to be substantially identical to the adjacent outer shape of the front plate (202).

[0068] In one embodiment of the present disclosure (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment of the present disclosure (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment of the present disclosure (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0069] According to one embodiment of the present disclosure, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sounds, and in one embodiment, multiple microphones may be disposed so as to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0070] According to one embodiment of the present disclosure, the sensor modules (204, 219) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor modules (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] According to one embodiment of the present disclosure, the camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (101), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (219).

[0072] According to one embodiment of the present disclosure, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0073] According to one embodiment of the present disclosure, the light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0074] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0075] FIG. 4 (eg, and with reference to any of the previous drawings (FIGS. 1-3)) is an exploded perspective view of an electronic device (101) showing a front side (210A) of the electronic device (101), according to one embodiment of the present disclosure.

[0076] Referring to FIG. 4, an electronic device (101) according to one embodiment of the present disclosure may include a side structure (231), a first support member (232) (e.g., a bracket), a display (220), at least one printed circuit board (or board assembly) (240a, 240b), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (214), and a rear plate (211). When including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit board (240a, 240b) may include a first circuit board (240a) positioned above the battery (250) and a second circuit board (240b) positioned below the battery (250), and a flexible printed circuit board (240c) may electrically connect the first circuit board (240a) and the second circuit board (240b).

[0077] According to one embodiment of the present disclosure, the first support member (232) may be provided with at least a portion having a flat shape (e.g., at least a portion having a substantially flat shape). In one embodiment, the first support member (232) may be disposed within the electronic device (101) and connected to the side structure (231), or may be formed integrally with the side structure (231). The first support member (232) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When the first support member (232) is at least partially formed of a metallic material, the side structure (231) or a portion of the first support member (232) may function as an antenna. The first support member (232) may have a display (220) coupled to one surface and a printed circuit board (240a, 240b) coupled to the other surface. The printed circuit board (240a, 240b) may be equipped with an interposer, a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0078] According to one embodiment of the present disclosure, the front plate (202) may be coupled to the support member (232) via an adhesive member. The front plate (202) may be referred to as a "cover" or a "front cover." The rear plate (211) may be referred to as a "cover" or a "rear cover." The edge of the rear cover (211) may be supported by the support member (232).

[0079] According to one embodiment of the present disclosure, the first support member (232) and the side structure (231) may be combined to form a front case or housing (230). The housing (230) may also be referred to as a frame (230). According to one embodiment, the housing (230) may be generally understood as a structure for housing, protecting, or arranging a printed circuit board (240a, 240b), and / or a battery (250). In an embodiment, the housing (230) may be understood as supporting, accommodating, protecting, or arranging one or more additional features or components of the electronic device (101).

[0080] In one embodiment of the present disclosure, the housing (230) may be understood to include structures that can be visually or tactilely perceived by a user on the exterior of the electronic device (101), for example, a side structure (231), a front plate (202), and / or a rear plate (211). The housing (230) may include the side structure (231), a first support member (232), a front plate (202), and a rear plate (211). In one embodiment of the present disclosure, the 'front or rear of the housing (230)' may refer to the front plate (202) or the rear plate (211). In one embodiment, the first support member (232) is disposed between the front plate (202) and the rear plate (211), and may function as a structure for arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or a camera assembly (214).

[0081] In one embodiment of the present disclosure, the memory (e.g., memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0082] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0083] According to one embodiment of the present disclosure, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., the first circuit board (240a)) together with a portion of the first support member (232). For example, the upper support member (260a) of the second support member (260) may be arranged to face the first support member (232) with the first circuit board (240a) interposed therebetween.

[0084] In one embodiment of the present disclosure, the lower support member (260b) of the second support member (260) may be disposed to face the first support member (232) with the second circuit board (240b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be disposed on the printed circuit boards (240a, 240b), and according to an embodiment, the printed circuit boards (240a, 240b) may be provided with an electromagnetic shielding environment from the second support member (260). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be disposed.

[0085] In one embodiment of the present disclosure, electrical / electronic components such as a speaker module, interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). For example, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (232).

[0086] The battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0087] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (211) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (231) and / or a portion or a combination of the first support member (232).

[0088] According to one embodiment of the present disclosure, the electronic device (101) may include a metal cover (M). The metal cover (M) may cover the substrate assembly (240a). As an example, the metal cover (M) may be a portion of a housing (230) that faces the display (220) and covers the substrate assembly (240a).

[0089] According to one embodiment of the present disclosure, the electronic device (101) may include a heat dispersion member (V). Heat generated inside the electronic device (101) may be dispersed and / or released to the outside of the electronic device (101) through the heat dispersion member (V). The heat dispersion member (V) may be disposed on the metal cover (M). For example, heat generated in an electronic component may be transferred to the battery (250) through the heat dispersion member (V). For example, the heat dispersion member (V) may include a vapor chamber or a heat pipe.

[0090] FIG. 5 is a cross-sectional view of a portion of an electronic device (101) according to one embodiment of the present disclosure. FIG. 6 is a cross-sectional view of a portion of an electronic device (101) according to one embodiment of the present disclosure.

[0091] According to one embodiment of the present disclosure, an electronic device (101) may include a first printed circuit board (310). The first printed circuit board (310) may include a first side (311) and a second side (312) facing in an opposite direction to the first side (311). Components (342, 345) of the electronic device (101) may be mounted on the first side (311) and / or the second side (312).

[0092] According to one embodiment of the present disclosure, an electronic device (101) may include a second printed circuit board (320). The second printed circuit board (320) may be spaced apart from a first printed circuit board. The second printed circuit board (320) may be positioned to face the first printed circuit board. The second printed circuit board (320) may include a third side (321) facing the first side (311) of the first printed circuit board (310). The second printed circuit board (320) may include a fourth side (322) facing the opposite direction of the third side (321).

[0093] According to one embodiment of the present disclosure, an electronic device (101) may include an interposer (330) disposed between a first printed circuit board (310) and a second printed circuit board (320). The interposer (330) may be disposed between a first side (311) of the first printed circuit board (310) and a third side (321) of the second printed circuit board (320). The interposer (330) may be connected to the first printed circuit board (310) and the second printed circuit board (320). The interposer (330) may include at least one via in a portion (332) (see FIG. 9). The first printed circuit board (310) and the second printed circuit board (320) may be electrically or mechanically connected through the interposer (330). For example, at least one electronic component disposed on at least a portion of the first printed circuit board (310) and / or the second printed circuit board (320) may be electrically connected to each other through at least one via included in the interposer (330).

[0094] According to one embodiment of the present disclosure, an interposer (330) may extend between a first printed circuit board (310) and a second printed circuit board (320) to form an inside space (331). In an embodiment, the inside space (331) may be formed by a first surface (311) of the first printed circuit board (310), a third surface (321) of the second printed circuit board (320), and an inward facing surface of the interposer (330) extending between the first printed circuit board (310) and the second printed circuit board (320). A plurality of components may be arranged in the inside space (331). As an example, the interposer (330) may extend in a loop shape between the first printed circuit board (310) and the second printed circuit board (320). As another example, the interposer (330) may include a plurality of interposers (not shown), which together may form an internal space (331).

[0095] According to one embodiment of the present disclosure, the interposer (330) may extend along at least a portion of an edge (311e, see FIG. 8) of a first side (311) of a first printed circuit board (310) or an edge (321e, see FIG. 9) of a third side (321) of a second printed circuit board (320) (e.g., a border). As an example, the interposer (330) may extend along a portion of an edge (311e, see FIG. 8) of the first side (311) or an edge (321e, see FIG. 9) of the third side (321), and may form an internal space (331) together with a structure (not shown) protruding from the edge (311e, see FIG. 8) of the first side (311) or the edge (321e, see FIG. 9) of the third side (321). As another example, the interposer (330) may extend along an edge (311e, see FIG. 8) of the first side (311) or an edge (321e, see FIG. 9) of the third side (321) to form an internal space (331).

[0096] According to one embodiment of the present disclosure, an electronic device (101) may include an electronic component (E1). As an example, the electronic component (E1) may include an application processor. The electronic component (E1) may be mounted on a fourth surface (322) of a second printed circuit board (320). That is, the electronic component (E1) may be mounted on a fourth surface (322) opposite to a third surface (321) facing the internal space (331) so as to be positioned or arranged outside the internal space (331). During the operation of the electronic component (E1), heat may be generated, and the generated heat may be transferred to the third surface (321) of the second printed circuit board (320).

[0097] According to one embodiment of the present disclosure, the electronic device (101) may include at least one shield can (341, 344). That is, in the embodiment, the electronic device (101) may include one or more shield cans (e.g., at least one shield can). The shield cans (341, 344) may be mounted on the first surface (311) of the first printed circuit board (310). Components (342, 345, e.g., GPS) may be disposed inside the shield cans (341, 344). In the embodiment, at least one component may be disposed inside each shield can (341, 344), for example, at least one component (342) may be disposed inside the shield can (341), and at least one component (345) may be disposed inside the shield can (344). The shield cans (341, 344) can be connected to (e.g., mounted on) the first printed circuit board (310). In other words, the components (342, 345) can be shielded from the internal space (331) by at least one shield can (341, 344). The shield cans (341, 344) illustrated in FIG. 5 may be named a first shield can (341) and a second shield can (344), respectively, and the same reference numerals may be applied to them.

[0098] According to one embodiment of the present disclosure, the internal space (331) may include a first region (331a) and a second region (331b). The first region (331a) may be understood as an interstice (e.g., a first interstice) between a first surface (311) of a first printed circuit board (310) on which a shield can (341, 344) is not arranged and a third surface (321) of a second printed circuit board (320) facing therewith. The second region (331b) may be understood as an interstice (e.g., a second interstice) between the upper surfaces (341s, 344s) of the shield cans (341, 344) and the third surface (321). The second region (331b) may include a space between the upper surface (341s) of the first shield can (341) and an area of ​​the third surface (321) facing therewith, and a space between the upper surface (344s) of the second shield can (344) and an area of ​​the third surface (321) facing therewith.

[0099] According to one embodiment of the present disclosure, a gap (G2) between the top surface (341s, 344s) of the shield can (341, 344) facing the third surface (321) of the second printed circuit board and the third surface (321) may be smaller than a gap (G1) between the first surface (311) and the third surface (321) of the first printed circuit board (310). An interstice (e.g., a second area (331b) of the internal space (331)) having a width smaller than the width of the first area (331a) of the internal space (331) (e.g., a gap (G2) between the upper surface (341s, 344s) of the shield can (341, 344) and the third area (321)) can be formed between the shield can (341, 344) and the third area (321).

[0100] According to one embodiment of the present disclosure, the shield cans (341, 344) may protrude from the first side (311) of the first printed circuit board (310) toward the third side (321) of the second printed circuit board (320). The shield cans (341, 344) may be disposed in the internal space (331). By virtue of the shield cans (341, 344), the volume of the internal space (331) in which the heat dissipation material (350) is disposed may be reduced. That is, in the embodiment, the total area of ​​the internal space (331) in which the heat dissipation material (350) is disposed may be reduced in terms of the area formed inside each shield can (341, 344).

[0101] According to one embodiment of the present disclosure, an electronic device (101) may include a heat dissipation material (350). The heat dissipation material (350) may be disposed in an internal space (331). For example, the heat dissipation material (350) may be positioned between a third surface (321) of a second printed circuit board (320) and a shield can (341, 344). The heat dissipation material (350) may contact the third surface (321) of the second printed circuit board (e.g., at least a portion of the third surface (321)). The heat dissipation material (350) may absorb heat generated from an electronic component (E1) through the third surface (321).

[0102] According to one embodiment of the present disclosure, the heat dissipating material (350) may have a viscosity within a predetermined range. Even if an external force is applied to the electronic device (101), the heat dissipating material (350) may not flow with a large displacement in the internal space (331) due to its viscosity. Unlike a liquid, the heat dissipating material (350) has high viscosity and thus does not flow with a large displacement in the internal space (331), and thus may be understood as a gel-like material. As an example, the heat dissipating material may include heat dissipating particles (e.g., Al2O3 and / or AlN), additives (such as a curing agent and a catalyst), silicone resin, silicone oil, and the like.

[0103] According to one embodiment of the present disclosure, the heat dissipation material (350) may include a first portion (351) disposed between the upper surface (341s, 344s) of the shield can (341, 344) and the third surface (321) of the second printed circuit board (320). Here, the upper surface (341s, 344s) may define a surface of the shield can (341, 344) that faces inward (e.g., toward the internal space (331) and toward the third surface (321) of the second printed circuit board (320). The heat dissipation material (350) may be stably disposed between the upper surface (341s, 344s) of the shield can (341, 344) and the third surface (321) of the second printed circuit board (320) by the shield can (341, 344). Accordingly, the heat dissipation material (350) can be stably placed in one area of ​​the internal space (331) through the shield can (341, 344), and the amount of the heat dissipation material (350) placed in the internal space (331) can be minimized and / or reduced.

[0104] According to one embodiment of the present disclosure, the heat dissipation material (350) may include a second portion (352) disposed between a first side (311) of a first printed circuit board (310) and a third side (321) of a second printed circuit board (320). The second portion (352) of the heat dissipation material (350) may include a portion disposed between an area of ​​the first side (311) where the shield can (341, 344) is not disposed and the third side (321).

[0105] According to one embodiment of the present disclosure, the electronic device (101) may include a through hole (313) disposed (e.g., formed through, penetrated) in a first printed circuit board (310). The through hole (313) may penetrate a first surface (311) and a second surface (312) of the first printed circuit board (310). The through hole (313) may be located on an outer side of a shield can (341, 344). The through hole (313) may be disposed adjacent to the shield can (341, 344). That is, in the embodiment, the through hole (313) may be disposed on a first surface (311) between the shield cans (341, 344) (or extend through the first surface (311)). At least one shield can (341, 344) may partially surround the through hole (313) (e.g., may be positioned adjacent to at least a portion of the edge / perimeter of the through hole (313)). The through hole (313) may be open toward the interior space (331). The through hole (313) is described in detail with reference to FIG. 7.

[0106] According to one embodiment of the present disclosure, the electronic device (101) may include a cap (C). The cap (C) may cover a through hole (313). The cap (C) may be disposed on a second surface (312) of a first printed circuit board (310). As an example, the cap (C) may include a plurality of slits.

[0107] According to one embodiment of the present disclosure, the electronic device (101) may further include a plurality of mounting components (E3, E4, E5, E6). The plurality of mounting components (E3, E4, E5, E6) may be mounted on a first printed circuit board (310) and / or a second printed circuit board (320). The plurality of mounting components (E3, E4, E5, E6) may be mounted on a first side (311) and / or a second side (312) of the first printed circuit board (310). The plurality of mounting components (E3, E4, E5, E6) may be mounted on a third side (321) and / or a fourth side (322) of the second printed circuit board (320). As an example, the plurality of mounting components (E3, E4, E5, E6) may include, but are not limited to, power control components (e.g., Power Management Integrated Circuit), communication components (e.g., Radio Frequency Integrated Circuit or Intermediate Frequency Integrated Circuit), or electrical components such as capacitors.

[0108] According to one embodiment of the present disclosure, the plurality of mounting components (E3, E4, E5, E6) may include a first mounting component (E3). The first mounting component (E3) may be positioned between the upper surface (341s) of the first shield can (341) and the third surface (321) of the second printed circuit board (320). The first mounting component (E3) may be mounted on an area of ​​the third surface (321) facing the upper surface (341s) of the first shield can (341).

[0109] According to one embodiment of the present disclosure, the plurality of mounting components (E3, E4, E5, E6) may include a second mounting component (E4). The second mounting component (E4) may be positioned between the upper surface (344s) of the second shield can (344) and the third surface (321) of the second printed circuit board (320). The second mounting component (E4) may be mounted on an area of ​​the third surface (321) facing the upper surface (344s) of the second shield can (344).

[0110] According to one embodiment of the present disclosure, the plurality of mounting components (E3, E4, E5, E6) may include a third mounting component (E5). The third mounting component (E5) may be mounted on an area of ​​a third surface (321) of a second printed circuit board (320) that does not face the upper surfaces (341s, 344s) of the shield candles (341, 344). The plurality of mounting components (E3, E4, E5, E6) may include a fourth mounting component (E6). The fourth mounting component (E6) may be mounted on an area of ​​a first surface (311) of a first printed circuit board (310) where the shield candles (341, 344) are not arranged.

[0111] FIG. 7 is a drawing for explaining injecting a heat dissipating material (350') into an internal space (331) between a first printed circuit board (310) and a second printed circuit board (320) according to one embodiment of the present disclosure. According to one embodiment of the present disclosure, the heat dissipating material (350') can be injected into the internal space (331) through a through hole (313). The heat dissipating material (350') can be injected into the internal space (331) through an (injector, I). However, the method of placing the heat dissipation material (350') in the internal space (331) is not limited thereto, and in another embodiment, the heat dissipation material (350') may be placed in the internal space (331) by applying the heat dissipation material (350') on the third surface (321) and then covering the first printed circuit board (310) on which the shield can (341, 344) is mounted.

[0112] According to one embodiment of the present disclosure, the injector (I) can be inserted into the internal space (331) by passing through the slit and the through hole (313) of the cap (C) in sequence. The heat dissipation material (350') can be introduced into the internal space (331) through the injector (I). The injected heat dissipation material (350') can spread into the internal space (331) along the third surface (321) of the second printed circuit board (320). As the heat dissipation material (350') spreads into the internal space (331) based on the injector (I), the speed at which it spreads can be reduced by colliding with the shield cans (341, 344), components mounted on the first surface (311) of the first printed circuit board (310), or components mounted on the third surface (321) of the second printed circuit board (320).

[0113] According to one embodiment of the present disclosure, the speed at which the heat dissipation material (350') spreads when passing through a narrow gap (e.g., the second region (331b) of the internal space (331)) between the shield can (341, 344) and the third surface (321) may be smaller than the speed at which the heat dissipation material (350') spreads when passing between the first surface (311) and the third surface (321). Therefore, the rough distribution of the heat dissipation material (350') injected into the internal space (331) can be controlled through the arrangement of the shield cans (341, 344).

[0114] According to one embodiment of the present disclosure, the fact that the heat-dissipating material (350') is injected into the internal space (331) through the through-hole (313) may include a case where the heat-dissipating material (350') is injected into the internal space (331) by directly passing through the through-hole (313). In addition, the fact that the heat-dissipating material (350') is injected into the internal space (331) through the through-hole (313) may include a case where an injector (I) is inserted into the internal space (331) through the through-hole (313), and then the heat-dissipating material (350') is injected into the internal space (331) through the inserted injector (I).

[0115] FIG. 8 is a drawing for explaining the distribution of a heat dissipation material (350) on a first printed circuit board (310) according to one embodiment of the present disclosure. FIG. 9 is a drawing for explaining the distribution of a heat dissipation material (350) on a second printed circuit board (320) according to one embodiment of the present disclosure.

[0116] Referring to FIGS. 8 and 9, according to one embodiment of the present disclosure, an interposer (330) may extend over a first printed circuit board (310). For example, the interposer (330) may extend along an edge (311e) of the first printed circuit board (310). A plurality of vias connected to the interposer (330) may be arranged on the outside of the edge (311b).

[0117] According to various embodiments of the present disclosure, the electronic device (101) may include at least one shield can (341, 344, 347). According to one embodiment of the present disclosure, the electronic device (101) may include a plurality (e.g., three) of shield cans (341, 344, 347), as illustrated in FIG. 8. According to another embodiment of the present disclosure (e.g., see FIG. 17), the electronic device (101) may include one shield can, including a single shield can, unlike that illustrated in FIG. 8.

[0118] According to one embodiment of the present disclosure, a plurality of shield candles (341, 344, 347) may be arranged adjacent to the through hole (313). For example, a distance between the plurality of shield candles (341, 344, 347) and the through hole (313) may be 1 mm to 2 mm. The plurality of shield candles (341, 344, 347) may be arranged along a border of the through hole (313) so as to at least partially surround the through hole (313) (e.g., may be arranged adjacent to at least a portion of an edge / circumference of the through hole (313)).

[0119] According to one embodiment of the present disclosure, the third side (321) of the second printed circuit board (320) may include a first region (321c). The first region (321c) is a region corresponding to the electronic component (E1), and as an example, may include a region overlapping the electronic component (E1) when viewed from above the third side (321). The first region (321c) may include a region facing in the opposite direction of a region of the fourth side (322) on which the electronic component (E1) is mounted.

[0120] According to one embodiment of the present disclosure, the third side (321) of the second printed circuit board (320) may include a core region (B1, B2). The core region (B1, B2) is a region corresponding to a region with a large amount of heat generation in the electronic component (E1), and may be, for example, a region corresponding to a processing core of a processor (e.g., processor (120) of FIG. 1).

[0121] According to one embodiment of the present disclosure, the third surface (321) of the second printed circuit board (320) may include a third region (313a). The third region (313a) corresponds to the through hole (313), and as an example, may include a region overlapping the through hole (313) when viewed from above the third surface (321). It can be understood that the heat dissipation material (350) spreads radially based on the third region (313a) corresponding to the through hole (313). The first region (321c), the core regions (B1, B2), and the third region (313a) will be described in detail with reference to FIGS. 9 and 10 .

[0122] FIG. 10 is a drawing for explaining a plurality of areas projected onto a second printed circuit board according to one embodiment of the present disclosure.

[0123] Referring to FIGS. 9 and 10 , according to one embodiment of the present disclosure, a third surface (321) of a second printed circuit board (320) may include a second region (341a, 344a) (e.g., a plurality of second regions) facing a top surface (341s, 344s of FIG. 8) of a shield can (341, 344). That is, the second region (341a) (among the plurality of second regions) may correspond to a region facing the shield can (341) (top surface (341s)), and the second region (344a) may correspond to a region facing the shield can (344) (top surface (344s)). The second region (341a, 344a) may overlap at least partially with the first region (321c). The second region (341a, 344a) may include an area overlapping the shield can (341, 344) when viewed from above the third surface (321).

[0124] According to one embodiment of the present disclosure, the third side (321) of the second printed circuit board (320) may include a fourth side (321i) located inside the first side (321c). The fourth side (321i) may not overlap with the second sides (341a, 344a). The fourth side (321i) may be an area facing an area of ​​the first side (311, see FIG. 8) of the first printed circuit board (310) where the shield can (341, 344) is not disposed. The fourth side (321i) may surround the third side (313a) together with the second side (341a, 344a). The fourth side (321i) may extend from one side of the third side (313a) toward the border of the first side (321c).

[0125] According to one embodiment of the present disclosure, the third region (313a) may be located on the inner side of the first region (321c). When viewed from above on the third side (321) of the second printed circuit board (320), the through hole (313) may be covered by the electronic component (E1). Accordingly, the heat dissipation material (350) injected into the internal space (331) through the through hole (313) may move to the third side (321) of the second printed circuit board (320) and spread in the radial direction (see FIGS. 8 and 9) based on the third region (313a).

[0126] According to one embodiment of the present disclosure, the third region (313a) may be spaced apart from the central portion (321t) of the first region (321c). For example, the third region (313a) may be positioned closer to one side of the edge than the center of the first region (321c). In this case, the heat dissipation material (350) injected through the through hole (313) may not be evenly spread throughout the first region (321c). In addition, a large amount of the heat dissipation material (350) needs to be injected in order to contact the entire first region (321c) or the region spaced apart from the third region (313a) (e.g., the core region (B1, B2)).

[0127] According to one embodiment of the present disclosure, the heat dissipation material (350) injected through the through hole (313) can spread radially with respect to the third region (313a). The heat dissipation material (350) that spreads radially with respect to the third region (313a) can spread along the second region (341a, 344a) and the fourth region (321i). The speed at which the heat dissipation material (350) spreads along the second region (341a, 344a) can be lower than the speed at which it spreads along the fourth region (321i). Therefore, the heat dissipation material (350) can spread farther from the third region (313a) when it spreads along the fourth region (321i) compared to when it spreads along the second region (341a, 344a). Additionally, the heat dissipation material (350) can be controlled to spread to areas requiring heat dissipation (e.g., core areas (B1, B2)). Accordingly, the amount of heat dissipation material (350) used to increase the area covering the third area (313a) and the first area (321c) can be minimized and / or reduced.

[0128] According to one embodiment of the present disclosure, the second region (341a, 344a) may include edges (341b, 344b, 344c) corresponding to side surfaces of the shield cans (341, 344). The first edges (341b) and the second edges (344b) that are adjacent to each other may extend approximately parallel to each other. In an embodiment, the first edges (341b) and the second edges (344b) may correspond to adjacent side surfaces of the respective shield cans (341, 344) that are adjacent to each other. The first edges (341b) and the second edges (344b) may be spaced apart from each other by a first distance (d1).

[0129] According to one embodiment of the present disclosure, a third region (313a) may be arranged between a first edge (341b) and a third edge (344c). The first edge (341b) and the third edge (344c) may extend approximately parallel to each other. The first edge (341b) and the third edge (344c) may be spaced apart from each other by a second distance (d2). The second distance (d2) may be greater than the first interval (d1).

[0130] According to one embodiment of the present disclosure, a third region (313a) corresponding to a through hole (313) may have a predetermined diameter (D). The diameter (D) of the third region (313a) may be greater than the first distance (d1). The diameter (D) of the third region (313a) may be smaller than the second distance (d2).

[0131] According to one embodiment of the present disclosure, one end of the fourth region (321i) adjacent to the third region (313a) may have a predetermined width (d3). This width may be greater than the gap (d1) between two adjacent shield candles (341, 344) among the plurality of shield candles (341, 344, 347). The width (d3) of one end of the fourth region (321i) may be equal to or greater than the diameter (D) of the third region (313a).

[0132] FIG. 11 is a drawing for explaining the arrangement of a plurality of shield candles (341, 344, 347) and a through hole (313) according to one embodiment of the present disclosure.

[0133] Referring to FIG. 11, according to one embodiment of the present disclosure, a plurality of shield candles (341, 344, 347) may be arranged to at least partially surround the through hole (313). The plurality of shield candles (341, 344, 347) may be positioned adjacent to each other. According to another embodiment of the present disclosure (e.g., see FIG. 17), unlike that illustrated in FIG. 11, the electronic device (101) may include at least one (e.g., one or two) shield cans (not illustrated) arranged to at least partially surround the through hole (313). The number and shape of the shield cans are not limited to the various embodiments of the present disclosure, and may include a case where at least some (e.g., the first shield can (341) and the second shield can (344)) of the plurality of shield candles (341, 344, 347) illustrated in FIG. 11 are formed integrally.

[0134] According to one embodiment of the present disclosure, the first shield can (341) may include a base portion (341w) that contacts a conductive pad (314) disposed on a first surface (311) of the first printed circuit board (310). Solder cream may be applied between the conductive pad (314) and the base portion (341w). The first shield can (341) may include a plurality of base portions (341w), and a recess (341g) may be formed between the base portions (341w). The interior and the exterior of the first shield can (341) may be spatially connected through the recesses (341g).

[0135] According to one embodiment of the present disclosure, the first shield can (341) may include a first side portion (3411) that partially surrounds the through hole (313). The first shield can (341) may include a second side portion (3412) that extends from the first side portion (3411) and is adjacent to the second shield can (344). The first shield can (341) may include a third side portion (3413) that extends from the first side portion (3411) and is located further from the through hole (313) than the first side portion (3411).

[0136] According to one embodiment of the present disclosure, the second shield can (344) may include a first side portion (3441) that partially surrounds the through hole (313). The first side portion (3441) may be partially curved along the through hole (313). The second shield can (344) may include a second side portion (3442) that extends from the first side portion (3441) and is adjacent to the first shield can (341). The second shield can (344) may include a third side portion (3443) that extends from the first side portion (3441) and is located further from the through hole (313) than the first side portion (3441).

[0137] According to one embodiment of the present disclosure, the third shield can (347) may include a first side portion (3471) adjacent to a third side portion (3443) of the second shield can (344). The third shield can (347) may include a second side portion (3472) extending away from the through hole (313) from the first side portion (3441).

[0138] According to one embodiment of the present disclosure, the second side portion (3412) of the first shield can (341) may extend along the second side portion (3442) of the second shield can (344). The first side portion (3411) of the first shield can (341) and the first side portion (3441) of the second shield can (344) may extend to surround the through hole (313). The distance (G3) between the second side portion (3412) of the first shield can (341) and the second side portion (3442) of the second shield can (344) may be smaller than the distance (G31) between the first side portion (3411) of the first shield can (341) and the first side portion (3441) of the second shield can (344).

[0139] According to one embodiment of the present disclosure, the third side portion (3413) of the first shield can (341) may extend along the second side portion (3472) of the third shield can (347). The third side portion (3413) of the first shield can (341) and the second side portion (3472) of the third shield can (347) may be spaced apart from each other by a predetermined distance (G5). The distance (G5) between the third side portion (3413) of the first shield can (341) and the second side portion (3472) of the third shield can (347) may be greater than the distance (G31) between the first side portion (3411) of the first shield can (341) and the first side portion (3441) of the second shield can (344). Therefore, the heat dissipation material may flow smoothly.

[0140] FIG. 12 illustrates a state in which the shield candles (341, 344, 347) are removed from FIG. 11, according to one embodiment of the present disclosure.

[0141] According to one embodiment of the present disclosure, an electronic device (101) may include a plurality of conductive pads (314, 315, 316). The conductive pads (314, 315, 316) may be disposed on a first surface (311) of a first printed circuit board (310). A first shield can (341) may be disposed on the first conductive pad (314). A second shield can (344) may be disposed on the second conductive pad (315). A third shield can (347) may be disposed on the third conductive pad (316).

[0142] According to one embodiment of the present disclosure, the electronic device (101) may include a plurality of first conductive pads (314). The plurality of first conductive pads (314) may be arranged to form a predetermined first loop. The predetermined first loop formed by the plurality of first conductive pads (314) may correspond to an edge of a first shield can (341). The first shield can (341) may be disposed on the plurality of first conductive pads (314).

[0143] According to one embodiment of the present disclosure, the electronic device (101) may include a plurality of second conductive pads (315). The plurality of second conductive pads (315) may be arranged to form a predetermined second loop. The predetermined second loop formed by the plurality of second conductive pads (315) may correspond to an edge of a second shield can (344). The second shield can (344) may be disposed on the plurality of second conductive pads (315).

[0144] According to one embodiment of the present disclosure, the electronic device (101) may include a plurality of third conductive pads (316). The plurality of third conductive pads (316) may be arranged to form a predetermined third loop. The predetermined third loop formed by the plurality of third conductive pads (316) may correspond to an edge of a third shield can (347). The third shield can (347) may be disposed on the plurality of third conductive pads (316).

[0145] According to one embodiment of the present disclosure, the number of conductive pads (314, 315, 316) is not limited to the embodiment illustrated in FIG. 12. According to various embodiments of the present disclosure, the plurality of first conductive pads (314), the plurality of second conductive pads (315), or the plurality of third conductive pads (316) may be formed of at least one (e.g., one or two) conductive pad, unlike as illustrated in FIG. 12.

[0146] According to one embodiment of the present disclosure, a portion (314a) of the first conductive pad (314) and a portion (315a) of the second conductive pad (315) may be extended to partially surround the through hole (313). A heat dissipation material (350) introduced into the internal space (331) through the through hole (313) may spread along the outer surfaces of the plurality of shield candles (341, 344, 347).

[0147] According to one embodiment of the present disclosure, both ends (314b, 314c) of the first conductive pad (314) may be spaced apart from the center (P) of the through hole (313). Both ends (315b, 315c) of the second conductive pad (315) may be spaced apart from the center (P) of the through hole (313). Both ends (316b, 316c) of the third conductive pad (316) may be spaced apart from the center (P) of the through hole (313). Recesses (341g, see FIG. 11) of shield cans (341, 344, 347) may be positioned at both ends (314b, 314c, 315b, 315c, 316b, 316c) of the conductive pads (314, 315, 316).

[0148] According to one embodiment of the present disclosure, the distance from the center (P) of the through-hole (313) at both ends (314b, 314c, 315b, 315c, 316b, 316c) of the conductive pad (314, 315, 316) may be determined by factors that affect the extent to which the heat-dissipating material (350) spreads, such as the injection amount of the heat-dissipating material (350), the position of the shield can (341, 344, 347), etc. As an example, the distance from the center (P) of the through-hole (313) at both ends (314b, 314c, 315b, 315c, 316b, 316c) of the conductive pad (314, 315, 316) may be 20 mm to 30 mm.

[0149] FIG. 13 is a graph showing the temperature of an electronic component (E1) according to the amount of injected heat dissipation material (350) according to one embodiment of the present disclosure. The temperature of the electronic component (E1) can be understood as the temperature of the electronic component (E1) measured based on the time when the electronic component (E1) exhibits maximum performance. Y represents the temperature when the shield cans (341, 344, 347) are not placed in the internal space (331), unlike one embodiment of the present disclosure, and X represents the temperature when the shield cans (341, 344, 347) are placed in the internal space (331), as in one embodiment of the present disclosure. As an example, the temperature of the electronic component (E1) can be calculated through values ​​measured by a plurality of thermometers (not shown) included in the electronic component (E1).

[0150] Referring to FIG. 13, unlike one embodiment of the present disclosure, when the shield can (341, 344, 347) is not placed in the internal space (331) (Y), the temperature of the electronic component (E1) becomes an appropriate temperature (e.g., 62 degrees Celsius) when 2 g of heat dissipation material (350) is injected, but like one embodiment of the present disclosure, when the shield can (341, 344, 347) is not placed in the internal space (331) (X), the temperature of the electronic component (E1) can be confirmed to be at the appropriate temperature even when only 1.4 g of heat dissipation material (350) is injected.

[0151] According to one embodiment of the present disclosure, by arranging the shield cans (341, 344, 347), the heat dissipation material (350) is stably arranged in an area (e.g., the first area (321c)) of the third surface (321) that can effectively dissipate heat from the electronic component (E1), thereby ensuring the heat dissipation performance of the electronic component (E1) with only a smaller amount of the heat dissipation material (350).

[0152] FIG. 14 illustrates a location of a heat dissipating material (1350) on a first printed circuit board (310), according to one embodiment of the present disclosure. FIG. 15 illustrates a location of a heat dissipating material (1350) on a second printed circuit board (320), according to one embodiment of the present disclosure. FIG. 16 illustrates a plurality of regions projected onto a second printed circuit board, according to one embodiment of the present disclosure.

[0153] The description of the components described with reference to FIGS. 2 to 13 (e.g., heat dissipation material (350), multiple shield candles (341, 344, 347), first region (321c), second region (341a, 344a, 347a)) can be substantially identically applied to the components of the same name illustrated in FIGS. 14 to 16 (e.g., heat dissipation material (1350), multiple shield candles (1341, 1344, 1347), first region (321c'), second region (1341a, 1344a, 1347a)) to the extent that they are not arranged with each other.

[0154] Referring to FIGS. 14 to 16, a plurality of shield candles (1341, 1344, 1347) can surround a through hole (313). A heat dissipation material (1350) injected into the internal space (331) through the through hole (313) can spread radially with respect to the through hole (313). The injected heat dissipation material (1350) can be placed between the plurality of shield candles (1341, 1344, 1347) and the third surface (321) of the second printed circuit board (320).

[0155] According to one embodiment of the present disclosure, a third surface (321) of a second printed circuit board (320) may include a first region (321c') corresponding to an electronic component (E1). When viewed from above the third surface (321), the first region (321c') may include a region overlapping the electronic component (E1). The third surface (321) may include a second region (1341a, 1344a, 1347a) facing upper surfaces (1341s, 1344s, 1347s) of a plurality of shield candles (1341, 1344, 1347). When viewed from above on the third side (321), the second region (1341a, 1344a, 1347a) may include a region overlapping the upper surfaces (1341s, 1344s, 1347s) of multiple shield candles (1341, 1344, 1347).

[0156] According to one embodiment of the present disclosure, the through hole (1313) may be covered by the electronic component (E1) when viewed from above the fourth surface (322). When viewed from above the third surface (321), the third region (1313a) may be located inside the first region (321c'). As an example, the third region (1313a) corresponding to the through hole (1313) may be located in the central portion of the first region (321c') (e.g., the central portion (321t) of FIG. 10).

[0157] According to one embodiment of the present disclosure, second regions (1341a, 1344a, 1347a) corresponding to a plurality of shield candles (1341, 1344, 1347) can surround a third region (313a). A heat dissipation material (350) introduced into the internal space (331) through the through hole (313) can spread along the second regions (1341a, 1344a, 1347a) of the third surface (321) and can be stably positioned between the plurality of shield candles (1341, 1344, 1347) and the third surface (321).

[0158] FIG. 17 illustrates a shield can (2341) and a heat dissipation material (2350) according to one embodiment of the present disclosure. FIG. 18 illustrates a plurality of regions (321c, 2313a, 2341a) on a second printed circuit board (320) according to one embodiment of the present disclosure.

[0159] The description of the components described with reference to FIGS. 2 to 13 (e.g., heat dissipation material (350), shield cans (341, 344, 347), second region (341a, 344a, 347a), third region (313a), through hole (313)) can be substantially identically applied to the components of the same name shown in FIGS. 17 and 18 (e.g., heat dissipation material (1350), multiple shield cans (1341, 1344, 1347), first region (321c'), second region (2341a), third region (2313a), through hole (2313)) to the extent that they are not arranged with each other.

[0160] Referring to FIGS. 17 and 18, according to one embodiment of the present disclosure, a third surface (321) of a second printed circuit board (320) may include a second region (2341a) corresponding to a shield can (2341). The second region (2341a) may include a region of the third surface (321) facing a top surface (2341s) of the shield can (2341). The second region (2341a) may be located outside the first region (321c). The second region (2341a) may be spaced apart from the first region (321c).

[0161] According to one embodiment of the present disclosure, the third surface (321) of the second printed circuit board (320) may include a third region (2313a) corresponding to the through hole (2313). The third region (2313a) may face the through hole (2313). The third region (2313a) may be located between the second region (2341a) and the first region (321c).

[0162] According to one embodiment of the present disclosure, a heat dissipation material (2350) injected into the internal space (331) through a through hole (2313) may include a first portion (2351) between the shield can (2341) and the second region (2341a). The heat dissipation material (2350) may include a second portion (2352) between the first surface (311) of the first printed circuit board (310) and the first region (321c) of the third surface (321).

[0163] According to one embodiment of the present disclosure, the rate at which the heat dissipation material (2350) spreads toward the second region (2341a) with respect to the through hole (2313) may be lower than the rate at which it spreads toward the first region (321c). Accordingly, a greater amount of the heat dissipation material (2350) may spread from the through hole (2313) toward the opposite side of the shield can (2341).

[0164] FIG. 19 is a cross-sectional view of a portion of an electronic device (101) showing a plurality of shield candles (3341, 3344) according to one embodiment of the present disclosure.

[0165] The description of components (e.g., heat dissipation material (350), shield cans (341, 344)) described with reference to FIGS. 2 to 13 can be substantially identically applied to components of the same name (e.g., heat dissipation material (3350), shield cans (1341, 1344)) illustrated in FIG. 19, to the extent that they are not arranged with each other.

[0166] According to one embodiment of the present disclosure, the electronic device (101) may include a plurality of shield candles (3341, 3344). The plurality of shield candles (3341, 3344) may at least partially surround the through hole (313). A heat dissipation material (3350) injected into the internal space (331) through the through hole (313) may flow between the shield candles (3341, 3344) and the third surface (321).

[0167] According to one embodiment of the present disclosure, when viewed from above on the fourth surface (322), the through hole (313) may be covered by the electronic component (E1). When viewed from above on the fourth surface (322), the through hole (313) may be spaced apart from the center of the electronic component (E1) (e.g., the center portion (321t) of FIG. 10).

[0168] The heights protruding from the first surface (311) of the first printed circuit board (310) may be different from each other. For example, the heights of the first shield can (3341) and the second shield can (3344) extending from the first surface (311) to the internal space (331) may be different from each other. For example, the gap (G22) between the first shield can (3341) (e.g., the first shield can (3341) having a smaller height than the second shield can (3344)) and the first surface (311) may be lower than the gap (G21) between the second shield can (3344) and the first surface (311).

[0169] According to one embodiment of the present disclosure, when viewed from above on the fourth side (322), the first shield can (3341) may be positioned closer to the center of the electronic component (E1) than the second shield can (3344). As an example, when viewed from above on the fourth side (322), an overlapping area between the first shield can (3341) and the electronic component (E1) may be larger than an overlapping area between the second shield can (3344) and the electronic component (E1).

[0170] FIG. 20 is a cross-sectional view of a portion of an electronic device (101) showing a first interposer (4331) and a second interposer (4332) according to one embodiment of the present disclosure. FIG. 21 illustrates a first printed circuit board (4310) according to one embodiment of the present disclosure. FIG. 22 illustrates a second printed circuit board (4320) and an interposer (4330) according to one embodiment of the present disclosure.

[0171] The description of the components described with reference to FIGS. 2 to 13 (e.g., heat dissipation material (350), first printed circuit board (310), second printed circuit board (320), interposer (330), through hole (313)) can be substantially identically applied to the components of the same name illustrated in FIGS. 20 to 22 (e.g., heat dissipation material (4350), first printed circuit board (4310), second printed circuit board (4320), interposer (4330), through hole (4313)) to the extent that they are not arranged with each other.

[0172] Referring to FIGS. 20 to 22, according to one embodiment of the present disclosure, an electronic device (101) may include a first printed circuit board (4310) including a first side (4311) and a second side (4312) facing in an opposite direction to the first side (4311). The first side (4311) of the first printed circuit board (4310) may be partitioned into a first portion (4311a) and a second portion (4311b) based on a second interposer (4332). A through hole (4313) may be formed in the second portion (4311b) of the first side (4311).

[0173] According to one embodiment of the present disclosure, the electronic device (101) may include a third side (4321) facing a first side (4311) of a first printed circuit board (4310) and a fourth side (4322) facing in an opposite direction of the third side (4321). The second printed circuit board (4320) may be spaced apart from the first printed circuit board (4310). The third side (4321) of the second printed circuit board (4320) may be partitioned into a first portion (4321a) and a second portion (4321b) based on a second interposer (4332).

[0174] According to one embodiment of the present disclosure, a second portion (4321b) of a third surface (4321) of a second printed circuit board (4320) may include an electronic component area (4321c). The electronic component area (4321c) is an area corresponding to the electronic component (E1), and as an example, may include an area overlapping the electronic component (E1) when viewed from above the third surface (4321). The electronic component area (4321c) may include a portion of the third surface (4321) that is opposite to an area of ​​the fourth surface (4322) on which the electronic component (E1) is mounted.

[0175] According to one embodiment of the present disclosure, a second portion (4321b) of a third surface (4321) of a second printed circuit board (4320) may include a through-hole region (4313a). The through-hole region (4313a) is a region corresponding to the through-hole (4313), and as an example, may include a region overlapping the through-hole (4313) when viewed from above the third surface (4321). The through-hole region (4313a) may be located inside the electronic component region (4321c).

[0176] According to one embodiment of the present disclosure, an electronic device (101) may include an interposer (4330). The interposer (4330) may be disposed between a first printed circuit board (4310) and a second printed circuit board (4320). In one embodiment, the interposer (4330) may include a plurality of interposer portions. The interposer (4330) may include a first interposer (4331) extending along an edge (4321e) of a third side (4321) of the second printed circuit board (4320) to form an inside space (4331a, 4331b). The interposer (4330) may include a second interposer (4332) disposed in the inside space (4331a, 4331b).

[0177] According to one embodiment of the present disclosure, the second interposer (4332) may be spaced inwardly from the first interposer (4331) (e.g., positioned on the inner side of an edge (4321e) of the third side (4321) within the internal space (4331). That is, in one embodiment, when the first interposer (4331) extends along the edge of the third side (4321) of the second printed circuit board (4320), the second interposer (4332) may be positioned on the inner side of the first interposer (4331). The second interposer (4332) may be connected to the first interposer (4331). The second interposer (4332) may be connected to the first interposer (4331), and in another embodiment, the second interposer (4332) may be positioned adjacent to the first interposer (4331).

[0178] According to one embodiment of the present disclosure, the second interposer (4332) may extend across the internal spaces (4331a, 4331b). In one embodiment, the second interposer (4332) may extend across (e.g., divide) the internal spaces (4331a, 4331b). That is, in one embodiment, the internal spaces (4331a, 4331b) may be located on each side of the second interposer (4332). The second interposer (4332) may extend along an edge of an electronic component (E1) mounted on a fourth surface (4322) of a second printed circuit board (4320). When viewed from above the fourth surface (4322), the second interposer (4332) may partially overlap the electronic component (E1) or may be located outside the electronic component (E1). The internal space (4331a, 4331b) can be partitioned into a first mounting space (4331a) and a second mounting space (4331b) by the second interposer (4332). That is, the mounting space (e.g., the mounting space (4331a, 4331b)) can be considered as a space (e.g., the internal space (4331a, 4331b)) where various components are placed.

[0179] According to one embodiment of the present disclosure, a heat dissipation material (4350) can be injected into the second mounting space (4331b) through the through hole (4313). Since the heat dissipation material (4350) is not introduced into the first mounting space (4331a) by the second interposer (4332), the injection amount of the heat dissipation material (4350) for heat dissipation of the electronic component (E1) can be minimized and / or reduced.

[0180] According to one embodiment of the present disclosure, a first printed circuit board (4310) may include an interposer mounting portion (4311e, 4311f). A first interposer (4331) may be mounted on the first interposer mounting portion (4311e). The first interposer mounting portion (4311e) may form an edge (4311e) of the first printed circuit board (4310). A second interposer (4332) may be mounted on the second interposer mounting portion (4311f). The first surface (4311) may be partitioned into a first region (4311c) and a second region (4311d) by the second interposer mounting portion (4311f).

[0181] FIG. 23 is a cross-sectional view of a portion of an electronic device (101) according to an embodiment of the present disclosure. FIG. 24 illustrates views of electronic components (E1, E2) and a solid heat transfer member (430) disposed on the electronic components (E1, E2) from two directions according to an embodiment of the present disclosure. FIG. 25 illustrates views of a gel-like heat transfer member (430) compressed by a conductive layer (440, see FIG. 23) and electronic components (E1, E2) from two directions according to an embodiment of the present disclosure.

[0182] Referring to FIGS. 23 to 25, an electronic device (101) according to an embodiment of the present disclosure may include a second electronic component (E2) disposed on a first electronic component (E1). The second electronic component (E2) may be mounted on the first electronic component (E1). As an example, the first electronic component (E1) may include a processor (e.g., the processor (120) of FIG. 1), and the second electronic component (E2) may be a memory (e.g., the memory (130) of FIG. 1) mounted on the first electronic component (E1) via solder balls and operatively connected to the first electronic component (E1).

[0183] According to one embodiment of the present disclosure, an electronic device (101) may include a substrate assembly (400). The description of the substrate assembly (240a) described with reference to FIG. 4 may be substantially identically applied to the substrate assembly (400) illustrated in FIG. 23 to the extent that they are not mutually disposed. The substrate assembly (400) may include a heat transfer member (430, see FIG. 25). The heat transfer member (430) may contact the first electronic component (E1) and the second electronic component (E2). Heat generated in the first electronic component (E1) and the second electronic component (E2) may be released to the outside of the electronic device (101) by the heat transfer member (430).

[0184] According to one embodiment of the present disclosure, a heat transfer member (430) may include a first portion (433) that contacts a second electronic component (E2). The first portion (433) of the heat transfer member (430) may be disposed between the second electronic component (E2) and the first conductive sheet (441). Accordingly, heat of the second electronic component (E2) may be spread to the first conductive sheet (441) through the first portion (433). In addition, heat of the first electronic component (E1) may be spread to the first conductive sheet (441) through the second electronic component (E2) and the first portion (433).

[0185] According to one embodiment of the present disclosure, the heat transfer member (430) may include a second portion (431, 432) that contacts the first electronic component (E1). Accordingly, heat of the first electronic component (E1) may spread from the first surface (E11) to the second portion (431, 432) of the heat transfer member (430). The second portion (431, 432) of the heat transfer member (430) may extend from the first portion (433) toward the first electronic component (E1). As an example, the second portion (431, 432) may protrude from the edge of the first portion (433) toward the first electronic component (E1).

[0186] According to one embodiment of the present disclosure, the heat transfer member (430) can at least partially cover the second electronic component (E2). The second portion (431, 432) of the heat transfer member (430) can cover at least a portion of the second surface (E22) of the second electronic component (E2). As an example, the first surface (E21) of the second electronic component (E2) can be a top surface, and the second surface (E22) can be a side surface.

[0187] According to one embodiment of the present disclosure, the electronic device (101) may include a shield can (420) disposed on a second printed circuit board (320). The shield can (420) may surround a first electronic component (E1) and a second electronic component (E2). The shield can (420) may be connected to a ground layer (not shown) through the printed circuit board (320).

[0188] According to one embodiment of the present disclosure, the electronic device (101) may include a conductive layer (440) disposed on a shield can (420). As an example, the conductive layer (440) may be in contact with the shield can (420) or may be bonded to the shield can (420) by a conductive adhesive. The conductive layer (440) and the shield can (420) may define a space that can minimize the influence of an external magnetic field. The shield can (420) and the conductive layer (440) may surround the first electronic component (E1), the second electronic component (E2), and the heat transfer member (430). Therefore, the influence of the external magnetic field on the first electronic component (E1) and the second electronic component (E2) may be minimized and / or reduced.

[0189] According to one embodiment of the present disclosure, the conductive layer (440) may include a first conductive sheet (441) disposed on a heat transfer member (430). The first conductive sheet (441) may cover one surface of the heat transfer member (430). For example, the first conductive sheet (441) may contact the one surface of the heat transfer member (430). Accordingly, heat may spread from the heat transfer member (430) to the first conductive sheet (441). As an example, the first conductive sheet (441) may be a copper thin film. The first conductive sheet (441) may contact the metal cover (M). The first conductive sheet (441) may be disposed between the heat transfer member (430) and the metal cover (M). Accordingly, heat may spread from the first conductive sheet (441) to the metal cover (M).

[0190] According to one embodiment of the present disclosure, the conductive layer (440) may be supported by the shield can (420). The conductive layer (440) may include a second conductive sheet (442) interposed between the first conductive sheet (441) and the shield can (420). The second conductive sheet (442) may surround a portion of the heat transfer member (430). For example, the second conductive sheet (442) may contact a side surface of the heat transfer member (430). Accordingly, heat may spread from the heat transfer member (430) to the second conductive sheet (442). As an example, the second conductive sheet (442) may be a metal thin film having a lower thermal conductivity than the first conductive sheet (441).

[0191] According to one embodiment of the present disclosure, the shield can (420) and the first conductive sheet (441) can be electrically connected through the second conductive sheet (442). Accordingly, the first electronic component (E1) and the second electronic component (E2) can minimize the influence of an external magnetic field through the shield can (420), the second conductive sheet (442), and the first conductive sheet (441).

[0192] According to one embodiment of the present disclosure, a portion of the heat generated from the first electronic component (E1) may be transferred to the heat dissipation material (350) through the second printed circuit board (320). A portion of the heat generated from the first electronic component (E1) may be transferred to the heat dissipation member (V) through the heat transfer member (430). The first electronic component (E1) may be positioned between the first shield can (341) and the heat dissipation member (V). When viewed from above the fourth surface (322), the first shield can (341) may overlap with the first electronic component (E1) or may be covered by the first electronic component (E1). For example, the first shield can (341) and the heat dissipation member (V) may be positioned on opposite sides with respect to the first electronic component (E1).

[0193] According to one embodiment of the present disclosure, the internal space (343) of the first shield can (341) can function as an insulating layer during the process of transferring heat generated from the first electronic component (E1). The heat generated from the first electronic component (E1) can be absorbed by the heat dissipation material (350), but due to the low thermal conductivity of air, the amount transferred to the surface of the electronic device (101) (e.g., the rear surface (210B) of FIG. 3) through the air layer can be limited. Accordingly, the surface of the electronic device (101) (e.g., the rear surface (210B) of FIG. 3) can be prevented from being locally overheated.

[0194] According to one embodiment of the present disclosure, a heat dispersion member (V) may be positioned between a first surface (210A, see FIG. 4) of an electronic device (101) and a first electronic component (E1). Accordingly, heat generated from the first electronic component (E1) may be transferred to the first surface (210A) through the heat dispersion member (V). A first shield can (341) may be positioned between a second surface (210B, see FIG. 4) of an electronic device (101) and the first electronic component (E1). Accordingly, heat generated from the first electronic component (E1) may be transferred to the second surface (210B, see FIG. 4) through the first shield can (341).

[0195] According to one embodiment of the present disclosure, the heat transfer member (430) may include a phase change material. As an example, the phase change material may include a paraffin-based material, which is a temperature-sensitive material. The heat transfer member (430) may be in a solid state at room temperature. The heat transfer member (430) may be in a gel state at least partially above a predetermined temperature. As an example, the predetermined temperature may be a temperature of approximately 45 degrees Celsius to 65 degrees Celsius.

[0196] According to one embodiment of the present disclosure, the heat transfer member (430) may be in a solid state at room temperature (Tr). For example, the room temperature (Tr) may be a temperature of 15 degrees Celsius to 25 degrees Celsius. When the heat transfer member (430) is in a solid state, the transport, placement, and assembly of the heat transfer member (430) may be easier compared to when the heat transfer member (430) is in a liquid or gel state. In addition, when the heat transfer member (430) is in a solid state, it has a certain level of rigidity, so that defects such as dents or compression of the heat transfer member (430) that may occur during the assembly and transport process can be reduced. Therefore, it is possible to prevent dents or compression from occurring and preventing the shape of the heat transfer member (430) from being restored, and thus, the dispersion of the heat dissipation performance of the heat transfer member (430) can be minimized.

[0197] According to one embodiment of the present disclosure, when the heat transfer member (430) is solid, a material (e.g., a phase change material) included in the heat transfer member (430) does not permeate into the gap of the shielding structure (e.g., the conductive layer (440) and the shield can (420) of FIG. 3) around the heat transfer member (430), and thus may not impair the shielding performance of the shielding structure. Even if the heat transfer member (430) becomes a gel phase after the electronic device (101) is operated, the heat transfer member (430) becomes a gel phase when the phase transition temperature (Tc) is reached after the electronic device (101) is operated, and does not contain silicone resin or oil that causes bleeding, and thus may not impair the shielding performance of the surrounding shielding structure (e.g., the conductive layer (440) and the shield can (420) of FIG. 3).

[0198] According to one embodiment of the present disclosure, the heat transfer member (430) may include a matrix material configured to maintain the heat transfer member (430) in a gel state at a temperature higher than the phase transition temperature (Tc). The matrix material functions as a frame of the heat transfer member (430), thereby substantially maintaining the shape of the heat transfer member (430) even when the temperature of the heat transfer member (430) rises to a temperature higher than the phase transition temperature (Tc). As an example, the matrix material may be a rubber-based material. The matrix material is not limited to a rubber-based material, and may be replaced with a material that can function as a frame.

[0199] According to one embodiment of the present disclosure, the gel phase in which the heat dissipation material (350) and the heat transfer member (430) are transferred have the same name, but may have different properties depending on their composition or composition ratio. For example, the gel state of the heat dissipation material (350) injected into the internal space (331) may not maintain its shape and may flow in the internal space (331) compared to the gel state of the heat transfer member (430). In contrast, the gel state of the heat transfer member (430) may be understood as a gel state in which the shape is maintained by the matrix material and does not flow, as an example, compared to the gel state of the heat dissipation material (350).

[0200] According to one embodiment of the present disclosure, the heat transfer member (430) may include heat dissipating particles. As an example, the heat dissipating particles may be aluminum oxide (Al2O3) or aluminum nitride (AlN). As another example, the heat dissipating particles may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0201] According to one embodiment of the present disclosure, the heat transfer member (430) may include heat-radiating particles, a phase change material, and a matrix material. As an example, the heat transfer member (430) may include about 75 to 90% heat-radiating particles, about 5 to 15% matrix material, and about 5 to 15% phase change material. The composition ratio of the heat-radiating particles, the matrix material, and the phase change material included in the heat transfer member (430) is not limited to the above examples.

[0202] According to one embodiment of the present disclosure, as the first electronic component (E1) and / or the second electronic component (E2) operates, the temperature of the heat transfer member (430) may increase due to heat generation of the first electronic component (E1) and / or the second electronic component (E2). When the temperature of the heat transfer member (430) increases after the first electronic component (E1) and / or the second electronic component (E2) operates, the heat transfer member (430) may at least partially change into a gel state.

[0203] According to one embodiment of the present disclosure, a first portion (433) of a solid heat transfer member (430) before being changed into a gel state may have a first height (h1). A plurality of second portions (431, 432) may have a first thickness (t1) and a second thickness (t2), respectively. A distance between an inner surface (430i) and an outer surface (430o) of the plurality of second portions (431, 432) may be a first thickness (t1) and a second thickness (t2), respectively.

[0204] According to one embodiment of the present disclosure, the inner surface (430i) of the second portion (431, 432) of the solid heat transfer member (430) before changing into a gel state can be spaced apart from the second surface (E22) of the second electronic component (E2) for easy coupling of the heat transfer member (430). Accordingly, the heat transfer member (430) can be easily assembled to the second electronic component (E2).

[0205] According to one embodiment of the present disclosure, after being changed into a gel state, the first portion (433) of the heat transfer member (430) compressed by the conductive layer (440) may have a second height (h2) smaller than the first height (h1). The plurality of second portions (431, 432) of the heat transfer member (430) compressed by the conductive layer (440) may have a third thickness (t3) larger than the first thickness (t1) and a fourth thickness (t4) larger than the second thickness (t2), respectively. The third thickness (t3) and the fourth thickness (t4) may be the largest thicknesses of each of the plurality of second portions (431, 432).

[0206] According to one embodiment of the present disclosure, the heat transfer member (430) may be compressed by the conductive layer (440) after changing into a gel state. When compressed by the conductive layer (440), the height of the first portion (433) of the heat transfer member (430) may decrease from the first height (h1) to the second height (h2). The difference between the first height (h1) and the second height (h2) may be due to an assembly tolerance that may occur during the manufacturing process of the substrate assembly (400). For example, tolerances such as an assembly tolerance that may occur during the process of assembling components (410, 420, 430, 440, E1, E2) of the substrate assembly (400), a component height tolerance of the second printed circuit board (320) and electronic components (E1, E2), etc. may occur.

[0207] According to one embodiment of the present disclosure, the gel-phase heat transfer member (430) can have a higher compressibility compared to the solid-phase heat transfer member (430). For example, the gel-phase heat transfer member (430) can have a compressibility of about 25 to 40%, and more specifically, can have a compressibility of about 35 to 40%. Since the heat transfer member (430) of the present disclosure has a higher compressibility in the gel phase compared to the solid-phase case, the above tolerances can be filled by the heat transfer member (430). For example, when the heat transfer member (430) becomes at least partially in the gel phase when the temperature is higher than the limit temperature (Tc), the heat transfer member (430) can be configured to have a compressibility of about 35 to 40%, and the second height (h2) can be a value that is reduced by about 35 to 40% from the first height (h1).

[0208] According to one embodiment of the present disclosure, as the height of the first portion (433) of the heat transfer member (430) decreases, the thickness of the second portion (431, 432) of the heat transfer member (430) may increase. As the thickness of the second portion (431, 432) of the heat transfer member (430) increases, the second portion (431, 432) may be brought into close contact with the second surface (E22) of the second electronic component (E2). As the thickness of the second portion (431, 432) of the heat transfer member (430) increases, the inner surface (430i) of the second portion (431, 432) may be brought into close contact with the second surface (E22) of the second electronic component (E2). As the thickness of the second part (431, 432) of the heat transfer member (430) increases, the second part (431, 432) can be brought into close contact with the shield can (420, see FIG. 3).

[0209] According to one embodiment of the present disclosure, a first surface (E11) of a surface (E11, E12) of a first electronic component (E1) may include a first area (E111) in which a second electronic component (E2) is disposed. Heat may diffuse from the first electronic component (E1) to the second electronic component (E2) through the first area (E111).

[0210] According to one embodiment of the present disclosure, a first surface (E11) of a surface (E11, E12) of a first electronic component (E1) may include a second region (E112) that contacts a second portion (431, 432) of the heat transfer member (430). The second region (E112) may at least partially surround the first region (E111). Heat may diffuse from the first electronic component (E1) to the second portion (431, 432) of the heat transfer member (430) through the second region (E112).

[0211] According to one embodiment of the present disclosure, the first electronic component (E1) may include a heat generating block (B). The heat generating block (B) may be positioned below the first surface (E11) and may overlap with the second region (E112). The heat generating block (B) may be positioned below the boundary between the first region (E111) and the second region (E112). Heat generated in the heat generating block (B) may spread to the second electronic component (E2) through the first region (E111). Heat generated in the heat generating block (B) may spread to the second portion (432) of the heat transfer member (430) through the second region (E112).

[0212] According to one embodiment of the present disclosure, the heat generating block (B) may include a first heat generating block (B1) and a second heat generating block (B2). The first heat generating block (B1) and the second heat generating block (B2) may be positioned below the first surface (E11) and overlap with the second area (E112). As an example, the first heat generating block (B1) may be a CPU of a processor (e.g., a processor (120) of FIG. 1), and the second heat generating block (B2) may be a GPU of the processor (e.g., a processor (120) of FIG. 1).

[0213] According to one embodiment of the present disclosure, the first electronic component (E1) may include a heat generating block (B). The heat generating block (B) may be a portion of the first electronic component (E1) having a relatively large amount of heat generation. As an example, the first electronic component (E1) may include a processor (e.g., the processor (120) of FIG. 1), and the heat generating block (B) may be a CPU / GPU portion and include at least one processing core. As another example, the heat generating block (B) may include any one of a plurality of processing cores, or a plurality of cores adjacent to each other.

[0214] According to one embodiment of the present disclosure, a heating block (B) may be positioned at an edge of a first electronic component (E1) to be connected to a power source (e.g., a battery (350) of FIG. 2). The heating block (B) may at least partially overlap a second area (E112) of a surface (E11, E12) of the first electronic component (E1). As an example, as illustrated in FIG. 3, the heating block (B) may overlap an edge of the second electronic component (E2) in a direction in which the first electronic component (E1) and the second electronic component (E2) are stacked. As another example, unlike as illustrated in FIG. 3, the heating block (B) may be positioned outside the edge of the second electronic component (E2) so as not to overlap an edge of the second electronic component (E2) in a direction in which the first electronic component (E1) and the second electronic component (E2) are stacked.

[0215] As electronic components (e.g., processors, memory, etc.) become more integrated and their performance becomes more advanced, the amount of heat generated by these components is increasing. Failure to reduce the temperature of these components due to heat generation can impact the operation of electronic devices (e.g., performance degradation due to throttling). Consequently, extensive research is being conducted on the heat dissipation structures of electronic components.

[0216] A problem to be solved in the present disclosure may be to minimize the flow of a gel-like heat dissipating material inside an electronic device.

[0217] A problem to be solved in the present disclosure may be to reduce the amount of heat dissipation material while ensuring the heat dissipation performance of an electronic component (e.g., an application processor).

[0218] A problem to be solved in the present disclosure may be to prevent the surface of an electronic device from being locally overheated due to the operation of electronic components.

[0219] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0220] An electronic device according to various embodiments of the present disclosure can minimize the flow of a heat-dissipating material in an internal space of the electronic device by arranging a configuration (e.g., a shield can) in an internal space of the electronic device into which a heat-dissipating material in a gel form is injected.

[0221] Electronic devices according to various embodiments of the present disclosure can reduce the amount of heat dissipation material injected while securing a certain level of heat dissipation performance or higher by concentrating the heat dissipation material in an area adjacent to an electronic component (e.g., an application processor).

[0222] An electronic device according to various embodiments of the present disclosure can reduce a user's perceived temperature by preventing local overheating on the surface of the electronic device by arranging a heat dissipating member (e.g., a vapor chamber) and an insulating layer on one side and the other side of an electronic component, respectively.

[0223] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0224] According to one embodiment of the present disclosure, an electronic device (101) may include a first printed circuit board (310) including a first side (311) and a second side (312) facing in an opposite direction of the first side (311).

[0225] According to one embodiment of the present disclosure, an electronic device (101) may include a second printed circuit board (320) spaced apart from the first printed circuit board, the second printed circuit board including a third side (321) facing the first side (311) and a fourth side (322) facing in an opposite direction of the third side (321).

[0226] According to one embodiment of the present disclosure, an electronic device (101) may include an interposer (330) disposed between the first printed circuit board (310) and the second printed circuit board (320).

[0227] According to one embodiment of the present disclosure, the interposer (330) may extend along an edge (edge, 321e) of the third surface (321) to form an inside space (331).

[0228] According to one embodiment of the present disclosure, an electronic device (101) may include an electronic component (E1) mounted on a fourth side (322) of the second printed circuit board (320).

[0229] According to one embodiment of the present disclosure, an electronic device (101) may include a shield can (341, 344) mounted on a first surface (311) of the first printed circuit board (310).

[0230] According to one embodiment of the present disclosure, the electronic device (101) may include a heat dissipation material (350) positioned between the third surface (321) and the shield can (341, 344).

[0231] According to one embodiment of the present disclosure, the electronic device (101) may include a through hole (313) formed in the first surface (311).

[0232] According to one embodiment of the present disclosure, the through hole (313) may be located on the outside of the shield can (341, 344).

[0233] According to one embodiment of the present disclosure, the shield can (341, 344) may be placed adjacent to the through hole (313).

[0234] According to one embodiment of the present disclosure, the shield can (341, 344) may partially surround the through hole (313).

[0235] According to one embodiment of the present disclosure, the third surface (321) may include a first area (321c) facing in an opposite direction to an area of ​​the fourth surface (322) on which the electronic component (E1) is mounted.

[0236] According to one embodiment of the present disclosure, the third surface (321) may include a second area (341a, 344a) facing the top surface (341s, 344s) of the shield can (341, 344) and overlapping the first area (321c).

[0237] According to one embodiment of the present disclosure, the third surface (321) may include a third area (313a) facing the through hole (313).

[0238] According to one embodiment of the present disclosure, the third region (313a) may be located within the first region (321c).

[0239] According to one embodiment of the present disclosure, the shield can (341, 344) may include a plurality of shield candles (341, 344) arranged along the border of the through hole (313) so as to at least partially surround the through hole (313).

[0240] According to one embodiment of the present disclosure, the third surface (321) may include a fourth area (321i) that does not overlap with the second area (341a, 344a).

[0241] According to one embodiment of the present disclosure, the fourth region (321i) may surround the third region (313a) together with the second region (341a, 344a).

[0242] According to one embodiment of the present disclosure, the fourth region (321i) may extend from one side of the third region (313a) toward the border of the first region (321c).

[0243] According to one embodiment of the present disclosure, the heat dissipating material (350) may include a first portion (351) disposed between the upper surface (341s, 344s) of the shield can (341, 344) and the second region (341a, 344a) of the third surface (321).

[0244] According to one embodiment of the present disclosure, the heat dissipating material (350) may include a second portion (352) disposed between the first surface (311) and the fourth region (321i) of the third surface (321).

[0245] According to one embodiment of the present disclosure, the width (d3) of a section of the fourth region (321i) adjacent to the third region (313a) may be greater than the spacing (d1) between two adjacent shield candles (341, 344) among the plurality of shield cans (341, 344, 347).

[0246] According to one embodiment of the present disclosure, the third region (313a) may be located in a central portion (321t) of the first region (321c).

[0247] According to one embodiment of the present disclosure, the third surface (321) may include a second area (2341a) facing the top surface (2341s) of the shield can (2341).

[0248] According to one embodiment of the present disclosure, the second region (2341a) may be spaced apart from the first region (321c).

[0249] According to one embodiment of the present disclosure, the third surface (321) may include a third region (2313a) facing the through hole (2313) and positioned between the second region (2341a) and the first region (321c).

[0250] According to one embodiment of the present disclosure, the gap (G2) between the top surface (341s, 344s) of the shield can (341, 344) facing the third surface (321) and the third surface (321) may be smaller than the gap (G1) between the first surface (311) and the third surface (321).

[0251] According to one embodiment of the present disclosure, the shield can (3341, 3344) may include a first shield can (3344) that at least partially surrounds the through hole (313) and a second shield can (3341).

[0252] According to one embodiment of the present disclosure, the gap (G22) between the third surface (321) and the upper surface (3341s) of the second shield can (3341) may be smaller than the gap (G21) between the third surface (321) and the upper surface (3344s) of the first shield can (3344).

[0253] According to one embodiment of the present disclosure, when viewed from the direction in which the third surface (321) faces, the through hole (313) may overlap with the electronic component (E1).

[0254] According to one embodiment of the present disclosure, when viewed from the direction in which the third surface (321) faces, the through hole (313) may be spaced apart from the center of the electronic component (E1).

[0255] According to one embodiment of the present disclosure, when viewed from the direction in which the third surface (321) faces, the second shield can (3341) may be closer to the center of the electronic component (E1) than the first shield can (3344).

[0256] According to one embodiment of the present disclosure, the electronic device (101) may include a heat dispersion member (V) positioned between a first surface (210A) of the electronic device (101) and the electronic component (E1), and extending along the first surface (210A).

[0257] According to one embodiment of the present disclosure, the shield can (341) may be positioned between the second surface (210B) of the electronic device (101) opposite to the first surface (210A) and the electronic component (E1).

[0258] According to one embodiment of the present disclosure, when viewed from the direction in which the third surface (321) faces, the electronic component (E1) and the shield can (341) may overlap.

[0259] According to one embodiment of the present disclosure, the electronic device (101) may include a heat transfer member (430) disposed between the first electronic component (E1) and the heat dissipation member (V).

[0260] According to one embodiment of the present disclosure, the heat transfer member (430) can be in contact with the second electronic component (E2) and the first electronic component (E1).

[0261] According to one embodiment of the present disclosure, the electronic device (101) may include a second interposer (4332) spaced inwardly from the first interposer (4331) and extending across the internal space (4331a, 4331b).

[0262] According to one embodiment of the present disclosure, the second interposer (4332) may be elongated on the third surface (4321) and connected to the first interposer (4331).

[0263] According to one embodiment of the present disclosure, the second interposer (4332) can partition the internal space (4331a, 4331b) into a plurality of mounting spaces (4331a, 4331b).

[0264] According to one embodiment of the present disclosure, the through hole (4313) and the electronic component (E1) may be positioned on opposite sides of one of the plurality of mounting spaces (4331a, 4331b).

[0265] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

[0266] Although features have been described in combination in this disclosure, the scope of this disclosure is not limited to such combinations. In particular, this disclosure encompasses alternative combinations unless explicitly stated to be incompatible; for example, features may be omitted from a described combination if they do not directly interact with other features / components of one embodiment and / or are not required to achieve the benefits of the embodiment. Separately described features may also be combined to form one or more embodiments.

Claims

1. In an electronic device (101), A first printed circuit board (310) including a first side (311) and a second side (312) facing in an opposite direction to the first side (311); A second printed circuit board (320) comprising a third side (321) facing the first side (311) and a fourth side (322) facing in an opposite direction to the third side (321), and spaced apart from the first printed circuit board; An interposer (330) disposed between the first printed circuit board (310) and the second printed circuit board (320) and extending along at least a portion of an edge (edge, 321e) of the third surface (321) to form an inside space (inside space, 331); An electronic component (E1) mounted on the fourth surface (322) of the second printed circuit board (320); A shield can (341, 344) mounted on the first surface (311) of the first printed circuit board (310); and An electronic device including a heat dissipation material (350) positioned between the third surface (321) and the shield can (341, 344).

2. In paragraph 1, It includes a through hole (313) formed on the first surface (311) and located on the outside of the shield can (341, 344). The above shield can (341, 344) is An electronic device positioned adjacent to the above through hole (313) and partially surrounding the above through hole (313).

3. In paragraph 1 or 2, The above shield can (341, 344) is An electronic device comprising a plurality of shield candles (341, 344) arranged along a border of the through hole (313) so as to at least partially surround the through hole (313).

4. In any one of paragraphs 1 to 3, The third side (321) above: A first region (321c) facing in the opposite direction to one region of the fourth surface (322) on which the electronic component (E1) is mounted; A second region (341a, 344a) facing the top surface (341s, 344s) of the shield can (341, 344) and overlapping the first region (321c); and An electronic device including a third region (313a) facing the through hole (313) and located within the first region (321c).

5. In paragraph 4, The third side (321) above is, It further includes a fourth region (321i) that does not overlap with the second region (341a, 344a), surrounds the third region (313a) together with the second region (341a, 344a), and extends from one side of the third region (313a) toward the border of the first region (321c), The above shield can (341, 344) includes a plurality of shield candles (341, 344), An electronic device in which a width (d3) of a section of the fourth region (321i) adjacent to the third region (313a) is greater than a gap (d1) between a first edge (341b) and a second edge (344b) of the second region (341a, 344a), and the first edge (341b) and the second edge (344b) correspond to adjacent side surfaces of two adjacent shield candles (341, 344) among the plurality of shield cans (341, 344, 347).

6. In paragraph 5, The above heat dissipating material (350) is: A first part (351) arranged between the upper surface (341s, 344s) of the shield can (341, 344) and the second area (341a, 344a) of the third surface (321); and An electronic device including a second portion (352) disposed between the first surface (311) and the fourth region (321i) of the third surface (321).

7. In paragraph 1 or 2, The third side (321) above: A first area (321c) opposite to an area of ​​the fourth surface (322) on which the electronic component (E1) is mounted; and A second region (2341a) facing the top surface (2341s) of the shield can (2341) and spaced apart from the first region (321c), The third side (321) above is, An electronic device further comprising a third region (2313a) facing the through hole (2313) and positioned between the second region (2341a) and the first region (321c).

8. In any one of clauses 1 to 10, An electronic device in which the gap (G2) between the top surface (341s, 344s) of the shield can (341, 344) facing the third surface (321) and the third surface (321) is smaller than the gap (G1) between the first surface (311) and the third surface (321).

9. In any one of paragraphs 1 to 6, The above shield cans (3341, 3344) are It comprises a first shield can (3344) and a second shield can (3341) that at least partially surround the above through hole (313). An electronic device in which the gap (G22) between the third surface (321) and the upper surface (3341s) of the second shield can (3341) is smaller than the gap (G21) between the third surface (321) and the upper surface (3344s) of the first shield can (3344).

10. In paragraph 9, When viewed from the direction in which the third surface (321) is facing, the through hole (313) overlaps with the electronic component (E1) and is spaced apart from the center of the electronic component (E1). An electronic device in which, when viewed from the direction in which the third surface (321) faces, the second shield can (3341) is closer to the center of the electronic component (E1) than the first shield can (3344).

11. In any one of paragraphs 1 to 13, Further comprising a heat dispersion member (V) positioned between the first surface (210A) of the electronic device (101) and the electronic component (E1) and extending along the first surface (210A), The above shield can (341) is An electronic device positioned between the second surface (210B) of the electronic device (101) opposite to the first surface (210A) and the electronic component (E1).

12. In any one of paragraphs 1 to 14, An electronic device in which the electronic component (E1) and the shield can (341) overlap when viewed from the direction in which the third surface (321) faces.

13. In electronic devices, A first printed circuit board (4310) including a first side (4311) and a second side (4312) facing in an opposite direction to the first side (4311); A second printed circuit board (4320) comprising a third side (4321) facing the first side (4311) and a fourth side (4322) facing in an opposite direction to the third side (4321), and spaced apart from the first printed circuit board (4310); A first interposer (4331) disposed between the first printed circuit board (4310) and the third surface (4321) and extending along an edge (edge, 4321e) to form an inside space (inside space, 4331a, 4331b); An electronic component (E1) mounted on the fourth surface (4322) of the second printed circuit board (4320); A second interposer (4332) spaced inwardly from the first interposer (4331) and extended across the internal space (4331a, 4331b); A through hole (4313) arranged on the first surface (4311) of the first printed circuit board (4310); and An electronic device including a heat dissipation material (4350) injected into the internal space (4331a, 4331b) through the through hole (4313).

14. In paragraph 13, The above second interposer (4332) is An electronic device elongated on the third surface (4321) and connected to the first interposer (4331).

15. In clause 13 or 14, The above second interposer (4332) is The above internal space (4331a, 4331b) is divided into a plurality of mounting spaces (4331a, 4331b), An electronic device in which the above through hole (4313) and the electronic component (E1) are located on opposite sides with respect to one of the plurality of mounting spaces (4331a, 4331b).

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