Transparent light-emitting screen and fabrication method therefor

By preparing a transparent conductive layer and insulating pattern on a transparent carrier, fixing the light emitting electrodes to realize a transparent and invisible light emitting screen, the problem of being unable to prepare a transparent light emitting screen in the prior art is solved, and an independent controlled light emitting effect is achieved.

WO2025156932A1PCT designated stage Publication Date: 2025-07-31HUIZHOU E FLY OPTOELECTRONICS MATERIALS CO LTD
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Patent Information

Application Number
PCT/CN2024/143747
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-01-26
Filing Date
2024-12-30
Publication Date
2025-07-31

AI Technical Summary

Technical Problem

The prior art cannot realize a transparent light-emitting screen that is invisible to the naked eye, resulting in the inability to form a transparent light-emitting screen.

Method used

A transparent carrier is used to prepare a transparent conductive layer through coating, a transparent insulating pattern and electrode is prepared, a conductive adhesive is used to fix the light emitting electrode, and is connected to the external control driving board through a conductive line to achieve light emitting effect control.

Benefits of technology

The production of a transparent light emitting screen is realized, the line is invisible to the naked eye, and the luminous effect of the light emitting body can be independently controlled.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A transparent light-emitting screen and a fabrication method therefor. The method comprises: providing a transparent carrier; carrying out coating fabrication on the transparent carrier to obtain a first transparent conductive board, in order that there is a transparent conductive layer on the first transparent conductive board; performing pattern fabrication on the first transparent conductive board to obtain a second transparent conductive board having a transparent insulating pattern, a transparent positive electrode and a transparent negative electrode, wherein the transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive board into transparent conductive circuits which are insulated from each other; performing geometric shape fabrication on the transparent insulating pattern to obtain a feature of insulating a positive electrode of a light-emitting body from a negative electrode thereof; and, by means of a conductive adhesive, respectively fixing the positive electrode and the negative electrode of each light-emitting body to the surfaces of a respective transparent positive electrode and transparent negative electrode, so that the one or more light-emitting bodies are independently controlled by the transparent conductive circuits and an external control drive board can control the light-emitting effect of the one or more light-emitting bodies to obtain the transparent light-emitting screen.
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Description

Transparent luminescent screen and preparation method thereof Technical Field

[0001] The invention relates to a transparent luminous screen and a preparation method thereof. Background Art

[0002] Transparent luminous screens can be widely used in vehicle skylights, vehicle rear windshields, vehicle triangular window glass, vehicle rear side window glass, smart homes, shopping malls, subways, high-speed railways, light rails, buildings and other scenarios, and have huge market application prospects.

[0003] Currently, the most common carrier on the market is the PCB board, which is a non-transparent structure such as gray and black. When the light-emitting body is integrated into the PCB board, it cannot form a transparent light-emitting screen. Another method is to use printing or metal film + yellow photoetching to form metal wires on the PET flexible board, and then implant the light-emitting body on the surface of the metal wires. However, the metal wires are visible to the naked eye and cannot form a transparent light-emitting screen. Summary of the Invention

[0004] Based on this, it is necessary to provide a transparent light-emitting screen with circuits invisible to the naked eye and a preparation method thereof.

[0005] A method for preparing a transparent luminous screen, comprising:

[0006] Provide a transparent carrier;

[0007] Performing film coating on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is formed on the surface of the first transparent conductive plate;

[0008] Patterning the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode, wherein the transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive plate into mutually insulated transparent conductive circuits;

[0009] The transparent insulating pattern is geometrically prepared to obtain the property of insulating the positive electrode and the negative electrode of the luminous body;

[0010] The positive electrode and negative electrode of the light-emitting body are fixed to the surface of the corresponding transparent positive electrode and transparent negative electrode respectively through conductive adhesives, so that one or more light-emitting bodies can be independently controlled through transparent conductive circuits. The external control driving board can control the luminous effect of the light-emitting body to obtain a transparent light-emitting screen.

[0011] A transparent luminous screen, comprising:

[0012] A transparent carrier, a transparent conductive layer, a transparent insulating pattern, a transparent positive electrode, a transparent negative electrode, a transparent conductive circuit, a conductive material buffer layer, a conductive material adhesive, a light emitting body, a colloid protective layer, a touch conductive circuit, and an external control board, wherein the transparent conductive layer is provided on at least one side of the transparent carrier, and the transparent insulating pattern is used to divide the transparent conductive layer into a transparent positive electrode, a transparent negative electrode, and a transparent conductive circuit, wherein the transparent conductive circuit includes a transparent positive electrode and a transparent negative electrode, which are respectively used for independent electrical connection with the positive electrode and the negative electrode of one or more light emitting bodies;

[0013] The positive electrode and negative electrode of the luminous body are fixed on the surface or inside of the transparent positive electrode and the transparent negative electrode;

[0014] The conductive material buffer layer is located on the surface or inside of the transparent positive electrode and the transparent negative electrode;

[0015] The conductive material adhesive is located on the conductive material buffer layer, and the conductive material buffer layer corresponds to the transparent positive electrode and the transparent negative electrode respectively;

[0016] The positive electrode and the negative electrode of the light emitting body are fixed on the surface of the conductive material adhesive;

[0017] The colloidal protective layer is used to encapsulate and protect the luminous body;

[0018] The touch conductive circuit is formed on the transparent conductive layer, the touch conductive circuit is insulated from the transparent conductive circuit, and the transparent conductive circuit is electrically connected to the transparent positive electrode and the transparent negative electrode respectively;

[0019] The external control board is electrically connected to the touch conductive circuit to control the light-emitting body.

[0020] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.

[0022] FIG1 is a flow chart of a method for preparing a transparent light-emitting screen in one embodiment;

[0023] FIG2 is a diagram of a transparent insulating pattern in one embodiment;

[0024] FIG3 is a transparent diagram of a transparent light-emitting screen when it is not illuminated in one embodiment;

[0025] FIG4 is a light-emitting diagram of the transparent light-emitting screen shown in FIG3 ;

[0026] FIG5 is a physical picture of a circular conductive material precisely screen-printed in one embodiment;

[0027] FIG6 is a schematic diagram of a transparent light-emitting screen with a touch control switch in one embodiment;

[0028] FIG7 is a schematic diagram of conductive material attached to the surface and inside of a pore in one embodiment;

[0029] FIG8 is a comparison diagram of the effects of a transparent light-emitting screen installed on a car skylight during the day and at night in one embodiment. DETAILED DESCRIPTION

[0030] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Please refer to Figure 1, which is a flow chart of a method for preparing a transparent light-emitting screen according to an embodiment of the present invention. The method for preparing a transparent light-emitting screen includes some or all of the following.

[0034] S100: Provide a transparent carrier.

[0035] In this embodiment, the transparent carrier serves as the substrate of the transparent light-emitting screen and is the primary light-transmitting component of the transparent light-emitting screen. In other words, in addition to being a carrier for attaching other conductive films, the transparent carrier also serves as the main light-transmitting component of the transparent light-emitting screen, ensuring that the transparent light-emitting screen achieves a specified light transmittance and transmits as much light as possible. The transparent carrier is made of at least one of polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI), and polyethylene naphthalate (PEN), with a light transmittance of greater than or equal to 90%.

[0036] S200: performing film coating on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is formed on the surface of the first transparent conductive plate.

[0037] In this embodiment, a transparent conductive layer is prepared on the surface of the transparent carrier to form a desired conductive layer on the surface of the transparent carrier, and the surface resistance of the conductive layer is no more than 20 ohms / square.

[0038] S300: Patterning the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode, wherein the transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive plate into mutually insulated transparent conductive circuits.

[0039] In this embodiment, the first transparent conductive plate is patterned to form corresponding transparent insulating patterns, transparent positive electrodes, and transparent negative electrodes on its surface. Specifically, the required transparent insulating patterns, transparent positive electrodes, and transparent negative electrodes are formed on a predetermined surface according to a specified pattern. The transparent positive and negative electrodes are routed to the edges of the substrate via independent transparent conductive traces. The transparent positive and negative electrodes are part of these traces and are used to contact the positive and negative electrodes of the light emitter, respectively. The channel impedance from any transparent positive and negative electrodes to the edge flexible printed circuit board is controlled to below 5K.

[0040] S400: preparing the shape of the transparent insulating pattern to obtain the property of insulating the positive electrode and the negative electrode of the luminous body.

[0041] In this embodiment, transparent insulating patterns are distributed in the transparent conductive layer area, dividing the transparent conductive layer into different transparent conductive paths. The transparent insulating patterns include geometric shapes such as straight lines, curves, squares, rectangles, and ellipses, among which: (1) Linear geometric shapes such as straight lines and curves are distributed in the location without the light source, and the width of the single straight lines, curves, etc. etched by laser is 20-100 microns; (2) Non-linear geometric shapes such as squares, rectangles, and ellipses are distributed in the location with the light source, and the conductive layer inside the square, rectangle, ellipse, etc. geometric shapes is completely etched away by laser, or multiple lines are etched inside, or insulating floating blocks of a certain shape, such as diamonds, are etched inside. The length of the non-linear geometric shapes such as squares, rectangles, and ellipses is not less than 2 mm, and the width is 1 / 4 to 1 / 2 greater than the insulation gap (GAP) between the positive and negative electrodes of the light source, that is, width = GAP + (1 / 4 to 1 / 2) GAP. For example, if the GAP of a particular illuminator is 150 microns, the corresponding geometric width would be designed to be 150 + 1 / 4 * 150 = 187.5 microns, or 225 microns, or any number in between (see Figure 2 for details). The transparent insulating pattern divides the transparent conductive layer into distinct transparent conductive paths. The impedance measured on both sides of the transparent insulating pattern using a multimeter must be greater than 100 megohms.

[0042] S500: The positive electrode and negative electrode of the light-emitting body are fixed to the circular conductive solid surface of the corresponding transparent positive electrode and transparent negative electrode through conductive adhesives, so that one or more light-emitting bodies are independently controlled through transparent conductive circuits. The transparent conductive circuits of one or more light-emitting bodies are gathered to any edge of the second transparent conductive plate. The external control driving board can realize the control of the light-emitting effect of the light-emitting body to obtain a transparent light-emitting screen.

[0043] In this embodiment, the conductive adhesive is a liquid conductive material such as conductive silver paste or conductive silver glue. The liquid conductive material is applied to the surface of a circular conductive solid body by dipping or spraying the liquid conductive material onto it. After drying on the surface of the circular conductive solid body, the size of the liquid conductive material is no larger than the size of the light-emitting electrode. The light-emitting body is then secured to the liquid conductive material under pressure by methods such as patch bonding or die bonding. Under the pressure of the light-emitting body, the liquid conductive material flows and spreads to a certain extent, then wraps around the edge of the light-emitting body. Finally, after baking at a certain temperature, the liquid conductive material solidifies and adheres the light-emitting body to the circular conductive solid body, forming a conductive path. The positive and negative electrodes of one or more light-emitting bodies are independently controlled via transparent conductive circuits. The transparent conductive circuits of one or more light-emitting bodies converge at any edge of the second transparent conductive plate. An external control and drive board can control the light-emitting effect of the light-emitting body, thereby forming a transparent light-emitting screen. See Figures 3 and 4 for details.

[0044] In another embodiment, the method for preparing the transparent light-emitting screen includes:

[0045] Provide a transparent carrier;

[0046] Performing film coating on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is formed on the surface of the first transparent conductive plate;

[0047] Patterning the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode. The transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive plate into mutually insulated transparent conductive circuits.

[0048] The transparent insulating pattern is geometrically prepared to obtain the property of insulating the positive electrode and the negative electrode of the luminous body;

[0049] A conductive material buffer layer is precisely screen-printed at the transparent positive electrode and the transparent negative electrode. The buffer material can be a single-layer structure or a multi-layer structure to improve the conduction characteristics between the light-emitting body and the transparent conductive layer.

[0050] In this embodiment, each light-emitting element has a positive electrode and a negative electrode. The surface materials of the positive and negative electrodes are primarily gold (Au) or a gold alloy. The light-emitting elements are low-voltage products with an input voltage of 2.0V to 3.0V and a drive current of approximately 10mA. The total channel impedance needs to be very low. The total channel impedance consists of two components: the contact impedance between the light-emitting element and the transparent positive and negative electrodes, and the line impedance of the transparent conductive path. Therefore, the contact impedance between the light-emitting element and the transparent positive and negative electrodes needs to be minimized. To this end, a conductive material buffer layer is introduced between the light-emitting element and the transparent positive and negative electrodes. The conductive material buffer layer can include liquid conductive materials such as silver paste, silver paste, and solder paste. Taking silver paste as an example, the silver particle content should be greater than 80%, and the silver particle volume resistivity should be better than 10-4 ohm·cm. This can reduce the contact impedance between the light-emitting element electrodes and the transparent positive and negative electrodes to below a few ohms.

[0051] In this embodiment, the size of the positive electrode and negative electrode of the light-emitting body are both about 100 microns. Due to the fine size, a precision screen is required to print the liquid conductive material onto the positive and negative electrodes of the transparent conductive layer using a high-precision printer. The surface of the precision screen has circular holes corresponding to the positive and negative electrode patterns of the transparent conductive circuit, and the size of the circular holes is no more than 0.5 mm. Specifically, the circular holes corresponding to the positive and negative electrode patterns of the transparent conductive circuit are first accurately drawn in the drawing software. Then, a film is printed based on the drawing, and the position and size of the circular holes on the screen are checked based on the film. Place the precision screen on a high-precision printing press. Adjust the scraper pressure to 0-300 Newtons, the scraper angle to + / - 30 degrees, and the printing speed to 5-100 mm / s. Pour liquid conductive material onto the starting end of the screen. The scraper moves the liquid conductive material across the screen surface. At the circular holes, the liquid conductive material penetrates and prints onto the transparent positive and negative electrodes, forming circular liquid conductive material circles on the surfaces of the transparent positive and negative electrodes. The circular liquid conductive material is distributed on both sides of a geometric shape, such as a square, rectangle, or oval. After baking at a temperature of 80-150 degrees Celsius, the circular liquid conductive material becomes a circular conductive solid. The distance between the center point of the circular conductive solid at the positive electrode and the center point of the circular conductive solid at the negative electrode should be greater than the insulation spacing between the positive and negative electrodes of the light-emitting element (see Figure 5 for details).

[0052] Finally, the positive electrode and negative electrode of the light-emitting body are fixed to the surface of the conductive material buffer layer of the corresponding transparent positive electrode and transparent negative electrode respectively through conductive adhesives, so that one or more light-emitting bodies can be independently controlled through transparent conductive circuits, and the transparent conductive circuits of one or more light-emitting bodies are gathered to any edge of the second transparent conductive plate, so that the luminous effect of the light-emitting body can be controlled by an external control driving board connected to the transparent conductive circuit to obtain a transparent light-emitting screen.

[0053] In another embodiment, the method for preparing the transparent light-emitting screen includes:

[0054] Provide a transparent carrier;

[0055] Performing film coating on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is formed on the surface of the first transparent conductive plate;

[0056] Patterning the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode. The transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive plate into mutually insulated transparent conductive circuits.

[0057] The transparent insulating pattern is geometrically prepared to obtain the property of insulating the positive electrode and the negative electrode of the luminous body;

[0058] A conductive material buffer layer is prepared at the transparent positive electrode and transparent negative electrode positions by opening holes in a mask combined with vacuum coating. The buffer layer can be a single-layer structure or a multi-layer structure to improve the contact characteristics between the light-emitting body and the transparent positive electrode and the transparent negative electrode. Specifically, stainless steel or PET is used as a mask material, and holes are opened at specific positions. The thickness of the mask material such as stainless steel or PET is preferably less than 50 microns, and the shape of the opening is rectangular or circular. The size of the rectangle is not more than 200 microns by 200 microns, and the diameter of the circle is not more than 200 microns. The mask with the openings prepared is attached to the second transparent conductive plate. The positions of the openings correspond to the surfaces of the transparent positive electrode and the transparent negative electrode. Then, a vacuum coating preparation method is used to deposit a highly conductive material on the surface of the transparent positive electrode and the transparent negative electrode, such as one or more composite materials of gold, silver, copper, metal oxides, etc. Optional vacuum coating methods include magnetron sputtering, evaporation coating, ion plating, atomic layer coating, various vapor deposition coatings, etc.

[0059] The positive and negative electrodes of the light-emitting elements are fixed to the surfaces of the conductive material buffer layers of the corresponding transparent positive and negative electrodes using conductive adhesives. One or more light-emitting elements are independently controlled via transparent conductive circuits, and the transparent conductive circuits of one or more light-emitting elements converge at any edge of the second transparent conductive plate. An external control and driving board can control the light-emitting effects of the light-emitting elements to produce a transparent light-emitting screen. The number of light-emitting elements can be one or more, and the colors can cover blue, red, green, etc. The distribution of the light-emitting elements on the surface of the second transparent conductive plate can be regular or random, with high density in some areas and low density in others.

[0060] A non-closed-loop pattern, such as a non-closed-loop circle or rectangle, can be laser-etched at any location on the transparent conductive layer. The transparent conductive circuit at the corresponding location and one or more other transparent conductive circuits containing light-emitting elements can then be directly brought together and directed to any edge of the second transparent conductive plate. The external control board can then implement both finger touch control and control of the light-emitting element's luminous effect. Specifically, a location can be laser-etched at a specific location on the second transparent conductive plate. The transparent conductive circuit at that location is independently controlled by the external control board and linked to the output circuits of the remaining light-emitting elements on the control board. The light-emitting screen can be turned on and off and its modes can be switched by finger touch, as shown in the schematic diagram of Figure 6. The light-emitting screen can also be controlled on, off, and in mode via Bluetooth, an app, or the like.

[0061] In another embodiment, the method for preparing the transparent light-emitting screen includes:

[0062] Provide a transparent carrier;

[0063] The transparent carrier is double-sided coated to form a first transparent conductive plate, whereby a transparent conductive layer is formed on both the first and second surfaces of the first transparent conductive plate. Specifically, the transparent conductive layer is deposited on the transparent carrier by vacuum magnetron sputtering. The transparent conductive layer can be a single layer or a multilayer thin film structure. The multilayer thin film structure is deposited in stages to form a multilayer transparent conductive film on the transparent carrier. For example, the transparent conductive film may include, in sequence, a metal oxide film, a metal layer, and a metal oxide film. The metal oxide film may be at least one of a silicon oxide film, a titanium oxide film, a niobium oxide film, and an aluminum oxide film. The metal layer may be made of gold, silver, or copper. The metal layer serves as the base layer of the conductive circuit, i.e., the layer where the conductive path resides. The transparent conductive film may also be a laminated disordered nanosilver mesh transparent conductive film, a metal indium tin oxide film, a carbon nanotube film, or a graphene film. The sheet resistance of the transparent conductive film must be less than 20 ohms / square, and the adhesion between the transparent conductive film and the transparent carrier must meet ASTM-5B requirements.

[0064] The first and second surfaces of the first transparent conductive plate are patterned to obtain a second transparent conductive plate having a transparent insulating pattern and a transparent positive electrode on the first surface and a transparent insulating pattern and a transparent negative electrode on the second surface. The transparent insulating pattern divides the transparent conductive layer on the first transparent conductive plate into mutually insulated transparent positive electrodes, transparent negative electrodes, and transparent conductive circuits. The second transparent conductive plate is perforated at the location of the positive electrode or the negative electrode. The perforation is performed by laser burning to form a pore between the first and second surfaces of the second transparent conductive plate. Specifically, a laser operating in the mid-infrared band, for example, a wavelength of 1064 nm and a power greater than 60 W, is used to laser-drill the first surface of the second transparent conductive plate to form a pore between the first and second surfaces of the second transparent conductive plate. The pore has a diameter of 0.2 mm or less. Liquid conductive material is screen-printed at the corresponding locations on the positive or negative electrodes of the second transparent conductive plate. If the positive electrode remains on the first surface, the liquid conductive material is printed at the negative electrode location. If the negative electrode remains on the first surface, the liquid conductive material is printed at the positive electrode location. Under the action of screen printing pressure, the liquid conductive material forms bridges at the edges and internal surfaces of the pores, as shown in Figure 7. The second transparent conductive plate is then baked, and the liquid conductive material solidifies under the action of temperature, firmly connecting to the conductive films on the first and second surfaces.

[0065] The transparent insulating pattern is geometrically prepared to obtain the property of insulating the positive electrode and the negative electrode of the light-emitting body. If the positive electrode is retained on the first surface, a transparent insulating pattern and a conductive path corresponding to the transparent positive electrode are prepared on the first surface, and a transparent insulating pattern and a conductive path corresponding to the transparent negative electrode are prepared on the second surface. The paths of the transparent positive electrode and the transparent negative electrode are respectively gathered to the edge of the second transparent conductive plate through the first surface and the second surface. Similarly, if the negative electrode is retained on the first surface, a transparent insulating pattern and a conductive path corresponding to the transparent negative electrode are prepared on the first surface, and a transparent insulating pattern and a conductive path corresponding to the transparent positive electrode are prepared on the second surface. The paths of the transparent negative electrode and the transparent positive electrode are respectively gathered to the edge of the second transparent conductive plate through the first surface and the second surface. The method can double the density of the light-emitting body on the second transparent conductive plate;

[0066] A conductive material buffer layer is precisely screen-printed on the surface of the transparent positive electrode and the transparent negative electrode. The buffer layer can be a single-layer structure or a multi-layer structure to improve the electrical conductivity between the light-emitting body and the transparent positive electrode and the transparent negative electrode;

[0067] The positive electrode and negative electrode of the light-emitting body are fixed to the surface of the conductive material buffer layer of the corresponding transparent positive electrode and transparent negative electrode respectively through conductive adhesives, so that one or more light-emitting bodies can be independently controlled through transparent conductive circuits. The transparent conductive circuits of one or more light-emitting bodies are gathered to any edge of the second transparent conductive plate. The external control driving board can control the luminous effect of the light-emitting body to obtain a transparent light-emitting screen.

[0068] In another embodiment, the method for preparing the transparent light-emitting screen includes:

[0069] Provide a transparent carrier;

[0070] Performing film coating on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is formed on the surface of the first transparent conductive plate;

[0071] Patterning the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode. The transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive plate into mutually insulated transparent conductive circuits.

[0072] The transparent insulating pattern is geometrically prepared to obtain the property of insulating the positive electrode and the negative electrode of the luminous body;

[0073] A conductive material buffer layer is precisely screen-printed on the surface of the transparent positive electrode and the transparent negative electrode. The buffer layer can be a single-layer structure or a multi-layer structure to improve the electrical conductivity between the light-emitting body and the conductive layer.

[0074] The positive and negative electrodes of the light-emitting body are fixed to the surfaces of the conductive material buffer layer of the corresponding transparent positive and negative electrodes respectively using conductive adhesives. The light-emitting body is 0.2 to 0.4 mm higher than the surface of the second transparent conductive plate. A colloidal protective layer is laid on the surface of the second transparent conductive plate based on the height of the light-emitting body;

[0075] One or more luminous elements are independently controlled via transparent conductive circuits. These circuits converge at any edge of the second transparent conductive plate. An external control and driver board can control the luminous effects of the luminous elements, creating a transparent luminous screen. For example, a car skylight can be transparent during the day and display a luminous effect at night. (See Figure 8 for details.)

[0076] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A method for preparing a transparent light-emitting screen, characterized by comprising: Providing a transparent carrier; Performing coating preparation on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is coated on the surface of the first transparent conductive plate; Performing pattern preparation on the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode, wherein the transparent insulating pattern divides the transparent conductive layer on the surface of the first transparent conductive plate into mutually insulated transparent conductive lines; Performing geometric shape preparation on the transparent insulating pattern to obtain the characteristic of insulating the positive electrode and the negative electrode of the light-emitting body; Fixing the positive electrode and the negative electrode of the light-emitting body on the surfaces of the corresponding transparent positive electrode and transparent negative electrode respectively through a conductive adhesive, so that one or more light-emitting bodies are independently controlled through the transparent conductive lines, and an external control driving board can realize the control of the light-emitting effect of one or more light-emitting bodies to obtain a transparent light-emitting screen.

2. The method for preparing a transparent light-emitting screen according to claim 1, wherein Performing coating preparation on the transparent carrier to obtain a first transparent conductive plate, including: Forming a transparent conductive layer on at least one surface of the transparent carrier to obtain the first transparent conductive plate.

3. The method for preparing a transparent light-emitting screen according to claim 2, wherein The surface resistivity of the transparent conductive layer is less than or equal to 20 ohms per square.

4. The method for preparing a transparent light-emitting screen according to claim 1, wherein The material of the transparent carrier is at least one of polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI), and polyethylene naphthalate (PEN).

5. The method for preparing a transparent light-emitting screen according to claim 1, wherein The light transmittance of the transparent carrier is greater than or equal to 90%.

6. The method for preparing a transparent light-emitting screen according to claim 1, wherein Performing pattern preparation on the first transparent conductive plate to obtain a second transparent conductive plate having a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode, including: Forming patterns of a transparent insulating pattern, a transparent positive electrode, and a transparent negative electrode on the transparent conductive layer, and the transparent insulating line pattern divides the transparent conductive layer on the first transparent conductive plate into mutually insulated transparent conductive lines, wherein the channel impedances of at least two transparent conductive lines are consistent.

7. The method for preparing a transparent light-emitting screen according to claim 1, characterized in that, After fixing the positive electrode and the negative electrode of the light-emitting body on the surfaces of the corresponding transparent positive electrode and transparent negative electrode respectively through a conductive adhesive, it further includes: Laser etching a non-closed loop pattern at any position of the transparent conductive layer, and leading the transparent conductive line at the corresponding position and the other one or more transparent conductive lines with light-emitting bodies placed thereon to any edge of the second transparent conductive plate, and the external control board can realize the control of the light-emitting effect of one or more light-emitting bodies; Leading the transparent conductive line to a flexible cable board at the non-closed loop position, wherein the size of the non-closed loop pattern is based on the finger touch size, and the flexible circuit board is externally connected to the control board, so that the on / off and mode switching of the light-emitting screen can be realized by finger touch on the surface of the non-closed loop pattern through the control board.

8. The method for preparing a transparent light-emitting screen according to claim 7, wherein The channel impedance from any transparent positive electrode and transparent negative electrode to the edge flexible cable board is less than 5K.

9. The method for preparing a transparent light-emitting screen according to claim 1, wherein Performing geometric shape preparation on the transparent insulating pattern to obtain the characteristic of insulating the positive electrode and the negative electrode of the light-emitting body, including: The transparent insulating pattern includes any combination of geometric shapes such as straight lines, curves, squares, rectangles, and ellipses. Among them, the linear geometric shapes of straight lines and curves are distributed at positions without light-emitting bodies, and the non-linear geometric shapes of squares, rectangles, and ellipses are distributed at positions with light-emitting bodies.

10. The method for preparing a transparent light-emitting screen according to claim 9, wherein The impedance measured on both sides of the transparent insulating pattern is greater than 100 megaohms.

11. The method for preparing a transparent light-emitting screen according to claim 9, characterized in that, The width of a single line of the transparent insulating pattern of straight lines and curves is 20 - 100 micrometers.

12. The method for preparing a transparent light-emitting screen according to claim 9, wherein Use a laser to completely etch away the conductive layer inside the geometric shapes of squares, rectangles, and ellipses, or etch multiple lines inside, or etch insulating floating blocks with a certain shape inside.

13. The method for preparing a transparent light-emitting screen according to claim 12, wherein The length of the insulating floating block is greater than or equal to 2 mm, and the width of the insulating floating block is 1 / 4 to 1 / 2 larger than the insulating distance between the positive and negative electrodes of the light-emitting body.

14. The method for preparing a transparent light-emitting screen according to claim 1, wherein The conductive adhesive is a liquid conductive material, and the conductive adhesive includes any one of conductive silver paste and conductive silver glue.

15. The method for preparing a transparent light-emitting screen according to claim 14, wherein, The process of fixing the positive and negative electrodes of the light-emitting body to the surfaces of the corresponding transparent positive and negative electrodes through the conductive adhesive includes: Dip or spray the liquid conductive material onto the surface of the circular conductive solid through a needle dipping glue or spray coating method. The size of the liquid conductive material after surface drying on the surface of the circular conductive solid should not be larger than the size of the light-emitting body electrode. Then, fix the light-emitting body above the liquid conductive material by means of chip mounting, die bonding, etc. under a certain pressure. Under the pressure of the light-emitting body, the liquid conductive material will flow and spread to a certain extent, and then wrap the edge of the light-emitting body. Finally, after baking at a certain temperature, the liquid conductive material will become solid and bond the light-emitting body and the circular conductive solid together to form a conductive path.

16. The method for preparing a transparent light-emitting screen according to claim 1, wherein, Before fixing the positive and negative electrodes of the light-emitting body to the surfaces of the corresponding transparent positive and negative electrodes through the conductive adhesive, a conductive material buffer layer is also prepared on the surfaces of the transparent positive and negative electrodes.

17. The method for preparing a transparent light-emitting screen according to claim 16, wherein The conductive material buffer layer includes silver glue, silver paste, and solder paste.

18. The method for preparing a transparent light-emitting screen according to claim 17, wherein, The silver colloid particle content is higher than 80%, and the volume resistivity of silver particles is greater than 10 -4 ohm·cm.

19. The method for preparing a transparent light-emitting screen according to claim 16, wherein Use a precision screen printing method or a method of using a mask plus coating to prepare the conductive material buffer layer.

20. The method for preparing a transparent light-emitting screen according to claim 16, wherein The pressure of the squeegee in the precision screen printing method is 0 - 300 Newtons, the angle of the squeegee is + / - 30 degrees, and the printing speed is 5 - 100 millimeters per second.

21. The method for preparing a transparent light-emitting screen according to claim 1, wherein, The transparent conductive film sequentially includes a metal oxide film, a metal layer, and a metal oxide film. The metal oxide film is at least one of a silicon oxide film, a titanium oxide film, a niobium oxide film, and an aluminum oxide film. The material of the metal layer is gold, silver, or copper.

22. The method for preparing a transparent light-emitting screen according to claim 1, wherein, The transparent conductive film is any one of a laminated disordered nano silver mesh transparent conductive film, an indium tin oxide film, carbon nanotubes, and a graphene film.

23. The method for preparing a transparent light-emitting screen according to claim 1, wherein Perform coating preparation on the transparent carrier to obtain a first transparent conductive plate, so that a transparent conductive layer is plated on the surface of the first transparent conductive plate, including: Prepare a transparent conductive layer on the first surface and the second surface of the transparent carrier, and perform laser drilling to obtain a first transparent conductive plate with pores, where the pores penetrate the transparent conductive layer and the transparent carrier.

24. The method for preparing a transparent light-emitting screen according to claim 23, wherein, A laser with a wavelength of 1064 nm and a power greater than 60 W is used to perform laser drilling on the first surface of the second transparent conductive plate to form pores between the first surface and the second surface of the second transparent conductive plate, and the aperture of the pores is less than or equal to 0.2 mm.

25. The method for preparing a transparent light-emitting screen according to claim 23, characterized in that, Preparing a transparent conductive layer on the first surface and the second surface of the transparent carrier, and performing laser drilling to obtain a first transparent conductive plate with pores, including: Laser etching is respectively performed on the first surface and the second surface of the transparent carrier to obtain a first surface with a transparent insulating pattern, a transparent positive electrode or a transparent negative electrode, and a second surface with a transparent insulating pattern, a transparent positive electrode or a transparent negative electrode.

26. The method for preparing a transparent light-emitting screen according to claim 23, wherein, Preparing a transparent conductive layer on the first surface and the second surface of the transparent carrier, and performing laser drilling to obtain a first transparent conductive plate with pores. After that, it further includes: A conductive material buffer layer is prepared on the inner surfaces around and inside the pores on the first surface and the second surface of the transparent carrier by using precision screen printing or a mask plus coating. The conductive material buffer layer is used as a conductive substance filler to bridge and connect the transparent conductive layers on the first surface and the second surface.

27. The method for preparing a transparent light-emitting screen according to claim 23, wherein The positive electrode and the negative electrode of the light-emitting body are respectively fixed on the surfaces of the corresponding transparent positive electrode and transparent negative electrode through a conductive adhesive. After that, it further includes encapsulating the transparent light-emitting screen with a colloid protective layer. The specific encapsulation steps are as follows: Prepare a single-component or multi-component transparent glue, pour the selected glue into a container, and use a stirrer to fully stir the glue at a fixed speed; Let the stirred glue liquid stand still. After there are no bubbles visible to the naked eye in the glue liquid, pour the glue on the starting end to the ending end of the second transparent conductive plate in a decreasing manner; Based on the height of the light-emitting body, use a scraper to evenly move from one side to the other side, and then perform temperature baking at 80-150 °C. After baking, a colloid protective layer is attached to the surface.

28. A transparent light-emitting screen, characterized in that, Including: A transparent carrier, a transparent conductive layer, a transparent insulating pattern, a transparent positive electrode, a transparent negative electrode, a transparent conductive circuit, a conductive material buffer layer, a conductive material adhesive, a light-emitting body, a colloid protective layer, a touch conductive circuit, and an external control board. The transparent conductive layer is disposed on at least one surface of the transparent carrier. The transparent insulating pattern is used to divide the transparent conductive layer into a transparent positive electrode, a transparent negative electrode, and a transparent conductive circuit. Among them, the transparent conductive circuit includes a transparent positive electrode and a transparent negative electrode, which are respectively used for independent electrical connections in contact with the positive electrode and the negative electrode of one or more light-emitting bodies; The positive electrode and the negative electrode of the light-emitting body are fixed on the surface or inside of the transparent positive electrode and the transparent negative electrode; The conductive material buffer layer is located on the surface or inside of the transparent positive electrode and the transparent negative electrode; The conductive material adhesive is located on the conductive material buffer layer, and the conductive material buffer layer corresponds to the transparent positive electrode and the transparent negative electrode respectively; The positive electrode and the negative electrode of the light-emitting body are fixed on the surface of the conductive material adhesive; The colloid protective layer is used to encapsulate and protect the light-emitting body; The touch conductive circuit is formed on the transparent conductive layer, and the touch conductive circuit is insulated from the transparent conductive circuit. The transparent conductive circuit is electrically connected to the transparent positive electrode and the transparent negative electrode respectively; The external control board is electrically connected to the touch conductive circuit to control the light-emitting body.

29. The transparent light-emitting screen according to claim 28, wherein, The transparent positive electrode and the transparent negative electrode can be prepared in the same direction on the first surface or the second surface of the first transparent conductive plate; Alternatively, the transparent positive electrode and the transparent negative electrode are respectively prepared on the first surface and the second surface of the first transparent conductive plate. The second transparent conductive plate is provided with a perforation that penetrates the transparent conductive layer and the transparent carrier. The perforation is used to connect the first surface and the conductive layer on the first surface, and a conductive material adhesive is filled in the perforation to bridge and connect the transparent positive electrode and the transparent negative electrode.

30. The transparent light-emitting screen according to claim 28, wherein The colloid protection layer is made of a single-component or multi-component transparent glue. Based on the height of the light-emitting body and the second transparent conductive plate, a colloid protection layer is automatically coated on the second transparent conductive plate by using packaging equipment.

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