Electroplating device and electroplating method

Abstract

An electroplating device and an electroplating method, relating to the field of semiconductor manufacturing apparatuses. The electroplating device comprises: a substrate holder (10), which is used for holding and rotating a substrate (20); a film frame (30), which is located below the substrate holder (10), the inside of the film frame (30) being used for accommodating an electroplating solution, and the film frame (30) being provided with a plurality of liquid outlet holes for spraying the electroplating solution onto the surface of the substrate (20); and a shielding member (12), which is connected to the substrate holder (10) by means of fixing columns, a gap being provided between the shielding member (12) and the substrate (20), the shielding member (12) being located between the substrate (20) and the film frame (30), and the shielding member (12) shielding the whole edge of the substrate (20) so as to weaken the edge electric field of the substrate (20). The electroplating device can weaken or shield the electric field near the edge of a substrate, thereby effectively reducing the coating thickness at the edge of the substrate and achieving the uniformity of the coating thickness on the substrate.

Description

Electroplating apparatus and electroplating method TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing equipment, and more particularly, to an electroplating apparatus and electroplating method. BACKGROUND

[0002] In the field of semiconductor manufacturing, electroplating is a common method for depositing a thin film of metal on a substrate. In particular, in advanced packaging technology, due to the advantages of simple process, low cost, and easy mass production, etc., electroplating is generally used to form solder (e.g., copper, nickel, tin, gold, etc.) bumps on a substrate to achieve chip-substrate interconnection.

[0003] However, in the electroplating process, the electric lines in the middle of the substrate tend to be uniform and parallel, and the electric lines at the edges tend to be dense, resulting in a higher electric field strength at the edges of the substrate, which causes the current density at the edge region of the substrate to be higher than that in other regions, thereby forming an edge effect. Due to the higher current density, the deposition rate of the plating layer at the edge of the substrate is faster, resulting in a thicker plating layer at the edge of the substrate than in other regions.

[0004] Therefore, it is of great significance to design an electroplating apparatus capable of effectively reducing the film thickness at the edge of the substrate. SUMMARY

[0005] Therefore, the present application provides an electroplating apparatus and electroplating method, which can weaken the electric field near the edge of the substrate, effectively reduce the film thickness at the edge of the substrate, and achieve uniformity of the film thickness on the substrate.

[0006] In a first aspect, an electroplating apparatus is provided, comprising: a substrate holder for holding and rotating a square substrate; a film holder located below the substrate holder, the inside of the film holder being used to accommodate an electroplating solution, and a plurality of liquid outlet holes being provided on the film holder for spraying the electroplating solution onto the surface of the substrate; a shielding member connected to the substrate holder by a fixing column, the shielding member having a gap with the substrate, the shielding member being located between the substrate and the film holder, and the shielding member being used to shield a ring of edges of the substrate to weaken the edge electric field of the substrate.

[0007] Optionally, the substrate holder is a vacuum holder.

[0008] Optionally, the gap between the shielding member and the substrate is not less than 0.5 mm to prevent the electroplating solution from accumulating at the edges of the substrate.

[0009] Optionally, the material of the shielding member is a corrosion-resistant insulating material.

[0010] Optionally, the electroplating apparatus further comprises a motor for driving the substrate holder to rotate about its own rotation axis.

[0011] Based on the above, the electroplating device is configured to rotate the substrate and the shielding member at the same speed. During electroplating, the edge field of the substrate is weakened due to the shielding member shielding the edge of the substrate, thereby reducing the edge film thickness of the substrate and achieving the uniformity of the film thickness on the substrate.

[0012] In some possible implementation manners, the shielding member has an overlapping area with the substrate in the orthographic projection, and the overlapping area is less than or equal to the area in which the edge film thickness of the substrate increases.

[0013] Optionally, the overlapping area has a first width, and the area in which the edge film thickness of the substrate increases has a second width, and the width difference between the first width and the second width is within 5 mm.

[0014] Optionally, the shielding member is a square ring-shaped shielding member, and the shape of the inner edge of the shielding member includes any one of a right-angled rectangle, a round-angled rectangle, a right-angled zigzag shape and a triangular zigzag shape; and the shape of the inner edge of the shielding member is similar to the shape of the inner circle of the area in which the edge film thickness of the substrate increases.

[0015] In this implementation manner, the area of the substrate edge that needs to be protected can be accurately shielded, and the electroplating requirements of different substrate sizes and shapes are met, thereby enhancing the flexibility and applicability of the electroplating device.

[0016] In some possible implementation manners, the shielding member is rotationally connected with the fixed column, and the included angle between the shielding member and the fixed column is adjustable, so that the included angle between the shielding member and the substrate is adjustable, to change the shielding strength of the shielding member, and the size of the included angle is negatively correlated with the shielding strength.

[0017] In this implementation manner, the fixed column can firmly fix the shielding member below the substrate holder, to prevent the shielding member from being deviated or falling off during electroplating. The angle between the shielding member and the substrate is changed by adjusting the included angle between the shielding member and the fixed column, to change the shielding strength of the shielding member, to meet the requirements of electroplating of different substrate edges.

[0018] In some possible implementation manners, the shielding member is provided with a plurality of through holes, and the size of each through hole is adjustable.

[0019] Optionally, an adjustable cover is arranged to control the opening rate of the shielding member.

[0020] In this implementation manner, the size of the through hole is adjusted in a targeted manner, so that the electric field distribution is effectively adjusted, and the uniformity of the film on the substrate surface can be achieved.

[0021] In a second aspect, the application provides a plating method, comprising: fixing a substrate on a substrate holder; connecting a shielding member with the substrate holder, the shielding member having a gap with the substrate, the shielding member shielding a periphery of the substrate; driving the substrate holder to rotate, so that the substrate and the shielding member rotate at the same speed; and performing a plating process by spraying plating liquid to a surface of the substrate through a liquid outlet hole on a film holder; wherein the gap between the shielding member and the substrate is not less than 0.5 mm.

[0022] In some possible implementations, the plating method further comprises: after the plating process is completed, obtaining a region where the edge film thickness of the substrate is increased; and adjusting an overlapping region of the front projection of the shielding member and the front projection of the substrate, so as to perform a next plating process.

[0023] Optionally, the adjusting of the overlapping region of the front projection of the shielding member and the front projection of the substrate specifically comprises: adjusting the overlapping region to be less than or equal to the region where the edge film thickness of the substrate is increased, wherein the overlapping region has a first width, and the region where the edge film thickness of the substrate is increased has a second width, and a width difference between the first width and the second width is within 5 mm.

[0024] Optionally, the region where the edge film thickness of the substrate is increased has an inner circle and an outer circle, and the adjusting of the overlapping region of the front projection of the shielding member and the front projection of the substrate specifically comprises: selecting another shielding member with a shape similar to that of the inner circle according to the shape of the inner circle; and replacing the shielding member with the other shielding member.

[0025] Optionally, the adjusting of the overlapping region of the front projection of the shielding member and the front projection of the substrate comprises: adjusting an included angle between the shielding member and the substrate, so as to change a shielding strength of the shielding member.

[0026] Optionally, before the next plating process is performed, the method further comprises: determining a first region and a second region in the region where the edge film thickness of the substrate is increased, wherein a film thickness in the first region is lower than an average film thickness of the substrate, and a film thickness in the second region is higher than the average film thickness; and adjusting an open area ratio of through holes on the shielding member, so that the open area ratio of the through holes corresponding to the first region is higher than the open area ratio of the through holes corresponding to the second region.

[0027] In summary, the plating device provided in the application connects a shielding member with a substrate holder, so that the shielding member and the substrate rotate at the same speed during plating, and the shielding member shields a periphery of the substrate to shield the edge electric field of the substrate, thereby weakening or shielding the edge electric field of the substrate, reducing the edge film thickness of the substrate, and achieving the uniformity of the film thickness on the substrate.

[0028] SUMMARY

[0029] FIG. 1 is a simplified schematic diagram of a plating device according to an embodiment of the application.

[0030] Fig. 2(a) and Fig. 2(b) are schematic diagrams of a substrate holder in an electroplating apparatus according to an embodiment of the present application.

[0031] Fig. 3(a) to Fig. 3(c) are top views of a substrate and a shield according to an embodiment of the present application.

[0032] Fig. 4(a) and Fig. 4(b) are comparison diagrams of substrate electroplating data according to an embodiment of the present application.

[0033] Preferred embodiments of the present application

[0034] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "comprise" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion.

[0036] In the present application, the phrase "embodiment" means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily mean that it refers to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments.

[0037] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected", "attached" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] The structures, proportions, sizes, etc. shown in the drawings of the present disclosure are merely used to cooperate with the content disclosed in the present disclosure for understanding and reading by those skilled in the art, and do not define the limiting conditions for the implementation of the present application, and therefore do not have technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are only for the purpose of clear understanding and description, and are not used to limit the scope of the present application. The change or adjustment of the relative relationship without substantial technical content is also considered as the scope of the present application. In order to make the drawings as simple as possible, the same structures in the drawings of the present specification are not repeatedly labeled.

[0039] It should be understood that "a plurality of" appearing below means more than two (including two).

[0040] It should be noted that the substrate described below is a square substrate.

[0041] FIG. 1 shows a simplified schematic diagram of an electroplating device according to an embodiment of the present application. As shown in FIG. 1, the electroplating device includes a substrate holder 10 for holding and rotating a substrate 20, which can be a vacuum holder; a film holder 30 located below the bottom of the substrate holder 10 and electrically connected to the anode of a power supply (not shown). During the electroplating process, the film holder 30 is filled with an electroplating solution, and the film holder 30 is provided with a plurality of liquid outlet holes for uniformly spraying the electroplating solution onto the surface of the substrate holder 10 and the substrate 20. The substrate holder 10 is provided with an electrode (not shown) electrically connected to the cathode of the power supply. Since the surface of the substrate holder 10 and the substrate 20 is covered with the electroplating solution, the electrode and the substrate 20 are electrically connected through the electroplating solution. The electrode and the electroplating solution achieve electrical connection between the substrate 20 and the power supply, thereby realizing electroplating of the substrate 20.

[0042] The substrate holder 10 has a motor 40 arranged on the top thereof, which drives the substrate holder 10 to move relative to the film holder 30 under the control of a motion controller (not shown) during the electroplating process, for example, to rotate counterclockwise, or to rotate clockwise, or to move up and down, so as to drive the substrate 20 placed on the substrate holder 10 to rotate or move up and down, so that the surface of the substrate 20 is more uniformly contacted with the electroplating solution, which is beneficial to the uniform deposition of metal ions on the surface of the substrate 20. However, although the rotation and up-and-down movement of the substrate can improve the uniformity of the contact between the electroplating solution and the surface of the substrate to a certain extent, due to the existence of the edge effect, the electric field intensity of the edge of the substrate is still higher than that of other areas, resulting in a higher current density of the edge of the substrate, so that the deposition speed of the coating layer of the edge of the substrate is faster, so that the problem of film thickness of the edge of the substrate occurs.

[0043] To solve the above problems, the electroplating device provided by the embodiments of the present application further comprises a shielding piece 12, which is arranged between the substrate 20 and the film holder 30, and has a gap of not less than 0.5 mm between the shielding piece 12 and the substrate 20, so as to prevent the electroplating solution from accumulating at the edge of the substrate 20. The shielding piece 12 shields a circle of the edge of the substrate 20, that is, the projection of the shielding piece 12 onto the substrate 20 overlaps with the edge of the substrate 20, which is used to shield the electric field of the edge of the substrate 20, so as to weaken or shield the electric field of the edge of the substrate 20. Specifically, referring to FIG. 1, the shielding piece 12 is rotationally connected with the fixed column 11, and the fixed column 11 is vertically attached to the substrate holder 10 from below the substrate holder 10. According to different electroplating requirements, the included angle A between the shielding piece 12 and the fixed column 11 can be adjusted to adjust the included angle between the shielding piece 12 and the substrate 20. When the included angle A changes, the inner edge of the shielding piece 12 correspondingly shrinks, and the overlapping area of the orthographic projection of the shielding piece 12 and the orthographic projection of the substrate 20 changes, so as to adjust the shielding strength of the shielding piece 12. The size of the included angle A is negatively correlated with the shielding strength of the shielding piece. When the included angle A is an acute angle, as shown in FIG. 2(a), the inner edge of the shielding piece 12 is close to the substrate 20, that is, the inner edge of the shielding piece 12 protrudes towards the substrate 20, so that the gap between the substrate 20 and the shielding piece 12 is reduced, thereby weakening the electric field on the substrate 20 at the position corresponding to the inner edge of the shielding piece 12, and further enhancing the shielding effect of the electric field of the edge of the substrate. When the included angle A is an obtuse angle, as shown in FIG. 2(b), the inner edge of the shielding piece 12 is away from the substrate 20, that is, the inner edge of the shielding piece 12 protrudes away from the substrate 20, so that the gap between the substrate 20 and the shielding piece 12 is relatively larger than when the included angle A is an acute angle, thereby weakening the shielding effect of the electric field of the edge of the substrate relative to the shielding effect when the included angle A is an acute angle, but relative to the case where the shielding piece is not installed, since there is an overlapping area between the substrate 20 and the shielding piece 12, the electric field on the substrate 20 at the position corresponding to the inner edge of the shielding piece 12 is weakened.

[0044] Based on the above, the shielding member is connected to the substrate holder through the fixing column, and will not fall off or deviate during the electroplating process, so that the substrate and the shielding member rotate at the same speed. Since the projection of the shielding member on the substrate overlaps with the edge of the substrate, the edge electric field of the substrate can be shielded, thereby weakening the edge electric field of the substrate, and further reducing the edge film thickness of the substrate. Moreover, by adjusting the angle between the shielding member and the fixing column, the angle between the shielding member and the substrate is adjusted, so as to change the shielding strength of the shielding member, which can effectively adjust the edge electric field of the substrate, and further adjust the edge film thickness of the substrate.

[0045] In some embodiments, the overlapping area of the front projection of the shielding member 12 and the front projection of the substrate 20 is less than or equal to the area where the edge film thickness of the substrate 20 increases. The area where the edge film thickness of the substrate increases refers to the edge area of the substrate where the film thickness is significantly greater than the middle area of the substrate due to the edge effect during the electroplating process. It can also refer to the area near the edge of the substrate affected by the increase in current density. In this area, the electroplated film is thicker than other areas. However, since the actual shielding area of the shielding member 12 on the substrate 20 is larger than the overlapping area, the width difference between the ring width of the overlapping area and the ring width of the area where the edge film thickness of the substrate increases is within 5 mm. For example, as shown in FIG. 4(a), the horizontal axis is the radial position of the substrate, and the vertical axis is the number of solder bumps. The area where the edge film thickness of the substrate increases is 7 mm, as shown in the area between [62, 68] mm in the figure. The shielding member can be adjusted so that its overlapping area with the substrate is 5 mm to reduce the edge film thickness of the substrate. For example, as shown in FIG. 4(b), the area between [64, 68] mm in the figure, the number of solder bumps on the substrate is significantly reduced compared to the corresponding position in FIG. 4(a).

[0046] It should be noted that the front projection can refer to the projection in a specified direction, for example, in the vertical direction. The overlapping area described above is the overlapping area of the projections of the shielding member 12 and the substrate 20 in the same specified direction.

[0047] It should be understood that the more solder bumps on the substrate, the thicker the film thickness at the corresponding position, that is, the number of solder bumps on the substrate reflects the film thickness of the substrate from the side.

[0048] In some embodiments, the shield 12 is a square ring-shaped shield, and the inner edge of the shield can be of different shapes, and the area of the edge of the substrate 20 where the film thickness increases has an inner ring and an outer ring, and the shape of the inner ring is selected according to the shape of the shield 12. Figures 3(a)-3(c) show top views of the shield 12, wherein the shape of the shield 12 is determined by the inner edge 122 and the outer edge 121 opposite the inner edge 122, and the outer edge 121 of the shield 12 is rectangular, and the inner edge 122 can be a right-angled rectangle as shown in Figure 3(a), a rounded rectangle as shown in Figure 3(b), a right-angled sawtooth as shown in Figure 3(c), or a triangular sawtooth or other shapes. The shape of the inner edge 122 of the shield 12 is the same as or similar to the shape of the inner ring of the area of the edge of the substrate where the film thickness increases, so that the shield 12 can more accurately match the shape of the area of the edge of the substrate where the film thickness increases, and achieve the best electric field shielding effect. The shape of the shield 12 can be selected according to the needs of different edge film plating in the electroplating process, and the shape of the shield 12 is not limited in the present application.

[0049] By connecting the shield 12 to the substrate holder, the shield 12 is used to weaken or shield the electric field of the edge of the substrate, effectively reducing the current density of the edge of the substrate, thereby reducing the film thickness of the edge of the substrate, and solving the problem of edge effect. Referring to Figures 4(a) and 4(b), Figure 4(a) uses a substrate holder without a shield to electroplate a substrate, and Figure 4(b) uses a substrate holder provided by the embodiments of the present application and containing a shield to electroplate a substrate, and the overlapping area between the shield and the substrate is 5 mm, and the gap between the shield and the substrate is 2 mm. As can be seen from the figures, the shield mainly affects the film thickness of the edge of the substrate. In the case where the edge of the substrate is not shielded by the shield, the film thickness of the edge of the substrate is much higher than that of other areas of the substrate, as shown in Figure 4(a), in the area between the substrate radial positions [62, 68] mm, the number of solder bumps increases from about 8 to about 27, which makes the film thickness of the edge of the substrate increase, thereby causing the edge of the substrate to have a large warpage. In the case where the edge of the substrate is shielded by the shield, the film thickness of the edge of the substrate is not much different from that of other areas of the substrate due to the weakening of the electric field of the edge, as shown in Figure 4(b), in the area between the substrate radial positions [64, 68] mm, the number of solder bumps of the edge of the substrate is about 4-9, which is not much different from the number of solder bumps (about 8) of other areas of the substrate, thereby making the film thickness of the entire substrate uniform. Therefore, the present application uses a shield to selectively weaken or shield the electric field of the edge of the substrate, greatly reduces the film thickness of the edge of the substrate, and makes the film thickness of the edge of the substrate closer to the film thickness of other positions on the substrate, thereby ensuring the uniformity of the film thickness of the substrate.

[0050] Further, the shielding member 12 is provided with a plurality of through holes, and the opening size of the through holes can be adjusted by setting adjustable coverings, so as to selectively adjust the distribution of the electric field, so as to optimize the current density distribution. For example, as shown in FIG. 4(b), even if the film thickness of the substrate edge range of about 2-3 mm (i.e. the area between the substrate radial positions [65, 67] mm in the figure) is lower than that of other areas, but is relatively low compared to the overall average thickness of the substrate film, the opening size of the through holes on the shielding member can be adjusted, so that the opening rate of the area with film thickness lower than the average thickness is greater than that of other positions, and the film uniformity of the substrate is further improved. In the electroplating process, the opening size of part of the through holes on the shielding member can also be repeatedly adjusted for areas with film thickness that is too high or too low, so as to adjust the film thickness at the positions on the substrate corresponding to the part of the through holes, so that the film thickness on the substrate is more uniform.

[0051] It should be understood that, since the shielding member 12 is connected with the substrate holder 10, and the substrate 20 is fixed on the substrate holder 10, the substrate 20, the substrate holder 10 and the shielding member 12 rotate at the same rotational speed during the electroplating process, so as to avoid the problem of electroplating uniformity caused by the mismatch of the rotational speed.

[0052] The shielding member is usually made of corrosion-resistant insulating material, which will not be corroded by the electroplating solution and will not react chemically with the electroplating solution, for example, polyether ether ketone (PEEK), titanium screw and the like.

[0053] Correspondingly, the application also provides an electroplating method, which comprises the following steps:

[0054] S1, fixing the substrate on the substrate holder, connecting the shielding member with the substrate holder, the shielding member having a gap with the substrate, and the shielding member shielding a part of the edge of the substrate;

[0055] S2, driving the substrate holder to rotate, so that the substrate and the shielding member rotate at the same speed;

[0056] S3, spraying the electroplating solution to the surface of the substrate through the liquid outlet holes on the film holder, and performing the electroplating process;

[0057] S4, after the electroplating process is completed, obtaining the area where the film thickness of the edge of the substrate is increased, and adjusting the overlapping area of the orthographic projection of the shielding member and the orthographic projection of the substrate, so as to perform the next electroplating process.

[0058] In a specific embodiment, in the actual process, the area where the film thickness of the edge of the substrate is increased has an inner circle and an outer circle, the inner circle is usually not a regular shape, and another shielding member with a shape similar to that of the inner circle is selected to replace the above shielding member, so as to adjust the overlapping area of the shielding member and the substrate, so that the transition between the shielding area and the non-shielding area on the substrate is more uniform.

[0059] In another specific embodiment, the step of adjusting the overlapping area of the front projection of the shielding member and the front projection of the substrate is specifically adjusting the overlapping area to be less than or equal to the area where the edge film thickness of the substrate increases.

[0060] In another specific embodiment, the step of adjusting the overlapping area of the front projection of the shielding member and the front projection of the substrate includes adjusting the included angle between the shielding member and the substrate.

[0061] In order to precisely adjust the film thickness non-uniformity problem existing in the area where the edge film thickness of the substrate increases, the area where the film thickness of the substrate is lower than the average film thickness of the substrate (first area) and the area where the film thickness of the substrate is higher than the average film thickness of the substrate (second area) in the area where the edge film thickness of the substrate increases can be obtained while adjusting the overlapping area of the shielding member and the substrate. By adjusting the opening rate of the through holes at different positions on the shielding member, the strength of the electric field at the corresponding positions in the area where the edge film thickness of the substrate increases is changed, so that the opening rate of the first area is higher than that of the second area, and finally the film thickness of the substrate is more uniform.

[0062] As can be seen from the above, by connecting the shielding member to the substrate holder to shield the edge of the substrate, the electric field at the edge of the substrate is weakened or shielded, the edge effect problem is solved, the film thickness at the edge of the substrate is reduced, and the uniformity of the film thickness on the substrate is achieved.

[0063] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electroplating apparatus characterized by comprising: The application relates to a substrate plating device. The device comprises: a substrate holder for holding and rotating a substrate; a film holder below the substrate holder, the inside of the film holder being used for containing plating liquid, the film holder being provided with a plurality of liquid outlet holes for spraying the plating liquid to the surface of the substrate; 2. The electroplating apparatus of claim 1, wherein a shielding member connected to the substrate holder through a fixing column, the shielding member having a gap with the substrate, the shielding member being located between the substrate and the film holder, and the shielding member being used for shielding a circle of edges of the substrate to weaken the edge electric field of the substrate.

3. The electroplating apparatus of claim 2, wherein The substrate is a square substrate, and the shielding member is a square ring-shaped shielding member.

4. The electroplating apparatus of claim 3, wherein The shielding member has an overlapping area with the substrate in orthographic projection, and the overlapping area is less than or equal to the area where the edge film thickness of the substrate is increased.

5. The electroplating apparatus of claim 3, wherein The shape of the inner edge of the shielding member comprises any one of a right-angled rectangular shape, a round-angled rectangular shape, a right-angled zigzag shape and a triangular zigzag shape.

6. The electroplating apparatus of claim 1, wherein The overlapping area has a first width, the area where the edge film thickness of the substrate is increased has a second width, and the width difference between the first width and the second width is within 5 mm.

7. The electroplating apparatus of claim 6, wherein The shielding member is provided with a plurality of through holes.

8. The electroplating apparatus of claim 1, wherein The size of each through hole can be adjusted.

9. The electroplating apparatus of claim 1, wherein The gap is not less than 0.5 mm.

10. The electroplating apparatus according to any one of claims 1 to 9, wherein The shielding member is rotationally connected to the fixing column, the included angle between the shielding member and the fixing column can be adjusted, so that the included angle between the shielding member and the substrate can be adjusted to change the shielding strength of the shielding member to the edge electric field.

11. The electroplating apparatus according to any one of claims 1 to 9, wherein The material of the shielding member is corrosion-resistant insulating material.

12. A method of electroplating, characterized by, The plating device further comprises a motor for driving the substrate holder to rotate around the central axis thereof. The application relates to a substrate plating method. The method comprises the following steps: fixing a substrate to a substrate holder; connecting a shielding member to the substrate holder, the shielding member having a gap with the substrate, and the shielding member being used for shielding a circle of edges of the substrate; driving the substrate holder to rotate so that the substrate and the shielding member rotate at the same speed; and 13. The electroplating method of claim 12, wherein, spraying plating liquid to the surface of the substrate through liquid outlet holes on a film holder to perform a plating process.

14. The electroplating method of claim 12, wherein, The gap is not less than 0.5 mm. The method further comprises the following steps: after the plating process is completed, obtaining the area where the edge film thickness of the substrate is increased; 15. The electroplating method of claim 14, wherein, adjusting the overlapping area of the shielding member in orthographic projection and the substrate in orthographic projection to perform a next plating process. The area where the edge film thickness of the substrate is increased has an inner circle and an outer circle, and the adjustment of the overlapping area of the shielding member in orthographic projection and the substrate in orthographic projection specifically comprises the following steps: selecting another shielding member with a shape similar to the shape of the inner circle according to the shape of the inner circle; 16. The electroplating method of claim 14, wherein, replacing the shielding member with the other shielding member.

17. The electroplating method of claim 16, wherein, The adjustment of the overlapping area of the shielding member in orthographic projection and the substrate in orthographic projection specifically comprises adjusting the overlapping area to be less than or equal to the area where the edge film thickness of the substrate is increased.

18. The electroplating method of claim 14, wherein, The overlapping area has a first width, the area where the edge film thickness of the substrate is increased has a second width, and the width difference between the first width and the second width is within 5 mm. Before the next plating process is performed, the method further comprises the following steps: determining a first region and a second region in a region where the edge film thickness on the substrate is large, wherein the film thickness in the first region is lower than an average film thickness of the substrate, and the film thickness in the second region is higher than the average film thickness; adjusting the open area ratio of the through holes on the shield so that the open area ratio of the through holes corresponding to the first region is higher than the open area ratio of the through holes corresponding to the second region.

19. The electroplating method of claim 14, wherein, The step of adjusting the overlapping region of the orthographic projection of the shield and the orthographic projection of the substrate includes adjusting the included angle between the shield and the substrate.

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