Heat exchanger

Abstract

A heat exchanger according to one aspect of the present disclosure has a ceramic substrate, a metal heat conduction member, and a temperature adjustment unit. The substrate has a first surface on which an object is placed, and a second surface positioned opposite to the first surface. The substrate has a heat transfer path having a cavity portion positioned inside the substrate and a metal film covering the inner surface of the cavity portion. The heat conduction member has a first portion thermally connected to the metal film and a second portion positioned away from the substrate. The second portion is cooled or heated by the temperature adjustment unit.

Description

heat exchanger

[0001] The present disclosure relates to a heat exchanger.

[0002] 2. Description of the Related Art Conventionally, heat exchangers have been known that cool electronic components and the like placed on a ceramic substrate by circulating a cooling medium through the substrate, which has an internal flow path.

[0003] Japanese Patent Application Laid-Open No. 2016-171343

[0004] A heat exchanger according to one embodiment of the present disclosure includes a ceramic base, a metal heat-conducting member, and a temperature adjustment unit. The base has a first surface on which an object is placed and a second surface opposite the first surface. The base has a heat transfer path including a cavity located inside the base and a metal film covering the inner surface of the cavity. The heat-conducting member has a first portion thermally connected to the metal film and a second portion located away from the base. The second portion is cooled or heated by the temperature adjustment unit.

[0005] FIG. 1 is a schematic cross-sectional view of a heat exchanger according to a first embodiment. FIG. 2 is a schematic cross-sectional view taken along the line II-II in FIG. 1 . FIG. 3 is an enlarged cross-sectional view showing an example of the configuration of portion H1 shown in FIG. 1 . FIG. 4 is a schematic cross-sectional view of a heat exchanger according to a second embodiment. FIG. 5 is a schematic cross-sectional view of a heat exchanger according to a third embodiment. FIG. 6 is a schematic cross-sectional view of a heat exchanger according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view of a heat exchanger according to a fifth embodiment. FIG. 8 is an enlarged cross-sectional view showing an example of the configuration of portion H2 shown in FIG. 7 . FIG. 9 is a schematic plan view showing an example of the configuration of a base according to a sixth embodiment. FIG. 10 is a schematic plan view showing an example of the configuration of a base according to a seventh embodiment. FIG. 11 is a schematic cross-sectional view showing an example of the configuration of a heat exchanger according to an eighth embodiment. FIG. 12 is a schematic cross-sectional view showing another example of the configuration of a heat exchanger according to the eighth embodiment.

[0006] Hereinafter, a form for carrying out a heat exchanger according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the embodiment. Furthermore, each embodiment can be appropriately combined within a range that does not cause contradiction in processing content. Furthermore, the same components in each of the following embodiments will be assigned the same reference numerals, and duplicated explanations will be omitted.

[0007] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis direction, Y-axis direction, and Z-axis direction, which are perpendicular to each other, are defined, and the Z-axis direction is the vertically upward direction.

[0008] Conventionally, heat exchangers have been known that cool electronic components or the like placed on a ceramic base having an internal flow path by circulating a cooling medium through the base. Patent Document 1 discloses a heat exchanger that is composed of a lid body portion, a side wall portion, and a bottom plate portion, and has a flow path member having an internal flow path through which the cooling medium flows, and a metal plate provided on the outer surface of the lid body.

[0009] However, with the above-mentioned technology, for example, when the pressure of a fluid such as a gas or liquid flowing through the flow path is high, stress may concentrate at the corners of the flow path, causing cracks or the like. If a crack occurs in the flow path, the fluid inside the flow path may leak out of the flow path. In this case, the cooling function of the heat exchanger may be impaired, or the fluid may come into contact with equipment located around the heat exchanger, causing malfunctions in the equipment.

[0010] Therefore, there is a need for a heat exchanger with excellent durability. According to the present disclosure, a heat exchanger with excellent durability can be provided.

[0011] First Embodiment First, the configuration of a heat exchanger according to a first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic cross-sectional view of the heat exchanger according to the first embodiment. Figure 2 is a schematic cross-sectional view taken along the line II-II in Figure 1. Note that the heat conduction member 20 is omitted in Figure 2.

[0012] 1, the heat exchanger 1 may include a ceramic base 10 and a metal heat conduction member 20. The heat conduction member 20 may include a fin portion 23, which is an example of a temperature adjustment portion 23.

[0013] The base 10 may have, for example, a disk shape with thickness in the vertical direction (Z-axis direction). Specifically, the base 10 may have a first surface 11 that is circular in a plan view and a second surface 12 that is circular in a plan view and located opposite the first surface 11. As shown in FIG. 1 , an object T may be placed on the first surface 11 of the base 10, such as an item that requires heating or cooling, an electronic component, a functional component, a structural component, an electronic device, a motor, or other device. The object T is not limited to a solid, but may also be a liquid or a gas. The object T and the base 10 are in thermal contact. The object T is cooled or heated via the base 10 and the heat conduction member 20, etc.

[0014] A plurality of recesses 121 may be provided on the second surface 12 of the base 10. In the first embodiment, an example is shown in which the base 10 has two recesses 121, but the number of recesses 121 may be three or more. Also, the number of recesses 121 may be one. In the example shown in Figures 1 and 2, the two recesses 121 are aligned along the X-axis direction.

[0015] 2 , the recess 121 may have, for example, a circular shape in a plan view of the base 10. A heat conduction member 20 described below may be inserted into the recess 121. The recess 121 may have a larger diameter than the heat conduction member 20.

[0016] The substrate 10 is made of ceramics. The ceramics that make up the substrate 10 include, for example, aluminum nitride (AlN) and aluminum oxide (Al ２ O ３ , alumina), silicon carbide (SiC), silicon nitride (Si ３ N ４) or the like. Of these, among the ceramics constituting the base 10, sintered bodies having aluminum nitride, aluminum oxide, or silicon nitride as their main components are preferred as those having insulating properties. Furthermore, in the case of a sintered body having silicon carbide (SiC) as its main component, the thermal conductivity of silicon carbide at 20°C is approximately 200 W / (m·K), so the efficiency of heat exchange can be improved. Note that the term "main component" as used herein refers to a material that accounts for, for example, 50% by mass or more or 80% by mass or more of the material.

[0017] The shape of the base 10 is arbitrary, and may be, for example, an elliptical shape, a rectangular shape, a trapezoidal shape, an annular shape, etc. in a plan view. In addition, a member having high thermal conductivity, such as a metal plate, may be positioned between the first surface 11 and the object T.

[0018] The base 10 may have a heat transfer path 15 composed of a cavity 13 located inside the base 10 and a metal film 14 covering the inner surface of the cavity 13. The cavity 13 refers to a portion located inside the base 10 and made of a material other than the ceramics that make up the base 10. The metal film 14 may be located in the cavity 13, or a so-called void in which gas exists in addition to the metal film 14 may be located. The cavity 13 may have, for example, a circular shape in a plan view of the base 10. In this case, the cavity 13 may have, among the inner surfaces of the cavity 13, a first inner surface 131 that is circular in a plan view parallel to the first surface 11 of the base 10, and a second inner surface 132 that is circular in a plan view and located opposite the first inner surface 131. The distance between the first inner surface 131 and the second inner surface 132 may be 1 mm or more and 10 mm or less. In FIG. 2, the cavity 13 is indicated by a broken line.

[0019] The cavity 13 may have a plurality of openings 133. The openings 133 are located on the bottom surface of the recess 121 of the base 10 and communicate with the interior of the cavity 13. Specifically, a portion of the inner surface of the cavity 13 extends continuously from the second inner surface 132 toward the openings 133, and opens to the outside at each opening 133. The openings 133 may have, for example, a circular shape in a plan view of the base 10 (see FIG. 2 ).

[0020] In the first embodiment, the cavity 13 has two openings 133 corresponding to the two recesses 121. The number of openings 133 can be changed as appropriate depending on the number of recesses 121.

[0021] A metal film 14 is provided on the inner surface of the cavity 13 so as to cover the inner surface. The metal film 14 may be made of, for example, nickel, gold, silver, platinum, palladium, aluminum, copper, etc. It is preferable that the metal film 14 be made of a metal having a higher thermal conductivity than the gas present in the cavity 13, for example, an inert gas such as air or nitrogen, and the substrate 10.

[0022] The metal film 14 can be formed by, for example, electroless plating. In such electroless plating, for example, an aqueous solution (plating solution) containing ions of the above metal is introduced into the interior of the cavity 13 through the opening 133. Alternatively, the metal film 14 may be formed by applying a paste containing powder of the above metal to the inner surface of the cavity 13 of the sintered base 10, and then drying or heat-treating the base 10. The thickness of the metal film 14 may be 1 μm or more and 1 mm or less.

[0023] A portion of the metal film 14 may be exposed to the outside of the base 10 at the opening 133 of the cavity 13, i.e., at the bottom surface of the recess 121 of the base 10 (see FIG. 2 ). In this case, the metal film 14 is thermally and electrically connected at the opening 133 to the heat conduction member 20 (described later) that is inserted into the recess 121.

[0024] The heat transfer path 15 having the metal film 14 functions as a heat dissipation path for heat generated in the object T together with a heat conduction member 20 described later. The metal film 14 and the heat conduction member 20 are connected via an opening 133. This point will be described later with reference to FIG. 3.

[0025] The heat conduction member 20 is a metal member that conducts the heat transmitted from the heat transfer path 15 to the fin portion 23 described below. The metal that can be used to form the heat conduction member 20 is, for example, aluminum. The metal that can be used to form the heat conduction member 20 may also be the same metal as the metal that forms the metal film 14, such as nickel or copper.

[0026] The heat conduction member 20 may be a rod-shaped member whose longitudinal direction is the thickness direction (Z-axis direction) of the base 10. The heat conduction member 20 may have a first portion 21 located at one end side in the axial direction of the heat conduction member 20 and a second portion 22 located at the other end side in the axial direction.

[0027] The first portion 21 is inserted into the recess 121 of the base 10 and is thermally and electrically connected to the metal film 14 at the bottom surface of the recess 121. That is, the portion of the heat conduction member 20 that is connected to the metal film 14 is the first portion 21. With this configuration, the heat conduction member 20 and the heat transfer path 15 are thermally and electrically connected. Note that the term "connected" here includes, for example, a case where the first portion 21 and the metal film 14 are integrated with a bonding material such as brazing material, as well as a case where they simply come into contact with each other. It is sufficient that at least a portion of the first portion 21 is in contact with the metal film 14.

[0028] The second portion 22 is located outside the base 10 and is thermally connected to the fin portion 23 described below. That is, the portion of the heat conduction member 20 that is connected to the fin portion 23 described below is the second portion 22. Note that, as will be described in detail later, in the first embodiment, the second portion 22 and the fin portion 23 may be integrally formed. For example, the heat conduction member 20 and the fin portion 23 can be integrally formed by cutting a single metal member.

[0029] The heat exchanger 1 according to the first embodiment has two heat conduction members 20, but the number of heat conduction members 20 is not limited to two and may be three or more. By providing a plurality of heat conduction members 20, the number of heat conduction paths between the base 10 and the cooling mechanism 30 (described below) increases, thereby improving the efficiency of heat exchange. The number of heat conduction members 20 may be one. The shape of the heat conduction member 20 is not particularly limited. For example, the heat conduction member 20 may be cylindrical or rectangular prism-shaped. The heat conduction member 20 may also be flat.

[0030] The fin portion 23 is thermally connected to the second portion 22. As described above, the fin portion 23 may be formed integrally with the second portion 22. In this case, the fin portion 23 may be formed of the same metal as the heat conduction member 20. However, this is not limiting, and the fin portion 23 and the heat conduction member 20 may be joined using a joining material such as brazing material. Furthermore, the fin portion 23 and the heat conduction member 20 may be integrated by welding or the like.

[0031] The fin section 23 has a plurality of fins 231. The fins 231 may be, for example, plate-shaped or columnar. Such fin section 23 can cool the second portion 22 by natural cooling. Cooling the second portion 22 by the fin section 23 increases the temperature gradient of the heat dissipation path from the object T to the second portion 22. The greater the temperature gradient, the greater the heat flux, i.e., the more heat can be transferred. Therefore, cooling the second portion 22 can increase the heat dissipation efficiency.

[0032] Heat generated in the object T is transferred to the first portion 21 of the heat conduction member 20 through the heat transfer path 15, which includes the metal film 14, which has a higher thermal conductivity than the base 10. Furthermore, the heat transferred to the first portion 21 of the heat conduction member 20 travels through the heat conduction member 20 from the first portion 21 to the second portion 22. The heat that reaches the second portion 22 is removed by natural cooling by the fin portion 23. As described above, the heat exchanger 1 according to the first embodiment is capable of dissipating heat from the object T without circulating a cooling medium inside the base 10. Therefore, cracks and the like are less likely to occur in the base 10 compared to conventional techniques that dissipate heat from the object by circulating a cooling medium through a flow path inside the base. Therefore, the heat exchanger 1 according to the first embodiment has excellent durability.

[0033] Next, the configuration of the H1 portion shown in Fig. 1 will be described in more detail with reference to Fig. 3. Fig. 3 is an enlarged cross-sectional view showing an example of the configuration of the H1 portion shown in Fig. 1.

[0034] 3 , first portion 21 of heat conduction member 20 may include an end face 211 that is one end face of heat conduction member 20. End face 211 may be, for example, circular in plan view. In this case, the diameter of end face 211 may be smaller than the diameter of recess 121 and larger than the diameter of opening 133. End face 211 may be located on the bottom surface of recess 121 so as to close opening 133.

[0035] A bonding material 40 containing metal may be located between the end surface 211 and the bottom surface of the recess 121. In this case, the heat conducting member 20 is fixed to the base 10 by the bonding material 40. The bonding material 40 may be, for example, a brazing material. The first portion 21 of the heat conducting member 20 is thermally and electrically connected to the metal film 14 via the bonding material 40.

[0036] The cavity 13 of the base 10 is sealed by the bonding material 40 and the heat conducting member 20. The sealed cavity 13 is filled with, for example, N ２ Alternatively, the cavity 13 may be filled with an inert gas such as argon gas or a gas such as argon gas. In this case, the metal film 14 located inside the cavity 13 is less likely to oxidize. The cavity 13 may be depressurized.

[0037] Here, an example has been described in which the metal film 14 and the heat conduction member 20 are joined by the bonding material 40, but the metal film 14 and the heat conduction member 20 may simply be in contact with each other. For example, the end surface 211 of the heat conduction member 20 may be brought into contact with the metal film 14 by pressing the heat conduction member 20 against the bottom surface of the recess 121 of the base 10 using a fixing mechanism or the like (not shown).

[0038] As described above, the heat exchanger 1 according to the first embodiment can dissipate heat from the object T via the heat transfer path 15 and the heat conduction member 20 provided inside the base 10, without circulating a fluid inside the base 10. Therefore, the heat exchanger 1 according to the first embodiment can efficiently exchange heat with the object T while having excellent durability.

[0039] Second Embodiment Next, the configuration of a heat exchanger 1 according to a second embodiment will be described with reference to Fig. 4. Fig. 4 is a schematic cross-sectional view of the heat exchanger 1 according to the second embodiment.

[0040] As shown in FIG. 4 , the heat exchanger 1 according to the second embodiment may have a metal member 50 located inside the cavity 13 in the heat transfer path 15 .

[0041] The metal member 50 may be made of a metal such as stainless steel, nickel, aluminum, or copper. The metal member 50 may be an aggregate of whisker-like or needle-like metal fibers. Each metal fiber may have a diameter of 1 μm to 100 μm and a length of 100 μm to 5 mm.

[0042] The multiple metal fibers constituting the metal member 50 are in contact with each other. This allows the metal member 50 to conduct heat and electricity throughout the entire cavity 13. Alternatively, metal particles may be present between the metal fibers, allowing them to be in contact with each other. This structure maintains the flexibility of the metal member and provides excellent durability against temperature changes. The size of the metal particles may be an average particle size of 1 nm or more and 200 nm or less, and the material of the metal particles may be aluminum, silver, copper, nickel, palladium, gold, or titanium.

[0043] Furthermore, some of the multiple metal fibers are in contact with the metal film 14 located on the inner surface of the cavity 13. This allows the metal member 50 to be thermally and electrically connected to the metal film 14. In this way, the heat exchanger 1 having the metal member 50 inside the cavity 13 increases the number of heat dissipation paths from the object T to the heat conduction member 20, allowing for more efficient heat exchange with the object T. Furthermore, metal particles may be present between the metal fibers and the metal film, allowing for contact. This structure maintains the flexibility of the metal member and provides excellent durability against temperature changes.

[0044] Furthermore, some of the metal fibers may be in contact with the heat conduction member 20 or the bonding material 40 at the opening 133 of the hollow portion 13, i.e., at the bottom surface of the recess 121. With this configuration, the number of heat dissipation paths from the object T to the heat conduction member 20 is further increased, allowing for more efficient heat exchange with the object T.

[0045] The metal member 50 does not necessarily have to be an aggregate of metal fibers. For example, the metal member 50 may be composed of a plurality of metal wires. Specifically, the metal member 50 may be, for example, a plurality of metal wires extending from one opening 133 of the cavity 13 to the other opening 133. The plurality of metal wires may be positioned in the cavity 13 in a bundled state. The metal wires may be made of a metal such as stainless steel, nickel, aluminum, or copper. The metal member 50 may be formed after the metal film 14 is formed. If the metal member 50 contains a plurality of metal fibers or metal particles, a liquid containing the metal fibers or metal particles may be poured and dried. If the metal member 50 is composed of a plurality of metal wires, the wires may be inserted into the cavity 13 in a bundled state. To improve the bonding between the metal film 14 and the metal member 50, heat treatment may be performed at a temperature below the melting point of the metal member 50 or the metal film 14.

[0046] Third Embodiment Next, the configuration of a heat exchanger 1 according to a third embodiment will be described with reference to Fig. 5. Fig. 5 is a schematic cross-sectional view of the heat exchanger 1 according to the third embodiment. As shown in Fig. 5, the heat exchanger 1 may have a cooling mechanism 30 (an example of a temperature adjustment unit) instead of the fin unit 23.

[0047] The cooling mechanism 30 cools the second portion 22 of the heat conduction member 20. The cooling mechanism 30 may include, for example, a cooling medium 31, a plurality of containers 32, a circulation pump 33 (an example of a circulation mechanism), a storage tank 34, a first pump 35, and a second pump 36.

[0048] The cooling medium 31 may be a liquefied gas, such as liquid nitrogen, liquid hydrogen or liquid helium.

[0049] Container 32 contains cooling medium 31. When cooling medium 31 is a liquefied gas, container 32 may be, for example, a pressure-resistant sealed container. An insertion opening for inserting heat conduction member 20 may be located on the top surface of container 32. In this case, heat conduction member 20 is inserted into container 32 through the insertion opening of container 32. Inside container 32, second portion 22 of heat conduction member 20 is immersed in cooling medium 31. As a result, second portion 22 of heat conduction member 20 is cooled.

[0050] Thus, according to the heat exchanger 1 of the third embodiment, by cooling the second part 22 using the cooling medium 31, the temperature gradient of the heat dissipation path from the object T to the second part 22 can be increased, thereby improving the heat dissipation efficiency.

[0051] The circulation pump 33 has a function of liquefying the cooling medium 31 vaporized inside the container 32 by pressurizing it or the like, and circulates the cooling medium 31 by returning the liquefied cooling medium 31 using this function to the container 32. Specifically, the circulation pump 33 is connected to a plurality of pipes 33a and a plurality of pipes 33b that communicate with the interior of each container 32. The pipe 33a communicates with the interior of the container 32, for example, at the top surface of the container 32, i.e., above the liquid level of the cooling medium 31. The pipe 33b communicates with the interior of the container 32, for example, at the side surface of the container 32. The connection position of the pipe 33b to the container 32 is not particularly limited.

[0052] The circulation pump 33 sucks the vaporized cooling medium 31 through the pipe 33a, liquefies the cooling medium 31, and then re-supplies the liquefied cooling medium 31 through the pipe 33b into the container 32. The circulation pump 33 allows the vaporized cooling medium 31 to be reused for cooling, thereby reducing the amount of cooling medium 31 consumed.

[0053] The first pump 35 transports the cooling medium 31 from the container 32 to a storage tank 34 described below. Specifically, the first pump 35 is connected to a plurality of pipes 35a that communicate with the interior of each container 32 and a pipe 35b that communicates with the interior of the storage tank 34. The pipes 35a communicate with the interior of the container 32, for example, at the bottom of the container 32, i.e., below the liquid level of the cooling medium 31. The pipes 35b communicate with the interior of the storage tank 34, for example, at the side of the storage tank 34. The connection position of the pipes 35b and the storage tank 34 is not particularly limited.

[0054] The second pump 36 transports the cooling medium 31 from the storage tank 34 (described later) to the container 32. Specifically, the second pump 36 is connected to a pipe 36a that communicates with the interior of the storage tank 34 and a plurality of pipes 36b that communicate with the interior of each container 32. The pipe 36a communicates with the interior of the storage tank 34, for example, at the bottom of the storage tank 34, i.e., below the liquid level of the cooling medium 31. The pipe 36b communicates with the interior of the container 32, for example, at the bottom of the container 32.

[0055] The storage tank 34 is a tank that stores and keeps the cooling medium 31 inside when the cooling of the heat conduction member 20 is stopped. Specifically, when the cooling of the heat conduction member 20 is stopped, the first pump 35 described above transports the cooling medium 31 from each container 32 to the storage tank 34. On the other hand, when the cooling of the heat conduction member 20 is started, the second pump 36 described above transports the cooling medium 31 from the storage tank 34 to each container 32.

[0056] According to this configuration, for example, when the cooling mechanism 30 is not in use, the cooling medium 31 can be stored in the storage tank 34. By storing the cooling medium 31 in a single storage tank 34 in this way, the remaining amount of the cooling medium 31 can be easily managed.

[0057] Fourth Embodiment Next, the configuration of a heat exchanger 1 according to a fourth embodiment will be described with reference to Fig. 6. Fig. 6 is a schematic cross-sectional view of the heat exchanger 1 according to the fourth embodiment.

[0058] 6 , second portion 22 of heat conduction member 20 immersed in cooling medium 31 inside container 32 may have a fin structure. Specifically, second portion 22 of heat conduction member 20 may have a plurality of fins 221. Fins 221 may be, for example, plate-shaped or columnar.

[0059] In this way, since the second portion 22 of the heat conduction member 20 has a fin structure, the contact area between the second portion 22 and the cooling medium 31 can be increased, thereby increasing the cooling efficiency of the second portion 22 by the cooling medium 31, and by increasing the cooling efficiency of the second portion 22, the heat dissipation efficiency of the object T can be increased.

[0060] Fifth Embodiment Next, the configuration of a heat exchanger 1 according to a fifth embodiment will be described with reference to Fig. 7 and Fig. 8. Fig. 7 is a schematic cross-sectional view of the heat exchanger 1 according to the fifth embodiment.

[0061] 7, the heat exchanger 1 according to the fifth embodiment may include a heating mechanism 60 (an example of a temperature adjustment unit). The heating mechanism 60 heats the object T.

[0062] Heating mechanism 60 may have, for example, heating power supply 37 and wiring 371a and 371b. Wiring 371a connects heating power supply 37 and heat conduction member 20A, and wiring 371b connects heating power supply 37 and heat conduction member 20B. This forms a closed circuit including heating power supply 37, wiring 371a, heat conduction member 20A, metal film 14, metal member 50, heat conduction member 20B, and wiring 371b.

[0063] The heating power supply 37 applies a voltage to the closed circuit. As a result, a current flows through the closed circuit, and the heat conduction member 20, the metal film 14, and the metal member 50 generate heat due to Joule heat. The metal film 14 and the metal member 50 located inside the base 10 generate heat, and the object T placed on the base 10 can be heated.

[0064] In this way, the heat exchanger 1 according to the fifth embodiment can heat the object T without circulating a heating medium such as hot water inside the base 10, and therefore cracks are less likely to occur in the base 10. Therefore, the heat exchanger 1 according to the first embodiment has excellent durability.

[0065] Furthermore, the heat exchanger 1 according to the fifth embodiment includes both the cooling mechanism 30 and the heating mechanism 60. In this case, the heat exchanger 1 can cause the heat conductive member 20, the metal film 14, and the metal member 50 to function as a heat dissipation path for transferring heat from the object T, and also as a heat transfer path for transferring heat to the object T. At this time, by preventing the heat conductive member 20 from coming into contact with the cooling medium 31, the heating efficiency can be improved.

[0066] Fig. 8 is an enlarged cross-sectional view showing an example of the configuration of portion H2 shown in Fig. 7. As shown in Fig. 8, wiring 371a may be fastened to heat conduction member 20A with screws 38. For example, heat conduction member 20A may have screw holes 24 for inserting screws 38, and wiring 371a may be wound around the shanks of screws 38. In this case, by threading screws 38 around which wiring 371a is wound into screw holes 24, wiring 371a and heat conduction member 20A can be electrically connected via screws 38.

[0067] With this configuration, even if the heat conduction member 20A repeatedly undergoes thermal expansion and contraction due to cooling and heating, the wiring 371a is unlikely to come off the heat conduction member 20. Furthermore, when heating is not required, the heating mechanism 60 can be easily removed from the heat exchanger 1 by removing the screws 38 from the heat conduction member 20. Conversely, it is also easy to attach the heating mechanism 60 to the heat exchanger 1. Note that while the connection between the wiring 371a and the heat conduction member 20A has been described as an example here, the connection between the wiring 371b and the heat conduction member 20B may also be screwed in a similar manner.

[0068] It should be noted that the heat exchanger 1 does not necessarily have to include both the cooling mechanism 30 and the heating mechanism 60. The heat exchanger 1 may be configured to include only the heating mechanism 60 out of the cooling mechanism 30 and the heating mechanism 60.

[0069] Sixth Embodiment Next, the configuration of a heat exchanger 1 according to a sixth embodiment will be described with reference to Fig. 9. Fig. 9 is a schematic plan view showing an example of the configuration of a base 10 according to the sixth embodiment. Fig. 9 corresponds to the cross-sectional view taken along the line II-II in Fig. 1, and the dashed line in the figure indicates a perspective view of a cavity 13.

[0070] As shown in FIG. 9 , the base 10 according to the sixth embodiment may have a plurality of support pillars 134 inside the cavity 13 that connect the first inner surface 131 and the second inner surface 132 of the cavity 13.

[0071] This configuration can increase the mechanical strength of the base 10 having the cavity 13. Increasing the mechanical strength of the base 10 makes it less likely for cracks to occur inside the base 10. In addition, when this configuration is used, the metal film 14 may be positioned so as to cover the surface of the support 134.

[0072] The support pillar 134 may have, for example, a cylindrical shape extending from the first inner surface 131 toward the second inner surface 132. The shape of the support pillar 134 is not particularly limited, and may be, for example, a rectangular pillar shape, or may have, for example, a flat plate shape extending from the first inner surface 131 toward the second inner surface 132. The number of support pillars 134 is also not particularly limited. The number of support pillars 134 may be one.

[0073] Seventh Embodiment Next, the configuration of a heat exchanger 1 according to a seventh embodiment will be described with reference to Fig. 10. Fig. 10 is a schematic plan view showing an example of the configuration of a base according to the seventh embodiment. Fig. 10 corresponds to the cross-sectional view taken along the line II-II in Fig. 1, and the dashed line in the figure indicates a perspective view of a cavity 13.

[0074] In the above-described embodiments, examples have been described in which the cavity 13 is a space that extends uniformly in all directions on a plane parallel to the first surface 11 of the base 10, in this case the XY plane. However, the cavity 13 may have a shape that extends in a specific direction on a plane parallel to the first surface 11 of the base 10.

[0075] For example, as shown in FIG. 10, the cavity 13 may have a serpentine shape when the base 10 is viewed from above.

[0076] Furthermore, the cavity 13 is not limited to the example shown in FIG. 10, and may have a spiral shape when viewed from above the base 10.

[0077] Eighth Embodiment Next, the configuration of a heat exchanger 1 according to an eighth embodiment will be described with reference to Fig. 11 and Fig. 12. Fig. 11 is a schematic cross-sectional view showing an example of the configuration of the heat exchanger 1 according to the eighth embodiment. Fig. 12 is a schematic cross-sectional view showing another example of the configuration of the heat exchanger 1 according to the eighth embodiment.

[0078] As shown in FIG. 11 , the base 10 according to the eighth embodiment may have two heat transfer paths 15 arranged along the Z-axis direction. In this case, of the two heat transfer paths 15, the heat transfer path 15 located on the first surface 11 side of the base 10 may function as a heat transfer path for heating. Specifically, the heat transfer path 15 located on the first surface 11 side may be connected to a heating mechanism 60 via heat conduction members 20A and 20B. Furthermore, of the two heat transfer paths 15, the heat transfer path 15 located on the second surface 12 side of the base 10 may function as a heat transfer path for heat dissipation. Specifically, the heat transfer path 15 located on the second surface 12 side may be connected to two heat conduction members 20C having fin portions 23.

[0079] In such a configuration, heat conduction members 20A and 20B may be the same heat conduction member as heat conduction member 20C. That is, heat conduction members 20A and 20B may have fin portions 23. Furthermore, in the eighth embodiment, the number of heat transfer paths 15 and heat conduction members 20A, 20B, and 20C is not limited to two, and may be three or more.

[0080] In this way, by providing separate heat transfer paths 15 for heating and heat transfer paths 15 for heat dissipation, it is possible to easily control the temperature when both heating and heat dissipation of the object T are performed, for example.

[0081] 12 , the diameters of the cavities 13 of the two heat transfer paths 15 may be the same. That is, when the heat transfer paths 15 are seen through from the first surface 11 side of the base 10, the heating area by the heat transfer path 15 for heating and the heat dissipation area by the heat transfer path 15 for heat dissipation may be the same. In such a case, for example, as shown in FIG. 12 , a through hole may be provided in the cavity 13 of the heat transfer path 15 for heat dissipation, and a part of the heat transfer path 15 for heating may be inserted through the through hole to connect the heat transfer path 15 for heating to the heat conduction members 20A and 20B.

[0082] With this configuration, the object T can be heated and dissipated with high thermal uniformity compared to when the heating area by the heat transfer path 15 for heating and the heat dissipation area by the heat transfer path 15 for heat dissipation are different.

[0083] <Other Modifications> The heat exchanger 1 according to the embodiment may include an electrostatic attraction electrode, a high-frequency electrode, and a resistance heating electrode on the base 10. If an electrostatic attraction electrode is provided, the target object T can be fixed by electrostatic attraction. If a high-frequency electrode is provided, processing using high-frequency waves such as plasma can be performed efficiently. If a resistance heating electrode is provided, the target object can be heated without the heating mechanism 60 described above, and if the heating mechanism 60 is also provided, more precise temperature control can be performed. These electrodes may be formed by a printing method using a metal paste when the base 10 is fabricated by a lamination method using ceramic sheets.

[0084] Furthermore, the base 10 may be provided with holes for vacuum suction, and if such holes are provided, the object T can be fixed by vacuum suction.

[0085] As described above, the heat exchanger 1 according to the embodiment can efficiently radiate heat or heat the object T without circulating a fluid inside the base 10. Therefore, the heat exchanger 1 according to the embodiment can efficiently exchange heat with the object T while having excellent durability.

[0086] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0087] The present technology can also be configured as follows: (1) A heat exchanger including: a ceramic base having a first surface on which an object is placed and a second surface opposite the first surface; a metal heat conductive member; and a temperature adjustment unit, wherein the base has a heat transfer path including a cavity located inside the base and a metal film covering the inner surface of the cavity, the heat conductive member having a first portion thermally connected to the metal film and a second portion located away from the base, and the second portion is cooled or heated by the temperature adjustment unit. (2) The heat exchanger according to (1), wherein the heat transfer path includes a metal member located inside the cavity, and the metal member is thermally connected to the metal film. (3) The heat exchanger according to (1) or (2), wherein the base has a recess located on the second surface, the cavity has an opening located on a bottom surface of the recess, and the first portion is located in the recess and thermally connected to the metal film at the opening. (4) The heat exchanger according to (3), wherein the heat transfer path has a metal member located inside the cavity, the metal member is thermally connected to the metal film, and the first portion is thermally connected to the metal film and the metal member at the opening. (5) The heat exchanger according to (3) or (4), wherein the first portion closes the opening. (6) The heat exchanger according to any one of (1) to (5), wherein the heat exchanger has a plurality of the heat conduction members. (7) The heat exchanger according to any one of (1) to (6), wherein the inner surface of the cavity has a first inner surface parallel to the first surface and a second inner surface positioned opposite the first inner surface, and the cavity has at least one support portion connecting the first inner surface and the second inner surface. (8) The heat exchanger according to any one of (1) to (7), wherein the base has a plurality of the heat transfer paths. (9) The heat exchanger according to any one of (1) to (8), wherein the temperature adjustment unit has a fin portion thermally connected to the second portion. (10) The heat exchanger according to any one of (1) to (9), wherein the temperature adjustment unit has a cooling medium and a container that stores the cooling medium, and the second portion is immersed in the cooling medium inside the container.(11) The heat exchanger according to (10), wherein the cooling medium is a liquefied gas, and the temperature adjustment unit further has a circulation mechanism that liquefies the liquefied gas vaporized inside the container and returns the liquefied gas to the container. (12) The heat exchanger according to (10) or (11), wherein the temperature adjustment unit further has: a storage tank that stores the cooling medium; a first pump that transports the cooling medium from the container to the storage tank; and a second pump that transports the cooling medium from the storage tank to the container. (13) The heat exchanger according to any one of (1) to (12), wherein the temperature adjustment unit has: a heating power source that applies a voltage to the heat conduction member; and wiring that connects the heat conduction member and the heating power source, and the wiring is screwed to the heat conduction member.

[0088] REFERENCE SIGNS LIST 1 heat exchanger 10 base body 11 first surface 12 second surface 13 cavity portion 14 metal film 15 heat transfer path 20 heat conduction member 21 first portion 22 second portion 23 temperature adjustment portion, fin portion 30 cooling mechanism 31 cooling medium 32 container 33 circulation pump 34 storage tank 35 first pump 36 second pump 37 heating power source 38 screw 40 bonding material 50 metal member 121 recess 133 opening 134 support portion 211 end surface 231 fin

Claims

1. A heat exchanger comprising: a ceramic base having a first surface on which an object is placed and a second surface opposite the first surface; a metallic heat conduction member; and a temperature adjustment unit, wherein the base has a heat transfer path having a cavity located inside the base and a metal film covering the inner surface of the cavity, and the heat conduction member has a first portion thermally connected to the metal film and a second portion located away from the base, and the second portion is cooled or heated by the temperature adjustment unit.

2. A heat exchanger as described in claim 1, wherein the heat transfer path has a metal member located inside the hollow portion, and the metal member is thermally connected to the metal film.

3. A heat exchanger as described in claim 1 or 2, wherein the base has a recess located on the second surface, the hollow portion has an opening located on the bottom surface of the recess, and the first portion is located in the recess and is thermally connected to the metal film at the opening.

4. A heat exchanger as described in claim 3, wherein the heat transfer path has a metal member located inside the hollow portion, the metal member is thermally connected to the metal film, and the first portion is thermally connected to the metal film and the metal member at the opening.

5. A heat exchanger according to claim 3 or 4, wherein the first portion closes the opening.

6. A heat exchanger according to any one of claims 1 to 5, comprising a plurality of said heat conducting members.

7. A heat exchanger according to any one of claims 1 to 6, wherein the inner surface of the cavity has a first inner surface parallel to the first face and a second inner surface positioned opposite the first inner surface, and the cavity has at least one support portion connecting the first inner surface and the second inner surface.

8. A heat exchanger according to any one of claims 1 to 7, wherein the base has a plurality of the heat transfer paths.

9. A heat exchanger according to any one of claims 1 to 8, wherein the temperature adjustment section has a fin section thermally connected to the second section.

10. A heat exchanger as described in any one of claims 1 to 9, wherein the temperature control unit has a cooling medium and a container for accommodating the cooling medium, and the second portion is immersed in the cooling medium inside the container.

11. A heat exchanger as described in claim 10, wherein the cooling medium is a liquefied gas, and the temperature control unit further has a circulation mechanism that liquefies the liquefied gas that has evaporated inside the container and returns it to the container.

12. A heat exchanger as described in claim 10 or 11, wherein the temperature control unit further has: a storage tank for storing the cooling medium; a first pump for transporting the cooling medium from the container to the storage tank; and a second pump for transporting the cooling medium from the storage tank to the container.

13. A heat exchanger as described in any one of claims 1 to 12, wherein the temperature control unit has a heating power supply that applies voltage to the heat conduction member and wiring that connects the heat conduction member and the heating power supply, and the wiring is screwed to the heat conduction member.

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